Silicon wafer transfer tooling

Abstract

The present invention provides a silicon wafer transfer tool, which relates to the field of semiconductor technology. The silicon wafer transfer tool includes a support platform and a base, the base being mounted on the top plate of the support platform, the support platform being equipped with an adjustment assembly connected to the base for adjusting the position of the base on the support platform; the base being equipped with a drive assembly, the drive end of which is connected to a carrier for carrying silicon wafers. The adjustment assembly in the silicon wafer transfer tool can improve the position and horizontality accuracy of the base and its drive assembly and carrier mounted on the support platform, thereby ensuring the accuracy of the drive assembly and carrier in the silicon wafer transfer stroke, and further ensuring the accuracy of the second station's photolithography and other processing of the silicon wafer, thereby improving the processing quality of chip products.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a silicon wafer transfer tool. Background Art

[0002] Silicon wafers, the carriers of microelectronic chips, can hold a vast number of electronic components within their tiny size, enabling incredible computing power. However, during chip processing, silicon wafers must be transported between different devices. However, existing transfer tooling suffers from poor transfer accuracy, impacting chip processing quality. Summary of the Invention

[0003] The purpose of the present invention includes providing a silicon wafer transfer tool to solve the technical problem that the transfer accuracy of the existing transfer tool is poor, thereby affecting the processing quality of the chip.

[0004] In order to solve the above problems, the present invention provides a silicon wafer transfer tooling, comprising a support platform and a base, wherein the base is installed on the top plate of the support platform, the support platform is installed with an adjustment component, and the adjustment component is connected to the base for adjusting the position of the base on the support platform; the base is installed with a driving component, and the driving end of the driving component is connected to a carrier for carrying silicon wafers.

[0005] Optionally, the adjustment assembly includes a first adjustment component, the first adjustment component includes a push bolt and a locking bolt, the top plate is provided with an adjustment area, the adjustment area is provided with a push threaded hole and a locking threaded hole, the base is provided with a locking hole corresponding to the locking threaded hole, the stud of the locking bolt passes through the locking hole from the top and is threadedly connected to the locking threaded hole, and the screw head of the locking bolt is blocked outside the locking hole; the stud of the push bolt is threadedly connected to the push threaded hole from the bottom, and the end extending from the push threaded hole is pressed against the bottom of the base;

[0006] The first adjustment components, the adjustment areas and the locking holes are all in multiple groups and correspond one to one, and the multiple adjustment areas are non-collinearly arranged.

[0007] Optionally, the first adjustment component further includes a first micrometer knob, the top plate is provided with a receiving groove on the top surface of the adjustment area, the first micrometer knob is mounted on the bottom of the top plate, and the measuring part of the first micrometer knob is accommodated in the receiving groove.

[0008] Optionally, the adjustment assembly further includes a second adjustment component, the second adjustment component including a first connecting seat, an adjusting bolt, and an adjusting nut, the first connecting seat being fixed to a position of the top plate on a side of the base, the first connecting seat being provided with a connecting hole, the stud of the adjusting bolt passing through the connecting hole and connected to a side wall of the base; the adjusting nut being threadedly connected to the adjusting bolt, and the adjusting nut being located between the first connecting seat and the screw head of the adjusting bolt;

[0009] There are two second adjusting components, and the two second adjusting components are arranged at intervals along the length direction of the base.

[0010] Optionally, the second adjusting component also includes a fixing bolt, and the top plate is provided with a fixing threaded hole; the first connecting seat includes a first connecting part and a second connecting part provided on the top of the first connecting part, the connecting hole is provided in the second connecting part, and the first connecting part is provided with a waist-shaped hole, and the length direction of the radial cross-section of the waist-shaped hole is toward the base, and the fixing bolt passes through the waist-shaped hole and is threadedly connected to the fixing threaded hole.

[0011] Optionally, the second adjustment component further includes a second connecting seat and a second micrometer knob installed on the second connecting seat, the second connecting seat is located on the side of the base, and the measuring part of the second micrometer knob faces the side wall of the base.

[0012] Optionally, the driving assembly includes a linear motor, a cable assembly and a robotic arm, a top surface of the base is provided with a guide rail, and the guide rail, the stator of the linear motor, the cable assembly and the base are in the same length direction;

[0013] The first end of the robotic arm is a mounting portion, which is connected to the mover of the linear motor, and the robotic arm extends along the length direction of the base. A slider is provided at the bottom of the mounting portion, and the slider is slidably engaged with the guide rail. The supporting member is fixed to the second end of the robotic arm; the cable assembly is installed on the base for powering the mover.

[0014] Optionally, the carrier includes a wafer fork, a top surface of the wafer fork is provided with a plurality of positioning posts, a contour formed by the arrangement of the plurality of positioning posts corresponds to a contour of the silicon wafer, and one of the positioning posts matches a positioning groove on an edge of the silicon wafer;

[0015] And / or, the blade fork is provided with a plurality of bearing areas, the plurality of bearing areas are coplanar, and at least one of the bearing areas is provided with a vacuum suction cup.

[0016] Optionally, the silicon wafer transfer tooling further includes a controller and a grating ruler, the scale grating of the grating ruler is mounted on the base, and the length direction of the scale grating is consistent with the length direction of the base; the reading head of the grating ruler is mounted on the robotic arm, and the reading head and the drive assembly are both connected to the controller.

[0017] Optionally, a limit buffer is provided at each end of the base in the length direction, and the two limit buffers are respectively used to limit and buffer the positions of the two ends of the mounting portion.

[0018] Optionally, a plurality of vibration isolators are detachably fixed to the bottom of the support platform, and the plurality of vibration isolators are supported on the bottom of the support platform and are non-collinearly arranged.

[0019] Optionally, a plurality of telescopic supporting legs are installed at the bottom of the support platform and are pivotally connected to a plurality of rollers, and the plurality of rollers correspond one-to-one to the plurality of telescopic supporting legs.

[0020] The silicon wafer transfer tooling provided by the present invention can transfer silicon wafers from a first workstation to a second workstation, wherein the adjustment component can effectively improve the position and horizontal accuracy of the base and the drive component and the carrier installed on the support table, thereby ensuring the accuracy of the drive component and the carrier for the silicon wafer transfer stroke, and further ensuring the accuracy of the second workstation's photolithography and other processing of the silicon wafer, thereby improving the processing quality of the chip products. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the silicon wafer transfer tooling provided by the present invention from a first perspective;

[0023] Figure 2 for Figure 1 A partial enlarged view of middle A;

[0024] Figure 3 A schematic diagram of the silicon wafer transfer tooling provided by the present invention from a second perspective;

[0025] Figure 4 A partial cross-sectional schematic diagram of the first adjusting component installed between the top plate and the base in the silicon wafer transfer tooling provided by the present invention;

[0026] Figure 5 This is a schematic diagram of the drive assembly of the silicon wafer transfer tool provided by the present invention being installed on the base;

[0027] Figure 6 for Figure 5 A partial enlarged view of B in the middle;

[0028] Figure 7 for Figure 5 Schematic diagram of removing the silicon wafer;

[0029] Figure 8 for Figure 7 Schematic diagram of removing the robotic arm, fork, and cable assembly.

[0030] Description of reference numerals:

[0031] 100-support platform; 110-top plate; 111-top threaded hole; 112-locking threaded hole; 113-accommodating groove; 120-bracket; 130-bottom plate; 140-telescopic support foot; 150-roller; 160-vibration isolator; 200-base; 210-locking hole; 220-guide rail; 230-first limit buffer; 240-second limit buffer; 300-drive assembly; 310-linear motor; 311-stator; 312-mover; 320-mounting part; 330-slider; 340-first limit block; 350-second limit block; 360-robotic arm; 370-cable assembly; 380 -connector; 400-fork; 410-positioning column; 420-bearing area; 430-vacuum suction cup; 500-first adjusting component; 510-retaining bolt; 520-locking bolt; 530-first micrometer knob; 600-second adjusting component; 610-first connecting seat; 611-connecting hole; 612-first connecting part; 613-second connecting part; 614-waist-shaped hole; 620-adjusting bolt; 630-adjusting nut; 640-fixing bolt; 650-second connecting seat; 660-second micrometer knob; 710-scale grating; 720-reading head; 800-silicon wafer; 810-positioning groove. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0033] This embodiment provides a silicon wafer transfer tool, such as Figures 1-4 As shown, it includes a support platform 100 and a base 200. The base 200 is installed on the top plate 110 of the support platform 100. The support platform 100 is installed with an adjustment component, which is connected to the base 200 and is used to adjust the position of the base 200 on the support platform 100; the base 200 is installed with a driving component 300, and the driving end of the driving component 300 is connected to a carrier for carrying the silicon wafer 800.

[0034] The silicon wafer transfer tooling provided in this embodiment includes a support table 100 for supporting various components, a base 200 serving as a mounting base, a carrier for carrying the silicon wafer 800, a drive assembly 300 for driving the carrier to move to transfer the silicon wafer 800, and an adjustment assembly for adjusting the position of the base 200 to improve the transfer accuracy of the drive assembly 300 on the silicon wafer 800.

[0035] Initially, the wafer transfer tool is located between the first station and the second station, such as Figure 1 As shown, the adjustment assembly adjusts the X-Y-Z position of the base 200 relative to the top plate 110 of the support platform 100 to achieve the set position (XY direction) and levelness (Z direction) requirements. Accordingly, the position and levelness of the drive assembly 300 and the carrier on the base 200 are both adjusted to meet the requirements. When transporting a silicon wafer 800, the drive assembly 300 can drive the carrier to accurately reach the starting position corresponding to the first station. After the carrier carries the silicon wafer 800, the drive assembly 300 drives the carrier to move the silicon wafer 800 to the end position corresponding to the second station, removes the silicon wafer 800, and completes the transport of the silicon wafer 800. Subsequently, the drive assembly 300 can drive the unloaded carrier back to the starting position to transport the next silicon wafer 800. Among them, the adjustment component can effectively improve the position and horizontal accuracy of the base 200 and the driving component 300 and the carrier installed on the support platform 100, thereby ensuring the accuracy of the driving component 300 and the carrier's transmission stroke of the silicon wafer 800, and then ensuring the second station's photolithography and other processing accuracy of the silicon wafer 800, thereby improving the processing quality of the chip product.

[0036] Specifically, if Figure 1 As shown, the width direction of the base 200 is consistent with the X direction, the length direction of the base 200 is consistent with the Y direction, and the height direction of the base 200 is consistent with the Z direction.

[0037] Specifically, in this embodiment, Figure 3 and Figure 4As shown, the adjustment assembly may include a first adjustment component 500, the first adjustment component 500 includes a top bolt 510 and a locking bolt 520, the top plate 110 is provided with an adjustment area, the adjustment area is provided with a top threaded hole 111 and a locking threaded hole 112, the base 200 is provided with a locking hole 210 corresponding to the locking threaded hole 112, the stud of the locking bolt 520 passes through the locking hole 210 from the top and is threadedly connected to the locking threaded hole 112, and the screw head of the locking bolt 520 is blocked outside the locking hole 210; the stud of the top bolt 510 is threadedly connected to the top threaded hole 111 from the bottom, and the end extending out of the top threaded hole 111 is pressed against the bottom of the base 200; the first adjustment component 500, the adjustment area and the locking hole 210 are all multiple groups and correspond one to one, and the multiple adjustment areas are non-collinearly arranged. The first adjusting component 500 is used to adjust the horizontality of the base 200. Specifically, the base 200 is arranged on the top surface of the top plate 110. The top end of the pushing bolt 510 can push the base 200 upward. The locking bolt 520 is connected between the base 200 and the top plate 110 and can press the base 200 downward. The pushing bolt 510 and the locking bolt 520 can limit the bottom and top positions of the base 200 respectively, thereby adjusting and limiting the Z-direction position of the base 200 relative to the top plate 110. Multiple groups of non-collinear pushing bolts 510 and locking bolts 520 adjust different parts of the base 200, thereby realizing the adjustment of the horizontality of the base 200. Specifically, during adjustment, the locking bolt 520 can be loosened, and then the push bolt 510 can be adjusted. After the top position of the push bolt 510 is determined, the locking bolt 520 can be tightened downward. As the locking bolt 520 is screwed into the locking threaded hole 112, the distance between the base 200 and the top plate 110 is continuously reduced, and the bottom surface of the base 200 abuts against the top of the push bolt 510. At this time, the screw head of the locking bolt 520 presses the top surface of the base 200 downward, thereby completing the position adjustment of the base 200 in the Z direction. Of course, in other embodiments, the first adjustment component 500 can also adopt other forms, which can realize the relative position adjustment of the base 200 and the top plate 110 in the Z direction. Specifically, as Figure 3 As shown, there may be three first adjustment components 500 .

[0038] In this embodiment, Figure 3 and Figure 4As shown, the first adjustment component 500 can also include a first micrometer knob 530, and the top plate 110 is provided with a receiving groove 113 on the top surface of the adjustment area. The first micrometer knob 530 is installed at the bottom of the top plate 110, and the measuring part of the first micrometer knob 530 is accommodated in the receiving groove 113. The first micrometer knob 530 is installed on the top plate 110, and the measuring part of the first micrometer knob 530 is located in the receiving groove 113. When the first micrometer knob 530 is rotated, the length of the measuring part extending upward changes, thereby measuring and locating the position of the bottom surface of the base 200 in the Z direction; when adjusting, the locking bolt 520 can be loosened, and multiple first micrometer knobs 530 can be rotated to ensure that the height of the top of their measuring parts is consistent, and then the top bolt 510 can be adjusted so that the top bolt 510 is the same height as the top of the first micrometer knob 530 in the same adjustment area, and then the locking bolt 520 can be tightened downward, thereby achieving high-precision adjustment of the Z-direction height of the base 200, and correspondingly achieving high-precision adjustment of the horizontality of the base 200.

[0039] In this embodiment, Figure 1-Figure 3 As shown, the adjustment assembly also includes a second adjustment component 600, which includes a first connecting seat 610, an adjusting bolt 620 and an adjusting nut 630. The first connecting seat 610 is fixed to the top plate 110 at the side of the base 200. The first connecting seat 610 is provided with a connecting hole 611. The stud of the adjusting bolt 620 passes through the connecting hole 611 and is connected to the side wall of the base 200; the adjusting nut 630 is threadedly connected to the adjusting bolt 620, and the adjusting nut 630 is located between the first connecting seat 610 and the screw head of the adjusting bolt 620; there are two second adjustment components 600, and the two second adjustment components 600 are arranged at intervals along the length direction of the base 200. The second adjustment component 600 is located on the side of the base 200. During adjustment, the adjustment nut 630 can be rotated. The adjustment bolt 620 is restrained by the connection hole 611 and the base 200 and cannot rotate. Therefore, the rotation of the adjustment nut 630 can drive the adjustment bolt 620 to move axially, thereby causing the base 200 to move in the XY plane. Accordingly, the two second adjustment components 600 are positioned at different locations along the length of the base 200 to adjust the base 200 in the X-Y direction (i.e., Rz). Specifically, the ends of the adjustment bolts 620 can be threaded or clamped to the sidewall of the base 200.

[0040] Of course, in other embodiments, the second adjusting component 600 can also adopt other forms, such as the second adjusting component 600 includes a first connecting seat 610 and an adjusting bolt 620, the screw of the adjusting bolt 620 is threadedly connected to the first connecting seat 610, and the end of the screw is pivotally connected to the base 200. During adjustment, the screw can be rotated to adjust the distance between the first connecting seat 610 and the base 200, and correspondingly achieve the position adjustment of the base 200 in the X-Y direction.

[0041] In this embodiment, Figure 2 and Figure 3 As shown, the second adjustment component 600 can also include a fixing bolt 640, and the top plate 110 is provided with a fixing threaded hole; the first connecting seat 610 includes a first connecting part 612 and a second connecting part 613 arranged on the top of the first connecting part 612, the connecting hole 611 is arranged in the second connecting part 613, and the first connecting part 612 is provided with a waist-shaped hole 614, and the length direction of the radial cross-section of the waist-shaped hole 614 is toward the base 200, and the fixing bolt 640 passes through the waist-shaped hole 614 and is threadedly connected to the fixing threaded hole. When installing the first connecting base 610, the fixing bolt 640 passes through the waist-shaped hole 614 and is threadedly connected to the fixing threaded hole. Since the length direction of the radial cross-section of the waist-shaped hole 614 extends along the X direction, the X-axis position of the first connecting base 610 can be adjusted within the length range of the waist-shaped hole 614, and the fixing bolt 640 can be used to connect the first connecting base 610 to the top plate 110. Accordingly, the X-Y axis position of the base 200 can be roughly adjusted. After the position of the first connecting base 610 is fixed, the X-Y axis position of the base 200 can be further fine-tuned by adjusting the bolt 620, thereby increasing the adjustment range of the second adjustment component 600 for the X-Y axis position of the base 200 and ensuring its adjustment accuracy. Specifically, each second adjustment component 600 can have two waist-shaped holes 614, and the two waist-shaped holes 614 are located on both sides of the first connecting portion 612 in the Y direction. Accordingly, there are also two fixing threaded holes and fixing bolts 640. Specifically, the two second adjustment components 600 can be located on the same side of the base 200 in the width direction and arranged at intervals along the length direction of the base 200; the two second adjustment components 600 can also be located on both sides of the base 200 in the width direction and arranged at intervals along the length direction of the base 200.

[0042] Optionally, in this embodiment, if Figure 1 and Figure 2As shown, the second adjustment component 600 may further include a second connecting base 650 and a second micrometer knob 660 mounted on the second connecting base 650. The second connecting base 650 is located on the side of the base 200, and the measuring portion of the second micrometer knob 660 faces the side wall of the base 200. The second micrometer knob 660 is used to measure the position of the side of the base 200. Each second micrometer knob 660 corresponds to an adjustment bolt 620. During adjustment, the second micrometer knob 660 can be rotated to move the end of the measuring portion of the second micrometer knob 660 toward or away from the side of the base 200. When the end position of the measuring portion is determined, the adjustment nut 630 in the same group is rotated, and the adjustment bolt 620 pulls the side of the base 200 to move in the X direction until the side wall of the base 200 abuts the end of the measuring portion. After the two second adjustment components 600 are adjusted, the X-Y position of the base 200 is adjusted. Preferably, the two second micrometer knobs 660 can be located on the same side of the base 200 in the width direction, and the two micrometer knobs are located at both ends of the length direction of the base 200, and the two adjusting bolts 620 are respectively located at both ends of the length direction of the base 200 and between the two second micrometer knobs 660.

[0043] It should be noted that when the base is adjusted using the adjustment assembly, the adjustment order of the first adjustment component and the second adjustment component can be adjusted according to actual conditions, and this application does not limit this.

[0044] Optionally, in this embodiment, if Figure 7As shown, the drive assembly 300 may include a linear motor 310, a cable assembly 370 and a robotic arm 360. The top surface of the base 200 is provided with a guide rail 220, and the length directions of the guide rail 220, the stator 311 of the linear motor 310, the cable assembly 370 and the base 200 are consistent; the first end of the robotic arm 360 is a mounting portion 320, the mounting portion 320 is connected to the mover 312 of the linear motor 310, and the robotic arm 360 extends along the length direction of the base 200, and a slider 330 is provided at the bottom of the mounting portion 320, the slider 330 is slidably engaged with the guide rail 220, and the bearing member is fixed to the second end of the robotic arm 360; the cable assembly 370 is installed on the base 200 for powering the mover 312. Specifically, the cable assembly 370 may include a cable drag chain and a cable, and the cable drag chain can drive the cable to move along its length direction to power the mover 312. This is a specific form of the drive component 300. When the silicon wafer 800 needs to be transported, the linear motor 310 is turned on, and the mover 312 moves along the length direction of the stator 311 and drives the robotic arm 360 and the carrier to move synchronously with it through the mounting portion 320. Accordingly, the carrier drives the silicon wafer 800 to be transported along the length direction of the stator 311. The robotic arm 360 is made of rigid material, and the deformation of the robotic arm 360 in its length direction is small, thereby ensuring the position accuracy of the robotic arm 360 in the length direction. On the basis of realizing the large-stroke transmission of the silicon wafer by the drive component, the transmission position accuracy of the silicon wafer by the drive component can be ensured. During the transmission process, the slider 330 can slide along the length direction of the guide rail 220, thereby guiding and limiting the movement stroke of the mounting part 320, so as to improve the movement position accuracy of the robot arm 360 and the carrier, and correspondingly improve the position accuracy of the drive component 300 in transmitting the silicon wafer 800; in addition, the slider 330 can support the robot arm 360 and the carrier through the mounting part 320, so as to reduce the load of the mover 312 supporting the above components, thereby ensuring the coordinated transmission of the mover 312 and the stator 311.

[0045] Specifically, in this embodiment, Figure 5 and Figure 6As shown, the carrier can include a wafer fork 400, with a plurality of positioning posts 410 disposed on its top surface. The contour formed by the plurality of positioning posts 410 corresponds to the contour of the silicon wafer 800, and one of the positioning posts 410 mates with a positioning groove 810 on the edge of the silicon wafer 800. This is a specific form of the carrier. When the wafer fork 400 carries the silicon wafer 800, the edge of the wafer 800 can be brought into contact with the limiting groove formed by the plurality of positioning posts 410, and the positioning groove 810 on the edge of the silicon wafer 800 can be engaged with a corresponding positioning post 410, thereby securing the position of the silicon wafer 800 on the wafer fork 400. This improves the positioning accuracy and stability of the wafer 800 during transport by the wafer fork 400, and reduces the risk of the wafer 800 shaking or even falling off the wafer fork 400. Specifically, the wafer fork 400 can be connected to the robotic arm 360 via a joint 380.

[0046] Optionally, in this embodiment, if Figure 7 As shown, multiple supporting areas 420 can be provided on the slice fork 400. The multiple supporting areas 420 are coplanar, and at least one supporting area 420 is provided with a vacuum suction cup 430. When the silicon wafer 800 is placed on the slice fork 400, the bottom surface of the silicon wafer 800 can be coplanarly aligned with the multiple supporting areas 420. The multiple supporting areas 420 provide support to different areas of the silicon wafer 800 in a dispersed manner, thereby improving the levelness of the silicon wafer 800 when placed on the slice fork 400 and reducing the contact between the entire top surface of the silicon wafer 800 and the slice fork 400, which can easily cause the silicon wafer 800 to tilt. In addition, after the silicon wafer 800 is placed on the slice fork 400, the vacuum suction cup 430 can be activated to firmly suck the silicon wafer 800, thereby improving the stability of the slice fork 400 in supporting the silicon wafer 800 and further reducing the possibility of the silicon wafer 800 shifting relative to the slice fork 400 or even falling off. Specifically, there may be three carrying areas 420, two of which are located at the ends of the two arms of the fork 400, and another carrying area 420 is located at the connection between the two arms. The vacuum suction cup 430 may be provided in the carrying area 420 at the connection.

[0047] In this embodiment, the silicon wafer transfer tooling may further include a controller and a grating ruler. The scale grating 710 of the grating ruler is mounted on the base 200, and the length direction of the scale grating 710 is consistent with the length direction of the base 200. The reading head 720 of the grating ruler is mounted on the robotic arm 360, and the reading head 720 and the drive assembly 300 are both connected to the controller. The grating ruler can calibrate the position of the mover 312 in the Y direction. When the reading head 720 moves synchronously with the mover 312, it can read the scale of the grating ruler and transmit the scale signal to the controller. The controller accordingly obtains the transfer position of the carrier to the silicon wafer 800. When the carrier reaches the starting position or the end position, the controller controls the drive assembly 300 to close, thereby realizing intelligent recognition and control of the Y-direction transfer position of the drive assembly 300, effectively improving the position accuracy of the drive assembly 300 in transferring the silicon wafer 800. The end of the scale grating 710 may be provided with a soft limit. When the reading head 720 recognizes the soft limit mark, the limit signal is transmitted to the controller, and the controller controls the driving component 300 to be closed.

[0048] It should be noted that the connection relationship between the controller and the drive component 300, the reading head 720, etc. falls within the scope of protection of this application, and the setting of the relevant control program in the controller belongs to the existing technology and does not constitute an improvement of this application.

[0049] Optionally, in this embodiment, if Figure 7 and Figure 8 As shown, a limit buffer can be provided at each end of the length direction of the base 200, and the two limit buffers are used to limit and buffer the positions of the two ends of the mounting portion 320. The two limit buffers are set as the first limit buffer 230 and the second limit buffer 240, respectively. The mover 312 drives the mounting portion 320 to move synchronously with it along the length direction of the stator 311, and the two ends of the moving stroke of the mover 312 relative to the stator 311 are the first position and the second position respectively. When the mover 312 moves to the first position, the mounting portion 320 abuts against the first limit buffer 230, and the first limit buffer 230 limits the mounting portion 320 from continuing to move, which correspondingly limits the mover 312 relative to the stator 311. 1 continues to move, thereby reducing the occurrence of the mover 312 being separated from the stator 311, and correspondingly ensuring the coordinated transmission of the mover 312 and the stator 311; similarly, when the mover 312 moves to the second position, the mounting portion 320 abuts against the second limiting buffer 240, and the second limiting buffer 240 limits the mounting portion 320 from continuing to move, and correspondingly limits the mover 312 from continuing to move relative to the stator 311, thereby reducing the occurrence of the mover 312 being separated from the stator 311, and correspondingly ensuring the coordinated transmission of the mover 312 and the stator 311.

[0050] Specifically, if Figure 8As shown, a first limiting block 340 and a second limiting block 350 can be fixedly installed at the bottom of the mounting portion 320, and the first limiting block 340 and the second limiting block 350 are arranged along the length direction of the base 200, wherein the first limiting block 340 is close to the first limiting buffer 230, and the second limiting block 350 is close to the second limiting buffer 240. When the mover 312 drives the mounting portion 320 to move synchronously with it, the first limiting block 340 and the second limiting block 350 move synchronously with the mounting portion 320. When the mover 312 moves to the first position, the first limiting block 340 abuts against the first limiting buffer 230, thereby achieving braking and limiting of the first-direction movement of the mover 312; when the mover 312 moves to the second position, the second limiting block 350 abuts against the second limiting buffer 240, thereby achieving braking and limiting of the second-direction movement of the mover 312.

[0051] Optionally, in this embodiment, if Figure 3 As shown, a plurality of vibration isolators 160 can be installed at the bottom of the support platform 100. The plurality of vibration isolators 160 are supported on the bottom of the support platform 100 and are arranged non-collinearly. During the process of the drive assembly 300 transporting the silicon wafer 800, the vibration isolators 160 can effectively block the vibration transmitted from the ground to the drive assembly 300, thereby reducing the impact of the vibration of the drive assembly 300 on the position accuracy of the silicon wafer 800, and correspondingly further improving the position accuracy of the silicon wafer transport tooling for the silicon wafer 800. Specifically, as Figure 3 As shown, there may be three vibration isolators 160 .

[0052] Specifically, if Figure 1 and Figure 3As shown, the support platform 100 may include a top plate 110, a bottom plate 130, and a bracket 120 connected between the top plate 110 and the bottom plate 130, wherein the vibration isolator 160 is installed at the bottom of the bottom plate 130; the bracket 120 may include at least three supporting beams, the bottom of the supporting beam extends downward from the bottom plate 130, and the bottom end of each supporting beam is installed with a telescopic supporting foot 140 and pivotally connected to a roller 150. When the silicon wafer conveying tool needs to convey the silicon wafer 800, the vibration isolator 160 is installed on the bottom plate 130, and the telescopic supporting foot 140 is retracted upward, and the telescopic supporting foot 140 and the roller 150 are pivotally connected. 0 is higher than the bottom of the vibration isolator 160, so the vibration isolator 160 can support and isolate the bottom plate 130. When there is no need to transport the silicon wafer 800, the telescopic support leg 140 can be extended downward until the bottom of the telescopic support leg 140 is lower than the roller 150 and the vibration isolator 160, and the telescopic support leg 140 supports the support platform 100. When the support platform 100 needs to be moved, the vibration isolator 160 can be removed and the telescopic support leg 140 can be retracted upward. The roller 150 contacts the ground to support the support platform 100, pushing the support platform 100. The rotation of the roller 150 drives the support platform 100 to move. The provision of the telescopic support leg 140 and the roller 150 can greatly improve the convenience of use of the silicon wafer transport tooling.

[0053] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0054] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A silicon wafer transfer tool, characterized in that: The invention comprises a support platform (100) and a base (200), wherein the base (200) is mounted on a top plate (110) of the support platform (100), and the support platform (100) is equipped with an adjustment component, wherein the adjustment component is connected to the base (200) and is used to adjust the position of the base (200) on the support platform (100); the base (200) is equipped with a driving component (300), and a driving end of the driving component (300) is connected to a bearing member for bearing a silicon wafer (800); The adjusting assembly comprises a first adjusting component (500) and a second adjusting component (600), the first adjusting component (500) comprises a top bolt (510) and a locking bolt (520), the top plate (110) is provided with an adjusting area, the adjusting area is provided with a top threaded hole (111) and a locking threaded hole (112), the base (200) is provided with a locking hole (210) corresponding to the locking threaded hole (112), the stud of the locking bolt (520) passes through the locking threaded hole (111) from the top, and the locking bolt (520) is provided with a locking hole (210) corresponding to the locking threaded hole (112). The hole (210) is threadedly connected to the locking threaded hole (112), and the screw head of the locking bolt (520) is blocked outside the locking hole (210); the stud of the abutting bolt (510) is threadedly connected to the abutting threaded hole (111) from the bottom, and the end extending out of the abutting threaded hole (111) abuts against the bottom of the base (200); the first adjusting component (500), the adjusting area and the locking hole (210) are all multiple groups and correspond one to one, and the multiple adjusting areas are non-collinearly arranged; The second adjustment component (600) includes a first connecting seat (610), an adjusting bolt (620) and an adjusting nut (630), wherein the first connecting seat (610) is fixed to the position of the top plate (110) on the side of the base (200), and the first connecting seat (610) is provided with a connecting hole (611), and the stud of the adjusting bolt (620) passes through the connecting hole (611) and is connected to the side wall of the base (200); the adjusting nut (630) is threadedly connected to the adjusting bolt (620), and the adjusting nut (630) is located between the first connecting seat (610) and the screw head of the adjusting bolt (620); there are two second adjustment components (600), and the two second adjustment components (600) are arranged at intervals along the length direction of the base (200).

2. The silicon wafer transfer tool according to claim 1, characterized in that: The first adjustment component (500) further includes a first micrometer knob (530), the top plate (110) is provided with a receiving groove (113) on the top surface of the adjustment area, the first micrometer knob (530) is mounted on the bottom of the top plate (110), and the measuring portion of the first micrometer knob (530) is accommodated in the receiving groove (113).

3. The silicon wafer transfer tool according to claim 1, characterized in that: The second adjusting component (600) further includes a fixing bolt (640), and the top plate (110) is provided with a fixing threaded hole; the first connecting seat (610) includes a first connecting portion (612) and a second connecting portion (613) provided on the top of the first connecting portion (612), the connecting hole (611) is provided in the second connecting portion (613), the first connecting portion (612) is provided with a waist-shaped hole (614), the length direction of the radial cross-section of the waist-shaped hole (614) is toward the base (200), and the fixing bolt (640) passes through the waist-shaped hole (614) and is threadedly connected to the fixing threaded hole.

4. The silicon wafer transfer tool according to claim 1, characterized in that: The second adjustment component (600) further includes a second connecting seat (650) and a second micrometer knob (660) mounted on the second connecting seat (650), wherein the second connecting seat (650) is located on the side of the base (200), and the measuring portion of the second micrometer knob (660) faces the side wall of the base (200).

5. The silicon wafer transfer tool according to any one of claims 1 to 4, characterized in that: The driving assembly (300) comprises a linear motor (310), a cable assembly (370) and a robotic arm (360); a guide rail (220) is provided on the top surface of the base (200); and the guide rail (220), the stator (311) of the linear motor (310), the cable assembly (370) and the base (200) are all in the same length direction; The first end of the robotic arm (360) is a mounting portion (320), the mounting portion (320) is connected to the mover (312) of the linear motor (310), and the robotic arm (360) extends along the length direction of the base (200), and a slider (330) is provided at the bottom of the mounting portion (320), the slider (330) is slidably engaged with the guide rail (220), and the bearing member is fixed to the second end of the robotic arm (360); the cable assembly (370) is installed on the base (200) and is used to supply power to the mover (312).

6. The silicon wafer transfer tool according to claim 5, characterized in that: The carrier comprises a fork (400), a top surface of the fork (400) is provided with a plurality of positioning posts (410), a contour formed by the arrangement of the plurality of positioning posts (410) corresponds to the contour of the silicon wafer (800), and one of the positioning posts (410) matches a positioning groove (810) on an edge of the silicon wafer (800); And / or, the blade fork (400) is provided with a plurality of carrying areas (420), the plurality of carrying areas (420) are coplanar, and at least one of the carrying areas (420) is provided with a vacuum suction cup (430).

7. The silicon wafer transfer tool according to claim 5, characterized in that: The silicon wafer transfer tooling further includes a controller and a grating ruler, wherein a scale grating (710) of the grating ruler is mounted on the base (200), and a length direction of the scale grating (710) is consistent with a length direction of the base (200); a reading head (720) of the grating ruler is mounted on the robotic arm (360), and the reading head (720) and the drive assembly (300) are both connected to the controller.

8. The silicon wafer transfer tool according to claim 5, characterized in that: A limit buffer is provided at each end of the base (200) in the length direction, and the two limit buffers are used to limit and buffer the positions of the two ends of the mounting portion (320).

9. The silicon wafer transfer tool according to any one of claims 1 to 4, characterized in that: A plurality of vibration isolators (160) are detachably fixed to the bottom of the support platform (100), and the plurality of vibration isolators (160) are supported on the bottom of the support platform (100) and are non-collinearly arranged.

10. The silicon wafer transfer tool according to any one of claims 1 to 4, characterized in that: The bottom of the support platform (100) is equipped with a plurality of telescopic support legs (140) and is pivotally connected to a plurality of rollers (150), and the plurality of rollers (150) correspond one to one to the plurality of telescopic support legs (140).

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