Silicon rod cutting equipment

Abstract

The present application provides a silicon rod cutting device, comprising: a silicon rod loading device, arranged between a material storage area and a cutting work area, for transferring the silicon rods to be cut placed in the material storage area to the cutting work area; a wire cutting device, comprising a cutting frame suspended on the upper side of the cutting work area, the cutting frame being provided with a single-wire wire saw and a multi-wire wire saw, for cutting the silicon rods placed in the cutting work area, and realizing the conversion between a first cutting state of cutting by the multi-wire wire saw and a second cutting state of cutting by the single-wire wire saw through the rotation of the cutting frame; a silicon rod unloading device, arranged at the discharge end of the cutting work area, for clamping and transporting the single-segment silicon rod segments that meet the workpiece specifications after being cut for unloading.

Description

Technical Field

[0001] The present application relates to the technical field of multi-wire cutting, and in particular to a silicon rod cutting device for cutting silicon rods. Background Art

[0002] Wire cutting technology is the most advanced silicon material processing technology in the world. Its principle is that a high-speed steel wire drives the cutting blade attached to the steel wire or directly uses a diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. During the cutting process, the steel wire or diamond wire is guided by the wire wheel to form a wire saw or a wire net on the cutting roller, and the workpiece to be processed is fed by the rise and fall of the worktable or the rise and fall of the wire saw or wire net. Under the action of the pressure pump, the automatic cooling water spraying device installed on the equipment sprays cold water to the steel wire or diamond wire and the cutting part of the workpiece, and the steel wire or diamond wire reciprocates to produce cutting, so as to cut the material to be processed into multiple pieces at one time. Compared with traditional knife saw blades, grinding wheels and inner circle cutting, wire cutting technology has the advantages of high efficiency, high production capacity and high precision.

[0003] The current silicon rod cutting machine needs to first cut off the impurity layer at the head and tail of the silicon rod that does not meet the production requirements in the processing technology before cutting the silicon rod, and then slice and take samples to test the material properties of the silicon rod to be cut; the existing sample acquisition technology moves the cutting frame or silicon rod a short distance after cutting off the head or tail of the silicon rod, and then repeats the cutting operation to cut silicon wafer samples. It is difficult to accurately control the short-distance movement of the cutting frame or silicon rod, and it is difficult to unify the specifications of the cut samples and it is easy to cause waste of silicon rod materials. The sampling operation in the traditional process also reduces the cutting efficiency.

[0004] Generally speaking, in the relevant technologies, the operations required for each process are arranged independently, and the operating equipment is scattered in different production units or production workshops or different production areas of the production workshops. The conversion of workpieces performing different process operations requires transportation and allocation. The processes are complicated and inefficient, requiring a large amount of manpower or transfer equipment, and there are great safety hazards. In addition, there are many flow links between the operating equipment of each process, which increases the risk of workpiece damage during the transfer process, and is prone to unqualified or unreasonable consumption caused by non-production factors. Summary of the invention

[0005] In view of the shortcomings of the prior art mentioned above, the purpose of the present application is to provide a silicon rod cutting device that can automatically switch between different processes, including a cutting system with both a single-wire wire saw and a multi-wire wire saw, an automatic loading device and an automatic unloading device, which is used to solve the problems in the prior art that the accuracy of obtaining samples is difficult to control, obtaining samples causes waste of silicon rod materials and reduces cutting efficiency, the transfer of workpieces in different processes causes workpiece damage, and the process is complicated and inefficient.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application provides a silicon rod cutting device, including a silicon rod loading device, which is arranged between a storage area and a cutting work area, and is used to transfer the silicon rods to be cut placed in the storage area to the cutting work area; a wire cutting device, including an upper cutting frame suspended in the cutting work area, and a single-wire wire saw and a multi-wire wire saw are arranged on the cutting frame. When cutting the silicon rods placed in the cutting work area, the cutting frame is used to realize the conversion between a first cutting state of cutting by the multi-wire wire saw and a second cutting state of cutting by the single-wire wire saw through the rotation of the cutting frame; a silicon rod unloading device, which is arranged at the discharge end of the cutting work area, and is used to clamp and transport the single-segment silicon rod segments that meet the workpiece specifications after truncation for unloading.

[0007] In some embodiments of the present application, the wire cutting device includes: a cutting frame, rotatably disposed on a lifting mechanism, including a rotating part, a first cantilever extending from the rotating part in a first direction, a second cantilever extending from the rotating part in a second direction, and a third cantilever extending from the rotating part in a third direction; a first multi-wire cutting wheel, disposed at an extended end of the first cantilever, having at least two wire grooves; a second multi-wire cutting wheel, disposed at an extended end of the second cantilever, having at least two wire grooves, and a multi-wire wire saw is formed by winding around the cutting wire segment between the first multi-wire cutting wheel and the second multi-wire cutting wheel; a single-wire cutting wheel, disposed at an extended end of the third cantilever, and a single-wire wire saw is formed by winding around the cutting wire segment between the second multi-wire cutting wheel and the single-wire cutting wheel; wherein, when the silicon rod is cut, the cutting frame rotates around its rotating part to realize the conversion between a first cutting state of cutting by the multi-wire wire saw and a second cutting state of cutting by the single-wire wire saw.

[0008] In some embodiments of the present application, an extension line of the multi-wire wire saw forms an angle of 90° with an extension line of the single-wire wire saw; and the cutting frame can be rotated by ±45° or 90° on the lifting mechanism.

[0009] In some embodiments of the present application, an extension line of the multi-wire wire saw forms an angle of 60° with an extension line of the single-wire wire saw; and the cutting frame can achieve ±60° or 120° rotation on the lifting mechanism.

[0010] In some embodiments of the present application, the first cutting state is a film taking operation state; and the second cutting state is a cutting operation state.

[0011] In some embodiments of the present application, the cutting wire is wound between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel in an end-to-end annular winding manner.

[0012] In some embodiments of the present application, the first multi-wire cutting wheel or the second multi-wire cutting wheel is driven to rotate by a driving motor to run the cutting wire around the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

[0013] In some embodiments of the present application, the cutting wire is a twisted wire cutting wire formed by twisting at least two cutting wires.

[0014] In some embodiments of the present application, the silicon rod cutting equipment also includes a tension detection mechanism, including a tensioning wheel arranged on the cutting frame, for detecting and adjusting the tension of the cutting wire between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

[0015] In some embodiments of the present application, the silicon rod cutting device further includes at least one wire wheel, which is disposed on the cutting frame to achieve the reversal of the cutting line.

[0016] In some embodiments of the present application, the cutting wire is guided by the guide wheel to be wound around the first multi-wire cutting wheel and the second multi-wire cutting wheel at least twice, and is guided by the guide wheel to be wound around the single-wire cutting wheel once.

[0017] In some embodiments of the present application, the cutting wire is wound around a pay-off reel at its head end and a take-up reel at its tail end, and is guided by multiple wire wheels and wound between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

[0018] In some embodiments of the present application, the cutting wire is guided by the guide wheel to be wound around the first multi-wire cutting wheel and the second multi-wire cutting wheel at least twice, and is guided by the guide wheel to be wound around the single-wire cutting wheel once.

[0019] In some embodiments of the present application, the silicon rod cutting equipment also includes at least one tension detection mechanism, including a tensioning wheel arranged on the cutting frame, the lifting mechanism or the frame, for detecting and adjusting the tension of the cutting wire between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

[0020] In some embodiments of the present application, when the silicon rod cutting device is in the first cutting state, the single-wire cutting wheel is not in contact with the cutting wire; when switching from the first cutting state to the second cutting state, the cutting frame rotates around its rotating part so that the single-wire cutting wheel presses the cutting wire, until reaching the second cutting state, the cutting wire is wound around the single-wire cutting wheel so that the cutting wire segment between the single-wire cutting wheel and the second multi-wire cutting wheel forms a single-wire wire saw.

[0021] In some embodiments of the present application, the silicon rod cutting equipment further includes a locking device, which is disposed on the lifting mechanism and is used to lock the cutting frame after the cutting frame rotates around its rotating portion to achieve conversion between the first cutting state and the second cutting state.

[0022] In some embodiments of the present application, the silicon rod cutting device further includes a cutting frame displacement device, which is disposed between the lifting mechanism and the machine base and is used for linear displacement along the axial direction of the silicon rod to adjust the length of the cut silicon rod.

[0023] In some embodiments of the present application, a leveling detection device is provided on the lifting mechanism to detect the horizontality of the axis of the silicon rod to be cut placed in the working area.

[0024] In some embodiments of the present application, the silicon rod cutting equipment further includes a leveling device, which is disposed in the working area and is used to level the axis of the silicon rod to be cut placed in the working area according to the detection result of the leveling detection device.

[0025] In some embodiments of the present application, the silicon rod loading device includes: a first rotating shaft, driven to rotate by a first driving device; and at least two swing arm assemblies, which are respectively axially connected to the first rotating shaft according to preset intervals, and the at least two swing arm assemblies are used to carry the silicon rods to be cut, and transfer the silicon rods to be cut to the cutting working area of ​​the cutting equipment under the drive of the first rotating shaft; each of the swing arm assemblies includes a swing arm body axially connected to the first rotating shaft and a supporting mechanism arranged on the swing arm body, and the supporting mechanism is used to follow the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rods to be cut during the transfer operation.

[0026] In some embodiments of the present application, the supporting mechanism includes a robot, which is arranged at the end of the swing arm body, and is used to follow the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rod to be cut during the transfer operation.

[0027] In some embodiments of the present application, the silicon rod cutting equipment also includes at least two transfer platforms corresponding to the swing arm assemblies one by one, which are arranged on the base of the cutting equipment and are used to respectively connect the at least two swing arm assemblies to the first rotating shaft according to preset intervals.

[0028] In some embodiments of the present application, the at least two transfer platforms include a second motion mechanism that causes at least one swing arm assembly to linearly displace on the first rotating axis to adjust the spacing distance between the at least two swing arm assemblies.

[0029] In some embodiments of the present application, there are four swing arm assemblies, including a first swing arm assembly and a second swing arm assembly respectively disposed at both ends of the first rotating shaft, and a third swing arm assembly and a fourth swing arm assembly respectively axially connected between the two ends of the first rotating shaft according to a preset interval.

[0030] In some embodiments of the present application, the transfer platform of the third swing arm assembly or the fourth swing arm assembly includes a second motion mechanism that linearly displaces on the first rotating shaft.

[0031] In some embodiments of the present application, the silicon rod cutting equipment also includes a second rotating shaft driven by a second driving device, the second rotating shaft is parallel to the first rotating shaft, and the second driving device outputs a corresponding rotation speed and / or rotation angle to the second rotating shaft following the working state of the first driving device.

[0032] In some embodiments of the present application, the first driving device and the second driving device are respectively disposed at opposite ends of the first rotating shaft or the second rotating shaft.

[0033] In some embodiments of the present application, the second rotating shaft is axially connected to the swing arm assembly and is located between the first rotating shaft on the swing arm body and the supporting mechanism.

[0034] In some embodiments of the present application, the supporting mechanism includes: a manipulator assembly, arranged at the end of the swing arm body, including: a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member is dynamically connected to the second rotating shaft, and drives the supporting member to rotate on the manipulator body when the second rotating shaft rotates, so that the supporting member remains in a state of carrying the silicon rod to be cut during the transfer operation.

[0035] In some embodiments of the present application, the swing arm body has a built-in space.

[0036] In some embodiments of the present application, the supporting mechanism includes: a driving gear, which is arranged in the built-in space of the swing arm body and is axially connected to the second rotating shaft, and is used to rotate under the drive of the second rotating shaft; a passive gear, which is axially connected to the built-in space of the swing arm body and is meshed with the driving gear; a manipulator assembly, which is arranged at the end of the swing arm body, includes a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member including a tooth portion meshing with the passive gear, and a supporting portion for conforming to the outer contour of the silicon rod to be cut.

[0037] In some embodiments of the present application, the number of teeth of the toothed portion of the supporting portion is greater than the number of teeth of the passive gear, and the number of teeth of the passive gear is greater than the number of teeth of the active gear.

[0038] In some embodiments of the present application, a contact surface between the supporting portion and the silicon rod to be cut has a buffer material.

[0039] In some embodiments of the present application, the swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut.

[0040] In some embodiments of the present application, the silicon rod cutting equipment further includes an end material taking device, which is disposed at at least one end of the cutting work area and is also used to receive the cutting tailings of the ends of the silicon rods to be cut.

[0041] In some embodiments of the present application, the silicon rod unloading device of the silicon rod cutting equipment is provided with a sensor device for detecting the cutting position of the end of the silicon rod to be cut.

[0042] In some embodiments of the present application, the sensor device is a contact sensor.

[0043] In some embodiments of the present application, the silicon rod unloading device includes: a feeding arm, which can be suspended translationally on the frame of the silicon rod cutting equipment, including a telescopic mechanism; a clamping member, arranged at the bottom end of the feeding arm, for clamping a single-segment silicon rod segment that meets the workpiece specifications after cutting.

[0044] In some embodiments of the present application, the clamping member includes: a first clamping block, including a first rack and a first clamping portion linked to the first rack; a second clamping block, mirror-arranged relative to the first clamping block, including a second rack and a second clamping portion linked to the second rack, a driving gear, connected to a power output shaft of a motor, and meshing with the first rack and the second rack, for driving the first clamping portion and the second clamping portion to move toward each other to perform a clamping action during forward rotation, and driving the first clamping portion and the second clamping portion to move away from each other to perform a releasing action during reverse movement.

[0045] In some embodiments of the present application, buffer materials are provided on the clamping surfaces of the first clamping portion and the second clamping portion for clamping the single-segment silicon rod segment.

[0046] To summarize, the silicon rod cutting equipment of the present application is designed by setting up a rotatable cutting frame, and by arranging a single-wire cutting wheel and a multi-wire cutting wheel on the cutting frame at the same time, the cutting frame can be rotated to different cutting states to realize multi-wire wire saw cutting and single-wire wire saw cutting, thereby solving the problem of low efficiency in obtaining samples through multiple cuttings, difficulty in controlling the thickness of the samples, and easy waste of materials.

[0047] In addition, the silicon rod cutting equipment of the present application also includes a silicon rod feeding device, which is provided with at least two swing arm assemblies that can move axially along the silicon rod to be cut, and cooperates with the supporting part at the end of the swing arm assembly through a manipulator or a manipulator assembly to ensure that the silicon rod is always in a load-bearing state during the transfer of the silicon rod to be cut to achieve automatic loading, thereby effectively improving economic benefits and safety.

[0048] In addition, the silicon rod cutting equipment of the present application also includes an automatic unloading device, and a driving device is set for the material taking arm and the clamping member movably suspended on the frame to realize the clamping and transportation functions, improve the continuity of the entire silicon rod cutting operation process, and effectively improve the production efficiency of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 Shown is a schematic structural diagram of an embodiment of the silicon rod cutting device of the present application.

[0050] Figure 2 It is a schematic diagram showing a first cutting state of the silicon rod cutting device of the present application in one embodiment.

[0051] Figure 3 Display as Figure 2 Enlarged schematic diagram at point a in the middle.

[0052] Figure 4 It is a schematic diagram showing a second cutting state of the silicon rod cutting device in one embodiment of the present application.

[0053] Figure 5 It is a schematic diagram showing an intermediate state of a silicon rod cutting device in one embodiment of the present application.

[0054] Figure 6 Shown is a schematic diagram of a cutting frame in one embodiment of the silicon rod cutting device of the present application.

[0055] Figure 7 It is a schematic diagram showing a first cutting state of the silicon rod cutting device of the present application in one embodiment.

[0056] Figure 8 It is a schematic diagram showing a second cutting state of the silicon rod cutting device in one embodiment of the present application.

[0057] Figure 9 It is a schematic diagram showing an intermediate state of a silicon rod cutting device in one embodiment of the present application.

[0058] Figure 10 Shown is a schematic diagram of a cutting frame in one embodiment of the silicon rod cutting device of the present application.

[0059] Figure 11 Shown is a schematic diagram of a silicon rod loading device in one embodiment of the silicon rod cutting device of the present application.

[0060] Figure 12Display as Figure 11 Enlarged schematic diagram at point b in the middle.

[0061] Figure 13 Display as Figure 11 Enlarged schematic diagram at c in the middle.

[0062] Figure 14 Shown is a schematic diagram of a swing arm assembly in one embodiment of the silicon rod stage equipment of the present application.

[0063] Figure 15 Shown is a schematic diagram of a swing arm assembly in one embodiment of the silicon rod stage equipment of the present application.

[0064] Figure 16 Shown is a schematic diagram of a swing arm assembly in one embodiment of the silicon rod stage equipment of the present application.

[0065] Figure 17 Shown is a schematic diagram of a swing arm assembly in one embodiment of the silicon rod stage equipment of the present application.

[0066] Figure 18 Shown is a schematic diagram of a swing arm assembly in one embodiment of the silicon rod stage equipment of the present application.

[0067] Figure 19 Shown is a schematic diagram of a swing arm assembly in one embodiment of the silicon rod stage equipment of the present application.

[0068] Figure 20 Shown is a schematic diagram of a silicon rod unloading device in one embodiment of the silicon rod cutting equipment of the present application.

[0069] Figure 21a and Figure 21b Shown is a schematic diagram of a silicon rod unloading device in one embodiment of the silicon rod cutting equipment of the present application.

[0070] Figure 22 Shown is a schematic diagram of the clamping components of the silicon rod unloading device of the silicon rod cutting equipment of the present application in one embodiment.

[0071] Figure 23 It is a schematic diagram of a driving device of a silicon rod unloading device in one embodiment of the silicon rod cutting device of the present application.

[0072] Figure 24 It is a schematic diagram of a driving device of a silicon rod unloading device in one embodiment of the silicon rod cutting device of the present application.

[0073] Figure 25 Display as Figure 21b Enlarged schematic diagram at point d in the middle. DETAILED DESCRIPTION

[0074] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0075] In the following description, with reference to the accompanying drawings, several embodiments of the present application are described. It should be understood that other embodiments may also be used, and mechanical composition, structure and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only to describe specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0076] Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first multi-wire cutting wheel can be referred to as the second multi-wire cutting wheel, and similarly, the second multi-wire cutting wheel can be referred to as the first multi-wire cutting wheel without departing from the scope of the various described embodiments. The first multi-wire cutting wheel and the multi-wire cutting wheel are both describing a cutting wheel, but unless the context clearly indicates otherwise, they are not the same multi-wire cutting wheel. Similar situations also include the first cantilever, the second cantilever and the third cantilever, the first swing arm assembly and the second swing arm assembly, or the first motion mechanism and the second motion mechanism, the first clamping portion and the second clamping portion, etc.

[0077] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0078] In the existing silicon material processing, based on the inherent hard and brittle characteristics of silicon rods, it is usually completed by wire cutting technology. The process of silicon rod operation starts with the truncation of the original long silicon rod to form multiple short silicon rods (that is, the silicon rod segments that meet the workpiece specifications after the silicon rods are cut). The equipment used for the truncation operation is the silicon rod truncation equipment. Generally, a workbench is provided on the silicon rod truncation equipment. For example, the cutting wire of steel wire or diamond wire is guided by the wire wheel to form a wire saw on the cutting roller to cut the single silicon rod to be processed. As a pre-process for the subsequent silicon wafer processing operation, samples need to be cut during the silicon rod truncation to check whether the material properties of the silicon rod meet the process requirements. The existing sample acquisition method generally involves cutting off the head or tail of the silicon rod by moving the cutting frame or the silicon rod, and then repeating the cutting operation to cut a silicon wafer sample. The thickness of the cut silicon wafer sample depends on the manually controlled moving distance. It is difficult to accurately control the short-distance movement of the cutting frame or the silicon rod, and it is difficult to unify the specifications of the cut samples. At the same time, it is difficult to achieve the short-distance movement required for the silicon wafer samples (for example, 2mm to 20mm), that is, it is easy to waste silicon rod materials due to excessive movement. The sampling operation that requires manual control in the traditional process also reduces the cutting efficiency.

[0079] In addition, under normal circumstances, the operations required for each process are arranged independently, and the operating equipment is scattered in different production units or production workshops or different production areas of the production workshop. The conversion of workpieces performing different process operations requires transportation and allocation. The process is complicated and inefficient, requiring a large amount of manpower or transfer equipment, and there are great safety hazards. In addition, there are many flow links between the operating equipment of each process, which increases the risk of workpiece damage during the transfer process, and is prone to unqualified or unreasonable consumption caused by non-production factors.

[0080] In the embodiment provided in the present application, in order to clarify the orientation of the space, a three-dimensional space defined by the first dimension direction, the second dimension direction, and the third dimension direction is defined, and the first dimension direction, the second dimension direction, and the third dimension direction are all linear directions and are perpendicular to each other. Taking a silicon rod to be cut placed in the cutting area as a reference, the first dimension direction is the axial direction of the silicon rod to be cut or the forward and backward directions; the second dimension direction is the left and right directions, for example, the direction of the linear displacement of the loading device between the storage area and the cutting work area is the left or right direction; the third dimension direction is the ascending and descending direction or the up and down direction, for example, the direction of the ascending or descending of the cutting frame.

[0081] See also Figure 1 , which is a schematic structural diagram of the silicon rod cutting device of the application in one embodiment, includes a wire cutting device 1, a silicon rod loading device 2, and a silicon rod unloading device 3.

[0082] See also Figure 2, showing a side view of the wire cutting device of the present application in the first cutting state in one embodiment. As shown in the figure, the wire cutting device of the present application is used to cut silicon rods, and the cutting operation is, for example, truncating operation or squaring operation or slicing operation; in the embodiment, the silicon rods include single crystal silicon rods and polycrystalline silicon rods, and the single crystal silicon rods are rod-shaped single crystal silicon grown from the melt by using the Czochralski method or the floating zone melting method, such as single crystal silicon rods with a length of about 5000mm (for example, a specification of 5360mm, etc.) or single crystal silicon rods with a length of about 800mm, which are common in silicon rod processing, and polycrystalline silicon is a silicon rod in which silicon is precipitated on the surface of the silicon core wire by precipitation technology such as chemical vapor deposition technology; but it is not limited to this, in other possible embodiments of the present application, the wire cutting device can also be used to cut polycrystalline silicon ingots, or other long strips of hard materials that need to be cut.

[0083] like Figure 2 As shown, the wire cutting device 1 of the silicon rod cutting equipment used for cutting silicon rods of the present application includes a cutting frame 111, a first multi-wire cutting wheel 112 and a second multi-wire cutting wheel 113 and a cutting wire segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 form a multi-wire wire saw 1121, a single-wire cutting wheel 114 and a cutting wire segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 form a single-wire wire saw ( Figure 2 winding system 12, frame 13, lifting mechanism 14, and base 15.

[0084] As mentioned above, before cutting the silicon rod, it is usually necessary to cut a sample to check whether the material properties of the silicon rod meet the process requirements, such as Figure 2 The wire cutting device is shown in the first cutting state. The lifting mechanism 14 is lifted and moved to drive the multi-wire wire saw 1121 (such as the multi-wire wire saw 1121 formed by the cutting line segments between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113) Figure 2 The embodiment shown is a double-wire wire saw) that moves up and down in the lifting direction to achieve multi-wire cutting of the silicon rod to be processed (not shown in the figure) located below the multi-wire wire saw 1121. In a cutting operation of a lifting movement, the parallel cutting wire saws simultaneously cut the silicon rod to be processed. While the silicon rod to be processed is cut, the silicon rod slices, i.e., the required silicon wafer samples, are also obtained. In the embodiment, the first cutting state is the wafer taking state.

[0085] exist Figure 2 In the illustrated embodiment, the wire winding system 12 of the wire cutting device of the present application further includes a cutting wire 121 , wire wheels 1221 , 1222 , and a tension detection component 123 .

[0086] A further improvement of the present application is that the wire cutting device further includes a cutting frame displacement device, and the cutting frame displacement device is arranged between the frame and the base. In one implementation of the present embodiment, the frame 13 is movably connected to the base of the wire cutting device through a horizontal guide rail (not shown in the figure) in the first dimension direction. The base includes a horizontal guide rail in the first dimension direction, and the bottom of the frame 13 of the cutting system is provided with a guide rail groove that matches the horizontal guide rail. The cutting frame displacement device drives the cutting frame to move linearly along the front-back direction on the cutting work area (or cutting workbench) of the base, so that the wire saw (single-wire wire saw or multi-wire wire saw, but in the cutting work, the cutting frame is usually in the state of a single-wire wire saw, that is, the second cutting state described in the present application) moves linearly along the axial direction of the silicon rod, and then the length of the silicon rod to be cut can be adjusted to obtain the desired single-segment silicon rod segment that meets the workpiece specifications.

[0087] In one embodiment, a driving mechanism is provided inside or outside the frame 13 for driving the frame 13 to move on the horizontal guide rail of the base 15. In one embodiment, the driving mechanism of the frame 13 includes: a travel screw (not shown in the figure) provided along the base guide rail and connected to the frame 13, and a travel motor (not shown in the figure) connected to the travel screw. The travel motor is used to drive the frame 13 to move along the guide rail, and the travel motor on the frame 13 is connected to the travel screw laid on the guide rail to achieve the relative movement of the frame 13 on the guide rail along the first dimension direction, i.e., the axial direction of the silicon rod to be cut on the supporting device and the frame 13. The cutting frame 111 is movably connected to the frame 13 in the lifting direction and is fixed to the frame 13 in the first dimension direction, i.e., the relative displacement of the cutting wire saw on the cutting frame 111 and the silicon rod to be cut on the supporting device in the axial direction of the silicon rod to be cut is achieved. In another implementation of this embodiment, the horizontal movement of the cutting frame 111 relative to the machine base may be driven by an external force.

[0088] See also Figure 3 , displayed as Figure 2 The enlarged schematic diagram of the wire cutting device at a, the frame 13 has a guide rail structure for cooperating with the lifting mechanism 14 to move up and down. Figure 3 In the illustrated embodiment, the frame 13 includes a lifting rail 131, and the lifting mechanism 14 has a guide groove (not shown in the figure) that matches the lifting rail.

[0089] In one implementation of this embodiment, in order to realize the lifting and lowering of the lifting mechanism 14 relative to the frame 13, a driving mechanism (not shown in the figure) is provided inside or outside the lifting mechanism 14, which is used to drive the lifting mechanism 14 to move on the guide rail 131 of the frame 13. In one embodiment, the driving mechanism of the lifting mechanism 14 includes: a travel screw arranged along the guide rail of the frame 13 and connected to the lifting mechanism 14, and a travel motor connected to the travel screw. The travel motor is used to drive the lifting mechanism 14 to move along the guide rail, and the travel motor on the lifting mechanism 14 is connected to the travel screw laid on the guide rail, so that the relative movement of the lifting mechanism 14 and the frame 13 in the vertical direction on the guide rail is realized and the movement of the lifting mechanism 14 relative to the frame 13 is limited to a single degree of freedom in the lifting direction.

[0090] In another embodiment of the present application, the connection assembly between the lifting mechanism 14 and the lifting guide rail of the frame 13 also includes a limit block for limiting the lifting mechanism 14 from excessive displacement during the lifting movement.

[0091] The wire wheel 122 is arranged on the cutting frame and the frame to realize the reversal of the cutting line and guide the cutting line. In a specific implementation method, the wire wheel may include a horizontal wire wheel, a longitudinal wire wheel, and an oblique wire wheel, etc. When installed, they can be arranged on different installation structures according to the routing method of the cutting line to achieve the purpose of guiding the cutting line.

[0092] In some embodiments of the present application, the wire cutting device adopts a non-closed winding method, the front end of the cutting wire is wound around a pay-off reel, the rear end is wound around a take-up reel, and is wound between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel through a plurality of guide wheel guides, so that in the first cutting state, the cutting frame performs a lifting and cutting operation to cut silicon wafer samples, and in the second cutting state, the cutting frame performs a lifting and cutting operation to cut the silicon rod.

[0093] See also Figure 2 , showing a side view of an embodiment of the wire cutting device of the present application adopting a non-closed winding method, including a cutting frame 111, a first multi-wire cutting wheel 112 and a second multi-wire cutting wheel 113 and a cutting wire segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire wire saw 1121, a single-wire cutting wheel 114 and a cutting wire segment wound between the second multi-wire cutting wheel 112 and the single-wire cutting wheel 113 to form a single-wire wire saw (not shown in the cutting state in the figure); a winding system 12, and a machine base 15.

[0094] The cutting frame 111 is rotatably arranged on the lifting mechanism 14, and the rotating frame includes: a rotating part 1111, a first cantilever 1112, a second cantilever 1113, and a third cantilever 1114. The center of the rotating shaft of the rotating part 1111 is the rotation center of the cutting frame 111; the first cantilever 1112 is a beam structure extending along the rotating part 1111 in a first direction; the second cantilever 1113 is a beam structure extending along the rotating part 1111 in a second direction; the third cantilever 1114 is a beam structure extending along the rotating part 1111 in a third direction; the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, they rotate with the rotation of the rotating part 1111.

[0095] In an embodiment, the central axis of the rotating shaft of the rotating part 1111 is connected to a driving motor, and the motor shaft, i.e., the power output shaft, drives the fixing plate of the cutting frame 111 to rotate along the rotating part 1111.

[0096] The spatial arrangement of the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 on the cutting frame 111 approximately forms a T-shaped structure, and the rotation center of the cutting frame 111 is set at the intersection of the three cantilevers of the cutting frame 111. In a specific implementation, the position of the rotation center is set in the center of gravity area of ​​the cutting frame 111 according to the structure and material characteristics of the cutting frame 111, so as to reduce the structural wear caused by the torque of the self-weight of the cutting frame 111 on the rotating shaft of the rotating part 1111. Figure 1 In the illustrated embodiment, the free ends (i.e., extended ends) of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are rotatably connected to the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114, respectively. A multi-wire wire saw 1121 is formed between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and a single-wire wire saw 1141 is formed between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. The first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, they rotate with the rotation of the rotating portion 1111.

[0097] The first multi-wire cutting wheel 112 is a cutting wheel provided with at least two wire grooves (including two or more wire grooves), and is rotatably arranged at an extension end of the first cantilever 1112 away from the rotation center, wherein the arrangement of the wire grooves on the cutting wheel is parallel to each other to ensure that the cutting wires wound on the cutting wheel are parallel to each other. The basic structure and installation method of the cutting wheel are well known or can be easily known to those skilled in the art, and will not be repeated here.

[0098] The second multi-wire cutting wheel 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at an extension end of the second cantilever 1113 away from the rotation center, wherein the wire grooves on the cutting wheel are arranged parallel to each other. In particular, the spacing between adjacent wire grooves of the second multi-wire cutting wheel is equal to the spacing between adjacent wire grooves of the first multi-wire cutting wheel, so that the cutting sections of the multi-wire wire saw 1121 formed by the cutting wires wound between the two multi-wire cutting wheels satisfy a spatial relationship of mutual parallelism.

[0099] The single-wire cutting wheel 114 is rotatably disposed at an extension end of the third cantilever 1114 away from the rotation center, and a single-wire wire saw is formed in accordance with the cutting line segment between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. The plane where the wire groove of the single-wire cutting wheel 114 is located in the first dimensional direction is the same plane as the plane where at least one wire groove of the second multi-wire cutting wheel 113 is located in the first dimensional direction.

[0100] In an exemplary embodiment, the single-wire cutting wheel 114 may be provided with a cutting wheel having multiple wire grooves. In the winding method, the cutting wire is wound around the wire grooves of the single-wire cutting wheel once to achieve the lead-out of a single wire saw.

[0101] In an exemplary embodiment, when the silicon rod is cut, the cutting frame 111 rotates around its rotating portion 1111 to achieve a conversion between a first cutting state in which the multi-wire wire saw 1121 is used for cutting and a second cutting state in which the single-wire wire saw is used for cutting.

[0102] like Figure 2 The wire cutting device is shown in the first cutting state. The lifting mechanism 14 is lifted and moved to drive the multi-wire wire saw 1121 (such as the multi-wire wire saw 1121 formed by the cutting line segments between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113) Figure 2 The embodiment shown is a double-wire wire saw that moves up and down in the lifting direction to achieve multi-wire cutting of the silicon rod to be processed (not shown in the figure) located below the multi-wire wire saw 1121. In the cutting operation of one lifting movement, the mutually parallel cutting lines 121 cut the silicon rod to be processed at the same time, and the silicon rod slices, i.e. the required silicon wafer samples, can be obtained.

[0103] In some embodiments of the present application, Figure 3As shown, the rotating part 1111 connecting the cutting frame and the lifting mechanism is a rotating flange lock, that is, the cutting frame 111 and the lifting mechanism 14 are movably connected through the rotating flange lock 1111. The rotating flange lock 1111 includes a first flange, a second flange (not shown in the figure), bolts and nuts. The first flange is provided with a plurality of first through holes with a diameter larger than the diameter of the bolt screw and smaller than the diameter of the bolt head. The second flange is provided with a plurality of second through holes corresponding to the first through holes. The second through holes include a large circular hole and a small circular hole. The large circular hole and the small circular hole are connected to each other from the side wall. In this embodiment, the nut is a 7-shaped nut, and the diameter of one end of the nut is larger than the diameter of the small circular hole and smaller than the diameter of the large circular hole. The combination of the nut and the special-shaped hole makes the flange lock easier to disassemble and assemble. In another embodiment of the present application, the connecting nut in the flange lock can be a butterfly nut.

[0104] In other embodiments of the present application, the connection between the cutting frame and the lifting mechanism can be set as a rotating part driven by a worm gear, including a worm gear, a forward worm gear, a reverse worm gear, a driver and a motor. The forward worm gear and the reverse worm gear are respectively engaged with the worm gear, the driver controls the magnitude and direction of the current in the motor, and the motor provides torque to the worm gear through the worm gear to realize the rotation of the cutting frame.

[0105] like Figure 2 As shown, it is a side view of the wire cutting device of the present application in a non-closed winding mode. In the illustrated embodiment, the cutting wire 121 can be a steel wire, or a diamond wire formed by embedding tiny hard particles such as diamonds on a cutting steel wire, or a diamond wire as described in Chinese Patent 201620281204.1 (Invention Name: Diamond Wire and Multi-wire Cutting Device), that is, the diamond wire comprises: a steel wire, the steel wire is divided into at least two types of cutting sections arranged at intervals; at least two types of diamond layers respectively plated on at least two types of cutting sections, and the particle order of each diamond layer is different.

[0106] In the specific embodiment where the diamond wire is selected, in order to avoid the wear of the diamond wire wound on the wire storage drum (including a wire unwinding drum 124 and a wire taking-up drum 125) due to the inevitable friction caused by high-speed routing, the winding of the diamond wire on the wire storage drum can preferably be single-layer winding. With respect to the winding method of the diamond wire on the wire storage drum, the wire storage drum wire arrangement mechanism described in Chinese Patent 200910197800.6 (Invention Name: Wire Storage Drum Wire Arranging Mechanism of Diamond Wire Cutting Machine) can be adopted.

[0107] In some embodiments of the present application, each cutting system consisting of a frame 13 and a cutting frame includes at least one tension detection mechanism, and the tension detection mechanism includes at least one tensioning wheel 123, and the tensioning wheel 123 is arranged on the cutting frame 111, the lifting mechanism 14 or the frame 13, and is used to detect and adjust the tension between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114. In terms of specific implementation, the tension wheel 123 can adopt the tension adjustment mechanism described in Chinese Patent 200910199387.7 (Invention Name: Tension Adjustment Mechanism of Diamond Wire Squarer); it can also adopt the method described in Chinese Patent 201410245524.7 (Invention Name: Multi-wire Cutting Equipment and Its Tension Adjustment Mechanism) for real-time sensing of the tension of the steel wire or cutting wire between the traction component and the wire storage drum (winding drum) and the tension of the steel wire or diamond wire between the traction component and the cutting area, and can adjust the tension of the steel wire or diamond wire on the winding drum and the tension of the steel wire or diamond wire in the cutting area according to the sensed tension value.

[0108] In some embodiments of the present application, the tension detection mechanism may also use a tension transition wheel (not shown) to ensure that the cutting line 121 is in a tension balance state during the cutting process. After the cutting line 121 starts from the pay-off drum 124 and passes around the frame 13, before winding the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 or the single-wire cutting wheel 114 on the cutting frame 111 in turn, it is introduced into the cutting frame 111 through the first tension transition wheel, and after completing the winding of the cutting wheel on the cutting frame 111, it is led out to the guide wheel 1221 of the frame 13 through the second tension transition wheel, and is guided by the guide wheel 1221 to be wound on the take-up drum 125. During cutting, the first tension transition wheel cooperates with the pay-off reel to adjust the cutting line 121 between the first tension transition wheel and the first multi-wire cutting wheel to ensure that the cutting line 121 is in a balanced state, and the second tension transition wheel cooperates with the take-up reel to adjust the cutting line 121 between the second tension transition wheel and the second multi-wire cutting wheel or the single-wire cutting wheel to ensure that the cutting line 121 is in a balanced state.

[0109] In some embodiments of the present application, the cutting system further includes a winding motor to drive the cutting line 121 between the wire take-up reel 125 and the wire pay-off reel 124 .

[0110] The wire cutting device of the present application is further improved in that it also includes a locking device, which is arranged on the lifting mechanism and is used to freeze the cutting state after the cutting frame is converted between different cutting states. The cantilever freedom of the cutting frame is greater than 0. During the cutting process, the contact force between the cutting wire 121 and the silicon rod to be cut may cause the cutting frame to rotate. The use of a locking device is an implementation means, so that the cutting frame stops rotating and is in a locked state after the driving motor of the rotating part drives the rotation to reach the preset cutting state position.

[0111] In one implementation of the embodiment of the present application, the locking device includes a rotating locking cylinder, which is in a relaxed state during the rotation process of the cutting frame to convert the cutting state, so as to enter a braking state after the cutting frame reaches a preset cutting state.

[0112] A further improvement of the present application is that the locking device also includes a positioning device. In the conversion of the cutting state, the rotation of the cutting frame is a passive rotation driven by the driving motor, and the rotation state of the cutting frame is controlled by the motor. In the specific implementation, the rotational inertia of the cutting frame itself can maintain the cutting frame to continue rotating after the motor stops running. The rotational angular velocity and duration of the rotational motion driven by the rotational inertia are difficult to control manually, which will affect the positioning of the spatial position of the cutting frame after it stops running. The positioning device is arranged on the lifting mechanism, including a fixed module of an automatic detection line and a positioning fixture assembly. When the rotating frame rotates to the first cutting state position or the second cutting state position, the fixed module of the automatic detection line detects that there are parts in the cutting frame placed in the positioning fixture assembly, and the cylinder of the rotating locking cylinder extends to push the positioning fixture assembly to clamp the cutting frame so that the degree of freedom of relative movement between the cutting frame and the lifting mechanism is 0.

[0113] See also Figure 3 In the embodiment shown in the figure, the winding method of the wire cutting device is non-closed, with the pay-off reel as the starting point and the take-up reel as the end point. The cutting wire 121 passes through the frame and the cutting frame on the wire cutting device. The cutting wire 121 starts from the pay-off reel and is wound on the frame according to the arrangement of the wire wheels. Then, the wire wheels, the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are wound from the frame 13 to the cutting frame 111. After the winding on the cutting frame is completed, the cutting wire 121 is guided from the frame through the wire wheels and wound to the take-up reel.

[0114] For the convenience of explaining and understanding the winding method of the present application, the winding method of the cutting wire 121 on the cutting frame is to wind from the frame to the wire wheel 1222 and start along the wire groove tangent point of the wire wheel 1222 as the starting point, and the direction of the cutting wire 121 is the tangent direction;

[0115] The cutting wire 121 is sequentially wound around the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the guide wheel 1221. The cutting wire 121 guided by the guide wheel 1221 forms a single-wire cutting wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in one winding.

[0116] After one wrapping, the cutting wire 121 starting from the wire groove tangent of the guide wheel 1221 wraps around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in sequence. After being wrapped around by the second multi-wire cutting wheel 113, a second cutting wire saw parallel to the single-wire cutting wire saws of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in the first wrapping is formed, that is, a multi-wire wire saw 1121 is formed, that is, two mutually parallel cutting wires are finally formed;

[0117] The extended wire extending from the tangent pay-off at the lower edge of the second multi-wire cutting wheel is wound around the guide wheel 1223 on the frame as the end point of the winding on the cutting frame 111.

[0118] In certain embodiments of the present application, the number of tensioning wheels around which the cutting wire is wound on a frame of the wire cutting device may be multiple.

[0119] In certain embodiments of the present application, based on the number of wafers required by the process, the circular winding method can pass through the first multi-wire cutting wheel and the second multi-wire cutting wheel for more than two times to form parallel cutting wire saws, and multiple silicon wafer samples can be cut in one lifting and cutting of the cutting frame.

[0120] like Figure 2 The schematic diagram of the wire cutting device in the first cutting state is shown, the first cutting state is the state where the cutting frame 111 rotates to the horizontal plane where the lower edge of the first multi-wire cutting wheel 112 and the lower edge of the second multi-wire cutting wheel 113 are at the same horizontal plane, and the shared horizontal plane is located below the cutting frame 111 structure in the first cutting state, and the cutting line 121 between the first multi-wire cutting wheel 111 and the second multi-wire cutting wheel 113 forms a multi-wire wire saw, and the multi-wire wire saw is a horizontal parallel line, that is, the first cutting state is a wafer taking operation state in which a silicon wafer sample can be cut in one cutting action. In the first cutting state, the single-wire cutting wheel and the cutting line 121 are in a separated state (non-contact state).

[0121] like Figure 4As shown, it shows the wire cutting device in the second cutting state, the second cutting state is the state where the cutting frame 111 rotates to the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 and the horizontal plane where the lower edge of the single-wire cutting wheel 114 are located are the same horizontal plane, and the shared horizontal plane is located below the cutting frame 111 structure in the first cutting state, and the cutting line 121 segment between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 forms a horizontal single-wire wire saw 1141. That is, the second cutting state is a state where silicon rods can be cut in one cutting action. In the second cutting state, the extension line of the first cantilever 1112 of the cutting frame 111 is at an angle of 45° with the extension line of the second cantilever 1113, and the extension line of the second cantilever 1113 is at an angle of 45° with the extension line of the third cantilever 1114. The cantilever structure of the cutting frame 111 is approximately symmetrical with the center line of the second cantilever 1113 as the symmetry line. The extension line of the multi-wire wire saw forms an angle of 90° with the extension line of the single-wire wire saw. When the cutting frame 111 rotates around the rotation center to switch between different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by a 90° rotation around the rotation axis, or the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by a ±45° rotation around the rotation axis.

[0122] See also Figure 5 , showing a side view of the wire cutting device of the present application in an intermediate state in one embodiment, the intermediate state is the natural static state of the cutting frame 111 under the action of the gravity of the cutting frame 111 when the locking device is in a relaxed state, that is, the cutting frame 111 is separated from the positioning fixture assembly. At this time, the multi-wire wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and the single-wire wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are both at a certain angle to the horizontal line, and the single-wire wire saw is tangent to the single-wire cutting wheel 114; the cutting frame is approximately a T-shaped structure placed upright in space, that is, the center of gravity of the part below the horizontal plane where the rotation center of the cutting frame 111 is located is in the lowest state.

[0123] Figure 2The wire cutting device is shown in the first cutting state, and the single-wire cutting wheel 114 is in a separated state from the cutting wire 121. In the conversion of the cutting process, when the cutting frame 111 is converted to the second cutting state, the single-wire cutting wheel 114 rotates around the rotation center with the third cantilever 1114 of the cutting frame 111 around the rotation center and is tangent to the cutting wire 121 from the separation in the first cutting state to the intermediate state and then to the compression state in the second cutting state. After reaching the position of the second cutting state, it is locked by the rotating locking cylinder and remains stationary. The wire groove in the single-wire cutting wheel 114 that is in the same plane as the cutting wire 121 in the first dimension direction contacts the cutting wire 121 after rotating to the second cutting state and compresses the cutting wire 121 to a horizontal state, so as to form a single-wire wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114.

[0124] In the process of the wire cutting device of the present application performing a complete cutting of the silicon rod on the carrying device, the process includes the following cutting states: adjusting the position of the silicon rod (silicon rod to be cut) on the carrying device and then clamping it to keep the silicon rod stationary, adjusting the position of the frame in the first dimension direction, so that the cutting wire saw is located above the intersection of the head (or tail, or in the case of two wire frames, the two cutting frames are respectively located on the head and tail sides of the silicon rod to be cut) to be cut and the part that meets the processing specifications, the motor drives the cutting frame to rotate a certain angle (45° in the illustrated embodiment) from the naturally stationary intermediate state to the first cutting state of the multi-wire wire saw cutting and the cutting frame is locked by the rotating locking cylinder, the lifting mechanism descends to drive the wire saw to move to contact the silicon rod and continue cutting, that is, When the head is cut off, a silicon wafer sample is cut off; after the sample is cut off, the lifting mechanism rises away from the silicon rod, and the travel motor on the horizontal guide rail adjusts the position of the frame in the first dimension according to the preset silicon rod segment length, and the motor connected to the cutting frame rotating shaft drives the cutting frame to rotate a certain angle (90° in the illustrated embodiment) to the second cutting state of single-wire cutting. During the rotation, the cutting line and the single-wire cutting wheel gradually change from separation to compression state until the cutting line is wound around the single-wire cutting wheel, forming a horizontal single-wire wire saw in the second cutting state, and the cutting frame is locked by rotating the locking cylinder, and the lifting mechanism drives the cutting wire saw to descend to cut and obtain silicon rod segments; repeat the steps of the single-wire wire saw to cut the silicon rod according to the requirements of the crystal segment until the cutting operation of the entire silicon rod is completed. After the cutting frame completes the cutting operation, the locking cylinder is in a relaxed state, and the cutting frame rotates a certain angle (45° in the illustrated embodiment) from the second cutting state to the intermediate state.

[0125] In some other embodiments of the wire cutting device of the present application, Figure 6As shown, the angle between the first cantilever 1112, the second cantilever 1113 and the third cantilever 1113 of the cutting frame 111 can be changed to 120° as shown in the figure, and the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are respectively fixed on the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114. The extension line of the multi-wire wire saw 1121 between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 and the extension line of the single-wire wire saw 1141 between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 form an angle of 60°. When the cutting frame 111 rotates around the rotation center 1111 to switch between different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating around the rotation axis by 120°, and the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating around the rotation axis by ±60°.

[0126] In other embodiments of the present application, Figure 7 As shown, the winding system of the wire cutting device of the present application adopts a closed winding structure, and the cutting wire 121 is wound between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114 on the cutting frame 111 in a ring-shaped winding manner connected end to end. The cutting wire 121 is wound on the cutting wheel through the cutting grooves of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and the formed cutting wire saws in the tangent direction of the cutting groove. The cutting wire 121 is guided by the wire wheel and wound at least twice around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and is guided by the wire wheel and wound once around the single-wire cutting wheel 114. The distance between the multiple wire grooves of the cutting wire 121 on the first multi-wire cutting wheel 112 is equal to the distance between the multiple wire grooves on the second multi-wire cutting wheel 113, that is, the cutting wires 121 led out along the tangent direction of the wire grooves of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 are in a spatially parallel relationship with each other.

[0127] The cutting frame 111 is rotatably arranged on a lifting mechanism (not shown in the figure), and the cutting frame 111 includes: a rotating part 1111, a first cantilever 1112, a second cantilever 1113, and a third cantilever 1114. The center of the rotating shaft of the rotating part 1111 is the center of rotation of the cutting frame; the first cantilever 1112 is a beam structure extending in a first direction along the rotating part 1111; the second cantilever 1113 is a beam structure extending in a second direction along the rotating part 1111; the third cantilever 1114 is a beam structure extending in a third direction along the rotating part 1111; the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, they rotate with the rotation of the rotating part 1111.

[0128] In some embodiments of the present application, the central axis of the rotating shaft of the rotating part 1111 is connected to a driving motor, and the motor shaft, i.e., the power output shaft, drives the cutting frame fixing plate to rotate along the rotating part.

[0129] The spatial arrangement of the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 on the cutting frame approximately forms a T-shaped structure, and the rotation center of the cutting frame is set at the intersection of the three cantilever arms of the cutting frame. In a specific implementation, the position of the rotation center is set in the center of gravity area of ​​the cutting frame according to the structure and material characteristics of the cutting frame, so as to reduce the structural wear caused by the torque of the cutting frame's own weight on the rotating shaft. Figure 1 In the illustrated embodiment, the free ends (i.e., extended ends) of the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 are fixedly connected to the first multi-wire cutting wheel, the second multi-wire cutting wheel and the single-wire cutting wheel, respectively, and a multi-wire wire saw 1121 is formed between the first multi-wire cutting wheel and the second multi-wire cutting wheel, and a single-wire wire saw is formed between the second multi-wire cutting wheel and the single-wire cutting wheel (not shown in the illustrated embodiment).

[0130] The first multi-wire cutting wheel 112 is a cutting wheel provided with at least two wire grooves, and is fixedly arranged at an extension end of the first cantilever 1112 away from the rotation center, wherein the wire grooves on the cutting wheel are arranged parallel to each other to ensure that the cutting wires wound on the cutting wheel are parallel to each other. The basic structure and installation method of the cutting wheel are well known or can be easily known to those skilled in the art and will not be repeated here.

[0131] The second multi-wire cutting wheel 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at an extension end of the second cantilever 1113 away from the rotation center, wherein the wire grooves on the cutting wheel are arranged parallel to each other. In particular, the spacing between adjacent wire grooves of the second multi-wire cutting wheel 113 is equal to the spacing between adjacent wire grooves of the first multi-wire cutting wheel 112, so that the cutting segments of the multi-wire wire saw formed by the cutting wires wound between the two multi-wire cutting wheels satisfy a spatial relationship of mutual parallelism.

[0132] The single-wire cutting wheel 114 is rotatably disposed at an extension end of the third cantilever 1114 away from the rotation center, and a single-wire wire saw is formed in accordance with the cutting line segment between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. The plane where the wire groove of the single-wire cutting wheel 114 is located in the first dimensional direction is the same plane as the plane where at least one wire groove of the second multi-wire cutting wheel 113 is located in the first dimensional direction.

[0133] In another embodiment of the present application, the single-wire cutting wheel 114 may be a cutting wheel provided with a plurality of wire grooves, and in the winding method, the cutting wire is wound around the wire grooves of the single-wire cutting wheel 114 once to realize leading out a single wire saw.

[0134] In some embodiments of the present application, when the silicon rod is cut, the cutting frame rotates around its rotating part to achieve the conversion between a first cutting state of cutting by the multi-wire wire saw and a second cutting state of cutting by the single-wire wire saw.

[0135] like Figure 7 The wire cutting device is shown in the first cutting state, and the lifting mechanism is lifted and moved to drive the cutting line segments between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire wire saw 1121 (such as Figure 1 The embodiment shown is a double-wire wire saw that moves up and down in the lifting direction to achieve multi-wire cutting of the silicon rod to be processed (not shown in the figure) located below the multi-wire wire saw 1121. In the cutting operation of one lifting movement, the parallel cutting wire saws cut the silicon rod to be processed at the same time, and the silicon rod slices, that is, the required silicon wafer samples, can be obtained.

[0136] In some embodiments of the present application, the rotating part 1111 connecting the cutting frame and the lifting mechanism is a rotary flange lock. The rotary flange lock includes a first flange, a second flange (not shown in the figure), bolts and nuts. The first flange is provided with a plurality of first through holes with a diameter larger than the diameter of the bolt screw and smaller than the diameter of the bolt head. The second flange is provided with a plurality of second through holes corresponding to the first through holes. The second through holes include a large circular hole and a small circular hole. The large circular hole and the small circular hole are connected to each other from the side wall. In this embodiment, the nut is a 7-shaped nut, and the diameter of one end of the nut is larger than the diameter of the small circular hole and smaller than the diameter of the large circular hole. The combination of the nut and the special-shaped hole makes the disassembly and assembly of the flange lock simpler and more labor-saving. In another embodiment of the present application, the connecting nut in the flange lock can be a butterfly nut.

[0137] In other embodiments of the present application, the connection between the cutting frame and the lifting mechanism can be set as a rotating part driven by a worm gear, including a worm gear, a forward worm gear, a reverse worm gear, a driver and a motor. The forward worm gear and the reverse worm gear are respectively engaged with the worm gear, the driver controls the magnitude and direction of the current in the motor, and the motor provides torque to the worm gear through the worm gear to realize the rotation of the cutting frame.

[0138] exist Figure 7 In the illustrated embodiment, the cutting wire 121 is a stranded wire cutting wire formed by twisting at least two cutting wires together. The stranded wire cutting wire is formed by two or more steel wire single wires or diamond wire single wires used for twisting rotating around a twisting wire axis at the same angular velocity and advancing at a uniform speed in a twisting wire winding manner, or is formed by twisting multiple single wires used for twisting in a certain direction and regularly twisting. Compared with a single wire cutting wire with the same cross-sectional area as the stranded wire, the stranded wire cutting wire has higher mechanical properties and flexibility, and prolongs the fatigue life of the cutting wire under repeated wear during cutting.

[0139] See also Figure 7 In the embodiment shown in the figure, the winding method of the cutting line 121 is a closed ring structure. To facilitate the description and understanding of the winding method of the present application, it is assumed that a point in the cutting line loop is used as a truncation point, and the point is used as the starting point of the winding. In one embodiment, the winding method of the cutting line 121 is to start from the single-wire cutting wheel 114 and take the wire groove tangent point of the single-wire cutting wheel 1114 as the starting point, and the direction of the cutting line 121 is the tangent direction;

[0140] The cutting wire 121 is sequentially wound around the second multi-wire cutting wheel 113, the first multi-wire cutting wheel 112, and the guide wheel 122. The cutting wire 121 guided by the guide wheel 122 in one winding forms a single-wire cutting wire saw 1122 between the first multi-wire cutting wheel and the second multi-wire cutting wheel.

[0141] After one wrapping, the cutting wire 121 starting from the wire groove of the guide wheel wraps around the second multi-wire cutting wheel 113 and the first multi-wire cutting wheel 112 in sequence. After being wrapped around by the first multi-wire cutting wheel 112, a second cutting wire saw is formed which is parallel to the single-wire cutting wire saw of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in the first wrapping, that is, a multi-wire wire saw 1121 is formed between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113;

[0142] The cutting wire 121 is wound around the single-wire cutting wheel 114 via the tensioning wheel 123 and reaches the assumed truncation point on the single-wire cutting wheel 114, that is, the first-connected annular winding method is realized in actual winding.

[0143] The contact between the cutting wire 121 and the cutting wheel on the cutting groove is a minor arc (an arc with an angle less than 180°), the cutting wire 121 is in a tensioned state between the cutting wheels, and the winding position is the outer edge of the convex shape formed by the single-wire cutting wheel or multi-wire cutting wheel, the tensioning wheel and the guide wheel.

[0144] In certain embodiments of the present application, the number of the wire pulleys 122 through which the annular winding wire passes on one cutting frame 111 in the wire cutting device may be multiple.

[0145] In certain embodiments of the present application, the number of tensioning wheels 123 through which the annular winding wire passes on one cutting frame 111 in the wire cutting device may be multiple.

[0146] In certain embodiments of the present application, the annular winding method can pass through the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 more than twice to form parallel cutting wire saws, and multiple silicon wafer samples can be cut in one lifting and cutting of the cutting frame.

[0147] In some embodiments of the present application, the winding system formed by the annular winding method also includes a driving motor (not shown in the figure), which is arranged adjacent to the first multi-wire cutting wheel 112 or the second multi-wire cutting wheel 113. In the present embodiment, the driving motor is the power source for running the cutting wire in the winding system. The driving motor directly drives the first multi-wire cutting wheel 112 or the second multi-wire cutting wheel 113 to drive the rotation to run the cutting wire 121 wound around the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114.

[0148] The tension detection mechanism includes a tensioning wheel 123 disposed on the cutting frame, which is used to detect and adjust the tension of the cutting wire 121 between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114. In the wire cutting process, the tension of the cutting wire 121 affects the yield and processing accuracy in the cutting process. The tension detection mechanism performs tension detection and adjustment so that the tension of the cutting wire reaches a certain threshold value set and maintains a constant value during cutting or takes the constant value as a certain range allowed by the numerical center.

[0149] The tensioning wheel 123 is used to adjust the tension of the cutting line 121, which can reduce the probability of the cutting line 121 breaking and reduce consumables. In the cutting operation, the cutting line 121 plays a vital role, but even the best cutting line 121 has limited elongation and wear resistance, that is, the cutting line 121 will gradually become thinner during the reciprocating motion until it is finally broken. Therefore, current wire cutting equipment generally has a cutting line 121 tension compensation mechanism designed to compensate for the elongation of the cutting line 121 during the reciprocating motion, and the use of a tensioning wheel 123 is one implementation method.

[0150] In some embodiments of the application, the tension detection mechanism at least includes: a tension wheel, a tension sensor, a servo motor and a screw rod. The tension wheel is arranged between the single-wire cutting wheel and the first multi-wire cutting wheel, and is used to pull the steel wire or diamond wire between the single-wire cutting wheel and the first multi-wire cutting wheel; the tension sensor is arranged on the tension wheel, and continuously senses the tension value of the diamond wire on the tension wheel, and sends a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor, and is used to start working after receiving the driving signal sent by the tension sensor; one end of the screw rod is connected to the tension wheel, and the other end is connected to the servo motor, and when the servo motor is working, the tension wheel is pulled to perform unidirectional displacement to adjust the tension of the steel wire or diamond wire.

[0151] A further improvement of the wire cutting device of the present application is that the tension adjustment mechanism further includes a slide rail, which is arranged between the servo motor and the tension wheel, so that when the screw pulls the tension wheel, the tension wheel slides on the slide rail. The servo motor has a rotating shaft, and the screw shaft is connected to the rotating shaft of the servo motor; when the tension sensor senses the tension of the steel wire or diamond wire for the first time, the preset value sensed by the tension sensor is the initial tension value, and during the cutting operation, the tension value sensed by the tension sensor is the current tension value, and the preset value sensed by the tension sensor is the tension value at the previous moment.

[0152] The wire cutting device of the present application is further improved in that it also includes a locking device, which is arranged on the lifting mechanism and is used to freeze the cutting state after the cutting frame is converted between different cutting states. The cantilever degree of freedom of the cutting frame is greater than 0. During the cutting process, the contact force between the cutting wire and the silicon rod to be cut may cause the cutting frame to rotate. The use of a locking device is an implementation means, so that the cutting frame stops rotating and is in a locked state after the driving motor of the rotating part drives the cutting frame to rotate and reaches the preset cutting state position.

[0153] In one implementation of the embodiment of the present application, the locking device includes a rotating locking cylinder, which is in a relaxed state during the rotation process of the cutting frame to convert the cutting state, so as to enter a braking state after the cutting frame reaches a preset cutting state.

[0154] A further improvement of the present application is that the locking device also includes a positioning device. In the conversion of the cutting state, the rotation of the cutting frame is a passive rotation driven by the driving motor, and the rotation state of the cutting frame is controlled by the motor. In the specific implementation, the rotational inertia of the cutting frame itself can maintain the cutting frame to continue rotating after the motor stops running. The rotational angular velocity and duration of the rotational motion driven by the rotational inertia are difficult to control manually, which will affect the positioning of the spatial position of the cutting frame after it stops running. The positioning device is arranged on the lifting mechanism, including a fixed module of an automatic detection line and a positioning fixture assembly. When the rotating frame rotates to the first cutting state position or the second cutting state position, the fixed module of the automatic detection line detects that there are parts in the cutting frame placed in the positioning fixture assembly, and the cylinder of the rotating locking cylinder extends to push the positioning fixture assembly to clamp the cutting frame so that the degree of freedom of relative movement between the cutting frame and the lifting mechanism is 0.

[0155] like Figure 7 As shown, the extension line of the first cantilever 1112 of the cutting frame 111 forms an angle of 45° with the extension line of the second cantilever 1113, and the extension line of the second cantilever 1113 forms an angle of 45° with the extension line of the third cantilever 1114. The cantilever structure of the cutting frame 111 takes the center line of the second cantilever 1113 as the symmetry line and is approximately symmetrical. The extension line of the multi-wire wire saw 1121 forms an angle of 90° with the extension line of the single-wire wire saw 1141. When the cutting frame 111 rotates around the rotation center to switch between different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating 90° around the rotation axis, and the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating ±45° around the rotation axis.

[0156] The first cutting state is a state in which the cutting frame 111 rotates to a state in which the horizontal plane where the lower edge of the first multi-wire cutting wheel 112 and the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 are located are the same horizontal plane, and the shared horizontal plane is located below the cutting frame 111 structure in the first cutting state, and the cutting line segments between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 form a multi-wire wire saw 1121, and the multi-wire wire saw 1121 is a horizontal parallel line. That is, the first cutting state is a wafer taking operation state in which a silicon wafer sample can be cut in one cutting action. In particular, for the wire cutting devices in different embodiments, the first cutting state is a wafer taking operation state of the wire cutting device.

[0157] See also Figure 8 , showing a side view of the wire cutting device of the present application in the second cutting state in one embodiment, the second cutting state is a state where the cutting frame 111 rotates to the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 and the lower edge of the single-wire cutting wheel 114 are at the same horizontal plane, and the shared horizontal plane is located below the cutting frame 111 structure in the first cutting state, and the cutting line segment between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 forms a horizontal single-wire wire saw. That is, the second cutting state is a state in which silicon rods can be cut in one cutting action. In particular, for the wire cutting devices in different embodiments, the second cutting state is the silicon rod cutting state of the wire cutting device.

[0158] See also Figure 9 , showing a side view of an intermediate state of the wire cutting device of the present application in one embodiment, the intermediate state is the natural static state of the cutting frame 111 under the action of gravity when the locking device is in a relaxed state, that is, the cutting frame 111 is separated from the positioning fixture assembly. At this time, the multi-wire wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and the single-wire wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are both at a certain angle to the horizontal line, and the cutting frame 111 is approximately a T-shaped structure placed upright in space, that is, the center of gravity of the part below the horizontal plane where the rotation center of the cutting frame 111 is located is in the lowest state.

[0159] In the specific implementation process of the wire cutting device cutting the silicon rod to be cut, after the transportation and loading of the silicon rod to be cut are completed, the cutting system cuts the silicon rod to be cut placed on the silicon rod carrying device. According to the characteristics of the silicon rod to be cut, such as the length of the head or tail impurity layer to be cut off, the position of the silicon rod on the carrying device or the horizontal position of the frame on the base of the wire cutting device is adjusted. After the position of the cutting frame in the first dimension direction is determined, the travel motor on the frame lifting mechanism drives the lifting mechanism to move in the lifting direction, and the driving motor of the cutting wire ring winding drives the cutting wire to run, and the cutting operation can be performed.

[0160] In the process of the wire cutting device of the present application performing a complete cutting of the silicon rod on the carrying device, the process includes the following cutting states: adjusting the position of the silicon rod on the carrying device and then clamping it to keep the silicon rod stationary, adjusting the position of the frame in the first dimension direction, so that the cutting wire saw is located above the intersection of the head to be cut and the part that meets the processing specifications, the motor drives the cutting frame to rotate a certain angle (45° in the illustrated embodiment) from the naturally stationary intermediate state to the first cutting state of the multi-wire wire saw cutting, and the cutting frame is locked by the rotating locking cylinder, and the lifting mechanism descends to drive the wire saw to move to contact the silicon rod And continue cutting, that is, cut off the silicon wafer sample when cutting off the head; after cutting off the sample, the lifting mechanism rises away from the silicon rod, and the travel motor on the horizontal guide rail adjusts the position of the frame in the first dimension according to the preset silicon rod segment length, and the motor connected to the cutting frame rotating shaft drives the cutting frame to rotate a certain angle (90° in the illustrated embodiment) to the second cutting state of single-line cutting, and the cutting frame is locked by rotating the locking cylinder, and the lifting mechanism drives the cutting wire saw to descend to cut and obtain the silicon rod segment; repeat the operation described in the previous step to the tail of the silicon rod, that is, the cutting frame completes the cutting operation of the entire silicon rod. After the cutting frame completes the cutting operation, the locking cylinder is in a relaxed state, and the cutting frame rotates a certain angle (45° in the illustrated embodiment) from the second cutting state to the intermediate state.

[0161] See also Figure 10 In some other embodiments of the wire cutting device of the present application, the angle between the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 of the first cutting frame 111 can be changed, and the first multi-cutting wheel 112, the second multi-cutting wheel 113 and the single-wire cutting wheel 114 are fixed on the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 respectively. The extension line of the multi-wire wire saw between the first multi-cutting wheel 112 and the second multi-cutting wheel 113 and the extension line of the single-wire wire saw between the second multi-cutting wheel 113 and the single-wire cutting wheel 114 form an angle of 60°. When the cutting frame 111 rotates around the rotation center to convert different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating 120° around the rotation axis, and the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating ±60° around the rotation axis.

[0162] In certain embodiments of the present application, the number of tension wheels around which the annular winding wire is wound on a cutting frame in the wire cutting device may be multiple.

[0163] In certain embodiments of the present application, the annular winding method can pass through the first multi-wire cutting wheel and the second multi-wire cutting wheel multiple times or more than twice to form parallel cutting wire saws, and multiple silicon wafer samples can be cut in one lifting and cutting of the cutting frame.

[0164] In the actual production process, silicon rods are usually not cylinders of equal diameter, but one end is larger than the other end or other types. If the bearing surface of the bearing device is set horizontally, the axis of the silicon rod to be cut may not be horizontal. At this time, the cutting section obtained by the vertical lifting movement of the lifting mechanism is not perpendicular to the axis of the cut silicon rod, that is, the obtained cutting surface is an inclined surface, and the obtained silicon rod section does not meet the processing requirements. A further improvement of the wire cutting device of the present application is that it also includes a horizontal detection device (not shown in the figure), which is set on the lifting mechanism and is used to detect the horizontality of the axis of the silicon rod to be cut.

[0165] In some embodiments of the present application, further, the level detection device on the lifting mechanism includes a first contact measuring instrument and a second contact measuring instrument, which are used to detect the horizontality of the axis of the silicon rod to be cut. The first contact measuring instrument is used to measure the level data of the silicon rod to be cut in the cutting work area at the measuring position corresponding to the first contact measuring instrument, and the second contact measuring instrument is used to measure the level data of the silicon rod to be cut in the cutting work area at the measuring position corresponding to the second contact measuring instrument.

[0166] A further improvement of the wire cutting device of the present application is that it also includes a leveling device (not shown in the figure), which is arranged in the working area and is used to level the axis of the silicon rod to be cut placed in the cutting working area according to the detection result of the horizontal detection device. The leveling device uses a horizontal centering structure, and when the horizontal detection device detects that the axis of the silicon rod to be cut is in a non-horizontal state, the leveling device drives the workpiece bearing device to rotate by a rotation drive mechanism to adjust the horizontality of the axis of the workpiece.

[0167] In one embodiment of the present application, the leveling device includes: a rotating fulcrum structure, a rotating drive mechanism, and an offset limiting mechanism. The rotating fulcrum structure is located below the silicon rod carrying device for carrying the silicon rods to be cut in the working area, and serves as a rotating fulcrum for the rotation of the silicon rod carrying device. The rotating drive mechanism is located below the silicon rod carrying device, and is used to drive the silicon rod carrying device to rotate around the rotating fulcrum structure to adjust the horizontality of the axis of the silicon rod to be cut. The offset limiting mechanism is adjacent to the rotating drive mechanism, and is used to limit the horizontal deviation of the silicon rod carrying device when it rotates (up and down deviation) around the rotating fulcrum structure.

[0168] In one embodiment of the leveling device of the wire cutting device of the present application for leveling, the first contact measuring instrument corresponds to the rotating fulcrum structure, and is used to measure the first height data of the vertex of the silicon rod to be cut at the rotating fulcrum structure (which can be an absolute height or a relative height relative to the silicon rod supporting device). The second contact measuring instrument corresponds to the rotating drive mechanism, and is used to measure the second height data of the vertex of the silicon rod to be cut at the rotating drive mechanism (which can be an absolute height or a relative height relative to the silicon rod supporting device). Subsequently, the first height data measured by the first contact measuring instrument and the second height data measured by the first contact measuring instrument can be combined to calculate the adjustment amount of the silicon rod supporting device at the rotating drive mechanism, and the rotating drive mechanism is actuated according to the adjustment amount to drive the silicon rod supporting device to rotate around the rotating fulcrum structure to complete horizontal centering, so that the axis of the silicon rod to be cut is adjusted to a horizontal state.

[0169] Optionally, in another embodiment of the present application, the leveling device (not shown) of the wire cutting device of the present application can also be configured as a horizontal centering mechanism that adjusts the horizontality of the silicon rod to be cut by adjusting the pads. The leveling device is provided on the silicon rod supporting device in the working area, and is used to adjust the axis of the silicon rod to be cut to a horizontal state. The horizontal centering mechanism includes: two adjustment pads, a horizontal detection unit, and a drive motor.

[0170] The two adjustment pads are respectively arranged at the head and tail ends of the silicon rod supporting device in the corresponding working area, and are used to support the silicon rod to be cut.

[0171] The level detection unit is used to detect the level of the silicon rod to be cut supported by the two adjustment pads.

[0172] The driving motor is associated with at least one of the two adjusting pads, and is used to control the associated at least one adjusting pad to perform lifting movement to ensure that the axis of the silicon rod to be cut is adjusted to a horizontal state.

[0173] In this way, the axis center level of the workpiece to be cut carried by the silicon rod carrying device can be adjusted to a horizontal state by using the workpiece horizontal centering mechanism, and a single workpiece section that meets the workpiece specifications can be obtained by cutting. In addition, due to the use of the workpiece horizontal centering mechanism, it can ensure that the axis center of the workpiece to be cut is in a horizontal state and the cutting cross-section of each workpiece section after cutting is perpendicular to the axis center, which meets the workpiece processing requirements and improves the cutting quality and yield rate of the workpiece.

[0174] In summary, the silicon rod cutting equipment disclosed in the present application, in the first aspect, provides a wire cutting device, and designs a rotatable cutting frame. By simultaneously arranging a single-wire cutting wheel and a multi-wire cutting wheel on the cutting frame, different winding systems are designed to realize the conversion of a single-wire wire saw and a multi-wire wire saw through rotation. The cutting frame can be rotated to different setting states to realize multi-wire wire saw cutting and single-wire wire saw cutting. In the cutting operation of the silicon rod to be cut, the cutting frame can be adjusted to realize the cutting and cutting of the sample, so as to achieve the purpose of obtaining the sample in one lifting and cutting according to the needs, and cutting in the silicon rod processing, thereby solving the problem. The problem of low efficiency in obtaining samples through multiple cutting and difficulty in controlling the thickness of the samples is that materials are easily wasted; furthermore, the cutting frame is arranged on a lifting mechanism on the frame, and the frame can move along the machine base in the first dimension, so that the position of the cutting wire saw can be adjusted according to the processing specifications to obtain qualified processed silicon rod cuts, solving the problem of different processing sizes required for workpieces; the wire cutting device of the present application improves the cutting efficiency of the equipment while also improving the qualified rate of the product and the utilization rate of the processed raw materials, effectively overcoming the various shortcomings of the prior art and having high industrial value.

[0175] In the second aspect, the present application applies for a silicon rod loading device, which is used to transfer the silicon rods to be cut placed in the storage area to the cutting work area (cutting workbench) of the silicon rod cutting device. The existing silicon rod loading technology is commonly used by using a hoisting device. The use of a hoisting device to transport the silicon rods to be cut requires the use of a clamp made of non-elastic material to clamp the silicon rods. The direct contact between the clamp material and the silicon rod during clamping may cause damage to the surface of the silicon rod. The common single silicon rod has a mass of about 400kg and a length of about 5000mm (for example, a specification of 5360mm) or about 800mm and other different specifications. If the center of gravity of the silicon rod rises during the hoisting process, there will be a great safety hazard once it is lost. At the same time, the movement of the hoisting device is usually in the lifting direction and the horizontal direction along a straight line, and the maneuverability is low. Another common existing means of loading silicon rods is manual transportation, which seriously affects the production efficiency of enterprises.

[0176] See also Figure 11 , which is a schematic diagram of a silicon rod loading device applied for in the second aspect of the present application, wherein the silicon rod loading device includes a first rotating shaft 21 and at least two swing arm assemblies 25A and 25B.

[0177] The first rotating shaft 21 is driven to rotate by a first driving device 23 . The length direction of the first rotating shaft 21 is arranged along the length direction of the silicon rods 16 to be cut in the silicon rod cutting work area 17 . The first driving device 23 is axially connected to the first rotating shaft 21 and arranged at one end of the first rotating shaft 21 .

[0178] In an embodiment of the present application, the first driving device 23 includes a driving motor 231 , and a power output shaft of the driving motor 231 is axially connected to the first rotating shaft 21 at one end of the first rotating shaft 21 .

[0179] There are at least two swing arm assemblies, which are respectively axially connected to the first rotating shaft 21 according to a preset interval. The at least two swing arm assemblies 25A and 25B are used to carry the silicon rod 16 to be cut, and transfer the silicon rod 16 to be cut to the cutting working area 17 of the cutting equipment under the drive of the first rotating shaft 21; each swing arm assembly 25 includes a swing arm body axially connected to the first rotating shaft 21 and a supporting mechanism arranged on the swing arm body, and the supporting mechanism is used to follow the movement of the swing arm so that the supporting part thereof remains in a state of carrying the silicon rod 16 to be cut during the transfer operation and the relative position of the silicon rod 16 to be cut and the supporting part does not change during the transfer operation. In other words, the relative position of the silicon rod 16 to be cut and the supporting part does not change during the transfer operation means that during the transfer operation, the silicon rod 16 to be cut is in a stationary state relative to the supporting part.

[0180] In an exemplary embodiment, the at least two swing arm assemblies 25A, 25B are axially connected to the first rotating shaft 21 at a preset interval of about 800 mm (the shortest length of a crystal rod generally required), for example.

[0181] In some embodiments of the present application, the supporting mechanism includes a manipulator, which is arranged at the end of the swing arm body and follows the movement of the swing arm. The swing arm body and the supporting mechanism rotate around the first rotation axis under the drive of the first driving device. When following the movement of the swing arm, the manipulator causes the supporting part to rotate relative to the swing arm body under the action of the manipulator, that is, the rotation of the supporting part relative to the center of the circumscribed circle of the supporting part is jointly determined by the rotation driven by the first driving device and the rotation relative to the swing arm body.

[0182] In one embodiment of the present application, during the process of the silicon rod loading device transporting the silicon rod to be cut from the storage area to the cutting area, the robot follows the movement of the swing arm so that the angular velocity of the support part relative to the swing arm body and the angular velocity of the swing arm around the first rotation axis are equal in magnitude and opposite in direction, the angular velocity of the support part relative to the center of its circumscribed circle is maintained at 0, and no relative movement occurs between the support part and the silicon rod to be cut on the support part.

[0183] In some embodiments of the present application, at least two transfer tables corresponding to the swing arm assemblies are provided on the base of the silicon rod loading device, and are used to respectively connect the at least two swing arm assemblies to the first rotating shaft according to a preset interval. In one implementation, the movable connection between the transfer table and the corresponding swing arm assembly limits the movement of the corresponding swing arm assembly relative to the transfer table to a rotational movement around the first rotating shaft, and the swing arm assembly produces a corresponding displacement with the displacement of the corresponding transfer table. The first rotating shaft runs through each of the swing arm assemblies, and when the first driving device drives the first rotating shaft to rotate, each swing arm assembly connected to the rotating shaft through the transfer table simultaneously rotates around the first rotating shaft.

[0184] See also Figure 12 , showing the silicon rod feeding device of this application Figure 11 The enlarged schematic diagram at b in the middle shows that the swing arm body 251 is driven by the first rotating shaft 21. Driven by the power output shaft of the first rotating shaft 21, i.e., the motor shaft of the first driving device, the swing arm body 251 can realize rotation around the first rotating shaft 21. One end (end) of the swing arm body 251 away from the first rotating shaft 21 is fixedly connected to the supporting mechanism 252. When the first rotating shaft 21 drives the swing arm body 251 to rotate in the normal plane of the axis of the first rotating shaft 21, the spatial position of the supporting mechanism 252 as a whole is changed, so that the supporting mechanism 252 as a whole moves in a swinging direction between the material storage area and the cutting area.

[0185] In one embodiment of the present application, each transfer platform 27 has a first motion mechanism for linear displacement between the material storage area and the cutting work area, including horizontal guide rails 271 arranged on the two surfaces of the front and rear sides of the transfer platform 27. The transfer platform 27 is movably connected to a supporting platform 28 provided with corresponding second-dimensional guide grooves (not shown in the figure) through the horizontal guide rails 271 in the second dimension direction. The supporting platform 28 is provided with a second motion mechanism to realize the linear displacement of the transfer platform 27 relative to the supporting platform 28 in the second dimension direction.

[0186] In some embodiments of the present application, a driving mechanism is provided inside or outside the transfer platform 27 to drive the transfer platform 27 to move on the horizontal guide rail 271 of the base. In one embodiment, the driving mechanism of the transfer platform 27 includes: a travel screw (not shown in the figure) arranged along the horizontal guide rail and connected to the transfer platform 27, and a travel motor (not shown in the figure) connected to the travel screw. The travel motor is used to drive the transfer platform 27 to move along the guide rail 271. The travel motor on the transfer platform 27 is connected to the travel screw laid on the guide rail to achieve the displacement of the transfer platform 27 on the guide rail along the second dimension direction, i.e., the shortest distance direction between the storage area and the cutting area.

[0187] In another embodiment of the present application, the first motion mechanism of the transfer platform for linear displacement between the material storage area and the cutting work area can be in the form of a travel motor and a ball screw pair, the ball screw pair includes a ball screw and a screw nut matched with the ball screw, the screw nut is connected to the transfer platform, the travel motor drives the ball screw to rotate, thereby driving the transfer platform to perform linear motion along the guide groove set on the supporting platform through the screw nut.

[0188] In some embodiments of the present application, the silicon rod loading device is provided with a second motion mechanism that causes at least one swing arm assembly 25 to linearly displace on the first rotating shaft 21 (i.e., displacement in the first dimensional direction). In one implementation of this embodiment, the bottom of the carrier 28 also includes a guide rail assembly in the first dimensional direction, which is movably connected to the guide rail in the first dimensional direction set on the base 15 through the bottom guide groove of the carrier 28 (not shown in the figure). The second motion mechanism is the guide rail assembly of the carrier 28, including a driving mechanism arranged inside or outside the carrier 28, which is used to drive the carrier 28 to move on the guide rail in the first dimensional direction of the base. The driving mechanism of the carrier 28 includes: a travel screw (not shown in the figure) arranged along the bottom guide rail of the carrier 28 and connected to the carrier 28, and a travel motor (not shown in the figure) connected to the travel screw. The travel motor is used to drive the support platform 28 to move along the base guide rail. The travel motor on the support platform 28 is connected to the travel screw laid on the base guide rail to achieve the displacement of the support platform 28 on the base guide rail along the first dimensional direction, i.e., the linear direction parallel to the first rotating shaft 21.

[0189] In another embodiment of the present application, the second motion mechanism that causes at least one swing arm assembly to linearly displace on the first rotating shaft can be in the form of a travel motor and a ball screw pair, the ball screw pair includes a ball screw and a screw nut compatible with the ball screw, the screw nut is connected to the support platform, the travel motor drives the ball screw to rotate, and thereby drives the support platform to perform linear motion along the guide groove provided on the machine base through the screw nut.

[0190] In the actual production process, silicon rods are usually not cylinders of equal diameter, but one end is large and the other end is small or other types. The position of the center of gravity of different silicon rods in the length direction of the silicon rod is determined by the specific shape of the silicon rod. In the transfer of silicon rods, it is necessary to satisfy the torque generated by the support of different supporting mechanisms on the silicon rods and the gravity torque to balance each other to ensure that the silicon rods do not fall axially during the transfer. In some embodiments of the present application, at least one of the bearing platforms corresponding to the at least two transfer platforms is provided with a bottom guide rail assembly, i.e., a second motion mechanism to drive the displacement of the transfer platform on the bearing platform in the linear direction of the first rotating shaft, and the number of bearing platforms that can move along the linear direction of the first rotating shaft can also be greater than one. The bearing platform provided with the second motion mechanism drives the movement of the corresponding transfer platform and the swing arm assembly in the linear direction of the first rotating shaft to realize the position adjustment of the swing arm assembly on the first rotating shaft, i.e., to realize the adjustment of the supporting mechanism relative to the silicon rod in the length direction of the silicon rod, and then to realize the adjustment of the position of the supporting mechanism relative to the position of the center of gravity of the silicon rod.

[0191] As mentioned above, the common silicon rod length in silicon rod processing is about 800mm to 5000mm, and the common silicon rod mass is about 400kg or heavier. During the transfer of silicon rods, two silicon rod support mechanisms are used to ensure the balance of the silicon rods. Usually, the two support points or surfaces during the transfer of silicon rods are located at the two ends of the silicon rods. The silicon rod surface in contact with the support points at both ends is subjected to a large pressure, which may damage the integrity of the silicon rod structure. Please refer to Figure 11 The side view of the silicon rod loading device of the present application is shown. In the illustrated embodiment, the number of the swing arm assemblies is four, including a first swing arm assembly 25A and a second swing arm assembly 25B located at both ends of the first rotating shaft, and a third swing arm assembly 25C and a fourth swing arm assembly 25D respectively connected between the two ends of the first rotating shaft 21 according to a preset interval. The pressure at the contact surface between each supporting mechanism 252 and the silicon rod during the transfer of the silicon rod is less than the contact surface pressure of two supporting mechanisms 252 or clamps in the common technology.

[0192] In some embodiments of the present application, a second motion mechanism is provided on the carrier platform corresponding to the transfer platform of the third swing arm assembly 25C or the fourth swing arm assembly 25D to achieve displacement of the transfer platform on the carrier platform in the linear direction of the first rotating shaft 21, so as to adjust the carrier position according to the center of gravity position of the silicon rod to be cut. In an implementation of this embodiment, the second motion mechanism can be provided as a guide rail assembly with a drive motor.

[0193] In some embodiments of the present application, Figure 13 As shown, it is shown as Figure 11In the enlarged schematic diagram at c in the middle, the silicon rod feeding device also includes a second rotating shaft 22, which is driven by a second driving device 24, and is arranged parallel to the first rotating shaft 21 and passes through the first, second, third and fourth swing arm assemblies, is axially connected to the swing arm assembly 25, and is located between the first rotating shaft 21 of the swing arm body 251 and the supporting mechanism 252, and the second driving device 24 is arranged at one end of the second rotating shaft 22.

[0194] A further improvement of the present application is that the first drive device and the second drive device are respectively arranged at the two ends of the first rotating shaft or the second rotating shaft in the length direction, and are respectively located at the ends of the rotating shaft where the first rotating shaft is connected to the first swing arm assembly, and at the ends of the rotating shaft where the second rotating shaft is connected to the second swing arm assembly, so as to achieve quality balance of the mechanical layout of the swing arm assembly in the length direction, and improve the structural space utilization of the swing arm assembly in the spatial layout and correspondingly reduce the volume of the swing arm assembly.

[0195] In some embodiments of the present application, the swing arm body includes a built-in space, that is, the swing arm body is configured to have a structure with an accommodating space for accommodating the axial connection assembly of the first rotating shaft, the second rotating shaft and the swing arm body.

[0196] In some embodiments of the present application, the supporting mechanism of the swing arm assembly includes a driving gear, a passive gear and a manipulator assembly, and the manipulator assembly includes a manipulator body and a supporting member.

[0197] See also Figure 14 , showing a cross-sectional view of the swing arm body 251 and the supporting mechanism 252 of the silicon rod feeding device of the present application, wherein the built-in space of the swing arm body 251 is provided with mutually meshing gears, and from the swing arm end to the end direction, there are a driving gear 2522 and a passive gear 2523 respectively, and the driving gear 2522 of each swing arm assembly 25 is axially connected to the second rotating shaft 22 and rotates under the drive of the second rotating shaft 22; the passive gear 2523 meshes with the driving gear 2522, and at the same time, the tooth portion 252121 of the supporting member 25212 meshes with the passive gear 2523.

[0198] like Figure 14 As shown, the manipulator body 25211 is fixedly arranged at the end of the swing arm body 251 of the swing arm structure, and is a U-shaped, C-shaped, or crescent-shaped steel structure (not shown in the figure) bent in a circular arc in the length direction, and the symmetry axis in the arc length direction is coaxially arranged with the symmetry axis of the swing arm structure.

[0199] The supporting member 25212 is movably disposed on the manipulator body 25211, and is used to carry the silicon rod 16 to be cut, and includes a tooth portion 252121 meshing with the passive gear 2523 and a supporting portion 252122 whose contour can conform to accommodate the silicon rod 16 to be cut. The tooth portion 252121 is an arc-shaped rack structure, which is movably disposed on the manipulator body 25211. The arc shape of the rack conforms to the arc shape of the manipulator body 25211 and is embedded in the U-shaped, C-shaped, or crescent-shaped cavity of the manipulator body 25211. The supporting portion 252122 is fixedly disposed on the tooth portion 252121 and moves with the tooth portion 252121.

[0200] In one embodiment of the present application, the U-shaped, C-shaped, or crescent-shaped steel structure of the manipulator body 25211 is a U-shaped, C-shaped, or crescent-shaped structure with a notch. As shown in the figure, the notch is arranged at the symmetry axis of the circumference of the arc, so that the passive gear 2523 of the supporting mechanism 252 is meshed with the tooth portion 252121 of the supporting member 25212 at the middle notch.

[0201] In one embodiment of the present application, a row of cylindrical balls arranged in parallel are provided on the contour of the supporting portion 252122 of the manipulator assembly 2521. The cylindrical balls are in direct contact with the surface of the silicon rod 16 to be cut during the transfer of the silicon rod. The radius of the arc formed along the common tangent line of the cylindrical balls is slightly larger than the common radius range of the silicon rod, which is used to ensure that the supporting mechanism 252 can place the carried silicon rod in its inner circular groove when carrying the silicon rod, and make the arc surfaces of the two close to limit the rolling and other displacements of the silicon rod when carrying.

[0202] In one embodiment of the present application, the second driving device can be configured as a driving motor, and the motor shaft is axially connected to the second rotating shaft 22 to drive the rotation of the second rotating shaft 22, thereby realizing the rotation of the driving gear 2522 axially connected to the second rotating shaft 22. The driving gear 2522 in the built-in space of the swing arm body rotates at the speed and direction of the second driving rotating shaft driven by the second rotating shaft 22. Driven by the driving gear 2522, the passive gear 2523 meshing with it generates a rotation opposite to the rotation direction of the driving gear 2522, and the angular velocity of the rotation of the passive gear 2523 is determined by the relationship between the number of teeth of the driving gear 2522 and the passive gear 2523 and the speed of the driving gear 2522; further, the tooth portion 252121 meshing with the passive gear 2523 generates a rotation opposite to the rotation direction of the passive gear 2523, and the angular velocity of the rotation of the tooth portion 252121 is determined by the relationship between the radius of the arc where the tooth portion 252121 is located and the radius of the passive wheel and the speed of the passive wheel. That is, the rotational angular velocity of the tooth portion 252121 is determined by the motor speed of the second drive device (a variable value) and the number of teeth or radius relationship of the active gear 2522, the passive gear 2523 and the rack (a fixed value), that is, the rotational angular velocity of the supporting member 25212 relative to the manipulator body 25211 is determined by the speed output by the second drive device, and the rotation direction is the same as the rotation direction output by the second drive device.

[0203] A further improvement of the present application is that the torque between the second drive device and the drive motor corresponding to the first drive mechanism can have a synergistic relationship. Figures 14 to 16 The swing arm assembly shown in the figure rotates around the first rotating shaft 21 under the drive of the first driving device during the transfer of silicon rods. In the process of the silicon rod feeding device transferring silicon rods, when the supporting part 252122 of the supporting mechanism 252 is in the load-bearing state, the swing arm assembly 25 is driven by the rotation around the first rotating shaft 21, and the rotation of the rotating shaft drives the angular displacement of the swing arm body 251 in the normal plane of the first rotating shaft 21. The rotation angular velocity of the swing arm body 251 is determined by the first driving device. The swing arm body 251 and the manipulator assembly 2521 at the end thereof follow the swing arm body 251 to rotate with the first rotating shaft 21 as the rotation center and the angular velocity of the first rotating shaft 21 as the rotation speed.

[0204] In particular, the second driving device drives the second rotating shaft 22 to rotate in the direction opposite to the rotation of the first rotating shaft 21 in the load-bearing state, so as to realize the rotation of the supporting member 25212 around the center of the circle where the rack arc is located. The simultaneous rotation of the supporting member 25212 with the first rotating shaft 21 as the center is defined as the first rotational motion, and the rotation of the center of the circle where the rack arc is located is defined as the second rotational motion. The second rotational motion is the synthesis of the first rotational motion controlled by the first rotating shaft 21 and the rotational motion relative to the manipulator body 25211 controlled by the second rotating shaft 22 performed by the supporting member 25212 following the swing arm body 251.

[0205] The cooperative relationship between the first driving device and the second driving device is the relationship between the rotational speed and the direction. The first driving device and the second driving device respectively control the two rotational movements of the supporting part 252122, so that the angular velocity of the second rotation of the supporting part 25212 is 0, and the silicon rod 16 to be cut in the transfer state is displaced from the storage area to the cutting area with the movement of the supporting part 25212, and the relative position with the supporting part 252122 remains unchanged.

[0206] In another embodiment of the present application, the first drive device and the second drive device can work independently of each other, respectively controlling the first rotational movement and the rotational movement of the rack relative to the manipulator body, so as to jointly control the change in the spatial position of the supporting part and the angle of the second rotational movement. Before transferring the silicon rod to be cut located in the storage area, the manipulator assembly is driven by the first rotating shaft to swing until the supporting part and the silicon rod are at the same horizontal height, and the supporting part only has the first rotational movement during the swing; the operating table guide rail assembly drives the operating table and the swing arm assembly and the manipulator assembly arranged thereon to feed along the vertical direction of the silicon rod to be cut on the horizontal plane until the supporting part contacts the silicon rod to be cut; after the supporting part contacts the silicon rod to be cut, the second rotating shaft drives the supporting part to rotate relative to the manipulator body, so that the supporting part is located directly below the silicon rod to be cut, and the contact position between the supporting part and the silicon rod to be cut is located at the symmetric axis and adjacent area of ​​the arc of the supporting part, and then the silicon rod transfer process is carried out by the first drive device and the second drive device in a coordinated relationship. Furthermore, during the silicon rod transfer process, the travel motor of the guide rail of the transfer platform and the travel motor of the guide rail of the carrier platform respectively drive the swing arm assembly and the manipulator disposed on the swing arm assembly to perform linear motion in the second dimension and the first dimension. The linear motion of the carrier platform along the guide groove of the machine base in the first dimension and the linear motion of the transfer platform relative to the carrier platform in the second dimension are independent of the rotational motion driven by the first drive device or the second drive device.

[0207] A further improvement of the present application is that the number of teeth of the tooth portion 252121 of the supporting portion 252122 is greater than the number of teeth of the passive gear 2523, and the number of teeth of the passive gear 2523 is greater than the number of teeth of the driving gear 2522. In the second rotational motion determined by the second driving device and the number of teeth or radius relationship among the driving gear 2522, the passive gear 2523 and the tooth portion 252121, the angular velocity of the driving gear 2522, the angular velocity of the passive gear 2523, and the angular velocity of the tooth portion 252121 decrease in sequence in accordance with the basic principle of external meshing of gears, thereby achieving precise control of the supporting member 25212 in the second rotational motion.

[0208] In one embodiment of the present application, the contact surface between the supporting portion 252122 and the silicon rod to be cut has a buffer material. In some implementations of this embodiment, the contact surface between the supporting portion 252122 and the silicon rod to be cut is made of elastic rubber material, or silicone or other materials with elastic deformation, damping properties or buffering properties to protect the surface of the silicon rod to be cut that is in contact with it from being scratched or bumped.

[0209] See also Figure 17 , shows a cross-sectional view of a swing arm body 251 and a supporting mechanism 252 in another embodiment, wherein the supporting mechanism 252 includes a driving gear 2522 disposed in the internal space of the swing arm body 251 and a manipulator assembly 2521 disposed at the end of the swing arm body 251. The driving gear 2522 is axially connected to the second rotating shaft and rotates with the second rotating shaft under the drive of the second rotating shaft. The manipulator assembly 2521 includes a manipulator body 25211 and a supporting member 25212, wherein the manipulator body 25211 is fixedly disposed at the end of the swing arm body 251 and includes a groove structure curved in a circular arc in the length direction.

[0210] The supporting member 25212 is movably arranged on the manipulator body 25211, and is used to carry the silicon rod to be cut, and includes a tooth portion 252121 meshing with the passive driving gear 2522 and a supporting portion 252122 whose contour can conform to the silicon rod to be cut. The tooth portion 252121 is an arc-shaped rack structure, which is movably arranged on the manipulator body 25211. The arc shape of the rack conforms to the arc shape of the structural groove of the manipulator body 25211 and is arranged on the manipulator body 25211. The tooth portion 252121 meshes with the driving gear 2522 in the built-in space of the swing arm body 251, and the driving gear 2522 in the built-in space drives the supporting member 25212 to rotate relative to the manipulator body 25211 under the rotation of the second rotating shaft. The supporting portion 252122 is fixedly arranged on the tooth portion 252121 and moves with the tooth portion 252121.

[0211] The supporting member 25212 rotates around the first rotating shaft following the manipulator body 25211 under the drive of the first driving device, and rotates relative to the manipulator body 25211 under the drive of the second driving device. In one implementation of this embodiment, the second driving device includes a driving motor, which is axially connected to the second rotating shaft at one end of the second rotating shaft. The second driving device drives the second rotating shaft to rotate, thereby driving the driving gear 2522 in the built-in space of the swing arm structure to rotate at the same angular velocity as the second rotating shaft, and the tooth portion 252121 rotates relative to the manipulator body 25211 at a certain angular velocity driven by the driving gear 2522 meshing with it. The rotation speed of the supporting member 25212 around the first rotating shaft 21 is determined by the first driving device, and the rotation of the supporting member 25212 relative to the manipulator body 25211 is determined by the second driving device and the radius ratio of the tooth portion 252121 and the driving gear 2522 in the built-in space. The first driving device and the second driving device independently control the two rotational movements of the supporting member 25212.

[0212] In one embodiment of the present application, the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate in a certain cooperative relationship, and the rotation speed of the supporting part 252122 relative to the center of its circumscribed circle is the vector sum of the rotation of the supporting part 252122 around the first rotating shaft and the rotation relative to the robot body 25211. Figures 17 to 19 The schematic diagram of the swing arm assembly rotating to different angles around the first rotation axis in the load-bearing state is shown, and the first driving device 23 and the second driving device 24 operating in the cooperative relationship compensate each other for the angle change of the supporting member 25212 relative to the center of its circumscribed circle, so as to achieve that the angular velocity of the supporting portion 252122 relative to the rotational motion with the center of the circumscribed circle of the supporting portion 252122 as the rotation center is always 0. The first driving device and the second driving device are driven in the cooperative relationship during the transfer operation, so that the supporting member 25212 does not rotate relative to the silicon rod to be cut carried by it during the transfer process in the load-bearing state.

[0213] In another embodiment of the present application, the number of teeth of the tooth portion 252121 is greater than the number of teeth of the driving gear 2522 in the built-in space of the swing arm body 251, and the angular velocity transmission controlled by the second drive device from the second rotating shaft to the tooth portion 252121 is a reduction transmission, so as to achieve precise control of the supporting member 25212 during the rotation of the supporting member 25212 relative to the manipulator body 25211.

[0214] In another embodiment of the present application, the supporting mechanism of the swing arm assembly includes a manipulator assembly, and the manipulator assembly is arranged at the end of the swing arm body. The manipulator assembly includes a manipulator body and a supporting member, and the manipulator body is fixedly arranged on the swing arm body and moves with the swing arm body; the supporting member is movably arranged on the manipulator body and is used to carry the silicon rod to be cut. The supporting member is dynamically connected to the second rotating shaft, and drives the supporting member to rotate on the manipulator body when the second rotating shaft rotates.

[0215] In one implementation of this embodiment, the rotation of the supporting member relative to the manipulator is controlled by a second driving device at a second rotating shaft speed, and the second rotating shaft drives the supporting member to rotate at a certain speed; the manipulator body follows the swing arm body and is driven by the first driving device to rotate around the first rotating shaft. The first driving device and the second driving device can independently drive the swing arm body to rotate around the first rotating shaft and the supporting member to rotate relative to the manipulator body.

[0216] In another embodiment of the present application, the first drive device and the second drive device drive the first rotating shaft and the second rotating shaft to rotate in a certain cooperative relationship. The support member rotates around the first rotating shaft following the manipulator body driven by the first drive device, and rotates relative to the manipulator body driven by the second drive device. The first drive device and the second drive device output the rotation speed in a cooperative relationship, so that the operation of the first drive device and the second drive device compensates for the angle change of the support member relative to the center of its circumscribed circle, so as to achieve that the angular velocity of the support part relative to the rotational motion with the center of the circumscribed circle of the support part as the rotation center is always 0. The first drive device and the second drive device are driven in the cooperative relationship during the transfer operation, so that the support part does not rotate relative to the silicon rod to be cut carried by it during the transfer process in the carrying state.

[0217] During the silicon rod transfer process of the silicon rod loading device of the present application, before the silicon rod to be cut located in the storage area is transferred, the manipulator assembly is driven by the first rotating shaft to swing along with the swing arm body until the supporting part and the silicon rod are at the same horizontal height, and the rotational movement of the swing arm assembly is independently driven by the first driving device during the swinging process; the operating table guide rail assembly drives the operating table and the swing arm assembly and the manipulator assembly arranged thereon to feed along the vertical direction of the silicon rod to be cut on the horizontal plane until the supporting part contacts the silicon rod to be cut; after the supporting part contacts the silicon rod to be cut, the supporting part is driven by the second rotating shaft to rotate relative to the manipulator body, so that the supporting part is located directly below the silicon rod to be cut, and the contact position between the supporting part and the silicon rod to be cut is located at the symmetry axis and adjacent area of ​​the arc of the supporting part, and then the silicon rod transfer process is carried out by the first driving device and the second driving device in a coordinated relationship.

[0218] Furthermore, during the silicon rod transfer process, the travel motor of the guide rail of the transfer platform and the travel motor of the guide rail of the carrier platform respectively drive the swing arm assembly and the manipulator disposed on the swing arm assembly to perform linear motion in the second dimension and the first dimension. The linear motion of the carrier platform along the guide groove of the machine base in the first dimension and the linear motion of the transfer platform relative to the carrier platform in the second dimension are independent of the rotational motion driven by the first drive device or the second drive device.

[0219] A further improvement of the silicon rod loading device of the present application lies in that the swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut, and for detecting the contact between the supporting portion and the silicon rod to be cut during the loading operation, and after the manipulator supports the silicon rod to be cut, the drive motors of the first rotating shaft and the second rotating shaft start working, that is, lifting the swing arm to execute the feeding.

[0220] In some embodiments of the present application, the detection device includes a pressure sensor disposed on the supporting portion, and the pressure sensor includes a pressure sensitive element and a signal processing unit. Before transferring the silicon rods to be cut located in the material storage area, the manipulator assembly swings along with the swing arm body under the drive of the first rotating shaft until the supporting part and the silicon rod are at the same horizontal height. During the swinging process, the rotational movement of the swing arm assembly is independently driven by the first driving device; the operating table guide rail assembly drives the operating table and the swing arm assembly and the manipulator assembly arranged thereon to feed along the vertical direction of the silicon rods to be cut on the horizontal plane until the supporting part contacts the silicon rods to be cut; the pressure sensitive element of the pressure sensor contacts the silicon rods to be cut, outputs a contact signal, and the transfer table performs a short distance retreat operation relative to the silicon rods to be cut in the second dimension direction; when the supporting part and the silicon rods to be cut are separated, the second rotating shaft drives the supporting part to rotate relative to the manipulator body, so that the supporting part is located directly below the silicon rods to be cut, and then the swing arm assembly rotates to lift the silicon rods, and the supporting part transfers the silicon rods to be cut from the material storage area to the cutting area under the joint drive of the first driving device, the second driving device, the operating table guide rail assembly, and the carrier table guide rail assembly. The silicon rod loading device transports the silicon rod to be cut to the cutting area, and the swing arm body rotates to place the silicon rod to be cut on the supporting table of the cutting work area, so that the driving motor of the second rotating shaft drives the second rotating shaft to rotate in the opposite direction, drives the supporting part to rotate to release the bottom of the silicon rod to be cut, and makes the transfer platform move away from the silicon rod to be cut in the second dimension.

[0221] By utilizing the detection device, through a pressure-sensitive element or contact sensor that is highly sensitive to pressure, the support part stops when it approaches the silicon rod to be cut and contacts it before transferring it, and then rotates to the bottom of the silicon rod to be cut for support, thereby preventing the stability of the silicon rod to be cut from being destroyed in the support or the surface structure from being destroyed, thereby ensuring the transportation safety of the entire silicon rod transfer process.

[0222] In summary: the silicon rod stage equipment disclosed in the present application provides a silicon rod loading device in the second aspect, which realizes carrying and transferring the silicon rods to be cut by setting a swing arm assembly structure driven by a first driving device, and a corresponding motion following device or a manipulator assembly driven by a second driving device is set for the bearing mechanism of the swing arm assembly. When the supporting part of the silicon rod loading device is in a bearing state, the first driving device and the second driving device are driven simultaneously according to the relationship between the preset driving devices according to the mechanical structure, so as to achieve a smooth transportation effect in which the silicon rods to be cut and the supporting part do not move relative to each other during transportation; furthermore, the swing arm assembly in the present application can be set on a transfer table that can move along the second dimensional direction, and the transfer table can be movably set on a bearing table that can move along the first dimensional direction, and each movement is relatively independent, so that the silicon rod loading device has a larger transportation range and flexibility in transportation overshoot; the silicon rod loading device of the present application realizes automatic loading, increases the efficiency of silicon rod transportation, ensures the safety of transportation, and improves the maneuverability of the transportation process, effectively overcomes the various shortcomings of the prior art and has high industrial value.

[0223] The silicon rod cutting equipment of the present application applies for a silicon rod unloading device in the third aspect, and the silicon rod unloading device is arranged at the discharge end of the cutting work area, and is used to clamp and transport the single-segment silicon rod segments that meet the workpiece specifications after being cut, so as to facilitate unloading. In the prior art, the silicon rod segments processed by the silicon rod cutting equipment are usually transported manually or pushed and pulled on the cutting table, which affects the production efficiency of the enterprise; the common weight of the silicon rod to be cut is about 400kg and above, and the manual and push-pull transportation methods require a lot of manpower, and the safety and economy are low.

[0224] like Figure 20 , which is a schematic structural diagram of a silicon rod unloading device of a silicon rod cutting device of the present application in one embodiment, wherein the silicon rod unloading device comprises: a material taking arm 31 and a clamping member 32 .

[0225] The material taking arm 31 is movably arranged on the top frame 19 of the silicon rod cutting device in a suspended manner and can be translated along the top frame 19. The material taking arm 31 includes a telescopic mechanism; the axis of the translational movement of the material taking arm 31 is arranged directly above the axis of the silicon rod to be cut in the cutting area.

[0226] The clamping member 32 is disposed at the bottom end of the material taking arm 31 and is used to clamp the single-segment silicon rod cut in the cutting area that meets the workpiece specification. The material taking arm 31 and the clamping member 32 are generally bilaterally symmetrical or mirror-symmetrical structures.

[0227] In an implementation of this embodiment, the material picking arm 31 is movably connected to the top frame 19 through a guide rail assembly, and the guide rail assembly includes: a guide groove 312 provided on the top frame 19, a guide rail 311 fixedly provided on the upper part of the material picking arm 31, and a material picking arm driving mechanism 313 provided on the upper part of the material picking arm 31. The guide rail 311 and the matching guide groove 312 are provided in the first dimension direction, so that the material picking arm 31 is displaced relative to the axial direction of the silicon rod along the guide groove 312. In practice, the position of the material picking arm 31 is adjusted according to the position of the processed silicon rod segment to achieve the subsequent clamping of the silicon rod segment.

[0228] In one embodiment of the present application, the pick-up arm driving mechanism 311 includes: a travel screw (not shown) arranged along the guide rail 311 on the upper part of the pick-up arm 31 and connected to the pick-up arm 31, and a travel motor 313 connected to the travel screw. The travel motor 313 is used to drive the pick-up arm 31 to move along the guide rail 311. The travel motor 313 on the pick-up arm 31 is connected to the travel screw laid on the guide rail 311, so as to realize the axial movement of the pick-up arm 31 on the guide rail 311 along the first dimension direction, i.e., along the silicon rod or silicon rod segment placed in the cutting area.

[0229] In another embodiment of the present application, the material picking arm driving mechanism can be in the form of a travel motor and a ball screw pair, the ball screw pair includes a ball screw and a screw nut matched with the ball screw, the screw nut is connected to the material picking arm, the travel motor drives the ball screw to rotate, thereby driving the material picking arm to make a linear motion along the guide groove set on the top frame through the screw nut.

[0230] In another embodiment of the present application, the guide rail assembly further comprises a stopper (not shown in the figure) for limiting excessive displacement of the material fetching arm on the top frame. In the implementation of this embodiment, the stopper can be set to a control stroke type, a fixed type or an adjustable type according to the movement requirements of the material fetching arm.

[0231] Please refer to FIG. 21, which is a schematic diagram of a silicon rod unloading device according to an embodiment of the present application, wherein Figure 21a is a front view of the silicon rod unloading device, Figure 21bIt is a rear view of the silicon rod unloading device. In one embodiment of the present application, the telescopic mechanism 314 can be set as a lifting guide rail assembly, and the lifting guide rail assembly includes: a lifting guide rail 3141, a guide groove 3142 matched with the lifting guide rail 3141, and a lifting guide rail driving mechanism 3143, wherein: the lifting guide rail 3141 is fixedly arranged on the upper part of the clamping member 32 and arranged along the lifting direction; the guide groove 3142 structure matched with the lifting guide rail 3141 is arranged on the material picking arm 31, and arranged in the lifting direction along the symmetry axis of the material picking arm 31; the lifting guide rail 3141 driving mechanism can be set as a cylinder telescopic assembly, the cylinder telescopic assembly is arranged between the material picking arm 31 and the clamping member 32, and the two ends are respectively connected to the material picking arm 31 and the clamping member 32, and the lifting shaft 31433 of the cylinder telescopic assembly is extended and retracted to drive the clamping member 32 to move in the lifting direction.

[0232] In one embodiment of the present application, the cylinder telescopic assembly includes: a cylinder support 31431, a cylinder 31432, and a lifting shaft 31433 connected to the cylinder 31432, wherein: the cylinder support 31431 is arranged on the material picking arm 31, is fixedly connected to the material picking arm 31, and is in a quadrilateral shape; the cylinder 31432 is arranged on the cylinder support 31431, and the cylinder support 31431 The lower base plate is fixedly provided as the cylinder 31432; the cylinder 31432 includes a cylinder cone rod (not shown in the figure), and the cylinder cone rod passes through the cylinder support 31431 and extends into the telescopic space below the cylinder support 31431; the lifting shaft 31433 is arranged at the lower end of the cylinder cone rod, and includes a compound valve that can realize two-way control of extension and contraction, and the compound valve is also rod-shaped; in an implementation method of this embodiment, the lower end of the cylinder cone rod is connected to the lifting shaft 31433 through a coupling; the lower end of the lifting shaft 31433, i.e. the free end, is fixedly connected to the lifting guide rail 3141 of the clamping member 32. In the embodiment shown in the figure, a T-shaped frame is fixedly provided at the end of the lifting guide rail 3141 of the clamping member 32, and the end of the lifting shaft 31433 is fixedly connected to the T-shaped frame.

[0233] In one embodiment of the present application, the cylinder 31432 drives the cylinder cone rod to drive the telescopic movement of the lifting shaft 31433. The lifting guide rail 3141 of the clamping member 32 is lifted and transported along the lifting guide groove 3142 of the material picking arm 31 under the push-pull action of the lifting shaft 31433, thereby realizing the overall displacement of the clamping member 32 in the lifting direction.

[0234] See also Figure 22, which is a schematic diagram of the structure of the clamping member in an embodiment of the silicon rod unloading device of the present application, wherein the clamping member includes a first clamping block 321, a second clamping block 322 and a driving gear, wherein: the first clamping block 321 includes a first rack and a first clamping portion 3212 linked to the first rack; the second clamping block 322 is mirror-imaged relative to the first clamping block 321, and includes a second rack and a second clamping portion 3222 linked to the second rack; one end of the first rack is fixedly disposed on the first clamping portion 3212, and one end of the second rack is fixedly disposed on the second clamping portion 3222; the driving gear is disposed in the On the horizontal building plate 35 in the middle of the clamping member, the driving gear is connected to the power output shaft of a motor and is meshed with the first rack and the second rack at the same time. Driven by the motor, when the driving gear rotates forward, it drives the first clamping portion 3212 and the second clamping portion 3222 to move toward each other, that is, the distance between the first clamping portion 3212 and the second clamping portion 3222 is reduced, and the clamping action can be performed; when the driving gear rotates reversely driven by the motor, it drives the first clamping portion 3212 and the second clamping portion 3222 to move away from each other, that is, the distance between the first clamping portion 3212 and the second clamping portion 3222 is increased, and the releasing action can be performed.

[0235] In one embodiment of the present application, the clamping surfaces at the bottom ends of the first clamping portion 3212 and the second clamping portion 3222 for contacting the silicon rod segment are designed to be arc-shaped, and the radius of the arc of the clamping surface is designed to be the outer diameter of a common silicon rod, so as to be close to the arc surface of the silicon rod segment; the length of the clamping portion is designed to be the common length of the silicon rod segment after cutting according to processing specifications.

[0236] The lower surface of the horizontal building plate 35 is provided with two mutually parallel guide rails 351 arranged along the second dimension direction, and the first clamping portion 3212 and the second clamping portion 3222 are movably provided on the horizontal building plate 35 through the guide rails 351 on the lower surface of the horizontal building plate 35. The first horizontal slider assembly 3213 and the second horizontal slider assembly 3223 are fixedly provided on the top of the first clamping portion 3212 and the second clamping portion 3222, respectively, and the first horizontal slider assembly 3213 and the second horizontal slider assembly 3223 are movably provided on the guide rails of the horizontal building plate 35 and can slide along the guide rails 351 of the horizontal building plate. Driven by the first rack and the second rack, the first horizontal slider assembly 3213 and the second horizontal slider assembly 3223 move along the guide rails of the horizontal building plate respectively. The first horizontal slider assembly 3213 comprises two sliders whose bottoms are fixedly arranged above the first clamping portion 3212, and a line connecting the two sliders at fixed positions on the first clamping portion 3212 is in the first dimensional direction; the second horizontal slider assembly 3223 comprises two sliders whose bottoms are fixedly arranged above the second clamping portion 3222, and a line connecting the two sliders at fixed positions on the second clamping portion 3222 is in the first dimensional direction.

[0237] See also Figures 23 to 24 , which is a schematic diagram of the structure of the clamping member driving device in different states, and the viewing direction is a projection of the structure observed from the bottom to the top of the clamping member. The driving gear 323 is arranged on the horizontal building plate 35 of the clamping member, and is axially connected to the power output shaft of a driving motor. The driving motor 324 is fixedly arranged on the lower surface of the horizontal building plate 35. The first rack 3211 and the second rack 3221 are respectively meshed with the front side and the rear side of the driving gear 323. In the illustrated embodiment, it is shown that the first rack 3211 and the second rack 3221 are respectively meshed with the upper side and the lower side of the driving gear 323 of the driving gear 323. Driven by the driving gear 323, the first rack 3211 and the second rack 3221 respectively generate corresponding movements. Based on the basic law of external meshing between gears or between gears and racks, when the driving gear 323 rotates, the first rack 3211 moves in the opposite direction of the linear velocity of the upper teeth of the driving gear 323; when the driving gear 323 rotates, the second rack 3221 moves in the opposite direction of the linear velocity of the lower teeth of the driving gear 323. When the driving gear 323 rotates, the teeth that are symmetrical about the center of the gear (such as the upper and lower teeth in the illustrated embodiment) must satisfy the relationship of opposite linear velocity directions, that is, the movement directions of the first rack 3211 and the second rack 3221 that are respectively meshed with the two sides of the driving gear 323 are always opposite, manifested as movement towards or away from each other. Figure 23In the embodiment shown in FIG. 24 , the driving gear 323 is in a reverse rotation state, and the first rack 3211 and the second rack 3221 are moving away from each other.

[0238] When the driving gear 323 rotates forward or reversely, the first rack 3211 and the second rack 3221 move toward or away from each other accordingly. The movement of the first rack 3211 and the second rack 3221 respectively drives the first horizontal slider assembly 3213 and the second horizontal slider assembly 3223 of the first clamping part and the second clamping part to slide toward or away from each other along the mutually parallel guide rails provided on the bottom surface of the horizontal building plate 35, that is, the first clamping part and the second clamping part move toward or away from each other.

[0239] In one embodiment of the present application, the process of the silicon rod unloading device clamping the processed silicon rod segments is as follows:

[0240] The picking arm of the silicon rod unloading device moves along the guide groove on the top frame driven by the travel motor of the guide rail at the upper end of the picking arm, and moves toward the silicon rod cut-off along the first dimension. The clamping part of the silicon rod unloading device moves along the first dimension driven by the picking arm, and the movement of the picking arm along the guide groove of the top frame stops when the first clamping part moves to a position directly above the silicon rod section to be clamped.

[0241] After the picking arm and the clamping member are fixed in the horizontal position, the driving gear of the clamping member is reversed under the drive of the motor, and the first clamping part and the second clamping part are separated to a distance greater than the diameter of the silicon rod segment to prevent the clamping part from touching the silicon rod segment during the downward movement. The telescopic mechanism, such as the cylinder telescopic assembly, drives the lifting shaft to move in the lifting direction, so that the first and second clamping parts move downward to approach the silicon rod segment to be clamped, until the first clamping part and the second clamping part are on the same horizontal plane as the silicon rod segment, and the telescopic movement is stopped. The reverse movement of the driving motor is relatively independent of the movement of the telescopic mechanism. In terms of implementation, it is only necessary to ensure that the first and second clamping parts run to the horizontal plane of the silicon rod segment (that is, the first clamping part and the second clamping part are respectively located on the left and right sides of the silicon rod segment), and that the clamping part does not collide with the silicon rod segment during movement.

[0242] The driving gear rotates forward to control the first clamping part and the second clamping part to approach each other, that is, approach the silicon rod segment, and stop moving when they contact and clamp the silicon rod segment.

[0243] The clamping member maintains a clamping state after clamping the silicon rod segment. According to the preset placement position of the silicon rod segment, the clamping member is driven to move up and down by the telescopic mechanism accordingly. The guide rail assembly between the top frame and the material picking arm drives the material picking arm and the clamping member to move as a whole in the first dimension. After the silicon rod segment is placed in the preset position, the first clamping part and the second clamping part are separated and released, and the material picking arm and the clamping part are moved away from the placed silicon rod segment.

[0244] A further improvement of the present application is that the first clamping part and the second clamping part of the silicon rod unloading device are provided with buffer materials on the clamping surfaces for clamping the single-segment silicon rod segment. The clamping surfaces may be provided with elastic rubber materials, polyethylene foam plastics, silicone or other materials with elastic deformation, damping properties or buffering properties to protect the surface of the silicon rod segment in contact therewith from being scratched or bumped.

[0245] A further improvement of the present application is that the silicon rod unloading device is further provided with a sensor device 33 for detecting the position of the end (ie, the head or tail) of the silicon rod to be cut.

[0246] See also Figure 25 , displayed as Figure 21b In the enlarged schematic diagram at d, the sensor element 33 is fixedly arranged on the mirror line of the support between the horizontal building plate and the lifting guide rail of the connecting clamp 32. In an implementation of this embodiment, the sensor element 33 is a contact sensor, including a circular measuring head 331, a signal line 332, and a telescopic rod 333.

[0247] The measuring head 331 is movably arranged at the free end of the telescopic rod 333 and can rotate around the center of the circle of the measuring head 331. The fixed end of the telescopic rod 333 is arranged on the mirror symmetry line of the support.

[0248] In the detection, the circular ring surface of the annular measuring head 331 is the contact surface, which is used to measure the height data of the contact point between the corresponding measuring head 331 and the silicon rod 16 to be cut (it can be an absolute height or a relative height relative to the silicon rod supporting device). In particular, when the annular measuring head 331 rotates along the center of the ring, the linear velocity direction of the lowest point of the measuring head 331 is in the first dimension direction, that is, the axial direction of the silicon rod 16 to be cut, so as to avoid the damage to the annular measuring head 331 or the surface of the silicon rod 16 to be cut when the measuring head 331 moves along the surface of the silicon rod 16 to detect the end position of the silicon rod.

[0249] During the detection process, the telescopic rod 333 controls the measuring head 331 to descend to just contact the surface of the silicon rod 16 to be cut, and the contact sensor follows the material picking arm 31 to move relative to the silicon rod 16 to be cut in the first dimension, so that the measuring head 331 moves along the surface of the silicon rod 16 to be cut. By collecting height data at different positions in real time and taking advantage of the diameter change at the end of the silicon rod 16 to be cut, the boundary line between the end to be cut (i.e., the head or tail) and the middle section of the silicon rod that can be processed is detected.

[0250] The sensor device 33 is used to detect the end position of the silicon rod to be cut, thereby avoiding the inaccuracy of human judgment that causes the cut end to be too long and cause waste, or the cut portion to be too short so that the processed silicon rod segments at the head and tail ends do not meet the workpiece specifications, effectively improving the workpiece qualification rate of the silicon rod segments adjacent to the head and tail ends of the silicon rod, and improving the utilization rate of materials.

[0251] A further improvement of the silicon rod cutting arrangement of the present application is that it also includes an end material removal device. The end material removal device is arranged at at least one end of the cutting work area, and is used to receive the cutting tailings at the end of the silicon rod to be cut. In the silicon rod cutting operation, it is necessary to cut silicon wafer samples from the silicon rod to be cut, and the thickness of the sample is usually 2 to 20 mm, that is, it cannot be transported by the silicon rod unloading device.

[0252] The end material removal device includes a rotating arm and an arc-shaped groove; the rotating arm is arranged on the cutting frame adjacent to the material discharging end of the silicon rod cutting device, and is movably arranged at the bottom of the cutting frame adjacent to the material discharging end through a rotating shaft in the lifting direction of an axis. The arc-shaped groove is fixedly arranged at the free end of the rotating arm, and the arc-shaped groove is a semi-open structure, so that the silicon wafer sample can be put in from the side of the arc-shaped groove.

[0253] In one embodiment of the present application, the end-removing device further includes a driving device, the driving device having a power output shaft such as a motor, which is used to be axially connected to the rotating shaft of the rotating arm to drive the rotating arm to rotate around the rotating shaft at the bottom of the cutting frame. Further, the end-removing device further includes a rotating arm locking device, which is used to lock the rotating arm when the rotating arm rotates to the silicon wafer sample to be cut.

[0254] During the process of cutting the silicon wafer sample, the rotating arm rotates under the drive of the driving device of the end material taking device until the arc-shaped groove is located below the silicon wafer sample to be cut, and the rotating arm is locked by the rotating arm locking device. The cutting frame adjacent to the discharge end is driven by the driving motor of the cutting frame to rotate to the first cutting state of double-wire cutting, and the cutting wire saw is driven by the lifting mechanism to feed and cut. After the cutting is completed, the silicon wafer sample located in the receiving groove is cut, and the rotating arm rotates away from the cutting frame under the drive of the power output shaft, that is, the silicon wafer sample is received and taken.

[0255] To summarize, the silicon rod cutting equipment of the present application provides a silicon rod unloading device in the third aspect, which is provided with a feeding arm and a clamping piece on a frame, and the feeding arm and the clamping piece are movably connected by a cylinder telescopic assembly, and a driving device is used to drive the two clamping parts of the clamping piece to move toward or away from each other in the second dimension, so as to complete the clamping and release of the cut silicon rod segments; furthermore, the feeding arm of the silicon rod unloading device of the present application is driven by the driving device to be slidably arranged on the frame, and cooperates with the lifting movement of the clamping piece and the clamping or releasing action of the clamping part, so as to realize the transportation of the silicon rod segments between preset positions, effectively realize the automation of the silicon rod unloading process and connect different processes, effectively improve the production efficiency of the enterprise, and have high industrial value.

[0256] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A silicon rod cutting device, It is characterized in that include: A silicon rod loading device is arranged between a material storage area and a cutting work area, and is used to transfer the silicon rods to be cut placed in the material storage area to the cutting work area; The wire cutting device comprises a cutting frame suspended on the upper side of the cutting work area, a first multi-wire cutting wheel, a second multi-wire cutting wheel, a single-wire cutting wheel, and a cutting wire; the cutting frame is rotatably arranged on a lifting mechanism, the cutting frame comprises a rotating part, a first cantilever extending from the rotating part toward a first direction, a second cantilever extending from the rotating part toward a second direction, and a third cantilever extending from the rotating part toward a third direction; the cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel in an annular winding manner connected end to end; the first multi-wire cutting wheel is arranged at an extended end of the first cantilever and has at least two wire grooves; the second multi-wire cutting wheel is arranged at an extended end of the first cantilever and has at least two wire grooves; The cutting wheel is arranged at the extended end of the second cantilever, and has at least two wire grooves, and a multi-wire wire saw is formed by winding around the cutting wire segment between the first multi-wire cutting wheel and the second multi-wire cutting wheel; the single-wire cutting wheel is arranged at the extended end of the third cantilever, and a single-wire wire saw is formed by winding around the cutting wire segment between the second multi-wire cutting wheel and the single-wire cutting wheel; wherein, when the silicon rod placed in the cutting work area is cut off, the cutting frame is rotated around its rotating part to realize the conversion between the first cutting state of cutting by the multi-wire wire saw and the second cutting state of cutting by the single-wire wire saw; the first cutting state is a wafer taking operation state, and the second cutting state is a cutting operation state; The silicon rod unloading device is arranged at the discharge end of the cutting work area, and is used to clamp and transport the single-segment silicon rod segments that meet the workpiece specifications after being cut for unloading.

2. The silicon rod cutting device according to claim 1, It is characterized in that The silicon rod feeding device comprises: A first rotating shaft is driven to rotate by a first driving device; and At least two swing arm assemblies are respectively axially connected to the first rotating shaft according to preset intervals, and the at least two swing arm assemblies are used to carry the silicon rods to be cut, and transfer the silicon rods to be cut to the cutting work area under the drive of the first rotating shaft; each of the swing arm assemblies includes a swing arm body axially connected to the first rotating shaft and a supporting mechanism arranged on the swing arm body, and the supporting mechanism is used to follow the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rods to be cut during the transfer operation.

3. The silicon rod cutting device according to claim 2, It is characterized in that The supporting mechanism includes a manipulator, which is arranged at the end of the swing arm body and is used to follow the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rod to be cut during the transfer operation.

4. The silicon rod cutting device according to claim 2, It is characterized in that The silicon rod loading device also includes at least two transfer platforms corresponding to the swing arm assemblies one by one, which are arranged on the base of the silicon rod loading device and are used to respectively connect the at least two swing arm assemblies to the first rotating shaft according to preset intervals.

5. The silicon rod cutting device according to claim 4, It is characterized in that The at least two transfer platforms include a first motion mechanism that linearly moves between the material storage area and the cutting work area.

6. The silicon rod cutting device according to claim 4, It is characterized in that The at least two transfer platforms include a second motion mechanism that enables at least one swing arm assembly to linearly displace on the first rotating shaft to adjust the spacing distance between the at least two swing arm assemblies.

7. The silicon rod cutting device according to claim 6, It is characterized in that The number of the swing arm assemblies is four, including a first swing arm assembly and a second swing arm assembly respectively disposed at two ends of the first rotating shaft, and a third swing arm assembly and a fourth swing arm assembly respectively axially connected between the two ends of the first rotating shaft according to a preset interval.

8. The silicon rod cutting device according to claim 7, It is characterized in that The transfer platform of the third swing arm assembly or the fourth swing arm assembly includes a second motion mechanism that linearly displaces on the first rotating shaft.

9. The silicon rod cutting device according to claim 4, It is characterized in that It also includes a second rotating shaft driven by a second driving device, the second rotating shaft is parallel to the first rotating shaft, and the second driving device outputs a corresponding rotation speed and / or rotation angle to the second rotating shaft following the working state of the first driving device.

10. The silicon rod cutting device according to claim 9, It is characterized in that The first driving device is disposed at one end of the first rotating shaft, and the second driving device is disposed at one end of the second rotating shaft.

11. The silicon rod cutting device according to claim 9, It is characterized in that The second rotating shaft is axially connected to the swing arm assembly and is located between the first rotating shaft on the swing arm body and the supporting mechanism.

12. The silicon rod cutting device according to claim 11, It is characterized in that The supporting mechanism includes: a manipulator assembly, which is arranged at the end of the swing arm body, including: a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member is dynamically connected to the second rotating shaft, and drives the supporting member to rotate on the manipulator body when the second rotating shaft rotates, so that the supporting member remains in a state of carrying the silicon rod to be cut during the transfer operation.

13. The silicon rod cutting device according to claim 11, It is characterized in that The swing arm body has a built-in space.

14. The silicon rod cutting device according to claim 13, It is characterized in that The supporting mechanism comprises: A driving gear is disposed in the built-in space of the swing arm body and is axially connected to the second rotating shaft, and is used for rotating under the driving of the second rotating shaft; A passive gear, axially connected to the built-in space of the swing arm body and meshing with the active gear; The manipulator assembly is arranged at the end of the swing arm body, including a manipulator body and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, wherein the supporting member includes a tooth portion meshing with the passive gear and a supporting portion for conforming to the outer contour of the silicon rod to be cut.

15. The silicon rod cutting device according to claim 14, It is characterized in that The number of teeth of the toothed portion of the supporting portion is greater than the number of teeth of the passive gear, and the number of teeth of the passive gear is greater than the number of teeth of the active gear.

16. The silicon rod cutting device according to claim 14, It is characterized in that The contact surface between the supporting portion and the silicon rod to be cut has a buffer material.

17. The silicon rod cutting device according to claim 2, It is characterized in that The swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut.

18. The silicon rod cutting device according to claim 1, It is characterized in that The extension line of the multi-wire wire saw forms an angle of 90° with the extension line of the single-wire wire saw; the cutting frame can be rotated by ±45° or 90° on the lifting mechanism.

19. The silicon rod cutting device according to claim 1, It is characterized in that The extended line of the multi-wire wire saw forms an angle of 60° with the extended line of the single-wire wire saw; the cutting frame can be rotated by ±60° or 120° on the lifting mechanism.

20. The silicon rod cutting device according to claim 1, It is characterized in that The first multi-wire cutting wheel or the second multi-wire cutting wheel is driven to rotate by a driving motor to run the cutting wire wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

21. The silicon rod cutting device according to claim 1, It is characterized in that The cutting wire is a twisted wire cutting wire formed by twisting at least two cutting wires.

22. The silicon rod cutting device according to claim 1, It is characterized in that It also includes a tension detection mechanism, including a tensioning wheel arranged on the cutting frame, for detecting and adjusting the tension of the cutting wires between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

23. The silicon rod cutting device according to claim 22, It is characterized in that It also includes at least one wire wheel, which is arranged on the cutting frame to realize the reversal of the cutting line.

24. The silicon rod cutting device according to claim 23, It is characterized in that The cutting wire is guided by the guide wheel to wind around the first multi-wire cutting wheel and the second multi-wire cutting wheel at least twice, and is guided by the guide wheel to wind around the single-wire cutting wheel once.

25. The silicon rod cutting device according to claim 1, It is characterized in that It also includes a locking device, which is arranged on the lifting mechanism and is used to lock the cutting frame after the cutting frame rotates around its rotating part to achieve the conversion between the first cutting state and the second cutting state.

26. The silicon rod cutting device according to claim 1, It is characterized in that It also includes a cutting frame displacement device, which is arranged between the lifting mechanism and the machine base and is used for linear displacement along the axial direction of the silicon rod to adjust the length of the cut silicon rod.

27. The silicon rod cutting device according to claim 1, It is characterized in that The lifting mechanism is provided with a level detection device for detecting the horizontality of the axis of the silicon rod to be cut placed in the cutting work area.

28. The silicon rod cutting device according to claim 27, It is characterized in that It also includes a leveling device, which is arranged in the cutting work area and is used to level the axis of the silicon rod to be cut placed in the cutting work area according to the detection result of the horizontal detection device.

29. The silicon rod cutting device according to claim 1, It is characterized in that It also includes an end material taking device, which is arranged at at least one end of the cutting work area and is used to receive the cutting tailings at the end of the silicon rod to be cut.

30. The silicon rod cutting device according to claim 1, It is characterized in that The silicon rod unloading device is provided with a sensor device for detecting the cutting position of the end of the silicon rod to be cut.

31. The silicon rod cutting device according to claim 30, It is characterized in that The sensor device is a contact sensor.

32. The silicon rod cutting device according to claim 1, It is characterized in that The silicon rod unloading device comprises: A material taking arm is suspended on the top frame of the silicon rod cutting device in a translational manner, and includes a telescopic mechanism; The clamping member is arranged at the bottom end of the material taking arm and is used for clamping the single-segment silicon rod segment that meets the workpiece specifications after being cut.

33. The silicon rod cutting device according to claim 32, It is characterized in that The clamping member comprises: A first clamping block, comprising a first rack and a first clamping portion linked to the first rack; The second clamping block is mirror-imaged relative to the first clamping block, and includes a second rack and a second clamping portion linked to the second rack. A driving gear is connected to a power output shaft of a motor and meshes with the first rack and the second rack, and is used to drive the first clamping part and the second clamping part to move toward each other to perform a clamping action during forward rotation, and to drive the first clamping part and the second clamping part to move away from each other to perform a releasing action during reverse rotation.

34. The silicon rod cutting device according to claim 33, It is characterized in that The first clamping part and the second clamping part are provided with buffer materials on the clamping surfaces for clamping the single-segment silicon rod segment.

35. A silicon rod cutting device, It is characterized in that include: A silicon rod loading device is arranged between a material storage area and a cutting work area, and is used to transfer the silicon rods to be cut placed in the material storage area to the cutting work area; The wire cutting device comprises a cutting frame suspended on the upper side of the cutting work area, a first multi-wire cutting wheel, a second multi-wire cutting wheel, a single-wire cutting wheel, and a cutting wire; the cutting frame is rotatably arranged on a lifting mechanism, the cutting frame comprises a rotating part, a first cantilever extending from the rotating part toward a first direction, a second cantilever extending from the rotating part toward a second direction, and a third cantilever extending from the rotating part toward a third direction; the cutting wire is wound around a wire-releasing drum at the head end and a wire-receiving drum at the tail end, and is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel by means of a plurality of wire wheel guides; the first multi-wire cutting wheel is arranged at the extending end of the first cantilever, and has at least two wire groove; the second multi-wire cutting wheel is arranged at the extended end of the second cantilever, and has at least two wire grooves, and the cutting wire segment between the first multi-wire cutting wheel and the second multi-wire cutting wheel forms a multi-wire wire saw; the single-wire cutting wheel is arranged at the extended end of the third cantilever, and the cutting wire segment between the second multi-wire cutting wheel and the single-wire cutting wheel forms a single-wire wire saw; wherein, when the silicon rod placed in the cutting work area is cut off, the cutting frame is rotated around its rotating part to realize the conversion between the first cutting state of cutting by the multi-wire wire saw and the second cutting state of cutting by the single-wire wire saw; the first cutting state is the film taking operation state, and the second cutting state is the cutting operation state; The silicon rod unloading device is arranged at the discharge end of the cutting work area, and is used to clamp and transport the single-segment silicon rod segments that meet the workpiece specifications after being cut for unloading.

36. The silicon rod cutting device according to claim 35, It is characterized in that The cutting wire is guided by the guide wheel to wind around the first multi-wire cutting wheel and the second multi-wire cutting wheel at least twice, and is guided by the guide wheel to wind around the single-wire cutting wheel once.

37. The silicon rod cutting device according to claim 35, It is characterized in that It also includes at least one tension detection mechanism, including a tensioning wheel arranged on the cutting frame or the lifting mechanism, for detecting and adjusting the tension of the cutting wire between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel.

38. The silicon rod cutting device according to claim 35, It is characterized in that When the wire cutting device is in the first cutting state, the single-wire cutting wheel is not in contact with the cutting wire; when switching from the first cutting state to the second cutting state, the cutting frame rotates around its rotating part so that the single-wire cutting wheel presses the cutting wire, until reaching the second cutting state, the cutting wire is wound around the single-wire cutting wheel so that the cutting wire segment between the single-wire cutting wheel and the second multi-wire cutting wheel forms a single-wire wire saw.

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