Method for manufacturing electronic device

Abstract

The present application relates to a method for manufacturing an electronic device. The method for manufacturing an electronic device comprises: providing a working substrate, the working substrate comprising a pre-set module and a protective film, the pre-set module comprising an effective area having a hole forming area, the protective film covering at least one of an upper surface and a rear surface of the pre-set module; radiating a laser beam to the working substrate from a first starting point toward a moving path, and removing at least a portion of the working substrate to form a first starting cutting line in the hole forming area, the moving path of the laser beam being defined as a boundary between the hole forming area and the effective area; radiating the laser beam along the moving path; and removing the hole forming area from the pre-set module to form a module hole, wherein the first starting cutting line forms a predetermined angle with respect to a tangent of the moving path.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0120717, filed on September 30, 2019, and Korean Patent Application No. 10-2020-0063592, filed on May 27, 2020, which are hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to a method of manufacturing an electronic device, and more particularly, to a method of manufacturing an electronic device including an electronic module. Background Art

[0004] The electronic device operates in response to an electrical signal applied thereto. The electronic device includes a display unit that displays an image or a sensing unit that senses an external input. The organic light emitting display panel included in the display unit has advantageous properties such as low power consumption, high brightness, and fast response speed.

[0005] Meanwhile, the electronic device includes an electronic module that receives an external signal or outputs an output signal to the outside, and the electronic module is accommodated in an external case together with a display panel to form the electronic device.

[0006] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0007] The method according to the exemplary embodiment of the present invention can provide a method of manufacturing an electronic device, which can form an electronic module with improved durability.

[0008] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] According to one or more exemplary embodiments of the present invention, a method for manufacturing an electronic device includes: providing a working substrate, the working substrate including a pre-set module and a protective film, the pre-set module including an effective area and an ineffective area, wherein the effective area includes a hole forming area, the ineffective area is defined to be adjacent to the effective area, and the protective film covers at least one of an upper surface and a rear surface of the pre-set module; radiating a laser beam to a first starting point defined in the hole forming area; radiating a laser beam to the working substrate from the first starting point toward a moving path to form a first starting cutting line in the hole forming area by removing at least a portion of the working substrate located between the first starting point and the moving path, the moving path of the laser beam being defined as a boundary between the hole forming area and the effective area; radiating the laser beam along the moving path; and removing the hole forming area from the pre-set module to form a setting module in which a module hole can be defined, wherein the first starting cutting line forms a predetermined angle relative to a tangent line at a point where the first starting cutting line intersects the moving path.

[0010] The method may further include radiating the laser beam from the moving path toward a first end point defined within the hole forming area.

[0011] The method may also include: forming a first ending cutting line from the moving path to a first ending point in the hole forming area by removing at least a portion of the working substrate using a laser beam, wherein one end of the first starting cutting line and one end of the first ending cutting line may overlap each other on the moving path.

[0012] The other end of the first start cutting line and the other end of the first end cutting line may be spaced apart from each other in the hole forming region.

[0013] The first start cutting line may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm.

[0014] While the laser beam is irradiated along the moving path, the laser beam may be rotated a plurality of times along the moving path.

[0015] The angle may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0016] The method may also include: radiating the laser beam to a second starting point defined in the hole forming area and separated from the first starting point; radiating the laser beam from the second starting point in a direction toward a moving path; radiating the laser beam along the moving path; and radiating the laser beam from the moving path in a direction toward a second end point defined in the hole forming area.

[0017] The method may further include removing the protective film from the setup module.

[0018] The laser beam may include at least one of a picosecond laser beam and a femtosecond laser beam.

[0019] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the inventive concept. The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0021] Figure 1 is an assembled perspective view showing an electronic device according to an exemplary embodiment of the present disclosure.

[0022] Figure 2A and Figure 2B is a perspective view showing an electronic device according to an exemplary embodiment of the present disclosure.

[0023] Figure 3A is an exploded perspective view showing an electronic device according to an exemplary embodiment of the present disclosure.

[0024] Figure 3B It is shown Figure 3A A block diagram of the electronic device shown in FIG.

[0025] Figure 4A is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0026] Figure 4B is a plan view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0027] Figure 5A is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0028] Figure 5B is a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0029] Fig. 6A , Figure 6B and Figure 6C is a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0030] Figure 7 is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0031] Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E is a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0032] Fig. 9A , Fig. 9B and Fig. 9C is a perspective view illustrating a dummy component according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0033] In the following description, for the purpose of explanation, many specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "implementation" and "implementation" are interchangeable words, which are non-limiting examples of one or more devices or methods using the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, known structures and devices are shown in block diagram form in order to avoid unnecessary obscurity of various exemplary embodiments. In addition, various exemplary embodiments may be different, but do not have to be exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0034] Unless otherwise specified, the illustrated exemplary embodiments should be understood as providing exemplary features of varying details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of various embodiments may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0035] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the exemplary embodiments can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0036] When an element such as a layer is referred to as "on" another element or layer, "connected to" or "coupled to" another element or layer, it can be directly on another element or layer, directly connected to or directly coupled to another element or layer, or there can be an intervening element or layer. However, when an element or layer is referred to as "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there is no intervening element or layer. For this reason, the term "connection" can refer to a physical connection, electrical connection and / or fluid connection with or without an intervening element. In addition, the D1 axis, the D2 axis and the D3 axis are not limited to the three axes of a rectangular coordinate system, such as an x-axis, a y-axis and a z-axis, and can be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis can be perpendicular to each other, or different directions that are not perpendicular to each other can be represented. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0037] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0038] For descriptive purposes, spatially relative terms such as "below," "below," "under," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein, and thereby describe the relationship of one element to another element (or elements) as shown in the accompanying drawings. In addition to the orientation depicted in the accompanying drawings, spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both above and below orientations. Additionally, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0039] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to also include the plural forms, unless the context clearly indicates otherwise. In addition, when used in this specification, the terms "comprises", "comprising", "includes" and / or "including" specify the existence of the features, wholes, steps, operations, elements, components and / or groups thereof described, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. It is also noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms rather than as degree terms, and therefore, are used to allow for the inherent deviations in the measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0040] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views as schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, variations in the shapes in the figures, such as due to manufacturing techniques and / or tolerances, should be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as being limited to the specific illustrated regional shapes, but should include deviations in shapes such as those caused by manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0041] As is customary in the art, some exemplary embodiments are shown and described in the drawings for functional blocks, units and / or modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic circuits (or optical circuits) such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connectors, etc., which can be formed using semiconductor-based manufacturing technology or other manufacturing technology. In the case where the blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled by software (e.g., microcode) to perform the various functions discussed herein, and they can be selectively driven by firmware and / or software. It is also conceivable that each block, unit and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed microprocessors and associated circuits) for performing other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module in some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0042] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0043] Figure 1 is an assembled perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 2A and Figure 2B is a perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 2A Shown in the first mode Figure 1 A perspective view of the electronic device EA shown in FIG. Figure 2B Shows the second mode Figure 1 In the following, reference will be made to the electronic device EA shown in FIG. Figure 1 , Figure 2A and Figure 2B The present disclosure is described.

[0044] The electronic device EA may be a device that is activated in response to an electrical signal applied thereto. The electronic device EA may include various embodiments. For example, the electronic device EA may be a tablet computer, a notebook computer, a computer, or a smart TV. In this exemplary embodiment, a smart phone is described as a representative example of the electronic device EA.

[0045] The electronic device EA displays an image IM through the transmissive area TA. The image IM includes at least one of a still image and a moving image. Figure 1 A clock widget and application icons are shown as representative examples of the image IM.

[0046] The transmission area TA may have a quadrilateral shape substantially parallel to each of the first direction DR1 and the second direction DR2, however, this is merely exemplary. The transmission area TA may include various shapes and should not be particularly limited.

[0047] The frame area BZA is defined to be adjacent to the transmission area TA. The frame area BZA may surround the transmission area TA. However, this is merely exemplary, and the frame area BZA may be defined to be adjacent to only one side of the transmission area TA, or may be omitted. The electronic device EA according to an exemplary embodiment of the present disclosure may include various embodiments and should not be limited to a specific embodiment.

[0048] The hole area HA may be defined in the electronic device EA according to the exemplary embodiment of the present disclosure. The hole area HA may be connected to the electronic module EM (refer to Figure 3A ) overlap. That is, the hole area HA may be an area where a camera or the like is set to photograph an external object or an area where an optical sensor is set to sense light. The image IM may be displayed while surrounding at least a portion of the edge of the hole area HA. ​​In the present exemplary embodiment, the image IM may be displayed while surrounding the hole area HA. ​​This will be described in detail later.

[0049] The tangent direction of the front surface FS may correspond to the thickness direction DR3 of the electronic device EA (hereinafter, referred to as the "third direction"). In the present exemplary embodiment, the front surface (or upper surface) and the rear surface (or lower surface) of each member are defined relative to the direction in which the image IM is displayed. The front surface and the rear surface of each member are opposite to each other in the third direction DR3.

[0050] The directions indicated by the first direction DR1, the second direction DR2 and the third direction DR3 are opposite to each other and can be changed to other directions. Hereinafter, the first direction, the second direction and the third direction are respectively indicated by the first direction DR1, the second direction DR2 and the third direction DR3 and are assigned the same reference numerals.

[0051] The electronic device EA may have an appearance defined by the window WM and the external housing HU. A front surface FS of the electronic device EA may be defined in the window WM.

[0052] Reference Figure 2A and Figure 2B , the electronic device EA can be folded relative to predetermined folding axes FX1 and FX2. Figure 2A As shown in , the electronic device EA-F1 can be folded relative to the first folding axis FX1. The first folding axis FX1 can be defined on the window WM. Therefore, the electronic device EA-F1 can be folded so that in the first mode, different parts of the window WM face each other and the outer housing HU is exposed to the outside.

[0053] like Figure 2B As shown in , the electronic device EA-F2 can be folded relative to the second folding axis FX2. The second folding axis FX2 can be defined on the external housing HU. Therefore, the electronic device EA-F2 can be folded so that in the second mode, different parts of the external housing HU face each other and the window WM is exposed to the outside. The user can easily view the image IM displayed by the electronic device EA-F2 in the folded state of the electronic device EA-F2.

[0054] The first folding axis FX1 and the second folding axis FX2 may basically exist in the electronic device EA at the same time. In this case, the electronic device EA may be transformed into the electronic device EA-F1 of the first mode or the electronic device EA-F2 of the second mode according to the direction of the external force applied thereto. As another way, the first folding axis FX1 and the second folding axis FX2 may selectively exist in the electronic device EA. At the same time, the extension direction of the first folding axis FX1 and the second folding axis FX2 may be limited to various directions, not limited to Figure 2A and Figure 2B The directions shown in FIG. 1 are for reference only and should not be limited to a particular embodiment.

[0055] The electronic device EA may be folded with respect to the folding axes FX1 and FX2, however, this is merely exemplary. The electronic device EA may have a rigid property of not being folded, and should not be limited to a specific embodiment.

[0056] Figure 3A is an exploded perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 3B It is shown Figure 3A The block diagram of the electronic device EA shown in FIG. Figure 3A and Figure 3B The present disclosure is described.

[0057] Reference Figure 3A, the electronic device EA may include a window WM, a setting module SM, an electronic module EM and an external housing HU.

[0058] In the present exemplary embodiment, the setup module SM may include the electronic panel EP, the optical film POL, the adhesive layer ADL, the circuit board DC, and the protection layer PTL. As described above, the window WM and the exterior housing HU are coupled to each other to define the appearance of the electronic device EA.

[0059] The window WM may be disposed on the electronic panel EP and cover the front surface IS of the electronic panel EP. The window WM may include an optically transparent insulating material. In addition, the window WM may have flexibility. For example, the window WM may include a resin film of polyimide, a resin substrate, or a thin glass substrate.

[0060] The window WM may have a single-layer structure or a multi-layer structure. For example, the window WM may have a stacked structure in which a plurality of plastic films are coupled to each other by an adhesive, or may have a stacked structure in which a glass substrate and a plastic film are coupled to each other by an adhesive.

[0061] The window WM may include a front surface FS exposed to the outside. The front surface FS of the electronic device EA may be defined by the front surface FS of the window WM. In detail, the transmission area TA may be an optically transparent area. The transmission area TA may have a shape corresponding to the active area AA. For example, the transmission area TA may overlap the entire portion or at least a portion of the active area AA. The image IM displayed by the active area AA of the electronic panel EP (see Figure 1 ) can be viewed from the outside through the transmission area TA.

[0062] The bezel area BZA may be an area having relatively low light transmittance compared to the transmission area TA. The bezel area BZA may define the shape of the transmission area TA. The bezel area BZA may be defined adjacent to the transmission area TA and may surround the transmission area TA.

[0063] The frame area BZA may have a predetermined color. When the window WM is a glass substrate or a plastic substrate, the frame area BZA may be a color layer printed or deposited on the surface of the glass substrate or the plastic substrate. Alternatively, the frame area BZA may be formed by coloring a corresponding area of ​​the glass substrate or the plastic substrate.

[0064] The bezel area BZA may cover the peripheral area NAA of the electronic panel EP to prevent the peripheral area NAA from being observed from the outside, however, this is merely exemplary. According to an exemplary embodiment of the present disclosure, the bezel area BZA may be omitted from the window WM.

[0065] The electronic panel EP may display an image IM. The electronic panel EP may include a front surface IS in which an active area AA and a peripheral area NAA are defined. The active area AA may be an area activated in response to an electrical signal.

[0066] In the present exemplary embodiment, the active area AA may be an area through which the image IM is displayed. The transmissive area TA may overlap at least with the active area AA. For example, the transmissive area TA may overlap with the entire portion or at least a portion of the active area AA. Therefore, the user may view the image IM through the transmissive area TA.

[0067] The peripheral area NAA may be covered by the bezel area BZA. The peripheral area NAA may be defined as being adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or a driving line may be arranged in the peripheral area NAA to drive the elements in the active area AA.

[0068] Various signal lines, pads PD, or electronic components may be provided in the peripheral area NAA to apply electrical signals to the active area AA. The peripheral area NAA may be covered by the bezel area BZA, and thus, the peripheral area NAA may not be observed from the outside.

[0069] In the present exemplary embodiment, the electronic panel EP may be assembled in a flat state so that the active area AA and the peripheral area NAA face the window WM, however, this is merely exemplary. That is, a portion of the peripheral area NAA of the electronic panel EP may be curved. In this case, a portion of the peripheral area NAA may face the rear surface of the electronic device EA, and therefore, the border area BZA in the front surface FS of the electronic device EA may be reduced. As another way, the electronic panel EP may be assembled to allow a portion of the active area AA to be curved. In addition, according to an exemplary embodiment of the present disclosure, the peripheral area NAA may be omitted from the electronic panel EP.

[0070] The panel hole HH may be defined through the electronic panel EP. At least a portion of the panel hole HH may be surrounded by the active area AA. In the present exemplary embodiment, the panel hole HH may be spaced apart from the peripheral area NAA. The panel hole HH may be defined in the active area AA so that its edge is completely surrounded by the active area AA. In the assembled state of the electronic device EA according to the present exemplary embodiment, the panel hole HH may be formed at a position overlapping with the transmission area TA and spaced apart from the frame area BZA.

[0071] The circuit board DC may be connected to the electronic panel EP. The circuit board DC may include a flexible board CF and a main board MB. The flexible board CF may include an insulating film and a wire mounted on the insulating film. The wire may be connected to the pad PD to electrically connect the circuit board DC and the electronic panel EP.

[0072] In the present exemplary embodiment, the flexible board CF can be assembled in a curved state. Therefore, the main board MB can be set on the rear surface of the electronic panel EP and can be stably accommodated in the space provided by the external housing HU. At the same time, in the present exemplary embodiment, the flexible board CF can be omitted, and in this case, the main board MB can be directly connected to the electronic panel EP.

[0073] The main board MB may include signal lines and electronic components not shown in the figure. The electronic components may be connected to the signal lines and may be electrically connected to the electronic panel EP. The electronic components may generate various electrical signals (e.g., signals for generating an image IM or signals for sensing an external input), and may process the sensed signals. Meanwhile, the main board MB may be provided in plurality to correspond to each electrical signal generated and processed thereby, however, it should not be limited to a specific embodiment.

[0074] Meanwhile, in the electronic device EA according to the exemplary embodiment of the present disclosure, the driving circuit that applies the electrical signal to the active area AA may be directly mounted on the electronic panel EP. In the present exemplary embodiment, the driving circuit may be mounted in chip form or may be formed together with the pixel. In this case, the area of ​​the circuit board DC may be reduced, or the circuit board DC may be omitted. The electronic device EA according to the exemplary embodiment of the present disclosure may include various embodiments, and it should not be limited to a specific embodiment.

[0075] The optical film POL may be disposed between the window WM and the electronic panel EP. The optical film POL may reduce the reflectivity of external light incident thereon from the outside of the window WM with respect to the electronic panel EP. In the present exemplary embodiment, the optical film POL may include a polarizing film or a color filter.

[0076] A predetermined hole HH-P (hereinafter, referred to as an "optical film hole") may be defined through the optical film POL. The optical film hole HH-P may be defined through an area corresponding to the panel hole HH of the electronic panel EP. In the present exemplary embodiment, the optical film hole HH-P may be defined in a position overlapping with the panel hole HH, and may have a shape matching the shape of the panel hole HH, however, this is merely exemplary. Due to process errors, there may be a tolerance in position and size between the optical film hole HH-P of the electronic panel EP and the panel hole HH.

[0077] The adhesive layer ADL may be disposed between the optical film POL and the window WM. The adhesive layer ADL may connect the optical film POL and the window WM. In the case where the optical film POL according to the present disclosure is a color filter formed in the electronic panel EP, the adhesive layer ADL may substantially connect the electronic panel EP and the window WM. The adhesive layer ADL may include an optically transparent adhesive, an optically transparent resin, or a pressure-sensitive adhesive, however, it should not be limited to a specific embodiment as long as the adhesive layer ADL is optically transparent.

[0078] A predetermined hole HH-A (hereinafter, referred to as an "adhesive layer hole") may be defined through the adhesive layer ADL. The adhesive layer hole HH-A may be formed along the panel hole HH of the electronic panel EP. In the present exemplary embodiment, the adhesive layer hole HH-A and the optical film hole HH-P are aligned along the panel hole HH of the electronic panel EP, however, this is merely exemplary. Due to process errors, the adhesive layer hole HH-A and the optical film hole HH-P may form a predetermined step difference with the panel hole HH of the electronic panel EP.

[0079] The protective layer PTL may be disposed under the electronic panel EP. The protective layer PTL may include a plurality of layers, and the protective layer PTL may include various layers to relieve stress applied to the electronic panel EP when the electronic panel EP is folded or to protect the electronic panel EP from external impact. For example, the protective layer PTL may include a buffer layer having a foam shape to absorb the impact of the electronic panel EP, a light blocking layer to block light from the electronic panel EP, and a heat dissipation layer to dissipate heat generated from the electronic panel EP.

[0080] A predetermined hole HH-T (hereinafter, referred to as a "protective layer hole") may be defined through the protective layer PTL. The protective layer hole HH-T may be formed along the panel hole HH of the electronic panel EP. In the present exemplary embodiment, the protective layer hole HH-T, the adhesive layer hole HH-A, and the optical film hole HH-P are aligned to correspond to the panel hole HH of the electronic panel EP, however, this is merely exemplary. The protective layer hole HH-T, the adhesive layer hole HH-A, and the optical film hole HH-P may form a predetermined step difference with the panel hole HH of the electronic panel EP due to process errors.

[0081] The electronic module EM may be disposed below the window WM. In a plan view, the electronic module EM may overlap the panel hole HH. The electronic module EM may receive an external input transmitted through the panel hole HH, or may provide an output through the panel hole HH.

[0082] A receiving portion receiving external input or an output portion providing output in the electronic module EM may overlap the panel hole HH in a plan view. According to the present disclosure, the electronic module EM may be disposed to overlap the active area AA, and thus, the bezel area BZA may be prevented or suppressed from increasing.

[0083] refer to Figure 3B , the electronic device EA may include an electronic panel EP, a power module PS, a first electronic module EM1, and a second electronic module EM2. The electronic panel EP, the power module PS, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other.

[0084] exist Figure 3B , a display unit DU and a sensing unit SU in a configuration of an electronic panel EP are shown as representative examples. The display unit DU may include a plurality of pixels and may display an image IM. The sensing unit SU may sense an external input applied to the window WM. The external input may include various types of external inputs, such as a part of the body of a user using the electronic device EA, light, heat, or pressure provided from the outside. In addition, the electronic device EA may sense proximity inputs and touch inputs to the electronic device EA. The sensing unit SU may be stacked on the display unit DU, or may be inserted into the display unit DU to be formed integrally with the display unit DU.

[0085] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for operating the electronic device EA. The first electronic module EM1 may be directly mounted on a motherboard electrically connected to the electronic panel EP, or may be electrically connected to the motherboard via a connector (not shown) after being mounted on a separate substrate.

[0086] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some of the above modules may be electrically connected to the motherboard through a flexible circuit board without being mounted on the motherboard.

[0087] The control module CM may control the overall operation of the electronic device EA. The control module CM may be, but is not limited to, a microprocessor. For example, the control module CM may activate or deactivate the electronic panel EP. The control module CM may control other modules such as the image input module IIM, the audio input module AIM, etc. based on a touch signal provided from the electronic panel EP.

[0088] The wireless communication module TM can transmit / receive wireless signals to / from other terminals using a Bluetooth or WiFi link. The wireless communication module TM can transmit / receive voice signals using a universal communication line. The wireless communication module TM may include a transmitter TM1 and a receiver TM2, the transmitter TM1 modulates the signal to be transmitted and transmits the modulated signal, and the receiver TM2 demodulates the signal applied thereto.

[0089] The image input module IIM may process an image signal and may convert the image signal into image data that may be displayed through the electronic panel EP. The audio input module AIM may receive an external sound signal through a microphone in a recording mode or a voice recognition mode and may convert the external sound signal into electrical voice data.

[0090] The external interface IF serves as an interface between the control module CM and external devices, such as an external charger, a wired / wireless data port, a card slot (eg, a memory card and a SIM / UIM card), and the like.

[0091] The second electronic module EM2 may include an audio output module AOM, a light emitting module LM, a light receiving module LRM, and a camera module CMM. The configuration may be directly mounted on a motherboard, may be electrically connected to an electronic panel EP via a connector (not shown) after being mounted on a separate substrate, or may be electrically connected to the first electronic module EM1.

[0092] The audio output module AOM may convert sound data provided from the wireless communication module TM or sound data stored in the memory MM, and may output the converted sound data to the outside.

[0093] The light emitting module LM may generate light and may output light. The light emitting module LM may emit infrared rays. The light emitting module LM may include an LED element. The light receiving module LRM may sense infrared rays. When infrared rays having a predetermined level or higher are sensed, the light receiving module LRM may be activated. The light receiving module LRM may include a complementary metal oxide semiconductor (CMOS) sensor. The infrared rays generated by the light emitting module LM and output from the light emitting module LM may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared rays may be incident into the light receiving module LRM. The camera module CMM may capture an image of an external object.

[0094] The electronic module EM according to an exemplary embodiment of the present disclosure may include at least one of the configurations of the first electronic module EM1 and the second electronic module EM2. For example, the electronic module EM may include at least one of a camera, a speaker, a light sensor, and a thermal sensor. The electronic module EM may sense an external object through the panel hole HH, and may provide a sound signal such as a voice to the outside through the panel hole HH. In addition, the electronic module EM may include a variety of configurations, and it should not be limited to a specific embodiment.

[0095] According to the present disclosure, the electronic module EM may be assembled to overlap the transmissive area TA in a plan view. Therefore, although the electronic module EM is accommodated, the bezel area BZA may be prevented or suppressed from increasing, and the aesthetics of the electronic device EA may be improved.

[0096] Figure 4A is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. Figure 4B is a plan view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. Figure 5A is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. Figure 5B is a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. Fig. 6A , Figure 6B , Figure 6C is a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. Figure 7 is a cross-sectional view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure. Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E is a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0097] In the following, reference will be made to Figure 4A , Figure 4B , Figure 5A , Figure 5B , Fig. 6A , Figure 6B , Figure 6C , Figure 7 , Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E The method for manufacturing an electronic device according to an exemplary embodiment of the present disclosure will be described in detail. Figure 3A ) is formed in the electronic module EM overlapped with the hole HH-A, HH-P, HH and HH-T manufacturing method of the electronic device. Figure 4A , Figure 4B , Figure 5A , Figure 5B , Fig. 6A , Figure 6B , Figure 6C , Figure 7 , Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E In the same / similar reference numerals, Figure 1 , Figure 2A , Figure 2B , Figure 3A and Figure 3B, and thus, detailed description of the same / similar elements having the same / similar reference numerals will be omitted.

[0098] The method of manufacturing an electronic device according to the present exemplary embodiment may include providing an working substrate EAS The working substrate EAS may include a pre-set module SM-A and protective films PF1 and PF2.

[0099] In this exemplary embodiment, the pre-setting module SM-A may be defined as a module located in a region where the holes HH-A, HH-P, HH and HH-T are formed and included in the Figure 3A Therefore, the pre-setting module SM-A may include the electronic panel EP, the optical film POL, the adhesive layer ADL and the protective layer PTL in the states before the holes HH-A, HH-P, HH and HH-T are formed, respectively. For ease of explanation, the circuit board DC will be omitted in the following figures.

[0100] Reference Figure 4A and Figure 4B The pre-setting module SM-A includes an active area AA having a hole forming area CA and a peripheral area NAA defined to be adjacent to the active area AA. In addition, the pre-setting module SM-A includes an upper surface SU and a rear surface SB opposite to the upper surface SU.

[0101] Figure 4B The hole forming area CA is shown as being defined at the upper left end of the active area AA, however, the position of the hole forming area CA should not be limited thereto or thereby. For example, the hole forming area CA may be defined as being Figure 3A The area where the electronic modules EM shown in FIG. 8 overlap, and the shape and number of the hole forming areas CA should not be particularly limited as long as the hole forming areas CA are defined within the effective area AA.

[0102] The protection films PF1 and PF2 may be disposed on at least one of the upper surface SU and the back surface SB of the pre-set module SM-A. Although not shown in the drawings, the protection films PF1 and PF2 may be attached to the pre-set module SM-A through an adhesive layer.

[0103] The protective films PF1 and PF2 can protect the pre-set module SM-A from external impacts generated when transporting and assembling the pre-set module SM-A. The protective films PF1 and PF2 can prevent or inhibit external moisture from entering the pre-set module SM-A, and can absorb external impacts. In addition, the protective films PF1 and PF2 can prevent or inhibit residues generated when a hole is formed through the pre-set module SM-A from entering the pre-set module SM-A.

[0104] The protective films PF1 and PF2 may protect the pre-set module SM-A. The protective films PF1 and PF2 may provide an outer surface exposed to the outside and may provide an adhesive surface attached to the adhesive member. The protective films PF1 and PF2 may prevent or inhibit external moisture from entering the pre-set module SM-A and may absorb external impact.

[0105] The protective films PF1 and PF2 may include a plastic film as a base layer thereof. The protective films PF1 and PF2 may include a plastic film containing one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone) and combinations thereof.

[0106] The material used for the protective films PF1 and PF2 should not be limited to plastic resins and may include organic-inorganic composite materials. The protective films PF1 and PF2 may include a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective films PF1 and PF2 may also include a functional layer formed in a plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. According to an exemplary embodiment of the present disclosure, the protective films PF1 and PF2 may be omitted.

[0107] The method of manufacturing the electronic device according to the present exemplary embodiment may include irradiating a laser beam to a first starting point SP defined within the hole forming area CA.

[0108] Reference Figure 5A and Figure 5B , the laser unit LS may radiate the laser beam onto the upper surface SU of the pre-set module SM-A. The laser beam may be radiated from a predetermined point defined within the hole forming area CA, which is defined by the effective area AA of the pre-set module SM-A. For example, the laser beam of the present exemplary embodiment may be radiated from a first starting point SP defined within the hole forming area CA.

[0109] According to the present disclosure, the boundary between the hole forming area CA and the active area AA may be defined as a path along which the laser beam is radiated, that is, a moving path MP of the laser unit LS. Therefore, the laser beam may be radiated along the moving path MP to remove the area of ​​the pre-setting module SM-A that overlaps with the hole forming area CA. In the present exemplary embodiment, the laser beam may be a picosecond laser beam or a femtosecond laser beam.

[0110] The method of manufacturing the electronic device according to the present exemplary embodiment may include irradiating a laser beam from a first starting point SP toward a direction toward a moving path MP.

[0111] Reference Fig. 6A , the laser unit LS may move from the first starting point SP toward the moving path MP while radiating the laser beam. When the laser unit LS is operated, the intensity of the initial laser beam in the preheating stage may be weaker than the intensity of the laser beam just before entering the moving path MP. According to the present disclosure, the irradiation of the initial laser beam starts from the first starting point SP defined in the hole forming area CA to uniformly maintain the intensity of the laser beam radiated onto the moving path MP. Therefore, a laser beam with uniform intensity can be radiated onto the moving path MP.

[0112] According to the present disclosure, the laser beam may have an intensity equal to or greater than about 5 W and equal to or less than about 10 W. The laser unit LS may move along the moving path MP at a processing speed equal to or greater than about 300 nm / s and equal to or less than about 5000 nm / s. In addition, the laser beam has a frequency equal to or greater than about 400 KHz and equal to or less than about 2 MHz.

[0113] According to the present disclosure, the first start cut line SL may be formed in the hole forming area CA. The first start cut line SL may be formed by removing at least a portion along a thickness direction of the working substrate EAS by irradiating a laser beam from a first start point SP to a moving path MP.

[0114] The first cut start line SL may have a predetermined angle θ1 with respect to a tangent line CX at a point where the first cut start line SL intersects the moving path MP. The angle θ1 may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0115] The first start cut line SL may have a curved shape having a predetermined curvature, however, the shape of the first start cut line SL should not be limited to the curved shape. That is, the first start cut line SL may have a straight line shape.

[0116] The first start cut line SL may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm, that is, a length from the first start point SP to the moving path MP.

[0117] The method of manufacturing an electronic device according to the present exemplary embodiment may include irradiating a laser beam along a moving path.

[0118] Reference Figure 6B , the laser unit LS may move from the first starting cutting line SL to enter the moving path MP while forming the first starting cutting line SL. In this case, the laser unit LS may rotate multiple times along the moving path MP and may radiate a laser beam of uniform intensity. For example, the laser unit LS may rotate along the moving path MP within a range of equal to or greater than once and equal to or less than 150 times.

[0119] Reference Figure 6C , the laser unit LS may be moved from the moving path MP to the first end point FP within the hole forming area CA. According to an exemplary embodiment, after the laser unit LS is moved onto the moving path MP, the laser unit LS may be moved from the moving path MP to the first end point FP within the hole forming area CA. According to the present disclosure, the irradiation of the initial laser beam ends at the first end point FP defined within the hole forming area CA to uniformly maintain the intensity of the laser beam irradiated onto the moving path MP. Therefore, a laser beam having a uniform intensity may be irradiated onto the moving path MP.

[0120] According to the present disclosure, the first end cut line FL may be formed in the hole forming area CA by removing at least a portion along a thickness direction of the working substrate EAS through a process of irradiating a laser beam from the moving path MP to the first end point FP.

[0121] The first end cutting line FL may have a predetermined angle θ2 with respect to a tangent line CX at a point where the first end cutting line FL intersects the moving path MP. The angle θ2 may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0122] The first end cut line FL may have a curved shape having a predetermined curvature, however, the shape of the first end cut line FL should not be limited to the curved shape. That is, the first end cut line FL may have a straight line shape.

[0123] The first ending cut line FL may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm, that is, a length from the moving path MP to the first ending point FP.

[0124] The method of manufacturing the electronic device according to the present exemplary embodiment may include forming a setting module having a module hole defined therein by removing a hole forming region from a pre-setting module and removing a protective film from the setting module.

[0125] Reference Figure 7 By irradiating a laser beam along the moving path MP using the laser unit LS, the hole forming area CA may be removed from the pre-set module SM-A. The portion from which the hole forming area CA is removed may be defined as a module hole MH. The module hole MH may be formed by Figure 3A The adhesive layer hole HH-A, the optical film hole HH-P, the panel hole HH and the protective layer hole HH-T shown in FIG. 1 and aligned with each other are defined.

[0126] Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8Eis a perspective view illustrating a method of manufacturing an electronic device according to an exemplary embodiment of the present disclosure.

[0127] Reference Fig. 8A , the laser unit LS may radiate the laser beam onto the upper surface SU of the pre-set module SM-A. The laser beam may be radiated from a predetermined point defined within the hole forming area CA, which is defined by the effective area AA of the pre-set module SM-A. For example, the laser beam of the present exemplary embodiment may be radiated from a first starting point SP1 defined within the hole forming area CA.

[0128] The method of manufacturing the electronic device according to the present exemplary embodiment may include irradiating a laser beam from a first starting point SP1 toward a direction toward a moving path MP.

[0129] Reference Figure 8B , the laser unit LS may move from the first starting point SP1 toward the moving path MP while radiating the laser beam. When the laser unit LS is operated, the intensity of the initial laser beam in the preheating stage may be weaker than the intensity of the laser beam just before entering the moving path MP. According to the present disclosure, the irradiation of the initial laser beam starts from the first starting point SP1 defined within the hole forming area CA to uniformly maintain the intensity of the laser beam radiated onto the moving path MP. Therefore, a laser beam having a uniform intensity can be radiated onto the moving path MP.

[0130] According to the present disclosure, the first start cut line SL1 may be formed in the hole forming area CA. The first start cut line SL1 may be formed by removing at least a portion along a thickness direction of the working substrate EAS by irradiating a laser beam from a first start point SP1 to a moving path MP.

[0131] The first cut start line SL1 may have a predetermined angle θ1 with respect to a tangent line CX1 at a point where the first cut start line SL1 intersects the moving path MP. The angle θ1 may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0132] The first start cut line SL1 may have a curved shape having a predetermined curvature, however, the shape of the first start cut line SL1 should not be limited to the curved shape. That is, the first start cut line SL1 may have a straight line shape.

[0133] The first start cut line SL1 may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm, that is, a length from the first start point SP1 to the moving path MP.

[0134] The method of manufacturing an electronic device according to the present exemplary embodiment may include irradiating a laser beam along a moving path.

[0135] Reference Figure 8C , the laser unit LS may start to move from the first starting cutting line SL1 to enter the moving path MP while forming the first starting cutting line SL1. In this case, the laser unit LS may rotate multiple times along the moving path MP and may radiate a laser beam of uniform intensity. For example, the laser unit LS may rotate along the moving path MP within a range of equal to or greater than once and equal to or less than 150 times.

[0136] The laser unit LS may be moved from the moving path MP to the first end point FP1 within the hole forming area CA. According to an exemplary embodiment, after the laser unit LS is moved onto the moving path MP, the laser unit LS may be moved from the moving path MP to the first end point FP1 within the hole forming area CA. According to the present disclosure, the irradiation of the initial laser beam ends at the first end point FP1 defined within the hole forming area CA to uniformly maintain the intensity of the laser beam irradiated onto the moving path MP. Therefore, a laser beam having a uniform intensity may be irradiated onto the moving path MP.

[0137] According to the present disclosure, the first end cut line FL1 may be formed in the hole forming area CA by removing at least a portion along a thickness direction of the working substrate EAS through a process of irradiating a laser beam from the moving path MP to the first end point FP1.

[0138] The first end cutting line FL1 may have a predetermined angle θ2 with respect to a tangent line CX1 at a point where the first end cutting line FL1 intersects the moving path MP. The angle θ2 may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0139] The first end cutting line FL1 may have a curved shape having a predetermined curvature, however, the shape of the first end cutting line FL1 should not be limited to the curved shape. That is, the first end cutting line FL1 may have a straight line shape.

[0140] The first ending cut line FL1 may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm, that is, a length from the moving path MP to the first ending point FP1 .

[0141] refer to Fig.8D , the laser unit LS may move from the second starting point SP2 toward the moving path MP while radiating the laser beam. When the laser unit LS is operated, the intensity of the initial laser beam in the preheating stage may be weaker than the intensity of the laser beam just before entering the moving path MP. According to the present disclosure, the irradiation of the initial laser beam starts from the second starting point SP2 defined in the hole forming area CA to uniformly maintain the intensity of the laser beam radiated onto the moving path MP. Therefore, a laser beam having a uniform intensity can be radiated onto the moving path MP.

[0142] According to the present disclosure, the second start cut line SL2 may be formed in the hole forming area CA and may be formed by removing at least a portion along a thickness direction of the working substrate EAS by irradiating a laser beam from the second start point SP2 toward the moving path MP.

[0143] The second cut start line SL2 may have a predetermined angle θ3 with respect to a tangent line CX2 at a point where the second cut start line SL2 intersects the moving path MP. The angle θ3 may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0144] The second start cut line SL2 may have a curved shape having a predetermined curvature, however, the shape of the second start cut line SL2 should not be limited to the curved shape. That is, the second start cut line SL2 may have a straight line shape.

[0145] The second start cut line SL2 may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm, that is, a length from the second start point SP2 to the moving path MP.

[0146] The method of manufacturing an electronic device according to the present exemplary embodiment may include irradiating a laser beam along a moving path.

[0147] Reference Fig. 8E , the laser unit LS may move from the second starting cutting line SL2 to enter the moving path MP while forming the second starting cutting line SL2. In this case, the laser unit LS may rotate multiple times along the moving path MP and may radiate a laser beam of uniform intensity. For example, the laser unit LS may rotate along the moving path MP within a range of equal to or greater than once and equal to or less than 150 times.

[0148] The laser unit LS may be moved from the moving path MP to the second end point FP2 within the hole forming area CA. According to an exemplary embodiment, after the laser unit LS is moved onto the moving path MP, the laser unit LS may be moved from the moving path MP to the second end point FP2 within the hole forming area CA. According to the present disclosure, the irradiation of the initial laser beam ends at the second end point FP2 defined within the hole forming area CA to uniformly maintain the intensity of the laser beam irradiated onto the moving path MP. Therefore, a laser beam having a uniform intensity may be irradiated onto the moving path MP.

[0149] According to the present disclosure, the second end cut line FL2 may be formed in the hole forming area CA by removing at least a portion along a thickness direction of the working substrate EAS through a process of irradiating a laser beam from the moving path MP toward the second end point FP2.

[0150] The second end cutting line FL2 may have a predetermined angle θ4 with respect to a tangent line CX2 at a point where the second end cutting line FL2 intersects the moving path MP. The angle θ4 may be equal to or greater than about 10 degrees and equal to or less than about 90 degrees.

[0151] The second end cutting line FL2 may have a curved shape having a predetermined curvature, however, the shape of the second end cutting line FL2 should not be limited to the curved shape. That is, the second end cutting line FL2 may have a straight line shape.

[0152] The second ending cut line FL2 may have a length equal to or greater than about 500 μm and equal to or less than about 750 μm, that is, a length from the moving path MP to the second ending point FP2.

[0153] The manufacturing method of the electronic device according to the present disclosure may further include forming a setup module SM by forming a module hole MH in the pre-setup module SM-A and removing protective films PF1 and PF2 attached to at least one of the upper surface SU and the back surface SB of the setup module SM.

[0154] According to the present disclosure, when a hole is formed by a laser beam provided from the laser unit LS, the laser beam moves from a point SP (first starting point) defined within the hole forming area CA. Therefore, when the laser unit LS enters the moving path MP, the laser unit LS can radiate a laser beam of uniform intensity while rotating along the moving path MP to form a hole. Therefore, hole formation defects can be reduced, and a method for manufacturing an electronic device with improved reliability can be provided.

[0155] Fig. 9A , Fig. 9B and Fig. 9C is a perspective view showing a dummy component according to an exemplary embodiment of the present disclosure. Fig. 9A , Fig. 9B and Fig. 9C In the same / similar reference numerals, Figure 1 , Figure 2A , Figure 2B , Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 5A , Figure 5B , Fig. 6A , Figure 6B , Figure 6C , Figure 7 , Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E, and thus, detailed description of the same / similar elements having the same / similar reference numerals will be omitted.

[0156] The dummy components DM, DM-A and DM-B described below may be defined as the preset module SM-A through Figure 4A , Figure 4B , Figure 5A , Figure 5B , Fig. 6A , Figure 6B , Figure 6C , Figure 7 , Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E The portion of the hole forming area CA is removed to form the hole forming area CA. Therefore, components included in the dummy parts DM, DM-A, and DM-B may be formed by irradiation of the laser beam.

[0157] Reference Fig. 9A , the method of manufacturing an electronic device according to the present exemplary embodiment may further include radiating the laser beam from the moving path in a direction toward a first end point defined in the hole forming region.

[0158] In the present exemplary embodiment, the dummy part DM may include a start point SP, an end point FP, a start cutting line SL, and an end cutting line FL.

[0159] The starting point SP can be defined as the point where the laser beam is irradiated to the hole forming area CA (refer to Fig. 6A ) and the end point FP may be the laser unit LS (reference Fig. 6A ) along the moving path MP (reference Figure 6B ) after rotating multiple times by leaving the moving path MP to complete the process. In the present exemplary embodiment, the starting point SP and the ending point FP may be spaced apart from each other.

[0160] According to the present disclosure, a start cut line SL and an end cut line FL may be formed in the dummy part DM. The start cut line SL may be formed from the start point SP to the moving path MP by removing at least a portion of the dummy part DM in the thickness direction through a process of irradiating a laser beam. In addition, the end cut line FL may be formed from the moving path MP to the end point FP by removing at least a portion of the dummy part DM in the thickness direction through a process of irradiating a laser beam.

[0161] In the present exemplary embodiment, one end of the start cutting line SL and one end of the end cutting line FL may be located on the moving path MP (refer to Fig. 6A) overlap each other. Therefore, the laser unit LS can start moving from the tangent line CX where the start cutting line SL intersects the moving path MP and advance to the end point FP while forming the end cutting line FL.

[0162] The manufacturing method of the electronic device may also include: radiating the laser beam to a second starting point defined in the hole forming area and spaced apart from the first starting point; radiating the laser beam from the second starting point in a direction toward a moving path; radiating the laser beam along the moving path; and radiating the laser beam from the moving path in a direction toward a second end point defined in the hole forming area.

[0163] Reference Fig. 9B , the dummy component DM-A according to the exemplary embodiment may include two starting points SP1 and SP2 spaced apart from each other and two ending points FP1 and FP2 spaced apart from each other. Therefore, the dummy component DM-A may include a moving path MP (reference Fig. 6A ), a first starting cutting line SL1 formed from the moving path MP to the first ending point FP1, a second starting cutting line SL2 formed from the second starting point SP2 to the moving path MP, and a second ending cutting line FL2 formed from the moving path MP to the second ending point FP2.

[0164] One end of the first start cut line SL1 may cross one end of the first end cut line FL1 on the first cut line CX1. Also, one end of the second start cut line SL2 may cross one end of the second end cut line FL2 on the second cut line CX2.

[0165] The laser unit LS may start its movement at the first starting point SP1, form a first starting cutting line SL1, rotate multiple times along the moving path MP, form a second ending cutting line FL2, and complete one process at the second ending point FP2. Then, the laser unit LS may start its movement at the second starting point SP2, form a second starting cutting line SL2, rotate multiple times along the moving path MP, form a first ending cutting line FL1, and complete a subsequent process after the one process at the first ending point FP1.

[0166] Reference Fig. 9C, the dummy part DM-B may include two or more starting points SP1, SP2, SP3, and SP4 spaced apart from each other and two or more ending points FP1, FP2, FP3, and FP4 spaced apart from each other. Therefore, a plurality of starting cutting lines SL1, SL2, SL3, and SL4 and a plurality of ending cutting lines FL1, FL2, FL3, and FL4 corresponding to the starting points SP1, SP2, SP3, and SP4 and the ending points FP1, FP2, FP3, and FP4 may be formed in the dummy part DM-B.

[0167] The laser unit LS may perform a process while crossing the start points SP1 , SP2 , SP3 , and SP4 and the end points FP1 , FP2 , FP3 , and FP4 .

[0168] According to the above, when a hole is formed using a laser beam, the laser beam moves from a point defined in a hole forming area. Therefore, once the laser beam enters the moving path, the laser beam can be radiated with uniform intensity while rotating along the moving path to form a hole. Therefore, hole formation defects can be reduced, and a manufacturing method of an electronic device with improved reliability can be provided.

[0169] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. A method for manufacturing an electronic device, comprising: A working substrate is provided, the working substrate comprising: A presetting module includes an effective area and an ineffective area, the effective area includes a hole forming area, and the ineffective area is defined to be adjacent to the effective area; and a protective film covering at least one of the upper surface and the rear surface of the pre-set module; irradiating a laser beam toward a first starting point defined in the hole forming area; radiating the laser beam toward the working substrate from the first starting point toward a moving path to form a first starting cutting line in the hole forming area by removing at least a portion of the working substrate between the first starting point and the moving path, the moving path of the laser beam being defined as a boundary between the hole forming area and the effective area; radiating the laser beam along the moving path; removing the hole forming region from the pre-setting module to form a setting module having a module hole defined therein; and radiating the laser beam from the moving path toward a first end point defined in the hole forming area, The first starting cutting line forms a predetermined angle with respect to a tangent line of a point where the first starting cutting line intersects the moving path.

2. The method according to claim 1, further comprising: forming a first end cut line from the moving path to the first end point within the hole forming region by removing at least a portion of the working substrate using the laser beam, Wherein, one end of the first starting cutting line and one end of the first ending cutting line overlap each other on the moving path.

3. The method according to claim 2, wherein: The other end of the first start cutting line and the other end of the first end cutting line are spaced apart from each other in the hole forming area.

4. The method according to claim 1, wherein: The first starting cutting line has a length equal to or greater than 500 μm and equal to or less than 750 μm.

5. The method according to claim 1, wherein: While the laser beam is irradiated along the moving path, the laser beam rotates a plurality of times along the moving path.

6. The method according to claim 1, wherein: The angle is equal to or greater than 10 degrees and equal to or less than 90 degrees.

7. The method according to claim 1, further comprising: irradiating the laser beam toward a second starting point defined in the hole forming area and spaced apart from the first starting point; radiating the laser beam from the second starting point in a direction toward the moving path; radiating the laser beam along the moving path; as well as The laser beam is radiated from the moving path in a direction toward a second end point defined in the hole forming area. The method according to claim 1 , further comprising removing the protective film from the setting module.

9. The method according to claim 1, wherein: The laser beam includes at least one of a picosecond laser beam and a femtosecond laser beam.

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