Method of manufacturing a molded chip

Abstract

Provided is a method for manufacturing a molded chip that can ensure electrical connection of a device. The method for manufacturing a molded chip includes the steps of: a preparation step of adhering device faces of a plurality of device chips arranged in a row to a heat-resistant protective member to form a chip group composed of the plurality of device chips; a molding step of, after the preparation step is performed, providing a molding resin to a back surface side of the device chips and a gap between the device chips, and covering the back surfaces and side surfaces of the device chips with the molding resin to form a molded wafer; and a molded division step of, after the molding step is performed, dividing the molded wafer into molded chips along the center of the gap filled with the molding resin based on an image obtained by photographing the front surface side of the molded wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to a manufacturing method of a molded chip. BACKGROUND

[0002] In order to protect a semiconductor device chip from external environmental changes, a technique of protecting by covering with a molding resin is known. For example, there are BGA (Ball Grid Array), CSP (Chip Size Package), and the like, but in these techniques, the mounted substrate and chip are connected by a wire, and thus the completed package is much larger than the chip. Therefore, a WL-CSP (Wafer level Chip Size Package) package has been invented, but this technique covers only one face of a chip having six faces with a molding resin, and thus the protection is insufficient.

[0003] In addition, a method of forming a groove in a street (division predetermined line) of a wafer, filling a molding resin in a front face of the wafer and the groove, and then polishing a back face, cutting the center of the molding resin of the street, and molding five faces of the chip with the molding resin has been invented (for example, refer to Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2017-022280

[0005] However, the technique shown in Patent Document 1 has the following problem: after the device face side is molded, the bump connected to the electrode of the device is covered with the molding resin, and the electrical connection is inhibited. SUMMARY

[0006] Therefore, an object of the present application is to provide a manufacturing method of a molded chip that can ensure electrical connection of a device.

[0007] According to the present application, a manufacturing method of a molded chip is provided, wherein the manufacturing method of the molded chip has the following steps: a preparation step of adhering device faces of a plurality of device chips arranged in a row to a heat-resistant protection member to form a chip group composed of the plurality of device chips; a molding step of, after the preparation step is performed, providing a molding resin to a back face side of the device chips and a gap between the device chips, and covering the back faces and side faces of the device chips with the molding resin to form a molded wafer; and a molded division step of, after the molding step is performed, dividing the molded wafer into molded chips along the center of the gap filled with the molding resin, based on an image obtained by photographing the front face side of the molded wafer.

[0008] Preferably, the preparation step includes a groove forming step of forming a groove having a depth exceeding a finished thickness along the division predetermined line on the wafer on which the devices are formed in a plurality of regions of the front surface divided by the division predetermined line; a protective member attaching step of attaching the protective member to the front surface of the wafer on which the groove is formed; and a grinding step of grinding the back surface of the wafer to expose the groove and divide the wafer into the device chips.

[0009] Preferably, the preparation step includes a thinning step of grinding the back surface of the wafer on which the devices are formed in a plurality of regions of the front surface divided by the division predetermined line to a finished thickness; and a division step of dividing the thinned wafer along the division predetermined line.

[0010] Preferably, the method of manufacturing the molded chip further has an expanding step of expanding the distance between the device chips from each other in a planar direction after the preparation step is performed and before the molding step is performed.

[0011] Preferably, the outer peripheral side surface of the wafer is formed in a circular arc shape, and the preparation step includes an edge trimming step of removing the portion of the circular arc shape on the front surface side of the wafer along the outer periphery of the wafer, and in the molding step, the molding resin supplied to the back surface of the wafer is pressed toward the back surface of the wafer using a mold.

[0012] Preferably, the method of manufacturing the molded chip further has a protective member peeling step of peeling the protective member from the front surface side of the molded wafer by attaching an adhesive tape to the back surface side of the molded wafer after the molding step is performed, and in the molding division step, the division processing is performed from the front surface side of the molded wafer.

[0013] The method of manufacturing the molded chip according to the present application has an effect of being able to ensure electrical connection of the devices. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a perspective view showing an example of a molded chip manufactured by the method of manufacturing the molded chip according to the first embodiment.

[0015] Figure 2 is a perspective view showing an example of a wafer to be manufactured into a molded chip shown in Figure 1

[0016] Figure 3 is a sectional view along the line III-III in Figure 2

[0017] Figure 4 is a flowchart showing a flow of the method of manufacturing the molded chip according to the first embodiment.

[0018] Figure 5 ​​It is shown schematically. Figure 4 A side view of the edge trimming step in the preparation step of the manufacturing method of the molded chip shown.

[0019] Figure 6 It is shown schematically. Figure 4 A side view of the groove forming step in the preparation step of the manufacturing method of the molded chip shown.

[0020] Figure 7 It is shown schematically. Figure 4 The cross-sectional view of the wafer after the protective component pasting step in the preparation step of the manufacturing method of the molded chip shown.

[0021] Figure 8 It is shown schematically in partial cross-section. Figure 4 A side view of the grinding step in the preparation process of the method for manufacturing a molded chip.

[0022] Figure 9 It is shown schematically. Figure 4 A cross-sectional view of the molding step in the manufacturing method of the molded chip shown.

[0023] Figure 10 It is shown schematically. Figure 4 A cross-sectional view of the molding division step in the manufacturing method of the molded chip shown.

[0024] Figure 11 This is a flowchart illustrating the manufacturing method of the molded chip according to the second embodiment.

[0025] Figure 12 It is shown schematically in partial cross-section. Figure 11 A side view of the thinning step in the preparation process of the method for manufacturing a molded chip.

[0026] Figure 13 It is shown schematically in partial cross-section. Figure 11 A side view of the cutting step in the preparation step of the method for manufacturing a molded chip.

[0027] Figure 14 This is a flowchart illustrating the manufacturing method of a molded chip according to a first variation of the first and second embodiments.

[0028] Figure 15 It is shown schematically. Figure 14 The diagram shows a cross-sectional view of the extended steps of the method for manufacturing molded chips, in which the various divided device chips are held in an extended device.

[0029] Figure 16 It is an illustrative representation of the... Figure 15 The cross-sectional view shown is of the extended protective component.

[0030] Figure 17 is a cross-sectional view schematically showing a state of contraction between a device chip and a ring-shaped frame of the protective member shown in Figure 16

[0031] Figure 18 is a flowchart showing a manufacturing method of a molded chip of the second modification of the first embodiment and the second embodiment.

[0032] Figure 19 is a cross-sectional view schematically showing a state of contraction between a device chip and a ring-shaped frame of the protective member shown in Figure 18

[0033] Figure 20 is a side view schematically showing a molding step of the manufacturing method of the molded chip shown in Figure 18

[0034] Figure 21 is a side view schematically showing a grinding step of the manufacturing method of the molded chip of the third modification of the first embodiment in a partial cross section.

[0035] Figure 22 is a cross-sectional view schematically showing a molding step of the manufacturing method of the molded chip of the third modification of the first embodiment.

[0036] Figure 23 is a side view schematically showing a thinning step of the manufacturing method of the molded chip of the third modification of the second embodiment in a partial cross section.

[0037] Explanation of Reference Numerals

[0038] 1: molded chip; 2: device chip; 3: molding resin; 5: front surface; 6: device; 7: back surface; 8: side surface; 10: wafer; 11: division predetermined line; 12: outer peripheral side surface; 13: circular arc-shaped portion; 14: chip group; 15: finished thickness; 16: groove; 17: gap; 18: molded wafer; 53: mold (mold); 100: protective member; 110: adhesive tape; ST1, ST1-2: preparation step; ST2: molding step; ST3: molded division step; ST11: edge trimming step; ST12: groove forming step; ST13: protective member attaching step; ST14: grinding step; ST15: thinning step; ST16: division step; ST20: expanding step; ST21: protective member peeling step. DETAILED DESCRIPTION

[0039] ​​​Embodiments of the present application will be described below in detail with reference to the accompanying drawings. The present application is not limited by the contents described in the following embodiments. In addition, the following described constituent elements include matters that can be easily conceived by those skilled in the art, matters that are substantially the same. In addition, the following described structures can be appropriately combined. In addition, various omissions, substitutions, or alterations of the structures can be made within a range not departing from the gist of the present application.

[0040] [1st Embodiment]

[0041] A manufacturing method of a molded chip of a 1st embodiment of the present application will be described with reference to the drawings. Figure 1 is a perspective view showing an example of a molded chip manufactured by the manufacturing method of the molded chip of the 1st embodiment. Figure 2 is a perspective view showing a wafer to be manufactured into Figure 1 a molded chip shown in Figure 3 is a cross-sectional view along the III-III line in Figure 2

[0042] As shown in Figure 1 , a molded chip 1 of the 1st embodiment includes a device chip 2 and a molded resin 3. As shown in Figure 2 , the device chip 2 includes a substrate 4 and a device 6 formed on a front surface 5 of the substrate 4. The front surface of the device 6 corresponds to a device surface. Thus, the device chip 2 has the device surface on the front surface 5 of the substrate 4. The device 6 is an electronic component such as an IC (Integrated Circuit) or an LSI (Large Scale Integration). In addition, the device chip 2 is provided with at least one of a plurality of unillustrated electrodes and electrode bumps for connecting the device surface with an unillustrated substrate or another device chip on the device surface of the device 6.

[0043] The molded resin 3 is composed of a synthetic resin having insulating properties, and covers a back surface 7 of the substrate 4 of the device chip 2, which is located on the opposite side of the front surface 5 on which the device 6 is provided, and side surfaces 8 that are connected to the front surface 5 and the back surface 7. In the embodiment, the molded resin 3 covers all of the side surfaces 8.

[0044] The molded chip 1 of the above-described structure is manufactured by dividing the wafer 10 shown in Figure 2 into the device chip 2, and covering the back surface 7 and the side surfaces 8 of the substrate 4 of the device chip 2 with the molded resin 3. The wafer 10 to be manufactured into the device chip 2 is a round plate-like semiconductor wafer or an optical device wafer having silicon, sapphire, or gallium arsenide as the substrate 4. In addition, in the description of the wafer 10, the same reference numerals are assigned to the same parts as the device chip 2, and the description will be made. As shown in Figure 2 ​As shown, the wafer 10 is formed with the devices 6 in a plurality of regions of the front surface 5 of the substrate 4 divided by the division predetermined lines 11.

[0045] In addition, as Figure 3 shown, the outer peripheral side surface 12 of the wafer 10 is formed in a circular arc shape projecting outward in the peripheral direction. The outer peripheral side surface 12 of the wafer 10 is formed in a cross-sectional circular arc shape projecting most outward in the peripheral direction in the thickness direction. That is, a circular arc shaped portion 13 is formed along the entire circumference at the outer periphery of the wafer 10.

[0046] Next, the manufacturing method of the molded chip 1 shown in Figure 1 will be described. Figure 4 is a flowchart showing the flow of the manufacturing method of the molded chip of the first embodiment.

[0047] The manufacturing method of the molded chip is a method of dividing the wafer 10 into individual device chips 2 along the division predetermined lines 11 and covering the back surface 7 and the side surface 8 of the device chip 2 with the molding resin 3 to manufacture the molded chip 1. As Figure 4 shown, the manufacturing method of the molded chip has a preparation step ST1, a molding step ST2, and a molded division step ST3.

[0048] (Preparation Step)

[0049] Figure 5 is a side view schematically showing the edge trimming step of the preparation step of the manufacturing method of the molded chip shown in Figure 4 Figure 6 is a side view schematically showing the groove forming step of the preparation step of the manufacturing method of the molded chip shown in Figure 4 Figure 7 is a cross-sectional view of the wafer after the protection member attaching step of the preparation step of the manufacturing method of the molded chip shown in Figure 4 Figure 8 is a side view schematically showing the grinding step of the preparation step of the manufacturing method of the molded chip shown in Figure 4

[0050] The preparation step ST1 is a step of attaching the device faces of the plurality of device chips 2 in a row to the heat-resistant protection member 100 to form a chip group 14 (shown in Figure 9 ) composed of the plurality of device chips 2 in a row. In the first embodiment, as Figure 4 shown, the preparation step ST1 includes an edge trimming step ST11, a groove forming step ST12, a protection member attaching step ST13, and a grinding step ST14.

[0051] (Edge Trimming Step)

[0052] ​​​​The edge trimming step ST11 is a step of removing the circular-arc-shaped portion 13 on the front surface 5 side of the wafer 10 along the outer periphery of the wafer 10. In the edge trimming step ST11, in the first embodiment, the cutting device 20 suction-holds the back surface 7 side of the wafer 10 on the holding surface 22 of the chuck table 21.

[0053] In the edge trimming step ST11, the cutting device 20 suction-holds the back surface 7 side of the wafer 10 on the holding surface 22 of the chuck table 21, as shown in FIG. 2, while rotating the chuck table 21 around an axis parallel to the vertical direction, and while rotating the cutting tool 25 rotating through the spindle 24 of the cutting unit 23, the cutting tool 25 is cut into the circular-arc-shaped portion 13 from the front surface 5 side of the wafer 10 to a depth exceeding the finished thickness 15 (shown in FIG. 1), and the circular-arc-shaped portion 13 on the front surface 5 side is removed. When the circular-arc-shaped portion 13 is removed from the front surface 5 side along the entire circumference of the wafer 10 in the edge trimming step ST11, the groove forming step ST12 is entered. In addition, the finished thickness 15 is the thickness of the wafer 10 that is thinned by the grinding step ST14. Figure 5 Figure 1 In the edge trimming step ST11, the cutting device 20 suction-holds the back surface 7 side of the wafer 10 on the holding surface 22 of the chuck table 21, as shown in FIG. 2, while rotating the chuck table 21 around an axis parallel to the vertical direction, and while rotating the cutting tool 25 rotating through the spindle 24 of the cutting unit 23, the cutting tool 25 is cut into the circular-arc-shaped portion 13 from the front surface 5 side of the wafer 10 to a depth exceeding the finished thickness 15 (shown in FIG. 1), and the circular-arc-shaped portion 13 on the front surface 5 side is removed. When the circular-arc-shaped portion 13 is removed from the front surface 5 side along the entire circumference of the wafer 10 in the edge trimming step ST11, the groove forming step ST12 is entered. In addition, the finished thickness 15 is the thickness of the wafer 10 that is thinned by the grinding step ST14.

[0054] (Groove forming step)

[0055] The groove forming step ST12 is a step of forming grooves 16 on the wafer 10 along the dicing lines 11 of the front surface 5 to a depth exceeding the finished thickness 15. In the groove forming step ST12, the cutting device 30 suction-holds the back surface 7 side of the wafer 10 on the holding surface 32 of the chuck table 31, performs alignment by photographing the front surface 5 of the wafer 10 using a not-shown photographing unit, and performs alignment of the cutting tool 35 of the cutting unit 33 with the dicing lines 11 of the wafer 10.

[0056] In the groove forming step ST12, as shown in FIG. 3, the cutting device 30, based on the alignment result, moves the wafer 10 and the cutting tool 35 relatively along the dicing lines 11 and cuts the cutting tool 35 into the wafer 10 from the front surface 5 side of the dicing lines 11 deeper than the finished thickness 15, and forms the grooves 16 on the dicing lines 11 to a depth exceeding the finished thickness 15. Figure 6 When the grooves 16 are formed by the cutting device 30 on all of the dicing lines 11 in the groove forming step ST12, the protective member attaching step ST13 is entered.

[0057] (Protective member attaching step)

[0058] ​The protection member attaching step ST13 is a step of attaching a protection member 100 as a wafer protection member to the front surface 5 of the wafer 10 formed with the groove 16. In the first embodiment, the protection member 100 is a round plate-shaped protection tape having heat resistance and flexibility, which has a larger diameter than the outer diameter of the wafer 10. In addition, the heat resistance means that the physical properties and the like do not change even when heated to the temperature at which the back surface 7 and the side surface 8 of the device chip 2 are covered with the molding resin 3 in the molding step ST2.

[0059] In the protection member attaching step ST13 in the first embodiment, a known chip mounter attaches the protection member 100 to the front surface 5 of the wafer 10 and the annular frame 101 after attracting and holding the wafer 10 and the annular frame 101 to the holding surface of the chuck table, as shown in FIG. 6. In the protection member attaching step ST13, the wafer 10 is held to the annular frame 101 by the protection member 100, as shown in FIG. 7. When the protection member 100 is attached to the front surface 5 of the wafer 10 in the protection member attaching step ST13, the grinding step ST14 is entered. Figure 7 Figure 7 In the protection member attaching step ST13 in the first embodiment, a known chip mounter attaches the protection member 100 to the front surface 5 of the wafer 10 and the annular frame 101 after attracting and holding the wafer 10 and the annular frame 101 to the holding surface of the chuck table, as shown in FIG. 6. In the protection member attaching step ST13, the wafer 10 is held to the annular frame 101 by the protection member 100, as shown in FIG. 7. When the protection member 100 is attached to the front surface 5 of the wafer 10 in the protection member attaching step ST13, the grinding step ST14 is entered.

[0060] (Grinding step)

[0061] The grinding step ST14 is a step of grinding the back surface 7 of the wafer 10 to expose the groove 16 on the back surface 7 side and dividing the wafer 10 into the device chips 2. In the first embodiment, in the grinding step ST14, the grinding device 40 attracts and holds the front surface 5 side of the wafer 10 to the holding surface 42 of the chuck table 41 through the protection member 100 and grips the annular frame 101 with the gripping portion 43. In the grinding step ST14, the grinding device 40 presses the grinding tool 47 of the grinding unit 46 rotating around the axis to the back surface 7 of the wafer 10 while rotating the chuck table 41 around the axis and supplying the grinding water 45 to the back surface 7 of the wafer 10 from the grinding water nozzle 44, as shown in FIG. 8. Figure 8

[0062] In the grinding step ST14, the grinding device 40 grinds and thins the wafer 10 from the back surface 7 side until the wafer 10 is ground to the finished thickness 15. In the grinding step ST14, the groove 16 having a depth exceeding the finished thickness 15 is formed on the wafer 10 from the front surface 5 side, and thus when the wafer 10 is thinned to the finished thickness 15 by the grinding device 40, the groove 16 is exposed on the back surface 7 side and the wafer 10 is divided into the individual device chips 2. In addition, the gap 17 equal to the width of the groove 16 is formed between the adjacent device chips 2. Figure 9 ​​Thus, a chip group 14 composed of a plurality of device chips 2 to which the protection member 100 is attached on the device face is formed. When the wafer 10 is thinned to the finished thickness 15 in the grinding step ST14, the preparation step ST1 ends and the molding step ST2 is entered.

[0063] (Molding Step)

[0064] Figure 9 is a cross-sectional view schematically showing Figure 4 the molding step of the manufacturing method of the molded chip shown in FIG. 1. The molding step ST2 is a step of providing molten molding resin 3 to the back face 7 side of the device chip 2 and the gap 17 between the device chips 2 after the preparation step ST1 is implemented, and covering the back face 7 and the side face 8 of the device chip 2 with the molding resin 3 to form a molded wafer 18. In addition, the molded wafer 18 is formed in a circular plate shape that is thicker than the wafer 10 after the grinding step ST14 that is thinned to the finished thickness 15, and has a larger outer diameter than the wafer 10.

[0065] In the first embodiment, in the molding step ST2, as shown in FIG. 2, Figure 9 the protection member 100 is held on the flat holding face 52 of the table 51 of the molding machine 50, and all of the device chips 2 attached to the protection member 100 are covered with a mold for molding, i.e., a casting mold 53 that has a cylindrical cavity 54 on the inner side, which is spaced apart from the plurality of device chips 2 attached to the protection member 100 and follows the outer shape of the molded wafer 18.

[0066] In the molding step ST2, pellets of the molding resin 3 are fed to an unillustrated hopper of the molding machine 50, and the molding machine 50 heats the molding resin 3 in pellet form in a heated cylinder to melt it and performs mixing in the heated cylinder, and then extrudes the molding resin 3 into the cavity 54 of the casting mold 53. In the molding step ST2, the molding resin 3 extruded into the cavity 54 and provided to the back face 7 of the wafer 10 is pressed toward the back face 7 of the device chip 2 by the molding machine 50, and hardens after covering the back face 7 and the side face 8. When the molding resin 3 in the cavity 54 hardens in the molding step ST2, the molding and dividing step ST3 is entered. Other than this, in the molding step ST2, the chip group in which the plurality of device chips 2 are arranged can be dipped in the molding resin in a liquid state to form a layer of the molding resin 3, or the chip group in which the plurality of device chips 2 are arranged can be laminated with a film-shaped molding resin material to form a layer of the molding resin 3.

[0067] (Molding and Dividing Step)

[0068] Figure 10 is a cross-sectional view schematically showing Figure 4A sectional view of a molding division step of the manufacturing method of the molded chip. The molding division step ST3 is a step of dividing the molded wafer 18 into the molded chips 1 along the center of the gap 17 filled with the molding resin 3 according to an image obtained by photographing the front surface 5 side of the molded wafer 18 after the molding step ST2 is implemented.

[0069] In the molding division step ST3, the cutting device 60 places the central portion of the protection member 100, which is attached to the plurality of device chips 2 on the front surface 5 side, on the light-transmitting plate 62, which is a circular plate-shaped light-transmitting material made of glass or the like having light-transmitting properties, of the chuck table 61, and places the outer edge portion of the protection member 100, which is attached to the annular frame 101, on the frame body 66, which is a circular ring-shaped frame made of stainless steel or the like, which surrounds the light-transmitting plate 62. In the molding division step ST3, the cutting device 60 holds the outer edge portion of the protection member 100 by suction through the suction port 67 provided to the frame body 66, and photographs the front surface 5 of the plurality of device chips 2 of the molded wafer 18 through the light-transmitting plate 62 using the photographing unit 68 disposed below the light-transmitting plate 62, to obtain an image of the front surface 5 of the plurality of device chips 2 of the molded wafer 18.

[0070] In the molding division step ST3, the cutting device 60 performs alignment according to the image of the front surface 5 of the plurality of device chips 2 of the molded wafer 18, and performs alignment of the cutting tool 65 of the cutting unit 63 with the center in the width direction of the gap 17. In the molding division step ST3, as shown in Figure 10 the cutting device 60 moves the wafer 10 and the cutting tool 65 relatively along the division predetermined line 11 while causing the cutting tool 65 to cut into the center in the width direction of the gap 17 from the molded resin 3 side, that is, the back surface 7 side, until the protection member 100 is reached, to divide the molded wafer 18 into the molded chips 1 according to the alignment result. When the cutting device 60 cuts the cutting tool 65 into the center of the gap 17 along all of the division predetermined lines 11 to divide the molded wafer 18 into the molded chips 1 in the molding division step ST3, the manufacturing method of the molded chip ends. Each of the molded chips 1 obtained by division is picked up from the protection member 100 by a known picker. In the molding division step ST3, the cutting tool 65 having a width narrower than that of the gap 17 is used to cut the molded wafer 18.

[0071] The manufacturing method of the molded chip of the first embodiment has a groove forming step ST12 of forming a groove 16 having a depth exceeding the finished thickness 15 on the front surface 5 of the wafer 10, a protective member attaching step ST13 of attaching the protective member 100 on the front surface 5 of the wafer 10, and a grinding step ST14 of thinning the wafer 10 from the back surface 7 side to the finished thickness 15 to thereby divide the wafer 10 into individual device chips 2 in a state of being attached to the protective member 100. Further, the manufacturing method of the molded chip has a molding step ST2 of covering the back surface 7 and the side surface 8 of the plurality of device chips 2 with the molding resin 3 on the protective member 100.

[0072] Accordingly, the manufacturing method of the molded chip can cover the back surface 7 and the side surface 8 of the plurality of device chips 2 with the molding resin 3 in a state of maintaining the relative positions of the devices 6 on the wafer 10 to each other. As a result, the manufacturing method of the molded chip 1 can suppress the electrodes or the electrode bumps of the device surfaces from being contaminated with the molding resin 3 and can ensure the electrical connection of the devices 6.

[0073] Further, the manufacturing method of the molded chip of the first embodiment has the edge trimming step ST11 of removing the circular arc-shaped portion 13 on the front surface 5 side of the wafer 10, and thus the blade-shaped portion formed by thinning the circular arc-shaped portion 13 is not left at a position on the outer peripheral side than the outermost peripheral device chip 2 after the grinding step ST14. Accordingly, the manufacturing method of the molded chip of the first embodiment can suppress the device chips 2 near the wafer outer periphery from being tilted due to the blade-shaped portion or the like when the molding resin 3 is pressed and filled from the back surface 7 side of the wafer 10 in the molding step ST2. As a result, the manufacturing method of the molded chip of the first embodiment can suppress the adverse effects such as the positional displacement of the device chips 2 when the device chips 2 are covered with the molding resin 3 in the molding step ST2.

[0074] Further, the manufacturing method of the molded chip of the first embodiment cuts the cutting tool 35 from the front surface 5 side in the groove forming step ST12 and cuts the cutting tool 65 from the molding resin 3 side of the molded wafer 18 in the molding division step ST3, and thus the cutting chips generated in the groove forming step ST12 and the molding division step ST3 can be suppressed from adhering to the device surfaces. Further, in the present application, the molding division step ST3 can be performed by ablation processing or processing of forming a modified layer by irradiating laser light having an absorbance or permeability with respect to the molding resin 3.

[0075] [Second Embodiment]

[0076] The manufacturing method of the molded chip of the second embodiment of the present application will be described with reference to the drawings. Figure 11 is a flowchart showing the flow of the manufacturing method of the molded chip of the second embodiment.Figure 12 is schematically shown in partial cross section Figure 11 is a side view of a thinning step of the preparation step of the manufacturing method of the molded chip shown. Figure 13 is schematically shown in partial cross section Figure 11 is a side view of a division step of the preparation step of the manufacturing method of the molded chip shown. In addition, Figure 11 , Figure 12 and Figure 13 , the same reference numerals are assigned to the same parts as those of the first embodiment, and the description thereof is omitted.

[0077] The manufacturing method of the molded chip of the second embodiment is a method of manufacturing the molded chip 1, like the first embodiment. As shown in Figure 11 , the manufacturing method of the molded chip of the second embodiment has a preparation step ST1, a molding step ST2, and a molded division step ST3, and the preparation step ST1 has an edge trimming step ST11, a thinning step ST15, and a division step ST16.

[0078] (thinning step)

[0079] The thinning step ST15 is a step of thinning the wafer 10 to the finished thickness 15 by grinding the back surface 7 of the wafer 10. In the second embodiment, in the thinning step ST15, the protective member 100 is attached to the front surface 5 side of the wafer 10 after the edge trimming step ST11, and the annular frame 101 is attached to the outer edge portion of the protective member 100. In the thinning step ST15, the grinding device 70 sucks and holds the front surface 5 side of the wafer 10 after the edge trimming step ST11 to the holding surface 72 of the chuck table 71 through the protective member 100, and grips the annular frame 101 with the grip portion 73. In the thinning step ST15, as shown in Figure 12 , the grinding device 70 rotates the chuck table 71 around the axis and supplies the grinding water 75 to the back surface 7 of the wafer 10 from the grinding water nozzle 74 while pressing the grinding tool 77 of the grinding unit 76 rotating around the axis to the back surface 7 of the wafer 10.

[0080] In the thinning step ST15, the grinding device 70 grinds and thins the wafer 10 from the back surface 7 side, and grinds the wafer 10 to the finished thickness 15. In the thinning step ST15, since the arc-shaped portion 13 of the wafer 10 has been removed from the front surface 5 side in the edge trimming step ST11 to a depth exceeding the finished thickness 15, the arc-shaped portion 13 is completely removed when the grinding device 70 thins the wafer 10 to the finished thickness 15. When the wafer 10 is thinned to the finished thickness 15 in the thinning step ST15, the division step ST16 is entered.

[0081] (division step)

[0082] The dividing step ST16 is a step of dividing the thinned wafer 10 along the division predetermined line 11. In the dividing step ST16, the cutting device 80 sucks and holds the front surface 5 side of the wafer 10 to the holding surface 82 of the chuck table 81 through the protection member 100, and grips the annular frame 101 with the gripping portion 84. In the dividing step ST16, the cutting device 80 performs alignment by detecting the division predetermined line 11 by photographing the wafer 10 from the back surface 7 side with the infrared camera 86, and performs alignment of the cutting tool 85 of the cutting unit 83 with the division predetermined line 11 of the wafer 10.

[0083] In the dividing step ST16, as shown in FIG. 6, the cutting device 80 divides the wafer 10 into individual device chips 2 by cutting the cutting tool 85 into the wafer 10 from the back surface 7 side of the division predetermined line 11 until the protection member 100 while relatively moving the wafer 10 and the cutting tool 85 along the division predetermined line 11 in accordance with the alignment result. When the wafer 10 is divided into individual device chips 2 by cutting the cutting tool 85 into all of the division predetermined lines 11 with the cutting device 80 and the gap 17 between the device chips 2 is formed in the dividing step ST16, the preparation step ST1 ends and the molding step ST2 is entered. Figure 13

[0084] The manufacturing method of the molded chip of the second embodiment has a wafer thinning step ST15 of thinning the wafer 10 to the finished thickness 15 by attaching the protection member 100 to the front surface 5 side of the wafer 10, and a dividing step ST16 of dividing the wafer 10 into individual device chips 2, thereby dividing the wafer 10 into individual device chips 2 in a state of being attached to the protection member 100. As a result, the manufacturing method of the molded chip functions to enable the molded resin 3 to be coated on the back surface 7 and the side surface 8 of the plurality of device chips 2 while maintaining the relative positions of the devices 6 on the wafer 10, to be able to suppress contamination of the electrodes or electrode bumps of the device surfaces by the molded resin 3, and to be able to ensure electrical connection of the devices 6.

[0085] In addition, the preparation step ST1 of the manufacturing method of the molded chip of the first embodiment has the edge trimming step ST11 of removing the arc-shaped portion 13 of the front surface 5 side of the wafer 10, and therefore the blade-shaped portion formed by thinning the arc-shaped portion 13 is not left at a position on the outer peripheral side than the outermost device chip 2 after the grinding step ST14. As a result, the manufacturing method of the molded chip of the second embodiment is able to suppress adverse effects such as positional displacement of the device chips 2 when the device chips 2 are coated with the molded resin 3 in the molding step ST2.

[0086] ​In addition, the manufacturing method of the molded chip of the second embodiment makes the cutting tool 85 cut from the back surface 7 side in the dividing step ST16, and makes the cutting tool 65 cut from the molded resin 3 side of the molded wafer 18 in the molded dividing step ST3, and thus it is possible to suppress the cutting chips from adhering to the device surface.

[0087] [First Modification]

[0088] The manufacturing method of the molded chip of the first modification of the second embodiment will be described with reference to the drawings. Figure 14 is a flowchart showing the flow of the manufacturing method of the molded chip of the first modification of the first and second embodiments. Figure 15 is a cross-sectional view schematically showing the state in which the protection member shown in Figure 14 is a cross-sectional view showing the state in which the protection member shown in Figure 16 is a cross-sectional view schematically showing the state in which the protection member shown in Figure 15 is expanded. Figure 17 is a cross-sectional view schematically showing the state in which the device chip of the protection member shown in Figure 16 is shrunk between the device chip and the annular frame. Figure 15 , Figure 16 and Figure 17 , the same reference numerals are assigned to the same parts as those of the first and second embodiments, and the description thereof will be omitted.

[0089] The manufacturing method of the molded chip of the first modification is the same as the first or second embodiment except that the protection member 100 has stretchability, has an expanding step ST20 as shown in Figure 14 , and that the distance between the device chips 2 is expanded in the expanding step ST20 after the preparation steps ST1, ST1-2 and before the molding step ST2.

[0090] In the expanding step ST20, the expanding device 90 holds the plurality of device chips 2 adhered to the protection member 100 by gripping the annular frame 101 with the gripping portion 91 in a state in which the back surface 7 side of the device chip 2 is oriented upward. At this time, as shown in Figure 15 , the expanding device 90 makes the cylindrical expanding drum 92 abut on the region of the protection member 100 between the wafer 10 and the annular frame 101 to preliminarily maintain the protection member 100 in a flat state. The expanding drum 92 has an inner diameter smaller than the inner diameter of the annular frame 101 and an outer diameter larger than the outer diameter of the wafer 10, and is disposed at a position coaxial with the annular frame 101 fixed by the gripping portion 91.

[0091] In the first modification, in the expanding step ST20, as shown in Fig. 9, the expanding device 90 raises the expanding drum 92. Then, the protective member 100 abuts against the expanding drum 92, and thus the protective member 100 is expanded in the planar direction, and as a result, the radial tensile force acts on the protective member 100. Figure 16

[0092] When the radial tensile force acts on the protective member 100, the wafer 10 is divided into individual device chips 2, and thus the distance between the adjacent device chips 2 is expanded. In the first modification, in the expanding step ST20, the protective member 100 is expanded by raising the expanding drum 92, but the present application is not limited to this, and the holding portion 91 can be lowered. In any case, as long as the expanding drum 92 is relatively raised with respect to the holding portion 91, and the holding portion 91 is relatively lowered with respect to the expanding drum 92.

[0093] In the first modification, in the expanding step ST20, the expanding device 90 lowers the expanding drum 92 and, as shown in Fig. 10, the protective member 100 is expanded by the heating unit 93. Figure 17

[0094] ​​In the manufacturing method of the molded chip of the first modification example, the protective member 100 attached to the wafer 10 is expanded in the expanding step ST20, thereby expanding the distance between the adjacent device chips 2 from each other, and thus the molding resin 3 can be easily filled between the device chips 2 in the molding step ST2. As a result, the manufacturing method of the molded chip of the first modification example can mold the side surface 8 of the device chip 2 with an appropriate thickness in addition to the effects of the first and second embodiments. In the first modification example, an example in which the expanding drum 92 is used in the expanding step ST20 is shown, but in the present application, the protective member 100 can be expanded in the planar direction, and is not limited to the use of the expanding device 90 having the expanding drum 92. In the present application, in addition to the half-cutting using the cutting tool 35, the chip group in which the device chips 2 are arranged can be formed using a so-called SDBG method in which laser light having a wavelength that is transparent to the wafer 10 is irradiated along the division intended line 11, and after an altered layer (fracture initiation point) is formed inside, the back surface 7 is ground.

[0095] [Second Modification Example]

[0096] The manufacturing method of the molded chip of the second modification example of the first and second embodiments will be described with reference to the drawings. Figure 18 is a flowchart showing the flow of the manufacturing method of the molded chip of the second modification example of the first and second embodiments. Figure 19 is a cross-sectional view schematically showing Figure 18 the molded wafer or the like after the protective member peeling step of the manufacturing method of the molded chip. Figure 20 is a side view schematically showing Figure 18 the molding and division step of the manufacturing method of the molded chip shown in Figure 18 , Figure 19 and Figure 20 , the same reference numerals are assigned to the same parts as those of the first and second embodiments and the first modification example, and the description thereof will be omitted.

[0097] The manufacturing method of the molded chip of the second modification example has a protective member peeling step ST21 as shown in Figure 18 , and the molding and division step ST3 is different, and is the same as the first and second embodiments or the first modification example except for this. In the example shown in Figure 18 , the manufacturing method of the molded chip of the second modification example has the expanding step ST20, but in the present application, the expanding step ST20 can not be provided.

[0098] The protective component peeling step ST21 is a step performed after molding step ST2, in which adhesive tape 110 is applied to the back side 7 of the molded wafer 18 to peel the protective component 100 from the front side 5 of the molded wafer 18. In the second variation, the protective component peeling step ST21 is as follows: Figure 19 As shown, an adhesive tape 110 with a diameter larger than the molded wafer 18 and an annular frame 111 mounted on its outer edge is attached to the back side 7 of the molded wafer 18 to peel off the protective component 100, thus proceeding to the molding separation step ST3. The adhesive tape 110 may have heat resistance and elasticity like the protective component 100, or it may not have heat resistance and elasticity.

[0099] In the second variation, during the molding dicing step ST3, the cutting device 60-2 holds the back side 7 of the molded wafer 18 on the holding surface 62-2 of the chuck stage 61-2 via the adhesive tape 110, and performs alignment by photographing the front side 5 of the wafer 10 using an imaging unit (not shown). In the second variation, during the molding dicing step ST3, as... Figure 20 As shown, the cutting device 60-2 performs the following segmentation process: the cutting tool 65 cuts into the wafer 10 from the front side 5 to the center of the gap 17 in the width direction until the adhesive tape 110, and segments the wafer 10 into individual device chips 2 from the front side 5.

[0100] The molding chip manufacturing method of the second variation can coat the back surface 7 and side surface 8 of the plurality of device chips 2 with molding resin 3 while maintaining the relative position of the devices 6 on the wafer 10. Therefore, it has the same effect as the first embodiment and the second embodiment: it can suppress the contamination of the electrodes or electrode bumps on the device surface by the molding resin 3 and ensure the electrical connection of the devices 6.

[0101] [3rd Variation]

[0102] The manufacturing method of the molded chip according to the first embodiment and the third modification of the second embodiment of the present invention will be described with reference to the accompanying drawings. Figure 21 This is a side view schematically showing the grinding step of the method for manufacturing a molded chip in the third variation of the first embodiment in partial cross-section. Figure 22 This is a cross-sectional view schematically illustrating the molding steps of a method for manufacturing a molded chip according to a third variation of the first embodiment. Figure 23 This is a side view schematically showing the thinning step of the method for manufacturing a molded chip in the third variation of the second embodiment in partial cross-section.

[0103] The method for manufacturing the molded chip in the third variation is as follows: Figure 21 , Figure 22 and Figure 23As shown, the protective member 120 is not a protective tape having heat resistance and flexibility, but is a hard auxiliary made of a hard material, and is the same as the first embodiment or the second embodiment except for this. In addition, Figure 21 , Figure 22 and Figure 23 The grinding step ST14, the molding step ST2, and the thinning step ST15 are shown as part of the manufacturing method of the molded chip of the first embodiment or the second embodiment, but the other steps are the same, and the protective member 120 is a hard auxiliary. The protective member 120 of the third modification example is formed in a circular plate shape having a larger diameter than the wafer 10 and the molded wafer 18, and is attached to the front surface 5 of the wafer 10 with the adhesive material 121 interposed therebetween.

[0104] The manufacturing method of the molded chip of the third modification example can coat the molded resin 3 on the back surface 7 and the side surface 8 of the plurality of device chips 2 while maintaining the relative positions of the devices 6 on the wafer 10, and thus has the same effects as the first embodiment and the second embodiment, that is, it can suppress the electrodes or electrode bumps of the device surfaces from being contaminated with the molded resin 3, and can ensure the electrical connection of the devices 6.

[0105] In addition, the present application is not limited to the above-described embodiments. That is, various modifications can be made and implemented within the scope of the gist of the present application. In the first embodiment and the second embodiment, and the like, the protective member 100 having heat resistance is used, but in the present application, a protective member not having heat resistance can be attached to the front surface of the wafer 10 in the preparation step ST1, the protective member not having heat resistance is peeled off before the molding step ST2, and then the protective member 100 having heat resistance is attached to the front surface 5 of the wafer 10, that is, the device chip 2.

Claims

1. A manufacturing method of molded chips, wherein the manufacturing method of molded chips has steps of: a preparation step of adhering device faces of a plurality of device chips arranged in a row to a heat-resistant protection member to form a chip group composed of the plurality of device chips; a molding step of, after the preparation step is performed, supplying a molding resin to a back surface side of the device chips and a gap between the device chips, and covering the back surfaces and side surfaces of the device chips with the molding resin to form a molded wafer; and a molded division step of, after the molding step is performed, placing a central portion of the protection member adhered to a front surface side of the plurality of device chips on a light-transmissive plate having light-transmissivity of a chuck table, placing an outer edge portion of the protection member on a frame body surrounding the light-transmissive plate, suction-holding the outer edge portion of the protection member by a suction port provided to the frame body, and dividing the molded wafer into molded chips along a center of the gap filled with the molding resin based on an image obtained by photographing the front surface side of the molded wafer through the light-transmissive plate using a photographing unit disposed below the light-transmissive plate, the protection member is continuously adhered to the device faces from the time when the protection member is adhered to the device faces in the preparation step until the time when the molded wafer is divided into the molded chips in the molded division step.

2. The manufacturing method of molded chips according to claim 1, wherein the preparation step includes steps of: a groove formation step of forming a groove having a depth exceeding a finished thickness along a division predetermined line of the front surface in a wafer in which devices are formed in a plurality of regions divided by the division predetermined line; a protection member adhering step of adhering the protection member to the front surface of the wafer in which the groove is formed; and a grinding step of grinding the back surface of the wafer to expose the groove and divide the wafer into device chips.

3. The manufacturing method of molded chips according to claim 1, wherein the preparation step includes steps of: a thinning step of thinning the back surface of the wafer in which devices are formed in a plurality of regions divided by a division predetermined line to a finished thickness by grinding; and a division step of dividing the thinned wafer along the division predetermined line.

4. The manufacturing method of molded chips according to claim 1, wherein the manufacturing method of molded chips further has an extension step of, after the preparation step is performed and before the molding step is performed, extending the protection member in a surface direction to extend distances of the device chips from each other.

5. The manufacturing method of molded chips according to claim 1, wherein a peripheral side surface of the wafer is formed in a circular arc shape, the preparation step includes an edge trimming step of removing the portion of the circular arc shape of the front surface side of the wafer along an outer periphery of the wafer, in the molding step, the molding resin supplied to the back surface of the wafer is pressed toward the back surface of the wafer using a mold. ​

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