Power connector and processing method thereof

Abstract

This application provides a power connector and its processing method. The processing method of the power connector includes the following steps: obtaining a connector assembly; performing protective treatment on the socket and the power cord respectively; performing a first injection molding operation on the protected connector assembly, so that a first cover body is molded around the socket and the LED circuit board, and the first cover body also molds a portion of the power cord, with a portion of the socket protruding from the first cover body; performing a second injection molding operation on the first cover body, so that a second cover body is molded around the first cover body and the power cord protruding from the first cover body, the second cover body also molded around the socket protruding from the first cover body, and the socket's insertion hole is exposed outside the second cover body. The above-mentioned power connector processing method reduces the molding difficulty of the power connector and produces a compact power connector.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and in particular to a power connector and a processing method thereof. Background Art

[0002] The structure used to connect an electronic device to a power source is called a power connector. After the power connector is connected to the electronic device, the electronic device may not be powered on. At this time, if a suitable test device cannot be obtained, it is difficult to determine whether the problem lies with the power source or the electronic device. Therefore, indicator lights are often set on the electronic device, power connector or power source to simply and quickly determine the problem based on the display status of the indicator light.

[0003] A traditional power connector has a circuit board, an indicator light and a lampshade added to the shell. The shell and the lampshade are connected by snaps. The peripheral diameter of the lampshade connected to the shell is larger than the peripheral diameter of the shell, so that the lampshade and the shell have better sealing after being assembled and connected. However, the volume of the power connector is increased, which makes the structural accuracy requirements of the power connector higher, thereby increasing the difficulty of molding the power connector. Summary of the invention

[0004] The object of the present invention is to overcome the deficiencies in the prior art and to provide a power connector with an indicator light structure and a processing method thereof which is less difficult to process.

[0005] The objective of the present invention is achieved through the following technical solutions:

[0006] A power connector, comprising:

[0007] A connector assembly, the connector assembly comprising a socket, an LED lamp circuit board and a power cord, the socket and the power cord are both electrically connected to the LED lamp circuit board;

[0008] A first covering body, wherein the first covering body is covered with plastic on the periphery of the socket and the LED lamp circuit board, and the first covering body also covers a part of the power cord, and a part of the socket protrudes from the first covering body;

[0009] The second covering body is covered by the first covering body and the power cord protruding from the first covering body, and the second covering body is also covered by the socket protruding from the first covering body, and the socket hole is exposed outside the second covering body.

[0010] In one embodiment, the second covering body is connected to the end of the first covering body away from the socket to form a packaging fixing groove;

[0011] The power connector further includes a packaging body, which is formed in the packaging fixing groove and is connected to the first covering body and the second covering body respectively.

[0012] In one of the embodiments, a bump is disposed on the first encapsulating body, the bump is disposed on a side wall of the first encapsulating body close to the packaging body, and the bump is connected to the packaging body.

[0013] In one embodiment, the second encapsulating body is formed with a first positioning groove communicating with the packaging fixing groove, and the packaging body is also formed in the first positioning groove.

[0014] In one embodiment, the first encapsulating body is formed with a second positioning groove, and the second encapsulating body is partially formed in the second positioning groove.

[0015] In one of the embodiments, at least two plug-in slots are formed at the end of the second covering body away from the insertion hole, and the at least two plug-in slots are evenly distributed on the second covering body.

[0016] A method for processing a power connector, used for processing the power connector described in any one of the above embodiments, the method for processing the power connector comprising the following steps:

[0017] Obtaining the connector component;

[0018] Performing protection treatment on the socket and the power cord respectively;

[0019] Performing a first injection molding operation on the connector assembly after the protection treatment, so that the first covering body is covered around the socket and the LED lamp circuit board, and the first covering body also covers a part of the power line, and a part of the socket protrudes from the first covering body;

[0020] The first covering body is subjected to a second injection molding operation so that the second covering body is covered on the first covering body and the power cord protruding from the first covering body, and the second covering body is also covered on the socket protruding from the first covering body, and the socket hole is exposed outside the second covering body.

[0021] In one embodiment, the second covering body is connected to the end of the first covering body away from the socket to form a packaging fixing groove; after the step of performing the second injection molding operation on the first covering body, the processing method of the power connector further includes the following steps:

[0022] A third injection molding operation is performed in the package fixing groove, so that the package body is formed in the package fixing groove, and the package body is connected to the first encapsulating body and the second encapsulating body respectively.

[0023] In one embodiment, before the step of performing protection treatment on the socket and the power cord respectively and after the step of obtaining a connector assembly of the power connector, the processing method of the power connector further includes the following steps:

[0024] The LED lamp circuit board is subjected to a temperature resistance treatment.

[0025] In one embodiment, before the step of performing the first injection molding operation on the connector assembly after the protection treatment and after the step of performing the protection treatment on the socket and the power cord respectively, the processing method of the power connector further includes the following steps:

[0026] The connector assembly is subjected to a preheating treatment.

[0027] Compared with the prior art, the present invention has at least the following advantages:

[0028] 1. In the power connector of the present invention, an LED lamp circuit board and a first covering body are used to replace the indicator light, the lampshade and the circuit board, thereby reducing the complexity of the shell of the power connector, thereby reducing the difficulty of molding the shell of the power connector, and making the first and second covering bodies covered with plastic on the periphery of the socket and the LED lamp circuit board, that is, the first covering body and the connector assembly form an integrally molded structure, and directly by integrally molding the socket, the LED lamp circuit board and the power cord on the first covering body, it is avoided that the structure of the power connector for installing and fixing the socket, the LED lamp circuit board and the power cord is difficult to design and is easy to shrink and deform during the molding process, which increases the difficulty of processing and molding the shell of the power connector, thereby making it difficult to achieve the accuracy of the corresponding position and structural relationship of the protrusion, and improves the installation and fixing reliability of the socket, the LED lamp circuit board and the power cord, avoids the problem that the circuit board for the indicator light collides with other structures in the power connector and damages the circuit board for the indicator light, and also avoids the problem that the lampshade and the power connector shell need to be separately processed and assembled, thereby reducing the processing procedures of the power connector and improving the compactness of the structure of the power connector;

[0029] 2. In the processing method of the power connector of the present invention, after the connection end of the socket and the lead-out end of the power cord in the connector assembly are protected, the first light-transmitting material is used to perform a first injection molding operation on the connector assembly after the protection treatment, so that the connector assembly after the protection treatment is directly fixed by injection molding to form an integrated molding structure, and the connection end of the socket and the lead-out end of the power cord after the protection treatment are exposed, ensuring the function of the power connector for connecting the electronic device to the power supply, and then the second injection molding operation is performed on the first covering body, thereby avoiding the problem that the structure of the power connector used to install and fix the socket, the LED lamp circuit board and the power cord is difficult to design and is easy to shrink and deform during the molding process, which increases the difficulty of processing and molding the power connector shell, and further makes it difficult to achieve the problem of the corresponding position and structural relationship accuracy of the protrusion, reduces the difficulty of processing and molding the power connection, improves the structural stability of the power connector, and further avoids the problem of the LED lamp circuit board colliding with other structures in the power connector and being damaged, and also avoids the problem that the lampshade and the power connector shell need to be separately processed and assembled, reduces the processing steps of the power connector, and improves the compactness of the structure of the power connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 This is a schematic structural diagram of a power connector according to an embodiment of the present invention;

[0032] Figure 2 for Figure 1 Another structural schematic diagram of the power connector shown;

[0033] Figure 3 for Figure 1 A schematic structural diagram of a connector assembly of the power connector shown;

[0034] Figure 4 for Figure 1 a cross-sectional view of the power connector shown;

[0035] Figure 5 The figure is a flow chart of a method for processing a power connector according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0039] The present application provides a power connector. The power connector includes a connector assembly, a first covering body and a second covering body. The connector assembly includes a socket, an LED lamp circuit board and a power cord, and the socket and the power cord are electrically connected to the LED lamp circuit board. The first covering body is plastic-coated around the socket and the LED lamp circuit board, and the first covering body also plastic-coats a portion of the power cord, and the portion of the socket protrudes from the first covering body. The second covering body, the second covering body is plastic-coated on the first covering body and the power cord protruding from the first covering body, and the second covering body is also plastic-coated on the socket protruding from the first covering body, and the socket of the socket is exposed outside the second covering body.

[0040] In the above-mentioned power connector, the LED lamp circuit board and the first covering body are used to replace the indicator light, the lampshade and the circuit board, which reduces the complexity of the shell of the power connector, thereby reducing the difficulty of molding the shell of the power connector, and the first and second covering bodies are molded around the socket and the LED lamp circuit board, so that the first covering body and the connector component form an integrally molded structure. By directly molding the socket, the LED lamp circuit board and the power cord integrally on the first covering body, it is avoided that the structure of the power connector used to install and fix the socket, the LED lamp circuit board and the power cord is difficult to design and is prone to shrinkage and deformation during the molding process, which increases the difficulty of processing and molding the shell of the power connector, and thereby it is difficult to achieve the accuracy of the corresponding position and structural relationship of the protrusion, and improves the installation and fixing reliability of the socket, the LED lamp circuit board and the power cord, avoids the problem of the indicator lamp circuit board colliding with other structures in the power connector and damaging the indicator lamp circuit board, and also avoids the problem that the lampshade and the power connector shell need to be separately processed and assembled, reduces the processing procedures of the power connector, and improves the compactness of the structure of the power connector.

[0041] Please also read Figure 1 , Figure 2 and Figure 3 In order to better understand the power connector 10 of the present application, the power connector 10 of the present application is further explained below. The power connector 10 of one embodiment includes a connector assembly 100, a first enclosure 200 and a second enclosure 300. The connector assembly 100 includes a socket 110, an LED lamp circuit board 120 and a power line 130, and the socket 110 and the power line 130 are both electrically connected to the LED lamp circuit board 120. The first enclosure 200 is plastic-coated around the socket 110 and the LED lamp circuit board 120, and the first enclosure 200 also plastic-coats a portion of the power line 130, and a portion of the socket 110 protrudes from the first enclosure 200. The second enclosure 300 is molded on the first enclosure 200 and the power line 130 protruding from the first enclosure 200 . The second enclosure 300 is also molded on the socket 110 protruding from the first enclosure, and the socket 110 is exposed outside the second enclosure 300 .

[0042] In the above-mentioned power connector 10, the LED lamp circuit board 120 and the first covering body are used to replace the indicator light, the lampshade and the circuit board, which reduces the complexity of the shell of the power connector 10, thereby reducing the difficulty of molding the shell of the power connector 10, and makes the first and second covering bodies 300 covered with the outer periphery of the socket 110 and the LED lamp circuit board 120, that is, the first covering body 200 and the connector assembly 100 form an integrally molded structure, directly by integrally molding the socket 110, the LED lamp circuit board 120 and the power cord 130 on the first covering body, avoiding the power connector 10 being used to install and fix the socket 110, the LED lamp circuit board 120, and the power cord 130. The structures of the lamp circuit board 120 and the power cord 130 are difficult to design and are prone to shrinkage and deformation during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and thus it is difficult to achieve the accuracy of the corresponding position and structural relationship of the protrusions. It also improves the installation and fixation reliability of the socket 110, the LED lamp circuit board 120 and the power cord 130, avoids the problem of the indicator light circuit board colliding with other structures in the power connector 10 and damaging the indicator light circuit board, and avoids the problem that the lampshade and the power connector 10 shell need to be assembled after separate processing, reduces the processing steps of the power connector 10, and improves the structural compactness of the power connector 10.

[0043] It is understandable that if it is necessary to add an indicator light function to the power connector 10, it is necessary to add a corresponding fixing structure inside the power connector 10 to install and fix the indicator light, lampshade and circuit board. A common fixing structure is a plurality of protrusions added to the inner wall of the shell of the power connector 10, and the indicator light, lampshade and circuit board are fixed by the plurality of protrusions. However, the plurality of protrusions provided on the power connector 10 leads to a complicated structure of the power connector 10. It is also understandable that in order to install and fix the indicator light, lampshade and circuit board by the plurality of protrusions provided on the shell of the power connector 10, it is required that the shell of the power connector 10 has a plurality of protrusions provided on the inner wall of the shell of the power connector 10. The positions and structural relationships of the several protrusions are relatively accurate. If the corresponding positions and structural relationships of the protrusions are less accurate, the indicator light, lampshade and circuit board cannot be stably and firmly installed and fixed, which reduces the installation stability of the indicator light, lampshade and circuit board, and easily causes the circuit board to collide with other structures in the power connector 10 and damage the circuit board; and the molding mold of the protrusions on the shell of the power connector 10 is difficult to design, and the protrusions on the shell of the power connector 10 are easily deformed during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and it is more difficult to achieve the accuracy of the corresponding positions and structural relationships of the protrusions. Therefore, in the power connector 10 of the present application, the LED light circuit board 120 and the first covering body are used to replace the indicator light, the lampshade, the circuit board and the protrusions on the shell, thereby reducing the complexity of the shell of the power connector 10, thereby reducing the difficulty of molding the shell of the power connector 10, and making the first and second covering bodies 300 covered with plastic on the periphery of the socket 110 and the LED light circuit board 120, so that the first covering body 200 and the connector assembly 100 form an integral molding structure, avoiding the difficulty in designing the molding mold for the protrusions on the shell of the power connector 10, and the protrusions on the shell of the power connector 10 are easily deformed during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and thus it is difficult to achieve the problem of the corresponding position and structural relationship accuracy of the protrusions, so that the socket 110, the LED light circuit board 120 and the power cord 130 are stably and securely fixed on the first covering body 200, thereby improving the structural stability of the power connector 10, thereby avoiding the problem of the circuit board for the indicator light colliding with other structures in the power connector 10 and damaging the circuit board for the indicator light.

[0044] It can also be understood that the connector assembly 100 can be directly fixed and installed through the first covering body 200, and the structure of the second covering body 300 can be omitted. However, if the first covering body 200 is used alone to fix the connector assembly 100 so that the power connector 10 has the function of an indicator light, it is necessary to make the material of the first covering body 200 transparent and have a certain structural strength. In the process of the first covering body 200 with a certain structural strength material forming an integral structure with the connector assembly 100, the residual stress of the contact part of the first covering body 200 and the connector assembly 100 is relatively large, which makes the first covering body 200 prone to shrinkage and cracking, making the connector assembly 100 easily peeled off from the first covering body 200, resulting in the LDE lamp circuit board being not firmly fixed, and the first covering body 200 has a high structural strength, which is easy to damage the LDE circuit board. Therefore, in the power connector 10 of the present application, the first covering body 200 is provided to achieve the connection stability of the connector assembly 100, and the structural strength of the power connector 10 is achieved by the second covering body 300.

[0045] Please also read Figure 4 In one embodiment, the second encapsulation body 300 is connected to the end of the first encapsulation body 200 away from the socket 110 to form a package fixing groove 400. The power connector 10 also includes a package body 500, which is formed in the package fixing groove 400, and the package body 500 is respectively connected to the first encapsulation body 200 and the second encapsulation body 300. It can be understood that in order to make the power connector 10 have better structural strength and reduce the damage of the first encapsulation body 200 to the circuit board, it is necessary to make the second encapsulation body 300 have a stronger hardness, and it is necessary to make the first encapsulation body 200 have better flexibility. In the case where the material properties of the second encapsulation body 300 and the first encapsulation body 200 are greatly different, when the second encapsulation body 300 is coated on the first encapsulation body 200, that is, when the second encapsulation body 300 and the first encapsulation body 200 form an integrally formed structure, The second covering body 300 has a poor covering effect on the first covering body 200, which makes the second covering body 300 easy to peel off from the first covering body 200, reducing the structural stability of the power connector 10. Therefore, the encapsulation body 500 is formed in the encapsulation fixing groove 400, that is, the encapsulation body 500, the first covering body 200 and the second covering body 300 form an integrated structure, which increases the connection stability of the second covering body 300 and the first covering body 200, thereby improving the structural stability of the power connector 10. It can also be understood that the encapsulation body 500 also serves as a sealing structure for the second covering body 300, thereby reducing the contact between the external environment and the connector assembly 100, especially the LED lamp circuit board 120, reducing the impact of the external environment on the connector assembly 100, ensuring the performance of the power connector 10 and improving the service life of the power connector 10.

[0046] It should be noted that the conventional power connector 10 has a conductive structure. If an indicator light is set in the power connector 10, a circuit board structure needs to be added. Therefore, the internal structure of the power connector 10 is greatly affected by water and dust in the external environment. In order to reduce the impact of the external environment on the power connector 10, the power connector 10 is generally sealed. However, the sealing ring is prone to aging, and the setting of the sealing ring correspondingly increases the structural complexity of the shell of the power connector 10, thereby increasing the difficulty of molding the power connector 10. Therefore, in the power connector 10 of the present application, a packaging body 500 is set in the power connector 10, and the packaging body 500 is molded in the packaging fixing groove 400, which ensures the transmission of the light source generated by the illuminated circuit board, improves the sealing effect of the internal structure of the power connector 10, and effectively reduces the degree of influence of the external environment on the power connector 10.

[0047] Please also read Figure 1 and Figure 4 In one embodiment, a bump 230 is formed on the first encapsulation body 200. The bump 230 is disposed on a side wall of the first encapsulation body 200 close to the package body 500, and the bump 230 is connected to the package body 500. It can be understood that in order to increase the connection stability between the package body 500 and the first encapsulation body 200, the bump 230 is disposed on the first encapsulation body 200. The bump 230 increases the contact area between the first encapsulation body 200 and the package body 500. When the package body 500 is formed in the second encapsulation body 300, that is, the package body 500 and the first encapsulation body 200 form an integrally formed structure, the contact area between the first encapsulation body 200 and the package body 500 is increased, thereby improving the connection stability between the package body 500 and the first encapsulation body 200.

[0048] Please also read Figure 4 In one embodiment, the first enclosure 200 includes a first mounting portion 210 and a second mounting portion 220, the first mounting portion 210 is connected to the second mounting portion 220, the socket 110 is inserted into the second mounting portion 220, and one end of the socket 110 is arranged in the first mounting portion 210, and the other end of the socket 110 is arranged in the second enclosure 300, the LED lamp circuit board 120 is arranged in the first mounting portion 210, the package body 500 is connected to a side wall of the first mounting portion 210 away from the second mounting portion 220, the power cord 130 is arranged in the first mounting portion 210, and the power cord 130 partially protrudes from the first mounting portion 210, thereby realizing the fixation of the socket 110, the LED lamp circuit board 120 and the power cord 130, and ensuring the electrical connection stability of the socket 110, the LED lamp circuit board 120 and the power cord 130 in the first enclosure 200, thereby improving the functional stability of the connector assembly 100.

[0049] Please also read Figure 1 and Figure 4 In one embodiment, the second encapsulation body 300 is formed with a first positioning groove connected to the package fixing groove 400, and the package body 500 is also formed in the first positioning groove 310, thereby improving the connection stability between the second encapsulation body 300 and the package body 500. To take a step back, in order to make the power connector 10 have better structural strength and the package body 500 and the first enclosure 200 have better connection stability, it is necessary to make the second enclosure 300 have stronger hardness and the package body 500 have better flexibility. In the case where the material properties of the second enclosure 300 and the package body 500 are greatly different, when the second enclosure 300 and the first enclosure 200 are formed as an integrally molded structure, even when the second enclosure 300 and the package body 500 form an integrally molded structure, there is a problem that the second enclosure 300 has a poor encapsulation effect on the package body 500, and the connection between the second enclosure 300 and the package body 500 is poor, resulting in the problem that the second enclosure 300 is easily peeled off from the package body 500. Therefore, the package body 500 is also molded in the first positioning groove 310, which improves the connection stability between the second enclosure 300 and the package body 500 and reduces the influence of the connector assembly 100 on the external environment.

[0050] Please also read Figure 1 and Figure 4 In one embodiment, the first encapsulating body 200 is formed with a second positioning groove 320, and the second encapsulating body 300 is partially formed in the second positioning groove 320. It can be understood that the second encapsulating body 300300 is encapsulated on the first encapsulating body 200, which plays a protective role on the first encapsulating body 200, so that the second encapsulating body 300 is partially formed in the second positioning groove 320, thereby improving the connection stability between the second encapsulating body 300 and the first encapsulating body 200. To take a step back, in order to make the power connector 10 have better structural strength and reduce the damage of the first covering body 200 to the circuit board, the second covering body 300 needs to have a stronger hardness, and the first covering body 200 needs to have better flexibility. In the case where the material properties of the second covering body 300 and the first covering body 200 are greatly different, when the second covering body 300 is covered on the first covering body 200, even if the second covering body 300 and the first covering body 200 are an integrally formed structure, the second covering body 300 has a poor encapsulation effect on the first covering body 200, resulting in a poor connection between the first covering body 200 and the second covering body 300, and the first covering body 200 is easily peeled off from the second covering body 300. Therefore, the second covering body 300 is partially formed in the second positioning groove 320, which improves the connection stability between the second covering body 300 and the first covering body 200 and reduces the influence of the external environment on the first covering body 200.

[0051] Please also read Figure 1 and Figure 4 In one embodiment, the first encapsulating body 200 is formed with a third positioning groove 330, and the second encapsulating body 300 is partially formed in the third positioning groove 330, thereby improving the connection stability between the second encapsulating body 300 and the first encapsulating body 200. To take a step back, in order to make the power connector 10 have better structural strength and reduce the damage of the first covering body 200 to the circuit board, the second covering body 300 needs to have a stronger hardness, and the first covering body 200 needs to have better flexibility. In the case where the material properties of the second covering body 300 and the first covering body 200 are greatly different, when the second covering body 300 is covered on the first covering body 200, even if the second covering body 300 and the first covering body 200 are an integrally formed structure, the second covering body 300 has a poor encapsulation effect on the first covering body 200, resulting in a poor connection between the first covering body 200 and the second covering body 300, making the first covering body 200 easy to peel off from the second covering body 300. Therefore, the second covering body 300 is partially formed in the third positioning groove 330, which improves the connection stability between the second covering body 300 and the first covering body 200 and reduces the influence of the external environment on the first covering body 200.

[0052] Please also read Figure 2 and Figure 4 In one embodiment, the second enclosure 300 includes a socket enclosure 340 and a power cord enclosure 350, the socket enclosure 340 is connected to the power cord enclosure 350, the socket enclosure 340 is enclosed on the packaging body 500 and the first enclosure 200, the socket 110 protruding from the first enclosure 200 is enclosed in the socket enclosure 340, and the power cord 130 protruding from the first enclosure 200 is enclosed in the power cord enclosure 350, thereby improving the connection stability of the connector assembly 100.

[0053] In one embodiment, the second covering body 300 is a polyvinyl chloride covering body. It can be understood that the polyvinyl chloride covering body has good structural strength, which ensures the structural strength of the power connector 10.

[0054] In one embodiment, the encapsulation body 500 is a silicone encapsulation body or a rubber encapsulation body. It is understandable that the first encapsulation body 200 is a structure for fixing the connector assembly 100. The material of the first encapsulation body 200 is a light-transmitting and relatively soft material, while the material of the second encapsulation body 300 is a material with a certain structural strength. There is a large difference in the performance of the first encapsulation body 200 and the second encapsulation body 300, resulting in that when the first encapsulation body 200 and the second encapsulation body 300 form an integrated structure, the second encapsulation body 300 has a poor plastic encapsulation effect on the encapsulation body 500, which in turn results in a poor connection between the second encapsulation body 300 and the encapsulation body 500, making the sealing of the first encapsulation body 200 poor. The effect is poor, which makes the connector assembly 100 easily affected by the external environment. Therefore, in the power connector 10 of the present application, the connector assembly 100 is sealed using a packaging body 500, and the packaging body 500 is a silicone packaging body or a rubber packaging body. In the process of using the silicone packaging body or the rubber packaging body to form an integrated structure with the second encapsulation body 300, the second encapsulation body 300 has a better coating effect on the silicone packaging body or the rubber packaging body, so that the combination stability of the packaging body 500 and the second encapsulation body 300 is higher, thereby improving the sealing effect of the connector assembly 100.

[0055] In one embodiment, the first covering body 200 is a silicone covering body or a rubber covering body. It is understandable that the first covering body 200 is a structure for fixing the connector assembly 100, so that the first covering body 200 is a silicone covering body or a rubber covering body, which ensures the light transmittance of the first covering body 200 and makes the first covering body 200 have good softness, reduces the damage of the first covering body 200 to the LED lamp circuit board 120, ensures the performance of the power connector 10 and improves the service life of the power connector 10.

[0056] Please also read Figure 1 and Figure 2 In one embodiment, at least two unplugging notches 360 are formed at the end of the second covering body 300 away from the socket, and the at least two unplugging notches 360 are evenly distributed on the second covering body 300, thereby increasing the friction between the user's hand and the surface of the power connector 10, making it easier to unplug and plug the power connector 10, thereby improving the ease of use of the power connector 10.

[0057] The present application also provides a method for processing a power connector, which is used to process and obtain a power connector of any of the above embodiments. The method for processing a power connector includes the following steps: obtaining a connector assembly; performing protective treatment on the socket and the power cord respectively; performing a first injection molding operation on the connector assembly after the protective treatment, so that the first covering body is covered with the outer periphery of the socket and the LED lamp circuit board, and the first covering body also covers part of the power cord, and part of the socket protrudes from the first covering body; performing a second injection molding operation on the first covering body, so that the second covering body is covered with the first covering body and the power cord protruding from the first covering body, and the second covering body is also covered with the socket protruding from the first covering body, and the socket hole is exposed outside the second covering body.

[0058] In the above-mentioned processing method of the power connector, after the connection end of the socket and the lead-out end of the power cord in the connector assembly are protected, the first light-transmitting material is used to perform a first injection molding operation on the connector assembly after the protection treatment, so that the connector assembly after the protection treatment is directly fixed by injection molding to form an integrated molding structure, and the connection end of the socket and the lead-out end of the power cord after the protection treatment are exposed, ensuring the function of the power connector for connecting the electronic device to the power supply, and then the second injection molding operation is performed on the first covering body, thereby avoiding the problem that the structure of the power connector used to install and fix the socket, the LED lamp circuit board and the power cord is difficult to design and is easy to shrink and deform during the molding process, increasing the difficulty of processing and molding of the power connector shell, and thus it is difficult to achieve the problem of the corresponding position and structural relationship accuracy of the protrusion, reducing the difficulty of processing and molding of the power connection, and improving the structural stability of the power connector, thereby avoiding the problem of the LED lamp circuit board colliding with other structures in the power connector and being damaged, and also avoiding the problem that the lampshade and the power connector shell need to be separately processed and assembled, reducing the processing steps of the power connector, and improving the structural compactness of the power connector.

[0059] Please also read Figure 1 , Figure 4 and Figure 5 In order to better understand the processing method of the power connector of the present application, the processing method of the power connector of the present application is further explained below. The processing method of the power connector of one embodiment includes the following steps:

[0060] S100, obtaining a connector assembly 100. The connector assembly 100 includes a socket 110, an LED lamp circuit board 120, and a power cord 130. The socket 110 is electrically connected to the LED lamp circuit board 120, and the LED lamp circuit board 120 is electrically connected to the power cord 130. It can be understood that the use of the LED lamp circuit board 120 instead of the indicator light, the lampshade, and the circuit board reduces the complexity of the housing of the power connector 10, thereby reducing the difficulty of molding the housing of the power connector 10.

[0061] S200, performing protection processing on the socket 110 and the power cord 130 respectively, that is, performing protection processing on the connection end of the socket 110 and the lead-out end of the power cord 130, thereby ensuring the electrical connection function of the power connector 10 for connecting the power supply and the electronic device.

[0062] S300, perform a first injection molding operation on the connector assembly 100 after the protection treatment, so that the first covering body 200 covers the periphery of the socket 110 and the LED lamp circuit board 120, and the first covering body 200 also covers part of the power line 130, and part of the socket 110 protrudes from the first covering body 200. In this embodiment, the first covering body 200 formed is a light-transmitting first covering body, that is, the first light-transmitting material is used to perform a first injection molding operation on the connector assembly 100 after the protection treatment, ensuring that the light emitted by the LED lamp circuit board 120 of the power connector 10 can be transmitted. . It can be understood that by performing the first injection molding operation on the connector assembly 100 after the protection treatment, the first enclosure 200 and the connector assembly 100 form an integrally molded structure, and by directly integrally molding the socket 110, the LED lamp circuit board 120 and the power cord 130 on the first enclosure 200, it is avoided that the structure of the power connector 10 used to install and fix the socket 110, the LED lamp circuit board 120 and the power cord 130 is difficult to design and easy to deform during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and thus it is difficult to achieve the corresponding position of the protrusion and the accuracy of the structural relationship, thereby reducing the difficulty of processing and molding the shell of the power connector 10, and improving the installation and fixing reliability of the socket 110, the LED lamp circuit board 120 and the power cord 130, avoiding the problem of the circuit board for the indicator light colliding with other structures in the power connector 10 and damaging the circuit board for the indicator light, reducing the processing steps of the power connector 10, and improving the compactness of the structure of the power connector 10.

[0063] S400, performing a second injection molding operation on the first covering body 200, so that the second covering body 300 is covered on the first covering body 200 and the power cord 130 protruding from the first covering body 200, and the second covering body 300 is also covered on the socket 110 protruding from the first covering body, and the jack of the socket 110 is exposed outside the second covering body 300. It can be understood that adding the first light-transmitting material to perform the first injection molding operation on the connector assembly 100, and then performing the second injection molding operation on the first covering body 200 after integral molding, avoids the problem that the material that can be used for injection molding has a high hardness requirement in order to ensure the structural strength and service life of the power connector 10, resulting in poor covering effect of the first covering body 200 on the connector assembly 100, causing the LED lamp circuit board 120 to be easily peeled off from the first covering body 200, making the connection stability between the LED lamp circuit board 120 and the first covering body 200 poor, and further causing the problem of serious damage to the circuit board, thereby improving the feasibility of integral molding of the power connector 10.

[0064] In the above-mentioned processing method of the power connector, after the connection end of the socket 110 and the lead-out end of the power line 130 in the connector assembly 100 are protected, the first light-transmitting material is used to perform a first injection molding operation on the connector assembly 100 after the protection treatment, so that the connector assembly 100 after the protection treatment is directly fixed by forming an integral molding structure through injection molding, and the connection end of the socket 110 and the lead-out end of the power line 130 after the protection treatment are exposed, thereby ensuring the function of the power connector 10 for connecting the electronic device to the power supply, and then performing a second injection molding operation on the first covering body 200, thereby avoiding the power connector 10 being used to install and fix the socket 110, The structures of the LED lamp circuit board 120 and the power cord 130 are difficult to design and are prone to shrinkage and deformation during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and thus it is difficult to achieve the accuracy of the corresponding position and structural relationship of the protrusions. The difficulty of processing and molding the power connection is reduced, and the structural stability of the power connector 10 is improved, thereby avoiding the problem of damage caused by collision between the LED lamp circuit board 120 and other structures in the power connector 10, and also avoiding the problem that the lampshade and the power connector 10 shell need to be assembled after separate processing, reducing the processing steps of the power connector 10 and improving the structural compactness of the power connector 10.

[0065] It is understandable that the shell of the common power connector 10 needs to have a certain wear resistance and hardness to ensure the structural strength and service life of the power connector 10. However, if the LED lamp circuit board 120 is directly injection molded using a material that can be used for injection molding, a strong residual stress will exist in the portion where the LED lamp circuit board 120 contacts the material that can be used for injection molding, and then the portion where the material that can be used for injection molding contacts the LED lamp circuit board 120 will have a large residual stress and shrink and crack, resulting in poor connection stability between the LED lamp circuit board 120 and the material that can be used for injection molding. After the LED lamp circuit board 120 and the material that can be used for injection molding are injection molded into an integrated structure, the LED lamp The circuit board 120 and the material that can be used for injection molding are prone to peeling, resulting in mutual collision and friction between the LED lamp circuit board 120 and the material that can be used for injection molding. If the material that can be used for injection molding is harder after curing, the possibility of damage to the LED lamp circuit board 120 is increased. Therefore, in the processing method of the power connector of the present application, a first light-transmitting material is added to injection mold the LED lamp circuit board 120, and then the first encapsulation body 200 after integral molding is overmolded. This avoids the problem that the material that can be used for injection molding has a higher hardness requirement in order to ensure the structural strength and service life of the power connector 10, thereby causing more serious damage to the circuit board, thereby improving the feasibility of integral molding of the power connector 10.

[0066] In one embodiment, the second encapsulation body 300 is connected to the end of the first encapsulation body 200 away from the socket 110 to form a package fixing groove 400; after the step of performing a second injection molding operation on the first encapsulation body 200, the processing method of the power connector further includes the following steps: performing a third injection molding operation in the package fixing groove 400, so that the package body 500 is formed in the package fixing groove 400, and the package body 500 is respectively connected to the first encapsulation body 200 and the second encapsulation body 300. It can be understood that in order to make the power connector 10 have a better structural strength and reduce the damage of the first encapsulation body 200 to the circuit board, it is necessary to make the second encapsulation body 300 have a stronger hardness, and it is necessary to make the first encapsulation body 200 have a better flexibility. In the case where the material properties of the second encapsulation body 300 and the first encapsulation body 200 are greatly different, when the second encapsulation body 300 is encapsulated on the first encapsulation body 200, that is, when the second encapsulation body 300 and the first encapsulation body 200 form an integrally molded structure, The second covering body 300 has a poor covering effect on the first covering body 200, which makes the second covering body 300 easy to peel off from the first covering body 200, reducing the structural stability of the power connector 10. Therefore, the encapsulation body 500 is formed in the encapsulation fixing groove 400, that is, the encapsulation body 500, the first covering body 200 and the second covering body 300 form an integrated structure, which increases the connection stability of the second covering body 300 and the first covering body 200, thereby improving the structural stability of the power connector 10. It can also be understood that the encapsulation body 500 also serves as a sealing structure for the second covering body 300, thereby reducing the contact between the external environment and the connector assembly 100, especially the LED lamp circuit board 120, reducing the impact of the external environment on the connector assembly 100, ensuring the performance of the power connector 10 and improving the service life of the power connector 10.

[0067] In one embodiment, before the step of performing protection treatment on the socket 110 and the power cord 130 respectively, and after the step of obtaining the connector assembly 100 of the power connector 10, the processing method of the power connector further includes the following step: performing temperature resistance treatment on the LED lamp circuit board 120. It can be understood that when the first light-transmitting material is used to perform the first injection molding operation on the connector assembly 100 after the protection treatment, the melting temperature of the first light-transmitting material may be higher than the melting temperature of the solder paste layer of the circuit board, resulting in the damage of the solder paste layer of the circuit board, affecting the normal function of the circuit board. Therefore, before obtaining the connector assembly 100 of the power connector 10, the circuit board is subjected to temperature resistance treatment, that is, the solder mask layer of the circuit board is protected to avoid the problem that the solder mask layer of the circuit board is damaged by high temperature, thereby ensuring the electrical connection function of the power connector 10 for connecting the power supply and the electronic equipment and ensuring the LED light indication performance of the power connector 10.

[0068] In one embodiment, a high temperature resistant insulating adhesive is used to perform a heat resistance treatment on the LED lamp circuit board 120. It can be understood that the heat resistance treatment is to apply a layer of high temperature resistant insulating adhesive on the solder mask layer of the circuit board, thereby avoiding the problem that the solder mask layer of the circuit board is damaged by high temperature, ensuring the electrical connection function of the power connector 10 for connecting the power supply and the electronic device and ensuring the LED lamp indication performance of the power connector 10.

[0069] In one embodiment, before the step of performing the first injection molding operation on the connector assembly 100 after the protection treatment, and after the step of performing the protection treatment on the socket 110 and the power cord 130 respectively, the processing method of the power connector further includes the following step: preheating the connector assembly 100. It can be understood that during the first injection molding operation, the temperature of the connector assembly 100 is greatly different from the temperature of the first light-transmitting material, so that when the first covering body 200 and the connector assembly 100 form an integrally formed structure, the residual stress of the contact portion of the first covering body 200 and the connector assembly 100 is relatively large, thereby causing the first covering body 200 to shrink and crack. In order to reduce the degree of shrinkage and cracking of the first covering body 200, the connector assembly 100 is preheated, which reduces the temperature difference between the connector assembly 100 and the first light-transmitting material, thereby reducing the shrinkage and cracking of the first covering body 200 and improving the reliability of the fixed installation of the connector assembly 100.

[0070] In one embodiment, a second light-transmitting material is used to perform a third injection molding operation in the package fixing groove 400 , thereby ensuring that the light emitted by the LED lamp circuit board 120 of the power connector 10 can be transmitted.

[0071] In one embodiment, the first light-transmitting material and the second light-transmitting material are independently selected from silicone or rubber. It is understood that, since the melting temperatures of rubber and silicone are relatively high, when the melted second light-transmitting material rubber or silicone is injected into the second encapsulation body 300, the inside of the second encapsulation body 300 and the surface of the first encapsulation body 200 that are in contact with the second light-transmitting material rubber or silicone will both melt on the surface, and the inside of the second encapsulation body 300 and the surface of the first encapsulation body 200 will be miscible with the second light-transmitting material rubber or silicone after melting to form a miscible interface, thereby improving the bonding stability between the second encapsulation body 300 and the encapsulation body 500, and improving the bonding stability between the first encapsulation body 200 and the encapsulation body 500, thereby improving the bonding stability between the first encapsulation body 200 and the second encapsulation body 300, and improving the sealing effect of the connector assembly 100.

[0072] In one embodiment, polyvinyl chloride is used to perform a first injection molding operation on the first covering body. The polyvinyl chloride has good structural strength after curing, thereby ensuring the structural strength of the second covering body 300 and further ensuring the structural strength of the power connector 10.

[0073] In one embodiment, before the step of performing protective treatment on the connection end of the socket 110 and the lead-out end of the power cord 130 in the connector assembly 100, and after the step of obtaining the connector assembly 100 of the power connector 10, the processing method of the power connector also includes the following step: fixing the power cord 130 to fix the connector assembly 100, thereby ensuring the effectiveness of the electrical connection between the connector assemblies 100.

[0074] In one embodiment, after performing a first injection molding operation on the connector assembly 100 after protection treatment using a first light-transmitting material, and before performing a second injection molding operation on the first coating 200, the processing method of the power connector also includes the following steps: activating the second coating 300 to form a slightly soluble state inside the second coating 300, so that the second coating 300 and the packaging body 500 form a miscible interface, thereby improving the bonding stability of the second coating 300 and the packaging body 500, and thereby improving the structural stability of the power connector 10.

[0075] In one embodiment, the activation operation of the second encapsulation 300 is to heat the interior of the second encapsulation 300 so that the interior of the second encapsulation 300 forms a slightly soluble state. It can be understood that the slightly soluble state is that the second encapsulation 300 and the surface are melted, but the interior is in a solidified state, so that the second encapsulation 300 and the encapsulation body 500 form a miscible interface, which improves the bonding stability of the second encapsulation 300 and the encapsulation body 500, thereby improving the structural stability of the power connector 10.

[0076] Compared with the prior art, the present invention has at least the following advantages:

[0077] 1. In the power connector 10 of the present invention, the LED lamp circuit board 120 and the first covering body are used to replace the indicator light, the lampshade and the circuit board, which reduces the complexity of the shell of the power connector 10, thereby reducing the difficulty of molding the shell of the power connector 10, and the first and second covering bodies 300 are covered with the outer periphery of the socket 110 and the LED lamp circuit board 120, that is, the first covering body 200 and the connector assembly 100 form an integrally molded structure, and the socket 110, the LED lamp circuit board 120 and the power cord 130 are directly integrally molded on the first covering body, thereby avoiding the need for the power connector 10 to be used for installing and fixing the socket 110 and the LED lamp circuit board. The structure of the socket 110 and the power cord 120 and the power cord 130 is difficult to design and is prone to shrinkage and deformation during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and thus it is difficult to achieve the problem of the corresponding position of the protrusion and the accuracy of the structural relationship. In addition, the installation and fixing reliability of the socket 110, the LED lamp circuit board 120 and the power cord 130 is improved, and the problem of the indicator light circuit board colliding with other structures in the power connector 10 and damaging the indicator light circuit board is avoided. The problem that the lampshade and the shell of the power connector 10 need to be assembled after separate processing is also avoided, which reduces the processing procedures of the power connector 10 and improves the compactness of the structure of the power connector 10;

[0078] 2. In the processing method of the power connector of the present invention, after the connection end of the socket 110 and the lead-out end of the power line 130 in the connector assembly 100 are protected, the first light-transmitting material is used to perform a first injection molding operation on the connector assembly 100 after the protection treatment, so that the connector assembly 100 after the protection treatment is directly fixed by injection molding to form an integral molding structure, and the connection end of the socket 110 and the lead-out end of the power line 130 after the protection treatment are exposed, ensuring the function of the power connector 10 for connecting the electronic device to the power supply, and then the second injection molding operation is performed on the first covering body 200, avoiding the power connector 10 being used to install and fix the socket 110. The structure of the LED lamp circuit board 120 and the power line 130 is difficult to design and is easy to shrink and deform during the molding process, which increases the difficulty of processing and molding the shell of the power connector 10, and thus it is difficult to achieve the problem of the corresponding position of the protrusion and the accuracy of the structural relationship. The difficulty of processing and molding the power connection is reduced, and the structural stability of the power connector 10 is improved, thereby avoiding the problem of the LED lamp circuit board 120 colliding with other structures in the power connector 10 and being damaged, and also avoiding the problem that the lampshade and the shell of the power connector 10 need to be assembled after separate processing, reducing the processing procedures of the power connector 10, and improving the compactness of the structure of the power connector 10.

[0079] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A power connector, characterized in that: include: A connector assembly, the connector assembly comprising a socket, an LED lamp circuit board and a power cord, the socket and the power cord are both electrically connected to the LED lamp circuit board; A first covering body, wherein the first covering body is covered with plastic on the periphery of the socket and the LED lamp circuit board, and the first covering body also covers a part of the power cord, and a part of the socket protrudes from the first covering body; A second covering body, wherein the second covering body is covered with the first covering body and the power cord protruding from the first covering body, and the second covering body is also covered with the socket protruding from the first covering body, and the socket hole of the socket is exposed outside the second covering body; The second covering body is connected to the end of the first covering body away from the socket to form a packaging fixing groove; The power connector further includes a packaging body, the packaging body is formed in the packaging fixing groove, and the packaging body is respectively connected to the first covering body and the second covering body; The packaging body, the first encapsulating body and the second encapsulating body form an integrally formed structure.

2. The power connector according to claim 1, characterized in that: A bump is formed on the first encapsulation body. The bump is disposed on a side wall of the first encapsulation body close to the packaging body, and the bump is connected to the packaging body.

3. The power connector according to claim 1, characterized in that: The second encapsulating body is formed with a first positioning groove communicating with the packaging fixing groove, and the packaging body is also formed in the first positioning groove.

4. The power connector according to claim 1, characterized in that: The first encapsulating body is formed with a second positioning groove, and the second encapsulating body is partially formed in the second positioning groove.

5. The power connector according to any one of claims 1 to 4, characterized in that: At least two plug-in slots are formed at the end of the second covering body away from the insertion hole, and the at least two plug-in slots are evenly distributed on the second covering body.

6. A method for processing a power connector, characterized in that: The power connector according to claim 1 is manufactured by processing, and the processing method of the power connector comprises the following steps: Obtaining the connector component; Performing protection treatment on the socket and the power cord respectively; Performing a first injection molding operation on the connector assembly after the protection treatment, so that the first covering body is covered around the socket and the LED lamp circuit board, and the first covering body also covers a part of the power line, and a part of the socket protrudes from the first covering body; Performing a second injection molding operation on the first covering body, so that the second covering body is covered with the first covering body and the power cord protruding from the first covering body, the second covering body is also covered with the socket protruding from the first covering body, and the socket hole of the socket is exposed outside the second covering body, and the second covering body is connected to the end of the first covering body away from the socket to form a packaging fixing groove; A third injection molding operation is performed in the package fixing groove, so that the package body is formed in the package fixing groove, and the package body is connected to the first encapsulating body and the second encapsulating body respectively.

7. The method for processing a power connector according to any one of claim 6, characterized in that: Before the step of performing protection treatment on the socket and the power cord respectively, and after the step of obtaining a connector component of the power connector, the processing method of the power connector further includes the following steps: The LED lamp circuit board is subjected to a temperature resistance treatment.

8. The method for processing a power connector according to any one of claims 6 to 7, characterized in that: Before the step of performing the first injection molding operation on the connector assembly after the protection treatment, and after the step of performing the protection treatment on the socket and the power cord respectively, the processing method of the power connector further includes the following steps: The connector assembly is subjected to a preheating treatment.

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