A communication device

Abstract

A communication device, comprising a housing and a first board area, a second board area and a third board area which are arranged in sequence from top to bottom, characterized in that the first board area, the second board area and the third board area have independent air ducts, and a sandwich air duct communicating with the air duct of the second board area is further arranged behind the first board area, the second board area and the third board area; the air discharged from the air duct of the second board area is guided by the sandwich air duct to at least one of the upper part of the first board area and the lower part of the third board area, mixed with the air discharged from at least one of the air ducts of the first board area and the third board area, and then discharged through an air cooling module and a system air outlet channel.

Description

Technical Field

[0001] The present invention relates to, but is not limited to, equipment ventilation technology, and more particularly, to a communication device having an air duct. Background Art

[0002] With the increasing demand for information rate, the 5G communication era has arrived. Communication products are developing towards high integration and high power, and equipment heat dissipation faces huge challenges. Moreover, when the physical quantity of operator's computer room equipment remains unchanged, it means that the power consumption of the entire computer room increases sharply, and the problems of insufficient power supply, refrigeration, etc. in the computer room are becoming increasingly severe. Considering energy conservation and cost reduction, operators transform the equipment computer room and implement solutions such as layout of micro modules and micro cold pools to achieve isolation of hot and cold channels of equipment and improve the energy efficiency ratio of computer room refrigeration.

[0003] For communication devices configured with single-sided board card areas of 3 frames or more, traditional forms such as upper and lower air ducts, left and right air ducts, and front and rear air ducts have problems such as thermal cascade, large thermal resistance, and concentrated hot spots, making it difficult for equipment to dissipate heat and limiting the application scenarios or configurations. For example, in a communication device, the middle frame board card area has a one-way air flow between the plug-in box and the side of the cabinet, with a large air resistance, which affects heat dissipation. Moreover, the middle frame board card area blows hot air towards the cabinet wall, with concentrated hot spots and a high temperature of the cabinet wall, resulting in poor customer perception. In another communication device, the middle frame board card area has an air flow from the upper and lower frame board card areas, and there is a serious thermal cascade in the slot areas through which the air flows, which may lead to limited or non-configurable board cards in the upper and lower board card areas. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this article. This overview is not intended to limit the scope of protection of the claims.

[0005] An embodiment of the present invention provides a communication device, including a housing and a first board card area, a second board card area, and a third board card area sequentially arranged from top to bottom. The first board card area, the second board card area, and the third board card area have independent air ducts, and a sandwich air duct communicating with the air duct of the second board card area is further provided behind the first board card area, the second board card area, and the third board card area; the air outlet of the air duct of the second board card area is guided by the sandwich air duct to at least one of the upper part of the first board card area and the lower part of the third board card area, mixed with the air outlet of at least one of the air ducts of the first board card area and the third board card area, and then discharged through an air cooling module and a system air outlet channel.

[0006] The communication device of the above embodiment of the present invention can make the air duct distribution of the system more reasonable by designing the sandwich air duct, and can effectively improve the heat dissipation performance of the communication device.

[0007] Other aspects will be apparent after reading and understanding the drawings and the detailed description. Description of the Drawings

[0008] Figure 1 It is a front view schematic diagram of a communication device according to an exemplary embodiment of the present invention.

[0009] Figure 2 It is Figure 1 a schematic diagram of the internal structure of the shown communication device, showing the part related to the air duct.

[0010] Figure 3A It is Figure 1 a schematic diagram of the air duct of the shown communication device.

[0011] Figure 3B It is a schematic diagram of the air duct of a communication device in another example.

[0012] Figure 4 It is Figure 1 a schematic diagram of the board in the second board area of the shown communication device.

[0013] Figure 5 It is Figure 1 a schematic diagram of the first partition and the second partition in the second board area of the shown communication device.

[0014] Figure 6 It is Figure 1 a schematic diagram of the internal structure of the device when the backplane of each board area of the shown communication device is changed to an integral backplane, showing the part related to the air duct.

[0015] Figure 7 It is a schematic diagram of the internal structure and air duct of a communication device according to another exemplary embodiment of the present invention.

[0016] Figure 8 It is Figure 7 a schematic diagram of the backplane in

[0017] Figure 9 It is Figure 7 a schematic diagram of the air duct in the second board area of the shown communication device. Detailed implementation manners

[0018] This application describes multiple embodiments, but the description is exemplary rather than restrictive, and it is obvious to those of ordinary skill in the art that there can be more embodiments and implementation schemes within the scope of the embodiments described in this application. Although many possible feature combinations are shown in the drawings and discussed in the detailed implementation manners, many other combination ways of the disclosed features are also possible. Unless specifically restricted, any feature or element of any embodiment can be combined with any other feature or element in any other embodiment, or can replace any other feature or element in any other embodiment.

[0019] An exemplary embodiment of the present invention provides a communication device. By arranging a plurality of partitions and combining with existing structural features such as the backplane inside the device, an interlayer air duct in the middle board card area is formed, so that the inlet and outlet air ducts of the upper, middle and lower board card areas are independent. The air-cooling module of the system is arranged in the rear area of the device to extract air from each board card area. After the middle board card area enters air from the front panel, after dissipating heat from the heat source components, the air flows into the interlayer air duct, mixes with the high-temperature air flowing through the upper board card area and the lower board card area, and then is extracted from the device by the air-cooling module at the rear to complete the system heat dissipation. Based on the above design, while overall realizing the front-in and rear-out air duct of the device, on the one hand, the air ducts of each board card area inside the device are independent, and the air flow and temperature distribution inside the device are more uniform, solving the problems of thermal cascade and hot spot concentration; on the other hand, there are fewer obstacles and better controllability in the air duct inside the device, which can solve the problem of large thermal resistance of the middle frame; in addition, system noise reduction can also be achieved by setting sound-absorbing materials on the air duct inside the device, improving the system heat dissipation capacity.

[0020] The communication device according to an exemplary embodiment of the present invention includes a housing and a first board card area, a second board card area, and a third board card area sequentially arranged from top to bottom. The first board card area, the second board card area, and the third board card area have independent air ducts, and an interlayer air duct communicating with the air duct of the second board card area is further arranged behind the first board card area, the second board card area, and the third board card area; the air outlet of the air duct of the second board card area is guided by the interlayer air duct to at least one of the upper part of the first board card area and the lower part of the third board card area, mixes with the air outlet of at least one of the air ducts of the first board card area and the third board card area, and then is discharged through the air-cooling module and the system air outlet channel. In one example, the interlayer air duct is arranged to divide the air outlet of the air duct of the second board card area into two paths and guide them to the upper part of the first board card area and the lower part of the third board card area respectively, and mix with the air outlets of the air ducts of the first board card area and the third board card area respectively. In another example, the interlayer air duct is arranged to guide the air outlet of the air duct of the second board card area to the upper part of the first board card area or the lower part of the third board card area, and mix with the air outlet of the air duct of the first board card area or the third board card area.

[0021] In one example, air inlet holes of the first board card area, the second board card area, and the third board card area are respectively arranged on the front of the housing. The air ducts of the first board card area, the second board card area, and the third board card area include: a first air duct arranged inside the housing and communicating with the air inlet hole of the first board card area, a second air duct communicating with the air inlet hole of the second board card area, and a third air duct communicating with the air inlet hole of the third board card area. The first air duct, the second air duct, and the third air duct are independent of each other.

[0022] In one example, a first air mixing channel communicating with the first air duct and located above the first board area is arranged inside the housing, and a second air mixing channel communicating with the third air duct and located below the third board area; the interlayer air duct communicates the second air duct with the first air mixing channel and the second air mixing channel respectively, and the first air mixing channel and the second air mixing channel are respectively connected to the system air outlet channel through their respective air cooling modules.

[0023] In one example, the system air outlet channel communicates with an air outlet hole provided on the rear surface of the housing.

[0024] The communication device according to the embodiment of the present invention may also be a communication device with more than 4 frames and more than 4 board areas. At this time, except for one first board area at the upper part and one third board area at the lower part, the others are all second board areas in the middle. That is to say, the second board area in the text may include one board area or multiple board areas. When the second board area includes multiple board areas, the air ducts of the second board area include the air ducts of multiple board areas, and the air ducts of the multiple board areas may be communicated with each other or isolated from each other.

[0025] In the embodiment of the present invention, the boards in the first board area, the second board area, and the third board area are functional boards for realizing functions such as control, processing, and signal transmission, and realize the normal service functions of the communication device. The first backplane, the second backplane, and the third backplane are circuit boards provided at the rear of the first board area, the second board area, and the third board area respectively, and the boards in each board area are inserted into the corresponding backplane for operation.

[0026] The communication device of the above embodiment of the present invention has at least one of the following characteristics:

[0027] The air ducts in each board area inside the device are independent, and the air flow and temperature distribution inside the device are more uniform, solving the problems of thermal cascade and hot spot concentration;

[0028] There are fewer obstacles and more controllable air ducts inside the device, which can solve the problem of large thermal resistance in the middle frame.

[0029] By providing an air inlet hole at the front of the device and an air outlet hole at the rear, the overall air duct form of front-in and rear-out is realized.

[0030] In an exemplary embodiment of the present invention, as Figures 1 to 5 shown, the boards in the first board area 21 are arranged longitudinally and parallel to each other. The air inlet hole 11-1 of the first board area 21 is provided on the front surface 11 of the housing 1 between the first board area 21 and the second board area 22. The first air duct includes an air inlet channel 21-1 formed by the first board area 21, the side wall surfaces of the housing 1, and the first baffle. The first baffle is located below the first board area 21 and isolates the first air duct 21-1 from the second air duct.

[0031] The circuit boards in the third circuit board area 23 are arranged longitudinally (the longitudinal direction is the vertical direction) in parallel. The air inlet holes 11-2 of the third circuit board area 23 are provided on the front surface 11 of the housing 1 between the third circuit board area 23 and the second circuit board area 22. The third air duct includes an air inlet channel 23-1 formed by the third circuit board area 23, the side wall surfaces of the housing 1, and the second baffle. The second baffle is located above the third circuit board area 23 to isolate the third air duct from the second air duct. In Figures 1 to 5 In the illustrated example, the first baffle is the first air guiding plate 51 with a lower front and a higher rear, and the second baffle is the second air guiding plate 52 with a higher front and a lower rear. However, the present application is not limited thereto, and the first baffle and the second baffle can also be arranged horizontally.

[0032] The circuit boards in the second circuit board area 22 are arranged horizontally (the horizontal direction is the horizontal direction) in parallel. The air inlet holes 62-1 of the second circuit board area 22 are provided on the panel of the second circuit board area 22. The second air duct includes a ventilation channel formed by the second circuit board area 22, the wall surface of the housing 1, the third baffle, and the fourth baffle; the third baffle is located above the second circuit board area 22 to isolate the second air duct from the first air duct, and the fourth baffle is located below the second circuit board area 22 to isolate the second air duct from the third air duct. The third baffle here and the above-mentioned first baffle can be the same board or not, and the fourth baffle and the above-mentioned second baffle can be the same board or not. There can be one or more baffles for isolating two air ducts.

[0033] The following uses two examples to illustrate two specific structures of the second circuit board area 22:

[0034] In Figures 1 to 5 In the illustrated example, the air inlet holes 62-1 of the second circuit board area 22 are provided in the middle of the panel of the second circuit board area 22. The third baffle is the first air guiding plate 51 with a lower front and a higher rear, and the fourth baffle is the second air guiding plate 52 with a higher front and a lower rear. Ventilation spaces are left on both sides of the second circuit board area 22. A first partition 34 is provided at the top of the second circuit board area 22, and a second partition 35 is provided at the bottom. As Figure 5 shown, ventilation holes 6 are provided on both sides of the first partition 34 and the second partition 35. In one example, as Figure 4 shown, the ventilation spaces on both sides of the second circuit board area 22 are communicated through the ventilation holes 5 opened on both sides of the printed circuit board in the second circuit board area 22. In this example, as Figure 3A shown, the second air duct formed by the above structure includes an upper air outlet channel 22-1 and a lower air outlet channel 22-2. Here, "upper" and "lower" represent the relative positional relationship between the air outlet channel 22-1 and the air outlet channel 22-2.

[0035] In Figures 7 to 9In another example shown, the backplane 8 is an integral backplane. The air inlet holes 62-1 of the second card slot area 22 are provided in the middle of the panel of the second card slot area 22. The third baffle is the first partition 34 at the top of the second card slot area 22, and the fourth baffle is the second partition 35 at the bottom of the second card slot area 22. Ventilation spaces are left between both sides of the second card slot area 22 and the side wall surfaces of the housing 1. As Figure 8 shown, ventilation holes 81 and 82 are provided at positions corresponding to the two ventilation spaces on both sides of the backplane 8 of the second card slot area 22 to communicate the second air duct and the interlayer air duct 2. In this example, the second air duct includes an air outlet channel 22-1' on the left side and an air outlet channel 22-2' on the right side.

[0036] There can be various ways to connect the interlayer air duct 2 and the second air duct.

[0037] As Figures 1 to 5 shown in the example, the backplanes of the first card slot area 21, the second card slot area 22, and the third card slot area 23 are separately provided. The interlayer air duct 2 is composed of the first backplane 31 of the first card slot area 21, the second backplane 32 of the second card slot area 22, the third backplane 33 of the third card slot area 23, the third partition 36 provided behind these backplanes, and the side wall surfaces of the housing 1. The second air duct includes an upper air outlet channel 22-1 and a lower air outlet channel 22-2. In this example, the interlayer air duct 2 and the second air duct are connected through the intervals between different backplanes.

[0038] As Figure 6 shown in the example, the backplanes of the first card slot area 21, the second card slot area 22, and the third card slot area 23 are an integral backplane 7. The second air duct includes an upper air outlet channel 22-1 and a lower air outlet channel 22-2. At this time, the interlayer air duct 2 and the second air duct are connected through the ventilation hole 71 corresponding to the upper air outlet channel 22-1 and the ventilation hole 72 corresponding to the lower air outlet channel 22-2 on the backplane 7.

[0039] As Figures 7 to 9 shown in the example, the backplanes of the first card slot area 21, the second card slot area 22, and the third card slot area 23 are an integral backplane 8. The second air duct includes an air outlet channel 22-1' on the left side and an air outlet channel 22-2' on the right side. The integral backplane 8 is provided with a ventilation hole 81 at a position corresponding to the air outlet channel 22-1' on the left side and a ventilation hole 82 at a position corresponding to the air outlet channel 22-2' on the right side.

[0040] As Figure 2 、 Figure 3AAs shown, the air-cooling module includes a first air-cooling module 41 disposed at the upper part behind the interlayer air duct 2, and a second air-cooling module 42 disposed at the lower part behind the interlayer air duct 2. The system air outlet channel is located behind the interlayer air duct and between the first air-cooling module 41 and the second air-cooling module 42, and is separated by a third air deflector 53 into a first air outlet channel 12-2 and a second air outlet channel 12-3. The first air outlet channel 12-2 and the second air outlet channel 12-3 are each communicated with the outside through an air outlet hole 12-1 on the rear surface 12 of the housing 1. The second air mixing channel 4 is also the air outlet channel of the third board area 23, and the first air mixing channel 3 is also the air outlet channel of the first board area 21. In Figure 3B In another example shown, the air-cooling module includes a first air-cooling module 41' disposed above the first air mixing channel 3, and a second air-cooling module 42' disposed at the lower part behind the interlayer air duct 2. The system air outlet channel includes a first air outlet channel 12-2' located above the first air-cooling module 41' and a second air outlet channel 12-3' located behind the interlayer air duct 2. The second air outlet channel 12-3' and the first air mixing channel 3 are separated by a third air deflector 53'. The first air outlet channel 12-2' and the second air outlet channel 12-3' are each communicated with the outside through an air outlet hole 12-1 on the rear surface 12 of the housing 1.

[0041] Sound-absorbing materials are provided on the wall surfaces of at least one of the first air mixing channel 3, the second air mixing channel 4, and the system air outlet channel in the above embodiments to eliminate noise as much as possible.

[0042] In the above exemplary embodiments, the structural features of the first partition 34 and the second partition 35 can be the same, and they are respectively in close contact with the upper and lower surfaces of the second board area 22, and are mirror-symmetrical with respect to the second board area 22; there is a certain distance between the third partition 36 and the first backplane 31, the second backplane 32, and the third backplane 33 to form an interlayer air duct 2; there is a certain distance between the third partition 36 and the rear surface 12 of the housing 1. A first air-cooling module 41 is provided between the upper part of the third partition 36 and the rear surface 12 of the housing 1, and the first air-cooling module can be adjusted in position as needed; a second air-cooling module 42 is provided between the lower part of the third partition 36 and the rear surface 12 of the housing 1, and the second air-cooling module 42 can be adjusted in position as needed; a third air deflector 53 is provided between the middle position of the third partition 36 and the rear surface 12 of the housing 1. The first air outlet channel 12-2 of the system is formed among the third air deflector 53, the part of the third partition 36 above the third air deflector 53, the wall surface of the housing 1, and the rear surface 12 of the housing 1; the second air outlet channel 12-3 of the system is formed among the third air deflector 53, the part of the third partition 36 below the third air deflector 53, the wall surface of the housing 1, and the rear surface 12 of the housing 1.

[0043] In the above exemplary embodiments, the first card area 21 is spaced apart from the inner surface of the top of the housing 1 by a certain distance. A first mixed air channel 3 is formed among the upper part of the first card area 21, the upper part of the first air cooling module 41, and the housing 1. A first air guiding plate 51 is arranged between the first card area 21 and the first partition plate 34 at the upper part of the second card area 22. The first air guiding plate 51 is spaced apart from the first card area 21 by a certain distance. An air inlet channel 21-1 of the first card area 21 is formed among the first air guiding plate 51, the first card area 21, and the left and right side walls of the housing 1.

[0044] In the above exemplary embodiments, an air inlet hole 62-1 is arranged in the middle of the panel of the second card area 22 to form an air inlet channel of the second card area 22. In Figures 1 to 6 In the shown example, ventilation holes 5 with a certain ventilation area are respectively arranged on the left and right of the printed circuit board (PCB) of the cards in the second card area 22. Ventilation holes 6 with similar sizes are arranged at the positions of the first partition plate 34 and the second partition plate 35 corresponding to the ventilation holes 5 of the second card PCB. The ventilation holes 6 arranged on the first partition plate 34 and the second partition plate 35 are the air outlet of the second card area 22. The first air guiding plate 51 is spaced apart from the first partition plate 34 at the upper part of the second card area 22 by a certain distance. A first air outlet channel 22-1 of the second card area 22 is formed among the first air guiding plate 51, the first partition plate 34, and the left and right wall surfaces of the housing 1, and is communicated with the sandwich air duct 2 through the gap between the first back plate 31 and the second back plate 32. A second air guiding plate 52 is arranged between the second partition plate 35 of the second card area 22 and the third card area 23. The second partition plate 35 is spaced apart from the second air guiding plate 52 by a certain distance. A second air outlet channel 22-2 of the second card area 22 is formed among the second partition plate 35, the second air guiding plate 52, and the left and right wall surfaces of the housing 1, and is communicated with the sandwich air duct 2.

[0045] In the above exemplary embodiments, the second air guiding plate 52 is spaced apart from the third card area 23 by a certain distance. An air inlet channel 23-1 of the third card area 23 is formed among the second air guiding plate 52, the third card area 23, and the left and right side wall surfaces of the housing 1.

[0046] In the above exemplary embodiments, the third card area 23 is spaced apart from the inner surface of the bottom of the housing 1 by a certain distance. A second mixed air channel 4 is formed among the lower part of the third card area 23, the lower part of the second air cooling module 42, and the inner surface of the housing 1.

[0047] When the device is working, the system air flow enters the air inlet channels of the first board area, the second board area, and the third board area from the air inlet holes on the front surface of the housing, flows through the heat-consuming devices on the boards in the corresponding board areas, dissipates heat from the heat-consuming devices, and then flows into the air outlet channels of the corresponding board areas. The high-temperature air flow in the air outlet channel of the first board area and the high-temperature air flow in the second board area that enters the interlayer air duct and flows upward merge into one in the first air mixing channel and are drawn into the first air outlet channel of the system by the first air cooling module. The high-temperature air flow in the air outlet channel of the third board area and the high-temperature air flow in the second board area that enters the interlayer air duct and flows downward merge into one in the second air mixing channel and are drawn into the second air outlet channel of the system by the second air cooling module. The high-temperature air flows passing through the first air outlet channel and the second air outlet channel of the system flow out of the device through the air outlet holes on the rear surface of the housing, and the heat dissipation of the system is realized throughout the process.

[0048] In the above exemplary embodiments, sound-absorbing materials can also be provided on the walls of air ducts such as the first air mixing channel, the second air mixing channel, the first air outlet channel, and the second air outlet channel to reduce noise in the internal air ducts of the system and improve the heat dissipation capacity of the system.

[0049] The communication device of the above embodiments of the present invention has at least one of the following effects:

[0050] By designing the interlayer air duct, the air duct distribution of the system is made more reasonable, which can effectively improve the heat dissipation of the system and solve the heat dissipation problems such as equipment thermal cascade, large air resistance, and high local air temperature.

[0051] It can achieve overall front air intake and rear air outlet, meet the equipment layout requirements of separating cold and hot air ducts in the operator's computer room, and there is no need to make a frame-cabinet integrated structure.

[0052] Through the reasonable design of the air ducts, the heat dissipation capacity of the system can be improved in the embodiments of the communication device of the present invention to prepare for subsequent expansion and upgrade of the product.

[0053] Next, a detailed description will be given of the Figures 1 to 9 embodiment.

[0054] Please refer to Figures 1~5 , a communication device includes a housing 1, a first board area 21, a second board area 22, a third board area 23, a first backplane 31, a second backplane 32, a third backplane 33, a first partition 34, a second partition 35, a third partition 36, a first air cooling module 41, a second air cooling module 42, a first air guiding plate 51, a second air guiding plate 52, and a third air guiding plate 53.

[0055] The front surface 11 of the housing 1 is provided with ventilation holes 11-1 (i.e., the air inlet holes 11-1 mentioned above) and ventilation holes 11-2 (i.e., the air inlet holes 11-2 mentioned above); the rear surface 12 is provided with a ventilation hole 12-1 (i.e., the air outlet hole 12-1 mentioned above); the ventilation holes 11-1 and 11-2 are the air inlet areas of the communication device, and the ventilation hole 12-1 is the air outlet area of the communication device.

[0056] A series of longitudinally parallel arranged circuit boards 61 are provided in the first circuit board area 21; laterally parallel arranged circuit boards 62 are provided in the second circuit board area 22; longitudinally parallel circuit boards 63 are provided in the third circuit board area 23.

[0057] The first backplane 31, the second backplane 32, and the third backplane 33 are the circuit boards of the circuit boards in the first circuit board area 21, the second circuit board area 22, and the third circuit board area 23 respectively, realizing functions such as signal and circuit connection between the circuit boards. The circuit boards 61 in the first circuit board area 21, the circuit boards 62 in the second circuit board area 22, and the circuit boards 63 in the third circuit board area 23 are inserted into the corresponding first backplane 31, second backplane 32, and third backplane 33 to operate; insulating and heat-insulating materials can be provided on the back of the backplane corresponding to the circuit board area to protect the first backplane 31, the second backplane 32, and the third backplane 33.

[0058] The third partition 36 is set at a certain distance from the first backplane 31, the second backplane 32, and the third backplane 33 to form an interlayer air duct 2; there is a certain distance between the third partition 36 and the rear surface 12 of the housing 1. A first air-cooling module 41 is provided between the upper part of the third partition 36 and the rear surface 12 of the housing 1; a second air-cooling module 42 is provided between the lower part of the third partition 36 and the rear surface 12 of the housing 1; a third air guide plate 53 is provided between the middle position of the third partition 36 and the rear surface 12 of the housing 1 to separate the space between the third partition 36 and the rear wall of the housing 1. A first air outlet channel 12-2 of the system is formed between the position above the middle of the third partition 36 and the rear surface 12 of the housing 1; a second air outlet channel 12-3 of the system is formed between the position below the middle of the third partition 36 and the rear surface 12 of the housing 1.

[0059] The first circuit board area 21 is placed relative to the upper part of the housing 1, and there is a certain distance between the first circuit board area 21 and the inner surface of the upper part of the housing 1. The space enclosed by the upper part of the first circuit board area 21, the upper part of the first air-cooling module 41, and the wall surface of the housing 1 forms a first mixed air channel 3.

[0060] The second circuit board area 22 is placed relative to the middle part of the housing 1. The first partition 34 and the second partition 35 with the same characteristics are provided on the upper and lower surfaces of the second circuit board area 22. The first partition 34 and the second partition 35 are mirror-symmetrical with respect to the second circuit board area 22. A first air guide plate 51 is provided between the first partition 34 and the first circuit board area 21, and a second air guide plate 52 is provided between the second partition 35 and the third circuit board area 23.

[0061] The panel of the circuit board 62 in the second circuit board area 22 is provided with ventilation holes 62-1, which serve as the air inlet holes for the second circuit board area 22; ventilation holes 5 with a certain ventilation area are provided on the left and right of the PCB of the circuit board 62; ventilation holes 6 with similar dimensions are provided at the positions corresponding to the PCB ventilation holes of the first partition 34, the second partition 35 and the circuit board 62, which serve as the air outlet holes for the second circuit board area.

[0062] There is a certain distance between the first circuit board area 21 and the first air guide plate 51, and an air inlet channel 21-1 for the first circuit board area 21 is formed among the first circuit board area 21, the first air guide plate 51 and the wall surface of the housing 1.

[0063] There is a certain distance between the first partition 34 of the second circuit board area 22 and the first air guide plate 51, and a first air outlet channel 22-1 for the second circuit board area 22 is formed among the first partition 34, the first air guide plate 51 and the wall surface of the housing 1, which is communicated with the interlayer air duct 2.

[0064] There is a certain distance between the second partition 35 of the second circuit board area 22 and the second air guide plate 52, and a second air outlet channel 22-2 for the second circuit board area 22 is formed among the second partition 35, the second air guide plate 52 and the wall surface of the housing 1, which is communicated with the interlayer air duct 2.

[0065] There is a certain distance between the third circuit board area 23 and the second air guide plate 52, and an air inlet channel 23-1 for the third circuit board area 23 is formed among the third circuit board area 23, the second air guide plate and the wall surface of the housing 1.

[0066] There is a certain distance between the third circuit board area 23 and the inner surface of the bottom of the housing 1, and a space surrounded by the lower part of the third circuit board area 23, the lower part of the second air cooling module 42 and the wall surface of the housing 1 forms a second mixed air channel 4.

[0067] The system air flow enters the air inlet channel 21-1 of the first circuit board area 21 from the ventilation hole 11-1 on the front surface 11 of the housing 1, flows through the heat source devices of the circuit boards 61 in the first circuit board area 21, and brings the heat to the first mixed air channel 3.

[0068] The system air flow enters the air inlet channel 23-1 of the third circuit board area 23 from the ventilation hole 11-2 on the front surface 11 of the housing 1, flows through the heat source devices of the circuit boards 63 in the third circuit board area 23, and brings the heat to the second mixed air channel 4.

[0069] The system air flow enters the second circuit board area 22 from the panel ventilation hole 62-1 of the circuit board 62 in the second circuit board area 22, flows through the heat source devices of the circuit board 62, and brings the heat upward to the first air outlet channel 22-1 of the second circuit board area 22, then enters the interlayer air duct 2, and then enters the first mixed air channel 3 upward; the high-temperature air flows in the first circuit board area 21 and the second circuit board area 22 are combined into one in the first mixed air channel 3 and are pumped by the first air cooling module 41 to the system first air outlet channel 12-2.

[0070] The system air flow enters the second board area 22 from the panel ventilation holes 62-1 of the board 62 in the second board area 22, flows through the heat source devices of the board 62, takes the heat downward to the second air outlet channel 22-2 of the second board area 22, and then enters the interlayer air duct 2 and goes downward into the second air mixing channel 4; the high-temperature air flows in the third board area 23 and the second board area 22 are combined into one in the second air mixing channel 4 and are drawn by the second air cooling module 42 into the system second air outlet channel 12-3.

[0071] The high-temperature air flow passing through the system first air outlet channel 12-2 and the system second air outlet channel 12-3 flows out of the device through the ventilation holes 12-1 on the rear surface 12 of the housing 1, and the heat dissipation of the system is realized throughout the process.

[0072] Sound-absorbing materials are provided at positions such as the walls of the first air mixing channel 3, the second air mixing channel 4, the system first air outlet channel 12-2, and the system second air outlet channel 12-3 for noise reduction design on the internal air flow channels of the system.

[0073] The above first backplane 31, second backplane 32, and third backplane 33 are in a separated form, or can also be an integral backplane 7 (please refer to Figure 6 ); ventilation holes 71 are provided at positions corresponding to the positions between the first board area 21 and the second board area 22 on the integral backplane 7; ventilation holes 72 are provided at positions corresponding to the positions between the third board area 23 and the second board area 22 on the integral backplane 7, and the first air outlet channel 22-1 and the second air outlet channel 22-2 of the second board area 22 are respectively communicated with the interlayer air duct 2 through the ventilation holes 71 and ventilation holes 72; the air duct form is the same as above.

[0074] Please refer to Figures 7~9 , which is the second embodiment of the present invention. The system architecture and most of the air duct forms are the same as those of the above first embodiment, and the difference lies in the second board area 22 and its air duct form.

[0075] The first backplane 31, second backplane 32, and third backplane 33 are changed to an integral backplane 8; the ventilation holes 5 on the PCB board of the board 62 in the second board area 22 are cancelled, and the ventilation holes 6 on the first partition 34 and the second partition 35 are cancelled.

[0076] The left and right sides of the second board area 22 are respectively spaced a certain distance from the left and right sides of the housing 1, and ventilation holes 81 and ventilation holes 82 with the same size are opened on the left and right corresponding to the second board area 22 on the integral backplane 8.

[0077] The left side of the second board area 22, the left side wall of the housing 1, the first partition 34, and the second partition 35 form the first air outlet channel 22-1' of the second board area 22, which is communicated with the interlayer air duct 2 through the ventilation hole 81.

[0078] On the right side of the second circuit board area 22, the right side wall of the housing 1, the first partition 34, and the second partition 35 form a second air outlet channel 22-2' of the second circuit board area 22, which is communicated with the interlayer air duct 2 through the ventilation holes 82.

[0079] The system air flow enters the second circuit board area 22 from the panel ventilation holes 62-1 of the circuit boards 62 in the second circuit board area 22, flows through the heat source devices of the circuit boards 62, and brings heat to the first air outlet channel 22-1' and the second air outlet channel 22-2' of the second circuit board area 22 to the left and right respectively. Then, after passing through the ventilation holes 81 and 82 of the overall backplane 8, it enters the interlayer air duct 2, and enters the first mixing air channel 3 and the second mixing air channel 4 upward and downward respectively, and is integrated with the high-temperature air flows of the first circuit board area 21 and the third circuit board area 23, and is respectively drawn into the system first air outlet channel 12-2 and the system second air outlet channel 12-3 by the first air cooling module 41 and the second air cooling module 42.

[0080] The high-temperature air flows passing through the system first air outlet channel 12-2 and the system second air outlet channel 12-3 flow out of the device through the ventilation holes 12-1 on the rear surface 12 of the housing 1, and the heat dissipation of the system is realized throughout the process.

[0081] A communication device of the present invention solves problems such as thermal cascade, large air resistance, and high local air flow temperature by adopting a reasonable air duct design and noise reduction measures, realizes the front-in and rear-out air duct form of the device, and according to evaluation, the slot heat dissipation capacity can be increased by about 40%.

[0082] In the description of the present application, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. In the description of this specification, the description of terms such as "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, "front", "rear", "upper", "lower", "left", "right" are based on the orientation of the device. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or instance. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. Although the disclosed embodiments of the present application are as above, the content described is only an embodiment adopted for the convenience of understanding the present application and is not used to limit the present application. Any person skilled in the art within the scope of the present application can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed by the present application. However, the scope of patent protection of the present application shall still be subject to the scope defined by the appended claims.

Claims

1. A communication device, comprising a housing and a first board area, a second board area, and a third board area sequentially arranged from top to bottom, characterized in that, the first board area, the second board area, and the third board area have independent air ducts, and a sandwich air duct communicating with the air duct of the second board area is further arranged behind the first board area, the second board area, and the third board area; air inlet holes of the first board area, the second board area, and the third board area are respectively arranged on the front surface of the housing, and the air ducts of the first board area, the second board area, and the third board area include: a first air duct communicating with the air inlet hole of the first board area, a second air duct communicating with the air inlet hole of the second board area, and a third air duct communicating with the air inlet hole of the third board area, and the first air duct, the second air duct, and the third air duct are independent of each other; a first air mixing channel communicating with the first air duct and located above the first board area and a second air mixing channel communicating with the third air duct and located below the third board area are arranged in the housing; the sandwich air duct connects two air outlet channels on different sides of the second air duct to the first air mixing channel and the second air mixing channel respectively, and the first air mixing channel and the second air mixing channel are respectively connected to the system air outlet channel through their respective air cooling modules.

2. The communication device according to claim 1, characterized in that: the boards in the first board area are longitudinally arranged in parallel, the air inlet hole of the first board area is arranged on the front surface of the housing between the first board area and the second board area, and the first air duct includes an air inlet channel formed by the first board area, the side wall surfaces of the housing, and a first baffle, and the first baffle is located below the first board area to isolate the first air duct from the second air duct; the boards in the third board area are longitudinally arranged in parallel, the air inlet hole of the third board area is arranged on the front surface of the housing between the third board area and the second board area, and the third air duct includes an air inlet channel formed by the third board area, the side wall surfaces of the housing, and a second baffle, and the second baffle is located above the third board area to isolate the third air duct from the second air duct.

3. The communication device according to claim 1, characterized in that: the air inlet hole of the second board area is arranged on the panel of the second board area, and the second air duct includes a ventilation channel formed by the second board area, the housing wall surface, a third baffle, and a fourth baffle; the third baffle is located above the second board area to isolate the second air duct from the first air duct, and the fourth baffle is located below the second board area to isolate the second air duct from the third air duct.

4. The communication device according to claim 3, characterized in that: The boards in the second board area are arranged horizontally and in parallel. The air inlet holes of the second board area are provided in the middle of the panel of the second board area. Ventilation spaces are left on both sides of the second board area. A first partition is provided at the top of the second board area, and a second partition is provided at the bottom of the second board area. Ventilation holes are provided at positions on both sides of the first partition and the second partition corresponding to the ventilation spaces. The first partition, the third baffle, and the housing wall surface form an air outlet channel of the second air duct. The second partition, the fourth baffle, and the housing wall surface form another air outlet channel of the second air duct.

5. The communication device according to claim 4, characterized in that: The ventilation spaces on both sides of the second board area are communicated through the ventilation holes provided on both sides of the printed circuit board in the second board area.

6. The communication device according to claim 3, characterized in that: The boards in the second board area are arranged horizontally and in parallel. The air inlet holes of the second board area are provided in the middle of the panel of the second board area. The third baffle is the first partition at the top of the second board area, and the fourth baffle is the second partition at the bottom of the second board area. Ventilation spaces are left between both sides of the second board area and the two side wall surfaces of the housing. Two ventilation holes are provided at positions on both sides of the back panel of the second board area corresponding to the two ventilation spaces.

7. The communication device according to claim 1, characterized in that: The interlayer air duct is composed of the back panels of the first board area, the second board area, and the third board area, the third partition provided behind the back panels, and the two side wall surfaces of the housing; The back panels of the first board area, the second board area, and the third board area are separately provided, and the interlayer air duct communicates with the second air duct through the intervals between different back panels; or, the back panels of the first board area, the second board area, and the third board area are an integral back panel, and the interlayer air duct communicates with the second air duct through the through holes provided on the back panel.

8. The communication device according to claim 1, characterized in that: The air cooling module includes a first air cooling module provided in the upper part behind the interlayer air duct, and a second air cooling module provided in the lower part behind the interlayer air duct. The system air outlet channel is located behind the interlayer air duct and between the first air cooling module and the second air cooling module, and is separated into a first air outlet channel and a second air outlet channel by a wind guiding plate; or The air cooling module includes a first air cooling module provided above the first mixed air channel, and a second air cooling module provided in the lower part behind the interlayer air duct. The system air outlet channel includes a first air outlet channel located above the first air cooling module and a second air outlet channel located behind the interlayer air duct. The second air outlet channel and the first mixed air channel are separated by a wind guiding plate.

9. The communication device according to claim 8, characterized in that: The first air outlet channel and the second air outlet channel are respectively communicated with the outside through the air outlet holes on the rear surface of the housing.

10. The communication device according to claim 1, characterized in that: The second card area in the middle of the device includes one card area; or The second card area in the middle of the device includes multiple card areas, and the air ducts of the multiple card areas are interconnected or isolated from each other.

11. The communication device according to claim 1, characterized in that: Sound-absorbing materials are provided on the wall surfaces of at least one of the first mixed air channel, the second mixed air channel, and the system air outlet channel.

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