An end effector that can be attached to a manipulator for use with a processing tool

Abstract

The present invention relates to an end actuator that can be connected to a manipulator for use with a processing tool, comprising: a finger assembly, including a base and a pair of fingers extending outward from the base, each pair of fingers including a proximal end adjacent to the base, the finger assembly being coupled to the arm of the manipulator, and a distal end at the front end of the pair of fingers; a first group of contact pads, arranged on the top surface of the finger assembly, at the base and the distal end of the pair of fingers, such that the first group of contact pads defines an outer diameter; a second group of contact pads, arranged on the top surface of the finger assembly, at the proximal end adjacent to the base and close to the distal end, such that the second group of contact pads defines an inner diameter, wherein the outer diameter is arranged concentric with the inner diameter, and the contact surface provided by the first group of contact pads is different from the contact surface provided by the second group of contact pads.

Description

[0001] This application is a divisional application of application No. 201610924742.2, filed on October 24, 2016, and entitled “Automatic replacement of consumable parts using an end effector connected to a plasma processing system”. Technical Field

[0002] Embodiments of the present invention relate to a cluster tool assembly used in manufacturing semiconductor wafers, and more particularly, to a cluster tool assembly that enables removal and replacement of consumable parts within a process module disposed within the cluster tool assembly. Background Art

[0003] A typical cluster tool assembly used in a manufacturing process to produce semiconductor wafers includes one or more processing modules, each of which is used to perform specific manufacturing operations such as cleaning operations, deposition, etching operations, rinsing operations, drying operations, etc. The chemical processes and / or processing conditions used to perform these operations cause some damage to the hardware components of the processing modules, which are often exposed to the harsh conditions within the processing modules. These damaged or worn hardware components need to be replaced in a timely manner to ensure that the damaged hardware components do not expose other hardware components in the processing modules to the harsh conditions and to ensure the quality of the semiconductor wafers. For example, an edge ring disposed near a semiconductor wafer in a processing module may frequently be damaged due to the position of the edge ring and its continuous exposure to ion bombardment from the plasma generated in the processing module used in the etching operation. A damaged edge ring needs to be replaced in a timely manner to ensure that the damaged edge ring does not expose underlying hardware components (such as a chuck) to the harsh process conditions. Replaceable hardware components are referred to as consumable parts in this article.

[0004] Current methods for replacing damaged consumable parts require a series of steps performed by trained service technicians. The technician needs to take the cluster tool assembly offline, pump / clean the cluster tool assembly to avoid exposure to toxic residues, open the cluster tool, remove the damaged consumable part, and replace the damaged consumable part with a new consumable part. Once the damaged part is replaced, the technician must then clean the cluster tool, pump the cluster tool assembly to vacuum, and condition the cluster tool assembly for wafer processing. In some cases, conditioning can include qualifying the cluster tool assembly by running a test process on a semiconductor wafer, obtaining a cross-section of the semiconductor wafer, and analyzing the cross-section to ensure the quality of the process operation. Replacing damaged consumable parts is a complex and time-consuming process that requires the cluster tool assembly to be offline for a significant period of time, thereby affecting the profit margins of semiconductor manufacturers.

[0005] It is in this context that the embodiments of the present invention are developed. Summary of the Invention

[0006] Embodiments of the present invention define a cluster tool assembly designed to remove and replace damaged hardware components of a processing module arranged in a cluster tool assembly without the need to break vacuum (i.e., expose the cluster tool assembly to atmospheric conditions) and an end effector mechanism disposed within the cluster tool assembly. The damaged hardware components that can be replaced are also referred to herein as consumables. The cluster tool assembly includes one or more processing modules, each of which is configured to perform semiconductor wafer processing operations. Because the consumables in the processing modules are exposed to chemicals and process conditions, the consumables become damaged and need to be replaced in a timely manner. By installing a replacement station to the cluster tool assembly, damaged consumables can be replaced without opening the cluster tool assembly. The replacement station includes a component buffer having compartments for storing new and used consumables. The replacement station and one or more processing modules are coupled to a controller so that the controller can coordinate access between the replacement station and the one or more processing modules when the one or more processing modules are maintained in a vacuum state so that the consumables can be replaced.

[0007] To provide convenient access to damaged consumables, the processing module can be designed to include a lift mechanism. When engaged, the lift mechanism is configured to move the consumable to an elevated position, allowing a manipulator available within the cluster tool assembly to access the processing module and retrieve the elevated consumable from the processing module. A replacement consumable is provided to the processing module, and the lift mechanism is configured to receive the consumable and lower it into position within the processing module.

[0008] By providing a replacement station to access consumables, the need to open the cluster tool assembly to atmospheric conditions in order to access damaged consumables is eliminated. In some implementations, the replacement station is maintained under vacuum, thereby eliminating the risk of contamination during the replacement of consumables. As a result, the time required to recondition the processing module to place it in an active operational state after replacing a damaged consumable is significantly reduced. In addition, the manipulator and lifting mechanism enable the replacement of consumables without the risk of inadvertently damaging any hardware components of the processing module during the retrieval and replacement of the consumables.

[0009] Embodiments of the present disclosure provide a cluster tool assembly that can be used to remove and replace consumable parts from a process module without exposing the cluster tool assembly to atmospheric conditions. Because the cluster tool assembly is not exposed, the cluster tool assembly does not need to be purged or evacuated. As a result, the time required to adjust and qualify the cluster tool assembly is significantly reduced.

[0010] The changing station can be arranged in three different positions. In one position, the roller changing station is temporarily mounted directly to the processing module within the cluster tool assembly, with the ability to pump to vacuum and retrieve consumable parts directly from the processing module. New consumable parts are retrieved from the changing station and placed directly into the processing module. In this position, the changing station will include a robot and a parts buffer for accommodating used consumable parts and new consumable parts. The isolation valve will remain on the processing module. This configuration is desirable because only the processing module and not the entire cluster tool assembly must be taken offline for this maintenance operation.

[0011] In the second position, the exchange station is permanently mounted to the vacuum transfer module (VTM), and the robot within the VTM is used to remove and replace consumable parts from the process module. In this position, the exchange station does not require a dedicated robot, but the end effector of the VTM robot will operate to move both semiconductor wafers and consumable parts.

[0012] In the third position, the exchange station is temporarily or permanently mounted to the atmospheric transfer module (ATM) and the ATM's robot, and the vacuum transfer module (VTM)'s robot is used to remove and replace consumable parts from the processing module. In this position, the exchange station will not require a dedicated robot arm, but the VTM and ATM robot end effectors and the load lock chamber located between the ATM and VTM will handle both semiconductor wafers and consumable parts.

[0013] The processing module includes a consumable part lifting mechanism. The consumable part is typically a ring, such as an edge ring. The consumable part will have to be raised so that the robot can easily access and remove it. In one embodiment, the lifting mechanism includes: a vacuum-tight actuator equipped with a lifting pin. In another embodiment, the actuator is maintained under a vacuum state. Under normal operation, the lifter remains retracted and does not contact the consumable part. When the consumable part needs to be replaced, the actuator extends the lifting pins and raises the consumable part. The robot extends the end effector into the processing module so that the end effector (e.g., a spatula-shaped or finger-shaped part connected to the robot) slides under the consumable part. The actuator then retracts the lifting pins, placing the consumable part on the end effector. The consumable part is pulled back into the replacement station. The reverse order is used to place a new consumable part in the processing module.

[0014] In one embodiment, an end effector mechanism that can be connected to a manipulator is disclosed. The end effector mechanism includes a wrist plate, a mounting arm, a finger assembly and a plurality of contact pads. The mounting arm is connected to the wrist plate. The mounting arm has a top plate and a bottom plate. The finger assembly is clamped between the top plate and the bottom plate of the mounting arm. The finger assembly includes a pair of fingers extending outward from the mounting arm. The finger assembly has a proximal end adjacent to the mounting arm and a distal end at the tip of the pair of fingers. A first pair of consumable contact pads is disposed on the top surface of the finger assembly and is located at the proximal end of the finger assembly. A second pair of consumable contact pads is disposed on the top surface of the finger assembly and is located at the distal end of the finger assembly. A third pair of substrate contact pads is disposed on the top surface of the finger assembly, adjacent to the first pair of consumable contact pads and between the first pair of consumable contact pads and the second pair of consumable contact pads. A fourth pair of substrate contact pads is disposed on the top surface of the finger assembly, adjacent to the second pair of consumable contact pads and between the first pair of consumable contact pads and the second pair of consumable contact pads. The finger assembly is configured to transport consumable parts using the first pair of consumable contact pads and the second pair of consumable contact pads and to transport substrates using the third pair of substrate contact pads and the fourth pair of substrate contact pads.

[0015] In another embodiment, a load lock chamber is disclosed within a cluster tool assembly for processing substrates. The cluster tool assembly includes an atmospheric transfer module (ATM), a vacuum transfer module (VTM), and a processing module. The load lock chamber is disposed between the ATM and the VTM and provides an interface between the atmospheric transfer module and the vacuum transfer module. The load lock chamber includes a support mechanism having a plurality of finger assemblies. Each of the plurality of finger assemblies includes a top support finger and a bottom support finger. The top support finger and the bottom support finger have a first end and a second end. The top surface of the bottom support finger includes a recess adjacent to the second end and defined between the first end and the second end. A first spacer is disposed between the top support finger and the bottom support finger at the first end. A second spacer is disposed below the bottom support finger at the first end. A substrate contact pad is disposed on the top surface of the top support finger and the bottom support finger at the second end adjacent to the front end of the top support finger and the bottom support finger. A consumable contact pad is disposed within the recess and between the substrate contact pad disposed within the bottom support finger and the first end of the bottom support finger. The plurality of finger assemblies are configured to transport consumable parts using the consumable contact pad and to transport substrates using the substrate contact pad.

[0016] Other aspects of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention can be fully understood by referring to the following description in conjunction with the accompanying drawings.

[0018] Figure 1 A simplified block diagram of a cluster tool assembly including an exchange station mounted to a process module used in processing semiconductor wafers is shown in one embodiment of the present invention.

[0019] Figure 2 A simplified block diagram of a cluster tool assembly including a change station mounted to a vacuum transfer module of the cluster tool in an alternative embodiment of the present invention is shown.

[0020] Figure 3 A simplified block diagram of a cluster tool assembly in an alternative embodiment of the present invention is shown, the cluster tool assembly including an exchange station mounted to an atmospheric delivery module of the cluster tool.

[0021] Figure 3AA simplified block diagram of a cluster tool assembly in one embodiment of the present invention is shown, comprising a manipulator having an end effector for moving consumable parts within the cluster tool.

[0022] Figure 4 A simplified block diagram of a portion of a processing module of a cluster tool assembly including an exemplary lift mechanism for providing access to consumable parts is shown in one embodiment of the present invention.

[0023] Figure 5A A simplified block diagram of a processing module with a mounted exchange station for moving consumable parts is shown in one embodiment of the present invention, wherein the lifting mechanism is in a disengaged mode.

[0024] Figure 5B A simplified block diagram of a processing module with an installed exchange station is shown in one embodiment of the present invention, wherein the lifting mechanism is in an engaged mode.

[0025] Figure 5C A simplified block diagram of a process module having an exchange station mounted to a vacuum transfer module and a lifting mechanism in the process module for use in replacing consumable parts in the process module in one embodiment of the present invention is shown.

[0026] Figure 6A An end effector mechanism is shown for use within an ATM configured to receive a substrate. Figure 6B 、 Figure 6B-1 and Figure 6C Shown are top and side views of an end effector mechanism disposed within an atmospheric delivery module and / or a vacuum delivery module in some embodiments of the present invention.

[0027] Figures 7A-7D Some embodiments according to the present invention illustrate varying bottom surface profiles of consumable parts received using an end effector mechanism.

[0028] Figure 7E An exemplary end effector mechanism on a manipulator of a VTM is shown according to some embodiments of the present invention.

[0029] Figure 7F-1 、 Figure 7F-2 Some embodiments according to the present invention illustrate an alternative contact pad concept for use in an end effector mechanism on a robot for supporting consumable parts of a VTM and / or ATM having different bottom profiles.

[0030] Figures 8A-8B

[0014] Example end effector mechanisms for transporting substrates and consumable parts into a load lock chamber are shown according to some embodiments of the present invention.

[0031] Figures 9A-9B Exemplary side and top views of an end effector mechanism with a ring carrier for transporting consumable parts to a load lock chamber are shown according to some embodiments of the present invention.

[0032] Figures 10A-10D An exemplary finger assembly for use within a load lock chamber configured to receive consumable parts is shown according to some embodiments of the present invention.

[0033] Figures 10E-10F Views of an existing load lock chamber and a redesigned load lock chamber including a finger assembly to receive consumable parts are shown according to some embodiments of the present invention.

[0034] Figure 11 An exemplary exchange station for storing consumable parts and ring carriers is shown in accordance with one embodiment of the present invention.

[0035] Figure 12 According to one embodiment of the present invention, slots within a process module are shown through which consumable parts or wafers are moved into and out of the process module.

[0036] Figure 13 A control module (ie, controller) for controlling various aspects of a cluster tool is shown according to one embodiment. DETAILED DESCRIPTION

[0037] Embodiments of the present disclosure define a cluster tool assembly for processing semiconductor wafers. The cluster tool assembly includes a process module for processing semiconductor wafers. A replacement station is mounted to the cluster tool assembly. The replacement station is maintained under vacuum to provide the necessary process conditions for replacing consumable parts without risk of contaminating the process module or the cluster tool assembly. A dedicated robot in the replacement station or an available robot in the cluster tool assembly is used to retrieve used consumable parts from the process module and replace them with new consumable parts.

[0038] In some embodiments, the replacement station can be mounted directly to a processing module of a cluster tool assembly where consumable components need to be replaced. In such embodiments, the replacement station is directly coupled to the processing module. A manipulator defined in the replacement station is used to retrieve and replace consumable components.

[0039] In some other embodiments, the exchange station can be mounted directly to a vacuum transfer module (VTM) within the cluster tool assembly. The exchange station is mounted to maintain uniformity and symmetry within the cluster tool assembly. The robot arm of the VTM used to move semiconductor wafers into and out of the processing modules is also used to retrieve and replace consumable components disposed within the processing modules.

[0040] In some other embodiments, the replacement station can be mounted directly to the atmospheric transfer module of the cluster tool assembly. In such embodiments, the manipulator of the atmospheric transfer module works together with the manipulator of the vacuum transfer module of the cluster tool assembly to access and replace consumable parts from the processing modules. The replacement station is designed to be mounted to different modules of the cluster tool assembly and enables the replacement of consumable parts without requiring the cluster tool assembly to be opened to atmospheric conditions to access the consumable parts.

[0041] Conventional designs of cluster tool assemblies require that the cluster tool assembly be opened to access and replace consumable parts within the processing module. Opening of the cluster tool assembly requires taking the cluster tool assembly offline and purging the cluster tool assembly to atmospheric conditions to allow access to the processing module. Once the cluster tool assembly is opened, trained technicians manually remove and replace consumable parts from the processing module. When replacing consumable parts, the cluster tool assembly must be adjusted so that semiconductor wafers can be processed. Since semiconductor wafers are valuable products, special care must be taken when adjusting the cluster tool assembly. This adjustment requires cleaning the cluster tool assembly, pumping the cluster tool assembly to vacuum, adjusting the cluster tool assembly, and qualifying the cluster tool assembly using a test run. Each of these steps requires a significant amount of time and effort. In addition to the time required for each step of adjusting the cluster tool assembly, other delays may be experienced when problems are encountered at one or more steps during the adjustment process of the cluster tool assembly. Some issues commonly encountered during the tuning process of cluster tool assemblies may include: misalignment of consumable parts during replacement, damage to new consumable parts when replacing damaged or used consumable parts, damage to other hardware components in the process module during the retrieval and replacement of consumable parts, the cluster tool assembly not achieving vacuum after pumpdown, the cluster tool assembly not achieving process performance, etc. Depending on the severity of each issue, additional time and effort may have to be expended, further contributing to delays in bringing the cluster tool assembly online, thereby directly impacting the manufacturer's profit margin.

[0042] Mounting the changing station to the cluster tool assembly and accessing the consumables via the changing station saves considerable time and effort required for maintaining the cluster tool assembly. The risk of damage to the consumables, the processing modules and / or the cluster tool assembly is minimized by using a manipulator available within the cluster tool assembly for replacing the consumables, and the risk of contamination is minimized by keeping the changing station under vacuum, thereby avoiding exposing the interior of the cluster tool assembly to the external atmosphere. Using the manipulator, a more precise alignment of the consumables in the processing modules can be achieved while minimizing damage to other hardware components of the processing modules. As a result, the time required to adjust the cluster tool assembly is significantly reduced. Timely replacement of consumables improves the quality and yield of the semiconductor elements defined in the semiconductor wafer.

[0043] In one embodiment, Figure 1 A simplified schematic diagram of a cluster tool assembly 100 for processing semiconductor wafers is shown. The cluster tool assembly 100 includes a plurality of modules to allow semiconductor wafers to be processed in a controlled environment that minimizes exposure of the semiconductor wafers to the environment. In one embodiment, the cluster tool assembly 100 includes an atmospheric transfer module (ATM) 102, a common vacuum transfer module (VTM) 104, and one or more processing modules 112-120. The ATM 102 operates under ambient conditions (i.e., atmospheric pressure) and interfaces with a wafer loader (not shown) to bring semiconductor wafers into the integrated cluster tool assembly 100 for processing and return the semiconductor wafers after processing. The ATM 102 can include a robot to move the semiconductor wafers from the wafer loader to the VTM 104. Since the ATM 102 is under atmospheric conditions, the robot can be part of a dry robot.

[0044] The VTM 104 operates under vacuum so that when the semiconductor wafer is moved from one processing module to another, the surface of the semiconductor wafer is minimally exposed to the atmosphere. Since the VTM 104 operates under vacuum and the ATM 102 operates under atmospheric conditions, a load lock chamber 110 is placed between the ATM 102 and the VTM 104. The load lock chamber 110 provides a controlled interface to allow semiconductor wafers to be transferred from the ATM 102 to the VTM 104. In this embodiment, a robot in the ATM 102 can be used to store semiconductor wafers in the load lock chamber 110. A separate robot can be provided in the VTM 104 to retrieve semiconductor wafers from the load lock chamber 110 and transfer semiconductor wafers to and from the processing modules (112-120). In some embodiments, the load lock is also referred to as an "interfacing chamber" due to its location.

[0045] One or more process modules 112-120 are integrated with the VTM 104, allowing semiconductor wafers to be moved from one process module to another within the controlled environment maintained by the VTM 104. In some embodiments, the process modules 112-120 may be evenly distributed around the VTM 104 and configured to perform different processing operations. Some of the processing operations that can be performed using the process modules 112-120 include etching operations, rinsing, cleaning, drying operations, plasma operations, deposition operations, plating operations, and the like. For example, process module 112 may be configured to perform a deposition operation, process module 114 may be configured to perform a cleaning operation, process module 116 may be configured to perform a second deposition operation, process module 118 may be configured to perform an etching or removal operation, and the like. The controlled environment of the VTM 104 enables semiconductor wafers to be transferred into and out of the process modules 112-120 without risk of contamination, and a robot within the VTM 104 facilitates the transfer of semiconductor wafers into and out of the various process modules 112-120 integrated with the VTM 104.

[0046] In one embodiment, the replacement station 108 is mounted to a process module (e.g., any of the process modules 112-120) within the cluster tool assembly 100. Figure 1 In the exemplary embodiment shown, the replacement station 108 is mounted to the processing module 118. When consumable parts in any other processing module 112-120 need to be replaced, the replacement station can be configured to be mounted to the corresponding processing module 112-120. For example, the processing module 118 can be used to perform an etching operation. The replacement station 108 is used to retrieve and replace consumable parts used in the processing module 118. The replacement station 108 includes a mechanism, such as a pump mechanism (not shown), for sucking the replacement station 108 and maintaining the replacement station 108 under vacuum when the replacement station 108 is installed in the processing module.

[0047] In one embodiment, when a consumable part at a processing module (i.e., any one of the processing modules 112-120) needs to be replaced, the replacement station 108 can be coupled to the processing module (112-120) via an isolation valve, and the replacement station 108 can be separated from the processing module (112-120) when the consumable part has been successfully replaced. In this embodiment, the replacement station 108 is a removable modular unit that is designed to be temporarily installed to a processing module to complete a required operation (e.g., replacement of a consumable part), removed when the required operation of the processing module is completed, and either retracted or moved to a different processing module where the required operation of replacing the consumable part is performed. For example, the isolation valve enables the replacement station 108 to be maintained under a vacuum.

[0048] The exchange station 108 includes a parts buffer to receive and hold consumable parts. In some embodiments, the parts buffer may include multiple compartments for receiving used consumable parts retrieved from the processing module and new consumable parts to be delivered to the processing module. In one embodiment, the opening of the exchange station 108 (where the exchange station is mounted to the isolation valve) is sized to allow consumable parts to be moved in and out of the exchange station 108.

[0049] A consumable part is a hardware component within a processing module that needs to be replaced due to continuous exposure to the process conditions in the processing module. As a result of the consumable part being continuously exposed to the harsh process conditions used in the processing of semiconductor wafers, the consumable part needs to be closely monitored to determine when damage exceeds an acceptable level so that it can be replaced in a timely manner. For example, in an etching processing module, an edge ring is arranged adjacent to a semiconductor wafer mounted on a chuck assembly to extend the processing area of ​​the semiconductor wafer. During the etching operation, the edge ring is exposed to ion bombardment from the plasma used to form features on the surface of the semiconductor wafer. Over a period of time, as a result of the continuous exposure, the edge ring may become damaged. When the damage to the edge ring exceeds an acceptable level, the edge ring needs to be replaced so that the damage to the edge ring does not expose other underlying components or otherwise adversely affect the semiconductor wafer processing.

[0050] In a typical etching operation, when a semiconductor wafer is received in a processing module, ions from the plasma impact the surface of the semiconductor wafer at an angle perpendicular to a plasma sheath formed in a processing region defined above the semiconductor wafer. As the layers of the edge ring wear away due to ion bombardment, the edge of the semiconductor wafer is exposed, causing the plasma sheath to roll along the contour of the edge of the semiconductor wafer. As a result, the ions impacting the surface of the semiconductor wafer follow the contour of the plasma sheath, resulting in the formation of tilted features toward the edge of the semiconductor wafer surface. These tilted features can affect the overall yield of semiconductor components formed on the semiconductor wafer. In addition, as multiple layers of the edge ring wear away, underlying components (such as a chuck), for example, may be exposed to the ions, thereby damaging the chuck surface. To improve yield and avoid damage to any underlying components, the edge ring (i.e., a consumable component) needs to be replaced regularly.

[0051] The replacement station 108 mounted to the processing module 118 will allow consumable parts (i.e., edge rings) to be easily replaced without breaking the vacuum in the processing module. In one embodiment, the replacement station 108 includes a dedicated robot configured to extend an end effector into the processing module (e.g., processing module 118) to retrieve the consumable part that needs to be replaced and deliver a new consumable part. A lifting mechanism within the processing module provides access to the consumable parts. The robot of the replacement station 108 is operable to place the new consumable part on the lifting pins of the lifting mechanism, and the lifting mechanism will install the new consumable part in the appropriate position within the processing module.

[0052] In one embodiment, to facilitate the replacement of consumable parts, a replacement station is mounted to a processing module (e.g., any or each of processing modules 112-120) via a first isolation valve. A robot from the replacement station is used to access and retrieve consumable parts from the processing module and move them to a parts buffer defined in the replacement station, and provide replacement consumable parts from the parts buffer. In one embodiment, the first isolation valve can be operatively connected to a controller to coordinate the retrieval and replacement of consumable parts in the processing module.

[0053] In addition to using a first isolation valve to mount a replacement station to a process module, a second isolation valve may be used to couple the process module to a vacuum transfer module (VTM) of the cluster tool assembly 100. When engaged, the second isolation valve is configured to isolate the process module (112-120) from the rest of the cluster tool assembly 100 so that replacement of consumable parts in the process module can be easily performed without affecting the operation of the other process modules of the cluster tool assembly 100. Providing a second isolation valve allows a specific process module (any one of 112-120) rather than the entire cluster tool assembly 100 to be taken offline, while allowing the rest of the process modules (112-120) within the cluster tool assembly 100 to continue processing semiconductor wafers. Additionally, since only a specific process module (e.g., any one of 112-120) is taken offline to replace the consumable part, significantly less time is required to restore the process module (112-120) and the cluster tool assembly 100 to a fully operational state. As a result, much less time is spent adjusting and qualifying the operation of the cluster tool assembly 100. The robot of the VTM 104 may be used during semiconductor wafer processing to move semiconductor wafers into and out of the processing modules (112-120).

[0054] In order to allow the manipulator of the replacement station 108 to retrieve the consumable parts from the processing modules (112-120), the consumable parts must be easily accessible. In one embodiment, the processing modules (112-120) include a lifting mechanism that provides access to the consumable parts that need to be replaced. In some embodiments, the lifting mechanism may include lifting pins that can be extended to move the consumable parts to a raised position. The end effector of the manipulator in the replacement station 108 extends into the processing modules (112-120) and slides under the consumable parts. The lifting mechanism then retracts the lifting pins to retain the consumable parts on the end effector of the manipulator. The end effector with the consumable parts is then retracted from the processing modules (112-120) into the replacement station 108. The new consumable parts are moved to the processing modules (112-120) using the end effector of the manipulator, and the lifting pins of the lifting mechanism extend to receive the new consumable parts. The lifting pins of the lifting mechanism work together to align the new consumable parts to the position in the processing modules (112-120). The procedure for retrieving and replacing consumable parts using the lift mechanism is referenced Figure 4 Discuss in more detail.

[0055] In some embodiments, the entire cluster tool assembly 100 may have to be taken offline to replace consumable parts. For example, this may occur when more than one consumable part within one or more processing modules (112-120) needs to be replaced. Even in such embodiments, because the replacement station and processing modules are maintained under vacuum, the time to take the cluster tool assembly 100 offline, install the replacement station to the processing modules (112-120), remove and replace the consumable parts, adjust the cluster tool assembly 100, and qualify the cluster tool assembly 100 can be much shorter. As a result, the processing conditions (i.e., vacuum) of the cluster tool assembly 100 are not adversely affected during the replacement of the consumable parts. In addition, because a robot is used for replacement, more precise retrieval and placement of the consumable parts can be designed, thereby avoiding the risk of damage to the consumable parts and / or the processing modules (112-120).

[0056] In some implementations, an opening on one side of the process module where the exchange station is mounted can be sized so that consumable parts can easily fit through the opening. Additionally, the openings in the process modules (112-120) can be designed to minimize any asymmetry issues that may occur in the process modules (112-120) and in the cluster tool assembly 100 as a whole.

[0057] refer to Figure 1The various embodiments and implementations discussed enable the replacement station 108 to be temporarily mounted to the processing module (112-120) when consumable parts in the processing module (112-120) need to be replaced and to be retracted when the replacement of the consumable parts is complete. The replacement station 108 may include a single part buffer having two different holding areas to receive and hold used consumable parts and new consumable parts or alternatively have different part buffers for holding used consumable parts and new consumable parts respectively. The manipulator and part buffer provided in the replacement station 108 allow for the transport and retrieval of consumable parts directly to and from the processing modules (112-120). The isolation valve in the processing module (112-120) enables only the processing module (112-120) to be taken offline rather than the entire cluster tool assembly 100.

[0058] Figure 2 An alternative embodiment of the cluster tool assembly 100 is shown in which the exchange station 108 is configured to be mounted to a vacuum transfer module (VTM) 104 disposed in the cluster tool assembly 100, rather than to a processing module (112-118). The VTM 104 includes a robot used during the processing of semiconductor wafers to move semiconductor wafers from a load lock chamber 110 to the processing modules 112-118, as well as to move into and out of one or more processing modules 112-118 integrated with the VTM 104. The robot includes an end effector for receiving, holding, and moving semiconductor wafers between different processing modules. A separate opening is defined in the VTM 104 to allow the exchange station 108 to be mounted so that the exchange station 108 is aligned with the opening defined in the VTM 104. In situations where symmetry is important, the opening in the VTM 104 is defined to maintain uniformity and symmetry of the VTM 104 and uniformity and symmetry of the cluster tool assembly 100. For example, a dummy opening with a dummy door may be defined in the VTM 104 relative to the opening to maintain uniformity and symmetry of the VTM 104. Alternatively, if a dummy opening already exists in the VTM 104 and the opening is large enough to move consumable parts, the replacement station 108 may be mounted to the dummy opening to continue to maintain uniformity and symmetry of the cluster tool assembly 100.

[0059] Typically, the opening in the VTM 104 is sized to accommodate semiconductor wafers and the carrier / robot used to move the semiconductor wafers in and out of the VTM 104. However, consumable components that are larger than the semiconductor wafers may not fit through them. For example, an edge ring configured to surround a semiconductor wafer received in a processing module (112-118) may be wider than the semiconductor wafer. In this case, the edge ring as a whole may not fit through the opening designed to move the semiconductor wafer without redesigning the opening. In some cases, redesigning the opening of the VTM 104 may not be a viable option because it may affect the symmetry of the cluster tool assembly. Therefore, instead of redesigning the opening of the VTM 104 and causing asymmetry in the cluster tool assembly 100, segmented consumable components can be used so that each segment can fit through the opening. For example, an edge ring used to surround a semiconductor wafer in a processing module can be designed as a segmented edge ring made of two or more components, each component designed to fit through the opening of the VTM 104 and the replacement station 108. In this embodiment, the segmented edge rings can be retrieved and replaced individually.

[0060] When replacing consumable parts, especially multi-component segmented consumable parts, each segment of consumable parts must be correctly aligned and fixed in the processing module so that there is no gap between the segments. It should be noted that in processing operations such as high aspect ratio etching operations, the gap existing between any parts of the etching processing module will cause ions to flow through and damage any lower layer components. For example, the gap of the edge ring in the etcher module of high aspect ratio will cause high energy ions to flow through and reach the bottom chuck on which the edge ring can be arranged, thereby damaging the surface of the chuck. In order to prevent the formation of gaps, the segmented consumable parts can be designed to ensure that each segment and other segments are closely matched when each segment is installed in the processing module. Therefore, in some implementations, the segmented or multi-component consumable parts can be designed to have interlocking segments. Alternatively, the consumable parts can be designed to have overlapping segments to prevent ions or treatment gases / chemicals from finding the direct flow path leading to the lower layer components. For example, in some implementations, the consumables can be comprised of inner and outer components that fit completely or in sections through the opening defined between the VTM 104 and the exchange station and mounted in the processing module with one component overlapping the other, thereby preventing gaps from forming. Other variations in the design of the consumables can be implemented to enable the consumables to be moved into and out of the VTM 104 without having to redesign the opening designed to maintain symmetry within the cluster tool assembly.

[0061] In one embodiment, instead of using a dedicated robot at the exchange station 108, the robot used in the VTM 104 to move semiconductor wafers into and out of the processing modules can also be used to retrieve and replace consumable parts. In some implementations, the end effector of the robot used to move semiconductor wafers between processing modules is used to receive, hold and move consumable parts between the processing modules 112-118 and the exchange station 108. In other implementations, the robot of the VTM 104 is designed to have different end effectors for moving consumable parts and semiconductor wafers. An end effector is a component generally defined in a robot for retrieving, supporting, holding, picking up, lifting, moving or rotating a movable part (such as a semiconductor wafer or consumable part). The movable part can be held on a plane in any orientation. Separate end effectors can be provided to move consumable parts and semiconductor wafers separately, thereby preventing contamination of the semiconductor wafers.

[0062] In an alternative embodiment, a dedicated manipulator in the replacement station 108 can operate in conjunction with the manipulator of the VTM 104 to extract and replace consumable parts in the processing module. For example, the manipulator of the VTM 104 can be used to extract used consumable parts from the processing module and move them to an intermediate storage area (a staging area) defined between the VTM 104 and the replacement station 108. The dedicated manipulator of the replacement station 108 can be used to move used consumable parts from the intermediate storage area to the parts buffer. Similarly, the dedicated manipulator of the replacement station 108 can be used to move new consumable parts from the parts buffer of the replacement station 108 to the intermediate storage area, and the manipulator of the VTM 104 can be used to move new consumable parts from the intermediate storage area to the processing module. In one embodiment, the intermediate storage area can have a first area for receiving used consumable parts and a second area for receiving new consumable parts. The lifting mechanism in the processing module (112-118) is used to install new consumable parts in the processing module (112-118).

[0063] exist Figure 2 The design of the replacement station 108 in the embodiment shown is similar to that of the reference Figure 1 The design of the replacement station 108 is discussed. For example, Figure 2 The exchange station 108 includes a mechanism (e.g., a pump) for maintaining the exchange station 108 under vacuum when the exchange station 108 is mounted to the VTM 104. Maintaining the process conditions of the exchange station 108 similar to the process conditions of the VTM 104 (i.e., under vacuum) ensures that the processing conditions within the VTM 104 are not adversely affected during the exchange of consumable parts. One or more part buffers are defined within the exchange station 108 to receive and hold used consumable parts and new consumable parts.

[0064] exist Figure 2 The design of the processing module (118) shown in Figure 1 The processing module (118) defined in is slightly different. The difference is Figure 2 The illustrated processing module does not include a second opening. For example, when the exchange station 108 is mounted directly on the VTM 104 and access to the processing module (118) by the exchange station 108 is provided through the VTM 104, the processing module (118) does not require a second opening for mounting the exchange station 108. In addition, a single isolation valve is used to provide access to the processing module (118) through the VTM 104 during the replacement of consumable parts and to isolate the processing module during the processing of semiconductor wafers. It should be noted that the exchange station 108 is maintained at a vacuum so that consumable parts can be easily replaced without adversely affecting the process conditions in the cluster tool assembly 100. Therefore, adjusting the cluster tool assembly 100 and qualifying the cluster tool assembly 100 to process semiconductor wafers can be achieved in a shorter time because no purge / pumping process is required, and other steps to qualify the cluster tool assembly can be performed in a shorter time. In some implementations, the exchange station 108 can be permanently mounted to the VTM 104.

[0065] Figure 3 Another embodiment of the cluster tool assembly 100 is shown in which the exchange station 108 is mounted to the atmospheric transfer module (ATM) 102. For example, the robot used to move semiconductor wafers from the wafer loader to the load lock chamber 110 in the ATM 102 of the cluster tool assembly 100 is also used to move consumable parts to and from the exchange station 108. In this embodiment, the exchange station 108 mounted to the ATM 102 is maintained under the same atmospheric conditions as the atmospheric conditions of the ATM 102. Therefore, the exchange station 108 does not require a pump or similar mechanism to keep the exchange station 108 under vacuum. In some implementations, the exchange station 108 can be permanently mounted to the ATM 102.

[0066] In addition to ATM 102, Figure 3 The illustrated cluster tool assembly 100 also includes a vacuum transfer module (VTM) 104, and a plurality of process modules 112-120 integrated with the VTM 104. A load lock chamber 110 is defined between the ATM 102 and the VTM 104 and serves as an interface for moving semiconductor wafers from the ATM 102 to the VTM 104 while maintaining process conditions in the ATM 102 and the VTM 104.

[0067] The load lock chamber 110 of the cluster tool assembly 100 is designed to handle both semiconductor wafers and consumable parts. Separate intermediate storage areas (such as compartments) can also be provided in the load lock chamber 110 for receiving semiconductor wafers and consumable parts to avoid contamination of the semiconductor wafers. The intermediate storage area in the load lock chamber 110 designed to receive consumable parts can also be configured to provide a separate intermediate storage area for receiving used consumable parts and new consumable parts. The opening defined in the load lock chamber 110 is designed to fit consumable parts and semiconductor wafers. Alternatively, when the opening is not designed to fit consumable parts, segmented consumable parts can be used so that each segment of the consumable parts can fit through the opening defined by the load lock chamber 110.

[0068] exist Figure 3 In the illustrated embodiment, the robot in the VTM 104 used to move semiconductor wafers from the load lock chamber 110 to the processing modules (112-120) integrated in the VTM 104 or from one processing module (112-120) to another processing module is also used to move consumable parts between the load lock chamber 110 and the processing modules (112-120).

[0069] In some implementations, in addition to the manipulators of the ATM 102 and the VTM 104, the exchange station 108 may also include a dedicated manipulator configured to move consumable parts between the parts buffer of the exchange station and the ATM 102. In such an embodiment, the manipulator of the ATM 102 can be used to move consumable parts and semiconductor wafers between the ATM 102 and the load lock chamber 110, and the manipulator of the VTM 104 can be used to move consumable parts and semiconductor wafers between the load lock chamber 110 and the processing modules (112-120). In one implementation, a single end effector may be provided in the manipulators of the ATM 102 and the VTM 104, which can be engaged at different times, to move both semiconductor wafers and consumable parts. In another embodiment, separate end effectors may be provided in the manipulators of the ATM 102 and the VTM 104, one end effector for moving semiconductor wafers and the other for moving consumable parts. A lifting mechanism is used to correctly align and install the new consumable parts in the appropriate position within the processing modules (112-120).

[0070] In one embodiment, compared to Figure 3 The version shown in Figure 3A A more detailed version of the cluster tool assembly 100 including additional modules is shown. Figure 3 Same as in Figure 3AThe illustrated embodiment shows an exchange station 108 coupled to the first side 101a of the ATM 102, and utilizes the manipulators of the ATM 102 and VTM 104 to exchange consumable parts. In this embodiment, in addition to the exchange station 108 being mounted on the first side 101a of the ATM 102, one or more wafer loaders 115 are also mounted on the first side 101a of the atmospheric transfer module 102. The wafer loaders 115 can be standard wafer loaders, such as front-opening unified pods (FOUPs), or custom wafer loaders designed to couple to the ATM 102. The exchange station 108 and wafer loaders 115 are configured to be temporarily or permanently coupled to the ATM 102 via a specific load port (not shown) defined on the first side 101a of the ATM 102. The doors of the exchange station 108 and wafer loaders 115 (whether standard or custom wafer loaders) are designed to be compatible with the openings of the standard load ports defined on the first side 101a of the ATM 102. The wafer loader 115 includes a wafer buffer comprising a plurality of compartments for receiving and holding processed or unprocessed wafers. It should be noted that wafer and substrate are used interchangeably in this application and refer to thin sheets of semiconductor material used in the manufacture of electronic devices (e.g., integrated circuits). In some embodiments, the exchange station 108 is similar in structure and design to the wafer loader 115 (e.g., a FOUP) and includes a component buffer 224 having a plurality of compartments 207 configured to receive and store new and / or used consumable components 208.

[0071] In addition to the exchange station 108 and wafer loader 115, one or more buffer stations 113 may be coupled to the ATM 102. The buffer station 113 may include a dynamic aligner, typically used to provide alignment input to a computer communicatively connected to the ATM 102. The alignment input is used to align the wafers as they are transported to the load lock chamber 110. For example, a robot 103 within the ATM 102 may be used to move a wafer from one of the wafer loaders 115 to a chuck disposed within a dynamic aligner within the buffer station 113. The chuck is configured to rotate the wafer. Sensors within the dynamic aligner are used to detect one or more notches disposed along the edge of the wafer and the eccentricity of the notches, and provide this data as alignment input to the computer. The computer provides the alignment input to the robot, which then uses the alignment input to transport the wafer from the dynamic aligner to the load lock chamber 110 so that the wafer is properly aligned upon transport. In some implementations, one or more of the dynamic aligners can be used to provide alignment inputs for the consumables to the computer to ensure that the consumables are correctly aligned when they are transported to the load lock chamber 110. It should be noted that the alignment inputs for aligning the wafers can be different from the alignment inputs for aligning the consumables. In other implementations, alignment of the consumables can be performed within the exchange station. In such implementations, it is not necessary to perform further alignment when the consumables are transported to the load lock chamber 110.

[0072] In some embodiments, the robot 103 in the ATM 102 that is designed to move wafers is also designed to move consumables 208 from the exchange station 108 to the load lock chamber 110. Existing designs of the robot 103 include an end effector mechanism with "fingers" for supporting wafers. However, the fingers on the end effector mechanism are designed to support wafers and are therefore short and are not designed to provide contact support for consumables because the diameter of consumables is generally larger than the diameter of wafers. To accommodate this difference, in one embodiment, the fingers of the end effector mechanism of the robot 103 in the ATM 102 are extended to a length sufficient to enable the fingers to provide contact support for the consumables 208. Although the end effector mechanism with extended fingers has been described as being implemented within the robot 103 of the ATM 102, it should be noted that the end effector mechanism described herein may also be implemented within the robot 105 of the VTM 104.

[0073] In an alternative embodiment, short fingers of the end effector mechanism of the manipulator within the ATM 102 are used to support the ring carrier. The surface of the ring carrier is used to support the consumable parts. The ring carrier can be in the form of a carrier plate that is stored within the housing of the replacement station 108 and is removed when the consumable parts need to be transported to the load lock chamber 110. In this embodiment, the fingers of the end effector do not have to be redesigned as the existing fingers of the end effector can be used to support the carrier plate. The details of the end effector mechanism used within the ATM 102 and / or VTM 104 will be referred to Figures 6A-6C The carrier plates used in supporting and transporting consumable parts will be referred to as Figures 8A-8B , 9A-9B for explanation.

[0074] Replacing consumable parts in the processing module 112 integrated within the cluster tool assembly 100 requires access to the processing module 112 and the consumable parts 208 in the processing module 112. Access to the processing module 112 has been described with reference to Figure 1-3 Discussion has been made wherein the replacement station 108 is mounted directly to the process modules (112-120), or the vacuum transfer module 104 or the atmospheric transfer module 102, thereby providing access to the process modules (112-118, 120). Once the process modules (112-120) are accessed, access to the consumable parts needs to be provided so that the consumable parts can be safely retrieved and replaced without damaging the consumable parts or other hardware components in the process modules (112-120).

[0075] Figure 4An exemplary embodiment of a lift mechanism is shown that can be used in a processing module (112-120) of a cluster tool assembly 100 to provide access to a consumable part 208 that needs to be replaced. In some implementations, the consumable part 208 is disposed above a bottom edge ring 236 and adjacent to a cover ring 232. The bottom edge ring 236 is disposed above a base ring 240 and, in some implementations, proximate to a sleeve ring 238. An insulator ring 234 can be disposed between the lift mechanism and a sidewall of the chamber. The lift mechanism is configured to move the consumable part 208 to a raised position so that the consumable part 208 can be accessed. In some implementations, the consumable part 208 is an edge ring that is disposed adjacent to a semiconductor wafer 150 received in the processing module during processing. The lift mechanism includes a plurality of lift pins 202 connected to a plurality of actuators 204. For example, the lift pins can be distributed along a plane to allow the lift pins to contact and move the consumable part at different points. In some implementations, the lift pins distributed on a plane can be grouped into different groups, wherein each group of lift pins operates independently to access and lift different consumable components. In some implementations, the actuator 204 is a vacuum-sealed actuator equipped with a plurality of lift pins 202 .

[0076] The actuator 204 is driven by an actuator driver 206. In disengagement mode, the lifting pins 202 remain retracted within the housing defined by the lifting mechanism and do not contact the consumable part 208. When the consumable part 208 needs to be replaced, the actuator 204 is driven by the actuator driver 206. The driven actuator 204 causes the lifting pins 202 to extend outside the housing so as to contact the consumable part 208 and move the consumable part 208 to a raised position. Since the processing module (e.g., 118) is maintained in a vacuum state, when the consumable part is raised, the consumable part is raised to the vacuum space 210. The manipulator of the VTM 104 or the replacement station 108 extends the end actuator into the processing module 118 and allows it to slide under the raised consumable part 208. In some embodiments, the shape of the end actuator connected to the manipulator is similar to a spatula so that the end actuator can support the raised consumable part. Once the end effector has been slid into place, the actuator 204 retracts the lifting pin 202 into the housing, causing the consumable part 208 to rest on the end effector. The manipulator is then manipulated to pull the end effector back into the VTM 104 or the replacement station 108, depending on which manipulator is used to retrieve the consumable part 208, thereby bringing the consumable part 208 back with it. When a new consumable part 208 needs to be placed in a processing module (e.g., 118), the reverse sequence is performed. The lifting mechanism of the processing module (e.g., 118) is used to properly install the consumable part in the appropriate position of the processing module (118) so that the processing module (118) and the cluster tool assembly 100 are operational.

[0077] In some implementations, a power source connected to the actuator driver 206 of the lift mechanism can, in addition to providing power to the actuator to operate the lift pins to raise the consumable component 208, also supply power to the consumable component via the lift pins. In such implementations, the actuator 204 and lift pins 202 can be made of conductive materials to facilitate supplying power to the consumable component 208. In some implementations, surface areas of the lift pins that contact the consumable component can serve as electrical contacts and be used to supply power from the power source to the consumable component. In some implementations, the power source is a radio frequency (RF) power source to enable the lift pins 202 to supply RF power to the consumable component 208. Additional details of using an RF power source to supply power to a drain component are described in commonly owned and co-pending U.S. Provisional Patent Application No. 62 / 191,817, filed on July 13, 2015, entitled “Extreme Edge Sheath and Wafer Profile Tuning Through Edge-Localized Ion Trajectory Control and Plasma Operation,” which is incorporated herein by reference in its entirety. In some implementations, the lift pins 202 can be switched. A switch can be used to control the amount of power supplied to the drain component 208. In some implementations, the switch can be used to supply different powers to the drain component 208. In some implementations, the power supplied to the drain component 208 can be used to heat the drain component 208. For example, when the drain component 208 is an edge ring, the power supplied by the power source can be used to provide a temperature-controlled edge ring. In some implementations, power can be supplied to the drain component 208 by other means, such as by capacitive coupling. Additional details of providing power to a consumable component 208 (e.g., an edge ring) using alternative means (e.g., capacitive coupling) are described in commonly owned and co-pending U.S. Provisional Patent Application No. 62 / 206,753, filed on August 18, 2015, and entitled “Edge Ring Assembly for Improving Feature Profile Tilting at Extreme Edge of Wafer,” which is incorporated herein by reference. It should be noted that the different means for providing power to the consumable component 208 discussed herein are merely exemplary, and other forms of providing power to the edge ring may also be used. In some implementations, the consumable component 208 (a single component or different components of a multi-component consumable component) can be aligned and mounted into a suitable position in a processing module (e.g., 118) using one or more magnets. For example, a lifting mechanism provided in the processing module (e.g., 118) can include a surface on which the consumable component 208 is supported.One or more magnets may be provided on the underside of the surface of the lift mechanism on which the consumables 208 are supported. The magnets provided in the lift mechanism may be used to align the consumables in the proper position within the processing module (eg, 118).

[0078] In some implementations, the lift mechanism can be connected to an air compressor or other compressed pressure source to allow pneumatic operation of the lift mechanism. In some implementations, the lift mechanism can be used to provide electrostatic clamping to clamp the consumable component 208 in place within a processing module (e.g., 118). In these implementations, the lift mechanism can be connected to a direct current (DC) power source to allow the lift pins 202 to provide DC power to clamp the consumable component 208 in place within a processing module (e.g., 118).

[0079] In one embodiment, Figure 5A An exemplary cluster tool assembly is shown identifying various components for replacing consumable components within a process module 118. The process module 118 may be an etcher module that can be used to generate a transformer coupled plasma (TCP) for performing conductive etching or a capacitive coupled plasma (CCP) for performing dielectric etching, or to perform plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD), or any other type of etching on a semiconductor wafer. Alternatively, the process module 118 may be used to perform any other processing operation (e.g., deposition, plating, etc.) to define various features on the semiconductor wafer.

[0080] The replacement station 108 may include a parts buffer 224. In one embodiment, the parts buffer 224 includes a plurality of compartments 207 configured to receive used consumable parts 208 retrieved from the processing module and new consumable parts 208 that need to be transported to the processing module. Alternatively, a separate parts buffer 224 can be used to store used consumable parts 208 and new consumable parts 208 separately. A replacement operator 214 within the replacement station 108 can be used to move new consumable parts 208 from the compartments 207 of the parts buffer 224 to the processing module 118, and to retrieve used consumable parts 208 from the processing module 118 and store them in the compartments 207 of the parts buffer 224. The replacement operator 214 includes a manipulator 215 that is configured to move laterally, vertically, and / or radially so that the end effector 213 of the replacement operator 214 can access the consumable parts 208 in the parts buffer 224 and the processing module 118. The end effector can be configured to access, retrieve and transport consumable parts 208 to the parts buffer 224 or the processing module. In some implementations, the end effector can be a special end effector designed to retrieve, pick up, lift, support, hold, move or rotate consumable parts on any plane. The end effector of the replacement manipulator 214 can be manipulated to extend and retract during operation so that the consumable parts can be retrieved from the processing module and stored in the parts buffer 224. In some implementations, the end effector can be configured to move in radial, lateral and / or vertical directions to provide greater flexibility during the retrieval operation. The replacement manipulator 214 is connected to the controller 220 to control the movement of the manipulator 215 and the end effector 213 of the replacement manipulator 214.

[0081] The exchange station 108 may also include a vacuum control module 231 connected to the pump 233 to manipulate processing conditions in the exchange station 108. In some implementations, the exchange station 108 is connected to the controller 220 so that the vacuum control module 231 can coordinate the operation or action of the pump 233 during the exchange of consumable parts.

[0082] A first isolation valve 216 is provided between the exchange station 108 and the processing module 118 to allow the exchange station 108 to be mounted to the processing module 118. In some implementations, the first isolation valve 216 can be a gate valve. The processing module 118 includes a first side and a second side, the first side of the processing module 118 being coupled to the vacuum transfer module (VTM) 104, and the second side of the processing module 118 being coupled to the first side of the first isolation valve 216. The second side of the first isolation valve 216 is coupled to the exchange station 108. For example, the coupling operates doors 217 and 219 defined in the exchange station 108 and the processing module 118, respectively, to enable a robot 215 in the exchange station 108 to access the processing module 118. A first side of a second isolation valve 216' is coupled to the VTM 104, and a second side of the second isolation valve 216' is coupled to the first side of the processing module 118. The coupling allows for the manipulation of doors 227, 229, which cover corresponding openings defined in the process module 118 and the VTM 104, respectively, to enable a robot in the VTM 104 to access the process module 118 and move semiconductor wafers into and out of the process module 118 during processing. The first isolation valve 216 and the second isolation valve 216' are connected to a controller 220 to coordinate the coupling of the process module 118 with the VTM 104 and the exchange station 108.

[0083] The processing module 118 includes an upper electrode 218 that can be used to provide processing chemicals to a processing region defined in the processing module 118. For example, the upper electrode 218 can be connected to a power source (not shown) to provide power to the processing chemicals in the processing region to generate a plasma. In some embodiments, the power source can be an RF power source connected to the upper electrode 218 through a matching network (not shown). Alternatively, the upper electrode can be electrically grounded.

[0084] The processing module 118 also includes a lower electrode 230. In some implementations, the lower electrode 230 is configured to receive the semiconductor wafer 150 for processing. In some implementations, the lower electrode 230 is an electrostatic chuck. The lower electrode 230 can be coupled to a power source (not shown) to provide power to the lower electrode 230 during processing. Alternatively, the lower electrode 230 can be electrically grounded.

[0085] The processing module 118 includes a lifting mechanism 221 to enable the consumable component 208 to be moved to a raised position. The lifting mechanism 221 is similar to the reference Figure 4 The lifting mechanism discussed herein includes a plurality of lifting pins 202 and an actuator 204 to lift the consumable component to a raised position, and an actuator driver 206 is connected to the actuator 204 to provide power to drive the actuator 204. The actuator driver 206 can be coupled to a controller 220 to control the operation of the lifting mechanism 221 during the replacement process of the consumable component.

[0086] Controller 220 includes a vacuum state control device 223 and a transfer logic 225 to facilitate coordinated operation of various components connected to controller 220. In one implementation, when a consumable component is to be replaced in processing module 118, exchange station 108 is brought into contact with first isolation valve 216. In response to detecting that exchange station 108 is at first isolation valve 216, a signal is sent from first isolation valve 216 to controller 220. Controller 220 then coordinates the coupling of exchange station 108 with processing module 118 and maintains vacuum at exchange station 108. For example, in response to receiving the detection signal from first isolation valve 216, vacuum state control device 223 of controller 220 may send a signal to vacuum control device 231 to initiate the coupling process of exchange station 108 with processing module 118. In response to the signal received from vacuum state control device 223, vacuum control device 231 may activate pump 233 to enable pump 233 to maintain a vacuum state at the exchange station. Once the exchange station 108 has reached a vacuum state, a signal is sent from the vacuum control device 231 to the vacuum state control device 223. The vacuum state control device 223 then sends a signal to the first isolation valve 216 to couple the exchange station with the processing module 118. In response, the first isolation valve 216 ensures that any intermediate area of ​​the first isolation valve 216 between the exchange station 108 and the processing module 118 is maintained under a vacuum state. Once ensured, the first isolation valve 216 couples the processing module 118 to the first side of the first isolation valve 216 and the exchange station 108 to the second side of the first isolation valve 216. Further testing can be performed to ensure that the intermediate area of ​​the first isolation valve 216 and the exchange station 108 are under vacuum before operating the doors 217, 219 to provide access to the processing module 118.

[0087] As part of the coupling operation, the vacuum state control device 223 can coordinate the operation of the second isolation valve 216' to maintain doors 227 and 229 covering corresponding openings defined in the process module 118 and the VTM 104 integrated with the process module 118, closing and sealing the process module 118. During coupling, the lift mechanism 221 in the process module 118 is maintained in the disengaged mode, the lift pins 202 are retracted within the housing of the lift mechanism 221, and the consumable component 208 is resting in its installed position. For example, the consumable component 208 is an edge ring. When the semiconductor wafer 150 is present in the process module 118, in its installed position, the edge ring is positioned adjacent to and substantially surrounding the semiconductor wafer 150.

[0088] Once the coupling process is complete, a signal is sent from the first isolation valve 216 to the controller 220, and in some embodiments, a signal is sent from the second isolation valve 216' to the controller 220. In response, the controller 220 activates the transfer logic 225. The transfer logic 225 is configured to coordinate the movement of the manipulator 215, the end effector 213 of the replacement manipulator 214 in the replacement station 108, and the actuator drive 206 of the lifting mechanism 221 in the processing module 118 to allow the end effector 213 to retrieve the consumable part from the processing module 118 and move it to the compartment 207 in the component buffer 224 defined in the replacement station 108, and move the replacement consumable part from the component buffer 224 compartment 207 back to the processing module 118 for installation. The lifting mechanism 221 is manipulated to install the replaced consumable part into the appropriate position in the processing module 118.

[0089] In one embodiment, Figure 5B A subsequent process is shown to retrieve the consumable part 208 from the processing module 118. The consumable part 208 is typically replaced before the semiconductor wafer is received into the processing module 118 for processing. According to this embodiment, once the replacement station 108 is coupled to the processing module 118 via the first isolation valve 216 and the second isolation valve 216' seals the doors 227, 229 leading to the VTM 104, the transfer logic 225 of the controller 220 is used to send a signal to the replacement operator 214 and the actuator driver 206 to retrieve the consumable part from the processing module and replace it with a new consumable part. The transfer logic 225 sends a signal to manipulate the robot 215 and the end effector 213 to allow the end effector 213 to extend into the processing module 118 to retrieve the consumable part. At the same time, the transfer logic 225 manipulates the actuator driver 206 to cause the actuator 204 to move the lift pin 202 away from the housing defined in the lift mechanism 221, thereby moving the consumable part 208 from the mounted position to the raised position, as shown. Figure 5B As shown. The end effector 213 slides under the raised consumable component to substantially support it. The actuator driver 206 is then manipulated to cause the actuator 204 to retract the lift pin 202 into the housing in the lift mechanism 221, allowing the raised consumable component 208 to be placed on the end effector 213 of the replacement manipulator 214. The end effector 213 of the replacement manipulator 214 is then manipulated to retract the consumable component 208 along with it into the replacement station 108. The end effector 213 is then manipulated to move the retrieved consumable component 208 to the compartment 207 of the component buffer 224.

[0090] New consumable parts 208 are similarly moved from different compartments 207 of the parts buffer 224 to the processing module 118. When a new consumable part 208 is moved into the processing module 118, the actuator driver 206 is manipulated to cause the actuator 204 to extend the lift pins 202 away from the housing to receive the new consumable part 208. The actuator 204 allows the lift pins 202 to be lowered, securing the consumable part 208 in its installed position within the processing module 118. During the consumable part replacement process, the vacuum state control device 223 continuously interacts with the vacuum control device 231 to ensure that the pump 233 continuously maintains the vacuum state of the replacement station to match the vacuum state maintained within the processing module 118.

[0091] Once the consumable component 208 is replaced, the controller 220 is used to coordinate the withdrawal of the exchange station 108 from the processing module 118. In response, the controller 220 sends a signal to the first isolation valve 216 to close the doors 217, 219 between the processing module 118 and the exchange station 108, and sends a signal to the second isolation valve 216' to open the doors 227, 229 to allow the VTM 104 to access the processing module 118.

[0092] In some implementations, the processing module 118 can be conditioned before the processing module returns to active operation. Because the replacement of consumable parts is performed under vacuum and only the processing module 118 needs to be conditioned, this conditioning operation can take less time. A signal can then be sent from the vacuum state control device 223 to the vacuum control device 231 to allow the pump 233 to purge the replacement station 108. The replacement station 108 can then be removed from the processing module 118.

[0093] Figure 5C Shown after the replacement in Figure 2, wherein the exchange station 108 is mounted to the VTM 104 rather than the process module 118. In this embodiment, the exchange station 108 is mounted to the vacuum transfer module (VTM) 104 via a first isolation valve 216 such that a first side of the first isolation valve 216 is coupled to a first side of the VTM 104. The exchange station 108 is coupled to a second side of the first isolation valve 216. The second isolation valve 216′ is arranged such that a first side of the second isolation valve 216′ is coupled to the process module 118 and a second side of the second isolation valve 216′ is coupled to a second side of the VTM 104. The first isolation valve 216 is configured to operate doors 237, 239 covering corresponding openings defined in the exchange station 108 and the VTM 104, respectively, while the second isolation valve 216' is configured to operate doors 227, 229 covering corresponding openings defined in the VTM 104 and the processing module 118, respectively, so as to allow the robot in the VTM 104 to access, retrieve and move consumable parts between the processing module 118 and the compartment 207 of the part buffer 224 in the exchange station 108. Figure 5C The replacement station 108 shown in FIG. 1 does not include a dedicated replacement manipulator 214 having a manipulator 215 and an end effector 213. The manipulator 235 is operatively coupled to a controller 220 to allow the controller to coordinate the operation of the manipulator 235. Furthermore, the replacement station, the first isolation valve 216, the VTM 104, the second isolation valve 216′, and the processing module 118 are coupled to the controller 220 to synchronize access between the replacement station and the processing module during the replacement of consumable parts while the processing module 118, the VTM 104, and the replacement station 108 are maintained under vacuum.

[0094] The process of installing the replacement station 108 to the VTM 104 is similar to that of referring to Figure 5A The embodiment discussed herein differs in that the replacement station 108 is mounted to the VTM 104 rather than the processing module 118. The process of replacing consumable parts 208 is similar to that described in reference to FIG. Figure 5A The embodiment discussed differs in that the controller 220 coordinates the manipulator 235 of the VTM 104, rather than coordinating Figure 5A The end effector 213 and the robot 215 of the replacement station 108 discussed in .

[0095] In an alternative embodiment, the exchange station 108 may include an exchange operator 214 (not shown) having a manipulator 215 and an end effector 213, wherein the exchange operator 214 is operatively connected to a controller 220. The controller 220 is configured to control the coordination of the manipulator 215, the end effector 213, and the manipulator 235 during the exchange of consumable parts. In this embodiment, the manipulator 215 and the end effector 213 may be used to retrieve and move consumable parts between the parts buffer 224 and the VTM 104, while the manipulator 235 of the VTM 104 may be used to move consumable parts between the VTM 104 and the processing module 118.

[0096] It should be pointed out that in Figure 5C In the illustrated embodiment, the second isolation valve 216' is not used to isolate the process module 118 from the rest of the cluster tool assembly 100 during the replacement of consumable parts. This is due to the fact that, in this embodiment, access to the process module is provided through the VTM 104. As a result, during the processing of semiconductor wafers, the second isolation valve 216' is configured to provide access when consumable parts need to be replaced, while enabling the selective isolation of the process module 118. In this embodiment, since the replacement station, VTM 104, and process module 118 are all maintained under vacuum during the replacement of consumable parts, the conditioning of the cluster tool assembly 100 after the replacement of consumable parts will take a shorter time.

[0097] Figure 6A An end effector mechanism 70 is shown for use in the robot 103 of the ATM 102 to transfer wafers between the wafer loader 115 and the load lock chamber 110. Figure 6A As shown in , the end effector mechanism 70 includes a wrist plate 701 that can be connected to a robot, such as the robot 103 in the ATM 102, on one side and to a mounting arm on the other side. In some embodiments, the mounting arm is made from a single plate of stainless steel material. A finger assembly 705 is mounted to the second side of the mounting arm. In some embodiments, the finger assembly 705 is mounted to the mounting arm using a spring loaded mounting to provide a means of horizontally adjusting the finger assembly 705. The finger assembly 705 includes a pair of fingers 707 that extend a length sufficient to support a wafer but not sufficient to support the consumable part 208, such as Figure 6A In some embodiments, the wrist plate 701 and the finger assembly 705 of the end effector mechanism 70 are made of aluminum. In some embodiments, the length L1-a of the finger assembly 705 is approximately 280 mm, and the length L1-b of the finger 707 is approximately 103 mm.

[0098] The fingers 707 of the finger assembly 705 can be extended to accommodate the consumable part 208. However, if the fingers 707 of the finger assembly 705 are extended, then Figure 6A The stainless steel material used in the end effector mechanism 70 would cause the fingers 707 to deflect from the wafer transfer plane due to the increase in payload caused by the additional material. The amount of deflection would make the end effector mechanism 700 less than ideal for use in confined spaces (such as the space within a cluster tool assembly) where precision in the transfer plane is required. Therefore, instead of redesigning the finger assembly 705 to extend the fingers 707, the original design of the finger assembly 705 is retained. The original design of the finger assembly 705 is used to transport consumable parts by enabling the finger assembly 705 to support a ring carrier. The ring carrier is in turn used to support the consumable parts 208. The details of the ring carrier will be referred to. Figures 8A-8B To describe.

[0099] Figure 6B 、 Figure 6B-1 and Figure 6C An exemplary end effector mechanism 700 for use in a manipulator within the cluster tool assembly 100 is illustrated in some embodiments. Figure 6B A top view of an exemplary end effector mechanism 700 for receiving and delivering consumable parts is shown. Figure 6B-1 A side view thereof is shown, and Figure 6C Its lateral tilt diagram is shown. Figure 6B 、 Figure 6B-1 and Figure 6C The end effector mechanism 700 shown in FIG is redesigned so that the end effector mechanism 700 can transport consumable parts in addition to wafers. Figure 6B 、 Figure 6B-1 and Figure 6C The end effector mechanism 700 shown in FIG can be implemented in the manipulator 105 within the VTM 104 and / or the manipulator 103 within the ATM 102. The redesigned end effector mechanism 700 includes a wrist plate 702 that can be mounted to the manipulator at one end and to a mounting arm 704 at the opposite end. The mounting arm 704 is defined by a top plate 704a and a bottom plate 704b, as shown in FIG. Figure 6B-1 As shown. In some embodiments, the top plate 704a of the mounting arm 704 is made of stainless steel, while the bottom plate 704b of the mounting arm 704 is made of aluminum. As long as the functionality of the mounting arm is maintained, variations in the materials used for the top and bottom plates may be implemented. In some embodiments, a spring-loaded mounting may be implemented between the top plate 704a and the wrist plate 702.

[0100] A finger assembly 710 having a pair of fingers 706 is clamped between a top plate 704a and a bottom plate 704b of the mounting arm 704, with the pair of fingers 706 extending outwardly from the mounting arm 704. In some embodiments, the finger assembly 710 of the end effector mechanism 700 is made of a ceramic material. The ceramic material provides rigidity to the fingers 706 and the finger assembly 710, thereby reducing deflection from the ring conveying plane, particularly when supporting wafers and / or consumable parts. Additionally, ceramic is lightweight, thereby resulting in a reduction in the effective load on the finger assembly 710. The clamping provides a stable mounting for the finger assembly 710 while ensuring that it does not cause any stress fractures within the ceramic finger assembly 710. Additionally, the lightweight ceramic material enables the finger assembly 710 to be aligned substantially parallel to the ring conveying plane, allowing consumable parts to be smoothly conveyed in and out of the load lock chamber 110. The first pair of consumable contact pads 708a is defined at the proximal end of the finger assembly 710, while the second pair of consumable contact pads 708b is defined at the distal end of the finger assembly 710, adjacent the front ends of the fingers 706 of the finger assembly 710. The length L3-a between the consumable contact pads 708a and 708b is defined as approximately 301 mm. Similarly, the third pair of substrate contact pads 708c is positioned proximate to the first pair of consumable contact pads 708a, while the fourth pair of substrate contact pads 708d is positioned proximate to the second pair of consumable contact pads 708b. The third and fourth pairs of substrate contact pads are positioned within the first and second pairs of consumable contact pads. The length L3-b between the substrate contact pads 708c and 708d is defined as approximately 133 mm.

[0101] Now refer to Figure 6B , the finger assembly 710 has a proximal end 710a defined as adjacent to the mounting arm 704 and a distal end defined at the front end of the pair of fingers 706. In some embodiments, the length L2-a is defined to cover at least the diameter of the consumable part 208 when the consumable part 208 is received so that the consumable part can be supported. For example, the length L2-a of the finger assembly 710 is defined to be at least about 360 mm, and the length L2-b of the pair of fingers 706 is defined to be at least 182 mm. The finger assembly 710 is used to receive and transport both the consumable part 208 and the wafer (i.e., substrate). For example, the finger assembly 710 is configured to transport 300 mm wafers and consumable parts that surround the 300 mm wafer, such as edge rings. In other embodiments, the finger assembly 710 is configured to transport 200 mm wafers, or 450 mm wafers, or wafers of any other size, and consumable parts that surround wafers of corresponding size, such as edge rings. In these embodiments, finger assembly 710 is sized to support appropriately sized wafers and consumable parts.

[0102] To assist in the transport of consumable parts 208 and wafers, a plurality of contact pads are provided at different distances on the top surface of the finger assembly 710 to support the consumable parts and wafers when they are received. In some embodiments, separate groups of contact pads are provided so that the consumable parts and wafers have different contact surfaces on the finger assembly 710. Such an arrangement may be desirable to reduce contamination of the wafers when using the same finger assembly 710 to transport consumable parts. A first pair of consumable contact pads 708a can be arranged on the top surface of the finger assembly 710 and located at or near the proximal end 710a of the mounting arm 704. A second pair of consumable contact pads 708b is arranged on the top surface of the finger assembly 710 and located at or near the distal end 710b of the front end 706a of the pair of fingers 706. The first pair of consumable contact pads 708a and the second pair of consumable contact pads 708b are used to transport consumable parts. Similarly, a third pair of substrate contact pads 708c is disposed on the top surface of the finger assembly 710 adjacent to the first pair of consumable contact pads and between the first pair of consumable contact pads 708a and the second pair of consumable contact pads 708b. A fourth pair of substrate contact pads 708d is disposed on the top surface of the finger assembly 710 adjacent to the second pair of consumable contact pads and between the first pair of consumable contact pads 708a and the second pair of consumable contact pads 708b. The third pair of substrate contact pads 708c and the fourth pair of substrate contact pads 708d are used to transport wafers. The consumable contact pads 708a and the consumable contact pads 708b are arranged outside the diameter of the wafer, while the substrate contact pads 708c and 708d are disposed inside the diameter of the wafer. This design allows the receiving surface of the wafer on the finger assembly 710 and the receiving surface of the consumable component 208 to be separated, minimizing contamination of the wafer.

[0103] In some embodiments, the contact pads are made of a non-slip material, such as an elastomeric material. The position of the consumable contact pads 708a, 708b on the top surface of the finger 706 is such that when the end actuator mechanism 700 of the manipulator lifts the consumable part 208, the contact pads provide reliable contact support to the bottom surface of the consumable part 208. In some embodiments, more than one set of consumable contact pads 708a, 708b can be provided at the proximal end 710a and the distal end 710b of the finger assembly 710 so that they can provide reliable contact support. In some embodiments, additional consumable contact pads 708 can be arranged to provide contact support to the bottom surface of the consumable part 208 having different bottom surface profiles that may require more than one contact point.

[0104] Figures 7A-7DA specific embodiment of a finger assembly 710 is shown for use in an end effector mechanism 700 for supporting consumable components 208 having different bottom surface profiles. In some embodiments, for example, the consumable component 208 may be an edge ring positioned adjacent to the wafer when the wafer is received within the processing module 112. The edge ring may have different cross-sectional profiles on the bottom surface, and the consumable contact pads 708 are arranged on the top surface of the finger assembly 710 to accommodate the different surface profiles of the consumable component 208.

[0105] Figure 7A An embodiment is shown in which the cross-section of the bottom surface edge of the consumable part 208 is substantially rectangular. In this embodiment, when the consumable part 208 is properly aligned and received on the finger assembly 710 of the end effector mechanism 700, the consumable contact pads 708 arranged at the top surface of the finger assembly 710 provide sufficient contact surface. In some implementations, the consumable contact pads 708a, 708b are separated by a distance at least equal to the diameter of the consumable part. Figure 7A In the embodiment shown in FIG, the consumable contact pad 708 is positioned so that it contacts the bottom surface of the consumable component 208 at mid-span.

[0106] Figure 7B An alternative cross-sectional profile of the bottom surface of the consumable component 208 is shown in one embodiment. The consumable component 208 includes a cutout on the bottom surface at the outer diameter of the consumable component 208. The position of the consumable contact pad 708 disposed on the top surface of the finger assembly 710 ensures that the consumable contact pad continuously contacts and supports the consumable component 208 and does not disengage from the bottom surface of the consumable component 208 as long as the alignment of the consumable component 208 on the finger 706 is within predefined positional error limits.

[0107] Figure 7C-1 FIGURE 2 shows a second alternative cross-sectional profile of the bottom surface of the consumable component 208 in one embodiment. The consumable component 208 includes a cutout in the middle of the bottom surface. Figure 7A and 7B If the consumable contact pad 708 at the distance shown were to be used, the contact pad 708 would not provide sufficient contact with the bottom surface of the consumable component 208, as in Figure 7C-1. This will result in the consumable parts being accommodated on the top surface of the fingers 706 rather than on the surface of the consumable contact pads 708. When the paired fingers 706 are made of a finely machined ceramic material, there is a high probability that the consumable parts 208 received on the paired fingers 706 may be misaligned during their transportation (an extremely undesirable result). In order to avoid such misalignment, additional consumable contact pads can be provided on the finger assembly 710 at different distances to ensure that when the consumable part 208 with the cutout is received on the finger assembly 710, the bottom surface of the consumable part 208 is in full contact with one or more consumable contact pads 708 provided on the paired fingers 706. The consumable contact pads are confined on the finger assembly 710 so as to support consumable parts 208 of an expected cross-section across an expected range of positional errors, while also being outside the expected wafer offset range so that the wafer will never contact the consumable contact pads when being received. Figure 7C-2 One such example is shown, where a set of two consumable contact pads 708 are disposed at different distances on the finger assembly 710 to provide reliable contact support on the bottom of the consumable component 208. The distance between the two consumable contact pads 708 can be configured according to the width of the cutout.

[0108] Figure 7D FIG. 1 shows a third alternative cross-sectional profile of the bottom surface of the consumable component 208 in one embodiment. In this embodiment, the consumable component 208 includes a flange with a smaller inner diameter so that when a wafer is received in the processing module, the wafer can be received on the flange of the consumable component. In this embodiment, the bottom surface of the consumable component 208 is smaller than that in FIG. Figure 7A-7C-2 As a result, the consumable contact pads 708 disposed on the finger assembly 710 will provide sufficient contact support to the consumable component 208 during transport. Figures 7A-7D As shown in , different types of contact pad concepts can be used.

[0109] Figure 7E The end effector mechanism 700 is shown depicted in the manipulator 105 within the VTM 104, and Figure 7F-1 、 7F-2 Details of an alternative contact pad concept used within the end effector mechanism 700 are shown to enable receipt of consumable parts having different bottom profiles. Figure 7E The various components of the end effector mechanism 700 shown in FIG are similar to those of the reference Figure 6A Components discussed with respect to the end effector mechanism 700 depicted in FIG.

[0110] Figure 7F-1 and 7F-2An alternative contact pad concept is shown for use in some embodiments in an end effector mechanism 700 for receiving consumable parts. Figure 7F-2 An enlarged view of a portion A-1 of the finger 706 within the finger assembly 710 is shown in which an alternative contact pad concept is defined. In such an embodiment, an annular contact structure 709 can be used in place of the consumable contact pad 708. In some embodiments, the annular contact structure 709 can be in the form of an O-ring made of an elastomeric material. The use of an O-ring or annular contact structure 709 enables an annular line contact that spans a greater range of radii of the consumable component. It also addresses the problem of reference Figures 7A-7D The present invention relates to a method for manufacturing a wafer contact pad that is configured to provide a plurality of wafer contact pads and wafer contact structures. The method further comprises: providing a plurality of wafer contact pads and wafer contact structures ... to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to provide a plurality of wafer contact pads to

[0111] Return to reference Figures 6B-6C ,exist Figures 6B-6C The end effector mechanism 700 shown in FIG can be used by the robot 105 within the vacuum transfer module 104, and also in some embodiments by the robot 103 within the ATM 102. In an alternative embodiment, Figures 6B-6C The end effector mechanism 700 can be used by the manipulator 105 of the VTM 104 and can be implemented in the manipulator 103 of the ATM 102. Figure 6A The configuration of the end effector mechanism 70 or the redesigned end effector mechanism 70 or 700 is shown in FIG.

[0112] Figures 8A-8B 1 shows a top view of different end effector mechanisms used in the robot within the ATM 102 and VTM 104 in some embodiments of the present invention. As previously described, the robot 103 in the ATM 102 can use the existing end effector mechanism 70 with short fingers and a carrier plate, or a modified end effector mechanism 700 with extended fingers to move wafers and consumable parts. Figure 8AFIG. 1 shows a top view of an existing end effector mechanism 70 integrated into a robot 103 of an ATM 102, which is typically used to transport wafers to a load lock chamber 110. The existing end effector mechanism 70 can also be used to transport consumable parts to the load lock chamber 110. Figure 8A As can be seen in FIG, the pair of fingers 707 defined in the end effector mechanism 70 are designed to provide contact support to a wafer (not shown) and are not designed to provide contact support to the consumable part 208, which has a larger radius than the wafer. In order to enable the end effector mechanism 70 to be used to support and transport consumable parts, a ring carrier fixture is used.

[0113] Figure 8B An exemplary embodiment is shown in which a loop carrier fixture is used with the end effector mechanism 70 in the manipulator 103 of an ATM 102 to transport consumable parts 208 between the exchange station 108 and the load lock chamber 110. The loop carrier fixture can be in the form of a carrier plate 1104. In some embodiments, the carrier plate 1104 is made of a carbon fiber material. Carbon fiber is lightweight and is ideal because it minimizes the increase in payload on the finger assembly 705. Carbon fiber also provides sufficient stiffness to minimize deflection.

[0114] In some embodiments, the carrier plate 1104 is configured to be triangular and sized so that the vertices (1104a, 1104b, 1104c) are at least as far from the center 1104m of the carrier plate 1104 as the radius of the consumable component 208. The triangular shape of the carrier plate has many advantages. For example, the triangular shape of the carrier plate allows the carrier plate 1104, with the consumable component 208 received thereon, to be easily moved into and out of the load lock chamber 110 without interfering with any components defined within the load lock chamber 110. This is possible because the vertices 1104a-1104c allow the carrier plate 1104 to be easily moved, for example, between the finger assemblies 902 defined within the load lock chamber 110 while maintaining sufficient clearance. Additionally, because the vertices 1104a-1104c are equidistant from the center of gravity 1104m defined at the center of the triangular carrier plate 1104, the consumable component 208 can be properly supported at the vertices without causing undue stress on any side.

[0115] In one embodiment, the carrier plate 1104 is stored in the replacement station 108 and retrieved by the robot 103 of the ATM 102 using the end effector mechanism 70. In some embodiments, the end effector mechanism 70 disposed in the robot 103 of the ATM 102 can be configured to provide sufficient suction when picking up the carrier plate 1104 so that the carrier plate 1104 can be securely received and carried on the end effector mechanism 70. In some embodiments, different carrier plates 1104 can be used to transport used consumable parts and new consumable parts respectively. For example, a first carrier plate can be used to transport used consumable parts, while a second carrier plate can be used to transport new consumable parts.

[0116] Using an end effector mechanism 70 with a ring carrier in the form of a carrier plate 1104 has its advantages. For example, an existing end effector mechanism 70 can be used without having to redesign it. Redesigning the end effector mechanism 70 to support the ring may require a shape change, which could interfere with the wafer support or other hardware at different wafer transfer positions. Such play issues can be addressed by changing the robot arm trajectory within the ATM, but this trajectory change may increase wafer transfer time, thereby reducing system throughput. Alternatively, using a ring carrier allows the existing trajectory to be used for wafer transfer without any change in wafer throughput. If necessary, a specific ring transfer trajectory can be defined so that the wafer transfer trajectory remains unchanged. Furthermore, this has a minimal impact on existing firmware. In some embodiments, the ring carrier (in the form of the carrier plate 1104) may increase the payload, which can contribute to deflection from the ring transfer plane. However, by using a suitable lightweight material for the ring carrier, such as carbon fiber, any increase in payload and resulting deflection can be significantly minimized.

[0117] Figure 9A and 9B10. Side and top views of an exemplary end effector mechanism 70 for use with a ring carrier 1104 for transferring consumable parts 208 into a load lock chamber 110, in some embodiments, are shown. The end effector mechanism 70 includes a wrist plate 701 that is attachable to the manipulator 103 at one end and to a mounting arm 703 at the other end. A finger assembly 705 is attached to a second end of the mounting arm 703. A pair of fingers 707 of the finger assembly extend outwardly from the mounting arm 703. The finger assembly 705 has a proximal end 705a proximate the mounting arm 703. A distal end 705b of the finger assembly 705 is defined at fingertips 707a of the pair of fingers 707. A first carrier contact pad 721a is disposed on a top surface of the finger assembly 705 proximate the center of a fork 723 formed at the base of the fingers 707. The second pair of carrier contact pads 721b is arranged on the top surface of the finger assembly 705 and is located near the distal end (705b) of the finger assembly 705. The carrier plate 1104 is supported on the finger assembly 705 using the first carrier contact pads 721a and the second pair of carrier contact pads 721b. The finger assembly 705 is also configured to transport substrates or wafers. It should be noted that in some embodiments, the existing end effector mechanism 70 having a ring carrier (in the form of the carrier plate 1104) can be used only with the robot of the ATM 102 because it is convenient to store and retrieve the carrier plate 1104 at the replacement station 108 and there is no need to redesign any other modules for storing the carrier plate 1104. The carrier plate 1104 includes consumable contact pads 708 located at each vertex 1104a-1104c at a distance from the center of the carrier plate 1104, and the consumable contact pads 708 are outside the radius of the substrate. In some embodiments, the consumable contact pad 708 is at least the radius of the consumable part 208 from the center of the carrier plate 1104 to provide a non-slip contact surface for the consumable part when it is received at the apex of the carrier plate 1104. Figures 7A-7D As discussed in the embodiment shown in , the consumable contact pads 708 can be disposed at different distances from the vertices of the carrier plate 1104. In some embodiments, each vertex can include a pair of consumable contact pads 708 disposed equidistant from each of the vertices 1104a-1104c. In alternative embodiments, a plurality of consumable contact pads 708 can be defined at different distances from each of the vertices 1104a-1104c to enable the contact pads to provide a reliable contact surface for consumable components 208 having different bottom surface profiles.

[0118] In addition to the modified end effector mechanism 700 included within the manipulator of the ATM 102 and / or VTM 104, additional modifications may be provided within the load lock chamber 110 to enable consumable parts to be received therein during a replacement operation.

[0119] Figures 10A-10F Various views and details are provided of a support mechanism that, in some embodiments, engages within the load lock chamber 110 to receive and support consumable parts. Figure 10A In one embodiment, a top view of a simplified load lock chamber 110 is shown, which is connected between the ATM 102 and the VTM 104 within the cluster tool assembly 100, in which the consumable parts 208 need to be replaced. The load lock chamber 110 includes a support mechanism 901 for receiving the consumable parts 208. The support mechanism 901 includes a plurality of finger assemblies 902 that provide contact surfaces on which the consumable parts are received. The finger assemblies 902 are arranged at fixed positions within the load lock chamber 110. In some embodiments, the finger assemblies 902 are configured to have mutually exclusive contact points for receiving wafers and consumable parts to avoid cross contamination, as will be described in the following paragraphs. It should be noted that the contact points can be at different heights or radial distances to achieve exclusive separation within the expected positional error of the wafers or consumable parts.

[0120] Figure 10B An existing finger assembly 903 within a load lock chamber 110 designed to receive wafers is shown. Each finger assembly 903 includes a top support finger 903a and a bottom support finger 903b. As shown, the top surfaces of both the top support finger 903a and the bottom support finger 903b are designed to include a downwardly inclined portion 911. Contact pads 912 are defined near the front ends of the top support fingers 903a and the bottom support fingers 903b to provide a non-slip contact surface for the wafer when receiving the wafer. Spacer blocks are defined to support the top support fingers 903a and the bottom support fingers 903b. The thickness of the spacer blocks is designed to provide sufficient play for receiving the wafer. However, by Figure 10B The clearance provided by the spacer block is not enough to receive consumable parts, which have a larger radius than the wafer. To accommodate the consumable parts, the finger assembly in the load lock chamber was redesigned to avoid interference with the components in the load lock chamber when receiving the consumable parts.

[0121] Figure 10CFIG. 1 shows an exemplary redesigned finger assembly 902 of a support mechanism 901 for use within a load lock chamber 110 to enable consumable components to be received thereon, in one embodiment of the present invention. The support mechanism 901 includes a plurality of finger assemblies 902. Figure 10A In one embodiment shown in , the support mechanism includes three finger assemblies equidistant from one another along the circumference of a circle. Each of the plurality of finger assemblies 902 includes a top supporting finger 902a and a bottom supporting finger 902b. In one embodiment, the top surface of the bottom supporting finger 902b is designed to include a recess 908 adjacent to the second end of the bottom supporting finger 902b, and a spacer block is arranged at a first end between the top supporting finger 902a and the bottom supporting finger 902b. In order to adequately accommodate the consumable part, the spacer block 905 is redesigned to provide sufficient clearance so that the consumable part 208 can be fully received on the finger assembly 902. In Figure 10C In the embodiment shown in , the spacer block 905 is shown moved away from the center of the load lock chamber 110, closer to the side wall of the load lock chamber 110, so as not to interfere with the transfer path of the consumable parts. A second spacer block 905" can be arranged at a first end below the bottom support finger 902b and be the same size as the redesigned spacer block 905, thicker or thinner than the redesigned spacer block 905. In some embodiments, the spacer block 905 is not provided, and the finger assembly can include a finger support for supporting the top support finger and the bottom support finger 902b while providing a gap therebetween. In addition, in Figure 10C In one embodiment shown, the bottom support finger 902b within each finger assembly 902 within the load lock chamber 110 is redesigned to include a recess 908 on the top surface at a distance at least equal to the radius of the consumable component. In one embodiment, the recess 908 is sized to be at least the width of the consumable component. One or more contact pads are defined on the surface of the finger assembly 902 to provide a non-slip contact support surface for the wafer and consumable component 208 when the wafer and consumable component 208 are received. For example, the substrate contact pad 904 is provided at the second end of the finger assembly proximate to the front end of the top support finger 902a and the bottom support finger 902b and on the top surface of the top support finger 902a and the bottom support finger 902b. In some embodiments, the substrate contact pad 904 is defined at a distance from the center of the support mechanism equal to the radius of the wafer to provide a contact support surface for the wafer when the wafer is received. Additionally, consumable contact pads 906 are defined within recesses 908 of bottom support fingers 902b to provide contact support for consumable component 208. Additional consumable contact pads 906 may be defined within recesses 908 based on the bottom surface profile of the consumable component.

[0122] In some embodiments, the substrate contact pads 904 at the top support fingers 902a may be used to receive a wafer, while the consumable contact pads within the recess may be used to receive the consumable parts. In an alternative embodiment, the top support fingers 902a may include recesses 908 having consumable contact pads 906 for receiving the consumable parts 208, while the substrate contact pads 904 on the surface of the bottom support fingers 902b may be used to receive the wafer. In an alternative embodiment, the recesses 908 may be provided in both the top support fingers 902a and the bottom support fingers 902b. In this embodiment, both the top support fingers 902a and the bottom support fingers 902b are configured to receive the consumable parts 208 and the wafer. It should be noted that the consumable parts 208 and the wafer will not be received on the finger assembly at the same time. However, in some implementations, it is possible to receive consumables and wafers simultaneously by enabling consumables to be received on the bottom support fingers 902b while using the top support fingers 902a to receive wafers, or vice versa. In such an embodiment, the wafer contact pads and the consumable contact pads are designed so that the contact surface for receiving the consumables 208 is kept separate from the contact surface for receiving the wafer to avoid cross contamination. It should be noted that the wafer contact pad positions are defined so that wafers received at the limits of the allowable position error will not contact the consumable contact pads. Similarly, consumables received at the limits of the allowable position error will not contact the wafer contact pads. The separation of the contact receiving surfaces will avoid cross contamination of the wafers when they are received on the finger assembly. In some embodiments, instead of using different contact pads, an annular contact structure may be provided within a recess 908 defined within the bottom support fingers 902b and / or the top support fingers 902a. The annular contact structure may be made of an elastomeric material and may be an O-ring. The contact surface provided by the annular contact structure spans a large range of consumable part radii.

[0123] Consumable components (such as edge rings) arranged near the wafers in the processing module are exposed to harsh processing conditions, and the wafers are exposed to these harsh processing conditions in the processing module. As a result, some of the chemical treatment substances may have been deposited on the surface of the consumable components as contaminants. When the consumable components are to be replaced in the processing module, the used consumable components with contaminants are removed from the processing module and received into the load lock chamber 110, and new consumable components are moved from the load lock chamber 110 to the processing module. When the load lock chamber 110 is used to move consumable components and wafers in and out of the processing module, if the contact support surface is common for receiving both the consumable components and the wafer, there is a high possibility that contaminants from the used consumable components will contaminate the surface of the wafer. In order to prevent such contamination from occurring, a solution is to use a separate load lock chamber 110 to move the wafer and the consumable components separately. This arrangement may be feasible, but may seriously affect the throughput of the wafer because only one of the two load lock chambers 110 will be available for moving the wafer.

[0124] In order to maintain wafer throughput and avoid potential wafer contamination, in one embodiment, an alternative solution is to enable the available load lock chambers 110 within the cluster tool assembly 100 to be used to move new and used consumables 208 as well as pre-processed and processed wafers. For example, in one embodiment, the top support fingers 902a and the bottom support fingers 902b can provide separate receiving areas for the consumables and the wafers. In such an embodiment, the multiple contact pads provided on the finger assembly enable the contact surface of the wafer to be maintained at a height that is separate from the contact surface of the consumable. In the case where the consumable is in the form of a ring (i.e., an edge ring), by maintaining the contact surface of the ring at a different height than the contact surface of the wafer, wafer surface contamination can be avoided or minimized.

[0125] Figure 10DShows an enlarged view of one such finger assembly 902 for supporting wafers and consumable components within the load lock chamber 110 in one embodiment. A recess 908 is defined in the top surface of the bottom support finger 902b. One or more consumable contact pads 906 are disposed within the recess 908 for receiving the consumable component 208, while one or more substrate contact pads 904 are provided near the front ends of the support fingers 902a, 902b for receiving the wafer. In one embodiment, on the bottom support finger 902b, the consumable contact pads 906 for receiving the consumable component are disposed at a distance from the center of the support mechanism that is at least equal to the radius of the consumable component 208, and the substrate contact pads 904 for receiving the wafer are disposed at a distance from the center of the support mechanism that is at least equal to the radius of the wafer. The consumable contact pads 906 disposed within the recesses 908 of the plurality of finger assemblies 902 define an annular receiving plane 911 for receiving the consumable component 208, and the substrate contact pads 904 provided on the finger assemblies 902 define a wafer receiving plane 913 for receiving the wafer. The recess 908 enables the annular receiving plane 911 and the wafer receiving plane 913 to be disposed at different heights, thereby separating the contact support surface for the wafer from the contact support surface for the consumable component. This separation of the contact support surfaces is designed to protect the surface of the wafer from contamination by preventing the wafer from contacting any part of the contact support surface for receiving the consumable component. In one embodiment, the height (h2) of the annular receiving plane 911 is at a lower height (h1) compared to the wafer receiving plane 913 (i.e., height h1 < h2). In one embodiment, the difference between h2 and h1 is at least greater than the height of the consumable component 208. In another embodiment, height h1 > h2, such that the wafer is received at a lower height and the consumable component is received at a higher height while separating the wafer receiving surface from the consumable component receiving surface.

[0126] Of course, in Figure 10C and 10DThe design of the finger assembly shown in is an example of keeping the contact surface of the wafer and the contact surface of the consumable parts separate. Other designs can be used, including finger assembly designs in which the height h1>h2 can be used. In this design, the cutout can be defined at the front end of the top surface of the support fingers 902a, 902b. The surface formed by the cutout can be used to receive the substrate contact pad 904 for supporting the wafer, and the consumable parts can be received on the consumable contact pad 906, which is defined in the recess 908 at the top surface of the bottom support finger 902b. In one embodiment, the cutout can also be formed on the top and / or bottom support fingers 902a, 902b so that it defines a wafer receiving surface for receiving the wafer, the cutout being located at least at a distance from the center of the support mechanism 901 equal to the radius of the wafer, and the substrate contact pad 904 can be provided thereon to provide a reliable contact support surface for the wafer. Likewise, consumable contact pads provided within recesses 908 defined within the top surfaces of the support fingers 902a, 902b provide a contact support surface for the consumable component.

[0127] Figure 10E and 10F An exemplary airlock chamber is shown before and after a redesign of the support mechanism 901 in some embodiments. The support mechanism 901 includes a plurality of finger assemblies that have been redesigned to accommodate transporting consumable parts as well as wafers. The redesigned finger assemblies provide a simple, easy, and cost-effective solution because they allow consumable parts 208 to be received within the loadlock chamber 110 without having to completely redesign the loadlock chamber 110. Figure 10E As shown, in order to adequately receive the consumables 208 on the bottom support fingers 902b of the finger assembly within the support mechanism 901, the spacer blocks 905' must be redesigned to be moved out of the consumables' transport path. Figure 10E The prior art design shown shows spacer blocks 905' that interfere with receiving consumable components on the bottom support fingers 902b. Figure 10F An exemplary embodiment is shown in which a redesigned spacer block 905 is engaged. The redesigned spacer block 905 is shown moved away from the center of the airlock, closer to the side wall. As previously described, the top and bottom support fingers can be supported and separated by the redesigned spacer block 905 or alternatively by finger supports (not shown) that provide sufficient play to allow consumable components to be adequately received on the bottom support fingers.

[0128] In order to fully receive the consumable parts 208 on the top support finger 902a, there must be sufficient vertical clearance to avoid interference caused by the inner edge radius of the loading lock chamber 110, and such interference will be encountered when moving the consumable parts into and out of the loading lock chamber 110. The finger assembly is designed to take this limitation into account by providing a minimum clearance between at least the "forbidden zone" of the consumable parts and the upper and lower slot corners of the loading lock chamber. The forbidden zone as used in this application refers to the cross-section of the largest consumable part design (e.g., outer diameter and height) and the peripheral offset representing the superposition of tolerances. The superposition of tolerances includes the effects of position errors caused by leveling, end effector deflection, trajectory of the robot arm, robot teaching and other tolerance contributing factors. The upper and lower slot corners are defined as the corresponding areas on the edges of the top support fingers and bottom support fingers of the support mechanism in the loading lock chamber where the consumable parts are received. In some embodiments, the minimum clearance defined between the forbidden zone and the slot corner is between about 0.01 inches and about 0.03 inches. In other embodiments, the minimum play is about 0.025 inches.

[0129] The finger assembly 902 is designed so that there is a minimum nominal clearance between at least the consumable components received on the finger assembly and the sidewall 110a of the load lock chamber 110. In some embodiments, the minimum nominal clearance is designed to be at least between about 5 mm and about 6 mm. In other embodiments, the minimum clearance is about 5.4 mm. In some embodiments, the minimum nominal clearance to the side of the load lock chamber 110 is defined to account for consumable component misalignment or positional offset, which can be corrected by the VTM robot using dynamic alignment input.

[0130] In addition, the height of the spacer block 905 within the finger assembly 902 should be limited so as to provide sufficient vertical clearance between the top support fingers 902a and the bottom support fingers 902b so that the consumable parts received on the bottom support fingers 902b can be moved into and out of the load lock chamber 110 without any interference. In some embodiments, the spacer block 905 within the finger assembly 902 is designed so as to provide a minimum clearance between the top surface of the consumable parts received on the bottom support fingers 902b and the bottom surface of the top support fingers 902a to define an annular conveying plane for moving the consumable parts along it. In some embodiments, the minimum clearance is between about 4 mm and 5 mm. In some embodiments, the vertical clearance defined by this gap is about 4.6 mm. In some embodiments, the vertical play between the top support fingers and the bottom support fingers is designed to provide a minimum play of at least about 2 mm to about 3 mm above and below the consumables as they are transferred into and out of the load lock chamber 110. In another embodiment, the vertical play between the top support fingers and the bottom support fingers is designed to be at least about 2.3 mm above and below the consumables to enable transfer. In some embodiments, the vertical play is defined to account for any payload deflection present in the end effector mechanism during transfer.

[0131] The high-level operations for replacing consumable parts within the cluster tool assembly 100, in one embodiment, will now be discussed. Figure 3 and 3A As depicted, the cluster tool assembly 100 includes: one or more load ports to which a wafer loader 115 or an exchange station 108 is permanently or temporarily mounted; an automated machining process (ATM) having a first robot for moving consumable components and wafers; a load lock chamber; a virtual machining process (VTM) having a second robot; and one or more process modules. Consumable components are located within the process modules and may need to be replaced periodically so that wafer processing can be performed efficiently.

[0132] In one embodiment, when a consumable part needs to be replaced within a processing module, all processing modules integrated with the VTM are placed in an inoperative state. This means that no wafers are within the cluster tool assembly except in the case of an engaged closed wafer loader. If a replacement station is temporarily installed, at least one loading port of the ATM remains free for receiving a replacement station 108. In this embodiment, the cluster tool assembly 100 is not configured to perform processing of wafers and replacement of consumable parts simultaneously. In an alternative embodiment, the cluster tool assembly can be configured to perform replacement of consumable parts and processing of wafers simultaneously. In such an embodiment, access to the various modules is coordinated so that consumable parts and wafers can be moved efficiently.

[0133] In one embodiment, a replacement station 108 with replacement consumable parts is installed into a free loading port within the cluster tool assembly 100. In one embodiment, the installation is done manually. In an alternative embodiment, the installation is done using a robot. Figure 3A In the illustrated embodiment, the FOUP type exchange station can be transported in an automatic manner using an overhead lift conveyor (OHT) or an automatic guided vehicle (AGV), which can be part of an automatic material handling system (AMHS). In one embodiment, the AMHS is installed in the main manufacturing facility. In some embodiments, the AMHS may include an automatic storage for storing FOUP type exchange stations and / or wafer loaders. The AMHS may include tracking software to guide the OHT or AGV to the appropriate exchange station or wafer loader so that the appropriate exchange station or wafer loader can be taken out from the storage and installed in the free loading port in the cluster tool assembly. In some embodiments, the OHT or AGV may be equipped with a radio frequency identification (RFID) tag reader or a barcode reader to find out the position of the exchange station or wafer loader in the storage of the AMHS. In some embodiments, the storage may include multiple rows of exchange stations and / or wafer loaders. In this embodiment, software can direct the OHT or AGV to the appropriate row, and a barcode reader or RFID tag reader can be used to identify a specific exchange station or wafer loader to remove from the row. In one example, the OHT or AGV can then retrieve the exchange station and automatically install it into a free loading port defined within the first side of the ATM of the cluster tool assembly.

[0134] When the exchange station 108 is installed, a transfer sequence is initiated on a user interface of a computer communicatively connected to the cluster tool assembly. The transfer sequence causes the exchange station 108 to be loaded into the cluster tool assembly. In some embodiments, consumable part mapping is performed by the ATM robot 103 when the exchange station is loaded. This mapping can provide dynamic alignment input so that the consumable parts can be aligned when they are moved to the load lock chamber.

[0135] The VTM robot 105 simultaneously or sequentially removes used consumables from the processing modules 112 in the cluster tool assembly 100 and transfers the used consumables 208 to the load lock chamber 110. The VTM robot 105 uses planar transfer to move the consumables 208 by coordinating the movement of lift pins within the processing module 112. For more information on the lift pin mechanism for removing consumables from the processing module, refer to Figure 4Discussion. The VTM manipulator 105 places the used consumable part 208 within the bottom support finger 902b of the finger assembly 902. In some embodiments, both the top support finger 902a and the bottom support finger 902b can be used to transport used or new consumable parts 208. In one embodiment, the bottom support finger 902b can be used to receive only used consumable parts 208, while the top support finger 902a can be used to receive only new consumable parts 208, or vice versa. In other embodiments, the receipt of used consumable parts and new consumable parts is not limited to a particular one of the support fingers, but can be received on either the top support finger 902a or the bottom support finger 902b. During the replacement process of the consumable part 208, dynamic alignment is active within the load lock chamber 110.

[0136] Once the used consumable parts 208 are placed on the support mechanism 901 of the load lock chamber 110, the air lock is ventilated so that the load lock chamber 110 is under ambient conditions. The ATM robot 103 is then activated to remove the consumable parts 208 from the load lock chamber 110 and transfer them to the replacement station 108. In one embodiment, this can include the ATM robot 103 taking out the ring carrier (i.e., carrier plate 1104) from the replacement station 108 and using it to remove the used consumable parts from the load lock chamber 110. The ATM robot 103 then picks up a new consumable part 208 from the replacement station 108 and transfers it to the load lock chamber 110. After receiving the new consumable part 208, the load lock chamber 110 is evacuated to vacuum. In order to evacuate the load lock chamber 110 to vacuum, in one embodiment, the load lock chamber 110 can be coupled to a pump by a vacuum control module (not shown) connected to a controller. A controller is used to coordinate the action of the pump so that the load lock chamber 110 can be evacuated to a vacuum as a new consumable part 208 is to be moved through the VTM 104 into the processing module 112. Once the load lock chamber 110 is set to a vacuum state, the VTM robot 105 is activated to pick up the consumable part 208 from the load lock chamber 110 and transport it to the processing module 112. In one embodiment, access to the load lock chamber 110 is controlled by a gate valve connected between the VTM 104 and the load lock chamber 110. Similarly, access to the processing module 112 through the VTM 104 can be controlled by a second gate valve (such as an isolation valve), as described with reference to Figure 5Cdiscussed. The second gate valve can be operated using a sensor mechanism. Since the dynamic alignment is active during the replacement process of the consumable part 208, when the VTM robot 105 picks up the consumable part 208 from the load lock chamber 110, it picks up the consumable part 208 with the dynamic alignment corrected and places it into the processing module 112. The lift pin mechanism in the processing module 112 extends the lift pins to receive the consumable part 208, positions the consumable part 208 in the installed state, and then retracts the lift pins into the housing (e.g., lift pin housing). In one embodiment, the replacement of consumable parts 208 in more than one processing modules 112-120 (alternatively referred to as "processing chambers") can be processed sequentially one at a time using this method.

[0137] Figure 11 An exemplary exchange station 108 is shown for storing new and used consumable parts 208 in one embodiment. In one embodiment, the exchange station 108 can be similar in structure to a wafer loader and include a parts buffer 224 having a plurality of compartments 207 to store the consumable parts 208. In one embodiment, the parts buffer includes a "clean" or "new" consumable parts area 1206 for receiving and storing new consumable parts 208 and a "dirty" or "worn" consumable parts area 1208 for receiving and storing used and worn, potentially contaminated consumable parts 208. A separator plate 1202 can be provided within the exchange station 108 to separate the clean consumable parts area 1206 from the dirty consumable parts area 1208. In one embodiment, a ring carrier in the form of a carrier plate 1104 can be stored within a housing provided within the exchange station. In one embodiment, the housing for the carrier plate 1104 can be provided within the clean or new consumable parts area 1206. The housing for the carrier plate 1104 can be located at the bottom, top, or anywhere between the bottom and top of the clean or new consumable parts area 1206. In an alternative embodiment, the carrier plate 1104 can be housed within the dirty or worn consumable parts area 1208. The housing for the carrier plate 1104 can be located at the bottom, top, or anywhere between the bottom and top of the dirty or worn consumable parts area 1208. In some embodiments, the exchange station 108 can accommodate two carrier plates 1104, one within the clean or new consumable parts area 1206 and the other within the dirty or worn consumable parts area 1208, so that new and used consumable parts can be transferred between the exchange station and the load lock chamber 110, respectively. In an alternative embodiment, instead of or in addition to the exchange station 108, one or more areas can be defined in the ATM 102 to store used and new consumable parts. In such an embodiment, consumable parts may be transported and removed from the ATM 102 using the replacement station 108 and a robot within the ATM 102 or utilizing other transport and removal devices.

[0138] Figure 12 In one embodiment, a view toward an exemplary slot within a processing module is shown in which consumable parts are received. For example, consumable parts are received along a circular transfer plane (RTP) 1301 located above a group of chamber interface pins 1308 within the processing module 112. In some embodiments, the RTP 1301 is defined above the chamber interface pins (CIP) 1308. In certain embodiments, the height of the consumable parts on the top surface of the electrostatic chuck (ESC) disposed in the processing module 112 is defined so that the clearance is sufficient to allow the consumable parts to be moved into and out of the processing module 112 without any interference. In such an embodiment, the clearance ensures that the consumable parts, the end effector mechanism having the arm, can fit through the slot opening of the processing module 112. Since the slot opening is designed for wafer transfer, the size of the consumable parts can be limited by the slot size. When wider consumable parts are to be transferred, segmented consumable parts can be used to fit into the existing slot opening of the processing module 112, rather than redesigning the slot opening. In a specific example, the relative height of the ESC biases the consumable parts toward the top of the slot. Due to the specific size of the slot corner radius, there will be a trade-off between the height and diameter of the consumable component. To ensure sufficient clearance all around, a tolerance zone can be defined around the consumable component and the robot to provide a combined volume during transfer. The tolerance zone will have to account for the effects of load deflection, trajectory errors of the robot arm, the effects of leveling errors, and other factors. In some embodiments, the clearance above, below, and to the sides of the nominal loop transfer path can be as small as a few millimeters or less.

[0139] In some embodiments, the RTP is different from the wafer transfer plane (WTP). In such embodiments, when wafers are transferred into and out of the processing module 112, the WTP is defined as being above the CIP 1308 and the RTP. In some embodiments, a minimum clearance is defined between a restricted area 1304 for the consumables 208 and an inside corner radius 1306 of an opening into the processing module 112 through which the wafers and consumables are transported. In some embodiments, the minimum clearance can be several millimeters in size. This minimum clearance enables consumables to be moved into and out of the processing module 112 without any part of the processing module 112 interfering with the transfer of the consumables.

[0140] A variety of embodiments have been described which define end effector mechanisms used within robots of ATM 102 and VTM 104 for transporting wafers so as to also transport consumables. In some embodiments, the end effector mechanism is redesigned so that the finger assembly extends beyond the edge of the wafer, thereby enabling support of the consumables. In alternative embodiments, an existing end effector mechanism is used to transport the consumables. In such an embodiment, because the existing end effector mechanism is not designed to support the consumables, an intermediate fixture in the form of a ring carrier is temporarily used to support the consumables during the transport of the consumables. The finger assembly in the load lock chamber is redesigned to support the consumables. The redesigned end effector mechanism and finger assembly have multiple contact pads to define mutually exclusive contact points for wafers and consumables, thereby avoiding cross contamination. The contact pads (consumable contact pads, wafer contact pads) can be designed to provide contact points at different heights or radial distances, thereby achieving exclusive separation within the expected positional error of the wafer or consumables.

[0141] Consumable parts often have a diameter, thickness and weight that exceeds that of the wafer. Therefore, the transfer of additional consumable parts toward the tool (the tool was not originally designed for such transfer) is limited by the clearance in the existing hardware. The deflection caused by the additional payload further reduces the clearance. Therefore, in order to accommodate the increase in payload and reduce deflection, the end actuator mechanism can be made of a higher rigidity material (such as ceramic) to limit the increase in deflection or thickness, while using a redesigned end actuator mechanism to reduce the total payload on the robot. Various contact pads (wafer contact pads, consumable contact pads) are defined on the surface of the finger assembly within the end actuator mechanism to support consumable parts within the desired position error range and that may have different bottom surface profiles. The same alignment input used to center the wafer can also be used to position and center the consumable parts. The consumable parts can be transported to and removed from the cluster tool assembly via a standard wafer FOUP loading port defined in the ATM. The exchange station for transporting and removing consumable parts is designed to be similar to the FOUP design for transporting wafers. The replacement station can be temporarily installed to the loading port of the ATM manually or by an automated system (such as an overhead rail FOUP transfer system). This temporary installation enables the replacement of consumable parts without the need to move or consume other wafer storage or processing hardware (i.e., wafer buffer, cooling station, integrated metrology, etc.) on the ATM. In an alternative embodiment, the consumable parts can be received into the ATM via the replacement station, temporarily stored in the ATM separated from the loading port and taken out when the consumable parts need to be replaced. Various embodiments described herein provide an effective and cost-effective way to replace the consumable parts in the cluster tool assembly without destroying the vacuum seal, thereby making the cluster tool assembly have a shorter downtime. The reduction in the downtime of the cluster tool assembly can lead to an increase in wafer yield.

[0142] Figure 13 A control module (also referred to as a controller) 220 for controlling the cluster tool assembly described above is shown. In one embodiment, the controller 220 may include some exemplary components such as a processor, a memory, and one or more interfaces. The controller 220 may be used to control devices in the cluster tool assembly 100 based in part on sensed values. By way of example only, the controller 220 may control one or more valves 602 (including Figure 5A 、 5B, isolation valves 216, 216' of 5C), filter heater 604, pump 606 (including pump 233), and other equipment 608. By way of example only, controller 220 receives sensed values ​​from pressure gauge 610, flow meter 612, temperature sensor 614, and / or other sensors 616. Controller 220 can also be used to control process conditions during precursor delivery and film deposition. Controller 220 will typically include one or more memory devices and one or more processors.

[0143] The controller 220 can control the activities of the precursor delivery system and the deposition apparatus. The controller 220 executes a computer program comprising instructions for controlling process timing, delivery system temperature, pressure differential across the filter, valve positions, manipulator and end effector, gas mixture, chamber pressure, chamber temperature, wafer temperature, RF power level, position of the wafer chuck or pedestal, and other parameters of a particular process. The controller 220 can also monitor the pressure differential and automatically switch the gaseous precursor from one or more paths to one or more other paths. Other computer programs stored on a memory device associated with the controller 220 may be used in certain embodiments.

[0144] Typically, there will be a user interface associated with the controller 220. The user interface may include a display 618 (e.g., a display screen and / or graphical software display of device and / or process conditions), and a user input device 620 such as a pointing device, keyboard, touch screen, microphone, etc.

[0145] Computer programs for controlling the delivery, deposition, and other processes in the processing sequence of precursors can be written in any conventional computer-readable programming language, such as assembly language, C, C++, Pascal, Fortran, or other programming languages. The compiled object code or script is executed by a processor to perform the tasks identified in the program.

[0146] Control module (i.e., controller) parameters related to process conditions such as, for example, filter pressure differential, process gas composition and flow rate, temperature, pressure, plasma conditions such as RF power level and low-frequency RF frequency, cooling gas pressure, and chamber wall temperature.

[0147] The system software can be designed or configured in many different ways. For example, a plurality of chamber component subroutines or control objects can be written to control the operation of the chamber or process module components necessary to perform the deposition process of the present invention. Examples of programs or portions of programs used for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, plasma control code, elevator control code, robot position code, end effector position code, and valve position control code.

[0148] The substrate positioning program may include program code for controlling chamber components used to load the substrate onto the pedestal or chuck and control the spacing between the substrate and other chamber components (e.g., gas inlets and / or targets). The process gas control program may include code for controlling gas composition and flow rate, and optionally code for flowing gas into the chamber to stabilize the chamber pressure prior to deposition. The filter monitoring program may include code for comparing measured differences with predetermined values ​​and / or code for switching paths. The pressure control program may include code for controlling the chamber pressure by, for example, adjusting a throttle valve in the chamber's exhaust system. The heater control program may include code for controlling the current flow to a heating unit used to heat components in the precursor delivery system, the substrate, and / or other parts of the system. Alternatively, the heater control program may control the delivery of a heat transfer gas (e.g., helium) to the wafer chuck. Valve position control code may include, for example, code for controlling access to a process module or cluster tool assembly by controlling an isolation valve that provides access to the process module or cluster tool assembly. The lift mechanism control code may include, for example, code for activating an actuator driver to cause the actuator to move lift pins. For example, the manipulator position encoding may include encoding for manipulating the position of the manipulator, including encoding for manipulating the manipulator to move along a transverse axis, a vertical axis, or a radial axis. For example, the end effector position encoding may include encoding for manipulating the position of the end effector, including encoding for manipulating the manipulator to extend, retract, or move along a transverse axis, a vertical axis, or a radial axis.

[0149] Examples of sensors that can be monitored during deposition include, but are not limited to, mass flow control modules, pressure sensors such as pressure gauge 610, and thermocouples (e.g., temperature sensor 614) located in the transport system, pedestal, or chuck. Appropriately programmed feedback and control algorithms can be used with data from these sensors to maintain desired process conditions. Previously, embodiments of the present invention were described as being implemented in single-chamber or multi-chamber semiconductor processing tools.

[0150] The various embodiments described herein allow consumable components to be replaced quickly and efficiently without exposing the cluster tool assembly to atmospheric conditions. As a result, the time required to replace consumable components, as well as any risk of chamber contamination during consumable component replacement, is significantly reduced, thereby allowing the cluster tool assembly to be brought online more quickly. Additionally, the risk of inadvertent damage to the processing modules, consumable components, and other hardware components within the processing modules is significantly reduced.

[0151] The foregoing description of the embodiment is provided for the purpose of illustration and description. It is not intended to be exhaustive or limit the present invention. The individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable when applicable and can be used in the selected embodiment, even if not specifically shown or described. The individual elements or features of a particular embodiment can also be varied in many ways. Such variations should not be considered as departing from the present invention, and all such modifications are intended to be included within the scope of the present invention.

[0152] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. The present embodiments are therefore to be considered illustrative and not restrictive, and the embodiments are not to be limited to the details given herein, but may be modified within the scope and equivalents of the claims.

Claims

1. An end effector connectable to a manipulator for use with a processing tool, comprising: a finger assembly defined by a plate, the finger assembly including a base and a pair of fingers extending outwardly from the base, each of the pair of fingers including a proximal end adjacent the base, wherein the finger assembly is coupled to an arm of the manipulator, and a distal end at a forward end of the pair of fingers; an annular contact structure disposed on a top surface of the finger assembly and received over a portion of the pair of fingers at the proximal and distal ends so as to cover an outer diameter, the surface of the annular contact structure being for supporting a consumable component when operated by the finger assembly, the surface being sized to provide continuous line contact with a bottom surface of the consumable component; a second set of contact pads disposed on the top surface of the finger assembly adjacent the proximal end of the base and proximate the distal end such that the second set of contact pads defines an inner diameter, the second set of contact pads being configured to support a substrate when operated by the finger assembly, in, The outer diameter is disposed concentrically with the inner diameter, and wherein the annular contact structure provides a first contact surface that is different from a second contact surface provided by the second set of contact pads.

2. The end effector of claim 1, wherein the inner diameter is equal to or smaller than a diameter of the substrate, and the outer diameter is equal to or smaller than a diameter of the consumable part.

3. The end effector according to claim 1, wherein: The annular contact structure is arranged to cover the circumference of a circle defined by the outer diameter, and the second set of contact pads is arranged inside the circle and along the circumference of a second circle defined by the inner diameter.

4. The end effector according to claim 1, wherein: The annular contact structure is located at a first height and the second group of contact pads is located at a second height, wherein the first height is different from the second height, so that the contact surface defined by the first height for receiving the consumable part is different from the contact surface defined by the second height for receiving the substrate.

5. The end effector of claim 1 , wherein the second set of contact pads comprises: a first pair of contact pads located at the proximal ends of the pair of fingers such that the first pair of contact pads are disposed within the outer diameter of the annular contact structure at the proximal ends; as well as A second pair of contact pads is located at the distal end such that the second pair of contact pads is disposed within the outer diameter of the annular contact structure at the distal end, thereby extending the inner diameter by a distance between the first and second pairs of contact pads of the second set.

6. The end effector of claim 1, wherein the surface of the annular contact structure is sized relative to at least a cross-sectional profile of the bottom surface of the consumable component.

7. The end effector of claim 1, wherein the finger assembly is coupled to the manipulator arm by connecting the base to a wrist plate.

8. The end effector of claim 7 , wherein the wrist plate is connected to the base via a mounting arm, the mounting arm comprising a top plate and a bottom plate, the base of the finger assembly being mounted between the top plate and the bottom plate of the mounting arm.

9. The end effector of claim 1, wherein the annular contact structure and the second set of contact pads are made of an elastomeric material.

10. The end effector of claim 1, wherein the robot is disposed within a vacuum transfer module of the processing tool.

11. The end effector according to claim 1, wherein: The surface of the annular contact structure is sized to accommodate a range of radii of the consumable component and variations in bottom profile of the consumable component.

12. The end effector of claim 1, wherein: The top surface of the finger assembly includes a recess defined corresponding to the outer diameter, and the annular contact structure is received and secured in the recess on the top surface of the finger assembly.

13. The end effector of claim 1 , wherein: The annular contact structure is a replaceable unit designed to be securely received on the top surface of the finger assembly.

14. An end effector assembly connectable to a manipulator for use with a processing tool, comprising: a finger assembly defined by a plate, the finger assembly comprising a base and a pair of fingers, each of the pair of fingers including a proximal end adjacent the base, wherein the finger assembly is connected to an arm of the manipulator, and a distal end at a front end of the pair of fingers, a first set of contact pads disposed on a top surface of the finger assembly near a center of a fork formed by the pair of fingers, near the proximal end, and a second set of contact pads disposed on the top surface of the finger assembly near the distal ends of the pair of fingers; a triangular carrier plate positioned above the finger assembly such that the first set of contact pads and the second set of contact pads define a contact surface for supporting the triangular carrier plate when handled by the finger assembly; as well as A set of support pads are positioned on the top surface of the triangular carrier plate such that each support pad in the set is positioned adjacent a respective vertex of the triangular carrier plate and each support pad is positioned at a distance from the center of the triangular carrier plate that is at least greater than an inner radius of the consumable part, the set of support pads providing a support surface for the consumable part when processed by the end actuator assembly.

15. The end effector assembly of claim 14, wherein the manipulator is disposed within an atmospheric delivery module.

16. The end effector assembly of claim 15, wherein: The triangular carrier plate is an independent unit that is stored in a replacement station coupled to the atmospheric transfer module and is retrieved by the robot when the consumable part is to be transported to or retrieved from the processing module of the processing tool, and wherein the replacement station is used to store the consumable part.

17. The end effector assembly of claim 14, wherein: The triangular carrier plate is positioned over the finger assembly such that the base of the triangular carrier plate is received over the base of the finger assembly.

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