A device for automatically removing defective electronic detonator chips and foot wires

By designing an automatic exclusion of non -performing products for electronic detonator chips, it solves the problem of large labor intensity and high error rate caused by manual detection. It realizes the rapid and accurate screening of bad products and improves production efficiency.

CN112588620BActive Publication Date: 2025-01-24HANGZHOU JINQI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202011234315.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-11-07
Publication Date
2025-01-24
Estimated Expiration
2040-11-07

AI Technical Summary

Technical Problem

The existing electronic detonator chip detection equipment is manual inspection tooling, which leads to high labor intensity for operators and prone to errors, which poses great risks and affects production efficiency.

Method used

Design a type of electronic detonator chip and foot line automatically eliminating non -performing products, including conveyor belts, positioning molds, brackets, feeding robots and wire clamping mechanisms to achieve automatic screening and feeding of bad products.

Benefits of technology

By automatically removing defective products, the removal speed and accuracy are improved, manual operations are reduced, error rates are reduced, and the production efficiency of the entire production line is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses an automatic defective product rejection device for electronic detonator chips and leads, comprising a conveyor belt and a positioning mold disposed on its upper surface, supports disposed on both sides of the conveyor belt, a material handling robot and a wire clamp removal mechanism mounted on the supports. A fixed base is provided at the bottom of the positioning mold, and a wire clamp is held in the fixed base. The wire clamp removal mechanism is located on the same horizontal plane as the wire clamp. This automatic defective product rejection device for electronic detonator chips and leads can automatically screen out unqualified products after the electronic detonator chips are crimped with lead wires and heat-shrink tubing and undergo product performance testing. This ensures that all products entering the subsequent electronic detonator production process are qualified, reducing waste caused by unqualified incoming materials, freeing up manpower while improving accuracy and increasing the defective product rejection speed, thereby improving the overall production line efficiency.
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Description

Technical Field

[0001] The invention relates to the technical field of electronic detonator chip processing equipment, in particular to a device for automatically removing defective electronic detonator chips and foot wires. Background Art

[0002] In the field of electronic detonator production, the current detection equipment for electronic detonator chips is a manual detection tool. When a product in a group of products is detected to be defective, the operator is required to manually take it out. This method increases the labor intensity of the operator because all sorting is done by the operator, and when the operator is tired, it is easy to make mistakes, which poses a great risk. In summary, the present application proposes a device for automatically removing defective electronic detonator chips and foot lines to solve the above-mentioned problems. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide a device for automatically removing defective electronic detonator chips and foot lines, which can quickly and accurately remove defective products, improve the removal speed, and further improve the production efficiency of the entire production line, which can effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for automatically removing defective electronic detonator chips and foot wires, comprising a conveyor belt and a positioning mold arranged on its upper surface, brackets arranged on both sides of the conveyor belt, a material taking robot installed on the brackets and a wire clamp removal mechanism, a fixed seat is provided at the bottom of the positioning mold, a wire clamp is clamped in the fixed seat, and the wire clamp removal mechanism and the wire clamp are in the same horizontal plane.

[0005] As a preferred technical solution of the present invention, the cross-section of the positioning mold is in the shape of an "I", and fixed seats are provided on both sides of the positioning mold. The material taking robot and the wire clamp taking mechanism are both in two groups and are symmetrically arranged on both sides of the positioning mold.

[0006] As a preferred technical solution of the present invention, ten fixing seats are arranged at equal distances on each side of the positioning mold.

[0007] As a preferred technical solution of the present invention, a collection box is placed on the side of the bracket.

[0008] As a preferred technical solution of the present invention, the wire clamp removal mechanism includes a mounting plate, a driving member is arranged on the mounting plate, a removal block is arranged at the movable end of the driving member, and a removal nail is arranged at the end face of the removal block close to the wire clamp.

[0009] As a preferred technical solution of the present invention, the number of the driving members is five, and the movable end of each driving member is provided with two taking-out blocks, and the taking-out nails are two long nails parallel to each other.

[0010] As a preferred technical solution of the present invention, the driving member is one of a cylinder, a hydraulic cylinder or an electric telescopic rod.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the device for automatically removing defective electronic detonator chips and foot wires can realize automatic screening out of unqualified products after the electronic detonator chip is crimped and the foot wire is sleeved with a heat shrink tube, and after product performance testing, to ensure that all products entering the subsequent electronic detonator production process are qualified products, reduce waste caused by unqualified incoming materials, liberate manpower, improve accuracy, and increase the speed of rejecting defective products, thereby improving the production efficiency of the entire production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the present invention;

[0013] Figure 2 This is an enlarged schematic diagram of the structure at A of the present invention;

[0014] Figure 3 It is a schematic diagram of the structure of the wire clamp removal mechanism of the present invention.

[0015] In the figure: 1 bracket, 2 material taking manipulator, 3 conveyor belt, 4 positioning mold, 5 wire clamp taking out mechanism, 6 collection box, 7 fixing seat, 8 wire clamp, 9 mounting plate, 10 driving member, 11 taking out block, 12 taking out nail. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-3The present invention provides a technical solution: a device for automatically rejecting defective electronic detonator chips and foot wires, comprising a conveyor belt 3 and a positioning mold 4 arranged on the upper surface thereof, a bracket 1 arranged on both sides of the conveyor belt 3, a material taking manipulator 2 and a wire clamp taking-out mechanism 5 installed on the bracket 1, the cross section of the positioning mold 4 is in the shape of an "I", both sides of the positioning mold 4 are provided with a fixing seat 7, the fixing seat 7 is arranged at the bottom of the positioning mold 4, each side of the positioning mold 4 is evenly spaced and provided with ten fixing seats 7, a wire clamp 8 is clamped in the fixing seat 7, the material taking manipulator 2 and the wire clamp taking-out mechanism 5 are both in two groups and are symmetrically arranged at On both sides of the positioning mold 4, the wire clamp removal mechanism 5 and the wire clamp 8 are in the same horizontal plane. The wire clamp removal mechanism 5 includes a mounting plate 9, on which a driving member 10 is arranged. A removal block 11 is arranged at the movable end of the driving member 10, and a removal nail 12 is arranged at the end face of the removal block 11 close to the wire clamp 8. There are five driving members 10, and two removal blocks 11 are arranged at the movable end of each driving member 10. The removal nails 12 are two long nails parallel to each other. The driving member 10 is one of a cylinder, a hydraulic cylinder or an electric telescopic rod. A collection box 6 is placed on the side of the bracket 1 for holding defective products removed by the material taking robot 2.

[0018] During use: when the conveyor belt 3 drives the positioning mold 4 with twenty electronic detonator chips to the defective product rejection station, after the positioning mold 4 is accurately positioned by the secondary positioning device, the movable end of the wire clamp removal mechanism 5 extends out, and two removal nails 12 are inserted from the narrower sides of the upper part of the wire clamp 8. The wire clamp 8 is clamped by the elasticity of the removal nails 12 itself, and then the movable end of the wire clamp removal mechanism 5 retracts to take out the wire clamp 8 in the fixed seat 7, and then the material taking robot 2 takes out the unqualified products detected by the previous station, and finally puts them into the defective product collection box 6, so as to achieve the purpose of automatic unloading of defective products.

Claims

1. A device for automatically removing defective electronic detonator chips and foot wires, characterized in that: The invention comprises a conveyor belt (3) and a positioning mold (4) arranged on the upper surface thereof, brackets (1) arranged on both sides of the conveyor belt (3), a material taking robot (2) and a wire clamp taking-out mechanism (5) installed on the brackets (1), wherein a fixing seat (7) is arranged at the bottom of the positioning mold (4), a wire clamp (8) is clamped in the fixing seat (7), and the wire clamp taking-out mechanism (5) and the wire clamp (8) are located in the same horizontal plane; The cross section of the positioning mold (4) is in the shape of an "I" character, and fixed seats (7) are provided on both sides of the positioning mold (4). The material taking manipulator (2) and the wire clamp taking mechanism (5) are both in two groups and are symmetrically arranged on both sides of the positioning mold (4); The wire clamp removal mechanism (5) comprises a mounting plate (9), a driving member (10) is arranged on the mounting plate (9), a removal block (11) is arranged at the movable end of the driving member (10), and a removal nail (12) is arranged on the end surface of the removal block (11) close to the wire clamp (8); The number of the driving members (10) is five, and the movable end of each driving member (10) is provided with two removal blocks (11), and the removal nails (12) are two long nails parallel to each other; When the conveyor belt (3) drives the positioning mold (4) with twenty electronic detonator chips to the defective product removal station, after the positioning mold (4) is accurately positioned by the secondary positioning device, the active end of the wire clamp removal mechanism (5) extends, and two removal nails (12) are inserted from the narrower sides of the upper part of the wire clamp (8). The wire clamp (8) is clamped by the elasticity of the removal nails (12). Then, the active end of the wire clamp removal mechanism (5) retracts, and the wire clamp (8) in the fixed seat (7) is removed. Then, the material removal robot (2) removes the unqualified products detected by the previous station.

2. The device for automatically removing defective electronic detonator chips and foot wires according to claim 1 is characterized in that: Ten fixing seats (7) are arranged at equal distances on each side of the positioning mold (4).

3. The device for automatically removing defective electronic detonator chips and foot wires according to claim 1 is characterized in that: A collection box (6) is placed on the side of the bracket (1).

4. The device for automatically removing defective electronic detonator chips and foot wires according to claim 1 is characterized in that: The driving member (10) is one of a cylinder, a hydraulic cylinder or an electric telescopic rod.

Citation Information

Patent Citations

  • Device for automatically removing defective products from chips and leg wires of electronic detonators

    CN215587206U