Stator package, rotor package and inductive angle sensor

Abstract

A stator package, a rotor package and an inductive angle sensor are disclosed. The disclosure particularly relates to a stator package (10) for use in an inductive angle sensor (1000), wherein the stator package (10) has a substrate (20) on which at least two metallization layers (11, 12) arranged in different planes are arranged. The stator package (10) also has a semiconductor chip (21) with an integrated circuit, wherein an electrically insulating potting compound (23) surrounds the substrate (20) including the semiconductor chip (21) and a receiving coil arrangement (30). The receiving coil arrangement (30) has at least two electrically conductive receiving coils (31, 32) implemented in two metallization layers (11, 12) using thin-film technology.

Description

Technical Field

[0001] The invention relates to a stator encapsulation for an inductive angle sensor and a corresponding rotor encapsulation for the inductive angle sensor. The invention also relates to an inductive angle sensor having such a rotor encapsulation and such a stator encapsulation, and a corresponding method for producing the encapsulation and the inductive angle sensor. Background Art

[0002] Position sensors are used to determine the position between two components that rotate relative to each other, such as a rotor and a stator. Such angle sensors are used, for example, to determine the steering angle or to determine the position of a motor shaft or the like.

[0003] There are different methods and devices for determining the angle between two components. The concepts described herein relate to sensors in the field of inductive angle measurement technology.

[0004] In sensors using the inductive measuring principle, an excitation coil is arranged on a first sensor component, for example on a stator. The excitation coil is excited with an alternating current and then generates a corresponding induction field or magnetic field. A second sensor component, for example a rotor, can rotate relative to the first sensor component. A so-called induction target is arranged on the second sensor component. The induction target receives the induction field or magnetic field generated by the excitation coil. The induction target is electrically conductive, so that an induced current is formed in the induction target in response to the received induction field or magnetic field. The induced induction current in turn causes a corresponding induction field or magnetic field in the target. The first sensor component, for example a stator, has a receiving coil, which receives the induction field or magnetic field generated by the target and generates an induction signal, for example a corresponding induction current or an induction voltage, in response thereto. The signal strength of the induction signal depends primarily on the position of the two sensor components relative to each other and therefore varies according to the position of the two sensor components relative to each other. Therefore, based on the evaluation of the signal strength of the induction signal induced in the receiving coil, the position of the two sensor components relative to each other can be determined.

[0005] The inductive sensor principle therefore differs from conventional magnetic field sensors, which measure the magnetic field strength of a magnetic field, in particular a permanent magnetic field. The magnetic field strength varies depending on the position of the two sensor components relative to one another. Another difference lies, for example, in the choice of material. Ferromagnetic materials are used for magnetic field sensors, but non-ferromagnetic materials with electrical conductivity (e.g. aluminum) can also be used for inductive sensors.

[0006] Magnetic field sensors are manufactured in very small sizes. However, they are susceptible to external disturbances, which can be caused in particular by the presence of ferromagnetic materials. Therefore, in environments with many magnetic components, the reliability of magnetic field sensors can vary greatly.

[0007] Inductive angle and / or position sensors, in contrast, are insensitive to ferromagnetic materials. The areas of application of inductive sensors are thus significantly expanded compared to the areas of application of the above-mentioned magnetic field sensors. In addition, inductive sensors are substantially immune to external influences such as dust, dirt or liquids.

[0008] Depending on how sensitive the inductive sensor should be or how large the desired measuring distance of the inductive sensor is, a high partial current is induced in the corresponding coil. In order to ensure that the inductive sensor has an ideal high sensitivity, the losses and parasitic inductances are kept as low as possible. Therefore, the winding dimensions of the corresponding coil should be designed for the high partial current. Therefore, the coil is usually produced in the form of structured printed conductors on a printed circuit board, the so-called PCB (PCB: Printed Circuit Board). On the PCB, a chip package is additionally arranged laterally adjacent to the structured printed conductor coil, which has a corresponding circuit for operating the inductive sensor on the PCB. As required, the inductive sensor should be as small as possible. However, the structured printed conductor coil on the PCB and the chip housing positioned adjacent to it require a certain minimum installation area. In addition, the minimum achievable printed conductor thickness on the PCB is also an additional limiting factor for the degree of miniaturization of the sensor.

[0009] In principle, the coils on the PCB should be manufactured very accurately, wherein even small deviations from the desired layout can lead to errors in the angle measurement. For example, the individual coils can be connected to each other by means of through holes in the PCB. These through holes can be arranged along the outer circumference and the inner circumference of the coil. However, deviations in the arrangement and size of the through holes can lead to higher-order errors (in the angular domain), which in turn can be difficult to compensate for. The diameter of such through holes in the PCB is usually also significantly larger than the width of the individual printed conductors on the PCB. For example, for a coil with an inner diameter of 15 mm, the through holes arranged on the inner diameter can be arranged close to each other, so that, for example, there is no longer space for the rotatable shaft required for rotation, or it is no longer possible to further reduce the inner diameter. In addition, the relatively high metallization content of all through holes can lead to significant errors in the angle measurement, for example due to undesirable eddy currents in the through holes or due to the presence of capacitive coupling.

[0010] Inductive sensor systems with multiple components, for example with multiple coils, can be easily manufactured using PCB technology. For this purpose, for example, a multilayer PCB with multiple integrated metal layers can be used. However, the increase in the number of metal layers required for this leads to increased production costs. As an alternative, the metal layers can be arranged on the front and back of the PCB, which is more cost-effective than using a multilayer PCB. However, this increases the vertical distance between the coils on the front and back. This distance can be, for example, 0.5 mm, which corresponds to approximately 40% of the nominal air gap between rotor and stator, which in turn can have a significant effect on the measurement accuracy. In addition, the limited alignment accuracy of the metal layers in the PCB can lead to angular errors.

[0011] In addition to this, the PCB may be susceptible to delamination due to thermomechanical or wet-mechanical stress, which may also lead to fractures in the copper conductor tracks. Therefore, it may be necessary to check the integration of the coil on site, for which, for example, precise resistors can be used in the coil turns, where it can be checked during operation whether these resistors are still present between the different connections. These resistors can be designed as SMD components, which are placed very precisely on the conductor tracks. In addition, the height of these SMD components is 1 mm to 2 mm. This can also lead to angular errors, especially in the case of small coils. In addition, there is a potential risk of collision between the rotor and the stator, which could damage the coil.

[0012] The production of inductive angle sensors or their individual components in PCB technology is therefore easy to implement and cost-effective, but leads to the above-mentioned problems and the measurement errors associated therewith, in particular with increasing miniaturization of the coils.

[0013] It is therefore desirable to provide an inductive angle sensor or individual sensor components for such an inductive angle sensor which have dimensions which are as small as possible, but which nevertheless provide very precise measurement results and which at the same time can be manufactured inexpensively. Summary of the invention

[0014] Therefore, a stator package according to the invention is proposed as such a sensor component. In addition, a rotor package according to the invention is proposed as a further sensor component. In addition, an angle sensor according to the invention having such a stator package and such a rotor package is proposed. Correspondingly manufactured embodiments and other advantageous aspects are given below.

[0015] According to one aspect, a stator package for an inductive angle sensor is proposed, wherein the stator package in particular has a substrate on which at least two metallization layers arranged in different planes can be arranged. The stator package can also have a receiving coil device with at least two electrically conductive receiving coils, wherein the receiving coil device is designed to receive a magnetic field radiated by an inductive target device that can be rotated relative to the stator package and to generate an inductive signal in response to the magnetic field. The stator package can also have a semiconductor chip that is electrically conductively connected to the receiving coil device, wherein the semiconductor chip has an integrated circuit that is designed to evaluate the inductive signal and determine the rotation angle between the receiving coil device and the inductive target device that can be rotated relative to the receiving coil device based on the inductive signal. An electrically insulating potting compound can surround the substrate including the semiconductor chip and the receiving coil. According to the innovative concept described here, the two receiving coils can be implemented in two metallization layers in thin-film technology.

[0016] According to another aspect, a method for producing such a stator package is proposed, wherein the method comprises in particular the steps of providing a substrate and arranging at least two metallization layers arranged in different planes on the substrate. According to the method, a receiving coil arrangement with at least two electrically conductive receiving coils can be produced, which are designed to receive a magnetic field radiated by an induction target arrangement that can be rotated relative to the stator package and to generate an induction signal in response to the magnetic field. A semiconductor chip can be arranged on or next to the substrate and the semiconductor chip is electrically contacted with the receiving coil arrangement, wherein the semiconductor chip has a circuit that is designed to evaluate the induction signal and determine the rotation angle between the receiving coil arrangement and the induction target arrangement that can be rotated relative to the receiving coil arrangement based on the induction signal. Furthermore, according to the method, an electrically insulating potting compound can be applied, which surrounds the substrate including the semiconductor chip and the receiving coil arrangement. According to the innovative concept described here, the at least two receiving coils of the receiving coil arrangement can be realized in two metallization layers using thin-film technology.

[0017] According to another aspect, a rotor package for an inductive angle sensor is proposed, wherein the rotor package in particular has a substrate, on which at least one metallization layer can be arranged. The rotor package can also have an inductive target device with at least one conductive inductive target, which is designed to generate an inductive current in response to a magnetic field radiated by an excitation coil, and to generate a magnetic field corresponding to the inductive current, and to radiate the magnetic field in the direction of the stator package. In addition, the rotor package can have an electrically insulating seal or potting material, which surrounds the substrate including the target device. The rotor package can be arranged on a rotatable shaft in a torsionally fixed manner and can be rotated relative to the stator package. In addition, at least one inductive target of the target device can be realized in at least one metallization layer.

[0018] According to another aspect, a method for manufacturing such a rotor encapsulation is proposed, wherein the method comprises in particular the steps of providing a substrate and arranging at least one metallization layer on the substrate. According to the method, an induction target device with at least one electrically conductive induction target can be produced, the electrically conductive induction target being designed to generate an induction current in response to a magnetic field radiated by an excitation coil, to generate a magnetic field corresponding to the induction current, and to radiate the magnetic field in the direction of the stator encapsulation. At least one induction target of the target device can be realized in at least one metallization layer. In a further method step, an electrically insulating seal or potting material can be applied, which surrounds the substrate including the target device. In addition, the rotor encapsulation can be arranged on a rotatable shaft in a torsionally fixed manner so that the rotor encapsulation can be rotated relative to the stator encapsulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Some exemplary embodiments are shown as examples in the drawings and are explained below.

[0020] Figure 1 A side cross-sectional view of an inductive angle sensor having a stator package and a rotor package is shown according to one embodiment,

[0021] Figure 2 A top view of a stator package is shown according to one embodiment.

[0022] Figure 3A A side cross-sectional view of an inductive angle sensor having a stator package and a rotor package is shown according to another embodiment.

[0023] Figure 3B A side cross-sectional view of an inductive angle sensor having a stator package and a rotor package is shown according to another embodiment.

[0024] Figure 4 A side cross-sectional view of an inductive angle sensor in a shaft end design with a stator package, a rotor package and a separate component plate is shown according to one embodiment,

[0025] Figure 5 A side cross-sectional view of an inductive angle sensor of a through-axis design having a stator package, a rotor package, and a separate component plate is shown according to another embodiment,

[0026] Figure 6 According to one embodiment, a schematic block diagram for illustrating a method for manufacturing a stator package is shown.

[0027] Figure 7 A schematic block diagram is shown for illustrating a method for manufacturing a rotor package according to one embodiment. DETAILED DESCRIPTION

[0028] In the following, embodiments are described in more detail with reference to the accompanying drawings, and elements having the same or similar functions are provided with the same reference numerals.

[0029] The method steps shown in the block diagram and described with reference to the block diagram may also be performed in an order different from the order shown or described. In addition, method steps related to a specific feature of the device may be interchanged with the same feature of the device, which may also be applied in reverse.

[0030] The terms "stator package" and "rotor package" are mainly used here for better understanding. Both packages can rotate relative to each other. It does not matter here whether the rotor package rotates and the stator package is fixed in position, or the stator package rotates and the rotor package is fixed in position.

[0031] Figure 1 An embodiment of an inductive angle sensor 1000 is shown having a stator package 10 according to an exemplary and non-limiting embodiment and having a rotor package 100 according to an exemplary and non-limiting embodiment.

[0032] The stator encapsulation 10 shown here has a receiving coil arrangement 30 with at least two electrically conductive receiving coils 31 , 32 . However, the receiving coil arrangement 30 can also have more than two electrically conductive receiving coils. The receiving coil arrangement 30 can preferably have an even number of receiving coils.

[0033] The rotor package 100, which is rotatable relative to the stator package 10, has an induction target device 130. The induction target device 130 can have at least one electrically conductive induction target 131. However, the induction target device 130 can also have a plurality of electrically conductive induction targets. For example, in the case of an induction angle sensor using the vernier principle, the induction target device 130 can have two electrically conductive induction targets. In principle, the target device 130 can also have more than two electrically conductive induction targets. The number of electrically conductive induction targets of the target device 130 can, for example, depend on the number of receiving coils 31, 32 in the receiving coil device 30. For example, each electrically conductive induction target can be provided for two receiving coils 31, 32, respectively.

[0034] The field coil (not shown here) can be arranged, for example, in the stator housing 10 or on an additional component plate (see Figure 4 and 5 ), the excitation coil can radiate a magnetic field in the direction of the induction target 131. The induction target 131 can be designed to generate an induced current in response to the magnetic field radiated by the excitation coil and generate a magnetic field corresponding to the induced current, which is in turn radiated in the direction of the stator package 10, in particular, in the direction of the receiving coil device 30.

[0035] The receiving coils 31, 32 may be designed to receive a magnetic field radiated by the inductive target device 131 rotatable relative to the stator package 10 and generate inductive signals in response to the magnetic field. The rotation angle between the stator package 10 and the rotor package 100 may be determined based on these inductive signals.

[0036] For this purpose, the stator package 10 may have a semiconductor chip 21. The semiconductor chip 21 may be electrically conductively connected to the receiving coil device 30, for example, by means of bonding wires 22, and the semiconductor chip may have an integrated circuit, for example an ASIC (application-specific integrated circuit). The integrated circuit may be designed to evaluate the above-mentioned induction signals received by the receiving coil device 30 and determine the rotation angle between the receiving coil device 30 arranged in the stator package 10 and the inductive target device 130 arranged in the rotor package 100 and rotatable relative thereto based on these induction signals.

[0037] The stator package 10 may have a substrate 20. The substrate 20 may, for example, have at least one inorganic material from the group consisting of silicon, glass or ceramics or may be made thereof. The substrate may have a thickness between 50 μm and 800 μm, and preferably between 200 μm and 500 μm.

[0038] At least two metallization layers 11, 12 can be arranged on the substrate 20. At least one of the at least two metallization layers 11, 12 can also be at least partially integrated in the substrate 20. The metallization layers 11, 12 can be metal layers integrated into the substrate, for example in the case of an inorganic substrate. It is also conceivable to design the substrate 20 in the form of a WLB substrate or an eWLB substrate ((e)WLB: (embedded) wafer-level ball grid array). In this case, the metallization layers 11, 12 can be present, for example, in a redistribution layer, a so-called redistribution layer (abbreviated to RDL).

[0039] At least two metallization layers 11, 12 may be arranged in two different planes. The cross section of the layer stack may be such that at least two metallization layers 11, 12 are arranged on the base substrate 20. In other words, the stator package 10 may have a vertical layer stack with at least two vertically stacked planes, wherein at least one metallization layer 11, 12 is arranged in each plane. Thus, the layer stack has at least two metallization layers 11, 12 that are spaced apart vertically from each other. That is, the at least two metallization layers 11, 12 are not arranged laterally adjacent to each other, but are arranged vertically stacked.

[0040] According to the inventive concept described herein, the at least two above-mentioned receiving coils 31 , 32 of the receiving coil arrangement 30 may be realized in thin film technology in the above-mentioned at least two metallization layers 11 , 12 of a vertical layer stack.

[0041] For example, at least two mutually spaced metallization layers 11, 12 can be structured by means of thin-film technology for producing receiving coils 31, 32. The term "thin-film technology" is to be understood as structured metallization deposition (for example by means of sputtering or vapor deposition - with structuring by photolithography). Thin-film technology can also include the fact that the thin so-called seed layer produced in this way is subsequently reinforced by a galvanic process - this can be done by current (galvanisch) or currentless. The dielectric layer can be produced or laminated using spin coating technology. In addition, the production processes known from microelectronics can also be used for thin-film technology.

[0042] In contrast, the term "thick film technology" would include, for example, subtractive techniques, such as in circuit board manufacturing (e.g. etching of copper cladding) or printing of conductive paste with subsequent curing. Thus, structurally, metallization layers manufactured using thin film technology can be distinguished from metallization layers manufactured using thick film technology.

[0043] The advantage of thin-film technology is that smaller structures (structure width and structure spacing) can be realized. In the case of a coil, more turns can thus be represented on the same area.

[0044] Therefore, the application of thin film technology described in the present disclosure in the manufacture of an inductive angle sensor makes it possible to manufacture the above-mentioned receiving coils 31, 32 of the receiving coil arrangement 30 in a very miniaturized form but still with very high precision. The entire stator package 10 can have a footprint (i.e., outer dimensions) of, for example, less than 15 mm or less than 10 mm.

[0045] According to one embodiment, the metallization layers 11 , 12 may each have a layer thickness of 100 nm to 5 μm. Furthermore, the receiving coils 31 , 32 of the receiving coil arrangement 30 , which may be produced in thin-film technology from the metallization layers 11 , 12 , may have one or more turns with a width of 10 μm or less.

[0046] At least one electrically insulating layer 13 can be arranged between at least two mutually spaced metallization layers 11, 12. Since thin-film technology can be used, the advantage here can also be that the electrically insulating layer 13 can be very thin. The electrically insulating layer 13 can, for example, have a layer thickness of approximately 100 nm to approximately 10 μm, and preferably approximately 300 nm. This can facilitate matching, that is, the pairing tolerances of the two receiving coils 31, 32.

[0047] According to the innovative concepts described herein, the stator package 10 may also have an electrically insulating seal or potting compound 23. The potting compound 23 may surround the substrate 20 comprising the semiconductor chip 21 and the receiving coils 31 , 32 . This provides another decisive advantage. With the aid of the potting compound 23, a large number of connections (e.g. bonding wires 22) between the receiving coils 31 , 32 and the semiconductor chip 21 or the integrated circuit can be encapsulated. As a result, the entire stator package 10 can be made more reliable and more robust than the packages in the prior art. In conventional angle sensors according to the prior art, soldered printed conductors are provided on the printed circuit board. These printed conductors may become loose and are susceptible to corrosion. In addition, there is a risk of so-called cold solder joints. Printed circuit boards also tend to delaminate the individual layers due to thermal or mechanical stresses.

[0048] In contrast, the completely encapsulated stator encapsulation 10 described here has significant advantages. The potting compound 23 protects the individual components of the stator encapsulation 10 to a large extent from external influences. In conjunction with the use of thin-film technology to produce the individual receiving coils 31, 32 of the receiving coil arrangement 30, a very miniaturized, highly precise and stable stator encapsulation 10 can be produced, which can also be produced cost-effectively.

[0049] The same applies to the rotor package 100 described herein. The rotor package 100 can also have a substrate 120, on which or in which at least one metallization layer 111 can be arranged. Here, the substrate 120 can also, for example, have at least one inorganic material from the group consisting of silicon, glass or ceramics, or be made thereof. The substrate 120 can have a thickness between 50 μm and 800 μm, and preferably between 200 μm and 500 μm.

[0050] The rotor package 100 can also be manufactured in a miniaturized form. The entire rotor package 100 can, for example, have a footprint (i.e., outer dimensions) of less than 15 mm, or less than 10 mm, or even less than 5 mm. In one embodiment, the rotor package 100 can have an outer dimension of approximately 5×5 mm. The rotor package 100 can be designed as an annular or circular or elliptical shape. In this case, the rotor package 100 can have a diameter of approximately 6 mm to 12 mm.

[0051] The aforementioned inductive target device 130 can be implemented in at least one metallization layer 111. Here, if necessary, thin-film technology can also be applied to produce the target device 130. The target device 130 can have a coil shape or be designed in the form of a solid metal mold. For example, the target device 130 can be made of a thin metal plate, such as a copper plate. The target device 130 can be punched or etched out of a metal plate, for example. The use of thin-film technology can be abandoned here, so that a relatively thick target device 130 can be produced, whose thickness or thickness is about 0.1 mm to 0.5 mm. Such a target device 130 will be more resistant to larger currents.

[0052] The induced currents occurring in the inductive angle sensor 1000 in the excitation coil and in the induction target 130 can be significantly higher than the currents induced in the receiving coils 31, 32 of the receiving coil arrangement 30. This is one reason why the receiving coils 31, 32 according to the concept described here can be produced particularly advantageously using thin-film technology.

[0053] As already mentioned above, the use of thin-film technology can be dispensed with in the production of the target device 130 in order to be able to conduct part of the high current better. For example, a metal plate can preferably be used to produce the target device 130 (e.g. a toothed disc or a lead frame). For the vernier principle, for example, a target device 130 with at least two inductive targets of different pole pitches is required (e.g. 3 and 4 teeth or rings of turns). In this case, on the other hand, it is advantageous to use a substrate and apply a thicker metal layer thereto, for example by means of electroplating. For example, a thin layer can first be applied by means of a sputtering technique, and then this layer can be thickened, for example by electroplating deposition.

[0054] In terms of shape, the target device 130 can be designed as a winding, which can then be manufactured again, for example, by means of thin-film technology. The geometry of the target device 130 can be similar or identical to the geometry of the receiving coils 31, 32 of the receiving coil device 30, for example. In particular, if the target device 130 is designed as a coil, one option would be to implement the substrate 120 in the form of a WLB substrate or an eWLB substrate ((e)WLB: (embedded) wafer-level ball grid array). The target device 130 can be generated from a metallization layer 111, which can be a metallization layer in a redistribution section (so-called redistribution layer, RDL for short) for example.

[0055] The rotor package 100 can also be cast with the aid of a seal or an electrically insulating potting compound 123. That is, the potting compound 123 can surround the substrate 120, which includes the metallization 111 or the inductive target device 130 that can be generated therefrom. The rotor package 100 can thus also be reliably protected from external influences. The appearance of the rotor package 100 can be substantially similar to a sheet-like device.

[0056] Such a rotor encapsulation 100 in the form of a sheet can also be intentionally made thicker and have a thickness of approximately 5 mm, for example. In a so-called shaft end system, this can ensure a sufficiently large distance between the coil and the metallic rotatable shaft 200 (see Figure 4 ), or this could allow the coils to be arranged at right angles to the axis of rotation 201.

[0057] exist Figure 1 Such a rotatable shaft 200 is also shown in the figure. The rotatable shaft 200 can rotate about its rotation axis 201. The inductive angle sensor 1000 shown here as an example is a so-called through-shaft system. Here, the rotatable shaft 200 extends rotatably through the entire stator package 10, viewed in the extension direction of the rotation axis 201 of the rotatable shaft.

[0058] For example, the stator package 10 may have a through hole 25 extending through the base plate 20 for this purpose. The shaft 200 may then extend through the through hole 25. Thus, the shaft 200 may rotate independently of the stator package 10. Or, in other words, the shaft 200 extending through the stator package 10 may rotate while the stator package 10 stops and does not rotate with the shaft 200. The shaft 200 may also extend through the potting compound 23 in the same manner.

[0059] Figure 2 Schematically and not to scale, a top view of a stator package 10 with a through-going shaft 200 is shown. The shaft 200 extends through a through-hole 25 in the base plate 20. The diameter of the through-hole 25 can be, for example, between 2 mm and 5 mm. The shaft 200 can have a slightly smaller diameter, for example a few tenths of a millimeter smaller, so that the shaft can be rotatably guided through the through-hole 25. The shaft 200 can have a diameter of, for example, 1 mm to 4 mm.

[0060] In addition, Figure 2 , also purely schematically and not to scale, shows a section through two metallization layers 11 , 12 spaced vertically apart from one another, in which receiving coils 31 , 32 of a receiving coil arrangement 30 can be produced. The receiving coil arrangement 30 can be annular in shape and surround or enclose the through-opening 25 .

[0061] Here, the different levels of the metallization layers 11, 12 are only schematically indicated by solid and dashed lines. This is intended to indicate that the individual receiving coils 31, 32 extend alternately on two metallization layers 11, 12 or on two planes and can therefore be intertwined with each other. This means that it is not necessarily understood that the first receiving coil 31 is generated only in the first metallization layer 11 and the second receiving coil 32 is generated only in the second metallization layer 12. On the contrary, both metallization layers 11, 12 can be used to generate the two receiving coils 31, 32, wherein the individual coil segments alternate between the first (upper) metallization layer 11 and the second (lower) metallization layer 12, so that the two receiving coils 31, 32 are ultimately intertwined with each other. That is, the wires of one coil 31 are respectively passed through the ring body of the other coil 32. Thus, for example, four coils can be produced in the form of only two layers.

[0062] This alternation of coil segments between two planes of the metallization layers 11, 12 can be realized, for example, in vertical plated through holes or through-holes 210, 220, which are specially provided for this purpose. That is, in these through-holes 210, 220, the coil structure of the receiving coils 31, 32 changes between a first (upper) plane and a second (lower) plane. It can be said that the two receiving coils 31, 32 cross each other in these through-holes 210, 220 and change their respective planes so that the receiving coils 31, 32 do not intersect each other.

[0063] The through holes 210, 220 can be arranged at the outer periphery of the receiving coil device 30 (see through holes 220) or at the inner periphery of the receiving coil device 30 (see through holes 210). Manufacturing the receiving coils 31, 32 with thin film technology provides another advantage of miniaturizing the stator package 10. The through holes 210, 220 can also be manufactured with thin film technology. The diameter of the through holes 210, 220 can be less than 10 μm. This provides the following advantages: in particular, the through holes 210 arranged at the inner periphery of the receiving coil device 30 can be arranged very close to each other. This means that the through holes 210 require significantly less space than conventional through holes in printed circuit boards as have been implemented so far in the prior art. Therefore, the inner diameter of the receiving coil device 30 made with thin film technology described in this article can be significantly reduced compared to conventional systems made with PCB technology.

[0064] Now, the more the inner diameter of the receiving coil arrangement is reduced, the closer the through-holes distributed along this inner diameter move to each other. The diameter of the through-holes on the printed circuit board is 100 μm or more. That is, the smaller the inner diameter of the receiving coil arrangement becomes, the closer the individual through-holes distributed along this inner diameter move to each other, which limits the possible reduction of the inner diameter of the receiving coil arrangement. The inner diameter of the receiving coil arrangement that can be produced in PCB technology is therefore limited to approximately 15 mm, for example. The outer diameter is approximately 25 mm here. The inner diameter of the receiving coil arrangement is provided with a high density of through-holes, so that it is no longer possible to reduce the size further and there is no longer any space for the rotation axis to pass through.

[0065] In contrast, the stator encapsulation 10 disclosed here solves this problem, wherein the receiving coils 31, 32 can be produced using thin-film technology. As described above, through-holes 210, 220 with a diameter of approximately 10 μm or less can also be produced using thin-film technology. As a result, the inner diameter of the receiving coil arrangement 30 can be reduced to 5 mm, while the shaft 200 still passes through the stator encapsulation 10. The outer diameter can also be reduced to approximately 16 mm or less, so that a significantly smaller stator encapsulation 10 can be produced overall.

[0066] As in Figure 2 , the receiving coil arrangement 30 can be designed in an annular manner and extend around the shaft 200. Accordingly, the through-hole 210 arranged at the inner diameter of the receiving coil arrangement 30 can also extend in an annular manner around the shaft 200. In this case, the through-hole 210 can be guided very close to the through-hole 25.

[0067] The perforation 25 may have a shape that allows the shaft 200 (e.g., having a diameter of 1 mm to 5 mm) to be inserted therethrough, while leaving at least a few tenths of a millimeter of air to prevent direct contact and wear. The perforation 25 may be circular, but may also be square, oval or polygonal, such as triangular, rectangular, pentagonal, hexagonal, etc., with or without rounded corners in certain cases. Such a perforation 25 may be difficult to manufacture in some substrates, which may then result in, for example, one of the above-mentioned special geometries (e.g., hexagonal), which deviates from the circular shape shown here purely by way of example.

[0068] Figure 3A and 3B Another possible embodiment of the inductive angle sensor 1000 is shown respectively. These embodiments are similar to those described above with reference to Figure 1 In the embodiments discussed, elements having similar or identical functions are therefore provided with the same reference numerals. Figure 1 In the embodiment shown, the semiconductor chip 21 is asymmetrical, ie is arranged laterally offset relative to the receiving coil arrangement 30. Figure 3A and Figure 3BIn the illustrated embodiment, the semiconductor chip 21 may be arranged substantially centrally or concentrically.

[0069] Figure 3A An embodiment is shown in which the semiconductor chip 21 is arranged on the receiving coil arrangement 30. For example, a dielectric layer (not shown here) can be arranged between the semiconductor chip 21 and the receiving coil arrangement 30. The shaft 200 can extend through the semiconductor chip 21. That is, the semiconductor chip 21 can also have a through-hole 25, through which the shaft 200 extends. When viewed in a top view, the receiving coil arrangement 30 will be arranged around the semiconductor chip 21 at least here with its outer diameter. The semiconductor chip 21 can be arranged centrally with respect to the shaft 200 or the receiving coil arrangement 30.

[0070] Figure 3B An alternative embodiment is shown. In this case, the inner diameter of the receiving coil arrangement 30 can be enlarged so that the semiconductor chip 21 can be arranged in the receiving coil arrangement 30 on the substrate 20. In this case, the axis 200 can also extend through the semiconductor chip 21 again. In the top view, the receiving coil arrangement 30 would be arranged with its outer diameter and inner diameter around the semiconductor chip 21. The semiconductor chip 21 can be arranged centrally relative to the axis 200 or the receiving coil arrangement 30.

[0071] As already mentioned at the outset, the inductive angle sensor 1000 presented here can be a so-called stub system or a through-shaft system. Up to now, a through-shaft system has been described purely by way of example.

[0072] Figure 4 An example of a shaft end system is shown. In addition to the embodiments discussed so far, an external component board 300 is also shown here. The component board 300 can be, for example, a PCB. The excitation coil 40 can be arranged at, in or on the component board 300. The excitation coil 40 can be electrically conductively connected to the semiconductor chip 21 or the integrated circuit arranged in the stator package 10 by means of a suitable current connection, for example by means of a bonding wire 220.

[0073] Alternatively, it is also conceivable that the excitation coil 40 is arranged in the stator package 10. Here, the excitation coil 40 can be designed in at least one of the at least two metallization layers 11, 12 using thin-film technology, or the excitation coil 40 can be designed in at least one third metallization layer using thin-film technology, and the substrate 20 is arranged on the third metallization layer. In this case, the excitation coil 40 can also be cast in the potting material 23 and electrically connected to the semiconductor chip 21, and can be excited by an alternating current to generate a magnetic field.

[0074] from Figure 4As can be seen in FIG. 1 , the stator package 10 can be arranged on the component plate 300 and optionally fixed thereto. For example, the stator package 10 can be bonded, glued to the component plate 300, or otherwise fixed on the component plate 300. Therefore, the stator package 10 itself can be designed without a circuit board. Optionally, if Figure 4 As shown, the excitation coil 40 is to be arranged in an external component plate 300, for example, and the stator package 10 without a circuit board can be arranged on such an external circuit board (or component plate) 300. However, the stator package 10 itself will be designed without a circuit board in this case.

[0075] The stator package 10 may be non-movable or non-rotatable. In contrast, the rotor package 100 may be movable or rotatable and may rotate relative to the non-rotatable stator package 10. For this purpose, the rotor package 100 may be arranged on an end section of a rotatable shaft 200. For example, the rotor package 100 may be mounted to the end of the shaft 200 by means of an adhesive 28. Thus, the rotor package 100 may rotate with the rotatable shaft 200. The rotor package 100 and the stator package 10 may be spaced apart from each other so that they do not contact. That is, there is an axial air gap 29 between the stator package 10 and the rotor package 100, which prevents undesirable direct contact between the stator package 10 and the rotor package 100.

[0076] Figure 5 An embodiment of an inductive angle sensor 1000 according to the through-shaft principle is shown. Here, a rotatable shaft 200 can extend both through the stator encapsulation 10 and through the rotor encapsulation 100 and optionally through a component plate 300. The component plate 300 together with the excitation coil 40 arranged therein can each have a through-hole 25 through which the rotatable shaft 200 extends.

[0077] The through hole 25 may have a slightly larger diameter than the rotatable shaft 200 so that the shaft 200 may rotate within the through hole 25. That is, both the stator package 10 and the component plate 300 may have a radial air gap 27 between the shaft 200 and the through hole, which prevents direct contact between the shaft 200 and the stator package 10 or between the shaft 200 and the component plate 300.

[0078] The rotor package 100 may also have a through hole 25, the diameter of which may be slightly larger than the diameter of the shaft 200. The rotor package 100 may be mounted to the shaft 200 in a rotationally fixed manner. For example, the rotor package 100 may be bonded to the shaft 200 by means of an adhesive 26. Thus, the rotor package 100 rotates with the shaft 200, while the shaft 200 rotates in the stationary stator package 10.

[0079] The stator encapsulation 10 and the rotor encapsulation 100 are preferably always contact-free. In addition, the stator encapsulation 10 can advantageously be oriented centered on the rotation axis 121 of the rotatable shaft 120. Figure 4 ), the rotor package 100 can be glued to the end face of the shaft end, and the stator package 10 can be arranged in front of it at an axial distance of about 1mm to 2mm. Figure 5 ), the shaft 120 can be, for example, "infinitely long", i.e. the shaft end is not suitable for the angle sensor 100. Both the rotor housing 100 and the stator housing 10 can have a hole 25 through which the shaft 120 passes. The rotor package 100 can be annular and fixed to the shaft 120. The stator package 10 can also be arranged in an annular shape and be 1 mm to 2 mm away from the rotor package 100.

[0080] Figure 6 A schematic block diagram is shown for illustrating a method for manufacturing the stator package 10 described herein.

[0081] In step 601 , a substrate 20 is provided, and at least two metallization layers 11 , 12 arranged in different planes are arranged on the substrate 20 .

[0082] In step 602, a receiving coil device 30 is generated with at least two conductive receiving coils 31, 32, which are designed to receive a magnetic field radiated by an inductive target device 130 rotatable relative to the stator package 10 and generate an inductive signal in response to the inductive signal.

[0083] In step 603, a semiconductor chip 21 is arranged on or next to the substrate 20 and is electrically contacted to the receiving coil arrangement 30, wherein the semiconductor chip 21 has a circuit designed to evaluate the induction signal and to determine the rotation angle between the receiving coils 31, 32 and the induction target arrangement 130 rotatable relative thereto based on the induction signal.

[0084] In step 604 , an electrically insulating potting compound 23 is applied so as to surround the substrate 20 including the semiconductor chip 21 and the receiving coils 31 , 32 .

[0085] According to the innovative concept described here, the two receiving coils 31 , 32 are realized in two metallization layers 11 , 12 during the production of the stator encapsulation 10 using thin-film technology.

[0086] Figure 7 A schematic block diagram is shown for illustrating a method for manufacturing a rotor package 100 described herein.

[0087] In step 701 , a substrate 120 is provided, and at least one metallization layer 111 is arranged on the substrate 120 .

[0088] In step 702, an induction target device 130 with at least one conductive induction target 131 is generated, the induction target device being designed to generate an induction current in response to a magnetic field radiated by an excitation coil 40, and to generate a magnetic field corresponding to the induction current, and to radiate the magnetic field in the direction 10 of the stator package. Here, the at least one induction target 131 of the target device 130 is implemented in at least one metallization layer 111.

[0089] In step 703 , an electrically insulating seal or potting material 123 is applied so as to surround the substrate 120 including the target device 130 .

[0090] In step 704 , the rotor package 100 is arranged in a rotationally fixed manner on the rotatable shaft 200 , such that the rotor package 100 is rotatable relative to the stator package 10 .

[0091] In other words, the innovative concepts described herein will be summarized again below and their advantages mentioned.

[0092] One object of the concepts described herein is to manufacture a stator package 10 with a size of about 5 mm to 15 mm, and preferably less than 10 mm, having a chip 21 with circuits and receiving coils 31, 32 (and optionally also with an excitation coil 40). Another object of the concepts described herein is to manufacture a rotor package 100 with a size of about 5 mm to 15 mm, and preferably less than 10 mm, having a target device 130 with one or more inductive targets 131. The inductive targets 131 can be, for example, simple conductive components or planar coils, each having an n-fold symmetry (n>1, i.e. having at least two radial projections with 360° / n symmetry).

[0093] No high currents are induced in the receiving coils 31, 32. Therefore, the receiving coils 31, 32 can have very small line dimensions without showing significant losses in signal quality. Only the impedance is slightly affected. However, this can be offset by the effective bandwidth of the sensor. Parasitic effects such as leakage currents, electrostatic discharges and inductances on the coils or on the connections between the coils and the semiconductor chip are not very critical.

[0094] Manufacturing the coils 31, 32 with thin film technology makes it possible to maintain full control over the high-precision manufacturing process of the receiving coils 31, 32. The application of thin film technology allows better control of the purity of the materials to be used and the process parameters, which again leads to improved reliability in the manufacture of the coils 31, 32 compared to conventional PCB technology. Terminal testing can be performed on the complete subsystem consisting of the chip 21 and the receiving coils 31, 32. In addition, the coils 31, 32 are surrounded by the potting material 23, which reliably protects the coils 31, 32 from external influences. For these reasons, the coils 31, 32 can be checked for integrity during operation without any resistors, which again improves accuracy and reduces manufacturing costs. The alignment of the individual metallization layers 11, 12 with each other is better than in PCB technology. The more precise geometry of the coils 31, 32 improves accuracy and reduces process variations. The smaller overall size of the stator package 10 reduces inductance overall.

[0095] The coils 31, 32 can be arranged on the same side of the substrate 20 and stacked on each other. This results in high-precision alignment. The stator package 10 can be arranged so that the coils 31, 32 disposed therein point in the direction of the rotor package 100, or so that the coils 31, 32 point in a direction away from the rotor package 100. The latter arrangement increases the vertical distance between the receiving coils 31, 32 in the stator package 10 and the target device in the rotor package 100. However, since the risk of collision is reduced, the safety and robustness of the angle sensor 1000 can be improved.

[0096] For PCBs, an increased number of metallization layers would cause the substrate to fall apart. This is not the case in the concept described in this article, so it is possible to consider providing a higher number of metallization layers. This could, for example, create redundant coils and electrostatic shielding, which would be difficult to implement in PCB technology.

[0097] Despite the relatively small size of the receiving coils 31, 32, with an outer diameter of, for example, 12 mm, a hole 25 of about 2 mm to 4 mm in diameter can be provided, through which the rotatable shaft 200 can pass. Even if the coils 31, 32 are produced on a silicon substrate 20, such a hole 25 can be formed in the silicon. In this regard, it would be advantageous if the silicon substrate 20 is thinner than conventional substrates. The initial thickness of the wafer is about 750 μm, and the wafer is usually thinned to 220 μm. In order to produce the hole 25 mentioned at the beginning, it is conceivable to thin the substrate 20 to 50 μm. This would allow a through shaft 200 of about 2-3 mm in diameter to be accommodated.

[0098] If the substrate 20 is a silicon substrate, it can be manufactured with a cost-effective semiconductor process, wherein for example only two metallization layers 11, 12 (with a coarse resolution of, for example, about 1 μm to about 2 μm) and an insulating layer 13 arranged therebetween and optionally a final passivation layer are applied on the unprocessed wafer. This will be significantly cheaper than the usual expensive semiconductor processes with a resolution of 125 nm, in which about 20 to 35 layers are applied for the circuit.

[0099] For the reasons mentioned above, it may be advantageous to apply manufacturing techniques that are finer than PCB technology for manufacturing receiving coils 31, 32 with an outer diameter of less than 15 mm. It may be proposed to manufacture the receiving coils 31, 32 with the thin film technology described herein, to use, for example, metal layers in the redistribution layer of a wafer-level package, such as a (e)WLB package, or to apply microelectronic manufacturing technology, in which the receiving coils 31, 32 are made, for example, in metallization layers of an inorganic substrate such as glass, ceramic or silicon, using, for example, the same technology as that used to manufacture connections in microelectronic circuits. Both technologies allow the realization of conductors and vias with dimensions ranging from 10 μm or less (compared to vias with a thickness of more than 100 μm in PCB technology).

[0100] The aforementioned (e) WLB package is susceptible to mechanical stresses imposed on the solder balls, especially if the package is larger than 15 x 15 mm and the temperature profile is challenging. In this case, it will be considered to make electrical connections with only a few solder balls in a small area, that is, although other solder balls are still present, these solder balls can only be used for mechanical support, that is, they will not be used for electrical contact and will not be soldered to the soldering points on the component board 300 (they are only present to prevent the stator package 10 from tilting before soldering).

[0101] The excitation coil 40 can also be arranged in the stator package 10, for example on the same substrate 20 as the receiving coils 31, 32 (for example, a silicon substrate in the case of a (e)WLB package). The production of the excitation coil 40 is not very difficult. In this case, a small number of turns of wire around the receiving coils 31, 32 is usually sufficient. In addition, the wire of the excitation coil 40 is usually thicker than the wire of the receiving coils 31, 32. Therefore, the excitation coil 40 (or multiple excitation coils) can be realized on a component board 300, on which the stator package 10 can also be arranged (see Figure 4 and 5). This offers the advantage of a simple implementation. On the other hand, it may be advantageous to integrate the field coil(s) 40 into the stator package 10. This offers the advantage of fewer statistical anomalies in the (capacitive and / or inductive) cross-coupling between the field coil 40 and the receiving coils 31, 32, and offers the possibility of increasing process reliability when manufacturing the field coil 40.

[0102] It is also conceivable to add more discrete electronic components to the stator package 10. For example, the inductive angle sensor 1000 can be expanded by a capacitor to cause the excitation coil 40 to resonate. For example, it would be more cost-effective to integrate the capacitor into the stator package 10 (for example, into the (e)WLB package). If the inductive target 130 is designed as a coil, a series capacitor can be added to cause the target 130 to resonate. If the receiving coils 31, 32 have an n-fold symmetry, it is advantageous that the target 130 also has the same n-fold symmetry.

[0103] As mentioned further above, the rotor package 100 may substantially have a tablet-like shape. The approximately tablet-like rotor package 100 may have a diameter of about 6 mm to 12 mm and be fixed on the rotatable shaft 200 .

[0104] Different types of inductive angle sensors 1000 can be manufactured using the concepts described herein. At least two receiving coils 31, 32 can be designed as a sine coil and a cosine coil for a two-phase angle sensor 1000, for example. In the case of a three-phase angle sensor 1000, at least three receiving coils 31, 32 can be provided, for example u, v and w coils. For example, a plurality of receiving coil devices can be provided, each receiving coil device having two or more receiving coils. For example, the stator package 10 can have two receiving coil devices, wherein the receiving coils of the first receiving coil device can have an n-fold symmetry, and the receiving coils of the second receiving coil device can have an m-fold symmetry, for example when n=1, m>>1 (for example 11), or n>>1 (for example 11), and m=n+1. The signal combination of the two receiving coil devices can provide an angle measurement result that is clear over a full 360° angular rotation. In contrast, an angle sensor 1000 having a single receiving coil arrangement with n-fold symmetry can provide an angle measurement result that is clear at least over 360° / n. However, for reasons of redundancy, two receiving coil arrangements may also be used.

[0105] The substrate 20 in the stator package 10 and the substrate 120 in the rotor package 100 can both be, for example, glass substrates (e.g., borax) with a thickness of 500 μm to 750 μm. The metallization layers 11, 12 can be applied to the substrate 20, for example, by means of titanium metallization, and can be structured by means of high-frequency etching. An oxide or nitride insulating layer can be arranged between the metallization layers 11, 12. In the rotor substrate 120, for example, a target device 130 with one or two inductive targets can be implemented in two metallization layers.

[0106] The rotor package 100 may have, for example, a substantially circular or oval shape. The stator substrate 20 may preferably be rectangular and may implement two or four receiving coils and optionally one excitation coil in two or four metallization layers.

[0107] Depending on the embodiment (through shaft or shaft end), a centrally arranged hole 25 can optionally be provided in the stator package 10 and / or the rotor package 100, through which the rotatable shaft 200 can pass. The semiconductor chip 21 can be arranged on the stator substrate 20 and electrically connected to the receiving coil and to the excitation coil. The stator package 10 and the rotor package 100 can be cast with the aid of a potting compound 23, 123, respectively. Corresponding markings can be applied to the potting compound on the sides of the packages 10, 100 that are opposite to each other during operation.

[0108] The above embodiments are merely illustrative of the principles of the concepts described herein, and it should be understood that modifications and variations of the arrangements and details described herein will be apparent to other skilled persons. Therefore, it is intended that the concepts described herein are limited only by the scope of protection of the appended patent claims, and not by the description herein with reference to the exemplary embodiments and the specific details presented herein.

[0109] Although some aspects have been described in conjunction with devices, it should be understood that these aspects also represent descriptions of corresponding methods, and thus the blocks or components of the devices should also be understood as corresponding method steps or features of method steps. Similarly, aspects that have been described in conjunction with or as method steps also represent descriptions of details or features of corresponding modules or corresponding devices.

Claims

1. A stator package (10) for use in an inductive angle sensor (1000), wherein the stator package (10) comprises: A substrate (20) on which at least two metallization layers (11, 12) arranged in different planes and a plurality of through holes penetrating the at least two metallization layers are arranged; A receiving coil device (30) having at least two electrically conductive receiving coils (31, 32), wherein the receiving coil device (30) is designed to: receive a magnetic field radiated by an inductive target device (130) rotatable relative to the stator package (10), and generate an induction signal in response to the magnetic field; a semiconductor chip (21) which is electrically conductively connected to the receiving coil arrangement (30), wherein the semiconductor chip (21) has an integrated circuit which is designed to: evaluate the induction signal and determine, based on the induction signal, a rotation angle between the receiving coil arrangement (30) and the induction target arrangement (130) which is rotatable relative to the receiving coil arrangement; an electrically insulating potting compound (23) surrounding the substrate (20) including the semiconductor chip (21) and the receiving coils (31, 32), The two receiving coils (31, 32) are alternately implemented in the two metallization layers (11, 12) respectively using thin film technology, and each receiving coil comprises a transition section extending from one metallization layer to the other metallization layer through a corresponding through hole, wherein the two receiving coils (31, 32) do not intersect with each other, but the projections of the receiving coils (31, 32) on the substrate are intertwined with each other.

2. The stator package (10) according to claim 1, wherein the stator package (10) is designed without a circuit board.

3. The stator package (10) according to claim 1 or 2, wherein the substrate (20) comprises at least one inorganic material from the group consisting of silicon, glass or ceramic.

4. The stator package (10) according to claim 1 or 2, wherein the substrate is made of at least one inorganic material from the group consisting of silicon, glass or ceramics.

5. The stator encapsulation (10) according to claim 1 or 2, wherein the area enclosed by the receiving coil device (30) is at least three times the area enclosed by the semiconductor chip (21), and / or wherein the outer diameter of the receiving coil device (30) is less than or equal to 16 mm.

6. The stator package (10) according to claim 1 or 2, wherein at least one of the receiving coils (31, 32) of the receiving coil device (30) is arranged around the semiconductor chip (21) in a top view, or wherein the semiconductor chip (21) is laterally offset relative to the receiving coil device (30).

7. The stator package (10) according to claim 1 or 2, The through hole comprises a conductive plated through hole (210) with a diameter less than 10 μm between the at least two metallization layers (11, 12), The receiving coil arrangement (30) is designed in an annular shape, and the electrically conductive plated through-holes (210) are arranged along the inner diameter of the annular receiving coil arrangement (30).

8. The stator encapsulation (10) according to claim 1 or 2, further comprising a through hole (25) extending through the substrate (20) and an axis (200), wherein the axis can rotatably extend through the through hole (25) in the substrate (20) and through the entire stator encapsulation (10), wherein the receiving coil device (30) is annularly surrounding the through hole (25) in the substrate (20) and is arranged around the axis (200).

9. A stator package (10) according to claim 1 or 2, wherein the receiving coil device (30) and the semiconductor chip (21) are arranged on the same side of the substrate (20), and / or wherein the receiving coils (31, 32) of the receiving coil device (30) are stacked on each other on the same side of the substrate (20).

10. A stator package (10) according to claim 1 or 2, wherein the stator package (10) is designed as a wafer-level ball grid array (WLB) package or an embedded wafer-level ball grid array (eWLB) package, and wherein the at least two metallization layers (11, 12) are designed in a redistribution area of ​​the stator package (10), and the redistribution area is a so-called redistribution layer.

11. The stator encapsulation (10) according to claim 1 or 2, wherein the stator encapsulation (10) has a footprint of less than 15 mm.

12. The stator encapsulation (10) according to claim 1 or 2, wherein the stator encapsulation (10) has a footprint of less than 10 mm.

13. The stator encapsulation (10) according to claim 1 or 2, wherein the metallization layer (11, 12) has a layer thickness of 100 nm to 5 μm, and / or wherein the receiving coil (31, 32) of the receiving coil arrangement (30) has one or more turns with a width of 10 μm or less.

14. The stator package (10) according to claim 1 or 2, wherein the substrate (20) has a thickness between 50 μm and 800 μm.

15. The stator encapsulation (10) according to claim 1 or 2, wherein a dielectric layer (13) having a layer thickness of 100 nm to 10 μm is arranged between the at least two metallization layers (11, 12).

16. A stator package (10) according to claim 1 or 2, wherein the excitation coil (40) is designed in at least one of the at least two metallization layers (11, 12) using thin-film technology, or wherein the excitation coil (40) is designed in at least one third metallization layer on which the substrate (20) is arranged using thin-film technology, and wherein the excitation coil (40) is conductively connected to the semiconductor chip (21) and can be excited by alternating current to generate a magnetic field.

17. A stator package (10) according to claim 1 or 2, wherein the stator package (10) can be arranged on a component plate (300) separated from the substrate (20) and having an excitation coil (40), and wherein the stator package (10) has a connection area, by means of which the semiconductor chip (21) arranged in the stator package (10) can be connected to the excitation coil (40).

18. A rotor package (100) for use in an inductive angle sensor (1000) together with a stator package (10) according to any one of claims 1 to 17, wherein: The rotor package (100) comprises: A substrate (120) on which at least one metallization layer (111) is arranged; An induction target device (130) having at least one conductive induction target (131), the conductive induction target being designed to: generate an induction current in response to a magnetic field radiated by an excitation coil (40), generate a magnetic field corresponding to the induction current, and radiate the magnetic field in the direction of the stator package (10); an electrically insulating seal or potting compound (123) surrounding the substrate (120) including the target device (130), The rotor encapsulation (100) is arranged on the shaft (200) in a rotationally fixed manner and is rotatable relative to the stator encapsulation (10), and The at least one sensing target (131) of the target device (130) is implemented in the at least one metallization layer (111).

19. An inductive angle sensor (1000) having a stator package (10) according to any one of claims 1 to 17 and having a rotor package (100) according to claim 18.

20. The inductive angle sensor (1000) of claim 19, further comprising a rotating shaft (200), wherein the shaft (200) extends through the stator package (10) and is rotatable relative to the stator package (10), and The rotor encapsulation (100) is arranged in a rotationally fixed manner on a section of the shaft (200) that protrudes from the stator encapsulation (10).

21. A method for manufacturing a stator package (10) according to any one of claims 1 to 17, wherein the method comprises the following steps: Providing a substrate (20), and arranging at least two metallization layers (11, 12) arranged in different planes on the substrate (20); Producing a receiving coil arrangement (30) with at least two electrically conductive receiving coils (31, 32), wherein the receiving coil arrangement (30) is designed to: receive a magnetic field radiated by an inductive target arrangement (130) rotatable relative to the stator package (10), and generate an inductive signal in response to the magnetic field; Arranging a semiconductor chip (21) on or next to the substrate (20) and electrically contacting the semiconductor chip (21) with the receiving coil arrangement (30), wherein the semiconductor chip (21) has a circuit designed to: evaluate the induction signal and determine, based on the induction signal, a rotation angle between the receiving coil arrangement (30) and the induction target arrangement (130) rotatable relative to the receiving coil arrangement; applying an electrically insulating potting compound (23) surrounding the substrate (20) including the semiconductor chip (21) and the receiving coil arrangement (30); The at least two receiving coils (31, 32) of the receiving coil arrangement (30) are implemented in the two metallization layers (11, 12) using thin-film technology.

22. A method for manufacturing a rotor package (100) according to claim 18, wherein the rotor package is used in an inductive angle sensor (1000) together with a stator package (10) according to any one of claims 1 to 17, wherein the method comprises the following steps: Providing a substrate (120), and arranging at least one metallization layer (111) on the substrate (120); Producing an induction target device (130) with at least one conductive induction target (131), wherein the conductive induction target (131) is designed to: generate an induction current in response to a magnetic field radiated by an excitation coil (40), generate a magnetic field corresponding to the induction current, and radiate the magnetic field in the direction of the stator package (10); wherein the at least one sensing target (131) of the target device (130) is implemented in the at least one metallization layer (111); applying an electrically insulating seal or potting compound (123) surrounding the substrate (120) including the target device (130); and The rotor encapsulation (100) is arranged in a rotationally fixed manner on a rotatable shaft (200), so that the rotor encapsulation (100) can rotate relative to the stator encapsulation (10).

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