One-way heat conduction device

Abstract

The present invention provides a one-way heat conduction device, comprising a first heat conduction plate, a frame and a second heat conduction plate. The first heat conduction plate, the frame and the second heat conduction plate are sealed to form an internal cavity. A heat conduction medium is contained in the cavity. The second heat conduction plate transfers heat with a semiconductor cold end to reduce the temperature of the second heat conduction plate, thereby causing the heat conduction medium on the second heat conduction plate in the cavity to change from a first phase to a second phase. After solidification, the heat conduction medium expands in volume to contact with the first heat conduction plate, and heat exchange from the second heat conduction plate to the first heat conduction plate is achieved through the heat conduction medium. After refrigeration is completed, the semiconductor is powered off, and the high-temperature heat of the hot end of the semiconductor is transferred to the cold end through the second heat conduction plate, causing the heat conduction medium to be heated and changed to the first phase. The volume of the heat conduction medium decreases and no longer contacts the first heat conduction plate to conduct heat, so that the heat of the hot end of the semiconductor cannot be directly transferred to the side that has been cooled. The heat conduction device has a simple structure and can independently realize the one-way heat conduction function.

Description

Technical Field

[0001] The invention relates to the technical field of refrigeration equipment, and in particular to a one-way heat conduction device. Background Art

[0002] Thermal conduction devices are widely used in conjunction with various cooling and heating devices, such as semiconductor refrigeration equipment for hot and cold cups and refrigerators. In order to prevent the heat from being transferred back to the inner cavity after the semiconductor refrigeration unit is powered off, causing the refrigeration to fail, existing semiconductor refrigeration devices usually use thermal insulation cotton to separate the refrigeration device from the low-temperature storage cavity, and transfer heat through metal cold blocks, but this still causes the heat from the hot end of the semiconductor to be transferred to the low-temperature storage cavity; or use additional electromagnetic components to control the movement of the thermal conduction device to achieve contact between the thermal conduction device and the inner cavity when the power is on, and separation of the thermal conduction device from the inner cavity when the power is off, so as to prevent heat from being transferred back after the power is off, causing the refrigeration to fail. However, the additional electromagnetic components make the entire semiconductor refrigeration device complex in structure and occupy a large space. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a one-way heat conduction device which has a simple structure and can independently realize the one-way heat conduction function.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] A one-way heat conduction device comprises a first heat conduction plate, a frame and a second heat conduction plate. The first heat conduction plate, the frame and the second heat conduction plate are sealed and connected in sequence to form an internal cavity. A heat conduction medium is contained in the cavity. The heat conduction medium is placed on the second heat conduction plate in the cavity. A gap is provided between the heat conduction medium and the first heat conduction plate in a first phase state. The heat conduction medium contacts the first heat conduction plate in a second phase state.

[0006] The beneficial effects of the present invention are as follows: a one-way heat conduction device of the present invention, the outer side of the first heat conduction plate contacts the cavity to be refrigerated, and the outer side of the second heat conduction plate contacts the cold end of the semiconductor refrigeration device. When working, the second heat conduction plate transfers heat with the cold end of the semiconductor refrigeration device to reduce the temperature of the second heat conduction plate, thereby causing the heat-conducting medium on the second heat conduction plate in the cavity to solidify from the first phase to the second phase. After solidification, the volume of the heat-conducting medium expands to contact with the first heat conduction plate. At this time, heat exchange from the second heat conduction plate to the first heat conduction plate is realized through the heat-conducting medium. After refrigeration is completed, the semiconductor refrigeration device is powered off, and the high-temperature heat of the hot end of the semiconductor refrigeration device is transferred to the cold end and heat exchange is generated with the heat-conducting medium in the cavity through the second heat conduction plate. The heat-conducting medium changes to the first phase due to heat, and the volume of the heat-conducting medium decreases and no longer contacts the first heat conduction plate to conduct heat. The heat at the hot end of the semiconductor chip cannot be directly transferred to the cooled container. The heat-conducting device has a simple structure and can independently realize the one-way heat conduction function. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a longitudinal cross-sectional schematic diagram of the first phase state of the heat-conducting medium of the one-way heat-conducting device of the first embodiment of the present invention;

[0008] Figure 2 It is a longitudinal cross-sectional schematic diagram of the heat-conducting medium in the second phase state of the one-way heat-conducting device of the first embodiment of the present invention;

[0009] Figure 3 This is a schematic diagram of the exploded structure of the one-way heat conduction device according to the first embodiment of the present invention;

[0010] Figure 4 This is a schematic structural diagram of a first heat conducting plate of a one-way heat conducting device according to Embodiment 1 of the present invention;

[0011] Figure 5 This is a schematic diagram of the structure of a small refrigerator according to the second embodiment of the present invention.

[0012] Description of labels:

[0013] 10. Box shell; 11. Inner liner; 12. One-way heat conduction device; 13. Semiconductor refrigeration device; 14. Radiator; 15. Sealed heat insulation bracket; 16. Box cover;

[0014] 121. first heat conducting plate; 122. frame; 123. second heat conducting plate; 124. heat conducting medium; 125. cavity; 126. convex column. DETAILED DESCRIPTION

[0015] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation methods and the accompanying drawings.

[0016] Please refer to Figures 1 to 4 A one-way heat conduction device comprises a first heat conduction plate, a frame and a second heat conduction plate. The first heat conduction plate, the frame and the second heat conduction plate are sealed and connected in sequence to form an internal cavity. The cavity contains a heat conduction medium, which is placed on the second heat conduction plate in the cavity. A gap is provided between the heat conduction medium and the first heat conduction plate in a first phase state, and the heat conduction medium contacts the first heat conduction plate in a second phase state.

[0017] From the above description, it can be seen that the beneficial effects of the present invention are: a one-way heat conduction device of the present invention, the outer side of the first heat conduction plate is in contact with the heat exchange space, and the outer side of the second heat conduction plate is in contact with the semiconductor cold end. When working, the second heat conduction plate transfers heat with the semiconductor cold end to reduce the temperature of the second heat conduction plate, thereby causing the heat-conducting medium on the second heat conduction plate in the cavity to solidify from the first phase to the second phase. After solidification, the volume of the heat-conducting medium expands to contact with the first heat conduction plate. At this time, the first heat conduction plate realizes heat exchange with the second heat conduction plate through the heat-conducting medium. After the refrigeration is completed, the semiconductor is powered off, and the high-temperature heat of the hot end of the semiconductor is transferred to the cold end and heat is exchanged with the heat-conducting medium in the cavity through the second heat conduction plate. The heat-conducting medium changes to the first phase due to heat, and the volume of the heat-conducting medium decreases and no longer contacts the first heat conduction plate to conduct heat. The heat at the hot end of the semiconductor sheet cannot be directly transferred to the cooled container. The heat-conducting device has a simple structure and can independently realize the one-way heat conduction function.

[0018] Furthermore, a protruding column is provided on a surface of the first heat conducting plate facing the second heat conducting plate.

[0019] It can be seen from the above description that providing the protruding column can increase the thickness of the first heat conducting plate and reduce the vertical distance between the first heat conducting plate and the second heat conducting plate.

[0020] Furthermore, a plurality of protruding pillars are evenly and spaced apart on a surface of the first heat conducting plate facing the second heat conducting plate.

[0021] It can be seen from the above description that a plurality of evenly arranged protrusions are conducive to even transfer of heat.

[0022] Furthermore, there is a gap between the heat-conducting medium and the convex column in the first phase, and the heat-conducting medium is in contact with the convex column in the second phase.

[0023] It can be seen from the above description that the heat-conducting medium contacts the convex column of the first heat-conducting plate in the working state, which can reduce the amount of the heat-conducting medium, thereby achieving a faster phase transition and saving costs.

[0024] Furthermore, the heat conducting medium is water or salt water.

[0025] From the above description, it can be seen that using water or salt water as a heat conducting medium can improve the efficiency of heat conduction because water and salt water have a high freezing point and good thermal conductivity when in solid state.

[0026] Furthermore, the frame is a heat-insulating frame.

[0027] It can be seen from the above description that the frame made of the heat insulating material can effectively block the heat transfer between the first heat conducting plate and the second heat conducting plate.

[0028] Furthermore, the first heat conducting plate, the frame and the second heat conducting plate are sealed and connected by screws.

[0029] As can be seen from the above description, the first heat conducting plate, the frame body and the second heat conducting plate are sealed with screws, which can make the connection more sealed to prevent leakage of the heat conducting medium.

[0030] Please refer to Figures 1 to 4 , Embodiment 1 of the present invention is:

[0031] A one-way heat conduction device 12, comprising a first heat conduction plate 121, a frame 122, and a second heat conduction plate 123, wherein the first heat conduction plate 121 and the second heat conduction plate 123 are aluminum plates, and the frame 122 is a heat insulation frame made of EVA heat insulation material, wherein the first heat conduction plate 121, the frame 122, and the second heat conduction plate 123 are placed in sequence and sealed and connected at four corners by screws;

[0032] Among them, the frame 122 and the first heat conducting plate 121 and the second heat conducting plate 123 form a closed cavity 125, the first heat conducting plate 121 is evenly provided with a plurality of protrusions 126 along the direction of the second heat conducting plate 123, 92% of the volume of the heat conducting medium 124 is injected into the cavity 125, the heat conducting medium 124 is salt water, and the volume of the cavity 125 is the volume between the plane formed by the lower surface of the protrusion 126 and the upper surface of the second heat conducting plate 123; the heat conducting medium 124 is separated from the protrusion 126 when in liquid state, and the heat conducting medium 124 is in contact with the protrusion 126 when in solid state. In other equivalent embodiments, the heat conducting medium can also be other working mediums that can realize the change between the first phase and the second phase, the amount of the heat conducting medium can be changed according to actual needs, and the frame can be other insulation materials.

[0033] Please refer to Figure 1 , Figure 2 and Figure 5 , Embodiment 2 of the present invention is:

[0034] A small refrigerator comprises a box shell 10, an inner tank 11, a semiconductor refrigeration device 13, a radiator 14 and the one-way heat conduction device 12 of the first embodiment, wherein the inner tank 11, the semiconductor refrigeration device 13, the radiator 14 and the one-way heat conduction device 12 are installed in the box shell 10, the radiator 14 is installed at the bottom of the box shell 10, the semiconductor refrigeration device 13 is installed above the radiator 14, the hot end of the semiconductor refrigeration device 13 faces the radiator 14 below, the cold end of the semiconductor refrigeration device 13 faces upward and is in close contact with the second heat conduction plate 123 of the one-way heat conduction device 12, and the inner tank 11 is installed above the one-way heat conduction device 12 and in close contact with the first heat conduction plate 121 of the one-way heat conduction device 12;

[0035] The small refrigerator also includes a sealed insulation bracket 15 and a box cover 16. The semiconductor refrigeration device 13 and the one-way heat conduction device 12 are installed on the sealed insulation bracket 15. The sealed insulation bracket 15 separates the radiator 14 and the hot end of the semiconductor refrigeration device 13 from the cold end of the semiconductor refrigeration device 13. The inner tank 11 and the upper end opening of the box shell 10 are sealed and connected. The box cover 16 can cover the inner tank 11 tightly to isolate the heat exchange with the outside.

[0036] When the small refrigerator of this embodiment is working, after the semiconductor refrigeration device 13 is powered on, the cold end contacts the one-way heat transfer device 12 to exchange heat, and the one-way heat transfer device 12 exchanges heat with the inner container 11, thereby reducing the internal temperature of the small refrigerator to achieve low-temperature storage, and the hot end of the semiconductor refrigeration device 13 dissipates heat through the radiator 14 at the bottom;

[0037] When the power is turned off, the semiconductor refrigeration device 13 stops working, and heat exchange occurs between the hot end and the cold end, causing the cold end to heat up and further transfer the heat to the one-way heat conducting device 12. At this time, the heat conducting medium 122 in the one-way heat conducting device 12 absorbs heat and changes from the second phase to the first phase and no longer contacts the first heat conducting plate 121, thereby isolating the direct heat exchange between the hot end and the first heat conducting plate 121 and the upper inner tank 11, so that after the semiconductor refrigeration device 13 stops working, the heat at the hot end will not be transferred to the inner tank 11 to reduce the cooling effect.

[0038] In summary, the present invention provides a one-way heat conducting device with a simple structure and capable of independently realizing a one-way heat conducting function. The outer side of a first heat conducting plate contacts a heat exchange space, and the outer side of a second heat conducting plate contacts a semiconductor cold end. During operation, the second heat conducting plate transfers heat with the semiconductor cold end to reduce the temperature of the second heat conducting plate, thereby causing the heat conducting medium on the second heat conducting plate in the cavity to solidify from a first phase to a second phase. After solidification, the heat conducting medium expands in volume to contact the first heat conducting plate. At this time, the first heat conducting plate exchanges heat with the second heat conducting plate through the heat conducting medium. After refrigeration is completed, the semiconductor is powered off, and the high-temperature heat of the hot end of the semiconductor is transferred to the cold end and heat is exchanged with the heat conducting medium in the cavity through the second heat conducting plate. The heat conducting medium changes to the first phase due to heat, and the volume of the heat conducting medium decreases and no longer contacts the first heat conducting plate to conduct heat. The heat at the hot end of the semiconductor sheet cannot be directly transferred to the cooled container. The heat conducting device has a simple structure and can independently realize a one-way heat conducting function.

[0039] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A one-way heat conduction device, characterized in that: It includes a first heat conducting plate, a frame and a second heat conducting plate, wherein the first heat conducting plate, the frame and the second heat conducting plate are sealed and connected in sequence to form an internal cavity, wherein a heat conducting medium is contained in the cavity, wherein the heat conducting medium is placed on the second heat conducting plate in the cavity, wherein a gap is provided between the heat conducting medium and the first heat conducting plate in a first phase, and wherein the heat conducting medium contacts the first heat conducting plate in a second phase; a convex column is provided on a side of the first heat conducting plate facing the second heat conducting plate; and the frame is a heat insulating frame.

2. The one-way heat conduction device according to claim 1, characterized in that: A plurality of the convex pillars are evenly and spaced apart on a surface of the first heat conducting plate facing the second heat conducting plate.

3. The one-way heat conduction device according to claim 1, characterized in that: There is a gap between the heat-conducting medium and the convex column in the first phase, and the heat-conducting medium is in contact with the convex column in the second phase.

4. The one-way heat conduction device according to claim 1, characterized in that: The heat conducting medium is water or salt water.

5. The one-way heat conduction device according to claim 1, characterized in that: The first heat conducting plate, the frame and the second heat conducting plate are sealed and connected by screws.

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