A wafer mounting feeding device

Abstract

The present application provides a wafer mounting feeding device, which includes a base having a head end and a tail end; a film expanding device liftably connected to the tail end of the base; an upper pressing plate assembly disposed on the base; a film carrier slidably connected to the upper pressing plate assembly; a gripping device slidably connected to the base and reciprocatingly sliding between the head end and the tail end. In the present application, by integrating the gripping device with the film expanding device and the upper pressing plate assembly, the gripping device can move back and forth between the upper pressing plate assembly and the film expanding device, avoiding the problem that the upper pressing plate assembly needs to be opened for feeding, ensuring the balance of the film expanding tension, and at the same time solving the problem of externally disposing the gripping device in the traditional design, reducing the space occupied by the gripping device and improving the working efficiency of the wafer mounting feeding device.

Description

Technical Field

[0001] The present invention relates to a feeding device, in particular to a wafer mounting feeding device. Background Art

[0002] In the prior art, the automatic feeding of wafer mounting is all operated by an external clamping and placing mode. A notch is opened on the wafer pressing plate for the clamping device to enter and exit. When the wafer is in the process of film expansion, the pressing plate presses down and interacts with the film expansion ring for film expansion. The film expansion tension received by the crystal ring blue film at the notch is uneven, affecting the die expansion yield. Moreover, the clamping and placing devices all need to be external, increasing the occupied space of the device. Summary of the Invention

[0003] In order to overcome the disadvantages and deficiencies in the prior art, the present application aims to solve the problem of the complex structure of the wafer mounting feeding device in the prior art.

[0004] The present application provides a wafer mounting feeding device, including a base, the base having a first end and a second end; a film expansion device, connected to the second end in a liftable manner; an upper pressing plate assembly, the upper pressing plate assembly being disposed on the base; a film carrier, the film carrier being slidably connected to the upper pressing plate assembly; a clamping device, the clamping device being slidably connected to the base and sliding back and forth between the first end and the second end; when the clamping device slides to the first end, the film carrier slides to a position facing the film expansion device, the clamping device is separated from the film carrier, the upper pressing plate assembly descends, and the film expansion device ascends to a position close to the film carrier for film expansion work; when the film expansion device descends away from the film carrier, the upper pressing plate assembly ascends, the clamping device clamps the film carrier, and slides from the first end to the second end to send the film carrier away from the upper pressing plate assembly.

[0005] Wherein, the clamping device includes a clamping cantilever, a cantilever fixing member, and a clamping mechanism. The cantilever fixing member is slidably connected to the base along the direction from the first end to the second end. The clamping cantilever is mounted on the cantilever fixing member, and the clamping mechanism is mounted on the clamping cantilever. The clamping mechanism is used for clamping the film carrier.

[0006] Wherein, the clamping device further includes a first driving mechanism, the first driving mechanism is mounted on the base, the first driving mechanism controls the clamping device to clamp the film carrier and drives the clamping device to move along the direction from the first end to the second end.

[0007] Among them, the upper pressure plate assembly includes a top plate, a cover plate, a plurality of first pulleys and a pair of supporting members, the top plate is arranged on the base, the plurality of first pulleys are fixed to the side of the top plate facing the base, the cover plate is installed on the top plate, and the plurality of first pulleys are rotatably connected to the cover plate, the supporting member is installed on the side of the cover plate facing the base, the supporting member has a supporting surface, the film carrier is abutted on the supporting surface, the supporting surface is parallel to the movement direction of the clamping device, and the supporting member is used to receive the film carrier.

[0008] Wherein, the upper pressure plate assembly also includes a guide member, which is fixed to a side of the top plate facing the base, and the guide member is arranged on a side of the top plate close to the tail end, and the guide member and the bearing member are arranged on the same horizontal line.

[0009] Among them, the wafer mounting and feeding equipment also includes a lifting device and a second driving mechanism, the lifting device is installed on the base, the second driving mechanism is installed on the base, and the second driving device controls the lifting device to drive the upper pressure plate assembly to rise or fall.

[0010] Among them, the film expanding device includes a film expander, an inner ring seat, an outer ring seat, a plurality of second pulleys and a transmission assembly for driving the inner ring seat to rise and fall, the plurality of second pulleys are fixed to a side of the base facing away from the upper pressure plate assembly, the inner ring seat is installed on the base, the plurality of second pulleys are arranged around the circumference of the outer ring seat, and the plurality of second pulleys are rotatably connected to the outer ring seat, the outer ring seat is sleeved on the inner ring seat, the film expander is fixed to one end of the inner ring seat facing the upper pressure plate assembly, the transmission assembly includes a roller fixed to the outer ring seat and a rotating groove inclined upwardly on the inner ring seat, the rotation of the outer ring seat drives the roller to move along the rotating groove to realize the lifting and lowering of the inner ring seat.

[0011] Wherein, the film expansion device further comprises a third driving mechanism, the third driving mechanism is mounted on the base, and the third driving mechanism controls the rotation of the outer ring seat.

[0012] Among them, the wafer mounting feeding equipment also includes a connecting device, one end of which is fixed to the cover plate, and the other end of which is fixed to the film expanding device, so that when the film expanding device rotates, the film expanding device drives the cover plate to rotate synchronously.

[0013] Wherein, the wafer mounting and feeding equipment further comprises a clamping assembly, wherein the clamping assembly is arranged on the base, and the clamping assembly is used to limit the rotation of the inner ring seat.

[0014] In this application, by integrating the grasping device, the film expanding device, and the upper pressing plate assembly, the grasping device can move back and forth between the upper pressing plate assembly and the film expanding device, avoiding the problem of the need for an opening in the upper pressing plate assembly for feeding, ensuring the balance of the film expanding tension, and at the same time solving the problem of the external design of the clamping device in the traditional design, reducing the space occupied by the grasping device and improving the working efficiency of the wafer mounting feeding equipment. Description of the Drawings

[0015] Figure 1 It is a schematic structural diagram of the wafer mounting feeding equipment provided by this application.

[0016] Figure 2 It is an exploded schematic structural diagram of the wafer mounting feeding equipment provided by this application.

[0017] Figure 3 It is another sectional schematic diagram of the wafer mounting feeding equipment provided by this application.

[0018] Figure 4 It is an exploded schematic structural diagram of the upper pressing plate assembly provided by this application.

[0019] Figure 5 It is Figure 4 a partially enlarged schematic diagram.

[0020] Figure 6 It is another sectional schematic diagram of the wafer mounting feeding provided by this application.

[0021] Figure 7 It is a schematic structural diagram of the film expanding device provided by this application.

[0022] Figure 8 It is another sectional schematic diagram of the wafer mounting feeding provided by this application.

[0023] Figure 9 It is another sectional schematic diagram of the wafer mounting feeding provided by this application. Detailed Description of the Embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figures 1 to 2, this application provides a wafer mounting feeding device 1 including a base 10, the base 10 having a head end 11 and a tail end 12; a film expanding device 20, connected to the tail end 12 in a liftable manner; an upper pressing plate assembly 30, the upper pressing plate assembly 30 being disposed on the base 10; a film carrier 50, the film carrier 50 being slidably connected to the upper pressing plate assembly 30; a clamping device 40, the clamping device 40 being slidably connected to the base 10 and sliding back and forth between the head end 11 and the tail end 12; when the clamping device 40 slides to the head end 11, the film carrier 50 slides to a position facing the film expanding device 20, the clamping device 40 is separated from the film carrier 50, the upper pressing plate assembly 30 descends, and the film expanding device 20 ascends to a position close to the film carrier 50 to perform film expanding work; when the film expanding device 20 descends away from the film carrier 50, the upper pressing plate assembly 30 ascends, the clamping device 40 clamps the film carrier 50, and slides from the head end 11 to the tail end 12 to send the film carrier 50 away from the upper pressing plate assembly 30.

[0026] Specifically, the base 10 is in the shape of a rectangular block, a first receiving groove 10a is formed at the tail end 12 of the base 10, the first receiving groove 10a is circular, the film expanding device 20 is installed in the first receiving groove 10a, the film expanding device 20 performs film expanding work with liftable movement along the axial direction of the receiving groove, the upper pressing plate assembly 30 also performs liftable movement along the axial direction of the first receiving groove 10a, the film carrier 50 is disposed between the upper pressing plate assembly 30 and the base 10, the film carrier 50 is a blue film steel ring, and the clamping device 40 can grab the film carrier 50 and slide from the head end 11 of the base 10 to the tail end 12 of the base 10.

[0027] When the clamping device 40 clamps one film carrier 50 from a material bin (not shown) and moves along the direction from the tail end 12 towards the head end 11, the film carrier 50 is driven by the clamping device 40 and moves on the upper platen assembly 30 along the same moving direction as the clamping device 40. At this time, the upper platen assembly is at the highest point where it can be lifted and lowered, and the film expanding device 20 is at the lowest point where it can be lifted and lowered. When the clamping device 40 clamps the film carrier 50 to be coaxial with the film expanding device 20, the clamping device 40 releases the film carrier 50 and continues to move to the head end 11. The clamping device 40 stands by at the head end 11. The upper platen assembly 30 fixes the film carrier 50, and the upper platen assembly 30 starts to descend to the lowest point where it can be lifted and lowered. The film expanding device 20 starts to rise to the highest point where it can be lifted and lowered. The film expanding device 20 performs film expanding work on the film carrier 50. After the film expanding device 20 completes the film expanding work, the film carrier 50 needs to be replaced. The film expanding device 20 descends from the highest point to the lowest point, and the upper platen assembly 30 rises to the highest point to avoid blocking the movement of the clamping device 40. The clamping device 40 moves to the position of the film carrier 50 and grabs the film carrier 50, and transports the film carrier 50 with the expanded film along the direction from the head end 11 to the tail end 12 to the material bin (not shown).

[0028] In this application, by integrating the clamping device 40 with the film expanding device 20 and the upper platen assembly 30, the clamping device 40 can move back and forth between the upper platen assembly 30 and the film expanding device 20, avoiding the problem that the upper platen assembly 30 needs to open for feeding, ensuring the balance of the film expanding tension, and at the same time solving the problem of externally designing the clamping device 40 in the traditional design, reducing the space occupied by the clamping device 40, and improving the working efficiency of the wafer mounting feeding device 1.

[0029] Further, please refer to Figure 3 , the clamping device 40 includes a clamping cantilever 41, a cantilever fixing member 42, and a clamping mechanism 43. The cantilever fixing member 42 is slidably connected to the base 10 along the direction from the head end 11 to the tail end 12. The clamping cantilever 41 is installed on the cantilever fixing member 42, and the clamping mechanism 43 is installed on the clamping cantilever 41. The clamping mechanism 43 is used to clamp the film carrier 50.

[0030] Specifically, the base 10 has a side wall 13, the side wall 13 extends along the direction from the head end 11 to the tail end 12, a first slide rail 131 is provided on the side of the side wall 13 facing the film expanding device 20, the first slide rail 131 extends along the direction from the head end 11 to the tail end 12, and the first slide rail 131 is fixed to the side wall 13 by screws (not shown). A first chute adapted to the first slide rail 131 is provided on the side of the cantilever fixing member 42 facing the first slide rail 131, so that the cantilever fixing member 42 can move back and forth on the first slide rail 131; the clamping cantilever 41 is in a rectangular block shape, the clamping cantilever 41 extends along a direction perpendicular to the side wall 13, one end of the clamping cantilever 41 close to the side wall 13 is fixedly connected to the cantilever fixing member 42 by screws, a clamping mechanism 43 is installed at the end of the clamping cantilever 41 far from the side wall 13, the clamping mechanism 43 is fixedly connected to the cantilever fixing member 42 by screws, and a clamping cylinder 44 is provided on the clamping cantilever 41. The clamping cylinder 44 controls the clamping mechanism 43 to perform pressing and loosening movements, so that the clamping mechanism 43 can clamp or place the film carrier 50.

[0031] In this embodiment, by installing the clamping device 40 on the base 10, and the clamping device 40 can move back and forth along the first slide rail 131, so as to realize the movement operation of the clamping device 40 from the head end 11 to the tail end 12, which is convenient for the clamping device 40 to convey the film carrier 50, making the wafer mounting and feeding device 1 more integrated and improving the working efficiency.

[0032] Further, continue to refer to Figure 3 , the wafer mounting and feeding device 1 further includes a first driving mechanism 100, the first driving mechanism 100 is installed on the base 10, the first driving mechanism 100 controls the clamping device 40 to clamp the film carrier 50 and the first driving mechanism 100 drives the clamping device 40 to move along the direction from the head end 11 to the tail end 12.

[0033] Specifically, the first driving mechanism 100 is disposed on one side of the head end 11. The first driving mechanism 100 includes a first driving motor 110, a first driving synchronous belt 120, a first driving synchronous pulley 130, and a first driving fixing base 140. One end of the first driving fixing base 140 is fixedly connected to the base 10. The other end of the first driving fixing base 140 extends out of the head end 11 and is used for fixedly installing the first driving motor 110. The first driving motor 110 is fixed to the first driving fixing base 140 by screws. The first driving fixing base 140 semi - surrounds the first driving motor 110. The first driving motor 110 extends out of the head end 11 to reduce the contact area between the first driving motor 110 and the base 10, thereby increasing the heat dissipation efficiency of the first driving motor 110. A first driving synchronous pulley 130 is installed on the surface of the first driving motor 110 facing the side wall 13. The first driving motor 110 can drive the first driving synchronous pulley 130 to rotate. The first driving synchronous belt 120 is wound around the circumferential side of the first driving synchronous pulley 130. The first driving synchronous belt 120 rotates along the direction from the head end 11 to the tail end 12. The first driving synchronous belt 120 abuts against the cantilever fixing member 42. When the first driving synchronous belt 120 rotates, it can drive the cantilever fixing member 42 to move.

[0034] In this embodiment, the first driving motor 110 drives the first driving synchronous pulley 130 to rotate. The first driving synchronous pulley 130 drives the first driving synchronous belt 120 to rotate. The first synchronous belt drives the cantilever fixing member 42 to move, so as to realize the first driving mechanism 100 driving the clamping device 40 to move. When the wafer mounting and feeding device 1 completes the film expansion work, the first driving mechanism 100 drives the clamping device 40 to move close to the film carrier 50. The first driving mechanism 100 sends an electrical signal to control the clamping mechanism 43 to grab the film carrier 50. The first driving mechanism 100 continues to drive the clamping device 40 to transfer the film carrier 50 to the material bin.

[0035] Further, please refer to Figures 4 to 5, the upper pressing plate assembly 30 includes a top plate 31, a cover plate 32, a plurality of first pulleys 33 and a pair of carriers 34. The top plate 31 is disposed on the base 10. The plurality of first pulleys 33 are fixed to one side of the top plate 31 facing the base 10. The cover plate 32 is mounted on the top plate 31, and the plurality of first pulleys 33 are rotatably connected to the cover plate 32. The carrier 34 is mounted on one side of the cover plate 32 facing the base 10. The carrier 34 has a resisting surface 34c. The film carrier 50 abuts against the resisting surface 34c. The resisting surface 34c is parallel to the moving direction of the clamping device 40. The carrier 34 is used for receiving the film carrier 50.

[0036] Specifically, the upper pressing plate assembly 30 is arranged perpendicular to the lifting direction of the film expanding device 20. The top plate 31 is in a rectangular block shape. The top plate 31 is arranged in the direction of the orthographic projection of the tail end 12. The top plate 31 is provided with a second receiving groove 30a. The second receiving groove 30a is circular. The second receiving groove 30a and the first receiving groove 10a are coaxially arranged. The cover plate 32 is in an annular boss structure. One end of the cover plate 32 facing away from the base 10 is received in the second receiving groove 30a. The other end of the cover plate 32 is provided with a first ring track 32a. The axial section of the first ring track 32a is in a V-shaped structure. The plurality of first pulleys 33 are mounted on one side of the top plate 31 facing the base 10. The plurality of first pulleys 33 are circumferentially arranged along the circumferential side of the cover plate 32, and the plurality of first pulleys 33 are slidably connected to the first ring track 32a, so that while the plurality of first pulleys 33 fix the cover plate 32, the cover plate 32 can also perform a rotational movement.

[0037] It can be understood that please refer to Figure 5, a pair of the carriers 34 are oppositely arranged on two sides of the cover plate 32. The carrier 34 is fixedly connected to the first ring rail 32a, and the carrier 34 extends along the moving direction of the clamping device 40. The carrier 34 has an L-shaped structure. The carrier 34 further has a carrier main body portion 34a and a carrier extension portion 34b. The abutting surface 34c is located on the surface of the carrier main body portion 34a facing the axis of the film carrier 50. The carrier extension portion 34b is perpendicular to the carrier main body portion 34a. The carrier extension portion 34b extends towards the axis direction of the film carrier 50. The carrier extension portion 34b is used for placing the film carrier 50 so that the carrier 34 can receive the film carrier 50; a first limiting member 36 and a second limiting member 37 are arranged on the carrier main body portion 34a. The first limiting member 36 is a stop block. The first limiting member 36 is fixed on the side of the carrier 34 close to the head end 11. The second limiting member 37 is a spring roller 251. The film carrier 50 can slide into the carrier 34 from one side of the tail end 12. The second limiting member 37 is fixed on the side of the carrier 34 close to the tail end 12. The first limiting member 36 and the second limiting member 37 are used to prevent the film carrier 50 from detaching from the carrier 34.

[0038] In this embodiment, when the clamping device 40 grabs the film carrier 50 and moves it from the tail end 12 to the second limiting member 37, the clamping device 40 will drive the film carrier 50 to slide into the second limiting member 37. When the clamping device 40 drives the film carrier 50 to the first limiting member 36, the first limiting member 36 will limit the film carrier 50 from continuing to move. The clamping device 40 releases the template carrier and moves to the head end 11 to wait. By installing a pair of the carriers 34 on the side of the cover plate 32 facing the base 10, the film carrier 50 can be supported. Also, by respectively arranging the first limiting member 36 and the second limiting member 37 in the carrier 34, the film carrier 50 can be prevented from detaching from the carrier 34.

[0039] In an embodiment, please refer to Figure 3, the upper platen assembly 30 further includes a second cover plate 38 and an adapter plate 39. The second cover plate 38 is annular. The second cover plate 38 is fixedly connected to the cover plate 32. A cover plate 32 positioning groove is formed on the side of the cover plate 32 facing away from the base 10. A cover plate 32 installation groove is formed on the side of the second cover plate 38 facing away from the base 10. One end of the adapter plate 39 is snapped into the cover plate 32 positioning groove, and the other end of the adapter plate 39 is fixed in the cover plate 32 installation groove by screws, so that the second cover plate 38 can be stably fixed in the cover plate 32. The cover plate 32 is a 12-inch steel ring plate, and the second cover plate 38 is an 8-inch steel ring plate. When replacement is needed, first place the second cover plate 38 inside the cover plate 32, and then fixedly connect the cover plate 32 and the second cover plate 38 through the adapter plate 39. Of course, corresponding-sized bearing members 34 are installed on the side of the second cover plate 38 facing the base 10, which will not be elaborated one by one here.

[0040] In this embodiment, by adding a replaceable second cover plate 38 inside the cover plate 32, the production of 8 / 12-inch specification wafers can be compatible, and production personnel can flexibly change according to actual needs, improving work efficiency.

[0041] Further, please refer to Figure 6 , the upper platen assembly 30 further includes a pair of guide members 35. The pair of guide members 35 are fixed to the side of the top plate 31 facing the base 10. The guide members 35 are arranged on the side of the top plate 31 close to the tail end 12, and the guide members 35 and the bearing members 34 are arranged on the same horizontal line.

[0042] Specifically, the guide member 35 has an L-shaped structure. The guide member 35 is similar in structure to the bearing member 34. The guide member 35 has a guide main body portion 35a and a guide extension portion 35b. The guide main body portion 35a and the guide extension portion 35b are perpendicular to each other. The extending direction of the guide extension portion 35b is the same as that of the bearing extension portion 34b. The guide main body portion 35a is fixed to the side of the top plate 31 facing the base 10. The guide member 35 extends from the side of the top plate 31 close to the tail end 12 towards the head end 11 to the bearing member 34.

[0043] In this embodiment, by installing the guide member 35 on the side of the top plate 31 close to the tail end 12, when the clamping device 40 takes out the film carrier 50 from the material bin, directional movement can be achieved and the film carrier 50 can be prevented from shifting in position during movement.

[0044] Further, please refer to Figure 3, the wafer mounting and feeding device 1 further includes a lifting device 60 and a second driving mechanism 200. The lifting device 60 is installed on the base 10, and the second driving mechanism 200 is installed on the base 10. The second driving mechanism controls the lifting device 60 to drive the upper pressing plate assembly 30 to rise or fall.

[0045] Specifically, the lifting device 60 is arranged at the corners of the top plate 31. There are four lifting devices 60. The lifting devices 60 fixedly connect the base 10 and the upper pressing plate assembly 30. The lifting device 60 includes a lifting rod 61 and a rotating ring 62. One end of the lifting rod 61 is fixedly connected to the top plate 31, and the other end of the lifting rod 61 is fixedly connected to the base 10 and extends to the side of the base 10 facing away from the upper pressing plate assembly 30. The rotating ring 62 is sleeved around the circumference of the lifting rod 61. The rotation of the rotating ring 62 can drive the lifting rod 61 to rise or fall. The second driving mechanism 200 is arranged on the side of the first end 11 away from the side wall 13. The second driving mechanism 200 is rotatably connected to the lifting device 60. The second driving mechanism 200 includes a second driving motor 210 and a second driving fixed seat 220. The second driving fixed seat 220 is installed on the side of the first end 11 away from the side wall 13. The second driving motor 210 is fixed in the second driving fixed seat 220. The second driving motor 210 is rotatably connected to the rotating ring 62. A second driving synchronous pulley 230 and a second driving synchronous belt 240 are further installed at the end of the lifting rod 61 away from the upper pressing plate assembly 30. The second driving synchronous pulley 230 and the second driving synchronous belt 240 are arranged on the side of the base 10 facing away from the upper pressing plate assembly 30. The second driving synchronous pulley 230 is sleeved around the circumference of the lifting rod 61. The second driving synchronous belt 240 is wound around the second driving synchronous pulley 230. The second driving motor 210 drives the rotating ring to rotate. The rotation of the rotating ring drives the lifting rod 61 to rotate. The rotation of the lifting rod 61 drives the second driving synchronous pulley 230 to rotate. The second driving synchronous pulley 230 drives the second driving synchronous belt 240 to slide, thereby driving the remaining three lifting devices 60 to rotate. The lifting rod 61 drives the upper pressing plate assembly 30 to rise in a direction away from the base 10.

[0046] When the wafer mounting and feeding device 1 needs to replace the film carrier 50, the second driving mechanism 200 controls the lifting device 60 to drive the upper pressing plate assembly 30 to rise, and the clamping device 40 clamps the film carrier 50 and conveys it to the tail end 12; when the clamping device 40 clamps the film carrier 50 and places it on the bearing member 34, the second driving mechanism 200 controls the lifting device 60 to drive the upper pressing plate assembly 30 to descend for film expanding operation.

[0047] In this embodiment, a lifting device 60 is installed in the corner area of the top plate 31, so that the upper pressing plate assembly 30 can be stably installed on the base 10. Moreover, the second driving mechanism 200 controls the movement of the lifting device 60 to drive the movement of the upper pressing plate assembly 30, making the wafer mounting and feeding device 1 have a compact structure, high integration degree, and improved production efficiency.

[0048] Further, please refer to Figure 6 and Figure 7 , the film expanding device 20 includes a film expander 21, an inner ring seat 22, an outer ring seat 23, a plurality of second pulleys 24, and a transmission assembly 25 for driving the inner ring seat 22 to lift. The plurality of second pulleys 24 are fixed on one side of the base 10 facing away from the upper pressing plate assembly 30. The inner ring seat 22 is installed on the base 10. The plurality of second pulleys 24 are arranged around the outer circumference of the outer ring seat 23, and the plurality of second pulleys 24 are rotatably connected to the outer ring seat 23. The outer ring seat 23 is sleeved around the inner ring seat 22. The film expander 21 is fixed to one end of the inner ring seat 22 facing the upper pressing plate assembly 30. The transmission assembly 25 includes a roller 251 fixed on the outer ring seat 23 and a rotating groove 252 inclined upwardly formed on the inner ring seat 22. The rotation of the outer ring seat 23 drives the roller 251 to move along the rotating groove 252 to realize the lifting movement of the inner ring seat 22.

[0049] Specifically, the outer ring seat 23 is an annular boss structure, one end of the outer ring seat 23 facing the upper pressure plate assembly 30 is received in the first receiving groove 10a, and the end of the outer ring seat 23 away from the upper pressure plate assembly 30 is provided with a second ring rail 23a, and the axial cross-section of the second ring rail 23a is a V-shaped structure, and a plurality of second pulleys 24 are installed on the side of the base 10 away from the upper pressure plate assembly 30, and the plurality of second pulleys 24 are arranged along the circumference of the outer ring seat 23, and the plurality of second pulleys 24 are slidably connected with the second ring rail 23a, so that the plurality of second pulleys 24 are arranged along the circumference of the outer ring seat 23. The two pulleys 24 support the outer ring seat 23 and can also rotate with the outer ring seat 23; the outer ring seat 23 has an inner wall 23c, and the inner wall 23c is provided with a roller positioning hole 23b adapted to the roller 251, and the roller 251 is fixed in the roller positioning hole 23b. The number of the rollers 251 is three and they are evenly installed on the inner wall 23c. The side of the rotating groove 252 close to the film expander 21 is also provided with a roller clamping groove 252, and the roller clamping groove 252 is a horizontal track, and the roller clamping groove 252 is used to accommodate the roller 251;The film expanding device 20 further includes a roller baffle 221. A baffle fixing groove (not shown) is formed on the side of the inner ring seat 22 facing away from the upper pressing plate assembly 30. The roller baffle 221 is installed in the baffle fixing groove and is elastically connected to the inner ring seat 22. The roller baffle 221 and the inner ring seat 22 form a roller receiving groove 221a. The roller receiving groove 221a is semi-circular in shape. The size of the roller receiving groove 221a is adapted to the size of the roller 251. The roller receiving groove 221a and the rotating groove 252 form a connecting portion 221b. The connecting portion 221b is in the shape of a rectangular groove. The connecting portion 221b and the inner ring seat 22 have a spacing smaller than the diameter of the roller 251. When the roller 251 slides to the connecting portion 221b, due to the elastic connection between the roller baffle 221 and the inner ring seat 22, the roller 251 propping up the roller baffle 221, that is, the roller baffle 221 expands toward the side away from the inner ring seat 22. Then the roller 251 continues to slide into the roller receiving groove 221a, and the side of the roller baffle 221 facing the inner ring seat 22 contracts, so that the roller 251 is fixed in the roller receiving groove 221a, that is, the integral synchronization of the inner ring seat 22 and the outer ring seat 23 is realized. The roller 251 slidably connects the outer ring seat 23 and the inner ring seat 22. The film expander 21 has an annular boss structure. The film expander 21 is magnetically connected to one end of the inner ring seat 22 facing the upper pressing plate assembly 30, and one end of the film expander 21 close to the inner ring seat 22 is fixed to the inner ring seat 22 by a pin, so that the film expander 21 rotates with the rotation of the inner ring seat 22, and at the same time, it is convenient for the film expander 21 to be disassembled and assembled from the inner ring seat 22. The structure is simple and stable. Of course, in other embodiments, the film expander 21 can also be fixed to the inner ring seat 22 by bonding, screwing, etc.;

[0050] In this embodiment, by installing the roller 251 on the outer ring seat 23 and forming the rotating groove 252 on the inner ring seat 22, the inner ring seat 22 is slidably connected to the outer ring seat 23. The roller 251 can slide on the rotating groove 252, thereby driving the inner ring seat 22 to move up and down relative to the outer ring seat 23. On the premise that the clamping device 40 can pass between the upper pressing plate assembly 30 and the base 10, a sufficient film expanding lifting height is still maintained to meet the film expanding performance of the wafer.

[0051] Further, please refer to Figures 8 to 9 , the wafer mounting and feeding device 1 further includes a clamping assembly 90. The clamping assembly 90 is arranged on the base 10, and the clamping assembly 90 is used to limit the rotation of the inner ring seat 22.

[0052] The clamping assembly 90 includes a clamping cylinder 91 and a pressure rod 92. The clamping cylinder 91 is fixed on one side of the head end 11 close to the film expanding device 20. The clamping cylinder 91 is in a rectangular block shape. The pressure rod 92 is fixed at one end of the clamping cylinder 91 facing the film expanding device 20. The pressure rod 92 is in a convex shape structure. A second positioning groove 22b is formed on one side of the inner ring seat 22 facing the head end 11. A pair of inserts 93 are installed on the second positioning groove 22b. The inserts 93 are in a rectangular block shape. The pair of inserts 93 are installed at intervals in the second positioning groove 22b. The pressure rod 92 is inserted into the gap between the pair of inserts 93. After the third driving mechanism 300 drives the outer ring seat 23 to rotate to a preset angle, the clamping cylinder 91 pushes the pressure rod 92 to insert into the inserts 93 to prevent the inner ring seat 22 from continuing to rotate.

[0053] Further, the wafer mounting and feeding device 1 further includes a third driving mechanism 300. The third driving mechanism 300 is installed on the base 10. The third driving mechanism 300 controls the rotation of the outer ring seat 23.

[0054] Specifically, please refer to Figure 2 and Figure 6 , the third driving mechanism 300 is arranged on one side of the tail end 12 away from the side wall 13. The third driving mechanism 300 includes a third driving motor 310, a third driving synchronous belt 320, a third driving synchronous pulley 330, a third driving rotating shaft 340, an outer ring seat synchronous pulley 350 and an outer ring seat synchronous belt 360. One end of the third driving rotating shaft 340 facing the upper pressing plate assembly 30 is wound and connected with the third driving motor 310 through the third driving synchronous belt 320. One end of the third driving rotating shaft 340 facing away from the upper pressing plate is wound and connected with the outer ring seat synchronous pulley 350 through the outer ring seat synchronous belt 360. The third driving motor 310 controls the rotation of the third driving synchronous pulley 330. The third driving synchronous pulley 330 drives the third driving rotating shaft 340 to rotate. The rotation of the third driving rotating shaft 340 drives the outer ring seat synchronous pulley 350 to rotate. The outer ring seat synchronous pulley 350 is fixed on one side of the outer ring seat 23 facing away from the upper pressing plate assembly 30 and is installed on one side of the second ring rail 23a facing away from the inner ring seat 22 by screws to realize the rotation of the outer ring seat synchronous pulley 350 driving the outer ring seat 23 to rotate.

[0055] When the wafer mounting and feeding device 1 needs to replace the film carrier 50, the clamping cylinder 91 pushes the pressure rod 92 to insert into the insert block 93 to prevent the inner ring seat 22 from rotating further. The roller 251 is located in the roller receiving groove 221a. The third driving motor 310 controls the rotation of the outer ring seat synchronous pulley 350. The outer ring seat synchronous pulley 350 drives the outer ring seat 23 to rotate. The rotation of the outer ring seat 23 causes the roller 251 to rotate and move from the roller receiving groove 221a to the roller clamping groove 252a. The outer ring seat 23 is fixed relative to the base 10, that is, the inner ring seat 22 descends along the rotation groove 252. At the same time, the pressure rod 92 drops along the gap of the insert block 93, thereby driving the film expander 21 to descend, so that the clamping device 40 can clamp the film carrier 50 and move from the head end 11 to the tail end 12.

[0056] In this embodiment, the third driving mechanism 300 is used to control the rotation of the outer ring seat 23. By driving the inner ring seat 22 to cooperate with the roller 251 to move up and down along the rotation groove 252, the efficient and convenient lifting movement of the film expanding device 20 on the base 10 is realized. Thus, when the clamping device 40 can shuttle between the upper pressing plate assembly 30 and the film expanding device 20, it can still maintain a sufficient film expanding lifting height to ensure the film expanding performance of the wafer and improve the stability of the wafer processing.

[0057] Further, please refer to Figure 2 , the wafer mounting and feeding device 1 further includes an encoder 70. The encoder 70 is installed at one end of the tail end 12 close to the side wall 13. An encoder synchronous pulley (not shown) is installed at one end of the encoder 70 facing away from the upper pressing plate assembly 30. The encoder synchronous pulley is slidably connected to the outer ring seat synchronous belt 360. The encoder 70 can read the rotation angle of the third driving synchronous pulley 330, that is, the encoder 70 can feedback the rotation angle of the third driving synchronous pulley 330 each time. Then, the staff can adjust or change the angle of the film carrier 50 based on the feedback of the encoder 70 combined with the actual requirements.

[0058] Further, please refer to Figure 8 , the wafer mounting and feeding device 1 further includes a connecting device 80. One end of the connecting device 80 is fixed to the cover plate 32, and the other end of the connecting device 80 is fixed to the film expanding device 20, so that when the film expanding device 20 rotates, the film expanding device 20 drives the cover plate 32 to rotate synchronously.

[0059] Specifically, the connecting device 80 includes a connecting rod 81, a connecting bearing 82, and a positioning seat 83. One end of the connecting rod 81 is fixed on the top plate 31. The inner ring seat 22 is provided with a first positioning groove 22a at the end facing the film expander 21. The positioning seat 83 is fixed in the first positioning groove 22a by screws. The connecting bearing 82 is installed in the positioning seat 83. The connecting bearing 82 is sleeved on the other end of the connecting rod 81. The connecting rod 81 is in clearance fit with the connecting bearing 82 to facilitate the lifting of the connecting rod 81 in the connecting bearing 82. When the third driving mechanism 300 drives the film expanding device 20 to rotate, the film expanding device 20 can drive the cover plate 32 to rotate in the second receiving groove 30a to achieve the synchronous rotation of the film expanding device 20 and the cover plate 32.

[0060] Further, please refer to Figure 1 , the wafer mounting and feeding device 1 further includes a moving device 400. The moving device 400 includes a first mover 410 and a second mover 420. The first mover 410 moves in the first direction X, and the second mover 420 moves in the second direction Y. The first direction X and the second direction Y are perpendicular to each other. The second direction Y is the direction from the head end to the tail end. The first mover 410 is arranged on the side of the head end facing away from the upper pressing plate assembly. One end of the base facing the first mover 410 is provided with a first slider (not shown). One end of the first mover 410 facing the base is provided with a first slide rail (not shown). The first slider is slidably connected to the first slide rail to enable the base to move in one direction. The second mover 420 is arranged on the side of the first mover 410 facing away from the base. One end of the first mover 410 facing the second mover 420 is provided with a second slider. One end of the second mover 420 facing the first mover 410 is provided with a second slide rail. The second slider is slidably connected to the second slide rail to enable the first mover 410 to move on the second mover 420, thereby driving the base to move in the second direction Y.

[0061] In this application, please refer to Figure 6 and Figure 9, when the wafer mounting and feeding device 1 starts to work, the clamping device 40 clamps the film carrier 50 from the material bin. The material bin is located on one side close to the tail end 12. The first driving mechanism 100 controls the clamping device 40 to clamp the film carrier 50 and move in the direction from the tail end 12 towards the head end 11. The film carrier 50 moves into the carrier 34 along the extending direction of the guiding member 35. The first limiting member 36 and the second limiting member 37 fix the film carrier 50 in the carrier 34. The clamping device 40 releases the film carrier 50 and continues to move to the head end 11 to standby; at this time, the upper pressing plate assembly 30 is at the highest point where it can rise by itself, the film expanding device 20 is at the lowest point where it can descend by itself, the pressing rod 92 is always clamped in the gap of the insert block 93, and the distance between the upper pressing plate assembly 30 and the film expanding device 20 can satisfy the movement of the clamping device 40; when the film carrier 50 is fixed on the upper pressing plate assembly 30, the third driving mechanism 300 controls the outer ring seat 23 to rotate. The rotation of the outer ring seat 23 drives the inner ring seat 22 to rise. At this time, the roller 251 is in the roller slot 252a. As the outer ring seat 23 rotates, the roller 251 slides and descends along the rotating slot 252 from the roller slot 252a. The roller 251 will slide and descend into the roller receiving slot 221a in the roller baffle 221, that is, the inner ring seat 22 rises towards the upper pressing plate assembly 30, and the film expander 21 rises synchronously with the inner ring seat 22. Then the second driving mechanism 200 controls the lifting device 60 to descend towards the base 10 to the lowest point where it can descend, that is, the film expander 21 jacks up the middle area of the film carrier 50 towards the upper pressing plate assembly 30 to achieve the purpose of tensioning the blue film in the film carrier 50. When the film expander 21 finishes the film expanding work, the pressing rod 92 retracts into the clamping cylinder 91, that is, the clamping assembly 90 stops abutting against the inner ring seat 22. Since the connecting rod 81 is connected to the connecting bearing 82, the rotation of the inner ring seat 22 drives the cover plate 32 to rotate. The staff can adjust the rotation angle of the wafer through the feedback of the encoder 70, and finally proceed to the next process step.

[0062] In this application, by integrating the clamping device 40 with the film expanding device 20 and the upper platen assembly 30, the upper platen assembly 30 can rise and the film expanding device 20 can descend, enabling the clamping device 40 to move back and forth between the upper platen assembly 30 and the film expanding device 20. Moreover, the problem that the upper platen assembly 30 needs to open for material feeding is avoided, ensuring the balance of the film expanding tension. Meanwhile, the problem of externally arranging the clamping device 40 in the traditional design is solved, reducing the space occupied by the clamping device 40 and improving the working efficiency of the wafer mounting and feeding device 1.

[0063] As described above, the above are only specific embodiments of the present invention, but the protection scope of the invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A wafer placement feeding device, comprising: a base having a head end and a tail end; A film expansion device, connected to the tail end in a liftable manner; An upper pressing plate assembly, wherein the upper pressing plate assembly is arranged on the base; a film carrier, the film carrier being slidably connected to the upper pressing plate assembly; A clamping device, the clamping device is slidably connected to the base and slides back and forth between the head end and the tail end; the clamping device comprises a clamping cantilever, a cantilever fixing part, and a clamping mechanism, the cantilever fixing part is slidably connected to the base along the direction from the head end to the tail end, the clamping cantilever is mounted on the cantilever fixing part, the clamping mechanism is mounted on the clamping cantilever, and the clamping mechanism is used to clamp the film carrier; When the clamping device slides to the head end, the film carrier slides to a position directly opposite to the film expanding device, the clamping device is separated from the film carrier, the upper pressure plate assembly descends, and the film expanding device rises to a position close to the film carrier to perform film expanding work; When the film expansion device descends away from the film carrier, the upper pressing plate assembly rises, and the clamping device clamps the film carrier and slides from the head end to the tail end to send the film carrier away from the upper pressing plate assembly.

2. The wafer mounting feeding device according to claim 1, wherein The wafer mounting and feeding equipment also includes a first driving mechanism, which is installed on the base. The first driving mechanism controls the clamping device to clamp the film carrier and drives the clamping device to move along the direction from the head end to the tail end.

3. The wafer mounting feeding device according to claim 1, characterized in that, The upper pressure plate assembly includes a top plate, a cover plate, a plurality of first pulleys and a pair of supporting members, the top plate is arranged on the base, the plurality of first pulleys are fixed to a side of the top plate facing the base, the cover plate is mounted on the top plate, and the plurality of first pulleys are rotatably connected to the cover plate, the supporting member is mounted on a side of the cover plate facing the base, the supporting member has a supporting surface, the film carrier is abutted against the supporting surface, the supporting surface is parallel to the movement direction of the clamping device, and the supporting member is used to receive the film carrier.

4. The wafer mounting and feeding device according to claim 3, characterized in that, The upper pressure plate assembly also includes a guide member, which is fixed to a side of the top plate facing the base, and is arranged on a side of the top plate close to the tail end, and the guide member and the bearing member are arranged on the same horizontal line.

5. The wafer mounting feeding device according to claim 1, characterized in that, The wafer mounting and feeding equipment further comprises a lifting device and a second driving mechanism, wherein the lifting device is mounted on the base, and the second driving mechanism is mounted on the base, and the second driving mechanism controls the lifting device to drive the upper pressure plate assembly to rise or fall.

6. The wafer mounting and feeding device according to claim 1, characterized in that, The film expanding device includes a film expander, an inner ring seat, an outer ring seat, a plurality of second pulleys, and a transmission assembly for driving the lifting of the inner ring seat. The plurality of second pulleys are fixed to a surface of the base facing away from the upper pressing plate assembly. The inner ring seat is mounted on the base. The plurality of second pulleys are arranged around the outer circumference of the outer ring seat, and the plurality of second pulleys are rotatably connected to the outer ring seat. The outer ring seat is sleeved around the inner ring seat. The film expander is fixed to one end of the inner ring seat facing the upper pressing plate assembly. The transmission assembly includes a roller fixed on the outer ring seat and a rotating groove formed on the inner ring seat and inclined upward. The rotation of the outer ring seat drives the roller to move along the rotating groove to realize the lifting of the inner ring seat.

7. The wafer mounting feeding device according to claim 6, wherein The wafer mounting and feeding device further includes a third driving mechanism. The third driving mechanism is mounted on the base, and the third driving mechanism controls the rotation of the outer ring seat.

8. The wafer mounting feeding device according to any one of claims 3 or 4, characterized in that, The wafer mounting and feeding device further includes a connecting device. One end of the connecting device is fixed to the cover plate, and the other end of the connecting device is fixed to the film expanding device, so that when the film expanding device rotates, the film expanding device drives the cover plate to rotate synchronously.

9. The wafer mounting feeding device according to any one of claims 6 or 7, characterized in that, The wafer mounting and feeding device further includes a clamping assembly. The clamping assembly is arranged on the base, and the clamping assembly is used to limit the rotation of the inner ring seat.

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