Device and method for operating a semiconductor component and luminous element

Abstract

The invention relates to a device for operating at least one semiconductor component, the device comprising at least one semiconductor component to be operated and at least one thermoelectric component, wherein the thermoelectric component is capable of temperature control, in particular cooling and / or heating, of the semiconductor component, wherein the device has at least one supply current connection in order to supply the semiconductor component with a supply current. The device is characterized in that it has a control unit and a temperature sensor connected to the control unit, the temperature sensor being capable of detecting the temperature (T) of the semiconductor component, and wherein the control unit is capable of directing a temperature-dependent portion of the supply current fed into the device at the supply current connection through the semiconductor component and into the thermoelectric component. A luminous body, in particular a motor vehicle luminous body, and a method for operating at least one semiconductor component are also proposed.

Description

Technical Field

[0001] The invention relates to a device for operating at least one semiconductor component, comprising at least one semiconductor component to be operated and at least one thermoelectric component, wherein the thermoelectric component is capable of controlling the temperature of the semiconductor component, in particular cooling and / or heating the semiconductor component, wherein the device has at least one supply current connection for supplying the semiconductor component with a supply current. Background Art

[0002] A device of the type described in the preamble of claim 1 is known from the publication DE 43 04 654 A1. A thermoelectric component designed as a Peltier element is integrated into a component substrate, in particular a printed circuit board. The thermoelectric component is used to control the temperature of a component, in particular a semiconductor component, which is also arranged on the component substrate. The thermoelectric component is connected to a DC voltage or DC current source. The current flowing through the thermoelectric component can be controlled and / or regulated as a function of the temperature of the component.

[0003] Despite this active temperature control, in particular cooling, a high thermal load on the semiconductor components, such as semiconductor light sources such as LEDs, can still occur when the semiconductor components are in operation. The high thermal load can in particular shorten the service life of the semiconductor components. Therefore, in order to avoid such a high thermal load, it is partially provided that, for example, when the maximum permissible operating temperature is exceeded, one or more corresponding semiconductor components are limited, thereby temporarily reducing the corresponding power loss and waste heat generation of the one or more semiconductor components. However, such a limitation requires additional circuit technology expenditure. For example, if a supply current is provided to the semiconductor components by an external power supply source for energy supply, a device for detecting one or more temperatures of the corresponding semiconductor components is required in the external power supply source. An additional current regulating element is usually also required, by means of which the generated supply current can be regulated in a temperature-dependent manner, in particular limited. Summary of the invention

[0004] The object of the present invention is therefore to provide a device and a method of the generic type which enable a simple and effective temperature control of at least one semiconductor component of the device in terms of circuit technology. A luminous body with a semiconductor light source is also to be provided which has a correspondingly improved temperature control effect on the semiconductor light source.

[0005] This object is achieved by a device for operating at least one semiconductor component, the device comprising at least one semiconductor component to be operated and at least one thermoelectric component, wherein the thermoelectric component is capable of controlling the temperature of the semiconductor component, in particular cooling and / or heating the semiconductor component, wherein the device has at least one supply current connection for supplying the semiconductor component with a supply current, wherein the device has a control unit and a temperature sensor connected to the control unit, the temperature sensor being capable of detecting the temperature of the semiconductor component, and wherein the control unit is capable of directing a temperature-dependent portion of the supply current fed into the device at the supply current connection through the semiconductor component and into the thermoelectric component.

[0006] The supply current fed in for supplying the semiconductor components can thus be used to supply the semiconductor components and the thermoelectric component. The semiconductor components can thus be supplied with energy by at least a second portion of the fed-in supply current which is reduced by a temperature-dependent portion depending on the temperature of the semiconductor components. The semiconductor components can thus be limited, in particular, in a temperature-dependent manner. This can reduce the generation of waste heat.

[0007] It can be provided that as the temperature of the semiconductor component increases, the temperature-dependent portion of the supply current supplied to the thermoelectric component increases.

[0008] In order to detect the temperature of the semiconductor component, the device has a temperature sensor connected to the control unit. For this purpose, the device can include the temperature sensor as a separate component. It is also conceivable that the temperature sensor is part of another component of the device. In particular, the temperature sensor can be integrated into the semiconductor component, into the thermoelectric component and / or into the control unit. The temperature sensor can be designed as an electronically active component, such as a thermistor, and / or as a mechanically active component, such as a bimetallic strip.

[0009] The control unit can set the temperature-dependent component using the temperature information from the temperature sensor.

[0010] If the fed-in supply current is generated by an external power supply source, the supply current can be generated by the power supply source independently of the temperature of the semiconductor component. Information about the temperature of the semiconductor component does not need to be transmitted to the external power supply source. Current regulators or the like for temperature-dependent regulation of the supply current generated by the external power supply source can be omitted in the external power supply source. The circuit complexity of the overall device including the power supply source and the device can thus be significantly reduced.

[0011] For example, as soon as a temperature threshold value is reached and / or exceeded by the semiconductor component, a temperature-dependent portion of the supplied supply current can also be used in a temperature-dependent manner, completely or partially, for a sole or additional supply of energy, in particular to the thermoelectric component. If, for example, cooling of the semiconductor component is required, the cooling capacity of the thermoelectric component can thereby be increased. Thus, the temperature capacity of the thermoelectric component can generally be increased in parallel with limiting the semiconductor component, and thus the semiconductor component can be temperature-controlled, in particular cooled, in a particularly effective manner.

[0012] The control unit is designed as a controllable, in particular temperature-dependent, current source or comprises a current source. Preferably, the control unit designed as a current source can be connected in series with the thermoelectric component.

[0013] If the thermoelectric component is a Peltier element or comprises a Peltier element, temperature control can be performed without moving mechanical elements. In addition, the thermoelectric component can then be used selectively for cooling or for heating.

[0014] The device can be designed to be particularly compact if it comprises a component substrate, in particular a circuit board, wherein the thermoelectric component is integrated into the component substrate.

[0015] When the thermoelectric component is thermally coupled, preferably directly thermally coupled, to the semiconductor component, a particularly good heat exchange between the thermoelectric component and the semiconductor component can be achieved. For this purpose, the semiconductor component can preferably be arranged directly in and / or on the thermoelectric component.

[0016] The control unit can be supplied with energy via a separate energy supply. Alternatively, the device can be configured to supply energy to the control unit via another portion of the fed-in supply current, so that an additional, separate energy supply for the control unit can be omitted.

[0017] The high temperature loads mentioned at the outset occur in particular during operation of one or more semiconductor light sources. It is therefore particularly advantageous according to the invention that the semiconductor component is a semiconductor light source, in particular an LED, or comprises a semiconductor light source, in particular an LED.

[0018] The invention also relates in particular to a lighting body having a device according to the invention, wherein the semiconductor component is a semiconductor light source, in particular an LED, or comprises a semiconductor light source, in particular an LED.

[0019] In particular, the light can be designed as a motor vehicle light or comprise a motor vehicle light.

[0020] In today's motor vehicle lights, in particular low beams, high beams or daytime running lights, a plurality of semiconductor light sources, in particular high-power LEDs, are used. Due to the high light power generated and the high total power loss or waste heat generation associated therewith, the semiconductor light sources of the motor vehicle lights are subject to particularly high thermal loads. As mentioned at the beginning, high thermal loads shorten the service life. Therefore, according to the present invention, a particularly simple arrangement in terms of circuit technology is provided, in which the relevant semiconductor light sources can be actively cooled, in particular with increased power, and at the same time limited, if necessary. The service life of the semiconductor light sources and the service life of the entire motor vehicle light can be extended.

[0021] The present invention also relates to a method for operating at least one semiconductor component, in particular a method for operating a semiconductor light source, particularly preferably a method for operating at least one LED, wherein the temperature of the semiconductor component to be operated is controlled by a thermoelectric component, in particular the semiconductor component is cooled and / or heated, and wherein a supply current is fed into a device comprising a semiconductor component and a thermoelectric component to supply energy to the semiconductor component, wherein a portion of the supply current fed into the device that is dependent on the temperature of the semiconductor component is conducted through the semiconductor component and fed into the thermoelectric component, so that the semiconductor component is supplied with energy with a second portion of the fed-in supply current that is at least reduced by the temperature-dependent portion of the supply current.

[0022] It is therefore no longer necessary to regulate a supply current, which is generated, for example, by an external power supply source and fed into the device, as a function of the temperature of the semiconductor components. Instead, the semiconductor components can be limited and their temperature controlled independently of the fed-in supply current.

[0023] Preferably, the temperature-dependent portion of the supply current in the feed-in device can be used completely or partially to increase the temperature control capacity, in particular the cooling and / or heating capacity, of the thermoelectric component, so that the semiconductor components can be temperature controlled, in particular cooled, with even greater power.

[0024] The above-described device according to the invention can preferably be used as the device.

[0025] It can be provided that, starting from reaching and / or exceeding a first temperature threshold value, a temperature-dependent portion of the supply current is diverted and fed into the thermoelectric component.

[0026] Further features and advantages of the invention emerge from the following detailed description of an exemplary embodiment of the invention with reference to the drawings, which illustrate essential details of the invention, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The individual features can be realized in variants of the invention either individually or in any desired combination of a plurality of them. Exemplary embodiments of the invention are shown in the schematic drawings and are described in the following description.

[0028] It shows:

[0029] Figure 1 A schematic diagram of a motor vehicle illuminant having a device for operating a semiconductor component is shown;

[0030] Figure 2 Shows Figure 1 A circuit diagram of the device in; and

[0031] Figure 3 A schematic proportion-temperature diagram is shown.

[0032] Reference numerals list

[0033] 10 Luminous body

[0034] 12 Semiconductor light source

[0035] 14 Components

[0036] 16 Structural element base

[0037] 18 Installation

[0038] 20 Control unit

[0039] 22 Temperature sensor

[0040] 24 External power supply

[0041] 26 Supply current connector

[0042] 28 Supply current connector

[0043] 30 Component current supply unit

[0044] I V Supply current

[0045] Temperature

[0046] T0 basic temperature threshold

[0047] T1 First temperature threshold

[0048] T2 Second temperature threshold

[0049] p% Temperature-dependent share

[0050] p1% share

[0051] p2% share

[0052] q% Second share

[0053] r% another share DETAILED DESCRIPTION

[0054] Figure 1 The motor vehicle illuminant 10 is shown in the schematic diagram as seen from the front into the interior of the motor vehicle illuminant 10. The motor vehicle illuminant 10 has a plurality of semiconductor light sources for generating light. Figure 1 One of the semiconductor light sources 12 is shown by way of example in FIG.

[0055] The semiconductor light source 12 is an LED, in particular a high-power LED, and is therefore a semiconductor component.

[0056] The thermoelectric component 14 is thermally coupled to the semiconductor light source 12. In particular, the semiconductor light source 12 is arranged in a recess (in the Figure 1 ), which enables particularly good heat transfer between the two elements 12 and 14.

[0057] The thermoelectric component 14 is designed as a Peltier element. The thermoelectric component is integrated into a component substrate 16 designed as a circuit board.

[0058] The semiconductor light source 12 , the thermoelectric component 14 and the structural element substrate 16 are part of a device 18 .

[0059] according to Figure 2 , the structure and working mode of the device 18 shall be described in detail below. Figure 2 A circuit diagram of the device 18 is shown.

[0060] It can be seen that the thermoelectric component 14 is connected in parallel with the semiconductor light source 12. The thermal coupling between the thermoelectric component 14 and the semiconductor light source 12 is Figure 2 This is symbolically indicated by a double arrow.

[0061] In this exemplary embodiment, the thermoelectric component 14 , which is designed as a Peltier element, serves in particular to cool the semiconductor light source 12 if necessary.

[0062] The control unit 20 is connected in series with the thermoelectric component 14 and the semiconductor light source 12 , which is designed, in particular, as an LED on the anode side. The control unit 20 is also part of the device 18 .

[0063] The control unit 20 is designed as a current source which can be adjusted in a temperature-dependent manner. For this purpose, the control unit is electrically connected to a temperature sensor 22, in particular a thermistor. The temperature sensor 22 is in turn thermally connected to the semiconductor light source 12, which Figure 2 The temperature sensor 22 can thus detect the temperature T of the semiconductor light source 12 and transmit corresponding temperature information to the control unit 20 .

[0064] In order to supply current I V For supplying power to the semiconductor light source 12 , the device 18 has two power supply connections 26 , 28 .

[0065] Supply current I V It can be generated by an external power supply 24 that is not part of the device 18. It is conceivable that the external power supply 24 is based on the vehicle lighting body 10 ( Figure 1 ) The generated or desired photocurrent regulates the supply current I V And in particular, it is switched on and / or off as required. Supply current I V The timing can be such as to dim the semiconductor light source 12 .

[0066] The control unit 20 is able to supply the supply current I V The supply current I fed into the device 18 is guided V A portion p % of the temperature T-dependent energy passes through the semiconductor light source 12 and is fed into the thermoelectric component 14 .

[0067] For this purpose, the control unit 20 can evaluate the temperature information transmitted by the temperature sensor 22 via the temperature T of the semiconductor light source 12, determine the value of the temperature-dependent portion p% based on this temperature information, and determine the value of the temperature-dependent portion p% based on the supply current I V The intensity of the current flowing through the control unit 20 is set and / or regulated by the temperature-dependent respective proportion p % of the control unit 20 .

[0068] Therefore, the supply current I V The semiconductor light source 12 is supplied with energy by a second portion q% which is at least reduced from the temperature-dependent portion p%. In other words, at least depending on the supply current I V The temperature-dependent proportion p% of φ limits the semiconductor light source 12 .

[0069] Supply current I V A temperature-dependent portion p% of the temperature is fed into the thermoelectric component 14 to supply it with energy. This increases the cooling power generated by the thermoelectric component 14 .

[0070] This reduces the power loss or waste heat generated by the semiconductor light sources 12 . At the same time, the semiconductor light sources 12 are cooled in an efficient manner by the thermoelectric components 14 .

[0071] In this embodiment, the current supply unit 30 is connected to the supply current I V A temperature-dependent portion p% of energizes the thermoelectric component 14 .

[0072] Preferably, the component current supply 30 is also designed to be temperature-controlled. The component current supply can be configured to operate the thermoelectric component 14 at a particularly predetermined basic cooling power when a basic temperature threshold T0 is reached and / or exceeded. When the basic temperature threshold T0 is fallen below, the component current supply 30 can be configured to reduce the cooling power of the thermoelectric component 14 or to completely disconnect the thermoelectric component 14.

[0073] In this embodiment, by supplying current I V Another portion r% of the power supply is used to supply the control unit 20, which is branched off from the supply current and fed into the control unit 20. As an alternative or in addition, it is also conceivable to supply the power supply via a separate power supply unit and / or by means of the supply current I V The temperature-dependent portion p% of the flow through the control unit supplies the control unit 20 with the energy required for its operation.

[0074] At this time, according to Figure 3 An exemplary embodiment of the method according to the invention will be explained in detail. Figure 3 For a better understanding, refer to Figure 2 The reference numerals denote elements.

[0075] It can be seen that the supply current I V The temperature-dependent portion p% of is 0% or at least substantially 0%. If the temperature T of the semiconductor light source 12 exceeds the first temperature threshold value T1, the supply current I V The temperature-dependent portion p% of φ is increased to p1%. As a result, the cooling power of the thermoelectric component 14 is increased and the semiconductor light source 12 is at least partially limited starting from reaching and / or exceeding the first temperature threshold value T1.

[0076] If the temperature T of the semiconductor light source 12 continues to increase, in particular until or above the second temperature threshold value T2, the supply current I V The control unit 20 ( Figure 2 ) can be provided to completely or at least substantially completely limit the semiconductor light source 12 , in particular to switch it off.

[0077] As an alternative or in addition, it is conceivable that instead of this, in particular two-stage, portion-temperature curve, another, for example a stepped, continuous, in particular linear portion-temperature curve can also be provided. Advantageously, such a portion-temperature curve is provided in which at least the portion p% increases, preferably continuously, with increasing temperature, so that ultimately with increasing temperature T the cooling power of the thermoelectric component 14 is higher at least above the first temperature threshold T1 than below the first temperature threshold T1.

[0078] According to the invention, the semiconductor light source 12 is therefore operated, wherein the semiconductor light source is temperature-controlled by the thermoelectric component 14. In particular, the semiconductor light source is cooled if necessary, in particular when a temperature threshold value T0 is exceeded. In this case, a supply current I V Feed-in device 18. Depending on the temperature T of the semiconductor 12, in this case the temperature T measured by means of a temperature sensor 22, a temperature-dependent portion p% is deflected past the semiconductor light source 12 and fed into the thermoelectric component 14. For this purpose, the temperature-dependent portion p% is determined by a control unit 20 as a function of the temperature T of the semiconductor light source 12 to be 0% or essentially 0%, p1% or p2%.

[0079] Therefore, only the supply current I V The supply current I V A second portion q% of the temperature-dependent portion p% supplies energy to the semiconductor light source 12 . At the same time, the cooling power of the thermoelectric component 14 can be increased, in particular for additional temperature control or cooling of the semiconductor light source 12 .

[0080] In this exemplary embodiment, the semiconductor components to be temperature-controlled are merely exemplary semiconductor light sources 12 , ie LEDs.

[0081] As an alternative or in addition to the semiconductor light source 12, other and / or further semiconductor components may also be part of the device 18 according to the invention and / or be provided in the method according to the invention. This may be, for example, one or more high-power semiconductors, such as semiconductor diodes, semiconductor switches and / or semiconductor amplifiers, in particular when high heat losses occur and / or are to be expected. The semiconductor components may be part of at least one control device and / or may be controlled and, in particular, supplied with energy, by at least one control device.

Claims

1. A device (18) for operating at least one semiconductor component, comprising: - at least one semiconductor component to be operated, and - at least one thermoelectric component (14), The thermoelectric component (14) is capable of regulating the temperature of the semiconductor component. The device (18) has at least one supply current connection (26, 28) for supplying current (I V ) supplies energy to the semiconductor structure element, The device (18) is characterized in that the device (18) has a control unit (20) and a temperature sensor (22) connected to the control unit (20), the temperature sensor being able to detect the temperature (T) of the semiconductor component, and The control unit (20) is capable of directing a supply current (I 26, 28) fed into the device (18) at the supply current connections (26, 28). V ) which is dependent on the temperature (T) passes through the semiconductor component and is fed into the thermoelectric component (14).

2. The device according to claim 1, characterized in that The thermoelectric component (14) is capable of cooling and / or heating the semiconductor component.

3. The device according to claim 1, characterized in that The control unit (20) is designed as a controllable current source or comprises such a current source.

4. The device according to claim 3, characterized in that The control unit (20) is designed as a current source which can be controlled in a temperature-dependent manner or comprises such a current source.

5. The device according to any one of claims 1 to 4, characterized in that The thermoelectric component (14) is a Peltier element or includes a Peltier element.

6. The device according to any one of claims 1 to 4, characterized in that The device (18) comprises a structural element substrate (16), wherein the thermoelectric component (14) is integrated into the structural element substrate (16).

7. The device according to claim 6, characterized in that The device (18) includes a circuit board.

8. The device according to any one of claims 1 to 4, characterized in that The thermoelectric component (14) is thermally coupled to the semiconductor component.

9. The device according to claim 8, characterized in that The thermoelectric component (14) is directly thermally coupled to the semiconductor component.

10. The device according to any one of claims 1 to 4, characterized in that The device (18) is configured to supply a supply current (I V Another portion (r%) of the energy source supplies energy to the control unit (20).

11. The device according to any one of claims 1 to 4, characterized in that The semiconductor component is a semiconductor light source (12) or comprises a semiconductor light source.

12. The device according to claim 11, characterized in that The semiconductor light source (12) is an LED.

13. A luminous body (10) comprising a device (18) according to any one of claims 1 to 12.

14. The luminous body according to claim 13, characterized in that: The illuminant (10) is designed as a motor vehicle illuminant or comprises a motor vehicle illuminant.

15. Method for operating at least one semiconductor component, wherein: The semiconductor component to be operated is temperature-controlled by means of a thermoelectric component (14), wherein a supply current (I V ) is fed into a device (18) comprising the semiconductor structure and the thermoelectric component (14) to supply energy to the semiconductor structure, It is characterized in that the supply current (I V ) is fed through the semiconductor component and fed into the thermoelectric component (14), thereby feeding in a supply current (I V ) at least reduces the supply current (I V ) supplies energy to the semiconductor component using a second portion (q%) of the temperature-dependent portion (p%).

16. The method according to claim 15, characterized in that The semiconductor component is a semiconductor light source (12).

17. The method according to claim 15, characterized in that The semiconductor component is an LED.

18. The method according to claim 15, characterized in that The semiconductor components to be operated are cooled and / or heated by means of the thermoelectric components (14).

19. The method according to claim 15, characterized in that The supply current (I V ) is used in whole or in part to increase the temperature control capacity of the thermoelectric component (14).

20. The method according to claim 19, characterized in that The temperature control power is a cooling power and / or a heating power.

21. The method according to any one of claims 15 to 20, characterized in that Since the first temperature threshold (T1) is reached and / or exceeded, the supply current (I V ) is deflected and fed into the thermoelectric component (14).

22. Method for operating at least one semiconductor component, wherein: The semiconductor component to be operated is temperature-controlled by means of a thermoelectric component (14), wherein a supply current (I V ) is fed into a device (18) comprising the semiconductor structure and the thermoelectric component (14) to supply energy to the semiconductor structure, It is characterized in that the supply current (I V ) is fed through the semiconductor component and fed into the thermoelectric component (14), thereby feeding in a supply current (I V ) at least reduces the supply current (I V ) supplies energy to the semiconductor component with a second portion (q%) of the temperature-dependent portion (p%) of the semiconductor component, The device (18) is a device (18) according to any one of claims 1 to 12.

23. The method according to claim 22, characterized in that The semiconductor component is a semiconductor light source (12).

24. The method according to claim 22, characterized in that The semiconductor component is an LED.

25. The method according to claim 22, characterized in that The semiconductor components to be operated are cooled and / or heated by means of the thermoelectric components (14).

26. The method according to claim 22, characterized in that The supply current (I V ) is used in whole or in part to increase the temperature control capacity of the thermoelectric component (14).

27. The method according to claim 26, characterized in that The temperature control power is a cooling power and / or a heating power.

28. The method according to any one of claims 22 to 27, characterized in that Since the first temperature threshold (T1) is reached and / or exceeded, the supply current (I V ) is deflected and fed into the thermoelectric component (14).

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