An IGBT bonder tray transfer and positioning device

Abstract

The present invention discloses a DBC tray transfer and positioning device for an IGBT bonder, which includes a mounting frame and a DBC tray that moves along the mounting frame through a conveyor belt. A positioning mechanism is slidably installed at the bottom of the mounting frame. The positioning mechanism consists of a lead screw mechanism fixedly arranged on the bottom plate of the mounting frame, a telescopic mechanism fixedly installed on the moving part of the lead screw mechanism, and a limit component fixedly installed on the telescopic mechanism. A notch matching the limit component is provided on the side of the DBC tray. With this device, the DBC tray is translated inside the mounting frame through the conveyor belt. When it is transported to the bonding operation point, the slidably arranged positioning mechanism intermittently positions the DBC tray, thereby ensuring that the DBC substrates on the DBC tray are sequentially bonded by the bonder above. This eliminates the need for manual auxiliary positioning by operators, has higher placement accuracy, and improves the production and processing efficiency, with strong practicability.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic component processing equipment, and particularly relates to a DBC tray transfer and positioning device for an IGBT bonder. Background Technique

[0002] IGBT (Insulated Gate Bipolar Transistor), that is, insulated gate bipolar transistor, is a core device for energy conversion and transmission, and is widely used in fields such as rail transit, smart grid, aerospace, electric vehicles, and new energy equipment. To improve the heat dissipation performance of power devices, increase service life and reliability, a modular packaging form with smaller volume, higher efficiency, and higher reliability has become the main packaging form of high-power IGBTs.

[0003] In the bonding process during the production of IGBT modules, bonding wires are required to connect the chips on the DBC substrate to each other and between the chips and the DBC substrate to form a complete circuit structure. Currently, in order to improve the utilization rate of the equipment, most bonders use trays to carry multiple DBC substrates for batch loading and unloading. Given that the bonding process has high requirements for the positioning accuracy of the DBC substrate, manual loading and unloading of trays is time-consuming and laborious, and cannot guarantee the placement accuracy. At the same time, it also limits the processing and production efficiency. Therefore, it is necessary to design a DBC tray transfer and positioning device for an IGBT bonder for use. Summary of the Invention

[0004] The purpose of the present invention is to provide a DBC tray transfer and positioning device for an IGBT bonder for use to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A DBC tray transfer and positioning device for an IGBT bonder, including a mounting frame and a DBC tray that moves along the mounting frame through a conveyor belt. A positioning mechanism is slidably installed at the bottom of the mounting frame. The positioning mechanism consists of a lead screw mechanism fixedly arranged on the bottom plate of the mounting frame, a telescopic mechanism fixedly installed on the moving part of the lead screw mechanism, and a limit component fixedly installed on the telescopic mechanism. A notch matching the limit component is provided on the side of the DBC tray;

[0006] The limit component is composed of two limit vertical rods symmetrically and fixedly arranged at the upper end of a horizontal plate. The horizontal plate is fixedly installed on the moving part of the lead screw mechanism;

[0007] The lead screw mechanism is composed of a lead screw rotatably installed in the middle of the bottom plate of the mounting frame, a moving nut threadedly connected to the lead screw and sliding along the lead screw, and a driving electric motor fixedly installed on the mounting frame for driving the lead screw to rotate. The lead screw is arranged parallel to the mounting frame;

[0008] An opto - electric inductor is fixedly arranged on the cross - plate;

[0009] A group of opposed sensors are arranged on the vertical plate of the mounting bracket.

[0010] Preferably, the movable nut is fixedly installed in the middle of the movable base. The lower end of the movable base is slidably connected to the mounting bracket through a guide rail, and the telescopic mechanism is fixedly installed at the upper end of the movable base.

[0011] Preferably, the telescopic mechanism is an electric push rod or an electric cylinder.

[0012] Preferably, the conveyor belt is arranged on the side wall of the vertical plate of the mounting bracket through pulleys rotatably installed on the vertical plate of the mounting bracket.

[0013] Preferably, a support bar is arranged below the conveyor belt. When the DBC tray presses on the conveyor belt, the support bar supports the conveyor belt and the DBC tray.

[0014] The technical effects and advantages of the present invention: The tray transfer and positioning device for the IGBT bonding machine,

[0015] 1. By setting a positioning mechanism for driving translation, the DBC trays are positioned multiple times at intervals, so that the DBC substrates on the DBC trays reach the bonding points in sequence for bonding operations. Finally, multiple DBC substrates on the DBC trays are completed for bonding processing, eliminating the need for manual auxiliary positioning by operators, having higher placement accuracy, and accelerating the production and processing efficiency, with strong practicability.

[0016] 2. The DBC trays are conveyed by means of belt transmission in cooperation with the mounting bracket, and the trays can be continuously conveyed to the bonding position. The tray loading and unloading efficiency is high, and it can be conveniently integrated with the automatic feeding and discharging device to realize automatic loading and unloading, further accelerating the processing efficiency. Brief Description of the Drawings

[0017] Figure 1 is the structural schematic diagram of the present invention;

[0018] Figure 2 is the internal structural schematic diagram of the mounting bracket.

[0019] In the figure: 1. Mounting bracket; 2. Conveyor belt; 3. DBC tray; 4. Positioning mechanism; 41. Lead screw mechanism; 42. Telescopic mechanism; 43. Limit assembly;

[0020] 411. Lead screw; 412. Movable nut; 413. Driving motor;

[0021] 431. Cross - plate; 432. Limit vertical rod;

[0022] 5, notch; 6, photoelectric inductor; 7, opposed sensor; 8, movable base; 9, guide rail; 10, pulley; 11, support bar. Detailed implementation

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] The present invention provides an IGBT bonder tray transfer and positioning device as shown in Figure 1-2 which includes a mounting frame 1 and a DBC tray 3 that moves along the mounting frame 1 through a conveyor belt 2. A positioning mechanism 4 is slidably mounted at the bottom of the mounting frame 1. The positioning mechanism 4 is composed of a lead screw mechanism 41 fixedly arranged on the bottom plate of the mounting frame 1, a telescopic mechanism 42 fixedly installed on the movable part of the lead screw mechanism 41, and a limit component 43 fixedly installed on the telescopic mechanism 42. A notch 5 matching the limit component 43 is provided on the side of the DBC tray 3.

[0025] At the beginning, the telescopic mechanism 42 is in the extended state. Multiple DBC trays 3 carrying DBC substrates (with DBC substrates placed in preset grooves on the DBC trays 3) are conveyed forward by the conveyor belt until the limit component 43 at the end of the telescopic mechanism 42 just snaps into the notch 5 at the end of the DBC tray 3, thereby restricting the front, back, left, and right directions of the tray and accurately determining the position of the tray. After the photoelectric inductor 6 and the opposed inductor sense the arrival of the DBC tray 3 and the presence of the DBC substrate in the tray, the bonder performs the next bonding action on the DBC substrate below;

[0026] After this step of bonding action is completed, the lead screw mechanism 41 operates to drive the telescopic mechanism 42 and the limit component 43 to move to the next positioning position. The tray continues to move forward under the drive of the conveyor belt and stops after being blocked by the limit component 43, so that the DBC substrate to be bonded in the DBC tray 3 is accurately positioned below the bonder. At this time, the next bonding action can be performed again. The above actions are repeated until all the DBC substrates in the tray are bonded. Then the telescopic mechanism 42 drives the limit component 43 to retract, and the DBC tray 3 is conveyed to the discharging position by the conveyor belt 2.

[0027] The limit component 43 is composed of two limit vertical rods 432 symmetrically and fixedly arranged at the upper end of a cross plate 431, and the cross plate 431 is fixedly installed on the movable part of the lead screw mechanism 41. By respectively clamping the two symmetrically arranged limit vertical rods 432 into the notches 5 opened at the end of the DBC tray 3, the front-back, left-right direction limit of the DBC tray 3 is realized, and the positioning is more stable and rapid.

[0028] A photoelectric sensor 6 is fixedly arranged on the cross plate 431, and a set of opposed sensors 7 is arranged on the vertical plate of the mounting frame 1. Through the photoelectric sensor 6 on the cross plate 431 of the limit component 43, the presence of the DBC tray 3 can be detected after the limit component 43 positions the DBC tray 3. At the same time, the presence of the DBC substrate placed on the DBC tray 3 is detected through the opposed sensors 7, and then the next bonding operation is carried out.

[0029] The lead screw mechanism 41 is composed of a lead screw 411 rotatably installed in the middle of the bottom plate of the mounting frame 1, a movable nut 412 threadedly connected to the lead screw 411 and sliding along the lead screw 411, and a driving motor 413 fixedly installed on the mounting frame 1 for driving the lead screw 411 to rotate. The lead screw 411 is arranged parallel to the mounting frame 1, the movable nut 412 is fixedly installed in the middle of the movable base 8, the lower end of the movable base 8 is slidably connected to the mounting frame 1 through a guide rail 9, and the telescopic mechanism 42 is fixedly installed on the upper end of the movable base 8. By driving the lead screw 411 to rotate through the driving motor 413, the movable nut 412 is translated along the lead screw 411, thereby driving the movable base 8 to translate, dragging the telescopic mechanism 42 and the limit mechanism to move to the next bonding point at the same time, and performing the bonding processing operation on the DBC substrates in the upper and lower groups of the DBC tray 3.

[0030] The telescopic mechanism 42 is an electric push rod or an electric cylinder.

[0031] The conveyor belt 2 is arranged on the side wall of the vertical plate of the mounting frame 1 through a pulley 10 rotatably installed on the vertical plate of the mounting frame 1.

[0032] A support bar 11 is arranged below the conveyor belt 2. When the DBC tray 3 is pressed against the conveyor belt 2, the support bar 11 supports the conveyor belt 2 and the DBC tray 3. When bonding the DBC substrates on the DBC tray 3, the two sides of the DBC tray 3 are supported by the support bar 11, thereby avoiding the situation of damaging the conveyor belt 2 due to excessive pressure.

[0033] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An IGBT bonder tray transfer and positioning device, comprising a mounting frame (1) and a DBC tray (3) that moves along the mounting frame (1) through a conveyor belt (2), characterized in that: A positioning mechanism (4) is slidably installed at the bottom of the mounting bracket (1). The positioning mechanism (4) consists of a lead screw mechanism (41) fixedly arranged on the bottom plate of the mounting bracket (1), a telescopic mechanism (42) fixedly installed on the movable part of the lead screw mechanism (41), and a limit component (43) fixedly installed on the telescopic mechanism (42). A notch (5) matching the limit component (43) is arranged on the side of the DBC tray (3). The limit component (43) is composed of two limit vertical rods (432) symmetrically and fixedly arranged at the upper end of a horizontal plate (431). The horizontal plate (431) is fixedly installed on the movable part of the lead screw mechanism (41). The lead screw mechanism (41) consists of a lead screw (411) rotatably installed in the middle of the bottom plate of the mounting bracket (1), a movable nut (412) threadedly connected to the lead screw (411) and sliding along the lead screw (411), and a drive motor (413) fixedly installed on the mounting bracket (1) for driving the lead screw (411) to rotate. The lead screw (411) is arranged parallel to the mounting bracket (1). A photoelectric sensor (6) is fixedly arranged on the horizontal plate (431). A group of transmissive sensors (7) are arranged on the vertical plate of the mounting bracket (1).

2. The IGBT bonder tray transfer and positioning device according to claim 1, wherein: The movable nut (412) is fixedly installed in the middle of a movable base (8). The lower end of the movable base (8) is slidably connected to the mounting bracket (1) through a guide rail (9), and the telescopic mechanism (42) is fixedly installed at the upper end of the movable base (8).

3. The IGBT bonder tray transfer and positioning device according to claim 1, wherein: The telescopic mechanism (42) is an electric push rod or an electric cylinder.

4. An IGBT bonder tray transfer and positioning device according to claim 1, characterized in that: The conveyor belt (2) is arranged on the side wall of the vertical plate of the mounting bracket (1) through a pulley (10) rotatably installed on the vertical plate of the mounting bracket (1).

5. An IGBT bonder tray transfer and positioning device according to any one of claims 1-4, characterized in that: A support bar (11) is arranged below the conveyor belt (2). When the DBC tray (3) presses on the conveyor belt (2), the support bar (11) supports the conveyor belt (2) and the DBC tray (3).

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