Measurement method and method for forming semiconductor structure

Abstract

Embodiments of the present invention relate to a measurement method and a method for forming a semiconductor structure. According to some embodiments of the present invention, a measurement method is provided. A probe and a first sensor are placed above a fixture, and the fixture includes a rod protruding from the fixture. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the rod facing the fixture. A first distance between the second surface of the rod and the first sensor is obtained by the first sensor. The probe and the first sensor are placed above a magnetron. The magnetic field strength at different heights above the magnetron is measured by the probe. According to some embodiments of the present invention, a method for forming a semiconductor structure is also provided.

Description

Technical Field

[0001] The embodiments of the present invention relate to a measuring method and a method for forming a semiconductor structure. Background Art

[0002] As electronic technology advances, the size of semiconductor devices continues to decrease while providing greater functionality and including more integrated circuit systems. Due to the miniaturization of semiconductor devices, a large number of semiconductor components are assembled on the semiconductor devices. In addition, a large number of manufacturing operations are performed within this small semiconductor device.

[0003] Before manufacturing semiconductor devices, calibration of manufacturing equipment is performed. For manufacturing stability and repeatability, the components of the manufacturing equipment must be tuned or adjusted. Manufacturing operations can be repeatedly performed on each of the semiconductor devices, and semiconductor components can be accurately assembled on the semiconductor devices. However, the calibration of the manufacturing equipment depends on the accuracy of data associated with the physical characteristics (i.e., size, thermal expansion coefficient, life, hardness, etc.) of each component of the manufacturing equipment. Therefore, maintaining the stability of the manufacturing equipment and the manufacturing repeatability of the semiconductor devices is challenging.

[0004] Therefore, there is a need to continually modify and improve the manufacture of semiconductor devices and the manufacturing equipment used to manufacture semiconductor devices. Summary of the invention

[0005] According to an embodiment of the present invention, a measurement method includes: placing a probe and a second sensor above a fixture, wherein the fixture includes a rod protruding from the fixture; moving the probe until a first surface of the probe is laterally aligned with a second surface of the rod facing the fixture; obtaining, by the second sensor, a distance D1 between the second surface of the rod and the second sensor; placing the probe and the second sensor above a magnetron; and measuring, by the probe, the magnetic field strength at different heights above the magnetron.

[0006] According to an embodiment of the present invention, a measurement method includes: providing a fixture, the fixture including a first sensor and a reference rod mounted on the fixture; moving a carrier above the fixture, wherein a second sensor and a probe are mounted on the carrier; aligning the probe and the reference rod with the first sensor and the second sensor, respectively; detecting a lower surface of the probe by the first sensor; recording a distance between the second sensor and the reference rod by the second sensor; moving the carrier above a magnetron; bringing the probe close to the magnetron based on the distance recorded by the second sensor; and moving the probe in an upward direction to measure the magnetic field strength of the magnetron at different heights.

[0007] According to an embodiment of the present invention, an apparatus for calibration includes: a rod and a first sensor, which protrude from a fixture and are mounted on the fixture; a probe and a second sensor, which are mounted on a carrier and disposed above the first sensor and the rod; a motor, which is configured to control the movement of the carrier; and a controller, which is electrically connected to the motor and is configured to control the motor, wherein the motor can move the carrier above and toward the fixture to align the probe and the second sensor with the first sensor and the rod, respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Aspects of the embodiments of the present invention are best understood from the following detailed description read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with standard industrial practice, various components are not drawn to scale. In fact, the dimensions of various components may be arbitrarily increased or reduced for clarity of discussion.

[0009] Figure 1 is a schematic diagram of a calibration device according to some embodiments of the present invention.

[0010] Figure 2 is a flow chart of a measurement method according to some embodiments of the present invention.

[0011] Figures 3 to 14 is a schematic diagram illustrating different stages of a measurement method according to some embodiments of the present invention.

[0012] Fig.15 is a schematic diagram of a PVD apparatus according to some embodiments of the present invention.

[0013] Fig.16 is a schematic diagram of a calibration device according to some embodiments of the present invention.

[0014] Fig.17 is a schematic diagram of a calibration device according to some embodiments of the present invention.

[0015] Fig.18 is a schematic diagram illustrating a reading range of an optical sensor according to some embodiments of the present invention.

[0016] Figure 19 to Figure 21 is to illustrate the use of only one pressure sensor to perform some embodiments of the present invention. Figure 15 to Figure 17 Schematic diagram of the method shown in .

[0017] Figure 22 to Figure 24 is an illustration of using two pressure sensors to perform Figure 15 to Figure 17 Schematic diagram of the method shown in .

[0018] Figure 25 to Figure 27The present invention is described in detail using an optical sensor and a pressure sensor to perform Figure 15 to Figure 17 Schematic diagram of the method shown in .

[0019] Figure 28 to Figure 29 is a schematic diagram illustrating the use of a pressure sensor and an optical sensor according to some embodiments of the present invention. DETAILED DESCRIPTION

[0020] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. The specific examples of the elements and arrangements will be described below to simplify this disclosure. Of course, these are only examples and do not wish to be restrictive. For example, in the following description, the first member is formed above the second member or on the second member, and the embodiment of the first member and the second member that directly contact can be included, and the embodiment that the first member and the second member may not directly contact can also be included, wherein additional members can be formed between the first member and the second member. In addition, this disclosure can repeat element symbols and / or letters in various examples. This repetition is for simplicity and clarity and does not indicate the relationship between the various embodiments and / or configurations discussed by itself.

[0021] Additionally, for ease of description, spatially relative terms (e.g., "below," "beneath," "lower," "above," "upper," and the like) may be used herein to describe the relationship of one element or component to another element or component, as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0022] As used herein, although terms such as "first", "second", and "third" describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. Such terms may be used only to distinguish elements, components, regions, layers, or sections from each other. Unless the context clearly indicates otherwise, terms such as "first", "second", and "third" used herein do not imply a sequence or order.

[0023] Although the numerical ranges and parameters stating the wide range of embodiments of the present invention are approximate values, the numerical values ​​stated in the specific examples should be reported as accurately as possible. However, any numerical value inherently contains a specific error that is necessarily caused by the standard deviation present in the corresponding test measurement. In addition, as used herein, the terms "substantially", "roughly" or "about" generally mean within a value or range that can be considered by a person of ordinary skill in the art. Alternatively, as considered by a person of ordinary skill in the art, the terms "substantially", "roughly" or "about" mean within an acceptable standard deviation of the mean value. A person of ordinary skill in the art should understand that the acceptable standard deviation can vary according to different technologies. Except in the operating / working examples or unless otherwise explicitly stated, all numerical ranges, quantities, values ​​and percentages disclosed herein (such as numerical ranges, quantities, values ​​and percentages of material quantity, duration, temperature, operating conditions, quantity ratios and the like) should be understood to be modified by the terms "substantially", "roughly" or "about" in all examples. Therefore, unless otherwise indicated, the numerical parameters stated in this disclosure and the accompanying claims are approximate values ​​that can vary according to expectations. Finally, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one endpoint to the other or between two endpoints. Unless otherwise indicated, all ranges disclosed herein include endpoints.

[0024] The present disclosure relates to a method for calibrating semiconductor equipment, such as physical vapor deposition (PVD) equipment. PVD equipment is widely used in thin film deposition during semiconductor manufacturing. The performance of PVD equipment is closely related to two main components of the PVD equipment, namely, the magnetron and the target. The magnetic field generated by the magnetron and formed around the surface of the target plays an important role in the deposition operation. The magnetic field is measured using a magnetic sensor, and the distance between the magnetron and the target needs to be maintained during the deposition operation to apply the required strength of the magnetic field to the target. The distance between the magnetron and the target can vary depending on different deposition applications, and therefore manual inspection and calibration of the distance must be performed on the chamber before performing the PVD task. However, when the magnetron leaves the chamber, manual calibration of the magnetron cannot provide sufficient efficiency and accuracy. Therefore, the deposition performance is degraded.

[0025] The above-mentioned problems can be solved by implementing a calibration method. The calibration method may include: mapping the position of the sensor relative to the surface of the magnetron; obtaining several parameters above the magnetron from the sensor (such as the magnetic field across the surface of the magnetron, the distance between the sensor and the magnetron, etc.); recording the parameters and modeling the film generation based on the parameters (magnetic field at different heights above the magnetron and across the surface of the magnetron, etc.); and selecting a suitable height above the magnetron to achieve desired film properties during film generation based on the modeling results.

[0026] In some embodiments, a calibration method includes: mapping the position of the sensor relative to the surface of a circular magnetron using a polar coordinate system; measuring the magnetic field at different heights above the circular magnetron and across the surface of the circular magnetron; and selecting a suitable height above the circular magnetron based on the measurements; and then installing the circular magnetron inside a PVD chamber based on the selected height.

[0027] In some embodiments, a calibration or measurement method is provided to: automatically detect the minimum distance between the magnetic sensor and the magnetron; measure the magnetic intensity at different heights above the magnetron; and record the magnetic intensity and distance at different heights above the top surface of the magnetron. The recorded distance is used as a reference to determine the approximate size of the gap between the magnetron and the target. An artificial intelligence (AI) data training scheme can be incorporated into the calibration, wherein the inspection performance of the magnetic sensor using an optical sensor or a pressure sensor can be improved by the AI ​​data training method. Therefore, the data repeatability and accuracy of the measurement results can be improved.

[0028] Figure 1 is a schematic diagram of a calibration device 100 according to some embodiments of the present invention. The calibration device 100 includes a fixture 101 having a reference rod 102 and a first sensor 103 mounted thereon. The reference rod 102 protrudes from the fixture 101. In some embodiments, the first sensor 103 also protrudes from the fixture 101. In some embodiments, the fixture 101 may be a plate for holding the first sensor 103 and the reference rod 102. In some embodiments, the fixture 101 may be a metal plate. In some embodiments, the reference rod 102 is a metal rod mounted on the fixture 101. In some embodiments, the first sensor 103 is mounted in the fixture 101 and has a top surface 103a. In some embodiments, the first sensor 103 has an upward sensing direction. In some embodiments, the first sensor 103 includes one or more types of sensors. In some embodiments, the first sensor 103 may include an optical sensor, a pressure sensor, or other suitable type of sensor. The configuration of the reference rod 102 can be adjusted according to different applications. Figure 1 In the embodiment shown, the reference rod 102 is a straight rod; however, it is not limited thereto. In other embodiments, the reference rod 102 may be a dome-shaped circular protrusion or top surface 102a.

[0029] The calibration device 100 further includes a carrier 111, a measuring tool 112, and a second sensor 113. In some embodiments, the measuring tool 112 and the second sensor 113 are mounted on the carrier 111. In some embodiments, the carrier 111, the measuring tool 112, and the second sensor 113 are disposed above the fixture 101. In some embodiments, the carrier 111 may be a metal plate extending along the first direction Z, such as Figure 1In some embodiments, the second sensor 113 includes one or more types of sensors. In some embodiments, the second sensor 113 includes one or more of an optical sensor and a pressure sensor.

[0030] In some embodiments, the measuring tool 112 is configured to measure the magnetic field strength. In some embodiments, the measuring tool 112 includes a probe 112a protruding from the measuring tool 112. In some embodiments, the probe 112a can be any type of magnetic field probe, such as a Gaussian probe or the like. In some embodiments, the probe 112a protrudes from the carrier 111 along the first direction Z. In other words, the probe 112a protrudes from the carrier 111 toward the fixture 101. In some embodiments, the lower surface 113a of the second sensor 113 is substantially coplanar with the lower surface 111a of the carrier 111. In some embodiments, the second sensor 113 is completely disposed within the carrier 111.

[0031] The calibration apparatus 100 includes one or more engines. Figure 1 As described in , the one or more engines include a first engine 121, a second engine 122, and a third engine 123. The first engine 121 is configured to move the carrier 111, the measuring tool 112, and the second sensor 113 along the second direction Y. The second engine 122 is configured to move the carrier 111, the measuring tool 112, and the second sensor 113 along the third direction X. The third engine 123 is configured to move the carrier 111, the measuring tool 112, and the second sensor 113 along the first direction Z. Therefore, the carrier 111, the measuring tool 112, and the second sensor 113 can move together along the first direction Z, the second direction Y, or the third direction X. In some embodiments, the first engine 121, the second engine 122, and the third engine 123 are directly or indirectly connected to the carrier 111. In Figure 1 In the illustrated embodiment, the carrier 111 is directly connected to the second engine 122 , and is indirectly connected to the first engine 121 and the third engine 123 .

[0032] The present disclosure is not limited to the above. In other embodiments, the carrier 111 may be omitted. Therefore, the measuring tool 112 and the second sensor 113 may be moved individually along the first direction Z, the second direction Y, and the third direction X. In some embodiments, the position or movement of the measuring tool 112 and the second sensor 113 may be controlled individually. In some embodiments, the measuring tool 112 and the second sensor 113 may be independently moved along the second direction Y by the first motor 121. In some embodiments, the measuring tool 112 and the second sensor 113 may be independently moved along the third direction X by the second motor 122. In some embodiments, the measuring tool 112 and the second sensor 113 may be independently moved along the first direction by the third motor 123. In some embodiments, the fourth motor 124 is mounted on the carrier 111 to control the movement of the second sensor 113 independently of the carrier 111 and the measuring tool 112.

[0033] In some embodiments, the calibration device 100 also includes a user interface that allows the operator to control the movement of the carrier 111, the measuring tool 112, and the second sensor 113. In some embodiments, the calibration device 100 includes a central processing unit (CPU). The first instruction from the user interface is sent to the CPU and the CPU generates a second instruction configured to control the movement of the carrier 111, the measuring tool 112, and the second sensor 113. In some embodiments, the second instruction is transmitted to the first engine 121, the second engine 122, the third engine 123, and / or the fourth engine 124. In some embodiments, the calibration device 100 may include software configured to communicate with the first sensor 103 and the second sensor 113. The software can integrate the hardware of the calibration device 100 (for example, including the carrier 111, the measuring tool 112, the second sensor 113, the first engine 121, the second engine 122, the third engine 123, etc.) to perform a measurement or calibration method. In some embodiments, the software is used to control the movement of the hardware, send commands to the hardware, read and determine the position of the hardware, obtain measurements, load experimental parameters, and / or automatically collect data.

[0034] The present disclosure also provides a method for measuring the magnetic field strength of a magnetron at different heights above the top surface of the magnetron using the calibration apparatus 100. The different heights are related to the magnetic field strength from the magnetron. The method can obtain an optimal height above the top surface of the magnetron. The magnetic field distribution at the optimal height is optimal. After the optimal height is obtained by the method, the distance between the magnetron and the target can be maintained optimal during the PVD operation with reference to the optimal height. Therefore, a film disposed on a substrate with good uniformity can be obtained by this PVD operation.

[0035] In some embodiments of the present invention, a measurement method 300 is provided. The measurement method 300 comprises Figure 2 Several operations 301 to 304 shown in . Figures 3 to 14 1 is a schematic diagram of a fixture 101, a reference rod 102, a first sensor 103, a carrier 111, a measuring tool 112 and a second sensor 113 in different stages of the method. Figures 3 to 14 The following description illustrates an embodiment including an optical sensor as the first sensor 103 and an optical sensor as the second sensor 113 , but the present disclosure is not limited thereto.

[0036] In some embodiments, operation 301 includes Figures 3 to 6 In operation 301, the probe 112a is moved until the lower surface 112b of the probe 112a is laterally aligned with the top surface 102a of the rod 102 protruding from the fixture 101, as shown in FIG. Figure 6 Reference Figure 3 , providing or receiving a fixture 101 and a carrier 111. In some embodiments, the reference rod 102 and the first sensor 103 are mounted on the fixture 101 and protrude from the fixture 101. In some embodiments, the measuring tool 112 and the second sensor 113 are mounted on the carrier 111. In some embodiments, the probe 112a of the measuring tool 112 protrudes from the carrier 111.

[0037] refer to Figure 4 , the carrier 111 is moved above the fixture 101 and toward the fixture 101. In some embodiments, the measuring tool 112 is disposed above the first sensor 103, and the second sensor 113 is disposed above the reference rod 102. In some embodiments, the probe 112a is disposed above the top surface 103a of the first sensor 103, and the lower surface 113a of the second sensor 113 is disposed above the top surface 102a of the reference rod 102. In some embodiments, the measuring tool 112 is vertically aligned with the first sensor 103, and the second sensor 113 is vertically aligned with the reference rod 102. In some embodiments, the carrier 111 is moved manually (e.g., by an operator) or automatically (e.g., by a motor with a controller) above the fixture 101.

[0038] In some embodiments, the first sensor 103 is configured to detect and locate the probe 112a. Once the probe 112a is located by the first sensor 103, the probe 112a or the carrier 111 stops above the first sensor 103. In some embodiments, the first sensor 103 sends a signal to the CPU, and when the probe 112a enters the detection range of the first sensor 103, the CPU instructs and stops the first motor 121, the second motor 122, and the third motor 123. In some embodiments, the second sensor 113 is individually moved and can detect and locate the reference rod 102. In some embodiments, the second sensor 113 stops when it is vertically aligned with the reference rod 102.

[0039] refer to Figure 5 , so that the carrier 111 moves toward the fixture 101. In some embodiments, the carrier 111 moves vertically toward the fixture 101. Figure 6 As the carrier 111 moves toward the fixture 101, the lower surface 112b of the probe 112a becomes substantially coplanar with the top surface 102a of the reference rod 102. The carrier 111 is moved vertically above the fixture 101 until the lower surface 112b of the probe 112a is at the same level as the top surface 102a of the reference rod 102. For illustration, Figure 6 The dotted line in 102 represents the extension of the top surface 102a of the reference rod 102. In some embodiments, when the lower surface 112b of the probe 112a is laterally aligned or coplanar with the top surface 102a of the reference rod 102, the carrier 111 stops. The lower surface 112b of the probe 112a faces the fixture 101. In some embodiments, the lower surface 112b may not be a flat surface but a rounded surface. In some embodiments, the top surface 102a of the reference rod 102 faces the second sensor 113. In some embodiments, the top surface 102a of the reference rod 102 is designed as a flat surface, but the present disclosure is not limited thereto.

[0040] In some embodiments, the carrier 111 continues to move toward the fixture 101 and the lower surface 112b of the probe 112a may be lower than the upper surface 102a of the reference rod 102, such as Figure 7 The first sensor 103 detects that the lower surface 112b of the probe 112a is lower than the top surface 102a of the reference rod 102, and a signal is sent to the CPU to control the third motor 123 to move the carrier 111 upward until the lower surface 112b of the probe 112a is coplanar with the top surface 102a of the reference rod 102, as shown in FIG. Figure 6 As shown in .

[0041] In order to accurately detect that the lower surface 112 b of the probe 112 a is coplanar with the top surface 102 a of the reference rod 102 , the height difference H between the top surface 103 a of the first sensor 103 and the top surface 102 a of the reference rod 102 is designed according to the reading range of the first sensor 103 .

[0042] refer to Figure 8According to some embodiments, for illustration, a center reading 131 is defined. The center reading 131 is the center position of the reading range 132 of the first sensor 103. The center reading 131 is half of the reading range 132. In some embodiments, the reading range 132 is about 200 mm. In some embodiments, the center reading 131 is located at a position about 100 mm away from the lower surface 112b of the probe 112a. In some embodiments, the center reading C of the first sensor 103 is also referred to as a zero reading. In some embodiments, a first position 133 and a second position 134 are defined. In some embodiments, the first position 133 is located at a position about Y mm away from the center reading 131 and close to the first sensor 103, and the second position 134 is located at a position about Y mm away from the center reading 131 and away from the first sensor 103. In some embodiments, Y is a number greater than zero.

[0043] When the distance between position P1 and the first sensor 103 is equal to the center reading 131, the reading of the first sensor 103 is zero, which can then be calculated or converted to half of the reading range 132 (e.g., 100 mm). When position P2 is lower than position P1 and within the reading range 132 of the first sensor 103, the reading of the first sensor 103 is a negative value, which can then be calculated as the distance between the first sensor 103 and position P2 greater than half of the reading range 132. Similarly, when position P3 is higher than position P1 and within the reading range 132 of the first sensor 103, the reading of the first sensor 103 to position P3 is a positive value, which can then be used to calculate the distance between the first sensor 103 and position P3 less than half of the reading range 132. When position P4 is higher than position P1 and the first position 133, the distance between position P4 and the first sensor 103 is not available. Similarly, when position P5 is lower than position P1 and the second position 134, the distance between position P5 and the first sensor 103 is not available. It should be noted that the center reading 131 and the reading range 132 may be adjusted according to different applications and specifications of the first sensor 103 , and are not limited thereto.

[0044] Return to reference Figure 6 , the height difference H between the top surface 103a of the first sensor 103 and the top surface 102a of the reference rod 102 is designed to be within the reading range 132 of the first sensor 103. The first sensor 103 is able to detect that the lower surface 112b of the probe 112a is coplanar with the upper surface 102a of the reference rod 102. In some embodiments, for detection and ease of calculation, the height difference H is designed to be substantially equal to the center reading 131 of the first sensor 103. In some embodiments, the top surface 102a of the reference rod 102 is initially defined as the zero reading of the first sensor 103.

[0045] In some embodiments, Figure 6 In operation 302, when the lower surface 112a of the probe 112a is coplanar with the top surface 102a of the reference rod 102, the distance D1 between the second sensor 113 and the top surface 102a of the reference rod 102 is obtained or recorded as a reference reading by the second sensor 113. In some embodiments, operation 302 is performed after operation 301.

[0046] refer to Fig. 9 , in subsequent operations of the measurement method, to ensure that the probe 112a does not touch the top surface of the magnetron during measurement, the carrier 111 is moved upwardly away from the fixture 101 by a default distance D2. In some embodiments, the default distance D2 may be equal to 0.5 cm, 1 cm, or 2 cm. In some embodiments, the default distance D2 is less than 5 cm. The default distance D2 may ensure that the probe 112a does not damage the magnetron during calibration. In an embodiment, after the carrier 111 is moved upwardly away from the fixture 101 by the default distance D2, the distance D3 between the top surface 102a of the reference rod 102 and the second sensor 113 is obtained or recorded by the second sensor 113. In some embodiments, the distance D3 is equal to the sum of the default distance D2 and the distance D1.

[0047] In some embodiments, operation 303 includes Figure 10 to Figure 11 In operation 303, a probe 112a and a second sensor 113 are placed above the magnetron 141, such as Fig.11 References 10 to Fig.11 , the carrier 111, the measuring tool 112, and the second sensor 113 move toward the magnetron 141 and are disposed above the magnetron 141. In some embodiments, the carrier 111 is moved by the first motor 121, the second motor 122, and the third motor 123. In some embodiments, the probe 112a is disposed above the magnetron 141 and at a position adjacent to the center of the top surface 141a of the magnetron 141. In some embodiments, the center of the top surface 141a of the magnetron 141 is obtained based on any suitable method before operation 303, so that the probe 112a is disposed above the center of the top surface 141a of the magnetron 141 and is substantially vertically aligned with the center, wherein the top surface 141a faces the carrier 111. In some embodiments, when the carrier 111 is disposed above the top surface 141a of the magnetron 141, the distance between the second sensor 113 and the top surface 141a of the magnetron 141 is greater than the distance D1. In some embodiments, according to the result obtained from operation 302 , the second sensor 113 is positioned away from the top surface 141 a of the magnetron 141 .

[0048] refer to Fig.12, the lower surface 112b of the probe 112a is brought to a desired level above the magnetron 141 based on the distance D1 recorded as a reference reading by the second sensor 113. The carrier 111 is moved downward toward the top surface 141a of the magnetron 141 by the first motor 121, the second motor 122, and the third motor 131 until the distance between the top surface 141a of the magnetron 141 and the second sensor 113 is substantially equal to the distance D1. Fig.12 In the illustrated embodiment, the lower surface 112b is vertically located above and spaced apart from the top surface 141a of the magnetron 141 by a distance D1. In some alternative embodiments, the lower surface 112b of the probe 112a is directly on the top surface 141a of the magnetron 141.

[0049] In some embodiments, Fig.14 Operation 304 is performed as shown in FIG. In operation 304, the magnetic field strength at different heights above the magnetron 141 is measured by the probe 112a. Figure 13 to Figure 14 , power is supplied to operate the magnetron 141, and a magnetic field is generated by the magnetron 141. Thus, the magnetic field strength at different heights above the magnetron 141 is measured by the measuring tool 112 through the probe 112a. The carrier 111 having the probe 112a and the second sensor 113 is moved upward away from the top surface 141a of the magnetron 141 at an interval D' to measure the magnetic field strength. The magnetic field strength of the magnetron 141 at sequential increments of the interval D' in the upward direction above the magnetron 141 can be obtained. The interval D' is not limited thereto, but can be adjusted as needed. As Fig.13 As shown in FIG. 1 , the carrier 111 moves vertically away from the top surface 141a of the magnetron 141. When the second sensor 113 is spaced from the top surface 141a by a distance equal to the spacing D′, when the probe 112a is in Fig.13 Then, the carrier 111 continues to move further away from the magnetron 141. In some embodiments, the carrier 111 moves further away from the top surface 141a of the magnetron 141 vertically by twice the interval D', as shown in FIG. Fig.14 As shown in FIG. Fig.14 The second magnetic field strength is measured at the position shown in FIG.

[0050] The correlation of the magnetic field strength at different heights above the top surface 141a of the magnetron 141 can be obtained by the measurement method described above. Next, the magnetron 141 can be installed above the target in the PVD equipment.

[0051] Fig.152 is a schematic diagram of a PVD apparatus 200 according to some embodiments of the present invention. The PVD apparatus 200 includes a chamber 201, a target 202, and a susceptor 203. The chamber 201 includes a plasma region A indicated by a dashed circle, which illustrates a plasma region during a PVD operation. The target 202 is a sputtering target installed in the chamber 201 and configured to provide a material of a PVD film formed on a substrate 204. The susceptor 203 is also disposed in the chamber 201 and configured to hold the substrate 204 thereon. After performing the measurement method, the magnetron 141 is installed above the target 202. An optimal distance D is defined between the magnetron 141 and the target 202.

[0052] The optimal distance D can be determined based on the correlation of the magnetic field strength at different heights above the top surface 141a of the magnetron 141 obtained by the measurement method. The optimal distance D with better uniformity results is used in mass production. Therefore, the measurement method of the embodiment of the present invention can provide a mathematical correlation between the optimal distance and the uniformity of the PVD film, and can improve manufacturing consistency and repeatability.

[0053] In the above embodiment, both the first sensor 103 and the second sensor 113 are optical sensors and can be Fig.16 and Fig.17 . As described above, according to some embodiments of the present invention, the controller 205 is configured to actuate and coordinate the motors 121, 122, 123 to control the movement of the carrier 111, and the software includes a first algorithm for communicating with the first sensor 103 and the second sensor 113 and controlling the first motor 12, the second motor 122, and the third motor 123 to find the optimal distance D. Then, the probe 112a moves over and around the center of the magnetron 141 using the second algorithm of the software, as shown in FIG. Fig.17 The second algorithm also ensures that the electron beam of the second sensor 113 falls on the top surface 141a of the magnetron 141. However, the present disclosure is not limited to the above and Figures 3 to 14 In some alternative embodiments, the first sensor 103 and the second sensor 113 may include one or more pressure sensors. The method 300 may also be applied to embodiments using pressure sensors as the first sensor 103 and / or the second sensor 113.

[0054] refer to Figure 18 to Figure 19 According to some embodiments, the second sensor 113 is a pressure sensor, and no first sensor 103 is mounted on the fixture 101. In an embodiment, the protrusion 112c of the probe 112a from the carrier 111 is designed to be smaller than the protrusion 113b of the second sensor 113 from the carrier 111, such as Fig.18After the second sensor 113 is placed above the reference rod 102, the second sensor 113 is moved toward the reference rod 102 by the third motor 123 until the second sensor 113 detects that the second sensor 113 contacts the reference rod 102, as shown in FIG. Fig.19 As shown in .

[0055] In some embodiments, the second sensor 113 is manually positioned above the reference pole 102 and aligned with the reference pole 102 by the operator controlling the first motor 121, the second motor 122, and the third motor 123. In some embodiments, the position of the reference pole 102 is stored in the software of the calibration device 100, and the second sensor 113 can be automatically positioned above the reference pole 102 and aligned with the reference pole 102. Figure 18 to Figure 19 In the illustrated embodiment, method 300 may be performed semi-automatically or automatically.

[0056] refer to Figure 20 to Figure 21 The carrier 111 including the probe 112a and the second sensor 113 moves above the center of the top surface 141a of the magnetron 141, as shown in FIG. Fig.19 Then, the carrier 111 is moved toward the magnetron 141 by the third motor 33 until the second sensor 113 detects contact between the magnetron 141 and the second sensor 113. Then, the magnetic field strength of the magnetron 141 at different heights is measured by moving the carrier 111 upward in sequential increments equal to the predetermined interval.

[0057] refer to Figure 22 to Figure 24 According to some embodiments, both the first sensor 103 and the second sensor 113 are pressure sensors. The fourth motor 124 is disposed on the carrier 111 having a track for controlling the height of the second sensor 113. In an embodiment, the third motor 123 is controlled to vertically move the probe 112a. In some embodiments, the probe 112a is manually moved above the first sensor 103 before the probe 112a contacts the first sensor 103. In some embodiments, the position of the first sensor 103 is stored in software, and the probe 112a can be automatically moved to vertically align with the first sensor 103. In some embodiments, once the lower surface 112b of the probe 112a is detected by the first sensor 103 to be in contact with the first sensor 103, the first sensor 103 can position the probe 112a, such as Fig. 22 As shown in .

[0058] After positioning the probe 112a, the second sensor 113 is moved downward by the fourth motor 124 to detect the top surface 102a of the reference rod 102, such as Fig.23The second sensor 113 records that the distance between the reference rod 102 and the carrier 111 is equal to the protrusion 113b of the second sensor 113. It should be noted that in the embodiment, before detecting the reference rod 102 Fig. 22 The protrusion 113b of the second sensor 113 shown in FIG. Fig.23 The protrusion 112c of the probe 112a is shown in FIG.

[0059] In some embodiments where a pressure sensor is used for the first sensor 103, the height of the reference rod 102 is designed to be substantially equal to the height of the first sensor 103. Then, the carrier 111 is moved over the magnetron 141 to measure the magnetic field strength at different heights, such as Fig.24 In some embodiments, to ensure that the probe 112a and the magnetron 141 do not touch to avoid damage, the second sensor 113 is further moved downward to make the protrusion 113b larger than the protrusion 112c before the second sensor 113 touches the top surface 141a of the magnetron 141. Then, the second sensor 113 is moved toward the magnetron 141 until the second sensor 113 detects that the second sensor 113 is in contact with the magnetron 141. Then, the magnetic field strength of the magnetron 141 at different heights is measured by moving the carrier 111 upward in sequential increments equal to the predetermined interval. Therefore, at Figure 22 to Figure 24 In the illustrated embodiment, method 300 may be performed semi-automatically or automatically.

[0060] refer to Figure 25 to Figure 27 According to some embodiments, the first sensor 103 is an optical sensor and the second sensor 113 is a pressure sensor. In an embodiment, the first sensor 103 is similar to Figures 3 to 14 The first sensor 103 is described in the related paragraphs above and is configured to locate the probe 112a and detect the lower surface 112b of the probe 112a when the lower surface 112b is coplanar with the top surface 102a of the reference rod 102. The fourth motor 124 is disposed on the carrier 111 having a track for controlling the height of the second sensor 113. In an embodiment, the second sensor 113 is similar to Figure 22 to Figure 24 The second sensor 113 is configured to detect the distance between the carrier 111 and the reference rod 102 , wherein the protrusion 113 b of the second sensor 113 from the carrier 111 is controlled by the fourth motor 124 and may be different in different stages of the method 300 .

[0061] like Fig.26 As shown in FIG. 1 , when the lower surface 112b is coplanar with the top surface 102a, the protrusion 113b of the second sensor 113 is used to record the distance between the carrier 111 and the top surface 102a of the reference rod 102. Fig. 27As shown in FIG. 1 , the protrusion 113b, which is larger than the protrusion 112c, is used to detect the top surface 141a of the magnetron 141 to ensure that the probe 112b is separated from the magnetron 141. Then, the magnetic field strength of the magnetron 141 at different heights is measured by moving the carrier 111 upward at predetermined intervals. Figure 25 to Figure 27 In the illustrated embodiment, method 300 may be performed automatically.

[0062] refer to Figure 28 to Figure 29 According to some embodiments, the first sensor 103 is a pressure sensor and the second sensor 113 is an optical sensor. The function and process of using the first sensor 103 to detect the lower surface 112b of the probe 112a are as follows: Fig. 22 The function and process of using the second sensor 113 to determine the distance D1 and to make the probe 112a reach the desired level above the magnetron 141 are as follows. Figures 3 to 14 After the first sensor 103 detects the lower surface 112b of the probe 112a, the distance D1 is recorded by the second sensor 113. Fig.28 As shown in FIG. 1 , in some embodiments, the distance D1 is recorded without additional gaps. Fig.29 As shown in , in some embodiments, the readings are recorded after adding the additional gap. Figure 28 to Figure 29 In the illustrated embodiment, method 300 may be performed semi-automatically or automatically.

[0063] Some embodiments of the present invention provide a measurement method. The method includes several operations. A probe and a second sensor are placed above a fixture, the fixture including a rod protruding from the fixture. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the rod facing the fixture. A distance D1 between the second surface of the rod and the second sensor is obtained by the second sensor. The probe and the second sensor are placed above a magnetron. The magnetic field strength at different heights above the magnetron is measured by the probe.

[0064] Some embodiments of the present invention provide a measurement method. The method includes several operations. A fixture is provided, the fixture including a first sensor and a reference rod mounted on the fixture. A carrier is moved above the fixture, wherein a second sensor and a probe are mounted on the carrier. The probe and the reference rod are aligned with the first sensor and the second sensor, respectively. The lower surface of the probe is detected by the first sensor. The distance between the second sensor and the reference rod is recorded by the second sensor. The carrier is moved toward a magnetron. The lower surface of the probe is brought to a desired level above the magnetron based on the distance recorded by the second sensor. The probe is moved in an upward direction to measure the magnetic field strength of the magnetron at different heights.

[0065] Some embodiments of the present invention provide an apparatus for calibration. The apparatus comprises: a rod and a first sensor protruding from and mounted on a fixture; a probe and a second sensor mounted on a carrier and disposed above the first sensor and the rod; a motor configured to control movement of the carrier; and a controller electrically connected to the motor and configured to control the motor, wherein the carrier can be moved by the motor over and toward the fixture to align the probe and the second sensor with the first sensor and the rod, respectively.

[0066] The features of several embodiments have been summarized above so that those skilled in the art can better understand the aspects of the embodiments of the present invention. Those skilled in the art will appreciate that they can easily use this disclosure as a basis for designing or modifying other processes and structures for implementing the same purpose and / or achieving the same advantages of the embodiments introduced herein. Those skilled in the art will also recognize that such equivalent constructions should not depart from the spirit and scope of the embodiments of the present invention, and that they may make various changes, substitutions, and modifications to this document without departing from the spirit and scope of the embodiments of the present invention.

[0067] Explanation of symbols

[0068] 100: Calibration equipment

[0069] 101: Fixture

[0070] 102: Reference rod

[0071] 102a: Top surface

[0072] 103: First sensor

[0073] 103a: Top surface

[0074] 111: Carrier

[0075] 111a: Lower surface

[0076] 112: Measuring tools

[0077] 112a: Probe

[0078] 112b: Lower surface

[0079] 112c: protrusion

[0080] 113: Second sensor

[0081] 113a: Lower surface

[0082] 113b: protrusion

[0083] 121: First Engine

[0084] 122: Second engine

[0085] 123: The third engine

[0086] 124: Fourth Engine

[0087] 131: Center Reading

[0088] 132: Read range

[0089] 133: First position

[0090] 134: Second position

[0091] 141:Magnetron

[0092] 141a: Top surface

[0093] 200:Physical vapor deposition (PVD) equipment

[0094] 201: Chamber

[0095] 202: Target

[0096] 203: Base

[0097] 204: Substrate

[0098] 205: Controller

[0099] 300: Measurement method

[0100] 301: Operation

[0101] 302: Operation

[0102] 303: Operation

[0103] 304: Operation

[0104] A: Plasma region

[0105] C: Center reading

[0106] D: Optimal distance

[0107] D': Interval

[0108] D1: Distance

[0109] D2: Default distance

[0110] D3: Distance

[0111] H: Height difference

[0112] P1: Location

[0113] P2: Location

[0114] P3: Location

[0115] P4: Location

[0116] P5: Location

[0117] X: Third direction

[0118] Y: Second direction

[0119] Z: First direction

Claims

1. A measurement method, comprising: positioning a probe and a second sensor above a fixture, the fixture comprising a rod protruding from the fixture; moving the probe until a first surface of the probe is laterally aligned with a second surface of the rod facing the fixture; obtaining, by the second sensor, a distance D1 between the second surface of the rod and the second sensor; placing the probe and the second sensor above the magnetron; and The magnetic field strength at different heights above the magnetron is measured by the probe. 2 . The measuring method according to claim 1 , wherein after the probe and the second sensor are placed above the magnetron, a distance between the magnetron and the second sensor is equal to the distance D1 .

3. The measuring method according to claim 1, further comprising: Before obtaining the distance D1, the probe and the second sensor are moved away from the rod by a distance D2. 4 . The measurement method according to claim 3 , wherein after the probe and the second sensor are placed above the magnetron, the distance between the magnetron and the probe is equal to the distance D2 . 5 . The measuring method of claim 1 , wherein the probe and the second sensor are connected to one or more motors, and positioning the probe and the second sensor above the fixture includes moving the probe and the second sensor by the one or more motors.

6. The measuring method according to claim 5, wherein positioning the probe and the second sensor comprises operating a first engine and a second engine of the one or more engines to horizontally move the probe and the second sensor, and moving the probe comprises operating a third engine of the one or more engines to vertically move the probe.

7. The measuring method according to claim 1, wherein moving the probe comprises: moving the probe in a vertical direction; detecting the first surface of the probe by a first sensor mounted to the fixture and adjacent to the rod; and Based on the detection by the first sensor, the probe is stopped when the first surface of the probe is laterally aligned with the second surface of the rod.

8. The measuring method according to claim 1, wherein the probe and the second sensor are mounted on a carrier, and placing the probe and the second sensor above the fixture comprises: The carrier is moved over the fixture to position the second sensor over the rod. 9 . The measurement method of claim 1 , wherein positioning the probe and the second sensor over the magnetron comprises moving the second sensor over a center of the magnetron.

10. A measurement method, comprising: providing a fixture, the fixture comprising a first sensor and a reference rod mounted on the fixture; moving a carrier over the fixture, wherein a second sensor and a probe are mounted on the carrier; aligning the probe and the reference rod with the first sensor and the second sensor, respectively; detecting the lower surface of the probe by the first sensor; recording, by the second sensor, the distance between the second sensor and the reference rod; moving the carrier over a magnetron; bringing the probe into proximity with the magnetron based on the distance recorded by the second sensor; and The probe is moved in an upward direction to measure the magnetic field strength of the magnetron at different heights.

11. The measuring method according to claim 10, further comprising: Prior to moving the carrier over the fixture, a distance from the first sensor is defined as a zero reading of the first sensor.

12. The measuring method of claim 11, wherein the height difference between the first sensor and the reference rod is equal to the zero reading of the first sensor.

13. The measuring method according to claim 10, wherein bringing the probe close to the magnetron comprises: detecting, by the second sensor, a distance between the second sensor and a top surface of the magnetron; and The carrier is moved toward the top surface of the magnetron until the distance between the second sensor and the top surface of the magnetron is equal to the distance recorded by the second sensor. 14 . The measuring method according to claim 10 , wherein the probe is brought to a desired level above a top surface of the magnetron without touching the top surface of the magnetron.

15. The measuring method according to claim 10, further comprising: The magnetic field strength of the magnetron is correlated to the different heights, wherein the distance between the magnetron and the lower surface of the probe is recorded by the second sensor.

16. An apparatus for calibration, comprising: a rod and a first sensor protruding from the fixture and mounted on the fixture; a probe and a second sensor mounted on a carrier and disposed above the first sensor and the rod; a motor configured to control movement of the carrier; and a controller electrically connected to the engine and configured to control the engine, The carrier can be moved above and toward the fixture by the motor so that the probe and the second sensor are aligned with the first sensor and the rod respectively, the first sensor can detect and locate the probe, when the first surface of the probe facing the fixture is laterally aligned with the second surface of the rod facing the carrier, the second sensor can obtain the distance between the second surface of the rod and the second sensor, and based on the distance obtained by the second sensor, the controller can control the motor to move the probe to measure the magnetic field strength of the magnetron at different heights.

17. The apparatus of claim 16, wherein the probe protrudes from the carrier.

18. The apparatus of claim 16, wherein a lower surface of the second sensor is coplanar with a lower surface of the carrier.

19. The apparatus of claim 16, wherein the carrier is movable above the fixture and in a direction normal to a top surface of the rod.

20. The apparatus of claim 16, wherein the probe is configured to measure magnetic field strength.

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