Method for forming a device on a substrate
By projecting ion beam forming devices on different surfaces of the substrate, the time-consuming problem of manufacturing multiple waveguides on the same substrate is solved, enabling efficient waveguide manufacturing and more flexible device design.
Patent Information
- Application Number
- CN201980082070.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2018-12-17
- Filing Date
- 2019-12-06
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2039-12-06
AI Technical Summary
Making multiple waveguides with different physical characteristics on the same substrate is a time-consuming process, and existing lithography methods are difficult to cause changes in the spacing and the profile of the device in different waveguides.
By projecting the ion bundle from one or more ion bundle chamber, a device is formed on the different surfaces of the substrate, and multiple waveguide methods are formed on both sides of the substrate.
This method allows multiple waveguides to be efficiently formed on the different parts of the substrate, reducing the manufacturing time, and increasing the ability to change the distance and the contour of the device in different waveguards.
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Figure CN113196453B_ABST
Abstract
Description
[0001] background Technical Field
[0002] Various embodiments of the present disclosure are generally directed to methods and systems for forming devices on substrates. Background Art
[0003] Virtual reality is generally considered to be a computer-generated simulated environment in which the user has a distinct sense of physical presence. The virtual reality experience can be generated in 3D and viewed with a head-mounted display (HMD), such as glasses or other wearable display devices with near-eye display panels as lenses to display the virtual reality environment in place of the actual environment.
[0004] However, augmented reality enables an experience in which the user is still able to look through the display lenses of the glasses or other HMD device to view the surrounding environment, as well as images of virtual objects that are generated for display and appear as part of the environment. Augmented reality can include any type of input, such as audio and tactile input, as well as virtual images, graphics, and video of the environment that can enhance or augment the user's experience.
[0005] Virtual images are overlaid on the surrounding environment to provide an augmented reality experience to the user. Waveguides are used to assist in overlaying the image. The generated light propagates through the waveguide until the light exits the waveguide and is overlaid on the surrounding environment. Optical devices typically require multiple waveguides with different physical properties on the same substrate in order to guide light of different wavelengths.
[0006] One disadvantage of the prior art is that fabricating waveguides on the same substrate is a time-consuming process. Different masking steps and methods are required in photolithography in order to fabricate waveguides with different material properties. In addition, some conventional photolithography methods do not have the ability to create varying pitches and profiles of devices in different waveguides.
[0007] Therefore, a manufacturing process is needed that allows devices to be formed on different portions of a substrate. Summary of the invention
[0008] Various embodiments of the present disclosure are generally directed to methods and systems for forming devices on substrates.
[0009] In one embodiment, a method for forming a device on a substrate includes the following steps: projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of the substrate; and projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a second surface of the substrate, wherein the first surface and the second surface are on opposite sides of the substrate.
[0010] In another embodiment, a system for forming a device on a substrate includes: one or more ion beam chambers, which are positioned to project one or more ion beams toward a first surface of the substrate; and one or more ion beam chambers, which are positioned to project one or more ion beams toward a second surface of the substrate, wherein the first surface and the second surface are on opposite sides of the substrate.
[0011] In another embodiment, a computer readable medium having instructions thereon, when the instructions are executed by one or more processors, causes a system to: project one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of a substrate; and project one or more ion beams from one or more ion beam chambers to form one or more devices on a second surface of the substrate, wherein the first surface and the second surface are on opposite sides of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to understand the above-mentioned features of the present invention in more detail, the present disclosure briefly summarized above can be described in more detail by reference to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the drawings only show exemplary embodiments and therefore should not be considered as limiting the scope, and other equally effective embodiments may be recognized.
[0013] Figure 1A is a perspective front view of a substrate having a plurality of lenses disposed on the substrate according to at least one embodiment described herein;
[0014] Figure 1B is a perspective front view of a waveguide combiner according to at least one embodiment described herein;
[0015] Figure 2A is a schematic diagram of a system according to at least one embodiment described herein;
[0016] Figure 2B is a schematic diagram of a system according to at least one embodiment described herein;
[0017] Figure 2Ca schematic diagram showing a close-up of one of the ion beam chambers according to at least one embodiment described herein; and
[0018] Figure 3 is a flow chart of a method according to at least one embodiment described herein.
[0019] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION
[0020] In the following description, many specific details are set forth to provide a more thorough understanding of the embodiments of the present disclosure. However, it will be apparent to those skilled in the art that one or more embodiments of the present disclosure may be performed without one or more of these specific details. In other cases, well-known features are not described in order to avoid obfuscating one or more embodiments of the present disclosure.
[0021] Various embodiments of the present disclosure relate to systems and methods for forming devices on substrates. For example, a method for forming a device on a substrate may include projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of the substrate, and projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a second surface of the substrate. In these embodiments, the first surface and the second surface are on opposite sides of the substrate. Thus, the ion beams can form devices on both sides of the substrate.
[0022] Figure 1A A perspective front view of a substrate 101 according to at least one embodiment is shown. The substrate 101 is configured to be used in an optical device. The substrate 101 can be any substrate used in the art. For example, the substrate 101 includes a semiconductor material, such as silicon (Si), germanium (Ge), silicon germanium (SiGe) and / or a III-V semiconductor, such as gallium arsenide (GaAs). In another example, the substrate 101 includes a transparent material, such as glass and / or plastic. The substrate 101 can have any number of insulating layers, semiconductor layers, or metal layers thereon.
[0023] As shown, substrate 101 includes a plurality of lenses 103 disposed on surface 104. Depending on the purpose of substrate 101, the plurality of lenses 103 are configured to focus light. The plurality of lenses 103 are disposed on substrate 101 in a grid of rows and columns. It is contemplated that other suitable arrangements of the plurality of lenses 103 disposed on substrate 101 may be implemented according to the embodiments described herein. Following the method of making a waveguide combiner described herein, each lens of the plurality of lenses 103 comprises waveguide combiner 100.
[0024] Figure 1B A perspective front view of a waveguide combiner 100 is shown according to one embodiment. The waveguide combiner 100 is configured to guide electromagnetic radiation (e.g., light). As shown, the waveguide combiner 100 includes a plurality of regions, each region including a plurality of gratings 102. The plurality of gratings 102 are configured to receive an incident light beam having an intensity (virtual image) from a microdisplay. Each grating of the plurality of gratings 102 separates the incident light beam into a plurality of modes, each light beam having a mode. The zero-order mode (zero-order mode, T0) light beam is refracted back to the waveguide combiner 100 or is lost in the waveguide combiner 100. The positive first-order mode (T1) light beam passes through the waveguide combiner 100 until the plurality of gratings 102 undergo total internal reflection (TIR). The negative first-order mode (T -1 ) beam propagates in the waveguide combiner 100 in the opposite direction to the T1 beam. -1 The optical beam undergoes TIR through the waveguide combiner 100 .
[0025] Figure 2A-2B A system 200 according to at least one embodiment described herein is shown. The system 200 is configured to expose an ion beam 206 at different angles to a substrate 101, which may be a flexible substrate. As shown, the system 200 includes a base 202, a plurality of ion beam chambers 208, a scanner 212, and a rolling system 216.
[0026] The base 202 holds the substrate 101 so that the surface 106 of the substrate 101 is exposed to the ion beam 206 generated by one or more ion beam chambers 208 and directed toward the surface 106, wherein the device 204 may be, for example, the grating 102. The base 202 has one or more holes 207 to allow the one or more ion beams 206 to pass through and form the one or more devices 204 on the surface 106. In addition, the surface 104 of the substrate 101 is exposed to the one or more ion beams 206 generated by the one or more ion beam chambers 208 and directed toward the surface 106. Both the surface 104 and the surface 106 are exposed to the one or more ion beams 206 to form the device 204 on both the surface 104 and the surface 106. Figure 2A-2B As shown, the surface 104 and the surface 106 are located on opposite sides of the substrate 101. Therefore, the system 200 is configured to create one or more devices 204 on both sides of the substrate 101. In addition, the system 200 can include a scanner 212 that is operable to move the base 202 in at least one of the y-direction and the x-direction proximate to the substrate so that the one or more devices 204 can be formed on different portions of the substrate 101.
[0027] The substrate 101 has a rollable and flexible property, so that a rolling system 216 is configured to move the portion of the substrate 101 in the path of the ion beam 206 to form the device 204. As shown, the rolling system 216 includes a plurality of rollers 214 and a plurality of roller actuators 215. The rollers 214 rotate the rolling portion 218 of the substrate 101 so that an additional portion 220 of the substrate can be exposed to one or more ion beams 206. Each of the roller actuators 215 is configured to rotate one of the plurality of rollers 214 to expose a different portion of the substrate 101 to the one or more ion beams 206.
[0028] Figure 2C A close-up schematic diagram of one of the ion beam chambers 208 according to at least one embodiment described herein is shown. As shown, the ion chamber 208 includes an ion beam source 203, which is configured to generate an ion beam 206, such as a ribbon beam or a spot beam. In some embodiments, the ion beam chamber 208 is configured to guide the ion beam 206 at an optimized angle relative to the surface of the substrate 101 to form a device 204 at different portions of the substrate 101. The angled etching system 200 also includes an extraction electrode 230 having a light emitting diode (LED) array 232. The LED array 232 can include a plurality of LEDs arranged in an array of rows and columns so that a temperature distribution can be provided on the surface 104 of the substrate 101 facing the ion beam 206 corresponding to the device 204 (e.g., one or more gratings in a plurality of gratings 101).
[0029] The system 200 further includes a controller 250 operable to communicate with the ion beam chamber 208, the LED array 205, the scanner 212, and the roller actuator 215. The controller 250 is operable to control various aspects of the system 200 and is configured to operate the method 300 described below. As shown, the controller 250 includes a central processing unit (CPU) 252, a memory 254, and support circuits (or I / O) 256. The CPU 252 is one of any form of computer processors that are used in industrial settings to control various processes and hardware (e.g., pattern generators, motors, and other hardware) and monitor these processes (e.g., process time and substrate position or location). The memory 254 is connected to the CPU 252 and is one or more memories in readily available storage, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of digital storage device, whether local or remote. Software instructions and data can be encoded and stored in the memory 254 for instructing the CPU 252. Support circuits 254 are also coupled to CPU 252 for supporting the CPU in a conventional manner. Support circuits 254 include conventional caches, power supplies, clock circuits, input / output circuits, subsystems, and the like.
[0030] Figure 3 1-2C , but is not limited to these systems and devices, and can be performed with other similar systems and devices.
[0031] At block 302, one or more ion beams 206 are projected from one or more of the ion beam chambers 208 to form one or more devices 204 on the surface 104 of the substrate 101. Each of the one or more ion beams 206 may be directed at an optimized angle relative to the surface 104 of the substrate 101. In some embodiments, the substrate 101 is a flexible substrate such that the rolling system 216 may roll portions of the surface 104 of the substrate 101 along the path of the one or more ion beams 206.
[0032] At block 304, one or more ion beams 206 are projected from the one or more ion beam chambers 208 to form one or more devices 204 on the surface 106 of the substrate 101. Each of the one or more ion beams 206 may be directed at an optimized angle relative to the surface 106 of the substrate 101. In some embodiments, a rolling system 216 may roll portions of the surface 106 of the substrate 101 along the path of the one or more ion beams 206.
[0033] In these embodiments, the surface 104 and the surface 106 are located on opposite sides of the substrate 101. Thus, the ion beam 206 can form devices on both sides of the substrate 101. In some embodiments, the pedestal 202 can be moved in at least one of the y-direction and the x-direction proximate to the substrate 101 so that one or more devices 204 are formed on different portions of the substrate 101. The scanner 212 can function to move the pedestal 202, although the pedestal 202 can be moved by other configurations.
[0034] While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be derived without departing from the basic scope thereof, and the scope of the invention is determined by the appended claims.
Claims
1. A method for forming a device on a substrate, the method comprising the steps of: projecting one or more first ion beams from one or more first ion beam chambers positioned above a first side of the rolling system, wherein each of the first ion beam chambers projects the one or more first ion beams toward a first surface of a substrate held by a base coupled to a scanner; and projecting one or more second ion beams from one or more second ion beam chambers positioned above a second side of the rolling system, wherein each of the second ion beam chambers projects the one or more second ion beams toward a second surface opposite the first surface of the substrate; as well as The pedestal is scanned near the substrate with the scanner so that the first ion beam or the second ion beam passes through one or more holes of the pedestal.
2. The method according to claim 1, wherein: directing each of the one or more first ion beams at the first angle relative to the first surface of the substrate by projecting the first ion beam at a first angle through the first ion beam chamber operable; and Each of the one or more ion beams is directed at a second angle relative to the second surface of the substrate by the second ion beam chamber being operable to project the second ion beam at the first angle. The method according to claim 1 , wherein the substrate is a flexible substrate.
4. The method according to claim 3, further comprising the following steps: Portions of the substrate having the first surface and the second surface are rolled along paths of the one or more first ion beams and the one or more second ion beams by the rolling system.
5. The method of claim 4, wherein the rolling system comprises a plurality of rollers and a plurality of roller actuators.
6. A system for forming a device on a substrate, the system comprising: one or more first ion beam chambers positioned above a first side of the scroll system, each of the first ion beam chambers being operable to project one or more first ion beams toward a first surface of the substrate, wherein at least one first ion beam chamber is operable to project the first ion beam at a first angle; and one or more second ion beam chambers positioned over a second side of the scrolling system opposite the first side, each of the second ion beam chambers being operable to project one or more second ion beams toward a second surface of the substrate, wherein the first surface and the second surface are on opposite sides of the substrate, and at least one of the second ion beam chambers being operable to project the second ion beam at a second angle different from the first angle; as well as A pedestal operable to hold the substrate, the pedestal coupled to a scanner, the pedestal having one or more apertures to allow the first ion beam or the second ion beam to pass through the one or more apertures, the scanner operable to move the pedestal proximate to the substrate. The system of claim 6 , wherein the substrate is a flexible substrate.
8. A computer readable medium having instructions thereon which, when executed by one or more processors, cause a system to: projecting one or more first ion beams from one or more first ion beam chambers positioned above a first side of the rolling system, wherein each of the first ion beam chambers projects the one or more first ion beams toward a first surface of a substrate held by a base coupled to a scanner; and projecting one or more second ion beams from one or more second ion beam chambers positioned above a second side of the rolling system, wherein each of the second ion beam chambers projects the one or more second ion beams toward a second surface of the substrate; as well as The pedestal is scanned near the substrate with the scanner so that the first ion beam or the second ion beam passes through one or more holes of the pedestal.
9. The computer readable medium of claim 8, wherein the substrate is a flexible substrate.
10. The computer-readable medium of claim 8, wherein the instructions, when executed by one or more processors, further cause the system to: Portions of the substrate having the first surface and the second surface are rolled along paths of the one or more first ion beams and the one or more second ion beams by the rolling system.
11. The computer readable medium of claim 10, wherein the rolling system comprises a plurality of rollers and a plurality of roller actuators.
12. The method of claim 1, scanning the susceptor in at least one of a y-direction and an x-direction proximate to the substrate.
13. The system of claim 7, further comprising: A rolling system is configured to roll portions of the substrate having the first surface and the second surface along paths of the one or more first ion beams and the one or more second ion beams.
14. The system of claim 13, wherein the rolling system comprises a plurality of rollers and a plurality of roller actuators.
15. The computer readable medium of claim 8, wherein the instructions, when executed by one or more processors, further cause the system to scan the pedestal in at least one of a y-direction and an x-direction proximate to the substrate.
Citation Information
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