Magnetic adsorption mechanism, evaporation device and manufacturing device for electronic device

Abstract

The present application provides a technique capable of adjusting the distribution of the adsorption force with respect to a mask simply and with high accuracy. A magnetic adsorption mechanism is provided, which uses a magnetic force to adsorb a mask to the surface of a film formation object, the mask being used to form a desired film formation pattern on the film formation object, wherein the magnetic adsorption mechanism is provided with: a plurality of magnets arranged on the side opposite to the mask with respect to the film formation object; and a back yoke on which the plurality of magnets are mounted and which forms a magnetic circuit that generates an adsorption force attracting the mask in the direction toward the film formation object using the magnetic force of the magnets, the back yoke having a magnetic resistance adjustment portion at a contact portion where the end surface in the magnetization direction of the magnets is in contact, the magnetic resistance adjustment portion being capable of adjusting the adsorption force by forming a space with variable amplitude between a portion of the end surface or by opening a portion of the end surface to the inside of the contact portion.

Description

TECHNICAL FIELD

[0001] The present application relates to a magnetic adsorption mechanism for adsorbing a mask to a film formation target by magnetic force. BACKGROUND

[0002] In the production of electronic devices such as organic EL elements, a method is known in which a substrate such as glass is placed with its film formation surface facing down on a mask, and a film is formed on the film formation surface via the mask. In terms of film quality, it is necessary to form a film with uniform thickness, and for this purpose, it is necessary to form a film with the substrate closely adhering to the mask.

[0003] Therefore, in Patent Document 1, a method is described in which a mask is attracted to a substrate and film formation is performed by the magnetic force of a plurality of magnets provided to a holding member that is a support member for the substrate.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT DOCUMENTS

[0006] Patent Document 1: Japanese Patent No. 4257497

[0007] However, as the substrate becomes larger, the number of magnets for adsorbing a mask to a substrate by magnetic force increases, and as a result of this, due to variations in the magnetic force of each magnet and variations in assembly accuracy, there are cases in which the distribution of the adsorbing force with respect to the mask does not converge within the desired range. If this occurs, when a mask is adsorbed to a substrate, the mask is adsorbed in an unexpected manner due to variations in the magnetic force, and as a result, a gap can occur between the mask and the substrate. Therefore, even if the method described in Patent Document 1 is used, there are cases in which a gap occurs locally between the mask and the substrate. If film formation is performed in a state in which a gap has occurred between the mask and the substrate, variations in film thickness can occur, and improvement is required.

[0008] Therefore, there are methods in which magnets are selected in order to suppress variations in the magnetic force of each magnet, but since more magnets are required in order to select the required number of magnets, the cost of the magnets increases. In addition, there are methods in which a spacer or the like is inserted between the magnets and the yoke in order to adjust the magnetic force of each magnet, but since a series of operations such as "removal of the magnets, insertion of the spacer, reinstallation of the magnets, measurement of the magnetic force" are required for a large number of magnets, the cost of the operations increases. SUMMARY

[0009] An object of the present application is to provide a technology that enables the distribution of the adsorbing force with respect to a mask to be adjusted simply and with high accuracy.

[0010] In order to achieve the above object, a magnetic type adsorption mechanism according to the present application uses magnetic force to adsorb a mask to a surface of a film formation object, the mask being used to form a desired film formation pattern on the film formation object, characterized by comprising:

[0011] a plurality of magnets arranged on a side opposite to the mask with respect to the film formation object; and

[0012] a back yoke on which the plurality of magnets are mounted and which forms a magnetic circuit that generates an adsorption force that attracts the mask in a direction toward the film formation object using magnetic force of the magnets,

[0013] the back yoke having a magnetic resistance adjustment portion at a contact portion at which an end surface in a magnetization direction of the magnets contacts, the magnetic resistance adjustment portion being capable of adjusting the adsorption force by forming a space having a variable width between at least a portion of the end surface or by opening at least a portion of the end surface to an inner side of the contact portion.

[0014] In order to achieve the above object, a magnetic type adsorption mechanism according to the present application uses magnetic force to adsorb a mask to a surface of a film formation object, the mask being used to form a desired film formation pattern on the film formation object, characterized by comprising:

[0015] a plurality of magnets arranged on a side opposite to the mask with respect to the film formation object; and

[0016] a back yoke on which the plurality of magnets are mounted and which forms a magnetic circuit that generates an adsorption force that attracts the mask in a direction toward the film formation object using magnetic force of the magnets,

[0017] the back yoke including a contact portion provided with a recess that forms a space for adjusting the adsorption force between at least a portion of an end surface in a magnetization direction of the plurality of magnets.

[0018] In order to achieve the above object, a magnetic type adsorption mechanism according to the present application uses magnetic force to adsorb a mask to a surface of a film formation object, the mask being used to form a desired film formation pattern on the film formation object, characterized by comprising:

[0019] a plurality of magnets arranged on a side opposite to the mask with respect to the film formation object; and

[0020] a back yoke on which the plurality of magnets are mounted and which forms a magnetic circuit that generates an adsorption force that attracts the mask in a direction toward the film formation object using magnetic force of the magnets,

[0021] The plurality of contact portions in which the end surface of the back yoke in the magnetization direction of the plurality of magnets is in contact include a contact portion provided with a through-hole that penetrates the back yoke in a manner that at least a portion of the end surface is open to the inside of the contact portion.

[0022] To achieve the above object, the evaporation device of the present application is characterized by comprising:

[0023] a mask for forming a desired film formation pattern on a film formation object;

[0024] a magnetic adsorption mechanism of the present application; and

[0025] an evaporation chamber in which an evaporation material is evaporated on the film formation object to which the mask is adsorbed by the magnetic adsorption mechanism.

[0026] To achieve the above object, the evaporation device of the present application is characterized by comprising:

[0027] An electronic device is manufactured by film formation on the film formation object using the evaporation device of the present application.

[0028] According to the present application, the adsorption force distribution with respect to the mask can be adjusted to a desired value with ease and high precision. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a schematic view showing a production line of an organic EL panel.

[0030] Figure 2 is a control block diagram of a production line of an organic EL panel.

[0031] Figure 3 is a schematic view showing a conveyance carriage.

[0032] Figure 4 is an exploded perspective view of a conveyance carriage.

[0033] Figure 5 is an exploded perspective view showing the structure of a magnetic adsorption mechanism.

[0034] Figure 6 is a schematic view showing the structure of a magnetic resistance adjustment portion.

[0035] Figure 7 is a schematic view showing the change in a magnetic circuit based on the magnetic resistance adjustment portion.

[0036] Figure 8 is a flowchart showing the process of alignment.

[0037] Figure 9is a schematic diagram showing each stage of progress of alignment.

[0038] Figure 10 is a subsequent schematic diagram showing each stage of progress of alignment.

[0039] Figure 11 is a subsequent schematic diagram showing each stage of progress of alignment.

[0040] Figure 12 is a schematic diagram showing a configuration example of a magnetic resistance adjustment section.

[0041] Figure 13 is a schematic diagram showing a configuration example of a magnetic resistance adjustment section.

[0042] Figure 14 is a schematic diagram showing a change in magnetic circuit based on a magnetic resistance adjustment section.

[0043] Figure 15 is a schematic diagram showing a configuration example of a magnetic resistance adjustment section.

[0044] Figure 16 is a schematic diagram showing a change in magnetic circuit based on a magnetic resistance adjustment section.

[0045] BRIEF DESCRIPTION OF DRAWINGS

[0046] 307: magnetic chuck, 307x: chuck body, 307x1: frame body, 307x2: support frame, 307x3: yoke plate (back yoke), 400: main surface, 401: adsorbing magnet, 401x1: adsorbing magnet N pole, 401x2: adsorbing magnet S pole, 402: magnetic resistance adjustment section, 402x1: threaded hole, 402x2: bolt, 402x3: nut, 410: yoke section, 411: space, G: glass substrate, M: mask DETAILED DESCRIPTION

[0047] Hereinafter, preferred embodiments and examples of the present application will be described with reference to the accompanying drawings. Note that the embodiments and examples described below are merely illustrative of preferred structures of the present application, and do not limit the scope of the present application to these structures. In addition, for the hardware structure and software structure of the device, manufacturing conditions, dimensions, materials, shapes, and the like in the following description, unless specifically described, the scope of the present application is not intended to be limited to the above. Furthermore, the same reference numerals are attached to the same constituent elements in principle, and repeated description is omitted.

[0048] The present application is suitable for a magnetic type adsorption mechanism that is assembled to an evaporation device that performs evaporation-based film formation on a film formation target and adsorbs a mask to the film formation target, and is typically applicable to an evaporation device that evaporates an organic material or the like with respect to a glass substrate and performs film formation in order to manufacture an organic EL panel. The present application is suitable for a magnetic type adsorption mechanism that adsorbs a mask to a film formation target using magnetic force, the mask being used to form a thin film, particularly an inorganic thin film, in a desired film formation pattern on a film formation target such as a substrate.

[0049] The material of the substrate as the film formation target can be a material that allows magnetic force to pass through, and in addition to glass, a film of a high molecular material, a metal other than a ferromagnetic body, or the like can be selected. The substrate can be, for example, a substrate in which a film of polyimide or the like is layered on a glass substrate. As the evaporation material, in addition to an organic material, a metallic material (metal, metal oxide, or the like), or the like can be selected.

[0050] In addition, the present application can also be understood as a control method of an evaporation device, an evaporation method, a film formation device that forms a thin film and a control method thereof, and a film formation method. In addition, the present application can also be understood as a manufacturing device of an electronic device that uses an organic EL panel such as an organic EL display, a manufacturing method of an electronic device. In addition, the present application can also be understood as a program that causes a computer to execute a control method, a storage medium that stores the program. The storage medium can be a non-transitory storage medium that can be read by a computer.

[0051] As the electronic device in the present application, a display device (for example, an organic EL display device) that has a light emitting element, an illumination device (for example, an organic EL illumination device) that has a light emitting element, a sensor (for example, an organic CMOS image sensor) that has a photoelectric conversion element, or the like are also included.

[0052] [Example 1]

[0053] (Overall structure of the production line)

[0054] Figure 1is a conceptual view showing the overall structure of a production line 100 of an organic EL panel. In general, the production line 100 constitutes a circulation-type conveyance path provided with a deposition treatment process conveyance path 100a, a return conveyance path 100b, a mask handover mechanism 100c, a carrier displacement device 100d, a mask handover mechanism 100e, a pre-alignment chamber 100g, and a carrier displacement device 100f. In each of the constituent elements constituting the circulation-type conveyance path, such as a substrate loading chamber 101, a reversing chamber 102, an alignment chamber 103, an acceleration chamber 104, a deposition chamber 105, a deceleration chamber 106, a mask separation chamber 107, a reversing chamber 108, a glass substrate discharge chamber 109, and the like, a conveyance assembly 301 for constituting the conveyance path is disposed. Details will be described later, but how the glass substrate G, the mask M, and the electrostatic chuck 308 (reference numeral C) are conveyed on the conveyance path in each process of the manufacturing process is shown in the present drawing.

[0055] In the deposition treatment process conveyance path 100a, in general, the glass substrate G is loaded from the outside in the conveyance direction (arrow A), the glass substrate G and the mask M are positioned and held on the conveyance carrier, and after the deposition treatment is performed while moving on the conveyance path together with the conveyance carrier 302, the glass substrate G after film formation is discharged. In the return conveyance path 100b, the mask M separated after the deposition treatment is completed and the conveyance carrier 302 after the glass substrate G is discharged are reset to the substrate loading chamber side.

[0056] In the mask handover mechanism 100c, the mask M separated from the conveyance carrier after the deposition treatment is completed is moved to the return conveyance path. The mask M moved to the return conveyance path is placed again on the conveyance carrier 302 emptied by discharging the substrate. In the carrier displacement device 100d, the empty conveyance carrier 302 having discharged the glass substrate G to the next process is transferred to the return conveyance path 100b. In the mask handover mechanism 100e, the mask M conveyed in the return conveyance path 100b and separated from the conveyance carrier is conveyed to the mask mounting position P2 on the deposition treatment process conveyance path 100a. In the carrier displacement device 100f, the empty conveyance carrier after the mask M is separated is conveyed from the return conveyance path 100b to the glass substrate loading position PI, which is the start point of the deposition treatment process conveyance path 100a. Details of the manufacturing process using the production line 100 will be described later.

[0057] Figure 2FIG. 1 is a conceptual diagram of a control module of the production line 100. The control module includes an operation management control section 700 that manages the operation information of the entire production line 100 and the operation controller 20. In addition, in each chamber (each device) that constitutes the production line 100, such as the substrate loading chamber 101, the inversion chamber 102, the alignment chamber 103, the acceleration chamber 104, and the evaporation chamber 105, a drive control section that controls the drive mechanism inside each chamber is provided. That is, the substrate loading chamber control section 701a is provided in the substrate loading chamber 101, the inversion chamber control section 701b is provided in the inversion chamber 102, the alignment chamber control section 701c is provided in the alignment chamber 103, the acceleration chamber control section 701d is provided in the acceleration chamber 104, and the evaporation chamber control section 701e is provided in the evaporation chamber 105. In each device (each chamber) other than the above, the control section 701N is also provided. It is also possible to consider that these drive control sections and the operation management control section 700 that manages the entire operation are included in the control means. In addition, it is also possible to consider that the operation controller 20 is also included in the control means.

[0058] In addition, the transport assembly a (301a) is provided in the substrate loading chamber 101, the transport assembly b (301b) is provided in the inversion chamber 102, the transport assembly c (301c) is provided in the alignment chamber 103, the transport assembly d (301d) is provided in the acceleration chamber 104, and the transport assembly e (301e) is provided in the evaporation chamber 105. In each chamber other than the above, the transport assembly 301N is also provided. In the transport assembly 301 provided in each device, a plurality of drive coils are provided in a line along the transport direction of the glass substrate G and the transport carriage 302. The drive of the transport carriage 302 is controlled by controlling the current or voltage flowing in each drive coil according to the value of the encoder provided in each transport assembly 301. Since the magnet provided in the transport carriage 302 and the coil provided in the transport assembly 301 in opposition to the magnet of the transport carriage 302 work together to transport the substrate, the transport carriage 302 and the transport assembly 301 can be considered as the substrate transport unit 300 (transport mechanism) together.

[0059] An encoder that detects the position of the transport carriage 302 is provided in each transport assembly 301. According to the detection value of the encoder, the operation management control section 700 sends an instruction to the drive control section of each chamber to start or stop the control of the drive mechanism of each chamber or change the control state. In addition, the trigger of the control is not limited to the encoder detection value, and any sensor can be used as long as it can be used in the control.

[0060] (Structure of Transport Carriage)

[0061] Figure 3 (A) is a view showing the structure of the transport carriage 302 from the side of the glass substrate G. Figure 1A front view of a substrate transfer unit 300 including a transfer assembly 301 as a fixed portion and a transfer bracket 302 as a movable portion, as viewed in the transfer direction indicated by arrow A. Figure 3 (B) Yes Figure 3 (A) is an enlarged view of the main part surrounded by a frame S, Figure 3 (C) is a side view of the conveying bracket 302, Figure 4 This is an exploded perspective view of the conveyor carriage. Multiple conveyor units 301 are arranged throughout the production line 100 to form a conveyor path. By controlling the current supplied to the drive coils of each conveyor unit 301, the multiple conveyor units can be controlled as a single conveyor path, allowing the conveyor carriage 302 to move continuously.

[0062] In the figure, the conveyor bracket 302's bracket body 302A comprises a rectangular frame. Guide grooves 303a and 303b, each with a U-shaped cross-section and opening laterally, are formed on its left and right sides, parallel to the conveying direction A. Meanwhile, roller bearings (guide rollers) 304a and 304b, each comprising a plurality of roller arrays, are rotatably mounted on the inner surfaces of side plates 3011a and 3011b on the conveyor assembly 301 side. Furthermore, the roller bearings 304a and 304b, inserted into the guide grooves 303a and 303b, support the conveyor bracket 302 so that it can move relative to the conveyor assembly 301 in the direction indicated by arrow A (the conveying direction).

[0063] On the upper surface of the guide grooves 303a and 303b on both sides of the carriage body 302A of the conveying carriage 302, driving magnets 305a and 305b (magnet array) formed by arranging multiple magnets in a predetermined pattern are arranged linearly and parallel to the conveying direction (travel direction) of the substrate. In addition, driving coils 306a and 306b (coil array) formed by arranging multiple coils in a predetermined pattern are arranged on the conveying component 301 side. Moreover, when the conveying carriage 302 is supported by the conveying component 301, the driving magnets 305a and 305b and the driving coils 306a and 306b are respectively arranged to be close to each other. The electromagnetic force between the driving magnets 305a and 305b on the conveying carriage 302 side and the driving coils 306a and 306b on the conveying component 301 side can be used to levitate the conveying carriage 302 or cause it to move in the direction of arrow A (conveying direction).

[0064] Furthermore, the opening width 303W of the guide grooves 303a and 303b on the conveyor carriage side is formed to be wider than the diameter 304R of each roller bearing 304a and 304b on the conveyor unit side by a gap CL (303W = 304R + CL). This structure allows the roller bearings 304a and 304b to float within the guide grooves within the predetermined gap CL.

[0065] This structure enables moving magnet linear motor control. Specifically, by controlling the current supplied to the multiple coils comprising the drive coils 306a and 306b, a propulsive force in the direction of travel of the conveyor carriage 302 or a magnetic levitation force relative to the conveyor assembly 301 can be generated. The drive coils 306a and 306b comprise the drive system. Furthermore, as long as a coil is configured on one side of the conveyor assembly or the conveyor carriage of the conveying mechanism, and a magnet is configured on the other side, even with a moving coil system, levitation alignment of the conveyor carriage can be achieved.

[0066] Moreover, according to Figure 3 The structure of the conveyor assembly 301 and the conveyor bracket 302 shown can also be used to convey the conveyor bracket 302 while supporting the conveyor bracket 302 with rollers using the roller bearings 304a and 304b. In other words, the conveyor bracket 302 can be moved while the conveyor bracket 302 is not magnetically suspended (while the conveyor bracket 302 is sinking due to its own weight and the guide grooves 303a and 303b are in contact with and supported by the roller bearings 304a and 304b).

[0067] (Mechanism for Holding Glass Substrate G and Mask M on Transport Carriage)

[0068] Next, the mechanism for holding the glass substrate G on the transport carriage 302 and the mechanism for holding the mask M on the glass substrate G will be described. According to this embodiment, the glass substrate G is held on the transport carriage 302 in an overlapping manner using an electrostatic chuck 308 as an electrostatic attraction member, and the mask M is held on the transport carriage 302 in an overlapping manner using a magnetic attraction chuck 307 as a magnetic attraction member.

[0069] exist Figure 3 、 Figure 4 In the embodiment, a chuck frame 309 is mounted on the bottom surface of a rectangular frame-shaped transport carriage 302, which houses a magnetic attraction chuck 307 and an electrostatic chuck 308. The magnetic attraction chuck 307 magnetically attracts the mask M, while the electrostatic chuck 308 attracts the glass substrate G using electrostatic force. An electrostatic chuck control unit (control box 312) is located on the top surface of the rectangular frame of the carriage body 302A. The electrostatic chuck control unit (control box 312) houses a control unit that charges the electrostatic chuck 308.

[0070] By operating the control box 312 and charging the electrostatic chuck 308 in the chuck frame 309 , the glass substrate G can be attracted and held.

[0071] like Figure 3 As shown, the magnetic attraction chuck 307 includes a chuck body 307x and two guide rods 307a. The two guide rods 307a extend from the back side of the chuck body 307x (the side opposite to the side facing the glass substrate G) on the side of the carriage body 302A in the Z-axis direction (upper direction in the figure). The guide rods 307a are slidably inserted into cylindrical guides 307b provided on the frame of the carriage body 302A and are movable up and down within the chuck frame 309.

[0072] The magnetic attraction chuck 307 has a connecting hook 307c, which is a connecting portion that can be engaged or disengaged with a drive-side hook 307g provided at the drive-side connecting end portion of the connecting end portion located on the external drive source side. By engaging this connecting hook 307c with the drive-side hook 307g and driving (moving) the drive-side hook 307g in the vertical direction, the chuck body 307x is driven vertically via the guide rod 307a. The drive-side hook 307g is controlled by an actuator 307h, such as a fluid pressure cylinder or ball screw drive device, located externally.

[0073] In the illustrated example, a connecting hook 307c is provided on a cover 307i fixed to the front end of a guide rod 307a, and a laterally extending positioning piece 307d is provided on the side of the cover 307i. On the other hand, on the bracket body 302A side, the positioning piece 307d can selectively engage with an upper locking piece 307f and a lower stopper 307e. The upper locking piece 307f abuts the positioning piece 307d at the upper end of the chuck body 307x, while the lower stopper 307e locks the lower end. The upper locking piece 307f is movable horizontally between an engaged position, where it engages with the lower surface of the positioning piece 307d at the upper end, and a retracted position, where it is away from the positioning piece 307d. When the upper locking piece 307f is in the retracted position, the positioning piece 307d can move downward and abut against the lower stopper 307e, thereby limiting the downward movement of the chuck body 307x relative to the bracket body 302A. This downward position allows for magnetic attraction of the mask M. However, a slight gap is provided between the chuck body 307x and the electrostatic chuck 308. This prevents the weight of the magnetic chuck 307x from acting on the electrostatic chuck 308.

[0074] The driving of the upper end locking piece 307f is also performed by an external driving force. For example, by rotating and driving a pinion provided at the front end using a rotation driving actuator 307m, and engaging the pinion with a rack provided to a movable member of the linear guide 307k or the upper end locking piece 307f, the upper end locking piece 307f can be horizontally moved.

[0075] As shown in Figure 3 , the upper end locking piece 307f is slidably supported by a pair of linear guides 307k provided at a predetermined interval via a base 307j provided to the upper surface of the carriage main body 302A. A lower end stopper 307e is provided to protrude from the upper surface of the base 307j between the linear guides 307k. The positioning piece 307d is configured to have a width that can pass between the linear guides 307k, and can be moved downward when the upper end locking piece 307f is moved to the retreat position, and abuts against the lower end stopper 307e.

[0076] In a state where the glass substrate G is held by the electrostatic chuck 308 of the chuck frame 309, the mask M is approached while being aligned with respect to the glass substrate G, and in a state where the mask M abuts against the glass substrate G, the magnetic chuck 307 is moved to the mask M side. Thereby, the mask M is magnetically attracted to the magnetic chuck 307 with the glass substrate G and the electrostatic chuck 308 interposed therebetween. Thereby, the glass substrate G and the mask M are chucked to the chuck frame 309 in a state of being aligned with each other, and as a result, are held on the transport carriage 302.

[0077] Next, the shapes of the electrostatic chuck 308 and the magnetic chuck 307 are described with reference to Figure 4 . The chuck frame 309 is a rectangular member that is smaller than the carriage main body 302A, and constitutes a guide wall 309a that guides four edges of a rectangular frame 307x1 that holds the outer periphery of the electrostatic chuck 308 and supports a grid-shaped support frame 307x2 that supports the magnetic chuck 307.

[0078] The electrostatic chuck 308 is a plate-shaped member such as ceramic, and attracts the glass substrate G using electrostatic force acting between the electrostatic chuck 308 and the glass substrate G by applying a voltage to an internal electrode, and is fixed to the lower side edge of the chuck frame 309 so as not to be vertically moved. Figure 4 As shown in , the electrostatic chuck 308 is divided into a plurality of chuck plates 308a (six in the figure), and the edges of the respective chuck plates 308a are fixed to each other by a plurality of ribs 309b. The ribs 309b are divided so as not to interfere with the support frame of the magnetic chuck 307.

[0079] The chuck main body 307x of the magnetic chuck 307 is a structure in which a rectangular frame 307xl has a grid-shaped support frame 307x2 having a pattern corresponding to the mask pattern formed in the mask M and a magnetic chucking mechanism including a chucking magnet 401 (Fig. 3) mounted to the support frame 307x2. Figures 5-7 The chucking magnet 401 is a magnet having an S pole and an N pole alternately and linearly arranged along the grid via a yoke plate 307x3. Details of the magnetic chucking mechanism are described later.

[0080] In addition, a mask chuck 311 as a mask holding member that holds the mask M is provided at a plurality of positions (ten positions in the embodiment) around the chuck frame 309 on the lower surface of the transport carriage 302 in addition to the magnetic chuck 307. The mask chuck 311 is a structure driven by a driving force from an actuator 311m arranged outside, and the transport carriage 302 is not provided with a driving source.

[0081] (Manufacturing Process)

[0082] Next, a process of actually fixing the mask M to the glass substrate G and performing vacuum evaporation of an organic EL light emitting material in the evaporation chamber and discharging it will be described.

[0083] As described above, Figure 1 The moving positions of the transport carriage 302 (electrostatic chuck 308) that transports the glass substrate G and the mask M with respect to each manufacturing process step in the production line 100 for organic EL panels are shown. In the drawings, for easy understanding, each moving position in the control in the manufacturing process step is described with reference numerals Cl, C2 attached to the transport carriage 302 (meaning of the reference numerals is described later), but in fact, it is not limited to the number of transport carriages 302 introduced to the transport path as shown. The number introduced at the same time is determined by the design of the manufacturing process and the production cycle time. In addition, in the drawings, the transport carriages and the like move in the counterclockwise direction on the paper in the production line, but it is not limited to this direction.

[0084] In the production line 100, as the propelling force of the transport carriage 302 in the transport direction, a magnetic drive system (linear motor system) is employed. In addition, in the support in the vertical direction of the transport carriage 302, either of a magnetic force-based levitation and a roller-based guide can be used. As described above, since the generation of garbage and dust is less in the case where the transport carriage 302 is magnetically levitated and transported, it is very effective for transport in a device that requires a high degree of vacuum and cleanliness such as the manufacture of organic EL panels.

[0085] In the drawings, the positions where the positional relationship of each constituent element changes are marked with the reference numerals P1 to P8 shown below.

[0086] P1: Glass substrate carrying position holding glass substrate G on the conveyor bracket

[0087] P2: Mask installation position where mask M is installed on glass substrate G on conveyor bracket

[0088] P3: Mask separation position for separating the mask M from the glass substrate G after the vapor deposition process

[0089] P4: a substrate discharge position where the glass substrate G after the vapor deposition process is separated from the conveying carriage 302 and discharged.

[0090] P5: Transfer the empty conveying tray 302 after discharging the glass substrate G to the tray transfer position of the return conveying path

[0091] P6: The mask M separated after the vapor deposition process is mounted on the mask transfer position of the transport carriage 302 on the return transport path

[0092] P7: Mask return position where the mask M is separated from the transport carriage 302 being transported on the return transport path and transported to the mask mounting position P2

[0093] P8: The carriage return position (end point of the return transport path) where the transport carriage 302 after the mask M is separated is transferred from the return transport path to the glass substrate carrying-in position P1 on the transport path for vapor deposition treatment.

[0094] While the conveyor carriage 302 is being moved on the production line 100 by the conveyor assembly 301, the stacking relationship of the glass substrate G, the mask M, and the electrostatic chuck 308 of the conveyor carriage may change at various locations on the production line, or may be turned upside down 180 degrees due to inversion processing. Figure 1 In the figure, to facilitate understanding of the vertical relationship between the glass substrate G, mask M, and electrostatic chuck 308, reference numerals are shown according to the main positions. That is, when the surface of the glass substrate G on which the film is to be formed (the film-forming surface) is located at the top, it is indicated by the reference numeral G1, and when the surface on which the film is not to be formed is located at the top, it is indicated by the reference numeral G2. In addition, when the substrate-attracting side of the electrostatic chuck 308 is located at the top, it is indicated by the reference numeral C1, and when the side on which the substrate is not to be attracted is located at the top, it is indicated by the reference numeral C2. In addition, when the film-forming side of the mask M is located at the top, it is indicated by the reference numeral M1, and when the side on which the film is not to be formed is located at the top, it is indicated by the reference numeral M2. The reference numerals indicate the state after inversion in each inversion chamber and the state after loading and unloading in the loading and unloading chambers.

[0095] <Moving-in Process>

[0096] The glass substrate G is carried into the substrate carrying chamber 101 on the evaporation processing process transport path 100a from an external stocker at the glass substrate carrying-in position Pl, and is held at a predetermined holding position on the transport carriage 302 by the electrostatic chuck 308. At the glass substrate carrying-in position Pl, the transport carriage 302 and the transport assembly 301 supporting the transport carriage 302 are arranged so that the transport assembly 301 becomes the lower side. At this time, the glass substrate holding surface (chuck surface) of the transport carriage 302 is in an upward attitude. The glass substrate G is carried into the glass substrate carrying-in position Pl from above and is placed on the chuck surface.

[0097] Next, the transport carriage 302 holding the glass substrate G is transported from the glass substrate carrying-in position Pl to the inversion chamber 102. This transport is performed in a roller transport mode. That is, the transport carriage 302 advances in the advancing direction by the magnetic force generated between the drive coil 306a, 306b to which a current or voltage is applied and the drive magnet 305a, 305b while contacting the roller bearings 304a, 304b that make the guide groove 303 a guide.

[0098] <Inversion-mode switching process>

[0099] In the inversion chamber 102, the rotation support mechanism rotates the transport assembly 301 supporting the transport carriage 302 holding the glass substrate G by 180 degrees with respect to the advancing direction. As a result, the transport carriage 302 and the transport assembly 301 are inverted in the up-down relationship, and the glass substrate G becomes the lower surface side. The rotation support mechanism can rotate the transport assembly 301 by 180 degrees in the advancing direction for each transport carriage 302. It is preferable that the rotation axis be located at the center of gravity so that positional deviation of the transport carriage 302 and the transport assembly 301 does not occur during the rotation operation. In the drawing, the inversion arrow R in the advancing direction of the transport carriage 302 and the transport assembly 301 is indicated. In addition, it is preferable that a locking mechanism mechanically locking the transport assembly 301 and the transport carriage 302 also be used.

[0100] Here, one of the reasons for rotating the transport carriage 302 for each transport assembly 301 is that the roller bearings 304a, 304b arranged on both sides of the transport assembly are inserted into the guide grooves 303a, 303b of the transport carriage 302 in order to guide the transport carriage 302. Another reason is that since the magnet on the transport carriage side and the coil on the transport assembly side are in a position relationship opposite to each other, if the configuration is such that only the transport carriage is inverted, although the inversion weight becomes lighter, the arrangement of the magnet on the transport carriage side and the guide mechanism of the transport assembly become complicated.

[0101] After the reverse processing in the reverse chamber, the current or voltage applied to the drive coil is controlled, and the support method of the transport carriage 302 is switched from the abutment of the roller bearings 304a, 304b and the guide grooves 303a, 303b to magnetic levitation. Thereby, the transition from the roller transport mode to the magnetic levitation transport mode is made. Next, the transport carriage 302 is moved to the alignment chamber 103 (mask mounting position P2) in the magnetic levitation transport mode.

[0102] <Alignment Process>

[0103] In the alignment operation, the alignment marks formed in advance on the glass substrate G and the mask M are photographed by the alignment camera, and the positional displacement and the direction of the two are detected, and the alignment (alignment) is performed while the position of the magnetically levitated transport carriage 302 is finely moved by the transport drive system, and the mask M is adsorbed and held to the transport carriage 302 by the magnetic adsorption chuck 307 in a state in which the glass substrate G and the mask M are accurately aligned in position.

[0104] As described above, the holding state is locked by the mask chucks 311 of the ten sites, and even if the electrostatic chuck 308 and the magnetic adsorption chuck 307 are later released, the state in which the glass substrate G and the mask M are held to the transport carriage 302 in the aligned state is maintained.

[0105] Here, at the time of alignment, the position with respect to the transport assembly 301 is finely adjusted in a state in which the transport carriage 302 is magnetically levitated. Therefore, since the alignment can be performed using the transport carriage drive system without separately providing a fine adjustment mechanism dedicated to alignment, it is also effective for the simplification and weight reduction of the structure of the transport carriage 302.

[0106] (Process Flow)

[0107] Referring to Figure 8 the flowcharts and Figures 9-11 , the details of the alignment operation of the alignment chamber 103 will be described. Figure 9 (A) to Figure 11 (D) correspond to steps S1 to S5, S7 to S12 of Figure 8 , respectively. In addition, in order to make the description simple, the roller bearings 304a, 304b and the guide grooves 303a, 303b are not illustrated in Figures 9-11 .

[0108] First, in step S1, as in Figure 9 (A), the mask M is carried in from the pre-alignment chamber 100g by the mask handover mechanism 100e. The alignment chamber control section detects the completion of the carrying in by the sensor provided to the alignment chamber 103.

[0109] Next, in step S2, as in Figure 9(B) As such, the transport carriage 302 holding the substrate is carried from the inversion chamber 102 to the alignment chamber 103 in the magnetic levitation transport mode. The transport direction A here is set to a direction from the inside toward the front. The alignment chamber control section detects the position from the value of the encoder of the transport assembly 301 and stops the transport carriage 302 at a predetermined alignment position. The gap (clearance) between the mask M and the glass substrate G at this time is set to CLS2. For example, CLS2 = 68 mm.

[0110] Next, in step S3, as Figure 9 (C) As such, the mask M is raised by the lifting device 202 (lifters 203a to 203d, lifting rods 204a to 204d) and stopped just before coming into contact with the glass substrate G. In the present embodiment, four sets of the lifters 203a to 203d and the lifting rods 204a to 204d are provided at the four corners of the lower surface of the mask tray 205, respectively, and Figure 9 Here, only one set of the lifter 203a and the lifting rod 204a and one set of the lifter 203b and the lifting rod 204b are shown. The stop position is a position at which the alignment camera can simultaneously measure the positions of the respective alignment marks of the glass substrate G and the mask M in the next step S4. When the gap between the mask M and the glass substrate G at this time is set to CLS3, for example, CLS3 = 3 mm.

[0111] Next, in step S4, as Figure 9 (D) As such, the respective alignment marks of the glass substrate G and the mask M are simultaneously measured by the alignment camera 1310. Further, a through-hole is provided in the transport carriage 302 in the direction of the optical axis of the alignment camera. The alignment camera can measure the alignment marks provided to the glass substrate G and the mask M via the through-hole. Alternatively, the through-hole can not be used but, for example, a notch or the like can be used as long as the structure is one that enables measurement of the alignment marks.

[0112] Next, in step S5, as Figure 10 (A) As such, the alignment chamber control section calculates the positional offset of the glass substrate G and the mask M from the measurement result in S4 and adjusts the position of the transport carriage 302 holding the glass substrate G so that the value of the positional offset converges to a predetermined allowable range. At the time of the position adjustment, as shown by reference numeral 331, the driving coils 306a, 306b (see FIG. 1) are driven to move the transport carriage 302 in the direction of the optical axis of the alignment camera 1310. Figure 3) and adjusts the magnetic force with the driving magnets 305a, 305b. Like this, the alignment action of this step is performed in a state where the transport carriage 302 is levitated. Next, in step S6, the alignment camera again performs measurement, and the alignment chamber control section determines whether the value of the positional deviation is within a predetermined range. If it is outside the range, it returns to S5, and the alignment is repeated until the positional deviation value converges within the range.

[0113] As described above, the alignment action of this flow is performed by adjusting the position of the transport carriage using the magnetic force in a state where the transport carriage and the glass substrate G held to the transport carriage are magnetically levitated. In this structure, since the transport carriage is non-contact with the transport assembly, the influence of friction and the like can be suppressed, and in addition, high-precision positioning can be performed. In addition, since the magnetic force generated by the driving coil for transporting the transport carriage in alignment and the driving magnet is used, it is not necessary to provide another driving member for alignment. As a result, it is possible to simplify the structure of the device and reduce the cost.

[0114] When the alignment action is completed, the course of magnetically attracting the mask M is entered, but in this embodiment, first, the mask frame MF is clamped using the mask chuck 311.

[0115] That is, in S7, the mask M is caused to rise and approach the glass substrate G as in Figure 10 (B). When the mask M rises, the mask M supported by the mask support portion 206 is caused to rise by causing the mask tray 205 to rise using the lifting device 202. The mask M itself is curved as schematically shown in the drawing, the mask frame MF supported to the mask support portion 206 rises, and approaches the glass substrate G to a predetermined gap. When the gap of the mask M and the glass substrate G at this time is set to CLS71, for example, CLS71 = 0.5 mm. In addition, since the transport carriage 302 is magnetically levitated, there is a gap CLS72 between the lower end of the carriage support portion 302Al and the mask tray 205.

[0116] Next, in S8, the magnetic levitation control is set to be off, and the transport carriage 302 is caused to land on the mask tray 205 as in Figure 10 (C). Since the magnetic levitation control is caused to be off, the transport carriage 302 which has been levitated is caused to fall due to the weight, and lands on the mask tray 205. In the illustrated example, the lower end of the carriage support portion 302Al provided to the carriage main body 302A and the mask tray 205 are in abutment. When the gap of the mask M and the glass substrate G at this time is set to CLS8, for example, CLS8 = 0.3 mm.

[0117] Next, in S9, the mask clamping is performed as in Figure 10 (D).

[0118] That is, the chuck piece 311c is engaged with the mask frame MF and clamped by rotating and driving the rotating shaft 311f using an external drive device. In the illustrated example, the upper chuck piece 311b is omitted. At this time, the mask frame MF is fixed. Even if the electrostatic chuck 308 and the magnetic chuck 307 are released, the state is maintained.

[0119] Next, in S10, as in Figure 11 (A), the transport carriage 302 is raised to a levitation start position in a state where the mask M is held by the mask chuck 311. The raising of the transport carriage 302 is performed using the lifting device of the mask tray 205. At the levitation start position, the interval between the drive coil 306 of the transport assembly 301 and the drive magnet 305 of the transport carriage 302 is a distance at which an attractive force becomes a degree at which the transport carriage 302 can be levitated. In this step, the transport carriage 302 is raised, for example, by about 0.7 mm.

[0120] Next, in S11, as in Figure 11 (B), the magnetic levitation control is set to ON, and the transport carriage 302 holding the mask M is levitated from the mask tray 205. That is, the transport carriage 302 is levitated from the mask tray 205 by a predetermined amount using the attractive force between the drive coil 306 of the transport assembly 301 and the drive magnet 305 of the transport carriage 302. The amount of raising is, for example, about 0.5 mm. That is, when the gap between the mask tray 205 at this time and the lower end of the carriage support portion 302A1 of the transport carriage 302 is set to CLS11, for example, CLS11 = 0.5 mm.

[0121] Next, in S12, as in Figure 11 (C), the magnetic chuck 307 is lowered and the mask M is magnetically attracted. That is, the locking piece locked at the upper end is rotationally driven using an external actuator, moved to a retreat position to release the locking in the downward direction, and the magnetic chuck 307 is lowered toward the electrostatic chuck 308 holding the glass substrate G, and the attraction magnets 401 of the magnetic chuck 307 and the mask M are magnetically attracted and held through the electrostatic chuck 308 and the glass substrate G. Thus, the mask M in the aligned state is tightly adhered to the film formation surface of the glass substrate G and is held. Furthermore, the movement of the magnetic chuck 307 downward is achieved by the driving force from the outside of the transport carriage 302. The amount of lowering of the magnetic chuck 307 at this time is, for example, 30 mm.

[0122] Next, in S13, as in Figure 11 (D), the transport carriage 302 is carried out toward the acceleration chamber 104 from the alignment chamber 103 toward the transport direction A.

[0123] By the above procedure, the aligned mask M is held by the magnetic chuck 307 to the film deposition surface of the glass substrate G held by the electrostatic chuck 308, and then the transport carriage 302 is carried out in a state where the mask frame MF is clamped by the mask chuck 311.

[0124] <Deposition Process>

[0125] Returning to Figure 1 , the description will be continued. The transport carriage which has completed the alignment action and is discharged from the alignment chamber 103 is accelerated in the acceleration chamber 104 as described above, and is carried into the deposition chamber 105. By accelerating the transport carriage before carrying it into the deposition chamber 105, the delay of the time required for the high-precision alignment processing in the alignment chamber 103 can be compensated for, and the reduction of the production cycle time can be suppressed.

[0126] In the deposition chamber, the organic EL luminescent material is vacuum-deposited while the transport carriage is moved in the arrow B direction at a predetermined deposition speed in a state of magnetic levitation. Thus, the deposition of the desired deposition pattern based on the mask M is performed with respect to the film deposition surface of the glass substrate G. As such, when the transport carriage is carried from the alignment chamber into the acceleration chamber and the deposition chamber, or when it is moved within the deposition chamber, by using the magnetic levitation transport mode, the generation of dust and the generation of powdery bodies due to friction can be prevented, and thus high-quality deposition can be performed.

[0127] <Separation-Carriage-Out Process>

[0128] The transport carriage which has completed the deposition processing and is discharged from the deposition chamber 105 is decelerated in the deceleration chamber 106, is transported to the mask separation chamber 107 which is in the mask separation position P3, and is stopped at a predetermined position. At this time, the locked state of the mask M based on the mask chuck 311 is released, and the mask M is separated from the glass substrate G.

[0129] The separated mask M is lowered by the same mechanism as the mask lifting device described above. The mask handover mechanism 100c receives and holds the lowered mask M by the holding frame, and is transported to the retreat position between the deposition processing process transport path 100a and the return transport path 100b. Then, when the empty transport carriage 302 after discharging the substrate moves to the mask receiving position P6 on the return transport path 100b, the mask M is moved to the position below the transport carriage 302. Further, the mask M is raised to the lower surface of the transport carriage 302 by the same mechanism as the mask lifting device, and is held by the magnetic chuck 307. As such, the transport carriage 302 which holds the mask M is returned to the supply side and is transported.

[0130] On the other hand, the transport pallet 302 after the mask M is separated in the mask separation chamber 107 is moved to the reverse chamber 108 while holding the glass substrate G with the stopper of the mask chuck 311. In the reverse chamber 108, the same rotation support mechanism as that of the supply-side reverse chamber 102 rotates the transport pallet 302 by 180 degrees in the advancing direction for each transport assembly 301. Thus, the glass substrate G becomes upside down.

[0131] After being reversed in the reverse chamber 108, the transport mode of the transport pallet 302 is switched again from the magnetic levitation transport mode to the roller transport mode. Then, the transport pallet 302 is transported to the glass substrate discharge chamber 109 at the substrate discharge position P4 by the roller transport. In the substrate discharge position P4, the mask chuck of the glass substrate G is released, and the glass substrate G is transported to the next process by a discharge mechanism not shown.

[0132] The transport pallet 302 in the glass substrate discharge chamber 109 after the glass substrate G is discharged to become empty is rotated by 90 degrees in the counterclockwise direction when viewed in the drawing together with the transport assembly 301. Thus, the glass substrate discharge chamber 109 is provided with a direction conversion mechanism that rotates the transport assembly 301 in the planar direction. Then, the transport pallet 302 is handed over from the transport assembly 301 to the pallet displacement device 100d and transported to the pallet handover position P5 that is the start point of the return transport path 100b. On the other hand, the transport assembly 301 after the transport pallet 302 is handed over to the pallet displacement device 100d is rotated by 90 degrees in the clockwise direction and returned to the original direction. Thus, the transport assembly 301 is reset to a state in which it can accept the next transport pallet 302 carried out from the reverse chamber 108.

[0133] The pallet displacement device 100d has the same transport mechanism as the transport assembly 301. The pallet displacement device 100d receives the transport pallet 302 that is emptied by discharging the glass substrate G from the transport assembly 301 that is rotated by 90 degrees in the glass substrate discharge chamber 109 and hands it over to the direction conversion mechanism (direction conversion transport assembly) 110 disposed at the start point (pallet handover position P5) of the return transport path 100b. The direction conversion mechanism 110 rotates the transport pallet 302 by 90 degrees in the counterclockwise direction when viewed from above and transports it to the transport assembly 301 that constitutes the return transport path 100b. After the transport is completed, the direction conversion mechanism 110 is rotated by 90 degrees in the clockwise direction and reset to the original position, becoming a state in which it can receive the next transport pallet 302 from the pallet displacement device 100d.

[0134] <Return Process>

[0135] The transport carriage 302 moves on the return transport path 100b in the roll transport mode. In the reverse chamber 111, the rotation support mechanism rotates the transport carriage 302 by 180 degrees in the advancing direction for each transport assembly 301. Thus, the transport carriage 302 is carried into the mask receiving position P6 in a state where the mask mounting surface of the electrostatic chuck 308 becomes the lower surface side. Next, the transport carriage 302 receives the mask M from the mask handover mechanism 100c and adsorbs it using the magnetic adsorption chuck 307, and holds it using the mask chuck 311. Next, the transport carriage 302 continues to move in the arrow C direction in the roll transport mode while holding the mask M using the mask chuck 311.

[0136] The transport carriage 302 stops after moving to the mask separation position P7 of the mask separation chamber 112, and separates the mask M by releasing the mask chuck 311. The separated mask M is handed over to the mask handover mechanism 100e. The mask handover mechanism 100e hands over the mask M to the alignment chamber 103 after roughly aligning it in the pre-alignment chamber 100g between the evaporation treatment process transport path 100a and the return transport path 100b.

[0137] On the other hand, the transport carriage 302 after separating the mask M at the mask separation position P7 is rotated by 180 degrees in the advancing direction in the reverse chamber 113. Thus, the glass substrate holding surface of the electrostatic chuck 308 becomes a state facing the upper surface side. Then, the transport carriage 302 is rotated by 90 degrees in the clockwise direction using the direction conversion mechanism 114 at the carriage reset position P8 which is the end point of the return transport path 100b. Next, it is handed over to the carriage displacement device 100f, and is transported to the substrate carrying-in chamber 101 which is the starting point of the evaporation treatment process transport path 100a, i.e., the glass substrate carrying-in position PI. The direction conversion mechanism 114 is rotated by 90 degrees in the counterclockwise direction after handing over the transport carriage 302 to return to the original state. On the other hand, the transport carriage 302 carried into the substrate carrying-in chamber 101 is further rotated by 90 degrees in the counterclockwise direction, and is reset to the initial position where it can hold the next glass substrate G carried in from the outside.

[0138] By performing the above processing, it is possible to perform a series of processes of evaporating an organic EL light emitting material on the glass substrates G carried in sequentially without stopping.

[0139] In addition, since the transport carriage 302 is transported in a magnetic levitation manner, dust and powdery substances caused by friction can be suppressed, and thus, it is effective particularly in the interior of the evaporation chamber, the carrying-in and carrying-out of the evaporation chamber, and the like. Moreover, according to the illustrated example, the glass substrate G is transported in only one direction from the time when the glass substrate G is carried into the production line 100 until the time when it is discharged by alignment and evaporation, and although it is necessary to reverse up and down in the traveling direction, it is not necessary to perform rotation in the planar direction by a robot or the like. That is, the glass substrate G is transported on a linear transport path. Therefore, since it is not necessary to perform rotation of the glass substrate G in the planar direction by a robot or the like, the possibility that dust and powdery substances adhere to the glass substrate G can be further reduced.

[0140] Moreover, in the illustrated example, the glass substrate G is carried into the production line in a state in which the film formation surface thereof faces upward. Therefore, for example, if the glass substrate G is carried in such a manner that the surface on which no film is formed is placed on the support mechanism, it is also effective in protecting the film formation surface of the glass substrate G when the glass substrate G is mounted on the transport carriage 302.

[0141] Here, in the evaporation chamber, since film formation processing is performed by gasification or sublimation of an evaporation material by PVD or CVD in a vacuum, it is necessary to arrange the evaporation material below. Therefore, at the time of evaporation, it is necessary to control the film formation surface of the glass substrate G to be in a posture facing downward. According to the structure of the present embodiment, the mask M is raised from the lower side toward the film formation surface of the glass substrate G held to the transport carriage 302, and is mounted to the glass substrate G via an alignment process. Therefore, at the time when the mask M is mounted, a posture in which the above-described evaporation material can be evaporated is obtained.

[0142] An electrostatic chuck 308 is used in the holding of the glass substrate G to the transport carriage 302, and a magnetic adsorption chuck 307 and a mechanical mask chuck 311 are used in the holding of the mask M. The electrostatic chuck 308 and the magnetic adsorption chuck 307 are assembled into a chuck frame 309, and the magnetic adsorption chuck 307 can switch between a clamped state and an unclamped state by a lifting action (an approach action or a retreat action of the adsorption magnet 401 with respect to the mask M) in the chuck frame 309. First, the mask M is elastically held to the transport carriage 302 with the mechanical mask chuck 311 with the glass substrate G interposed therebetween. Thereafter, the clamping of the mask M is completed by lowering the magnetic adsorption chuck 307. According to the structure of the present embodiment, the three kinds of chucks can be assembled compactly to the transport carriage 302.

[0143] The electrostatic chuck control section that controls the electrostatic chuck of this embodiment is housed in the control box 312 together with a power supply for charging and a wireless communication section that communicates instructions from the control system, and is assembled to the transport carriage. Therefore, during manufacture, it is not necessary to connect a power supply cable, a communication cable, or the like from the outside to the transport carriage 302.

[0144] In the above embodiment, the driving magnets 305a, 305b are provided on the upper surface of the transport carriage 302, and are attracted from above by the driving coils 306a, 306b that are arranged on the transport assembly 301 in opposition to the driving magnets 305a, 305b. However, the arrangement of the magnet units and the coil units is not limited to this, and it is also possible to arrange driving magnets on the side surface of the transport carriage 302, to arrange a plurality of coils on the transport assembly 301 in opposition to the driving magnets, and to hold from the side surface of the transport carriage 302 by magnetic levitation.

[0145] According to this embodiment, in a state in which the glass substrate G and the mask M are held by the transport carriage 302, alignment is performed by magnetic force in a state of magnetic levitation in the alignment chamber before evaporation is performed in the evaporation chamber. By this, high-precision positioning can be performed. In addition, since control is performed by the current or voltage to the coils of the transport assembly that is the transport member, it is not necessary to provide another member for alignment, and the device can be implemented simply and at low cost.

[0146] <Features and advantages of this embodiment>

[0147] Referring to Figures 5-7 , Figure 12 , the magnetic attraction mechanism of this embodiment will be described. Figure 5 is an exploded perspective view showing the structure of the magnetic attraction mechanism of this embodiment mounted to the magnetic attraction chuck 307. Figure 6 is a schematic diagram showing the structure of the magnetic resistance adjustment section 402. Figure 7 is a schematic diagram showing changes in the magnetic circuit based on the magnetic resistance adjustment section 402. Figure 12 is a bottom view (schematic view from the mask M side) of the magnetic attraction chuck 307, and is a schematic view showing an example of the arrangement structure of each of the attraction magnets 401 in the yoke plate 307x3 and the arrangement structure of the magnetic resistance adjustment section 402.

[0148] (Detailed structure of the magnetic attraction chuck and magnetic resistance adjustment method)

[0149] Referring to Figure 5 , Figure 6 , Figure 7 , the magnetic attraction chuck 307 will be described in detail.

[0150] As Figure 5As shown, the chuck body 307x of the magnetic attraction chuck 307 includes a rectangular frame 307x1, a grid-shaped support frame 307x2 having a pattern corresponding to the shielding pattern formed on the mask M, and a magnetic attraction mechanism attached to the support frame 307x2. The magnetic attraction mechanism comprises a yoke plate 307x3, which serves as a back yoke having a magnetic resistance adjustment portion 402, and an attraction magnet 401, which serves as a permanent magnet attached to the yoke plate 307x3. The attraction magnet 401 is attached to the lower surface, or main surface 400, of the yoke plate 307x3. The yoke plate 307x3 is attached to the lower surface of the support frame 307x2.

[0151] like Figure 6 As shown, a plurality of attraction magnets 401 are mounted on the main surface 400 of the yoke plate 307x3, and attraction magnet N poles 401x1 and attraction magnet S poles 401x2 are alternately arranged linearly at predetermined intervals.

[0152] Each attraction magnet 401 is attached to the main surface 400 of the yoke plate 307x3 so that its magnetic poles are arranged in the direction of attraction of the mask M. Specifically, each attraction magnet 401 is attached to the main surface 400 of the yoke plate 307x3 so that the magnetization direction (the direction of the magnetic pole arrangement) of the attraction magnet 401 is aligned in the direction in which the mask M, which is made of a magnetic metal material such as stainless steel, should be attracted to the glass substrate G. Specifically, in the attraction magnet N pole 401x1, the N pole is located on the side opposite the mask M, and the S pole is located on the side opposite the main surface 400 of the yoke plate 307x3. The end surface on the main surface 400 side in the magnetization direction, that is, the magnetized surface 401e2 on the S pole side, is attached so as to contact the main surface 400. On the other hand, in the adsorption magnet S pole 401x2, the S pole is located on the side opposite to the mask M, and the N pole is located on the side opposite to the main surface 400 of the yoke plate 307x3, and the end face on the main surface 400 side in the magnetization direction, that is, the magnetized surface 401e1 on the N pole side is installed to be in contact with the main surface 400.

[0153] In addition, Figure 6 In the figure, the glass substrate G and the electrostatic chuck 308 disposed between the mask M and the magnetic attraction chuck 307 are omitted. That is, the magnetic attraction chuck 307 (each attraction magnet 401) is configured to be disposed on the side opposite to the mask M with respect to the glass substrate G as the film formation object.

[0154] like Figure 6 As shown, the magnetic resistance adjusting unit 402 includes a screw hole 402x1 as a through hole penetrating the yoke plate 307x3, a bolt 402x2 as a filling member insertable into the screw hole 402x1, and a nut 402x3 for limiting the insertion amount of the bolt 402x2.

[0155] A threaded hole 402xl is formed in the yoke plate 307x3 at a position where the adsorption magnet 401 is arranged. The threaded hole 402xl penetrates (penetrates in a manner that opens at the main surface 400 and the surface on the opposite side thereof, respectively) between the main surface 400 of the yoke plate 307x3 and the surface on the opposite side thereof on the inner side of the adsorption magnet 401. The opening on the main surface 400 side of the threaded hole 402xl is configured to be plugged (not open) by the adsorption magnet 401. That is, the diameter of the threaded hole 402xl is set so that the opening area of the threaded hole 402xl is smaller than the magnetized surface on the side of the main surface 400 of the yoke plate 307x3 among the magnetized surfaces of the adsorption magnet 401.

[0156] The bolt 402x2 is composed of a ferromagnetic material and is configured to be screwed from the side of the yoke plate 307x3 opposite the main surface 400 to the threaded hole 402xl. Furthermore, as the ferromagnetic material, for example, a ferromagnetic material composed of a material that generates a magnetic force such as a permanent magnet, a material that can be adsorbed by a magnetic force such as iron, and the like can be cited. The ferromagnetic material for the bolt 402x2 can be the same material as the yoke plate 307x3 or a different material.

[0157] The nut 402x3 is formed of a material that is not a ferromagnetic material and is used when fixing the amount of insertion of the bolt 402x2 with respect to the threaded hole 402xl at an arbitrary position.

[0158] The reluctance adjustment portion 402 is capable of controlling the suction force to the mask M generated by the magnetic force of the suction magnet 401 by adjusting the amount of insertion of the bolt 402x2 into the threaded hole 402x1 or selecting the insertion and extraction of the bolt 402x2 into the threaded hole 402x1. Specifically, a space (gap) g is formed between a portion of the magnetized surface of the suction magnet 401 (a region opposite to the opening of the threaded hole 402x1) that is joined to the main surface 400 of the yoke plate 307x3 and the threaded hole 402x1 and the bolt 402x2. A portion of the magnetic force in the magnetic circuit formed by the suction magnet 401 and the yoke plate 307x3 forms a magnetic circuit that reaches the yoke plate 307x3 (the peripheral surface of the threaded hole 402x1), the bolt 402x2 (the front end surface) from the end surface of the suction magnet 401 through the space g. The wider the space g becomes, that is, the longer the magnetic circuit through the space g becomes, the more the suction force to the mask M generated by the magnetic force of the suction magnet 401 decreases, and the narrower the space g becomes, that is, the shorter the magnetic circuit through the space g becomes, the more the suction force increases. Therefore, by not inserting the bolt 402x2 into the threaded hole 402x1, that is, by forming a space that opens to the inside of the suction magnet 401 (making the amplitude of the space g infinite), the suction force becomes the minimum. In addition, by inserting the bolt 402x2 into the inside of the threaded hole 402x1, that is, by inserting the bolt 402x2 into the threaded hole 402x1 until the front end surface of the bolt 402x2 abuts against the joined end surface of the suction magnet 401 (making the space g disappear), the suction force becomes the maximum.

[0159] Therefore, in summary, according to the amount of insertion of the bolt 402x2 into the threaded hole 402x1 or whether the bolt 402x2 is inserted into the threaded hole 402x1, the reluctance adjustment portion 402 is capable of taking the following three modes.

[0160] The first mode is to insert the bolt 402x2 into the inside of the threaded hole 402x1 without forming the space g between the suction magnet 401 and the yoke plate 307x3 (first reluctance adjustment portion 402A).

[0161] The second mode is to not insert the bolt 402x2 into the threaded hole 402x1 to form a space that opens a portion of the magnetized surface to the inside of the suction magnet 401 (second reluctance adjustment portion 402B).

[0162] The third mode is to not insert the bolt 402x2 into the inside of the threaded hole 402x1 to form the space g between the suction magnet 401, the threaded hole 402x1, and the bolt 402x2 (third reluctance adjustment portions 402C1, 402C2).

[0163] In the third reluctance adjustment section 402C1, 402C2, which is a structure in which the front end surface of the bolt 402x2 is recessed with respect to the main surface 400 of the yoke plate 307x3, a contact section (third contact section) having a recessed shape that is recessed with respect to the joint surface of the adsorption magnet 401 is formed in the back yoke structure that forms a magnetic circuit. The depth of the recessed portion is variable by adjusting the amount of insertion of the bolt 402x2 with respect to the threaded hole 402x1, and thus, a space in which the magnitude of the adsorbing force to the mask M that is generated by the magnetic force of the adsorption magnet 401 is variable is formed.

[0164] The first reluctance adjustment section 402A forms a contact section (first contact section) in which the recessed portion described above is not provided in the back yoke structure.

[0165] The second reluctance adjustment section 402B forms a contact section (second contact section) in which a through hole is formed instead of the recessed portion described above in the back yoke structure, the through hole passing through in a manner such that a portion of the end surface of the adsorption magnet 401 is open to the inside of the contact section.

[0166] Further, the number of threaded holes 402x1 with respect to one adsorption magnet 401 is not limited to one, and can be two or more. In addition, the number of bolts 402x2 that are inserted into the threaded holes 402x1 with respect to one adsorption magnet 401 can also be appropriately selected.

[0167] Furthermore, with respect to the nut 402x3, a nut having a different height can be separately used according to the amount of insertion of the bolt 402x2 with respect to the threaded hole 402x1, or the nut can not be used according to the amount of insertion of the bolt 402x2.

[0168] In addition, the magnitude of the gap g can also be adjusted by separately using bolts having different lengths.

[0169] Reference Figure 7 (A), Figure 7 (B), the adjustment of the magnetic reluctance of the magnetic adsorption mechanism is described. Figure 7 (A) is a schematic cross-sectional view that shows a case in which the adjustment of the magnetic force in the magnetic reluctance adjustment section is replaced with a simple model. Figure 7 (B) is a diagram that shows Figure 7 (A) equivalent circuit.

[0170] In Figure 7In (A), the adsorption magnet 401 magnetized in the up-down direction is attached to the yoke portion 410. In the yoke portion 410, a threaded hole 402xl is formed at a position corresponding to the adsorption magnet 401. A screw 402x2 made of a ferromagnetic substance is inserted into the threaded hole 402xl in a manner in which the amount of insertion is variable. A space 411 is formed between the face (end face magnetized by the magnetic pole of the other side) on the side opposite to the mounting face (end face magnetized by the magnetic pole of one side) of the adsorption magnet 401 and the yoke portion 410. By the magnetic force generated by the adsorption magnet 401, in the yoke portion 410, a magnetic circuit capable of generating an adsorbing force acting in a manner toward the adsorption magnet 401 side is formed in the region on the side opposite across the adsorption magnet 401 and the space 411.

[0171] Here, the relationship between the magnetic flux φ, the magnetic motive force F, and the magnetic resistance R in the magnetic circuit is described. Between the magnetic flux φ, the magnetic motive force F, and the magnetic resistance R, the following equation (1) holds.

[0172] φ = F / R... (1)

[0173] Here, due to the dimensional accuracy of the adsorption magnet 401, the mounting accuracy with respect to the yoke plate 307x3, and the like, the magnetic motive force F is a predetermined value, that is, the magnetic motive force F becomes an inherent value (a value having individual differences) in each adsorption magnet 401.

[0174] As Figure 7 shown in (A), the magnetic force passing through the face at which the adsorption magnet 401 and the yoke portion 410 are in contact is formed in the circuit passing through the yoke portion 410 and the space 411 (the circuit shown by the solid arrow in (A)). Figure 7 If represented by the equivalent circuit of (B), the magnetic resistance passing through the yoke portion 410 is Rl, and the magnetic resistance of the space 411 is RAir. Figure 7

[0175] On the other hand, the magnetic circuit passing through the face at which the adsorption magnet 401 and the threaded hole 402xl are in contact is formed in the circuit passing through the yoke portion 410 and the space 411 via the space g in the threaded hole 402xl and the screw 402x2 made of a ferromagnetic substance (the circuit shown by the broken arrow in (A)). Figure 7 If represented by the equivalent circuit of (B), the magnetic resistance of the portion composed of the threaded hole 402xl and the screw 402x2 is VR, the magnetic resistance passing through the yoke portion 410 is R2, and the magnetic resistance of the space 411 is RAir. Therefore, the total magnetic resistance R0 of the periphery of the magnetic resistance adjustment portion 402 becomes the following equation (2). Figure 12 1 / R0 = 1 / R1 + 1 / (VR+R2)... (2)

[0176]

[0177] ​​In the portion composed of the threaded hole 402xl and the bolt 402x2, the magnetic resistance of the space g in which the bolt 402x2 is not inserted in the threaded hole 402xl is large, and the magnetic resistance of the bolt 402x2 composed of the ferromagnetic substance is small. Therefore, since VR becomes small when the amount of insertion of the bolt 402x2 with respect to the threaded hole 402xl is increased (the space g is made narrow), R0 also becomes small. On the other hand, since VR becomes large when the amount of insertion of the bolt 402x2 is decreased or removed (the space g is made wide), R0 also becomes large. Therefore, according to the equations (1), (2), the magnetic flux φ becomes small when VR is increased, and the magnetic flux φ becomes large when VR is decreased.

[0178] As described above, in the present embodiment, the threaded hole 402xl and the bolt 402x2 composed of the ferromagnetic substance are provided at positions corresponding to each of the adsorption magnets 401 arranged on the yoke plate 307x3. Also, by adjusting the amount of insertion of each of the bolts 402x2 with respect to the threaded hole 402xl or removing it, it is possible to individually adjust the adsorption force of the adsorption object, that is, the mask M, with respect to each of the adsorption magnets 401. Thus, it is possible to absorb the deviation of the adsorption force caused by individual differences such as differences in assembly accuracy, dimensional accuracy, and the like of each of the adsorption magnets 401, and it is possible to seek uniformity of the adsorption force of each of the adsorption magnets 401 with respect to the mask M. In addition, by individually adjusting the adsorption force of each of the adsorption magnets 401 depending on the adsorption position in the mask M, it is possible to form a balanced adsorption force distribution for adsorbing the mask M to the glass substrate G without a gap. That is, according to the present embodiment, using a simple and space-saving structure based on adjustment of the insertion and amount of insertion of the bolt 402x2, it is possible to adjust the adsorption force distribution of the adsorption mask M with high accuracy and easily. In addition, by changing the material of each of the bolts 402x2 to a material having a different magnetic permeability, it is also possible to adjust the adsorption force distribution of the mask M adsorbed to the surface of the glass substrate G with high accuracy and easily.

[0179] Here, one example of the configuration structure of the adsorption magnet 401 and the magnetic resistance adjustment portion 402 will be described with reference to Figure 12 . It is most preferable to provide the above-described magnetic resistance adjustment portion 402 with respect to all of the adsorption magnets 401 mounted to the yoke plate 307x3, but for example, it can be provided only at a minimum necessary position in consideration of cost.

[0180] As Figure 13As shown, since the central portion of the beam 307x3-1 in the yoke plate 307x3 is a portion in which the mask M is bent greatly, the magnetic resistance adjustment portion 402 can be provided to the suction magnet S pole 401x2 disposed at the corresponding position (magnetic resistance adjustment portion 402-1). In addition, since the intersection portion 307x3-2 in which the beams intersect in the yoke plate 307x3 is a portion in which the magnetic force is likely to be disturbed, the magnetic resistance adjustment portion 402 can be provided to the suction magnet N pole 401x1 disposed at the portion (magnetic resistance adjustment portion 402-2).

[0181] Further, since the outer peripheral portion of the yoke plate 307x3 is a portion in which the mask M is bent less (the mask M moves relatively less), the necessity of providing the magnetic resistance adjustment portion 402 is low.

[0182] [Embodiment 2]

[0183] Referring to Figure 14 , Figure 13 , Embodiment 2 of the present application will be described. Figure 14 is a schematic view showing the structure of the magnetic attraction mechanism installed in the magnetic attraction chuck 307. Figure 13 is a schematic view showing the change in the magnetic circuit based on the magnetic resistance adjustment portion 502.

[0184] Further, in Embodiment 2, the same reference numerals are assigned to the structures common to Embodiment 1, and the description thereof will be omitted. In Embodiment 2, matters not particularly described herein are the same as in Embodiment 1.

[0185] (Detailed structure of the magnetic attraction chuck and magnetic resistance adjustment method)

[0186] The magnetic resistance adjustment portion 502 in Embodiment 2 is structured such that the magnetic resistance of the space g inside the through-hole 502x1 is changed by the filling member 502x2 composed of a ferromagnetic substance provided to the yoke plate 307x3, thereby adjusting the distribution of the attraction force for the mask M. The through-hole 502x1 and the filling member 502x2 are not structured to be inserted and pulled out by screwing as in the threaded hole 402x1 and the bolt 402x2 of Embodiment 1, but are structured to be inserted and pulled out simply. The fitting shape is not particularly limited, and the filling member 502x2 can be composed of any shape such as a triangular prism, a quadrangular prism, a cylindrical shape, and the like.

[0187] As shown in Figure 14 , the magnetic resistance adjustment portion 502 is structured to have the through-hole 502x1 which penetrates the main surface 400 formed at the position in which the suction magnet 401 is arranged in the yoke plate 307x3 and the surface opposite to the main surface 400, and the filling member 502x2 which can be inserted into the through-hole 502x1 and is composed of a ferromagnetic substance having a fitting shape.

[0188] Examples of ferromagnetic materials used in filling member 502x2 include materials that generate magnetic force, such as permanent magnets, and materials that can be attracted by magnetic force, such as iron. Furthermore, the number of through-holes 502x1 corresponding to a single attracting magnet is not limited to one; two or more may be provided. Furthermore, filling member 502x2 corresponding to a single attracting magnet can be inserted as needed.

[0189] Reference Figure 14 (A) and (B) illustrate the magnetic resistance adjustment of the magnetic attraction mechanism. Figure 14 (A) is a diagram showing a case where the adjustment of the magnetic force in the magnetic resistance adjustment unit 502 is replaced with a simple model. Figure 14 (B) is shown Figure 14 (A) Diagram of the equivalent circuit.

[0190] exist Figure 14 In (A), an adsorption magnet 401 magnetized in the up-down direction is mounted on the yoke 410. A through hole 502x1 is formed in the yoke 410 at a position corresponding to the adsorption magnet 401. A filling member 502x2 made of a ferromagnetic body having a shape that fits in the through hole is inserted into the through hole 502x1 with a variable insertion amount. A space 411 is formed between the surface of the adsorption magnet 401 on the side opposite to the mounting surface and the yoke 410. The magnetic force generated by the adsorption magnet 401 is used to generate an adsorption force that adsorbs the yoke 410 on the opposite side across the space 411.

[0191] like Figure 14 As shown in (A), the magnetic force passing through the surface where the adsorption magnet 401 and the yoke 410 meet forms a circuit passing through the yoke 410 and the space 411 (in Figure 14 (A) The loop is shown by the solid arrow. If Figure 14 As shown in the equivalent circuit of (B), the magnetic resistance passing through the yoke 410 is R1, and the magnetic resistance of the space 411 is RAir.

[0192] On the other hand, the magnetic circuit passing through the surface where the attraction magnet 401 contacts the through hole 502x1 forms a circuit passing through the yoke 410 and the space 411 via the filling member 502x2 made of a ferromagnetic body in the through hole 502x1 (in Figure 14 (A) is the loop indicated by the dotted arrow). If Figure 15 (B) represents the equivalent circuit, where the magnetic resistance of the portion formed by through-hole 502x1 and filling member 502x2 is VR, the magnetic resistance passing through yoke 410 is R2, and the magnetic resistance of space 411 is RAir. Therefore, the total magnetic resistance R0 around the magnetic resistance adjusting portion 502 is expressed as the following equation, which is the same as equation (2) above.

[0193] 1 / R0=1 / R1+1 / (VR+R2)

[0194] In the portion formed by through-hole 502x1 and filler member 502x2, inserting filler member 502x2 reduces VR, thus reducing R0. Removing filler member 502x2 increases VR, thus increasing R0. Therefore, according to equations (1) and (2), increasing VR reduces magnetic flux φ, while decreasing VR increases magnetic flux φ.

[0195] In the structure of this embodiment, the through-holes 502x1 and the ferromagnetic filling members 502x2 are also provided at positions corresponding to the attracting magnets 401 arranged on the yoke plate 307x3. Therefore, the magnetic resistance can be adjusted by inserting or removing the filling members 502x2. This allows for highly precise and easy adjustment of the attracting force distribution of the attracting mask M. Furthermore, by changing the material of the filling members 502x2 to materials with different magnetic permeabilities, the attracting force distribution of the attracting mask M can also be adjusted with high precision and ease.

[0196] In addition, in this embodiment, similarly to the first embodiment, the insertion amount of the filling member 502x2 into the through-hole 502x1 can be adjusted, and the space g similar to the first embodiment can be formed with a variable width.

[0197] [Example 3]

[0198] Reference Figure 16 、 Figure 15 , Example 3 of the present invention is described. Figure 16 3 is a diagram showing the detailed structure of the magnetic attraction mechanism attached to the magnetic attraction chuck 307 . Figure 15 Schematic diagram showing changes in the magnetic circuit caused by the magnetic resistance adjustment unit 602 .

[0199] In addition, in Example 3, the same reference numerals are attached to the same configurations as in Example 1, and repeated description thereof is omitted. In Example 3, matters not particularly described here are the same as in Example 1.

[0200] (Detailed structure of magnetic attraction chuck and magnetic resistance adjustment method)

[0201] The magnetic resistance adjustment unit 602 in Example 3 is configured to adjust the distribution of the attraction force of the attraction mask M by changing the magnetic resistance of the space within the groove 602x4 using the through hole 602x1, the groove 602x4, and the filling plate 602x2 made of a ferromagnetic material provided in the yoke plate 307x3.

[0202] like Figure 16As shown, the magnetic resistance adjustment section 602 has a structure provided with a through-hole 602xl, a groove section 602x4, and a filling plate 602x2, the through-hole 602xl is formed through a main surface 400 formed at a position in the yoke plate 307x3 where the adsorption magnet 401 is arranged and a surface opposite the main surface 400, the groove section 602x4 is obtained by excavating the periphery of the through-hole 602xl, and the filling plate 602x2 has a shape that coincides with the groove section 602x4 and is composed of a ferromagnetic substance. That is, the through-hole 602xl is configured to be open at the bottom of the groove section 602x4 on the side opposite the main surface 400.

[0203] Further, as the ferromagnetic substance for the filling plate 602x2, for example, a material that generates a magnetic force such as a permanent magnet, a material that can be adsorbed by a magnetic force such as iron, or the like can be cited. In addition, the number of the through-hole 602xl and the groove section 602x4 with respect to one adsorption magnet is not limited to one, and can be two or more. In addition, the groove section 602x4 can be excavated across a plurality of through-holes 602xl. In addition, the filling plate 602x2 with respect to one adsorption magnet can be appropriately installed.

[0204] Reference Figure 16 (A), (B), the magnetic resistance adjustment of the magnetic adsorption mechanism is described. Figure 16 (A) is a diagram showing a case where the adjustment of the magnetic force in the magnetic resistance adjustment section 602 is replaced by a simple model. Figure 16 (B) is a diagram showing Figure 16 (A) is a diagram showing a case where the adjustment of the magnetic force in the magnetic resistance adjustment section 602 is replaced by a simple model.

[0205] In Figure 16 (A), the adsorption magnet 401 magnetized in the up-down direction is installed in the yoke section 410. In the yoke section 410, a through-hole 602xl is formed at a position corresponding to the adsorption magnet 401, and a groove section 602x4 obtained by excavating the periphery of the through-hole 602xl is formed around the through-hole 602xl. A filling plate 602x2 composed of a ferromagnetic substance that can be installed in the shape of the groove section 602x4 is installed in the groove section 602x4. A space 411 is formed between the surface on the side opposite the installation surface of the adsorption magnet 401 and the yoke section 410. By the magnetic force generated by the adsorption magnet 401, an adsorption force that adsorbs the yoke section 410 on the opposite side through the space 411 is generated.

[0206] As Figure 16 shown in (A), the magnetic force that passes through the surface where the adsorption magnet 401 and the yoke section 410 are in contact is formed in a loop that passes through the yoke section 410 and the space 411 (the loop shown by the solid arrow in (A)). If represented by an equivalent circuit of (B), the magnetic resistance that passes through the yoke section 410 is Rl, and the magnetic resistance of the space 411 is RAir. Figure 16 Figure 16 (B), the magnetic resistance that passes through the yoke section 410 is Rl, and the magnetic resistance of the space 411 is RAir.​

[0207] On the other hand, the magnetic circuit passing through the surface where the adsorption magnet 401 is in contact with the through-hole 602xl is formed in the circuit passing through the yoke portion 410 and the space 411 via the space g in the through-hole 602xl and the filling plate 602x2 composed of a ferromagnetic substance (in the circuit shown by the broken arrow in ​ (A) ). If represented by the equivalent circuit of (B), the magnetic resistance of the portion composed of the through-hole 602xl and the filling plate 602x2 is VR, the magnetic resistance of the circuit passing through the yoke portion 410 is R2, and the magnetic resistance of the space 411 is RAir. Therefore, the total magnetic resistance R0 of the periphery of the magnetic resistance adjustment portion 602 becomes the following equation which is the same as the above equation (2). ​

[0208] 1 / R0 = 1 / R1 + 1 / (VR+R2)

[0209] In the portion composed of the through-hole 602xl and the filling plate 602x2, the magnetic resistance of the space g of the through-hole 602xl is large, and the magnetic resistance of the filling plate 602x2 composed of a ferromagnetic substance is small. Therefore, since VR becomes small when the filling plate 602x2 is attached, R0 also becomes small, and since VR becomes large when the filling plate 602x2 is removed, R0 also becomes large. Therefore, according to equations (1) and (2), the magnetic flux φ becomes small when VR is increased, and the magnetic flux φ becomes large when VR is decreased.

[0210] In the structure of the present embodiment, since the through-hole 602xl and the filling plate 602x2 composed of a ferromagnetic substance are also provided at positions corresponding to each adsorption magnet 401 arranged on the yoke plate 307x3, the magnetic resistance can be adjusted by attaching or removing each filling plate 602x2. Thus, the adsorption force distribution of the adsorption mask M can be adjusted with high precision and easily. Further, by changing the material of each filling plate 602x2 to a material having a different magnetic permeability, the adsorption force distribution of the adsorption mask M can also be adjusted with high precision and easily.

[0211] Further, for example, a downward convex portion which can be inserted and fitted in the through-hole 602xl can be provided on the lower surface of the filling plate 602x2, and the width of the space g in the through-hole 602xl can be adjusted. That is, for example, as the filling plate 602x2, a plurality of filling plates having no convex portion and filling plates having different heights of the convex portion are prepared in advance, and the appropriate one is selected and attached to the groove portion 602x4, and the adsorption force distribution can be further adjusted with high precision.​

Claims

1. A magnetic adsorption mechanism, wherein the magnetic adsorption mechanism uses magnetic force to adsorb a mask to the surface of a film-forming object, wherein the mask is used to form a desired film-forming pattern on the film-forming object, characterized in that: The magnetic adsorption mechanism comprises: a plurality of magnets arranged on a side of the film formation object opposite to the mask; and a back yoke having a plurality of the magnets mounted thereon and forming a magnetic circuit, wherein the magnetic circuit generates an adsorption force that attracts the mask toward the film formation object by utilizing the magnetic force of the magnets; The back yoke has a magnetic resistance adjustment portion at a contact portion that contacts an end face in a magnetization direction of the magnet. The magnetic resistance adjustment portion is capable of adjusting the adsorption force by forming a space with a variable amplitude between the back yoke and at least a portion of the end face, or by opening at least a portion of the end face toward the inside of the contact portion. The magnetic resistance adjustment unit includes: a through hole that passes through between the contact portion in the back yoke and an inner side of the contact portion; and a filling member capable of being inserted into the through hole from the inner side and made of a ferromagnetic body, The adsorption force is adjusted by adjusting the insertion amount of the filling member relative to the through hole, or according to whether the filling member is inserted into the through hole. The through hole is a threaded hole, The filling member is a bolt that can be screwed into the threaded hole.

2. The magnetic adsorption mechanism according to claim 1, characterized in that: The magnetic adsorption mechanism further includes a nut for limiting an insertion amount of the bolt into the threaded hole.

3. A magnetic adsorption mechanism, wherein the magnetic adsorption mechanism uses magnetic force to adsorb a mask to the surface of a film-forming object, wherein the mask is used to form a desired film-forming pattern on the film-forming object, characterized in that: The magnetic adsorption mechanism comprises: a plurality of magnets arranged on a side of the film formation object opposite to the mask; and a back yoke having a plurality of the magnets mounted thereon and forming a magnetic circuit, wherein the magnetic circuit generates an adsorption force that attracts the mask toward the film formation object by utilizing the magnetic force of the magnets; The back yoke has a magnetic resistance adjustment portion at a contact portion that contacts an end face in a magnetization direction of the magnet. The magnetic resistance adjustment portion is capable of adjusting the adsorption force by forming a space with a variable amplitude between the back yoke and at least a portion of the end face, or by opening at least a portion of the end face toward the inside of the contact portion. The magnetic resistance adjustment unit includes: a through hole, the through hole penetrating between the contact portion in the back yoke and an inner side of the contact portion; a groove portion formed on the inner side of the back yoke, and the through hole opening at a bottom of the groove portion; and a filling member that can be fitted into the groove portion so as to block the opening of the through hole and is made of a ferromagnetic body, The adsorption force is adjusted according to whether the filling member is fitted into the groove.

4. A magnetic adsorption mechanism, wherein the magnetic adsorption mechanism uses magnetic force to adsorb a mask to the surface of a film-forming object, wherein the mask is used to form a desired film-forming pattern on the film-forming object, characterized in that: The magnetic adsorption mechanism comprises: a plurality of magnets arranged on a side of the film formation object opposite to the mask; and a back yoke having a plurality of the magnets mounted thereon and forming a magnetic circuit, wherein the magnetic circuit generates an adsorption force that attracts the mask toward the film formation object by utilizing the magnetic force of the magnets; The back yoke includes a contact portion having a recessed portion among a plurality of contact portions with which end faces of the plurality of magnets in the magnetization direction contact, wherein the recessed portion forms a space for adjusting the adsorption force between the recessed portion and at least a portion of the end faces. The plurality of contact portions provided with the recessed portion include contact portions having different depths of the recessed portion.

5. The magnetic adsorption mechanism according to claim 4, characterized in that: The plurality of contact portions include a first contact portion in which the recessed portion is not provided.

6. The magnetic adsorption mechanism according to claim 4 or 5, characterized in that: The plurality of contact portions further includes a second contact portion provided with a through hole that penetrates the back yoke such that at least a portion of the end surface is open to the inside of the contact portion.

7. A vapor deposition device, characterized in that: The evaporation device comprises: A mask for forming a desired film formation pattern on a film formation object; The magnetic adsorption mechanism according to any one of claims 1 to 6; and A vapor deposition chamber is provided for vapor-depositing a vapor deposition material on the film formation object to which the mask is attracted by the magnetic attraction mechanism.

8. An electronic device manufacturing device, characterized in that: An electronic device is manufactured by forming a film on the film formation object using the vapor deposition apparatus according to claim 7 .

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