Electronic devices

Abstract

The present application relates to an electronic device. The electronic device includes a window, a display panel disposed below the window, and a digitizer disposed below the display panel. The digitizer includes a photosensitive resin layer and a plurality of sensing coils disposed inside the photosensitive resin layer, wherein the photosensitive resin layer includes a front surface and a rear surface opposite to the front surface. Compared with the rear surface, the front surface is relatively flat.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2019-0094449, filed on August 2, 2019, and Korean Patent Application No. 10-2019-0170341, filed on December 19, 2019, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] Exemplary embodiments of the present disclosure relate to electronic devices. More particularly, exemplary embodiments of the present disclosure relate to electronic devices with improved reliability. Background Art

[0004] Electronic devices may include display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode (OLED) display, a field effect display (FED), and an electrophoretic display (EPD).

[0005] Such an electronic device may be activated in response to an electrical signal applied thereto. The electronic device may include a sensor that senses an external input applied thereto from outside of a display panel that displays an image.

[0006] Such an electronic device may include a plurality of electrode patterns to be activated by an electrical signal. The region in which the electrode pattern is activated displays information or responds to an external signal. Summary of the invention

[0007] Exemplary embodiments of the present disclosure provide an electronic device with improved visibility.

[0008] According to an exemplary embodiment, an electronic device includes: a window; a display panel disposed below the window; and a digitizer disposed below the display panel. The digitizer includes: a photosensitive resin layer including a first surface and a second surface opposite to the first surface; and a plurality of sensing coils disposed inside the photosensitive resin layer. The first surface is relatively flat compared to the second surface.

[0009] In an exemplary embodiment, the first surface is disposed closer to the display panel than the second surface, has a surface roughness less than that of the second surface, and has a surface roughness equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers.

[0010] In an exemplary embodiment, the surface roughness of the second surface is equal to or greater than about 5 micrometers and equal to or less than about 15 micrometers.

[0011] In an exemplary embodiment, the digitizer further includes: a shielding layer disposed on the second surface; and an adhesive layer attaching the shielding layer to the second surface. The shielding layer includes magnetic metal powder.

[0012] In an exemplary embodiment, the second surface is disposed closer to the display panel than the first surface, the surface roughness of the first surface is less than that of the second surface, and the surface roughness of the second surface is equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers.

[0013] In an exemplary embodiment, the surface roughness of the first surface is equal to or greater than about 1 micrometer and equal to or less than about 3 micrometers.

[0014] In an exemplary embodiment, the digitizer further includes a shielding layer in contact with the first surface, and the shielding layer includes one of Permalloy, Invar, and stainless steel.

[0015] In an exemplary embodiment, the plurality of sensing coils include a first sensing coil extending in a first direction and a second sensing coil extending in a second direction crossing the first direction and spaced apart from the first sensing coil in a thickness direction of the photosensitive resin layer.

[0016] In an exemplary embodiment, the photosensitive resin layer includes a first photosensitive resin layer, a second photosensitive resin layer, and a third photosensitive resin layer. The first sensing coil is disposed on the first photosensitive resin layer, and the first photosensitive resin layer corresponds to the first surface. The second photosensitive resin layer covers the first sensing coil. The second sensing coil is disposed on the second photosensitive resin layer. The third photosensitive resin layer covers the second sensing coil and corresponds to the second surface.

[0017] In an exemplary embodiment, the electronic device further includes at least one of a lower film and a buffer layer disposed under the display panel.

[0018] In an exemplary embodiment, the digitizer is disposed below the lowest one of the display panel, the lower film and the buffer layer, or between the display panel and the lower film, or between the lower film and the buffer layer, or between the display panel and the buffer layer.

[0019] In an exemplary embodiment, the electronic device further includes at least one of a sensing sensor disposed on the display panel, the sensing sensor sensing an external input using self capacitance or mutual capacitance, and an optical member disposed between the window and the display panel.

[0020] In an exemplary embodiment, the electronic device includes a folding area folded about a folding axis extending in one direction, a first non-folding area extending from a first side of the folding area, and a second non-folding area extending from a second side of the folding area.

[0021] In exemplary embodiments, the photosensitive resin layer includes photosensitive polyimide.

[0022] According to an exemplary embodiment, an electronic device includes: a window; a display panel disposed below the window; and a digitizer disposed below the display panel. The digitizer includes: a photosensitive resin layer including a front surface and a rear surface opposite to the front surface; and a plurality of sensing coils disposed inside the photosensitive resin layer. The surface roughness of the front surface is equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers.

[0023] In an exemplary embodiment, the surface roughness of the rear surface is greater than that of the front surface, and the surface roughness of the rear surface is equal to or greater than about 5 micrometers and equal to or less than about 15 micrometers.

[0024] In an exemplary embodiment, the digitizer further includes: a shielding layer disposed on the rear surface; and an adhesive layer attaching the shielding layer to the rear surface. The shielding layer includes magnetic metal powder.

[0025] In an exemplary embodiment, a surface roughness of the rear surface is less than a surface roughness of the front surface, and the digitizer further includes a shielding layer disposed on the front surface, and the shielding layer includes one of Permalloy, Invar, and stainless steel.

[0026] In an exemplary embodiment, the plurality of sensing coils include a first sensing coil extending in a first direction and a second sensing coil extending in a second direction crossing the first direction and spaced apart from the first sensing coil in a thickness direction of the photosensitive resin layer.

[0027] In an exemplary embodiment, the photosensitive resin layer includes a first photosensitive resin layer, a second photosensitive resin layer, and a third photosensitive resin layer. The first sensing coil is disposed on the first photosensitive resin layer, and the first photosensitive resin layer corresponds to the front surface. The second photosensitive resin layer covers the first sensing coil. The second sensing coil is disposed on the second photosensitive resin layer. The third photosensitive resin layer covers the second sensing coil and corresponds to the rear surface.

[0028] In an exemplary embodiment, the electronic device further includes at least one of a lower film and a buffer layer disposed under the display panel.

[0029] In an exemplary embodiment, the digitizer is disposed between the display panel and the lower film, or between the display panel and the buffer layer, or between the lower film and the buffer layer, or below the lowest one of the display panel, the lower film and the buffer layer.

[0030] According to an exemplary embodiment, an electronic device includes: a window; a display panel disposed below the window; and a digitizer disposed below the display panel and including a first surface and a second surface opposite to the first surface. The digitizer includes: a first photosensitive resin layer corresponding to the first surface of the digitizer; a first sensing coil disposed on the first photosensitive resin layer; a second photosensitive resin layer covering the first sensing coil; a second sensing coil disposed on the second photosensitive resin layer; and a third photosensitive resin layer covering the second sensing coil and corresponding to the second surface of the digitizer. The first surface is relatively flat compared to the second surface.

[0031] In an exemplary embodiment, the first surface is disposed closer to the display panel than the second surface, and a surface roughness of the first surface is smaller than a surface roughness of the second surface.

[0032] In an exemplary embodiment, the surface roughness of the first surface is equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers, and the surface roughness of the second surface is equal to or greater than about 5 micrometers and equal to or less than about 15 micrometers.

[0033] In an exemplary embodiment, the first photosensitive resin layer, the second photosensitive resin layer, and the third photosensitive resin layer include photosensitive polyimide.

[0034] According to the above, the digitizer includes two opposing surfaces. When the flat surface is adjacent to the display module, a phenomenon in which the user visually recognizes an uneven surface due to light transmitted through the display module can be prevented or reduced.

[0035] Also, when an uneven surface is adjacent to a display module, the shielding layer may be coupled to the photosensitive resin layer even without providing a separate adhesive layer, and thus, a slim digitizer may be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and other features of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0037] Figure 1A is a perspective view showing an electronic device in an unfolded state according to an exemplary embodiment of the present disclosure;

[0038] Figure 1B is a perspective view showing an electronic device according to an exemplary embodiment of the present disclosure;

[0039] Figure 1C is a plan view showing an electronic device in a folded state according to an exemplary embodiment of the present disclosure;

[0040] Figure 1D is a perspective view showing an electronic device according to an exemplary embodiment of the present disclosure;

[0041] Figure 2A is a cross-sectional view showing an electronic device according to an exemplary embodiment of the present disclosure;

[0042] Figure 2B is a cross-sectional view showing an electronic device according to an exemplary embodiment of the present disclosure;

[0043] Figure 2C is a cross-sectional view showing an electronic device according to an exemplary embodiment of the present disclosure;

[0044] Figure 3A is a plan view showing a display panel according to an exemplary embodiment of the present disclosure;

[0045] Figure 3B is an equivalent circuit diagram showing a pixel according to an exemplary embodiment of the present disclosure;

[0046] Figure 4 is a plan view showing a sensing sensor according to an exemplary embodiment of the present disclosure;

[0047] Figure 5 is a plan view showing a digitizer according to an exemplary embodiment of the present disclosure;

[0048] Fig. 6A is a cross-sectional view showing a portion of an electronic device according to an exemplary embodiment of the present disclosure;

[0049] Figure 6B is a cross-sectional view showing a digitizer according to an exemplary embodiment of the present disclosure;

[0050] Figure 7 is a cross-sectional view showing a digitizer according to an exemplary embodiment of the present disclosure;

[0051] Figure 8 is a cross-sectional view showing a digitizer according to an exemplary embodiment of the present disclosure;

[0052] Fig. 9 is a cross-sectional view showing a digitizer according to an exemplary embodiment of the present disclosure;

[0053] FIG. 10A to FIG. 10G is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure; and

[0054] FIG. 11A to FIG. 11C is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0055] Exemplary embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings.In all drawings, the same reference numerals may represent the same elements.

[0056] In the present disclosure, it will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, the element or layer can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0057] It will be understood that, although the terms first, second, etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the present disclosure, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0058] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0059] For ease of explanation, spatially relative terms such as "below," "beneath," "under," "above," "on," etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the accompanying drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "below" or "under" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "under" may encompass both above and below orientations.

[0060] It will also be understood that when used in this specification, the terms “may include” and / or “comprising” indicate the presence of the stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or combinations thereof.

[0061] It should be understood that descriptions of features or aspects within each exemplary embodiment should typically be considered as available for other similar features or aspects in other exemplary embodiments, unless the context clearly dictates otherwise.

[0062] In this article, when a value is described as being approximately equal to another value or being substantially the same as or equal to another value, it will be understood that these values ​​are the same, or these values ​​are equal to each other within the measurement error, or if measurably unequal, then these values ​​are close enough in value so as to be functionally equal to each other as will be understood by those of ordinary skill in the art. For example, the term "about" as used in this article includes the value and the average value within the acceptable deviation range of the specific value determined by the measurement discussed and the error (that is, the limitation of the measurement system) associated with the measurement of a specific amount as considered by those of ordinary skill in the art. For example, "about" can mean within one or more standard deviations as understood by those of ordinary skill in the art. In addition, it will be understood that although a parameter can be described as having "about" a specific value in this article, according to exemplary embodiments, the parameter can be exactly the specific value, or can be approximated to the specific value within the measurement error as will be understood by those of ordinary skill in the art.

[0063] Figure 1A is a perspective view showing the electronic device EA in an unfolded state according to an exemplary embodiment of the present disclosure. Figure 1B is a perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 1C is a plan view showing the electronic device EA in a folded state according to an exemplary embodiment of the present disclosure. Figure 1D is a perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure.

[0064] refer to Figure 1A , the electronic device EA may be a device activated in response to an electrical signal. According to an exemplary embodiment, the electronic device EA may include a tablet computer, a notebook computer, a computer, or a smart TV. In the exemplary embodiments described herein, a smart phone will be described as the electronic device EA. However, the present disclosure is not limited thereto.

[0065] The electronic device EA may display an image IM through the first display surface FS. The first display surface FS through which the image IM is displayed may correspond to the front surface of the electronic device EA. The image IM may include, for example, a moving image (eg, a moving image for use in a video) and a still image. Figure 1A A time, date and weather widget is shown as an example of an image IM.

[0066] In an exemplary embodiment, the front (or upper) surface and the rear (or lower) surface of each member of the electronic device EA may be defined relative to the direction along which the image IM is displayed. The front surface and the rear surface may face each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface may be substantially parallel to the third direction DR3.

[0067] The distance between the front and rear surfaces in the third direction DR3 may correspond to the thickness or height of the electronic device EA in the third direction DR3. Directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be relative to each other and may be changed to other directions.

[0068] The electronic device EA may sense an external input applied thereto from the outside. The external input may include various forms of input provided from the outside of the electronic device EA.

[0069] For example, the external input may include a proximity input (e.g., hovering) applied when approaching to a predetermined distance near or adjacent to the electronic device EA, and a touch input through the user's body (e.g., the user's hand). In addition, the external input may be provided in the form of force, pressure, temperature, light, etc.

[0070] Figure 1A An example of an external input caused by the pen SP is shown. The pen SP may be attached to or detached from the electronic device EA, and the electronic device EA may provide or receive a signal corresponding to the attachment and detachment of the pen SP.

[0071] The electronic device EA according to an exemplary embodiment may include a first display surface FS and a second display surface RS. The first display surface FS may also be referred to as a front display surface, and the second display surface RS may also be referred to as a rear display surface. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be opposite to the first display surface FS.

[0072] The first active area F-AA may be activated in response to an electrical signal. An image IM may be displayed through the first active area F-AA, and a variety of external inputs may be sensed through the first active area F-AA. The first peripheral area F-NAA may be adjacent to the first active area F-AA. The first peripheral area F-NAA may have a predetermined color. The first peripheral area F-NAA may also be referred to as a border area. The first peripheral area F-NAA may surround the first active area F-AA. Therefore, the first active area F-AA may be substantially defined by the first peripheral area F-NAA, however, this is merely exemplary. For example, in an exemplary embodiment, the first peripheral area F-NAA may be adjacent to only one side of the first active area F-AA, or may be adjacent to more than one side but less than all sides of the first active area F-AA, or may be omitted. However, the electronic device EA is not limited to these configurations.

[0073] A variety of electronic modules may be provided in the electronic module area EMA. For example, the electronic module may include at least one of a camera, a speaker, a light sensing sensor, and a heat sensing sensor. The electronic module area EMA may sense an external object through the display surfaces FS and RS, or may provide a sound signal such as a voice to the outside through the display surfaces FS and RS. In addition, the electronic module may include a plurality of other components, and is not limited to the components described herein.

[0074] The electronic module area EMA may be surrounded by one of the first active area F-AA and the first peripheral area F-NAA. However, the electronic module area EMA is not limited thereto. For example, the electronic module area EMA may be defined in the first active area F-AA, but is not particularly limited thereto.

[0075] The electronic device EA according to an exemplary embodiment may include at least one folding area FA and a plurality of non-folding areas NFA1 and NFA2 extending from the folding area FA.

[0076] refer to Figure 1B , the electronic device EA may include a first folding axis AX1 extending in the second direction DR2. For example, the first folding axis AX1 may extend in the second direction DR2 on the first display surface FS. The first folding axis AX1 may be referred to as an imaginary axis about which the electronic device EA folds inwardly. In an exemplary embodiment, the non-folding areas NFA1 and NFA2 may extend from the folding area FA, and the folding area FA is interposed between the non-folding areas NFA1 and NFA2 along the first folding axis AX1. For example, the first non-folding area NFA1 may extend from one side of the folding area FA in the first direction DR1, and the second non-folding area NFA2 may extend from the other side of the folding area FA in the first direction DR1.

[0077] The electronic device EA can be folded around the first folding axis AX1 to be in an inward folded state, in which an area of ​​the first display surface FS overlapping the first non-folding area NFA1 faces another area of ​​the first display surface FS overlapping the second non-folding area NFA2. For example, in the inward folded state, the first display surface FS can be folded onto itself, and the second display surface RS can be exposed to the outside.

[0078] refer to Figure 1C , the second display surface RS can be seen by the user during the electronic device EA is in the inward folded state. In this case, the second display surface RS may include a second active area R-AA through which an image is displayed. The second active area R-AA may be activated in response to an electrical signal. The second active area R-AA may be an area through which an image is displayed and a variety of external inputs are sensed.

[0079] The second peripheral area R-NAA may be defined as being adjacent to the second active area R-AA. The second peripheral area R-NAA may have a predetermined color. The second peripheral area R-NAA may also be referred to as a frame area. The second peripheral area R-NAA may surround the second active area R-AA. In addition, the second display surface RS may also include an electronic module area similar to the electronic module area EMA described above, in which an electronic module including a variety of components is provided. However, the second display surface RS is not limited thereto.

[0080] refer to Figure 1D , the electronic device EA may include a second folding axis AX2 extending in the second direction DR2. For example, the second folding axis AX2 may extend in the second direction DR2 on the second display surface RS. The second folding axis AX2 may be referred to as an imaginary axis around which the electronic device EA is folded outward.

[0081] The electronic device EA can be folded around the second folding axis AX2 to be in an outward folded state, in which an area of ​​the second display surface RS overlapping with the first non-folding area NFA1 faces another area of ​​the second display surface RS overlapping with the second non-folding area NFA2. For example, in the outward folded state, the second display surface RS can be folded onto itself, and the first display surface FS can be exposed to the outside.

[0082] It should be understood that the electronic device EA is not limited to the configuration described above. For example, in an exemplary embodiment, the electronic device EA can be folded around multiple folding axes so that a portion of the first display surface FS and a portion of the second display surface RS face each other, and the number of folding axes and the number of non-folding areas are not limited to the configuration described above.

[0083] Figure 2A is a cross-sectional view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 2B is a cross-sectional view showing an electronic device EA-1 according to an exemplary embodiment of the present disclosure. Figure 2C is a cross-sectional view showing an electronic device EA-2 according to an exemplary embodiment of the present disclosure. Figure 3A is a plan view showing a display panel DP according to an exemplary embodiment of the present disclosure. Figure 3B is an equivalent circuit diagram showing a pixel PX according to an exemplary embodiment of the present disclosure. Figure 4 is a plan view illustrating a sensing sensor ISL according to an exemplary embodiment of the present disclosure.

[0084] exist FIG. 2A to FIG. 2C , Figure 3A and Figure 3B as well as Figure 4 In the same / similar reference numerals are indicated in Figures 1A to 1D Therefore, for the convenience of description, further detailed description of these same / similar elements will be omitted.

[0085] FIG. 2A to FIG. 2C 2 is a cross-sectional view schematically showing an electronic device EA, an electronic device EA- 1 , and an electronic device EA- 2 according to an exemplary embodiment of the present disclosure.

[0086] refer to Figure 2A , the electronic device EA may include a window WM, an optical member OM, a display module DM, a lower film FM, a protection member PM and a digitizer ZM.

[0087] The window WM may be disposed on the display module DM. The window WM may provide display surfaces FS and RS, and may protect the display module DM. The window WM may include a material having a high light transmittance. For example, the window WM may include a glass substrate, a sapphire substrate, or a plastic film. The window WM may have a single-layer or multi-layer structure. For example, the window WM may have a stacked structure of a plurality of plastic films attached to each other by an adhesive, or may have a glass substrate and a stacked structure of a plastic film attached to the glass substrate by an adhesive.

[0088] In the window WM, one area through which light generated by the display module DM is transmitted can be defined as a first active area F-AA of the first display surface FS, and a frame area of ​​the window WM can be defined as a first peripheral area F-NAA. In addition, another area through which light generated by the display module DM is transmitted in the window WM can be defined as a second active area R-AA of the second display surface RS, and a frame area of ​​the window WM can be defined as a second peripheral area R-NAA.

[0089] The optical member OM may be disposed under the window WM. The optical member OM may reduce the external light reflectivity of the display module DM for light incident to the display module DM. For example, the optical member OM may include at least one of an anti-reflection film, a polarization film, a color filter, and a gray filter.

[0090] The display module DM may be used as an output device. For example, the display module DM may display an image through the active areas F-AA and R-AA, and a user may obtain information through the image. In addition, the display module DM may be used as an input device to sense an external input applied to the active areas F-AA and R-AA.

[0091] The display module DM may include a display panel DP and a sensing sensor ISL.

[0092] refer to Figure 3A , the display panel DP may include a plurality of pixels PX, a plurality of signal lines GL, DL, PL, and ECL, and a plurality of display pads PDD.

[0093] The display panel DP may include a display area DA and a non-display area NDA, wherein an image is displayed through the display area DA, a driving circuit or a driving line is disposed in the non-display area NDA, and an image is not displayed in the non-display area NDA. The display area DA may overlap at least a portion of the active areas F-AA and R-AA of the electronic device EA. In addition, the non-display area NDA may overlap the peripheral areas F-NAA and R-NAA of the electronic device EA.

[0094] The signal lines GL, DL, PL, and ECL may be connected to the pixels PX to apply electrical signals to the pixels PX. Among the signal lines included in the display panel DP, the scan lines GL, the data lines DL, the power lines PL, and the light emitting control lines ECL are shown as representative examples. However, this is only exemplary. For example, the signal lines GL, DL, PL, and ECL may also include initialization voltage lines, and the signal lines GL, DL, PL, and ECL are not particularly limited. The pixels PX may be arranged in a first direction DR1 and in a second direction DR2 to form a matrix structure in a plan view.

[0095] Figure 3B An exemplary embodiment of a signal circuit diagram of one of the pixels PX is shown. Figure 3B A pixel PX connected to an i-th scan line GLi and an i-th emission control line ECLi is shown, where i is a natural number.

[0096] The pixel PX may include a light emitting element EE and a pixel circuit CC. The pixel circuit CC may include a plurality of transistors T1 to T7 and a capacitor CP. The transistors T1 to T7 may be formed by, for example, a low temperature polysilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

[0097] The pixel circuit CC may control the amount of current flowing through the light emitting element EE in response to the data signal. The light emitting element EE may emit light at a predetermined brightness in response to the amount of current provided from the pixel circuit CC. To this end, the first power voltage ELVDD has a voltage level set higher than the voltage level of the second power voltage ELVSS. The light emitting element EE may include, for example, an organic light emitting element or a quantum dot light emitting element.

[0098] Each of the transistors T1 to T7 may include an input electrode (or source electrode), an output electrode (or drain electrode), and a control electrode (or gate electrode). In the present disclosure, for ease of description, one of the input electrode and the output electrode may be referred to as a "first electrode", and the other of the input electrode and the output electrode may be referred to as a "second electrode".

[0099] A first electrode of the first transistor T1 is connected to the first power voltage ELVDD via the fifth transistor T5, and a second electrode of the first transistor T1 is connected to the anode electrode of the light emitting element EE via the sixth transistor T6. The first transistor T1 may be referred to as a "driving transistor".

[0100] The first transistor T1 controls the amount of current flowing through the light emitting element EE in response to a voltage applied to a control electrode of the first transistor T1 .

[0101] The second transistor T2 is connected between the data line DL and the first electrode of the first transistor T1. The control electrode of the second transistor T2 is connected to the i-th scan line GLi. When the i-th scan signal is applied to the i-th scan line GLi, the second transistor T2 is turned on to electrically connect the data line DL to the first electrode of the first transistor T1.

[0102] The third transistor T3 is connected between the second electrode of the first transistor T1 and the control electrode of the first transistor T1. The control electrode of the third transistor T3 is connected to the i-th scan line GLi. When the i-th scan signal is applied to the i-th scan line GLi, the third transistor T3 is turned on to electrically connect the second electrode of the first transistor T1 to the control electrode of the first transistor T1. Therefore, when the third transistor T3 is turned on, the first transistor T1 is connected in a diode configuration.

[0103] The fourth transistor T4 is connected between the node ND and the initialization power generator. The control electrode of the fourth transistor T4 is connected to the (i-1)th scan line GLi-1. When the (i-1)th scan signal is applied to the (i-1)th scan line GLi-1, the fourth transistor T4 is turned on to apply the initialization voltage Vint to the node ND.

[0104] The fifth transistor T5 is connected between the power line PL and the first electrode of the first transistor T1. A control electrode of the fifth transistor T5 is connected to the i-th light emission control line ECLi.

[0105] The sixth transistor T6 is connected between the second electrode of the first transistor T1 and the anode electrode of the light emitting element EE. A control electrode of the sixth transistor T6 is connected to the i-th light emitting control line ECLi.

[0106] The seventh transistor T7 is connected between the initialization power generator and the anode electrode of the light emitting element EE. The control electrode of the seventh transistor T7 is connected to the (i+1)th scan line GLi+1. When the (i+1)th scan signal is applied to the (i+1)th scan line GLi+1, the seventh transistor T7 is turned on to apply the initialization voltage Vint to the anode electrode of the light emitting element EE.

[0107] The seventh transistor T7 can improve the black performance of the pixel PX. For example, when the seventh transistor T7 is turned on, the parasitic capacitor of the light emitting element EE is discharged. Then, in an exemplary embodiment, the light emitting element EE does not emit light due to the leakage current from the first transistor T1 when displaying black brightness, and therefore, the black performance can be improved.

[0108] In addition, the control electrode of the seventh transistor T7 is connected to the Figure 3B However, the present disclosure is not limited thereto. For example, according to an exemplary embodiment of the present disclosure, the control electrode of the seventh transistor T7 may be connected to the i-th scan line GLi or the (i-1)-th scan line GLi-1.

[0109] The capacitor CP is connected between the power line PL and the node ND. The capacitor CP is charged with a voltage corresponding to the data signal. When the fifth transistor T5 and the sixth transistor T6 are turned on by the voltage charged in the capacitor CP, the amount of current flowing through the first transistor T1 may be determined.

[0110] In the present disclosure, the equivalent circuit of the pixel PX is not limited to Figure 3B For example, according to exemplary embodiments, the pixel PX may be implemented in various ways to allow the light emitting element EE to emit light. Figure 3BA PMOS transistor used in the pixel circuit CC is shown. However, the present disclosure is not limited thereto. For example, in an exemplary embodiment, the pixel circuit CC may be implemented using an NMOS transistor or a combination of an NMOS transistor and a PMOS transistor.

[0111] Reference again Figure 3A , the power pattern VDD may be disposed in the non-display area NDA. In an exemplary embodiment, the power pattern VDD may be connected to the power line PL. Therefore, the display panel DP may include the power pattern VDD, and thus, the pixels PX may receive the same first power signal.

[0112] The display pad PDD may include a first pad D1 and a second pad D2. The first pad D1 may be provided in plurality, and the first pads D1 may be connected to the data lines DL, respectively. The second pad D2 may be connected to the power pattern VDD to be electrically connected to the power line PL. The display panel DP may apply an electrical signal provided from the outside through the display pad PDD to the pixel PX. In addition to the first pad D1 and the second pad D2, the display pad PDD may further include a pad for receiving other electrical signals, and the display pad PDD is not limited to a specific exemplary embodiment.

[0113] refer to Figure 4 , the sensing sensor ISL may be disposed on the display panel DP. The sensing sensor ISL may be coupled to the display panel DP through a separate adhesive layer. In addition, the sensing sensor ISL may be directly formed on the display panel DP through a continuous process. However, the sensing sensor ISL is not particularly limited.

[0114] The sensing sensor ISL may include a first sensing electrode TE1, a second sensing electrode TE2, a plurality of sensing lines TL1, TL2, and TL3, and a plurality of sensing pads PDT, wherein the plurality of sensing pads PDT include a first sensing pad TP1, a second sensing pad TP2, and a third sensing pad TP3. The sensing sensor ISL may include a sensing area SA and a non-sensing area NSA. The non-sensing area NSA may surround the sensing area SA. The sensing area SA may be a sensing area in which an input provided from the outside is sensed. The sensing area SA may overlap with the display area DA of the display panel DP.

[0115] The sensing sensor ISL may sense the external input using, for example, a self-capacitance method or a mutual-capacitance method. The first sensing electrode TE1 and the second sensing electrode TE2 may be variously modified, arranged, and connected according to the self-capacitance method or the mutual-capacitance method.

[0116] The first sensing electrode TE1 may include a first sensing pattern SP1 and a first connection pattern BP1. The first sensing electrode TE1 may extend in the first direction DR1 and may be arranged in the second direction DR2. The first sensing patterns SP1 may be spaced apart from each other in the first direction DR1. At least one first connection pattern BP1 may be connected to two first sensing patterns SP1 adjacent to each other in the first direction DR1, thereby connecting the two adjacent first sensing patterns SP1 to each other in the first direction DR1.

[0117] The second sensing electrode TE2 may include a second sensing pattern SP2 and a second connection pattern BP2. The second sensing electrode TE2 may extend in the second direction DR2 and may be arranged in the first direction DR1. The second sensing patterns SP2 may be spaced apart from each other in the second direction DR2. At least one second connection pattern BP2 may be connected to two second sensing patterns SP2 adjacent to each other in the second direction DR2, thereby connecting the two adjacent second sensing patterns SP2 to each other in the second direction DR2.

[0118] The sensing lines TL1, TL2, and TL3 may be disposed in the non-sensing area NSA. The sensing lines TL1, TL2, and TL3 may include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3.

[0119] The first sensing line TL1 may be connected to the first sensing electrode TE1. The second sensing line TL2 may be connected to one end of the second sensing electrode TE2. The third sensing line TL3 may be connected to the other end of the second sensing electrode TE2. The other end of the second sensing electrode TE2 may be opposite to the one end of the second sensing electrode TE2.

[0120] According to an exemplary embodiment, the second sensing electrode TE2 may be connected to the second sensing line TL2 and the third sensing line TL3. Therefore, for a region of the second sensing electrode TE2 having a relatively longer length than that of the first sensing electrode TE1, sensitivity may be uniformly maintained. However, this is merely exemplary. In an exemplary embodiment, the third sensing line TL3 may be omitted, and the third sensing line TL3 is not particularly limited.

[0121] The sensing pad PDT may be arranged in the non-sensing area NSA. The sensing pad PDT may include a first sensing pad TP1, a second sensing pad TP2, and a third sensing pad TP3. The first sensing pad TP1 may be connected to the first sensing line TL1, and thus may be electrically connected to the first sensing electrode TE1. The second sensing pad TP2 may be connected to the second sensing line TL2, and the third sensing pad TP3 may be connected to the third sensing line TL3. Therefore, the second sensing pad TP2 and the third sensing pad TP3 may be electrically connected to the second sensing electrode TE2.

[0122] Reference again Figure 2A , the lower film FM may be disposed under the display module DM. When the electronic device EA is folded, the lower film FM may reduce the stress applied to the display module DM. In addition, the lower film FM may prevent external moisture from entering the display module DM and may absorb external impact, thereby providing protection for the display module DM.

[0123] The lower film FM may include a plastic film as its base layer. For example, the lower film FM may include a plastic film including at least one of polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone) and combinations thereof.

[0124] The material for the lower film FM is not limited to plastic resin, and may include, for example, an organic-inorganic composite material. For example, the lower film FM may include a porous organic layer and an inorganic material filled in the pores of the organic layer.

[0125] The lower film FM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method.

[0126] The protective member PM may be disposed under the lower film FM. The protective member PM may include at least one functional layer that protects the display module DM. For example, the protective member PM may include a light shielding layer, a heat dissipation layer, a buffer layer, and a plurality of adhesive layers.

[0127] The light shielding layer can improve the phenomenon that the components set in the display module DM are seen through the window WM through the active areas F-AA and R-AA. The light shielding layer may include a binder and a plurality of pigment particles dispersed in the binder. The pigment particles may include carbon black. Since the electronic device EA according to the exemplary embodiment includes the protective member PM having the light shielding layer, the light shielding effect can be improved.

[0128] The heat dissipation layer can effectively dissipate the heat generated by the display module DM. The heat dissipation layer may include at least one of graphite, copper (Cu), and aluminum (Al) having excellent heat dissipation characteristics. However, the heat dissipation layer is not limited thereto. The heat dissipation layer may improve the heat dissipation characteristics and may have electromagnetic wave shielding characteristics or electromagnetic wave absorption characteristics.

[0129] The buffer layer may be a synthetic resin foam. The buffer layer may include a matrix and a plurality of pores. The buffer layer may have elasticity and may have a porous structure.

[0130] The substrate may include a flexible material. The substrate may include a synthetic resin. For example, the substrate may include at least one of acrylonitrile butadiene styrene copolymer (ABS), polyurethane (PU), polyethylene (PE), ethylene vinyl acetate (EVA), and polyvinyl chloride (PVC).

[0131] The pores may absorb impact applied to the buffer layer. The pores may be defined by a porous structure of the buffer layer.

[0132] However, the present disclosure is not limited thereto. In an exemplary embodiment, at least one of the light shielding layer, the heat dissipation layer, and the buffer layer may be omitted, and a plurality of layers may be provided in a single-layer structure. However, the present disclosure is not particularly limited thereto.

[0133] The digitizer ZM may be disposed below the display module DM. The digitizer ZM may sense the external input by the pen SP (refer to Figure 1A ) is transmitted. The digitizer ZM may sense external input by an electromagnetic resonance (EMR) method. According to the EMR method, a resonant circuit provided in the pen SP generates an electric field, the vibrating electric field induces signals to a plurality of coils included in the digitizer ZM, and the position of the pen SP is detected based on the signals induced to the coils. The digitizer ZM will be described in more detail later.

[0134] In an exemplary embodiment, in the electronic device EA, the digitizer ZM, the protective member PM, the lower film FM, the display module DM and the optical member OM may be sequentially arranged in the third direction DR3. Therefore, the digitizer ZM according to the exemplary embodiment may be disposed below the protective member PM disposed at the lowest position among the display module DM, the lower film FM and the protective member PM.

[0135] exist FIG. 2A to FIG. 2C The components shown in the figure can be connected to each other by an adhesive layer arranged between these components. The adhesive layer can be, for example, an optically clear adhesive (OCA) film, an optically clear resin (OCR) or a pressure sensitive adhesive (PSA) film. In addition, the adhesive layer can include a photocurable adhesive material or a heat-curable adhesive material. However, the adhesive layer is not particularly limited.

[0136] refer to Figure 2B , the electronic device EA-1 may include a window WM-1, an optical member OM-1, a display module DM-1, a lower film FM-1, a protection member PM-1, and a digitizer ZM-1.

[0137] In an exemplary embodiment, the protective member PM-1, the digitizer ZM-1, the lower film FM-1, the display module DM-1 and the optical member OM-1 of the electronic device EA-1 can be arranged sequentially in the third direction DR3. Therefore, in an exemplary embodiment, the digitizer ZM-1 can be disposed between the lower film FM-1 and the protective member PM-1.

[0138] refer to Figure 2C , the electronic device EA-2 may include a window WM-2, an optical member OM-2, a display module DM-2, a lower film FM-2, a protective member PM-2 and a digitizer ZM-2.

[0139] In an exemplary embodiment, the protective member PM-2, the lower film FM-2, the digitizer ZM-2, the display module DM-2 and the optical member OM-2 of the electronic device EA-2 can be arranged sequentially in the third direction DR3. Therefore, in an exemplary embodiment, the digitizer ZM-2 can be disposed between the display module DM-2 and the lower film FM-2.

[0140] In an exemplary embodiment, the electronic device may include a lower film, a protective member, a digitizer, a display module, and an optical member sequentially arranged in the third direction DR3, and in this case, the digitizer may be disposed between the display module and the protective member. As another example, the digitizer may be disposed on the display module. However, the position of the digitizer is not particularly limited.

[0141] Figure 5 is a plan view showing a digitizer ZM according to an exemplary embodiment of the present disclosure. Fig. 6A is a cross-sectional view illustrating a portion of an electronic device according to an exemplary embodiment of the present disclosure. Figure 6B is a cross-sectional view showing a digitizer ZM according to an exemplary embodiment of the present disclosure.

[0142] The digitizer ZM according to the exemplary embodiment may sense the external input using an electromagnetic resonance (EMR) method.

[0143] The digitizer ZM may include a photosensitive resin layer PI, digitizer sensors RF1, RF2, CF1, and CF2, and a plurality of digitizer pads TC1 and TC2. In addition, the digitizer ZM may include a first surface ZM-U and a second surface ZM-B facing the first surface ZM-U. The first surface ZM-U may also be referred to as an upper surface, and the second surface ZM-B may also be referred to as a bottom surface or a rear surface.

[0144] The photosensitive resin layer PI may be a base layer in which the digitizer sensors RF1, RF2, CF1, and CF2 are disposed. The photosensitive resin layer PI may include an organic material. For example, the photosensitive resin layer PI may include photosensitive polyimide.

[0145] The digitizer sensors RF1, RF2, CF1, and CF2 may be disposed inside the photosensitive resin layer PI. In the present disclosure, the expression “disposed inside” may mean “embedded in.” Therefore, the digitizer sensors RF1, RF2, CF1, and CF2 may be embedded in the photosensitive resin layer PI.

[0146] The first digital converter sensors RF1 and RF2 may include a plurality of first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3, and the second digital converter sensors CF1 and CF2 may include a plurality of second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3.

[0147] The first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 may extend in a first direction DR1. The second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may extend in a second direction DR2 crossing the first direction DR1. The second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may be spaced apart from the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 in a thickness direction of the photosensitive resin layer PI.

[0148] The first digital converter sensors RF1 and RF2 may correspond to the input coils of the digital converter ZM of the EMR method, and the second digital converter sensors CF1 and CF2 may correspond to the output coils of the digital converter ZM of the EMR method. As used herein, the terms "digital converter sensor" and "sensing coil" are interchangeable terms, and therefore, hereinafter, the first digital converter sensors RF1 and RF2 may also be referred to as first sensing coils RF1 and RF2, and the second digital converter sensors CF1 and CF2 may also be referred to as second sensing coils CF1 and CF2.

[0149] The first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 and the second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may be arranged in the photosensitive resin layer PI to be insulated from each other. Each of the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 may be connected to a corresponding second digitizer pad TC2, and each of the second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may be connected to a corresponding first digitizer pad TC1.

[0150] The first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 may receive scanning signals activated in different time periods from each other. Each of the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 may generate a magnetic field in response to a corresponding scanning signal.

[0151] When the pen SP (reference Figure 1A ) approaches the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3, the magnetic field induced by the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2, and RF2-3 resonates with the resonant circuit of the pen SP. The pen SP may generate a resonant frequency. In an exemplary embodiment, the pen SP may include an LC resonant circuit including an inductor and a capacitor.

[0152] The second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2, and CF2-3 may output sensing signals to the first digitizer pad TC1 according to the resonance frequency of the pen SP.

[0153] In the following description, the central portion of the area where the second coil RF2-2 among the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2 and RF2-3 intersects with the second coil CF2-2 among the second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2 and CF2-3 is assumed to be the input point PP.

[0154] A sensing signal output from the second coil RF2-2 among the first sensing coils RF1-1, RF1-2, RF1-3, RF2-1, RF2-2 and RF2-3 may have a higher level than levels of sensing signals output from other first sensing coils RF1-1, RF1-2, RF1-3, RF2-1 and RF2-3.

[0155] A sensing signal output from the second coil CF2-2 among the second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2 and CF2-3 may have a higher level than levels of sensing signals output from the other second sensing coils CF1-1, CF1-2, CF1-3, CF2-1 and CF2-3.

[0156] The sensing signals output from the first coil CF2-1 and the third coil CF2-3 among the second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2 and CF2-3 can have a lower level than the level of the sensing signal output from the second coil CF2-2, and the sensing signals output from the first coil CF2-1 and the third coil CF2-3 among the second sensing coils CF1-1, CF1-2, CF1-3, CF2-1, CF2-2 and CF2-3 can have a higher level than the level of the sensing signals output from the other second sensing coils CF1-1, CF1-2 and CF1-3.

[0157] The two-dimensional coordinate information of the input point PP of the pen SP can be calculated based on the time when the sensing signal output from the second coil CF2-2 and having a high level is detected and the relative position of the second coil CF2-2 relative to the other second sensing coils CF1-1, CF1-2, CF1-3, CF2-1 and CF2-3.

[0158] refer to Fig. 6A and Figure 6B The digitizer ZM according to the exemplary embodiment may include a first surface ZM-U (front surface) and a second surface ZM-B (bottom surface or rear surface). The first surface ZM-U may be disposed closer to the display module DM than the second surface ZM-B.

[0159] In an exemplary embodiment, the first surface ZM-U may be relatively flat compared to the second surface ZM-B. For example, the first surface ZM-U may be flatter than the second surface ZM-B. For example, the roughness of the first surface ZM-U may be different from the roughness of the second surface ZM-B, as further described below (e.g., the first surface ZM-U may be less rough than the second surface ZM-B). The roughness of the first surface ZM-U may correspond to the first surface ZM-U being substantially flat (i.e., within measurement error as understood by a person of ordinary skill in the art).

[0160] Figure 6B : is an enlarged view showing the region of the digitizer ZM. Figure 6B can correspond to along Figure 5In an exemplary embodiment, when the digitizer ZM is formed, the first surface ZM-U may be a surface disposed on a base substrate on which a process is performed. In addition, the second surface ZM-B may be a surface formed by forming the first sensing coils RF1 and RF2 and the second sensing coils CF1 and CF2 in the photosensitive resin layer PI and curing the photosensitive resin layer PI.

[0161] For example, the photosensitive resin layer PI may be formed by: forming first sensing coils RF1-1, RF1-2, and RF1-3; performing primary curing on the photosensitive resin layer PI; forming second sensing coils CF1-1, CF1-2, and CF1-3 on the primary cured photosensitive resin layer PI; and then performing secondary curing on the photosensitive resin layer PI. Secondary curing on the photosensitive resin layer PI may mean curing the photosensitive resin layer PI at a time point after the primary curing on the photosensitive resin layer PI.

[0162] In this case, compared with the first surface ZM-U, the second surface ZM-B of the photosensitive resin layer PI may have an irregular surface due to the thickness of the first sensing coils RF1-1, RF1-2, and RF1-3 and the second sensing coils CF1-1, CF1-2, and CF1-3 provided in the photosensitive resin layer PI. Therefore, compared with the second surface ZM-B, the first surface ZM-U may be relatively flat.

[0163] Therefore, when compared with the second surface ZM-B formed by forming the first sensing coils RF1 and RF2 and being cured, the first surface ZM-U may be relatively less disturbed by the first sensing coils RF1 and RF2.

[0164] In an exemplary embodiment, the surface roughness of the first surface ZM-U may be less than the surface roughness of the second surface ZM-B (e.g., the first surface ZM-U may be less rough, i.e., flatter, than the second surface ZM-B). For example, the surface roughness of the first surface ZM-U may be equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers, and the surface roughness of the second surface ZM-B may be relatively greater than the roughness of the first surface ZM-U, and may be equal to or greater than about 5 micrometers and equal to or less than about 15 micrometers.

[0165] Herein, when the surface roughness is described as being equal to or greater than about a first value and equal to or less than about a second value, the surface roughness may also be described as being between the first value and the second value (inclusive of the first value and the second value).

[0166] Roughness (including surface roughness described below) can be measured by specific equipment. For example, the range of roughness described in the present disclosure may be a value measured by using a VK-X200 laser scanning microscope of KEYENCE Corporation.

[0167] The first surface ZM-U of the digitizer ZM can be coupled to the lower portion of the protective member PM through the adhesive layer AL. According to the present disclosure, since the first surface ZM-U having a relatively flat surface compared to the second surface ZM-B is disposed closer to the display module DM than the second surface ZM-B, it is possible to prevent the irregular surface from being seen by the user due to light transmitted through the display module DM. Therefore, the electronic device can have improved visibility.

[0168] Figure 7 is a cross-sectional view showing a digitizer ZM-A according to an exemplary embodiment of the present disclosure. Figure 8 is a cross-sectional view showing a digitizer ZM-BA according to an exemplary embodiment of the present disclosure. Fig. 9 is a cross-sectional view showing a digitizer ZM-C according to an exemplary embodiment of the present disclosure. Figures 7 to 9 In the same / similar reference numerals are indicated in Figures 1A to 6B Therefore, for the convenience of description, further detailed description of these same / similar elements will be omitted.

[0169] refer to Figure 7 , the digitizer ZM-A may include a photosensitive resin layer PI-A and a plurality of sensing coils RF1 and CF1. The photosensitive resin layer PI-A of the digitizer ZM-A may include a plurality of resin layers PS1, PS2, and PS3.

[0170] The first resin layer PS1 may provide a first surface ZM-U of the digitizer ZM-A. The first sensing coils RF1-1, RF1-2, and RF1-3 may be disposed on the first resin layer PS1.

[0171] The second resin layer PS2 may be disposed on the first resin layer PS1 and may cover the first sensing coils RF1-1, RF1-2, and RF1-3. The second sensing coils CF1-1, CF1-2, and CF1-3 may be disposed on the second resin layer PS2.

[0172] The third resin layer PS3 may provide the second surface ZM-B of the digitizer ZM-A. The third resin layer PS3 may cover the second sensing coils CF1-1, CF1-2, and CF1-3.

[0173] The photosensitive resin layer PI-A may include photosensitive polyimide. Figure 6BThe photosensitive resin layer PI of the digitizer ZM is formed to have an integral shape and is not divided into a plurality of layers even when cured multiple times, but according to Figure 7 The photosensitive resin layer PI-A of the exemplary embodiment may be divided into a plurality of layers when cured depending on the characteristics of the photosensitive polyimide.

[0174] The first surface ZM-U of the digitizer ZM-A may be relatively flat compared to the second surface ZM-B. The first surface ZM-U may be arranged closer to the display module DM than the second surface ZM-B (see FIG. Fig. 6A ).

[0175] refer to Figure 8 , the digitizer ZM-BA may include a photosensitive resin layer PI-B, a plurality of sensing coils RF1 and CF1, and may further include a shielding layer MP. The photosensitive resin layer PI-B and the shielding layer MP may be coupled to each other by an adhesive layer AL.

[0176] The shielding layer MP may be disposed on a relatively irregular surface among the surfaces of the digitizer ZM-BA. For example, the shielding layer MP may be disposed on the second surface ZM-B. The first surface ZM-U may be disposed closer to the display module DM than the second surface ZM-B (see Fig. 6A ).

[0177] In an exemplary embodiment, the shielding layer MP may include a metal material. For example, the shielding layer MP may include magnetic metal powder (MMP).

[0178] In an exemplary embodiment, the surface roughness of the first surface ZM-U may be equal to or greater than about 1 micron and equal to or less than about 10 microns, and the surface roughness of the second surface ZM-B may be relatively greater than the roughness of the first surface ZM-U and may be equal to or greater than about 5 microns and equal to or less than about 15 microns.

[0179] According to the exemplary embodiment, the shielding layer MP may prevent electrical interference from occurring between the digitizer ZM-BA and components disposed below the digitizer ZM-BA. Therefore, the electronic device may have improved reliability.

[0180] refer to Fig. 9 According to an exemplary embodiment, the digitizer ZM-C may include a photosensitive resin layer PI-C, a plurality of sensing coils RF1 and CF1, and a shielding layer ZBS. The digitizer ZM-C may include a second surface ZM-F disposed closer to the display module DM than a first surface ZM-R facing the second surface ZM-F (refer to Fig. 6A ). The shielding layer ZBS may be in direct contact with the first surface ZM-R.

[0181] In an exemplary embodiment, the second surface ZM-F may be disposed closer to the display module DM than the first surface ZM-R (refer to Fig. 6A ).

[0182] The shielding layer ZBS may be part of a base layer used as a base substrate during the process of forming the digitizer ZM-C. Figure 8 In the case shown a separate adhesive layer AL is coupled to the photosensitive resin layer PI-C.

[0183] In an exemplary embodiment, the shielding layer ZBS may include a metal material. For example, the shielding layer ZBS may include Permalloy or Invar (which is an alloy of nickel (Ni) and iron (Fe)) and stainless steel.

[0184] In an exemplary embodiment, the surface roughness of the second surface ZM-F may be equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers, and the surface roughness of the first surface ZM-R may be equal to or greater than about 1 micrometer and equal to or less than about 3 micrometers.

[0185] According to example embodiments, the shielding layer ZBS may be coupled to the photosensitive resin layer PI-C even without providing a separate adhesive layer, and thus, a slim digitizer ZM-C may be provided.

[0186] FIG. 10A to FIG. 10G is a cross-sectional view showing a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. FIG. 10A to FIG. 10G In the same / similar reference numerals are indicated in Figures 1A to 7 Therefore, for the convenience of description, further detailed description of these same / similar elements will be omitted.

[0187] In the following, reference will be made to FIG. 10A to FIG. 10G A method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure is described.

[0188] refer to Fig. 10A A base substrate BSL on which a process is performed may be provided, and a first photosensitive resin layer PIA may be formed on the base substrate BSL. The first photosensitive resin layer PIA may include photosensitive polyimide.

[0189] refer to Fig. 10B , the first sensing coil RF1 may be formed on the first photosensitive resin layer PIA. The first sensing coil RF1 may be formed by coating a conductive material on the first photosensitive resin layer PIA and patterning the conductive material.

[0190] Then, refer to Fig. 10C, a second photosensitive resin layer PIB may be formed on the first photosensitive resin layer PIA. Due to the step difference between the region where the first sensing coil RF1 is disposed and the region where the first sensing coil RF1 is not disposed, the second photosensitive resin layer PIB coated on the first photosensitive resin layer PIA may have a concave-convex portion. The first curing process UV1 may be performed after the second photosensitive resin layer PIB is coated.

[0191] During the first curing process UV1, a boundary between the first photosensitive resin layer PIA and the second photosensitive resin layer PIB having the same material as the first photosensitive resin layer PIA may not be visible. Fig. 10C , for convenience of explanation, a boundary between the first photosensitive resin layer PIA and the second photosensitive resin layer PIB is shown by a dotted line.

[0192] refer to Fig. 10D , a second sensing coil CF1 may be formed on the second photosensitive resin layer PIB. The second sensing coil CF1 may be formed to be spaced apart from the first sensing coil RF1. The second sensing coil CF1 may be formed by coating a conductive material on the second photosensitive resin layer PIB and patterning the conductive material.

[0193] refer to Fig. 10E , a third photosensitive resin layer PIC may be formed on the second photosensitive resin layer PIB. Due to the step difference between the region where the first sensing coil RF1 and the second sensing coil CF1 are disposed and the region where the first sensing coil RF1 and the second sensing coil CF1 are not disposed, the third photosensitive resin layer PIC coated on the second photosensitive resin layer PIB may have a concave-convex portion. The second curing process UV2 may be performed after the third photosensitive resin layer PIC is coated.

[0194] During the second curing process UV2, a boundary between the second photosensitive resin layer PIB and the third photosensitive resin layer PIC having the same material as the first photosensitive resin layer PIA may not be visible. Fig. 10E , for convenience of explanation, boundaries between the first photosensitive resin layer PIA, the second photosensitive resin layer PIB, and the third photosensitive resin layer PIC are each shown by a dotted line.

[0195] refer to Fig.10F , the first etching process EC1 may be performed on the base substrate BSL after the second curing process UV2 to remove the entire base substrate BSL. Therefore, a first surface ZM-U exposed after removing the entire base substrate BSL and a second surface ZM-B facing the first surface ZM-U and more irregular than the first surface ZM-U may be formed in the digitizer ZM. The first photosensitive resin layer PIA, the second photosensitive resin layer PIB, and the third photosensitive resin layer PIC may be collectively referred to as a photosensitive resin layer PI. As may be seen in FIG. 10A to FIG. 10FAs can be seen in FIG. 1 , the first photosensitive resin layer PIA corresponds to the first surface ZM-U, and the third photosensitive resin layer PIC corresponds to the second surface ZM-B.

[0196] According to an exemplary embodiment, the base substrate BSL may include one of a metal material and a glass material. When the base substrate BSL includes the metal material, the base substrate BSL may be removed from the first photosensitive resin layer PIA by a chemical method. For example, the base substrate BSL may be removed from the first photosensitive resin layer PIA by applying a solution containing an acid to the base substrate BSL.

[0197] When the base substrate BSL includes a glass material, the base substrate BSL may be removed from the first photosensitive resin layer PIA by a physical method. For example, the base substrate BSL may be removed from the first photosensitive resin layer PIA by irradiating a laser beam to the base substrate BSL.

[0198] In this case, a "Xe excimer laser" or a "solid-state laser" may be used as the laser irradiation equipment for removing the base substrate BSL. When ultraviolet light of about 300um to about 400um is irradiated by the laser irradiation equipment, the adhesive force between the first photosensitive resin layer PIA and the base substrate BSL may become weak, and then the base substrate BSL may be removed from the first photosensitive resin layer PIA. According to an exemplary embodiment, when the base substrate BSL is removed by a physical method, the time required to remove the base substrate BSL from the first photosensitive resin layer PIA may be further reduced compared to when the base substrate BSL is removed by a chemical method. Then, referring to Figure 10G The method for manufacturing an electronic device may include combining a digitizer ZM with a display module DM. The digitizer ZM and the display module DM may be combined with each other through an adhesive layer AL. Figure 10G can correspond to along Figure 5 A cross-sectional view taken along line II'.

[0199] According to the exemplary embodiment, since the first surface ZM-U having a relatively flat surface when compared with the second surface ZM-B is disposed closer to the display module DM than the second surface ZM-B, the concavoconvex portion (e.g., rough portion) of the second surface ZM-B is not visible to the user. Therefore, the viewing characteristics of the electronic device can be improved.

[0200] FIG. 11A to FIG. 11C is a cross-sectional view showing a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. FIG. 11A to FIG. 11C In the same / similar reference numerals are indicated in Figures 1A to 10G Therefore, for the convenience of description, further detailed description of these same / similar elements will be omitted.

[0201] Fig.11A Shown with Fig. 10E The base substrate BSL is the same state as the state after the third photosensitive resin layer PIC is secondary cured in the manufacturing process of the electronic device. According to an exemplary embodiment, the base substrate BSL may include a metal material. For example, the base substrate BSL may include one of Permalloy, Invar, and stainless steel.

[0202] Then, refer to Fig. 11B , a second etching process EC2 may be performed to remove a portion of the base substrate BSL. The removal of a portion of the base substrate BSL may be performed in a thickness direction of the base substrate BSL. After removing the portion of the base substrate BSL, the remaining portion of the base substrate BSL may be used as a shielding layer ZBS.

[0203] According to an exemplary embodiment, a surface of the photosensitive resin layer PI in contact with the shielding layer ZBS may be defined as a first surface ZM-R, and a surface opposite to the first surface ZM-R may be defined as a second surface ZM-F. In an exemplary embodiment, the shielding layer ZBS may be formed to contact (e.g., directly contact) the first surface ZM-R.

[0204] Then, refer to Fig. 11C The manufacturing method of the electronic device may include combining the digitizer ZM-D with the display module DM. The digitizer ZM-D and the display module DM may be combined with each other through an adhesive layer AL.

[0205] According to the exemplary embodiment, a portion of the base substrate BSL used as a working substrate may be removed, and the remaining portion of the base substrate BSL may be used as a shielding layer ZBS. Therefore, a digitizer ZM-D integrally provided with the shielding layer ZBS may be formed without using a separate shielding layer and a separate adhesive layer. Therefore, the manufacturing cost of the digitizer ZM-D may be reduced, and a digitizer ZM-D having a slim size may be realized.

[0206] While the present disclosure has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. Electronic equipment, including: window; A display panel, disposed below the window; as well as A digital converter is arranged below the display panel, and the digital converter includes: a photosensitive resin layer comprising a first surface and a second surface opposite to the first surface; and A plurality of sensing coils are arranged inside the photosensitive resin layer, wherein the first surface is relatively flat compared to the second surface, and Wherein, the first surface is arranged closer to the window than the second surface.

2. The electronic device according to claim 1, wherein: The first surface is disposed closer to the display panel than the second surface, the surface roughness of the first surface is smaller than the surface roughness of the second surface, and the surface roughness of the first surface is equal to or greater than 1 micrometer and equal to or less than 10 micrometers.

3. The electronic device according to claim 2, wherein: The surface roughness of the second surface is equal to or greater than 5 micrometers and equal to or less than 15 micrometers.

4. The electronic device according to claim 2, wherein: The digitizer further comprises: a shielding layer disposed on the second surface; and an adhesive layer attaching the shielding layer to the second surface, Wherein, the shielding layer comprises magnetic metal powder.

5. The electronic device according to claim 1, wherein: The plurality of sensing coils include: A first sensing coil extending in a first direction; and The second sensing coil extends in a second direction crossing the first direction and is spaced apart from the first sensing coil in a thickness direction of the photosensitive resin layer.

6. The electronic device according to claim 5, wherein: The photosensitive resin layer comprises: a first photosensitive resin layer, Wherein, the first sensing coil is disposed on the first photosensitive resin layer, and the first photosensitive resin layer corresponds to the first surface; a second photosensitive resin layer, covering the first sensing coil, Wherein, the second sensing coil is arranged on the second photosensitive resin layer; and The third photosensitive resin layer covers the second sensing coil and corresponds to the second surface.

7. The electronic device according to claim 1, further comprising: At least one of the lower film and the buffer layer is disposed below the display panel.

8. The electronic device according to claim 7, wherein: The digital converter is arranged below the lowest one of the display panel, the lower film and the buffer layer, or between the display panel and the lower film, or between the lower film and the buffer layer, or between the display panel and the buffer layer.

9. The electronic device according to claim 1, further comprising: At least one of a sensing sensor and an optical member, wherein the sensing sensor is disposed on the display panel, the sensing sensor senses an external input using self-capacitance or mutual capacitance, and the optical member is disposed between the window and the display panel.

10. The electronic device according to claim 1, wherein: The electronic device comprises: a folding region, folded about a folding axis extending in one direction; a first unfolded region extending from a first side of the folded region; and The second unfolded area extends from a second side of the folded area.

11. The electronic device according to claim 1, wherein: The photosensitive resin layer includes photosensitive polyimide.

12. Electronic equipment, including: window; A display panel, disposed below the window; as well as A digital converter is arranged below the display panel, and the digital converter includes: a photosensitive resin layer including a front surface and a rear surface opposite to the front surface; and A plurality of sensing coils are arranged inside the photosensitive resin layer, wherein the surface roughness of the front surface is less than the surface roughness of the rear surface and is equal to or greater than 1 micrometer and equal to or less than 10 micrometers, and Wherein, the front surface is arranged closer to the window than the rear surface.

13. The electronic device according to claim 12, wherein: The surface roughness of the rear surface is equal to or greater than 5 micrometers and equal to or less than 15 micrometers.

14. The electronic device according to claim 13, wherein: The digitizer further comprises: a shielding layer disposed on the rear surface; and an adhesive layer attaching the shielding layer to the rear surface, Wherein, the shielding layer comprises magnetic metal powder.

15. The electronic device according to claim 12, wherein: The plurality of sensing coils include: A first sensing coil extending in a first direction; and The second sensing coil extends in a second direction crossing the first direction and is spaced apart from the first sensing coil in a thickness direction of the photosensitive resin layer.

16. The electronic device according to claim 15, wherein: The photosensitive resin layer comprises: a first photosensitive resin layer, Wherein, the first sensing coil is disposed on the first photosensitive resin layer, and the first photosensitive resin layer corresponds to the front surface; a second photosensitive resin layer, covering the first sensing coil, Wherein, the second sensing coil is arranged on the second photosensitive resin layer; and A third photosensitive resin layer covers the second sensing coil and corresponds to the rear surface.

17. The electronic device according to claim 12, further comprising: At least one of the lower film and the buffer layer is disposed below the display panel.

18. The electronic device according to claim 17, wherein: The digital converter is arranged between the display panel and the lower film, or between the display panel and the buffer layer, or between the lower film and the buffer layer, or below the lowest one of the display panel, the lower film and the buffer layer.

19. Electronic equipment, including: window; A display panel, disposed below the window; as well as A digital converter is disposed below the display panel and includes a first surface and a second surface opposite to the first surface, the digital converter comprising: a first photosensitive resin layer corresponding to the first surface of the digitizer; A first sensing coil is disposed on the first photosensitive resin layer; a second photosensitive resin layer, covering the first sensing coil; a second sensing coil, disposed on the second photosensitive resin layer; and a third photosensitive resin layer covering the second sensing coil and corresponding to the second surface of the digitizer, wherein the first surface is relatively flat compared to the second surface, and Wherein, the first surface is arranged closer to the window than the second surface.

20. The electronic device according to claim 19, wherein: The first surface is disposed closer to the display panel than the second surface, and a surface roughness of the first surface is smaller than a surface roughness of the second surface.

21. The electronic device according to claim 20, wherein: The surface roughness of the first surface is equal to or greater than 1 micrometer and equal to or less than 10 micrometers, and the surface roughness of the second surface is equal to or greater than 5 micrometers and equal to or less than 15 micrometers.

22. The electronic device according to claim 20, wherein: The first photosensitive resin layer, the second photosensitive resin layer, and the third photosensitive resin layer include photosensitive polyimide.

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