An anti-collision mechanism for a glue application device

Abstract

The present invention discloses an anti-collision mechanism for a glue coating device, including a buffer component. One end of the buffer component is provided with a glue applicator, and the other end of the buffer component is arranged on the driving arm of the glue coating device. The buffer component can change its own structure under the action of an external force. In the art, in order to ensure the firm installation of the dispensing device and improve the dispensing accuracy, those skilled in the art will not consider setting a buffer component at the installation end of the dispensing device, let alone consider setting a buffer component with a variable structure of its own. However, in some relatively expensive circuit boards, if the components are damaged, it will cause great losses. This technical solution can effectively avoid the damage of the components, thereby reducing the production risk.

Description

Technical Field

[0001] The present invention relates to the technical field of glue application equipment for circuit boards, and particularly relates to an anti-collision mechanism for a glue application device. Background Art

[0002] In the existing glue dotting or coating operation of circuit boards, a fixed connection or a transmission connection is adopted between the output ends of a glue dotting valve and a three-axis module or a multi-axis module. However, when the glue dotting valve performs glue dotting operation on the circuit board in the horizontal plane, it is easy to collide with the components on the circuit board, resulting in damage to the circuit board. Based on the cost of some specially customized circuit boards, when the components of the circuit board are damaged during the glue coating process by the glue dotting valve, it will lead to the scrapping of the product, causing relatively serious losses to the manufacturer. In view of this, a new technical solution is needed to solve the above technical problems. Summary of the Invention

[0003] To solve the above technical problems, the present application proposes an anti-collision mechanism for a glue application device, which offsets the impact between the glue applicator and the circuit board components by setting a buffer component, thereby avoiding damage to the circuit board when it is impacted.

[0004] Specifically, the present invention discloses an anti-collision mechanism for a glue application device, including a buffer component. One end of the buffer component is provided with a glue applicator, and the other end of the buffer component is arranged on the driving arm of the glue application device. The buffer component can change its own structure under the action of an external force. The two ends of the buffer component can be fixedly or transmissionally provided with the glue applicator and the driving arm, which is adjusted according to the specific use scenario.

[0005] Among them, the glue application device can be a coater or a glue dotting machine. For example, when the glue application device is a glue dotting machine, generally, a glue dotting machine has a three-axis module or a multi-axis module, which is equivalent to the driving arm mentioned in this article. At this time, the glue applicator can be a glue dotting device. The existing one is that the glue dotting device is directly installed at the output end of the multi-axis module. The improvement made by the present invention is that a buffer component is arranged between the glue dotting device and the output end of the multi-axis module.

[0006] In this field, in order to ensure the firm installation of the glue dotting device and improve the glue dotting accuracy, those skilled in the art will not consider setting a buffer component at the installation end of the glue dotting device, let alone consider setting a buffer component with a variable self-structure. However, in some relatively expensive circuit boards, if the components are damaged, it will cause great losses. The technical effect of this technical solution is that it can effectively avoid damage to the components, thereby reducing the production risk.

[0007] During operation, when the glue applicator collides with the components vertically arranged on the circuit board while applying glue on the horizontal plane, the force is transmitted to the buffer assembly. The buffer assembly can change its own structure to reduce or eliminate the collision between the glue applicator and the circuit board components. The buffer assembly can offset the impact received by the glue applicator through its own elastic deformation, plastic deformation, or fracture of its own structure. Additionally, the buffer assembly can be set as a split structure. For example, the split structure includes two connecting parts (but not limited to two connecting parts), one is set on the glue applicator, and the other is set on the driving arm, and the two connecting parts are connected through a flexible connection and a floating connection, or the two connecting parts can be magnetically connected or elastically connected; it can also be that one side of the two connecting parts is hinged, and the other side is elastically connected or magnetically connected; for the diversity of connection forms, no exhaustive list will be made in this article. When one of the two connecting parts is stressed, the positions of the two connecting parts change, thereby also being able to avoid the impact between the glue applicator and the circuit board components.

[0008] Furthermore, it further includes a control system. The control system includes a detection module and an electronic control module. The detection module is used to detect the change in the structure of the buffer assembly, and the electronic control module is used to control the movement of the driving arm, and the detection module and the electronic control module are signal-connected.

[0009] The working process and technical effect of this technical solution are as follows: When the glue applicator collides with the components of the circuit board, the structure of the buffer assembly changes. The detection module transmits a signal to the electronic control module, and the electronic control module controls the alarm to sound and controls the driving arm to stop moving.

[0010] Preferably, the buffer assembly includes a first connecting part and a second connecting part. The first connecting part is set on the glue applicator, the second connecting part is set on the driving arm, and the first connecting part is movably set on the second connecting part.

[0011] This technical solution provides a split design structure of the buffer assembly. The first connecting part is movably set on the second connecting part. When the glue applicator is impacted, the first connecting part moves on the second connecting part, thereby offsetting the collision between the glue applicator and the components on the circuit board.

[0012] Preferably, the first connecting part and the second connecting part are magnetically connected. When the glue applicator collides with the components on the circuit board, when the collision force is greater than the magnetic adsorption force between the first connecting part and the second connecting part, the first connecting part detaches from the second connecting part, thereby reducing the collision force between the glue applicator and the components on the circuit board.

[0013] Further, the first connecting portion and the second connecting portion are connected by a spring. This technical solution can be implemented independently or synchronously with the magnetic connection method between the first connecting portion and the second connecting portion. It can effectively prevent the glue applicator from falling. The installation method of the spring is that spring installation grooves are respectively provided on the opposite surfaces of the first connecting portion and the second connecting portion, and both ends of the spring are respectively fixed in the installation grooves of the first connecting portion and the second connecting portion.

[0014] Preferably, the first connecting portion is attached to the lower surface of the second connecting portion. The technical effect of this technical solution is that when the connection method between the first connecting portion and the second connecting portion is spring connection or magnetic connection, the first connecting portion is more convenient to move on the lower surface of the second connecting portion without interference or blockage.

[0015] Preferably, air holes are provided on the second connecting portion and / or the first connecting portion. The air inlet end of the air holes is connected to an external air supply device, and the air outlet end of the air holes penetrates to the joint surface of the first connecting portion and the second connecting portion.

[0016] When this technical solution is working, the air pressure regulating device is used to regulate the air pressure in the connecting pipeline between the air holes and the air supply device, so that there is a relative separating force between the first connecting portion and the second connecting portion, thereby offsetting the original adsorption force between the first connecting portion and the second connecting portion. When the glue applicator is collided, the first connecting portion is more likely to be separated from the second connecting portion.

[0017] Preferably, a guiding component is provided between the first connecting portion and the second connecting portion. The function of the guiding component is that when the first connecting portion and the second connecting portion are separated by an external force, when the external force is withdrawn, under the action of the guiding component, the spring pulls the positions of the first connecting portion and the second connecting portion back to the initial state. Thus, the position state of the first connecting portion and the second connecting portion is more easily restored.

[0018] Preferably, the guiding component includes:

[0019] A limiting groove provided on the first connecting portion and a tapered pin provided on the second connecting portion, or a limiting groove provided on the second connecting portion and a tapered pin provided on the first connecting portion;

[0020] Wherein, the tapered pin is movably arranged in the limiting groove.

[0021] The advantages of this technical solution are as follows: The tapered pin has a conical surface. When the first connecting portion and the second connecting portion move relative to each other, the tapered pin will not interfere with the movement of the first connecting portion and the second connecting portion; and when resetting, the tapered pin has a guiding effect and can restore the relative position of the first connecting portion and the second connecting portion to the initial state.

[0022] Preferably, the shape of the tapered pin is conical or pyramid-shaped. The advantage of this technical solution is that the conical pin can adapt to the 360-degree relative movement of the first connecting part and the second connecting part on the horizontal plane; when the tapered pin is pyramid-shaped, the first connecting part and the second connecting part can perform lateral or longitudinal relative movement on the horizontal plane, which can adapt to the working scenario of the glue applicator.

[0023] As a preferred solution of another guiding component of the present application, the guiding component includes:

[0024] A guiding column provided on the first connecting part and a guiding groove provided on the second connecting part, or a guiding column provided on the second connecting part and a guiding groove provided on the first connecting part;

[0025] Wherein, one end of the guiding column is inserted into the guiding groove, and the part of the guiding column extending into the guiding groove is hemispherical.

[0026] The technical effect of this preferred technical solution is that it can cooperate with the springs on the first connecting part and the second connecting part to restore the positions of the first connecting part and the second connecting part. Brief Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art.

[0028] Figure 1 It is a schematic diagram of the installation position of the buffer component in an anti-collision mechanism for a glue application device in Embodiments 1 to 9;

[0029] Figure 2 It is a schematic diagram of the structure of the buffer component in Embodiment 3;

[0030] Figure 3 It is a schematic diagram of the structure of the buffer component in Embodiment 4;

[0031] Figure 4 It is Figure 3 A three-dimensional structural decomposition diagram of;

[0032] Figure 5 In, a represents the combined implementation manner of the air hole 16 in Embodiment 5 and Embodiment 3;

[0033] Figure 5 In, b represents the combined implementation manner of the air hole 16 in Embodiment 5 and Embodiment 4;

[0034] Figure 6 In, a is a schematic diagram of the structure of the tapered pin provided on the first connecting part in Embodiment 6;

[0035] Figure 6 In [b], it is a schematic structural diagram of the tapered pin in Embodiment 6 being arranged on the second connecting part;

[0036] Figure 7 In [a], it is a schematic structural diagram of the guide post in Embodiment 7 being arranged on the first connecting part;

[0037] Figure 7 In [b], it is a schematic structural diagram of the guide post in Embodiment 7 being arranged on the second connecting part;

[0038] Figure 8 is Figure 7 a three - dimensional exploded schematic diagram of [a] in;

[0039] Figure 9 It is a schematic diagram of a combined implementation manner of the tapered pin in Embodiment 6 and the air hole in Embodiment 5.

[0040] The reference numerals involved in the attached drawings are as follows:

[0041] 11 - buffer assembly; 12 - glue applicator; 13 - driving arm; 14 - first connecting part; 15 - second connecting part; 16 - air hole; 17 - tapered pin; 18 - limiting groove; 19 - guiding groove; 20 - guide post; 21 - sealing ring installation groove; 22 - magnet installation groove. Specific implementation manners

[0042] The present invention will be further described in detail below with reference to the attached drawings. Embodiment 1

[0043] As Figure 1 shown, this embodiment discloses an anti - collision mechanism for a glue - applying device, including a buffer assembly 11. One end of the buffer assembly 11 is provided with a glue applicator 12, and the other end of the buffer assembly 11 is arranged on the driving arm 13 of the glue - applying device. The buffer assembly 11 can change its own structure under the action of an external force. Among them, the buffer assembly 11 can offset the impact received by the glue applicator 12 through its own elastic deformation, plastic deformation, or fracture of its own structure. Embodiment 2

[0044] The difference between Embodiment 2 and Embodiment 1 is that as Figures 2 to 4As shown in the figure, the buffer assembly 11 can also be configured as a split structure. For example, the split structure includes two connecting members (but not limited to two connecting members), one is disposed on the glue applicator 12, and the other is disposed on the driving arm 13. The two connecting members are connected by a flexible connection and a floating connection, or the two connecting members can be magnetically connected or elastically connected; it can also be that one side of the two connecting members is hinged and the other side is elastically connected or magnetically connected; for the diversity of connection forms, no further enumeration will be made herein. When one of the two connecting members is stressed, the positions of the two connecting members change, thereby also avoiding the impact between the glue applicator 12 and the circuit board components.

[0045] In both Embodiment 2 and Embodiment 1, a control system can be provided. The control system includes a detection module and an electronic control module. The detection module is used to detect the change in the structure of the buffer assembly 11, and the electronic control module is used to control the movement of the driving arm 13, and the detection module and the electronic control module are signal-connected. When the glue applicator 12 collides with the components of the circuit board, the structure of the buffer assembly 11 changes. The detection module transmits a signal to the electronic control module, and the electronic control module controls the alarm to sound and controls the driving arm 13 to stop moving.

[0046] As an implementation manner of this embodiment, the buffer assembly 11 includes a first connecting portion 14 and a second connecting portion 15. The first connecting portion 14 is disposed on the glue applicator 12, the second connecting portion 15 is disposed on the driving arm 13, and the first connecting portion 14 is movably disposed on the second connecting portion 15.

[0047] This technical solution provides a split design structure of the buffer assembly 11. The first connecting portion 14 is movably disposed on the second connecting portion 15. When the glue applicator 12 is impacted, the first connecting portion 14 moves on the second connecting portion 15, thereby offsetting the collision between the glue applicator 12 and the components on the circuit board. Embodiment 3

[0048] As shown in FIG. 2, in this embodiment, based on Embodiment 2, a specific design is made for the specific installation form between the first connecting portion 14 and the second connecting portion 15. The first connecting portion 14 and the second connecting portion 15 are magnetically connected. When the glue applicator 12 collides with the components on the circuit board, when the collision force is greater than the magnetic adsorption force between the first connecting portion 14 and the second connecting portion 15, the first connecting portion 14 detaches from the second connecting portion 15, thereby reducing the collision force between the glue applicator 12 and the components on the circuit board.

[0049] As an implementation manner of this embodiment, a magnet mounting groove 22 is provided on the upper surface of the first connecting portion 14, and a strong magnet is fixed in the magnet mounting groove 22. Embodiment 4

[0050] As Figure 3 andFigure 4 As shown, in this embodiment, the installation form of the first connecting portion 14 and the second connecting portion 15 in Embodiment 3 is improved, and the first connecting portion 14 and the second connecting portion 15 are connected by a spring. This technical solution can be implemented independently or simultaneously with the magnetic connection installation method between the first connecting portion 14 and the second connecting portion 15 in Embodiment 3. It can effectively prevent the glue applicator 12 from falling. The installation method of the spring is that spring installation grooves are respectively provided on the opposite surfaces of the first connecting portion 14 and the second connecting portion 15, and both ends of the spring are respectively fixed in the installation grooves of the first connecting portion 14 and the second connecting portion 15. Among them, the number of springs in this embodiment is multiple, and the positions of the springs can be arranged separately.

[0051] As an implementation manner of this embodiment, the first connecting portion 14 is attached to the lower surface of the second connecting portion 15. The technical effect of this technical solution is that when the connection method between the first connecting portion 14 and the second connecting portion 15 is a spring connection or a magnetic connection, the first connecting portion 14 is more convenient to move on the lower surface of the second connecting portion 15 without interference or blockage. Embodiment 5

[0052] As Figure 5 shown, on the basis of Embodiment 3 and Embodiment 4, this embodiment proposes a technical solution for reducing the adsorption force or elastic tensile force between the first connecting portion 14 and the second connecting portion 15. An air hole 16 is provided on the second connecting portion 15 and / or the first connecting portion 14. The air inlet end of the air hole 16 is connected to an external air supply device, and the air outlet end of the air hole 16 penetrates to the joint surface of the first connecting portion 14 and the second connecting portion 15. Among them, as Figure 5 shown by a in Figure 5 is the combined implementation manner of the air hole 16 and Embodiment 3,

[0053] As an implementation manner of this embodiment, a sealing ring installation groove 21 is provided at the air outlet end of the air hole 16, and a sealing ring is arranged in the sealing ring installation groove 21. The sealing ring is used to form a closed space between the first connecting portion 14 and the second connecting portion 15. The air pressure in the air hole 16 accumulates in the sealing ring. Among them, the sealing ring and the air hole 16 are coaxially arranged to prevent the leakage of gas and facilitate the formation of air pressure, thereby effectively providing a force for separating the first connecting portion 14 and the second connecting portion 15 from each other.

[0054] When this technical solution is in operation, the air pressure in the connecting pipeline between the air hole 16 and the air supply device is adjusted through the air pressure adjusting device, so that there is a relative separation force between the first connecting portion 14 and the second connecting portion 15, thereby offsetting the original adsorption force between the first connecting portion 14 and the second connecting portion 15, so that when the glue applicator 12 receives a collision, the first connecting portion 14 is more likely to disengage from the second connecting portion 15. Embodiment 6

[0055] Based on Embodiment 5, Embodiment 6 proposes a design solution that facilitates the first connecting portion 14 and the second connecting portion 15 to return to the initial state. A guiding component is provided between the first connecting portion 14 and the second connecting portion 15. The function of the guiding component is that when the first connecting portion 14 and the second connecting portion 15 are separated by an external force, when the external force is withdrawn, under the action of the guiding component, the spring pulls the positions of the first connecting portion 14 and the second connecting portion 15 back to the initial state. Thus, the position state of the first connecting portion 14 and the second connecting portion 15 is more easily restored.

[0056] As an implementation manner of this embodiment, as Figure 6 shown, the guiding component includes:

[0057] As Figure 6 shown in a of, the limiting groove 18 provided on the second connecting portion 15 and the tapered pin 17 provided on the first connecting portion 14; in addition, Figure 9 is a combined form of the tapered pin 17 and the air hole 16 in Embodiment 5, but is not limited to this combined form. Or as Figure 6 shown in b of, the limiting groove 18 provided on the first connecting portion 14 and the tapered pin 17 provided on the second connecting portion 15.

[0058] Wherein, the tapered pin 17 is movably arranged in the limiting groove 18.

[0059] The advantages of this solution are as follows: The tapered pin 17 has a conical surface. When the first connecting portion 14 and the second connecting portion 15 move relative to each other, the tapered pin 17 will not interfere with the movement of the first connecting portion 14 and the second connecting portion 15; and when resetting, the tapered pin 17 has a guiding effect and can restore the relative positions of the first connecting portion 14 and the second connecting portion 15 to the initial state

[0060] Furthermore, the shape of the tapered pin 17 is conical or quadrangular pyramid-shaped. The advantages of this technical solution are that the conical pin can adapt to the 360-degree relative movement of the first connecting portion 14 and the second connecting portion 15 on the horizontal plane; when the tapered pin 17 is a quadrangular pyramid, the first connecting portion 14 and the second connecting portion 15 can perform relative lateral or longitudinal movement on the horizontal plane, and can adapt to the working scenario of the glue applicator 12. Embodiment 7

[0061] In this embodiment, the guiding component is changed compared with Embodiment 6. For example, Figure 7 as shown, the guiding component includes:

[0062] As Figure 7 shown in a and Figure 8 as shown, the guiding post 20 provided on the first connecting portion 14 and the guiding groove 19 provided on the second connecting portion 15. Or as shown in b in Figure 7 , the guiding post 20 provided on the second connecting portion 15 and the guiding groove 19 provided on the first connecting portion 14; wherein, one end of the guiding post 20 is inserted into the guiding groove 19, and the portion of the guiding post 20 extending into the guiding groove 19 is hemispherical.

[0063] The technical effect of this technical solution is that it can cooperate with the springs on the first connecting portion 14 and the second connecting portion 15 to restore the positions of the first connecting portion 14 and the second connecting portion 15. Embodiment 6 and Embodiment 7 can be implemented separately, or the technical solutions of the guiding components of Embodiment 6 and Embodiment 7 can be set between the first connecting portion 14 and the second connecting portion 15 at the same time. Embodiment 8

[0064] In this embodiment, on the basis of Embodiment 2, the installation forms of the first connecting portion 14 and the second connecting portion 15 are designed. One end of the first connecting portion 14 and the second connecting portion 15 is connected by a hinge shaft, and the other ends of the first connecting portion 14 and the second connecting portion 15 are connected by a spring or an elastic hinge, so that the first connecting portion 14 can rotate around the hinge shaft, which can play a role of one-way buffering. The drawings of this embodiment are not given. Embodiment 9

[0065] In this embodiment, on the basis of Embodiment 7, the installation forms of the first connecting portion 14 and the second connecting portion 15 are designed. The middle parts of the first connecting portion 14 and the second connecting portion 15 are connected by a ball hinge, so as to play a role in resetting the first connecting portion 14 and the second connecting portion 15. The drawings of this embodiment are not given.

[0066] For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several deformations and improvements can also be made to the specific installation manners of the first connecting portion 14 and the second connecting portion 15, and these all belong to the protection scope of the present invention.

Claims

1. An anti-collision mechanism for a glue coating device, characterized in that, It includes a buffer component. One end of the buffer component is provided with a glue applicator, and the other end of the buffer component is arranged on the driving arm of the gluing device. The buffer component can change its own structure under the action of an external force; The buffer component includes a first connecting part and a second connecting part. The first connecting part is arranged on the glue applicator, the second connecting part is arranged on the driving arm, and the first connecting part is movably arranged on the second connecting part; The first connecting part and the second connecting part are magnetically connected; The first connecting part and the second connecting part are connected by a spring; Air holes are provided on the second connecting part and / or the first connecting part. The air inlet end of the air holes is connected to an external air supply device, and the air outlet end of the air holes penetrates to the joint surface of the first connecting part and the second connecting part; The air pressure in the connecting pipeline between the air holes and the air supply device is adjusted by a pressure regulating device, so that there is a relative separating force between the first connecting part and the second connecting part.

2. The anti-collision mechanism for the glue application device according to claim 1, characterized in that, It further includes a control system. The control system includes a detection module and an electric control module. The detection module is used to detect the change of the structure of the buffer component. The electric control module is used to control the movement of the driving arm, and the detection module and the electric control module are signal-connected.

3. The anti-collision mechanism for the glue application device according to claim 1, characterized in that, The first connecting part is attached to the lower surface of the second connecting part.

4. The anti-collision mechanism for the glue application device according to claim 1, wherein A guiding component is arranged between the first connecting part and the second connecting part.

5. The anti-collision mechanism for the glue application device according to claim 4, characterized in that, The guiding component includes: A limiting groove arranged on the first connecting part and a tapered pin arranged on the second connecting part, or a limiting groove arranged on the second connecting part and a tapered pin arranged on the first connecting part; Wherein, the tapered pin is movably arranged in the limiting groove.

6. The anti-collision mechanism for the glue application device according to claim 5, characterized in that, The shape of the tapered pin is conical or quadrangular pyramidal.

7. The anti-collision mechanism for the glue application device according to claim 4, characterized in that, The guiding component includes: A guiding column arranged on the first connecting part and a guiding groove arranged on the second connecting part, or a guiding column arranged on the second connecting part and a guiding groove arranged on the first connecting part; wherein, one end of the guiding column is inserted into the guiding groove, and the part of the guiding column extending into the guiding groove is hemispherical.

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