Multilayer ceramic capacitor and method for manufacturing the same

Abstract

The present disclosure provides a multilayer ceramic capacitor and a method for manufacturing the same, the multilayer ceramic capacitor comprising: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed inside the ceramic body and each exposed to a first surface and a second surface of the ceramic body and each exposed to one of a third surface and a fourth surface; and a first side edge portion and a second side edge portion disposed on the side portions of the plurality of internal electrodes exposed to the first surface and the second surface. The ceramic body comprises an effective portion, an upper cover portion disposed above the effective portion, and a lower cover portion disposed below the effective portion, the effective portion comprising the plurality of internal electrodes disposed to overlap each other and with the dielectric layer interposed therebetween to form a capacitor. The first side edge portion and the second side edge portion have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0173854 filed on December 24, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field

[0002] The present disclosure relates to a multilayer ceramic capacitor having improved reliability and a method of manufacturing the same. Background Art

[0003] Generally, electronic components using ceramic materials, such as capacitors, inductors, piezoelectric elements, varistors, or thermistors, include a ceramic body formed using the ceramic material, an internal electrode formed inside the ceramic body, and an external electrode disposed on a surface of the ceramic body to be connected to the internal electrode.

[0004] Recently, as electronic products have become miniaturized and multifunctional, chip components have also become miniaturized and highly functional. As part of these trends, multilayer ceramic capacitors are required to have high capacitance in a small size.

[0005] Miniaturization and high capacitance of multilayer ceramic capacitors require a significant increase in the effective electrode area (increasing the effective volume fraction that provides capacitance).

[0006] In order to realize the above-mentioned small and high-capacity multilayer ceramic capacitor, when manufacturing the multilayer ceramic capacitor, the inner electrode can be exposed in the width direction of the body, thereby significantly increasing the area of ​​the inner electrode in the width direction through the edgeless design. For example, in the pre-firing stage, after manufacturing such a sheet, a method of separately attaching the side edge portion to the surface of the sheet where the lateral electrode is exposed is used to complete the multilayer ceramic capacitor.

[0007] However, in this method, a relatively large amount of voids are generated at an interface between the ceramic body and the side margin portion in a process of forming the side margin portion, thereby reducing reliability.

[0008] Furthermore, electric field concentration occurs due to voids generated at the interface between the ceramic body and the side edge portion, thereby causing a problem of lowering a breakdown voltage (BDV).

[0009] Furthermore, the voids may lead to a decrease in moisture resistance reliability due to a decrease in the outer sintering density.

[0010] In addition, when an interface bond is generated at the boundary between the side edge portion and the main body, a reduction in bonding strength may be caused, and thus a reduction in moisture resistance reliability may be caused.

[0011] Therefore, research is required to prevent breakdown voltage (BDV) degradation and moisture resistance reliability degradation in small and high capacity products. Summary of the invention

[0012] This summary is provided to introduce selected concepts in a simplified form, and these concepts are further described in the following detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0013] An aspect of the present disclosure is to provide a multilayer ceramic capacitor and a method of manufacturing the same which can improve reliability.

[0014] According to one aspect of the present disclosure, a multilayer ceramic capacitor includes: a ceramic body including a dielectric layer, the ceramic body having a first surface and a second surface opposite to each other, a third surface and a fourth surface opposite to each other and connecting the first surface and the second surface, and a fifth surface and a sixth surface connecting the first surface to the fourth surface and opposite to each other. A plurality of internal electrodes are arranged inside the ceramic body to overlap each other and the dielectric layer is interposed between the plurality of internal electrodes, and the plurality of internal electrodes are each exposed to one of the third surface and the fourth surface and the first surface and the second surface. A first side edge portion and a second side edge portion are arranged on the side portions of the plurality of internal electrodes exposed to the first surface and the second surface. The ceramic body includes an effective portion, an upper cover portion arranged above the effective portion, and a lower cover portion arranged below the effective portion, the effective portion including the plurality of internal electrodes arranged to overlap each other and the dielectric layer is interposed between the plurality of internal electrodes to form a capacitor. The first side edge portion and the second side edge portion have a dielectric composition different from the dielectric composition of one of the upper cover portion and the lower cover portion.

[0015] According to one aspect of the present disclosure, a method for manufacturing a multilayer ceramic capacitor includes: preparing a first ceramic green sheet and a second ceramic green sheet, a plurality of first internal electrode patterns are spaced apart from each other at predetermined intervals on the first ceramic green sheet, and a plurality of second internal electrode patterns are spaced apart from each other at predetermined intervals on the second ceramic green sheet; stacking the first ceramic green sheet and the second ceramic green sheet in such a manner that the plurality of first internal electrode patterns and the plurality of second internal electrode patterns overlap each other, and forming a lower cover portion by stacking a plurality of ceramic green sheets at a lower portion of the stacked body, thereby forming a ceramic green sheet laminate. Cutting the ceramic green sheet laminate to have a side surface that exposes edges of the plurality of first internal electrode patterns and the plurality of second internal electrode patterns in a width direction; forming a first side edge portion, a second side edge portion, and an upper cover portion integrally with each other on an upper portion and on the side surface of the cut ceramic green sheet laminate. Firing the cut ceramic green sheet laminate to provide a ceramic body including an effective portion and a lower cover portion, the effective portion having a dielectric layer and first and second internal electrodes. The forming of the first side edge portion, the second side edge portion, and the upper cover portion is performed by adding a ceramic material so that the first side edge portion, the second side edge portion, and the upper cover portion are formed integrally with each other.

[0016] According to one aspect of the present disclosure, a multilayer ceramic capacitor includes: a ceramic body having first and second internal electrodes alternately stacked and a dielectric layer interposed between the first and second internal electrodes, wherein the first and second internal electrodes are both exposed to opposite first and second surfaces of the ceramic body. An upper cover portion and a lower cover portion are disposed above and below the ceramic body in a stacking direction of the first and second internal electrodes, and a first side edge portion and a second side edge portion are disposed on the opposite first and second surfaces of the ceramic body, respectively. The upper cover portion has a different dielectric composition from that of the lower cover portion.

[0017] According to one aspect of the present disclosure, a multilayer ceramic capacitor includes: a ceramic body having first and second internal electrodes alternately stacked and a dielectric layer interposed between the first and second internal electrodes, wherein the first and second internal electrodes are exposed to opposite first and second surfaces of the ceramic body. An upper cover portion and a lower cover portion are arranged above and below the ceramic body in a stacking direction of the first and second internal electrodes, and a first side edge portion and a second side edge portion are arranged on the opposite first and second surfaces of the ceramic body, respectively. The first side edge portion and the second side edge portion have a different magnesium (Mg) content from one of the upper cover portion and the lower cover portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to an embodiment;

[0020] Figure 2 It is shown Figure 1 A perspective view of an exterior of a ceramic body;

[0021] Figure 3 It is shown in the firing Figure 2 A perspective view of a ceramic green sheet stack before forming a ceramic main body;

[0022] Figure 4 is along Figure 2 A side view taken from direction B;

[0023] FIG. 5A to FIG. 5D are cross-sectional views and perspective views schematically illustrating a method of manufacturing a multilayer ceramic capacitor according to another embodiment of the present disclosure;

[0024] Figures 6A to 6B is a perspective view schematically showing a method of manufacturing a multilayer ceramic capacitor according to a first embodiment; and

[0025] Figures 7A to 7B is a perspective view schematically showing a method of manufacturing a multilayer ceramic capacitor according to a second embodiment. DETAILED DESCRIPTION

[0026] The following detailed description is provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent to those of ordinary skill in the art. For example, the order of operations described herein is merely an example and is not limited to the order set forth herein, but changes may be made that will be apparent to those of ordinary skill in the art, except for operations that must occur in a particular order. In addition, descriptions of features and structures that will be known to those of ordinary skill in the art may be omitted for clarity and brevity.

[0027] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0028] Here, it should be noted that the use of the term "may" with respect to an example or embodiment (e.g., with respect to what an example or embodiment may include or implement) means that there is at least one example or embodiment that includes or implements such features, while all examples and embodiments are not limited thereto.

[0029] Throughout the specification, when an element such as a layer, a region, or a substrate is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” the other element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present between them.

[0030] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more.

[0031] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, the first member, first component, first region, first layer, or first portion referred to may also be referred to as the second member, second component, second region, second layer, or second portion.

[0032] For ease of description, spatially relative terms such as "above", "above", "below" and "below" may be used herein to describe the positional relationship of one element to another element as shown in the drawings. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientations depicted in the drawings. For example, if the device in the drawings is turned over, an element described as being "above" or "above" relative to another element will be "below" or "below" relative to the other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein will be interpreted accordingly.

[0033] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" list the existence of the stated features, quantities, operations, components, elements and / or their combinations, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0034] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0035] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have multiple configurations, other configurations that will be apparent after understanding the disclosure of the present application are also feasible.

[0036] The drawings may not be drawn to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.

[0037] Subsequently, examples are described in more detail with reference to the accompanying drawings.

[0038] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to an embodiment.

[0039] Figure 2 It is shown Figure 1 A perspective view of the exterior of a ceramic body.

[0040] Figure 3 It is shown in the firing Figure 2 A perspective view of a ceramic green sheet stack before forming a ceramic body.

[0041] Figure 4 is along Figure 2 A side view taken from direction B.

[0042] Reference Figures 1 to 4 , the multilayer ceramic capacitor 100 according to the embodiment includes a ceramic body 110 , a plurality of internal electrodes 121 and 122 formed in the ceramic body 110 , and external electrodes 131 and 132 formed on an outer surface of the ceramic body 110 .

[0043] The ceramic body 110 may have first and second surfaces 1 and 2 opposite to each other, third and fourth surfaces 3 and 4 connecting the first and second surfaces, and fifth and sixth surfaces 5 and 6 as upper and lower surfaces, respectively.

[0044] The first and second surfaces 1 and 2 are opposite to each other in the width direction of the ceramic body 110, and the third and fourth surfaces 3 and 4 are opposite to each other in the length direction. The fifth and sixth surfaces 5 and 6 may be defined as surfaces opposite to each other in the thickness direction or stacking direction of the internal electrodes.

[0045] The shape of the ceramic body 110 is not particularly limited, but may be a rectangular parallelepiped shape as shown in the figure.

[0046] One end of each of the plurality of internal electrodes 121 formed in the ceramic body 110 is exposed to the third surface 3 , and one end of each of the plurality of internal electrodes 122 formed in the ceramic body 110 is exposed to the fourth surface 4 of the ceramic body.

[0047] The internal electrodes 121 and 122 may be provided as a pair of first and second internal electrodes 121 and 122 having different polarities.

[0048] One end of each of the first internal electrodes 121 may be exposed to the third surface 3 , and one end of each of the second internal electrodes 122 may be exposed to the fourth surface 4 .

[0049] The other end of each first internal electrode 121 is disposed at a predetermined interval from the fourth surface 4 , and the other end of each second internal electrode 122 is disposed at a predetermined interval from the third surface 3 .

[0050] The first and second external electrodes 131 and 132 may be formed on the third and fourth surfaces 3 and 4 of the ceramic body to be electrically connected to the first and second internal electrodes 121 and 122 , respectively.

[0051] According to the embodiment, the multilayer ceramic capacitor 100 includes a plurality of internal electrodes 121 and 122 and a first side edge portion 112 and a second side edge portion 113 arranged inside the ceramic body 110, the plurality of internal electrodes 121 and 122 are exposed to the first surface 1 and the second surface 2, and each is exposed to one of the third surface and the fourth surface, and the first side edge portion 112 and the second side edge portion 113 are arranged on the sides of the internal electrodes 121 and 122 exposed to the first surface 1 and the second surface 2.

[0052] A plurality of internal electrodes 121 and 122 are formed in the ceramic body 110, and respective edge portions of the plurality of internal electrodes 121 and 122 are exposed to the first surface 1 and the second surface 2 which are outer side surfaces of the ceramic body 110 in a width direction. The first side edge portion 112 and the second side edge portion 113 are disposed on the exposed side portions.

[0053] An average thickness of the first side margin portion 112 and the second side margin portion 113 may be greater than or equal to 2 μm and less than or equal to 10 μm.

[0054] According to an embodiment, the ceramic body 110 may include a stacked body in which a plurality of dielectric layers 111 are stacked, first and second side margin parts 112 and 113 each disposed on a corresponding one of opposite side surfaces of the stacked body, an upper cover part 114 and a lower cover part 115 .

[0055] The plurality of dielectric layers 111 may be in a sintered state and may be integrated such that boundaries between adjacent dielectric layers are not recognized.

[0056] The length of the ceramic body 110 corresponds to the distance from the third surface 3 to the fourth surface 4 of the ceramic body.

[0057] The length of the dielectric layer 111 forms the distance between the third surface 3 and the fourth surface 4 of the ceramic body.

[0058] According to one embodiment, the length of the ceramic body may be 400 μm to 1400 μm, specifically, the length of the ceramic body may be 400 μm to 800 μm, or 600 μm to 1400 μm, but is not limited thereto.

[0059] The internal electrodes 121 and 122 may be formed on the corresponding dielectric layers 111 , and each pair of adjacent internal electrodes 121 and 122 may be formed in the ceramic body by sintering with one dielectric layer 111 interposed therebetween.

[0060] Reference Figure 3 , the first internal electrode 121 is formed on the dielectric layer 111. The first internal electrode 121 is not completely formed in the length direction of the dielectric layer. For example, one end of the first internal electrode 121 may be formed to be spaced apart from the fourth surface 4 of the ceramic body by a predetermined interval, and the other end of the first internal electrode 121 may be formed to reach the third surface 3 and be exposed to the third surface 3.

[0061] An end portion of the first internal electrode 121 exposed to the third surface 3 of the ceramic body is connected to the first external electrode 131 .

[0062] Contrary to the first internal electrode, one end of the second internal electrode 122 is formed to be spaced apart from the third surface 3 by a predetermined interval, and the other end of the second internal electrode 122 is exposed to the fourth surface 4 and connected to the second external electrode 132 .

[0063] The internal electrodes may be stacked in an amount of 400 layers or more to implement a high-capacitance multilayer ceramic capacitor, but the embodiment is not limited thereto.

[0064] The dielectric layer 111 may have the same width as that of the first internal electrode 121. For example, the first internal electrode 121 may be formed to extend across the entire width of the dielectric layer 111.

[0065] According to an embodiment, the width of the dielectric layer and the width of the internal electrode may be 100 μm to 900 μm, but the embodiment is not limited thereto. In detail, the width of the dielectric layer and the width of the internal electrode may be 100 μm to 500 μm, or 100 μm to 900 μm.

[0066] As the size of the ceramic body is further reduced, the thickness of the side margin part may affect the electrical characteristics of the multilayer ceramic capacitor. According to an embodiment of the present disclosure, the side margin part may have a thickness of 10 μm or less, thereby improving the characteristics of the miniaturized multilayer ceramic capacitor.

[0067] For example, since the side margin portion is formed to have a thickness of 10 μm or less, a maximum area of ​​an overlap region of internal electrodes forming a capacitor can be secured to obtain high capacitance in a small multilayer ceramic capacitor.

[0068] The ceramic body 110 may include an effective portion A serving as a portion contributing to capacitance formation of the capacitor, and an upper cover portion 114 and a lower cover portion 115 formed on upper and lower portions of the effective portion A as upper and lower edge portions, respectively.

[0069] The active portion A may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0070] The lower cover portion 115 may have the same material and configuration as those of the dielectric layer 111 , except that the lower cover portion 115 does not include an internal electrode.

[0071] For example, the lower cover portion 115 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0072] The lower cover part 115 may have a thickness of 20 μm or less, but is not limited thereto.

[0073] The lower cover part 115 may be formed by stacking a single dielectric layer or two or more dielectric layers on the lower surface of the active part A in a thickness direction, and may basically serve to prevent damage to the internal electrodes of the active part A due to physical or chemical stress.

[0074] The upper cover portion 114 is disposed on the upper surface of the effective portion A, and similarly to the case of the lower cover portion 115 , may serve to prevent damage to the internal electrodes of the effective portion A due to physical or chemical stress.

[0075] According to the embodiment, as will be described later, by integrally forming the first side margin part 112 , the second side margin part 113 , and the upper cover part 114 , an interface bond between the side margin part and the ceramic body may be reduced, thereby improving reliability.

[0076] In detail, when the upper cover portion 114 is formed on the upper surface of the effective portion A, unlike the case where the lower cover portion 115 is formed by stacking a single dielectric layer or two or more dielectric layers on the lower surface of the effective portion A in the thickness direction, the first side edge portion 112 and the second side edge portion 113 are formed integrally with the upper cover portion 114.

[0077] Therefore, the interface bonding between the first side margin part 112 , the second side margin part 113 , and the ceramic body 110 may be reduced, thereby improving reliability.

[0078] In the prior art, when the upper cover portion 114 is provided on the upper surface of the effective portion A, similarly to the lower cover portion, a single dielectric layer or two or more dielectric layers are stacked on the upper surface of the effective portion A in the thickness direction, and the side edge portion is formed separately from the upper cover portion. Therefore, in this case, an interface bond is formed between the side edge portion and the upper cover portion.

[0079] As described above, in the related art multilayer ceramic capacitor, since the interface bonding is formed between the side edge portion and the upper cover portion, the moisture resistance reliability is poor due to the weakening of the bonding force.

[0080] However, according to an embodiment of the present disclosure, by forming the first side margin portion 112 , the second side margin portion 113 , and the upper cover portion 114 integrally with each other, the interface bonding between the side margin portion and the ceramic body may be reduced, thereby improving reliability.

[0081] In an embodiment of the present disclosure, since the internal electrode and the dielectric layer are formed by simultaneous cutting, the width of the internal electrode and the width of the dielectric layer may be the same, which will be described in more detail later.

[0082] In this embodiment, the width of the dielectric layer is formed to be the same as the width of the internal electrodes, and thus the edges of the internal electrodes 121 and 122 may be exposed to the first and second surfaces in a width direction of the ceramic body 110 .

[0083] The first and second side margin parts 112 and 113 may be formed on opposite side surfaces of the ceramic body 110 exposing edges of the internal electrodes 121 and 122. Meanwhile, the upper cover part 114 may be formed on a fifth surface of the ceramic body 110 in a thickness direction.

[0084] The thickness of the first and second side margin parts 112 and 113 may be 10 μm or less. As the thickness of the first and second side margin parts 112 and 113 decreases, an overlap area of ​​internal electrodes formed in the ceramic body may increase.

[0085] The thickness of the first and second side margin parts 112 and 113 is not particularly limited as long as they have a thickness that can prevent short circuits of internal electrodes exposed to the side of the ceramic body 110. For example, the thickness of the first and second side margin parts 112 and 113 may be 2 μm or more.

[0086] If the thickness of the first and second side margin portions is less than 2 μm, the mechanical strength against external impact may be reduced. If the thickness of the first and second side margin portions is greater than 10 μm, the overlapping area of ​​the internal electrodes may be relatively reduced, and therefore, it may be difficult to ensure a high capacity of the multilayer ceramic capacitor.

[0087] In order to significantly increase the capacitance of a multilayer ceramic capacitor, a method of thinning the dielectric layer, a method of stacking the thinned dielectric layer to a higher degree, a method of improving the coverage of the internal electrode, and the like may be considered.

[0088] In addition, a method of improving the overlapping area of ​​internal electrodes forming the capacitor may be considered.

[0089] In order to increase the overlapping area of ​​the internal electrodes, the edge area where the internal electrodes are not formed should be significantly reduced.

[0090] In detail, as the size of the multilayer ceramic capacitor is further reduced, the edge area should be significantly reduced to increase the overlapping area of ​​the internal electrodes.

[0091] According to this embodiment, the internal electrodes are formed in the entire width direction area of ​​the dielectric layer, and the thickness of the side margin portion is set to 10 μm or less, so that the overlapping area of ​​the internal electrodes is relatively increased.

[0092] Generally, as the number of dielectric layers and inner electrodes increases, the thickness of the dielectric layers and the inner electrodes becomes relatively thinner. Therefore, the phenomenon of inner electrode short circuit may occur frequently. In addition, when the inner electrode is formed only on a portion of the dielectric layer, the inner electrode may have a step, thereby reducing the accelerated life or reliability of the insulation resistance.

[0093] However, according to this embodiment of the present disclosure, even when the internal electrodes and the dielectric layer are formed using relatively thin films, since the internal electrodes are formed in the entire width direction of the dielectric layer, the overlapping area of ​​the internal electrodes can be increased to increase the capacitance of the multilayer ceramic capacitor.

[0094] In addition, a multilayer ceramic capacitor having excellent capacitance characteristics and excellent reliability can be provided by reducing a step difference caused by an inner electrode to improve accelerated lifetime of insulation resistance.

[0095] According to an embodiment, the first and second side margin parts 112 and 113 have a dielectric composition different from a dielectric composition of one of the upper and lower cover parts 114 and 115 .

[0096] In detail, according to an embodiment, the first side margin part 112 and the second side margin part 113 are characterized in that they have a dielectric composition different from that of the lower cover part 115 .

[0097] As described above, when the upper cover portion 114 is formed on the upper surface of the effective portion A, unlike the lower cover portion 115 formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the lower surface of the effective portion A, the first side edge portion 112 and the second side edge portion 113 may be formed integrally with the upper cover portion 114. For example, the first side edge portion 112, the second side edge portion 113, and the upper cover portion 114 may be formed through the same process step and using the same material or composition, so that there is no boundary between them.

[0098] Therefore, the lower cover portion 115 may have the same composition as the dielectric composition of the dielectric layer 111 of the active portion A, while having a dielectric composition different from the dielectric compositions of the first and second side margin portions 112 and 113 .

[0099] On the other hand, since the upper cover portion 114 is integrally formed with the first and second side margin portions 112 and 113 , the dielectric composition of the upper cover portion 114 may be the same as the dielectric composition of the first and second side margin portions 112 and 113 .

[0100] According to the embodiment, the interface bonding between the side margin parts 112 and 113 and the ceramic body 110 may be reduced by integrally forming the first side margin part 112 , the second side margin part 113 , and the upper cover part 114 , thereby improving reliability.

[0101] In addition, by controlling the dielectric composition of the first side margin portion 112 , the second side margin portion 113 , and the upper cover portion 114 to be different from the dielectric composition of the dielectric layer 111 of the active portion A and the lower cover portion 115 , reliability may be improved.

[0102] According to an embodiment, the upper cover part 114 and the lower cover part 115 may have dielectric compositions different from each other.

[0103] The dielectric composition of the lower cover portion 115 may be the same as the dielectric composition of the dielectric layer 111 of the active portion A, but may be different from the dielectric composition of the upper cover portion 114 .

[0104] For example, since the upper cover portion 114 is integrally formed with the first side margin portion 112 and the second side margin portion 113 , the dielectric composition of the upper cover portion 114 may be different from the dielectric composition of the lower cover portion 115 .

[0105] On the other hand, the dielectric layer 111 of the active portion A and one of the upper cover portion 114 and the lower cover portion 115 may have different dielectric compositions.

[0106] In detail, according to an embodiment, the dielectric layer 111 of the active part A may have a dielectric composition different from that of the upper cover part 114 .

[0107] As described above, since the upper cover portion 114 is integrally formed with the first and second side margin portions 112 and 113 , the dielectric composition of the upper cover portion 114 may be different from the dielectric composition of the dielectric layer 111 of the active portion A.

[0108] According to an embodiment, in the case of the upper ceramic part and the lower ceramic part of the ceramic body 110, the side ceramic part from the outermost (e.g., the uppermost or the lowermost) inner electrode 121 or 122 among the plurality of inner electrodes 121 and 122 to one of the fifth surface 5 and the sixth surface 6 is the upper cover part 114 or the lower cover part 115. The side ceramic part region as the upper cover part 114 or the lower cover part 115 may have a dielectric composition different from the dielectric composition of the first side edge part 112 and the second side edge part 113 as the remaining region.

[0109] In detail, in the side ceramic portion of the ceramic body 110, a side ceramic portion region corresponding to a region from an outermost (e.g., lowermost) inner electrode 121 or 122 among a plurality of inner electrodes 121 and 122 to a sixth surface 6 of the ceramic body 110 is a lower cover portion 115, and the side ceramic portion region as the lower cover portion 115 has a dielectric composition different from that of the first side edge portion 112 and the second side edge portion 113 as the remaining regions.

[0110] According to an embodiment, the content of magnesium (Mg) included in the first and second side margin parts 112 and 113 may be greater than the content of magnesium (Mg) included in one of the upper and lower cover parts 114 and 115 .

[0111] In detail, the content of magnesium (Mg) included in the first and second side margin parts 112 and 113 may be greater than the content of magnesium (Mg) included in the lower cover part 115 .

[0112] By controlling the content of magnesium (Mg) included in the first and second side margin parts 112 and 113 to be greater than the content of magnesium (Mg) included in the lower cover part 115 , the insulation breakdown voltage may be increased, thereby improving reliability.

[0113] By controlling the content of magnesium (Mg) contained in the first side edge portion 112 and the second side edge portion 113 adjacent to the internal electrodes 121 and 122 exposed to the first surface 1 and the second surface 2 of the ceramic body 110, the length of the edge oxide layer of the internal electrodes 121 and 122 exposed to the side of the ceramic body 110 in the width direction can be controlled, and thus, the breakdown voltage (BDV) can be increased and the moisture resistance reliability can be improved.

[0114] Generally, in a process of forming the side margin part, a large number of voids are generated at an interface between the ceramic body and the side margin part, thereby reducing reliability.

[0115] Furthermore, electric field concentration occurs due to voids generated at the interface between the ceramic body and the side edge portion, thereby causing a problem of lowering a breakdown voltage (BDV).

[0116] Furthermore, the voids may lead to a decrease in moisture resistance reliability due to a decrease in the outer sintering density.

[0117] According to an embodiment, by adjusting the content of magnesium (Mg) contained in the first side edge portion 112 and the second side edge portion 113 (and in the upper cover portion 114) to be greater than the content of magnesium (Mg) contained in the lower cover portion 115, an oxide layer can be formed on the gap generated at the interface where the ceramic body 110 and the side edge portions 112 and 113 contact each other.

[0118] As described above, when an oxide layer is formed on a void formed at an interface between the ceramic body 110 and the side edge parts 112 and 113 , concentration of an electric field may be mitigated by ensuring insulation, and thus, a breakdown voltage (BDV) may be increased and malfunctions such as short circuits may be reduced.

[0119] The method of controlling the content of magnesium (Mg) contained in the first side edge portion 112 and the second side edge portion 113 to be greater than the content of magnesium (Mg) contained in the lower cover portion 115 can be performed by controlling the dielectric composition used to form the ceramic body and the dielectric composition used to form the first side edge portion and the second side edge portion to be different from each other during the process of manufacturing the multilayer ceramic capacitor.

[0120] For example, unlike the dielectric composition used to form the ceramic body (e.g., including the dielectric layer 111), by increasing the content of magnesium (Mg) in the dielectric composition used to form the first side edge portion 112 and the second side edge portion 113 (and for forming the upper cover portion 114), the amount of magnesium (Mg) contained in the first side edge portion 112 and the second side edge portion 113 can be adjusted to be greater than the amount of magnesium (Mg) contained in the lower cover portion 115, which is formed using the same composition as the dielectric composition used to form the ceramic body.

[0121] On the other hand, the content of magnesium (Mg) included in the upper cover portion 114 may be greater than the content of magnesium (Mg) included in the lower cover portion 115 .

[0122] As described above, since the upper cover portion 114 is integrally formed with the first and second side edge portions 112 and 113 , the content of magnesium (Mg) included in the upper cover portion 114 is greater than the content of magnesium (Mg) included in the lower cover portion 115 .

[0123] According to an embodiment, the content of magnesium (Mg) included in one of the upper cover part 114 and the lower cover part 115 may be greater than the content of magnesium (Mg) included in the dielectric layer 111 of the active part A.

[0124] In detail, the content of magnesium (Mg) included in the upper cover portion 114 may be greater than the content of magnesium (Mg) included in the dielectric layer 111 of the active portion A.

[0125] Since the upper cover part 114 is integrally formed with the first and second side margin parts 112 and 113 , the content of magnesium (Mg) included in the upper cover part 114 may be greater than the content of magnesium (Mg) included in the dielectric layer 111 of the active part A.

[0126] According to an embodiment, the content of magnesium (Mg) in the first side edge portion 112, the second side edge portion 113 and the upper cover portion 114 may be greater than or equal to 10 mol and less than or equal to 30 mol relative to 100 mol of titanium (Ti) contained in the first side edge portion 112, the second side edge portion 113 and the upper cover portion.

[0127] By controlling the amount of magnesium (Mg) in the first side edge portion 112, the second side edge portion 113 and the upper cover portion 114 to be greater than or equal to 10 mol and less than or equal to 30 mol relative to 100 mol of titanium (Ti) contained in the first side edge portion, the second side edge portion and the upper cover portion, the breakdown voltage (BDV) and moisture resistance reliability can be improved.

[0128] If the amount of magnesium (Mg) of the first side edge portion 112, the second side edge portion 113 and the upper cover portion 114 is less than 10 mol relative to 100 mol of titanium (Ti) contained in the first side edge portion 112, the second side edge portion 113 and the upper cover portion, the formation of an oxide layer on the gap formed at the interface between the ceramic body and the side edge portion may be insufficient, and therefore, the breakdown voltage (BDV) may be reduced and defects such as short circuits may increase.

[0129] On the other hand, if the amount of magnesium (Mg) in the first side edge portion 112, the second side edge portion 113 and the upper cover portion 114 is greater than 30 mol relative to 100 mol of titanium (Ti) contained in the first side edge portion 112, the second side edge portion 113 and the upper cover portion, problems such as uneven distribution of breakdown voltage (BDV) and reliability may occur due to deterioration of sintering properties.

[0130] However, the amount as described above is not necessarily limited, and the content may vary according to product design.

[0131] According to an embodiment, there is provided a micro multilayer ceramic capacitor in which the thickness of the dielectric layer 111 is 0.4 μm or less, and the thickness of the internal electrode 121 or 122 is 0.4 μm or less.

[0132] As in the embodiment, when coating a thin film dielectric layer and an internal electrode in which the thickness of the dielectric layer 111 is 0.4 μm or less and the thickness of the internal electrode 121 or 122 is 0.4 μm or less, the degradation of the bonding strength and moisture resistance reliability problems occurring at the bonding interface of the edge portion are significantly important issues.

[0133] In an embodiment, even in the case where the dielectric layer 111 and the first and second internal electrodes 121 and 122 are thin films of 0.4 μm or less, by forming the first side edge portion 112, the second side edge portion 113 and the upper cover portion 114 integrally with each other, the interface bonding between the side edge portions and the ceramic body can be reduced, thereby improving reliability.

[0134] However, thin film does not necessarily mean that the thickness of the dielectric layer 111 and the first and second internal electrodes 121 and 122 is 0.4 μm or less, and more generally, may be understood to include dielectric layers and internal electrodes having a thickness thinner than that of related art products.

[0135] Figures 5A to 5D are cross-sectional views and perspective views schematically illustrating a method of manufacturing a multilayer ceramic capacitor according to another embodiment.

[0136] According to another embodiment, a method for manufacturing a multilayer ceramic capacitor includes: preparing a first ceramic green sheet and a second ceramic green sheet, forming a plurality of first internal electrode patterns at predetermined intervals on the first ceramic green sheet, and forming a plurality of second internal electrode patterns at predetermined intervals on the second ceramic green sheet; stacking the first ceramic green sheet and the second ceramic green sheet in such a manner that the plurality of first internal electrode patterns and the plurality of second internal electrode patterns overlap each other, and forming a lower cover portion by stacking the plurality of ceramic green sheets at a lower portion of the stacked body, thereby forming a ceramic green sheet laminate; cutting the ceramic green sheet laminate to have a side surface with edges of the plurality of first internal electrode patterns and the plurality of second internal electrode patterns exposed in a width direction; forming a first side edge portion, a second side edge portion, and an upper cover portion on an upper portion and a side surface of the laminate; and firing the cut laminate to provide a ceramic body including an effective portion having a dielectric layer and first and second internal electrodes and a lower cover portion. The formation of the first side edge portion, the second side edge portion, and the upper cover portion is performed by adding a ceramic material to integrally form the first side edge portion, the second side edge portion, and the upper cover portion.

[0137] Hereinafter, a method of manufacturing a multilayer ceramic capacitor according to another embodiment will be described.

[0138] like Figure 5AAs shown in FIG. 2 , a plurality of stripe-shaped first internal electrode patterns 221 are formed on the ceramic green sheet 211 and spaced apart from each other at predetermined intervals. The plurality of stripe-shaped first internal electrode patterns 221 may be formed in parallel with each other.

[0139] The ceramic green sheet 211 may be formed using a ceramic paste including ceramic powder, an organic solvent, and an organic binder.

[0140] The ceramic powder is a material having a high dielectric constant and may be a barium titanate (BaTiO3)-based material, a lead composite perovskite-based material, a strontium titanate (SrTiO3)-based material, etc., but is not limited thereto. Specifically, a barium titanate (BaTiO3)-based powder may be used. When the ceramic green sheet 211 is fired, the ceramic green sheet 211 becomes a dielectric layer 111 constituting the ceramic body 110.

[0141] The stripe-shaped first internal electrode pattern 221 may be formed using an internal electrode paste containing a conductive metal, and the conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof, but is not limited thereto.

[0142] A method of forming the stripe-shaped first internal electrode pattern 221 on the ceramic green sheet 211 is not particularly limited, but may be formed by, for example, a printing method such as a screen printing method or a gravure printing method.

[0143] Although not shown, a plurality of stripe-shaped second internal electrode patterns 222 may be similarly formed on another ceramic green sheet 211 at predetermined intervals.

[0144] Hereinafter, the ceramic green sheet having the first internal electrode pattern 221 formed thereon may be referred to as a first ceramic green sheet, and the ceramic green sheet having the second internal electrode pattern 222 formed thereon may be referred to as a second ceramic green sheet.

[0145] Then, if Figure 5B As shown in , the first ceramic green sheets and the second ceramic green sheets may be alternately stacked in such a manner that the stripe-shaped first internal electrode patterns 221 and the stripe-shaped second internal electrode patterns 222 are alternately stacked to overlap each other with spaces between adjacent patterns shifted from each other.

[0146] Thereafter, the stripe-shaped first internal electrode pattern 221 may be the first internal electrode 121 , and the stripe-shaped second internal electrode pattern 222 may be the second internal electrode 122 .

[0147] According to another embodiment, the thickness td of each of the first and second ceramic green sheets is 0.6 μm or less, and the thickness te of each of the first and second internal electrode patterns is 0.5 μm or less.

[0148] Since an embodiment of the present disclosure is characterized by a very small high-capacity multilayer ceramic capacitor having a thin film in which the dielectric layer has a thickness of 0.4 μm or less and the internal electrode has a thickness of 0.4 μm or less, the thickness td of the first ceramic green sheet and the second ceramic green sheet before firing is 0.6 μm or less, and the thickness te of the first internal electrode pattern and the second internal electrode pattern before firing is 0.5 μm or less.

[0149] Figure 5C is a cross-sectional view showing a ceramic green sheet stack 220 in which a first ceramic green sheet and a second ceramic green sheet are stacked according to an embodiment, and Figure 5D is a perspective view of a ceramic green sheet stacked body 220 in which a first ceramic green sheet and a second ceramic green sheet are stacked.

[0150] Reference Figure 5C and 5D , first ceramic green sheets having a plurality of parallel strip-shaped first internal electrode patterns 221 printed thereon and second ceramic green sheets having a plurality of parallel strip-shaped second internal electrode patterns 222 printed thereon are alternately stacked.

[0151] In detail, the first and second ceramic green sheets may be stacked in such a manner that a central portion of the stripe-shaped first internal electrode pattern 221 printed on the first ceramic green sheet overlaps a gap between the stripe-shaped second internal electrode patterns 222 printed on the second ceramic green sheet.

[0152] The first and second ceramic green sheets are stacked so that the first and second internal electrode patterns 221 and 222 overlap each other, and the plurality of ceramic green sheets are disposed at a lower portion of the stacked body to form a ceramic green sheet stack 220 on which a lower cover portion has been formed.

[0153] Then, if Figure 5D , the ceramic green sheet laminate 220 may be cut across a plurality of stripe-shaped first internal electrode patterns 221 and stripe-shaped second internal electrode patterns 222. For example, the ceramic green sheet laminate 220 may be a laminate 210 provided by cutting along cutting lines C1-C1 and C2-C2 orthogonal to each other.

[0154] In detail, the strip-shaped first internal electrode pattern 221 and the strip-shaped second internal electrode pattern 222 may be cut in the length direction and divided into a plurality of multilayer bodies in a strip shape having a predetermined width. At this time, the stacked ceramic green sheets are also cut together with the internal electrode patterns. Therefore, the dielectric layer may be formed to have the same width as that of the internal electrode.

[0155] Cutting may be performed along cutting lines C2-C2 to conform to a single ceramic body size. For example, before forming the first side edge portion and the second side edge portion, a strip-shaped laminate may be formed by cutting along cutting lines C1-C1 extending perpendicularly to a predetermined interval between the plurality of first internal electrode patterns and the plurality of second internal electrode patterns, and after forming the first side edge portion, the second side edge portion, and the upper cover portion, a plurality of laminates 210 may be formed by cutting the strip-shaped laminate into a single ceramic body size along cutting lines C2-C2 extending parallel to a predetermined interval between the plurality of first internal electrode patterns and the plurality of second internal electrode patterns.

[0156] For example, the strip-shaped laminate may be cut by cutting the central portion of the stacked first internal electrodes and the predetermined gap formed between the second internal electrodes at the same cutting line. Thus, the ends of the first and second internal electrodes may be exposed on opposite cutting surfaces, respectively.

[0157] Thereafter, the first and second side margin parts may be formed on the first and second side surfaces of the stacked body 210 , and at the same time, the upper cover part may be formed on the upper surface of the stacked body 210 .

[0158] Figures 6A to 6B is a perspective view schematically showing a method of manufacturing a multilayer ceramic capacitor according to a first embodiment.

[0159] Reference Fig. 6A and 6B According to the first embodiment, the manufacturing method of the multilayer ceramic capacitor includes: preparing a strip-shaped laminate 210, which is formed to have a width extending by the distance between the side edges; and integrally forming a first side edge portion, a second side edge portion and an upper cover portion on the upper portion and side surfaces of the laminate 210, and edges of the first internal electrode pattern 221 and the second internal electrode pattern 222 are exposed on the side surfaces.

[0160] Next, the laminated body 210 is cut and fired to form the ceramic body 110 including an effective portion A including a dielectric layer 111 and first and second internal electrodes 121 and 122 , a lower cover portion 115 , a first side margin portion 112 , a second side margin portion 113 , and an upper cover portion 114 .

[0161] According to the first embodiment, forming the first side margin part 212 , the second side margin part 213 , and the upper cover part 214 may be performed by adding a ceramic material to form the first side margin part 212 , the second side margin part 213 , and the upper cover part 214 integrally with each other.

[0162] In addition, according to the first embodiment, unlike the second embodiment to be described later, the first side edge portion 212 , the second side edge portion 213 , and the upper cover portion 214 are integrally formed by adding a ceramic material to the strip-shaped stacked body 210 .

[0163] The formation of the first side margin part 212 , the second side margin part 213 , and the upper cover part 214 may be performed by injecting a ceramic slurry onto the bar-shaped stacked body 210 or pressing a dielectric sheet onto the bar-shaped stacked body 210 .

[0164] When the dielectric sheet is pressed against the strip-shaped laminate 210 , a dielectric sheet having relatively high fluidity may be used.

[0165] When the ceramic green sheet stack 210 is cut, the lower cover portion 215 may be cut to a region thereof corresponding to the widths of the first side margin portion 212 and the second side margin portion 213 .

[0166] To this end, the lower cover portion 215 may be formed to have a width extending by the widths of the first and second side margin portions 212 and 213 with respect to the width of the stacked body 210 .

[0167] Figures 7A to 7B is a perspective view schematically showing a method of manufacturing a multilayer ceramic capacitor according to a second embodiment.

[0168] Reference Fig. 7A and Figure 7B According to the second embodiment, the formation of the first side margin portion 212 , the second side margin portion 213 , and the upper cover portion 214 may be performed in a state where a plurality of stacked sheets are formed by cutting the ceramic green sheet stack 210 .

[0169] Since the method of manufacturing a multilayer ceramic capacitor according to the second embodiment is roughly similar to the method of manufacturing a multilayer ceramic capacitor according to the above-mentioned first embodiment, except that the first side edge portion 212, the second side edge portion 213 and the upper cover portion 214 are formed integrally in a state of multiple stacked sheets, its detailed description will be omitted.

[0170] Thereafter, external electrodes may be formed on the third surface of the ceramic body and the fourth surface of the ceramic body, respectively, the first internal electrode being exposed to the third surface and the second internal electrode being exposed to the fourth surface.

[0171] In addition, descriptions of the same features as those in the above-described embodiment will be omitted here to avoid redundancy.

[0172] As described above, according to the embodiment, by integrally forming the first side margin portion, the second side margin portion, and the upper cover portion, the interface bonding between the side margin portion and the body may be reduced, and reliability may be improved.

[0173] In addition, reliability can be improved by controlling the dielectric composition of the first side margin portion, the second side margin portion, and the upper cover portion to be different from the dielectric composition of the dielectric layer of the active portion and the lower cover portion.

[0174] Although the present disclosure includes specific examples, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein will be considered as descriptive meanings only, and not for limiting purposes. The description of the features or aspects in each example will be considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in different orders, and / or if the components in the described systems, architectures, devices, or circuits are combined in different ways and / or replaced or supplemented by other components or their equivalents, the appropriate results may be obtained. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents will be interpreted as being included in the present disclosure.

Claims

1. A multilayer ceramic capacitor comprising: A ceramic body including a dielectric layer, the ceramic body having a first surface and a second surface opposite to each other, a third surface and a fourth surface opposite to each other and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other and connecting the first surface to the fourth surface; a plurality of internal electrodes disposed inside the ceramic body to overlap each other with the dielectric layer interposed therebetween, and each of the plurality of internal electrodes is exposed to one of the third surface and the fourth surface and the first surface and the second surface; as well as A first side margin portion and a second side margin portion are provided on side portions of the plurality of internal electrodes exposed to the first surface and the second surface, wherein the ceramic body comprises an effective portion, an upper cover portion disposed above the effective portion, and a lower cover portion disposed below the effective portion, the effective portion comprises a plurality of internal electrodes disposed to overlap each other and the dielectric layer being interposed between the plurality of internal electrodes to form a capacitor, and A content of magnesium (Mg) included in the first side edge portion and the second side edge portion is greater than a content of magnesium (Mg) included in one of the upper cover portion and the lower cover portion.

2. The multilayer ceramic capacitor according to claim 1, wherein The upper cover portion and the lower cover portion have different dielectric compositions.

3. The multilayer ceramic capacitor according to claim 1, wherein The dielectric layer of the active portion has a different dielectric composition than one of the upper cover portion and the lower cover portion.

4. The multilayer ceramic capacitor according to claim 1, wherein In a side surface of the multilayer ceramic capacitor parallel to the first surface, a first portion adjacent to one of the fifth and sixth surfaces of the ceramic body has a dielectric composition different from a second portion forming the first side margin portion or the second side margin portion.

5. The multilayer ceramic capacitor according to claim 1, wherein A content of magnesium (Mg) included in the upper cover portion is greater than a content of magnesium (Mg) included in the lower cover portion.

6. The multilayer ceramic capacitor according to claim 1, wherein A content of magnesium (Mg) included in one of the upper cover portion and the lower cover portion is greater than a content of magnesium (Mg) included in the dielectric layer of the effective portion.

7. A method for manufacturing a multilayer ceramic capacitor, comprising: preparing a first ceramic green sheet and a second ceramic green sheet, a plurality of first internal electrode patterns being spaced apart from each other at predetermined intervals on the first ceramic green sheet, and a plurality of second internal electrode patterns being spaced apart from each other at predetermined intervals on the second ceramic green sheet; stacking the first ceramic green sheets and the second ceramic green sheets in such a manner that the plurality of first internal electrode patterns and the plurality of second internal electrode patterns overlap each other, and forming a lower cover portion by stacking a plurality of ceramic green sheets at a lower portion of a stacked body, thereby forming a ceramic green sheet stack; cutting the ceramic green sheet laminate to have side surfaces exposing edges of the plurality of first internal electrode patterns and the plurality of second internal electrode patterns in a width direction; forming a first side edge portion, a second side edge portion, and an upper cover portion integrally with each other on an upper portion of the cut ceramic green sheet stack and on the side surface; and firing the cut ceramic green sheet laminate to provide a ceramic body including an effective portion and a lower cover portion, the effective portion having a dielectric layer and first and second internal electrodes, wherein the forming of the first side edge portion, the second side edge portion, and the upper cover portion is performed by adding a ceramic material so that the first side edge portion, the second side edge portion, and the upper cover portion are formed integrally with each other, A content of magnesium (Mg) included in the first side edge portion, the second side edge portion, and the upper cover portion is greater than a content of magnesium (Mg) included in the lower cover portion.

8. The method according to claim 7, wherein: Forming the first side margin portion, the second side margin portion, and the upper cover portion includes injecting a ceramic slurry onto the cut ceramic green sheet stack or pressing a dielectric sheet onto the cut ceramic green sheet stack.

9. The method according to claim 7, further comprising: After forming the first side margin portion, the second side margin portion, and the upper cover portion, the cut ceramic green sheet laminate is cut along a cutting line extending parallel to the predetermined intervals between the plurality of first internal electrode patterns and the plurality of second internal electrode patterns.

10. The method according to claim 7, wherein: The cutting step further includes cutting the ceramic green sheet laminate along a cutting line extending perpendicularly to a predetermined interval between the plurality of first internal electrode patterns and the plurality of second internal electrode patterns before forming the first side margin portion, the second side margin portion and the upper cover portion.

11. The method according to claim 7, wherein: After the ceramic green sheet stack is cut, the width of the lower cover portion is larger than the width of the cut ceramic green sheet stack by the thickness of the first side edge portion and the second side edge portion.

12. The method according to claim 7, wherein: The first side margin portion, the second side margin portion, and the upper cover portion have a dielectric composition different from a dielectric composition of the lower cover portion.

13. The method according to claim 7, wherein: The first side edge portion, the second side edge portion, and the upper cover portion have a dielectric composition different from a dielectric composition of the first ceramic green sheet and the second ceramic green sheet of the ceramic green sheet stack.

14. The method according to claim 7, wherein: The first side edge portion, the second side edge portion, and the upper cover portion contain a greater amount of magnesium (Mg) than the first ceramic green sheet and the second ceramic green sheet of the ceramic green sheet stack.

15. A multilayer ceramic capacitor comprising: a ceramic body having first and second internal electrodes alternately stacked and a dielectric layer interposed between the first and second internal electrodes, wherein the first and second internal electrodes are exposed to opposite first and second surfaces of the ceramic body; an upper cover part and a lower cover part disposed above and below the ceramic body in a stacking direction of the first internal electrode and the second internal electrode; and The first side edge portion and the second side edge portion are respectively disposed on the first surface and the second surface opposite to the ceramic body, wherein one of the upper cover portion and the lower cover portion has a higher magnesium (Mg) content than the other of the upper cover portion and the lower cover portion.

16. The multilayer ceramic capacitor according to claim 15, wherein: The other of the upper cover part and the lower cover part has the same dielectric composition as the dielectric layer of the ceramic body.

17. The multilayer ceramic capacitor according to claim 15, wherein: One of the upper cover portion and the lower cover portion has the same dielectric composition as the first side margin portion and the second side margin portion.

18. The multilayer ceramic capacitor according to claim 17, wherein: The one of the first and second side edge portions and the upper and lower cover portions has a magnesium (Mg) content of 10 mol or more and 30 mol or less with respect to 100 mol of titanium (Ti) included therein.

19. The multilayer ceramic capacitor according to claim 17, wherein: The first surface and the second surface of the ceramic body are disposed opposite to each other in a width direction, and The other of the upper cover portion and the lower cover portion has a width measured in a width direction that is greater than a width of the ceramic body measured in the width direction.

20. A multilayer ceramic capacitor comprising: a ceramic body having first and second internal electrodes alternately stacked and a dielectric layer interposed between the first and second internal electrodes, wherein the first and second internal electrodes are exposed to opposite first and second surfaces of the ceramic body; an upper cover part and a lower cover part disposed above and below the ceramic body in a stacking direction of the first internal electrode and the second internal electrode; and The first side edge portion and the second side edge portion are respectively disposed on the first surface and the second surface opposite to the ceramic body, The first side edge portion and the second side edge portion have a higher magnesium (Mg) content than one of the upper cover portion and the lower cover portion.

21. The multilayer ceramic capacitor according to claim 20, wherein: The first side margin portion and the second side margin portion have the same dielectric composition and magnesium content as the other of the upper cover portion and the lower cover portion.

22. The multilayer ceramic capacitor according to claim 20, wherein: The one of the upper cover part and the lower cover part has the same dielectric composition as the dielectric layer of the ceramic body.

23. The multilayer ceramic capacitor according to claim 20, wherein: The first and second side edge portions and the other of the upper and lower cover portions have a magnesium (Mg) content of 10 mol or more and 30 mol or less relative to 100 mol of titanium (Ti) contained therein.

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