A fully automatic chip aging test device

Abstract

The present application discloses a fully automatic chip aging test device, including a rack, a loading and unloading area for taking and placing chips is provided on the rack, a transfer area for carrying an aging board loaded with chips is provided on one side of the loading and unloading area, and an aging test area for performing aging tests on chips on the aging board is provided on one side of the transfer area. The loading and unloading mechanism in the loading and unloading area can automatically load and unload chips to be tested or after testing, and the lifting and transporting mechanism in the transfer area can automatically transport the aging board loaded with chips to be tested or after testing between the loading and unloading area and the aging test area, and finally complete the aging test in the aging test area; the entire process of the aging test is automatically completed by the machine, realizing fully automatic aging testing of chips, greatly reducing the output of manpower and improving work efficiency.

Description

Technical Field

[0001] The present application relates to the field of chip detection technology, and in particular to a fully automatic chip aging test device. Background Art

[0002] The aging test project refers to the process of simulating the various factors involved in the actual use conditions of the product to cause aging of the product and conducting corresponding conditions to strengthen the experiment.

[0003] After chip production and manufacturing is completed, the chip needs to be aged on the aging board. Currently, the chip is generally pushed from the cart to the aging test cabinet for aging testing by hand. However, manually pushing the cart to the aging test cabinet for aging testing has the disadvantages of low work efficiency, poor stability and high labor costs. Summary of the invention

[0004] Based on this, it is necessary to provide a fully automatic chip aging test device to realize fully automatic aging test of chips and automatically complete the entire process of aging test, which greatly reduces manpower output and improves work efficiency.

[0005] The present application provides a fully automatic chip aging test device, comprising a rack, on which a loading and unloading area for picking up and placing chips is provided, a transfer area for carrying an aging board loaded with chips is provided on one side of the loading and unloading area, and an aging test area for performing aging tests on chips on the aging board is provided on one side of the transfer area;

[0006] The loading and unloading area includes a plurality of material loading mechanisms arranged on the frame and a first conveying mechanism and a second conveying mechanism arranged on one side of the material loading mechanism; a first loading and unloading mechanism is arranged above the material loading mechanism, and the first loading and unloading mechanism takes and places the chips on the material loading mechanism onto the first conveying mechanism or takes and places the chips on the first conveying mechanism onto the material loading mechanism; a second loading and unloading mechanism is arranged above the second conveying mechanism, and the second loading and unloading mechanism takes and places the chips on the first conveying mechanism onto the second conveying mechanism or takes and places the chips on the second conveying mechanism onto the first conveying mechanism;

[0007] The transfer area includes a lifting and transporting mechanism, which takes the aging board on the second carrier mechanism and places it on the aging test area, or takes the aging board in the aging test area and places it on the second carrier mechanism;

[0008] The aging test area includes a test bracket and an aging tester arranged on the test bracket;

[0009] Wherein, the loading and unloading area also includes a robot, which is used to open or tighten the cover on the aging board.

[0010] The fully automatic chip aging test device described in the present application includes a loading and unloading area and a transfer area and an aging test area which are sequentially arranged on one side of the loading and unloading area. The loading and unloading mechanism in the loading and unloading area can automatically load and unload the chips to be tested or after the test, and the lifting and transferring mechanism in the transfer area can automatically transfer the aging board loaded with the chips to be tested or after the test between the loading and unloading area and the aging test area, and finally complete the aging test in the aging test area; the entire process of the aging test is automatically completed by the machine, realizing fully automatic aging test of the chip, greatly reducing the output of manpower and improving work efficiency.

[0011] In some embodiments, the first loading and unloading mechanism comprises:

[0012] A lifting frame, wherein a suction nozzle cylinder is provided on the lifting frame, and the suction nozzle cylinder is used to absorb the chip on the material loading mechanism and drive the chip to move;

[0013] A first driving component, the first driving component is connected to the lifting frame, and the first driving component drives the lifting frame to move up and down;

[0014] A second driving assembly, the second driving assembly is connected to the lifting frame, and the second driving assembly drives the lifting frame to move longitudinally;

[0015] A third driving assembly is connected to the second driving assembly via a first slide, and the third driving assembly drives the lifting frame to move laterally.

[0016] In some embodiments, the first transport mechanism includes a first guide rail, a first transport platform, a second transport platform, a transmission assembly, and a driving member, wherein the first transport platform and the second transport platform are arranged on the first guide rail, the transmission assembly is connected to the first transport platform and the second transport platform, and the driving member is connected to the transmission assembly. When the driving member is started, the first transport platform and the second transport platform are driven by the transmission assembly to make relative motion on the first guide rail. The chips to be tested or tested are sent back and forth to the material loading mechanism and the second transport mechanism. At the same time, the first transport platform and the second transport platform act at the same time. When the second transport platform is loading, the first transport platform prepares the materials, making the structure more reasonable, avoiding the situation of the first loading and unloading mechanism waiting for no load, and improving production efficiency.

[0017] In some embodiments, the second transport mechanism includes a second guide rail, a third transport platform and a fourth drive component, the third transport platform is slidably disposed on the second guide rail, the fourth drive component is connected to the third transport platform, and the fourth drive component drives the third transport platform to slide along the second guide rail.

[0018] In some embodiments, the second loading and unloading mechanism comprises:

[0019] A mounting frame, wherein a nozzle cylinder is provided on the mounting frame, and the nozzle cylinder is used to absorb the chip on the second carrier mechanism and drive the chip to move;

[0020] A sixth driving assembly, the sixth driving assembly is connected to the mounting frame, and the sixth driving assembly drives the mounting frame to move up and down;

[0021] a seventh driving assembly, the seventh driving assembly being connected to the mounting frame, and the seventh driving assembly driving the mounting frame to move longitudinally;

[0022] An eighth driving assembly is connected to the seventh driving assembly via a second slide, and the eighth driving assembly drives the mounting frame to move laterally.

[0023] In some embodiments, a transfer area and an aging test area are provided on both sides of the loading and unloading area. Aging tests can be performed on both sides of the loading and unloading area, which greatly increases the number of tests, reduces equipment investment, and reduces production costs.

[0024] In some embodiments, the material loading mechanism includes a loading rack and a tray disposed on the loading rack.

[0025] In some embodiments, a transfer mechanism is provided on the third carrier platform, and the transfer mechanism transfers the aging board to the lifting and transferring mechanism; the transfer mechanism includes a transfer platform, a fifth drive assembly provided on the inner side of the transfer platform, and a transfer frame provided on the surface of the transfer platform, and the transfer frame is connected to the fifth drive assembly, and the fifth drive assembly drives the transfer frame to slide on the surface of the transfer platform. During the process of loading (or taking) materials, the manipulator loads (or takes) a row of materials, and at this time, the fifth drive assembly drives the transfer frame to slide on the surface of the transfer platform by a material distance, that is, drives the aging board on the transfer frame to move forward by a material distance, which can reduce the action of the manipulator, which is equivalent to reducing the action time.

[0026] In some embodiments, the lifting and transporting mechanism comprises:

[0027] Lifting bracket;

[0028] A lifting platform, the lifting platform is slidably mounted on the lifting bracket;

[0029] A lifting drive assembly, the lifting drive assembly is connected to the lifting platform, and the lifting drive assembly drives the lifting platform to move up and down along the lifting bracket;

[0030] A transfer component, the transfer component is arranged on the lifting platform, and the transfer component transfers the aging board on the second carrier mechanism to the aging test area or transfers the aging board in the aging test area to the second carrier mechanism;

[0031] Wherein, the transfer component includes a ninth drive component and a pushing plate, and the pushing plate is connected to the ninth drive component.

[0032] In some embodiments, the lifting and transporting mechanism further includes a horizontal driving component, which is connected to the lifting bracket to drive the lifting bracket to move horizontally. The horizontal driving component can drive the lifting bracket to move horizontally, and the transporting component can transport the aging board on the horizontal moving path, so that multiple test brackets can be set in the aging test area to increase the test capacity and have high practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0034] Figure 1 This is a schematic diagram of the structure of the fully automatic chip aging test device of this application;

[0035] Figure 2 This is a schematic diagram of the loading and unloading area structure of this application;

[0036] Figure 3 This is a schematic diagram of the first loading and unloading mechanism structure of this application;

[0037] Figure 4 This is a schematic diagram of the structure of the first transport mechanism of this application;

[0038] Figure 5 This is a schematic diagram of the structure of the second transport mechanism of this application;

[0039] Figure 6 This is a schematic diagram of the structure of the second transport mechanism of this application;

[0040] Figure 7 This is a schematic diagram of the structure of the second loading and unloading mechanism of this application;

[0041] Figure 8 This is a schematic diagram of the lifting and transfer mechanism structure for this application;

[0042] Fig. 9 This is a structural diagram of the transfer area and aging test area for this application.

[0043] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] like Figure 1-Figure 2 As shown, a fully automatic chip aging test device is used for aging test of chips. The fully automatic chip aging test device includes a frame, and a loading and unloading area 10 for taking and placing chips is provided on the frame. A transfer area 20 for carrying an aging board with chips is provided on one side of the loading and unloading area 10. An aging test area 30 for performing aging test on chips on the aging board is provided on one side of the transfer area 20;

[0048] The loading and unloading area 10 includes a plurality of material loading mechanisms 15 arranged on the frame and a first conveying mechanism 11 and a second conveying mechanism 12 arranged on one side of the material loading mechanism 15; a first loading and unloading mechanism 13 is arranged above the material loading mechanism 15, and the first loading and unloading mechanism 13 takes and places the chips on the material loading mechanism 15 onto the first conveying mechanism 11 or takes and places the chips on the first conveying mechanism 11 onto the material loading mechanism 15; a second loading and unloading mechanism 14 is arranged above the second conveying mechanism 12, and the second loading and unloading mechanism 14 takes and places the chips on the first conveying mechanism 11 onto the second conveying mechanism 12 or takes and places the chips on the second conveying mechanism 12 onto the first conveying mechanism 11;

[0049] The transfer area 20 includes a lifting and transporting mechanism 21, which takes the aging board on the second carrier mechanism 12 and places it on the aging test area 30 or takes the aging board in the aging test area 30 and places it on the second carrier mechanism 12;

[0050] The aging test area 30 includes a test bracket 31 and an aging tester 32 disposed on the test bracket 31;

[0051] The loading and unloading area 10 further includes a robot 16, which is used to open or tighten the cover on the aging board.

[0052] It should be noted here that the robot 16 is an existing mature product and can be selected according to the specifications of different aging boards. The principles of its installation and use are well known to those skilled in the art and will not be repeated here.

[0053] Preferably, in this embodiment, a transfer area 20 and an aging test area 30 are provided on both sides of the loading and unloading area 10 .

[0054] like Figure 2 As shown, the material loading mechanism 15 includes a loading frame 151 and a tray 152 disposed on the loading frame 151. Specifically, the loading frame 151 has a certain clamping function, and when in use, the tray 152 can be clamped.

[0055] like Figure 3As shown, the first loading and unloading mechanism 13 includes a lifting frame 131, a first driving assembly 132, a second driving assembly 133, and a third driving assembly 134, wherein the lifting frame 131 is provided with a nozzle cylinder 1311, and the nozzle cylinder 1311 is used to absorb the chips on the material loading mechanism 15 and drive the chips to move; the first driving assembly 132 is connected to the lifting frame 131, and the first driving assembly 132 drives the lifting frame 131 to move up and down; the second driving assembly 133 is connected to the lifting frame 131, and the second driving assembly 133 drives the lifting frame 131 to move longitudinally; the third driving assembly 134 is connected to the second driving assembly 133 through the first slide 135, and the third driving assembly 134 drives the lifting frame 131 to move laterally. Specifically, the first drive assembly 132 includes a motor and a transmission screw. The motor and the transmission screw are installed on the second drive assembly 133 through a mounting plate. The motor drives the transmission screw to rotate, and the transmission screw drives the lifting frame 131 to move up and down; the second drive assembly 133 includes a linear motor module, and the linear motor module is connected to the third drive assembly through a first slide 135. When the second drive assembly 133 is actuated, it can drive the lifting frame 131 to move longitudinally; the third drive assembly 134 includes a slide rail, a motor, a transmission belt, and a pulley. The motor, the transmission belt, and the pulley are arranged on the slide rail. The transmission belt is connected to the output end of the motor through the pulley, and the transmission belt is connected to the first slide 135. The motor drives the transmission belt to drive the first slide 135 to move laterally along the slide rail, thereby driving the lifting frame 131 to move laterally.

[0056] like Figure 4As shown, the first transport mechanism 11 includes a first guide rail 111, a first transport platform 112, a second transport platform 113, a transmission component 114, and a driving member (not shown in the figure), wherein the first transport platform 112 and the second transport platform 113 are arranged on the first guide rail 111, the transmission component 114 is connected to the first transport platform 112 and the second transport platform 113, and the driving member is connected to the transmission component 114. When the driving member is started, the first transport platform 112 and the second transport platform 113 are driven by the transmission component 114 to make relative movement on the first guide rail 111. Specifically, the first guide rail 111 is two parallel linear slide rails, the first carrier 112 and the second carrier 113 are arranged on the linear slide rails, the transmission assembly 114 can be a transmission belt, and the driving member can be a motor. The transmission belt is connected to the first carrier 112 and the second carrier 113 on the linear slide rails. When the motor drives the transmission belt to move, the first carrier 112 and the second carrier 113 approach each other or move away from each other; when the first carrier 112 and the second carrier 113 approach each other, the second loading and unloading mechanism 14 moves the chip on the first carrier 112 The chip is placed on the second carrier 113 or the chip on the second carrier 113 is placed on the first carrier 112; when the first carrier 112 and the second carrier 113 are away from each other, the first loading and unloading mechanism 13 places the chip on the first carrier 112 on the material loading mechanism 15 or places the chip on the material loading mechanism 15 on the first carrier 112, and the second loading and unloading mechanism 14 places the chip on the second carrier 113 on the second carrier 12 or places the chip on the second carrier 12 on the second carrier 113.

[0057] As shown in FIG*, the second transport mechanism 12 includes a second guide rail 121, a third transport platform 122 and a fourth drive assembly 123. The third transport platform 122 is slidably disposed on the second guide rail 121. The fourth drive assembly 123 is connected to the third transport platform 122. The fourth drive assembly 123 drives the third transport platform 122 to slide along the second guide rail 121. Specifically, the fourth drive assembly 123 includes a motor transmission belt and a pulley. The motor and the pulley are arranged on the inner side of the second guide rail 121. The transmission belt is connected to the output end of the motor through the pulley, and the transmission belt is connected to the third transport platform 122. The motor drives the transmission belt to move, thereby driving the third transport platform 122 to slide on the second guide rail 121, so that the aging board with chips on the third transport platform 122 is transported to the transfer area 20.

[0058] like Figure 5 and Figure 6As shown, the third carrier 122 is provided with a transfer mechanism 124, and the transfer mechanism 124 transfers the aging board to the lifting and transferring mechanism 21; the transfer mechanism 124 includes a transfer platform 1241, a fifth drive component 1242 arranged on the inner side of the transfer platform 1241, and a transfer frame 1243 arranged on the surface of the transfer platform 1241, and the transfer frame 1243 is connected to the fifth drive component 1242, and the fifth drive component 1242 drives the transfer frame 1243 to slide on the surface of the transfer platform 1241. Specifically, the fifth drive component 1242 includes a linear motor module, and the linear motor module drives the transfer frame 1243 to slide on the surface of the transfer platform 1241. During the process of loading (or taking), the manipulator loads (or takes) a row of materials. At this time, the fifth drive component drives the transfer frame to slide on the surface of the transfer platform by a material distance, that is, drives the aging board on the transfer frame to advance by a material distance, which can reduce the action of the manipulator, which is equivalent to reducing the action time.

[0059] like Figure 7 As shown, the second loading and unloading mechanism 14 includes a mounting frame 141, a sixth driving assembly 142, a seventh driving assembly 143, and an eighth driving assembly 144, wherein the mounting frame 141 is provided with a nozzle cylinder 1411, and the nozzle cylinder 1411 is used to absorb the chip on the second carrier mechanism 12 and drive the chip to move; the sixth driving assembly 142 is connected to the mounting frame 141, and the sixth driving assembly 142 drives the mounting frame 141 to move up and down; the seventh driving assembly 143 is connected to the mounting frame 141, and the seventh driving assembly 143 drives the mounting frame 141 to move longitudinally; the eighth driving assembly 144 is connected to the seventh driving assembly 143 through a second slide 145, and the eighth driving assembly 144 drives the mounting frame 141 to move laterally. Specifically, the sixth drive assembly 142 includes a motor and a transmission screw. The motor and the transmission screw are installed on the seventh drive assembly 143 through a mounting plate. The motor drives the transmission screw to rotate, and the transmission screw drives the mounting frame 141 to move up and down; the seventh drive assembly 143 includes a cylinder, and the cylinder is connected to the eighth drive assembly through a second slide seat 145. When the seventh drive assembly 143 is actuated, it can drive the mounting frame 141 to move longitudinally; the eighth drive assembly 144 includes a cylinder, and the cylinder drives the seventh drive assembly 143 to move horizontally, thereby driving the mounting frame 141 to move horizontally.

[0060] like Figure 8As shown, the lifting and transfer mechanism 21 includes a lifting bracket 211, a lifting platform 212, a lifting drive component 213, and a transfer component 214, wherein the lifting platform 212 is slidably installed on the lifting bracket 211; the lifting drive component 213 is connected to the lifting platform 212, and the lifting drive component 213 drives the lifting platform 212 to move up and down along the lifting bracket 211; the transfer component 214 is arranged on the lifting platform 212, and the transfer component 214 transfers the aging board on the second carrier mechanism 12 to the aging test area 30 or transfers the aging board in the aging test area 30 to the second carrier mechanism 12; specifically, the lifting drive component 213 includes a motor and a transmission screw, the motor and the transmission screw are arranged on the lifting bracket 211, the transmission screw is connected to the output end of the motor, and the lifting platform 212 is screwed on the transmission screw, when the motor drives the transmission screw to rotate, the lifting platform 212 moves upward or downward along the transmission screw.

[0061] like Figure 7 As shown, the transfer assembly 214 includes a ninth drive assembly 2141 and a push plate 2142, and the push plate 2142 is connected to the ninth drive assembly. Specifically, the ninth drive assembly 2141 can be a linear motor module, and the linear motor module drives the push plate 2142 to move, thereby pushing the aging board out or pulling it onto the lifting platform 212.

[0062] like Fig. 9 As shown, the lifting and transporting mechanism 21 further includes a horizontal driving assembly 215, and the horizontal driving assembly 215 is connected to the lifting bracket 211 to drive the lifting bracket 211 to move horizontally. Specifically, the horizontal driving assembly 215 includes a horizontal slide rail, a motor, and a transmission screw. The motor and the transmission screw are arranged on the inner side of the horizontal slide rail, and the transmission screw is connected to the lifting bracket 211. When the motor drives the transmission screw to rotate, the transmission screw drives the lifting bracket 211 to move on the horizontal slide rail.

[0063] It can be understood that the fully automatic chip aging test device of the present application also includes a control system, which controls the automatic operation of the loading and unloading area, the transfer area and the aging test area.

[0064] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A fully automatic chip aging test device, characterized in that: The machine comprises a rack, wherein a loading and unloading area for taking and placing chips is arranged on the rack, a transfer area for carrying an aging board loaded with chips is arranged on one side of the loading and unloading area, and an aging test area for performing aging test on the chips on the aging board is arranged on one side of the transfer area; The loading and unloading area includes a plurality of material loading mechanisms arranged on the frame and a first conveying mechanism and a second conveying mechanism arranged on one side of the material loading mechanism; a first loading and unloading mechanism is arranged above the material loading mechanism, and the first loading and unloading mechanism takes and places the chips on the material loading mechanism onto the first conveying mechanism or takes and places the chips on the first conveying mechanism onto the material loading mechanism; a second loading and unloading mechanism is arranged above the second conveying mechanism, and the second loading and unloading mechanism takes and places the chips on the first conveying mechanism onto the second conveying mechanism or takes and places the chips on the second conveying mechanism onto the first conveying mechanism; The transfer area includes a lifting and transporting mechanism, which takes the aging board on the second carrier mechanism and places it on the aging test area, or takes the aging board in the aging test area and places it on the second carrier mechanism; The aging test area includes a test bracket and an aging tester arranged on the test bracket; Wherein, the loading and unloading area also includes a manipulator, which is used to open or tighten the cover on the aging board; The first loading and unloading mechanism comprises: A lifting frame, wherein a suction nozzle cylinder is provided on the lifting frame, and the suction nozzle cylinder is used to absorb the chip on the material loading mechanism and drive the chip to move; A first driving component, the first driving component is connected to the lifting frame, and the first driving component drives the lifting frame to move up and down; A second driving assembly, the second driving assembly is connected to the lifting frame, and the second driving assembly drives the lifting frame to move longitudinally; a third driving assembly, the third driving assembly being connected to the second driving assembly via a first sliding seat, and the third driving assembly driving the lifting frame to move laterally; The first transport mechanism comprises a first guide rail, a first transport platform, a second transport platform, a transmission assembly, and a driving member, wherein the first transport platform and the second transport platform are arranged on the first guide rail, the transmission assembly is connected to the first transport platform and the second transport platform, and the driving member is connected to the transmission assembly. When the driving member is started, the first transport platform and the second transport platform are driven by the transmission assembly to make relative motion on the first guide rail; The second transport mechanism comprises a second guide rail, a third transport platform and a fourth driving assembly, wherein the third transport platform is slidably disposed on the second guide rail, the fourth driving assembly is connected to the third transport platform, and the fourth driving assembly drives the third transport platform to slide along the second guide rail; The second loading and unloading mechanism comprises: A mounting frame, wherein a nozzle cylinder is provided on the mounting frame, and the nozzle cylinder is used to absorb the chip on the second carrier mechanism and drive the chip to move; A sixth driving assembly, the sixth driving assembly is connected to the mounting frame, and the sixth driving assembly drives the mounting frame to move up and down; a seventh driving assembly, the seventh driving assembly being connected to the mounting frame, and the seventh driving assembly driving the mounting frame to move longitudinally; An eighth driving assembly is connected to the seventh driving assembly via a second slide, and the eighth driving assembly drives the mounting frame to move laterally.

2. The fully automatic chip aging test device according to claim 1, characterized in that: Transfer areas and aging test areas are provided on both sides of the loading and unloading areas.

3. The fully automatic chip aging test device according to claim 1, characterized in that: The material loading mechanism comprises a loading frame and a tray arranged on the loading frame.

4. The fully automatic chip aging test device according to claim 1, characterized in that: A transfer mechanism is provided on the third carrier platform, and the transfer mechanism transfers the aging board to the lifting and transferring mechanism; the transfer mechanism includes a transfer platform, a fifth driving component provided on the inner side of the transfer platform, and a transfer frame provided on the surface of the transfer platform, the transfer frame is connected to the fifth driving component, and the fifth driving component drives the transfer frame to slide on the surface of the transfer platform.

5. The fully automatic chip aging test device according to claim 1, characterized in that: The lifting and transporting mechanism comprises: Lifting bracket; A lifting platform, the lifting platform is slidably mounted on the lifting bracket; A lifting drive assembly, the lifting drive assembly is connected to the lifting platform, and the lifting drive assembly drives the lifting platform to move up and down along the lifting bracket; A transfer component, the transfer component is arranged on the lifting platform, and the transfer component transfers the aging board on the second carrier mechanism to the aging test area or transfers the aging board in the aging test area to the second carrier mechanism; Wherein, the transfer component includes a ninth drive component and a pushing plate, and the pushing plate is connected to the ninth drive component.

6. The fully automatic chip aging test device according to claim 5, characterized in that: The lifting and transferring mechanism also includes a horizontal driving component, and the horizontal driving component is connected to the lifting bracket to drive the lifting bracket to move horizontally.

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