Substrate processing device and substrate conveying device
By designing a multi-hand conveying robot and multi-layer process chamber structure in the substrate cleaning device, space limitations and bottleneck problems are solved, and the efficiency and output of the substrate processing device are improved.
Patent Information
- Application Number
- CN202010677474.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-07-17
- Filing Date
- 2020-07-14
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2040-07-14
AI Technical Summary
The existing substrate cleaning device requires two transfer robots and buffer chambers, resulting in space loss and bottlenecks, limiting the number and production efficiency of process chambers.
A substrate processing device is designed, by setting multiple process chambers on both sides of the conveying channel and using a movable and rotatable multi-hand conveying robot, the substrate is transported and processed at different heights, reducing the transmission equipment's The number of buffer chambers is omitted and the number of process chambers is increased.
Increase the number of process chambers in the same space, improve productivity, eliminate bottlenecks, and achieve higher throughput and yield.
Smart Images

Figure CN112242336B_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0086540, filed on Jul. 17, 2019, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field
[0003] Embodiments of the inventive concepts described herein relate to a substrate processing apparatus. Background Art
[0004] Generally, in a semiconductor manufacturing process, a fine pattern arrangement is formed by repeatedly performing various processes such as deposition of insulating films and metal materials, etching, photoresist coating, development, and ashing, etc. Foreign matter that is not completely removed by the etching or ashing process remains on the substrate. A wet cleaning process using deionized water or chemicals is used as a process for removing foreign matter.
[0005] The substrate cleaning device supplies chemicals or deionized water to the substrate through a nozzle above the substrate while the substrate is rotated by a motor after the substrate is clamped to a substrate chuck in a small chamber capable of processing a single substrate. The chemicals or deionized water are spread on the substrate by the rotation force of the substrate, and thus foreign matter adhering to the substrate is removed.
[0006] Figure 1 1 is a view showing an arrangement structure of a substrate cleaning device in the related art. The substrate cleaning device includes an index module 12 , a buffer unit 13 , and a process module 14 .
[0007] In the substrate cleaning apparatus, in the case where there are a maximum of four towers and each tower is composed of three process chambers, the process module 14 may include a total of twelve process chambers.
[0008] In addition, the substrate cleaning apparatus requires an index robot for transferring substrates in the index module 12 and a main transfer robot for transferring substrates in the process module 14. A buffer chamber playing an intermediate role in transferring substrates between the index robot and the main transfer robot is essential.
[0009] Since the substrate cleaning apparatus requires two transfer robots and a buffer chamber as described above, a space loss and a bottleneck phenomenon may occur. Summary of the invention
[0010] Embodiments of the inventive concept provide a substrate treating apparatus and a substrate transferring apparatus for increasing the number of process chambers installed in an existing tool area.
[0011] Embodiments of the inventive concept provide a substrate processing apparatus and a substrate transferring apparatus for maximizing throughput of the apparatus.
[0012] The technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept belongs from the following description.
[0013] According to an exemplary embodiment, a substrate processing apparatus includes: a plurality of load ports on which carriers having substrates received therein are placed; a plurality of process chambers on which processes are performed on the substrates; and a transfer robot that transfers the substrates between the load ports and the process chambers. The transfer robot is movable along a transfer passage having a longitudinal direction formed along a first direction, the load ports and the process chambers being arranged along the first direction on one side and opposite sides of the transfer passage, and the transfer robot transfers the substrates between the carriers placed on the load ports and the process chambers.
[0014] A substrate entrance / exit opening of a first process chamber disposed on the one side of the transfer channel and a substrate entrance / exit opening of a second process chamber disposed on the opposite side of the transfer channel in the process chamber may be disposed at different heights.
[0015] An upper end of a first process chamber disposed on the one side of the transfer passage and an upper end of a second process chamber disposed on the opposite side of the transfer passage among the process chambers may be disposed at different heights.
[0016] The transfer robot may include a plurality of hands disposed at different heights, and the plurality of hands may simultaneously transfer the substrate into or out of the first process chamber and the second process chamber.
[0017] The plurality of hands may be rotatable to face a direction so as to simultaneously transfer the substrates into or out of a process chamber or a carrier placed on a load port.
[0018] A height difference between the substrate inlet / outlet opening of the first process chamber and the substrate inlet / outlet opening of the second process chamber, or a height difference between the upper end of the first process chamber and the upper end of the second process chamber, may correspond to a height difference between adjacent hands among the plurality of hands.
[0019] The load ports may be disposed to face each other with the transfer passage between the load ports.
[0020] Each loading port may include: a vertical frame having a port door that opens or closes a door of a carrier; a mounting table on which the carrier is placed and which is movable to a position where the door of the carrier is opened or closed by the port door; and a moving member that moves the carrier from a first position to the mounting table, where the carrier is transferred from a carrier transfer device.
[0021] The moving member may include a moving stage capable of rotating and sliding so that the door of the carrier faces the port door of the load port.
[0022] The moving stage may be located below a path along which the carrier transport device moves.
[0023] A transfer robot for transferring a substrate between a carrier placed on a loading port and a process chamber comprises: a first hand and a second hand arranged at different heights, wherein the first hand transfers the substrate to one of a first process chamber and a second process chamber, or transfers the substrate out of one of the first process chamber and the second process chamber, the first process chamber and the second process chamber are arranged to be opposite to each other relative to a transfer channel, and the second hand and the first hand simultaneously transfer the substrate to the other process chamber of the first process chamber and the second process chamber, or transfer the substrate out of the other process chamber.
[0024] One of the first hand and the second hand may be rotatable such that the first hand and the second hand face one direction to simultaneously transfer the substrate into or out of one of the first process chamber and the second process chamber.
[0025] A height difference between the first hand and the second hand may correspond to a height difference between a substrate inlet / outlet opening of the first process chamber and a substrate inlet / outlet opening of the second process chamber.
[0026] Each of the first hand and the second hand may include a plurality of transfer hands. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The above and other objects and features will become apparent from the following description with reference to the following drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:
[0028] Figure 1 is a view showing an arrangement structure of a substrate cleaning device in the related art;
[0029] Figure 2 is a perspective view showing a substrate processing apparatus according to an embodiment of the inventive concept;
[0030] Figure 3 is a plan view illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;
[0031] Figure 4 When looking in direction AA Figure 3 A cross-sectional view of a device;
[0032] Figure 5 It shows Figure 3 A three-dimensional diagram of a transfer robot in a device;
[0033] Figure 6 yes Figure 5 A side view of the transfer robot shown in ;
[0034] Figure 7 It shows Figure 2 a view of a loading port in a device;
[0035] Figure 8 It shows Figure 7 A side view of the load port shown in ;
[0036] Figures 9 to 12 is a view showing a process step of loading a carrier onto a load port; and
[0037] Fig.13 is a view showing another embodiment of a transfer robot. DETAILED DESCRIPTION
[0038] Since the inventive concept allows for various changes and numerous embodiments, exemplary embodiments will be shown in the drawings and described in detail in the written specification. However, this is not intended to limit the inventive concept to a particular mode of practice, and it should be understood that all changes, equivalents and substitutes that do not depart from the spirit and scope of the inventive concept are included in the inventive concept. In describing the inventive concept, when a detailed description related to a known function or configuration may obscure the subject matter of the inventive concept, the detailed description will be omitted.
[0039] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the scope of the inventive concept. Unless otherwise specified, terms in the singular may include plural forms. It should be understood that when used herein, terms such as "include", "comprise" and "have" specify the existence of stated features, numbers, steps, operations, components, parts or combinations thereof, but do not exclude the existence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.
[0040] Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used only to distinguish one component from other components.
[0041] Hereinafter, embodiments according to the inventive concept will be described in detail with reference to the accompanying drawings. In describing the embodiments with reference to the accompanying drawings, the same or corresponding components are provided with the same reference numerals in the drawings regardless of the reference numerals, and their repeated description will be omitted.
[0042] In this embodiment, the semiconductor wafer exemplifies the substrate. However, in addition to the semiconductor wafer, the substrate may be various types of substrates such as a photomask and a flat panel display panel, etc. In addition, in this embodiment, the substrate processing apparatus will be exemplified as an apparatus for performing a substrate cleaning process.
[0043] Figure 2 is a perspective view illustrating a substrate treating apparatus according to an embodiment of the inventive concept. Figure 3 is a plan view illustrating a substrate treating apparatus according to an embodiment of the inventive concept. Figure 4 When looking in direction AA Figure 3 A cross-sectional view of the device.
[0044] Reference Figures 2 to 4 , a substrate treating apparatus 1000 of the inventive concept may include an index module 100 , a process module 200 , and a transfer robot 900 .
[0045] The index module 100 and the process module 200 are sequentially arranged in a row. Hereinafter, the direction in which the index module 100 and the process module 200 are arranged is referred to as a first direction X. A direction perpendicular to the first direction X when viewed from above is referred to as a second direction Y, and a direction perpendicular to a plane including the first direction X and the second direction Y is referred to as a third direction Z.
[0046] The process module 200 may include a first process module 200-1, a second process module 200-2, and a transfer chamber 800. In the first process module 200-1 and the second process module 200-2, towers T are arranged along the longitudinal direction of the transfer chamber 800, and each tower T has process chambers 300 stacked on each other in the third direction Z. That is, the process chambers 300 may be arranged in an A×B array (A and B are natural numbers of 1 or more) on one side of the transfer chamber 800. Here, "A" is the number of process chambers 300 arranged along the first direction X, and "B" is the number of process chambers 300 arranged along the third direction Z. In the case where six or nine process chambers 300 are arranged on one side of the transfer chamber 800, the process chambers 300 may be arranged in a 2×3 or 3×3 array. The number of process chambers 300 may be increased or decreased.
[0047] In this embodiment, each tower T may have a structure in which three process chambers 300 are stacked on each other. Therefore, the first process module 200-1 may include a total of nine process chambers 300 that the transfer robot 900 can access. Like the first process module 200-1, the second process module 200-2 may include a total of nine process chambers 300 that the transfer robot 900 can access.
[0048] Substrate processing devices for performing a cleaning process on the substrate W may be respectively disposed in the process chamber 300. The substrate processing devices disposed in the process chamber 300 may have different structures depending on the type of cleaning process performed. Alternatively, the substrate processing devices in each process chamber 300 may have the same structure. In another case, the process chamber 300 may be divided into a plurality of groups. The substrate processing devices disposed in the process chambers 300 belonging to the same group may have the same structure. The substrate processing devices disposed in the process chambers 300 belonging to different groups may have different structures.
[0049] For example, in the case where the process chambers 300 are divided into two groups, the first group of process chambers 300 may be disposed in the first process module 200-1 located on one side of the transfer chamber 800, and the second group of process chambers 300 may be disposed in the second process module 200-2 located on the opposite side of the transfer chamber 800. Alternatively, the first group of process chambers 300 may be disposed in a lower layer, and the second group of process chambers 300 may be disposed in an upper layer on one side and the opposite side of the transfer chamber 800. The first group of process chambers 300 and the second group of process chambers 300 may be distinguished according to the type of chemicals used and the type of cleaning method.
[0050] The index module 100 may include a first load port 100 - 1 and a second load port 100 - 2 . The first load port 100 - 1 and the second load port 100 - 2 may be positioned to face each other with the transfer chamber 800 therebetween.
[0051] The process chamber 300 of the first process module 200-1 and the process chamber 300 of the second process module 200-2, which are arranged to face each other, may be arranged at different heights. For example, the height of the substrate inlet / outlet opening 301 of the process chamber 300 arranged in the first process module 200-1 may be different from the height of the substrate inlet / outlet opening 301 of the process chamber 300 arranged in the second process module 200-2. In other words, the height of the upper end of the process chamber 300 arranged in the first process module 200-1 may be different from the height of the upper end of the process chamber 300 arranged in the second process module 200-2. The height difference "t" between the process chamber 300 of the first process module 200-1 and the process chamber 300 of the second process module 200-2 may correspond to the height difference between adjacent hands among the plurality of hands.
[0052] The transfer robot 900 is provided in the transfer chamber 800 so as to be movable. The transfer robot 900 is used to transfer the substrate between the index module 100 and the process module 200 .
[0053] Figure 5 It shows Figure 3 a perspective view of a transfer robot in the device; and Figure 6 yes Figure 5 Side view of the transfer robot shown in .
[0054] Reference Figure 5 and Figure 6 The transfer robot 900 may include a main body 902 , a base 904 , and a plurality of hands 910 .
[0055] The base 904 may be provided on the body 902 so as to be rotatable and height-adjustable.
[0056] The plurality of hands 910 may include a first hand 920 and a second hand 930. The first hand 920 and the second hand 930 may be disposed at different heights on the susceptor 904. The height difference between the first hand 920 and the second hand 930 corresponds to a height difference "t" between the process chamber 300 of the first process module 200-1 and the process chamber 300 of the second process module 200-2.
[0057] The first hand 920 can transfer the substrate into the process chamber 300 of the first process module 200-1, or transfer it out of the process chamber 300 of the first process module 200-1, and the second hand 930 can transfer the substrate into the process chamber 300 of the second process module 200-2, or transfer it out of the process chamber 300 of the second process module 200-2 simultaneously with the first hand 920.
[0058] In addition, the first hand 920 and the second hand 930 may be operated to simultaneously transfer substrates to or from substrate carriers disposed on the first load port 100-1 and the second load port 100-2. That is, the first hand 920 and the second hand 930 may take out substrates from substrate carriers disposed on the first load port 100-1 and the second load port 100-2, or may place substrates in substrate carriers disposed on the first load port 100-1 and the second load port 100-2.
[0059] For example, each of the first hand 920 and the second hand 930 may include two transfer hands 922 and 924 for replacing the substrate. For example, one of the two transfer hands 922 and 924 takes out a completely processed substrate from the process chamber 300, while the other places an unprocessed substrate in the process chamber 300. In this embodiment, the first hand 920 and the second hand 930 are shown as having two transfer hands 922 and 924. However, the first hand 920 and the second hand 930 are not limited thereto.
[0060] The first hand 922 and the second hand 924 can independently move forward and backward in the same direction at different heights. In this embodiment, the first hand 922 can be located above the second hand 924. Each of the first hand 922 and the second hand 924 includes a pocket part on which a substrate is placed, and the pocket part has The shape of the bag portion is not limited to shape, and can be changed into various shapes.
[0061] The transfer robot 900 performs a substrate pickup operation in a state where the first transfer hand 922 or the second transfer hand 924 moves forward (pickup position). The transfer robot 900 performs a substrate transfer operation in a state where the first transfer hand 922 or the second transfer hand 924 moves backward (starting position).
[0062] As described above, the transfer robot 900 includes a bidirectional hand, thereby minimizing the bottleneck phenomenon.
[0063] Figure 7 It shows Figure 2 a view of a load port in a device; and Figure 8 It shows Figure 7 Side view of the load port shown in .
[0064] Reference Figure 7 and Figure 8 In this embodiment, the first load port 100-1 and the second load port 100-2 have the same configuration. Therefore, the configuration of the first load port 100-1 will be described in detail below, and the description of the configuration of the second load port 100-2 will be omitted.
[0065] The first load port 100-1 may include: a vertical frame 110 placed in a vertical position and including a port door 112 for opening or closing a door D of a carrier C; a mounting table 120 formed in a structure in which the carrier C is placed on an upper surface; and a moving member 130 that moves the carrier C from a first position, where the carrier C is transferred from a carrier transfer device, to the mounting table 120. The mounting table 120 is installed in a structure capable of moving toward or away from the port door 112.
[0066] Here, the carrier C includes a body which is open at one side, is selectively opened or closed by a door D, and has a plurality of slots in which substrates are loaded. For example, a front opening unified pod (FOUP) may be used as the carrier C. The door D is inserted into the opening side of the carrier C to seal the inside of the carrier C from the outside, and has a plurality of recesses which are coupled with the port door 112 of the first load port 100-1.
[0067] The vertical frame 110 is installed such that at least a portion thereof is attached to the transfer chamber 800. The vertical frame 110 is installed in an upright position to constitute a portion of a side of the transfer chamber 800. A port door 112 that can be opened or closed is formed in the vertical frame 110 to allow a substrate to be transferred into the transfer chamber 800.
[0068] In close contact with the door D installed at one side of the carrier C, the port door 112 can be operated between a state of opening the door D and a state of isolating the internal space of the transfer chamber 800 and the internal space of the carrier C. The operation of the port door 112 can be performed by a motor and a gear in the vertical frame 110. Alternatively, the port door 112 can be driven by a pneumatic cylinder or a hydraulic cylinder. Since the interior of the transfer chamber 800 is maintained as a clean room, the port door 112 is preferably completely isolated from the outside for the cleaning of the transfer chamber 800.
[0069] The moving member 130 may include a moving table 132 that can rotate and slide to allow the door D of the carrier C to face the port door 112 of the first load port 100-1. The moving table 132 may be configured to be rotatable, and the moving table 132 may have a carrier moving device 134 on its upper surface, which is used to place the carrier C on the mounting table 120 or move the carrier C placed on the mounting table 120 to the moving table 132. The carrier moving device 134 may be provided in various forms, and is not limited to the structure shown in the drawings. The moving table 132 may be located below a path along which a carrier conveying device (e.g., an overhead hoist transport (OHT)) moves.
[0070] Figures 9 to 12 is a view showing a process step of loading a carrier onto a load port.
[0071] like Figures 9 to 12 As shown, the carrier C is placed on the moving platform 132 (see FIG. 1 ) by a carrier transport device (eg, an overhead lift transport (OHT)). Fig. 9 ). At this time, the carrier C is placed on the moving stage 132 with the door D of the carrier C facing the process module 200. The moving stage 132 is rotated 90 degrees so that the door D of the carrier C faces the port door 112 (refer to Fig.10 In this state, the carrier C is moved to the mounting station 120 by the carrier moving device 134 (refer to Fig.11 ). The door D of the carrier C placed on the mounting table 120 can be opened by the port door 112 (refer to Fig.12 ).
[0072] As described above, by optimizing the layout, the substrate processing apparatus of the present invention can reduce the number of conveying devices and can omit the buffer chamber, thereby increasing the number of chambers by 1.5 times on the same floor space and thus improving productivity. In addition, the substrate processing apparatus of the present invention can eliminate the bottleneck phenomenon by using a bidirectional multi-layer multi-hand conveying robot.
[0073] Fig.13 is a view showing another embodiment of a transfer robot.
[0074] In the description Fig.13 In the embodiment of the present invention, repeated description of components that are the same as or corresponding to those in the above-mentioned embodiment may be omitted.
[0075] according to Fig.13The transfer robot 900 a of the embodiment of FIG. 1 is different from the transfer robot 900 according to the above-described embodiment in that the second hand 930 a can change direction so as to transfer the substrate in the same direction as the first hand 920 .
[0076] That is, the transfer hands 922 and 924 of the second hand 930 a may be rotated 180 degrees by the rotating member 990 , and in the rotated state, the second hand 930 a and the first hand 920 may transfer the substrate together in the same direction.
[0077] According to the inventive concept, a significant effect of providing more process chambers than in the prior art without increasing the width of the device can be achieved.
[0078] In addition, according to the inventive concept, by omitting the index robot and the buffer chamber in the same tool area, more process chambers may be provided, thereby achieving an increase in throughput.
[0079] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive, but illustrative.
Claims
1. A substrate processing device, comprising: a plurality of load ports on which carriers are placed, the carriers having substrates received therein; a plurality of process chambers configured to perform a process on the substrate; as well as a transfer robot configured to transfer the substrate between the load port and the process chamber, wherein the conveying robot is movable along a conveying channel, the conveying channel having a longitudinal direction formed along a first direction, wherein the loading port and the process chamber are arranged along the first direction on one side and an opposite side of the transfer channel, and wherein the transfer robot transfers the substrate between the carrier placed on the loading port and the process chamber; wherein a substrate inlet / outlet opening of a first process chamber disposed on the one side of the transfer channel and a substrate inlet / outlet opening of a second process chamber disposed on the opposite side of the transfer channel are disposed at different heights; Wherein, the conveying robot comprises a plurality of hands arranged at different heights, and The plurality of hands simultaneously transfer the substrate into the first process chamber and the second process chamber, or transfer the substrate out of the first process chamber and the second process chamber.
2. The substrate processing apparatus according to claim 1, wherein: An upper end of a first process chamber disposed on the one side of the transfer passage and an upper end of a second process chamber disposed on the opposite side of the transfer passage among the process chambers are disposed at different heights.
3. The substrate processing apparatus according to claim 1, wherein: The plurality of hands are rotatable to face a direction so as to simultaneously transfer the substrates into or out of a process chamber or a carrier placed on a load port.
4. The substrate processing apparatus according to claim 1, wherein: A height difference between the substrate inlet / outlet opening of the first process chamber and the substrate inlet / outlet opening of the second process chamber, or a height difference between an upper end of the first process chamber and an upper end of the second process chamber, corresponds to a height difference between adjacent hands among the plurality of hands.
5. The substrate processing apparatus according to claim 1, wherein: The load ports are arranged to face each other with the transfer passage between the load ports.
6. The substrate processing apparatus according to claim 1, wherein: Each of the load ports comprises: a vertical frame having a port door configured to open or close a door of the carrier; a mounting table on which the carrier is placed, wherein the mounting table is movable to a position where the door of the carrier is opened or closed by the port door; and A moving member configured to move the carrier from a first position, where the carrier is transferred from a carrier transfer device, to the mounting table.
7. The substrate processing apparatus according to claim 6, wherein: The moving member includes a moving stage capable of rotating and sliding so that the door of the carrier faces the port door of the load port.
8. The substrate processing apparatus according to claim 7, wherein: The moving stage is located below a path along which the carrier transport device moves.
9. A transfer robot for transferring a substrate between a carrier placed on a load port and a process chamber, wherein: The transfer robot comprises: a first hand and a second hand arranged at different heights, wherein the first hand transfers the substrate into or out of a first process chamber and a second process chamber, the first process chamber and the second process chamber are arranged to be opposite to each other with respect to the transfer channel, and The second hand and the first hand simultaneously transfer the substrate to another process chamber of the first process chamber and the second process chamber, or transfer the substrate out of the other process chamber; The height difference between the first hand and the second hand corresponds to the height difference between the substrate inlet / outlet opening of the first process chamber and the substrate inlet / outlet opening of the second process chamber.
10. The transfer robot according to claim 9, wherein: One of the first hand and the second hand is rotatable so that the first hand and the second hand face one direction to simultaneously transfer the substrate into or out of one of the first process chamber and the second process chamber.
11. The transfer robot according to claim 9, wherein: Each of the first hand and the second hand includes a plurality of transfer hands.
12. A substrate processing device, comprising: an index module, the index module comprising one or more load ports; a process module comprising one or more process chambers configured to receive a substrate from the index module and perform a process on the substrate; as well as a transfer robot configured to transfer the substrate between the index module and the process module, wherein the conveying robot is movable along a conveying channel, the conveying channel having a longitudinal direction formed along a first direction, wherein the loading port and the process chamber are arranged along the first direction on one side and an opposite side of the transfer channel, and The transfer robot transfers the substrate between the carrier placed on the loading port and the process chamber.
13. The substrate processing apparatus according to claim 12, wherein: A substrate inlet / outlet opening of a first process chamber disposed on the one side of the transfer passage and a substrate inlet / outlet opening of a second process chamber disposed on the opposite side of the transfer passage are disposed at different heights.
14. The substrate processing apparatus according to claim 12, wherein: An upper end of a first process chamber disposed on the one side of the transfer passage and an upper end of a second process chamber disposed on the opposite side of the transfer passage among the process chambers are disposed at different heights.
15. The substrate processing apparatus according to claim 13 or 14, wherein: The transfer robot includes a plurality of hands arranged at different heights, and The plurality of hands simultaneously transfer the substrate into the first process chamber and the second process chamber, or transfer the substrate out of the first process chamber and the second process chamber.
16. The substrate processing apparatus according to claim 15, wherein: The plurality of hands are rotatable to face a direction so as to simultaneously transfer the substrates into or out of a process chamber or a carrier placed on a load port.
17. The substrate processing apparatus according to claim 15, wherein: A height difference between the substrate inlet / outlet opening of the first process chamber and the substrate inlet / outlet opening of the second process chamber, or a height difference between the upper end of the first process chamber and the upper end of the second process chamber, corresponds to a height difference between adjacent hands among the plurality of hands.
Citation Information
Patent Citations
Stabilization of enzymes in the composition
KR1020190086540A
Substrate transfer robot and vacuum processing apparatus
CN101801615A
Method for automatic sending cassette pod
US20180158708A1
Substrate processing sequence in a cartesian robot cluster tool
US8911193B2
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