A bonding and fixing device and method for a semiconductor germanium single crystal rod and a crystal carrier

Abstract

The present invention discloses a bonding and fixing device and a bonding and fixing method for a semiconductor germanium single crystal rod and a crystal carrier. The bonding and fixing device includes a bottom plate, a bracket and a pressing device; the bracket includes a cross beam, and two opposite support legs are provided at both ends of the bottom of the cross beam; the bottom plate is located at the bottom between the two support legs; the pressing device includes a lead screw, a positioning pin, a bearing and a pressing block; a threaded hole is provided on the cross beam, the lead screw is threadedly connected to the threaded hole, the top of the lead screw passes through the top of the cross beam and the bottom passes through the bottom of the cross beam, the pressing block is connected to the bottom of the lead screw through a bearing, the pressing block is located above the bottom plate and below the cross beam; a V-shaped through groove with a downward opening is provided at the bottom of the pressing block; two vertical positioning pins are provided at the top of the pressing block, and the two positioning pins are respectively located on both sides of the lead screw; two guiding holes corresponding to the two positioning pins are provided on the cross beam, and the tops of the two positioning pins respectively pass through the corresponding guiding holes on the cross beam. The above device is convenient to use, has firm bonding, improves work efficiency and reduces losses.

Description

Technical Field

[0001] The present invention relates to a bonding and fixing device and a bonding and fixing method for a semiconductor germanium single crystal rod and a crystal holder, belonging to the technical field of semiconductor germanium single crystal rod processing. Background Art

[0002] Currently, enterprises involved in germanium single crystal slicing cannot avoid the link of germanium single crystal bonding. Before slicing the germanium single crystal rod, it needs to be bonded to the crystal holder first. The existing bonding method for the crystal rod and the crystal holder is as follows: Stand the crystal rod on a marble platform, apply the bonding agent on the crystal rod and then dock it with the crystal holder. The crystal rod and the crystal holder have no fixation and no stress points, so the bonding agent cannot be extruded, and air bubbles and voids will appear at the bonding place, resulting in insufficient bonding strength. In the subsequent cutting process, it is easy to have the situation of chip dropping and rod dropping. In the light case, the whole section of the crystal rod is scrapped, and in the heavy case, the crystal rod drops and damages the slicing machine, causing serious losses; moreover, both the crystal rod and the crystal holder are standing on the platform, which is easy to be knocked down, and at the same time, the residual glue is difficult to clean, and it is easy to cause the displacement of the crystal rod and the crystal holder when cleaning the residual glue. Summary of the Invention

[0003] The present invention provides a bonding and fixing device and a bonding and fixing method for a semiconductor germanium single crystal and a crystal holder, ensuring the bonding strength between the crystal rod and the crystal holder, easy to clean the residual glue, reducing the probability of wire breakage during slicing, avoiding the loss of chip dropping and rod dropping; being convenient to use and improving the efficiency.

[0004] To solve the above technical problems, the technical solutions adopted by the present invention are as follows:

[0005] A bonding and fixing device for a semiconductor germanium single crystal rod and a crystal holder includes a bottom plate, a bracket and a pressing device; the bracket includes a cross beam, and two opposite support legs are provided at both ends in the length direction of the bottom of the cross beam; the bottom plate is located at the bottom between the two support legs; the pressing device includes a lead screw, a positioning pin, a bearing and a pressing block; a threaded hole is provided on the cross beam, the lead screw is threadedly connected to the threaded hole, the top of the lead screw passes through the top of the cross beam and the bottom passes through the bottom of the cross beam, the pressing block is connected to the bottom of the lead screw through a bearing, the pressing block is located above the bottom plate and below the cross beam; a V-shaped through groove with an opening downward is provided at the bottom of the pressing block; two vertical and opposite positioning pins are provided at the top of the pressing block, and the two positioning pins are respectively located on both sides of the lead screw; two guiding holes corresponding to the two positioning pins are provided on the cross beam, and the top parts of the two positioning pins respectively pass through the corresponding guiding holes on the cross beam.

[0006] During use, place the bottom plate and the bracket on the operating table.

[0007] A method for adhesively fixing a germanium single crystal rod and a crystal holder using the above device includes the following steps: 1. Rotate the lead screw counterclockwise to raise the pressure block to a height convenient for operation (i.e., a height convenient for the bonding operation of the crystal rod and the crystal holder); 2. Prepare the crystal rod and the crystal holder to be bonded; 3. Place the crystal holder on the bottom plate and directly below the V-shaped through groove. The axial direction of the V-shaped through groove is consistent with the length direction of the crystal holder. Apply an adhesive to the bonding surface of the crystal rod to be bonded and place it on the crystal holder. The length direction of the crystal rod is consistent with the length direction of the crystal holder, and the crystal rod is directly below the V-shaped through groove; 4. Rotate the lead screw clockwise to drive the pressure block to descend and press the crystal rod; 5. After fixing the position, the residual glue extruded can be cleaned up, and then the crystal rod can be removed after the glue cures.

[0008] When the above device is in use, the bonding glue between the crystal rod and the crystal holder can be fully extruded, improving the bonding strength between the crystal rod and the crystal holder. At the same time, the positions of the crystal rod and the crystal holder are firmly fixed during the curing of the glue, ensuring that the crystal rod and the crystal holder will not shift in position, and both ends of the crystal rod can be bonded simultaneously; when cleaning the residual glue, the position between the crystal rod and the crystal holder will not be changed due to excessive force, and the residual glue can be cleaned more thoroughly; the entire crystal rod bonding process can be completed within 10 minutes, with the efficiency increased by more than 60%, avoiding the situation of the machine waiting for materials, and it is also relatively convenient to remove the bonded crystal rod. Just loosen the device to remove it.

[0009] The bottom plate plays a supporting role when fixed; by rotating the lead screw, the height of the pressure block can be adjusted; the setting of the positioning pin ensures the stability of the pressure block during up and down movement, ensuring that the pressure block will not rotate with the lead screw and ensuring the verticality of the up and down movement of the pressure block. The positioning pin can slide up and down relative to the guiding hole on the cross beam; the guiding hole on the cross beam is a vertical guiding hole, facilitating the vertical movement of the positioning pin along with the pressure block; the setting of the V-shaped through groove with an opening downward at the bottom of the pressure block facilitates clamping the crystal rod for better positioning.

[0010] As common knowledge, a bearing includes an inner ring and an outer ring, and the inner ring and the outer ring can rotate relative to each other. In this application, the pressure block is connected to the bottom of the lead screw through a bearing, so that the lead screw can rotate while the pressure block does not rotate.

[0011] To further improve the fixing stability, the apex angle of the V-shaped through groove is 85 - 95°.

[0012] To facilitate assembly, the positioning pin is threadedly connected to the pressure block.

[0013] To facilitate use, a rotating handle is provided at the top of the lead screw.

[0014] To balance the stability in use and the light weight of the device, the materials used for the bottom plate and the pressure block are both aluminum alloy.

[0015] To ensure the structural strength and service life of the device, the materials used for the bracket, lead screw, and positioning pin are all stainless steel.

[0016] To improve work efficiency, two sets of pressing devices are provided on the bottom plate in the length direction and are arranged oppositely. In this way, two sections of crystal bars can be bonded simultaneously, improving work efficiency.

[0017] Preferably, the threaded holes are provided at the central position in the length direction on the cross beam.

[0018] Technologies not mentioned in the present invention refer to the prior art.

[0019] The semiconductor germanium single crystal bar and crystal holder bonding and fixing device of the present invention can fully extrude the bonding glue between the crystal bar and the crystal holder, improving the bonding strength between the crystal bar and the crystal holder. At the same time, it also firmly fixes the positions of the crystal bar and the crystal holder during the curing of the glue, ensuring that the crystal bar and the crystal holder do not shift in position, and both ends of the crystal bar can be bonded simultaneously; when cleaning the residual glue, the positions between the crystal bar and the crystal holder will not be changed due to excessive force, and the residual glue can be cleaned more thoroughly; the entire crystal bar bonding process can be completed within 10 minutes, with the efficiency increased by more than 60%, avoiding the situation of the machine waiting for materials, and it is also relatively convenient to remove the bonded crystal bar, just loosen the device to remove it; it has a simple structure, low cost, and light weight; good stability, long service life; convenient operation, and improved efficiency. Brief Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the use state of the semiconductor germanium single crystal bar and crystal holder bonding and fixing device of the present invention;

[0021] In the figure, 1 is the bottom plate, 2 is the support leg, 3 is the cross beam, 4 is the lead screw, 5 is the positioning pin, 6 is the bearing, 7 is the pressing block, 8 is the crystal bar, and 9 is the crystal holder. Detailed Description of the Embodiments

[0022] To better understand the present invention, the content of the present invention will be further clarified below in conjunction with embodiments, but the content of the present invention is not limited to the following embodiments.

[0023] The orientation words such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. in this application are based on the orientation or position relationship shown in the drawings or during the use state, and are only for the convenience of describing this application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0024] Embodiment 1

[0025] AsFigure 1 As shown in Figure 1 , a bonding and fixing device for a semiconductor germanium single crystal rod and a crystal holder includes a bottom plate, a bracket, and a pressing device; the bracket includes a cross beam, and two opposite support legs are provided at both ends of the bottom of the cross beam in the length direction; the bottom plate is located at the bottom between the two support legs; the pressing device includes a lead screw, a positioning pin, a bearing, and a pressing block; a vertically arranged threaded hole is provided on the cross beam, the lead screw is threadedly connected to the threaded hole, the top of the lead screw passes through the top of the cross beam and the bottom passes through the bottom of the cross beam, the pressing block is connected to the bottom of the lead screw through a bearing, the pressing block is located above the bottom plate and below the cross beam; a V-shaped through groove with an opening downward is provided at the bottom of the pressing block; two vertically arranged and opposite positioning pins are provided at the top of the pressing block, and the two positioning pins are respectively located on both sides of the lead screw; two guiding holes corresponding to the two positioning pins are provided on the cross beam, and the tops of the two positioning pins respectively pass through the corresponding guiding holes on the cross beam.

[0026] A method for bonding and fixing a semiconductor germanium single crystal rod and a crystal holder using the above device includes the following steps: 1. Rotate the lead screw counterclockwise to raise the pressing block to a convenient operating height; 2. Prepare the crystal rod and the crystal holder to be bonded; 3. Place the crystal holder on the bottom plate and directly below the V-shaped through groove, the axial direction of the V-shaped through groove is consistent with the length direction of the crystal holder, apply an adhesive on the bonding surface of the crystal rod to be bonded and place it on the crystal holder, the length direction of the crystal rod is consistent with the length direction of the crystal holder, and the crystal rod is directly below the V-shaped through groove; 4. Rotate the lead screw clockwise to drive the pressing block to descend and press the crystal rod; 5. After fixing the position, the residual glue extruded can be cleaned up, and then the crystal rod can be removed after the glue is cured.

[0027] When the above device is in use, the bonding glue between the crystal rod and the crystal holder can be fully extruded, improving the bonding strength between the crystal rod and the crystal holder. At the same time, the positions of the crystal rod and the crystal holder are firmly fixed during the curing of the glue, ensuring that the crystal rod and the crystal holder will not shift in position, and both ends of the crystal rod can be bonded simultaneously; when cleaning the residual glue, the position between the crystal rod and the crystal holder will not be changed due to excessive force, and the residual glue can be cleaned more thoroughly; the entire crystal rod bonding process can be completed within 10 minutes, with the efficiency increased by more than 60%, avoiding the situation of waiting for materials by the machine, and it is also relatively convenient to remove the bonded crystal rod, and it can be removed by simply loosening the device.

[0028] The bottom plate plays a supporting role during fixation; by rotating the lead screw, the height of the pressing block can be adjusted; the setting of the positioning pin ensures the stability of the pressing block during up and down movement, ensuring that the pressing block will not rotate with the lead screw and also ensuring the verticality of the up and down movement of the pressing block, and the positioning pin can slide up and down relative to the guiding hole on the cross beam; the setting of the V-shaped through groove with an opening downward at the bottom of the pressing block facilitates clamping the crystal rod for better positioning.

[0029] Embodiment 2

[0030] On the basis of Embodiment 1, the following further improvements are made: In order to further improve the stability of fixation, the apex angle of the V-shaped through groove is 90°.

[0031] Embodiment 3

[0032] On the basis of Embodiment 2, the following further improvements are made: In order to facilitate assembly, the positioning pin is threadedly connected to the pressure block. In order to facilitate use, a rotating handle is provided at the top of the lead screw. The materials used for the bottom plate and the pressure block are both aluminum alloy; the materials used for the bracket, the lead screw and the positioning pin are all stainless steel.

[0033] Embodiment 4

[0034] On the basis of Embodiment 3, the following further improvements are made: In order to improve work efficiency, two sets of oppositely arranged pressing devices are provided in the length direction of the bottom plate. In this way, two crystal bars can be bonded simultaneously, improving work efficiency.

Claims

1. A method for bonding and fixing a semiconductor germanium single crystal rod and a crystal carrier, characterized in that: A semiconductor germanium single crystal rod and a crystal carrier bonding and fixing device is adopted. The semiconductor germanium single crystal rod and a crystal carrier bonding and fixing device includes: a bottom plate, a bracket and a pressing device; the bracket includes a cross beam, and two opposite support legs are provided at both ends of the bottom of the cross beam in the length direction; the bottom plate is located at the bottom between the two support legs; the pressing device includes a lead screw, a positioning pin, a bearing and a pressing block; a threaded hole is provided on the cross beam, the lead screw is threadedly connected to the threaded hole, the top of the lead screw passes through the top of the cross beam and the bottom passes through the bottom of the cross beam, the pressing block is connected to the bottom of the lead screw through a bearing, the pressing block is located above the bottom plate and below the cross beam; a V-shaped through groove with an opening downward is provided at the bottom of the pressing block; two vertical and opposite positioning pins are provided at the top of the pressing block, and the two positioning pins are respectively located on both sides of the lead screw; two guiding holes corresponding to the two positioning pins are provided on the cross beam, and the top parts of the two positioning pins respectively pass through the corresponding guiding holes on the cross beam; The apex angle of the V-shaped through groove is 85~95°; The positioning pin is threadedly connected to the pressing block; The materials of the bottom plate and the pressing block are both aluminum alloy; The method for bonding and fixing a semiconductor germanium single crystal rod and a crystal carrier includes the following steps: 1) Rotate the lead screw counterclockwise to raise the pressing block to a convenient operating height; 2) Place the crystal carrier on the bottom plate and directly below the V-shaped through groove. The axial direction of the V-shaped through groove is consistent with the length direction of the crystal carrier. Apply an adhesive to the bonding surface of the crystal rod to be bonded and place it on the crystal carrier. The length direction of the crystal rod is consistent with the length direction of the crystal carrier, and the crystal rod is directly below the V-shaped through groove; 3) Rotate the lead screw clockwise to drive the pressing block to descend and press the crystal rod. After fixing the position, clean the residual glue extruded by extrusion, and then remove the crystal rod after the glue cures.

2. The method for bonding and fixing a semiconductor germanium single crystal rod and a crystal carrier according to claim 1, characterized in that: A rotating handle is provided at the top of the lead screw.

3. The method for bonding and fixing a semiconductor germanium single crystal rod and a crystal carrier according to claim 1 or 2, characterized in that: The materials of the bracket, the lead screw and the positioning pin are all stainless steel.

4. The method for bonding and fixing a semiconductor germanium single crystal rod and a crystal carrier according to claim 1 or 2, characterized in that: Two sets of relatively arranged pressing devices are provided in the length direction of the bottom plate.

5. The method for bonding and fixing a semiconductor germanium single crystal rod and a crystal carrier according to claim 1 or 2, characterized in that: The threaded hole is provided at the central position in the length direction on the cross beam.

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