Electronic devices

Abstract

The present application relates to an electronic device, the electronic device comprising: an electronic panel capable of being folded together with a window; and a first functional layer and a second functional layer, each of the first functional layer and the second functional layer being capable of being folded together with the window and the electronic panel. The second functional layer is disposed farther from the window than the first functional layer and has a thickness in a range of about 30 microns to about 50 microns and a modulus in a range of about 3 gigapascals to about 8 gigapascals, and the first functional layer is disposed closer to the window than the second functional layer, and the first functional layer has a thickness equal to or greater than the thickness of the second functional layer and a modulus less than the modulus of the second functional layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims the priority of Korean Patent Application No. 10-2019-0054399 filed on May 9, 2019, and all rights arising therefrom, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure herein relates to an electronic device, and more particularly, to a foldable electronic device with improved reliability. Background Art

[0004] Bendable or foldable electronic devices have been actively developed. Flexible electronic devices include an electronic panel such as a flexible display panel or a flexible touch panel, a window for covering the electronic panel, and various functional layers. The functional layer is provided between the window and the electronic panel. The window and the functional layer can be bent or folded together with the electronic panel.

[0005] The layers of the electronic device have relatively flexible properties to be bent or folded. Due to the flexible properties, reliability against stress caused by bending may be increased, but reliability against external impact may be reduced. Summary of the invention

[0006] The present disclosure provides a foldable electronic device with improved impact resistance and improved flexibility.

[0007] An embodiment of the present invention provides an electronic device, which includes: an electronic panel that provides an image and can be folded relative to a folding axis; a window that can be folded relative to the folding axis together with the electronic panel, and the image from the electronic panel is provided to the outside of the electronic device through the window; a first functional layer that can be folded together with the window and the electronic panel, and is disposed between the window and the electronic panel; and a second functional layer that can be folded together with the first functional layer, the window, and the electronic panel, and is disposed between the first functional layer and the electronic panel to be disposed farther from the window than the first functional layer. The second functional layer disposed farther from the window than the first functional layer has a thickness in the range of about 30 microns to about 50 microns and a modulus in the range of about 3 gigapascals to about 8 gigapascals, and the first functional layer disposed closer to the window than the second functional layer has a thickness equal to or greater than the thickness of the second functional layer and a modulus less than the modulus of the second functional layer.

[0008] In an embodiment, the first functional layer may have a thickness in a range of about 50 micrometers (μm) to about 100 μm, and the first functional layer may have a modulus that is variable according to temperature.

[0009] In an embodiment, the first functional layer may have a modulus of about 200 megapascals (MPa) or more at room temperature.

[0010] In an embodiment, the first functional layer may have a thickness in a range of about 50 μm to about 75 μm, and at a temperature of about -20°C, the first functional layer may have a modulus of about 1000 MPa or more.

[0011] In an embodiment, the first functional layer may have a thickness in a range of about 75 μm to about 100 μm, and at a temperature of about -20°C, the first functional layer may have a modulus in a range of about 1000 MPa to about 1800 MPa.

[0012] In an embodiment, the first functional layer may have a thickness in a range of about 50 μm to about 75 μm, and at a temperature of about 80° C., the first functional layer may have a modulus of about 100 MPa or more.

[0013] In an embodiment, the first functional layer may have a thickness in a range of about 75 μm to about 100 μm, and at a temperature of about 80° C., the first functional layer may have a modulus of about 150 MPa or more.

[0014] In an embodiment, the electronic device may further include a cover panel facing the window, wherein the electronic panel, the first functional layer and the second functional layer are located between the cover panel and the window.

[0015] In an embodiment, each of the first functional layer and the second functional layer may be optically transparent.

[0016] In an embodiment, the window may comprise glass.

[0017] In an embodiment, the electronic device may further include a coating on the top surface of the window. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention. In the drawings:

[0019] Figure 1A and Figure 1B is a perspective view showing an embodiment of an electronic device;

[0020] Figure 2A and Figure 2B is a perspective view showing another embodiment of an electronic device;

[0021] Figure 3A and Figure 3Bis a schematic cross-sectional view showing an embodiment of an electronic device;

[0022] Figure 4A It is shown Figure 3A An equivalent circuit diagram of an embodiment of an electronic device in;

[0023] Figure 4B It is shown Figure 3A An enlarged cross-sectional view of an embodiment of an electronic device in;

[0024] Figure 5A is a schematic perspective view showing yet another embodiment of an electronic device;

[0025] Figure 5B yes Figure 5A A schematic cross-sectional view of an electronic device in FIG. 1 ; and

[0026] Figure 6 is a schematic cross-sectional view showing still another embodiment of the electronic device. DETAILED DESCRIPTION

[0027] The present invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure will be thorough and complete, and the scope of the present invention will be fully conveyed to those skilled in the art. Throughout the text, the same reference numerals represent the same elements. In addition, in the accompanying drawings, the thickness, proportions and sizes of the components are exaggerated for clarity of illustration.

[0028] In this specification, it will also be understood that when a component (or region, layer, part) is referred to as being associated with another component (such as being "on", "connected to" or "coupled to" another component), it may be directly disposed / connected / coupled to the other component, or there may be a third component located therebetween. Conversely, when a component (or region, layer, part) is referred to as being associated with another component (such as being "directly" "on", "directly connected to" or "directly coupled to" another component), there is no third component located therebetween.

[0029] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, "a", "an", "the", and "at least one" do not represent a limit on quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, "an element" has the same meaning as "at least one element". "At least one" should not be interpreted as limiting "a" or "an". "Or" means "and / or". The term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0030] It should be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, an element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise mentioned, terms in the singular may include plural forms.

[0031] In addition, “under”, “below”, “over”, “upper”, etc. are used to explain the relationship between components shown in the drawings. These terms may be relative concepts and described based on the directions expressed in the drawings.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art. Terms defined in commonly used dictionaries should be interpreted as having the same meaning as in the relevant technical context, and unless clearly defined in the specification, these terms should not be ideally or excessively interpreted as having a formal meaning.

[0033] The meaning of “include” or “comprising” indicates characteristics, fixed numbers, steps, operations, elements, components or a combination thereof, but does not exclude other characteristics, fixed numbers, steps, operations, elements, components or a combination thereof.

[0034] As used herein, "about" or "approximately" includes the stated value and the mean within an acceptable deviation range of the particular value determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, 20%, 10%, or 5%.

[0035] Embodiments are described herein with reference to cross-sectional illustrations that are schematic diagrams of idealized embodiments. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include shape deviations, for example, due to manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, the sharp angles shown may be rounded. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions, nor to limit the scope of the claims presented.

[0036] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0037] Figure 1A and Figure 1B 1 is a perspective view showing an embodiment of the electronic device EA. Figure 1A and Figure 1B As shown, the electronic device EA can be transformed into various shapes. Figure 1A is a perspective view showing the electronic device EA in an expanded shape or a flat shape, and Figure 1B 1 is a perspective view showing an embodiment of an electronic device EA-F in a folded shape or a bent shape. Figure 1B The electronic device EA-F has the same Figure 1A The same configuration (e.g., components, layers, etc.) of the electronic device EA in FIG. Figure 1A to Figure 1B Embodiments of the present invention are described.

[0038] The electronic devices EA and EA-F are driven by receiving electrical signals. The electronic device EA can be provided in various types, such as a touch sensing device, a display device, and a touch screen device. However, the present invention is not limited thereto. In the embodiment, for ease of description, the electronic device EA is exemplarily described as a display device.

[0039] The electronic device EA may be deformed into various shapes by an external force applied to the electronic device EA. According to the force applied from the outside of the electronic device EA, the electronic device EA may be unfolded, rolled, or partially folded to provide a predetermined curved surface. Figure 1A and Figure 1B The shape according to the external force is shown.

[0040] like Figure 1AAs shown in , the electronic device EA can be unfolded. The unfolded electronic device EA (hereinafter referred to as the unfolded electronic device EA) can display an image IM on the front surface FS. The front surface FS can be set in a plane parallel to a plane defined by a first direction D1 and a second direction D2 intersecting each other. The normal direction (e.g., a vertical line) of the front surface FS is a third direction D3 intersecting the first direction D1 and the second direction D2. The thickness of the electronic devices EA and EA-F and / or their components is defined along the third direction D3. The front surface FS may include an effective area AA and a peripheral area NAA.

[0041] The active area AA may display an image IM according to an electrical signal (e.g., a display area AA). The peripheral area NAA is disposed adjacent to the active area AA. The peripheral area NAA does not display an image IM (e.g., a non-display area NAA). The shape of the active area AA on a plane may be determined by the peripheral area NAA.

[0042] like Figure 1B As shown, the electronic device EA-F can be folded. The folded electronic device EA-F (hereinafter referred to as the folded electronic device EA-F) can be folded relative to the folding axis FX. The folding axis FX can be defined at various positions along the electronic devices EA and EA-F. In an embodiment, the folding axis FX is arranged at the front surface FS and extends longitudinally along the second direction D2. However, the present invention is not limited to this. In an embodiment, for example, the folding axis FX can be arranged below the electronic devices EA and EA-F (such as arranged at the rear surface opposite to the front surface FS along the thickness of the electronic devices EA and EA-F), can be longitudinally extended along the first direction D1, or can be longitudinally extended in a direction inclined or diagonal relative to the first direction D1 and / or the second direction D2. The electronic devices EA and EA-F can be folded or unfolded along the defined folding axis FX. However, the present invention is not limited to this.

[0043] In an embodiment, the electronic device EA can be folded around a folding axis FX ( Figure 1B ). Therefore, the folded electronic device EA-F can have a shape in which parts of the active area AA face each other at the inner area of ​​the folded electronic device EA-F so as to be covered. The unfolded electronic device EA provides information (e.g., image IM) to the outside thereof through the active area AA, and the folded electronic device EA-F stably protects the active area AA by arranging its parts to face each other along the thickness of the folded electronic device EA-F.

[0044] Figure 2A and Figure 2B is a perspective view showing another embodiment of the electronic device EA and the electronic device EA-R (eg, the electronic devices EA and EA-R). Figure 2A is a perspective view showing the unfolded electronic device EA, and Figure 2B 1 is a perspective view showing the electronic device EA-R deformed into a rolled shape. Figure 2B The electronic equipment EA-R has Figure 2A The electronic equipment in EA has the same configuration.

[0045] In an embodiment, the electronic device EA may have Figure 1A The electronic equipment EA in the device has basically the same configuration.

[0046] The electronic device EA can be deformed to be set as an electronic device EA-R (hereinafter referred to as a wound electronic device EA-R). The electronic devices EA and EA-R can be wound relative to the winding axis RX. The winding axis RX can be defined at various positions along the electronic devices EA and EA-R. In an embodiment, the winding axis RX is set at the front surface FS and is located on an area overlapping or corresponding to the peripheral area NAA.

[0047] The winding axis RX is shown as an axis extending longitudinally along the second direction D2. However, the present invention is not limited to this. In an embodiment, for example, the winding axis RX may be disposed below the front surface FS of the electronic device EA and EA-R (such as disposed at a rear surface opposite to the front surface FS along the thickness of the electronic device EA and EA-R), or may extend longitudinally along a diagonal direction relative to the first direction D1 or the second direction D2. Although the electronic device EA may be wound or unfolded relative to the defined winding axis RX, the present invention is not limited to this.

[0048] In this embodiment, the electronic device EA is wound around the winding axis RX. Therefore, the wound electronic device EA-R can have a shape in which the active area AA is covered. The electronic devices EA and EA-R provide information to the user through the active area AA in the unfolded state, and stably protect the active area AA in the wound state.

[0049] Figure 3A and Figure 3B is a schematic cross-sectional view showing an embodiment of electronic devices EA and EA-F. Figure 4A It is shown Figure 3A An equivalent circuit diagram of an embodiment of the electronic device EA in FIG. 1 , and Figure 4B It is shown Figure 3A An enlarged cross-sectional view of an embodiment of the electronic device EA in FIG.

[0050] Figure 3A It is shown Figure 1A a cross-sectional view of the electronic device EA, and Figure 3B It is shown Figure 1B sectional view of the electronic device EA-F in FIG. FIG. 3A to FIG. 4B Embodiments of the present invention are described.

[0051] like Figure 3A and Figure 3B As shown, the electronic devices EA and EA-F include a window WM, a plurality of functional layers FL1 and FL2, an electronic panel EP, a cover panel CP and a plurality of adhesive layers AS1, AS2, AS3 and AS4. The adhesive layers AS1, AS2, AS3 and AS4 may include a first adhesive layer AS1, a second adhesive layer AS2, a third adhesive layer AS3 and a fourth adhesive layer AS4.

[0052] The window WM is provided on the electronic panel EP. The window WM has a front surface FS (refer to Figure 1A ) on the top surface of the electronic panel EP. The window WM may be provided on a display surface (such as a front surface FS) of the electronic panel EP. The window WM may be optically transparent. Therefore, an image IM generated from the electronic panel EP may pass through the window WM and may be easily recognized from outside the electronic device EA.

[0053] The window WM has a flexible property. Therefore, the window WM may be foldable or unfoldable with respect to the folding axis FX. In an embodiment, for example, the window WM may be a resin film including an organic material.

[0054] Alternatively, the window WM may be a glass substrate. Here, the window WM may have a thickness along the third direction D3, for example, about 100 micrometers (μm) or less, to ensure both rigidity and flexibility. Therefore, the window WM may have flexible characteristics while stably protecting the components of the electronic device EA.

[0055] The electronic panel EP has a flexible characteristic. Therefore, the electronic panel EP can be folded or unfolded relative to the folding axis FX. The electronic panel EP may include a display panel DP ( Figure 5B ), a sensing panel for detecting external pressure applied thereto, or a combination thereof. In an embodiment, the electronic panel EP includes a display panel DP. Therefore, the electronic panel EP displays an image IM (refer to Figure 1A ). The display panel DP may be one of a liquid crystal display panel, an organic light emitting display panel, an electrophoretic display panel or an electrowetting display panel.

[0056] The electronic panel EP may include a plurality of pixels PX (eg, a plurality of pixels PX). Each of the pixels PX may generate and / or emit light for realizing an image IM. Figure 4A In the figure, for the convenience of description, an equivalent circuit diagram of an embodiment of one of the pixels PX is simply shown.

[0057] like Figure 4AAs shown, the pixel PX is electrically connected to a plurality of signal lines. In an embodiment, for example, the pixel PX receives a gate signal through a gate line GL (e.g., a gate signal line GL) and receives a data signal through a data line DL (e.g., a data signal line DL). In addition, the pixel PX may receive a first power supply voltage through a power line PL (e.g., a power signal line PL). The pixel PX may include a first transistor TR1, a second transistor TR2, a capacitor CAP, and a light emitting element OLD.

[0058] The first transistor TR1 outputs a data signal applied to the data line DL in response to a gate signal applied to the gate line GL. The first transistor TR1 may be used as a switching element of the pixel PX. The capacitor CAP is charged according to an amount of charge corresponding to a voltage difference between a signal provided by the first transistor TR1 and a power signal provided by the power line PL.

[0059] The second transistor TR2 is connected to the light emitting element OLD and controls an electric driving current flowing through the light emitting element OLD according to the amount of charge stored in the capacitor CAP.

[0060] The light emitting element OLD generates and / or emits light according to the electrical signal. The light emitting element OLD may be an organic light emitting element ("OLED") including an organic light emitting layer or a quantum dot light emitting element ("QD-LED") including quantum dots. The light emitting element OLD generates and / or emits light during the conduction period of the second transistor TR2.

[0061] exist Figure 4B In the figure, the enlarged cross section of the electronic panel EP corresponds to Figure 4A 0045] A portion of the equivalent circuit diagram in which the second transistor TR2 and the light emitting element OLD are disposed. In the embodiment, the light emitting element OLD is exemplarily described as an organic light emitting element.

[0062] like Figure 4B As shown, the electronic panel EP may include a base substrate BS, a second transistor TR2, a light emitting element OLD, a plurality of insulating layers I1, I2, I3, and I4, and an encapsulation layer EC.

[0063] The base substrate BS may have flexibility and insulating properties. Therefore, the base substrate BS may be easily folded or unfolded relative to the folding axis FX. In an embodiment, the base substrate BS may include a plurality of layers stacked along a third direction D3. In an embodiment, for example, the base substrate BS may include a first film layer F1, a first barrier layer B1, a second film layer F2, and a second barrier layer B2.

[0064] Each of the first film layer F1 and the second film layer F2 may include an organic material. In an embodiment, for example, each of the first film layer F1 and the second film layer F2 may include a resin such as polyimide ("PI"). The first film layer F1 and the second film layer F2 may include the same material as each other or different materials from each other, or may be made of the same material as each other or different materials.

[0065] Each of the first barrier layer B1 and the second barrier layer B2 may include an inorganic material. The first barrier layer B1 and the second barrier layer B2 may be alternately disposed in the base substrate BS with the first film layer F1 and the second film layer F2. Therefore, the first barrier layer B1 and the second barrier layer B2 may prevent moisture from penetrating into the pixel PX through the first film layer F1 and the second film layer F2, and improve the adhesion between the elements or layers of the pixel PX and the base substrate BS. In the base substrate BS, the first barrier layer B1 and the second barrier layer B2 may be omitted, and the base substrate BS may include only one of the first film layer F1 and the second film layer F2. However, the present invention is not limited thereto.

[0066] The second transistor (eg, second thin film transistor) TR2 is disposed on the base substrate BS. The second thin film transistor TR2 includes a semiconductor pattern SP, a control electrode CE, an input electrode IE, and an output electrode OE.

[0067] The semiconductor pattern SP is disposed between the base substrate BS and the first insulating layer I1. The first insulating layer I1 is disposed on the base substrate BS to cover the semiconductor pattern SP. The first insulating layer I1 includes an organic layer and / or an inorganic layer. The first insulating layer I1 may include a plurality of thin films.

[0068] The control electrode CE is connected to the first transistor TR1 and the capacitor CAP. The control electrode CE is disposed between the first insulating layer I1 and the second insulating layer I2. The control electrode CE overlaps the semiconductor pattern SP in a plane and is spaced apart from the semiconductor pattern SP along a thickness direction. The second insulating layer I2 is disposed on the first insulating layer I1 to cover the control electrode CE. The second insulating layer I2 includes an organic layer and / or an inorganic layer. The second insulating layer I2 may include a plurality of thin films.

[0069] The input electrode IE and the output electrode OE are spaced apart from each other along the second insulating layer I2. The input electrode IE is connected to the capacitor CAP, and the output electrode OE is connected to the light emitting element OLD. The input electrode IE and the output electrode OE extend through the first insulating layer I1 and the second insulating layer I2 and are respectively connected to opposite sides of the semiconductor pattern SP.

[0070] The light emitting element OLD is disposed on the third insulating layer I3. The third insulating layer I3 is disposed on the second insulating layer I2 to cover the input electrode IE and the output electrode OE of the second thin film transistor TR2. The third insulating layer I3 includes an organic layer and / or an inorganic layer. The third insulating layer I3 may include a plurality of thin films.

[0071] The light emitting element OLD includes a first electrode E1, a light emitting layer OL and a second electrode E2. The light emitting element OLD excites charges of the light emitting layer OL through a potential difference between the first electrode E1 and the second electrode E2 to generate and / or emit light.

[0072] The first electrode E1 is disposed on the third insulating layer I3. The first electrode E1 extends through the third insulating layer I3 and is connected to the second thin film transistor TR2. The first electrode E1 receives a voltage corresponding to a data signal from the second thin film transistor TR2.

[0073] The light emitting layer OL may be disposed on the first electrode E1 and disposed in an opening defined in the fourth insulating layer I4. The fourth insulating layer I4 is disposed on the third insulating layer I3 to provide an opening that exposes at least a portion of the first electrode E1 outside the fourth insulating layer I4. The fourth insulating layer I4 includes an organic layer and / or an inorganic layer. The fourth insulating layer I4 may include a plurality of thin films.

[0074] The second electrode E2 is disposed on the light emitting layer OL. The second electrode E2 covers the fourth insulating layer I4 and the light emitting layer OL. The second electrode E2 may be connected to the power supply terminal ELV ( Figure 4A ) to receive a second power supply voltage different from the first power supply voltage.

[0075] Although not shown, at least one organic layer and / or at least one inorganic layer may be further provided between the first electrode E1 and the light emitting layer OL and between the second electrode E2 and the light emitting layer OL. In an embodiment, the light emitting layer OL may be provided as a plurality (e.g., a plurality of light emitting layers OL) spaced apart from each other along the base substrate BS. The light emitting element OLD may include various embodiments.

[0076] The encapsulation layer EC is disposed on the second electrode E2. The encapsulation layer EC may include a plurality of thin films arranged along the third direction D3. In an embodiment, for example, the encapsulation layer EC includes a first film L1, a second film L2, and a third film L3 sequentially disposed from the base substrate BS.

[0077] The first film L1 is disposed on the second electrode E2 to cover the second electrode E2. The first film L1 may include an inorganic material. The first film L1 protects the second electrode E2 from external moisture or air. The second film L2 is disposed on the first film L1. The thickness of the second film L2 may be relatively greater than the thickness of the first film L1. The second film L2 may include an organic material. The second film L2 provides a flat top surface to flatten the first film L1 below.

[0078] The third film L3 is disposed on the second film L2 to cover the second film L2. The third film L3 encapsulates the second film L2. The electronic panel EP may include various components according to types of the electronic panel EP and / or the display panel DP therein.

[0079] Reference again Figure 3A , the cover panel CP is disposed on the rear surface of the electronic panel EP. The modulus or elasticity of the cover panel CP may be greater than the modulus or elasticity of the electronic panel EP. The cover panel CP may reduce or effectively prevent an external impact applied from the lower side of the electronic device EA from being transmitted to the electronic panel EP to improve the reliability of the electronic device EA.

[0080] The functional layers FL1 and FL2 are disposed between the electronic panel EP and the window WM. The functional layers FL1 and FL2 may include a first functional layer FL1 and a second functional layer FL2.

[0081] Among the functional layers FL1 and FL2, the first functional layer FL1 may be a layer closer to the window WM than the second functional layer FL2. The first functional layer FL1 has a relatively low modulus. The first functional layer FL1 may have a first thickness T1. Based on the range of the first thickness T1 of the first functional layer FL1, the first functional layer FL1 may have different moduli.

[0082] Among the functional layers FL1 and FL2, the second functional layer FL2 may be a layer closer to the electronic panel EP than the first functional layer FL1. The second functional layer FL2 has a relatively high modulus. The second functional layer FL2 may have a second thickness T2. The second thickness T2 may be equal to or less than the first thickness T1. In an embodiment, for example, the second functional layer FL2 may have a modulus in a range of about 3 gigapascals (GPa) to about 8 GPa and a second thickness T2 in a range of about 30 μm to about 50 μm.

[0083] Table 1 below shows the Figure 3A Result of bending property test of the electronic device EA of the thickness and modulus of the first functional layer FL1 of the component of the electronic device EA.

[0084] [Table 1]

[0085]

[0086]

[0087] The results shown in Table 1 may be experimental results of an embodiment of the electronic device EA designed to have components identical to each other except for the thickness and modulus of the first functional layer FL1. Figure 1B The bending property test can check whether interlayer delamination occurs when folded relative to a predetermined folding axis FX as shown in . The term "OK" can indicate a case where the bending property is ensured, while the term "NG" can indicate a case where defects such as interlayer delamination or plastic deformation occur.

[0088] In addition, the modulus in the embodiment of the electronic device EA can be a value obtained by performing a tensile test for each temperature using a universal testing machine ("UTM"). Here, the tensile test is performed with a sample having a width of about 10 millimeters (mm) and a length of about 50 mm, or a sample having a width of about 25 mm and a length of about 100 mm, at a tensile speed of about 50 millimeters per minute (mm / min).

[0089] As shown in Table 1, the modulus of the first functional layer FL1 may vary according to temperature. Under relatively low temperature (-20° C.) conditions, when the first thickness T1 is about 50 μm to about 75 μm, the first functional layer FL1 may have a modulus of about 1000 MPa, and when the first thickness T1 is about 75 μm to about 100 μm, the first functional layer FL1 may have a modulus in the range of about 1000 MPa to about 1800 MPa.

[0090] In addition, at room temperature (25° C.), when the first thickness T1 is about 50 μm to about 100 μm, the first functional layer FL1 may have a modulus of about 200 MPa or more. In addition, at relatively high temperature (85° C.), when the first thickness T1 is about 50 μm to about 75 μm, the first functional layer FL1 may have a modulus of about 100 MPa or more, and when the first thickness T1 is about 75 μm to about 100 μm, the first functional layer FL1 may have a modulus of about 150 MPa or more.

[0091] The first functional layer FL1 may include an elastomeric-based material (e.g., elastomer) satisfying the above thickness and modulus conditions. In an embodiment, for example, the first functional layer FL1 may include polyurethane, silicone, polyether block amide ("PEBA"), and copolyester elastomer ("COPE") satisfying the above thickness and modulus conditions.

[0092] As shown in Table 1, since the thickness (e.g., thickness T1 and T2) and modulus of each of the first functional layer FL1 and the second functional layer FL2 are controlled within a predetermined numerical range, the electronic device EA can have improved bending characteristics. Therefore, although the electronic device EA further includes the plurality of functional layers FL1 and FL2, the electronic device EA can ensure flexibility.

[0093] Hereinafter, the impact resistance of the electronic device EA will be described with reference to the following Table 2. The following Table 2 includes the results of the impact resistance test between the embodiment and the comparative example.

[0094] [Table 2]

[0095]

[0096] In Table 2, the impact resistance shows the result value of the height generated when the impact is applied to the corresponding structure in the pen drop type test. The reference embodiment has a laminated structure including a first functional layer FL1 made of a material having a relatively high modulus. In the reference embodiment, the rate of change of the modulus of the first functional layer FL1 according to temperature may be relatively smaller than the rate of change of the modulus of each of the first to second embodiments and the first to third comparative examples according to temperature. In the reference embodiment, the first functional layer FL1 is designed to have a thickness of about 50 μm. In the case of the reference embodiment, although the bending characteristics are excellent, the impact resistance has a minimum value of about 4 centimeters (cm).

[0097] The first comparative example and the second comparative example may include a first functional layer FL1 set by conditions outside the modulus and thickness ranges according to one or more embodiments of the present invention. The first comparative example and the second comparative example each have a thickness of less than about 50 μm, which is outside the thickness range of the first functional layer FL1 according to one or more embodiments of the present invention and does not satisfy the modulus range.

[0098] Specifically, the first comparative example is designed to include a first functional layer FL1 having a thickness of about 40 μm and a modulus of about 6150 MPa at a relatively low temperature (-20° C.), a modulus of about 5500 MPa at a room temperature (25° C.), and a modulus of about 3580 MPa at a relatively high temperature (85° C.) That is, the first functional layer FL1 of the first comparative example has a thickness outside the thickness range of one or more embodiments of the present invention and a modulus outside the modulus range of one or more embodiments of the present invention.

[0099] The second comparative example is designed to include a first functional layer FL1 having a thickness of about 40 μm and a modulus of about 1470 MPa at a relatively low temperature (-20° C.), a modulus of about 1190 MPa at a room temperature (25° C.), and a modulus of about 940 MPa at a relatively high temperature (85° C.) That is, the first functional layer FL1 of the second comparative example has a thickness outside the thickness range of one or more embodiments of the present invention and a modulus outside the modulus range of one or more embodiments of the present invention.

[0100] Compared with the reference embodiment, each of the first comparative example and the second comparative example has improved bending characteristics and relatively improved impact resistance. However, each of the first comparative example and the second comparative example has an impact resistance of less than about 9 cm. In this case, when the user uses the electronic device EA, the electronic device EA may be relatively easily damaged by external impact. The electronic device EA according to one or more embodiments of the present invention has an impact resistance of at least about 9 cm or more. Therefore, an electronic device EA with improved reliability during its use can be provided.

[0101] Each of the first and second embodiments may include a first functional layer FL1 that satisfies the modulus range and thickness range in one or more embodiments of the present invention. Specifically, the first embodiment includes a first functional layer FL1 having a thickness of about 75 μm. That is, the first functional layer FL1 of the first embodiment may have a thickness of about 75 μm to about 100 μm and a modulus of about 1000 MPa to about 1800 MPa under relatively low temperature (-20°C) conditions, a thickness of about 50 μm to about 100 μm and a modulus of about 200 MPa or more under room temperature (25°C) conditions, and a thickness of about 50 μm to about 75 μm and a modulus of about 100 MPa or more under relatively high temperature (85°C) conditions. The first embodiment has improved bending characteristics and relatively high impact resistance to reduce or effectively prevent damage to the electronic device EA caused by even impacts associated with a height of about 9 cm or more. Furthermore, since the first functional layer FL1 of the first embodiment is designed to have a modulus of about 1800 MPa or less under relatively low temperature conditions, degradation of bending characteristics and flexibility due to an excessive increase in modulus may be reduced or effectively prevented.

[0102] The second embodiment includes a first functional layer FL1 having a thickness of about 55 μm. That is, the first functional layer FL1 of the second embodiment satisfies a range of about 1000 MPa or more under a relatively low temperature (-20° C.) condition, a range of about 200 MPa or more under a room temperature (25° C.) condition, and a range of about 100 MPa or more under a relatively high temperature (85° C.) condition. Compared with the reference embodiment, the second embodiment has improved bending characteristics and an increase in impact resistance of about 5 cm or more.

[0103] The third to fifth comparative examples each include a first functional layer FL1 that does not satisfy the above conditions for one or more embodiments of the present invention. Specifically, the first functional layer of each of the third comparative example having a thickness of about 100 μm, the fourth comparative example having a thickness of about 110 μm, and the fifth comparative example having a thickness of about 100 μm may have a modulus outside the range of equal to or greater than about 150 MPa under relatively high temperature (85° C.) conditions.

[0104] Since each of the third to fifth comparative examples includes a first functional layer FL1 having a thickness relatively greater than that of each of the first and second comparative examples, each of the third to fifth comparative examples has improved impact resistance compared to that of the reference embodiment. However, each of the third to fifth comparative examples is degraded in terms of bending characteristics. The third to fifth comparative examples may improve the protective force of the electronic panel EP against external impacts applied to the electronic device EA, but may be deformed during folding or winding thereof and become susceptible to repeated shape deformation of the electronic device EA.

[0105] The first functional layer FL1 and the second functional layer FL2 may be optically transparent. In an embodiment, for example, each of the first functional layer FL1 and the second functional layer FL2 may have a visible transmittance of about 90% or more and a haze of about 1% or less. Therefore, the image IM displayed by the electronic panel EP may pass through the first functional layer FL1 and the second functional layer FL2 and may be easily seen from the outside of the electronic device EA.

[0106] Reference again Figure 3A and Figure 3B Each of the first to fourth adhesive layers AS1, AS2, AS3, and AS4 may have adhesive properties and flexibility. In an embodiment, for example, each of the first to fourth adhesive layers may include a pressure sensitive adhesive ("PSA").

[0107] The first adhesive layer AS1 of the first adhesive layer AS1, the second adhesive layer AS2, the third adhesive layer AS3, and the fourth adhesive layer AS4 is disposed between the window WM and the first functional layer FL1 to couple the window WM and the first functional layer FL1 to each other. The second adhesive layer AS2 is disposed between the first functional layer FL1 and the second functional layer FL2 to couple the first functional layer FL1 and the second functional layer FL2 to each other. The third adhesive layer AS3 is disposed between the second functional layer FL2 and the electronic panel EP to couple the second functional layer FL2 and the electronic panel EP to each other.

[0108] The fourth adhesive layer AS4 is disposed between the electronic panel EP and the cover panel CP to couple the electronic panel EP and the cover panel CP to each other. In an optional embodiment, the fourth adhesive layer AS4 may be omitted. Here, the cover panel CP may be directly disposed on the rear surface of the electronic panel EP and in close contact with the electronic panel EP. However, the present invention is not limited thereto.

[0109] The folded electronic device EA-F can be folded around the folding axis FX. Each of the components of the electronic device EA is folded relative to the folding axis FX. The window WM closest to the folding axis FX along the third direction D3 can be folded with a first radius of curvature R1 (e.g., a curvature R1 of a first radius). The first radius of curvature R1 can be defined as the distance between the front surface FS of the folded electronic device EA-F at the top surface of the window WM and the folding axis FX.

[0110] The cover panel CP farthest from the folding axis FX along the third direction D3 may be folded at a second radius of curvature R2 (eg, a second radius of curvature R2). The second radius of curvature R2 may be defined as a distance from a rear surface of the cover panel CP to the folding axis FX.

[0111] In an embodiment, the folding axis FX is defined at the front surface of the window WM (e.g., the front surface FS of the electronic device EA). Therefore, the value of the second radius of curvature R2 is greater than the value of the first radius of curvature R1. Each of the first radius of curvature R1 and the second radius of curvature R2 may be equal to or less than about 2 mm. According to one or more embodiments of the present invention, the electronic device EA having the functional layers FL1 and FL2 disposed between the window WM and the electronic panel EP may be stably folded even with a micro radius of curvature.

[0112] Since the thickness and modulus of each of the functional layers FL1 and FL2 disposed between the window WM and the electronic panel EP are controlled, the electronic device EA according to one or more embodiments of the present invention can have improved rigidity against folding stress applied thereto and improved impact resistance against external impact applied thereto.

[0113] Figure 5A1 is a schematic perspective view showing still another embodiment of the electronic device EA-1. Figure 5B It is shown Figure 5A Schematic cross-sectional view of the electronic device EA-1 in FIG. FIG. 5A to FIG. 5B Embodiments of the present invention are described.

[0114] Figure 5A and Figure 5B The electronic equipment EA-1 includes Figure 2A Components corresponding to those of the electronic device EA in FIG. 1, except that the electronic panel EP-1 is Figures 1A to 4B The same components as described in the drawings will be denoted by the same reference numerals, and repeated descriptions will be omitted.

[0115] like Figure 5A As shown, the electronic device EA-1 can detect the applied external input TC. Therefore, the electronic device EA-1 can display the image IM (functioning as an output device) and receive the external input TC (functioning as an input device).

[0116] Although the user's hand is shown as an example of the external input TC, the external input TC applied from the outside may be provided in various types. In an embodiment, for example, in addition to the contact or proximity position generated by an input object (e.g., a part of a human body, a stylus, etc.), the external input TC may also include force, pressure, and / or light. However, the present invention is not limited thereto.

[0117] like Figure 5B As shown, the electronic panel EP-1 may include a display panel DP and a detection panel TP. The display panel DP generates and displays an image IM. The display panel DP may substantially correspond to Figure 4B The electronic panel EP in. In the following, repeated descriptions will be omitted.

[0118] The detection panel TP may include a sensor for detecting an external input TC. The sensor may include a plurality of conductive patterns. The external input TC may change the capacitance between the conductive patterns, or provide a new capacitance together with the conductive patterns. In addition, the external input TC may change the resistance of each of the conductive patterns. The detection panel TP may obtain information about the position and strength of the external input TC through changes in the capacitance or resistance of the sensor.

[0119] The detection panel TP may be directly disposed on the display panel DP. In an embodiment, for example, the detection panel TP may be directly disposed on the encapsulation layer EC of the electronic panel EP (see Figure 4B Therefore, no additional adhesive member may be provided between the detection panel TP and the display panel DP.

[0120] In the embodiment, the detection panel TP is disposed on the display panel DP to be located outside thereof. However, this is an exemplary description. In the embodiment, for example, the detection panel TP may be disposed inside the display panel DP or below the display panel DP.

[0121] According to one or more embodiments of the present invention, although the electronic panel EP-1 includes various components, a stable foldable electronic device EA-1 may be implemented by controlling the thickness and modulus of each of the first functional layer FL1 and the second functional layer FL2.

[0122] Figure 6 is a schematic cross-sectional view showing another embodiment of an electronic device. For ease of description, Figure 6 Shown with Figure 3A In addition, Figures 1A to 5B The same components as those described in are denoted by the same reference numerals, and repeated descriptions will be omitted.

[0123] like Figure 6 As shown in Figure 3A Compared with the electronic device EA in FIG. 1 , the electronic device EA- 2 may include a window WM1 and a cover panel CP1 , each of which includes a plurality of layers. The window WM1 may include a base panel BP and a coating layer HC.

[0124] The base panel BP may include an insulating material. In addition, the base panel BP may be optically transparent. In an embodiment, for example, the base panel BP may include a resin film such as polyimide ("PI"). The base panel BP may correspond to Figure 3A Window WM in.

[0125] The coating layer HC contacts the base panel BP to protect the base panel BP. The coating layer HC may be directly disposed on the base panel BP. However, the present invention is not limited thereto. In an embodiment, for example, although a predetermined adhesive may be further provided between the coating layer HC and the base panel BP, the present invention is not limited thereto.

[0126] The cover panel CP1 may include a first layer CP-L1, a second layer CP-L2, and a fifth adhesive layer AS5. Each of the first layer CP-L1 and the second layer CP-L2 may include a material having relatively high elasticity or a material having relatively high modulus. In an embodiment, for example, each of the first layer CP-L1 and the second layer CP-L2 may include an insulating material such as sponge, rubber, and resin, or a metal such as aluminum. The first layer CP-L1 and the second layer CP-L2 may be the same as or different from each other. Since the cover panel CP1 also includes the first layer CP-L1 and the second layer CP-L2, the electronic device EA-2 may have improved bending characteristics and improved impact resistance.

[0127] The fifth adhesive layer AS5 is disposed between the first layer CP-L1 and the second layer CP-L2 in the cover panel CP1 to couple the first layer CP-L1 and the second layer CP-L2 to each other. The fifth adhesive layer AS5 may be flexible so as to be deformable corresponding to the folding or winding of the electronic device EA-2. In an embodiment, for example, the fifth adhesive layer AS5 may include a pressure-sensitive adhesive.

[0128] According to one or more embodiments of the present invention, although each of the window WM1 and the cover panel CP1 includes multiple layers, an electronic device EA-2 with improved bending characteristics and improved impact resistance can be provided by controlling the thickness T1 and T2 and the modulus of each of the first functional layer FL1 and the second functional layer FL2.

[0129] According to one or more embodiments of the present invention, a flexible laminate structure capable of simultaneously ensuring flexibility and rigidity can be realized by designing the thicknesses T1 and T2 and modulus of the plurality of functional layers FL1 and FL2 within a predetermined range. Therefore, an electronic device EA can be provided that reduces stress caused by folding and improves impact resistance.

[0130] Although the embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these embodiments but is limited to various changes and modifications that can be made by those skilled in the art within the spirit and scope of the present invention as claimed in the claims.

[0131] Therefore, the actual protection scope of the present invention will be determined by the technical scope of the appended claims.

Claims

1. Electronic equipment, including: an electronic panel providing an image and being foldable about a folding axis; a window, foldable together with the electronic panel relative to the folding axis and disposed on the electronic panel; a first functional layer, capable of being folded together with the window and the electronic panel, and disposed between the window and the electronic panel; as well as a second functional layer, which can be folded together with the first functional layer, the window and the electronic panel, and is disposed between the first functional layer and the electronic panel, in: the second functional layer disposed further away from the window than the first functional layer has a thickness in a range of 30 microns to 50 microns and a modulus in a range of 3 GPa to 8 GPa, and The first functional layer has a thickness equal to or greater than a thickness of the second functional layer and a modulus less than a modulus of the second functional layer.

2. The electronic device according to claim 1, wherein: The thickness of the first functional layer is in the range of 50 micrometers to 100 micrometers, and The modulus of the first functional layer can be varied as a function of temperature.

3. The electronic device according to claim 2, wherein: The modulus of the first functional layer is 200 MPa or more at room temperature.

4. The electronic device according to claim 2, wherein: The thickness of the first functional layer is in the range of 50 micrometers to 75 micrometers, and The modulus of the first functional layer is 1000 MPa or more at a temperature of -20°C.

5. The electronic device according to claim 2, wherein: The thickness of the first functional layer is in the range of 75 micrometers to 100 micrometers, and At a temperature of -20°C, the modulus of the first functional layer is in a range of 1000 MPa to 1800 MPa.

6. The electronic device according to claim 2, wherein: The thickness of the first functional layer is in the range of 50 micrometers to 75 micrometers, and The modulus of the first functional layer is 100 MPa or more at a temperature of 80°C.

7. The electronic device according to claim 2, wherein: The thickness of the first functional layer is in the range of 75 micrometers to 100 micrometers, and The modulus of the first functional layer is 150 MPa or more at a temperature of 80°C.

8. The electronic device according to claim 1, further comprising: A cover panel faces the window, and the electronic panel, the first functional layer and the second functional layer are located between the cover panel and the window.

9. The electronic device according to claim 1, wherein: Each of the first functional layer and the second functional layer is optically transparent.

10. The electronic device according to claim 1, wherein: The window comprises glass.

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