Headphone Connector and Its Manufacturing Method

Abstract

The present invention discloses a headphone connector and a manufacturing method thereof, wherein the headphone connector includes an insulating seat and a plurality of terminals. The insulating seat is provided with a socket for inserting a headphone plug along its front end and rearwardly, and the contact portions of the terminals are all exposed in the sockets. The insulating seat is integrally fixed to all terminals by injection molding, and the root peripheries of the contact portions of all terminals are integrally connected to the insulating seat, with no gap therebetween. The headphone connector of the present invention uses injection molding to form insulating seats on all terminals, and has a stable structure, simple assembly, and high work efficiency. The root peripheries of the contact portions of all terminals are integrally connected to the insulating seat, with no gap therebetween, that is, except for the socket, there are no holes communicating with the outside world, which can prevent foreign matter such as flux, water, and dust from entering the interior of the product, thereby ensuring the connection quality of the headphone connector. At the same time, the movable space required for the terminal to be inserted and removed due to the plug is eliminated, so that the headphone connector can be made smaller and more space-saving.

Description

Technical field:

[0001] The present invention relates to the field of connector product design, and in particular to an earphone connector and a manufacturing method thereof. Background technology:

[0002] Electrical connectors are the primary adapters used for signal transmission in various electronic products. Audio connectors, specifically designed for audio signal input / output, are widely used in various audio and video products. This is especially true in recent years, with the rapid development of various portable electronic products such as mobile phones, personal digital assistants (PDAs), MP3 players, voice recorders, notebook computers, and Apple iPods, which all utilize audio interfaces (headphone connectors) of various sizes.

[0003] At present, the headphone connectors available on the market all include a plastic base and a plurality of terminals installed in the plastic base. The plastic base is provided with a socket for inserting the headphone plug along its front end and rearward. The terminals and the plastic base are assembled in a plug-in manner, that is, a plurality of terminal holes for inserting the terminals are provided on the plastic base, and after the terminals are inserted into the terminal holes, the conductive arms of the terminals extend into the sockets. At this time, a gap is inevitably formed between the terminals and the plastic base, that is, there are gaps at multiple locations on the outer surface of the plastic base that pass through the sockets, making it easy for foreign matter such as flux / water / dust to enter the interior of the product, affecting product quality. Furthermore, considering that the conductive arms in the terminals need room to move when connecting with the headphone plug, the terminal holes need to be opened relatively deep, resulting in a larger overall size of the plastic base. In addition, in the prior art, each terminal of the headphone connector is independent, that is, the production of one terminal requires a set of hardware molds, which has high mold making costs, and the subsequent assembly is cumbersome and inefficient.

[0004] In view of this, the inventor proposes the following technical solution Summary of the invention:

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an earphone connector and a manufacturing method thereof.

[0006] In order to solve the above technical problems, the present invention adopts the following first technical solution: the headphone connector includes an insulating seat and a plurality of terminals, and the insulating seat is provided with a jack for inserting the headphone plug along its front end to the rear, and the contact parts of the terminals are all exposed in the jack. The insulating seat is fixed to all terminals as a whole by injection molding, and the root periphery of the contact parts of all terminals is integrally connected to the insulating seat with no gap therebetween.

[0007] Furthermore, in the above technical solution, the contact portion is in a convex shape, and the jack of the insulating seat is connected to the outside world only through its port.

[0008] Furthermore, in the above technical solution, the terminal includes a main body portion in the form of a plate, a contact portion stamped on the upper end surface of the main body portion and protruding upward, and a pin portion bent at the end of the main body portion, and a groove is formed on the lower end surface of the main body portion at a position corresponding to the contact portion, and the root of the contact portion is integrally connected to the upper end surface of the main body portion.

[0009] Furthermore, in the above technical solution, a clearance groove is formed at the lower end of the insulating seat, and the groove body of the lower end surface of the main body is exposed in the clearance groove.

[0010] Furthermore, in the above technical solution, the pin portion is perpendicular to the main body portion, and the pin portion extends out of the side surface of the insulating seat and extends vertically upward.

[0011] Furthermore, in the above technical solution, outwardly protruding bosses are formed on both sides of the insulating seat, the pin portion is fixed integrally with the boss, and the pin portion extends upwardly out of the boss along the upper end surface of the boss.

[0012] Furthermore, in the above technical solution, a step is formed on the rear end portion of the jack, and the contact portion of at least one terminal is exposed on the step of the terminal.

[0013] Furthermore, in the above technical solution, the main bodies of all the terminals are distributed on the same plane, and a plurality of through holes are provided on the main body, and the insulating seat fills and covers the through holes.

[0014] In order to solve the above technical problems, the present invention adopts the following second technical solution: the manufacturing method of the headphone connector includes the following steps: making terminals: first, selecting a metal plate, and punching out a plurality of through holes on the metal plate to form a material strip and a plurality of terminal models integrally connected to the material strip; then, a convex contact portion is stamped out on each terminal model, and a pin portion is bent to form, so that a plurality of terminals integrally connected to it are formed on the material strip; making an insulating seat: positioning the material strip in a plastic mold, and injection molding an insulating seat in the plastic mold, so that the insulating seat is integrally fixed to a plurality of terminals, wherein the root periphery of the contact portion of all terminals is integrally connected to the insulating seat, with no gap therebetween, and the pin portion extends out of the insulating seat, and the material strip is placed outside the insulating seat; finally, the material strip is cut to complete the manufacturing of the headphone connector.

[0015] Furthermore, in the above technical solution, a clearance groove is formed at the lower end of the insulating seat, and a groove body formed at the position corresponding to the contact part of the lower end surface of the terminal is exposed in the clearance groove; outwardly protruding bosses are formed on both sides of the insulating seat, the pin portion is fixed integrally with the boss, and the pin portion extends upward from the boss along the upper end surface of the boss.

[0016] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0017] 1. The headphone connector of the present invention uses injection molding to form insulating seats on all terminals. It has a stable structure, simple assembly and high work efficiency. The base periphery of the contact portion of all terminals is integrally connected to the insulating seat with no gap between them. That is, except for the jack, there is no hole communicating with the outside world. This can prevent foreign matter such as flux, water, and dust from entering the interior of the product, ensuring the connection quality of the headphone connector. At the same time, it eliminates the space required for the terminals to move when the plug is inserted and removed, making the headphone connector smaller and more space-saving.

[0018] 2. The manufacturing method of the headphone connector is to form all the terminals simultaneously on a piece of metal plate, that is, all the terminals can be produced using a set of hardware molds. The manufacturing process is simple, efficient, and low-cost. In addition, all the terminals share a single material strip, which makes it easier to position all the terminals at once, facilitating the subsequent injection molding of the insulating seat. The insulating seat is then molded on all the terminals by injection molding. The structure is stable, the assembly is simple, and the work efficiency is high. The root periphery of the contact part of all the terminals is integrally connected to the insulating seat, and there is no gap between them. In other words, except for the jack, there is no hole communicating with the outside world. This can prevent foreign matter such as flux, water, and dust from entering the interior of the product, ensuring the connection quality of the headphone connector. At the same time, the space required for the terminal to move when the plug is inserted and removed is eliminated, making the headphone connector smaller and more space-saving. Description of the drawings:

[0019] Figure 1 is a perspective view of the present invention;

[0020] Figure 2 It is a three-dimensional diagram from another perspective of the present invention;

[0021] Figure 3 It is an exploded perspective view of the present invention;

[0022] Figure 4 It is an assembly diagram of the terminal and the material strip in the present invention;

[0023] Figure 5 It is an assembly drawing of the present invention and the material belt. Specific implementation method:

[0024] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0025] See Figure 1-5The figure shows a headphone connector, which includes an insulating seat 1 and a plurality of terminals 2. The insulating seat 1 has a jack 11 for inserting a headphone plug along its front end. The contact portions 21 of the terminals 2 are all exposed in the jack 11. The insulating seat 1 is fixed to all the terminals 2 by injection molding, and the root periphery of the contact portions 21 of all the terminals 2 is integrally connected to the insulating seat 1, with no gap therebetween. The present invention uses injection molding to form the insulating seat 1 on all the terminals 2. It has a stable structure, simple assembly and high work efficiency. The root periphery of the contact portions 21 of all the terminals 2 is integrally connected to the insulating seat 1, with no gap therebetween. That is, except for the jack 11, there is no hole communicating with the outside world. This can prevent foreign matter such as flux, water, and dust from entering the interior of the product, ensuring the connection quality of the headphone connector. At the same time, it eliminates the space required for the terminals to move when the plug is inserted and removed, making the headphone connector smaller and more space-saving.

[0026] The contact portion 21 is convex, and the jack 11 of the insulating seat 1 is connected to the outside world only through its port, which can prevent foreign matter such as flux, water, and dust from entering the interior of the product, thereby ensuring the connection quality of the headphone connector.

[0027] The terminal 2 includes a main body 22 in the form of a plate, a contact portion 21 stamped and formed on the upper end surface of the main body 22 and protruding upward, and a pin portion 23 bent and formed at the end of the main body 22. A groove 24 is formed on the lower end surface of the main body 22 at a position corresponding to the contact portion 21, and the root of the contact portion 21 is integrally connected to the upper end surface of the main body 22.

[0028] A recess 12 is formed at the lower end of the insulating seat 1 , and the groove 24 at the lower end surface of the main body 22 is exposed in the recess 12 .

[0029] The pin portion 23 is perpendicular to the main body portion 22, and the pin portion 23 extends out of the side of the insulating seat 1 and extends vertically upward. The pin portion 23 is arranged outside the side of the insulating seat 1, so that the size of the entire terminal can be made smaller, which can save space and the material used in the insulating seat 1. Furthermore, the pin portions 23 of all terminals 2 are distributed on both sides of the insulating seat 1. After the pin portions 23 of the present invention are welded to the PCB board, the present invention can be stably installed on the PCB board, ensuring that the force of the present invention on the PCB board is balanced. During assembly, transportation, testing and other links, the head will not tilt upward or detach from the PCB board, which will not cause product defects and ensure product quality. There is no need to use additional mechanisms for positioning, making the structure of the present invention simpler. Both sides of the insulating seat 1 are formed with outwardly protruding bosses 13, and the pin portion 23 is fixed integrally with the boss 13, and the pin portion 23 extends upward from the boss 13 along the upper end surface of the boss 13.

[0030] A step 111 is formed on the rear end of the insertion hole 11 , and the contact portion 21 of at least one terminal 2 is exposed on the step 111 of the terminal 2 .

[0031] The main bodies 22 of all terminals 2 are distributed on the same plane, so that all terminals 2 can be conveniently formed on the same metal plate, and a plurality of through-holes 221 are provided on the main body 22, and the insulating seat 1 fills and covers the through-holes 221, thereby further ensuring the stability of the assembly of the main body 22 and the insulating seat 1.

[0032] The manufacturing method of the headphone connector includes the following steps:

[0033] Making terminals: First, a metal plate 3 is selected and several through holes 31 are punched out on the metal plate 3 to form a material strip 32 and several terminal models integrally connected to the material strip 32; then, a convex contact portion 21 is stamped out on each terminal model, and a pin portion 23 is bent to form a plurality of terminals 2 integrally connected to the material strip 32, as shown in FIG. Figure 4 As shown;

[0034] Making an insulating seat: Position the strip 32 in a plastic mold and injection mold the insulating seat in the plastic mold so that the insulating seat is fixed integrally on a number of terminals 2. The outer periphery of the root of the contact portion 21 of all terminals 2 is integrally connected to the insulating seat 1 without a gap, and the pin portion 23 extends out of the insulating seat. The strip 32 is placed outside the insulating seat 1, as shown in FIG. Figure 5 As shown;

[0035] Finally, the material strip 32 is cut to complete the production of the headphone connector.

[0036] The above-mentioned method for manufacturing the headphone connector simultaneously molds all the terminals on a single metal plate 3, that is, all the terminals can be manufactured using a single set of hardware molds. This method is simple to manufacture, highly efficient, and extremely low in cost. In addition, all the terminals share a single material strip, which makes it easier to position all the terminals at once, facilitating the subsequent injection molding of the insulating seat 1. The insulating seat 1 is then molded onto all the terminals 2 using injection molding. This method provides a stable structure, easy assembly, and high efficiency. The base periphery of the contact portions 21 of all the terminals 2 is integrally connected to the insulating seat 1, with no gaps therebetween. That is, except for the jack 11, there are no holes communicating with the outside world. This prevents foreign matter such as flux, water, and dust from entering the interior of the product, ensuring the quality of the headphone connector connection. Furthermore, the space required for the terminals to move during insertion and removal is eliminated, allowing the headphone connector to be made smaller and more space-efficient.

[0037] A clearance groove 12 is formed at the lower end of the insulating seat 1, and a groove body 24 formed at the position corresponding to the contact part 21 of the lower end surface of the terminal 2 is exposed in the clearance groove 12; both sides of the insulating seat 1 are formed with outwardly protruding bosses 13, and the pin part 23 is fixed integrally with the boss 13, and the pin part 23 extends upward from the boss 13 along the upper end surface of the boss 13.

[0038] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made based on the structure, features and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. An earphone connector, comprising an insulating seat (1) and a plurality of terminals (2), wherein the insulating seat (1) is provided with a jack (11) for inserting an earphone plug along its front end and extending backward, and the contact portions (21) of the terminals (2) are all exposed in the jack (11), characterized in that: The insulating seat (1) is integrally fixed to all the terminals (2) by injection molding, and the periphery of the root of the contact portion (21) of all the terminals (2) is integrally connected to the insulating seat (1) with no gap therebetween; The terminal (2) comprises a main body (22) in the form of a plate, a contact portion (21) stamped and formed on the upper end surface of the main body (22) and protruding upward, and a pin portion (23) bent and formed at the end of the main body (22); A clearance groove (12) is formed at the lower end of the insulating seat (1), and a groove body (24) on the lower end surface of the main body (22) is exposed in the clearance groove (12); The pin portion (23) is perpendicular to the main body portion (22), and the pin portion (23) extends out of the side surface of the insulating seat (1) and extends vertically upward; Both sides of the insulating seat (1) are formed with outwardly protruding bosses (13), the pin portion (23) is fixed integrally with the boss (13), and the pin portion (23) extends upwardly from the boss (13) along the upper end surface of the boss (13).

2. The headphone connector according to claim 1, wherein: The contact portion (21) is in a convex shape, and the socket (11) of the insulating seat (1) is connected to the outside world only through its port.

3. The headphone connector according to claim 1, wherein: A groove (24) is formed on the lower end surface of the main body (22) at a position corresponding to the contact portion (21), and the root of the contact portion (21) is integrally connected to the upper end surface of the main body (22).

4. The headphone connector according to any one of claims 1 to 3, wherein: A step (111) is formed on the rear end portion of the jack (11), and a contact portion (21) of at least one terminal (2) is exposed on the step (111) of the terminal (2).

5. The headphone connector according to claim 1, wherein: The main bodies (22) of all the terminals (2) are distributed on the same plane, and a plurality of through holes (221) are provided on the main body (22), and the insulating seat (1) fills and covers the through holes (221).

6. The method for manufacturing an earphone connector according to claim 1, wherein: The following steps are included: Making terminals: First, a metal plate (3) is selected, and a plurality of through holes (31) are punched out on the metal plate (3) to form a material strip (32) and a plurality of terminal models integrally connected to the material strip (32); then, a convex contact portion (21) is punched out on each terminal model, and a pin portion (23) is bent to form the contact portion, so that a plurality of terminals (2) integrally connected to the material strip (32) are formed on the material strip (32); Making an insulating seat: positioning a material strip (32) in a plastic mold, and injection molding an insulating seat in the plastic mold, so that the insulating seat is fixed integrally on a plurality of terminals (2), wherein the root periphery of the contact portion (21) of all terminals (2) is integrally connected to the insulating seat (1) without a gap therebetween, and the pin portion (23) extends outside the insulating seat, and the material strip (32) is placed outside the insulating seat (1); Finally, the material strip (32) is cut to complete the production of the headphone connector.

7. The method for manufacturing an earphone connector according to claim 6, wherein: The insulating seat (1) is formed with a clearance groove (12) at the lower end thereof, and a groove body (24) formed at a position corresponding to the contact portion (21) on the lower end surface of the terminal (2) is exposed in the clearance groove (12); both sides of the insulating seat (1) are formed with outwardly protruding bosses (13), the pin portion (23) is fixed integrally with the boss (13), and the pin portion (23) extends upwardly from the boss (13) along the upper end surface of the boss (13).

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