Energy storage device

Abstract

A method includes providing a stack for an energy storage device on a substrate, the stack including a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer. A groove is formed through at least the second electrode layer and the electrolyte layer, such that the groove is wider in the second electrode layer than in the electrolyte layer. An electrically insulating material is provided in the groove. A conductive material is provided in the groove on the insulating material.

Description

Technical Field

[0001] The invention relates to a method for producing an energy storage device, an energy storage device and an intermediate structure for producing an energy storage device. Background Art

[0002] Energy storage devices such as solid-state thin-film batteries can be produced by forming a stack of layers on a substrate. The stack of layers typically includes a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer. The combination of the stack and substrate can then be cut into individual parts to form individual batteries.

[0003] To avoid short circuit, an electrical insulating material may be provided to insulate the first electrode layer from the second electrode layer. The first electrode layer and the second electrode layer may each be connected to an external circuit via a conductive material.

[0004] It would be desirable to provide a method of manufacturing an energy storage device that is simpler or more efficient than known manufacturing methods. Summary of the invention

[0005] According to a first aspect of the present invention, there is provided a method comprising:

[0006] providing a stack for an energy storage device on a substrate, the stack comprising a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer;

[0007] forming a groove through at least the second electrode layer and the electrolyte layer such that the groove is wider in the second electrode layer than in the electrolyte layer;

[0008] providing an electrically insulating material in the recess; and

[0009] A conductive material is provided on the insulating material in the recess.

[0010] By forming a groove wider in the second electrode layer than in the electrolyte layer, the electrically insulating material can be more effectively contained in the groove. The accommodation of the conductive material in the groove can also be improved. For example, the conductive material can be mainly or entirely located in the wider part of the groove, which can provide a larger accommodation area for the conductive material compared to other methods. Therefore, this can reduce the contact between the conductive material and the stacked part outside the groove, otherwise such contact may occur if the conductive material is not fully accommodated in the groove. Therefore, a smaller amount of conductive material can be used to provide sufficient electrical connection (for example, for connection to an external circuit) between one of the first electrode layer or the second electrode layer and the electrical connector. Therefore, the method can allow a more efficient manufacture of energy storage devices.

[0011] In examples, forming the groove through at least the second electrode layer and the electrolyte layer forms an exposed surface of the electrolyte layer that is more wettable to the conductive material than the exposed surface of the second electrode layer. In these examples, the conductive material preferentially wets the exposed surface of the electrolyte layer rather than the exposed surface of the second electrode layer. For example, in the case where the exposed surface of the electrolyte is within the groove, this can further improve the containment of the conductive material within the groove.

[0012] In an example where the second electrode layer is further away from the substrate than the first electrode layer, the first portion of the exposed surface of the second electrode layer may be outside the groove. The first portion of the exposed surface of the second electrode layer may, for example, be an exposed surface of the stack, which is opposite to the unexposed surface of the stack, and the unexposed surface is in contact with the substrate. Therefore, the exposed surface of the stack may be the upper surface of the stack. In examples such as these, the conductive material may preferably wet the exposed surface of the electrolyte layer in the groove, rather than the first portion of the exposed surface of the second electrode layer outside the groove. Therefore, the conductive material may preferably remain in the groove, rather than contacting the first portion of the exposed surface of the second electrode layer outside the groove. This can further improve the confinement of the conductive material in the groove.

[0013] In an example such as this, providing a conductive material in a groove may include depositing the conductive material on a first portion of the exposed surface of the second electrode layer so that the conductive material flows into the groove. Therefore, in this case, the conductive material can move into the groove spontaneously without being stimulated externally. For example, the wettability difference between the exposed surface of the second electrode layer and the electrolyte layer may be sufficient to allow the conductive material to travel from the first portion of the exposed surface of the contacting second electrode layer to the contacting electrolyte layer. This can reduce manufacturing restrictions on the deposition position of the conductive material. For example, instead of depositing the conductive material precisely in the groove, the conductive material can be deposited on a larger deposition area (e.g., on the first portion of the exposed surface of the second electrode layer) instead. Nevertheless, the conductive material can still flow into the groove. In this way, the conductive material can be arranged in the groove in a more direct manner.

[0014] In an example, the exposed surface of the electrolyte layer is more hydrophilic than the first portion of the exposed surface of the second electrode layer. This may be the case where the conductive material preferentially wets a surface with a higher hydrophilicity (i.e., a lower hydrophobicity). In this case, the conductive material may not wet the first portion of the exposed surface of the second electrode layer and move to contact the exposed surface of the electrolyte layer within the groove.

[0015] In the examples, grooves are formed through the second electrode layer, the electrolyte layer and the first electrode layer to form an exposed surface of the substrate. In these examples, the electrically insulating material can contact the exposed surfaces of the electrolyte layer and the first electrode layer in the groove, thereby improving the insulation of the first electrode layer and the second electrode layer. In the examples, the exposed surface of the substrate is more wettable to the electrically insulating material than the exposed surface of the electrolyte layer. This can further help the movement of the electrically insulating material into the groove. For example, since the electrically insulating material preferably wets the exposed surface of the substrate, the electrically insulating material can move toward the exposed surface of the substrate and further move into the groove. Then, the electrically insulating material can remain in contact with the exposed surface of the substrate, rather than contacting the exposed surface of the electrolyte layer, which is less wettable to the electrically insulating material. In this way, the electrically insulating material can be effectively and directly confined in the groove.

[0016] In examples, providing the electrically insulating material in the grooves includes depositing the electrically insulating material on an exposed surface of the electrolyte, whereby the electrically insulating material flows into contact with the exposed surface of the substrate. In these examples, the electrically insulating material may spontaneously move into the grooves. As similarly explained with respect to the deposition of the conductive material, this may allow the electrically insulating material to be deposited over a larger deposition area, thereby simplifying the manufacture of the energy storage device.

[0017] In an example, the exposed surface of the electrolyte layer is more hydrophilic than the exposed surface of the substrate. This may be the case when the electrically insulating material has a greater affinity for surfaces with a lower hydrophilicity (i.e., a higher hydrophobicity). In this case, the electrically insulating material may not wet the exposed surface of the electrolyte layer and move to contact the exposed surface of the substrate within the groove.

[0018] In the example, the exposed surface of the electrolyte layer is more wettable to the conductive material than the electrically insulating material. Therefore, since the conductive material has a greater affinity for the exposed surface of the electrolyte layer, the conductive material may not wet the electrically insulating material. This may encourage the conductive material to move away from the electrically insulating material and contact the second portion of the second electrode layer within the groove. This may improve the electrical connection between the conductive material and the second electrode layer. The non-wetting of the electrically insulating material may be performed spontaneously in this way without the need for external stimulation, thereby simplifying the creation of electrical contact between the conductive material and the second electrode layer.

[0019] In an example, the exposed surface of the electrolyte layer is more hydrophilic than the electrically insulating material. This may be the case where the conductive material preferentially wets a surface with a higher hydrophilicity (i.e., with a lower hydrophobicity). This may result in the conductive material not wetting the electrically insulating material and moving into contact with the second electrode layer.

[0020] In examples, after providing the conductive material in the groove, the exposed surface of the second electrode layer is substantially free of the conductive material. Thus, in these examples, the conductive material can be contained within the groove without overflowing to contact other surfaces of the stack, such as the exposed surface of the second electrode layer. This can allow a smaller amount of conductive material to be used in the manufacture of the energy storage device. Thus, the energy storage device can be manufactured more efficiently.

[0021] In an example, the conductive material is disposed in the groove so that the conductive material is in contact with the exposed surface of the electrolyte layer and the surface of the electrically insulating material. Therefore, the conductive material can be supported or otherwise contacted by both the exposed surface of the electrolyte layer and the surface of the electrically insulating material. In these cases, after the stack has been divided into a plurality of batteries, the conductive material can extend toward the exposed surface of the battery for the energy storage device. For example, one side of the conductive material can be flush with one side of the battery. Compared with the conductive material being recessed or away from the exposed surface of the battery, this can allow the battery to be connected more directly to other batteries or to other circuits (e.g., external circuits).

[0022] In an example, the exposed surface of the electrolyte layer has a width greater than or equal to about 5 microns in a direction perpendicular to the surface of the substrate. With this width, the exposed surface of the electrolyte layer can be wide enough to contain a relatively large proportion of the conductive material within the groove. As explained herein, this can therefore allow for more efficient manufacture of energy storage devices.

[0023] In an example, the conductive material is disposed in the groove so that the conductive material contacts a second portion of the exposed surface of the second electrode layer that is located within the groove. The contact between the conductive material and the second portion of the exposed surface of the second electrode layer can therefore provide an electrical connection between the conductive material and the second electrode layer. This allows the second electrode layer to be connected to other components (e.g., other batteries or external circuits of a multi-battery energy storage device) via the conductive material. Such an electrical connection can extend in a plane parallel to the exposed surface of the electrolyte layer in a direction perpendicular to the width of the exposed surface of the electrolyte layer. This can reduce the risk of melting at the place where the conductive material meets the second electrode layer during use of the energy storage device. For example, melting may be less likely to occur than when the conductive material encounters the second electrode layer intermittently or with a relatively small contact area.

[0024] In an example, the second portion of the exposed surface of the second electrode layer is more wettable to the conductive material than the electrically insulating material. Therefore, the conductive material may preferably wet the second portion of the exposed surface of the second electrode layer rather than the electrically insulating material. Therefore, the conductive material may not wet the electrically insulating material and move toward the second portion of the exposed surface of the second electrode layer and contact the second electrode layer. This enables the electrical connection between the second electrode layer and the conductive material to be formed spontaneously without external stimulation. This can simplify such electrical connection.

[0025] In an example, the electrically insulating material in the groove has a curved surface. The curved surface of the electrically insulating material can be used to further constrain the position of the conductive material on the electrically insulating material. For example, if the electrically insulating material has a convex surface, the conductive material may not wet the electrically insulating material to a greater extent than if the electrically insulating material has other surface shapes. This can provide a constraint on the second portion of the exposed surface of the second electrode layer of the conductive material and improve the electrical connection between the conductive material and the second electrode layer. On the contrary, if the electrically insulating material has a concave surface, the exposed surface of the conductive material can have a larger surface area than others. Therefore, this larger surface area can provide a larger available area for the electrical connection between the conductive material and other electrical components. This can simplify the connection of the conductive material to these other electrical components. In addition, the battery can be used more flexibly because it can be connected to a wider range of different electronic components than other batteries with smaller available areas for electrical connection.

[0026] In an example, the groove has a substantially T-shaped cross-section. For example, this provides a suitable shape for a groove for accommodating both electrically insulating material and conductive material. As described herein, such a shape can be directly manufactured, for example, using laser ablation.

[0027] In an example, at least one of the following: an electrically insulating material is provided as a first liquid or a conductive material is provided as a second liquid. This allows, for example, one or both of the electrically insulating material and the conductive material to be simply provided using inkjet printing. In addition, liquids tend to flow without external influences to conform to the shape of the container (e.g., the grooves described herein). Therefore, depositing either or both of the electrically insulating material and the conductive material as liquids allows either of these materials to flow into the desired location in a simple manner. The flow of these materials can be directly controlled, for example by controlling the wettability of the surface that these materials are to contact.

[0028] According to a second aspect of the present invention, there is provided an energy storage device, comprising:

[0029] substrate;

[0030] A stack on a substrate, the stack comprising:

[0031] a first electrode;

[0032] a second electrode; and

[0033] An electrolyte is provided between a first electrode and a second electrode, the first electrode being closer to the substrate than the second electrode, the electrolyte comprising a first portion overlapping the second electrode and a second portion not overlapping the second electrode.

[0034] an electrically insulating material in contact with the first electrode and the electrolyte; and

[0035] A conductive material is in contact with the second portion of the electrolyte and the second electrode.

[0036] In the case of an electrolyte in which the first portion overlaps with the second electrode and the second portion does not overlap with the second electrode, the width of the second electrode may be less than the width of the electrolyte. For example, such a width may be adopted in a plane parallel to the plane of the substrate. Therefore, this may allow the electrolyte to have an exposed surface, such as the surface of the second portion of the electrolyte that does not overlap with the second electrode. The second portion of the electrolyte, for example, provides a contact area (for example, a ledge or shelf) for supporting a conductive material. The conductive material may be supported and confined on the second portion of the electrolyte, in contact with the second electrode. The second electrode may be connected to other electrical components (such as other batteries or external circuits) via a conductive material. Therefore, this energy storage device may be more directly connected to other electrical components. In addition, this energy storage device may be manufactured in a simple or effective manner, for example, with reference to the method described in the first aspect of the present invention.

[0037] In an example, the width of the surface of the second portion of the electrolyte is greater than or equal to about 5 microns in a plane parallel to the plane of the surface of the substrate. As explained with reference to the first aspect of the invention, with this width, the surface of the second portion of the electrolyte can effectively support or otherwise contain a large proportion of the conductive material. This allows for more efficient manufacture of energy storage devices. In addition, the electrical connection between the conductive material and the second electrode can be improved and is less likely to melt.

[0038] In an example, the electrically insulating material may not substantially contact the second electrode. Thus, this may provide a larger contact area between the conductive material and the second electrode than would otherwise be possible, which may improve electrical contact between the conductive material and the second electrode.

[0039] According to a third aspect of the present invention, there is provided a method comprising:

[0040] providing a stack for an energy storage device on a substrate, the stack comprising a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer, the stack comprising a groove passing through at least the second electrode layer and the electrolyte layer, wherein the groove is wider in the second electrode layer than in the electrolyte layer, such that the electrolyte layer comprises a first portion overlapping the second electrode layer and a second portion not overlapping the second electrode layer; and

[0041] An electrically insulating material is deposited on the exposed surface of the second portion of the electrolyte layer so that the electrically insulating material flows into the groove to contact the exposed surface within the groove, which is more wettable to the electrically insulating material than the exposed surface of the second portion of the electrolyte layer.

[0042] Similar to the first aspect of the invention, examples according to the third aspect of the invention improve the containment of the electrically insulating material within the groove. For example, the electrically insulating material can move into the groove spontaneously. This can reduce manufacturing constraints on the deposition of the electrically insulating material and can simplify the arrangement of the electrically insulating material in the groove. In addition, the electrically insulating material can be provided more effectively than other methods in which the electrically insulating material is less effectively confined within the groove.

[0043] In an example, the groove extends to the exposed surface of the substrate, and the exposed surface within the groove includes the exposed surface of the substrate. Since the exposed surface of the substrate may correspond to the deepest surface within the groove, this may further encourage the electrically insulating material to flow into the groove and remain within the groove. The deepest surface is, for example, the surface within the groove that is farthest from the entrance of the groove.

[0044] In an example, the exposed surface base of the second portion of the electrolyte layer is parallel to the surface of the substrate. In this way, the energy storage device can be directly manufactured. For example, a series of layers can be deposited sequentially to provide a stack on the substrate. A groove can be formed by the series of layers, and then, an electrically insulating material can be provided.

[0045] According to a fourth aspect of the present invention, there is provided an intermediate structure for an energy storage device, the intermediate structure comprising:

[0046] substrate;

[0047] A stack on a substrate, the stack comprising:

[0048] a first electrode layer;

[0049] a second electrode layer; and

[0050] an electrolyte layer between the first electrode layer and the second electrode layer,

[0051] The stack includes a groove passing through at least the second electrode layer and the electrolyte layer, wherein the groove is wider in the second electrode layer than in the electrolyte layer, such that the electrolyte layer includes a first portion overlapping the second electrode layer and a second portion not overlapping the second electrode layer; and

[0052] The electrically insulating material contacts the exposed surface in the groove, the exposed surface in the groove being more wettable to the electrically insulating material than the exposed surface of the second portion of the electrolyte layer.

[0053] With such an intermediate structure, the electrically insulating material can be more effectively confined within the recess. For example, this simplifies the deposition of the electrically insulating material and can increase the efficiency of manufacturing an energy storage device using the intermediate structure.

[0054] Other features will become apparent from the following description, given by way of example only, which refers to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 is a schematic diagram showing a stack for an energy storage device according to an example;

[0056] Figure 2 is a diagram showing a method for processing according to an example Figure 1 A schematic diagram of an example of stacking to manufacture an energy storage device;

[0057] Figures 3a to 3f is a schematic diagram illustrating features of a method of manufacturing an energy storage device according to an example;

[0058] Figure 4 is a schematic diagram showing an intermediate structure for manufacturing an energy storage device according to an example; and

[0059] Figure 5 is a schematic diagram showing an intermediate structure for manufacturing an energy storage device according to still another example. DETAILED DESCRIPTION

[0060] Details of the methods, structures and devices according to the examples will become apparent with reference to the accompanying drawings, according to the examples. In this specification, many specific details of certain examples are set forth for the purpose of explanation. Reference to "example" or similar language in the specification means that a particular feature, structure or characteristic described in conjunction with the example is included in at least one example, but not necessarily in other examples. It should also be noted that certain examples are schematically described, in which certain features are omitted and / or must be simplified in order to facilitate explanation and understanding of the concepts underlying the examples.

[0061] Figure 1 A stack 100 of layers for an energy storage device is shown. For example, Figure 1The stack 100 may be used as part of a thin film energy storage device having a solid electrolyte.

[0062] exist Figure 1 In the embodiment, stack 100 is on substrate 102. Substrate 102 is, for example, glass or a polymer and can be rigid or flexible. Substrate 102 is typically planar, although this may not be the case in all cases. Figure 1 The stack 100 is shown as being in direct contact with the substrate 102, but in other examples, there may be one or more additional layers between the stack 100 and the substrate 102. Therefore, unless otherwise specified, references herein to an element being "on" another element should be understood to include direct or indirect contact. In other words, an element on another element may be contacting the other element, or not contacting the other element, but rather typically supported by one or more intermediate elements, but still located above or overlapping the other element.

[0063] Figure 1 The stack 100 includes a first electrode layer 104, an electrolyte layer 106, and a second electrode layer 108. Figure 1 In the example of FIG. 1 , the second electrode layer 108 is farther from the substrate 102 than the first electrode layer 104 , and the electrolyte layer 106 is located between the first electrode layer 104 and the second electrode layer 108 .

[0064] The first electrode layer 104 may serve as a positive current collector layer. In such an example, the first electrode layer 104 may form a positive electrode layer (i.e., may correspond to a cathode during discharge of a battery of an energy storage device including the stack 100). The first electrode layer 104 may include a material suitable for storing lithium ions through a stable chemical reaction, such as lithium cobalt oxide, lithium iron phosphate, or an alkali metal polysulfide salt.

[0065] In alternative examples, there may be a separate positive current collector layer that may be located between the first electrode layer 104 and the substrate 102. In these examples, the separate positive current collector layer may include nickel foil; however, it should be understood that any suitable metal may be used, such as aluminum, copper, or steel, or metallized materials including metallized plastics, such as aluminum on polyethylene terephthalate (PET).

[0066] The second electrode layer 108 can serve as a negative current collector layer. In this case, the second electrode layer 108 can form a negative electrode layer (which can correspond to the anode during discharge of a battery of an energy storage device including the stack 100). The second electrode layer 108 may include lithium metal, graphite, silicon, or indium tin oxide (ITO). For the first electrode layer 104, in other examples, the stack 100 may include a separate negative current collector layer, which may be on the second electrode layer 108, and the second electrode layer 108 is between the negative current collector layer and the substrate 102. In examples where the negative current collector layer is a separate layer, the negative current collector layer may include nickel foil. However, it should be understood that any suitable metal may be used for the negative current collector layer, such as aluminum, copper, or steel, or a metallized material including a metallized plastic, such as aluminum on polyethylene terephthalate (PET).

[0067] The first and second electrode layers 104, 108 are generally conductive. Therefore, current can flow through the first electrode layer 104 and the second electrode layer 108 due to the flow of ions or electrons through the first electrode layer 104 and the second electrode layer 108.

[0068] The electrolyte layer 106 may include any suitable material that is ionically conductive but is also an electrical insulator, such as lithium phosphorus oxynitride (LiPON). As described above, the electrolyte layer 106 is, for example, a solid layer and may be referred to as a fast ion conductor. The solid electrolyte layer may have a structure between a liquid electrolyte and a crystalline solid, where the liquid electrolyte, for example, lacks a regular structure and contains ions that can move freely. Crystalline materials, for example, have a regular structure with an ordered arrangement of atoms that may be arranged in a two-dimensional or three-dimensional lattice. The ions of a crystalline material are generally immobile and therefore may not be able to move freely throughout the material.

[0069] For example, stack 100 may be fabricated by depositing first electrode layer 104 on substrate 102. Electrolyte layer 106 is subsequently deposited on first electrode layer 104, and second electrode layer 108 is then deposited on electrolyte layer 106. Each layer of stack 100 may be deposited by flooding, which provides a simple and efficient way to produce highly uniform layers, although other deposition methods are possible.

[0070] Figure 1 The stack 100 can also be processed to make an energy storage device. Figure 2 The schematic diagram shows the Figure 1 An example of processing of a stack 100 is shown.

[0071] exist Figure 2, stack 100 and substrate 102 together form an intermediate structure 110 for manufacturing an energy storage device. In this example, intermediate structure 110 is flexible, allowing it to be wound around a roll 112 as part of a roll-to-roll manufacturing process (sometimes referred to as a reel-to-reel manufacturing process). Intermediate structure 110 can be gradually unwound from roll 112 and further processed.

[0072] exist Figure 2 In an example of , a groove may be formed through the intermediate structure 110 (e.g., through the stack 100) using a first laser 114. The first laser 114 is arranged to apply a laser beam 116 to the intermediate structure 110 to remove a portion of the intermediate structure 100, thereby forming the groove in the stack 100. This process may be referred to as laser ablation.

[0073] After forming the grooves, electrically insulating materials can be deposited in at least some of the grooves using a material deposition system 118. The material deposition system 118 fills at least some of the grooves with a liquid 120 such as an organic suspension liquid material, for example. The liquid 120 can then be solidified in the groove to form an electrically insulating plug in the groove. Electrically insulating materials can be considered non-conductive and can therefore conduct a relatively small amount of current when subjected to an electric field. Typically, electrically insulating materials (sometimes referred to as insulators) conduct less current than semiconductor materials or conductive materials. However, there is still a small amount of current flowing through the electrically insulating material under the influence of an electric field, because even insulators may include a small amount of charge carriers that carry current. In the examples herein, the material can be considered electrically insulating, where the material is electrically insulating enough to perform the function of an insulator. For example, this function can be performed in the case where the material fully insulates one element from another element to avoid a short circuit.

[0074] Reference Figure 2 After depositing the electrically insulating material, the intermediate structure 110 is cut along at least some of the grooves to form individual cells for an energy storage device. Figure 2 In the example shown, hundreds or potentially thousands of cells may be cut from a roll of intermediate structure 110, thereby allowing for the manufacture of multiple batteries in an efficient manner.

[0075] exist Figure 2 In the embodiment of the present invention, a cutting operation is performed using a second laser 122, which is arranged to apply a laser beam 124 to the intermediate structure 110. Each cut may, for example, pass through the center of the insulating plug, so that the plug is divided into two parts, each part forming a protective covering on the exposed surface including the edge to which it has been attached. Cutting through the entire stack in this way forms the exposed surfaces of the first and second electrode layers 104, 108.

[0076] Although not in Figure 21 and 2 (illustratively only), but it should be understood that after depositing the electrically insulating material, the intermediate structure 110 can be folded back on itself to form a z-folded structure having at least ten layers, possibly hundreds of layers, and possibly even thousands of layers, with each insulating plug aligned. The laser cutting process performed by the second laser 122 can then be used to cut the z-folded structure for each of the aligned plug groups in a single cutting operation.

[0077] After cutting the battery, electrical connectors can be arranged along opposite sides of the battery so that a first electrical connector on one side of the battery contacts the first electrode layer 104 (which can be considered to form the first electrode after the battery has been separated from the rest of the intermediate structure 110), but is prevented from contacting other layers by an electrically insulating material. Similarly, a second electrical connector on the opposite side of the battery can be arranged to contact the second electrode layer 108 (which can be considered to form the second electrode after the battery has been separated from the rest of the intermediate structure 110), but is prevented from contacting other layers by an insulating material. Thus, the insulating material can reduce the risk of short circuits between the first and second electrode layers 104, 108 and other layers in each battery. The first and second electrical connectors can be, for example, metal materials applied to the edge of the stack 110 (or to the edge of the intermediate structure 110) by sputtering. Thus, the batteries can be effectively and easily connected in parallel.

[0078] Figures 3a to 3f is a schematic diagram illustrating features of a method of manufacturing an energy storage device according to an example. Figures 3a to 3f The method can be used to manufacture an energy storage device including a stack 200 and a substrate 202, wherein the stack 200 and the substrate 202 are similar to Figure 1 The stack 100 and the substrate 102. Figure 1 Corresponding features of the stack 200 of FIG. 3 are similarly labeled with the same reference numerals increased by 100. A corresponding description shall apply.

[0079] exist Figure 3a , a stack 200 is provided on a substrate 202. The stack 200 includes a first electrode layer 204, an electrolyte layer 206, and a second electrode layer 208. The electrolyte layer 206 is between the first electrode layer 204 and the second electrode layer 208. The stack 200 of FIG. 3 also includes a current collector layer 203. In this example, the current collector layer 203 is a positive current collector layer because it is located between the first electrode layer 204 (in this example, the positive electrode layer) and the substrate 202. In other examples, the current collector layer 203 can be omitted. Alternatively, in addition to or instead of the positive current collector layer, the stack 200 can include a negative current collector layer on the second electrode layer 208. It should be understood that the width of the elements of the stack are schematically shown, and other widths are possible in other examples.

[0080] The current collector layer 203 may be provided by sputtering. The first electrode layer 204, the electrolyte layer 206, and the second electrode layer 208 may be provided, for example, by a vapor deposition process such as physical vapor deposition (PVD) or chemical vapor deposition (CVD), or by a coating process used with a roll-to-roll system, such as slot die coating (sometimes referred to as slot coating). Each of these layers may be provided sequentially. However, in other examples, a partially assembled substrate 202 may be provided. For example, a stack including a current collector layer 203, a first electrode layer 204, an electrolyte layer 206, and a second electrode layer 208 (or a subset of these layers) may have been arranged on the substrate 202 before providing the substrate 202. In other words, the substrate 202 may be provided with a stack 200 (or a portion of a stack 200) already arranged thereon.

[0081] exist Figure 3b In the embodiment, a groove 126 is formed at least through the second electrode layer 208 and the electrolyte layer 206, so that the groove 126 is wider in the second electrode layer 208 than in the electrolyte layer 206. The groove is, for example, a continuous or discontinuous channel, groove or trench. In some examples, the groove can be elongated. For example, Figure 3b The groove 126 may be elongated in the direction of entering or leaving the page (e.g. Figure 3b 200). The groove may extend partially through the layers of stack 200, or extend through all layers of stack 200 to expose an exposed portion of substrate 202. The groove may be considered a microfluidic channel because it may provide a channel within which a fluid, such as a liquid, may be contained or may flow. For example, the groove may be used as a guide to direct or otherwise guide a material (e.g., an electrically insulating or conductive material as discussed herein) to a desired location. The desired location may, for example, be a location within the groove itself. In this way, the groove may be used to contain a fluid or to constrain or prevent the fluid from flowing elsewhere (e.g., an area outside the groove).

[0082] The groove 126 may have any shape that is wider in the second electrode layer 208 than in the electrolyte layer 206. Figure 3bIn the embodiment of the present invention, the groove 126 has a substantially T-shaped cross section. The cross-sectional shape of the groove refers to, for example, the two-dimensional shape of the groove in a plane perpendicular to the plane of the surface of the substrate 202. In other words, the cross section of the groove may correspond to the intersection between the groove (e.g., three-dimensional) and a two-dimensional plane perpendicular to the plane of the surface of the substrate 202. The substantially T-shaped cross section is, for example, a cross section having a shape substantially similar to or recognizable as corresponding to the shape of the capital letter T. For example, such a cross section may include a stem extending along an axis in a substantially vertical direction, (e.g., within 5 degrees, 10 degrees, or 15 degrees of the vertical line). The top may meet the stem and extend along an axis substantially perpendicular to the axis of the stem. For example, the axis of the top may be substantially horizontal (e.g., within 5 degrees, 10 degrees, or 15 degrees of the horizontal line). Typically, the upper end of the stem meets the center portion of the top. However, this is not always the case, and in some cases, the stem may extend beyond the top (e.g., less than 10% or less than 5% of the length of the stem) and extend beyond the top. Likewise, the stem may not meet the top in the exact center or middle of the top. Instead, the stem may meet the middle third or middle 20% of the top.

[0083] In other examples, the cross-section of the groove 126 may have different shapes. For example, the groove 126 may have a substantially V-shaped cross-section, wherein the width of the groove 126 gradually decreases as the depth of the groove 126 increases (away from the mouth or other entrance of the groove 126). In another example, the groove 126 may be wider in the other layers of the stack 200 than in the electrolyte layer 206. For example, the groove 126 may also be wider in the first electrode layer 204 than in the electrolyte layer 206. In such an example, the width of the groove 126 in the first electrode layer 204 may be the same as or different from the width of the groove 126 in the second electrode layer 208. For example, the groove 126 may have a dumbbell-shaped cross-section (which may correspond to the shape of a capital letter H rotated 90 degrees). In other examples, the groove 126 may have an asymmetric shape, such as an inverted L-shaped cross-section. The inverted L-shaped cross-section may be similar to a T-shaped cross-section, but one of the sides of the top is absent, so that one side of the groove corresponds to a straight line of the cross-section.

[0084] The groove 126 may be formed using laser ablation. "Laser ablation" may refer to the removal of material from the stack 200 using a laser-based process. The removal of material may include any of a number of physical processes. For example, the removal of material may include (but is not limited to) melting, melt expulsion, vaporization (or sublimation), photon decomposition (single photon), photon decomposition (multi-photon), mechanical shock, thermomechanical shock, other shock-based treatments, surface plasma processing, and removal by evaporation (ablation). Laser ablation, for example, involves irradiating the surface of one or more layers to be removed with a laser beam. For example, this results in a portion of one or more layers being removed. The amount of layer removed by laser ablation can be controlled by controlling the properties of the laser beam, such as the wavelength of the laser beam or the pulse length of a pulsed laser beam. Laser ablation generally allows the formation of grooves to be controlled in a direct and rapid manner. However, in other examples, alternative methods may be used to form the grooves, such as photolithography.

[0085] The formation of the groove 126 through at least the second electrode layer 208 and the electrolyte layer 206 forms an exposed surface 128 of the electrolyte layer 206. The exposed surface is, for example, a surface that is not covered or otherwise in contact with another layer after the groove 126 is formed. In this manner, for example, after the groove 126 is formed, the exposed surface is, for example, not covered, exposed or otherwise displayed. The exposed surface may correspond to a wall, side, sidewall or face of the groove 126, for example. Thus, the exposed surface may be or may include any surface within the groove 126 that is not covered by another material. For example, the exposed surface may be or include a vertical wall of the groove 126 or a generally upwardly extending inner surface of the groove 126 that extends in an upward direction relative to the substrate 202. Alternatively, the exposed surface may be or include a horizontal wall of the groove 126 or a wall or other surface of the groove 126 that extends in a plane generally parallel to the plane of the substrate 202 or in a horizontal plane. For example, the exposed surface may be or include a horizontal bottom surface of the groove 126, which may be, for example, the deepest surface of the groove 126, which may be closest to the substrate 202. In other examples, the recess 126 may include one or more shelf or ledge portions that may extend in a plane that is generally parallel to the plane of the base 202 or in a horizontal plane. Figure 3b An example is shown: Figure 3b , the exposed surface 128 of the electrolyte layer 208 corresponds to the shelf in the groove 126. It should be understood that in other examples, the exposed surface can be or include a surface outside the groove 126. For example, the exposed surface can be or include an outer surface, face or side of the stack 200 or the substrate 202.

[0086] exist Figure 3b middle, Figure 3bThe second electrode layer 208 in the embodiment has an exposed surface 130. In this example, the exposed surface 130 of the second electrode layer 208 includes a first portion 130a outside the groove 126. For example, the mouth of the groove 126 corresponding to the opening or entrance of the groove 126 is in the same plane as the plane of the first portion 130a of the exposed surface of the second electrode layer 208. However, the first portion 130a of the exposed surface of the second electrode layer 208 itself is located outside the groove because it is located outside the channel corresponding to the groove 126. However, in this example, the exposed surface 130 of the second electrode layer 208 does include a second portion 130b inside the groove 126. In this example, the first portion 130a of the exposed surface 130 of the second electrode layer 208 corresponds to the upper surface of the stack 200 and is parallel to the plane of the substrate 202. The second portion 130b of the exposed surface 130 of the second electrode layer 208 is perpendicular to the plane of the substrate 202. However, in other examples, the first portion and the second portion of the exposed surface of the second electrode layer may be arranged differently.

[0087] exist Figure 3b In the embodiment, a groove 126 is formed through the second electrode layer 208, the electrolyte layer 206 and the first electrode layer 204. Figure 3b In the example of , there is an exposed surface 132 of the substrate 202. In this case, the groove 126 extends to the exposed surface 132 of the substrate 202, and the exposed surface 134 within the groove includes the exposed surface 132 of the substrate 202 (i.e., in this example, the exposed surface 132 of the substrate 202 forms the lower surface or bottom surface of the T-shaped groove 126). Figure 3b In the example of FIG. 1 , the exposed surface 134 in the groove also includes a second portion 130b of the exposed surface of the second electrode layer 208, an exposed surface 128 of the electrolyte layer 206, and another exposed surface of the electrolyte layer 206 (at Figure 3b 128) and the exposed portion of each of the first electrode layer 204 and the current collector layer 203. However, Figure 3b This is merely an example, and in other examples, groove 126 may not extend into first electrode layer 204 and / or current collector layer 203. Alternatively, groove 126 may extend through a portion of substrate 202 in addition to extending through first electrode layer 204 and current collector layer 203.

[0088] exist Figure 3bIn the embodiment of the present invention, each layer of the stack 200 is a substantially flat layer (although other layer types are possible). For example, each layer can have two flat surfaces opposite to each other (such as an upper surface and a lower surface, or a surface closest to the substrate 202 and a surface farthest from the substrate 202). Each of the two surfaces can be parallel to each other or parallel to each other within manufacturing tolerances. A layer can be considered to be substantially planar, where the layer is planar within manufacturing tolerances, or the deviation from a precise plane is relatively small, such as a deviation from a precise plane of less than 20%, 15%, 10%, or 5%.

[0089] By forming a groove 126 through the stack 200, for example using laser ablation, to expose an exposed surface 128 of the electrolyte layer 206, the exposed surface 128 of the electrolyte layer 206 is substantially parallel to a surface of the substrate 202, such as the exposed surface 132 of the substrate 202. Two planes can be considered to be substantially parallel to each other when the two surfaces are completely parallel to each other or within a manufacturing tolerance range, or are parallel to each other within a range of less than 20 degrees, 15 degrees, 10 degrees, or 5 degrees. Providing a substantially flat surface such as this is more straightforward than a surface of a different configuration that may be non-flat. For example, where the stack 200 includes a series of substantially flat layers, when a portion of the second electrode layer 208 is removed, the exposed surface 128 of the electrolyte layer 206 can be substantially parallel to the surface of the substrate 202 without further processing of the electrolyte layer 206.

[0090] In accordance with Figures 3a to 3f In some methods, groove 126 is formed through at least a portion of stack 200. However, in other methods, stack 200 may already include grooves such as groove 126. In other words, stack 200 may include pre-fabricated grooves.

[0091] Use Figure 3b In the recess 126 shown, the electrolyte layer 206 includes a first portion 136a overlapping the second electrode layer 208 and a second portion 136b that does not overlap the second electrode layer 208. It can be considered that the first layer is overlapped by the second layer, wherein the second layer covers the first layer, or the projection of the second layer in the vertical direction (e.g., downward direction) coincides with the first layer itself. For example, the second layer can generally be above and above the first layer. The first layer can overlap with the second layer, wherein the first layer and the second layer are in contact with each other, or there are one or more layers between the first layer and the second layer. However, the first layer and the second layer do not have to have the same size or shape as each other. For example, a portion of the first layer can overlap with a portion of the second layer, wherein a portion of the first layer is covered by a portion of the second layer or is below a portion of the second layer.

[0092] exist Figure 3cIn the embodiment of the present invention, an electrically insulating material 138 is provided in the groove 126. The electrically insulating material 138 can be provided as a first liquid, for example, using an inkjet material deposition process (such as an inkjet printing process). This, for example, involves, for example, ejecting or otherwise advancing droplets of the electrically insulating material 138 from a nozzle onto the stack 200. Droplets of the electrically insulating material 138 can be accurately deposited within the groove 126, or at a suitable location to subsequently flow or travel into the groove 126. The electrically insulating material 138 can be an ink, such as a dielectric ink. A suitable dielectric ink is DM-INI-7003, available from Dycotec Materials Ltd., Unit 12 Star West, Westmead Industrial Estate, Westlea, Swindon, SN5 7SW, UK. A dielectric material that can be used as the electrically insulating material 138 is, for example, an electrical insulator that can be polarized when an electric field is applied. Such dielectric materials also typically have low electrical conductivity, such that electrically insulating material 138 may insulate first electrode layer 204 and second electrode layer 208 from each other. Electrically insulating material 138 may have hydrophilic properties and, therefore, may have an affinity for water.

[0093] The electrically insulating material 138 may be deposited on the exposed surface 128 of the electrolyte layer 206, whereby the electrically insulating material 138 flows into contact with the exposed surface 134 within the groove 126. For example, the electrically insulating material 138 may flow to contact a portion of the exposed surface 134 within the groove 126 that is more wettable by the electrically insulating material 138 than the exposed surface 128 of the electrolyte layer 206 (e.g., the exposed surface 128 of the second portion 136b of the electrolyte layer 206). In other words, the portion of the exposed surface 134 within the groove 126 may have a higher wettability than the exposed surface 128 of the electrolyte layer 206 relative to the electrically insulating material 138.

[0094] Wettability relates to the relative affinity of a liquid or other fluid to a solid surface. Relative affinity, for example, controls the ability of a liquid to remain in contact with a solid surface, which depends on the interaction between the liquid and the surface when the liquid and the surface are in contact with each other. The contact angle at which a liquid-gas interface meets a solid-liquid interface can be measured to determine the wettability of a liquid to a solid (in an example in which a liquid is arranged on a solid in a vapor, such as in air). The contact angle generally depends on the difference in surface tension between the liquid and the solid at the interface between the liquid and the solid. A relatively low contact angle (such as a contact angle between 0 and 90 degrees) indicates that a solid surface is relatively wettable for a liquid. This can be referred to as a surface with high wettability to a liquid. On the contrary, a relatively high contact angle (such as a contact angle greater than 90 degrees but less than 180 degrees) indicates that a solid surface is not wettable for a liquid. This can be referred to as a surface with low wettability to a liquid. For water, a wettable surface can be referred to as hydrophilic, and a non-wettable surface can be referred to as hydrophobic.

[0095] exist Figure 3c In the example of , the exposed surface 132 of the substrate 202 is more wettable to the electrically insulating material 138 than the exposed surface 128 of the electrolyte layer 206. For example, the exposed surface 128 of the electrolyte layer 206 can be more hydrophilic than the exposed surface 132 of the substrate 202. In this case, when the electrically insulating material 138 is deposited on the exposed surface 128 of the electrolyte layer 206, the electrically insulating material 138 can flow into contact with the exposed surface 132 of the substrate 202. Figure 3d Flow of electrically insulating material 138 into groove 126 is schematically illustrated in FIG. Such flow may occur due to the affinity of exposed surface 132 of substrate 202 to electrically insulating material 138. Thus, electrically insulating material 138 may move into groove 126 without external influence, thereby simplifying the placement of electrically insulating material 138 within groove 126.

[0096] After providing the electrically insulating material 138 in the groove 126, the exposed surface 128 of the electrolyte layer 206 may be substantially free of the electrically insulating material 138. In addition, the electrically insulating material 138 may be substantially free of contact with the second electrode layer 208. When none of the material contacts the surface or none of the material contacts the surface within a manufacturing tolerance range, the material can be considered to be substantially absent from the surface or not contacting the surface. However, in some cases, it can be considered that the material is substantially absent from the surface where the proportion of the surface in contact with the material is minimal or relatively small (e.g., less than 20%, 15%, 10% or 5% of the surface). In this way, after depositing the electrically insulating material 138, a larger proportion of the exposed surface 128 of the electrolyte layer 206 can remain exposed. Therefore, this provides a larger surface area for contact by the conductive material 140 (see Figure 3e and 3fIn addition, a larger proportion of the second portion 130b of the exposed surface 130 of the second electrode layer 208 may remain exposed for subsequent contact with the conductive material 140.

[0097] exist Figure 3e In the embodiment of the present invention, a conductive material 140 is provided in the groove 126 on the insulating material 138. The conductive material 140 can be provided as a second liquid. For example, similar to the electrically insulating material 138, an inkjet material deposition process such as inkjet printing can be used to provide the conductive material 140. Similar to the electrically insulating material 138, the conductive material 140 can have hydrophilic properties. The conductive material 140 can therefore have an affinity for water. Suitable conductive materials are available from DuPont (UK) Ltd., 4th Floor, Kings Court, London Road, Stevenage, Hertfordshire, SG1 2NG, UK.

[0098] The conductive material 140 may be deposited on the first portion 130a of the exposed surface 130 of the second electrode layer 208 so that the conductive material 140 flows into the groove 126. For example, the exposed surface 128 of the electrolyte layer 206 may be more wettable to the conductive material 140 than the exposed surface of the second electrode layer 208 (such as the second portion 130b of the exposed surface 130 of the second electrode layer 208). For example, the exposed surface 128 of the electrolyte layer 206 may be more hydrophilic than the exposed surface of the second electrode layer 208, such as the second portion 130b of the exposed surface 130 of the second electrode layer 208. Therefore, due to the affinity of the conductive material 140 to the second portion 130b of the exposed surface 130 of the second electrode layer 208, this may cause the conductive material 140 to move into the groove 126 without applying an external stimulus. In other examples, the conductive material 140 may be deposited at a different location than the first portion 130a of the exposed surface 130 of the second electrode layer 208. Due to the presence of the conductive material 140 , the conductive material 140 can still flow into the groove 126 to wet the exposed surface within the groove 126 .

[0099] After depositing the conductive material 140 within the recess 126, the conductive material 140 may flow into contact with the second portion 130b of the exposed surface 130 of the second electrode layer 208. Figure 3fSchematically shown in . In this example, the exposed surface 128 of the electrolyte layer 206 is more wettable to the conductive material 140 than the electrically insulating material 138. For example, the electrically insulating material 138 may be more hydrophilic than the exposed surface 128 of the electrolyte layer 206. Therefore, the conductive material 140 preferably wets the exposed surface 128 of the electrolyte layer 206 compared to the electrically insulating material 138. Therefore, the conductive material 140 retreats away from the electrically insulating material 138 and in this case toward the second portion 130b of the second electrode layer 208. The second portion 130b of the exposed surface 130 of the second electrode layer 208 may be more wettable to the conductive material 140 than to the electrically insulating material 138. This may further cause the conductive material 140 to flow to and contact the second portion 130b of the exposed surface 130 of the second electrode layer 208.

[0100] After providing the conductive material 140 in the groove 126, the conductive material 140 may be substantially absent from the first portion 130a of the exposed surface of the second electrode layer 208. This may be due to the wettability of the respective surfaces. For example, the first portion 130a of the exposed surface of the second electrode layer 208 is less wettable to the conductive material 140 than the second portion 130b of the exposed surface of the second electrode layer 208 and the exposed surface 128 of the electrolyte layer 206, and the conductive material 140 may spontaneously flow into the groove 126 without contacting the first portion 130a of the exposed surface of the second electrode layer 208.

[0101] In an example such as FIG3 , the exposed surface 128 of the electrolyte layer 206 has a width greater than or equal to about 5 microns in a plane parallel to the plane of the surface of the substrate 202 (e.g., the plane of the exposed surface 132 of the substrate 202). In this context, a width of about 5 microns is, for example, a width of 5 microns within a measurement or manufacturing tolerance range, which can be a width of 5 microns within plus or minus 20%, 15%, 10%, or 5% of 5 microns. The exposed surface 128 is, for example, a surface of the second portion 136b of the electrolyte layer 206 that does not overlap with the second electrode layer 208.

[0102] In a plane parallel to the plane of the surface of substrate 202, the width of exposed surface 128 of electrolyte layer 206 is, for example, taken from the interface between second portion 130 b of exposed surface 130 and exposed surface 128 to one end of exposed surface 128. With a width greater than or equal to about 5 microns, exposed surface 128 can contain conductive material 140 within recess 126 more effectively than otherwise.

[0103] use Figures 3a to 3fThe recesses 126 may allow the electrically insulating material 138 and the electrically conductive material 140 to be easily accommodated in predetermined locations relative to other elements of the stack 200. The accommodation of these materials may be controlled by using the wettability of the various surfaces of the stack 200 and the recesses 126 to control where these materials wet (or do not wet) and thus where the materials flow and remain without external stimulation. The accommodation of these materials within the recesses 126 may be more direct than other methods aimed at improving the accommodation of electrically insulating or conductive materials within the channel.

[0104] It can be considered Figure 3f The structure shown corresponds to an intermediate structure for manufacturing an energy storage device. For example, each layer of the stack 200 may have a first portion (in the example of FIG. 1 ) for forming a first battery after separating the stack 200 into batteries. Figure 3f The letter "a" is added to the second cell (in Figure 3f 142 through the electrically insulating material 138, which can be, for example, a vertical axis through the center of the electrically insulating material 138 (although other axes are possible in other examples). The process can be used to make a first cell having a second electrode 208a, an electrolyte 206a, a first electrode 204a, and a current collector layer 203a, and a second cell having a second electrode 208b, an electrolyte 206b, a first electrode 204b, and a current collector layer 203b.

[0105] Thus, the method of FIG3 can be used to manufacture an energy storage device including a substrate 202 and a stack 202 on the substrate 202, wherein the stack includes a first electrode 204a, 204b, a second electrode 208a, 208b, and an electrolyte 206a, 206b between the first electrode 204a, 204b and the second electrode 208a, 208b. In the example of FIG3, the first electrode 204a, 204b is closer to the substrate 202 than the second electrode 208a, 208b, although this need not be the case. The electrolyte 206a, 206b in such an energy storage device includes a first portion that overlaps with the second electrode 208a, 208b and a second portion that does not overlap with the second electrode 208a, 208b. The energy storage device also includes an electrically insulating material 138 in contact with the first electrode 204a, 204b and the electrolyte 206a, 206b and an electrically conductive material 140 in contact with a second portion of the electrolyte 206a, 206b and the second electrode 208a, 208b.

[0106] The method of FIG. 3 is merely illustrative, and other methods may be used to fabricate energy storage devices using the principles described herein. Figure 4Another schematic diagram of an intermediate structure for making an energy storage device is shown. Figure 3f The corresponding characteristics are similar Figure 4 Features are marked with the same reference numerals increased by 100. The description shall apply accordingly. Figure 4 Some reference numerals are omitted.

[0107] Figure 4 The intermediate structure and Figure 3f The intermediate structure is the same as Figure 4 In the embodiment, the electrically insulating material 238 in the groove has a curved surface instead of a flat surface. The curved surface of the electrically insulating material 238 is, for example, the surface of the electrically insulating material 238 closest to the mouth or other entrance to the groove. For example, the curved surface of the electrically insulating material 238 can be the upper surface of the electrically insulating material 238, or can be the surface of the electrically insulating material 238 farthest from the substrate 302.

[0108] The curved surface is, for example, a rounded surface. In this example, the electrically insulating material 238 has a convex surface that curves or extends outward in a direction away from the plane of the surface of the substrate 302. The convex surface of the electrically insulating material 238, for example, promotes the conductive material 240 to contact the second electrode layer 308, thereby improving the contact between the conductive material 240 and the second electrode layer 308.

[0109] In this example, conductive material 240 is in contact with an exposed surface of electrolyte layer 306 and a surface of electrically insulating material 238 (and this may be the case in other examples where the surface of electrically insulating material 238 has a different shape).

[0110] Figure 5 Another example is shown. Figure 4 The corresponding characteristics are similar Figure 5 Features are marked with the same reference numerals increased by 100. A corresponding description shall apply.

[0111] Figure 5 and Figure 4 The same, except that the electrically insulating material 338 in the groove has a concave surface. The concave surface is, for example, curved inwardly toward the plane of the surface of the substrate 402 or hollowed out in an inward direction. With this arrangement of the electrically insulating material 338, the conductive material 340 has a larger surface area for contacting other electrical components than otherwise.

[0112] The curvature of the electrically insulating material can be controlled, for example, by controlling the properties of the electrically insulating material and the stacked layers. For example, the amount of electrically insulating material disposed in the groove can be varied to change the curvature of the surface of the electrically insulating material. For example, overfilling of the groove (or providing a greater curvature than the curvature of the surface of the electrically insulating material) can be controlled. Figure 3fMore electrically insulating material in the can provide an electrically insulating material 238 having a convex surface, such as Figure 4 Conversely, insufficient filling of the grooves may provide a concave surface for the electrically insulating material 238. In addition, the wettability of the exposed surface of the electrolyte layer 306, 406 within the grooves (e.g., the surface of the electrolyte layer 306, 406 perpendicular to the exposed surface 128 of FIG. 3) may be controlled to control the curvature of the surface of the electrically insulating material 306, 406.

[0113] The above examples should be understood as illustrative examples. Further examples are contemplated. In the above examples, the first electrode layer is closer to the substrate than the second electrode layer. However, in other examples, the second electrode layer may be closer to the substrate than the first electrode layer. In this case, the cross-section of the groove may be approximately inverted T-shaped or approximately inverted V-shaped. Therefore, in examples such as these, the shape of the groove may narrow toward the mouth of the groove, rather than away from the mouth of the groove.

[0114] In order to make such a groove, the stack can be arranged on a first side of the substrate, and the laser ablation system can be arranged on a second side of the substrate opposite to the first side. The laser beam generated by the laser ablation system can be transmitted through the substrate, for example, if the substrate is transparent. Then, the laser beam can be incident on the bottom side of the stack (for example, it contacts the first side of the substrate). The laser beam can be used to ablate the material of the stack to form a groove passing through the stack without cutting the substrate or removing all substrates in the area of ​​the substrate corresponding to the groove. However, it should be understood that other methods can be used to form a groove with such an inverted shape. For example, an angled laser beam can be provided, wherein the laser beam is angled relative to the surface of the substrate on which the stack is provided. The angle of the laser beam can be controlled to selectively remove portions of the stack to provide a groove with a cross-section of a desired or other predetermined shape.

[0115] In the examples herein, the wettability of various surfaces may be an intrinsic property of the materials used. However, in some cases, the wettability of some or all surfaces may be changed or otherwise affected by the treatment applied to the surface. For example, in the case where an exposed surface is formed by forming a groove through a layer, the wettability of the exposed surface may be different from the intrinsic wettability of the material of the layer. For example, exposing the exposed surface by laser ablation may change the wettability of the exposed surface compared to other surfaces of the same material not formed by laser ablation. The degree of change in the wettability of the exposed surface can be controlled or changed by changing the processing conditions. For example, the wettability can be increased or decreased by changing the environment in which the laser ablation occurs. In one example, laser ablation in the presence of a gas (e.g., an inert gas) may result in different wettability compared to laser ablation in the presence of air. Based on the above, systematic testing can be performed to determine the relationship between wettability and differences in processing conditions.

[0116] In examples such as these, the formation of recesses can provide areas in which electrically insulating materials and conductive materials can be deposited while also creating exposed surfaces within the recesses with appropriate wettability to help confine the electrically insulating materials and conductive materials within the recesses. This can simplify the fabrication of energy storage devices having such recesses compared to other methods in which subsequent treatments are applied to the exposed surfaces to change the wettability of the exposed surfaces.

[0117] However, in other examples, the wettability of the exposed surface can be changed after the exposed surface is created. For example, the exposed surface can be subjected to electromagnetic radiation to change the wettability of the exposed surface. Irradiating the exposed surface with ultraviolet (UV) light can, for example, increase the hydrophilicity of the exposed surface. The environment in which the irradiation of the exposed surface occurs can be changed to control the degree of change in the wettability of the exposed surface.

[0118] It should be understood that any feature described with respect to any one example can be used alone or in combination with other features described, and can also be used in combination with one or more features of any combination of any other examples or other examples. In addition, equivalents and modifications not described above may also be adopted without departing from the scope of the appended claims.

Claims

1. A method for manufacturing an energy storage device, comprising: providing a stack for an energy storage device on a substrate, the stack comprising a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer; forming a groove through at least the second electrode layer and the electrolyte layer such that the groove is wider in the second electrode layer than in the electrolyte layer; providing an electrically insulating material in the recess; as well as providing an electrically conductive material on the electrically insulating material in the recess; The groove formed at least through the second electrode layer and the electrolyte layer forms an exposed surface of the electrolyte layer, and the exposed surface of the electrolyte layer is more wettable to a conductive material than the exposed surface of the second electrode layer.

2. The method according to claim 1, wherein: The second electrode layer is further away from the substrate than the first electrode layer, The first portion of the exposed surface of the second electrode layer is outside the groove.

3. The method according to claim 2, wherein: Providing the conductive material in the groove comprises: A conductive material is deposited on a first portion of the exposed surface of the second electrode layer such that the conductive material flows into the recess.

4. The method according to claim 2 or 3, wherein: The exposed surface of the electrolyte layer is more hydrophilic than a first portion of the exposed surface of the second electrode layer.

5. The method according to any one of claims 1 to 3, wherein: The groove is formed through the second electrode layer, the electrolyte layer, and the first electrode layer to form an exposed surface of the substrate, wherein the exposed surface of the substrate is more wettable by an electrically insulating material than an exposed surface of the electrolyte layer.

6. The method according to claim 5, wherein: Providing the electrically insulating material in the groove comprises: An electrically insulating material is deposited on the exposed surface of the electrolyte layer, whereby the electrically insulating material flows into contact with the exposed surface of the substrate.

7. The method according to claim 5, wherein: The exposed surface of the electrolyte layer is more hydrophilic than the exposed surface of the substrate.

8. The method according to any one of claims 1 to 3, wherein: The exposed surface of the electrolyte layer is more wettable to the electrically conductive material than to the electrically insulating material.

9. The method according to claim 8, wherein: The exposed surface of the electrolyte layer is more hydrophilic than the electrically insulating material.

10. The method according to any one of claims 1 to 3, wherein: After providing the conductive material in the recess, the exposed surface of the second electrode layer is substantially free of the conductive material.

11. The method according to any one of claims 1 to 3, wherein: An electrically conductive material is provided in the recess such that the electrically conductive material is in contact with an exposed surface of the electrolyte layer and a surface of the electrically insulating material.

12. The method according to any one of claims 1 to 3, wherein: The exposed surface of the electrolyte layer has a width greater than or equal to 5 micrometers in a plane parallel to the plane of the surface of the substrate.

13. The method according to claim 12, wherein: A conductive material is provided in the recess such that the conductive material contacts a second portion of the exposed surface of the second electrode layer within the recess.

14. The method according to claim 13, wherein: The second portion of the exposed surface of the second electrode layer is more wettable to the electrically conductive material than to the electrically insulating material.

15. The method according to any one of claims 1 to 3, wherein: The electrically insulating material in the groove has a curved surface.

16. The method according to any one of claims 1 to 3, wherein: The groove has a substantially T-shaped cross section.

17. The method according to any one of claims 1 to 3, wherein: At least one of the following: providing an electrically insulating material as the first liquid; or A conductive material is provided as the second liquid.

18. An energy storage device formed by the method of any one of claims 1 to 17.

19. A method of manufacturing an energy storage device, comprising: providing a stack for an energy storage device on a substrate, the stack comprising a first electrode layer, a second electrode layer, and an electrolyte layer between the first electrode layer and the second electrode layer, the stack comprising a groove passing through at least the second electrode layer and the electrolyte layer, wherein the groove is wider in the second electrode layer than in the electrolyte layer, such that the electrolyte layer comprises a first portion overlapping the second electrode layer and a second portion not overlapping the second electrode layer; and An electrically insulating material is deposited on the exposed surface of the second portion of the electrolyte layer so that the electrically insulating material flows into the groove to contact the exposed surface within the groove, which is more wettable by the electrically insulating material than the exposed surface of the second portion of the electrolyte layer.

20. The method according to claim 19, wherein: The groove extends to the exposed surface of the substrate, and the exposed surface within the groove includes the exposed surface of the substrate.

21. The method according to claim 19 or 20, wherein: An exposed surface of the second portion of the electrolyte layer is substantially parallel to a surface of the substrate.

22. An energy storage device formed by the method of any one of claims 19 to 21.

23. An intermediate structure for an energy storage device, the intermediate structure comprising: substrate; A stack on a substrate, the stack comprising: a first electrode layer; a second electrode layer; and an electrolyte layer between the first electrode layer and the second electrode layer, The stack includes a groove passing through at least the second electrode layer and the electrolyte layer, wherein the groove is wider in the second electrode layer than in the electrolyte layer, such that the electrolyte layer includes a first portion overlapping the second electrode layer and a second portion not overlapping the second electrode layer; and An electrically insulating material is in contact with the exposed surface in the recess, the exposed surface in the recess being more wettable by the electrically insulating material than the exposed surface of the second portion of the electrolyte layer.

24. The intermediate structure according to claim 23, wherein: The first electrode layer is closer to the substrate than the second electrode layer, and the groove extends through the first electrode layer to the exposed surface of the substrate such that the exposed surface within the groove includes the exposed surface of the substrate.

25. An intermediate structure according to claim 23 or 24, wherein: The exposed surface of the second portion of the electrolyte layer has a width greater than or equal to 5 micrometers in a plane parallel to the plane of the surface of the substrate.

26. An intermediate structure according to claim 23 or 24, wherein: The groove has a substantially T-shaped cross section.

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