A stress test system and test method for close joint tiling

Abstract

The application discloses a stress testing system and testing method for close joint laying of ceramic tiles, and the system comprises a first ceramic tile, a second ceramic tile, a stress testing plate temperature measuring device and a heating device; the first ceramic tile and the second ceramic tile are laid on a cement base layer; the stress testing plate is located between the first ceramic tile and the second ceramic tile, one side of the stress testing plate is in contact with the first ceramic tile, and the other side of the stress testing plate is in contact with the second ceramic tile; and the heating device is used for heating the cement base layer. By implementing the embodiment of the application, the stress on the adjacent ceramic tiles can be detected when the cement base layer is heated and expanded.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of ceramic tile detection, and in particular to a stress testing system and method for close-joint laying of ceramic tiles. BACKGROUND

[0002] After close-joint laying of ceramic tiles, the phenomenon of ceramic tile collapse occurs when floor heating is performed, which is due to the fact that the cement base layer under the ceramic tiles expands when heated, driving the ceramic tiles to press against each other, and the excessive pressing stress causes the ceramic tile glaze at the joint to fall off. Therefore, if the pressing stress between adjacent ceramic tiles when heated and expanded can be detected, data support can be provided for subsequent scientific construction. SUMMARY

[0003] The present application provides a stress testing system and method for close-joint laying of ceramic tiles, which can detect the stress of adjacent ceramic tiles when the cement base layer is heated and expanded.

[0004] An embodiment of the present application provides a stress testing system for close-joint laying of ceramic tiles, comprising:

[0005] a first ceramic tile, a second ceramic tile, a stress testing plate, a temperature measuring device, and a heating device;

[0006] The first ceramic tile and the second ceramic tile are laid on a cement base layer;

[0007] The stress testing plate is located between the first ceramic tile and the second ceramic tile, and one side of the stress testing plate is in contact with the first ceramic tile, and the other side of the stress testing plate is in contact with the second ceramic tile;

[0008] The temperature measuring device is used to measure the temperature of the first ceramic tile and the second ceramic tile;

[0009] The heating device is used to heat the cement base layer;

[0010] Further, it further comprises a first foam plate laid on the first ceramic tile and a second foam plate laid on the second ceramic tile.

[0011] Further, the heating device is a floor heating device.

[0012] Further, the specifications of the first ceramic tile include 300mm x 300mm, 600mm x 900mm, or 600mm x 1200mm, and the specifications of the second ceramic tile include 300mm x 300mm, 600mm x 900mm, or 600mm x 1200mm.

[0013] The present application provides a method corresponding to the above-mentioned system embodiment;

[0014] An embodiment of the present application provides a stress test method for sealing and paving ceramic tiles, which comprises paving a first ceramic tile and a second ceramic tile on a cement base layer, and contacting one side of a stress test plate with the first ceramic tile and the other side of the stress test plate with the second ceramic tile;

[0015] recording initial stress of the stress test plate, initial temperature of the first ceramic tile and initial temperature of the second ceramic tile at the initial state;

[0016] heating the cement base layer, and recording stress data of the stress test plate, temperature data of the first ceramic tile and temperature data of the second ceramic tile in real time during the heating process;

[0017] stopping heating when the temperature of the first ceramic tile or the temperature of the second ceramic tile reaches a preset temperature;

[0018] recording stress data of the stress test plate, temperature data of the first ceramic tile and temperature data of the second ceramic tile in real time during the heat dissipation process;

[0019] generating a relationship analysis result of ceramic tile stress and ceramic tile temperature according to the initial stress of the stress test plate, the initial temperature of the first ceramic tile, the initial temperature of the second ceramic tile, the stress data of the stress test plate during the heating process, the temperature data of the first ceramic tile during the heating process, the temperature data of the second ceramic tile during the heating process, the stress data of the stress test plate during the heat dissipation process, the temperature data of the first ceramic tile during the heat dissipation process and the temperature data of the second ceramic tile during the heat dissipation process; wherein the ceramic tile stress is the stress between the first ceramic tile and the second ceramic tile.

[0020] By implementing the embodiment of the present application, the following beneficial effects are achieved:

[0021] An embodiment of the present application provides a stress test system and method for sealing and paving ceramic tiles, the system comprises a first ceramic tile, a second ceramic tile, a stress test plate, a temperature measuring device and a heating device; the first ceramic tile and the second ceramic tile are paved on a cement base layer; the stress test plate is located between the first ceramic tile and the second ceramic tile, and one side of the stress test plate is in contact with the first ceramic tile and the other side of the stress test plate is in contact with the second ceramic tile; the heating device is used for heating the cement base layer; and the temperature measuring device is used for measuring the temperature of the first ceramic tile and the temperature of the second ceramic tile. When the system works, the heating device heats the cement base layer, the cement base layer expands due to heating, and the first ceramic tile and the second ceramic tile are pressed against each other, and the stress test plate arranged between the first ceramic tile and the second ceramic tile can measure the stress data between the two ceramic tiles, so that the stress of adjacent ceramic tiles can be detected when the cement base layer expands due to heating. Construction personnel can adjust the size of the gap between the two adjacent ceramic tiles according to the size of the stress data, so that scientific construction can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a structural schematic view of a stress test system for close joint tiling ceramic tiles according to an embodiment of the present application.

[0023] Figure 2 is a method flow chart of a stress test method for close joint tiling ceramic tiles according to an embodiment of the present application.

[0024] Legend: first ceramic tile 1, second ceramic tile 2, stress test plate 3, temperature measuring point 4. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0026] As shown in Figure 1 , the present application provides a stress test system for close joint tiling ceramic tiles, which comprises: a first ceramic tile 1, a second ceramic tile 2, a stress test plate 3, a temperature measuring device (not shown in the figure) and a heating device (not shown in the figure); the first ceramic tile 1 and the second ceramic tile 2 are laid on a cement base layer; the stress test plate 3 is located between the first ceramic tile 1 and the second ceramic tile 2, and one side of the stress test plate 3 is in contact with the first ceramic tile 1, and the other side of the stress test plate 3 is in contact with the second ceramic tile 2; the heating device is used for heating the cement base layer.

[0027] In this embodiment, the heating device heats the cement base layer, which will expand, and then the first ceramic tile 1 and the second ceramic tile 2 are driven to be squeezed to both sides, at this time the stress test plate 3 arranged between the first ceramic tile 1 and the second ceramic tile 2 is squeezed, and the corresponding stress data is tested. Through the stress test system for close joint tiling ceramic tiles disclosed in the embodiment of the present application, the stress change between the adjacent two ceramic tiles after the cement base layer is heated and expanded can be tested.

[0028] The temperature measuring device is used for measuring the temperature of the first ceramic tile 1 and the second ceramic tile 2. As shown in Figure 1 , the first ceramic tile 1 and the second ceramic tile 2 are provided with temperature measuring points 4, and at least one temperature measuring point 4 is arranged on each ceramic tile. The temperature measuring device collects the temperature at the temperature measuring points 4 to obtain the temperature data of each ceramic tile; the temperature data of each ceramic tile is corresponded to the stress data of the stress test plate 3, so that the relationship between stress and temperature can be analyzed, and the standardized test of the thermal stress of close joint tiling ceramic tiles can be realized.

[0029] The stress test plate 3 can be a digital display type push-pull force meter FM-207-1000K, and the temperature measuring device can be a temperature measuring gun.

[0030] Preferably, 9 temperature measuring points 4 are arranged on each ceramic tile plate, and the temperature measuring points 4 are arranged as follows: one at the center of the ceramic tile, one at each of the four corners, and one between any two of the temperature measuring points 4 at the corners, so that the temperature measuring points 4 are evenly distributed on the ceramic tile. When 9 temperature measuring points 4 are arranged on the ceramic tile, the temperature of the ceramic tile is the average of the temperatures collected by the temperature measuring points 4, so that the temperature of the ceramic tile is more accurate. Of course, if only one temperature measuring point 4 is arranged on the ceramic tile, the temperature of the temperature measuring point 4 is taken as the temperature value of the ceramic tile, and in the actual temperature measurement process, the temperature measuring gun is close to the temperature measuring point to realize temperature measurement.

[0031] In a preferred embodiment, a first foam plate is arranged on the first ceramic tile 1, and a second foam plate is arranged on the second ceramic tile 2. The foam plate is arranged to reduce heat dissipation and achieve better heating effect.

[0032] In a preferred embodiment, the heating device is a floor heating device, which is arranged under the cement base to heat the cement base. Of course, other heating devices can also be used to heat the cement base.

[0033] In a preferred embodiment, the size of the first ceramic tile 1 includes 300mm*300mm, 600mm*900mm or 600mm*1200mm, and the size of the second ceramic tile 2 includes 300mm*300mm, 600mm*900mm or 600mm*1200mm.

[0034] It should be noted that the side of the cement base in contact with the ceramic tile can have a pull groove or not, and the side of the ceramic tile not in contact with the cement base can be coated with ceramic tile glue or not.

[0035] Based on the above-mentioned system embodiments, the present application provides method embodiments:

[0036] As shown in Figure 2 An embodiment of the present application provides a stress test method for sealing and laying ceramic tiles, which comprises the following steps:

[0037] S101: The first ceramic tile and the second ceramic tile are arranged on the cement base, one side of the stress test plate is in contact with the first ceramic tile, and the other side of the stress test plate is in contact with the second ceramic tile.

[0038] Step S102: record the initial stress of the stress test plate, the initial temperature of the first tile and the initial temperature of the second tile.

[0039] Step S103: heat the cement base layer and record the stress data of the stress test plate, the temperature data of the first tile and the temperature data of the second tile in real time during the heating process.

[0040] Step S104: stop heating when the temperature of the first tile or the temperature of the second tile reaches a preset temperature.

[0041] Step S105: record the stress data of the stress test plate, the temperature data of the first tile and the temperature data of the second tile in real time during the cooling process.

[0042] Step S106: generate a relationship analysis result of tile stress and tile temperature according to the initial stress of the stress test plate, the initial temperature of the first tile, the initial temperature of the second tile, the stress data of the stress test plate during the heating process, the temperature data of the first tile during the heating process, the temperature data of the second tile during the heating process, the stress data of the stress test plate during the cooling process, the temperature data of the first tile during the cooling process and the temperature data of the second tile during the cooling process; wherein the tile stress is the stress between the first tile and the second tile.

[0043] For the above step S101, the setting mode of the first tile, the second tile and the stress test plate is the same as described in the method embodiment of the application, and will not be repeated here.

[0044] For step S102, the collection mode of the temperature of each tile is the same as described in the method embodiment of the application, and will not be repeated here.

[0045] For step S103, the cement base layer can be heated by floor heating, and then the stress data, the temperature data of the first tile and the temperature data of the second tile during the heating process are recorded in real time.

[0046] For step S104, when the first preset temperature is reached, the floor heating is turned off and the heating is stopped.

[0047] For step S105, after the heating is stopped, the first tile and the second tile start to cool down, and at this time the stress data of the stress test plate, the temperature data of the first tile and the temperature data of the second tile during the cooling process are recorded in real time until the temperature values of the first tile and the second tile both reach room temperature.

[0048] For step S106, in one preferred embodiment, a statistical chart is generated according to the data collected in the above steps, which is schematically shown as follows: taking stress value as the horizontal coordinate, taking temperature value as the vertical coordinate, and taking the temperature variation of the 9th temperature measuring point of the left and right tiles as the broken line graph, and taking the generated broken line statistical chart as the analysis result of the relationship between the ceramic tile stress and the ceramic tile temperature. Of course, other forms of statistical charts or data tables can also be used as the analysis result of the relationship between the ceramic tile stress and the ceramic tile temperature.

[0049] Table 1 shows the relevant data of the stress between the two ceramic tiles and the ceramic tile temperature during the cooling process.

[0050]

[0051]

[0052] Table 1

[0053] By implementing the present embodiment, the stress test plate can be pressed by the ceramic tile to simulate the stress condition of the ceramic tile affected by temperature, and the expansion and pressing of the ceramic tile can be standardized and quantified, which is beneficial to the standardization test of the thermal stress of the closely jointed ceramic tile, and fills the technical gap of the quality control, detection and evaluation of the closely jointed ceramic tile. In addition, the quantization standard is unified, the error is small, the data reproducibility is high, and the detection speed is fast. In the detection process, the same starting temperature and the same starting stress can be set for repeated testing, which further ensures the detection accuracy of the stress generated by the thermal expansion displacement of the ceramic tile layer under the same temperature rise, thereby being beneficial to the accuracy of the thermal stress of the closely jointed ceramic tile.

[0054] The above describes the preferred embodiments of the present application. It should be noted that those skilled in the art can make some improvements and refinements without departing from the principles of the present application, and these improvements and refinements are also considered within the protection scope of the present application.

Claims

1. A stress testing system for dry laid tiles, characterized in that, include: First ceramic tile, second ceramic tile, stress test plate, temperature measuring device, and heating device; The first and second ceramic tiles are laid on a cement base layer; The stress testing plate is located between the first ceramic tile and the second ceramic tile, with one side of the stress testing plate in contact with the first ceramic tile and the other side of the stress testing plate in contact with the second ceramic tile; The temperature measuring device is used to measure the temperature of the first ceramic tile and the second ceramic tile; The heating device is used to heat the cement base layer; One of the stress testing methods for sealed tile laying, applicable to a stress testing system for tightly laid tiles, includes: The first and second ceramic tiles are laid on the cement base, and one side of the stress test plate is in contact with the first ceramic tile, and the other side of the stress test plate is in contact with the second ceramic tile. Record the initial stress of the stress test plate, the initial temperature of the first tile, and the initial temperature of the second tile in the initial state. The cement base layer is heated, and the stress data of the stress test plate, the temperature data of the first ceramic tile, and the temperature data of the second ceramic tile are recorded in real time during the heating process. Heating stops when the temperature of the first tile or the second tile reaches the preset temperature; The stress data of the stress test plate, the temperature data of the first ceramic tile, and the temperature data of the second ceramic tile are recorded in real time during the heat dissipation process. Based on the initial stress of the stress test plate, the initial temperature of the first tile, the initial temperature of the second tile, the stress data of the stress test plate during the heating process, the temperature data of the first tile during the heating process, the temperature data of the second tile during the heating process, the stress data of the stress test plate during the heat dissipation process, the temperature data of the first tile during the heat dissipation process, and the temperature data of the second tile during the heat dissipation process, an analysis result on the relationship between tile stress and tile temperature is generated; wherein, the tile stress is the stress between the first tile and the second tile.

2. The stress test system for dry laying tiles according to claim 1, characterized in that, Also includes: A first foam board laid on the first ceramic tile and a second foam board laid on the second ceramic tile.

3. The stress test system for dry laying tiles according to claim 1, characterized in that, The heating device is a floor heating system.

4. The stress test system for tiled floor and wall coverings according to claim 1, characterized in that, The first tile has the following specifications: 300mm×300mm, 600mm×900mm or 600mm×1200mm; the second tile has the following specifications: 300mm×300mm, 600mm×900mm or 600mm×1200mm.

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