Radiation detection module, radiation detector, and method for manufacturing radiation module

Abstract

The radiation detection module of the embodiment includes: an array substrate having a plurality of photoelectric conversion units; a scintillator disposed on the plurality of photoelectric conversion units; a frame-shaped sealing unit containing a thermoplastic resin as a main component, disposed around the scintillator and bonded to the array substrate and the scintillator; and a moisture-proof unit covering the top of the scintillator and bonded to the outer surface of the sealing unit near the periphery. The outer surface of the sealing unit is in the shape of a curved surface protruding outward.

Description

Technical Field

[0001] Embodiments of the present invention relate to a radiation detection module, a radiation detector, and a method for manufacturing the radiation detection module. Background Art

[0002] As an example of a radiation detector, there is an X-ray detector. The X-ray detector is provided with a scintillator and an array substrate. The scintillator converts X-rays into fluorescence, and the array substrate converts the fluorescence into an electrical signal. In addition, in order to improve the utilization efficiency of the fluorescence and improve the sensitivity characteristics, a reflective layer is sometimes provided on the scintillator.

[0003] Here, in order to suppress the degradation of characteristics due to water vapor, etc., it is necessary to isolate the scintillator and the reflective layer from the external environment. For example, when the scintillator includes CsI (cesium iodide): Tl (thallium) or CsI: Na (sodium), etc., the degradation of characteristics due to water vapor, etc. may be aggravated.

[0004] Therefore, as a structure capable of obtaining high moisture-proof performance, a technique has been proposed in which a scintillator and a reflective layer are covered with a hat-shaped moisture-proof portion and a flange (eaves) portion of the moisture-proof portion is bonded to an array substrate.

[0005] However, when the flange of the moisture-proof part is bonded to the array substrate, a space is required for bonding the flange to the periphery of the scintillator. In recent years, people hope to achieve miniaturization of X-ray detectors, but if a cap-shaped moisture-proof part is provided, miniaturization of the X-ray detector may not be achieved.

[0006] In addition, if a large amount of X-rays are irradiated to the human body, it will have an adverse effect on health. Therefore, it is necessary to suppress the amount of X-rays irradiated to the human body to the required minimum. Therefore, in the case of an X-ray detector used for medical treatment, the intensity of the irradiated X-rays may be small, so the intensity of the X-rays passing through the moisture-proof part may be very small. In this case, if the thickness of the moisture-proof part is reduced, the intensity of the X-rays passing through can be increased. However, if the thickness of the hat-shaped moisture-proof part is reduced, cracks are easily generated when the foil of aluminum or the like is formed into a hat shape.

[0007] Therefore, it is desired to develop a technology that can achieve miniaturization of the X-ray detector and reduce the thickness of the moisture-proof portion.

[0008] Prior art literature

[0009] Patent Literature

[0010] Patent Document 1: Japanese Patent Application Publication No. 2009-128023 Summary of the invention

[0011] Technical problem to be solved by the invention

[0012] An object of the present invention is to provide a radiation detection module, a radiation detector, and a method for manufacturing the radiation detection module, which can realize miniaturization of the radiation detector and reduce the thickness of the moisture-proof portion.

[0013] Technical solutions adopted to solve technical problems

[0014] The radiation detection module of the embodiment includes: an array substrate having a plurality of photoelectric conversion units; a scintillator disposed on the plurality of photoelectric conversion units; a frame-shaped sealing unit, the sealing unit including a thermoplastic resin as a main component, disposed around the scintillator and bonded to the array substrate and the scintillator; and a moisture-proof unit covering the top of the scintillator and bonded to the outer surface of the sealing unit near the periphery. The outer surface of the sealing unit is in the shape of a curved surface protruding outward. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic perspective view for illustrating the X-ray detector and the X-ray detection module according to the present embodiment.

[0016] Figure 2 It is a schematic cross-sectional view for illustrating an X-ray detection module.

[0017] Figure 3 is a block diagram of an X-ray detector.

[0018] Figure 4 (a) Figure 4 (b) is a schematic cross-sectional view for illustrating an X-ray detection module according to another embodiment.

[0019] Figure 5 This is a schematic cross-sectional view for illustrating an X-ray detection module according to still another embodiment.

[0020] Figure 6 (a) is a schematic plan view of the moisture-proof portion. Figure 6 (b) is a schematic three-dimensional view of the moisture-proof portion 17.

[0021] Figure 7 This is a schematic cross-sectional view for illustrating an X-ray detection module according to still another embodiment.

[0022] Figure 8 This is a schematic cross-sectional view for illustrating an X-ray detection module according to yet another embodiment.

[0023] Fig. 9 (a) Fig. 9(b) is a schematic cross-sectional view for illustrating a bending portion according to still another embodiment.

[0024] Fig.10 It is a schematic cross-sectional view for illustrating an X-ray detection module of a comparative example.

[0025] Fig.11 It is a schematic cross-sectional view for illustrating an X-ray detection module of a comparative example.

[0026] Fig.12 It is a schematic cross-sectional view for illustrating an X-ray detection module of a comparative example.

[0027] Fig.13 It is a schematic cross-sectional view for illustrating an X-ray detection module of a comparative example.

[0028] Fig.14 This is a schematic perspective view for illustrating the application of a thermoplastic resin in a comparative example.

[0029] Fig.15 This is a schematic perspective view for illustrating the application of the thermoplastic resin according to the present embodiment. DETAILED DESCRIPTION

[0030] Hereinafter, the embodiments will be described with reference to the accompanying drawings. In addition, in each of the drawings, the same components are denoted by the same reference numerals, and detailed descriptions thereof will be appropriately omitted.

[0031] In addition, the radiation detector of the embodiment of the present invention can be applied to various radiations such as gamma rays in addition to X-rays. Here, as an example, the case of X-rays, which are representative rays among radiations, is described. Therefore, by replacing "X-rays" in the following embodiments with "other radiations", the radiation detector can also be applied to other radiations.

[0032] Furthermore, the radiation detector can be used, for example, in general medicine, etc. However, the use of the radiation detector is not limited to general medicine.

[0033] (X-ray detector and X-ray detection module)

[0034] Figure 1 It is a schematic perspective view for illustrating the X-ray detector 1 and the X-ray detection module 10 according to the present embodiment.

[0035] In order to avoid complexity, Figure 1 In the figure, the protective layer 2f, the reflective layer 6, the moisture-proof portion 7, the sealing portion 8, etc. are omitted.

[0036] Figure 2It is a schematic cross-sectional view for illustrating the X-ray detection module 10 .

[0037] Figure 3 is a block diagram of the X-ray detector 1 .

[0038] like Figure 1 and Figure 2 As shown, an X-ray detection module 10 and a circuit substrate 11 are provided in the X-ray detector 1. In addition, a frame (not shown) can be provided in the X-ray detector 1. The X-ray detection module 10 and the circuit substrate 11 can be provided inside the frame. For example, a plate-shaped support plate 12 can be provided inside the frame, the X-ray detection module 10 can be provided on the surface of the support plate 12 on the incident side of the X-rays, and the circuit substrate 11 can be provided on the surface of the support plate 12 on the opposite side of the incident side of the X-rays.

[0039] The X-ray detection module 10 is provided with an array substrate 2 , a scintillator 5 , a reflective layer 6 , a moisture-proof portion 7 , and a sealing portion 8 .

[0040] The array substrate 2 includes a substrate 2a, a photoelectric conversion unit 2b, a control line (or a gate line) 2c1, a data line (or a signal line) 2c2, a wiring pad 2d1, a wiring pad 2d2, and a protective layer 2f.

[0041] In addition, the number of photoelectric conversion parts 2b, control lines 2c1, and data lines 2c2 is not limited to the number shown as an example.

[0042] The substrate 2a is plate-shaped and is formed of glass such as alkali-free glass. The planar shape of the substrate 2a can be set to a quadrilateral. The thickness of the substrate 2a can be set to about 0.7 mm, for example.

[0043] A plurality of photoelectric conversion parts 2b are provided on one surface side of the substrate 2a.

[0044] The photoelectric converter 2b has a rectangular shape and is provided in a region partitioned by the control line 2c1 and the data line 2c2. A plurality of photoelectric converters 2b can be arranged in a matrix. In addition, one photoelectric converter 2b corresponds to one pixel of an X-ray image.

[0045] Each of the plurality of photoelectric conversion sections 2b is provided with a photoelectric conversion element 2b1 and a thin film transistor (TFT; Thin Fil Transistor) 2b2 which is a switching element.

[0046] In addition, a storage capacitor (not shown) can be provided, which stores the signal charge converted in the photoelectric conversion element 2b1. The storage capacitor can be, for example, in the form of a rectangular plate, and is provided under each thin film transistor 2b2. However, depending on the capacity of the photoelectric conversion element 2b1, the photoelectric conversion element 2b1 can also serve as a storage capacitor.

[0047] The photoelectric conversion element 2 b 1 can be provided as a photodiode or the like, for example.

[0048] The thin film transistor 2b2 switches between storing charge in the storage capacitor and releasing charge from the storage capacitor. The thin film transistor 2b2 has a gate electrode, a drain electrode, and a source electrode. The gate electrode of the thin film transistor 2b2 is electrically connected to the corresponding control line 2c1. The drain electrode of the thin film transistor 2b2 is electrically connected to the corresponding data line 2c2. The source electrode of the thin film transistor 2b2 is electrically connected to the corresponding photoelectric conversion element 2b1 and the storage capacitor. In addition, the anode side of the photoelectric conversion element 2b1 and the storage capacitor can be grounded. In addition, the anode side of the photoelectric conversion element 2b1 and the storage capacitor can also be connected to a bias line not shown.

[0049] A plurality of control lines 2c1 are provided in parallel with each other at predetermined intervals. The control lines 2c1 extend, for example, in the row direction. One control line 2c1 is electrically connected to one of the plurality of wiring pads 2d1 provided near the periphery of the substrate 2a. One of the plurality of wiring lines provided on the flexible printed substrate 2e1 is electrically connected to one wiring pad 2d1. The other ends of the plurality of wiring lines provided on the flexible printed substrate 2e1 are electrically connected to the reading circuit 11a provided on the circuit substrate 11, respectively.

[0050] A plurality of data lines 2c2 are provided in parallel with each other at predetermined intervals. The data lines 2c2 extend, for example, in a column direction orthogonal to the row direction. One data line 2c2 is electrically connected to one of the plurality of wiring pads 2d2 provided near the periphery of the substrate 2a. One of the plurality of wiring lines provided on the flexible printed substrate 2e2 is electrically connected to one wiring pad 2d2. The other ends of the plurality of wiring lines provided on the flexible printed substrate 2e2 are electrically connected to the signal detection circuit 11b provided on the circuit substrate 11.

[0051] The control line 2c1 and the data line 2c2 can be formed using a low-resistance metal such as aluminum or chromium.

[0052] The protective layer 2f covers the photoelectric conversion unit 2b, the control line 2c1, and the data line 2c2. The protective layer 2f can be formed of an insulating material, such as an oxide insulating material, a nitride insulating material, an oxynitride insulating material, and a resin.

[0053] The scintillator 5 is provided on the plurality of photoelectric converters 2b and converts incident X-rays into visible light, ie, fluorescence. The scintillator 5 can be provided so as to cover the region (effective pixel region A) on the substrate 2a where the plurality of photoelectric converters 2b are provided.

[0054] The scintillator 5 may include, for example, cesium iodide (CsI): thallium (Tl), sodium iodide (NaI): thallium (Tl), or cesium bromide (CsBr): europium (Eu). The scintillator 5 may be formed by vacuum evaporation. If the scintillator 5 is formed by vacuum evaporation, a scintillator 5 composed of a plurality of columnar crystals is formed. The thickness of the scintillator 5 may be, for example, about 600 μm.

[0055] In addition, when the scintillator 5 is formed by vacuum evaporation, a mask having an opening is used. In the above case, the scintillator 5 is formed at a position opposite to the opening on the array substrate 2 (above the effective pixel area A). In addition, the film formed by evaporation is also formed on the surface of the mask. In addition, near the opening of the mask, the film grows in a manner that gradually extends into the inside of the opening. If the film extends into the inside of the opening, evaporation onto the array substrate 2 is suppressed near the opening. Therefore, if Figure 1 and Figure 2 As shown, the thickness of the scintillator 5 near the periphery gradually decreases toward the outside.

[0056] The scintillator 5 may also be formed using, for example, terbium activated gadolinium sulfate (Gd2O2S / Tb or GOS). In the above case, a matrix of grooves may be provided so that a quadrangular prism-shaped scintillator 5 is provided in each of the plurality of photoelectric conversion parts 2b.

[0057] The reflective layer 6 is provided to improve the utilization efficiency of the fluorescence and to improve the sensitivity characteristics. That is, the reflective layer 6 is provided to reflect the light of the fluorescence generated in the scintillator 5 that is directed to the side opposite to the side where the photoelectric conversion unit 2b is provided and to direct it toward the photoelectric conversion unit 2b. However, the reflective layer 6 is not necessarily required and can be provided according to the sensitivity characteristics required by the X-ray detection module 10.

[0058] Hereinafter, a case where the reflective layer 6 is provided will be described as an example.

[0059] The reflective layer 6 is provided on the X-ray incident side of the scintillator 5. The reflective layer 6 covers at least the upper surface of the scintillator 5. The reflective layer 6 can further cover the side surface 5a of the scintillator 5.

[0060] For example, a material obtained by mixing light scattering particles made of titanium oxide (TiO 2 ) or the like, a resin, and a solvent can be applied onto the scintillator 5 and dried to form the reflective layer 6 .

[0061] Furthermore, for example, the reflective layer 6 can be formed by forming a layer made of a metal having a high light reflectivity, such as a silver alloy or aluminum, on the scintillator 5 .

[0062] Furthermore, for example, the reflective layer 6 can be formed by providing a sheet having a surface made of a metal with high light reflectivity such as silver alloy or aluminum, or a resin sheet including light scattering particles, on the scintillator 5 .

[0063] In addition, when a paste-like material is applied to the scintillator 5 and dried, the material shrinks as it dries, so the scintillator 5 is pulled, and sometimes the scintillator 5 is peeled off from the array substrate 2. Therefore, it is more desirable to provide a sheet-like reflective layer 6 on the scintillator 5. In this case, the sheet-like reflective layer 6 can also be bonded to the scintillator 5 using, for example, a double-sided tape, but it is more desirable to place the sheet-like reflective layer 6 on the scintillator 5. If the sheet-like reflective layer 6 is placed on the scintillator 5, it becomes easier to suppress the peeling of the scintillator 5 from the array substrate 2 caused by the expansion or contraction of the reflective layer 6.

[0064] The moisture-proof portion 7 is provided to suppress the degradation of the characteristics of the reflective layer 6 or the characteristics of the scintillator 5 due to moisture contained in the air.

[0065] The moisture-proof part 7 covers at least a part of the scintillator 5 and the sealing part 8. There may be a gap between the moisture-proof part 7 and the reflective layer 6, etc., or the moisture-proof part 7 may be in contact with the reflective layer 6, etc. For example, if the moisture-proof part 7 and the sealing part 8 are joined in an environment where the air pressure is reduced to a pressure lower than the atmospheric pressure, the moisture-proof part 7 and the reflective layer 6, etc. can be in contact. In addition, generally speaking, there are gaps of about 10% to 40% of the volume of the scintillator 5. Therefore, if gas is contained in the gaps, when the X-ray detector 1 is transported by an aircraft, etc., the gas expands and may damage the moisture-proof part 7. If the moisture-proof part 7 and the sealing part 8 are joined in an environment where the air pressure is reduced to a pressure lower than the atmospheric pressure, even when the X-ray detector 1 is transported by an aircraft, etc., the moisture-proof part 7 can be prevented from being damaged. That is, it is more desirable that the pressure of the space divided by the sealing part 8 and the moisture-proof part 7 is lower than the atmospheric pressure.

[0066] Here, there are cases where there are bubbles or voids inside the sealing part 8, there is a gap or leakage path between the sealing part 8 and the moisture-proof part 7, or there is a gap or leakage path between the sealing part 8 and the array substrate 2. In the above case, when the moisture-proof part 7 and the sealing part 8 are joined in an environment where the air pressure is reduced to a pressure lower than the atmospheric pressure and then returned to the atmospheric pressure environment, the atmosphere will enter the interior through the gap or leakage path. If the atmosphere enters the interior, the moisture-proof part 7 and the scintillator 5 will not be in close contact, so that wrinkles will be generated on the surface of the moisture-proof part 7, or the tension will disappear. Therefore, the existence of the gap or leakage path can be easily found with the naked eye. The life of the product with a gap or leakage path may be shortened, but in the process of inspecting such a product, such a product can be easily found and removed. Therefore, it becomes easy to improve the quality of the X-ray detector 1.

[0067] The moisture-proof part 7 can be provided as a sheet material containing metal. The metal can be, for example, aluminum-containing metal, copper-containing metal, magnesium-containing metal, tungsten-containing metal, stainless steel, kovar material, etc. In the above case, if the moisture-proof part 7 containing metal is provided, the moisture that passes through the moisture-proof part 7 can be almost completely eliminated.

[0068] In addition, the moisture-proof portion 7 can also be configured as a laminated sheet laminated with a resin film and a metal film. In the above case, the resin film can be formed, for example, by polyimide resin, epoxy resin, polyethylene terephthalate resin, Teflon (registered trademark), low-density polyethylene, high-density polyethylene, elastic rubber, etc. The metal film can be configured, for example, as a metal film containing the above-mentioned metal. The metal film can be formed, for example, by sputtering, lamination, etc. In the above case, it is more desirable that the metal film is disposed on one side of the scintillator 5. In this way, the metal film can be covered by the resin film, and therefore, the situation that the metal film is damaged by the action of external force, etc. can be suppressed. In addition, if the metal film is disposed on the inner side (on the scintillator 5 side) than the resin film, the situation that the characteristics of the scintillator 5 are deteriorated due to the penetration of water through the resin layer can be suppressed.

[0069] In addition, an inorganic film may be provided instead of the metal film or together with the metal film. The inorganic film may be provided as a film containing silicon oxide, aluminum oxide, etc. The inorganic film may be formed using a sputtering method, etc., for example.

[0070] In the case of a laminated sheet including a metal film, for example, a resin film having a thickness substantially the same as that of the metal film can be used. If a resin film having such a thickness as described above is provided, the rigidity of the moisture-proof portion 7 can be increased, and thus, pinholes can be suppressed from being generated in the moisture-proof portion 7 during the manufacturing process. In addition, generally speaking, since the linear expansion coefficient of the resin is greater than the linear expansion coefficient of the metal, if the thickness of the resin film is excessively increased, the warping of the array substrate 2 described later is likely to occur. Therefore, it is desirable that the thickness of the resin film is set to be less than the thickness of the metal film.

[0071] In addition, the thickness of the moisture-proof part 7 can be determined by considering the absorption of X-rays or rigidity, etc. In the above case, if the thickness of the moisture-proof part 7 is increased, the amount of X-rays absorbed by the moisture-proof part 7 increases. On the other hand, if the thickness of the moisture-proof part 7 is reduced, the rigidity decreases and it is easy to be damaged.

[0072] For example, if the thickness of the moisture-proof portion 7 is set to be less than 10 μm, the rigidity of the moisture-proof portion 7 becomes too low, and pinholes may be generated due to damage caused by external forces, thereby possibly causing leakage. If the thickness of the moisture-proof portion 7 is greater than 50 μm, the rigidity of the moisture-proof portion 7 becomes too large, and the tracking property of the concave and convex of the upper end of the scintillator 5 will deteriorate. Therefore, the confirmation of the above-mentioned gap and the leakage path may become difficult. In addition, the array substrate 2 described later may be prone to warping.

[0073] Therefore, it is desirable that the thickness of the moisture-proof portion 7 is not less than 10 μm and not more than 50 μm.

[0074] In the above case, the moisture-proof part 7 can be set to, for example, an aluminum foil with a thickness of 10 μm or more and 50 μm or less. If the thickness of the aluminum foil is 10 μm or more and 50 μm or less, the amount of X-ray transmission can be increased by about 20% to 30% compared with an aluminum foil with a thickness of 100 μm. In addition, if the aluminum foil is set to a thickness of 10 μm or more and 50 μm or less, the above leakage can be suppressed, and the above gap and the confirmation of the leakage path become easy. In addition, the warping of the array substrate 2 described later can be suppressed.

[0075] Here, if a large amount of X-rays are irradiated to the human body, it will have an adverse effect on health, so the amount of X-rays irradiated to the human body can be suppressed to the required minimum. Therefore, in the case of the X-ray detector 1 used for medical treatment, the intensity of the irradiated X-rays may be small, and the intensity of the X-rays passing through the moisture-proof part 7 may be very small. Since the moisture-proof part 7 of the present embodiment is set as a sheet with a thickness of 10 μm or more and 50 μm or less, it is possible to capture X-ray images even when the intensity of the irradiated X-rays is small.

[0076] In the above case, if the thickness of the moisture-proof portion 7 is reduced, the rigidity of the moisture-proof portion 7 is reduced. Therefore, if a flange portion is provided to form a three-dimensional moisture-proof portion, cracks are likely to occur when, for example, the metal foil is press-formed. Figure 2 As shown, the periphery of the sheet-shaped moisture-proof portion 7 is bonded to the outer surface 8a of the sealing portion 8. Therefore, it is not necessary to process the moisture-proof portion 7 into a three-dimensional shape in advance, and the sheet-shaped moisture-proof portion 7 can be directly bonded to the outer surface 8a of the sealing portion 8. As a result, even if the thickness of the moisture-proof portion 7 is set to be 10 μm or more and 50 μm or less, it is possible to suppress the occurrence of cracks in the moisture-proof portion 7.

[0077] In addition, as described later, the periphery of the moisture-proof portion 7 is joined to the sealing portion 8 by heating the periphery of the moisture-proof portion 7. In the above case, if the temperature near the periphery of the moisture-proof portion 7 and the temperature of the sealing portion 8 are reduced, thermal stress is generated between the periphery of the moisture-proof portion 7 and the sealing portion 8. If thermal stress is generated between the periphery of the moisture-proof portion 7 and the sealing portion 8, peeling may occur between the periphery of the moisture-proof portion 7 and the sealing portion 8. If peeling occurs, the moisture-proof performance may be significantly reduced. Since the thickness of the moisture-proof portion 7 is more than 10μm and less than 50μm, the moisture-proof portion 7 becomes easy to extend when thermal stress is generated. Therefore, since the thermal stress can be relieved, the situation of peeling between the periphery of the moisture-proof portion 7 and the sealing portion 8 can be suppressed.

[0078] like Figure 2 As shown, the sealing portion 8 is bonded to the side surface 5a of the scintillator 5 and the array substrate 2. In the above case, the sealing portion 8 can be in close contact with the side surface 5a of the scintillator 5. In the case where the scintillator 5 is constituted as an aggregate of a plurality of columnar crystals, a concave-convex portion is formed on the side surface 5a of the scintillator 5. Therefore, if a part of the sealing portion 8 is disposed inside the concave-convex portion of the side surface 5a of the scintillator 5, the bonding strength between the sealing portion 8 and the scintillator 5 can be increased. The sealing portion 8 can be in close contact with the array substrate 2. If the sealing portion 8 is in close contact with the array substrate 2, it is possible to suppress the moisture contained in the atmosphere from penetrating between the sealing portion 8 and the array substrate 2 and reaching the scintillator 5.

[0079] The shape of the outer surface 8a of the sealing portion 8 can be set to a curved surface protruding outward. In this way, the distance L between the outer surface 8a of the sealing portion 8 and the side surface 5a of the scintillator 5 can be increased. Therefore, it is possible to suppress the moisture contained in the atmosphere from penetrating the inside of the sealing portion 8 and reaching the scintillator 5.

[0080] Furthermore, if the shape of the outer surface 8a of the sealing portion 8 is configured as a curved surface protruding outward, it is easy to make the vicinity of the peripheral edge of the moisture-proof portion 7 follow the outer surface 8a of the sealing portion 8. Therefore, it is easy to make the moisture-proof portion 7 and the sealing portion 8 close to each other. In addition, since the moisture-proof portion 7 can be deformed smoothly, even if the thickness of the moisture-proof portion 7 is reduced, it is possible to suppress the occurrence of cracks in the moisture-proof portion 7.

[0081] In addition, it is ideal if Figure 2 As shown, when the moisture-proof part 7 and the sealing part 8 are closely attached, the peripheral end surface 7a of the moisture-proof part 7 is in contact with the array substrate 2, or the peripheral end surface 7a is located near the array substrate 2. In this way, it is possible to effectively prevent moisture contained in the atmosphere from entering the interior of the sealing part 8.

[0082] In addition, it is desirable that the height of the sealing portion 8 is set to be lower than the height of the scintillator 5. If the height of the sealing portion 8 is set to be lower than the height of the scintillator 5, the sheet material constituting the moisture-proof portion 7 will not be excessively deformed, and thus wrinkles, breaks, pinholes, etc., can be suppressed from occurring in the moisture-proof portion 7.

[0083] In addition, if the height of the sealing portion 8 is lower than the height of the scintillator 5, the vicinity of the periphery of the moisture-proof portion 7 can be bent. If the vicinity of the periphery of the moisture-proof portion 7 can be bent, the difference between the amount of heat shrinkage of the moisture-proof portion 7 and the amount of heat shrinkage of the array substrate 2 can be absorbed. Therefore, the deformation of the array substrate 2 under the action of thermal stress can be suppressed.

[0084] The details of making the height of the sealing portion 8 lower than the height of the scintillator 5 will be described later (see Figure 8 ).

[0085] The sealing portion 8 can be configured to include a thermoplastic resin as a main component. If the sealing portion 8 includes a thermoplastic resin as a main component, the sealing portion 8 can be bonded to the array substrate 2, the scintillator 5, and the moisture-proof portion 7 by heating. Here, for example, if the sealing portion 8 includes an ultraviolet curing resin as a main component, it is necessary to irradiate ultraviolet rays when bonding the sealing portion 8 to the array substrate 2, the scintillator 5, and the moisture-proof portion 7. However, since the moisture-proof portion 7 includes metal, etc., it is impossible to allow ultraviolet rays to pass through. In addition, if the moisture-proof portion 7 is configured to be able to transmit ultraviolet rays, the scintillator 5 may change color under the action of ultraviolet rays, and the generated fluorescence may be absorbed.

[0086] In contrast, since the sealing portion 8 contains a thermoplastic resin as a main component, it can be easily joined by heating. In addition, the scintillator 5 will not change color under the action of ultraviolet rays. In addition, since the time required for heating and cooling the sealing portion 8 is short, the manufacturing time can be shortened, and the manufacturing cost can be reduced.

[0087] Thermoplastic resins may be, for example, nylon, PET (polyethylene terephthalate), polyurethane, polyester, polyvinyl chloride, ABS (acrylonitrile butadiene styrene), acrylic, polystyrene, polyethylene, polypropylene, etc. In the above case, the water vapor permeability coefficient of polyethylene is 0.068 g·mm / day·m 2 The water vapor permeability coefficient of polypropylene is 0.04g·mm / day·m 2. Therefore, if the sealing portion 8 contains at least one of polyethylene and polypropylene as a main component, the amount of water that penetrates the inside of the sealing portion 8 and reaches the scintillator 5 can be significantly reduced.

[0088] The rigidity of the thermoplastic resin can be set lower than the rigidity of the moisture-proof portion 7 .

[0089] In addition, the sealing portion 8 can also include a filler using an inorganic material. If the filler formed of an inorganic material is included in the sealing portion 8, the penetration of moisture can be further suppressed. The inorganic material can be set to, for example, talc, graphite, mica, kaolin (clay whose main component is kaolinite), etc. The filler can be set to have a flat shape, for example. The diffusion of moisture entering the inside of the sealing portion 8 from the outside is hindered by the filler formed of an inorganic material, and therefore, the speed at which moisture passes through the sealing portion 8 can be reduced. Therefore, the amount of moisture reaching the scintillator 5 can be reduced.

[0090] Here, the X-ray detector 1 stored in a high temperature and high humidity environment is sometimes used in an environment with a lower temperature. In this case, water vapor inside the frame sometimes condenses and adheres to the surface of the X-ray detector 1. If there are fine cracks on the outer surface 8a of the sealing portion 8, the moisture attached to the surface may enter the cracks and be guided into the interior of the sealing portion 8. In addition, the X-ray detector 1 is sometimes transported in an environment below the freezing point, causing the moisture entering the cracks to freeze. If the moisture entering the cracks freezes, the volume will increase, so the cracks will become larger and moisture will enter more easily. If the above situation occurs repeatedly, the sealing portion 8 may be damaged, the moisture-proof portion 7 and the sealing portion 8 may be peeled off, and the array substrate 2 and the sealing portion 8 may be peeled off.

[0091] In addition, it is preferable that at least the outer surface 8a of the sealing portion 8 has water repellency. If at least the outer surface 8a of the sealing portion 8 has water repellency, it is possible to suppress the intrusion of moisture into the cracks.

[0092] For example, a water repellent may be applied to the outer surface 8a of the sealing portion 8. In addition, if the sealing portion 8 contains at least one of polyethylene and polypropylene as a main component, the outer surface 8a having water repellency can be provided.

[0093] In addition, it is desirable to observe the inside of the thermoplastic resin immediately after the thermoplastic resin is coated in a frame shape to confirm the presence of bubbles, foreign matter, leakage paths, etc. If the above-mentioned confirmation can be performed with the naked eye or using an optical microscope, the production efficiency can be improved. Therefore, it is desirable that the thermoplastic resin coated in a frame shape is also transparent at the part with the largest thickness. That is, it is desirable that the sealing portion 8 is set to have light transmittance. In this way, it is easy to remove products whose service life may be shortened due to the presence of bubbles, foreign matter, leakage paths, etc. Therefore, the quality of the product can be improved.

[0094] Next, return Figure 1 The circuit board 11 will be described.

[0095] like Figure 1 As shown, the circuit substrate 11 is disposed on the side of the array substrate 2 opposite to the side where the scintillator 5 is disposed. The circuit substrate 11 is electrically connected to the X-ray detection module 10 (array substrate 2).

[0096] like Figure 3 As shown, a reading circuit 11a and a signal detection circuit 11b are provided on the circuit substrate 11. In addition, these circuits may be provided on one substrate, or these circuits may be provided separately on a plurality of substrates.

[0097] The reading circuit 11 a switches the thin film transistor 2 b 2 between an on state and an off state.

[0098] The reading circuit 11 a includes a plurality of gate drivers 11 aa and a row selection circuit 11 ab .

[0099] The control signal S1 is input to the row selection circuit 11ab from an image processing unit (not shown) provided outside the X-ray detector 1. The row selection circuit 11ab inputs the control signal S1 to the corresponding gate driver 11aa according to the scanning direction of the X-ray image.

[0100] The gate driver 11 aa inputs a control signal S1 to the corresponding control line 2 c 1 .

[0101] For example, the reading circuit 11a sequentially inputs the control signal S1 to each of the control lines 2c1 through the flexible printed circuit board 2e1. The thin film transistor 2b2 is turned on by the control signal S1 input to the control line 2c1 and can receive the charge (image data signal S2) from the storage capacitor.

[0102] The signal detection circuit 11 b includes a plurality of integrating amplifiers 11 ba , a plurality of selection circuits 11 bb , and a plurality of AD converters 11 bc .

[0103] One integrating amplifier 11ba is electrically connected to one data line 2c2. The integrating amplifier 11ba sequentially receives the image data signal S2 from the photoelectric conversion unit 2b. In addition, the integrating amplifier 11ba integrates the current flowing in a certain time and outputs a voltage corresponding to the integrated value to the selection circuit 11bb. In this way, the value (charge amount) of the current flowing through the data line 2c2 in a predetermined time can be converted into a voltage value. That is, the integrating amplifier 11ba converts the image data information corresponding to the intensity distribution of the fluorescence generated in the scintillator 5 into potential information.

[0104] The selection circuit 11bb selects the integrating amplifier 11ba for reading, and sequentially reads the image data signal S2 converted into potential information.

[0105] The AD converter 11bc sequentially converts the read image data signal S2 into a digital signal. The image data signal S2 converted into a digital signal is input to the image processing unit via wiring. In addition, the image data signal S2 converted into a digital signal can also be sent to the image processing unit wirelessly.

[0106] The image processing unit forms an X-ray image based on the image data signal S2 converted into a digital signal. In addition, the image processing unit can also be integrated with the circuit board 11.

[0107] Another embodiment of an X-ray detection module will be described.

[0108] Figure 4 (a) Figure 4 (b) is a schematic cross-sectional view for illustrating an X-ray detection module 10a according to another embodiment.

[0109] As described below, the sealing portion 8 is formed by coating softened thermoplastic resin on the array substrate 2, or by 3D printing a thermoplastic resin in a frame shape on the array substrate 2. Therefore, the size of the sealing portion 8 may vary.

[0110] When the size of the sealing portion 8 deviates, the peripheral end surface 7a of the moisture-proof portion 7 may interfere with the array substrate 2, thereby generating wrinkles near the periphery of the moisture-proof portion 7. When wrinkles are generated near the periphery of the moisture-proof portion 7, the moisture-proof portion 7 may peel off.

[0111] In the above case, it is possible to Figure 4 As shown in (a), a distance H1 is provided between the peripheral end surface 17a of the moisture-proof portion 17 and the array substrate 2. For example, the size of the sheet-shaped moisture-proof portion 17 can be shortened. In this way, even if the size of the sealing portion 8 deviates, wrinkles or the like can be suppressed from being generated near the peripheral edge of the moisture-proof portion 17.

[0112] In the above case, if the distance H1 is too large, more water may enter the interior of the sealing portion 8. The inventors of the present application have found through actual observation that it is more ideal if Figure 4 The distance H1 shown in (b) is equal to or less than half of the height H2 of the sealing portion 8. In the above case, the smaller the distance H1 is, the less moisture enters the inside of the sealing portion 8.

[0113] Figure 5 This is a schematic cross-sectional view for illustrating an X-ray detection module 10 b according to still another embodiment.

[0114] Figure 6 (a) is a schematic plan view of the moisture-proof portion 17.

[0115] Figure 6 (b) is a schematic three-dimensional view of the moisture-proof portion 17.

[0116] like Figure 5 As shown, the moisture-proof portion 17 can also be bent near the periphery along the array substrate 2. That is, a bent portion 17b along the array substrate 2 can be provided at the periphery of the moisture-proof portion 17. In the above case, the bent portion 17b can also be bonded to the array substrate 2. In this way, the outer surface 8a of the sealing portion 8 can be covered by the moisture-proof portion 17, so that the entry of moisture into the interior of the moisture-proof portion 17 can be effectively suppressed. In addition, if the size of the bent portion 17b is too large, it may be impossible to miniaturize the X-ray detection module 10b and further miniaturize the X-ray detector 1. Therefore, it is ideal that the size of the bent portion 17b is set to, for example, less than 2 mm.

[0117] Furthermore, if the vicinity of the peripheral edge of the moisture-proof portion 17 is bent, the following problem will occur.

[0118] The moisture-proof portion 17 can use a sheet material without deformation and unevenness. If the sheet material forming the moisture-proof portion 17 is covered on the scintillator 5, the sheet material will float from the array substrate 2 by an amount equivalent to the thickness of the scintillator 5. It is relatively easy to bend the peripheral edge in this state along the sealing portion 8 toward the array substrate 2, and the tensile stress will hardly act on the sheet material.

[0119] However, it is geometrically impossible to bend the sheet into the same shape as the side at the corner of the frame-shaped seal portion 8. Therefore, it is necessary to stretch a part of the sheet so that the sheet is along the seal portion 8.

[0120] The moisture-proof part 17 is required to have a function of shielding moisture from the outside, but if a part of the sheet is stretched, the part becomes thinner, and fine cracks or pinholes may be generated. If cracks or pinholes are generated, the ability to shield moisture is reduced.

[0121] In the above case, if Figure 6 (a) Figure 6 As shown in (b), the geometric deformation can be absorbed by providing a convex portion 17c protruding outward at the corner of the moisture-proof portion 17. Therefore, it is possible to suppress the situation where a part of the sheet is stretched, thereby suppressing the situation where cracks or pinholes are generated.

[0122] Figure 7 This is a schematic cross-sectional view for illustrating an X-ray detection module 10c according to still another embodiment.

[0123] As mentioned above, the material of the array substrate 2, the material of the scintillator 5, the material of the moisture-proof part 7, and the material of the sealing part 8 are different. Therefore, they have different linear expansion coefficients. Here, heat is generated during the activation of the X-ray detection module 10c, so their temperatures become high. In addition, the temperature around the X-ray detector 1 sometimes changes. Therefore, thermal stress is generated between them corresponding to the temperature change. In the above case, if a tensile stress F is generated in the moisture-proof part 7, the tensile stress F may be applied to the joint portion between the moisture-proof part 7 and the sealing part 8, or the joint portion between the sealing part 8 and the array substrate 2, thereby causing peeling or cracking. If peeling or cracking occurs, moisture can easily reach the scintillator 5. In addition, deformations such as warping may also occur in the array substrate 2.

[0124] Therefore, in the X-ray detection module 10c of this embodiment, the recessed portion 8a1 is provided on the outer surface 8a of the sealing portion 8. If the recessed portion 8a1 is provided, the vicinity of the recessed portion 8a1 is easily deformed. Therefore, the generated tensile stress F can be relieved by the deformation of the vicinity of the recessed portion 8a1.

[0125] In addition, the portion of the moisture-proof portion 7 facing the recessed portion 8a1 may be provided with a flexure 7c. The flexure 7c is more easily elastically deformed than the portion of the moisture-proof portion 7 not provided with the flexure 7c. If the flexure 7c is provided, the generated tensile stress F can be relieved by elastically deforming the flexure 7c. In the above case, the flexure 7c may be brought into contact with the recessed portion 8a1, or the flexure 7c may be bent. Figure 7 As shown, a gap is provided between the flexure 7c and the recessed portion 8a1. If the flexure 7c is in contact with the recessed portion 8a1, the rigidity of the flexure 7c can be increased, so that cracks or pinholes can be suppressed from being generated in the flexure 7c. If a gap is provided between the flexure 7c and the recessed portion 8a1, the deformation of the flexure 7c becomes easy, so that the tension stress F becomes easy to relieve.

[0126] If the tensile stress F can be relieved, peeling or cracking of the moisture-proof portion 7 can be suppressed. In addition, deformation such as warping can be suppressed from occurring in the array substrate 2 .

[0127] In addition, it is also possible to Fig.15 As shown, a convex portion 18c is provided on the outer surface 8a of the sealing portion 8. The details of the convex portion 18c will be described later.

[0128] Figure 8 It is a schematic cross-sectional view for illustrating an X-ray detection module 10d according to still another embodiment.

[0129] like Figure 8 As shown, the height H3 of the sealing portion 8 can be set to be lower than the height H4 of the scintillator 5. If the height H3 of the sealing portion 8 is lower than the height H4 of the scintillator 5, the periphery of the moisture-proof portion 7 can be bent. That is, in this way, it becomes easy to set the flexure 7d near the periphery of the moisture-proof portion 7. The flexure 7d is more easily elastically deformed than the portion of the moisture-proof portion 7 where the flexure 7d is not set. If the flexure 7d is set, the same effect as the aforementioned flexure 7c can be obtained. That is, the tensile stress F generated can be alleviated by elastically deforming the flexure 7d, thereby suppressing the peeling, rupture, etc. of the moisture-proof portion 7, or the deformation such as warping on the array substrate 2.

[0130] For example, the linear expansion coefficient of the moisture-proof portion 7 made of aluminum foil is 23×10 －6 The linear expansion coefficient of the array substrate 2 is 4×10 －6 Therefore, if the temperature of the moisture-proof portion 7 fixed to the sealing portion 8 decreases, the moisture-proof portion 7 will shrink more significantly than the array substrate 2. In the above case, if the moisture-proof portion 7 is almost completely flat, the difference in shrinkage cannot be absorbed, and warping will occur in the array substrate 2. In contrast, if the flexure portions 7c and 7d are provided, the difference in shrinkage can be absorbed, and thus the occurrence of warping in the array substrate 2 can be suppressed.

[0131] In this case, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 can be set to be greater than the thickness of the moisture-proof portion 7. For example, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 can be set to be greater than 0.1 mm. On the other hand, if the height H3 of the sealing portion 8 is too low, a short circuit may occur between the moisture-proof portion 7 and the array substrate 2 when a high voltage such as static electricity is applied. Therefore, it is more desirable that the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 be set to be less than 0.5 mm. That is, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 is set to be greater than 0.1 mm and less than 0.5 mm.

[0132] The inventors of this application have learned through actual observation that it is ideal that the height H3 of the sealing portion 8 is set to be greater than 30% and less than 70% of the height H4 of the scintillator 5. If the height H3 of the sealing portion 8 is set in the above manner, the aforementioned warping of the array substrate 2 can be suppressed, the amount of moisture permeation per unit time can be reduced, and the amount of material required for forming the sealing portion 8 can be reduced.

[0133] For example, the effect of reducing the amount of moisture permeation per unit time can be considered in the following manner.

[0134] If the total moisture permeation rate of the moisture-proof part 7 and the sealing part 8 per unit time is Q, the moisture permeation rate of the moisture-proof part 7 per unit time is Q7, and the moisture permeation rate of the sealing part 8 per unit time is Q8, the following equation holds.

[0135] Q=Q7+Q8

[0136] In the above case, since Q7 is considered to be substantially constant, the increase or decrease of Q almost depends on the increase or decrease of Q8.

[0137] Here, if the moisture permeability coefficient of the sealing portion 8 is represented by P, and the moisture permeability cross-sectional area of ​​the sealing portion 8 is represented by S (mm 2 ), let the moisture permeability width of the sealing portion 8 be W, let the circumference of the sealing portion 8 be L (mm), and let the height of the sealing portion 8 be H (mm), then the following formula holds.

[0138] Q8=P×S / W=P×L×H / W

[0139] Therefore, if the height H of the sealing portion 8 is reduced, the moisture permeation amount Q8 of the sealing portion 8 per unit time can be reduced, and the total moisture permeation amount Q of the moisture-proof portion 7 and the sealing portion 8 per unit time can be reduced.

[0140] That is, the moisture resistance can be improved, and therefore the reliability of the X-ray detection module 10 can be improved.

[0141] Fig. 9 (a) Fig. 9 (b) is a schematic cross-sectional view for illustrating a flexible portion 7e according to still another embodiment.

[0142] like Fig. 9 (a) Fig. 9 As shown in (b), the flexure 7e can also be provided in the area of ​​the moisture-proof part 7 that is opposite to the upper surface 5b of the scintillator 5. The flexure 7e can be provided, for example, in an embossed shape. The surface of the flexure 7e on the side opposite to the scintillator 5 (the surface on the side for X-rays to be incident) protrudes outward from the surface of the moisture-proof part 7 on the side opposite to the scintillator 5. The surface of the scintillator 5 of the flexure 7e protrudes outward from the surface of the moisture-proof part 7 on the scintillator 5 side.

[0143] The wall thickness of the flexure 7e can be set to be substantially the same as the wall thickness of the portion of the moisture-proof portion 7 where the flexure 7e is not provided. The flexure 7e can be formed, for example, by performing a stamping process (embossing process) on the sheet-shaped moisture-proof portion 7. In addition, even a low moisture-permeable moisture-proof film formed by laminating a resin film and a film formed by an inorganic material can be formed by performing a stamping process (embossing process) on the sheet-shaped moisture-proof portion 7.

[0144] The height dimension of the flexure 7e can be set to be larger than the wall thickness dimension of the portion of the moisture-proof portion 7 where the flexure 7e is not provided. The width dimension, quantity and arrangement of the flexure 7e are not particularly limited. The width dimension, quantity and arrangement of the flexure 7e can be appropriately determined according to the aforementioned amount of heat shrinkage, the size of the moisture-proof portion 7, etc.

[0145] The flexure 7e is more elastically deformable than the portion of the moisture-proof portion 7 where the flexure 7e is not provided. Therefore, the difference in the amount of thermal contraction based on the difference in the linear expansion coefficient can be absorbed by elastically deforming the flexure 7e. Therefore, if the flexure 7e is provided, warping of the array substrate 2 can be suppressed.

[0146] In the above case, it is also possible to Fig. 9 As shown in (a), only the bending portion 7e is provided in the moisture-proof portion 7, and it is also possible to Fig. 9 As shown in (b), the moisture-proof portion 7 is provided with a flexible portion 7e, and flexible portions 7d and 7c are provided near the periphery of the moisture-proof portion 7.

[0147] Fig.10 It is a schematic cross-sectional view for illustrating an X-ray detection module 110 of a comparative example.

[0148] If Fig.10 If the sealing portion 8 shown is bonded to the array substrate 2 but not to the side surface 5a of the scintillator 5, the sealing portion 8 is prone to peeling. For example, as mentioned above, thermal stress is generated due to the temperature change caused by the start-up or the change of the ambient temperature. In the above case, if the sealing portion 8 is only bonded to the array substrate 2, the bonding strength of the sealing portion 8 becomes smaller. Therefore, under the effect of the generated thermal stress, the sealing portion 8 may peel off.

[0149] In contrast, in the X-ray detection modules 10, 10a to 10c of the present embodiment, the sealing portion 8 is bonded to the side surface 5a of the scintillator 5 and the array substrate 2. In addition, the sealing portion 8 is in close contact with the side surface 5a of the scintillator 5. Moreover, a portion of the sealing portion 8 is provided inside the concavo-convex portion of the side surface 5a of the scintillator 5. Therefore, the bonding strength of the sealing portion 8 can be increased, and thus, the peeling of the sealing portion 8 under the action of thermal stress can be suppressed.

[0150] Fig.11 It is a schematic cross-sectional view for illustrating an X-ray detection module 110 a of a comparative example.

[0151] like Fig.11 As shown in FIG. 1 , the exposed portion 11a8a1 of the outer surface 118a of the sealing portion 118 becomes an inclined surface inclined in a direction closer to the scintillator 5 as it approaches the array substrate 2. Therefore, the distance L between the outer surface 118a of the sealing portion 118 and the side surface 5a of the scintillator 5 becomes shorter near the array substrate 2. Therefore, moisture contained in the atmosphere easily penetrates between the sealing portion 118 and the array substrate 2 and reaches the scintillator 5.

[0152] In contrast, in the X-ray detection modules 10, 10a to 10c of the present embodiment, the outer surface 8a of the sealing portion 8 is shaped as a curved surface protruding outward. Therefore, near the array substrate 2, the distance L between the outer surface 18a of the sealing portion 18 and the side surface 5a of the scintillator 5 can be increased, so that moisture contained in the atmosphere is not easy to reach the scintillator 5.

[0153] Fig.12 It is a schematic cross-sectional view for illustrating an X-ray detection module 110 b of a comparative example.

[0154] like Fig.12 As shown, if the height of the sealing portion 128 is higher than the height of the scintillator 5, the sheet material as the moisture-proof portion 17 needs to be forcibly deformed when covering it. Therefore, wrinkles, cracks, pinholes, etc. are easily generated in the moisture-proof portion 17.

[0155] In addition, the exposed portion of the outer surface 128 a of the sealing portion 128 tends to be larger. If the exposed portion is larger, the water permeation cross section is larger, so more water enters the inside of the sealing portion 128 .

[0156] In contrast, in the X-ray detection modules 10, 10a to 10c of the present embodiment, the height of the sealing portion 8 is less than the height of the scintillator 5, so there is no need to forcibly deform the sheet material serving as the moisture-proof portion 7. Therefore, wrinkles, cracks, pinholes, etc. can be suppressed from occurring in the moisture-proof portion 7.

[0157] Fig.13 It is a schematic cross-sectional view for illustrating an X-ray detection module 110 c of a comparative example.

[0158] If Fig.13The outer surface 138a of the sealing portion 138 shown is a plane perpendicular to the array substrate 2, so it is not easy for the moisture-proof portion 117 to cover the outer surface 138a. If the outer surface 138a is not covered by the moisture-proof portion 117, the water penetration cross section becomes larger, so more water will enter the inside of the sealing portion 138. In the above case, if the periphery 117a of the moisture-proof portion 117 is bent to cover the outer surface 138a, cracks and ruptures are likely to occur in the bent portion 117b. If cracks and ruptures occur, water may enter through the cracks and ruptures.

[0159] In contrast, in the X-ray detection modules 10, 10a to 10c of the present embodiment, the outer surface 8a of the sealing portion 8 is shaped as a curved surface protruding outward. Therefore, when the outer surface 8a is covered by the sealing portion 7, there is no portion that needs to be forcibly bent by the sealing portion 7. Therefore, the outer surface 8a can be covered by the sealing portion 7 without generating cracks or ruptures.

[0160] (Method for manufacturing X-ray detection module and method for manufacturing X-ray detector)

[0161] Next, a method for manufacturing an X-ray detection module and a method for manufacturing an X-ray detector are exemplified.

[0162] First, control lines 2c1, data lines 2c2, wiring pads 2d1, wiring pads 2d2, photoelectric conversion units 2b, and protective layers 2f are sequentially formed on substrate 2a to manufacture array substrate 2. Array substrate 2 can be manufactured using, for example, a semiconductor manufacturing process. In addition, known techniques can be applied to the manufacture of array substrate 2, and therefore, detailed description is omitted.

[0163] Next, the scintillator 5 is formed so as to cover the effective pixel region A on the substrate 2 a .

[0164] For example, the scintillator 5 can be formed by vacuum deposition. If the scintillator 5 is formed by vacuum deposition, a scintillator 5 composed of a plurality of columnar crystals is formed. The thickness of the scintillator 5 can be appropriately changed according to the DQE characteristics, sensitivity characteristics, and resolution characteristics required by the X-ray detector 1. The thickness of the scintillator 5 can be set to about 600 μm, for example.

[0165] In addition, the luminescent substance may be mixed with an adhesive, and the mixed material may be applied to cover the effective pixel area A and fired to form a matrix of grooves on the fired material and to provide a quadrangular prism-shaped scintillator 5 in each of the plurality of photoelectric conversion sections 2b.

[0166] Next, the reflective layer 6 is formed on the scintillator 5 .

[0167] For example, the reflective layer 6 can be formed by applying a coating liquid in which a plurality of light scattering particles, a resin, and a solvent are mixed onto the scintillator 5 and drying the mixture.

[0168] Furthermore, the reflective layer 6 can be formed by, for example, forming a layer made of a metal having a high light reflectivity, such as a silver alloy or aluminum, on the scintillator 5 .

[0169] In addition, for example, the reflective layer 6 can be provided by providing or pasting a sheet having a surface made of a metal with a high light reflectivity such as silver alloy or aluminum, or a resin sheet including light scattering particles, on the scintillator 5 .

[0170] Next, the sealing portion 8 is formed.

[0171] For example, the sealing portion 8 can be formed by softening a thermoplastic resin using a solvent, applying the softened thermoplastic resin in a frame shape around the scintillator 5 , and then evaporating the solvent to harden the thermoplastic resin.

[0172] Alternatively, for example, the sealing portion 8 can be formed by heating a thermoplastic resin to soften it, applying the softened thermoplastic resin in a frame shape around the scintillator 5 , and curing the thermoplastic resin by heat dissipation or the like.

[0173] Furthermore, for example, the frame-shaped sealing portion 8 can also be formed using 3D printing or the like.

[0174] Fig.14 1 is a schematic perspective view for illustrating the application of the thermoplastic resin 18 of the comparative example. As described above, the softened thermoplastic resin 18 is applied in a frame shape. Therefore, a joint 18a is generated at least at one place. When the softened thermoplastic resin 18 is applied in a frame shape, if the supply amount of the thermoplastic resin 18 per unit time is set constant or the moving speed B of the nozzle that discharges the thermoplastic resin 18 is set constant, then Fig.14 As shown, a depression 18b may be formed at the joint 18a connecting the starting point of the supply and the end point of the supply. For example, if the starting point of the supply and the end point of the supply are separated, a steep depression 18b whose height is lower than the surrounding height may be formed at the joint 18a between the starting point of the supply and the end point of the supply. If a steep depression 18b is formed, the sheet material as the moisture-proof part 7 cannot follow the depression 18b, and a leakage path may be formed. The moisture-proof part 7 and the outer surface 8a of the sealing part 8 are not bonded at the part of the leakage path, and moisture can easily enter through the leakage path.

[0175] Fig.15 This is a schematic perspective view for illustrating the application of the thermoplastic resin 18 according to the present embodiment.

[0176] like Fig.15As shown, the convex portion 18c can be formed at the joint 18a. For example, the convex portion 18c can be formed by increasing the supply amount of the thermoplastic resin 18 per unit time at the joint 18a, or by reducing the moving speed B of the nozzle. In the above case, it is more desirable to form a convex portion 18c having a gentle outer surface and a low height.

[0177] It is easier to arrange the sheet material serving as the moisture-proof portion 7 along the convex portion 18c than the steep concave portion 18b. Therefore, it is possible to suppress the occurrence of a leakage path.

[0178] Next, a sheet serving as the moisture-proof portion 7 is placed over the scintillator 5 , the reflective layer 6 , and the sealing portion 8 , and the vicinity of the periphery of the sheet is bonded to the outer surface 8 a of the sealing portion 8 .

[0179] For example, the sheet can be heated while being pressed near the periphery of the sheet against the outer surface 8a of the sealing portion 8 to melt the outer surface 8a of the sealing portion 8 and bond to the moisture-proof portion 7. The sheet and the outer surface 8a of the sealing portion 8 are bonded to form the moisture-proof portion 7.

[0180] The sheets can be joined together in an environment where the pressure is reduced to a pressure lower than the atmospheric pressure.

[0181] By bonding the sheet to the outer surface 8a of the sealing portion 8 in an environment where the air pressure is reduced to a pressure lower than the atmospheric pressure, it is possible to suppress the air containing water vapor from being contained in the moisture-proof portion 7. In addition, even when the X-ray detector 1 is placed in an environment where the air pressure is lower than the atmospheric pressure, such as when the X-ray detector 1 is transported by an aircraft, it is possible to suppress the moisture-proof portion 7 from expanding or deforming due to the air in the moisture-proof portion 7. In addition, the moisture-proof portion 7 is pressed by the atmospheric pressure, so the moisture-proof portion 7 is in close contact with the scintillator 5.

[0182] As described above, the X-ray detection modules 10 and 10a to 10c can be manufactured.

[0183] Next, the array substrate 2 and the circuit substrate 11 are electrically connected via the flexible printed substrates 2e1 and 2e2.

[0184] In addition, circuit components and the like are installed as appropriate.

[0185] Next, the array substrate 2 , the circuit substrate 11 , and the like are housed in a housing (not shown).

[0186] In the above case, if the warping of the array substrate 2 is large, the array substrate 2 may interfere with the components housed inside the frame, or the array substrate 2 may interfere with the inner wall of the frame. If the X-ray detection module 10 of this embodiment is set as described above, the warping of the array substrate 2 can be suppressed, so the operation in the assembly process can be smoother.

[0187] Furthermore, an electrical test, an X-ray image test, and the like can be performed as necessary to check whether the photoelectric conversion element 2 b 1 has an abnormality or whether the electrical connection has an abnormality.

[0188] The X-ray detector 1 can be manufactured in the above-described manner.

[0189] In addition, in order to confirm the moisture-proof reliability of the product and the reliability against changes in temperature environment, high-temperature and high-humidity tests, hot and cold cycle tests, etc. can also be carried out.

[0190] As described above, the method for manufacturing the X-ray detection module according to the present embodiment can include the following steps.

[0191] A step of forming the scintillator 5 on the plurality of photoelectric conversion sections 2 b provided on the array substrate 2 .

[0192] A step of applying the softened thermoplastic resin 18 in a frame shape around the scintillator 5 to form the sealing portion 8 .

[0193] A step of covering the scintillator 5 and the sealing portion 8 with a sheet as the moisture-proof portion 7 , heating the vicinity of the periphery of the sheet, and bonding the vicinity of the periphery of the sheet to the outer surface 8 a of the sealing portion 8 .

[0194] In the above case, in the step of forming the sealing portion 8 , the convex portion 18 c can be formed on the coated joint 18 a .

[0195] Several embodiments of the present invention are described above, but these embodiments are only examples and do not limit the scope of the invention. These new embodiments can also be implemented in various other ways, and various omissions, substitutions, changes, etc. can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope or purpose of the invention, and are included in the invention described in the claims and their equivalents. In addition, the above-mentioned embodiments can be implemented in combination with each other.

Claims

1. A radiation detection module, comprising: An array substrate having a plurality of photoelectric conversion parts; a scintillator, the scintillator being disposed on the plurality of photoelectric conversion parts and having a side portion inclined toward a direction close to the array substrate as it goes toward the outside; a frame-shaped sealing portion, the sealing portion including a thermoplastic resin as a main component, disposed around the scintillator and bonded to the array substrate and the side portion of the scintillator; and a moisture-proof portion, the moisture-proof portion covers the upper side of the scintillator and is bonded to the outer surface of the sealing portion near the periphery, The outer surface of the sealing portion is in the shape of a curved surface protruding outward, An end portion of the curved surface of the sealing portion on the side opposite to the array substrate side is located on the side portion of the scintillator. The vicinity of the peripheral edge of the moisture-proof portion is joined to the curved surface of the sealing portion so as to follow the curved surface protruding outward. The peripheral end of the moisture-proof portion is in contact with the array substrate, or the peripheral end of the moisture-proof portion is arranged near the array substrate.

2. The radiation detection module according to claim 1, wherein: The distance between the peripheral end surface of the moisture-proof portion and the array substrate is less than half of the height of the sealing portion.

3. The radiation detection module according to claim 1, wherein: A bending portion along the array substrate is arranged at the periphery of the moisture-proof portion.

4. The radiation detection module according to claim 3, wherein: The corners of the moisture-proof part are provided with convex parts protruding outward.

5. The radiation detection module according to any one of claims 1 to 4, wherein: A recessed portion is provided on an outer surface of the sealing portion.

6. The radiation detection module according to claim 5, wherein: A bending portion is provided at a portion of the moisture-proof portion that faces the recessed portion.

7. The radiation detection module according to any one of claims 1 to 4, wherein: A convex portion is provided on the outer surface of the sealing portion.

8. The radiation detection module according to any one of claims 1 to 4, wherein: The height of the sealing portion is lower than the height of the scintillator.

9. The radiation detection module according to claim 8, wherein: A difference between a height of the scintillator and a height of the sealing portion is greater than or equal to 0.1 mm and less than or equal to 0.5 mm.

10. The radiation detection module according to claim 8, wherein: The height of the sealing portion is not less than 30% and not more than 70% of the height of the scintillator.

11. The radiation detection module according to any one of claims 1 to 4, wherein: The side of the scintillator is provided with a concave and convex portion, A portion of the sealing portion is provided inside the concavity and convexity of the side portion of the scintillator.

12. The radiation detection module according to any one of claims 1 to 4, wherein: The sealing portion has light translucency.

13. The radiation detection module according to any one of claims 1 to 4, wherein: At least an outer surface of the sealing portion is water-repellent.

14. The radiation detection module according to any one of claims 1 to 4, wherein: The thermoplastic resin is at least any one of polyethylene and polypropylene.

15. The radiation detection module according to any one of claims 1 to 4, wherein: The thermoplastic resin further contains a filler using an inorganic material.

16. The radiation detection module according to any one of claims 1 to 4, wherein: The moisture-proof portion is any one of a sheet containing metal, a laminated sheet in which a resin film and a metal film are laminated, and a laminated sheet in which a resin film and an inorganic film are laminated.

17. The radiation detection module according to any one of claims 1 to 4, wherein: The moisture-proof portion has a thickness of 10 μm or more and 50 μm or less.

18. The radiation detection module according to any one of claims 1 to 4, wherein: The moisture-proof portion has a flexure portion, The flexible portion is more easily elastically deformed than a portion of the moisture-proof portion where the flexible portion is not provided.

19. The radiation detection module according to any one of claims 1 to 4, wherein: The thermoplastic resin has a lower rigidity than the moisture barrier.

20. The radiation detection module according to any one of claims 1 to 4, wherein: The pressure of a space defined by the sealing portion and the moisture-proof portion is lower than the atmospheric pressure.

21. The radiation detection module according to any one of claims 1 to 4, wherein: The scintillator comprises cesium iodide (CsI):thallium (Tl).

22. The radiation detection module according to any one of claims 1 to 4, wherein: The invention also includes a reflective layer, which is arranged between the scintillator and the moisture-proof part.

23. A radiation detector comprising: The radiation detection module according to any one of claims 1 to 22; as well as A circuit substrate is electrically connected to the radiation detection module.

24. A method for manufacturing a radiation detection module, the method for manufacturing a radiation detection module according to any one of claims 1 to 22, comprising: forming a scintillator on a plurality of photoelectric conversion units disposed on an array substrate; A step of applying a softened thermoplastic resin in a frame shape around the scintillator to form a sealing portion; as well as A step of covering the scintillator and the sealing portion with a sheet as a moisture-proof portion, heating the vicinity of the periphery of the sheet, and bonding the vicinity of the periphery of the sheet to the outer surface of the sealing portion, In the step of forming the sealing portion, a convex portion is formed at the coated joint.

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