Guide rail type glue removal machine

Abstract

The present invention provides a guide rail type glue removal machine, comprising a film box unit (102) and a glue removal unit (103) installed on one side of a machine platform (101), wherein the two film box units (102) are respectively located on both sides of the glue removal unit (103), and a sliding module (105) is slidably provided on a slide rail (104) on the other side of the machine platform (101), and an adsorption mechanism (106) is installed on the sliding module (105); the film box unit (102) comprises a lifting platform (2.1) installed on a lifting module (2.2), and a box body (2.3) is stacked on the lifting platform (2.1). The present invention provides a guide rail type glue removal machine with a compact structure, a reasonable design, and a small size.

Description

Technical Field

[0001] The present invention relates to a guide rail type adhesive stripping machine, in particular to a device for removing adhesive and cleaning semiconductor substrates (such as wafers), belonging to the technical field of semiconductor equipment. Background Art

[0002] Currently, the cleanliness requirements for the surfaces of semiconductor substrates, such as wafers, are becoming increasingly stringent during semiconductor device manufacturing. Contaminants such as particles, organic matter, and metals on semiconductor substrates are typically removed through chemical reactions or physical forces to overcome the attractive forces of chemical bonds or physical adhesion. Currently, wet cleaning is still the predominant method for cleaning semiconductor substrates, which is generally divided into two types: tank cleaning and single-wafer cleaning. Tank cleaning can process multiple substrates simultaneously, offering high cleaning efficiency. However, a major drawback of tank cleaning is its limited contaminant removal rate. This is because even with high-purity chemicals and deionized water, contaminants removed from the substrates remain in the cleaning solution, causing secondary contamination. To prevent secondary contamination, single-wafer cleaning is gradually replacing tank cleaning, effectively preventing secondary contamination. During the substrate cleaning process, fresh chemicals and deionized water are continuously supplied to the substrate surface, while used chemicals and deionized water are directly discharged and recycled. Furthermore, yield is a key factor in the transition to single-wafer cleaning, and single-wafer cleaning can significantly improve yield. Compared with tank cleaning, single-wafer cleaning has the advantages of good cleaning effect, high cleaning liquid recovery rate, and effective prevention of cross contamination, but the production capacity is relatively low compared to tank cleaning.

[0003] Therefore, in some processes, in order to achieve better cleaning results and appropriately increase production capacity, it is necessary to use a combination of tank cleaning and single-wafer cleaning to clean the substrates. However, the existing tank cleaning equipment and single-wafer cleaning equipment are two completely separate devices. After the substrate is cleaned in the tank cleaning equipment, it is placed in the single-wafer cleaning equipment for cleaning and drying. This results in a long cleaning process cycle, high cleaning costs, and the two sets of equipment occupy a large space. Therefore, a degumming machine that can solve the above problems is urgently needed. Summary of the Invention

[0004] The purpose of the present invention is to overcome the above-mentioned shortcomings and provide a guide rail type glue remover with compact structure, reasonable design and small size.

[0005] The object of the present invention is achieved like this:

[0006] A guide rail type glue removal machine includes a film box unit and a glue removal unit installed on one side of the machine. The two film box units are located on both sides of the glue removal unit. A sliding module is slidably arranged on the slide rail on the other side of the machine, and an adsorption mechanism is installed on the sliding module.

[0007] The present invention provides a guide rail type glue removing machine, wherein the film box unit comprises a lifting platform installed on a lifting module, and the box bodies are stacked on the lifting platform.

[0008] The present invention provides a guide rail type glue removing machine, wherein the glue removing unit includes a fixed plate installed on a machine table, a square cavity is installed on the fixed plate, a lifting cavity is provided in the square cavity, a wafer ring is provided in the lifting cavity, one end of a rotating main shaft is inserted into the square cavity and passes through the lifting cavity to drive the wafer ring, the top end of the cavity lifting rod penetrates into the square cavity and is connected to the top outer wall of the lifting cavity, the top end of the wafer ring lifting rod penetrates into the square cavity, passes through the lifting cavity and is connected to the bottom surface of the wafer ring; and the bottom of the wafer ring lifting rod is installed on the lifting seat.

[0009] The present invention provides a guide rail type glue removing machine, wherein a swing arm is arranged in the square cavity.

[0010] The present invention provides a guide rail type glue remover, wherein the parts of the cavity jacking rod and the wafer ring jacking rod located in the square cavity are both covered with liquid blocking parts.

[0011] The present invention provides a guide rail type adhesive stripping machine. The wafer ring lifting rod is sleeved with a sealing guide part, and the sealing guide part is embedded in the lifting cavity.

[0012] The present invention provides a guide rail type adhesive stripping machine, wherein the outer edge protrusion of the upper surface of the wafer ring is provided with a limit stopper.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The film box of the present invention is combined with the degumming unit. The finger adsorption mechanism directly goes to the film box unit to take the film and transfers it to the degumming unit. After the degumming is completed, the finger adsorption mechanism transfers it to the film box unit on the other side. The whole structure shortens the process cycle and reduces the process cost. In addition, the whole machine has high maintainability, low cost and small investment, which is easy to promote and apply. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The figure is a structural schematic diagram of a guide rail type glue removing machine of the present invention.

[0016] Figure 2 The figure is a structural schematic diagram of a film box unit of a guide rail type glue removing machine of the present invention.

[0017] Figure 3 The figure is a structural schematic diagram of a degumming unit of a guide rail type degumming machine according to the present invention.

[0018] Figure 4 The figure is a schematic diagram of the state of the lifting chamber of a guide rail type glue removal machine of the present invention when it is lifted.

[0019] Figure 5This is a schematic diagram of the state of a guide rail type glue removal machine when the lifting chamber is descending.

[0020] in:

[0021] Machine 101, cassette unit 102, degumming unit 103, slide rail 104, sliding module 105, adsorption mechanism 106;

[0022] Cavity 1 201, Cavity 2 202;

[0023] Lifting platform 2.1, lifting module 2.2, box body 2.3;

[0024] Fixed plate 3.1, square cavity 3.2, lifting cavity 3.3, wafer ring 3.4, rotating spindle 3.5, cavity extension rod 3.6, wafer ring lifting rod 3.7, lifting seat 3.8, swing arm 3.9, liquid blocking member 3.10, sealing guide member 3.11;

[0025] Limit stop 3.4.1. DETAILED DESCRIPTION

[0026] See also Figures 1 to 5 The present invention relates to a guide rail type glue removal machine, comprising a film box unit 102 and a glue removal unit 103 installed on one side of a machine platform 101, wherein the two film box units 102 are respectively located on both sides of the glue removal unit 103, and a sliding module 105 is slidably provided on a slide rail 104 on the other side of the machine platform 101, and an adsorption mechanism 106 is installed on the sliding module 105;

[0027] When in use, the suction mechanism 106 grabs the substrate from the cassette unit 102 on one side, and then, driven by the sliding module 105, passes through the multiple degumming units 103 in sequence for degumming and cleaning, and is placed into the cassette unit 102 on the other side after degumming and cleaning.

[0028] join Figure 2 Furthermore, the film box unit 102 includes a lifting platform 2.1 installed on the lifting module 2.2, and a box body 2.3 is stacked on the lifting platform 2.1; thereby facilitating lifting, grabbing and placing the collected films into the box body 2.3 during operation;

[0029] See also Figure 3Furthermore, the degumming unit 103 includes a fixed plate 3.1 mounted on the machine table 101, with a square cavity 3.2 mounted on the fixed plate 3.1, a lifting cavity 3.3 provided in the square cavity 3.2, a wafer ring 3.4 provided in the lifting cavity 3.3 (the outer edge of the upper surface of the wafer ring 3.4 is convexly provided with a limit stopper 3.4.1), one end of the rotating spindle 3.5 is inserted into the square cavity 3.2 and passes through the lifting cavity 3.3 to drive the wafer ring 3.4, the top end of the cavity extension rod 3.6 passes through the square cavity 3.2 and is connected to the top outer wall of the lifting cavity 3.3, the top end of the wafer ring lifting rod 3.7 passes through the square cavity 3.2, passes through the lifting cavity 3.3 and is connected to the bottom surface of the wafer ring 3.4; and the bottom of the wafer ring lifting rod 3.7 is mounted on the lifting seat 3.8;

[0030] Preferably, a swing arm 3.9 is provided in the square cavity 3.2;

[0031] Preferably, the portions of the cavity extension rod 3.6 and the wafer ring extension rod 3.7 located in the square cavity 3.2 are both equipped with liquid blocking members 3.10;

[0032] Preferably, the wafer ring lifting rod 3.7 is provided with a sealing guide 3.11, and the sealing guide 3.11 is embedded in the lifting cavity 3.3;

[0033] The degumming process of the guide rail type degumming machine of the present invention is as follows:

[0034] The wafer pick-up and placement suction mechanism (such as a finger) carries the wafer ring 3.4 into the square cavity 3.2; the wafer ring lifting rod 3.7 rises to take the wafer; then the wafer ring 3.4 is separated from the suction mechanism (such as a finger), and the suction mechanism (such as a finger) leaves the square cavity; the wafer ring lifting rod 3.7 falls, and during the falling process, the wafer ring 3.4 automatically falls into the loading tray of the lifting cavity 3.3, and at the same time, the wafer ring lifting rod 3.7 continues to fall into place and automatically separates from the wafer ring 3.4; the rotating spindle 3.5 carries the wafer ring 3.4 in the loading tray .4 rotation; the degumming arm in the swing arm 3.9 rotates and swings into the cavity of the lifting cavity 3.3. After the swing arm 3.9 is in place, the nozzle on the arm opens to spray the degumming liquid (the swing arm 3.9 can spray the liquid at a fixed point or by swinging back and forth). After the spraying is completed, the degumming arm swings out of the cavity; then the cleaning and drying arm in the swing arm 3.9 rotates and swings into the cavity; at this time, the cavity extension rod 3.6 moves to lift the lifting cavity 3.3, and the cavity 1 201 and the cavity 2 202 are switched, so as to perform liquid separation and recovery (see Figure 4 and Figure 5Specifically, the cavity is an integrated double cavity, which has two chambers (chamber 1 201 and chamber 2 202). When degumming, the swing arm 3.9 serving as the degumming arm enters chamber 1 201. When the swing arm 3.9 is cleaning and drying, the swing arm 3.9 serving as the cleaning and drying arm first swings into the cavity of the lifting cavity 3.3, and then the lifting cavity 3.3 is lifted under the action of the cavity lifting rod 3.6, so that the cleaning and drying arm enters chamber 2 202); and the nozzles on the swing arm 3.9 are opened to clean and dry in sequence; after cleaning and drying are completed, the cavity lifting rod 3.6 causes the cavity to descend, and the cleaning and drying arm swings out of the cavity; then the carrier plate stops rotating, and the wafer ring lifting rod 3.7 rises at the same time. During the rising process, the wafer ring 3.4 automatically separates from the carrier plate and is supported and taken out of the cavity by the wafer ring lifting rod 3.4. Finally, the adsorption mechanism (such as a finger) takes the wafer out of the square cavity and enters other units, thereby completing a complete cycle.

[0035] In addition: It should be noted that the above specific implementation is only an optimization scheme of this patent. Any changes or improvements made by technicians in this field based on the above concept are within the scope of protection of this patent.

Claims

1. A guide rail type glue remover, characterized by: The machine comprises a film box unit (102) and a degumming unit (103) installed on one side of a machine (101), wherein the two film box units (102) are respectively located on both sides of the degumming unit (103); a sliding module (105) is slidably provided on a slide rail (104) on the other side of the machine (101), and an adsorption mechanism (106) is installed on the sliding module (105); The film box unit (102) includes a lifting platform (2.1) installed on the lifting module (2.2), and a box body (2.3) is stacked on the lifting platform (2.1); the degumming unit (103) includes a fixed plate (3.1) installed on the machine (101), a square cavity (3.2) is installed on the fixed plate (3.1), a lifting cavity (3.3) is provided in the square cavity (3.2), and a wafer ring (3.4) is provided on the carrier plate in the lifting cavity (3.3). The rotating spindle One end of the (3.5) inserted into the square cavity (3.2) passes through the lifting cavity (3.3) and drives the wafer ring (3.4) on the carrier to rotate; the top of the cavity extension rod (3.6) passes through the one end of the square cavity (3.2) and is connected to the top outer wall of the lifting cavity (3.3); the top of the wafer ring lifting rod (3.7) passes through the one end of the square cavity (3.2), passes through the lifting cavity (3.3), and is connected to the bottom surface of the wafer ring (3.4); and the bottom of the wafer ring lifting rod (3.7) is installed on the lifting seat (3.8).

2. A guide rail type glue remover according to claim 1, characterized in that: A swing arm (3.9) is provided in the square cavity (3.2).

3. The guide rail type glue remover according to claim 1, characterized in that: The portions of the cavity extension rod (3.6) and the wafer ring extension rod (3.7) located in the square cavity (3.2) are both equipped with liquid blocking parts (3.10).

4. The guide rail type glue remover according to claim 1, characterized in that: A sealing guide (3.11) is sleeved on the wafer ring lifting rod (3.7), and the sealing guide (3.11) is embedded in the lifting cavity (3.3).

5. The guide rail type adhesive stripping machine according to claim 1, characterized in that: A limit stopper (3.4.1) is provided on the outer edge of the upper surface of the wafer ring (3.4).

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