Wiring circuit substrate assembly sheet and method for manufacturing the same

Abstract

In a wiring circuit substrate assembly sheet in which a product region in which a plurality of wiring circuit substrates as products are arranged and disposed and a margin region surrounding the product region are divided, the margin region has a first region adjacent to the product region and a second region located on the opposite side of the product region with respect to the first region, the wiring circuit substrate assembly sheet has a dummy wiring circuit substrate disposed in at least a part of the first region and smaller than the wiring circuit substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a wiring circuit board assembly sheet and a manufacturing method thereof. BACKGROUND

[0002] A manufacturing method of a printed circuit board in which a resist film is formed on the upper surface of a copper foil, and then etching is performed to form a plurality of circuit patterns from the copper foil is known in the past.

[0003] For example, in a manufacturing method of a printed circuit board in which a circuit pattern including a plurality of lines separated by intervals is formed, a scheme in which a resist film is formed to have a dummy pattern at a portion where the line interval is wide is proposed (for example, refer to Patent Document 1 below).

[0004] In Patent Document 1 below, in etching, the dummy pattern restricts the flow of etching liquid, and thereby, the amount of side etching between lines is suppressed, and the desired line width in the circuit pattern is ensured.

[0005] PRIOR ART DOCUMENT

[0006] PATENT DOCUMENT

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2000-200957 SUMMARY

[0008] Problem to be solved by the invention

[0009] However, in Patent Document 1 above, first, a portion where the line interval is wide among the plurality of lines needs to be determined, and then, a resist film corresponding to the dummy pattern needs to be arranged for each of the portions, which is complicated.

[0010] Also, in the method described in Patent Document 1 above, although the desired line width can be ensured in the circuit patterns on both sides of the portion where the line interval is wide in the inside (central portion) of the region in which a plurality of circuit patterns are arranged, as to the circuit patterns arranged at the peripheral end portion (outer end portion) of the region, since the resist is not arranged outside the region, the flow (speed) of the etching liquid is not restricted, and as a result, there is a problem in that the line width in the circuit pattern above becomes narrow, and the desired line width cannot be ensured.

[0011] The present application provides a manufacturing method of a wiring circuit board assembly sheet capable of easily manufacturing a wiring circuit board with high reliability, and a wiring circuit board assembly sheet manufactured according to the method.

[0012] Solution for solving the problem

[0013] The present application (1) includes a wiring circuit substrate assembly sheet in which a product region in which a plurality of wiring circuit substrates as products are arranged and disposed and a margin region surrounding the product region are divided in the wiring circuit substrate assembly sheet, the margin region has a first region adjacent to the product region and a second region located on the opposite side of the product region with respect to the first region, the wiring circuit substrate assembly sheet has a dummy wiring circuit substrate disposed in at least a part of the first region and smaller than the wiring circuit substrate.

[0014] However, in the wiring circuit substrate assembly sheet in which the product region in which the plurality of wiring circuit substrates as products are arranged and disposed and the margin region surrounding the product region are divided, in the manufacturing process thereof, a wiring including a conductor layer, a support substrate including a metal layer are formed by etching. In this case, when an etching resist coating is disposed in the product region and etching is performed, an etching liquid forms the wiring, the support substrate and the like while being in contact with the etching resist coating, and at the same time, the above-mentioned etching liquid reaches the margin region.

[0015] However, the etching resist coating is not disposed in the margin region. Therefore, when the etching liquid reaches the margin region from the product region, the etching liquid falls strongly, and turbulence is generated in the etching liquid. As a result, the precision of the wiring, the support substrate of the wiring circuit substrate located inside the margin region in the product region is decreased.

[0016] However, in the wiring circuit substrate assembly sheet, since the margin region has the first region adjacent to the product region and the second region located on the opposite side of the product region with respect to the first region, and the dummy wiring circuit substrate is disposed in at least a part of the first region, even when the etching liquid falls and turbulence is generated when the etching liquid reaches the second region from the product region, although the precision of the dummy wiring circuit substrate is decreased, since the influence of the turbulence of the etching liquid on the wiring circuit substrate is reduced, the decrease in the precision of the wiring circuit substrate can be suppressed. Therefore, in the wiring circuit substrate assembly sheet, the reliability of the wiring circuit substrate is excellent.

[0017] The present application (2) includes the wiring circuit substrate assembly sheet described in (1), in which the dummy wiring circuit substrate is disposed in the entire first region.

[0018] In the wiring circuit substrate assembly sheet, even when turbulence of the etching liquid is generated in the entire second region, since the dummy wiring circuit substrate is disposed in the entire first region, the influence of the turbulence of the etching liquid on the entire product region can be reduced.

[0019] The present application (3) includes the wiring circuit substrate assembly sheet described in (1) or (2), in which the wiring circuit substrate has a wiring including a conductor layer, and the dummy wiring circuit substrate has a dummy wiring including the conductor layer.

[0020] In the case where the wiring circuit substrate has a wiring including a conductor layer and the dummy wiring circuit substrate has a dummy wiring including a conductor layer, in the manufacturing of the wiring circuit substrate assembly sheet, an etching resist coating is arranged on the conductor layer corresponding to the wiring and the dummy wiring. Also, when the etching liquid reaches the second region from the first region, even if the etching liquid falls and turbulence is generated, although the precision of the dummy wiring decreases, the precision of the wiring can be inhibited from decreasing. Therefore, in the wiring circuit substrate assembly sheet, the reliability of the wiring is excellent.

[0021] The present application (4) includes the wiring circuit substrate assembly sheet described in (3), wherein the wiring circuit substrate assembly sheet has an elongated shape and has both end portions in a width direction orthogonal to a length direction, the both end portions in the width direction are included in the second region, the wiring circuit substrate assembly sheet has a conductor end portion arranged at the both end portions in the width direction and having the conductor layer.

[0022] If the wiring circuit substrate assembly sheet has an elongated shape, the wiring circuit substrate assembly sheet is conveyed in the length direction while being etched to be manufactured.

[0023] In the etching process, the etching liquid falls from the both end edges in the width direction of the wiring circuit substrate assembly sheet, and therefore, turbulence of the etching liquid is generated at the both end portions in the width direction.

[0024] However, in the case where the conductor end portion is formed, since the etching resist coating is provided at the both end portions in the width direction included in the second region and protruding outward in the width direction from the both end portions in the width direction, in the above etching, even if turbulence is generated, the product region is not easily affected by the turbulence. Therefore, a wiring circuit substrate having excellent reliability can be manufactured.

[0025] The present application (5) includes the wiring circuit substrate assembly sheet described in any one of (1) to (4), wherein the wiring circuit substrate has a support substrate including a metal-based layer, and the dummy wiring circuit substrate has a dummy support substrate including the metal-based layer.

[0026] In the case where the wiring circuit substrate has a support substrate including a metal-based layer and the dummy wiring circuit substrate has a dummy support substrate including the metal-based layer, in the manufacturing of the wiring circuit substrate assembly sheet, an etching resist coating is arranged on the metal-based layer corresponding to the support substrate and the dummy support substrate. Also, when the etching liquid reaches the second region from the first region, even if the etching liquid falls and turbulence is generated, although the precision of the dummy support substrate decreases, the precision of the support substrate can be inhibited from decreasing. Therefore, in the wiring circuit substrate assembly sheet, the reliability of the support substrate is excellent.

[0027] The present application (6) includes the wiring circuit substrate assembly sheet described in (5), wherein the wiring circuit substrate assembly sheet has an elongated shape, and has both end portions in a width direction orthogonal to a length direction, the both end portions in the width direction being included in the second region, the wiring circuit substrate assembly sheet has a metal-based end portion disposed at the both end portions in the width direction and having the metal-based layer.

[0028] If the wiring circuit substrate assembly sheet has an elongated shape, the wiring circuit substrate assembly sheet is transported in the length direction while being etched to be manufactured.

[0029] In the etching process, since the etching liquid falls from both end edges in the width direction of the wiring circuit substrate assembly sheet, turbulence of the etching liquid is generated at the both end portions in the width direction.

[0030] However, in the case where the support substrate end portion is formed, since the both end portions in the width direction included in the second region and the etching-resistant coating layer protruding from the both end portions in the width direction to both outer sides in the width direction are provided, in the above etching, even if the turbulence is generated, the product region is not easily affected by the turbulence. Therefore, a wiring circuit substrate excellent in reliability can be manufactured.

[0031] The present application (7) includes a wiring circuit substrate assembly sheet, wherein a product region in which a plurality of wiring circuit substrates as products are arranged and disposed, and a margin region surrounding the product region are divided in the wiring circuit substrate assembly sheet, the wiring circuit substrate has a wiring including a conductor layer, the wiring circuit substrate assembly sheet has an elongated shape, and has both end portions in a width direction orthogonal to a length direction, the both end portions in the width direction being included in the margin region, the wiring circuit substrate assembly sheet has a conductor end portion disposed at the both end portions in the width direction and having the conductor layer.

[0032] In the etching process, since the etching liquid falls from both end edges in the width direction of the wiring circuit substrate assembly sheet, turbulence of the etching liquid is generated at the both end portions in the width direction.

[0033] However, in the case where the conductor end portion is formed, since the both end portions in the width direction included in the second region and the etching-resistant coating layer protruding from the both end portions in the width direction to both outer sides in the width direction are provided, in the above etching, even if the turbulence is generated, the product region is not easily affected by the turbulence. Therefore, a wiring circuit substrate excellent in reliability can be manufactured.

[0034] The present application (8) includes a wiring circuit substrate assembly sheet in which a product region in which a plurality of wiring circuit substrates as products are arranged and disposed and a margin region surrounding the product region are divided in the wiring circuit substrate assembly sheet, the wiring circuit substrate has a support substrate including a metal layer, the wiring circuit substrate assembly sheet has an elongated shape and has both end portions in a width direction orthogonal to a length direction, the both end portions in the width direction are included in the margin region, the wiring circuit substrate assembly sheet has a metal end portion disposed at the both end portions in the width direction and having the metal layer.

[0035] In the etching process, since the etching solution falls from the both end edges in the width direction of the wiring circuit substrate assembly sheet, turbulence of the etching solution is generated at the both end portions in the width direction.

[0036] However, in the case where the support substrate end portion is formed, since the both end portions in the width direction included in the second region and the etching resist coating layer protruding from the both end portions in the width direction to both outer sides in the width direction are provided, in the above etching, even if the turbulence is generated, the product region is not easily affected by the turbulence. Therefore, a wiring circuit substrate excellent in reliability can be produced.

[0037] The present application (9) includes a manufacturing method of a wiring circuit substrate assembly sheet, which is the manufacturing method of the wiring circuit substrate assembly sheet described in (3), the method having: a first process in which a first etching resist coating layer is disposed on the conductor layer in a manner corresponding to the wiring and the dummy wiring; and a second process in which a part of the conductor layer exposed from the first etching resist coating layer is etched to form the wiring and the dummy wiring.

[0038] If the first etching resist coating layer is disposed on the conductor layer in a manner corresponding to the wiring and the dummy wiring in the first process, even if the side surface etching of the dummy wiring due to the turbulence of the etching solution of the first region causes the width of the dummy wiring to be insufficiently ensured in the second process, the product region is not easily affected by the turbulence, and the width of the wiring can be sufficiently ensured.

[0039] The present application (10) includes the manufacturing method of the wiring circuit substrate assembly sheet described in (9), in which the conductor layer is transported along a transport direction in the second process and has both end portions in a width direction orthogonal to the transport direction, the both end portions in the width direction are included in the second region, and the first etching resist coating layer is formed in the first process in a manner in which the first etching resist coating layer covers a face of the both end portions in the width direction of the conductor layer on a thickness direction side and protrudes from the both end portions in the width direction of the conductor layer to both outer sides in the width direction.

[0040] The first resist coating is formed so as to cover the side of the both ends of the conductor layer in the width direction on the thickness direction side and protrude from the both ends of the conductor layer in the width direction to the outside in the width direction, thereby making it possible to distance the place where turbulence of the etching liquid is likely to occur from the product area in the etching process. Thus, it is possible to reduce the influence of turbulence of the etching liquid in the product area.

[0041] The present application (11) includes a manufacturing method of a wiring circuit board assembly sheet, which is the manufacturing method of the wiring circuit board assembly sheet described in (5), the method having: a third step in which a second resist coating is arranged on the metal-based layer in correspondence with the support substrate and the dummy support substrate; and a fourth step in which a part of the metal-based layer exposed from the second resist coating is etched to form the support substrate and the dummy support substrate.

[0042] If the second resist coating is arranged on the metal-based layer in correspondence with the support substrate and the dummy support substrate in the third step, even if the side etching of the dummy support substrate due to turbulence of the etching liquid in the first region causes the width of the dummy support substrate to be insufficiently ensured in the fourth step, the product area is not easily affected by the turbulence, and the width of the wiring can be sufficiently ensured.

[0043] The present application (12) includes the manufacturing method of the wiring circuit board assembly sheet described in (11), in which the metal-based layer is transported in the fourth step in the transport direction and has both ends in the width direction orthogonal to the transport direction, the both ends in the width direction are included in the second region, and the second resist coating is formed in the third step so as to cover the side of the both ends of the metal-based layer in the width direction on the thickness direction side and protrude from the both ends of the metal-based layer in the width direction to the outside in the width direction.

[0044] The second resist coating is formed so as to cover the side of the both ends of the metal-based layer in the width direction on the thickness direction side and protrude from the both ends of the metal-based layer in the width direction to the outside in the width direction, thereby making it possible to distance the place where turbulence of the etching liquid is likely to occur from the product area in the etching process. Thus, it is possible to reduce the influence of turbulence of the etching liquid in the product area.

[0045] Effects of the invention

[0046] In the wiring circuit board assembly sheet of the present application, the reliability of the wiring circuit board is excellent.

[0047] The manufacturing method of the wiring circuit board assembly sheet of the present application can easily manufacture the wiring circuit board having excellent reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 A plan view showing a first embodiment of the wired circuit board assembly sheet of the present invention.

[0049] Figure 2 A~ Figure 2 D is Figure 1 The manufacturing process diagram of the wiring circuit board assembly sheet shown in FIG. Figure 1 The cross-sectional view of line AA, Figure 2 A represents the substrate preparation process, Figure 2 B represents the resist placement step, Figure 2 C represents the etching process, Figure 2 D represents a resist removal step and a covering step.

[0050] Figure 3 A plan view showing a modified example of the first embodiment.

[0051] Figure 4 A plan view showing a wired circuit board assembly sheet according to a second embodiment.

[0052] Figure 5 A~ Figure 5 C is Figure 4 The manufacturing process diagram of the wiring circuit board assembly sheet shown in FIG. Figure 4 The cross-sectional view of line AA, Figure 5 A represents a resist placement step, Figure 5 B represents the etching process, Figure 5 C represents a resist removal step and a covering step.

[0053] Figure 6 1 is a manufacturing process diagram (cross-sectional view) of a wiring circuit board assembly sheet according to a third embodiment. Figure 6 A represents the substrate preparation process, Figure 6 B represents the first resist placement step, Figure 6 C represents the first etching step.

[0054] Figure 7 then Figure 6 C is a manufacturing process diagram (cross-sectional view) of the wired circuit board assembly sheet according to the third embodiment. Figure 7 A represents the first resist removal step, Figure 7 B represents a base layer forming step, Figure 7 C represents a covering process.

[0055] Figure 8 then Figure 7 C is a manufacturing process diagram (cross-sectional view) of the wired circuit board assembly sheet according to the third embodiment. Figure 8A indicates a 2nd resist arrangement step, Figure 8 B indicates a 2nd etching step, Figure 8 C indicates a 2nd resist removal step. DETAILED DESCRIPTION

[0056] Reference Figures 1-2 D describes a 1st embodiment of the wiring circuit substrate set sheet of the present application.

[0057] Further, Figure 1 The enclosed figure at the upper right is an enlarged view of the wiring circuit substrate and dummy wiring circuit substrate, and the figure at the lower right with hatching is a figure in which each region is distinguished by the type of hatching.

[0058] As Figure 1 indicated, the wiring circuit substrate set sheet 1 has a long strip shape extending in the length direction. Further, the wiring circuit substrate set sheet 1 has a predetermined length in the width direction orthogonal to the length direction. As Figure 2 indicated in D, the wiring circuit substrate set sheet 1 has one face and the other face which oppose each other with a space in the thickness direction orthogonal to the length direction and the width direction.

[0059] As Figure 1 indicated in E and Figure 2 D, the wiring circuit substrate set sheet 1 has a support sheet 2 and a plurality of wiring circuit substrates 3.

[0060] The support sheet 2 has the same planar shape (outer shape) as the wiring circuit substrate set sheet 1. As the material of the support sheet 2, a resin such as polyimide can be cited. The thickness of the support sheet 2 is, for example, 1 μm or more and 1 mm or less.

[0061] The wiring circuit substrate 3 has a substantially rectangular shape in plan view. The wiring circuit substrate 3 is arranged in a plurality on the support sheet 2. Further, the plurality of wiring circuit substrates 3 are each supported in a detachable manner with respect to the support sheet 2. Specifically, as Figure 1 indicated in the enlarged view at the upper right, an opening portion 14 is formed around the wiring circuit substrate 3, and the wiring circuit substrate 3 is connected to the surrounding support sheet 2 by a joint portion 24. The opening portion 14 has a shape of a substantially rectangular frame surrounding the wiring circuit substrate 3 in plan view, and is through in the thickness direction of the support sheet 2.

[0062] Further, the joint portion 24 spans the opening portion 14, whereby the support sheet 2 is suspended and supported on the wiring circuit substrate 3. The joint portion 24 has the same material and thickness as the support sheet 2. Further, the layer structure of the wiring circuit substrate 3 is described later. This wiring circuit substrate 3 is different from the dummy wiring circuit substrate 11 described later, and is a product in the wiring circuit substrate set sheet 1.

[0063] In the wiring circuit substrate assembly sheet 1, a product region 4 and a margin region 5 are divided.

[0064] The product region 4 is a region divided into a substantially rectangular shape in plan view, and the product region 4 is arranged in the wiring circuit substrate assembly sheet 1 with a sufficient interval in the length direction and the width direction from each other (specifically, a region in which the margin region 5 described later is provided).

[0065] In each of the plurality of product regions 4, the plurality of wiring circuit substrates 3 are arranged with a slight gap 25 therebetween. Specifically, in the product region 4, the adjacent wiring circuit substrates 3 are separated by the slight gap 25, and the gap 25 is set to be as small (narrow) as possible from the viewpoint of improving the yield of the wiring circuit substrates 3 in the wiring circuit substrate assembly sheet 1. The ratio of the length (width) of the gap 25 separating the adjacent wiring circuit substrates 3 to the width of the wiring circuit substrate 3 is, for example, 0.1 or less, preferably 0.01 or less, more preferably 0.001 or less, and for example, 0.0001 or more. Specifically, the length (width) of the gap 25 separating the adjacent wiring circuit substrates 3 is, for example, 100 μm or less, preferably 50 μm or less, more preferably 10 μm or less, and for example, 0.1 μm or more. Furthermore, in the product region 4, any of the gaps 25 has the same width. That is, the wiring circuit substrates 3 are arranged with the gaps 25 having the same width therebetween.

[0066] The margin region 5 surrounds the product region 4. Specifically, the margin region 5 has a substantially rectangular frame shape surrounding the product region 4 with respect to one product region 4. In detail, the margin region 5 has a substantially cross shape in plan view and a belt shape extending in the length direction along both the width direction end edges of the support sheet 2 in the wiring circuit substrate assembly sheet 1. That is, with respect to the margin region 5 having the substantially cross shape, one margin region 5 corresponding to one product region 4A is continuous with other margin regions 5 corresponding to other product regions 4B adjacent to the one product region 4A.

[0067] The margin region 5 has a first area 6 and a second area 7.

[0068] Furthermore, in the right lower portion of the wiring circuit substrate assembly sheet 1, Figure 1 the first area 6 is hatched with a diagonal line from the upper left toward the lower right, and the second area 7 is hatched with a diagonal line from the upper right toward the lower left.

[0069] The first region 6 is adjacent to the product region 4. Specifically, the first region 6 is disposed in the vicinity of the product region 4, that is, near the periphery of the product region 4. The first region 6 is divided into a shape of a substantially rectangular frame in plan view that surrounds the position in the vicinity of the immediately outside of the product region 4. That is, the inner dimension of the first region 6 is set to be substantially the same as the outer dimension of the product region 4.

[0070] In the first region 6, a dummy wiring circuit substrate 11 described later is disposed.

[0071] The second region 7 is located on the opposite side of the product region 4 with respect to the first region 6. That is, the second region 7 is distanced from the product region 4 with the first region 6 interposed therebetween on the outside of the product region 4. In other words, the second region 7 surrounds the first region 6.

[0072] The second region 7 is divided into a shape of a substantially rectangular frame in plan view that surrounds the position in the vicinity of the immediately outside of the first region 6. That is, the inner dimension of the second region 7 is set to be substantially the same as the outer dimension of the first region 6.

[0073] Further, the second region 7 between the two product regions 4A and 4B disposed adjacently is shared by the two product regions 4A and 4B.

[0074] In the second region 7, neither of the wiring circuit substrate 3 and the dummy wiring circuit substrate 11 described later is disposed, and thus the second region 7 is divided into a blank area in the excess region 5.

[0075] In the wiring circuit substrate assembly sheet 1, the first region 6 and the second region 7 are disposed in this order toward the outside of the product region 4 (the outside in the direction orthogonal to the thickness direction).

[0076] Further, the excess region 5 does not include the gap 25 in the product region 4, that is, the excess region 5 is distinguished from the gap 25. The width of the excess region 5 is wide enough, and specifically, the ratio of the width of the excess region 5 to the width of the product region 4 (the width of the excess region 5 / the width of the product region 4) is, for example, 10 or more, preferably 100 or more, more preferably 1000 or more, and additionally, for example, 100000 or less.

[0077] Further, the width between the product regions 4A and 4B adjacent in the width direction of the excess region 5 is the width in the width direction. In addition, the width between the product regions 4A and 4C adjacent in the length direction of the excess region 5 is the width in the length direction. Furthermore, the width of the excess region 5 at the outermost side in the width direction is the width in the width direction between the width direction end edge of the excess region 5 and the product region 4A (or 4C) at the outermost side in the width direction. Further, the width in the width direction, the width in the length direction, and the like of the excess region 5 described above can be collectively referred to as the short side direction length of the excess region 5.

[0078] Specifically, the length of the margin region 5 in the short-side direction is, for example, 5 mm or more, preferably 10 mm or more, more preferably 20 mm or more, and, for example, 50 mm or less.

[0079] Next, the layer structure of the wired circuit board 3 and the arrangement and layer structure of the dummy wired circuit board 11 will be described in detail in this order.

[0080] like Figure 2 As shown in D, the wired circuit board 3 includes a base layer 8, wires 9 arranged on one surface of the base layer 8 in the thickness direction, and a cover layer 10 (virtual line) arranged on one surface of the base layer 8 in the thickness direction to cover the wires 9.

[0081] The base layer 8 has the same planar shape as the wired circuit board 3. The base layer 8 is formed by the opening 14 (see Figure 1 ) is separated from the surrounding support sheet 2. The material and thickness of the base layer 8 are the same as those of the support sheet 2.

[0082] The wiring 9 has a pattern that is contained within the base layer 8 when viewed from above. The pattern shape of the wiring 9 is not particularly limited and can be appropriately set according to the application and purpose. The wiring 9 includes, for example, signal lines (differential wiring, etc.), power lines (power supply wiring, etc.), ground lines (ground lines, etc.), antennas (transmitting and receiving signal lines, etc.). In addition, the wiring 9 may also have auxiliary parts (terminals, etc.) (not shown) that correspond to the functions of each of the above-mentioned wiring lines when viewed from above.

[0083] The wiring 9 includes a conductor layer 15 (see Figure 2 A~ Figure 2 B).

[0084] As materials for the wiring 9, conductors such as metal-based materials (specifically, metal materials) can be cited. As metal-based materials, metal elements classified as Groups 1 to 16 in the periodic table, alloys containing two or more of these metal elements, etc. can be cited. In addition, as metal-based materials, any of transition metals and typical metals can also be cited. More specifically, as metal-based materials, for example, Group 2 metal elements such as calcium, Group 4 metal elements such as titanium and zirconium, Group 5 metal elements such as vanadium, Group 6 metal elements such as chromium, molybdenum, and tungsten, Group 7 metal elements such as manganese, Group 8 (8th column) metal elements such as iron, Group 8 (9th column) metal elements such as cobalt, Group 8 (10th column) metal elements such as nickel and platinum, Group 1 metal elements such as copper, silver, and gold, Group 2 metal elements such as zinc, Group 3 metal elements such as aluminum and gallium, and Group 4 metal elements such as germanium and tin can be cited. They can be used alone or in combination.

[0085] The ratio of the thickness of the wiring 9 to the thickness of the base layer 8 is, for example, 0.5 or more, preferably 1.0 or more, more preferably 1.5 or more, and, for example, 3.0 or less. Specifically, the thickness of the wiring 9 is, for example, 1 μm or more and 1000 μm or less. The width of the wiring 9 is, for example, 10 μm or more and 1000 μm or less.

[0086] The cover layer 10 covers the portion of the base layer 8 exposed from the wiring 9 and the side surface and the thickness direction side surface of the wiring 9. The material of the cover layer 10 is the same as that of the base layer 8.

[0087] The ratio of the thickness of the cover layer 10 to the thickness of the base layer 8 is, for example, 0.2 or more, preferably 0.3 or more, more preferably 0.5 or more, and, for example, 2.0 or less. Specifically, the thickness of the cover layer 10 is, for example, 25 μm or more and 1000 μm or less. The dummy wiring circuit substrate 11 is disposed in the first region 6. Specifically, the dummy wiring circuit substrate 11 is disposed in the entire first region 6. Specifically, the dummy wiring circuit substrate 11 is disposed in a plurality of columns with a space therebetween in the first region 6 along the frame forming the first region 6.

[0088] Specifically, the dummy wiring circuit substrate 11 has a first dummy wiring circuit substrate 26 disposed on both sides in the length direction and both sides in the width direction of the product area 4 and a second dummy wiring circuit substrate 27 disposed on the oblique outer side of the product area 4.

[0089] The first dummy wiring circuit substrates 26A disposed on both sides in the length direction of the product area 4 are disposed in a column with a space therebetween in the width direction. The pitch in the width direction between the first dummy wiring circuit substrates 26A is the same as the pitch in the width direction between the wiring circuit substrates 3. Specifically, the length in the width direction of the first dummy wiring circuit substrates 26A and the space therebetween are the same as the length in the width direction of the wiring circuit substrates 3 and the space therebetween, respectively.

[0090] On the other hand, the length L1 in the length direction of the first dummy wiring circuit substrate 26A and the length L0 in the length direction of the wiring circuit substrate 3 satisfy, for example, the following expression (5), preferably the following expression (6), more preferably the following expression (7), and, for example, the following expression (8).

[0091] L1 < L0 (5)

[0092] L1 < 0.5 x L0 (6)

[0093] L1 < 0.25 x L0 (7)

[0094] 0.001 x L0 < L1 (8)

[0095] The first dummy wiring circuit board 26B arranged on each of the both sides in the width direction of the product area 4 is arranged in one column with intervals in the length direction. The interval in the length direction between the first dummy wiring circuit boards 26B is the same as the interval in the length direction between the wiring circuit boards 3. Specifically, the length in the length direction of the first dummy wiring circuit board 26B and the interval are the same as the length in the length direction of the wiring circuit board 3 and the interval, respectively.

[0096] On the other hand, the width direction length W1 of the first dummy wiring circuit board 26B and the width direction length W0 of the wiring circuit board 3 satisfy, for example, the following equation (9), preferably the following equation (10), more preferably the following equation (11), and further the following equation (12).

[0097] W1 < W0 (9)

[0098] W1 < 0.5 x W0 (10)

[0099] W1 < 0.25 x W0 (11)

[0100] 0.001 x W0 < W1 (12)

[0101] The second dummy wiring circuit board 27 is smaller than the first dummy wiring circuit board 26. Specifically, the length L2 and the width W2 of the second dummy wiring circuit board 27 are the same as the length L1 of the first dummy wiring circuit board 26A arranged on each of the both sides in the length direction of the product area 4 and the width W1 of the first dummy wiring circuit board 26B arranged on each of the both sides in the width direction of the product area 4, respectively.

[0102] The second dummy wiring circuit board 27 is arranged at each of the four corners of the frame forming the first area 6.

[0103] Thus, in the area in which the product area 4 and the first area 6 are combined, the wiring circuit boards 3, the first dummy wiring circuit boards 26, and the second dummy wiring circuit boards 27 are arranged with equal intervals (minute gaps 25).

[0104] The dummy wiring circuit board 11 is smaller than the wiring circuit board 3. Specifically, the dummy wiring circuit board 11 is smaller than the wiring circuit board 3 in plan view, and in detail, the planar area S1 of the dummy wiring circuit board 11 and the planar area S0 of the wiring circuit board 3 satisfy the following equation (13), preferably the following equation (14), more preferably the following equation (15), and further preferably the following equation (16).

[0105] S1 < S0 (13)

[0106] S1 < 0.8 x S0 (14)

[0107] S1<0.5×S0 (15)

[0108] S1<0.3×S0 (16)

[0109] In addition, in the case where the top-view areas of the dummy wiring circuit substrates 11 are different from each other, specifically, in the case where the dummy wiring circuit substrate 11 includes a first dummy wiring circuit substrate 26 and a second dummy wiring circuit substrate 27 having a top-view area smaller than the top-view area of ​​the first dummy wiring circuit substrate 26, the above-mentioned top-view area S1 of the above-mentioned dummy wiring circuit substrate 11 means the top-view area of ​​the first dummy wiring circuit substrate 26.

[0110] Although dummy wired circuit board 11 has the same layer structure as wired circuit board 3, unlike wired circuit board 3, dummy wired circuit board 11 is not recovered (obtained) from wired circuit board assembly sheet 1 as a product, but remains supported by support sheet 2. In other words, dummy wired circuit board 11 is not a product.

[0111] like Figure 2 As shown in FIG. 3 , dummy wiring circuit board 11 includes dummy base layer 12 and dummy wiring 13 arranged on one side in the thickness direction of dummy base layer 12. Dummy base layer 12 has the same layer structure and thickness as base layer 8 of wiring circuit board 3, and dummy wiring 13 has the same layer structure and thickness as wiring 9 of wiring circuit board 3.

[0112] In addition, the dummy base layer 12 utilizes the opening 14 (see Figure 1 ) is separated. The dummy wiring 13 includes a conductor layer 15 (refer to Figure 2 A~ Figure 2 B).

[0113] Furthermore, the width of dummy wiring 13 is allowed to be narrower than the width of wiring 9. Specifically, width W6 of dummy wiring 13 and width W5 of wiring 9 satisfy the following equation (17) and further satisfy the following equation (18).

[0114] W6 <W5 (17)

[0115] 0.01×W5 <W6<0.5×W5 (18)

[0116] Next, a method for producing the wired circuit board assembly sheet 1 will be described.

[0117] like Figure 2 A~ Figure 2As shown in D, the method for producing the wired circuit board assembly sheet 1 includes a substrate preparation step, a resist placement step as an example of a first step, an etching step as an example of a second step, a resist removal step, and a covering step.

[0118] In the method for manufacturing the wired circuit board assembly sheet 1 , the above-mentioned steps are performed in sequence.

[0119] The method for manufacturing the wiring circuit board assembly sheet 1 is implemented, for example, by a roll-to-roll method. In the roll-to-roll method, a device for manufacturing each layer (not shown) is used to arrange the wiring circuit board assembly sheet 1 in the longitudinal direction ( Figure 2 A~ Figure 2 D in the paper depth direction) on both sides of the delivery roller and the winding roller (both not shown), in each process, the components sent out from the delivery roller are sent toward the winding roller.

[0120] like Figure 2 As shown in A, in the substrate preparation step, a two-layer substrate 16 is prepared that includes a support sheet 2 and a conductive layer 15 disposed on one surface in the thickness direction of the support sheet 2. The two-layer substrate 16 preferably includes only the support sheet 2 and the conductive layer 15.

[0121] The support sheet 2 has not yet formed the above-mentioned opening 14 in the substrate preparation step (see Figure 1 ), therefore, the support sheet 2 is prepared as a long strip that is continuous in the longitudinal direction and does not have an opening 14.

[0122] Conductive layer 15 is disposed over the entire surface of one side in the thickness direction of support sheet 2. During the substrate preparation step, conductive layer 15 is not yet patterned to correspond to the aforementioned wiring 9 and dummy wiring 13. Conductive layer 15 is prepared as a long, continuous conductive sheet in the longitudinal direction. The material and thickness of conductive layer 15 are the same as those of wiring 9.

[0123] To prepare the two-layer substrate 16, for example, resin is applied to the other side of the conductor layer 15 in the thickness direction and then dried to form the support sheet 2. Alternatively, the two-layer substrate 16 having the support sheet 2 and the conductor layer 15 can be directly prepared.

[0124] like Figure 2 As shown in FIG. 2B , in the resist placement step, the first anti-corrosion coating 17 is formed in a manner similar to that of the wiring 9 and the dummy wiring 13 (see FIG. Figure 2 C) The corresponding configuration is arranged on one surface in the thickness direction of the conductive layer 15 .

[0125] To arrange the first anti-corrosion coating layer 17 on the conductive layer 15, for example, a sheet of dry film resist is first arranged on the entire surface of one side in the thickness direction of the conductive layer 15 (this is not shown). Next, the first anti-corrosion coating layer 17 is formed from the dry film resist by photolithography (exposure and development) so that the first anti-corrosion coating layer 17 has a shape corresponding to the wiring 9 and the dummy wiring 13.

[0126] Specifically, the first corrosion resistant coating 17 includes a resist product portion 18 corresponding to the wiring 9 and a resist dummy portion 19 corresponding to the dummy wiring 13. The resist product portion 18 and the resist dummy portion 19 have the same width as the wiring 9 to be formed next in a plan view.

[0127] In this way, the corrosion-resistant laminate 20 having the support sheet 2, the conductor layer 15, and the first corrosion-resistant coating layer 17 in this order toward one side in the thickness direction is produced.

[0128] like Figure 2 As shown in C, in the etching step, the portion of the conductor layer 15 exposed from the first anti-corrosion coating layer 17 is etched to form the wiring 9 and the dummy wiring 13.

[0129] Specifically, in the etching process, an etching device (not shown) having an outlet (nozzle, shower head, etc.) is used. The outlet (not shown) is arranged on one side in the thickness direction of the resist stack 20 and is arranged in parallel in the width direction of the resist stack 20. Specifically, it is provided opposite to at least the resist product portion 18.

[0130] In the etching process, Figure 2 As shown by the thick arrow in B, the etching liquid contacts the anti-etching product portion 18 and the portion of the conductor layer 15 exposed from the anti-etching product portion 18 from the discharge port, reaches the anti-etching dummy portion 19 arranged on the outside thereof, and then falls toward the portion of the conductor layer 15 corresponding to the second area 7.

[0131] The etching liquid spreads from the resist product portion 18 toward the resist dummy portion 19 , and then, turbulence is generated in the etching liquid just before it falls from the resist dummy portion 19 onto the portion of the conductive layer 15 corresponding to the second region 7 , that is, in the etching liquid around the resist dummy portion 19 .

[0132] Therefore, the etching liquid contacts the portion of the conductor layer 15 exposed from the resist dummy portion 19 at a high speed, and thus the etching speed of the conductor layer 15 is also increased. Figure 2 As shown in C, an over-etched dummy wiring 13 is formed. For example, the width of the dummy wiring 13 is narrower than the width of the resist dummy portion 19.

[0133] On the other hand, the resist product section 18 is arranged at a position inside the falling place of the etching liquid described above across the resist dummy section 19, and thus the influence of the turbulence described above is small (less likely to be affected), and thus the high speed of the etching liquid due to the turbulence can be suppressed. Thus, the etching speed can also be suppressed from becoming fast, and thus the over-etching described above can be suppressed. As a result, the width of the wiring 9 is the same as the width of the resist product section 18. That is, the patterning accuracy of the wiring 9 is high.

[0134] Then, in the resist removing step, the first resist coating 17 is removed by, for example, peeling or the like.

[0135] Then, as shown by the imaginary line of D, in the covering step, the covering layer 10 is arranged on the thickness direction one side of the support sheet 2 in a manner of covering the face and the side face of the wiring 9 on the thickness direction one side. Figure 2

[0136] Then, the support sheet 2 is subjected to an outer shape processing to form the opening section 14. At the same time, the joint section 24 is formed (refer to Figure 1 ).

[0137] Thus, the wiring circuit substrate aggregate sheet 1 is manufactured.

[0138] Then, the wiring circuit substrate 3 is cut off from the support sheet 2, and is recovered (obtained) from the wiring circuit substrate aggregate sheet 1. On the other hand, the dummy wiring circuit substrate 11 remains in the state of being supported by the support sheet 2, and then is discarded together with the support sheet 2.

[0139] Also, in the manufacturing method of the wiring circuit substrate aggregate sheet 1, in the etching step, even if the etching liquid falls and turbulence is generated when the etching liquid reaches the second region 7 from the product region 4, although the accuracy of the dummy wiring circuit substrate 11 arranged in the first region 6 decreases, the influence of the turbulence of the etching liquid on the wiring circuit substrate 3 is reduced, and thus the decrease in the accuracy of the wiring circuit substrate 3 arranged in the product region 4 can be suppressed. Thus, in the wiring circuit substrate aggregate sheet 1, the reliability of the wiring circuit substrate 3 is excellent.

[0140] In addition, even if turbulence of the etching liquid is generated in the entire second region 7, since the dummy wiring circuit substrate 11 is arranged in the entire first region 6, the influence of the turbulence of the etching liquid on the entire product region 4 can also be reduced.

[0141] ​Further, the wiring circuit substrate 3 has the wiring 9 including the conductor layer 15, and the dummy wiring circuit substrate 11 has the dummy wiring 13 including the conductor layer 15. Therefore, in the manufacturing of the wiring circuit substrate assembly sheet 1, the first resist coating layer 17 is arranged at the portions of the conductor layer 15 corresponding to the wiring 9 and the dummy wiring 13. Then, when the etching liquid reaches the second region 7 from the first region 6, even if the etching liquid falls and turbulence is generated, the precision of the wiring 9 can be suppressed from decreasing, although the precision of the dummy wiring 13 decreases. Therefore, in this wiring circuit substrate assembly sheet 1, the reliability of the wiring 9 is excellent.

[0142] Modified examples

[0143] Next, modified examples of the first embodiment will be described. In each of the following modified examples, the same reference numerals are assigned to the same components and processes as those of the above-described first embodiment, and detailed description thereof will be omitted. In addition, the first embodiment and each of the modified examples can be appropriately combined. Further, each of the modified examples can achieve the same effects as the first embodiment except for the specifically described contents.

[0144] In the first embodiment, as shown in FIG. 1, the dummy wiring circuit substrate 11 is arranged in the entire first region 6, but the dummy wiring circuit substrate 11 can be arranged in a part of the first region 6. Figure 1

[0145] Specifically, the first technical solution in which the dummy wiring circuit substrate 11 has the first dummy wiring circuit substrate 26 and does not have the second dummy wiring circuit substrate 27, the second technical solution in which the dummy wiring circuit substrate 11 has the second dummy wiring circuit substrate 27 and does not have the first dummy wiring circuit substrate 26, and the like can be given.

[0146] In addition, as shown in FIG. 1, the dummy wiring circuit substrate 11 can be arranged in a part of the first region 6, and the dummy wiring circuit substrate 11 can not be arranged in another part of the first region 6. Figure 3

[0147] In this modified example, in each of the first regions 6, the dummy wiring circuit substrate 11 is arranged along a line that has a substantially Japanese Kana "コ" (letter U) shape in plan view.

[0148] Second embodiment

[0149] In the following second embodiment, the same reference numerals are assigned to the same components and processes as those of the above-described first embodiment, and detailed description thereof will be omitted. In addition, the first embodiment and the second embodiment can be appropriately combined. Further, the second embodiment can achieve the same effects as the first embodiment except for the specifically described contents. ​​

[0150] Reference Figures 4-5 C describes the second embodiment. Furthermore, in Figure 1 , regarding the conductor end portion 28 (described later), the configuration and shape thereof are shown in hatching for clear illustration. In addition, the resist end portion 21 (described later) is not provided to the wiring circuit substrate assembly sheet 1, but is shown in phantom line because it is used in the manufacturing process of the wiring circuit substrate assembly sheet 1.

[0151] In the first embodiment, as shown in Figure 4 , the entire second region 7 is divided into a blank region, but it can also be, as shown in Figure 5 and Figure 5 C, the conductor end portion 28 is provided to the wiring circuit substrate assembly sheet 1 in such a manner that it is contained in a part of the second region 7.

[0152] In the second embodiment, the wiring circuit substrate assembly sheet 1 has the conductor end portion 28 that is independent from the wiring 9 and the dummy wiring 13.

[0153] The conductor end portion 28 is disposed at both ends in the width direction of the support sheet 2. The two conductor end portions 28 each have a substantially strip shape extending in the length direction. Furthermore, the conductor end portion 28 is contained in a part of the second region 7, but is not contained in the first region 6.

[0154] The width direction outer end edge of the conductor end portion 28 coincides with the width direction outer end edge of the support sheet 2 when viewed from above. On the other hand, the width direction inner end edge of the conductor end portion 28 coincides with the boundary between the second region 7 and the first region 6 when viewed from above, and specifically, the conductor end portion 28 is disposed with a slight gap from the outer dummy wiring 13.

[0155] To manufacture this wiring circuit substrate assembly sheet 1, as shown in Figure 4 A, in a resist disposition process, the first resist coating layer 17 having the resist end portion 21 is disposed to the two-layer base material 16. Specifically, the first resist coating layer 17 has the resist product portion 18 and the resist dummy portion 19, and also has the resist end portion 21. The resist end portion 21 integrally has the resist base end portion 22 and the resist protruding portion 23.

[0156] The resist base end portion 22 is disposed in correspondence with the conductor end portion 28, and specifically, is disposed in the same pattern as the conductor end portion 28 to the face on one side in the thickness direction and the face on the other side in the thickness direction of the two-layer base material 16.

[0157] The resist protruding portion 23 is a free end portion that protrudes from the width direction outer end face of the resist base end portion 22 to both outer sides in the width direction. In addition, the resist protruding portion 23 has a substantially leaf shape that extends from the width direction outer end face of the two-layer base material 16 to both outer sides in the width direction. In addition, the resist protruding portion 23 has a shape that is substantially the same as the conductor end portion 28 when viewed from above.Figure 5 As shown by the imaginary line, it extends in the longitudinal direction in parallel with the resist base end portion 22 and has a substantially strip-shaped shape in a plan view.

[0158] The width (protrusion length) W7 of the anti-etching protrusion 23 and the width (width direction length) W8 of the anti-etching base end portion 22 are set so that the anti-etching end portion 21 becomes a place (area) where the etching liquid is fully retained (described later) just before it falls from the top end (width direction outer edge) of the anti-etching protrusion 23.

[0159] During the etching process, as shown by the bold arrows, the etching liquid discharged from the discharge port toward the resist product portion 18 and the resist dummy portion 19 flows smoothly (or accumulates) at the resist base end portion 22 and then falls from the top edge of the resist protrusion 23 toward the other side in the thickness direction.

[0160] like Figure 5 As shown in B, in the etching step, the conductor end portion 28 is formed from the portion of the conductor layer 15 covered by the resist base end portion 22 .

[0161] like Figure 2 As shown in C, in the resist removal step, the first corrosion resistant coating 17 is removed.

[0162] In this way, the wired circuit board assembly sheet 1 having the conductor end portions 28 is manufactured.

[0163] Furthermore, the wired circuit board assembly sheet 1 has an elongated shape, and is manufactured while the resist laminate 20 is conveyed in the longitudinal direction.

[0164] However, if Figure 5 As indicated by the imaginary arrows at B, since the etching liquid falls from both ends in the width direction of the resist laminate 20 , turbulence is generated at both ends in the width direction by the etching liquid immediately before falling.

[0165] However, in the second embodiment, Figure 5 As shown in Figure A, since conductor end portions 28 are formed by providing two widthwise end portions within second region 7 and resist projections 23 projecting outward from these widthwise end portions, even if turbulence occurs during the etching described above, product region 4 is less susceptible to such turbulence. Consequently, a highly reliable wired circuit board 3 can be manufactured. Specifically, the dimensional accuracy of the wires 9 corresponding to the resist product portions 18 is excellent.

[0166] In addition, if Figure 6 As shown in A, during the etching process, the resist protrusions 23 can be used to keep the location where the etching liquid is likely to be turbulent away from the resist product portion 18. This can reduce the influence of the turbulence of the etching liquid on the resist product portion 18.

[0167] In addition, the resist base end portion 22 supports the resist protruding portion 23. The resist base end portion 22 is arranged on both sides in the thickness direction of the two-layer base material 16, and thus can more firmly support the resist protruding portion 23.

[0168] Modified Example

[0169] Next, a modified example of the second embodiment will be described. In the following modified example, the same reference numerals are assigned to the same components and processes as those of the above-described second embodiment, and detailed description thereof will be omitted. In addition, the second embodiment and the modified example can be appropriately combined. Furthermore, the modified example can exert the same effects as the second embodiment except for the specifically described contents.

[0170] In the second embodiment, the resist end portion 21 has the resist base end portion 22 and the resist protruding portion 23 in the resist arrangement process, but for example, it can have the resist base end portion 22 without the resist protruding portion 23, for which illustration is omitted. In this modified example, the manufactured wiring circuit substrate assembly sheet 1 also has the conductor end portion 28.

[0171] In the second embodiment, the wiring circuit substrate assembly sheet 1 has the dummy wiring circuit substrate 11 and the conductor end portion 28, but for example, it can have the conductor end portion 28 without the dummy wiring circuit substrate 11, for which illustration is omitted.

[0172] If the wiring circuit substrate assembly sheet 1 has the conductor end portion 28, in the etching process, the etching liquid can be sufficiently retained at the resist end portion 21, and the turbulence of the etching liquid in the product area 4 can be suppressed.

[0173] Third Embodiment

[0174] Next, the third embodiment will be described with reference to Figure 8 A ~ Figure 2 C.

[0175] In the following third embodiment, the same reference numerals are assigned to the same components and processes as those of the above-described first to second embodiments, and detailed description thereof will be omitted. In addition, the first to third embodiments can be appropriately combined. Furthermore, the third embodiment can exert the same effects as the first to second embodiments except for the specifically described contents.

[0176] As shown in Figure 8 D, in the first embodiment, the dummy wiring circuit substrate 11 has the dummy wiring 13, but in the third embodiment, as shown in Figure 6 C, the dummy wiring circuit substrate 11 further has a dummy support substrate 32.

[0177] In the third embodiment, for example, in the manufacturing method of the wiring circuit substrate assembly sheet 1, as shown in Figure 6 B Figure 8 C, the dummy wiring 13 is formed, and then, as shown in Figure 8 A Figure 6 B, the dummy support substrate 32 is formed.

[0178] Specifically, in the third embodiment, the manufacturing method of the wiring circuit substrate assembly sheet 1 has two resist configuring processes, two etching processes, and two resist removing processes.

[0179] In detail, the manufacturing method of the wiring circuit substrate assembly sheet 1 has a substrate preparation process, a first resist configuring process as one example of a first process, a first etching process as one example of a second process, a first resist removing process, a base layer forming process, a covering process, a second resist configuring process as one example of a third process, a second etching process as one example of a fourth process, and a second resist removing process.

[0180] In the substrate preparation process, for example, as shown in Figure 6 A, first, a three-layer substrate 34 having a metal-based layer 30, a resin layer 33, and a conductor layer 15 is prepared.

[0181] The metal-based layer 30 is a sheet that forms the other side face in the thickness direction of the three-layer substrate 34. As the material of the metal-based layer 30, the metal-based material exemplified as the material of the metal-based layer 30 can be cited.

[0182] The resin layer 33 is disposed on the side face in the thickness direction of the metal-based layer 30. As the material of the resin layer 33, the resin exemplified in the support sheet 2 of the first embodiment can be cited.

[0183] The conductor layer 15 is disposed on the side face in the thickness direction of the resin layer 33, forming the side face in the thickness direction of the three-layer substrate 34.

[0184] As shown in Figure 6 B, in the first resist configuring process, the first resist coating layer 17 having the resist end portion 21 is disposed on the side face in the thickness direction and the other side face in the thickness direction of the three-layer substrate 34.

[0185] As shown in Figure 7 C, the first etching process etches the portions of the conductor layer 15 exposed from the resist product portion 18, the resist dummy portion 19, and the resist end portion 21, forming the wiring 9, the dummy wiring 13, and the conductor end portion 28.

[0186] As shown in Figure 7 A, in the first resist removing process, the first resist coating layer 17 is removed.

[0187] As shown in Figure 7 B, the resin layer 33 is patterned to form the base layer 8, the dummy base layer 12, and the base end portion 37. The base end portion 37 has a pattern corresponding to the conductor end portion 28.

[0188] As shown in Figure 8 C, in the covering step, the covering layer 10 is provided.

[0189] As shown in Figure 8 A, in the second resist providing step, the second resist coating layer 29 is provided to the metal layer 30. The second resist coating layer 29 has the second resist product portion 38 corresponding to the support substrate 31, the second resist dummy portion 39 corresponding to the dummy support substrate 32, and the resist end portion 21.

[0190] The second resist product portion 38 is provided to the surface of the metal layer 30 on the other side in the thickness direction, and has the same pattern as the support substrate 31 (see Figure 8 B) when viewed from above.

[0191] The second resist dummy portion 39 is provided to the surface of the metal layer 30 on the other side in the thickness direction and the surface of the dummy base layer 12 on the one side in the thickness direction, and has the same pattern as the dummy support substrate 32 (see Figure 8 B) when viewed from above.

[0192] The resist end portion 21 integrally has the resist base end portion 22 and the resist protruding portion 23.

[0193] As shown in Figure 8 B, in the second etching step, the portion of the metal layer 30 exposed from the second resist coating layer 29 (the base layer 8 and the covering layer 10) is etched to form the support substrate 31, the dummy support substrate 32, and the support substrate end portion 36. The support substrate end portion 36 has the same shape as the conductor end portion 28 when viewed from above.

[0194] As shown in Figure 8 C, in the second resist removing step, the second resist coating layer 29 is removed.

[0195] Thus, the wiring circuit substrate assembly sheet 1 having the wiring circuit substrate 3, the dummy wiring circuit substrate 11, the conductor end portion 28, and the support substrate end portion 36 is obtained.

[0196] In the manufacturing of the wiring circuit substrate assembly sheet 1 of the third embodiment, the second resist coating 29 corresponding to the support substrate 31 and the dummy support substrate 32 is provided to the metal-based layer 30. Also, when the etching liquid reaches the second region 7 from the first region 6, although the etching liquid falls and turbulence is generated, the precision of the dummy support substrate 32 is reduced, but the influence of the turbulence of the etching liquid on the wiring circuit substrate 3 is reduced, so that the reduction in the precision of the support substrate 31 can be suppressed. Therefore, in the wiring circuit substrate assembly sheet 1, the reliability of the support substrate 31 is excellent.

[0197] In addition, in the wiring circuit substrate assembly sheet 1, the wiring circuit substrate assembly sheet 1 has an elongated shape, and the metal-based layer 30 provided with the second resist coating 29 is transported in the longitudinal direction, and the wiring circuit substrate assembly sheet 1 is etched to be manufactured.

[0198] In the second etching process, the etching liquid falls from both ends in the width direction of the wiring circuit substrate assembly sheet 1, so that turbulence of the etching liquid is generated at both ends in the width direction.

[0199] However, since the both ends in the width direction included in the second region 7 and the resist projection 23 projecting from both ends in the width direction to both outer sides in the width direction are provided to form the support substrate end portion 36, in the above etching, even if turbulence is generated, the product region 4 is not easily affected. Therefore, the wiring circuit substrate 3 having excellent reliability can be manufactured. That is, the dimensional precision of the support substrate 31 corresponding to the resist product portion 18 is excellent.

[0200] In addition, in the second etching process, as shown in FIG. 8, the place where turbulence of the etching liquid is easily generated can be distanced from the resist product portion 18 by the resist projection 23. Industrial applicability A

[0201] Thus, the influence of the turbulence of the etching liquid can be reduced at the resist product portion 18.

[0202] In addition, the resist base end portion 22 supports the resist projection 23. The resist base end portion 22 is provided to both sides in the thickness direction of the three-layer base material 34, so that the resist projection 23 can be more firmly supported.

[0203] Modified Examples

[0204] Next, a modified example of the third embodiment will be described. In each of the following modified examples, the same reference numerals are assigned to the same members and processes as those of the above-described third embodiment, and detailed description thereof will be omitted. In addition, the first to third embodiments and each of the modified examples can be appropriately combined. Also, each of the modified examples can have the same effects as the third embodiment except for the specifically described contents.

[0205] In the third embodiment, dummy supporting substrates 32 and dummy wiring 13 are formed. In the first embodiment, dummy wiring 13 is formed.

[0206] In this modification, dummy supporting substrates 32 can be formed without forming dummy wiring 13, and this is not illustrated.

[0207] Further, the above-described application is provided as an example of an embodiment of the present application, but this is merely an example and cannot be interpreted limitatively. Modification examples of the present application that can be obvious to those skilled in the art are included in the above-described claims.

[0208] Explanation of reference signs

[0209] The wiring circuit substrate assembly sheet can be applied to various uses.

[0210] ​

[0211] 1, wiring circuit substrate assembly sheet; 2, supporting sheet; 3, wiring circuit substrate; 4, product area; 5, excess area; 6, first region; 7, second region; 9, wiring; 11, dummy wiring circuit substrate; 13, dummy wiring; 15, conductor layer; 17, first resist coating layer; 28, conductor end portion; 29, second resist coating layer; 30, metal layer; 31, supporting substrate; 32, dummy supporting substrate.

Claims

1. A wiring circuit board assembly sheet, characterized in that: The wiring circuit board assembly sheet is divided into a product area in which a plurality of wiring circuit boards as products are arranged and a margin area surrounding the product area, wherein the margin area includes a first region adjacent to the product area and a second region located on the opposite side of the product area relative to the first region. The wired circuit board assembly sheet includes a dummy wired circuit board, which is arranged in at least a portion of the first region and is smaller than the wired circuit board. The first area is divided into a frame shape surrounding the product area, A plurality of the dummy wiring circuit substrates are arranged in a row at intervals along a frame forming the first region.

2. The wired circuit board assembly sheet according to claim 1, wherein The wiring circuit substrate has wiring including a conductor layer. The dummy wiring circuit substrate includes dummy wiring including the conductor layer.

3. The wired circuit board assembly sheet according to claim 2, wherein: The wired circuit board assembly sheet has an elongated shape and has two end portions in a width direction perpendicular to the longitudinal direction, and the two end portions in the width direction are included in the second region. The wired circuit board assembly sheet has conductor end portions that are arranged at both end portions in the width direction and include the conductor layer.

4. The wired circuit board assembly sheet according to claim 1, wherein The wiring circuit substrate has a supporting substrate including a metal layer. The dummy wiring circuit substrate includes a dummy support substrate including the metal-based layer.

5. The wired circuit board assembly sheet according to claim 4, wherein The wired circuit board assembly sheet has an elongated shape and has two end portions in a width direction perpendicular to the longitudinal direction, and the two end portions in the width direction are included in the second region. The wired circuit board assembly sheet has metal end portions, the metal end portions are arranged at both end portions in the width direction, and have the metal layer.

6. The wired circuit board assembly sheet according to claim 1, wherein The wiring circuit substrate has wiring including a conductor layer. The wired circuit board assembly sheet has an elongated shape and has two end portions in a width direction perpendicular to the longitudinal direction, and the two end portions in the width direction are included in the margin region. The wired circuit board assembly sheet has conductor end portions that are arranged at both ends in the width direction and include the conductor layer.

7. The wired circuit board assembly sheet according to claim 1, wherein The wiring circuit substrate has a supporting substrate including a metal layer. The wired circuit board assembly sheet has an elongated shape and has two end portions in a width direction perpendicular to the longitudinal direction, and the two end portions in the width direction are included in the margin region. The wired circuit board assembly sheet has metal end portions, the metal end portions are arranged at both end portions in the width direction, and have the metal layer.

8. A method for manufacturing a wiring circuit board assembly sheet, characterized in that: This is the method for manufacturing the wired circuit board assembly sheet according to claim 2, This method has: a first step of disposing a first anti-corrosion coating layer on the conductor layer so as to correspond to the wiring and the dummy wiring; as well as In the second step, the portion of the conductor layer exposed from the first anti-corrosion coating layer is etched to form the wiring and the dummy wiring.

9. The method for producing a wired circuit board assembly sheet according to claim 8, wherein: The conductive layer is conveyed along the conveying direction in the second step and has two end portions in a width direction perpendicular to the conveying direction, and the two end portions in the width direction are included in the second region. In the first step, the first corrosion-resistant coating is formed so as to cover the surfaces of the conductor layer at both ends in the width direction on one side in the thickness direction and protrude from both ends in the width direction of the conductor layer toward both outer sides in the width direction.

10. A method for manufacturing a wiring circuit board assembly sheet, characterized in that: This is the method for producing a wired circuit board assembly sheet according to claim 4, This method has: a third step of disposing a second anti-corrosion coating layer on the metal-based layer so as to correspond to the support substrate and the dummy support substrate; as well as The fourth step is to etch the portion of the metal-based layer exposed from the second anti-corrosion coating layer to form the support substrate and the dummy support substrate.

11. The method for producing a wired circuit board assembly sheet according to claim 10, wherein: The metal-based layer is conveyed along the conveying direction in the fourth step and has two end portions in a width direction perpendicular to the conveying direction, and the two end portions in the width direction are included in the second region. In the third step, the second corrosion-resistant coating is formed in such a manner that the second corrosion-resistant coating covers the surface of one side of the thickness direction of the two end portions in the width direction of the metal layer and protrudes from the two end portions in the width direction to both outer sides in the width direction.

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