Fluid supply unit and substrate processing device having the same

Abstract

The present invention provides a fluid supply unit and a substrate processing device having the fluid supply unit. A device for processing a substrate comprises: a process chamber having a processing space for processing the substrate; a fluid supply unit for supplying fluid to the processing space, wherein the fluid supply unit comprises: a supply pipe connected to the processing space to supply the fluid to the processing space; a pump installed in the supply pipe to provide flow pressure to the fluid; an exhaust line installed between the pump and the process chamber to discharge the pressure in the fluid to the outside; a safety valve installed in the exhaust line to open and close the exhaust line; and a reservoir installed between the pump and a branch point at which the exhaust line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than the cross-sectional area of ​​the portion of the supply pipe located between the pump and the branch point.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0083113, filed on Jul. 10, 2019, which is hereby incorporated by reference into this application in its entirety. Technical Field

[0003] Embodiments of the inventive concepts described herein relate to a fluid supply unit and a substrate treating apparatus having the same. Background Art

[0004] Generally, semiconductor devices are manufactured from a substrate such as a wafer, and are manufactured by performing a deposition process, a photolithography process, an etching process, etc. to form a fine circuit pattern on the top surface of the substrate.

[0005] Since the top surface of the substrate on which the circuit pattern is formed may be contaminated by various foreign substances in the case where the above-mentioned process is performed, a cleaning process may be performed to remove the foreign substances.

[0006] Currently, supercritical fluids are used in the process of cleaning substrates. In one embodiment, in the cleaning process, isopropyl alcohol (hereinafter referred to as IPA) is used to clean the top surface of the substrate, and then supercritical carbon dioxide (CO 2 ) is fed to the top surface of the substrate to remove the IPA remaining on the substrate.

[0007] In the cleaning device, the pipe for supplying carbon dioxide (carbon dioxide supply line) is equipped with a condenser, a pump, and a safety valve for discharging carbon dioxide above the reference pressure. When an abnormal stop occurs in the process of setting the cleaning device or in the test operation process thereof, the switch valve of the carbon dioxide supply line is closed, so an instantaneous pressure increase occurs. When the pressure in the carbon dioxide supply line increases, the safety valve operates, which may increase the possibility of damage to the bellows in the safety valve and process contamination. Summary of the invention

[0008] Embodiments of the inventive concept provide a fluid supply unit capable of suppressing a pressure fluctuation phenomenon in a supply line of a supercritical fluid, and a substrate treating apparatus having the same.

[0009] The purpose of the present invention is not limited to this. For those skilled in the art, other purposes not mentioned will become apparent from the following description.

[0010] According to an exemplary embodiment, an apparatus for processing a substrate includes: a process chamber having a processing space for processing the substrate; a fluid supply unit for supplying fluid to the processing space, wherein the fluid supply unit includes: a supply pipe connected to the processing space to supply the fluid to the processing space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to the outside; a safety valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point at which the vent line branches from the supply pipe, wherein the reservoir has a larger cross-sectional area than a cross-sectional area of ​​a portion of the supply pipe located between the pump and the branch point.

[0011] Furthermore, the reservoir may have a tubular shape.

[0012] Furthermore, the reservoir may have a rugby ball shape in which both ends have the same cross-sectional area as portions of the supply tube, and the cross-sectional area of ​​the reservoir increases as the reservoir extends from each end toward a midpoint of the reservoir.

[0013] Furthermore, the fluid may be a supercritical fluid.

[0014] Furthermore, the reservoir may contain an inertia fluid having inertia for suppressing pressure fluctuation of the fluid.

[0015] According to an exemplary embodiment, a fluid supply unit includes: a supply pipe along which a fluid flows; a pump installed in the supply pipe to provide flow pressure to the fluid; an exhaust line installed at a rear end of the pump to discharge pressure in the fluid to the outside; and a safety valve installed in the exhaust line to open and close the exhaust line, wherein the supply pipe includes a flow-path enlarging pipe installed between the pump and a branch point at which the exhaust line branches from the supply pipe, wherein the flow-path enlarging pipe has a cross-sectional area larger than that of the supply pipe to reduce pressure changes in the supply pipe.

[0016] Furthermore, the fluid may be a supercritical fluid.

[0017] Furthermore, the flow path expansion tube may contain an inertial fluid having inertia to suppress pressure fluctuation of the fluid.

[0018] Furthermore, the flow path expansion tube may have a rugby ball shape, wherein both ends thereof have the same cross-sectional area as the supply tube, and the cross-sectional area of ​​the flow path expansion tube increases as the flow path expansion tube extends from each end toward a midpoint of the flow path expansion tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects and features will become apparent from the following description with reference to the following drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:

[0020] Figure 1 is a plan view schematically illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;

[0021] Figure 2 It is schematically shown Figure 1 A diagram of an embodiment of a liquid handling device;

[0022] Figure 3 It is schematically shown Figure 1 A diagram of an embodiment of a cleaning device;

[0023] Figure 4 It is shown Figure 3 A view of the storage device shown in ; and

[0024] Figure 5 is a view showing another embodiment of a storage. DETAILED DESCRIPTION

[0025] Hereinafter, the embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. The embodiments of the inventive concept can be modified in various forms. The scope of the inventive concept should not be interpreted as being limited to the following embodiments. Embodiments are provided to more fully explain the inventive concept to those skilled in the art. Therefore, for a clearer explanation, the shapes of the elements in the accompanying drawings are exaggerated.

[0026] Figure 1 is a plan view schematically illustrating a substrate processing system according to an embodiment of the inventive concept.

[0027] Reference Figure 1 , the substrate processing system includes an index module 10, a processing module 20, and a controller. In one embodiment, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction 92. When viewed from above, the direction perpendicular to the first direction 92 is referred to as a second direction 94. The direction perpendicular to the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0028] The index module 10 transfers the substrate W from the container 80 storing the substrate W to the processing module 20, and transfers the substrate W processed in the processing module 20 to the container 80. The length direction of the index module 10 is the second direction 94. The index module 10 has a loading port 12 and an index frame 14. The loading port 12 is opposite to the processing module 20 around the index frame 14. The container 80 containing the substrate W therein is placed on the loading port 12. A plurality of loading ports 12 may be provided. The plurality of loading ports 12 may be arranged along the second direction 94.

[0029] The container 80 may include a sealed container such as a FOUP (Front Open Unified Pod). The container 80 may be placed on the load port 12 by an operator, or a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, or an automatic guided vehicle.

[0030] The index frame 14 has an index robot 120. The index frame 14 has a guide rail 140, and the length direction of the guide rail 140 is the second direction 94. The index robot 120 can be configured to be movable on the guide rail 140. The index robot 120 includes a hand 122, and the substrate W is placed on the hand 122. The hand 122 can be configured to be able to move forward and backward, rotate around the third direction 96, and move along the third direction 96. A plurality of hands 122 can be arranged, and the plurality of hands 122 can be spaced apart from each other in the vertical direction. The hands 122 can move forward and backward independently of each other.

[0031] The processing module 20 includes a buffer unit 200, a conveying device 300, a liquid processing device 400, and a cleaning device 500. The buffer unit 200 provides a space in which the substrate W loaded into the processing module 20 and the substrate W loaded out of the processing module 20 temporarily stay. The liquid processing device 400 performs a liquid processing process of supplying liquid on the substrate W to process the substrate W using the liquid. The cleaning device 500 performs a drying process to remove the liquid remaining on the substrate W. The conveying device 300 transports the substrate W between the buffer unit 200, the liquid processing device 400, and the cleaning device 500.

[0032] The conveying device 300 may have a length direction of a first direction 92. The buffer unit 200 may be disposed between the index module 10 and the conveying device 300. The liquid handling device 400 and the cleaning device 500 may be disposed on a side of the conveying device 300. The liquid handling device 400 and the conveying device 300 may be arranged along a second direction 94. The cleaning device 500 and the conveying device 300 may be arranged along the second direction 94. The buffer unit 200 may be located at one end of the conveying device 300.

[0033] In one embodiment, the liquid treatment device 400 may be respectively arranged on both sides of the conveying device 300. The cleaning device 500 may be respectively arranged on both sides of the conveying device 300. The liquid treatment device 400 may be closer to the buffer unit 200 than the cleaning device 500. On one side of the conveying device 300, the liquid treatment device 400 may be arranged in a matrix of A×B (each of A and B is a natural number greater than 1) along the first direction 92 and the third direction 96, respectively. In addition, on one side of the conveying device 300, the cleaning device 500 may be arranged in a matrix of C×D (each of C and D is a natural number greater than 1) along the first direction 92 and the third direction 96, respectively. Alternatively, only the liquid treatment device 400 may be arranged on one side of the conveying device 300, and only the cleaning device 500 may be arranged on the other side of the conveying device 300.

[0034] The conveyor 300 has a conveyor robot 320. The conveyor 300 has a guide rail 340, and the length direction of the guide rail 340 is the first direction 92. The conveyor robot 320 can be configured to be movable on the guide rail 340. The conveyor robot 320 includes a hand 322, and the substrate W is placed on the hand 322. The hand 322 can be configured to be able to move forward and backward, rotate around the third direction 96, and move along the third direction 96. A plurality of hands 322 can be arranged, and the plurality of hands 322 can be spaced apart from each other in the vertical direction. The hands 322 can move forward and backward independently of each other.

[0035] The buffer unit 200 has a plurality of buffer areas 220 on which the substrate W is placed. The buffer areas 220 may be configured to be spaced apart from each other along the third direction 96. The buffer unit 200 has an open front surface and an open rear surface. The front surface faces the index module 10, and the rear surface faces the transfer device 300. The index robot 120 accesses the buffer unit 200 through the front surface. The transfer robot 320 may access the buffer unit 200 through the rear surface.

[0036] Figure 2 It is schematically shown Figure 1 FIG. 4 is a diagram of an embodiment of a liquid handling device 400. Figure 2 The liquid treatment device 400 has a housing 410, a cup 420, a support unit 440, a liquid supply unit 460, and an ascending and descending unit 480. The housing 410 is generally formed in the shape of a rectangular parallelepiped. The cup 420, the support unit 440, and the liquid supply unit 460 are disposed in the housing 410.

[0037] The cup 420 has a processing space having an open top. In the processing space, the substrate W is processed with liquid. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid to the substrate W supported by the support unit 440. The liquid has various types. The various types of liquids can be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0038] In one embodiment, the cup 420 has a plurality of collection vessels 422, 424, and 426. Each collection vessel 422, 424, and 426 has a collection space to collect liquid for processing a substrate. Each collection vessel 422, 424, and 426 is formed in an annular shape around the support unit 440. As the liquid treatment process proceeds, the pre-treatment liquid scattered by the rotation of the substrate W enters the collection space through each inlet 422a, 424a, and 426a of the collection vessels 422, 424, and 426, respectively. In one embodiment, the cup 420 has a first collection vessel 422, a second collection vessel 424, and a third collection vessel 426. The first collection vessel 422 is configured to surround the support unit 440, the second collection vessel 424 is configured to surround the first collection vessel 422, and the third collection vessel 426 is configured to surround the second collection vessel 424. The second inlet 424a may be located above the first inlet 422a, and the liquid is supplied to the second collection dish 424 through the second inlet 424a, and the liquid is supplied to the first collection dish 422 through the first inlet 422a. The third inlet 426a may be located above the second inlet 424a, and the liquid is supplied to the third collection dish 426 through the third inlet 426a.

[0039] The support unit 440 has a support plate 442 and a drive shaft 444. The top surface of the support plate 442 may be generally formed in a circular shape and may have a diameter larger than the diameter of the substrate W. A support pin 442a is provided at the center of the support plate 442 to support the rear surface of the substrate W. The support pin 442a has a top protruding from the support plate 442 so that the substrate W is spaced a certain distance from the support plate 442. A chuck pin 442b is provided at the edge of the support plate 442. The chuck pin 442b protrudes upward from the support plate 442 and supports the side of the substrate W so that when the substrate W rotates, the substrate W does not deviate from the support unit 440. The drive shaft 444 is driven by an actuator 446 and is connected to the center of the bottom surface of the substrate W and rotates the support plate 442 around its central axis.

[0040] In one embodiment, the liquid supply unit 460 has a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 supplies the first liquid onto the substrate W. The first liquid may be a liquid for removing a film or foreign matter remaining on the substrate W. The second nozzle 464 supplies the second liquid onto the substrate W. The second liquid may be a liquid soluble in the third liquid. For example, the second liquid may be a liquid that is more soluble in the third liquid than the first liquid. The second liquid may be a liquid that neutralizes the first liquid supplied on the substrate W. In addition, the second liquid may be a liquid that neutralizes the first liquid and is more soluble in the third liquid than the first liquid. In one embodiment, the second liquid may be water. The third nozzle 466 supplies the third liquid onto the substrate W. The third liquid may be a liquid that is well soluble in the supercritical fluid used in the cleaning device 500. For example, the third liquid may be a liquid that is more soluble in the supercritical fluid used in the cleaning device 500 than the second liquid. In one embodiment, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol (IPA). In one embodiment, the supercritical fluid may be carbon dioxide. The first nozzle 462, the second nozzle 464 and the third nozzle 466 are supported on different arms 461. These arms 461 can move independently. Alternatively, the first nozzle 462, the second nozzle 464 and the third nozzle 466 can be mounted on the same arm and move simultaneously.

[0041] The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate W changes due to the vertical movement of the cup 420. Therefore, the collection dishes 422, 424, and 426 for collecting the pre-treatment liquid are changed according to the type of liquid supplied to the substrate W, so that the liquid can be collected separately. Alternatively, the cup 420 may be fixedly installed, and the lifting unit 480 may move the support unit 440 in the vertical direction.

[0042] Figure 3 It is schematically shown Figure 1 1 is a diagram of an embodiment of a cleaning device 500. According to one embodiment, the cleaning device 500 uses a supercritical fluid to remove liquid on a substrate W. The cleaning device 500 has a body 520, a support (not shown), a fluid supply unit 600, and a baffle (not shown).

[0043] The main body 520 provides a processing space 502 for performing a cleaning process. The main body 520 has an upper main body 522 and a lower main body 524. The upper main body 522 and the lower main body 524 are combined with each other to provide the processing space 502 as described above. The upper main body 522 is located above the lower main body 524. The upper main body 522 has a fixed position. The lower main body 524 can be moved up and down by a driving member 590 such as a cylinder. When the lower main body 524 is separated from the upper main body 522, the processing space 502 is opened, so the substrate W is brought into or out of the processing space 502. During the process, the lower main body 524 is in close contact with the upper main body 522, so the processing space 502 is sealed from the outside. The cleaning device 500 has a heater 570. In one embodiment, the heater 570 is located inside the wall of the main body 520. The heater 570 heats the processing space 502 of the main body 520 so that the fluid supplied to the internal space of the main body 520 remains in a supercritical state. The interior of the processing space 502 has an atmosphere of a supercritical fluid.

[0044] The support member (not shown) supports the substrate W in the processing space 502 of the main body 520. The support member (not shown) has a fixed rod (not shown) and a stand device (not shown). The fixed rod (not shown) is fixed to the upper body 522 to protrude downward from the bottom surface of the upper body 522. The fixed rod (not shown) has a length direction as a vertical direction. A plurality of fixed rods (not shown) are arranged, and the plurality of fixed rods are spaced apart from each other. The fixed rods (not shown) are arranged so that when the substrate W is brought into or out of the space surrounded by the fixed rods, the substrate W does not interfere with the fixed rods (not shown). The stand device (not shown) is coupled to each fixed rod (not shown). The stand device (not shown) extends from the bottom of the fixed rod (not shown) in a direction toward the space surrounded by the fixed rod (not shown). Due to the above structure, the edge area of ​​the substrate W brought into the processing space 502 of the main body 520 is placed on a support device (not shown), and the entire area of ​​the top surface of the substrate W, the central area of ​​the bottom surface of the substrate W, and a partial edge area of ​​the bottom surface of the substrate W are exposed to the cleaning fluid supplied to the processing space 502.

[0045] The fluid supply unit 600 supplies the cleaning fluid to the processing space 502 of the body 520. In one embodiment, the cleaning fluid may be supplied to the processing space 502 in a supercritical state. Alternatively, the cleaning fluid may be supplied to the processing space 502 in a gaseous state, and then in the processing space 502, the phase of the cleaning fluid may become a supercritical state.

[0046] In one embodiment, the fluid supply unit 600 may include a fluid supply source 610 , a supply line 620 , a pump 630 , an exhaust line 640 , a safety valve 642 , a reservoir 650 , and an on-off valve 660 .

[0047] One end of the supply line 620 may be connected to the fluid supply source 610. The supply line may receive supercritical carbon dioxide from the fluid supply source. The supply line 620 may include a main supply line 622, an upper branch line 624, and a lower branch line 626.

[0048] An upper branch line 624 and a lower branch line 626 are branched from the main supply line 622. The upper branch line 624 is coupled to the upper body 522 to supply the cleaning fluid downward onto the substrate W placed on the support 540. In one embodiment, the upper branch line 624 is coupled to the center of the upper body 522. The lower branch line 626 is coupled to the lower body 524 to supply the cleaning fluid upward onto the substrate W placed on the support 540. In one embodiment, the lower branch line 626 may be coupled to the center of the lower body 524. The exhaust unit 550 is coupled to the lower body 524. When the lower branch line 626 is coupled to the center of the lower body 524, the exhaust port of the exhaust unit 550 may be positioned in a manner offset from the center of the lower body 524. The supercritical fluid in the processing space 502 of the body 520 is exhausted from the body 520 through the exhaust unit 550.

[0049] A pump 630 is installed in the main supply line 622 to provide flow pressure to the fluid. An exhaust line 640 is installed between a branch point and the pump to discharge the pressure in the fluid to the outside; an upper branch line 624 and a lower branch line 626 branch from the main supply line 622 at the branch point. A safety valve 642 is installed in the exhaust line 640 and is configured to open the exhaust line 640 when the fluid pressure on the main supply line 622 rises above a preset pressure. An on-off valve 660 is installed in the main supply line 622 to control the fluid supply.

[0050] The reservoir 650 is installed between a branch point at which the exhaust line 640 branches from the main supply line 622 and the pump 630 .

[0051] Figure 4 It is shown Figure 3 A view of the storage device shown in FIG.

[0052] Reference Figure 3 and Figure 4, the reservoir 650 has a flow path expansion tube shape having a cross-sectional area larger than that of the main supply line 622. In one embodiment, the reservoir 650 may store an inertial fluid having inertia to suppress the pressure fluctuation phenomenon of the fluid. For example, the inertial fluid may be a liquid containing carbon dioxide. The reservoir 650 has a cross-sectional area larger than that of the main supply line 622. Therefore, when the system stops abnormally, the pressure fluctuation in the main supply line 622 may be suppressed based on the inertia of the inertial fluid stored in the reservoir 650, thereby preventing the possibility of damage and contamination of the safety valve 642. In addition, when a pressure fluctuation occurs in the main supply line 622 adjacent to the pump 630, the fluid flows into the large space of the reservoir 650, so that the pressure fluctuation may be alleviated.

[0053] Figure 5 is a view showing another embodiment of a storage.

[0054] Figure 5 The reservoir 650a shown in FIG. 6 has a rugby shape, wherein both ends 652a and 652b connected to the main supply line 622 have the same cross-sectional area as that of the main supply line 622, and the cross-sectional area of ​​the reservoir 650a gradually increases as the reservoir 650a extends from each end to the center of the reservoir 650a. In the rugby-shaped reservoir 650a, when a fluid is introduced and diffused therein, the fluid flow may be smooth as indicated by the arrows.

[0055] According to one embodiment of the present inventive concept, a pressure fluctuation phenomenon in a supply line of a supercritical fluid may be suppressed.

[0056] The effects of the present inventive concept are not limited to the above-mentioned effects. Those skilled in the art to which the present inventive concept pertains may clearly understand unmentioned effects from the present specification and the accompanying drawings.

[0057] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive, but illustrative.

[0058] Reference numerals

[0059] 400: Liquid processing device 410: Housing

[0060] 420: cup 440: support unit

[0061] 500: Cleaning device 600: Fluid supply unit

[0062] 610: Fluid supply source 620: Supply line

[0063] 630: Pump 640: Exhaust line

[0064] 650: Storage 660: Open / Close Valve

Claims

1. A device for processing a substrate, the device include: a process chamber, wherein the process chamber has a processing space for processing the substrate; a fluid supply unit, the fluid supply unit being used to supply fluid to the processing space, Wherein, the fluid supply unit comprises: a supply pipe connected to the processing space to supply the fluid to the processing space; a pump installed in the supply pipe to provide flow pressure to the fluid; an exhaust line installed between the pump and the process chamber to discharge the pressure in the fluid to the outside; a safety valve installed in the exhaust line to open and close the exhaust line; and A reservoir is installed between the pump and a branch point at which the exhaust line branches from the supply pipe, wherein the reservoir has a larger cross-sectional area than a portion of the supply pipe between the pump and the branch point.

2. The device according to claim 1, in, The reservoir has a tubular shape.

3. The device according to claim 1, in, Both ends of the reservoir have the same cross-sectional area as the portion of the supply pipe.

4. The device according to claim 3, in, The cross-sectional area of ​​the reservoir increases as the reservoir extends from each end toward a midpoint of the reservoir.

5. The device according to claim 3, in, The reservoir has a rugby ball shape.

6. The device according to claim 1, in, The fluid is a supercritical fluid.

7. The device according to claim 6, in, The fluid is carbon dioxide.

8. The device according to claim 1, in, The reservoir contains an inertial fluid having inertia for suppressing pressure fluctuation of the fluid.

9. A fluid supply unit, the fluid supply unit include: a supply pipe along which a fluid flows; a pump installed in the supply pipe to provide flow pressure to the fluid; an exhaust line installed at a rear end of the pump to discharge pressure in the fluid to the outside; a safety valve installed in the exhaust line to open and close the exhaust line, and a reservoir installed between the pump and a branch point at which the exhaust line branches from the supply pipe, wherein the reservoir has a larger cross-sectional area than a portion of the supply pipe between the pump and the branch point to mitigate pressure changes in the supply pipe.

10. The fluid supply unit according to claim 9, in, The fluid is a supercritical fluid.

11. The fluid supply unit according to claim 10, in, The fluid is carbon dioxide.

12. The fluid supply unit according to claim 9, in, The reservoir contains an inertial fluid having inertia to suppress pressure fluctuation of the fluid.

13. The fluid supply unit according to claim 9, in, Both ends of the reservoir have the same cross-sectional area as that of the supply pipe.

14. The fluid supply unit according to claim 13, in, The cross-sectional area of ​​the reservoir increases as the reservoir extends from each end toward a midpoint of the reservoir.

15. The fluid supply unit according to claim 13, in, The reservoir has a rugby ball shape.

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