Modulation ring injection molding device and method

Abstract

The present invention discloses a modulation ring injection molding device and method. The device includes a stirring assembly, a gas compressor, an injection molding cavity, an upper end ring, a lower end ring, and a heating assembly. The gas pipeline of the gas compressor is connected to the air inlet of the stirring assembly. The stirring assembly is connected to the gate of the lower end ring through a material pipeline. A valve is provided on the material pipeline. The upper end ring and the lower end ring are respectively concentrically fixed to the upper and lower end faces of the modulation ring, and the upper flow channel of the upper end ring and the lower flow channel of the lower end ring are both connected to the injection molding hole of the modulation ring. The upper end ring, the modulation ring and the lower end ring are all located in the injection molding cavity. The heating assembly is located below the stirring assembly, the material pipeline and the injection molding cavity to heat the stirring assembly, the material pipeline and the injection molding cavity. The present structure and method utilize high-pressure gas to push the material to fill the injection molding hole of the modulation ring, complete the assembly of non-conductive materials, improve the filling quality, have strong versatility and high production efficiency.

Description

Technical Field

[0001] The invention relates to the field of injection molding devices, in particular to an injection molding device and method for a modulation ring. Background Art

[0002] The modulation ring is a core component of permanent magnet gears and permanent magnet composite motors based on the principle of magnetic field modulation. It has broad application prospects in the fields of wind power generation, air cooling islands, belt conveyors, electric vehicles, etc. The modulation ring is composed of magnetic conductive materials and non-magnetic conductive materials arranged at intervals. It has a simple structure, but has high strength and precision requirements. The existing modulation ring magnetic conductive material part is composed of stacked silicon steel sheets, and the non-magnetic conductive material part is assembled by manually filling epoxy glue, which has bubbles, affecting the strength and precision of the modulation ring, and the production efficiency is low, which cannot meet market demand. Summary of the invention

[0003] The purpose of the present invention is to provide a modulation ring injection molding device in view of the problems existing in the prior art, which solves the problems of complex assembly process, low precision and poor rigidity of the existing modulation ring non-magnetic material, and provides a modulation ring injection molding device with simple operation and high assembly precision.

[0004] The purpose of the present invention is to be solved by the following technical solutions:

[0005] A modulation ring injection molding device comprises a stirring assembly, a gas compressor, an injection cavity, an upper end ring, a lower end ring, and a heating assembly, wherein the gas pipeline of the gas compressor is connected to the air inlet of the stirring assembly; the stirring assembly is connected to the gate of the lower end ring through a material pipeline, and a valve is arranged on the material pipeline; an air hole and an upper flow channel are arranged on the upper end ring, and the air hole is communicated with the upper flow channel; a gate and a lower flow channel are arranged on the lower end ring, and the gate is arranged on the circumferential surface of the lower end ring, and The upper end ring is concentrically fixed to the upper end face of the modulation ring, and the upper flow channel is communicated with the injection hole of the modulation ring, the lower end ring is concentrically fixed to the lower end face of the modulation ring, and the lower flow channel is communicated with the injection hole of the modulation ring, the upper end ring, the modulation ring and the lower end ring are all located in the injection cavity; the heating assembly is located below the stirring assembly, the material pipeline and the injection cavity, and includes a first heater and a second heater, the first heater heats the stirring assembly and the material pipeline, and the second heater heats the injection cavity.

[0006] A modulation ring injection molding method, comprising the following steps:

[0007] (a) Fix the upper end ring, the modulation ring and the lower end ring, place them in the injection molding cavity, and connect the material pipeline with the gate;

[0008] (b) starting the stirring assembly to stir the material evenly, and simultaneously starting the heating assembly to heat the material to keep it in a molten state;

[0009] (c) Close the stirring assembly, start the gas compressor, open the air inlet, output high-pressure gas to the stirring assembly, open the valve, and allow the material to flow into the material pipeline, gate, downflow channel, injection hole and upflow channel in sequence under the push of the high-pressure gas;

[0010] (d) When material flows out of each air hole, close the valve and turn off the gas compressor;

[0011] (e) turning off the second heater to allow the material in the injection molding cavity to cool and solidify;

[0012] (f) After cooling is completed, the upper end ring, the modulation ring and the lower end ring are taken out from the injection molding cavity, and the upper end ring, the modulation ring and the lower end ring are separated to complete the injection molding of the modulation ring.

[0013] The stirring assembly comprises a motor, a reducer, an end cover, a stirring shaft and a shell. The motor and the reducer are installed on the end cover and drive the stirring shaft in the shell to rotate. The air inlet is also arranged on the end cover.

[0014] The injection cavity is provided with an observation cover plate, and the observation cover plate is made of transparent material.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] The present invention aims at a structure in which a modulation ring has a large number of injection holes which are not connected to each other. The material is transported by high-pressure gas to avoid the appearance of pores in the material. The structure of the upper end ring and the lower end ring allows the material to enter each injection hole of the modulation ring under the action of pressure, and the material is heated by the heating assembly to ensure the fluidity of the material and improve the mold filling effect of the material. When all the pores have materials coming out, the filling is completed and the cooling stage is entered. After the material solidifies, the modulation ring is taken out and the next process is entered. The present invention has no requirements on the size of the modulation ring, has strong versatility, and avoids the problems of bubbles and low precision caused by manual filling of materials. It has high production efficiency and is suitable for popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attached Figure 1 It is a schematic structural diagram of an embodiment of a modulation ring injection molding device of the present invention;

[0018] Attached Figure 2 It is a schematic diagram of the assembly of the upper end ring, the modulation ring and the lower end ring;

[0019] Attached Figure 3 Schematic diagram of the modulation ring structure;

[0020] Among them: 1 stirring assembly; 1-1 motor; 1-2 reducer; 1-3 end cover; 1-4 stirring shaft; 1-5 shell; 2 gas compressor; 3 injection cavity; 4 upper end ring; 4-1 air hole; 4-2 upper runner; 5 lower end ring; 5-1 gate; 5-2 lower runner; 6 heating assembly; 6-1 first heater; 6-2 second heater; 7 gas pipeline; 8 air inlet; 9 material pipeline; 10 valve; 11 modulation ring; 11-1 injection hole; 12 observation cover. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0022] like Figure 1-3 The invention discloses a modulation ring injection molding device, comprising a stirring assembly (1), a gas compressor (2), an injection cavity (3), an upper end ring (4), a lower end ring (5), and a heating assembly (6). The stirring assembly (1) comprises a motor (1-1), a reducer (1-2), an end cover (1-3), a stirring shaft (1-4), and a housing (1-5). The motor (1-1) and the reducer (1-2) are mounted on the end cover (1-3) and drive the stirring shaft (1-4) located in the housing (1-5) to rotate. The end cover (1-3) is also provided with an air inlet (8). The gas pipeline (7) of the gas compressor (2) is connected to the air inlet (8) of the stirring assembly (1); the upper end ring (4) is provided with an air hole (4-1) and an upper flow channel (4-2), and the air hole (4-1) is communicated with the upper flow channel (4-2); the lower end ring (5) is provided with a gate (5-1) and a lower flow channel (5-2), and the gate (5-1) is provided on the circumferential surface of the lower end ring (5) and is communicated with the lower flow channel (5-2); the stirring assembly (1) is connected to the gate (5-1) of the lower end ring (5) through a material pipeline (9), and a valve (10) is provided on the material pipeline (9); the upper end ring (4) is concentrically fixed to the upper end surface of the modulation ring (11), and the upper flow channel (4-2) The lower end ring (5) is concentrically fixed to the lower end surface of the modulation ring (11), and the lower flow channel (5-2) is connected to the injection hole (11-1) of the modulation ring (11). The upper end ring (4), the modulation ring (11) and the lower end ring (5) are all located in the injection cavity (3); the heating assembly (6) is located below the stirring assembly (1), the material pipeline (9) and the injection cavity (3), and includes a first heater (6-1) and a second heater (6-2). The first heater (6-1) heats the stirring assembly (1) and the material pipeline (9), and the second heater (6-2) heats the injection cavity (3). An observation cover plate (12) is provided on the injection cavity (3), and the observation cover plate (12) is made of transparent material.

[0023] A modulation ring injection molding method comprises the following steps:

[0024] (a) fixing the upper end ring (4), the modulation ring (11) and the lower end ring (5), placing them in the injection molding cavity (3), and connecting the material pipeline (9) with the gate (5-1);

[0025] (b) starting the stirring assembly (1) to stir the material evenly, and simultaneously starting the heating assembly (6) to heat the material to keep it in a molten state;

[0026] (c) The stirring assembly (1) is closed, the gas compressor (2) is started, the air inlet (8) is opened, and high-pressure gas is output to the stirring assembly (1), and the valve (10) is opened, so that the material, under the impetus of the high-pressure gas, flows into the material pipeline (9), the gate (5-1), the lower flow channel (5-2), the injection hole (11-1) and the upper flow channel (5-1) in sequence;

[0027] (d) observing the injection molding condition by observing the cover plate (12), and when material flows out of each air hole (4-1), closing the valve (10) and turning off the gas compressor (2);

[0028] (e) turning off the second heater (6-2) to allow the material in the injection molding cavity (3) to cool and solidify;

[0029] (f) After cooling is completed, the upper end ring (4), the modulation ring (11) and the lower end ring (5) are taken out from the injection molding cavity (3), and the upper end ring (4), the modulation ring (11) and the lower end ring (5) are separated to complete the injection molding of the modulation ring (11).

[0030] The present invention aims at a structure in which a modulation ring has a large number of injection holes which are not connected to each other. The material is transported by high-pressure gas to avoid the appearance of pores in the material. The structure of the upper end ring and the lower end ring allows the material to enter each injection hole of the modulation ring under the action of pressure, and the material is heated by the heating assembly to ensure the fluidity of the material and improve the mold filling effect of the material. When all the pores have materials coming out, the filling is completed and the cooling stage is entered. After the material solidifies, the modulation ring is taken out and the next process is entered. The present invention has no requirements on the size of the modulation ring, has strong versatility, and avoids the problems of bubbles and low precision caused by manual filling of materials. It has high production efficiency and is suitable for popularization and use.

[0031] The above embodiments are only for illustrating the technical idea of ​​the present invention, and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the present invention; any technology not involved in the present invention can be realized by existing technologies.

Claims

1. A modulation ring injection molding device, comprising a stirring assembly (1), a gas compressor (2), an injection cavity (3), an upper end ring (4), a lower end ring (5), and a heating assembly (6), characterized in that: The gas pipeline (7) of the gas compressor (2) is connected to the air inlet (8) of the stirring assembly (1); the upper end ring (4) is provided with an air hole (4-1) and an upper flow channel (4-2), and the air hole (4-1) is communicated with the upper flow channel (4-2); the lower end ring (5) is provided with a gate (5-1) and a lower flow channel (5-2), and the gate (5-1) is provided on the circumferential surface of the lower end ring (5) and is communicated with the lower flow channel (5-2); the stirring The mixing assembly (1) is connected to the gate (5-1) of the lower end ring (5) through a material pipeline (9), and a valve (10) is provided on the material pipeline (9); the upper end ring (4) is concentrically fixed to the upper end surface of the modulation ring (11), and the upper flow channel (4-2) is connected to the injection hole (11-1) of the modulation ring (11); the lower end ring (5) is concentrically fixed to the lower end surface of the modulation ring (11), and the lower flow channel (5-2) is connected to the injection hole (11-1) of the modulation ring (11). 1-1) are connected, the upper end ring (4), the modulation ring (11) and the lower end ring (5) are all located in the injection cavity (3); the heating assembly (6) is located below the stirring assembly (1), the material pipeline (9) and the injection cavity (3), and includes a first heater (6-1) and a second heater (6-2), the first heater (6-1) heats the stirring assembly (1) and the material pipeline (9), and the second heater (6-2) heats the injection cavity (3); the stirring assembly (1) The assembly (1) comprises a motor (1-1), a reducer (1-2), an end cover (1-3), a stirring shaft (1-4) and a housing (1-5); the motor (1-1) and the reducer (1-2) are mounted on the end cover (1-3) and drive the stirring shaft (1-4) located in the housing (1-5) to rotate; the air inlet (8) is also arranged on the end cover (1-3); and an observation cover plate (12) is arranged on the injection molding cavity (3), and the observation cover plate (12) is made of a transparent material.

2. A method for using a modulation ring injection molding device according to claim 1, characterized in that It includes the following steps: (a) fixing the upper end ring (4), the modulation ring (11) and the lower end ring (5), placing them in the injection molding cavity (3), and connecting the material pipeline (9) with the gate (5-1); (b) starting the stirring assembly (1) to stir the material evenly, and simultaneously starting the heating assembly (6) to heat the material to keep it in a molten state; (c) closing the stirring assembly (1), starting the gas compressor (2), opening the air inlet (8), outputting high-pressure gas to the stirring assembly (1), and opening the valve (10), so that the material, driven by the high-pressure gas, flows into the material pipeline (9), the gate (5-1), the lower flow channel (5-2), the injection hole (11-1) and the upper flow channel (4-2) in sequence; (d) When material flows out of each air hole (4-1), close the valve (10) and turn off the gas compressor (2); (e) turning off the second heater (6-2) to allow the material in the injection molding cavity (3) to cool and solidify; (f) After cooling is completed, the upper end ring (4), the modulation ring (11) and the lower end ring (5) are taken out from the injection molding cavity (3), and the upper end ring (4), the modulation ring (11) and the lower end ring (5) are separated to complete the injection molding of the modulation ring (11).

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