Method and device for electrochemical deposition of metal patterns
By using the methods of horizontal film arrangement, film stringing, exposure, development, electrochemical deposition and film stripping and etching, combined with horizontal electrochemical deposition equipment, the problems of large equipment footprint and high fragmentation rate in solar cell production are solved, and efficient and low-cost fully automated production is achieved, which is suitable for large-scale production.
Patent Information
- Application Number
- CN202110237208.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-03-03
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2041-03-03
AI Technical Summary
In the existing technology, the solar cell production process has problems such as large equipment footprint, high fragmentation rate, and low degree of automation. Especially when making copper metal electrodes, it is difficult to achieve efficient and low-cost fully automated production.
The method of horizontal film arrangement, film stringing, horizontal exposure, development and forming, electrochemical deposition and film stripping and etching is adopted, combined with horizontal electrochemical deposition equipment, and two conductive belts are used to assist in fully automated production. The equipment is designed as a sealed structure to facilitate gas discharge and reduce the amount of solution configuration.
It achieves fully automated production with high production capacity and low fragmentation rate. The equipment occupies a small area, has a good production environment, uses less chemicals, and is suitable for large-scale production.
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Figure CN112864281B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of solar cells, and in particular to a method and equipment for electrochemically depositing metal patterns. Background Art
[0002] With the rapid development of the photovoltaic industry, the industrialization of solar cell manufacturing technologies is becoming increasingly diverse, and the cost of manufacturing cells is lower than that of traditional high-temperature printing processes. Electrochemical metal deposition is a simple method that can form copper metal electrodes on the surface of solar cells. Its resistivity is much lower than that of traditional silver paste-printed electrodes, and it has good contact resistance and fill factor. Furthermore, the copper metal electrode morphology has good plasticity and a good aspect ratio.
[0003] Copper metal electrodes are typically produced using gantry plating or vertical continuous plating. These types of equipment require a large footprint and complex fixtures for metal deposition. Solar cell thickness is typically 120 to 180 μm, making the use of fixtures prone to fragmentation. Summary of the Invention
[0004] The object of the present invention is to provide a method and apparatus for electrochemically depositing metal patterns, which can produce whole-line horizontally, have a low breakage rate, can achieve a high degree of full automation, have a large production capacity, and provide a good production operating environment.
[0005] The purpose of the present invention is achieved through the following technical solutions:
[0006] A method for electrochemically depositing metal patterns, comprising the following steps:
[0007] A. Horizontal arrangement: Arrange the substrates horizontally in sequence along the conveying direction;
[0008] B. Laminating the films into strings: Laminating the conductive tape and the photosensitive film tape onto the substrates processed by the horizontal arrangement in step A, so that the substrates are arranged into strings;
[0009] C. Horizontal exposure: After the substrate is laminated in step B, each substrate area is exposed to complete the pattern transfer;
[0010] D. Development and Forming: Horizontally develop the substrate subjected to the horizontal exposure treatment in step C, and form a dry film with a hollow pattern to be electrochemically deposited on the substrate with the photosensitive film belt;
[0011] E. Electrochemical Deposition: The substrate developed and formed in step D is horizontally fed into an electrochemical deposition apparatus, and a conductive tape is connected to the cathode of the electrochemical deposition apparatus and the anode of the electrochemical deposition apparatus to form a conductive closed loop for horizontal electrochemical deposition.
[0012] F. Stripping and etching: removing the dry film from the substrate treated by electrochemical deposition in step E and recovering the conductive tape;
[0013] G. Cleaning the finished product: Clean and dry the substrate that has been stripped and etched in step F.
[0014] A device for electrochemically depositing metal patterns, comprising a film laminating device, an exposure device connected to a film outlet end of the film laminating device, a developing device connected to a film outlet end of the exposure device, a metal deposition device connected to a film outlet end of the developing device, a film stripping and etching device connected to a film outlet end of the metal deposition device, and a cleaning device connected to a film stripping and etching device; the film laminating device comprises a conductive belt extending along a conveying direction and capable of being respectively attached to both sides of a substrate surface, the conductive belt being located between a photosensitive film and a substrate.
[0015] Compared to existing technologies, the present invention offers advantages in that it uses only two conductive strips during the production process, provides auxiliary functions, and occupies a small footprint, boasts high production capacity, and requires minimal chemical preparation. Furthermore, the equipment can be sealed to allow for the timely discharge and disposal of gases generated during the electrodeposition process, without impacting the production environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a simplified structural diagram of an embodiment of an apparatus for electrochemically depositing metal patterns according to the present invention.
[0017] Figure 2 It is a schematic diagram of an embodiment of a film structure.
[0018] Figure 3 It is a schematic diagram of the coordination structure between the conductive tape and the substrate.
[0019] Figure 4 The present invention is a schematic diagram of an embodiment of a metal deposition device.
[0020] Figure 5 yes Figure 4 Schematic diagram of the cross-section structure.
[0021] Figure 6 It is a schematic diagram of the matching structure of the cathode fixing component and the conductive belt.
[0022] Figure 7 The present invention is a schematic diagram of an embodiment of a deposition transmission component. DETAILED DESCRIPTION
[0023] The present invention is described in detail below with reference to the accompanying drawings and embodiments:
[0024] A method for electrochemically depositing metal patterns, comprising the following steps:
[0025] A. Horizontal arrangement: Arrange the substrates horizontally in sequence along the conveying direction;
[0026] B. Laminating the films into strings: Laminating the conductive tape and the photosensitive film tape onto the substrates processed by the horizontal arrangement in step A, so that the substrates are arranged into strings;
[0027] C. Horizontal exposure: After the substrate is laminated in step B, each substrate area is exposed to complete the pattern transfer;
[0028] D. Development and Forming: Horizontally develop the substrate subjected to the horizontal exposure treatment in step C, and form a dry film with a hollow pattern to be electrochemically deposited on the substrate with the photosensitive film belt;
[0029] E. Electrochemical Deposition: The substrate developed and formed in step D is horizontally fed into an electrochemical deposition apparatus, and a conductive tape is connected to the cathode of the electrochemical deposition apparatus and the anode of the electrochemical deposition apparatus to form a conductive closed loop for horizontal electrochemical deposition.
[0030] F. Stripping and etching: removing the dry film from the substrate treated by electrochemical deposition in step E and recovering the conductive tape;
[0031] G. Cleaning the finished product: Clean and dry the substrate that has been stripped and etched in step F.
[0032] The specific method of affixing the films in a string in step B is to affix two conductive tapes extending along the conveying direction to both sides of the substrate surface, and then affix the photosensitive film tape to the substrate surface to cover the substrate and the conductive tape; or, the specific method of affixing the films in a string is to affix the conductive tape and the photosensitive film tape to the substrate surface at the same time, the photosensitive film tape completely covers the substrate, the conductive tape is located between the photosensitive film tape and the substrate, and the two conductive tapes extending along the conveying direction are affixed to both sides of the substrate surface; the contact width between the conductive tape and the substrate is less than 1.5 mm.
[0033] The specific method of the horizontal exposure in step C is that the substrate is horizontally transferred to the exposure device, the exposure area is positioned, and then the exposure is performed, and then the protective film of the photosensitive film belt is torn off.
[0034] The steps B of film lamination, C of horizontal exposure, D of development and forming, E of electrochemical deposition, and F of film stripping and etching are all processed simultaneously on the upper and lower surfaces of the substrate, so that the electrochemical deposition of metal patterns is completed on the upper and lower surfaces of the substrate at the same time.
[0035] like Figures 1 to 7 Shown is a schematic diagram of an embodiment of an apparatus for electrochemically depositing metal patterns provided by the present invention.
[0036] A device for electrochemically depositing metal patterns, comprising a film laminating device 1, an exposure device 2 connected to the film outlet end of the film laminating device 1, a developing device 3 connected to the film outlet end of the exposure device 2, a metal deposition device 4 connected to the film outlet end of the developing device 3, a film stripping and etching device 5 connected to the film outlet end of the metal deposition device 4, and a cleaning device 6 connected to the film stripping and etching device 5; the film laminating device 1 includes a conductive belt 8 extending along a conveying direction and capable of being respectively attached to both sides of the surface of a substrate 7 on which a metal pattern is to be deposited.
[0037] The film laminating device 1 includes a film laminating roller group 9 whose extending direction is perpendicular to the conveying direction of the substrate 7 .
[0038] The conductive tape 8 is copper foil or aluminum foil or other metal tape with good conductivity, with a thickness of 25-100 μm and a width of 5-20 mm.
[0039] The exposure device 2 includes a roll-to-roll film tearing assembly provided at the film outlet end of the exposure device 2 , which is used to collect the protective film torn off from the photosensitive film 14 .
[0040] The metal deposition equipment 4 includes a metal deposition tank 10, a deposition transmission component 11 arranged in the middle of the metal deposition tank 10, a cathode fixing component 12 fixedly connected to the conductive belt 8, and an anode component 13 horizontally arranged at the upper and lower parts of the metal deposition tank 10.
[0041] The deposition transmission assembly 11 includes a conveying roller unit arranged under the substrate 7 and an upper pressure roller unit arranged under the substrate 7; the conveying roller unit is composed of an active conveying roller 15 and a driven conveying roller 16 arranged along the conveying direction; the upper pressure roller unit is composed of several upper pressure rollers 17 arranged along the conveying direction.
[0042] Example:
[0043] Take the production of metal grid electrodes on the surface of solar cells as an example.
[0044] The solar cell (i.e., substrate 7) is transported in a horizontal conveying manner, and the conductive tape 8 and photosensitive film 14 are laminated to the upper and lower surfaces of the solar cell via a laminating roller 9 to form a solar cell string. After lamination, the solar cell is horizontally conveyed to an exposure device 2. The exposure machine automatically positions the solar cell and then exposes it on both sides in the area where the solar cell is located to complete the pattern transfer. After exposure, the solar cell is horizontally conveyed to a developing device 3 for double-sided development to develop the required grid line pattern. The solar cell is then horizontally conveyed to a metal deposition device 4, and the entire string of solar cells is connected using a cathode fixing assembly 12. In addition to providing conductivity, the cathode fixing assembly 12 can also serve as a guide. On the horizontal metal deposition device, through electrochemical deposition, the solar cell with the conductive tape 8 attached on both sides acts as a cathode, and forms a conductive closed loop with the anode assembly 13 on the horizontal device, and the desired copper metal is deposited in the grid line pattern area of the solar cell. Finally, the dry film on the solar cell is removed by a film stripping and etching device 5, and the conductive tape 8 is recovered. Finally, the solar cell is cleaned and dried in a cleaning device 6.
Claims
1. A method for electrochemically depositing a metal pattern, characterized in that: Its specific steps include A. Horizontal arrangement: Arrange the substrates horizontally in sequence along the conveying direction; B. Laminating the films into strings: Laminating the conductive tape and the photosensitive film tape onto the substrates processed by the horizontal arrangement in step A, so that the substrates are arranged into strings; C. Horizontal exposure: After the substrate is laminated in step B, each substrate area is exposed to complete the pattern transfer; D. Development and Forming: Horizontally develop the substrate subjected to the horizontal exposure treatment in step C, and form a dry film with a hollow pattern to be electrochemically deposited on the substrate with the photosensitive film belt; E. Electrochemical Deposition: The substrate developed and formed in step D is horizontally fed into an electrochemical deposition apparatus, and a conductive tape is connected to the cathode of the electrochemical deposition apparatus and the anode of the electrochemical deposition apparatus to form a conductive closed loop for horizontal electrochemical deposition; F. Stripping and etching: removing the dry film from the substrate treated by electrochemical deposition in step E and recovering the conductive tape; G. Cleaning the finished product: Clean and dry the substrate that has been stripped and etched in step F.
2. The method for electrochemically depositing a metal pattern according to claim 1, wherein: The specific method of affixing the films in a string in step B is to affix two conductive tapes extending along the conveying direction to both sides of the substrate surface, and then affix the photosensitive film tape to the substrate surface to cover the substrate and the conductive tape; or, the specific method of affixing the films in a string is to affix the conductive tape and the photosensitive film tape to the substrate surface at the same time, the photosensitive film tape completely covers the substrate, the conductive tape is located between the photosensitive film tape and the substrate, and the two conductive tapes extending along the conveying direction are affixed to both sides of the substrate surface; the contact width between the conductive tape and the substrate is less than 1.5 mm.
3. The method for electrochemically depositing a metal pattern according to claim 1, wherein: The specific method of the horizontal exposure in step C is that the substrate is horizontally transferred to the exposure device, the exposure area is positioned, and then the exposure is performed, and then the protective film of the photosensitive film belt is torn off.
4. A method for electrochemically depositing a metal pattern according to any one of claims 1 to 3, characterized in that: The steps B of film lamination, C of horizontal exposure, D of development and forming, E of electrochemical deposition, and F of film stripping and etching are all processed simultaneously on the upper and lower surfaces of the substrate, so that the electrochemical deposition of metal patterns is completed on the upper and lower surfaces of the substrate at the same time.
5. An apparatus for applying the method for electrochemically depositing metal patterns according to any one of claims 1 to 4, characterized in that: It includes a film laminating device, an exposure device connected to the film outlet end of the film laminating device, a developing device connected to the film outlet end of the exposure device, a metal deposition device connected to the film outlet end of the developing device, a film stripping and etching device connected to the film outlet end of the metal deposition device, and a cleaning device connected to the film stripping and etching device; the film laminating device includes a conductive belt extending along the conveying direction and capable of being respectively attached to both sides of the surface of the metal pattern substrate to be deposited.
6. The device for electrochemically depositing metal patterns according to claim 5, characterized in that: The film laminating device comprises a film pressing roller group whose extending direction is perpendicular to the conveying direction of the substrate.
7. The device for electrochemically depositing metal patterns according to claim 5, characterized in that: The conductive tape is copper foil or aluminum foil or other metal tape with good conductivity, with a thickness of 25-100 μm and a width of 5-20 mm.
8. The device for electrochemically depositing metal patterns according to claim 5, characterized in that: The exposure device includes a roll-to-roll film tearing assembly arranged at the film output end of the exposure device.
9. The device for electrochemically depositing metal patterns according to any one of claims 5 to 8, characterized in that: The metal deposition equipment includes a metal deposition tank, a deposition transmission component arranged in the middle of the metal deposition tank, a cathode fixing component fixedly connected to the conductive belt, and an anode component horizontally arranged at the upper and lower parts of the metal deposition tank.
Citation Information
Patent Citations
Equipment for electrochemically depositing metal patterns
CN214477514U