Display panel, display device and manufacturing method

By making the connecting leads on the display panel on the inorganic protective layer and performing specific process processing during the ITO sputtering process, the problems of ITO leads falling off and high resistivity are solved, and more stable connections and higher luminescence are achieved efficiency.

CN113013215BActive Publication Date: 2025-01-03BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202110220398.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-02-26
Publication Date
2025-01-03
Estimated Expiration
2041-02-26

AI Technical Summary

Technical Problem

In the prior art, the ITO lead film layer is prone to fall off on the display panel, has a large resistivity, and the organic substrate is prone to blackening, affecting the service life and luminous efficiency of the under-screen camera.

Method used

The connecting lead is made on the inorganic protective layer, and the bonding force with the lead is increased through the inorganic protective layer, and oxygen UV irradiation and oxygen plasma processes are carried out during the ITO sputtering film formation process to reduce the resistivity and avoid the substrate from blackening.

Benefits of technology

It improves the bonding force of the connecting leads, reduces the resistivity, avoids the blackening of the substrate, extends the service life of the display panel and improves the luminous efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a display panel, a display device and a preparation method. The display panel includes a transparent substrate and a first display area and a second display area located on the transparent substrate. The first display area is provided with a plurality of first light-emitting device units arranged in an array, and the second display area is provided with a plurality of first drive units arranged in an array. Each of the first drive units is connected to one of the first light-emitting device units through a connecting lead, and the corresponding first light-emitting device unit is driven to emit light by the first drive unit; wherein the connecting lead is made on an inorganic protective layer. With this display panel, the connecting lead connected to the light-emitting device unit arranged on the camera light-transmitting area is made on the inorganic protective layer to increase the bonding force with the connecting lead, reduce the resistivity, and avoid the problem of blackening of the substrate.
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Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel, a display device and a manufacturing method thereof. Background Art

[0002] At present, with the market development demand for full-screen display, integrating the camera under the display panel has become the main direction of current display device structure design.

[0003] For the camera integrated under the display panel, in order to realize the shooting function, the area of ​​the display panel corresponding to the camera is required to be set as a display area that can transmit light. Based on this structural requirement, the entire display panel usually includes a camera area, a normal display area surrounding the camera area, and a transition area between the normal display area and the camera area. In order to ensure the normal display and light transmission functions of the camera area at the same time, the light-emitting device unit in the camera area is connected to the driving unit in the transition area through an indium tin oxide ITO lead, and the driving unit in the transition area drives the light emission.

[0004] In common technology, ITO leads are made on a flat organic substrate, but the bonding force between the ITO lead film layer and the organic substrate is poor, and the ITO lead film layer is prone to fall off. In addition, the organic substrate is prone to outgassing in a vacuum environment, which affects the deposition of the film and makes the resistivity of the ITO lead prepared on the organic substrate too high. At the same time, the polymer chains in the organic substrate are cracked by particle bombardment to produce carbon, which produces compounds with the film layer, causing the substrate to turn black, seriously affecting the service life and luminous efficiency of the under-screen camera product. Summary of the invention

[0005] The purpose of the technical solution of the present invention is to provide a display panel, a display device and a preparation method, which are used to solve the problems of the ITO lead film layer being easy to fall off, the resistivity being too high and the base being easy to blacken in the display panel using an under-screen camera in the prior art.

[0006] An embodiment of the present invention provides a display panel, comprising a transparent substrate and a first display area and a second display area located on the transparent substrate, wherein a plurality of first light emitting device units arranged in an array are disposed on the first display area, and a plurality of first driving units arranged in an array are disposed on the second display area, wherein:

[0007] Each of the first driving units is connected to one of the first light-emitting device units through a connecting lead, and the first driving unit drives the corresponding first light-emitting device unit to emit light; wherein the connecting lead is made on the inorganic protective layer.

[0008] Optionally, in the display panel, a flat layer is formed on a side of the connecting lead away from the transparent substrate, the flat layer is connected to the connecting lead and covers the entire first display area and the second display area.

[0009] Optionally, in the display panel, the first light-emitting device unit includes a first anode, a first cathode, and a first light-emitting layer between the first anode and the first cathode, which are arranged on a side of the flat layer away from the transparent substrate; the first driving unit includes a first active layer, a first gate, and a first source / drain layer, which are arranged between the transparent substrate and the inorganic protective layer;

[0010] The connecting lead is connected to the source or drain of the first source / drain layer through a first via hole penetrating the inorganic protective layer, and the first anode is connected to the connecting lead through a second via hole penetrating the planar layer.

[0011] Optionally, the display panel further comprises a third display area, the third display area is arranged around the first display area, and the second display area is arranged between the first display area and the third display area;

[0012] Wherein, a plurality of pixel structures arranged in an array are provided on the third display area, and each pixel structure comprises a second light emitting device unit and a second driving unit;

[0013] The distribution density of the plurality of pixel structures on the third display area is greater than the distribution density of the plurality of the first light emitting device units on the first display area.

[0014] Optionally, in the display panel, the second driving unit includes a second active layer, a second gate and a second source / drain layer arranged in sequence between the transparent substrate and the second light-emitting device unit, wherein the inorganic protective layer extends to the third display area and covers the third source / drain layer.

[0015] Optionally, in the display panel, a flat layer is provided on a side away from the inorganic protective layer in the third display area, and the second light-emitting device unit includes a second anode, a second light-emitting layer and a second cathode, which are located on a side of the flat layer away from the transparent substrate and are arranged in sequence, wherein the second anode is connected to the source or drain of the second source / drain layer through a third via hole penetrating the flat layer and the inorganic protective layer.

[0016] Optionally, in the display panel, a plurality of array-arranged pixel structures are further provided on the second display area, and a distribution density of the plurality of pixel structures on the second display area is less than a distribution density of the plurality of pixel structures on the third display area.

[0017] Optionally, in the display panel, the inorganic protective layer is a silicon oxide layer.

[0018] An embodiment of the present invention further provides a display device, comprising a display panel as described in any one of the above items.

[0019] An embodiment of the present invention further provides a preparation method, which is applied to the display panel as described in any one of the above items, and the method comprises:

[0020] Manufacturing a plurality of first drive units arranged in an array on the second area of ​​the transparent substrate, wherein the insulating layer when manufacturing the first drive units extends to the first area of ​​the transparent substrate;

[0021] Manufacturing an inorganic protective layer on the first driving unit, wherein the inorganic protective layer covers the entire first region and the second region;

[0022] A plurality of connecting leads are fabricated on the inorganic protective layer, wherein a first end of each of the connecting leads is connected to one of the first driving units through a via hole penetrating the inorganic protective layer;

[0023] In the first area, a plurality of first light emitting device units arranged in an array are manufactured, and each of the first light emitting device units is connected to a second end of the connecting lead.

[0024] Optionally, in the preparation method, after forming a plurality of connecting leads on the inorganic protective layer, the method further comprises:

[0025] Making a flat layer on the connecting lead; the flat layer covers the entire first area and the second area;

[0026] A plurality of the first light emitting device units are manufactured on the planar layer, and are respectively connected to the second end of one of the connecting leads through via holes penetrating the first light emitting device units.

[0027] Optionally, the preparation method further comprises:

[0028] A synchronous process of manufacturing a plurality of arrays of first drive units on a second area of ​​the transparent substrate and manufacturing a plurality of arrays of second drive units on a third area of ​​the transparent substrate;

[0029] When the inorganic protective layer is formed on the first driving unit, the formed inorganic protective layer also extends to cover the plurality of the second driving units;

[0030] A simultaneous process of manufacturing a plurality of arrays of first light emitting device units on a first region of a transparent substrate and manufacturing a plurality of arrays of second light emitting device units on a third region.

[0031] Optionally, the preparation method, wherein a plurality of connecting leads are made on the inorganic protective layer, comprises:

[0032] A plurality of connecting leads are produced by ITO sputtering film formation, and oxygen UV irradiation and oxygen plasma process are performed during the sputtering process.

[0033] At least one of the above technical solutions in the specific embodiment of the present invention has the following beneficial effects:

[0034] The display panel described in the embodiment of the present invention has the connecting leads connected to the light-emitting device units arranged on the camera light-transmitting area made on the inorganic protective layer to increase the bonding force with the connecting leads, reduce the resistivity, and avoid the problem of blackening of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram of a planar structure of a display panel according to an embodiment of the present invention;

[0036] Figure 2 A schematic diagram for illustrating the distribution structure of various device units in different display areas on a display panel according to an embodiment of the present invention;

[0037] Figure 3 A schematic diagram of the cross-sectional structure of a display panel according to an embodiment of the present invention is provided;

[0038] Figure 4 The present invention is a schematic diagram of a process for describing a method for manufacturing a display panel according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and advantages to be solved by the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0040] In order to solve the problems in the prior art of display panels using under-screen cameras, that the ITO lead film layer is easy to fall off, the resistivity is relatively high, and the base is easy to blacken, the embodiments of the present invention provide a display panel, so that the connecting leads connected to the light-emitting device units arranged on the camera's light-transmitting area are made on an inorganic protective layer to increase the bonding force with the connecting leads, reduce the resistivity, and avoid the problem of base blackening.

[0041] To clearly illustrate the structure of the display panel according to the embodiment of the present invention, the following first combines Figure 1 and Figure 2 The regional distribution of the display panel described in the embodiment of the present invention is described.

[0042] like Figure 1 and Figure 2 As shown, the display panel described in the embodiment of the present invention includes a first display area 11 , a second display area 12 and a third display area 13 .

[0043] Optionally, the first display area 11 and the second display area 12 are formed as a light-transmitting display area, wherein when the display panel is installed on an electronic device, a photosensitive element such as a camera can be installed inside the electronic device at a position corresponding to the first display area 11, for capturing images through the first display area 11, thereby forming an under-screen camera display structure.

[0044] Optionally, the third display area 13 is arranged around the first display area 11, the second display area 12 is located between the first display area 11 and the third display area 13, and the second display area 12 is connected to the first display area 11 and the third display area 13 respectively to form a transition area between the first display area 11 and the third display area 13. The first display area 11, the second display area 12 and the third display area 13 are combined to form the entire display area of ​​the display panel.

[0045] Optionally, the entire display area of ​​the display panel can be a light-transmitting display area, or only the first display area 11 and the second display area 12 are combined to form a light-transmitting display area of ​​the display panel, for realizing image acquisition of the under-screen camera. In one embodiment, the display panel is an OLED display panel.

[0046] In the embodiment of the present invention, optionally, the first display area 11, the second display area 12 and the third display area 13 are manufactured on a transparent substrate.

[0047] In addition, combined Figure 2 As shown, on the display panel described in the embodiment of the present invention, a plurality of first light emitting device units 100 arranged in an array are disposed on the first display area 11 , and a plurality of first driving units 200 arranged in an array are disposed on the second display area 12 .

[0048] Optionally, in order to form an under-screen camera display structure, in the first display area 11, multiple first light-emitting device units 100 are made of light-transmitting materials to form a light-transmitting effect in the first display area 11; optionally, the first light-emitting device unit 100 is not limited to being made of only light-transmitting materials, and the light-transmitting function of the gaps between the multiple first light-emitting device units 100 that are spaced apart can also be used to form a light-transmitting effect in the first display area 11.

[0049] Optionally, in the second display area 12, multiple first driving units 200 are made of light-transmitting material to form a light-transmitting effect in the second display area 12; of course, optionally, the first driving unit 200 is not limited to being made of only light-transmitting material, and the light-transmitting function of the intervals between the multiple first driving units 200 distributed at intervals can also be used to form the light-transmitting effect in the second display area 12.

[0050] In the embodiment of the present invention, each first driving unit 200 of the second display area 12 is connected to one of the first light-emitting device units 100 through a connecting wire 300, and the first driving unit 200 can drive the corresponding first light-emitting device unit 100 to emit light.

[0051] Optionally, in an embodiment of the present invention, the display panel is an OLED display panel, the first light-emitting device unit 100 is an OLED light-emitting unit in an OLED pixel unit, and the first driving unit 200 is a driving unit in the OLED pixel unit for driving the OLED light-emitting unit to emit light.

[0052] The display panel described in this embodiment is adopted, and the first light-emitting device unit 100 and the first driving unit 200 for driving the first light-emitting device unit 100 to emit light are distributed in different areas to meet the light transmission function requirements of the first display area 11 and the second display area 12; in addition, through the one-to-one connection of multiple first light-emitting device units 100 and multiple first driving units 200, the first light-emitting device unit 100 of the first display area 11 is realized to display images in the first display area 11. Optionally, multiple array-arranged pixel structures 400, i.e., pixel units, are also respectively provided on the second display area 12 and the third display area 13. Among them, the second display area 12 and the third display area 13 can realize image display through the pixel structures 400 respectively provided.

[0053] In one embodiment, optionally, the distribution density of the plurality of pixel structures 400 disposed on the second display area 12 is less than the distribution density of the plurality of pixel structures 400 disposed on the third display area 13. The third display area 13 is formed as a normal display area of ​​the display panel, and the second display area 12 utilizes the intervals between the plurality of pixel structures 400 disposed, or the pixel structures 400 on the second display area 12 and the first driving unit 200 are made of a light-transmitting material, and can be formed into a light-transmitting display area, meeting the requirements of displaying images and transmitting light.

[0054] Furthermore, the distribution density of the multiple first light-emitting device units 100 arranged on the first display area 11 is less than the distribution density of the multiple pixel structures 400 on the third display area 13. The first display area 11 utilizes the intervals between the multiple first light-emitting device units 100, or the multiple first light-emitting device units 100 on the first display area 11 are made of translucent materials, to form a translucent display area to meet the requirements of displaying images and transmitting light.

[0055] Figure 3 is a schematic diagram of a cross-sectional structure of a display panel according to an embodiment of the present invention, as shown in Figure 3 As shown, in the first display area 11 and the second display area 12 , the connecting wire 300 is connected to the first light emitting device unit 100 of the first display area 11 and the first driving unit 200 of the second display area 12 , respectively.

[0056] In the display panel of the embodiment of the present invention, the connecting lead 300 is made on the inorganic protective layer 500, that is, when the display panel is prepared, the connecting lead 300 is made with the inorganic protective layer 500 as the base. Optionally, the connecting lead 300 is made of transparent ITO material.

[0057] It should be noted that in the display panel of conventional technology, the ITO lead film layer is made on an organic material substrate. The bonding force between the ITO lead film layer made on the organic material substrate and the substrate is poor, and the ITO lead film layer is prone to fall off. There is also a problem of high resistivity of the ITO lead. In addition, the polymer chain in the organic material substrate is bombarded by particles and cracked to produce carbon, which produces compounds with the film layer, causing the substrate to turn black. The display panel described in the embodiment of the present invention makes the connecting lead on the inorganic protective layer 500, uses the inorganic protective layer 500 with good density as the substrate, and makes the connecting lead 300, so that the bonding force between the connecting lead 300 and the inorganic protective layer 500 is good, so as to greatly reduce the situation of the connecting lead 300 falling off, and can avoid the problems of degassing, black spots and increased resistivity of the organic polymer material during the preparation process of the connecting lead 300.

[0058] In the embodiment of the present invention, optionally, the inorganic protective layer is a silicon oxide (SiOx) layer.

[0059] The following combination Figure 3 , the structure of each display area on the display panel described in the embodiment of the present invention is described in detail.

[0060] The first display area 11 , the second display area 12 and the third display area 13 are all manufactured on the transparent substrate 1 and are distributed in different areas on the transparent substrate 1 .

[0061] Among them, Figure 3As shown, taking the top-emitting light-emitting device as an example, in the third display area 13, a buffer layer 2, a second driving unit and a second light-emitting device unit are sequentially manufactured from the transparent substrate 1 to the direction away from the transparent substrate 1, and the second driving unit is connected to the second light-emitting device unit to form a pixel structure, and the second driving unit is used to drive the second light-emitting device unit to emit light.

[0062] Specifically, the second driving unit includes a second active layer 131 , a gate insulating layer 132 , a second gate electrode 133 , an interlayer insulating layer 134 , and a second source / drain electrode layer 135 which are sequentially arranged from the transparent substrate 1 to a direction away from the transparent substrate 1 .

[0063] In the embodiment of the present invention, the inorganic protection layer 500 is disposed on the second source / drain electrode layer 135 , and a planarization layer 600 is formed on the inorganic protection layer 500 .

[0064] The second light emitting device unit includes a second anode 136 , a second light emitting layer 137 , and a second cathode 138 which are sequentially disposed on the planar layer 600 , and the second light emitting layer 137 is disposed in the pixel defining layer 139 .

[0065] The second anode 136 is connected to the source or drain of the second source / drain layer 135 through a third via hole penetrating the planar layer 600 and the inorganic protective layer 500 , so that the second driving unit can drive the second light emitting device unit to emit light.

[0066] In the second display area 12, a buffer layer 2 and a first driving unit 200 are sequentially formed from the transparent substrate 1 to the direction away from the transparent substrate 1. The first driving unit 200 includes a first active layer 201, a gate insulating layer 132, a first gate electrode 202, an interlayer insulating layer 134, and a first source / drain electrode layer 203, which are sequentially arranged from the transparent substrate 1 to the direction away from the transparent substrate 1. In the embodiment of the present invention, an inorganic protective layer 500 is formed on the first source / drain electrode layer 203, a connecting lead 300 is formed on the side of the inorganic protective layer 500 away from the first source / drain electrode layer 203, and a flat layer 600 is formed on the side of the connecting lead 300 away from the inorganic protective layer 500.

[0067] Optionally, the gate insulating layer 132 of the third display region 13 extends to the second display region 12 to form the gate insulating layer 132 of the second display region 12; the interlayer insulating layer 134 of the third display region 13 extends to the second display region 12 to form the interlayer insulating layer 134 of the second display region 12. The inorganic protective layer 500 and the planarizing layer 600 entirely cover the first display region 11, the second display region 12, and the third display region 13.

[0068] In addition, in the second display area 12 and the third display area 13, the first active layer 201 and the second active layer 131, the first gate 202 and the second gate 133, the first source / drain layer 203 and the second source / drain layer 135 are respectively in the same layer, and can optionally be made by the same patterning process.

[0069] In the first display area 11, a buffer layer 2 extending from the second display area 12 to the first display area 11, a gate insulating layer 132, an interlayer insulating layer 134, an inorganic protective layer 500, a connecting lead 300 and a flat layer 600 are sequentially formed from the transparent substrate 1 to the direction away from the transparent substrate 1. Among them, a first light-emitting device unit 100 is formed on the side of the flat layer 600 away from the transparent substrate 1. The first light-emitting device unit 100 includes a first anode 101, a first light-emitting layer 102 and a first cathode 103 sequentially arranged on the side of the flat layer 600 away from the transparent substrate 1, and the second light-emitting layer 102 is arranged in the pixel defining layer 139. Among them, optionally, the second cathode 138 can extend to the first display area 11 to form a first cathode 103; of course, the first cathode 103 and the second cathode 108 can also be different patterns of the same layer.

[0070] Among them, see Figure 3 As shown, in the second display area 12 , the connecting lead 300 is connected to the source or drain of the first source / drain layer 203 through a first via hole penetrating the inorganic protective layer 500 , and the first anode 101 is connected to the connecting lead 300 through a second via hole penetrating the planar layer 600 .

[0071] In the embodiment of the present invention, optionally, the first anode 101, the first light-emitting layer 102 and the first cathode 103 of the first display area 12 are arranged in the same layer as the second anode 136, the second light-emitting layer 137 and the second cathode 138 of the third display area 13, and are respectively manufactured using the same composition process.

[0072] In the embodiment of the present invention, Figure 3 A schematic diagram for explaining the structure of connecting the first light emitting device unit 100 of the first display area 12 and the second driving unit 200 of the second display area 12 by the connecting wire 300. Figure 2 In addition to setting a plurality of second driving units 200 arranged in an array, a plurality of pixel structures arranged in an array may also be set in the second display area 12. The pixel structures set are the same as the pixel structures set in the third display area 13, and each layer is made by the same patterning process, which will not be described in detail here.

[0073] It should be noted that, in the second display area 12 and the third display area 13, a capacitor structure 700 is also provided respectively, for providing a voltage in the light-emitting stage of the pixel structure. The capacitor structure 700 includes a first electrode layer 701, a second electrode layer 702 and a signal transmission layer 703 connected to the first electrode layer 701 which are arranged relatively. Optionally, the first electrode layer 701 is arranged in the same layer as the first gate electrode 202 and the second gate electrode 133, and can be made by the same patterning process, and the gate insulating layer 132 can be set as two layers, wherein the first electrode layer 701 can be arranged on the first gate insulating layer of the gate insulating layer 132 close to the transparent substrate 1, and the second electrode layer 702 is arranged on the second gate insulating layer away from the transparent substrate 1, forming a relatively arranged structure. The signal transmission layer 703 is in the same layer as the first source / drain electrode layer 203 and the second source / drain electrode layer 135, and is made by the same patterning process, and the signal transmission layer 703 is connected to the first electrode layer 701 through a via penetrating the interlayer insulating layer 134 and the second gate insulating layer.

[0074] Using the display panel described in this embodiment, Figure 3 As shown, the inorganic protective layer 500 covers the display area of ​​the entire display panel and is made on the source / drain layer of the driving unit. On this basis, the connecting leads 300 are made in the second display area 12 and the third display area 13 with the inorganic protective layer 500 as the substrate. By making the connecting leads 300 on the inorganic protective layer 500, the possibility of the connecting leads 300 falling off can be greatly reduced, and the problems of degassing, black spots and increased resistivity of organic polymer materials in the preparation process of the connecting leads 300 can be avoided.

[0075] In the display panel described in the embodiment of the present invention, optionally, during the production process of the connecting lead 300, ITO can be sputtered to form a film, and oxygen UV irradiation and oxygen plasma process can be performed during the sputtering process to reduce the resistivity of the connecting lead 300 made of ITO and greatly increase the bonding with the inorganic protective layer 500.

[0076] According to experiments, the display panel of the embodiment of the present invention uses an inorganic protective layer as a substrate for making the connecting lead 300, which can significantly reduce water and oxygen corrosion.

[0077] In addition, the resistivity of the connecting lead 300 made of ITO is related to the ITO square resistance, the thickness of the ITO connecting lead, the line width of the ITO connecting lead, etc. For example, under the condition of line width 2.4, when the square resistance Spec is less than 2135, the thickness of the ITO connecting lead can be between 150 angstroms and 200 angstroms. Compared with the display panel usually made in the organic layer, the display panel described in the embodiment of the present invention can reduce the resistivity of the ITO connecting lead, and under the same resistivity condition, it is possible to further reduce the thickness of the ITO connecting lead.

[0078] Another aspect of the present invention is to provide a display device, which includes a display panel of the above-mentioned embodiment structure, combined with Figures 1 to 3 With reference to the above detailed description, those skilled in the art should be able to understand the specific implementation structure of the display device using the display panel described in the embodiment of the present invention, which will not be described in detail here.

[0079] Another aspect of the present invention is to provide a manufacturing method, which is applied to the display panel as described in any one of the above items. Figure 4 As shown, the method includes:

[0080] S410, manufacturing a plurality of first drive units arranged in an array on a second region of a transparent substrate, wherein an insulating layer when manufacturing the first drive units extends to the first region of the transparent substrate;

[0081] S420, forming an inorganic protective layer on the first driving unit, wherein the inorganic protective layer covers the entire first region and the second region;

[0082] S430, making a plurality of connecting leads on the inorganic protective layer, wherein a first end of each connecting lead is connected to one of the first driving units through a via hole penetrating the inorganic protective layer;

[0083] S440, manufacturing a plurality of first light emitting device units arranged in an array in the first area, and each of the first light emitting device units is connected to a second end of the connecting lead.

[0084] Optionally, the preparation method further comprises:

[0085] In a simultaneous process of manufacturing a plurality of arrays of first drive units on a second region of the transparent substrate, a plurality of arrays of second drive units are also manufactured on a third region of the transparent substrate;

[0086] When the inorganic protective layer is formed on the first driving unit, the formed inorganic protective layer also extends to cover the plurality of the second driving units;

[0087] In a simultaneous process of manufacturing a plurality of arrays of first light emitting device units on the first region of the transparent substrate, a plurality of arrays of second light emitting device units are also manufactured on the third region.

[0088] Combination Figure 3 As shown, in the preparation method described in the embodiment of the present invention, the first area, the second area, and the third area on the transparent substrate are formed into a first display area 11, a second display area 12, and a third display area 13 respectively.

[0089] Optionally, during the synchronization process of manufacturing a plurality of arrays of first driving units on the second area of ​​the transparent substrate, a plurality of array-arranged third driving units are also manufactured on the second area; during the synchronization process of manufacturing a plurality of arrays of first light-emitting device units on the first area of ​​the transparent substrate, a plurality of array-arranged third light-emitting device units are also manufactured on the second area, and the plurality of third driving units are connected one-to-one with the plurality of third light-emitting device units to form a plurality of pixel structures arranged on the second area.

[0090] In the embodiment of the present invention, optionally, in the preparation method, after forming a plurality of connecting leads on the inorganic protective layer, the method further comprises:

[0091] Making a flat layer on the connecting lead; the flat layer covers the entire first area and the second area;

[0092] A plurality of the first light emitting device units are manufactured on the planar layer, and are respectively connected to the second end of one of the connecting leads through via holes penetrating the first light emitting device units.

[0093] Optionally, the planarization layer also covers the third region.

[0094] In addition, it should be noted that, in step S410, Figure 3 As shown, the insulating layer used in manufacturing the first driving unit includes a buffer layer, a gate insulating layer, an interlayer insulating layer, a pixel defining layer, and the like.

[0095] In the embodiment of the present invention, the specific structures of the first display area, the second display area and the third display area can be combined Figure 3 As shown, each film layer can be manufactured by using a process such as exposure or evaporation, which will not be described in detail here.

[0096] The preparation method described in the embodiment of the present invention can optionally be used to form a film by ITO sputtering when making the connecting leads, and oxygen UV irradiation and oxygen plasma process are performed during the sputtering process to reduce the resistivity of the connecting leads made of ITO and greatly increase the bonding with the inorganic protective layer.

[0097] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A display panel, comprising a transparent substrate and a display area located on the transparent substrate, wherein the display area comprises a first display area and a second display area, wherein the first display area is provided with a plurality of first light emitting device units arranged in an array, and the second display area is provided with a plurality of first driving units arranged in an array, wherein: Each of the first driving units is connected to one of the first light-emitting device units through a connecting lead, and the first driving unit drives the corresponding first light-emitting device unit to emit light; wherein the connecting lead is made on an inorganic protective layer, and the inorganic protective layer covers the entire display area; A flat layer is formed on a side of the connecting lead away from the transparent substrate, the flat layer is connected to the connecting lead and covers the entire first display area and the second display area; The first light-emitting device unit includes a first anode, a first cathode and a first light-emitting layer between the first anode and the first cathode, which are arranged on a side of the flat layer away from the transparent substrate; the first driving unit includes a first active layer, a first gate and a first source / drain layer, which are arranged between the transparent substrate and the inorganic protective layer; The connecting lead is connected to the source or drain of the first source / drain layer through a first via hole penetrating the inorganic protective layer, and the first anode is connected to the connecting lead through a second via hole penetrating the planar layer.

2. The display panel according to claim 1, characterized in that: The display panel further includes a third display area, the third display area is arranged around the first display area, and the second display area is arranged between the first display area and the third display area; Wherein, a plurality of pixel structures arranged in an array are provided on the third display area, and each pixel structure comprises a second light emitting device unit and a second driving unit; The distribution density of the plurality of pixel structures on the third display area is greater than the distribution density of the plurality of the first light emitting device units on the first display area.

3. The display panel according to claim 2, characterized in that: The second driving unit includes a second active layer, a second gate and a second source / drain layer sequentially arranged between the transparent substrate and the second light emitting device unit, wherein the inorganic protective layer extends to the third display area and covers the third source / drain layer.

4. The display panel according to claim 3, characterized in that: In the third display area, a flat layer is arranged on the side away from the inorganic protective layer, and the second light-emitting device unit includes a second anode, a second light-emitting layer and a second cathode which are located on the side of the flat layer away from the transparent substrate and are arranged in sequence, wherein the second anode is connected to the source or drain of the second source / drain layer through a third via hole penetrating the flat layer and the inorganic protective layer.

5. The display panel according to claim 2, characterized in that: A plurality of pixel structures arranged in an array are also disposed on the second display area, and a distribution density of the plurality of pixel structures on the second display area is less than a distribution density of the plurality of pixel structures on the third display area.

6. The display panel according to claim 1, characterized in that: The inorganic protective layer is a silicon oxide layer.

7. A display device, characterized in that: A display panel comprising any one of claims 1 to 6.

8. A preparation method, characterized in that: Applied to the display panel according to any one of claims 1 to 6, the method comprising: Manufacturing a plurality of first drive units arranged in an array on the second area of ​​the transparent substrate, wherein the insulating layer when manufacturing the first drive units extends to the first area of ​​the transparent substrate; Manufacturing an inorganic protective layer on the first driving unit, wherein the inorganic protective layer covers the entire first region and the second region; A plurality of connecting leads are fabricated on the inorganic protective layer, wherein a first end of each of the connecting leads is connected to one of the first driving units through a via hole penetrating the inorganic protective layer; In the first area, a plurality of first light emitting device units arranged in an array are manufactured, and each of the first light emitting device units is connected to a second end of the connecting lead.

9. The preparation method according to claim 8, characterized in that: After forming a plurality of connecting leads on the inorganic protective layer, the method further comprises: Making a flat layer on the connecting lead; the flat layer covers the entire first area and the second area; A plurality of the first light emitting device units are manufactured on the planar layer, and are respectively connected to the second end of one of the connecting leads through via holes penetrating the first light emitting device units.

10. The preparation method according to claim 8, characterized in that: The method further comprises: A synchronous process of manufacturing a plurality of arrays of first drive units on a second area of ​​the transparent substrate and manufacturing a plurality of arrays of second drive units on a third area of ​​the transparent substrate; When the inorganic protective layer is formed on the first driving unit, the formed inorganic protective layer also extends to cover the plurality of the second driving units; A simultaneous process of manufacturing a plurality of arrays of first light emitting device units on a first region of a transparent substrate and manufacturing a plurality of arrays of second light emitting device units on a third region.

11. The preparation method according to claim 8, characterized in that: A plurality of connecting leads are fabricated on the inorganic protective layer, including: A plurality of connecting leads are produced by ITO sputtering film formation, and oxygen UV irradiation and oxygen plasma process are performed during the sputtering process.