Method for calibrating workstation position in process chamber, semiconductor process equipment

Abstract

An embodiment of the present application provides a method for calibrating a workstation position in a process chamber and semiconductor process equipment, the method comprising: placing a calibration piece at a preset position using a transmission device, and rotating the calibration piece to a preset orientation using a calibration device, wherein the calibration piece comprises a plurality of openings, and the plurality of openings are arranged in a one-to-one correspondence with a plurality of ejector pins on a chuck in the process chamber, and the sidewalls of the openings are tapered for accommodating the ejector pins; transferring the calibration piece rotated to a preset orientation into the process chamber using a transmission device so that the calibration piece is located above the chuck, raising the plurality of ejector pins, controlling the transmission device to descend, and respectively introducing the plurality of ejector pins into the plurality of openings, and supporting the calibration piece by the plurality of ejector pins; transferring the calibration piece out of the process chamber using a transmission device, and detecting an offset of the calibration piece in a preset direction relative to the preset position using the calibration device; calibrating the current workstation position based on the offset to obtain a calibrated workstation position.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a method for calibrating workstation positions in a process chamber and semiconductor process equipment. Background Art

[0002] Semiconductor processing equipment such as ion etchers use transfer devices such as vacuum robots to transfer wafers during operation. Over time, slight displacement deviations occur between machine components, causing slight displacements of workstations in the process chamber. After a slight displacement of a workstation in the process chamber, the current position of the workstation in the process chamber, i.e., the workstation position currently provided to relevant devices such as the robot, is determined before the displacement of the workstation in the process chamber. Therefore, it is necessary to calibrate the workstation position in the process chamber in a timely manner to obtain the calibrated workstation position, and provide the calibrated workstation position to relevant devices such as the robot.

[0003] Currently, the commonly used calibration method requires manual calibration of the workstation positions within the process chamber under atmospheric conditions. The atmospheric environment disrupts the chamber's vacuum state, causing the process chamber to remain idle for extended periods, such as 8 to 24 hours. This results in reduced production efficiency. Furthermore, manual calibration of the workstation positions within the process chamber has a low accuracy rate. Summary of the Invention

[0004] In order to overcome the problems existing in the related art, the present application provides a method for calibrating the position of a workstation in a process chamber and a semiconductor process equipment.

[0005] According to a first aspect of an embodiment of the present application, a method for calibrating a workstation position in a process chamber is provided, which is applied to semiconductor process equipment, comprising:

[0006] The calibration piece is placed at a preset position using a transfer device, and the calibration piece is rotated to a preset orientation using a calibration device, wherein the calibration piece includes a plurality of openings, the plurality of openings are arranged in a one-to-one correspondence with a plurality of ejector pins on a chuck in the process chamber, and the sidewalls of the openings are tapered for accommodating the ejector pins;

[0007] Using a transfer device to transfer the calibration piece rotated to the preset orientation into the process chamber, so that the calibration piece is located above the chuck, raising a plurality of ejectors, controlling the transfer device to descend, and respectively introducing the plurality of ejectors into the plurality of openings, so that the calibration piece is supported by the plurality of ejectors;

[0008] The calibration piece is transferred out of the process chamber by using a transfer device, and an offset of the calibration piece in a preset direction relative to a preset position is detected by using a calibration device;

[0009] The current workstation position is calibrated based on the offset to obtain a calibrated workstation position.

[0010] According to a second aspect of an embodiment of the present application, a semiconductor process equipment is provided, comprising: a controller, a calibration device, a transmission device, and a process chamber, wherein:

[0011] The calibration device is configured to rotate a calibration piece at a preset position to a preset orientation, wherein the calibration piece includes a plurality of openings, the plurality of openings corresponding one-to-one to a plurality of ejector pins on a chuck in a process chamber, and the sidewalls of the openings are tapered to accommodate the ejector pins; after the transfer device transfers the calibration piece out of the process chamber, the transfer device detects an offset of the calibration piece in a preset direction relative to the preset position;

[0012] The transfer device is configured to transfer the calibration piece rotated to a preset orientation into the process chamber so that the calibration piece is located above the chuck. After the plurality of ejector pins are raised, the transfer device is driven to descend, and the plurality of ejector pins are respectively introduced into the plurality of openings, so that the calibration piece is supported by the plurality of ejector pins.

[0013] The controller is configured to calibrate the current workstation position based on the offset to obtain a calibrated workstation position.

[0014] The calibration of the workstation position in the process chamber provided by the embodiment of the present application enables the workstation position in the process chamber to be automatically and accurately calibrated by the calibration component in the event of displacement of the workstation in the process chamber. This eliminates the need for chamber opening, and avoids the problem of the process chamber being in a state of process stoppage for a long time and reduced production efficiency caused by the need for relevant personnel to perform corresponding manual operations to calibrate the position of the process chamber in an atmospheric environment. This also saves labor and time costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0016] Figure 1 A flow chart of a process chamber position calibration method provided by an embodiment of the present application is shown;

[0017] Figure 2 A top view of the calibration piece is shown;

[0018] Figure 3 A side view of the opening is shown;

[0019] Figure 4 A schematic diagram showing the comparison of the radius of the calibration device and the distance between the ejector pin and the center of the chuck is shown;

[0020] Figure 5 A schematic diagram of the process of introducing the ejector pin into the opening is shown;

[0021] Figure 6 A schematic diagram showing the effect of lateral displacement of the opening;

[0022] Figure 7 A structural block diagram of a semiconductor process equipment provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0023] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. It should also be noted that, for ease of description, only portions relevant to the relevant invention are shown in the accompanying drawings.

[0024] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] Figure 1 A flow chart of a process chamber position calibration method provided in an embodiment of the present application is shown, and the method includes:

[0026] Step 101: Place the calibration piece at a preset position using a transmission device, and rotate the calibration piece to a preset orientation using a calibration device.

[0027] In the present application, the calibration piece includes a plurality of openings, which are arranged in one-to-one correspondence with a plurality of ejector pins on a chuck in a process chamber, and the side walls of the openings are tapered, that is, the openings are funnel-shaped openings for accommodating the ejector pins.

[0028] The pins on the chuck of the process chamber can be called pins. The shape of the calibration piece can be the same as that of the wafer or can be a sheet-like body with a shape similar to that of the wafer.

[0029] The total weight of the calibration piece should not be excessively heavy. The overall material of the calibration piece can be a resin material to make the total weight of the calibration piece relatively light. The slope of the opening of the calibration piece can be large, and the sidewalls of the opening of the calibration piece can be smooth. The opening included in the calibration piece can be located on the bottom surface of the calibration piece.

[0030] In the present application, a transfer device, such as a manipulator, can be used to place the calibration piece at a preset position, such as on a calibration device, i.e., an aligner, and the calibration piece can be rotated to a preset orientation by the calibration device. Using the calibration device to rotate the calibration piece to the preset orientation ensures that, when the calibration piece is transferred into the process chamber using the transfer device, each opening of the calibration piece is aligned with the corresponding pin, without displacement of the workstation and ejector pins in the process chamber.

[0031] In some embodiments, the edge of the calibration piece further includes an opening; and using the calibration device to rotate the calibration piece to a preset orientation includes: using the calibration device to rotate the calibration piece so that the opening faces the preset orientation.

[0032] The opening at the edge of the calibration piece can be called the north opening. When the calibration piece is rotated using the calibration device, this opening can be used as a marker to rotate the calibration piece using the calibration device so that the opening faces a predetermined direction, thereby aligning the calibration piece with the predetermined direction.

[0033] Please refer to Figure 2 , which shows a top view of the calibration piece.

[0034] exist Figure 2 , the outline 201 of the calibration piece, the opening 202 of the calibration piece, and the opening 203 at the edge of the calibration piece are shown in a top view. The outline 201 of the calibration piece is circular.

[0035] Please refer to Figure 3 , which shows a side view of the opening.

[0036] The sidewall of the opening is tapered, i.e., the opening is funnel-shaped. The side view of the opening is a side view of the opening projected when the calibration piece is placed vertically and the opening of the calibration piece faces the positive direction of the horizontal coordinate axis.

[0037] In the side view of the opening, a projection shape 301 corresponding to the bottom of the opening and inclined projection line segments 302 and 303 corresponding to the contour of the portion of the opening other than the bottom are shown.

[0038] As an example, H=5 mm, L=4 mm, L1=3 mm, D=5 mm, d=2 mm.

[0039] In some embodiments, the radius of the calibration device is different from the distance of the ejector pin from the center of the chuck.

[0040] Each ejector pin is positioned at the same distance from the center of the process chamber's chuck. When a calibration component is placed on the calibration fixture and rotated, the pins used to support the component also serve to support it. The calibration fixture's radius differs from the distance between the ejector pins and the chuck's center. This ensures that when the transfer mechanism places the component on the calibration fixture, the pins holding the component do not penetrate into the openings in the component.

[0041] Please refer to Figure 4 , which shows a schematic diagram of the comparison effect between the radius of the calibration device and the distance between the ejector pin and the center of the chuck.

[0042] The calibration fixture is a type of tooling. The location of the tooling hole is the location of the ejector pin. The radius of the calibration fixture, or aligner, is r, and the distance between the ejector pin and the center of the chuck is R.

[0043] In step 102, a transfer device is used to transfer the calibration piece rotated to a preset orientation into the process chamber so that the calibration piece is located above the chuck. A plurality of ejectors are raised, and the transfer device is controlled to descend. The plurality of ejectors are respectively introduced into the plurality of openings, and the calibration piece is supported by the plurality of ejectors.

[0044] In the present application, a transmission device such as a manipulator can be controlled to grab the calibration part that is rotated to a preset orientation, and transfer the calibration part that is rotated to the preset orientation into the process chamber so that the calibration part is located above the chuck. After the calibration part that is rotated to the preset orientation is transferred into the process chamber, a plurality of ejectors can be raised and the transmission device can be controlled to descend. The transmission device can carry the calibration part that is rotated to the preset orientation and move vertically downward so that a plurality of ejectors are respectively introduced into a plurality of openings, and the calibration part is supported by the plurality of ejectors. When the calibration part that is rotated to the preset orientation moves to the position of the top of the pin needle as the transmission device descends, the transmission device can be stopped from being controlled to descend, and the transmission device releases the calibration part that is rotated to the preset orientation, so that the calibration part that is rotated to the preset orientation falls under the action of gravity.

[0045] If the workstation in the process chamber does not move, accordingly, for any pin needle, the pin needle does not move. When the pin needle starts to be inserted into the opening corresponding to the pin needle, the pin needle is basically aligned with the center of the bottom of the opening corresponding to the pin needle. The pin needle will not contact the opening corresponding to the pin needle. When it does not contact the opening corresponding to the pin needle, the calibration piece will only move in the vertical direction. After a certain period of time, the pin needle reaches the bottom of the opening corresponding to the pin needle, thereby guiding the ejector pin into the opening.

[0046] If the workstation in the process chamber is displaced, causing any pin needle to be displaced, since the side wall of the opening is tapered, during the falling process of the calibration piece, after the top of the pin needle is inserted into the opening corresponding to the pin needle, the top of the pin needle first contacts a point on the side wall of the opening corresponding to the pin needle, which is not the bottom of the opening, and then causes the opening corresponding to the pin needle to tilt and move, further causing the calibration piece to start to displace in a non-vertical direction until the pin needle reaches the bottom of the opening corresponding to the pin needle, thereby guiding the ejector pin into the opening.

[0047] Please refer to Figure 5 , which shows a schematic diagram of the process of introducing the ejector pin into the opening of the calibration part.

[0048] exist Figure 5 , shows the process of introducing the ejector pin into the calibration piece when the pin pin is displaced due to displacement of the workstation in the process chamber.

[0049] exist Figure 5 In the figure, an opening 501 of the calibration piece and a pin 502 corresponding to the opening 501 are shown as an example.

[0050] Before the calibration piece falls, a transport device, such as a robotic arm, grabs the piece and transfers it into the process chamber. The transport device is then controlled to descend, carrying the piece vertically downward. When the piece reaches the top of pin 502, the transport device is controlled to descend, releasing the piece and allowing it to begin falling under gravity.

[0051] During the falling process of the calibration piece, after the top of the pin needle 502 is inserted into the opening 501, it first contacts a point on the side wall of the opening 501 that is not the bottom of the opening. The side wall of the opening 501 is tapered and smooth, so after contacting this point, the opening 501 is caused to move tilted, which is equivalent to the pin needle 502 sliding into the opening 501 along the inclined surface on the side wall of the opening.

[0052] Please refer to Figure 6 , which shows a schematic diagram of the effect of lateral displacement of the opening.

[0053] exist Figure 6 In FIG, it is shown that when the pin needle is displaced due to displacement of the workstation in the process chamber, the opening is displaced laterally, and accordingly, the calibration piece is displaced laterally relative to the preset position.

[0054] In step 103 , the calibration piece is transferred out of the process chamber by using a transport device, and an offset of the calibration piece in a preset direction relative to a preset position is detected by using a calibration device.

[0055] In the present application, after multiple ejector pins are respectively introduced into multiple openings and the calibration part is supported by the multiple ejector pins, the calibration part can be transferred out of the process chamber using a transmission device, and the calibration device can be used to detect the offset of the calibration part in a preset direction relative to the preset position.

[0056] If a workstation in the process chamber shifts, causing the ejector pin to shift, this in turn causes the calibration piece to shift in a non-vertical direction relative to its preset position. Thus, the calibration device can be used to detect the offset of the calibration piece in a preset direction relative to its preset position. The preset direction is a direction other than the vertical direction.

[0057] In some embodiments, the preset direction includes: the telescopic axis direction and the rotation axis direction of the transmission device.

[0058] In this application, the telescopic axis may refer to the R-axis in the robot's rectangular coordinate system, established based on the position of the transmission device, such as the center point. The rotational axis may refer to the T-axis in the robot's rectangular coordinate system. The direction of the telescopic axis of the transmission device may be referred to as the R-axis direction. The direction of the rotational axis of the transmission device may be referred to as the T-axis direction.

[0059] Step 104 : calibrate the current workstation position based on the offset to obtain a calibrated workstation position.

[0060] In the present application, the current workstation position may refer to the workstation position currently provided to the relevant device in the process chamber. The current workstation position is determined before the workstation is displaced in the process chamber.

[0061] In the present application, a calibrated station position of a station in the process chamber can be determined based on the offset and the current station position of the station in the process chamber. Thus, calibration of the station position of the station in the process chamber is completed, and the calibrated station position of the station in the process chamber can be provided to a related device, for example, the calibrated station position can be provided to a robot, so that the robot can accurately grasp and place wafers based on the calibrated station position.

[0062] The correlation between the offset of the calibration member in a preset direction and the offset of the workstation position of the workstation in the process chamber in the event of displacement of the process chamber can be predetermined. Based on the correlation between the offset of the calibration member in the preset direction relative to the preset position and the offset of the workstation position of the workstation in the process chamber in the preset direction, the offset of the workstation position in the preset direction relative to the offset of the calibration member in the preset direction can be determined. The sum of the component of the current workstation position in the process chamber in the preset direction and the offset of the workstation position in the preset direction is determined as the component of the workstation position in the process chamber after calibration in the preset direction.

[0063] In the calibrated station position of the station in the process chamber, the component in the preset direction is the sum of the component of the current station position of the station in the process chamber in the preset direction and the offset of the station position of the station in the process chamber in the preset direction. For directions other than the preset direction, the components in other directions can be the components of the current station position of the station in the process chamber in other directions.

[0064] For example, the preset directions include the directions of the telescopic axis and the rotational axis of the transmission device. When the workstation position in the process chamber is displaced, a correlation between the offset in the R-axis direction relative to the preset position calibration member and the offset in the R-axis direction of the workstation position in the process chamber, and a correlation between the offset in the T-axis direction relative to the preset position calibration member and the offset in the T-axis direction of the workstation position in the process chamber can be predetermined. Based on the correlation between the offset in the R-axis direction relative to the preset position calibration member and the offset in the R-axis direction of the workstation position in the process chamber, the offset in the R-axis direction of the workstation position in the process chamber relative to the offset in the R-axis direction can be determined. Based on the correlation between the offset in the T-axis direction relative to the preset position calibration member and the offset in the T-axis direction of the workstation position in the process chamber, the offset in the T-axis direction of the workstation position in the process chamber can be determined relative to the offset in the T-axis direction of the preset position calibration member.

[0065] After determining the offset in the R-axis direction and the T-axis direction of the station position of the process chamber, the sum of the R-axis component of the current station position of the process chamber and the offset in the R-axis direction of the station position of the process chamber can be determined as the R-axis component of the calibrated station position of the process chamber. The sum of the T-axis component of the current station position of the process chamber and the offset in the T-axis direction of the station position of the process chamber can be determined as the T-axis component of the calibrated station position of the process chamber. After determining the R-axis component and the T-axis component of the calibrated station position of the process chamber, the calibrated station position of the process chamber can be determined. That is, the calibrated station position of the process chamber can be composed of the R-axis component and the T-axis component of the calibrated station position of the process chamber.

[0066] In some embodiments, the current workstation position is calibrated based on the offset to obtain the calibrated workstation position, including: calculating the sum of the component of the current workstation position in the telescopic axis direction and the offset of the calibration piece in the telescopic axis direction, and determining it as the component of the calibrated workstation position in the telescopic axis direction; calculating the sum of the component of the current workstation position in the rotation axis direction and the offset of the calibration piece in the rotation axis direction, and determining it as the component of the calibrated workstation position in the rotation axis direction.

[0067] The offset in the R-axis direction relative to the preset position calibration part can be directly used as the offset in the R-axis direction of the station position of the station in the process chamber. The offset in the T-axis direction relative to the preset position calibration part can be directly used as the offset in the T-axis direction of the station position of the station in the process chamber. The offset in the R-axis direction relative to the preset position calibration part is represented by ΔR, and the offset in the T-axis direction relative to the preset position calibration part is represented by ΔT. The sum of the component in the R-axis direction of the current station position of the station in the process chamber and ΔR can be determined as the component in the R-axis direction of the station position of the station after calibration in the process chamber. The sum of the component in the T-axis direction of the current station position of the station in the process chamber and ΔT can be determined as the component in the T-axis direction of the station position of the station after calibration in the process chamber.

[0068] Please refer to Figure 7 , which shows a block diagram of the structure of a semiconductor process equipment provided by an embodiment of the present application. The semiconductor process equipment includes: a controller 701, a calibration device 702, a transmission device 703, and a process chamber 704.

[0069] The calibration device 702 is configured to rotate a calibration piece at a preset position to a preset orientation. The calibration piece includes a plurality of openings, each corresponding to a plurality of ejector pins on a chuck in the process chamber 704. The sidewalls of the openings are tapered to accommodate the ejector pins. After the transfer device transfers the calibration piece out of the process chamber 704, the calibration piece is detected to deflect in a preset direction relative to the preset position.

[0070] The transfer device 703 is configured to transfer the calibration piece rotated to a predetermined orientation into the process chamber so that the calibration piece is positioned above the chuck. After the plurality of ejector pins are raised, the transfer device 703 is driven downward to guide the plurality of ejector pins into the plurality of openings, thereby supporting the calibration piece.

[0071] The controller 701 is configured to calibrate the current workstation position based on the offset to obtain a calibrated workstation position.

[0072] In some embodiments, the preset direction includes: the telescopic axis direction and the rotation axis direction of the transmission device 703 .

[0073] In some embodiments, the edge of the calibration piece further includes an opening; the calibration device 702 is further configured to rotate the calibration piece so that the opening faces a preset direction.

[0074] In some embodiments, the controller 701 is further configured to calculate the sum of the component of the current workstation position in the direction of the telescopic axis and the offset of the calibration part in the direction of the telescopic axis, and determine it as the component of the calibrated workstation position in the direction of the telescopic axis; calculate the sum of the component of the current workstation position in the direction of the rotation axis and the offset of the calibration part in the direction of the rotation axis, and determine it as the component of the calibrated workstation position in the direction of the rotation axis.

[0075] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0076] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A method for calibrating a workstation position in a process chamber, characterized in that: The method comprises: The calibration piece is placed at a preset position using a transport device, and the calibration piece is rotated to a preset orientation using a calibration device, wherein the calibration piece includes a plurality of openings, the plurality of openings are arranged in a one-to-one correspondence with a plurality of ejector pins on a chuck in a process chamber, and the sidewalls of the openings are tapered for accommodating the ejector pins; Using a transfer device to transfer the calibration piece rotated to the preset orientation into the process chamber so that the calibration piece is located above the chuck, raising the plurality of ejector pins, controlling the transfer device to descend, and respectively introducing the plurality of ejector pins into the plurality of openings, so that the calibration piece is supported by the plurality of ejector pins; The calibration piece is transferred out of the process chamber by the transfer device, and an offset of the calibration piece in a preset direction relative to the preset position is detected by the calibration device; the offset is formed based on the ejector pin driving the calibration piece under the action of the tapered side wall of the opening; The current workstation position is calibrated based on the offset to obtain a calibrated workstation position.

2. The method according to claim 1, characterized in that The preset directions include: the telescopic axis direction and the rotation axis direction of the transmission device.

3. The method according to claim 1, characterized in that The calibration piece further includes an opening at an edge thereof; The step of rotating the calibration member to a preset orientation using a calibration device includes: The calibration device is used to rotate the calibration piece so that the opening faces the preset direction.

4. The method according to claim 1, wherein The radius of the calibration device is different from the distance between the ejector pin and the center of the chuck.

5. The method according to claim 1, wherein The number of the ejector pins is three, and the number of the openings is three.

6. The method according to claim 2, characterized in that The calibrating the current workstation position based on the offset to obtain the calibrated workstation position includes: Calculating the sum of the component of the current workstation position in the direction of the telescopic axis and the offset of the calibration member in the direction of the telescopic axis, and determining the sum as the component of the calibrated workstation position in the direction of the telescopic axis; The sum of the component of the current workstation position in the direction of the rotation axis and the offset of the calibration member in the direction of the rotation axis is calculated and determined as the component of the calibrated workstation position in the direction of the rotation axis.

7. A semiconductor process equipment, characterized in that: The device includes: a controller, a calibration device, a transmission device, and a process chamber, wherein: The calibration device is configured to rotate a calibration piece in a preset position to a preset orientation, wherein the calibration piece includes a plurality of openings, the plurality of openings being arranged in a one-to-one correspondence with a plurality of ejector pins on a chuck in a process chamber, and the sidewalls of the openings being tapered for accommodating the ejector pins; after the transfer device transfers the calibration piece out of the process chamber, the transfer device detects an offset of the calibration piece in a preset direction relative to the preset position; the offset is formed based on the ejector pins driving the calibration piece under the action of the tapered sidewalls of the openings; The transfer device is configured to transfer the calibration piece rotated to the preset orientation into the process chamber so that the calibration piece is located above the chuck. After the plurality of ejector pins are raised, the transfer device is driven to descend, and the plurality of ejector pins are respectively introduced into the plurality of openings, so that the calibration piece is supported by the plurality of ejector pins. The controller is configured to calibrate the current workstation position based on the offset to obtain a calibrated workstation position.

8. The semiconductor process equipment according to claim 7, wherein: The preset directions include: the telescopic axis direction and the rotation axis direction of the transmission device.

9. The semiconductor process equipment according to claim 7, wherein: The calibration piece further includes an opening at an edge thereof; The calibration device is further configured to rotate the calibration member so that the opening faces the preset orientation.

10. The semiconductor process equipment according to claim 8, wherein: The controller is further configured to calculate the sum of the component of the current workstation position in the direction of the telescopic axis and the offset of the calibration part in the direction of the telescopic axis, and determine it as the component of the calibrated workstation position in the direction of the telescopic axis; calculate the sum of the component of the current workstation position in the direction of the rotation axis and the offset of the calibration part in the direction of the rotation axis, and determine it as the component of the calibrated workstation position in the direction of the rotation axis.

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