A circuit board with fully antistatic data line head and manufacturing method thereof

Abstract

The present invention relates to the technical field of antistatic data line heads, and in particular to a circuit board and a manufacturing method of a fully antistatic data line head. The circuit board A surface and the circuit board B surface of the fully antistatic circuit board are provided with attached copper lines for signal transmission and for installing electronic components, and each non-grounded attached copper line is reserved with a copper disk for releasing transient pulse energy; a layer of functional material is attached to the surface of the copper disk to form a barrier, and a metal layer is plated on the surface of the functional material, and one side of the metal layer extends to the nearest grounding line to form an energy release channel. The present invention designs an effective area to construct an energy release electrode S and an energy absorption electrode S', and utilizes the coating of functional materials and the positions of S and S', which do not occupy the surface space of the circuit board to complete the establishment of the energy discharge channel. High-fidelity data transmission and antistatic functions can be achieved in an extremely small area and space, while reducing the antistatic cost.

Description

Technical Field

[0001] The present invention relates to the technical field of antistatic data line heads, and in particular to a circuit board of a full antistatic data line head and a manufacturing method thereof. Background Art

[0002] Most of the data cables currently on the market use four wires to complete signal transmission, namely two power cables (one positive power cable and one negative power cable) and two cables for data transmission (one D+ and one D-). This type of data cable occupies more than half of the market, with annual sales of more than 1 billion cables and a price of about 10 to 20 yuan per cable. Due to the limitation of the board area and in order to save costs, the head circuit of this data cable does not perform any anti-interference or magnetic pulse protection. For example, the two data cables D+ and D- are directly connected from the USB port to the plug, and the two power cables are only provided with simple charging prompts by the display chip. The more conscientious one is to add two varistors to prevent surges. Such a structure will directly lead a large amount of random pulse energy from the outside or the human body, such as magnetic induction, electrostatic pulses and other high voltages, to the inside of the device, posing a great threat to the device. Although brand manufacturers have added some protection to their data cables, the protection is incomplete. They only use varistors for protection on the power lines. Varistors are very cheap, but their parasitic capacitance is extremely large, which has a great impact on high-frequency signals. Therefore, data transmission lines simply do not connect any protection devices. If you insist on adding high-fidelity protection components, the price will be several times or even dozens of times that of ordinary cables, which is simply unacceptable to ordinary consumers. They have to sacrifice the life of the equipment in exchange for cheapness.

[0003] The circuit board of the circuit board of the fully antistatic data line head of the present invention introduces a switch functional material into the product, which makes the ordinary data line head circuit board become a full-range antistatic data line head circuit board at a very low cost. Since the functional material is a thin layer coated on the circuit surface, it does not occupy the precious circuit board area and space, so the whole data line head circuit can be fully coated. Theoretically, 200 protection channels can be established per square centimeter, so that each copper wire and each electronic component on the board can be fully protected by high-voltage pulses. At the same time, since the switch functional material has a very small capacitance value (about 0.05PF), D+ and D- can also be protected by high-fidelity antistatic protection, so that the two data transmission lines can achieve high-speed, stable and high-fidelity signal transmission. The implementation of the scheme will subvert the current data line market structure and enable users to obtain high-quality services with low expenditures. Summary of the invention

[0004] Based on the technical problems existing in the background technology, the present invention proposes a circuit board with a fully anti-static data line head and a manufacturing method, which has the characteristics of realizing high-fidelity data transmission and anti-static functions in an extremely small area and space, while reducing the anti-static cost, solving the problem of large space occupation and high cost of existing anti-static technology.

[0005] The present invention provides the following technical solutions:

[0006] A circuit board for a fully antistatic data line head, comprising a fully antistatic circuit board with an insulating layer in the middle and copper layers on both sides, wherein the two sides of the fully antistatic circuit board are respectively provided with a circuit board surface A and a circuit board surface B, wherein the circuit board surface A and the circuit board surface B are provided with copper lines for signal transmission and for installing electronic components, and each non-grounded copper line is provided with a copper disk for releasing transient pulse energy;

[0007] A layer of functional material is attached to the surface of the copper disk to form a barrier, and a metal layer is plated on the surface of the functional material. Two sides of the metal layer overlap with two sides of the copper disk, and the other two sides pass through the other two sides of the copper disk, and one side extends to the nearest grounding wire to form an energy release channel;

[0008] The functional material adopts voltage-induced resistance material. Under normal working voltage, the resistance of the two corresponding endpoints of the voltage-induced resistance material is ∞, and it is an insulator. When a transient high voltage appears at the two ends, that is, the voltage is higher than 250V, the material resistance value immediately changes from an insulator to a conductor, so that the high voltage is quickly discharged to the low end in the form of current. After the high voltage passes, the voltage-induced resistance material changes from a conductor to an insulator.

[0009] Preferably, the functional material coating area fully covers and exceeds the edge of the copper disk by more than 0.2 mm, and the functional material coating thickness is 50 um to 100 um.

[0010] Preferably, the metal layer electroplated on the surface of the functional material is a copper material, the coating thickness is 7um-10um, the width is overlapping with an edge of the copper disk, and the length extends to a grounding wire and is electrically connected to the grounding wire.

[0011] Preferably, the upper end of the circuit board A surface is provided with a pad connected to an external line, the middle end is provided with a signal transmission copper wire, and the lower end is provided with an external socket copper wire lead pin connected to other devices;

[0012] The upper end of the circuit board B surface is connected to the electronic components for signal processing with copper wires, the middle end is the signal transmission copper wires, and the lower end is the external socket copper wire pins that are mirror-symmetrical to the circuit board A surface.

[0013] Preferably, a connecting through hole for the attached copper wires associated with the two sides is provided between the A side of the circuit board and the B side of the circuit board. There are 4 grounding wires on the left and right sides of the A side of the circuit board and the B side of the circuit board. A positioning pin for fixing the attached copper wire lead pin protective sleeve is arranged in the middle section of each of the 4 grounding wires. The attached copper wire lead pin protective sleeve is positioned and tightened by the positioning pin and sealed with thermoplastic material.

[0014] Preferably, the copper thickness on both sides of the fully antistatic circuit board is 15um, and the thickness of the middle insulating layer is 670um; the upper end width of the fully antistatic circuit board M is 6.5mm, the lower end width is 5.2mm, and the length is 15mm.

[0015] A method for manufacturing a circuit board with a fully antistatic data line head comprises the following steps:

[0016] Step 1: etching copper wires on a circuit board substrate having an insulating layer in the middle and copper layers on both sides, reserving a copper disk on each non-grounded copper wire, attaching a voltage-induced resistance material to the surface of the copper disk, and polishing the voltage-induced resistance material attached to the copper disk surface with a grinder;

[0017] Step 2: Paste the blue film and expose it with laser, wash the film to reveal the copper plating position, plate copper on the voltage-induced resistance material surface to cover the copper disk and connect it to the ground;

[0018] Step three, applying insulating paint on the circuit board substrate, installing electronic components and prefabricated parts, and then performing injection molding to obtain a fully antistatic data cable end product.

[0019] Preferably, in the step 1, a screen printer is used to print the voltage-induced resistance material on the copper disk surface, and each edge of the voltage-induced resistance material surface exceeds the covered copper disk edge by more than 0.2 mm, and the thickness of the voltage-induced resistance material is controlled at 50um-100um; high-temperature curing, the incubator temperature is adjusted to 150°C, left for 60 minutes, and cooled naturally.

[0020] Preferably, in the step 1, the polymer composite nano voltage-induced soft resistive film is cut into a shape in which each edge exceeds the edge of the covered copper disk by more than 0.2 mm, and then the film is pasted on the surface of the copper disk using a high-temperature laminating machine.

[0021] Preferably, in step 2, the copper plating width coincides with the edge of the copper disk covered by the voltage-induced resistance material, the copper plating length extends to the nearest grounding wire and is electrically connected to the grounding wire, and the copper plating thickness is 7um-10um.

[0022] The present invention provides a circuit board and manufacturing method for a fully antistatic data line head, which realizes the fully antistatic design and production on the data line head circuit board with extremely limited area, and completes the task of all-round ESD protection that cannot be achieved by using a single ESD protection element. The key point is to design the effective area to construct the energy release electrode S and the energy absorption electrode S', and to use the coating of functional materials and the position of S and S', which do not occupy the surface space of the circuit board, to complete the establishment of the energy discharge channel. D+ and D- can also be protected, so that the two data transmission lines can achieve high-speed, stable and high-fidelity signal transmission. The implementation of the solution will subvert the current data line market structure and enable users to obtain high-quality services with low expenditures. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the circuit board substrate structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the circuit board structure after etching of the present invention;

[0025] Figure 3 This is a schematic diagram of the circuit board structure after the functional material is attached to the circuit board according to the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of a circuit board after copper plating according to the present invention;

[0027] Figure 5 It is a schematic diagram of forming the energy discharge channel of the present invention;

[0028] Figure 6 It is a structural schematic diagram of the finished product of the fully antistatic data cable head of the present invention.

[0029] In the figure: 1. electronic component; 2. copper plate; 3. functional material; 4. metal layer; 5. ground wire; 6. through hole; 7. positioning pin; 8. positioning groove. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] The present invention provides a technical solution: a circuit board of a fully antistatic data line head, comprising a fully antistatic circuit board with an insulating layer in the middle and copper layers on both sides, the two sides of the fully antistatic circuit board are respectively provided with a circuit board A side and a circuit board B side, and the fully antistatic circuit board is also provided with a positioning groove 8 for fixing with a shell, and the circuit board A side and the circuit board B side are provided with copper lines for signal transmission and for installing electronic components 1, and the electronic components are signal display chips and auxiliary components. A copper disk 2 is reserved for releasing transient pulse energy on each non-grounded copper line; (for example, there are S1, S2, S3, S4 on the circuit board A side, and S5, S6, S7 on the circuit board B side, and multiple S can be added according to different chips). In MA, the shape of S can be a rectangle with a size of 0.5mm×0.5mm, or a circle with a diameter of 0.6mm. In MB, S can be a rectangle with a size of 0.3mm×0.3mm, or a circle with a diameter of 0.4mm. The size of S is the overlapping size formed by the copper plating layer and S after covering the functional material 3.

[0032] The copper plate 2 has a layer of functional material 3 attached to the surface to form a barrier. The functional material 3 is plated with a metal layer 4. Two sides of the metal layer 4 overlap with two sides of the copper plate 2. The other two sides pass through the other two sides of the copper plate 2. One side extends to the nearest grounding line 5 to form an energy release channel.

[0033] The functional material 3 is a voltage-variable resistor material. Under normal working voltage, the resistance of the two corresponding endpoints of the voltage-variable resistor material is ∞, and it is an insulator. When a transient high voltage appears at the two ends, that is, the voltage is higher than 250V, the material resistance value immediately changes from an insulator to a conductor (response time <1ns), so that the high voltage is quickly discharged to the low end in the form of current. After the high voltage passes, the voltage-variable resistor material changes from a conductor to an insulator.

[0034] The functional material is selected from the "polymer composite nano voltage varistor soft film" (derived from the Chinese invention patent ZL201210314982.2) or the composite nano voltage varistor paste obtained by printing and curing (derived from the second method for manufacturing a functional circuit board core board in ZL201410195406X). The P material coating area fully covers and exceeds the edge of the S surface by more than 0.2mm. The functional material coating thickness is 50um to 100um.

[0035] The coating area of ​​the functional material 3 fully covers and exceeds the edge of the copper plate 2 by more than 0.2 mm. The coating thickness of the functional material 3 is 50 um to 100 um.

[0036] The metal layer 4 electroplated on the surface of the functional material 3 is a copper material with a coating thickness of 7um-10um, a width overlapping with an edge of the copper disk 2 , and a length extending to a grounding wire 5 and electrically connected to the grounding wire 5 .

[0037] The upper end of the circuit board A surface is provided with a pad connected to the external line, the middle end is provided with a signal transmission copper wire, and the lower end is provided with an external socket with copper wire pins connected to other devices;

[0038] The upper end of the circuit board B surface is connected to the electronic components for signal processing with copper wires, the middle end is the signal transmission copper wires, and the lower end is the external socket copper wire pins that are mirror-symmetrical to the circuit board A surface.

[0039] The fully antistatic circuit board M has A-side and B-side patterns MA and MB composed of copper wires etched on the double-sided copper circuit board substrate. MA represents the A-side of the circuit board, and MB represents the B-side of the circuit board. The upper end of MA has V-, D+, D-, and V+ pads connected to the external line, the middle end has signal transmission copper wires, and the lower end has external sockets GND, D+, D-, SA, VUSB, NC, NC, and SB copper wire pins connected to other devices. The upper end of MB is the copper wire connected to the electronic components for signal processing, the middle end is the signal transmission copper wire, and the lower end is the external socket copper wire pins SB, NC, NC, VUSB, SA, D-, D+, and GND that are mirror-symmetrical to MA. There is a connecting through hole 6Φ between MA and MB for the copper wires associated with the A and B sides, and there are 4 wider grounding wires 5 on the left and right sides of MA and MB. A positioning pin 7 for fixing the copper wire pin protective sleeve is arranged in the middle of each of the 4 wider grounding wires 5. The copper wire lead pin protective sleeve is positioned and locked by the positioning pin 7 and sealed by the thermoplastic material.

[0040] The design of L is to facilitate the rapid release of large pulse current and the rapid neutralization of + and - static electricity. The middle section of the wide ground wire 5 is arranged with a positioning pin 7 for fixing the copper wire lead pin protective sleeve. The positioning pin 7 is formed by cooling the coated solder paste after melting at 250°C. The positioning pin 7 is 2.5mm long, 0.3mm wide, and 0.15mm high. The surface is flat to facilitate the tight locking of the lead pin protective sleeve and keep a certain distance between the inner wall of the protective sleeve and the lead pin.

[0041] The copper thickness on both sides of the full antistatic circuit board is 15um, and the thickness of the middle insulating layer is 670um; the full antistatic circuit board M has an upper width of 6.5mm, a lower width of 5.2mm, and a length of 15mm.

[0042] The copper wires on the A and B sides of the double-sided copper wire pattern are formed, and the thickness, spacing, and position of the through holes on the MA and MB are the same. The samples are all made of Figure 2 definition.

[0043] The V-, D+, D-, V+ pads on MA connected to the external wires are at the top of M, each with a length of 3mm, a width of 1.2mm, and a spacing of 0.3mm. The external sockets GND, D+, D-, SA, VUSB, NC, NC, SB attached copper wire pins on MA and MB are attached copper wire segments at the bottom of M, each with a length of 2mm, a width of 0.4mm, and a spacing of 0.2mm.

[0044] The positioning pin 7 is used to locate the position of the copper wire lead pin protective sleeve and tighten the protective sleeve. The copper wire lead pin protective sleeve is made of titanium alloy with a thickness of 0.2mm. The outer length of the sleeve is 7mm, the width is 6mm, the thickness is 1.4mm, the length of the cavity inside the sleeve is 7mm, the width is 5mm, and the height is 1.0mm. The sleeve is provided with a window at the position of the copper wire lead pin. The window is 5.5mm long and 2.6mm wide so that the lead pins on both sides MA and MB of the protective sleeve on the positioning pin 7 are just exposed. The thermoplastic sealing is performed by injection molding in a hot pressing mold machine to plastic-seal the empty space in the sleeve cavity and the patch component part of the circuit board.

[0045] A method for manufacturing a circuit board with a fully antistatic data line head comprises the following steps:

[0046] Step 1, etching copper wires on a circuit board substrate with an insulating layer in the middle and copper layers on both sides, reserving a copper plate 2 on each non-grounded copper wire, attaching a voltage-induced resistance material to the surface of the copper plate 2, and polishing the voltage-induced resistance material attached to the surface of the copper plate 2 with a grinder, wherein the copper plate can be represented by S;

[0047] Step 2: Paste the blue film and expose it with laser, wash the film to reveal the copper plating position, plate copper on the voltage-induced resistance material surface to cover the copper plate 2 and connect it to the ground;

[0048] Step three, applying insulating paint on the circuit board substrate, installing the electronic components 1 and the prefabricated parts, and then performing injection molding to obtain a fully antistatic data cable end product.

[0049] The specific manufacturing method is as follows:

[0050] 1. Cut the double-sided copper-coated 0.7mm thick circuit board substrate into a rectangle with a length of 15mm and a width of 6mm, such as Figure 1 shown.

[0051] 2. Through hole 6: Press Figure 2 Mark the coordinate through hole 6Φ position, select a drill with a diameter of 0.2mm for mechanical drilling, and determine the two surfaces MA and MB. MA represents the A side of the circuit board, and MB represents the B side of the circuit board.

[0052] 3. After cleaning the through hole 6, copper plating with a thickness of 8-15um is performed to create point connections on both sides of the through hole 6.

[0053] 4. Paste blue film on both sides of the board, ① reserve S1-S4 in MA and S5-S7 in MB.

[0054] ② (S1-S4) area ≤ 0.5mm×0.5mm, (S5-S7) area ≤ 0.3mm×0.3mm.

[0055] 5. Drawing: Draw with laser Figure 2 , that is, the patterns of MA and MB are printed on the MA and MB positions of the through hole 6 corresponding to the blue film respectively.

[0056] 6. Wash the film to reveal patterns MA and MB.

[0057] 7. Etching: Place the board in the etching solution to etch out MA and MB.

[0058] 8. Attach functional material 3 to the copper plate:

[0059] (1) The first method uses a screen printer to print the functional material 3 at positions S1-S7.

[0060] ① Each edge of the material surface must exceed the covered S edge by more than 0.2mm.

[0061] ②The material thickness is controlled between 50um and 100um.

[0062] ③High temperature curing, adjust the temperature of the oven to 150℃, leave for 60 minutes, and cool down naturally (see Figure 3 ).

[0063] ⑵The second method

[0064] ①Cut the "polymer composite nano voltage-induced soft resistive film" into the shape determined in ① of the first method.

[0065] ② Use a high-temperature laminating machine to apply the film to the surface of S.

[0066] 9. Grinding: Grind and polish the functional material 3 on the copper plate with a grinder.

[0067] 10. Laser exposure of blue film, washing film to reveal the copper plating position (see Figure 4 ).

[0068] ① The copper plating width should just coincide with the edge of S covered by the functional material 3.

[0069] ② The copper plating length can extend to the nearest grounding line 5 and be electrically connected to the grounding line 5.

[0070] 11. Copper plating: Copper plating is performed on 3 sides of the functional material to cover the copper plate 2 and connect it to the ground. The copper plating thickness is 7um-10um.

[0071] 12. Apply insulating paint.

[0072] ① Reserve pads for installing electronic components.

[0073] ② Reserve the wiring pads for V-, D+, D-, and V+.

[0074] ③ Reserve GND, D+, D-, SA, VUSB, NC, NC, and SB external copper wire pins.

[0075] ④ Reserve the pads for positioning pin 71-4. Positioning pin 7 is 2.5mm long and 0.3mm wide.

[0076] 13. Printing.

[0077] 14. Punch the die to trim the edges and punch the positioning groove 8.

[0078] 15. Screen print solder paste, and print solder paste on all the solder pads reserved after painting and the copper wire needles.

[0079] 16. Attach the electronic component 1 to the pad of the printed circuit.

[0080] 17. After reflow, adjust the temperature to 250℃, tin and solder.

[0081] 18. Install prefabricated parts: insert the copper wire needle sheath externally.

[0082] 19. The external copper wire needle is gold-plated.

[0083] 20. Injection molding in a hot pressing machine: ① Filling the sheath cavity; ② Covering the patch components; ③ Preliminary shape encapsulation.

[0084] Get full anti-static data cable heads, such as Figure 6 shown.

[0085] like Figure 5 As shown, ① represents the effective area S, forming an energy release electrode, ② represents the coating of functional material 3 covering and exceeding the edge of S to form a potential barrier; ③ represents the copper plating of functional material 3, the two sides of the copper plating coincide with the two sides of S, the other two sides span the other two sides of S and one side extends to the nearest ground. The grounded copper surface has an S' surface corresponding to S (the dotted box part of ③) to form an energy absorption electrode; ④ energy release electrode S→functional material 3→energy absorption electrode S' forms an energy discharge channel.

[0086] In the present invention, full antistatic design and production are realized on the data line head circuit board with extremely limited area, completing the task of all-round ESD protection that cannot be achieved by using a single ESD protection element. The key point is to design the effective area to construct the energy release electrode S and the energy absorption electrode S', and to use the coating of the functional material 3 and the position of S and S', which do not occupy the surface space of the circuit board to complete the establishment of the energy discharge channel. D+ and D- can also be protected, so that the two data transmission lines can achieve high-speed, stable and high-fidelity signal transmission. The implementation of the solution will subvert the current data line market structure and enable users to obtain high-quality services with low expenditures.

[0087] The routing design and the number of effective areas S of the patch electronic components 1 in the circuit can be modified, adjusted, increased or decreased according to different types of models or different display modes and data transmission functions, and the external copper wire pin sockets can also be designed into different arrangements and shapes according to the requirements of different models. This solution can also design S on the ground wire and set S' on the protected wire. Therefore, it is suitable for all kinds of data line full antistatic and high-fidelity transmission designs, and is also suitable for the design of all kinds of full antistatic circuit boards. Therefore: All designs involving the use of an effective area S reserved in the circuit and coating a functional material 3 on a copper disk or coating a similar functional material 3 on a circuit board, mounting or using a single ESD protection device embedded in a circuit board to imitate the design of the present invention to produce a full antistatic circuit board and a full antistatic data line head, all fall within the scope of protection of the present invention.

[0088] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A circuit board with a fully antistatic data line head, characterized in that: A fully antistatic circuit board having an insulating layer in the middle and copper layers on both sides, wherein the two sides of the fully antistatic circuit board are respectively provided with a circuit board A side and a circuit board B side, wherein the circuit board A side and the circuit board B side are provided with copper lines for signal transmission and for mounting electronic components (1), and each non-grounded copper line is provided with a copper plate (2) for releasing transient pulse energy; A layer of functional material (3) is attached to the surface of the copper disk (2) to form a barrier, and a layer of metal layer (4) is plated on the surface of the functional material (3). Two sides of the metal layer (4) overlap with two sides of the copper disk (2), and the other two sides pass through the other two sides of the copper disk (2), and one side extends to the nearest grounding wire (5), forming an energy release channel; The functional material (3) is a voltage-variable resistor material. Under normal working voltage, the resistance of the two corresponding endpoints of the voltage-variable resistor material is ∞, and it is an insulator. When a transient high voltage appears at the two ends, that is, the voltage is higher than 250V, the material resistance value immediately changes from an insulator to a conductor, so that the high voltage is quickly discharged to the low end in the form of current. After the high voltage passes, the voltage-variable resistor material changes from a conductor to an insulator. The coating area of ​​the functional material (3) fully covers the entire area and exceeds the edge of the copper plate (2) by more than 0.2 mm, and the coating thickness of the functional material (3) is 50 um to 100 um; The metal layer (4) electroplated on the surface of the functional material (3) is a copper material, the coating thickness is 7um-10um, the width is overlapping with an edge of the copper plate (2), and the length extends to a grounding line (5) and is electrically connected to the grounding line (5); The copper thickness of both sides of the fully antistatic circuit board is 15um, and the thickness of the middle insulating layer is 670um; the upper end width of the fully antistatic circuit board M is 6.5mm, the lower end width is 5.2mm, and the length is 15mm.

2. The circuit board with a fully antistatic data line head according to claim 1, characterized in that: The upper end of the circuit board A surface is provided with a pad connected to an external line, the middle end is provided with a signal transmission copper wire, and the lower end is provided with an external socket with a copper wire lead pin connected to other devices; The upper end of the circuit board B surface is connected to the electronic components for signal processing with copper wires, the middle end is the signal transmission copper wires, and the lower end is the external socket copper wire pins that are mirror-symmetrical to the circuit board A surface.

3. The circuit board with a fully antistatic data line head according to claim 2, characterized in that: A connecting through hole (6) for connecting copper wires associated with the two surfaces is provided between the A surface of the circuit board and the B surface of the circuit board. Four grounding wires (5) are provided on the left and right sides of the A surface of the circuit board and the B surface of the circuit board. A positioning pin (7) for fixing the copper wire lead pin protective sleeve is arranged in the middle of each of the four grounding wires (5). The copper wire lead pin protective sleeve is positioned and locked by the positioning pin (7) and is sealed by thermoplastic material.

4. A method for manufacturing a circuit board with a fully antistatic data line head, used to manufacture a circuit board with a fully antistatic data line head as claimed in any one of claims 1 to 3, characterized in that: The steps include: Step 1, etching copper wires on a circuit board substrate having an insulating layer in the middle and copper layers on both sides, reserving a copper plate (2) on each non-grounded copper wire, attaching a voltage-induced resistance material to the surface of the copper plate (2), and grinding and polishing the voltage-induced resistance material attached to the surface of the copper plate (2) with a grinder; Step 2: Paste the blue film and expose it with laser, wash the film to reveal the copper-plated S' position, plate copper on the voltage-induced resistance material surface to cover the copper disk (2) and connect it to the ground; Step three, applying insulating paint on the circuit board substrate, installing the electronic components (1) and the prefabricated parts, and then performing injection molding to obtain a fully antistatic data cable end product.

5. The method for manufacturing a circuit board with a fully antistatic data line head according to claim 4, characterized in that: In the step 1, a screen printer is used to print the voltage-induced resistance material on the surface of the copper disk (2), each edge of the voltage-induced resistance material surface must extend beyond the edge of the covered copper disk (2) by more than 0.2 mm, and the thickness of the voltage-induced resistance material is controlled within a range of 50 um to 100 um; High temperature curing, adjust the oven temperature to 150°C, leave for 60 minutes, and cool naturally.

6. The method for manufacturing a circuit board with a fully antistatic data line head according to claim 4, characterized in that: In the step 1, the polymer composite nano voltage-induced soft-resistance film is cut into a shape in which each edge exceeds the edge of the covered copper disk (2) by more than 0.2 mm, and then the film is pasted on the surface of the copper disk (2) using a high-temperature laminating machine.

7. The method for manufacturing a circuit board with a fully antistatic data line head according to claim 4, characterized in that: In the step 2, the copper plating width coincides with the edge of the copper disk (2) covered by the voltage-induced resistance material, the copper plating length extends to the nearest grounding line (5) and is electrically connected to the grounding line (5), and the copper plating thickness is 7um-10um.

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