Display panel and method of manufacturing the same

Abstract

The present disclosure relates to a display panel and a method for manufacturing a display panel, the method comprising: preparing a working substrate, the working substrate comprising a mother substrate including a plurality of unit areas, a light-emitting element layer formed in each of the unit areas, and an encapsulation layer formed on each light-emitting area in each of the unit areas; arranging a plurality of protective films covering the light-emitting element layer and the encapsulation layer in the unit areas, respectively; cutting the working substrate along a cutting line located at the outer side of the protective film of at least one unit area to form at least one preliminary display panel; grinding a side surface of the at least one preliminary display panel; and removing the protective film from the at least one ground preliminary display panel to form at least one display panel.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display panel and a method of manufacturing the display panel. More particularly, the present disclosure relates to a display panel having enhanced strength and a method of manufacturing the display panel. Background Art

[0002] Electronic devices such as smart phones, tablet computers, notebook computers, and smart TVs are being developed. These electronic devices generally include a display device to provide information. These electronic devices include not only a display device but also various electronic modules.

[0003] In recent years, display devices have used display panels including organic electroluminescent elements as their display elements. Display panels including organic electroluminescent elements are thinner than liquid crystal display panels. Various methods are being developed to enhance the strength of thinner display panels. Summary of the invention

[0004] Embodiments of the present disclosure may provide a display panel having enhanced strength.

[0005] Embodiments of the present disclosure may provide a method of manufacturing a display panel having enhanced strength.

[0006] An embodiment of the present invention provides a method for manufacturing a display panel, the method comprising: preparing a working substrate, the working substrate comprising a mother substrate including a plurality of unit areas, a light-emitting element layer formed in each of the unit areas, and an encapsulation layer formed on each of the light-emitting areas in each of the unit areas; arranging a plurality of protective films covering the light-emitting element layer and the encapsulation layer in the unit areas, respectively; cutting the working substrate along a cutting line located at the outer side of the protective film of at least one of the unit areas, wherein at least one preliminary display panel is formed; grinding a side surface of the at least one preliminary display panel; and removing the protective film from at least one ground preliminary display panel, wherein at least one display panel is formed.

[0007] According to an embodiment of the inventive concept, the cutting line is formed along each of the unit regions in the working substrate, and the protection film does not overlap the cutting line.

[0008] According to an embodiment of the inventive concept, the encapsulation layer includes one or more inorganic layers alternately stacked with one or more organic layers.

[0009] According to an embodiment of the present invention, cutting the working substrate along the cutting line includes: setting a cutting device on a first surface of the working substrate on which the light emitting element layer and the encapsulation layer are arranged; and moving the cutting device along the cutting line to cut the working substrate.

[0010] According to an embodiment conceived in the present invention, grinding the side surface of the at least one prepared display panel includes: grinding a straight line shape portion of the side surface, wherein the straight line shape portion has a straight line shape; and grinding a curved surface shape portion of the side surface, wherein the curved surface shape portion has a curved shape.

[0011] According to an embodiment of the inventive concept, grinding the straight line shape portion includes one or more steps of grinding a front surface edge or a rear surface edge of the straight line shape portion using an edge grinder.

[0012] According to an embodiment of the inventive concept, when the grinding of the straight line shape portion includes grinding the rear surface edge of the straight line shape portion, the grinding of the straight line shape portion further includes inverting the at least one preliminary display panel before grinding the rear surface edge.

[0013] According to an embodiment of the inventive concept, grinding the straight line shape portion includes simultaneously grinding a front surface edge and a rear surface edge of the straight line shape portion using a computer numerical control grinding device.

[0014] According to an embodiment of the inventive concept, grinding the curved surface shape portion includes simultaneously grinding a front surface edge and a rear surface edge of the curved surface shape portion using a computer numerical control grinding device.

[0015] According to an embodiment of the inventive concept, when the straight line shape portion is ground using the CNC grinding device, the straight line shape portion is ground through the same process as the curved surface shape portion.

[0016] According to an embodiment of the inventive concept, grinding the side surface of the at least one preliminary display panel further includes grinding a pad portion of the side surface adjacent to a pad region in which a plurality of pads are disposed.

[0017] According to an embodiment of the inventive concept, grinding the pad part includes: turning the at least one preliminary display panel upside down; and grinding a rear surface edge of the pad part using an edge grinder.

[0018] According to an embodiment of the inventive concept, when the straight line shape portion is ground using an edge grinder, the pad portion is ground through the same process as the straight line shape portion.

[0019] An embodiment of the inventive concept provides a display panel, the display panel comprising: a base substrate; a light emitting element layer disposed on one surface of the base substrate; and an encapsulation layer covering the light emitting element layer. An edge of the base substrate comprises a straight line shape portion having a straight line shape and a shape processing portion comprising at least one curved surface shape portion having a curved shape.

[0020] The at least one curved surface shape portion includes a first curved surface grinded at an edge of a front surface of the base substrate and a second curved surface grinded at an edge of a rear surface of the base substrate.

[0021] According to an embodiment of the present invention, the straight shape portion includes a straight grinding surface formed at at least one of the front surface edge and the rear surface edge of the base substrate, and the straight grinding surface has a width equal to or smaller than the first curved grinding surface and the second curved grinding surface of the shape processing portion.

[0022] According to an embodiment conceived in the present invention, the display panel further includes a plurality of pads arranged on the base substrate, wherein the edge of the base substrate further includes a pad portion adjacent to the plurality of pads, and the pad portion includes a pad grinding surface formed at the edge of the rear surface of the base substrate.

[0023] According to an embodiment of the inventive concept, the pad grinding surface has a width smaller than widths of the first and second curvilinear grinding surfaces of the shape processed portion.

[0024] An embodiment of the present invention also provides a method for manufacturing a display panel, the method comprising: providing a plurality of prepared display panels, wherein each prepared display panel includes a unit area and a protective film covering the unit area, wherein each prepared display panel includes a side surface; grinding a straight line shape portion of the side surface, wherein the straight line shape portion has a straight line shape; grinding a curved surface shape portion of the side surface, wherein the curved surface shape portion has a curved shape; grinding a pad portion of the side surface adjacent to a pad area in which a plurality of pads are arranged; and removing the protective film from each ground prepared display panel, wherein a plurality of display panels are formed.

[0025] According to an embodiment conceived in the present invention, providing the plurality of prepared display panels includes: preparing a working substrate, the working substrate including a mother substrate including a plurality of the unit areas, a light-emitting element layer formed in each of the unit areas, and an encapsulation layer formed on each of the light-emitting areas in each of the unit areas; arranging a plurality of the protective films covering the light-emitting element layer and the encapsulation layer in the unit areas, respectively; and cutting the working substrate along a cutting line located at the outer side of the protective film of each of the unit areas, wherein a plurality of the prepared display panels are formed.

[0026] According to an embodiment of the present invention, grinding the straight-line shape portion includes one or more steps of grinding the front surface edge of the straight-line shape portion using one of an edge grinder or a computer numerical control grinding device and grinding the rear surface edge of the straight-line shape portion using one of the edge grinder and the computer numerical control grinding device, grinding the curved-surface shape portion includes simultaneously grinding the front surface edge and the rear surface edge of the curved-surface shape portion using the computer numerical control grinding device, and grinding the pad portion includes: inverting each prepared display panel; and grinding the rear surface edge of the pad portion using the edge grinder.

[0027] According to the above, the display panel includes a base substrate, and a ground surface is provided at an edge of the base substrate through a grinding process. Since cracks are removed from the side surface of the base substrate through the grinding process, the strength of the display panel can be enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure.

[0029] Figure 2 yes Figure 1 A plan view of the display panel shown in FIG.

[0030] Figure 3 It is along Figure 2 A cross-sectional view taken along line II' in FIG.

[0031] FIG. 4A to FIG. 4C is a cross-sectional view of a straight line shape portion according to an exemplary embodiment of the present disclosure.

[0032] Figure 5 It is along Figure 2 A cross-sectional view taken along line II-II'.

[0033] Figure 6 is when Figure 2 A side view of the first straight line shape portion and the third curved surface shape portion when viewed in the direction A1 in FIG.

[0034] Figure 7 It is along Figure 2 A cross-sectional view taken along line III-III'.

[0035] Figure 8 is when Figure 2 A side view of the first curved surface shape portion and the pad portion when viewed in the direction A2.

[0036] 9A to 9D is a plan view illustrating a method of manufacturing a display panel according to an exemplary embodiment of the present disclosure.

[0037] FIG. 10A to FIG. 10E is a cross-sectional view illustrating a method of manufacturing a display panel according to an exemplary embodiment of the present disclosure.

[0038] FIG. 11A to FIG. 11C A grinding process for a straight-line shape portion according to an exemplary embodiment of the present disclosure is illustrated.

[0039] Fig. 12A and Fig. 12B A grinding process for a shape processing part according to an exemplary embodiment of the present disclosure is shown.

[0040] FIG. 13A to FIG. 13C A grinding process for a pad portion according to an exemplary embodiment of the present disclosure is illustrated.

[0041] Fig.14 yes Figure 3 An enlarged view of portion A3 in FIG.

[0042] Fig.15 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure.

[0043] Fig.16 yes Fig.15 A plan view of the display panel shown in FIG.

[0044] Fig.17 yes Fig.16 A cross-sectional view of the notch-shaped portion in FIG. DETAILED DESCRIPTION

[0045] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the embodiments of the present disclosure may take many different forms and should not be construed as being limited to the embodiments set forth herein. The same reference numerals may always refer to the same elements.

[0046] It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0047] Herein, when one value is described as being approximately equal to another value (e.g., "the width may be from about 0.1 mm to about 1 mm"), it will be understood that the values ​​are equal to one another within measurement error, or, if measurably unequal, are sufficiently close in value to be functionally equal to one another as would be understood by one of ordinary skill in the art.

[0048] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0049] Figure 1 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure, Figure 2 yes Figure 1 A plan view of the display panel shown in FIG. Figure 3 It is along Figure 2 A cross-sectional view taken along line II' in FIG.

[0050] Reference Figure 1 , the display device 100 includes a display panel DP and a window WM.

[0051] According to an embodiment, the display panel DP includes a display area DA that responds to an electrical signal to display an image and a non-display area NDA adjacent to the display area DA. The display panel DP includes a plurality of pixels PX. The pixels PX are arranged in the display area DA. The non-display area NDA surrounds the display area DA, and the image is not displayed through the non-display area NDA. The non-display area NDA includes a pad area PDA located at one side of the display panel DP. A plurality of pads are arranged in the pad area PDA of the display panel DP.

[0052] According to an embodiment, when viewed in a plan view, the display panel DP has a rectangular shape including four sides. The display panel DP has a rectangular plate shape. The display panel DP includes a front surface IS through which an image is displayed, a rear surface opposite to the front surface IS, and side surfaces SS1 to SS4 connecting the front surface IS and the rear surface. The front surface IS is parallel to a plane defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1. A normal line of the front surface IS is indicated by a third direction DR3 which is a thickness direction of the display panel DP.

[0053] According to an embodiment, the side surfaces SS1 to SS4 include a first side surface SS1, a second side surface SS2, a third side surface SS3, and a fourth side surface SS4. The first side surface SS1 and the second side surface SS2 are substantially parallel to each other, extend in the first direction DR1, and are parallel to a plane defined by the first direction DR1 and the third direction DR3. The third side surface SS3 and the fourth side surface SS4 are substantially parallel to each other, extend in the second direction DR2, and are parallel to a plane defined by the second direction DR2 and the third direction DR3. The third side surface SS3 connects the first side surface SS1 and the second side surface SS2 along one side of the display panel DP, and the fourth side surface SS4 connects the first side surface SS1 and the second side surface SS2 along another side of the display panel DP. According to an embodiment of the present disclosure, the third side surface SS3 is disposed adjacent to the pad area PDA.

[0054] exist Figure 1 and Figure 2In the embodiment, the display panel DP has a typical shape such as a rectangular shape, however, the embodiments of the present disclosure are not limited thereto. That is, the display panel DP may have an atypical shape such as a shape in which at least one side protrudes or is recessed from the rectangular shape. Fig.15 and Fig.16 A display panel DP of an atypical shape is described.

[0055] According to an embodiment, the window WM is disposed on the display panel DP. The window WM protects the display panel DP. In a plan view, the window WM may be divided into a transmission area TA and a frame area BA. The transmission area TA transmits most of the light incident thereto. The transmission area TA is optically transparent.

[0056] According to an embodiment, the bezel area BA blocks most of the light incident thereon. The bezel area BA makes the components disposed under the window WM not recognizable from the outside, that is, hides the components disposed under the window WM. In addition, the bezel area BA reduces the reflection of the external light incident thereon.

[0057] According to an embodiment, the bezel area BA is adjacent to the transmissive area TA. In a plan view, the transmissive area TA has a shape defined by the bezel area BA. In the present exemplary embodiment, the transmissive area TA covers at least the display area DA of the display panel DP. The bezel area BA covers the non-display area NDA of the display panel DP. However, in other embodiments, the bezel area BA covers a portion of the display area DA.

[0058] Reference Figure 2 According to the embodiment, the edge of the display panel DP includes straight line shape parts SLP1 to SLP3 and shape processing parts SMP1 to SMP4. The straight line shape parts SLP1 to SLP3 and the shape processing parts SMP1 to SMP4 are positioned along the edge of the display panel DP. That is, the edge of the display panel DP has a straight line shape in the straight line shape parts SLP1 to SLP3, and the edge of the display panel DP has a curved surface shape in the shape processing parts SMP1 to SMP4, or has a shape that is recessed into or protruded from the side surface of the display panel DP.

[0059] According to an embodiment of the present disclosure, the straight line shape portions SLP1 to SLP3 include a first straight line shape portion SLP1, a second straight line shape portion SLP2, and a third straight line shape portion SLP3. The first straight line shape portion SLP1, the second straight line shape portion SLP2, and the third straight line shape portion SLP3 may be disposed on the second side surface SS2, the first side surface SS1, and the fourth side surface SS4, respectively. That is, the first straight line shape portion SLP1 overlaps the second side surface SS2, the second straight line shape portion SLP2 overlaps the first side surface SS1, and the third straight line shape portion SLP3 overlaps the fourth side surface SS4.

[0060] According to an embodiment of the present disclosure, the shape processing parts SMP1 to SMP4 include a first curved surface shape part SMP1, a second curved surface shape part SMP2, a third curved surface shape part SMP3 and a fourth curved surface shape part SMP4. The first curved surface shape part SMP1 is provided at a location where the second side surface SS2 and the third side surface SS3 are connected to each other. The second curved surface shape part SMP2 is provided at a location where the first side surface SS1 and the third side surface SS3 are connected to each other. The third curved surface shape part SMP3 is provided at a location where the second side surface SS2 and the fourth side surface SS4 are connected to each other. The fourth curved surface shape part SMP4 is provided at a location where the first side surface SS1 and the fourth side surface SS4 are connected to each other. Each of the first curved surface shape part SMP1 to the fourth curved surface shape part SMP4 is bent to have a rounded shape.

[0061] According to an embodiment, the edge of the display panel DP further includes a pad portion PP adjacent to the pad area PDA The pad portion PP overlaps the third side surface SS3 and is disposed between the first curved shape portion SMP1 and the second curved shape portion SMP2.

[0062] Reference Figure 3 According to the embodiment, the display panel DP includes a base substrate SUB, a circuit element layer DP-CL, a light emitting element layer DP-EDL, and an encapsulation layer TFE. The base substrate SUB, the circuit element layer DP-CL, and the light emitting element layer DP-EDL are sequentially stacked on each other in the third direction DR3.

[0063] According to an embodiment, the base substrate SUB includes a front surface SUB-FS, a rear surface SUB-BS opposite to the front surface SUB-FS, and a side surface connecting the front surface SUB-FS and the rear surface SUB-BS. The circuit element layer DP-CL is disposed on the front surface SUB-FS of the base substrate SUB. The base substrate SUB may be a glass substrate, but is not limited to a glass substrate. The base substrate SUB has a thickness from about 100 microns to about 400 microns.

[0064] According to an embodiment, the circuit element layer DP-CL includes a plurality of transistors. Each of the transistors includes a control electrode, an input electrode, and an output electrode. For example, the circuit element layer DP-CL includes a switching transistor and a driving transistor for driving an organic electroluminescent element.

[0065] According to an embodiment, the light emitting element layer DP-EDL is disposed on the circuit element layer DP-CL. The light emitting element layer DP-EDL includes a plurality of organic electroluminescent elements.

[0066] Will refer to Fig.14 The light emitting element layer DP-EDL and the circuit element layer DP-CL are described in detail.

[0067] According to an embodiment, the encapsulation layer TFE is disposed on the light emitting element layer DP-EDL. The light emitting element layer DP-EDL is encapsulated by the encapsulation layer TFE. According to an embodiment of the present disclosure, the encapsulation layer TFE has a structure in which at least one inorganic layer and at least one organic layer are alternately stacked on each other in the third direction DR3.

[0068] According to the embodiment, the encapsulation layer TFE protects the light emitting element layer DP-EDL from moisture, oxygen, and foreign substances such as dust particles.

[0069] like Figure 2 and Figure 3 As shown in , according to the embodiment, the first straight line shape portion SLP1 of the display panel DP includes a first straight line grinding surface SGS1 and a second straight line grinding surface SGS2, and the second straight line shape portion SLP2 of the display panel DP includes a third straight line grinding surface SGS3 and a fourth straight line grinding surface SGS4. In the present exemplary embodiment, the first side surface SS1 of the display panel DP corresponds to the first side surface B-SS1 of the base substrate SUB, and the second side surface SS2 of the display panel DP corresponds to the second side surface B-SS2 of the base substrate SUB.

[0070] According to an embodiment, the first linear grinding surface SGS1 is disposed between the second side surface B-SS2 of the base substrate SUB and the front surface SUB-FS of the base substrate SUB, and the second linear grinding surface SGS2 is disposed between the second side surface B-SS2 of the base substrate SUB and the back surface SUB-BS of the base substrate SUB. The third linear grinding surface SGS3 is disposed between the first side surface B-SS1 of the base substrate SUB and the front surface SUB-FS of the base substrate SUB, and the fourth linear grinding surface SGS4 is disposed between the first side surface B-SS1 of the base substrate SUB and the back surface SUB-BS of the base substrate SUB.

[0071] According to an embodiment, each of the first to fourth linear grinding surfaces SGS1 to SGS4 has an inclined surface. Each of the first to fourth linear grinding surfaces SGS1 to SGS4 has a first width W1 in the thickness direction of the display panel DP (ie, the third direction DR3).

[0072] In addition, according to an embodiment, the third straight line shape portion SLP3 includes a fifth straight line grinding surface and a sixth straight line grinding surface connected to a fourth side surface of the base substrate SUB. The fourth side surface of the base substrate SUB corresponds to the fourth side surface SS4 of the display panel DP. The fifth straight line grinding surface and the sixth straight line grinding surface have a first width W1 in the third direction DR3. According to an embodiment of the present disclosure, the first width W1 has a value in a range from about 20 micrometers to about 100 micrometers.

[0073] As described above, according to the embodiment, when the linear grinding surface is formed in the first to third linear shape portions SLP1 to SLP3, the strength of the edge portion of the base substrate SUB is enhanced. The linear grinding surface of the first to third linear shape portions SLP1 to SLP3 may be formed by a grinding process. The linear grinding surface has a width that varies depending on how the grinding process is performed or the device that performs the grinding process. According to an embodiment of the present disclosure, Figure 3 The linear grinding surfaces shown in are formed by a computer numerical control (CNC) grinding process. When the CNC grinding process is performed, each of the linear shape parts SLP1 to SLP3 is provided with a pair of linear grinding surfaces that respectively connect the front surface SUB-FS and the back surface SUB-BS of the base substrate SUB. That is, a pair of linear grinding surfaces are formed substantially simultaneously by the CNC grinding process. The CNC grinding process will be described in detail below with reference to the accompanying drawings.

[0074] When two surfaces such as the first side surface B-SS1 and the front surface SUB-FS of the base substrate SUB intersect at a right angle at an edge portion of the base substrate SUB, a sharp edge is formed, and the base substrate SUB is susceptible to external impact. However, when an inclined linear grinding surface is provided in the first to third linear shape portions SLP1 to SLP3, defects such as cracks due to external impact can be prevented from occurring in the base substrate SUB, thereby enhancing the strength of the display panel DP.

[0075] FIG. 4A to FIG. 4C is a cross-sectional view of a straight line shape portion according to an exemplary embodiment of the present disclosure. FIG. 4A to FIG. 4C A cross-sectional structure of the first straight line shape portion SLP1 among the first straight line shape portion SLP1 to the third straight line shape portion SLP3 is shown.

[0076] According to an embodiment, the first to third straight line shape portions SLP1 to SLP3 may have substantially the same shape as each other, or may have shapes different from each other. Each of the first to third straight line shape portions SLP1 to SLP3 may have Figures 3 to 4C Therefore, we will refer to FIG. 4A to FIG. 4CThe shape of the first straight line shape portion SLP1 is described as a typical example, however, such a structure should not be limited to the first straight line shape portion SLP1 and may be incorporated into the second straight line shape portion SLP2 and the third straight line shape portion SLP3 .

[0077] Reference Figure 2 and Figure 4A According to an embodiment, the first straight line shape portion SLP1 of the display panel DP overlaps the second side surface SS2, and the first straight line shape portion SLP1 includes a first straight line grinding surface SGS1-1 and a second straight line grinding surface SGS1-2. In this case, the second side surface SS2 of the display panel DP corresponds to the second side surface B-SS2 of the base substrate SUB.

[0078] According to an embodiment, the first linear grinding surface SGS1-1 is disposed between the second side surface B-SS2 of the base substrate SUB and the front surface SUB-FS of the base substrate SUB, and the second linear grinding surface SGS1-2 is disposed between the second side surface B-SS2 of the base substrate SUB and the back surface SUB-BS of the base substrate SUB.

[0079] According to an embodiment, each of the first linear grinding surface SGS1-1 and the second linear grinding surface SGS1-2 has an inclined surface. Each of the first linear grinding surface SGS1-1 and the second linear grinding surface SGS1-2 has a second width W2 in the thickness direction of the display panel DP as the third direction DR3. According to an embodiment of the present disclosure, the second width W2 is smaller than the first width W1, and the second width W2 has a value in the range from about 5 micrometers to about 60 micrometers.

[0080] According to an embodiment, Figure 4A The first linear shape portion SLP1 is shown to include a pair of linear grinding surfaces SGS1-1 and SGS1-2 connected to the front surface SUB-FS and the back surface SUB-BS of the base substrate SUB, respectively, however, the embodiments of the present disclosure should not be limited thereto. Figure 4B and Figure 4C As shown in , the first straight line shape portion SLP1 may include only one straight line grinding surface. Figure 4B The first straight line shape portion SLP1 includes a first straight line grinding surface SGS1-1 disposed between the front surface SUB-FS and the second side surface B-SS2 of the base substrate SUB, and according to Figure 4C , the first straight line shape portion SLP1 includes one second straight line grinding surface SGS1-2 disposed between the back surface SUB-BS and the second side surface B-SS2 of the base substrate SUB.

[0081] As described above, according to the embodiment, since the linear grinding surface is formed in the first linear shape portion SLP1, the strength of the edge portion of the base substrate SUB is enhanced. FIG. 4A to FIG. 4C The linear grinding surfaces SGS1-1 and SGS1-2 shown in FIG. 1 may be formed by an edge grinding process. After performing the edge grinding process, the first linear shape portion SLP1 includes at least one linear grinding surface. The linear grinding surface formed by the edge grinding process is not as good as that formed by the CNC grinding process. Figure 3 The linear grinding surfaces SGS1 to SGS4 shown in FIG.

[0082] When two surfaces such as the second side surface B-SS2 and the front surface SUB-FS of the base substrate SUB intersect at a right angle at an edge portion of the base substrate SUB, a sharp edge is formed, and the base substrate SUB may be susceptible to external impact. However, when one or more inclined linear grinding surfaces are provided in the first linear shape portion SLP1, defects such as cracks due to external impact can be prevented from occurring in the base substrate SUB, thereby enhancing the strength of the display panel DP.

[0083] Figure 5 It is along Figure 2 A cross-sectional view of the shape processing portion taken along line II-II' shown in FIG. Figure 6 It shows that when Figure 2 A side view of the first straight line shape portion and the third curved surface shape portion when viewed in the direction A1 in FIG. Figure 5 The cross-sectional structure of the third curved surface shape portion SMP3 of the first curved surface shape portion SMP1 to the fourth curved surface shape portion SMP4 is shown.

[0084] According to the embodiment, the first to fourth curved shape portions SMP1 to SMP4 have substantially the same shape as each other. Therefore, the shape of the third curved shape portion SMP3 will be described as a typical example, and detailed descriptions of the first, second, and fourth curved shape portions SMP1, SMP2, and SMP4 will be omitted.

[0085] Reference Figure 2 and Figure 5According to an embodiment, the third curved surface shape portion SMP3 includes a first curved grinding surface CGS1 provided at the front surface edge of the base substrate SUB and a second curved grinding surface CGS2 provided at the rear surface edge of the base substrate SUB. Among them, four corners where two side surfaces of the first side surface to the fourth side surface of the base substrate SUB are connected to each other are processed to be curved. Therefore, the base substrate SUB includes a first curved surface, a second curved surface, a third curved surface and a fourth curved surface provided at four corners, respectively. Among the four curved surfaces, the third curved surface B-CS3 is disposed between the second side surface SS2 and the fourth side surface SS4 of the display panel DP.

[0086] According to an embodiment, the first curvilinear grinding surface CGS1 is disposed between the third curved surface B-CS3 of the base substrate SUB and the front surface SUB-FS of the base substrate SUB, and the second curvilinear grinding surface CGS2 is disposed between the third curved surface B-CS3 of the base substrate SUB and the back surface SUB-BS of the base substrate SUB.

[0087] According to an embodiment, each of the first and second curvilinear grinding surfaces CGS1 and CGS2 has an inclined surface. Each of the first and second curvilinear grinding surfaces CGS1 and CGS2 has a first width W1 in a thickness direction of the display panel DP (ie, a third direction DR3). According to an embodiment of the present disclosure, the first width W1 has a value in a range from about 20 micrometers to about 100 micrometers.

[0088] As described above, according to the embodiment, since the curved grinding surfaces are formed at the four corners of the base substrate SUB, the strength of the edge portion of the base substrate SUB is enhanced. Specifically, the first curved grinding surface CGS1 and the second curved grinding surface CGS2 are formed by a grinding process. According to an embodiment of the present disclosure, the first curved surface shape portion SMP1 to the fourth curved surface shape portion SMP4 processed to have a curved surface are ground using a CNC grinding process.

[0089] When two surfaces such as the third curved surface B-CS3 and the front surface SUB-FS of the base substrate SUB intersect at right angles at the corner of the base substrate SUB, a sharp edge is formed, and the base substrate SUB is susceptible to external impact. However, when an inclined curved grinding surface is provided in the first to fourth curved surface shape portions SMP1 to SMP4, defects such as cracks due to external impact can be prevented from occurring in the base substrate SUB, thereby enhancing the strength of the display panel DP.

[0090] Reference Figures 2 to 6According to an embodiment, the third curved surface shape portion SMP3 includes a first curved grinding surface CGS1 and a second curved grinding surface CGS2 processed by a CNC grinding process, and the first straight line shape portion SLP1 includes a first straight line grinding surface SGS1-1 and a second straight line grinding surface SGS1-2 processed by an edge grinding process. That is, the first straight line shape portion SLP1 and the third curved surface shape portion SMP3 are ground by different methods. In this case, the first curved grinding surface CGS1 and the second curved grinding surface CGS2 have a first width W1, and the first straight line grinding surface SGS1-1 and the second straight line grinding surface SGS1-2 have a second width W2. As described above, because the first curved grinding surface CGS1 and the second curved grinding surface CGS2 have different widths from the first straight line grinding surface SGS1-1 and the second straight line grinding surface SGS1-2, there is a discontinuous interface between the first straight line shape portion SLP1 and the third curved surface shape portion SMP3.

[0091] In addition, according to an embodiment, discontinuous interfaces exist between the first straight line shape portion SLP1 and the first curved surface shape portion SMP1, between the third curved surface shape portion SMP3 and the third straight line shape portion SLP3, between the fourth curved surface shape portion SMP4 and the third straight line shape portion SLP3, between the second straight line shape portion SLP2 and the second curved surface shape portion SMP2, and between the second straight line shape portion SLP2 and the fourth curved surface shape portion SMP4.

[0092] Figure 7 It is along Figure 2 A cross-sectional view taken along line III-III' in FIG. Figure 8 is when Figure 2 A side view of the first curved surface shape portion and the pad portion when viewed in the direction A2.

[0093] Reference Figure 2 and Figure 7 According to an embodiment, the pad part PP includes a pad grinding surface PGS formed at an edge of a rear surface of the base substrate SUB. The pad grinding surface PGS is formed between a third side surface B-SS3 of the base substrate SUB and a rear surface SUB-BS of the base substrate SUB. Here, the third side surface B-SS3 of the base substrate SUB corresponds to a third side surface SS3 of the display panel DP.

[0094] According to an embodiment, the pad grinding surface PGS has an inclined surface. The pad grinding surface PGS has a second width W2 in the thickness direction of the display panel DP (ie, the third direction DR3). According to an embodiment of the present disclosure, the second width W2 has a value in a range from about 5 micrometers to about 60 micrometers.

[0095] According to an embodiment, in the pad portion PP, a grinding surface is not formed at the front surface edge of the base substrate SUB. A pad layer PL is formed in the pad area PDA of the base substrate SUB. A flexible circuit film is attached to the pad area PDA of the base substrate SUB. The flexible circuit film is electrically connected to the pad layer PL. In this case, the front surface edge of the base substrate SUB is covered by the flexible circuit film.

[0096] According to the embodiment, when the grinding surface is formed at one of the front surface edge and the rear surface edge in the pad portion PP, the CNC grinding process is not performed. That is, the pad grinding surface PGS is formed at the rear surface edge by the edge grinding process. Therefore, the pad grinding surface PGS prevents defects such as cracks from occurring in the base substrate SUB due to external impact, and thus, the strength of the display panel DP is enhanced in the pad area PDA.

[0097] Reference Figure 2 and Figure 8 According to an embodiment, the first curved surface shape portion SMP1 includes a third curved grinding surface CGS3 and a fourth curved grinding surface CGS4 processed by a CNC grinding process, and the pad portion PP includes a pad grinding surface PGS processed by an edge grinding process. That is, the pad portion PP and the first curved surface shape portion SMP1 are ground by different processes. In this case, the third curved grinding surface CGS3 and the fourth curved grinding surface CGS4 have a first width W1, and the pad grinding surface PGS has a second width W2. As described above, because the pad grinding surface PGS has a different width from the third curved grinding surface CGS3 and the fourth curved grinding surface CGS4, there is a discontinuous interface between the pad portion PP and the first curved surface shape portion SMP1.

[0098] In addition, according to the embodiment, there is a discontinuous interface between the pad portion PP and the second curved surface shape portion SMP2 .

[0099] 9A to 9D is a plan view showing a method of manufacturing a display panel according to an exemplary embodiment of the present disclosure, and FIG. 10A to FIG. 10E is a cross-sectional view illustrating a method of manufacturing a display panel according to an exemplary embodiment of the present disclosure.

[0100] Reference Fig.9A and Fig. 10A According to an embodiment, a plurality of unit regions CR are formed in a mother substrate MS. The mother substrate MS may be a glass substrate, but is not limited to a glass substrate. The mother substrate MS has a thickness ranging from about 100 micrometers to about 400 micrometers.

[0101] According to an embodiment, each of the unit regions CR corresponds to a display panel DP such as Figure 2 The display panel DP shown in FIG. Fig.9A The working substrate WS shown in FIG. 1 includes a light emitting element layer DP-EDL formed in each unit region CR of the mother substrate MS. In addition, the working substrate WS also includes Figure 3 The circuit element layer DP-CL is shown in FIG. 1 and is disposed between the light emitting element layer DP-EDL and the mother substrate MS in each unit region CR. For ease of illustration, 9A to 10E The circuit element layers DP-CL in the working substrate WS are not shown.

[0102] According to an embodiment, the light emitting element layer DP-EDL includes an organic electroluminescent element. The element included in the light emitting element layer DP-EDL may be formed by a deposition process, a photolithography process, or a patterning process.

[0103] Reference Fig. 9B and Fig. 10B According to an embodiment, the working substrate WS further includes an encapsulation layer TFE formed to cover the light emitting element layer DP-EDL. The encapsulation layer TFE is formed for each unit region CR. Therefore, the light emitting element layer DP-EDL is encapsulated by the encapsulation layer TFE.

[0104] Reference Fig. 9C and Fig. 10C According to an embodiment, the protective film PF is disposed on the encapsulation layer TFE. The protective film PF is disposed in each unit region CR. The protective film PF includes a polymer material. For example, the protective film PF includes a polyester material. An adhesive layer is coated on one surface of the protective film PF. The adhesive layer is a pressure-sensitive adhesive film. The protective film PF is disposed on the working substrate WS so that one surface on which the adhesive layer is coated is attached to the encapsulation layer TFE.

[0105] Reference Fig.9D and Fig. 10D According to an embodiment, the working substrate WS is divided into parts respectively corresponding to the unit regions CR. The working substrate WS is cut along the first cutting line CL1-1 and the second cutting line CL1-2 using a cutting device CW. The unit parts are cut along the third cutting line CL2-1 and the fourth cutting line CL2-2. The cutting device CW includes a cutting wheel that rotates while moving along the cutting lines CL1-1, CL1-2, CL2-1, and CL2-2.

[0106] According to another embodiment of the present disclosure, the cutting device CW includes a laser scanner that irradiates a laser beam onto the cutting lines CL1 - 1 , CL1 - 2 , CL2 - 1 , and CL2 - 2 .

[0107] According to an embodiment of the present disclosure, the protection film PF is disposed inside the corresponding cell region CR. That is, the protection film PF does not overlap with the cutting lines CL1-1, CL1-2, CL2-1, and CL2-2. Therefore, when the cutting process is performed, the adjacent protection films PF are spaced apart from each other so that the cutting device CW moves without being disturbed by the protection film PF.

[0108] Therefore, according to an embodiment, the working substrate WS may be divided into several pieces, and hereinafter, the working substrate WS is referred to as "a plurality of prepared display panels". Fig. 10E , a preliminary display panel P-DP among a plurality of preliminary display panels is shown. The preliminary display panel P-DP includes an unpolished preliminary base substrate P-SUB. Hereinafter, the grinding process of the preliminary base substrate P-SUB will be referred to as FIG. 11A to FIG. 13C describe.

[0109] FIG. 11A to FIG. 11C shows the grinding process for the straight shape part, Fig. 12A and Fig. 12B shows the grinding process for the shape processing part, and FIG. 13A to FIG. 13C A grinding process for a pad portion is shown.

[0110] Reference Fig.11A According to an embodiment, the preliminary base substrate P-SUB includes a front surface PB-FS on which the light emitting element layer DP-EDL and the encapsulation layer TFE are disposed, a rear surface PB-BS opposite to the front surface PB-FS, and a side surface connecting the front surface PB-FS and the rear surface PB-BS. According to an embodiment of the present disclosure, the preliminary base substrate P-SUB includes first to fourth side surfaces. The first to fourth side surfaces of the preliminary base substrate P-SUB correspond to Figure 2 1 to 4 side surfaces SS1 to SS4 of the display panel DP shown in FIG.

[0111] FIG. 11A to FIG. 11C The process in which the straight line shape portion is ground by the edge grinding process according to the embodiment is shown, however, the embodiment of the present disclosure should not be limited thereto. That is, in other embodiments, the straight line shape portion is ground by the CNC grinding process.

[0112] Reference Fig.11AAccording to an embodiment, an edge grinder EGM is disposed on the front surface edge of the second side surface PB-SS2 of the preparation base substrate P-SUB. The edge grinder EGM is disposed at the front surface edge where the front surface PB-FS of the preparation base substrate P-SUB and the second side surface PB-SS2 intersect. The edge grinder EGM includes a rotating shaft and a grinding wheel that rotates about the rotating shaft. The grinding wheel is rotated by the rotating shaft and grinds the front surface edge of the straight line shape portion. In the present exemplary embodiment, the rotation speed of the rotating shaft is about 4,000 RPM. The edge grinder EGM grinds the front surface edge of the straight line shape portion located at the second side surface PB-SS2 while moving along the front surface edge of the straight line shape portion located at the second side surface PB-SS2. In addition, the edge grinder EGM grinds other front surface edges of the straight line shape portion located at other side surfaces of the preparation base substrate P-SUB while moving in addition to the front surface edge of the straight line shape portion located at the second side surface PB-SS2. The moving speed (i.e., grinding speed) of the edge grinder EGM is about 50 mm / s.

[0113] According to an embodiment, after grinding the front surface edge of the straight shape portion, as shown in FIG. Fig. 11B The preliminary display panel P-DP is inverted as shown in . Subsequently, an edge grinder EGM is disposed on the rear surface edge of the preliminary base substrate P-SUB. That is, the edge grinder EGM is disposed at the rear surface edge where the rear surface PB-BS and the first side surface PB-SS1 of the preliminary base substrate P-SUB meet.

[0114] According to the embodiment, the edge grinder EGM grinds the rear surface edge of the straight shape portion while rotating. The edge grinder EGM grinds the rear surface edge of the straight shape portion located at the first side surface PB-SS1 while moving along the front surface edge of the straight shape portion located at the first side surface PB-SS1. In addition, the edge grinder EGM grinds other rear surface edges of the straight shape portion located at other side surfaces of the preliminary base substrate P-SUB while moving in addition to the rear surface edge of the straight shape portion located at the first side surface PB-SS1.

[0115] Therefore, according to an embodiment, the first side surface PB-SS1 and the second side surface PB-SS2 of the preparation base substrate P-SUB are prepared by Fig. 11CThe edge grinding process shown in is ground, thereby forming a plurality of linear grinding surfaces in the first linear shape portion SLP1 and the second linear shape portion SLP2. In detail, the first linear shape portion SLP1 includes a first linear grinding surface SGS1-1 and a second linear grinding surface SGS1-2, and the second linear shape portion SLP2 includes a third linear grinding surface SGS2-1 and a fourth linear grinding surface SGS2-2. In an embodiment of the present disclosure, the first linear grinding surface SGS1-1, the second linear grinding surface SGS1-2, the third linear grinding surface SGS2-1, and the fourth linear grinding surface SGS2-2 have a width from about 10 microns to about 45 microns.

[0116] As described above, according to the embodiment, when the grinding process for the straight line shape portion is completed, the grinding process for the shape processing portion or the pad portion may be performed.

[0117] Fig. 12A and Fig. 12B According to an embodiment, the method of grinding by CNC grinding process is shown. Figure 2 In the present exemplary embodiment, the shape processing parts SMP1 to SMP4 correspond to the shape processing parts SMP1 to SMP4 processed to have a curved surface. Figure 2 The four corners of the display panel DP shown in FIG.

[0118] According to an embodiment, Fig. 12A and Fig. 12B 2 is a view viewed toward the straight line shape portion SLP3, and shows the shape processing portions SMP3 and SMP4. Fig. 12A , the CNC device is arranged at the fourth curved surface PB-CS4 of the preparation base substrate P-SUB. The CNC device includes a plurality of CNC tools CT. Each CNC tool CT includes inclined surfaces spaced a predetermined distance from each other. Each CNC tool CT includes a space defined by the inclined surfaces therein. When the fourth curved surface PB-CS4 of the preparation base substrate P-SUB enters the space, the CNC tool CT grinds the front surface edge and the rear surface edge of the fourth curved surface PB-CS4 substantially simultaneously while rotating and moving at a predetermined speed.

[0119] According to an embodiment, the rotation speed of the CNC tool CT is about 25,000 RPM, and the moving speed is about 9 mm / s. The CNC tool CT grinds the front surface edge and the rear surface edge of the shape processing portion substantially simultaneously while rotating and moving. Similarly, the CNC tool CT grinds other curved surfaces (such as the third curved surface PB-CS3) of the curved surface shape portion SMP3 disposed at other corners of the preparation base substrate P-SUB and the curved surface shape portion SMP4 of the second curved surface.

[0120] Therefore, according to an embodiment, by Fig. 12B The CNC grinding process shown in the figure grinds the fourth curved surface PB-CS4 and the third curved surface PB-CS3 of the preparation base substrate P-SUB, thereby forming a plurality of curved grinding surfaces in the fourth curved surface shape portion SMP4 and the third curved surface shape portion SMP3. In detail, the fourth curved surface shape portion SMP4 includes the third curved grinding surface CGS3 and the fourth curved grinding surface CGS4, and the third curved surface shape portion SMP3 includes the first curved grinding surface CGS1 and the second curved grinding surface CGS2. In an embodiment of the present disclosure, the first curved grinding surface CGS1 to the fourth curved grinding surface CGS4 have a width from about 20 microns to about 100 microns.

[0121] In another embodiment of the present disclosure, when the straight shape portion is ground by a CNC grinding process instead of an edge grinding process, the straight shape portion and the shape-processed portion are ground substantially simultaneously by the CNC grinding process.

[0122] According to an embodiment, when the grinding process for the shape processing part is completed, the grinding process for the pad part may be performed.

[0123] According to an embodiment, when FIG. 11A to FIG. 11C When the straight-line shape portion is ground by the edge grinding process shown in , the pad portion PP and the straight-line shape portion can be ground by the edge grinding process for grinding the straight-line shape portion.

[0124] Reference Fig.13A According to an embodiment, the fourth side surface PB-SS4 of the preparation base substrate P-SUB is ground by an edge grinding process, so a plurality of linear grinding surfaces are formed in the third linear shape portion SLP3. In detail, the third linear shape portion SLP3 includes a fifth linear grinding surface SGS3-1 and a sixth linear grinding surface SGS3-2.

[0125] According to an embodiment, for the grinding process of the pad portion PP, the preparation display panel P-DP is inverted, and the edge grinder EGM is disposed at the rear surface edge of the pad portion PP. The edge grinder EGM is disposed at the rear surface edge where the rear surface PB-BS of the preparation base substrate P-SUB and the third side surface PB-SS3 intersect. The edge grinder EGM rotates the grinding wheel using a rotating shaft to grind the rear surface edge of the pad portion PP. The edge grinder EGM grinds the rear surface edge of the pad portion PP located at the third side surface PB-SS3 while moving along the rear surface edge of the pad portion PP located at the third side surface PB-SS3. In the present exemplary embodiment, the rotation speed of the rotating shaft is about 4,000 RPM, and the moving speed of the edge grinder EGM is about 50 mm / s.

[0126] According to an embodiment, Fig. 13B As shown in FIG. 1 , the third side surface PB-SS3 of the preliminary base substrate P-SUB is ground through the edge grinding process, thereby forming a pad grinding surface PGS in the pad portion PP. Thus, the base substrate SUB on which the grinding process is performed is completed.

[0127] Then, when the protective film PF is removed from the encapsulation layer TFE, as shown in FIG. Fig. 13C The display panel DP is completed as shown in FIG.

[0128] Fig.14 yes Figure 3 An enlarged view of portion A3 in FIG.

[0129] Reference Fig.14 According to the embodiment, the circuit element layer DP-CL, the light emitting element layer DP-EDL and the encapsulation layer TFE are sequentially stacked on the base substrate SUB.

[0130] According to an embodiment, the circuit element layer DP-CL includes at least one inorganic layer, at least one organic layer, and a circuit element. The circuit element layer DP-CL includes a first intermediate inorganic layer 10 , a second intermediate inorganic layer 20 , and an intermediate organic layer 30 .

[0131] According to an embodiment, the inorganic layer includes one or more of silicon nitride, silicon oxynitride and silicon oxide. The organic layer includes at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin and perylene resin.

[0132] According to an embodiment, the pixel PX includes a plurality of transistors and an organic light emitting diode OLED. The transistor is disposed on the circuit element layer DP-CL. Among the transistors, the transistor TR connected to the organic light emitting diode OLED includes a conductive pattern or a semiconductor pattern. In detail, the transistor TR includes a gate electrode GE, a source electrode SE, and a drain electrode DE. The transistor TR also includes a semiconductor pattern. The semiconductor pattern includes one of amorphous silicon, polycrystalline silicon, and a metal oxide semiconductor.

[0133] According to an embodiment, the first intermediate inorganic layer 10 is disposed on the semiconductor pattern. The gate electrode GE of the transistor TR is disposed on the first intermediate inorganic layer 10. The second intermediate inorganic layer 20 is disposed on the first intermediate inorganic layer 10 and covers the gate electrode GE. The source electrode SE and the drain electrode DE are disposed on the second intermediate inorganic layer 20.

[0134] According to an embodiment, the intermediate organic layer 30 is disposed on the second intermediate inorganic layer 20 and covers the source electrode SE and the drain electrode DE. The intermediate organic layer 30 provides a flat upper surface opposite to the second intermediate inorganic layer 20.

[0135] According to an embodiment, the light emitting element layer DP-EDL is disposed on a flat upper surface of the intermediate organic layer 30. The light emitting element layer DP-EDL includes a pixel defining layer PDL and an organic light emitting diode OLED. The pixel defining layer PDL includes the same organic material as the intermediate organic layer 30. The first electrode EL1 is disposed on the intermediate organic layer 30. The first electrode EL1 is connected to the drain electrode DE via a through hole penetrating the intermediate organic layer 30. The pixel defining layer PDL exposes at least a portion of the first electrode EL1.

[0136] According to an embodiment, the light emitting layer EML is disposed on the first electrode EL1. The light emitting layer EML is formed in each pixel PX after being patterned into a plurality of parts. The light emitting layer EML may include an organic material or an inorganic material. In the present exemplary embodiment, the patterned light emitting layer EML is shown as a typical example, however, the embodiment is not limited thereto, and in other embodiments, the light emitting layer EML is generally disposed above the pixel PX. In addition, the light emitting layer EML may have a multilayer structure.

[0137] According to an embodiment, the second electrode EL2 is disposed on the light emitting layer EML. The second electrode EL2 is generally disposed above the pixel PX.

[0138] According to an embodiment, the encapsulation layer TFE is disposed on the second electrode EL2. The encapsulation layer TFE is generally disposed above the pixel PX. In the present exemplary embodiment, the encapsulation layer TFE directly covers the second electrode EL2.

[0139] According to an embodiment, the encapsulation layer TFE includes a first inorganic layer IOL1, an organic layer IL, and a second inorganic layer IOL2 stacked one on top of the other. The organic layer IL is disposed between the first inorganic layer IOL1 and the second inorganic layer IOL2. The first inorganic layer IOL1 and the second inorganic layer IOL2 are formed by depositing an inorganic material, and the organic layer IL is formed by depositing, printing, or coating an organic material.

[0140] According to an embodiment, the first inorganic layer 1OL1 and the second inorganic layer 1OL2 protect the organic light emitting diode OLED from moisture and oxygen, and the organic layer IL protects the organic light emitting diode OLED from foreign substances such as dust particles. The first inorganic layer 1OL1 and the second inorganic layer 1OL2 include at least one of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide. The organic layer IL includes a polymer such as an acrylic organic layer, however, this is only an example and the embodiment is not limited thereto.

[0141] According to an embodiment, Fig.14The encapsulation layer TFE includes two inorganic layers IOL1 and IOL2 and one organic layer IL as a typical example, however, the embodiment is not limited thereto. For example, in other embodiments, the encapsulation layer TFE includes three inorganic layers and two organic layers, and in this case, the encapsulation layer TFE has a structure in which the inorganic layers and the organic layers are alternately stacked on each other.

[0142] Fig.15 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure, Fig.16 yes Fig.15 A plan view of the display panel shown in FIG. Fig.17 yes Fig.16 A cross-sectional view of the notch-shaped portion in FIG.

[0143] like Fig.15 and Fig.16 As shown in FIG. 1 , according to an embodiment, a display device 101 includes a display panel DP, an external module MD, a housing HM, and a window WM. The external module MD includes a plurality of modules MD1, MD2, and MD3.

[0144] According to an embodiment, the display panel DP includes a display area DA that displays an image in response to an electrical signal and a non-display area NDA adjacent to the display area DA. The display panel DP includes a plurality of pixels PX. The pixels PX are disposed in the display area DA.

[0145] According to an embodiment, the display panel DP includes at least one notch portion NT. That is, when viewed in a plan view, the display panel DP includes at least four sides, and the notch portion NT is a portion of one of the four sides recessed toward the center of the display panel DP.

[0146] According to an embodiment, the notch portion NT includes a first processing surface NT_L, a second processing surface NT_R, and a third processing surface NT_M. Each of the first processing surface NT_L and the second processing surface NT_R extends in the first direction DR1 and the third direction DR3. The first processing surface NT_L and the second processing surface NT_R face each other in the second direction DR2. The third processing surface NT_M extends in the second direction DR2 and the third direction DR3, and connects the first processing surface NT_L and the second processing surface NT_R.

[0147] According to an embodiment, the external module MD includes a sound module MD1, an optical module MD2, and a power module MD3. The sound module MD1 may be a sound output module that converts an electrical signal into a sound signal, or may be a sound input module that receives an external sound signal and converts the external sound signal into an electrical signal.

[0148] According to an embodiment, the optical module MD2 can be a light receiving module that receives an external light signal such as an infrared signal and converts the external light signal into an electrical signal, a light transmitting module that receives an electrical signal and converts the electrical signal into a light signal such as an infrared signal or a visible light signal, or a camera module that captures an image of an external object.

[0149] According to an embodiment, the power module MD3 supplies power necessary for the overall operation of the display device 101. The sound module MD1, the optical module MD2, and the display panel DP receive power from the power module MD3. The power module MD3 includes a conventional battery module.

[0150] According to an embodiment, at least one of the external modules MD is disposed in a recessed area HA surrounded by the notch portion NT. For example, the sound module MD1 and the optical module MD2 are disposed in the recessed area HA surrounded by the notch portion NT. Since the display panel DP according to an exemplary embodiment of the present disclosure includes the notch portion NT, the external modules MD and the display panel DP can be stably accommodated in the housing HM without increasing the size of the housing HM. Therefore, the display device 101 has a narrow frame area.

[0151] According to the embodiment, the housing HM provides a predetermined internal space. The display panel DP and the external module MD are accommodated in the internal space of the housing HM. As described above, since at least a portion of the external module MD is accommodated in the notch portion NT, the size of the housing HM can be prevented from increasing.

[0152] According to an embodiment, the window WM is coupled to the housing HM to form an inner space. The window WM and the housing HM define an appearance of the display device 101.

[0153] In addition, in the present exemplary embodiment, the window WM includes a transmissive area TA overlapping the recessed area HA surrounded by the notch portion NT. Therefore, the modules MD1 and MD2 disposed in the recessed area HA may be visible from the outside through the transmissive area TA.

[0154] According to an embodiment, when the display panel DP includes the notch portion NT, the display panel DP has an atypical shape.

[0155] According to an embodiment, the edge of the display panel DP includes straight line shape parts SLP1 to SLP4 and shape processing parts SMP1 to SMP5. The straight line shape parts SLP1 to SLP4 and the shape processing parts SMP1 to SMP5 are defined based on the shape of the edge of the display panel DP. That is, in the straight line shape parts SLP1 to SLP4, the edge of the display panel DP has a straight line shape, and in the shape processing parts SMP1 to SMP5, the edge of the display panel DP has a curved line shape or a shape that is concave or convex relative to the side surface of the display panel DP.

[0156] According to an embodiment of the present disclosure, the straight line shape portions SLP1 to SLP4 include first straight line shape portions SLP1 to fourth straight line shape portions SLP4. The first straight line shape portions SLP1 to fourth straight line shape portions SLP4 correspond to the first side surface SS1, the second side surface SS2, and the fourth side surface SS4. That is, the first straight line shape portion SLP1 overlaps the second side surface SS2, and the second straight line shape portion SLP2 overlaps the first side surface SS1. The third straight line shape portion SLP3 and the fourth straight line shape portion SLP4 overlap the fourth side surface SS4.

[0157] According to an embodiment of the present disclosure, the shape processed portions SMP1 to SMP5 include first to fourth curved surface shape portions SMP1 to SMP4 and a notch shape portion SMP5 having a concave fourth side surface and disposed between the third and fourth straight line shape portions SLP3 and SLP4.

[0158] According to an embodiment, the edge of the display panel DP further includes a pad portion PP adjacent to the pad area PDA The pad portion PP overlaps the third side surface SS3 and is disposed between the first curved shape portion SMP1 and the second curved shape portion SMP2.

[0159] Reference Fig.16 and Fig.17 According to the embodiment, the notch shape portion SMP5 includes a first notch grinding surface NGS1 and a second notch grinding surface NGS2 formed in the notch portion NT. In detail, the first notch grinding surface NGS1 is formed between the third processed surface NT_M and the front surface SUB-FS of the base substrate SUB, and the second notch grinding surface NGS2 is formed between the third processed surface NT_M and the back surface SUB-BS of the base substrate SUB. The first notch grinding surface NGS1 and the second notch grinding surface NGS2 are formed not only on the third processed surface NT_M but also on the Fig.15 On the first processed surface NT_L and the second processed surface NT_R shown in FIG.

[0160] According to an embodiment, each of the first notch grinding surface NGS1 and the second notch grinding surface NGS2 has an inclined surface. Each of the first notch grinding surface NGS1 and the second notch grinding surface NGS2 has a first width W1 in the thickness direction of the display panel DP (ie, the third direction DR3). According to an embodiment of the present disclosure, the first width W1 has a value in a range from about 20 micrometers to about 100 micrometers.

[0161] As described above, according to the embodiment, since the grinding surface is formed in the notch portion NT, the strength of the notch portion of the base substrate SUB is enhanced. Specifically, the first notch grinding surface NGS1 and the second notch grinding surface NGS2 are formed by a grinding process. According to an embodiment of the present disclosure, the notch shape portion SMP5 is formed by a CNC grinding process.

[0162] In addition, according to the embodiment, since the grinding process is performed on the base substrate SUB in various ways in the shape processing part, the strength of the edge portion of the display panel DP is enhanced.

[0163] Although the exemplary embodiments of the present disclosure have been described, it should be understood that the embodiments of the present disclosure should not be limited to these exemplary embodiments, but within the spirit and scope of the present disclosure, those skilled in the art can make various changes and modifications. Therefore, the disclosed subject matter should not be limited to the exemplary embodiments described herein, and the scope of the inventive concept should be determined according to the present disclosure.

Claims

1. A method for manufacturing a display panel, wherein: The method comprises: preparing a working substrate, the working substrate comprising a mother substrate including a plurality of unit regions, a light emitting element layer formed in each of the unit regions, and an encapsulation layer formed on each light emitting region in each of the unit regions; Disposing a plurality of protective films covering the light emitting element layer and the encapsulation layer in the unit region respectively; cutting the working substrate along a cutting line located at an outer side of the protective film of at least one of the unit regions, wherein at least one preliminary display panel is formed; Grinding the side surface of the at least one preliminary display panel includes: grinding a straight line shape portion of the side surface having a straight line shape and grinding a curved surface shape portion of the side surface having a curved shape; and The protective film is removed from at least one ground prepared display panel, wherein at least one display panel is formed, wherein the curved shape portion comprises a first curved grinding surface at a front surface edge of the curved shape portion and a second curved grinding surface at a rear surface edge of the curved shape portion, The straight shape portion includes a straight grinding surface formed at at least one of a front surface edge and a rear surface edge of the straight shape portion, and the straight grinding surface has a width different from the first and second curved grinding surfaces.

2. The method according to claim 1, wherein: The cutting line is formed along each of the unit regions in the working substrate, and the protection film does not overlap the cutting line.

3. The method according to claim 1, wherein: The encapsulation layer includes one or more inorganic layers alternately stacked with one or more organic layers.

4. The method according to claim 1, wherein: Cutting the working substrate along the cutting line comprises: Disposing a cutting device on a first surface of the working substrate on which the light emitting element layer and the encapsulation layer are disposed; and The cutting device is moved along the cutting line to cut the working substrate.

5. The method according to claim 1, wherein: Grinding the straight-line shape portion includes one or more steps of grinding the front surface edge or the rear surface edge of the straight-line shape portion using an edge grinder.

6. The method according to claim 5, wherein: When the grinding of the straight line shape portion includes grinding the rear surface edge of the straight line shape portion, the grinding of the straight line shape portion further includes inverting the at least one preliminary display panel before grinding the rear surface edge.

7. The method according to claim 1, wherein: Grinding the straight-line shape portion includes simultaneously grinding the front surface edge and the rear surface edge of the straight-line shape portion using a computer numerical control grinding device.

8. The method according to claim 1, wherein: Grinding the curved surface shape portion includes simultaneously grinding the front surface edge and the rear surface edge of the curved surface shape portion using a computer numerical control grinding device.

9. The method according to claim 8, wherein: When the straight shape portion is ground using the CNC grinding device, the straight shape portion is ground through the same process as the curved shape portion.

10. The method according to claim 1, wherein: Grinding the side surface of the at least one preliminary display panel further includes grinding a pad portion of the side surface adjacent to a pad region in which a plurality of pads are disposed.

11. The method according to claim 10, wherein: Grinding the pad portion includes: inverting the at least one preliminary display panel; and The edge of the rear surface of the pad portion is ground using an edge grinder.

12. The method according to claim 10, wherein: When the straight line shape portion is ground using an edge grinder, the pad portion is ground through the same process as the straight line shape portion.

13. A display panel, wherein: The display panel comprises: base substrate; a light emitting element layer disposed on one surface of the base substrate; and an encapsulation layer, covering the light emitting element layer, Wherein, the edge of the base substrate includes: a straight line shape portion having a straight line shape; and The shape processing portion includes at least one curved surface shape portion having a curved shape, wherein the at least one curved surface shape portion includes: a first curvilinear grinding surface formed at an edge of the front surface of the base substrate; A second curved grinding surface is formed at the rear surface edge of the base substrate, wherein the straight line shape portion includes a straight grinding surface formed at at least one of the front surface edge and the rear surface edge of the base substrate, and the straight line grinding surface has a width different from the first curved grinding surface and the second curved grinding surface of the shape processing portion.

14. The display panel according to claim 13, wherein: The display panel further includes a plurality of pads disposed on the base substrate, wherein the edge of the base substrate further includes a pad portion adjacent to the plurality of pads, and the pad portion includes a pad grinding surface formed at the rear surface edge of the base substrate.

15. The display panel according to claim 14, wherein: The pad grinding surface has a width smaller than widths of the first and second curvilinear grinding surfaces of the shape processed portion.

16. A method for manufacturing a display panel, wherein: The method comprises: providing a plurality of preliminary display panels, wherein each preliminary display panel comprises a unit area and a protective film covering the unit area, wherein each preliminary display panel comprises a side surface; grinding the straight line shape portion of the side surface, wherein the straight line shape portion has a straight line shape; grinding the curved surface shape portion of the side surface, wherein the curved surface shape portion has a curved shape; grinding a pad portion of the side surface adjacent to a pad region in which a plurality of pads are disposed; and The protective film is removed from each of the ground prepared display panels, wherein a plurality of display panels are formed, wherein the curved shape portion comprises a first curved grinding surface at a front surface edge of the curved shape portion and a second curved grinding surface at a rear surface edge of the curved shape portion; The straight shape portion includes a straight grinding surface formed at at least one of a front surface edge and a rear surface edge of the straight shape portion, and the straight grinding surface has a width different from the first and second curved grinding surfaces.

17. The method according to claim 16, wherein: Providing the plurality of preliminary display panels comprises: preparing a working substrate, the working substrate comprising a mother substrate including a plurality of the unit regions, a light emitting element layer formed in each of the unit regions, and an encapsulation layer formed on each of the light emitting regions in each of the unit regions; respectively disposing a plurality of the protective films covering the light emitting element layer and the encapsulation layer in the unit region; and The working substrate is cut along a cutting line located at an outer side of the protective film of each of the unit areas, wherein a plurality of the preliminary display panels are formed.

18. The method according to claim 16, in, grinding the straight shape portion comprises one or more steps of grinding the front surface edge of the straight shape portion using one of an edge grinder or a computer numerical control grinding device and grinding the rear surface edge of the straight shape portion using one of the edge grinder and the computer numerical control grinding device, wherein grinding the curved surface shape portion comprises using the computer numerical control grinding device to simultaneously grind the front surface edge and the rear surface edge of the curved surface shape portion, and Wherein, grinding the pad portion includes: turning each of the prepared display panels upside down; and grinding the edge of the rear surface of the pad portion using the edge grinder.

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