Apparatus for processing substrates

Abstract

The present invention relates to an apparatus for processing a substrate. In one embodiment, the apparatus comprises: a process chamber having a process space in which the substrate is processed with a fluid in a supercritical state; a support unit that supports the substrate in the process space; a fluid supply unit that supplies the fluid into the process space; a filling member that is arranged to face the substrate placed on the support unit in the process space; and a measuring unit that measures a state in the process space, the measuring unit being arranged in the filling member.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority under 35 U.S.C. §119 from Korean Patent Application No. 10-2019-0076976 filed on June 27, 2019 in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of the inventive concepts described herein relate to an apparatus for processing a substrate. Background Art

[0004] Generally, semiconductor elements are manufactured from a substrate such as a wafer, and are manufactured by forming a fine circuit pattern on an upper surface of the substrate through a deposition process, a photolithography process, an etching process, and the like.

[0005] While performing the process, various foreign substances may be generated on the upper surface of the substrate on which the circuit pattern is formed. In order to remove the foreign substances, a cleaning process may be performed.

[0006] Recently, supercritical fluids are used in the process of cleaning substrates. For example, the cleaning process can be performed in the following manner: the upper surface of the substrate is cleaned using isopropyl alcohol (hereinafter referred to as "IPA"), and supercritical carbon dioxide (CO 2 ) is dispensed onto the upper surface of the substrate to remove the IPA remaining on the substrate.

[0007] When using supercritical fluid in cleaning device, the state in cleaning device can not be identified before finishing process, and therefore it is difficult to control conditions such as the amount of supercritical fluid to be supplied, the amount of supercritical fluid to be released and process time. In supercritical process, the temperature and density of supercritical fluid can change according to internal pressure change, and the behavior of pattern tilt phenomenon or particles can change according to the temperature distribution of supercritical fluid. In addition, process performance is highly dependent on the temperature distribution of supercritical fluid. Therefore, a method for measuring temperature distribution is needed. Summary of the invention

[0008] Embodiments of the inventive concept provide a substrate treating apparatus and method for improving cleaning efficiency when cleaning a substrate using a supercritical fluid.

[0009] Embodiments of the inventive concept provide a substrate processing apparatus and method for monitoring a state in a chamber when cleaning a substrate using a supercritical fluid.

[0010] Embodiments of the inventive concept provide a substrate treating apparatus and method for detecting an optimal process condition when cleaning a substrate using a supercritical fluid.

[0011] Technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept belongs from the following description.

[0012] According to an exemplary embodiment, an apparatus for processing a substrate includes: a process chamber having a process space in which the substrate is processed with a fluid in a supercritical state; a support unit that supports the substrate in the process space; a fluid supply unit that supplies the fluid into the process space; a filling member that is arranged to face the substrate on the support unit placed in the process space; and a measuring unit that measures a state in the process space, the measuring unit being provided in the filling member.

[0013] In an embodiment, the measuring unit may include a temperature sensor.

[0014] In an embodiment, the measurement unit may include a plate on which the temperature sensors are arranged in an array.

[0015] In one embodiment, the temperature sensors may be arranged in one or more arrays and may be disposed on a surface facing the substrate.

[0016] In one embodiment, the shell of the filling member may be formed from a first material.

[0017] In one embodiment, the measuring unit may further include a communication module, the filling member may include a shell formed of a first material and a transmission window formed of a second material and installed in the shell, the transmission window being capable of transmitting wireless communication signals, and the first material may have a higher heat transfer rate than the second material.

[0018] In one embodiment, a hole may be formed in the housing, and the transmission window may be disposed in the hole.

[0019] In one embodiment, the first material may be a metal material, and the second material may be a resin material.

[0020] In one embodiment, the second material may be at least one of polyetheretherketone (PEEK), polyamide, or polytetrafluoroethylene (PTFE).

[0021] In one embodiment, the filling member may include: a shell having an internal space open at the top and formed of a first material; an upper member covering the top of the internal space and formed of a second material; and a transmission window arranged between the upper member and the shell and formed of a third material, the transmission window being capable of transmitting wireless communication signals, and the first material and the second material may have a higher heat transfer rate than the third material.

[0022] In one embodiment, the first material and the second material may be metallic materials.

[0023] In one embodiment, the first material and the second material may be the same material.

[0024] In one embodiment, the third material may be at least one of PEEK, polyamide or PTFE.

[0025] In one embodiment, the third material may be a resin material.

[0026] In one embodiment, the measuring unit may include: one or more sensors; a battery that supplies power to the sensors; and a communication module that transmits a signal measured by the sensors to the outside.

[0027] In one embodiment, the communication module may be disposed near the transmission window.

[0028] In one embodiment, the process chamber may include: an upper body in which the support unit is installed; a lower body in which the filling member is installed, and the lower body provides the process space together with the upper body; an actuator that moves one of the upper body and the lower body relative to the other; an upper supply line that supplies the fluid into the process space and is disposed in the upper body; and a lower supply line that supplies the fluid into the process space and is disposed in the lower body. The substrate may be supported so that the patterned surface faces upward, and the filling member may be located between the lower supply line and the substrate.

[0029] In an embodiment, the support unit may be configured to support an edge region of a bottom surface of the substrate, and the filling member may be located below the support unit in the process space.

[0030] In one embodiment, the measurement unit may include: one or more sensors; and a memory storing information values ​​measured by the one or more sensors.

[0031] In an embodiment, the measurement unit may further include a battery that supplies power to the one or more sensors.

[0032] In one embodiment, the device may further include: a connector, which is exposed outside the housing and connected to the memory, and the connector is capable of transmitting data in the memory to the outside.

[0033] In one embodiment, the measuring unit may further include a leveling sensor configured to measure the posture of the device.

[0034] In one embodiment, the measuring unit may further include a pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and other objects and features will become apparent from the following description with reference to the following drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:

[0036] Figure 1 is a schematic plan view illustrating a substrate processing system according to an embodiment of the present inventive concept;

[0037] Figure 2 It is shown Figure 1 A schematic diagram of an embodiment of a liquid processing device;

[0038] Figure 3 It is shown Figure 1 A schematic diagram of an embodiment of a cleaning device;

[0039] Figure 4 It shows that according to Figure 3 A cross-sectional view of a first embodiment of a filling member of a cleaning device;

[0040] Figure 5 Shown according to Figure 3 An exploded perspective view of a first embodiment of a filling member of a cleaning device;

[0041] Figure 6 is a schematic diagram showing a measurement unit 1110;

[0042] Figure 7 It shows that according to Figure 3 a cross-sectional view of a second embodiment of a filling member of a cleaning device;

[0043] Figure 8 It shows that according to Figure 3 A cross-sectional view of a third embodiment of a filling member of a cleaning device;

[0044] Fig. 9 It shows that according to Figure 3 a cross-sectional view of a fourth embodiment of a filling member of a cleaning device; and

[0045] Fig.10 is a schematic diagram showing the measurement unit 1410 . DETAILED DESCRIPTION

[0046] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. However, the inventive concept can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the disclosure will be thorough and complete and will fully convey the scope of the inventive concept to those skilled in the art. In the accompanying drawings, the size of the components is exaggerated for clarity of illustration.

[0047] Figure 1 is a schematic plan view illustrating a substrate processing system according to an embodiment of the inventive concept.

[0048] Reference Figure 1 , the substrate processing system includes an index module 10, a process module 20 and a controller (not shown). According to one embodiment, the index module 10 and the process module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the process module 20 are arranged is referred to as a first direction 92, a direction perpendicular to the first direction 92 when viewed from above is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0049] The index module 10 transfers the substrate W from the carrier 80 in which the substrate W is received to the process module 20, and places the substrate W completely processed in the process module 20 in the carrier 80. The longitudinal direction of the index module 10 is parallel to the second direction 94. The index module 10 has a plurality of loading ports 12 and an index frame 14. The loading ports 12 are located on the opposite side of the process module 20 relative to the index frame 14. The carrier 80 in which the substrate W is received is placed on the loading ports 12. The plurality of loading ports 12 may be arranged along the second direction 94.

[0050] An airtight carrier such as a front opening unified pod (FOUP) may be used as the carrier 80. The carrier 80 may be placed on the load port 12 by a transfer unit (not shown) such as an overhead conveyor, an overhead conveyor, or an automatic guided vehicle, or by an operator.

[0051] The index robot 120 is disposed in the index frame 14. A guide rail 140 is disposed in the index frame 14, the longitudinal direction of the guide rail is parallel to the second direction 94, and the index robot 120 is movable on the guide rail 140. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 is movable forward and backward, rotatable around an axis facing the third direction 96, and movable along the third direction 96. A plurality of hands 122 may be provided to be spaced apart from each other in the vertical direction. The hands 122 may be independently movable forward and backward.

[0052] The process module 20 includes a buffer unit 200, a conveying device 300, a liquid processing device 400, and a cleaning device 500. The buffer unit 200 provides a space in which a substrate W loaded into the process module 20 and a substrate W to be unloaded from the process module 20 temporarily stay. Each liquid processing device 400 performs a liquid processing process for processing the substrate W by dispensing liquid onto the substrate W. Each cleaning device 500 performs a drying process for removing liquid remaining on the substrate W. The conveying device 300 transfers the substrate W between the buffer unit 200, the liquid processing device 400, and the cleaning device 500.

[0053] The conveying device 300 may be arranged so that its longitudinal direction is parallel to the first direction 92. The buffer unit 200 may be arranged between the index module 10 and the conveying device 300. The liquid handling device 400 and the cleaning device 500 may be arranged on opposite sides of the conveying device 300. The liquid handling device 400 and the conveying device 300 may be arranged along the second direction 94. The cleaning device 500 and the conveying device 300 may be arranged along the second direction 94. The buffer unit 200 may be located at one end of the conveying device 300.

[0054] According to one embodiment, the liquid treatment device 400 may be disposed on the opposite side of the conveying device 300. The cleaning device 500 may be disposed on the opposite side of the conveying device 300. The liquid treatment device 400 may be disposed closer to the buffer unit 200 than the cleaning device 500. On one side of the conveying device 300, the liquid treatment device 400 may be disposed in an A×B array (A and B are natural numbers of 1 or greater) along the first direction 92 and the third direction 96. In addition, on one side of the conveying device 300, the cleaning device 500 may be disposed in a C×D array (C and D are natural numbers of 1 or greater) along the first direction 92 and the third direction 96. Alternatively, only the liquid treatment device 400 may be disposed on one side of the conveying device 300, and only the cleaning device 500 may be disposed on the opposite side of the conveying device 300.

[0055] The conveyor 300 has a conveyor robot 320. A guide rail 340 whose longitudinal direction is parallel to the first direction 92 may be provided in the conveyor 300, and the conveyor robot 320 is movable on the guide rail 340. The conveyor robot 320 includes a hand 322 on which the substrate W is placed. The hand 322 is movable forward and backward, rotatable around an axis facing the third direction 96, and movable along the third direction 96. A plurality of hands 322 may be provided to be spaced apart from each other in the vertical direction, and the plurality of hands 322 may be independently movable forward and backward.

[0056] The buffer unit 200 includes a plurality of buffer zones 220 in which the substrates W are placed. The buffer zones 220 may be arranged to be spaced apart from each other along the third direction 96. The front and back sides of the buffer unit 200 are open. The front side is opposite to the index module 10, and the back side is opposite to the transfer device 300. The index robot 120 may approach the buffer unit 200 through the front side, and the transfer robot 320 may approach the buffer unit 200 through the back side.

[0057] Figure 2 It is shown Figure 1 A schematic diagram of an embodiment of a liquid processing device 400 is shown. Figure 2 The liquid treatment device 400 has a housing 410, a cup 420, a support unit 440, a liquid dispensing unit 460, and a lifting unit 480. The housing 410 has a substantially rectangular parallelepiped shape. The cup 420, the support unit 440, and the liquid dispensing unit 460 are disposed in the housing 410.

[0058] The cup 420 has a process space opened at the top, and processes the substrate W with liquid in the process space. The support unit 440 supports the substrate W in the process space. The liquid dispensing unit 460 dispenses the liquid onto the substrate W supported on the support unit 440. A plurality of types of liquids may be sequentially dispensed onto the substrate W. The lifting unit 480 adjusts the height of the cup 420 relative to the support unit 440.

[0059] According to one embodiment, the cup 420 has a plurality of recovery bowls 422, 424 and 426. The recovery bowls 422, 424 and 426 have a recovery space for recovering the liquid used to process the substrate W. The recovery bowls 422, 424 and 426 are arranged in a ring around the support unit 440. During the liquid treatment process, the treatment liquid spread by the rotation of the substrate W can be introduced into the recovery space through the inlets 422a, 424a and 426a of the respective recovery bowls 422, 424 and 426. According to one embodiment, the cup 420 has a first recovery bowl 422, a second recovery bowl 424 and a third recovery bowl 426. The first recovery bowl 422 is arranged to surround the support unit 440, the second recovery bowl 424 is arranged to surround the first recovery bowl 422, and the third recovery bowl 426 is arranged to surround the second recovery bowl 424. The second inlet 424a through which liquid is introduced into the second recovery bowl 424, the first inlet 422a through which liquid is introduced into the first recovery bowl 422, and the third inlet 426a through which liquid is introduced into the third recovery bowl 426 may be located at a higher position than the first inlet 422a.

[0060] The support unit 440 has a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 may have a substantially circular shape and may have a larger diameter than the substrate W. A support pin 442a is provided on a central portion of the support plate 442 to support the back side of the substrate W. The support pin 442a protrudes upward from the support plate 442 so that the substrate W is spaced apart from the support plate 442 by a predetermined distance. A chuck pin 442b is provided on an edge portion of the support plate 442. The chuck pin 442b protrudes upward from the support plate 442 and supports a lateral portion of the substrate W to prevent the substrate W from being disengaged from the support unit 440 when being rotated. The drive shaft 444 is driven by an actuator 446. The drive shaft 444 is connected to the center of the bottom surface of the support plate 442 and rotates the support plate 442 around its central axis.

[0061] According to one embodiment, the liquid dispensing unit 460 has a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 dispenses the first liquid onto the substrate W. The first liquid may be a liquid for removing a film or foreign matter remaining on the substrate W. The second nozzle 464 dispenses the second liquid onto the substrate W. The second liquid may be a liquid that dissolves well in the third liquid. For example, the second liquid may be a liquid that dissolves better in the third liquid than the first liquid. The second liquid may be a liquid for neutralizing the first liquid dispensed onto the substrate W. In addition, the second liquid may be a liquid that neutralizes the first liquid and dissolves better in the third liquid than the first liquid. According to one embodiment, the second liquid may be water. The third nozzle 466 dispenses the third liquid onto the substrate W. The third liquid may be a liquid that dissolves well in the supercritical fluid used in the cleaning device 500. For example, the third liquid may be a liquid that dissolves better in the supercritical fluid used in the cleaning device 500 than the second liquid. According to one embodiment, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol (IPA). According to one embodiment, the supercritical fluid may be carbon dioxide. The first nozzle 462, the second nozzle 464, and the third nozzle 466 may be supported on different arms 461. The arm 461 may move independently. Alternatively, the first nozzle 462, the second nozzle 464, and the third nozzle 466 may be mounted on the same arm and may move simultaneously.

[0062] The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate W is changed by the vertical movement of the cup 420. Therefore, the recovery bowls 422, 424 and 426 for recovering the process liquid can be changed according to the type of liquid dispensed onto the substrate W, and the liquid can be recovered separately. Different from the above description, the cup 420 may be fixedly installed, and the lifting unit 480 may move the support unit 440 in the vertical direction.

[0063] Figure 3 It is shown Figure 1 Schematic diagram of an embodiment of a cleaning device 500 of the present invention. According to an embodiment, the cleaning device 500 removes liquid on the substrate W using a supercritical fluid. The cleaning device 500 has a body 520, a support (not shown), a fluid supply unit 560, and a filling member 1000.

[0064] The main body 520 provides a process space 502 in which a cleaning process is performed. The main body 520 has an upper main body 522 and a lower main body 524. The upper main body 522 and the lower main body 524 are combined with each other to provide the above-mentioned process space 502. The upper main body 522 is arranged above the lower main body 524. The upper main body 522 can be fixed in an appropriate position, and the lower main body 524 can be raised or lowered by a driving member 590 such as a cylinder. When the lower main body 524 is separated from the upper main body 522, the process space 502 is opened. At this time, the substrate W is loaded into or out of the process space 502. During the process, the lower main body 524 is in close contact with the upper main body 522 to seal the process space 502 from the outside. The cleaning device 500 has a heater 570. According to an embodiment, the heater 570 is located in the wall of the main body 520. The heater 570 heats the process space 502 of the body 520 so that the fluid supplied into the inner space of the body 520 is maintained in a supercritical state. An atmosphere formed of the supercritical fluid is formed in the process space 502.

[0065] The support member (not shown) supports the substrate W in the process space 502 of the main body 520. The support member (not shown) has a fixing rod (not shown) and a mounting member (not shown). The fixing rod (not shown) is fixedly mounted on the upper main body 522 to protrude downward from the bottom surface of the upper main body 522. The longitudinal direction of the fixing rod (not shown) is oriented in the vertical direction. The fixing rods (not shown) are positioned to be spaced apart from each other. The fixing rods (not shown) are arranged so that when the substrate W is placed in the space surrounded by the fixing rods (not shown) or is pulled out therefrom, the substrate W does not interfere with the fixing rods (not shown). The mounting member (not shown) is coupled to each fixing rod (not shown). The mounting member (not shown) extends from the lower end of the fixing rod (not shown) toward the space surrounded by the fixing rod (not shown). Due to the above structure, the edge area of ​​the substrate W placed in the process space 502 of the main body 520 is placed on the mounting member (not shown), and the entire top side of the substrate W, the central area of ​​the back side of the substrate W, and a portion of the edge area of ​​the back side of the substrate W are exposed to the cleaning fluid supplied to the process space 502. In one embodiment, the substrate W is supported so that the patterned surface faces upward.

[0066] The fluid supply unit 560 supplies a cleaning fluid into the process space 502 of the main body 520. According to one embodiment, the cleaning fluid may be supplied into the process space 502 in a supercritical state. Alternatively, the cleaning fluid may be supplied into the process space 502 in a gaseous state and may undergo a phase change to a supercritical state in the process space 502. According to one embodiment, the fluid supply unit 560 has a main supply line 562, an upper supply line 564, and a lower supply line 566. The upper supply line 564 and the lower supply line 566 branch from the main supply line 562. The upper supply line 564 is coupled to the upper main body 522, and the cleaning fluid is supplied from above the substrate W placed on the support (not shown). According to one embodiment, the upper supply line 564 is coupled to the center of the upper main body 522. The lower supply line 566 is coupled to the lower main body 524, and the cleaning fluid is supplied from below the substrate W placed on the support (not shown). According to one embodiment, the lower supply line 566 may be coupled to the center of the lower body 524. The exhaust unit 550 is coupled to the lower body 524. When the lower supply line 566 is coupled to the center of the lower body 524, an exhaust port (not shown) of the exhaust unit 550 may be eccentrically positioned outside the center of the lower body 524. The supercritical fluid in the process space 502 of the body 520 is released outside the body 520 through the exhaust unit 550.

[0067] The filling member 1000 may be arranged in the process space 502 of the main body 520. The filling member 1000 may be arranged in a cylindrical or conical shape with a set volume. The filling member 1000 is supported by a support rod 1001 so as to be spaced apart from the bottom surface of the main body 520 upward. The support rod 1001 may be arranged in a rod shape. The support rod 1001 may be arranged to be spaced apart from each other at a predetermined interval. When viewed from above, the filling member 1000 may be arranged to cover the supply port (not shown) of the lower supply line 566 and the exhaust port (not shown) of the exhaust unit 550. The filling member 1000 may prevent the cleaning fluid supplied by the lower supply line 566 from being directly distributed to the substrate W to damage the substrate W.

[0068] Figure 4 It shows that according to Figure 3 a cross-sectional view of a first embodiment of a filling member of a cleaning device, and Figure 5 Shown according to Figure 3 An exploded perspective view of a first embodiment of a filling member of a cleaning device. Figure 4 and Figure 5 , the filling member 1100 includes a housing and a measuring unit 1110 , and the housing includes an upper member 1101 , a transmission window 1102 , and a lower member 1103 .

[0069] The upper member 1101 forms the upper surface of the housing. The upper member 1101 is formed of a metal material. The metal material preferably has a high thermal conductivity. In addition, the metal material is a material that resists supercritical fluids in high temperature and high pressure states. The metal material is preferably stainless steel.

[0070] The transmission window 1102 forms a side wall of the housing. The transmission window 1102 is formed of a resin material. The resin material is preferably a material through which wireless communication signals can pass. The resin material may be at least one of PEEK, polyamide or PTFE.

[0071] The lower member 1103 forms the lower surface of the housing. The lower member 1103 is formed of a metal material. The metal material is a material that can resist a supercritical fluid in a high temperature and high pressure state. The metal material is preferably stainless steel.

[0072] The upper member 1101 is preferably formed of a material having a higher heat transfer rate than the transmission window 1102 .

[0073] The measurement unit 1110 includes a board 1111 , a temperature sensor array 1112 including a temperature sensor, a module device 1113 , and a battery 1120 .

[0074] The plate 1111 may be a circuit board. The temperature sensor array is adjacent to the upper member 1101, and the temperature sensors 1112 are arranged in an array on the circuit board 1111. The temperature sensors 1112 adjacent to the upper member 1101 indirectly measure the influence of the temperature of the substrate W transferred to the body 520. The temperature sensor array may be arranged so that the temperature sensors 1112 are coupled to the upper member 1101 without the plate 1111.

[0075] Figure 6 is a schematic diagram showing the measurement unit 1110 .

[0076] The measuring unit 1110 includes a temperature sensor array, a module device 1113 and a battery 1120. The components of the measuring unit 1110 may be connected to each other. The module device 1113 may include a processor module 1114, a leveling sensor 1115, a pressure sensor 1116 and a communication module 1117.

[0077] The processor module 1114 may control the temperature sensor array, the communication module 1117, the leveling sensor 1115, and the pressure sensor 1116. The processor module 1114 may be included in the board 1111 of the temperature sensor array.

[0078] The temperature sensor array disposed adjacent to the upper member 1101 indirectly measures the temperature around the substrate W in the process space 502 based on the temperature transferred through the upper member 1101. The upper member 1101 preferably has a high heat transfer rate.

[0079] The leveling sensor 1115 may measure the posture of the cleaning device 500. For example, when the cleaning device 500 is shaken violently, the posture of the cleaning device 500 may be measured by the leveling sensor 1115.

[0080] The pressure sensor 1116 may indirectly measure the pressure in the body 520 by measuring pressure changes in the filling member 1100 .

[0081] The communication module 1117 can transmit the temperature information, the posture information of the device, and the internal pressure information sensed by the temperature sensor array, the leveling sensor 1115, and the pressure sensor 1116 to an external device. The communication module 1117 can transmit the information in real time, or can transmit the stored information. In the case where the communication module 1117 transmits the stored information, the measurement unit 1110 can also include a memory (not shown).

[0082] The battery 1120 may supply power to the module device 1113 or the temperature sensor array.

[0083] Figure 7 It shows that according to Figure 3 A cross-sectional view of a second embodiment of a filling member of a cleaning device. Figures 4 to 6 The description of components denoted by the same reference numerals will be repeated. Figures 4 to 6 Description alternative.

[0084] In one embodiment, the housing 1201 of the filling member 1200 may be provided in an inverted truncated cone shape. Although not shown, the housing 1201 may be provided in a cylindrical shape. Although not shown, the housing 1201 may have different flat surfaces according to the shape of the substrate W.

[0085] The housing 1201 is formed of a metal material. The metal material preferably has high thermal conductivity. In addition, the metal material is a material that can resist supercritical fluids in high temperature and high pressure states. The metal material is preferably stainless steel.

[0086] A portion of the housing 1201 is implemented with a transmission window 1202. The transmission window 1102 is formed of a resin material. The resin material is preferably a material through which wireless communication signals can pass. The resin material can be at least one of PEEK, polyamide or PTFE. In one embodiment, a hole can be formed in a portion of the upper surface of the housing 1201, and the transmission window 1202 can be disposed in the hole.

[0087] For ease of description, the transmission window 1202 is shown as being too large. However, as long as the wireless communication signal can pass through the transmission window 1202, there is no particular limitation on the size of the transmission window 1202.

[0088] Figure 8 It shows that according to Figure 3 A cross-sectional view of a third embodiment of a filling member of a cleaning device. Figures 4 to 6 The description of components denoted by the same reference numerals will be repeated. Figures 4 to 6 Description alternative.

[0089] The housing 1301 of the filling member 1300 may be provided in an inverted truncated cone shape. Although not shown, the housing 1301 may be provided in a cylindrical shape. Although not shown, the housing 1301 may have different flat surfaces according to the shape of the substrate W.

[0090] The housing 1301 is formed of a resin material. The resin material is preferably a material through which wireless communication signals can pass. The resin material may be at least one of PEEK, polyamide, or PTFE. In one embodiment, the housing 1301 is preferably formed of a material through which wireless communication signals can pass and having a heat transfer rate similar to or corresponding to that of a metal material.

[0091] Fig. 9 It shows that according to Figure 3 A cross-sectional view of a fourth embodiment of a filling member of a cleaning device. Figures 4 to 6 The description of components denoted by the same reference numerals will be repeated. Figures 4 to 6 Description alternative.

[0092] The housing 1401 of the filling member 1400 may be provided in an inverted truncated cone shape. Although not shown, the housing 1401 may be provided in a cylindrical shape. Although not shown, the housing 1401 may have different flat surfaces according to the shape of the substrate W.

[0093] The housing 1401 is formed of a metal material. The metal material preferably has a high thermal conductivity. In addition, the metal material is a material that resists supercritical fluids in high temperature and high pressure states. The metal material is preferably stainless steel. The measuring unit 1410 is preferably integrally embedded in the housing 1401. The housing 1401 includes a connector 1413 exposed to the outside.

[0094] Fig.10 is a schematic diagram showing the measurement unit 1410 .

[0095] The measuring unit 1410 may include a memory 1419. The memory 1419 may be connected to the connector 1413. The connector 1413 may be connected to the memory 1419, and may transmit data in the memory 1419 to the outside.

[0096] The substrate processing apparatus according to the embodiment of the inventive concept can monitor the process by receiving the sensing value of the measuring unit in real time. In addition, by monitoring the process based on the sensing value of the measuring unit, at least one of the temperature and pressure in the process chamber can be feedback controlled.

[0097] Although not shown, the module device may include only one of the sensor, the communication module, and the processor module. The sensor, the communication module, and the processor module are not provided in the form of a module device, but may be provided as separate components. A battery may be included in the module device.

[0098] According to embodiments of the inventive concept, a substrate treating apparatus and method may improve cleaning efficiency when cleaning a substrate using a supercritical fluid.

[0099] Furthermore, the substrate processing apparatus and method may monitor the state in the chamber when the substrate is cleaned using the supercritical fluid.

[0100] Furthermore, the substrate processing apparatus and method may detect optimal process conditions when cleaning a substrate using a supercritical fluid.

[0101] The effects of the present inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein can be clearly understood by those skilled in the art to which the present inventive concept belongs from the specification and the accompanying drawings.

[0102] The above description illustrates the inventive concept. In addition, the above content describes the exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes and environments. That is, without departing from the scope of the inventive concept disclosed in the specification, the scope equivalent to the written disclosure and / or the technology or knowledge scope of those skilled in the art, the inventive concept can be modified or modified. The written embodiment describes the best state of the technical spirit for implementing the inventive concept, and various changes required in the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiment state. In addition, it should be explained that the attached claims include other embodiments.

[0103] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive, but illustrative.

Claims

1. A device for processing a substrate, the device include: A process chamber, wherein the process chamber has a process space, and the substrate is processed in the process space using a fluid in a supercritical state; a supporting unit configured to support the substrate in the process space; a fluid supply unit configured to supply the fluid into the process space; a filling member disposed to face the substrate on the supporting unit placed in the process space; as well as a measuring unit configured to measure a state in the process space, wherein the measuring unit is arranged in the filling member; The measuring unit further comprises a communication module, wherein the filling member comprises a shell formed of a first material and a transmission window formed of a second material and installed in the shell, the transmission window being capable of transmitting a wireless communication signal, and The first material has a higher heat transfer rate than the second material.

2. The device according to claim 1, in, The measuring unit includes a temperature sensor.

3. The device according to claim 2, in, The measuring unit includes a board on which the temperature sensors are arranged in an array.

4. The device according to claim 2, in, The temperature sensors are arranged in one or more arrays and are disposed on a surface facing the substrate.

5. The device according to claim 1, in, A hole is formed in the housing, and the transmission window is disposed in the hole.

6. The device according to claim 1 or 5, in, The first material is a metal material, and the second material is a resin material.

7. The device according to claim 1 or 5, in, The second material is at least one of PEEK, polyamide or PTFE.

8. The device according to claim 1, in, The measuring unit comprises: one or more sensors; a battery configured to supply power to the sensor; and A communication module is configured to transmit the signal measured by the sensor to the outside.

9. The device according to claim 1, in, The measurement unit further includes one or more of a pressure sensor and a leveling sensor configured to measure the posture of the device.

10. The device according to claim 1, in, The process chamber comprises: an upper body in which the support unit is installed; a lower body in which the filling member is installed, the lower body being configured to provide the process space together with the upper body; an actuator configured to move one of the upper body and the lower body relative to the other; an upper supply line configured to supply the fluid into the process space and disposed in the upper body; and a lower supply line configured to supply the fluid into the process space and disposed in the lower body, wherein the substrate is supported so that the patterned surface faces upward, and The filling member is located between the lower supply line and the substrate.

11. The device according to claim 10, in, The support unit is configured to support an edge region of a bottom surface of the substrate, and The filling member is located below the supporting unit in the process space.

12. The device according to claim 10, in, The measuring unit comprises: one or more sensors; and A memory configured to store information values ​​measured by the one or more sensors.

13. The device according to claim 12, in, The measurement unit further comprises a battery configured to supply power to the one or more sensors.

14. The device according to claim 12, further comprising: include: A connector is exposed to the outside of the housing of the filling member and connected to the memory, and the connector can transmit data in the memory to the outside.

15. An apparatus for processing a substrate, the apparatus include: A process chamber, wherein the process chamber has a process space, and the substrate is processed in the process space using a fluid in a supercritical state; a supporting unit configured to support the substrate in the process space; a fluid supply unit configured to supply the fluid into the process space; a filling member disposed to face the substrate on the supporting unit placed in the process space; as well as a measuring unit configured to measure a state in the process space, wherein the measuring unit is arranged in the filling member; Wherein, the filling member comprises: a housing having an interior space open at a top, the housing being formed of a first material; an upper member configured to cover a top of the interior space and formed of a second material; and a transmission window disposed between the upper member and the housing and formed of a third material, the transmission window being capable of transmitting wireless communication signals, and The first material and the second material have a higher heat transfer rate than the third material.

16. The device according to claim 15, in, The first material and the second material are metal materials.

17. The device according to claim 15, in, The third material is a resin material.

18. The device according to claim 15, in, The measuring unit comprises: one or more sensors; a battery configured to supply power to the sensor; and A communication module is configured to transmit the signal measured by the sensor to the outside.

19. The device according to claim 18, in, The communication module is arranged near the transmission window.

20. The device according to claim 15, in, The measurement unit further includes one or more of a pressure sensor and a leveling sensor configured to measure the posture of the device.

21. An apparatus for processing a substrate, the apparatus include: A process chamber, wherein the process chamber has a process space, and the substrate is processed in the process space using a fluid in a supercritical state; a supporting unit disposed in the process space and configured to support an edge region of a bottom surface of the substrate; a fluid supply unit configured to supply the fluid into the process space; a filling member, the filling member being arranged to face the substrate on the supporting unit placed in the process space, the filling member being located below the supporting unit; and a measuring unit disposed in the filling member and configured to measure a state in the process space, The process chamber comprises: an upper body in which the support unit is installed; a lower body in which the filling member is installed, the lower body being configured to provide the process space together with the upper body; an actuator configured to move one of the upper body and the lower body relative to the other; an upper supply line configured to supply the fluid into the process space and disposed in the upper body; and a lower supply line configured to supply the fluid into the process space and disposed in the lower body, wherein the filling member is located between the lower supply line and the substrate, The measuring unit comprises: a communications module; and one or more of a temperature sensor, a pressure sensor, and a leveling sensor configured to measure the attitude of the device, and The filling member includes a shell formed of a first material, and a transmission window formed of a second material and installed in the shell, the transmission window being capable of transmitting wireless communication signals, wherein the first material has a higher heat transfer rate than the second material.

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