Wiring circuit substrate assembly sheet and method for manufacturing wiring circuit substrate

Abstract

The wiring circuit substrate assembly sheet comprises: a support sheet having two parallel end edges; and a plurality of wiring circuit substrates arranged on the support sheet at intervals. The wiring circuit substrate has a metal tie portion in a substantially rectangular frame shape. The metal tie portion comprises: a first sheet extending along a first direction perpendicular to the thickness direction of the support sheet; and a second sheet extending along a second direction perpendicular to the thickness direction and the first direction. Both the first sheet and the second sheet are inclined relative to the end edges of the support sheet.

Description

Technical Field

[0001] The present invention relates to a wiring circuit substrate assembly sheet, a method for producing the wiring circuit substrate assembly sheet, and a method for producing a wiring circuit substrate. Background Art

[0002] Conventionally, there is known a method of manufacturing an assembly sheet including a plurality of conductor patterns by forming a plurality of rectangular conductor patterns on a sheet-shaped support sheet extending in front, back, left, and right directions (see, for example, Patent Document 1).

[0003] In Patent Document 1, each of the plurality of conductor patterns integrally includes front and rear pieces extending in the left-right direction and parallel to each other, and left and right pieces connecting both end edges of the front and rear pieces and extending in the front-back direction and parallel to each other.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2004-165375 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] However, when forming the conductor pattern described in Patent Document 1 by a subtractive method of etching a flat conductor sheet to form a conductor pattern, first, an etching resist is disposed in a predetermined pattern on the surface of the conductor sheet, and then the sheets are transported toward an etching device.

[0009] The anti-corrosion coating has front and rear sheets and left and right sheets, and the front and rear sheets and left and right sheets have the same pattern as the conductor pattern to be formed. In addition, the support sheet has two end edges parallel to the conveying direction, and the left and right sheets of the anti-corrosion coating are parallel to the end edges, and the extension lines of the front and rear sheets of the anti-corrosion coating are orthogonal to the end edges. On the other hand, the discharge port of the etching liquid is arranged in the left and right direction orthogonal to the conveying direction of the stacked body in the etching device.

[0010] Then, in the etching device, while the stacked body is advanced in the conveying direction, the portion of the metal sheet exposed from the corrosion resistant coating is brought into contact with the etching liquid discharged in the left-right direction.

[0011] At this time, the etching liquid collides with the front sheet of the corrosion-resistant coating, and strongly etches the metal sheet in front of the front sheet.

[0012] Next, the etching liquid flows along the left and right sheets of the corrosion resistant coating, and the metal sheets on the outside of the left and right sheets are etched more slowly by the etching liquid than the metal sheet in front of the front sheet.

[0013] Furthermore, the etching liquid flowing through the outer sides of the left and right sheets very gently flows around the rear sheet of the corrosion-resistant coating. Therefore, the metal sheet behind the rear sheet is etched more slowly by such etching liquid than the metal sheet outside the left and right sheets.

[0014] Therefore, the positional accuracy of the outer shape of the front piece and the left and right pieces of the conductor pattern corresponding to the front piece and the left and right pieces of the corrosion-resistant coating is reduced. In addition, the positional accuracy of the outer shape of the rear piece and the left and right pieces of the conductor pattern corresponding to the rear piece and the left and right pieces of the corrosion-resistant coating is reduced. Therefore, there is a defect that the conductor pattern cannot obtain the desired electrical characteristics.

[0015] The present invention provides a method for manufacturing a wiring circuit board assembly sheet capable of forming the outer shapes of a first sheet and a second sheet with excellent positional accuracy, a wiring circuit board assembly sheet manufactured by the method for manufacturing a wiring circuit board assembly sheet, and a method for manufacturing a wiring circuit board manufactured subsequently.

[0016] Solutions for solving problems

[0017] The present invention (1) includes a wiring circuit substrate assembly sheet, the wiring circuit substrate assembly sheet comprising: a support sheet having two parallel end edges; and a plurality of wiring circuit substrates, the plurality of wiring circuit substrates being arranged on the support sheet with intervals therebetween, the wiring circuit substrates having a substantially rectangular frame-shaped metal-based portion, the metal-based portion comprising: a first sheet extending along a first direction orthogonal to the thickness direction of the support sheet; and a second sheet extending along a second direction orthogonal to the thickness direction and the first direction, the first sheet and the second sheet being inclined relative to the end edges of the support sheet.

[0018] In the wiring circuit substrate assembly sheet, while the supporting sheet is conveyed in the direction in which the two end edges extend, the metal-based part of the wiring circuit substrate assembly sheet is formed by a pattern forming device arranged in a direction orthogonal to the conveying direction. In this case, the first sheet and the second sheet are both inclined relative to the conveying direction. Therefore, the first sheet and the second sheet are also inclined relative to the pattern forming device. Thus, the first sheet and the second sheet are both formed by the pattern forming device under the same etching conditions. Therefore, the outer shapes of the first sheet and the second sheet are formed with the same accuracy. As a result, the wiring circuit substrate assembly sheet can have the following wiring circuit substrate: a metal-based part with excellent positional accuracy of the outer shape.

[0019] The present invention (2) includes the wired circuit board assembly sheet described in (1), wherein the metal-based portion includes wires.

[0020] In this wired circuit board assembly sheet, since the metal-based portion includes wires, desired electrical characteristics can be achieved.

[0021] The present invention (3) comprises the wired circuit board assembly sheet described in (1) or (2), wherein the metal-based portion includes a support layer.

[0022] In this wired circuit board assembly sheet, since the metal-based portion includes the support layer, desired thermal conductivity can be achieved.

[0023] The present invention (4) includes a method for manufacturing a wiring circuit substrate assembly sheet, which is a method for manufacturing a wiring circuit substrate assembly sheet having a support sheet and a plurality of wiring circuit substrates arranged on the support sheet at intervals from each other, the method for manufacturing the wiring circuit substrate assembly sheet being characterized in that it comprises: a first step in which a roughly rectangular frame-shaped anti-corrosion coating is arranged on a metal sheet to produce an anti-corrosion laminate having the metal sheet and the anti-corrosion coating, the anti-corrosion coating comprising a first anti-corrosion sheet and a second anti-corrosion sheet, the first anti-corrosion sheet being arranged along a first direction orthogonal to the thickness direction of the support sheet, the second anti-corrosion sheet being arranged along a direction orthogonal to the thickness direction and the first anti-corrosion sheet The second direction is orthogonal to the direction; and a second process, in which the portion of the metal sheet exposed from the anti-corrosion coating is etched while the anti-corrosion stack is moved to form a metal-based portion in the shape of a roughly rectangular frame including a first metal sheet covered by the first anti-corrosion sheet and a second metal sheet covered by the second anti-corrosion sheet, thereby manufacturing the wiring circuit substrate having the metal-based portion. In the second process, the anti-corrosion stack is moved while the first anti-corrosion sheet and the second anti-corrosion sheet are inclined relative to the moving direction of the anti-corrosion stack, and the portion of the metal sheet exposed from the anti-corrosion coating is etched.

[0024] In the second step of the manufacturing method of the wiring circuit substrate assembly sheet, the first resist sheet and the second resist sheet are both inclined relative to the moving direction. Therefore, they are also inclined relative to the etching device. Then, the first sheet and the second sheet are formed by the etching device under the same etching conditions. Therefore, the outer shapes of the first sheet and the second sheet can be formed with the same accuracy. As a result, a wiring circuit substrate assembly sheet having a metal-based portion with excellent positional accuracy of the outer shape can be manufactured.

[0025] The present invention (5) includes the method for producing a wired circuit board assembly sheet according to (4), wherein the length of the first resist sheet in the second direction is the same as the length of the second resist sheet in the first direction.

[0026] The etching liquid collides with the first anti-etching sheet and directly etches a portion of the metal sheet located near one side of the second direction of the first anti-etching sheet. On the other hand, a portion of the etching liquid passes over the first anti-etching sheet and etches a portion of the metal sheet located near the other side of the second direction of the first anti-etching sheet.

[0027] In addition, the etching liquid also collides with the second anti-etching sheet and directly etches the portion of the metal sheet located near one side of the second anti-etching sheet in the first direction. On the other hand, a portion of the etching liquid passes over the second anti-etching sheet and etches the portion of the metal sheet located near the other side of the second anti-etching sheet in the first direction.

[0028] As described above, etching of the portion of the metal sheet located near the first resist sheet on the second direction side and etching of the portion of the metal sheet located near the second resist sheet on the first direction side are performed under the same conditions.

[0029] Furthermore, in this manufacturing method, in the first step, the length of the first resist sheet in the second direction and the length of the second resist sheet in the first direction are set to be the same. Therefore, in the second step, the conditions under which the etching solution passes over the first resist sheet and the conditions under which the etching solution passes over the second resist sheet can be set to be the same, and the etching of the portion of the metal sheet located near the other side in the second direction of the first resist sheet and the etching of the portion of the metal sheet located near the other side in the first direction of the second resist sheet can be performed under the same conditions.

[0030] Therefore, the second direction length of the first sheet covered by the first resist sheet and the first direction length of the second sheet covered by the second resist sheet can be made the same.

[0031] The present invention (6) includes a method for manufacturing a wiring circuit board, which comprises the following steps: manufacturing a wiring circuit board assembly sheet using the method for manufacturing a wiring circuit board assembly sheet described in (4); and separating the wiring circuit board from the supporting sheet.

[0032] In this method of manufacturing a wired circuit board, the wired circuit board assembly sheet is manufactured and then the wired circuit board is separated from the support sheet. Therefore, a wired circuit board having a metal part with excellent positional accuracy of the outer shape can be manufactured.

[0033] Effects of the Invention

[0034] The wired circuit board assembly sheet of the present invention can include a wired circuit board having a metal portion with excellent positional accuracy of the outer shape.

[0035] The method for producing a wired circuit board assembly sheet of the present invention can produce a wired circuit board assembly sheet having a metal portion with excellent positional accuracy of the outer shape.

[0036] The method for manufacturing a wired circuit board of the present invention can manufacture a wired circuit board having a metal-based portion with excellent positional accuracy of an outer shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 The top view shows one embodiment of the wired circuit board assembly sheet of the present invention. The lower left figure shows an enlarged view of the wired circuit board supported by the support sheet, and the lower right figure shows an enlarged view of the wired circuit board separated from the support sheet.

[0038] Figure 2 A~ Figure 2 D is Figure 1 The process diagram of the method for manufacturing the wiring circuit board assembly sheet shown in FIG. Figure 1 The cross-sectional view of line XX, Figure 2 A represents the substrate preparation step, Figure 2 B represents the process of configuring dry film resist, Figure 2 C represents a resist placement step for producing a resist laminate, Figure 2 C' represents Figure 2 C is an enlarged cross-sectional view of the resist stack, Figure 2 D represents an etching process.

[0039] Figure 3 E~ Figure 3 G then Figure 2 D, yes Figure 1 The process diagram of the method for manufacturing the wiring circuit board assembly sheet shown in FIG. Figure 1 The cross-sectional view of line XX, Figure 3 E represents the resist removal process, Figure 3 F represents the covering process, Figure 3 G represents the contour processing step.

[0040] Figure 4 A~ Figure 4 C is correct Figure 2 D is a diagram for explaining the etching process in detail. Figure 4 A represents the top view, Figure 4 B represents the side view, Figure 4 C means along Figure 4 A and Figure 4 Front cross-sectional view of line YY of B.

[0041] Figure 5 A~ Figure 5 C is a comparative example of a method for producing a wiring circuit board assembly sheet, Figure 5 A represents the top view, Figure 5 B is a front cross-sectional view of the resist stack during etching. Figure 5 C is a front cross-sectional view of the resist laminate including the etched metal-based portion.

[0042] Figure 6 A and Figure 6 B is Figure 1The enlarged plan view of a modified example of the wiring circuit board of the wiring circuit board assembly sheet shown in FIG. Figure 6 A represents a metal tie portion including a first metal sheet having a length in the second direction longer than that of the first metal sheet on the other side and a second metal sheet having a length in the first direction longer than that of the second metal sheet on the other side, Figure 6 B represents a form of a metal tie portion composed of a first metal sheet having a second direction length longer than the first direction length of the second metal sheet on one side and a first metal sheet on the other side having a second direction length longer than the first direction length of the second metal sheet on the other side.

[0043] Figure 7 A~ Figure 7 E is Figure 2 A~ Figure 3 A modification of the manufacturing method of G, Figure 7 A represents the process of preparing three layers of substrate, Figure 7 B represents the first resist placement step, Figure 7 C represents the first etching process, Figure 7 D represents the resist removal step, Figure 7 E represents a step of forming an insulating resin portion.

[0044] Figure 8 F~ Figure 8 INext Figure 7 E, yes Figure 2 A~ Figure 3 A modification of the manufacturing method of G, Figure 8 F represents the covering process, Figure 8 G represents the second resist placement step, Figure 8 H represents the second etching process, Figure 8 I represents a resist removal step.

[0045] Fig. 9 A and Fig. 9 B is Figure 2 A~ Figure 4 C is a top view of a modified example of the method for manufacturing a wiring circuit board assembly sheet, Fig. 9 A represents the resist stacked body transported to the etching device in the etching process, Fig. 9 B represents the obtained wired circuit board assembly sheet. DETAILED DESCRIPTION

[0046] Reference Figure 1 to Figure 4 C describes an embodiment of the wiring circuit board assembly sheet and a method for producing the same according to the present invention. Figure 2 C' and Figure 4 In the left figure, the thick arrows indicate the flow of the etching solution. Figure 4 The right side of A and Figure 4In B, the thick arrow indicates the conveyance direction of the resist laminate.

[0047] like Figure 1 As shown in FIG. 1 , the wiring circuit board assembly sheet 1 has a long strip shape extending in the longitudinal direction. Figure 3 As shown in G, the wired circuit board assembly sheet 1 has a thickness and includes a surface on one side in the thickness direction and a surface on the other side in the thickness direction. Figure 1 and Figure 3 As shown in G, the wired circuit board assembly sheet 1 has a short side length perpendicular to the longitudinal direction and the thickness direction, and includes one short side end edge 4 and the other short side end edge 5. The one short side end edge 4 and the other short side end edge 5 are parallel to the longitudinal direction.

[0048] The surface direction of the wiring circuit board assembly sheet 1 includes the above-mentioned length direction and short side direction. In addition, the thickness direction of the wiring circuit board assembly sheet 1 is a direction orthogonal to the surface direction. The length of the short side direction of the wiring circuit board assembly sheet 1 is shorter than the length of the wiring circuit board assembly sheet 1 in the length direction.

[0049] This wired circuit board assembly sheet 1 includes a support sheet 6 and a plurality of wired circuit boards 7 .

[0050] The support sheet 6 has the same top view shape (outer shape) as the wiring circuit board assembly sheet 1. That is, the support sheet 6 has one end edge 4 in the short side direction and the other end edge 5 in the short side direction as an example of two parallel end edges. The support sheet 6 is, for example, an insulating sheet. As the material of the support sheet 6, resins such as polyimide (resin materials with flexibility) can be cited. The thickness of the support sheet 6 is, for example, 1 μm or more, preferably 10 μm or more, and, for example, 10 mm or less, preferably 1 mm or less.

[0051] The plurality of wired circuit boards 7 are separably supported by the support sheet 6. The plurality of wired circuit boards 7 are arranged on the support sheet 6 at intervals.

[0052] The wiring circuit board 7 is in a substantially rectangular shape (preferably a substantially square shape) when viewed from above. In addition, the wiring circuit board 7 has two first end edges 18, which are arranged opposite to each other in a second direction perpendicular to the first direction and the thickness direction along a first direction inclined relative to the length direction and the short side direction of the support sheet 6. The two first end edges 18 have the same length.

[0053] In addition, the wiring circuit substrate 7 has two second end edges 19, which are arranged along the second direction and are spaced apart from each other in the first direction. The two second end edges 19 have the same length and connect the two first end edges 18. In the wiring circuit substrate 7, the two first end edges 18 and the two second end edges 19 are formed integrally. In addition, when describing the metal-based portion 9, the inclination of the first direction and the second direction relative to the longitudinal direction and the short side direction is described in detail.

[0054] The wiring circuit board 7 includes a support portion 8, a metal-based portion 9 disposed on one surface of the support portion 8 in the thickness direction, and a cover layer 14 disposed on one surface of the support portion 8 in the thickness direction so as to cover the metal-based portion 9. Preferably, the wiring circuit board 7 includes only the support portion 8, the metal-based portion 9, and the cover layer 14.

[0055] The support portion 8 has the same top view shape as the wiring circuit substrate 7. That is, the support portion 8 is substantially rectangular in top view. Specifically, the support portion 8 has two first end edges 18, which are arranged along the first direction and opposite to each other in the second direction. The two first end edges 18 have the same length.

[0056] In addition, the support portion 8 has two second end edges 19, which are arranged along the second direction and are spaced apart from each other in the first direction. The two second end edges 19 have the same length and connect the two first end edges 18. In the support portion 8, the two first end edges 18 and the two second end edges 19 are formed integrally.

[0057] In addition, the support portion 8 is supported in a manner that can be separated from the support sheet 6. Specifically, an opening portion 13 is formed around the support portion 8, and the support portion 8 is connected to the surrounding support sheet 6 by means of a joint 10. The opening portion 13 has a shape that is a roughly rectangular frame when viewed from above and surrounds the wiring circuit substrate 7. The joint 10 connects, for example, each of the four end edges (two first end edges 18 and two second end edges 19) to each of the four inner end edges in the support sheet 6 facing the opening portion 13. In addition, the joint 10 has a roughly straight line shape that spans the opening portion 13 formed around the support portion 8. Thus, the support portion 8 is suspended in the support sheet 6 via the opening portion 13 and by means of the joint 10.

[0058] The outer dimensions of the support portion 8 are appropriately set according to the use and purpose of the wiring circuit substrate 7. For example, the top view area S1 of the support portion 8 is set so that the ratio thereof to the top view area S2 of the metal-based portion 9 described later is within the range described later. In addition, the top view area S1 of the support portion 8 is, for example, the same as the top view area S0 of the wiring circuit substrate 7. The thickness and material of the support portion 8 are the same as the thickness and material of the support sheet 6.

[0059] The metal-based part 9 has a roughly rectangular frame shape when viewed from above, and preferably has a roughly square frame shape. In addition, the metal-based part 9 is included in the support part 8 when projected in the thickness direction. The metal-based part 9 is formed in a region inside the support part 8 except for the central part of the support part 8 when viewed from above. The metal-based part 9 includes wirings such as signal lines (differential wiring, etc.), power lines (power supply wiring, etc.), ground lines (grounding lines, etc.), antennas (transmitting and receiving signal lines, etc.). In addition, the metal-based part 9 may also have, for example, auxiliary parts (terminals, etc.) (not shown) corresponding to the functions of the above-mentioned wirings when viewed from above.

[0060] The metal tie portion 9 has four pieces respectively along the four end edges of the support portion 8. Specifically, the metal tie portion 9 integrally has two first metal pieces 11 and two second metal pieces 12, the two first metal pieces 11 are respectively arranged along the two first end edges 18 and on the inner sides of the two first end edges 18, and the two second metal pieces 12 are respectively arranged along the two second end edges 19 and on the inner sides of the two second end edges 19.

[0061] The two first metal sheets 11 have a substantially straight shape along the first direction. The two first metal sheets 11 have the same length and are parallel to each other. In addition, the two first metal sheets 11 are arranged at intervals from each other in the second direction. The two first metal sheets 11 are, for example, substantially rectangular in cross-sectional view. The two first metal sheets 11 are composed of a first metal sheet 61 arranged on one side of the second direction and a first metal sheet 62 arranged on the other side of the second direction.

[0062] The first metal sheet 61 on one side has a first outer side surface 63 as an outer side surface facing one side in the second direction, a first inner side surface 64 as an inner side surface facing the first metal sheet 62 on the other side, and a first upper surface 68 connecting one end edge of the first metal sheet 61 in the thickness direction. The first outer side surface 63 and the first inner side surface 64 are parallel. The first upper surface 68 is parallel to the surface of the support portion 8 on one side in the thickness direction.

[0063] The other side first metal sheet 62 has a second inner side surface 65 as an inner side surface facing the first side metal sheet 61, a second outer side surface 66 as an outer side surface facing the other side in the second direction, and a second upper surface 69 connecting one end edge of the thickness direction of the second inner side surface 65 and the second outer side surface 66. The second upper surface 69 is parallel to the surface of one side of the support portion 8 in the thickness direction.

[0064] Specifically, the first metal sheet 11 is such that the first direction along which the first metal sheet 11 is arranged is inclined relative to the one end edge 4 in the short side direction of the support sheet 6 when viewed from above. Specifically, when viewed from above, the angle formed by the first extension line E1 extending the first metal sheet 11 and the one end edge 4 in the short side direction of the support sheet 6 has at least a first acute angle α1, and such a first acute angle α1 is, for example, 20 degrees or more, preferably 30 degrees or more, and more preferably 40 degrees or more. In addition, such a first acute angle α1 is 70 degrees or less, preferably 60 degrees or less, more preferably 50 degrees or less, and particularly preferably 45 degrees.

[0065] The width W1 of the first metal sheet 11 is the second direction length W1 of the first metal sheet 11, and specifically, is the same length as the length between the first outer side surface 63 and the first inner side surface 64, and is the same length as the length between the second inner side surface 65 and the second outer side surface 66. Specifically, the width W1 of the first metal sheet 11 is, for example, 3 μm or more, preferably 10 μm or more, and, for example, 1000 μm or less, preferably 500 μm or less.

[0066] The first direction length L1 of the first metal piece 11 is, for example, 50 μm or more, preferably 100 μm or more, more preferably 300 μm or more, and is, for example, 10 mm or less.

[0067] The ratio (L1 / W1) of the first direction length L1 to the width W1 of the first metal piece 11 is, for example, greater than 2, preferably greater than 5, more preferably greater than 10, and for example, less than 10000, preferably less than 1000.

[0068] The two second metal sheets 12 have a substantially straight shape along the second direction. The two second metal sheets 12 have the same length and are parallel to each other. In addition, the two second metal sheets 12 are arranged at intervals from each other in the first direction. The two second metal sheets 12 connect the two first metal sheets 11 at both ends in the first direction along the second direction. The two second metal sheets 12 are, for example, substantially rectangular in cross-sectional view. The two second metal sheets 12 are composed of a second metal sheet 71 on one side arranged in the first direction and a second metal sheet 72 on the other side arranged in the first direction.

[0069] The second metal sheet 71 on one side has a third outer side surface 73 as an outer side surface facing one side in the first direction, a third inner side surface 74 as an inner side surface facing the second metal sheet 72 on the other side, and a third upper surface 78 connecting one end edge of the thickness direction of the third outer side surface 73 and the third inner side surface 74. The third upper surface 78 is parallel to the surface of the support portion 8 on one side in the thickness direction.

[0070] The second metal sheet 72 on the other side has a fourth inner side surface 75 as an inner side surface facing the second metal sheet 71 on the one side, a fourth outer side surface 76 as an outer side surface facing the other side in the first direction, and a fourth upper surface 79 connecting one end edge of the thickness direction of the fourth inner side surface 75 and the fourth outer side surface 76. The fourth upper surface 79 is parallel to the surface of one side of the support portion 8 in the thickness direction.

[0071] Specifically, the second direction along which the second metal sheet 12 extends is a direction orthogonal to the first direction (orthogonal direction). Therefore, the second direction (the second metal sheet 12) is inclined relative to the one end edge 4 in the short side direction of the support sheet 6 when viewed from above. Specifically, when viewed from above, the angle formed by the second extension line E2 extending the second metal sheet 12 and the one end edge 4 in the short side direction of the support sheet 6 has at least a second acute angle α2. The sum of the second acute angle α2 and the first acute angle α1 is a right angle.

[0072] The width W2 of the second metal sheet 12 is the first direction length W2 of the second metal sheet 12, and specifically, is the same length as the length between the third outer side surface 73 and the third inner side surface 74, and is the same length as the length between the fourth inner side surface 75 and the fourth outer side surface 76. Specifically, the width W2 of the second metal sheet 12 is, for example, 3 μm or more, preferably 10 μm or more, and for example, 1000 μm or less, preferably 500 μm or less. The ratio (W2 / W1) of the width W2 of the second metal sheet 12 to the width W1 of the first metal sheet 11 is, for example, 0.5 or more, preferably 0.8 or more, and for example, 1.5 or less, preferably 1.2 or less, and particularly preferably 1.

[0073] The second direction length L2 of the second metal sheet 12 is, for example, 50 μm or more, preferably 100 μm or more, more preferably 300 μm or more, and, for example, 10 mm or less. The ratio (L2 / W2) of the second direction length L2 of the second metal sheet 12 to the width W2 is the same as the ratio (L1 / W1) of the first direction length L1 of the first metal sheet 11 to the width W1, and specifically, for example, is 2 or more, preferably 5 or more, more preferably 10 or more, and, for example, is 10000 or less, and preferably 1000 or less. The ratio (L2 / L1) of the second direction length L2 of the second metal sheet 12 to the first direction length L1 of the first metal sheet 11 is, for example, 0.5 or more, preferably 0.8 or more, and, for example, is 1.5 or less, and preferably 1.2 or less.

[0074] The top-view area S2 of the metal-based part 9 is the sum of the top-view areas of the first upper surface 68, the second upper surface 69, the third upper surface 78, and the fourth upper surface 79. The ratio (S2 / S1) of the top-view area S2 of the metal-based part 9 to the top-view area S1 of the support part 8 is relatively high, for example, 0.5 or more, preferably greater than 0.5, more preferably 0.6 or more, further preferably 0.8 or more, and for example, less than 1.0, preferably 0.95 or less. The ratio (S2 / S0) of the top-view area S2 of the metal-based part 9 to the top-view area S0 of the wiring circuit board 7 is the same as the above-mentioned ratio (S2 / S1).

[0075] The thickness of the metal-based portion 9 is appropriately set. The thickness T1 of the first metal sheet 11 and the thickness T2 of the second metal sheet 12 are, for example, the same, for example, 5 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and for example, 1000 μm or less, preferably 200 μm or less. The ratio (T1 / W1) of the thickness T1 of the first metal sheet 11 to the width W1 is, for example, 0.01 or more, preferably 0.1 or more, and for example, 100 or less, preferably 10 or less. The ratio (T2 / W2) of the thickness T2 of the second metal sheet 12 to the width W2 is the same as the above-mentioned ratio (T1 / W1).

[0076] The material of the metal-based part 9 can be appropriately selected and used from, for example, known or commonly used metal-based materials (specifically, metal materials). Specifically, as metal-based materials, metal elements classified as Group 1 to Group 16 in the periodic table, alloys containing two or more of these metal elements, etc. can be cited. In addition, as metal-based materials, any of transition metals and typical metals can also be cited. More specifically, as metal-based materials, for example, second main group metal elements such as calcium, fourth sub-group metal elements such as titanium and zirconium, fifth sub-group metal elements such as vanadium, sixth sub-group metal elements such as chromium, molybdenum, tungsten, seventh sub-group metal elements such as manganese, eighth sub-group (eighth column) metal elements such as iron, eighth sub-group (ninth column) metal elements such as cobalt, eighth sub-group (tenth column) metal elements such as nickel and platinum, first sub-group metal elements such as copper, silver, and gold, second sub-group metal elements such as zinc, third main group metal elements such as aluminum and gallium, fourth main group metal elements such as germanium and tin can be cited. These can be used alone or in combination.

[0077] In addition, the metal-based part 9 includes a metal part 9 whose material is metal.

[0078] The covering layer 14 is an insulating layer that protects the metal-based part 9. The covering layer 14 covers the surface on one side of the thickness direction of the support part 8 that is exposed from the metal-based part 9, the surface on one side of the thickness direction of the metal-based part 9 (the first upper surface 68, the second upper surface 69, the third upper surface 78, and the fourth upper surface 79), and the side surfaces (the first outer side surface 63, the first inner side surface 64, the second inner side surface 65, the second outer side surface 66, the third outer side surface 73, the third inner side surface 74, the fourth inner side surface 75, and the fourth outer side surface 76). As a material for the covering layer 14, an insulating resin such as polyimide can be cited. The thickness of the covering layer 14 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 500 μm or less, preferably 200 μm or less.

[0079] Next, a method for producing the wired circuit board assembly sheet 1 will be described.

[0080] The method for manufacturing the wiring circuit board assembly sheet 1 is as follows Figure 2 A~ Figure 3 As shown in G, there are substrate preparation steps (refer to Figure 2 A) A resist placement step as an example of the first step ( Figure 2 B~ Figure 2 C) An etching step as an example of the second step (see Figure 2 D) Resist removal process (refer to Figure 3 E) Covering process (refer to Figure 3 F) and external processing steps (refer to Figure 3 G).

[0081] The method for producing the wired circuit board assembly sheet 1 is carried out, for example, by a roll-to-roll method. Figure 4 As shown in B, in the roll-to-roll method, a delivery roller 15 and a winding roller 16 are arranged at both ends in the length direction of a manufacturing device for the wiring circuit board assembly sheet 1 (not shown in its entirety), and in each process, the components described later that are delivered from the delivery roller 15 are delivered to the winding roller 16 to implement the method.

[0082] like Figure 2 As shown in A, in the substrate preparation step, a two-layer substrate 40 having a support sheet 6 and a metal sheet 17 disposed on one surface in the thickness direction thereof is prepared. The two-layer substrate 40 preferably has only the support sheet 6 and the metal sheet 17 .

[0083] The support sheet 6 has not yet formed the above-mentioned opening 13 in the substrate preparation step (see Figure 3 G), but is prepared as a long strip piece which is continuous in the longitudinal direction and does not have the opening 13. On the other hand, the support piece 6 includes one end edge 4 in the short side direction and the other end edge 5 in the short side direction.

[0084] The metal sheet 17 is arranged on the entire surface of one side in the thickness direction of the support sheet 6. In the substrate preparation step, the metal sheet 17 is not formed into a pattern corresponding to the above-mentioned metal part 9, but is prepared as a long strip sheet continuous in the length direction. The material and thickness of the metal sheet 17 are the same as the material and thickness of the above-mentioned metal part 9. In addition, the metal sheet 17 includes a metal sheet 17 made of metal.

[0085] For example, a resin is applied to the other side of the metal sheet 17 in the thickness direction and then dried to form the support sheet 6, thereby preparing the two-layer substrate 40. Alternatively, the two-layer substrate 40 having the support sheet 6 and the metal sheet 17 in advance can be directly prepared.

[0086] like Figure 2 B~ Figure 2 C and Figure 4 As shown in A, in the resist disposing step, the corrosion-resistant coating layer 2 having a substantially rectangular frame shape is disposed on one surface of the metal sheet 17 in the thickness direction.

[0087] In order to arrange the anti-corrosion coating 2 on the metal sheet 17, for example Figure 2 As shown in B, first, a sheet-shaped dry film resist 3 is placed on the entire surface of one side in the thickness direction of the metal sheet 17 .

[0088] like Figure 2 C and Figure 4 As shown in A, the dry film resist 3 is then formed into an etching resist 2 in a substantially rectangular frame shape by photolithography (exposure and development).

[0089] The corrosion-resistant coating 2 and the metal-based portion 9 to be formed (see Figure 1 and Figure 3 That is, the anti-corrosion coating 2 integrally comprises a first anti-etching sheet 21 and a second anti-etching sheet 22, wherein the first anti-etching sheet 21 and the first metal sheet 11 to be formed have approximately the same shape when viewed from above, and the second anti-etching sheet 22 and the second metal sheet 12 to be formed have approximately the same shape when viewed from above.

[0090] The first resist sheet 21 is arranged along the first direction. Two first resist sheets 21 are arranged at intervals in the second direction. The two first resist sheets 21 have the same length and are composed of a first resist sheet 31 on one side arranged on the second direction and a first resist sheet 33 on the other side arranged on the second direction. In addition, the first resist sheet 21 is roughly rectangular in cross-section. For example, the first resist sheet 31 on one side has a first resist outer side 51 facing the second direction, a first resist inner side 53 facing the first resist sheet 33 on the other side, and a first resist upper surface 55 connecting one end edge of the thickness direction. The third extension line E3 extending the first resist sheet 21 is inclined relative to the one end edge 4 in the short side direction of the support sheet 6.

[0091] The second resist sheet 22 is arranged along the second direction. Two second resist sheets 22 are arranged at intervals in the first direction. The two second resist sheets 22 have the same length and are composed of a second resist sheet 32 ​​on one side arranged on the first direction and a second resist sheet 34 on the other side arranged on the other side of the first direction. In addition, the second resist sheet 22 is roughly rectangular in cross-section. For example, the second resist sheet 32 ​​on one side has a second resist outer side 52 facing the first direction, a second resist inner side 54 facing the second resist sheet 34 on the other side, and a second resist upper surface 56 connecting one end edge of the thickness direction. The fourth extension line E4 extending the second resist sheet 22 is inclined relative to the one end edge 4 in the short side direction of the support sheet 6.

[0092] The second direction length W3 of the first resist sheet 21 is the same as the first direction length W4 of the second resist sheet 22. In addition, the second direction length W3 of the first resist sheet 21 is the length between the first resist outer side surface 51 and the first resist inner side surface 53. The first direction length W4 of the second resist sheet 22 is the length between the second resist outer side surface 52 and the second resist inner side surface 54.

[0093] In addition, regarding the top view size of the corrosion resistant coating 2, in the etching process described later, it is expected that the metal sheet 17 will be overetched (an overetched portion will be generated), and the size can be set in advance to be slightly larger than the metal portion 9 (see Figure 2 D’s imaginary line).

[0094] Thus, the anti-corrosion laminate 23 is produced which has the support sheet 6, the metal sheet 17, and the anti-corrosion coating 2 in this order toward one side in the thickness direction. The anti-corrosion laminate 23 preferably has only the support sheet 6, the metal sheet 17, and the anti-corrosion coating 2.

[0095] like Figure 2 D and Figure 4 A~ Figure 4As shown in C, in the etching step, the portion of the metal sheet 17 exposed from the corrosion resistant coating 2 is etched while the resist laminate 23 is moved.

[0096] In the etching step, for example, an etching device 25 is used.

[0097] The etching device 25 is arranged between the delivery roller 15 and the winding roller 16. The etching device 25 has a discharge portion 26. The discharge portion 26 is arranged along the width direction. Specifically, the discharge portion 26 has a plurality of discharge ports 27, and the plurality of discharge ports 27 are arranged at intervals in an orthogonal direction that is orthogonal to the relative direction of the delivery roller 15 and the winding roller 16 and the thickness direction of the anti-corrosion laminate 23. The above-mentioned relative direction corresponds to the MD direction, and also corresponds to the length direction of the anti-corrosion laminate 23. In addition, the above-mentioned orthogonal direction corresponds to the TD direction, and also corresponds to the width direction of the anti-corrosion laminate 23. In addition, the discharge portion 26 is, for example, arranged at a position in the etching device 25 that is closer to the thickness direction of the anti-corrosion laminate 23 than the predetermined position where the anti-corrosion laminate 23 is conveyed. In addition, the plurality of discharge ports 27 are configured to be able to continuously discharge the etching liquid relative to the metal sheet 17.

[0098] like Figure 4 A and Figure 4 As shown by the thick arrow in B, in the etching process, the resist stack 23 is fed from the feed roller 15 toward the etching device 25. In addition, the direction in which the resist stack 23 is fed (the conveying direction as an example of the moving direction) is along one end edge 4 in the short side direction and the other end edge 5 in the short side direction of the support sheet 6 in the resist stack 23.

[0099] The resist stack 23 is fed from the feed roller 15 toward the etching device 25 in a state where both the first resist sheet 21 and the second resist sheet 22 are tilted with respect to the conveyance direction (an example of the moving direction) of the resist stack 23 .

[0100] like Figure 4 B and Figure 4 As shown by the dotted arrow C, the etching liquid is continuously discharged from the plurality of discharge ports 27 toward the resist stack 23 at the same time.

[0101] As the etching liquid, there can be mentioned a chemical solution which corrodes (etches, dissolves) the material of the metal sheet 17 but does not corrode the corrosion-resistant coating 2 and the support sheet 6 .

[0102] Then, the etching liquid comes into contact with the surface on one side in the thickness direction of the portion of the metal sheet 17 exposed from the corrosion resistant coating 2 , and etching is performed from this surface toward the other side in the thickness direction.

[0103] Specifically, the first resist sheet 21 and the second resist sheet 22 are both tilted relative to the conveying direction of the resist stack 23, and the etching liquid is discharged from the plurality of discharge ports 27 while the resist stack 23 is conveyed. Figure 2 C' and Figure 4 As shown by the solid arrow of A, the etching liquid strongly collides with the first resist outer side surface 51 of the first resist sheet 31 on one side, and then quickly etches the metal sheet 17 near the downstream of the conveying direction. At the same time, the etching liquid strongly collides with the second resist outer side surface 52 of the second resist sheet 32 ​​on one side, and then quickly etches the metal sheet 17 near the downstream of the conveying direction.

[0104] In addition, if Figure 2 C' and Figure 4 As shown by the dotted arrow of A, in the first resist sheet 31 on one side, a part of the etching liquid that collides with the first resist outer side surface 51 passes over the first resist upper surface 55 and reaches the vicinity of the upstream side of the first resist inner side surface 53 in the conveying direction. Compared with the collision with the first resist outer side surface 51 described above, the etching liquid contacts the first resist inner side surface 53 more slowly. Therefore, the etching liquid slowly etches the portion of the metal sheet 17 located near the upstream side of the first resist inner side surface 53 in the conveying direction. At the same time, in the second resist sheet 32 ​​on one side, a part of the etching liquid that collides with the second resist outer side surface 52 passes over the second resist upper surface 56 and reaches the vicinity of the upstream side of the second resist inner side surface 54 in the conveying direction. Compared with the collision with the second resist outer side surface 52 described above, the etching liquid contacts the second resist inner side surface 54 more slowly. Therefore, the etching liquid slowly etches the portion of the metal sheet 17 located near the upstream side of the second resist inner side surface 54 in the conveying direction.

[0105] After the etching liquid flows along the second resist outer side surface 52 of the second resist sheet 32 ​​on one side, it bypasses the first corner 81 between the second resist sheet 32 ​​on one side and the first resist sheet 33 on the other side. The etching liquid slowly etches the portion of the metal-based sheet 17 located near the upstream of the conveying direction of the first resist sheet 33 on the other side. At the same time, after the etching liquid flows along the first resist outer side surface 51 of the first resist sheet 31 on one side, it bypasses the second corner 82 (the corner opposite to the first corner 81) between the first resist sheet 31 on one side and the second resist sheet 34 on the other side. The etching liquid slowly etches the portion of the metal-based sheet 17 located near the upstream of the conveying direction of the second resist sheet 34 on the other side.

[0106] On the other hand, the etching liquid that has passed the second resist sheet 32 ​​on one side collides with the first resist sheet 33 on the other side, and etches the portion of the metal sheet 17 that is located near the downstream in the conveying direction of the first resist sheet 33 on the other side. In addition, a part of the etching liquid passes over the first resist sheet 33 on the other side, and etches the portion of the metal sheet 17 that is located near the upstream in the conveying direction of the first resist sheet 33 on the other side. At the same time, the etching liquid that has passed over the first resist sheet 31 on one side collides with the second resist sheet 34 on the other side, and etches the portion of the metal sheet 17 that is located near the downstream in the conveying direction of the second resist sheet 34 on the other side. In addition, a part of the etching liquid passes over the second resist sheet 34 on the other side, and etches the portion of the metal sheet 17 that is located near the upstream in the conveying direction of the second resist sheet 34 on the other side.

[0107] like Figure 2 As shown in D, the metal-based portion 9 having substantially the same plan view shape as the corrosion-resistant coating 2 having substantially the rectangular frame shape in plan view (ie, substantially the rectangular frame shape in plan view) is thereby formed.

[0108] The resist laminate 23 having the metal-based portion 9 is subjected to appropriate treatments such as cleaning and drying, and then taken up by the take-up roll 16 .

[0109] Then, if Figure 3 As shown in E, in the resist removal step, the corrosion resistant coating 2 is removed by, for example, stripping or the like.

[0110] Then, if Figure 3 As shown in F, in the covering step, the covering layer 14 is arranged on one side in the thickness direction of the support sheet 6 so as to cover the surface and side surfaces of the metal-based portion 9 on one side in the thickness direction.

[0111] Then, if Figure 3 As shown in FIG. 1 , in the outer shape processing step, the support sheet 6 is outer-shaped, and an opening 13 is formed in the support sheet 6 in a manner that penetrates in the thickness direction. At the same time, the joint 10 (see FIG. 1 ) is formed. Figure 1 ), a plurality of wiring circuit boards 7 are supported on the support sheet 6 in a separable manner by means of the joint 10. As the outer shape processing of the support sheet 6, for example, etching, cutting (cutting) and the like can be used.

[0112] In this way, the wired circuit board assembly sheet 1 including the support sheet 6 and the plurality of wired circuit boards 7 is manufactured.

[0113] Then, cut off the joint portion 10, such as Figure 1 As shown in the lower right figure of , the wired circuit board 7 is separated from the supporting sheet 6 to obtain the wired circuit board 7.

[0114] Furthermore, in the wiring circuit board assembly sheet 1, the metal part 9 is formed by conveying the support sheet 6 to the etching device 25 along the longitudinal direction extending from the one end edge 4 in the short side direction, while discharging the etching liquid from the discharge part 26, which is arranged along the TD direction orthogonal to the MD direction corresponding to the longitudinal direction. Therefore, the first metal sheet 11 and the second metal sheet 12 are both inclined relative to the MD direction, and therefore also inclined relative to the TD direction. Therefore, the first metal sheet 11 and the second metal sheet 12 are also inclined relative to the discharge part 26. Then, the first metal sheet 11 and the second metal sheet 12 are formed under the same etching conditions as described above.

[0115] In detail, Figure 4 As shown in FIG. 1A, since both the first resist sheet 31 and the second resist sheet 32 ​​are inclined relative to the discharge portion 26, the momentum of the etching liquid colliding with the first resist outer side 51 of the first resist sheet 31 and the momentum of the etching liquid colliding with the second resist outer side 52 of the second resist sheet 32 ​​are of the same degree. Therefore, the etching rate of the portion of the metal sheet 17 located near the downstream of the first resist outer side 51 in the conveying direction and the etching rate of the portion of the metal sheet 17 located near the downstream of the second resist outer side 52 in the conveying direction are of the same degree.

[0116] Therefore, if Figure 2 As shown in D, the first outer side surface 63 of the first metal piece 61 and the third outer side surface 73 of the second metal piece 71 have the same positional accuracy. Therefore, the positional accuracy of the outer shapes of the first metal piece 61 and the second metal piece 71 can be matched.

[0117] And, if Figure 4 As shown in A, the etching liquid flows along the second anti-etching outer surface 52 of the second anti-etching sheet 32 ​​on one side and then bypasses the first corner 81 to slowly etch the portion of the metal sheet 17 located upstream of the conveying direction of the first anti-etching sheet 33 on the other side (the other side of the second direction).

[0118] In addition, the etching liquid flows along the first anti-etching outer surface 51 of the first anti-etching sheet 31 on one side and then bypasses the second corner 82 to slowly etches the portion of the metal sheet 17 located upstream in the conveying direction (the other side of the first direction) of the second anti-etching sheet 34 on the other side.

[0119] The slowness of etching the portion of the metal sheet 17 located near the upstream of the conveying direction of the first anti-etching sheet 33 on the other side and the slowness of etching the portion of the metal sheet 17 located near the upstream of the conveying direction of the second anti-etching sheet 34 on the other side are the same, so the etching speeds of the two are also the same.

[0120] Therefore, if Figure 1As shown, the position accuracy of the second outer side surface 66 of the other side first metal sheet 62 and the position accuracy of the fourth outer side surface 76 of the other side second metal sheet 72 are the same. Therefore, the position accuracy of the outer shapes of the other side first metal sheet 62 and the other side second metal sheet 72 can be matched.

[0121] In short, the outer shapes of the first metal sheet 11 and the second metal sheet 12 are formed with the same accuracy. As a result, the wired circuit board assembly sheet 1 can include the wired circuit board 7 having the metal-based portion 9 with excellent positional accuracy of the outer shape.

[0122] On the other hand, Figure 5 A and Figure 5 As shown in FIG. 1B , in a comparative example in which the first direction is along the short side direction and the second direction is along the length direction, the first direction is orthogonal to the MD direction. Therefore, in the etching process, the etching liquid collides most strongly with the first resist outer side surface 51 of the first resist sheet 31 on one side, and the portion of the metal sheet 17 located near the downstream of the conveying direction of the first resist sheet 31 on one side is etched at the fastest etching speed.

[0123] Then, the etching liquid that has passed through both ends of the first resist sheet 31 on one side relatively slowly contacts the outer side surfaces of the two second resist sheets 22. Therefore, the etching rate of the portion of the metal sheet 17 located near the outer side of the second resist sheet 22 is slower than the etching rate of the portion of the metal sheet 17 located near the downstream side of the conveying direction of the first resist sheet 31 on one side.

[0124] Then, the etching liquid that further bypasses the upstream end of the conveying direction of the two second resist sheets 22 comes into contact with the other first resist sheet 33 most slowly. Therefore, the etching speed of the portion of the metal sheet 17 located near the upstream of the conveying direction of the other first resist sheet 33 is slower than the etching speed of the portion of the metal sheet 17 located near the outer side of the second resist sheet 22, that is, the slowest.

[0125] So, if Figure 5 As shown in FIG. 3 , the first outer side surface 63 of the first metal sheet 61 (the first metal sheet 11) on one side and the second metal sheet 71 on one side and the second metal sheet 72 on the other side (the two second metal sheets 12) (at Figure 5 C only shows that the position accuracy of the outer surface of the second metal piece 72 on the other side does not match.

[0126] Furthermore, the positional accuracy of the outer side surfaces of the one second metal piece 71 and the other second metal piece 72 (the two second metal pieces 12 ) and the second outer side surface 66 of the other first metal piece 62 (the other first metal piece 11 ) does not match.

[0127] Therefore, the outer shapes of the first metal piece 11 and the second metal piece 12 are formed with completely different precision.

[0128] On the other hand, in the method for producing the wired circuit board assembly sheet 1, referring to Figure 4 As shown in A, in the etching process, while the first resist sheet 21 and the second resist sheet 22 are tilted relative to the conveying direction of the resist stack 23, the portion of the metal sheet 17 exposed from the anti-corrosion coating 2 is etched while the resist stack 23 is moved. Therefore, the first resist sheet 21 and the second resist sheet 22 are tilted relative to the conveying direction, that is, the MD direction. Therefore, they are also tilted relative to the arrangement direction of the plurality of discharge ports 27. The first metal sheet 11 and the second metal sheet 12 are formed under the same conditions using the etching liquid discharged from the discharge portion 26 of the etching device 25. Therefore, the first metal sheet 11 and the second metal sheet 12 can be formed with the same shape accuracy. As a result, a wiring circuit board assembly sheet 1 having a metal-based portion 9 with excellent shape accuracy can be manufactured.

[0129] In addition, the etching liquid that has passed the second resist sheet 32 ​​etches the portion of the metal sheet 17 located near the upstream of the second resist sheet 32 ​​in the conveying direction, and then collides with the first resist sheet 33 on the other side, and directly and strongly etches the portion of the metal sheet 17 located near the downstream of the first resist sheet 33 on the other side. In addition, the etching liquid that has passed the first resist sheet 31 etches the portion of the metal sheet 17 located near the upstream of the first resist sheet 31 on the one side, and then collides with the second resist sheet 34 on the other side, and directly and strongly etches the portion of the metal sheet 17 located near the downstream of the second resist sheet 34 on the other side.

[0130] Furthermore, in the manufacturing method, in the resist placement step, the second direction length W3 of the first resist sheet 21 (the first resist sheet 31 on one side and the first resist sheet 33 on the other side) and the first direction length W4 of the second resist sheet 22 (the second resist sheet 32 ​​on one side and the second resist sheet 34 on the other side) are set to be the same. Therefore, in the etching step, the condition for the etching liquid to pass over the first resist sheet 31 on one side and the condition for the etching liquid to pass over the second resist sheet 32 ​​on one side can be set to be the same, and the condition for the etching liquid to collide with the first resist sheet 33 on the other side and the condition for the etching liquid to collide with the second resist sheet 34 on the other side can be set to be the same.

[0131] Therefore, the etching of the portion of the metal sheet 17 located near the upstream of the first resist sheet 31 on one side in the conveying direction and the etching of the portion of the metal sheet 17 located near the upstream of the second resist sheet 32 ​​on one side in the conveying direction can be performed under the same conditions. At the same time, the etching of the portion of the metal sheet 17 located near the downstream of the first resist sheet 33 on the other side in the conveying direction and the etching of the portion of the metal sheet 17 located near the downstream of the second resist sheet 34 on the other side in the conveying direction can be performed under the same conditions.

[0132] Therefore, the second direction length W1 of the first metal sheet 61 covered by the first anti-etching sheet 31 on one side and the first direction length W2 of the second metal sheet 71 covered by the second anti-etching sheet 32 ​​on one side can be set to be the same. At the same time, the second direction length W1 of the first metal sheet 62 on the other side covered by the first anti-etching sheet 33 on the other side and the first direction length W2 of the second metal sheet 72 on the other side covered by the second anti-etching sheet 34 on the other side can be set to be the same.

[0133] In short, the second direction length W1 of the first metal sheet 11 (first sheet) covered by the first resist sheet 21 and the first direction length W2 of the second metal sheet 12 (second sheet) covered by the second resist sheet 22 can be made the same.

[0134] Furthermore, in the wired-circuit-board assembly sheet 1 , since the metal-based portion 9 includes wires, desired electrical characteristics can be exhibited.

[0135] Furthermore, the method for manufacturing the wired circuit board 7 manufactures the wired circuit board assembly sheet 1 described above and then separates the wired circuit board 7 from the support sheet 6, so that the wired circuit board 7 having the metal-based portion 9 with excellent outer shape accuracy can be manufactured.

[0136] The use of such a wiring circuit board 7 is not particularly limited and can be applied to various fields. The wiring circuit board 1 can be used in various applications such as a wiring circuit board for electronic equipment (a wiring circuit board for electronic components) and a wiring circuit board for electric equipment (a wiring circuit board for electric components). Examples of wiring circuit substrates for electronic devices and wiring circuit substrates for electrical devices include wiring circuit substrates for sensors such as position information sensors, obstacle detection sensors, and temperature sensors; wiring circuit substrates for transport vehicles such as automobiles, trains, airplanes, and work vehicles; wiring circuit substrates for video equipment such as flat panel displays, flexible displays, and projection-type video equipment; wiring circuit substrates for communication relay equipment such as network equipment and large-scale communication equipment; wiring circuit substrates for information processing terminals such as computers, tablet computers, smart phones, and home game consoles; wiring circuit substrates for movable equipment such as unmanned aircraft and robots; wiring circuit substrates for medical equipment such as wearable medical devices and medical diagnostic equipment; wiring circuit substrates for electrical equipment such as refrigerators, washing machines, vacuum cleaners, and air conditioners; wiring circuit substrates for video electronic equipment such as digital cameras and DVD recorders.

[0137] Modifications

[0138] In the following modifications, the same reference numerals are used for the same components and processes as those in the above-mentioned embodiment, and detailed description thereof is omitted. In addition, each modification can have the same effects as those in the embodiment except for the contents specially described. Furthermore, the embodiment and the modification can be appropriately combined.

[0139] In one embodiment, the metal sheet 17 is wet-etched using an etching solution in the etching step, but dry etching such as laser processing may also be performed. In this case, the laser irradiation device (not shown) has a laser irradiation unit (not shown) capable of scanning in the TD direction.

[0140] like Figure 1 As shown, in one embodiment, the width W1 of the first metal sheet 11 and the width W2 of the second metal sheet 12 are the same, but may also be as follows Figure 6 Different as shown in B.

[0141] exist Figure 6In the modified example shown in B, the width W1A of the first metal sheet 61 is different from the width W2A of the second metal sheet 71. For example, the width W1A of the first metal sheet 61 is larger than the width W2A of the second metal sheet 71. Alternatively, the opposite may be true, which is not shown.

[0142] exist Figure 6 In the modified example shown in B, the width W1B of the other side first metal sheet 62 is different from the width W2B of the other side second metal sheet 72. For example, the width W1B of the other side first metal sheet 62 is larger than the width W2B of the other side second metal sheet 72. Alternatively, the opposite situation may be possible, which is not shown in the figure.

[0143] In addition, if Figure 6 As shown in FIG. 1A , the widths W1 of the two first metal sheets 11 may be different from each other. The width W1A of the first metal sheet 61 on one side is different from the width W1B of the first metal sheet 62 on the other side. For example, the width W1A of the first metal sheet 61 on one side is larger than the width W1B of the first metal sheet 62 on the other side. Alternatively, the opposite situation may be possible, which is not shown in the figure.

[0144] In addition, Figure 6 In the modified example shown in A, the widths W2 of the two first metal sheets 11 may be different from each other. The width W2A of the second metal sheet 71 on one side is different from the width W2B of the second metal sheet 72 on the other side. For example, the width W2A of the second metal sheet 71 on one side is larger than the width W2B of the second metal sheet 72 on the other side. Alternatively, the opposite situation may be possible, which is not shown in the figure.

[0145] In addition, if Figure 3 As shown by the solid line of G, in one embodiment, the support portion 8 is a single layer, but it can also be a multi-layer. In this modified example, as shown in FIG. Figure 3 As shown by the imaginary line G, two layers are preferred.

[0146] Specifically, if Figure 8 As shown in FIG. 1, the support portion 8 is a two-layer structure, for example, a metal support portion 28 and a resin support portion 29 as an example of a support layer are sequentially provided toward one side in the thickness direction. In this modification, it is preferred that the support portion 8 only has the metal support portion 28 and the resin support portion 29.

[0147] In this modification, an example of the metal-based portion of the present invention is the metal-based portion 9 , and is the metal supporting portion 28 .

[0148] like Figure 2 C~ Figure 2 As shown in D, in one embodiment, the resist disposing step and the etching step are each performed once, but they may be performed a plurality of times, for example.

[0149] For example, Figure 7 B~ Figure 7 As shown in C, in the first etching step, the metal-based portion 9 is formed from the metal-based sheet 17, and then, as shown in FIG. Figure 8 G~ Figure 8 As shown in H, the metal supporting portion 28 is formed from the metal supporting sheet 30 in the second etching step.

[0150] In this modification, for example, Figure 7 As shown in FIG. 1A, first, a three-layer substrate 48 is prepared, and the three-layer substrate 48 has a metal support sheet 30 as an example of a support sheet, an insulating sheet 46, and a metal sheet 17 in order toward one side in the thickness direction. The insulating sheet 46 and the metal sheet 17 both have the same top view shape as the metal support sheet 30. As a material of the insulating sheet 46, the resin exemplified in the support sheet 6 of one embodiment can be cited. The three-layer substrate 48 has a short side direction one end edge 4 and a short side direction other end edge 5 parallel to each other.

[0151] Then, if Figure 7 As shown in FIG. B, the anti-corrosion coating 2 is arranged on both sides of the thickness direction of the three-layer substrate 48. Specifically, the anti-corrosion coating 2 is formed in the above-mentioned pattern on one side of the metal sheet 17 in the thickness direction, and the anti-corrosion coating 2 is arranged on the entire surface of the other side of the metal sheet 17 in the thickness direction.

[0152] In this way, the first anti-corrosion laminate 39 including the three-layer base material 48 and the anti-corrosion coating layer 2 is produced.

[0153] Then, if Figure 7 As shown in FIG. 3 , the first etching process is performed by etching the portion of the metal-based sheet 17 exposed from the anti-corrosion coating 2 while the first anti-corrosion sheet 21 and the second anti-corrosion sheet 22 of the anti-corrosion coating 2 are tilted relative to the conveying direction, while the first anti-corrosion laminate 39 is conveyed. Thus, the metal-based portion 9 having a substantially rectangular frame shape when viewed from above is formed.

[0154] Then, if Figure 7 As shown in D, the anti-corrosion coating 2 is removed.

[0155] like Figure 7 As shown in FIG. 8E, the resin support portion 29 is formed from the insulating sheet 46 by, for example, cutting (cutting) or etching.

[0156] like Figure 8 As shown in F, next, the cover layer 14 is arranged on one side in the thickness direction of the resin support portion 29 so as to cover the surface and side surfaces of the metal-based portion 9 on one side in the thickness direction.

[0157] Then, if Figure 8 G~ Figure 8As shown in FIG. 1 , the second resist disposing step and the etching step are sequentially performed.

[0158] like Figure 8 As shown in FIG. 1 , specifically, first, the second anti-corrosion coating layer 24 having the third anti-corrosion sheet 36, the fourth anti-corrosion sheet 37, and the fifth anti-corrosion portion 38 is arranged on the surfaces of both sides in the thickness direction of the metal support sheet 30. The second anti-corrosion coating layer 24 arranged on the surface of one side in the thickness direction of the metal support sheet 30 and the second anti-corrosion coating layer 24 arranged on the surface of the other side in the thickness direction of the metal support sheet 30 have the same shape when projected in the thickness direction. In addition, the third anti-corrosion sheet 36 and the fourth anti-corrosion sheet 37 arranged on the surface of one side in the thickness direction of the metal support sheet 30 cover the side surface of the resin support portion 29, the side surface of the cover layer 14, and the surface of one side in the thickness direction. Thus, the second anti-corrosion laminate 49 is manufactured, and the second resist arrangement step is performed.

[0159] Then, if Figure 8 As shown in FIG. 1 , the third resist sheet 36 and the fourth resist sheet 37 of the second anti-corrosion coating 24 are oriented relative to the conveying direction ( Figure 7 The second etching process is performed by conveying the second anti-corrosion laminate 49 while the portion of the metal support sheet 30 exposed from the second anti-corrosion coating 24 is etched. Thus, a metal support portion 28 having a substantially rectangular frame shape when viewed from above is formed.

[0160] Then, if Figure 8 As shown in FIG. 1 , the second anti-corrosion coating 24 is removed.

[0161] In this way, the wired circuit board assembly sheet 1 including a plurality of wired circuit boards 7 is manufactured.

[0162] The wiring circuit board 7 includes a metal support portion 28, a resin support portion 29 disposed on one surface in the thickness direction of the metal support portion 28, a metal tie portion 9 disposed on one surface in the thickness direction of the resin support portion 29, and a cover layer 14 disposed on one surface in the thickness direction of the resin support portion 29 so as to cover the one surface in the thickness direction and the side surface of the metal tie portion 9. The wiring circuit board 7 includes a second opening portion 41 penetrating in the thickness direction.

[0163] In the wiring circuit board assembly sheet 1, the metal support portion 28 is included in the support portion 8. Therefore, the metal support portion 28 can reliably support the metal tie portion 9 via the resin support portion 29, and can diffuse the heat generated in the metal tie portion 9 based on a predetermined thermal conductivity. In particular, since the wiring circuit board 7 has the second opening portion 41, the thermal conductivity can be further improved by convection based on the flow of air in the second opening portion 41.

[0164] In the etching process of the above-mentioned embodiment and the modified example, at least the metal sheet 17 is etched. Figure 2 In one embodiment shown in D, the metal sheet 17 is etched. Figure 7 E and Figure 8 In the modification shown in FIG. 1, the metal sheet 17 and the metal support sheet 30 are etched. However, for example, the metal sheet 17 may not be etched, but only the metal support sheet 30 may be etched to form only the metal support portion 28 as an example of a metal portion, which is not shown in the figure.

[0165] In addition, for example, the wired circuit board assembly sheet 1 can also be manufactured by a single sheet method instead of a roll-to-roll method.

[0166] And, if Fig. 9 As shown in A, a two-layer substrate 23 having a predetermined length and a substantially rectangular shape in a plan view can be conveyed to the etching device 25 at an angle with respect to both the conveying direction and the direction along the discharge unit 26 to perform the second step.

[0167] The two-layer base material 23 has one end edge 4 in the short-side direction and the other end edge 5 in the short-side direction, and also has one end edge 43 in the length direction and the other end edge 44 in the length direction. In the two-layer base material 23, the one end edge 4 in the short-side direction and the other end edge 5 in the short-side direction have the same length. In addition, the one end edge 43 in the length direction and the other end edge 44 in the length direction have the same length and connect the one end edge 4 in the short-side direction and the other end edge 5 in the short-side direction.

[0168] The rectangular frame shape of the corrosion resistant coating 2 is arranged straightly in parallel with respect to the longitudinal direction of the two-layer substrate 23. Specifically, the first resist sheet 21 is parallel to one end 4 of the short side of the two-layer substrate 23. The second resist sheet 22 is parallel to one end 43 of the two-layer substrate 23 in the longitudinal direction.

[0169] In the second step, the resist stack 23 is conveyed to the etching device 25 with the first resist sheet 21 tilted relative to the conveying direction and the direction along the discharge unit 26 and the second resist sheet 22 also tilted relative to the conveying direction and the direction along the discharge unit 26 .

[0170] After the second step is performed, in the obtained wiring circuit board assembly sheet 1, a plurality of wiring circuit boards 7 are arranged in parallel and straight with respect to the longitudinal direction of the wiring circuit board assembly sheet 1. Specifically, the first end edge 18 of the wiring circuit board 7 is parallel to one end edge 4 in the short side direction of the wiring circuit board assembly sheet 1. The second end edge 19 of the wiring circuit board 7 is parallel to one end edge 43 in the longitudinal direction of the wiring circuit board assembly sheet 1.

[0171] In addition, the above invention is provided as an exemplary embodiment of the present invention, but this is only an example and should not be interpreted as limiting. Modifications of the present invention that are clear to those skilled in the art are included in the above claims.

[0172] Industrial Applicability

[0173] The wired circuit board can be used in various applications such as a wired circuit board for electronic equipment and a wired circuit board for electric equipment.

[0174] Description of Reference Numerals

[0175] 1. Wiring circuit substrate assembly sheet; 2. Anti-corrosion coating; 4. One end edge in the short side direction; 5. The other end edge in the short side direction; 6. Support sheet; 7. Wiring circuit substrate; 9. Metal system; 11. First metal sheet; 12. Second metal sheet; 17. Metal system sheet; 21. First anti-etching sheet; 22. Second anti-etching sheet; 24. Second anti-corrosion coating; 28. Metal support; 29. ​​Resin support; 30. Metal support sheet; 31. First anti-etching sheet on one side; 32. Second anti-etching sheet on one side; 33. First anti-etching sheet on the other side; 34. Second anti-etching sheet on the other side; 39. First anti-etching laminate; 49. Second anti-etching laminate.

Claims

1. A wiring circuit board assembly sheet, characterized in that: The wiring circuit substrate assembly sheet has: a supporting sheet having two parallel end edges; and a plurality of wiring circuit substrates, the plurality of wiring circuit substrates being arranged on the support sheet at intervals from each other, The wiring circuit substrate has a substantially rectangular frame-shaped metal part. The metal system comprises: a first sheet extending along a first direction orthogonal to the thickness direction of the supporting sheet; and a second sheet extending along a second direction perpendicular to the thickness direction and the first direction, The first piece and the second piece are both inclined with respect to the end edge of the supporting piece.

2. The wired circuit board assembly sheet according to claim 1, wherein: The metal-tied portion includes wiring.

3. The wired circuit board assembly sheet according to claim 1, wherein: The metal-based portion includes a support layer.

4. A method for producing a wiring circuit board assembly sheet, comprising: a supporting sheet and a plurality of wiring circuit boards arranged on the supporting sheet at intervals from each other; The method for producing a wired circuit board assembly sheet is characterized by comprising: A first step, in which a substantially rectangular frame-shaped anti-corrosion coating is disposed on a metal sheet to produce an anti-corrosion laminate having the metal sheet and the anti-corrosion coating, wherein the anti-corrosion coating includes a first anti-corrosion sheet and a second anti-corrosion sheet, the first anti-corrosion sheet being arranged along a first direction perpendicular to the thickness direction of the support sheet, and the second anti-corrosion sheet being arranged along a second direction perpendicular to the thickness direction and the first direction; and A second step, in which the portion of the metal sheet exposed from the anti-corrosion coating is etched while the anti-corrosion laminate is moved, thereby forming a metal-based portion having a substantially rectangular frame shape and including a first metal sheet covered by the first anti-corrosion sheet and a second metal sheet covered by the second anti-corrosion sheet, thereby manufacturing the wiring circuit substrate having the metal-based portion. In the second step, the portion of the metal sheet exposed from the anti-corrosion coating layer is etched while the resist stack is moved in a state where both the first resist sheet and the second resist sheet are tilted relative to the moving direction of the resist stack.

5. The method for producing a wired circuit board assembly sheet according to claim 4, wherein: In the first step, the length of the first resist sheet in the second direction and the length of the second resist sheet in the first direction are set to be the same.

6. A method for manufacturing a wiring circuit substrate, characterized in that: The method for manufacturing the wiring circuit substrate comprises the following steps: Manufacturing a wiring circuit substrate assembly sheet using the method for manufacturing a wiring circuit substrate assembly sheet according to claim 4; and The wired circuit board is separated from the supporting sheet.

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