Multilayer electronic components

Abstract

The present disclosure provides a multilayer electronic component, comprising: a main body, comprising a first inner electrode and a second inner electrode alternately arranged in a first direction with a dielectric layer interposed between the first inner electrode and the second inner electrode, and the main body comprising a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction. A first external electrode is arranged on the third surface, the fourth surface, the fifth surface, and the sixth surface. A second external electrode is arranged on one or both of the first and second surfaces, and a via electrode is exposed through the surface of the main body on which the second external electrode is arranged. The ratio W / L is greater than or equal to 0.95 and less than or equal to 1.05, wherein L is the length of the main body and W is the width of the main body.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0009507 filed on January 23, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multilayer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip capacitors mounted on printed circuit boards of various electronic products, such as imaging devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), as well as computers, smartphones, and mobile phones, for charging and discharging. MLCCs also play roles in electronic control units (ECUs) in vehicles, such as stabilizing power supply voltage, decoupling, attenuating high-frequency noise, and providing DC blocking.

[0004] Recently, as the functions and performance expectations of electronic products have become advanced, continuous impedance reduction in the high-frequency region is desired, and thus, demand for low equivalent series inductance (ESL) MLCC products is rapidly increasing.

[0005] Conventional products for reducing ESL may include low inductance chip capacitors (LICCs), super low inductance capacitors (SLICs), three-terminal MLCCs, etc. However, these products have the problem of difficulty in meeting low ESL characteristics in a very high frequency range.

[0006] To solve this problem, silicon capacitors having very low ESL have recently been developed, but in the case of silicon capacitors, the number of layers that can be stacked in a semiconductor process may be small, making it difficult to ensure capacitance.

[0007] Therefore, there is a need to develop a multilayer electronic component having a new structure that can satisfy low ESL characteristics at high frequencies while ensuring capacitance. Summary of the Invention

[0008] An aspect of the present disclosure is to provide a multilayer electronic assembly having relatively low ESL.

[0009] An aspect of the present disclosure is to provide a multilayer electronic component having relatively low ESL even in a high frequency region.

[0010] An aspect of the present disclosure is to provide a multilayer electronic component having relatively high capacitance per unit volume.

[0011] However, the purpose of the present disclosure is not limited to the above and will be more easily understood in the course of describing specific embodiments of the present disclosure.

[0012] According to one aspect of the present disclosure, a multilayer electronic component includes a body including first and second inner electrodes alternately arranged in a first direction with a dielectric layer interposed between the first and second inner electrodes. The body also includes a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in the second direction, and a fifth surface and a sixth surface connected to the first, second, third, and fourth surfaces and opposing each other in a third direction. A first outer electrode is disposed on the third, fourth, fifth, and sixth surfaces and connected to the first inner electrodes. A second outer electrode is disposed on one or both of the first and second surfaces, and a via electrode is exposed through the surface on which the second outer electrode is disposed and connects the second inner electrode and the second outer electrode. A ratio W / L is greater than or equal to 0.95 and less than or equal to 1.05, where L is the dimension of the body in the second direction and W is the dimension of the body in the third direction.

[0013] According to one aspect of the present disclosure, a multilayer electronic component includes a main body including first and second internal electrodes alternately stacked in a first direction with a dielectric layer disposed between the first and second internal electrodes, wherein each of the first internal electrodes extends to each of four side surfaces of the main body. A first external electrode is disposed on all four side surfaces of the main body to connect to the first internal electrodes, and a second external electrode is disposed on one or more end surfaces of the main body opposite to each other in the first direction and connected to the second internal electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0015] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is schematically shown.

[0016] Figure 2 Schematically shows Figure 1 A perspective view of a main body without an outer electrode thereon.

[0017] Figure 3 is a diagram illustrating a dielectric layer in which a first internal electrode is disposed according to an embodiment of the present disclosure.

[0018] Figure 4 is a diagram illustrating a dielectric layer in which a second internal electrode is disposed according to an embodiment of the present disclosure.

[0019] Figure 5 It is schematically shown Figure 2 An exploded perspective view of the exploded subject.

[0020] Figure 6 It is along Figure 1 A cross-sectional view taken along line II'.

[0021] Figure 7 A perspective view schematically shows a multilayer electronic component according to a first variation of the present disclosure.

[0022] Figure 8 A perspective view schematically shows a multilayer electronic component according to a second variation of the present disclosure.

[0023] Figure 9 is a graph showing changes in impedance according to frequency of the measurement comparative example, the inventive example 1, and the inventive example 2. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and accompanying drawings. However, the embodiments of the present disclosure may be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, embodiments of the present disclosure may be provided to more fully describe the present disclosure to those of ordinary skill in the art. Therefore, for clarity of description, the shapes and sizes of elements in the accompanying drawings may be exaggerated, and elements indicated by the same reference numerals in the accompanying drawings may be identical elements.

[0025] In the accompanying drawings, for the purpose of illustrating the present disclosure, parts not related to the description will be omitted, and thicknesses may be exaggerated to clearly illustrate layers and regions. The same reference numerals will be used to indicate the same components. In addition, throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including" an element, it means that the element may also include other elements without departing from the scope of the present disclosure.

[0026] In the drawings, the X direction may be defined as the second direction, the L direction, or the length direction; the Y direction may be defined as the third direction, the W direction, or the width direction; and the Z direction may be defined as the first direction, the stacking direction, the T direction, or the thickness direction. For example, the X direction, the Y direction, and the Z direction may be orthogonal to each other.

[0027] Multilayer electronic components

[0028] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is schematically shown.

[0029] Figure 2 Schematically shows Figure 1 A perspective view of the main body excluding the outer electrode.

[0030] Figure 3 is a diagram illustrating a dielectric layer in which a first internal electrode is disposed according to an embodiment of the present disclosure.

[0031] Figure 4 is a diagram illustrating a dielectric layer in which a second internal electrode is disposed according to an embodiment of the present disclosure.

[0032] Figure 5 It is schematically shown Figure 2 An exploded perspective view of the exploded subject.

[0033] Figure 6 It is along Figure 1 A cross-sectional view taken along line II'.

[0034] In the following, reference will be made to Figures 1 to 6 A multilayer electronic assembly 100 according to an embodiment of the present disclosure is described.

[0035] A multilayer electronic component 100 according to an embodiment of the present disclosure may include a body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately arranged in a first direction (Z direction) with the dielectric layer interposed therebetween, and the body 110 including a first surface 1 and a second surface 2 opposing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and opposing each other in a second direction (X direction), and a fifth surface 5 and a sixth surface 6 connected to the first, second, third, and fourth surfaces and opposing each other in a third direction (Y direction). A first external electrode 131 is provided on the third, fourth, fifth, and sixth surfaces and connected to the first internal electrode, a second external electrode 132 is provided on one or both of the first and second surfaces, and a via electrode 123 is exposed from a surface of the body 110 on which the second external electrode 132 is provided and connects the second internal electrode and the second external electrode. The ratio W / L is greater than or equal to 0.95 and less than or equal to 1.05, where L is a dimension of the main body in the second direction and W is a dimension of the main body in the third direction.

[0036] Any suitable body measurement method can be used to measure the L dimension of the body in the second direction and the W dimension in the third direction. In one illustrative embodiment, the L dimension can be measured in a cross section of the body 110 extending in the X and Z directions and passing through the center of the body in the Y direction. In one illustrative embodiment, the L dimension can be measured five times by cutting the body 110 at evenly spaced locations along the Z direction, and the L dimension can be averaged. A similar method can be used to measure the W dimension. Alternatively, other suitable measurement methods can be used.

[0037] Conventional products for reducing ESL may include low inductance chip capacitors (LICCs), super low inductance capacitors (SLICs), three-terminal MLCCs, etc. However, these products have the problem of difficulty in meeting low ESL characteristics in a very high frequency range.

[0038] To solve this problem, silicon capacitors having very low ESL have recently been developed, but in the case of silicon capacitors, the number of layers that can be stacked in a semiconductor process may be small, making it difficult to ensure capacitance.

[0039] Therefore, in the present disclosure, the length (L) and the width (W) of the body can be controlled to be almost similar (e.g., almost equal to each other), and the first inner electrode 121 can be exposed from the third, fourth, fifth, and sixth surfaces of the body to be connected (e.g., directly connected) to the first outer electrode 131. The second inner electrode 122 and the second outer electrode 132 can be connected to each other through the via electrode 123 to minimize the current loop and expand the area connected to the substrate during installation, thereby reducing ESL. In particular, according to the present disclosure, ESL in the high-frequency region can be significantly reduced.

[0040] In the body 110 , dielectric layers 111 and internal electrodes 121 and 122 may be alternately stacked.

[0041] The body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in a first direction (Z direction), a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction (X direction), and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and are opposite to each other in a third direction (Y direction). Furthermore, the body 110 may have a hexahedral shape, etc. Due to the shrinkage of the ceramic powder contained in the body 110 during the sintering process, the body 110 may not have a perfect hexahedral shape with completely straight lines, but may have a generally hexahedral shape.

[0042] The ratio W / L may be greater than or equal to 0.95 and less than or equal to 1.05, where L is the dimension of the main body in the second direction, and W is the dimension of the main body in the third direction. When W / L is less than 0.95 or greater than 1.05, the distance between the external electrodes on two of the four surfaces (e.g., the four side surfaces, namely, the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6) becomes longer. In this case, the length of the current loop increases, thereby increasing the ESL. Therefore, W / L may be greater than or equal to 0.95 and less than or equal to 1.05, and more preferably, L and W may be substantially the same. For example, more preferably, the LW cross-section of the main body may have a generally square shape.

[0043] In this case, the dimension (L) (e.g., length) of the main body in the second direction and the dimension (W) (e.g., width) of the main body in the third direction may be 0.5 mm or less, respectively. When the dimension (L) of the main body in the second direction or the dimension (W) of the main body in the third direction exceeds 0.5 mm, the distance between the external electrodes increases. In this case, since the length of the current loop increases, the ESL increases. In addition, since the dimension of the first external electrode 131 in the second direction or the dimension of the first external electrode 131 in the third direction also increases, the ESL in the low-frequency region is reduced due to multiple resonances with parasitic components inside the multilayer electronic component.

[0044] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and boundaries between adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify the boundaries between the layers without using a scanning electron microscope (SEM).

[0045] According to the embodiment of the present disclosure, the raw materials used to form the dielectric layer 111 are not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead-based composite perovskite materials, strontium titanate-based materials, etc. can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the ceramic powder may include BaTiO3 or calcium (Ca), zirconium (Zr), etc. partially dissolved in BaTiO3 (BaTiO3). 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc.

[0046] Various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like may be added to powder particles such as barium titanate (BaTiO 3 ) as a material for forming the dielectric layer 111 according to the purpose of the present disclosure. In this case, various additives such as transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like may be used as the ceramic additives.

[0047] The main body 110 may include a capacitor forming portion and an upper protective layer 112 and a lower protective layer 113. The capacitor forming portion is arranged in the main body 110 and includes a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged to be opposite to each other and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122 to form a capacitor. The upper protective layer 112 and the lower protective layer 113 are respectively formed above and below the capacitor forming portion in the Z direction.

[0048] The capacitance forming portion may be a portion that contributes to forming capacitance of a capacitor and may be formed by repeatedly and alternately stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0049] The upper protective layer 112 and the lower protective layer 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming portion in the vertical direction (e.g., the Z direction), respectively, and can basically play a role in preventing damage to the internal electrode due to physical stress or chemical stress. In addition, a via electrode 123 may be included in the upper protective layer 112 and / or the lower protective layer 113, the first internal electrode 121 and the second external electrode 132 may be insulated from each other, and the second internal electrode 122 and the second external electrode 132 may be electrically connected to each other through the via electrode 123.

[0050] The upper protective layer 112 and the lower protective layer 113 may not include any internal electrode therein and may include the same material as that of the dielectric layer 111 .

[0051] The internal electrodes 121 and 122 may be arranged to face each other with the dielectric layer 111 interposed therebetween. The internal electrodes 121 and 122 may include first internal electrodes 121 alternately stacked with second internal electrodes 122 to face and overlap each other, and the dielectric layer may be interposed between the first internal electrodes 121 and the second internal electrodes 122.

[0052] The first internal electrode 121 may be exposed through the third, fourth, fifth, and sixth surfaces of the body 110, and the second internal electrode 122 may be disposed so that its edge is spaced apart from the third, fourth, fifth, and sixth surfaces of the body 110. Thus, the first internal electrode 121 may be exposed from the third, fourth, fifth, and sixth surfaces to be directly connected to the first external electrode 131 disposed on the third, fourth, fifth, and sixth surfaces, and the second internal electrode 122 may be connected to the second external electrode 132 through the via electrode 123. The first internal electrode 121 and the second internal electrode 122 may have different polarities.

[0053] In this case, the length and width of the first internal electrode 121 may be substantially the same as the length (L) and width (W) of the main body 110 (taking into account a tolerance). For example, the ends of the first internal electrode 121 may all be exposed to the outside from the main body 110, and the second internal electrode 122 may be formed so as not to be exposed to the outside from the main body 110. For example, each of the first internal electrodes 121 may be exposed along the entire width of each of the four side surfaces of the main body 110. Therefore, the electrical connectivity between the first internal electrode 121 and the first external electrode 131 may be improved, and the overlapping area between the first internal electrode 121 and the second internal electrode 122 may be maximized to increase the capacitance per unit volume.

[0054] The first and second internal electrodes 121 and 122 may be electrically separated and isolated from each other by the dielectric layer 111 interposed therebetween.

[0055] The body 110 may be formed by alternately stacking dielectric layers 111 on which the first internal electrodes 121 are printed and dielectric layers 111 on which the second internal electrodes 122 are printed in a thickness direction (Z direction) and then sintering them.

[0056] In this case, the first and second internal electrodes 121 and 122 may be stacked so that the number of the first and second internal electrodes 121 and 122 is 20 or less, respectively. For example, the first and second internal electrodes 121 and 122 may be stacked so that the total number of the stacked internal electrodes is 40 or less. When the total number of the stacked internal electrodes of the first and second internal electrodes 121 and 122 is greater than 40, mounting reliability may deteriorate as the thickness (T) of the body 110 increases, and impedance at a specific frequency may increase due to the occurrence of a resonance phenomenon.

[0057] In addition, the first and second internal electrodes 121 and 122 may be stacked so that the number of the first and second internal electrodes 121 and 122 is 10 or less, respectively. For example, the first and second internal electrodes 121 and 122 may be stacked so that the total number of stacked internal electrodes is 20 or less.

[0058] When the total number of stacked internal electrodes of the first and second internal electrodes 121 and 122 is greater than 20, the size of the first external electrode 131 in the first direction may increase. In this case, the impedance at a specific frequency may increase due to multiple resonances with parasitic components inside the multilayer electronic component.

[0059] The material used to form the internal electrodes 121 and 122 is not particularly limited, and a material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes on a ceramic green sheet, the conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0060] As a printing method of the conductive paste for the internal electrode, a screen printing method, a gravure printing method, etc. may be used, but the present disclosure is not limited thereto.

[0061] The via electrode 123 may be exposed through a surface of the body 110 on which the second external electrode 132 is disposed to connect the second internal electrode 122 and the second external electrode 132 .

[0062] The via electrode 123 may not be electrically connected to the first internal electrode 121. To this end, the first internal electrode 121 may include an insulating portion 121 a so as to be spaced apart from the via electrode 123 (for example, the insulating portion 121 a may provide a space between the first internal electrode 121 and the via electrode 123), and the via electrode 123 may be provided to penetrate the insulating portion 121 a and the second internal electrode 122. In this case, the direction in which the via electrode 123 passes through the body 110 may be the first direction.

[0063] The via electrode 123 may be formed by forming a via hole in the body 110 and then filling the via hole with a conductive material. In this case, the conductive material may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0064] To form the via hole, a physical penetration process such as mechanical pinning or laser drilling may be used. When the thickness of the body is too thick and laser drilling is used, the peripheral portion of the via hole may be damaged, deteriorating the connectivity of the second inner electrode 122. Therefore, a physical penetration process may be preferably used.

[0065] In the embodiment of the present disclosure, four via electrodes 123 are shown, but the present disclosure is not limited thereto. For example, the via electrode 123 may be provided as a single via electrode, or may be provided as a plurality of via electrodes (such as two or more via electrodes).

[0066] When a plurality of via electrodes 123 are provided, the current loop length can be further minimized to reduce ESL. Therefore, in order to further reduce ESL, the via electrode 123 can be provided as two or more via electrodes.

[0067] The external electrodes 131 and 132 may be disposed on the body 110 and may be electrically connected to the internal electrodes 121 and 122 , respectively.

[0068] The first external electrode 131 may be provided on the third, fourth, fifth, and sixth surfaces of the body 110 and may be connected to the first internal electrode 121. The second external electrode may be provided on at least one of the first and second surfaces of the body 110 to be connected to the via electrode 123, and the second external electrode may be electrically connected to the second internal electrode 122 through the via electrode 123.

[0069] like Figure 1 As shown, the first external electrode 131 may be disposed around the third, fourth, fifth, and sixth surfaces of the body 110. Therefore, the area of ​​the first external electrode 131 contacting the first internal electrode 121 may be maximized, and electrical connectivity between the first external electrode 131 and the first internal electrode 121 may be improved.

[0070] In addition, refer to Figure 7 , Figure 7 In a perspective view schematically illustrating a multilayer electronic component 100a according to a first variation of the present disclosure, the first external electrode 131' may be provided to extend from a portion of the first surface to a portion of the second surface of the body 110. Thus, by increasing the area connected to the substrate during mounting, ESL can be further reduced and mounting reliability can be improved.

[0071] like Figure 1 or Figure 7 As shown, when two or more via electrodes 123 are provided, the second external electrode 132 may be provided as a plurality of second external electrodes to be connected to each of the two or more via electrodes 123 on the first surface or the second surface of the body 110 .

[0072] In addition, refer to Figure 8 , Figure 8 A perspective view schematically illustrates a multilayer electronic component 100b according to a second variation of the present disclosure. When two or more via electrodes 123 are provided, a second external electrode 132′ may be provided to be connected to all of the two or more via electrodes 123. That is, the second external electrode 132′ may be provided as a single external electrode simultaneously connected to two or more via electrodes 123. Therefore, by increasing the area connected to the substrate during mounting, ESL can be further reduced and mounting reliability can be improved.

[0073] The external electrodes 131 and 132 may be formed of any material, such as metal, as long as they have conductivity. Specific materials may be determined in consideration of electrical characteristics, structural stability, etc., and the external electrodes 131 and 132 may also have a multi-layer structure.

[0074] For example, the external electrodes 131 and 132 may be fired electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0075] In addition, the external electrodes 131 and 132 may have a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. In addition, the external electrodes 131 and 132 may be formed by transferring a sheet including a conductive metal onto the main body, or by transferring a sheet including a conductive metal onto a fired electrode. In addition, the external electrodes 131 and 132 may be formed using an atomic layer deposition (ALD) process, a molecular layer deposition (MLD) process, a chemical vapor deposition (CVD) process, a sputtering process, or the like.

[0076] The conductive metal used for the external electrodes 131 and 132 is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes to form a capacitor. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0077] In addition, a plating layer may be provided on the outer surface of the outer electrode. As a more specific example of the plating layer, the plating layer may be a nickel (Ni) plating layer or a tin (Sn) plating layer, and may have a form in which a nickel (Ni) plating layer and a tin (Sn) plating layer are formed in sequence, or may have a form in which a tin (Sn) plating layer, a nickel (Ni) plating layer, and a tin (Sn) plating layer are formed in sequence. In addition, the plating layer may include multiple nickel (Ni) plating layers and / or multiple tin (Sn) plating layers.

[0078] (Example)

[0079] Figure 9 is a graph showing changes in impedance according to frequency for the comparative example, inventive example 1, and inventive example 2, and Table 1 below shows simulation results of impedance values ​​according to frequency for the comparative example, inventive example 1, and inventive example 2. The impedance value at high frequencies may be proportional to the ESL value.

[0080] The comparative example is an MLCC having a conventional three-terminal structure. In this case, the L of the body is 1000 μm, the W of the body is 500 μm, and 10 first internal electrodes and 10 second internal electrodes are stacked, with a total of 20 stacked internal electrodes.

[0081] Inventive Examples 1 and 2 are multilayer electronic components manufactured according to embodiments of the present disclosure. In Inventive Example 1, the L and W lengths of the main body were set to 300 μm, and 10 first internal electrodes and 10 second internal electrodes were stacked, with a total of 20 stacked internal electrodes. In Inventive Example 2, the L and W lengths of the main body were set to 300 μm, and 30 first internal electrodes and 30 second internal electrodes were stacked, with a total of 60 stacked internal electrodes.

[0082] [Table 1]

[0083] ESL(pH) 200MHz 300MHz 500MHz 700MHz 1GHz 2GHz 3GHz Comparison Examples 62.45pH 58.77pH 53.30pH 49.67pH 46.73pH 46.86pH 51.31pH Invention Example 1 15.68pH 25.42pH 36.92pH 23.73pH 21.11pH 17.56pH 16.15pH Invention Example 2 72.09pH 35.20pH 27.99pH 24.47pH 21.71pH 17.97pH 16.57pH

[0084] Reference Figure 9 , the size of Inventive Example 1 and Inventive Example 2 can be small compared to the comparative example. Therefore, the total capacitance compared to the three-terminal structure is slightly lower, but the capacitance per unit volume is relatively higher.

[0085] Furthermore, when comparing Inventive Example 1 and Inventive Example 2, it can be seen that the self-resonant frequency (SRF) increases as the total number of stacked internal electrodes decreases.

[0086] Referring to Table 1, in the case of Inventive Example 2, the ESL characteristics are measured to be relatively high due to the resonance effect in the 200 MHz band, but it can be seen that Inventive Example 1 and Inventive Example 2 have lower ESL characteristics than the Comparative Example.

[0087] Specifically, it can be seen that at a frequency of 300 MHz or higher, the ESL characteristics of Inventive Example 1 and Inventive Example 2 are significantly lower than the ESL characteristics of the comparative example as the frequency increases.

[0088] In the case of Invention Example 2, the relatively high ESL characteristics measured in the 200 MHz band may be a phenomenon caused by the increase in the distance of the first external electrode in the first direction as the total number of stacks of internal electrodes increases, thereby causing multiple resonances with parasitic components inside the multilayer electronic component.

[0089] One of the various effects of the present disclosure may be to reduce ESL by controlling the shape of the body and the arrangement of the external electrodes and the internal electrodes. Specifically, according to the present disclosure, ESL in a high frequency region may be reduced.

[0090] One of several effects of the present disclosure is to provide a multilayer electronic component having high capacitance per unit volume.

[0091] However, various advantages and effects of the present disclosure are not limited to the above and can be more easily understood in the course of describing specific embodiments of the present disclosure.

[0092] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic assembly comprising: a main body including first and second internal electrodes alternately stacked in a first direction with a dielectric layer disposed between the first and second internal electrodes, wherein each of the first internal electrodes extends to each of the four side surfaces of the body; a first outer electrode provided on all four side surfaces of the body to be connected to the first inner electrode; and a second outer electrode provided on one or both end surfaces of the body opposite to each other in the first direction and connected to the second inner electrode, The first external electrode is spaced apart from edges of the one or both end surfaces of the body.

2. The multilayer electronic component according to claim 1, wherein Each of the first internal electrodes is exposed along an entire width of each of the four side surfaces of the body.

3. The multilayer electronic component according to claim 2, wherein The second internal electrode is disposed to be spaced apart from each of the four side surfaces.

4. The multilayer electronic component according to claim 1, wherein The length of the first internal electrode is substantially the same as that of the main body, and the width of the first internal electrode is substantially the same as that of the main body.

5. The multilayer electronic component according to claim 2, wherein The first external electrode extends across an entire width of each of the four side surfaces of the body. 6 . The multilayer electronic component of claim 1 , further comprising one or more via electrodes extending through the body in the first direction to connect the second external electrode and the second internal electrode.

7. The multilayer electronic component according to claim 6, wherein The first inner electrode includes an insulating portion providing a space between the first inner electrode and the via electrode, and The via electrode is provided to penetrate the second internal electrode and the insulating portion.

8. The multilayer electronic component according to claim 7, wherein The multilayer electronic component includes a plurality of second external electrodes, and the plurality of second external electrodes are respectively connected to the second internal electrodes through a plurality of via electrodes.

9. The multilayer electronic component according to claim 8, wherein The second external electrode contacts each of the plurality of via electrodes on the one or both end surfaces.

10. The multilayer electronic component according to any one of claims 1 to 9, wherein The ratio W / L is greater than or equal to 0.95 and less than or equal to 1.05, wherein L and W are dimensions of the body in a second direction and a third direction, respectively, the second direction and the third direction being orthogonal to each other and to the first direction.

11. The multilayer electronic component according to claim 10, wherein Both L and W are 0.5 mm or less.

12. The multilayer electronic component according to claim 11, wherein The number of each of the first and second internal electrodes in the body is 20 or less.

13. The multilayer electronic component according to any one of claims 1 to 9, wherein The ratio W / L is greater than or equal to 0.95 and less than or equal to 1.05, wherein L and W are dimensions of the first internal electrode in second and third directions, respectively, the second and third directions being orthogonal to each other and to the first direction.

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