Display module and display device

Abstract

An embodiment of the present invention provides a display module and a display device, wherein the display module includes a display substrate and a heat dissipation composite layer arranged on a side of the display substrate away from the display side of the display substrate, wherein the heat dissipation composite layer includes a first adhesive layer stacked on a side of the display substrate away from the display side of the display substrate and a heat dissipation layer arranged on a side of the first adhesive layer away from the display substrate, wherein the first adhesive layer is a conductive adhesive layer, and the heat dissipation layer is a conductive material, and the first adhesive layer connects the display substrate to the heat dissipation layer; the problem of static electricity accumulation affecting the display effect of the display module is solved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is an active light-emitting display device with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, flexible display devices (Flexible Display) using OLED as a light-emitting device and thin film transistors (TFT) for signal control have become the mainstream products in the current display field.

[0003] However, the OLED display substrate has a complex circuit and is relatively thin, and is relatively sensitive to electric charge. When electric charge accumulates on the OLED display substrate, the OLED display substrate is prone to problems such as greening and flickering. Summary of the invention

[0004] The embodiments of the present invention provide a display module and a display device, which solve the problem that the display effect of the display module is affected by static electricity accumulation.

[0005] In a first aspect, an embodiment of the present invention provides a display module, comprising a display substrate and a heat dissipation composite layer arranged on a side of the display substrate away from a display side of the display substrate, the heat dissipation composite layer comprising a first adhesive layer stacked on a side of the display substrate away from the display side of the display substrate and a heat dissipation layer arranged on a side of the first adhesive layer away from the display substrate, the first adhesive layer is a conductive adhesive layer, the heat dissipation layer is a conductive material, and the first adhesive layer connects the display substrate to the heat dissipation layer.

[0006] In an exemplary embodiment, the heat dissipation composite layer further includes a conductive structure disposed between the first adhesive layer and the heat dissipation layer, and the conductive structure connects the first adhesive layer and the heat dissipation layer.

[0007] In an exemplary embodiment, the display substrate includes a border area, and a vertical projection of the conductive structure on the display substrate overlaps at least a portion of the border area.

[0008] In an exemplary embodiment, the conductive structure is a ring-shaped structure.

[0009] In an exemplary embodiment, the border area is in a rectangular ring shape, and a vertical projection of the conductive structure on the display substrate overlaps with at least one side of the border area.

[0010] In an exemplary embodiment, the heat dissipation composite layer further includes a buffer layer disposed between the first adhesive layer and the heat dissipation layer, and the conductive structure is located on a peripheral side of the buffer layer.

[0011] In an exemplary embodiment, the display substrate includes a display area, and a vertical projection of the buffer layer on the display substrate overlaps at least a portion of the display area.

[0012] In an exemplary embodiment, the heat dissipation composite layer further includes a second adhesive layer disposed between the buffer layer and the heat dissipation layer, the second adhesive layer is an insulating adhesive layer, and the conductive structure is located on a peripheral side of the second adhesive layer.

[0013] In an exemplary embodiment, the conductive structure is made of conductive adhesive or conductive cloth; or, the conductive structure includes a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer, and a conductive cloth disposed between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.

[0014] In an exemplary embodiment, the heat dissipation layer is a metal layer.

[0015] In an exemplary embodiment, the impedance of the first adhesive layer is less than 10 7 ohm.

[0016] In an exemplary embodiment, a grid pattern is disposed on a surface of the first adhesive layer close to the display substrate.

[0017] In a second aspect, an embodiment of the present invention further provides a display device, comprising the aforementioned display module.

[0018] The present invention provides a display module and a display device, wherein a display substrate is connected to a heat dissipation layer via a first adhesive layer, so that the first adhesive layer can conduct static electricity generated on the display substrate to the heat dissipation layer, thereby avoiding static electricity accumulation on the display substrate and solving display problems such as greening caused by static electricity accumulation on the display substrate.

[0019] Of course, it is not necessary to achieve all of the advantages described above at the same time when implementing any product or method of the present invention. Other features and advantages of the present invention will be described in the subsequent description embodiments, and partly become apparent from the description embodiments, or be understood by practicing the present invention. The purposes and other advantages of the embodiments of the present invention can be achieved and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention. The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the contents of the present invention.

[0021] Figure 1 An exploded view of a display module provided in an embodiment of the present disclosure;

[0022] Figure 2 A schematic diagram of the structure of a heat dissipation composite layer in a display module provided in an embodiment of the present disclosure;

[0023] Figure 3 A cross-sectional view of a heat dissipation composite layer in a display module provided in an embodiment of the present disclosure;

[0024] Figure 4 An enlarged view of a heat dissipation composite layer in a display module provided in an embodiment of the present disclosure;

[0025] Figure 5 A schematic diagram of the structure of a first adhesive layer in a display module provided in an embodiment of the present disclosure;

[0026] Figure 6 A schematic diagram of the structure of a conductive structure in a display module provided in an embodiment of the present disclosure;

[0027] Figure 7 A schematic diagram of the structure of a heat dissipation layer in a display module provided in an embodiment of the present disclosure;

[0028] Figure 8 A schematic diagram of the structure of a buffer layer in a display module provided in an embodiment of the present disclosure;

[0029] Fig. 9 A schematic diagram of the structure of the second adhesive layer in the display module provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0030] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined arbitrarily with each other.

[0031] Figure 1 The exploded diagram of the display module provided by the embodiment of the present disclosure. Figure 1As shown, the display module provided by the embodiment of the present disclosure includes a display substrate 100 and a heat dissipation composite layer 200 disposed on the side of the display substrate 100 away from the display side of the display substrate 100. The heat dissipation composite layer 200 is attached to the display substrate 100 and can play a role in heat dissipation, which helps to quickly dissipate the heat generated by the display substrate 100 when working. Among them, the display substrate 100 can be a rigid or flexible OLED display substrate.

[0032] Figure 2 A schematic diagram of the structure of a heat dissipation composite layer in a display module provided in an embodiment of the present disclosure; Figure 3 A cross-sectional view of a heat dissipation composite layer in a display module provided in an embodiment of the present disclosure; Figure 4 This is an enlarged view of the heat dissipation composite layer in the display module provided by the embodiment of the present disclosure. Figure 3 for Figure 2 A cross-sectional view in the AA direction, and Figure 4 for Figure 3 The enlarged view at a in the figure is taken as an example to illustrate the structure of the display module of the embodiment of the present disclosure. Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation composite layer 200 includes a first adhesive layer 1 stacked on the side of the display substrate 100 away from the display side of the display substrate 100 and a heat dissipation layer 3 arranged on the side of the first adhesive layer 1 away from the display substrate 100. The first adhesive layer 1 is a conductive adhesive layer, and the heat dissipation layer 3 is a conductive material. The first adhesive layer 1 connects the display substrate 100 with the heat dissipation layer 3, so that the first adhesive layer 1 can conduct the static electricity generated on the display substrate 100 to the heat dissipation layer 3, avoid static electricity accumulation on the display substrate 100, and solve the display problem such as greening caused by static electricity accumulation on the display substrate 100. Among them, the conductive adhesive layer is an adhesive layer containing conductive particles or metal ions. The heat dissipation layer 3 can be a metal layer.

[0033] In an exemplary embodiment, the heat dissipation layer 3 can play a role in heat dissipation, which helps to quickly dissipate the heat generated when the display substrate 100 is working; and the heat dissipation layer 3 can eliminate static electricity on the display substrate 100.

[0034] In an exemplary embodiment, the display module also includes a middle frame, and the heat dissipation layer 3 is arranged on the middle frame away from the display substrate 100 and connected to the middle frame, so that the heat dissipation layer 3 is grounded through the middle frame, eliminating static electricity on the heat dissipation layer 3 and preventing static electricity from being transmitted back to the display substrate 100.

[0035] In an exemplary embodiment, the heat dissipation composite layer 200 further includes a conductive structure 2 disposed between the first adhesive layer 1 and the heat dissipation layer 3, and the conductive structure 2 connects the first adhesive layer 1 and the heat dissipation layer 3. The conductive structure 2 has a conductive property and can conduct static electricity on the first adhesive layer 1 to the heat dissipation layer 3.

[0036] In an exemplary embodiment, the first adhesive layer 1 has adhesive properties and can adhere the conductive structure 2 to the side of the display substrate 100 away from the display side of the display substrate 100; and the first adhesive layer 1 also has conductive properties and can conduct static electricity on the display substrate 100 to the conductive structure 2.

[0037] In an exemplary embodiment, the display substrate 100 includes a display area and a frame area surrounding the display area. The vertical projection of the conductive structure 2 on the display substrate 100 overlaps with at least a portion of the frame area, so that the vertical projection of the conductive structure 2 on the display substrate 100 does not overlap with the display area to avoid affecting the fit of the display area.

[0038] Figure 6 Schematic diagram of the structure of the conductive structure in the display module provided by the embodiment of the present disclosure. In an exemplary embodiment, Figure 4 and Figure 6 As shown, the conductive structure 2 may be a ring-shaped structure. The conductive structure 2 is arranged corresponding to the frame area of ​​the display substrate 100. The material of the conductive structure 2 may be a conductive adhesive layer, for example, the material of the conductive structure 2 may be a conductive adhesive or a conductive cloth, which is easy to arrange and has a low price; or, the conductive structure 2 is a composite structure, and the conductive structure 2 includes a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer arranged in a stacked manner, and a conductive cloth arranged between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.

[0039] In a specific implementation, the conductive structure may also be in other shapes, for example, the border region of the display substrate is a rectangular ring, and the vertical projection of the conductive structure on the display substrate overlaps with at least one side of the border region. For example, the vertical projection of the conductive structure on the display substrate overlaps with at least one of the two long sides of the border region; or, the vertical projection of the conductive structure on the display substrate overlaps with at least one of the two short sides of the border region.

[0040] Figure 5 FIG. 1 is a schematic diagram of the structure of the first adhesive layer in the display module provided in an embodiment of the present disclosure. Figure 4 and Figure 5 As shown, the first adhesive layer 1 is made of low impedance material. For example, the impedance of the material of the first adhesive layer 1 is less than 10 7 The first adhesive layer 1 is attached to the side of the display substrate 100 away from the display side of the display substrate 100, and is used to conduct static electricity on the display substrate 100 to the conductive structure 2, and the conductive structure 2 then conducts the static electricity to the heat dissipation layer 3. The first adhesive layer 1 can be made of double-sided adhesive material.

[0041] In an exemplary embodiment, if Figure 5As shown, a grid pattern 101 is provided on the surface of the first adhesive layer 1 close to the display substrate. The grid pattern 101 is a plurality of cross-arranged grooves provided on the surface of the first adhesive layer 1. The first adhesive layer 1 can be pressed by the grid so that the cross-arranged grooves are printed on the adhesive surface. The grid pattern 101 is used to exhaust air during the bonding process between the first adhesive layer 1 and the display substrate, prevent the generation of bonding bubbles, and enhance the tightness of the heat dissipation composite layer and the display substrate.

[0042] Figure 7 Schematic diagram of the structure of the heat dissipation layer in the display module provided by the embodiment of the present disclosure. Figure 4 and Figure 7 As shown, the heat dissipation layer 3 can be a metal layer. The metal layer can be silver, copper, aluminum and alloys thereof, so that the heat dissipation layer 3 has a good heat dissipation effect on the one hand, and a good conductive effect on the other hand, and can eliminate static electricity on the display substrate.

[0043] Figure 8 Schematic diagram of the structure of the buffer layer in the display module provided by the embodiment of the present disclosure. In an exemplary embodiment, Figure 4 and Figure 8 As shown, the heat dissipation composite layer 200 also includes a buffer layer 4 disposed between the first adhesive layer 1 and the heat dissipation layer 3. The buffer layer 4 has a buffering effect, which can prevent the heat dissipation composite layer 200 from damaging the display substrate 100 during the bonding process with the display substrate 100 or has a buffering effect on the external force on the display module. The conductive structure 2 is located on the peripheral side of the buffer layer 4. The material of the buffer layer 4 can be foam.

[0044] In an exemplary embodiment, the vertical projection of the buffer layer 4 on the display substrate 100 overlaps at least part of the display area, that is, the buffer layer 4 is arranged corresponding to the display area, and the conductive structure 2 is arranged corresponding to the frame area. The buffer layer 4 can prevent the bonding pressure from damaging the display area during the bonding process.

[0045] Fig. 9 Schematic diagram of the structure of the second adhesive layer in the display module provided by the embodiment of the present disclosure. Figure 4 and Fig. 9 As shown, the heat dissipation composite layer 200 further includes a second adhesive layer 5 disposed between the buffer layer 4 and the heat dissipation layer 3, the second adhesive layer 5 is an insulating adhesive layer, and the conductive structure 2 is located around the second adhesive layer 5. The second adhesive layer 5 is used to bond the buffer layer 4 to the heat dissipation layer 3. The second adhesive layer 5 may be polyester resin (PET) or polyimide (PI).

[0046] The embodiment of the present disclosure also provides a display device, including the aforementioned display module. The display device includes, for example, a mobile phone, a tablet computer, a smart wearable product (smart watch, bracelet), a personal digital assistant (PDA), a car computer, etc. The embodiment of the present application does not impose any special restrictions on the specific form of the above-mentioned display device.

[0047] In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0048] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Although the embodiments disclosed in the present invention are as above, the contents described are only embodiments adopted to facilitate understanding of the present invention and are not intended to limit the present invention. Any technician in the field to which the present invention belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present invention, but the patent protection scope of the present invention shall still be subject to the scope defined in the attached claims.

Claims

1. A display module, characterized in that: The invention comprises a display substrate and a heat dissipation composite layer arranged on a side of the display substrate away from the display side of the display substrate, wherein the heat dissipation composite layer comprises a first adhesive layer stacked and arranged on a side of the display substrate away from the display side of the display substrate and a heat dissipation layer arranged on a side of the first adhesive layer away from the display substrate, wherein the first adhesive layer is a conductive adhesive layer, the heat dissipation layer is a conductive material, and the first adhesive layer connects the display substrate with the heat dissipation layer; the heat dissipation composite layer further comprises a conductive structure arranged between the first adhesive layer and the heat dissipation layer, and the conductive structure electrically connects the first adhesive layer with the heat dissipation layer; the display substrate comprises a frame area, and the heat dissipation layer is connected to the frame area; the conductive structure overlaps at least part of the frame area at a vertical projection of the display substrate; the heat dissipation composite layer further comprises a buffer layer arranged between the first adhesive layer and the heat dissipation layer, and the conductive structure is located on the peripheral side of the buffer layer.

2. The display module according to claim 1, characterized in that: The conductive structure is a ring structure.

3. The display module according to claim 1, characterized in that: The frame area is in a rectangular ring shape, and a vertical projection of the conductive structure on the display substrate overlaps with at least one side of the frame area.

4. The display module according to claim 1, characterized in that: The display substrate includes a display area, and a vertical projection of the buffer layer on the display substrate overlaps at least a portion of the display area.

5. The display module according to claim 1, characterized in that: The heat dissipation composite layer further includes a second adhesive layer disposed between the buffer layer and the heat dissipation layer, the second adhesive layer is an insulating adhesive layer, and the conductive structure is located on a peripheral side of the second adhesive layer.

6. The display module according to claim 1, characterized in that: The conductive structure is made of conductive adhesive or conductive cloth; or, the conductive structure includes a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer, and a conductive cloth arranged between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.

7. The display module according to claim 1, characterized in that: The heat dissipation layer is a metal layer.

8. The display module according to claim 1, characterized in that: The impedance of the first adhesive layer is less than 10 7 ohm.

9. The display module according to claim 1, characterized in that: A grid pattern is arranged on a surface of the first adhesive layer close to the display substrate.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1 to 9.

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