Method of manufacturing electronic device

Abstract

The present application relates to a method for manufacturing an electronic device. The method includes: providing an unfinished setting module for a display panel, wherein the display panel has an active area and a peripheral area adjacent to the active area, and is foldable around a foldable axis extending in one direction, wherein a hole forming area is defined in the active area; selectively irradiating a laser beam with a first energy density and a second energy density different from the first energy density along a path defined along a boundary between the hole forming area and the active area, wherein the path includes a first path and a second path, wherein the first paths are spaced apart from each other in a direction substantially parallel to the foldable axis, and the second path is disposed between the first paths, wherein the laser beam is irradiated with a first energy density along the first path, and the laser beam is irradiated with a second energy density along the second path; and forming a setting module with a hole by removing the hole forming area from the unfinished setting module.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0015808, filed on February 10, 2020, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention relate to a method of manufacturing an electronic device, and more particularly, to a method of manufacturing an electronic device including an electronic module having a display device. Background Art

[0004] The electronic device is activated in response to an electrical signal applied to the electronic device. The electronic device includes a display unit that displays an image or a sensing unit that senses an external input. The organic light emitting display panel included in the display unit has advantageous characteristics such as low power consumption, high brightness, and fast response speed.

[0005] The electronic device includes an electronic module for receiving an external signal or outputting an output signal to the outside. The electronic module is accommodated in a housing together with a display panel to form the electronic device.

[0006] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0007] The method of manufacturing an electronic device according to the principles and exemplary implementations of the present invention can form an electronic module with improved durability, such as a camera module for a foldable display panel. For example, regions of the foldable display panel having different applied stresses due to repeated folding operations are formed differently from each other, and the energy density of the laser beam used to remove the hole forming region is different according to the target region, and thus, the components disposed in the region subjected to relatively greater stress are protected.

[0008] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] According to one aspect of the present invention, a method for manufacturing an electronic device includes the following steps: providing an unfinished setting module for a display panel, wherein the display panel has an effective area and a peripheral area adjacent to the effective area, and is capable of being folded around a foldable axis extending in one direction, and a hole forming area is defined in the effective area; selectively irradiating a laser beam with a first energy density and a second energy density different from the first energy density along a path defined along a boundary between the hole forming area and the effective area, the path including a first path and a second path, the first paths being spaced apart from each other in a direction substantially parallel to the foldable axis, and the second path being arranged between the first paths, wherein the laser beam is irradiated with a first energy density along the first path, and the laser beam is irradiated with a second energy density along the second path; and forming a setting module with a hole by removing the hole forming area from the unfinished setting module.

[0010] The first energy density may be less than the second energy density.

[0011] The hole forming area may have a substantially circular shape, a substantially elliptical shape, or a substantially polygonal shape.

[0012] The number of times the laser beam rotates along the path may be in a range of greater than or equal to about once and less than or equal to about one hundred times.

[0013] The hole forming region may be provided in plural.

[0014] The laser beam may be generated by a pulsed laser.

[0015] The step of selectively irradiating the laser beam may include moving the laser beam along the first path at a first speed that is slower than a speed at which the laser beam moves along the second path.

[0016] The laser beam may move at a speed within a range of greater than or equal to about 50 mm / s and less than or equal to about 6000 mm / s.

[0017] The laser beam may have a power in a range of greater than or equal to about 0.5 W and less than or equal to about 30 W.

[0018] The laser beam may have a frequency in a range of greater than or equal to about 100 kHz and less than or equal to about 20,000 kHz.

[0019] According to another aspect of the present invention, a method for manufacturing an electronic device includes: providing an unfinished setting module for a display panel, the display panel having an active area and a peripheral area adjacent to the active area, and being capable of being folded around a foldable axis extending in one direction, the active area including a first area and a second area that are subjected to different stresses during folding; irradiating a laser beam to the active area along a path defined in the active area; and forming a setting module by irradiating the laser beam to the first area with a first energy density and irradiating the laser beam to the second area with a second energy density greater than the first energy density, in which a module hole is defined by the unfinished setting module.

[0020] The first regions may be spaced apart from each other in a direction substantially parallel to the foldable axis, and the second region may be disposed between the first regions.

[0021] The laser beam may have a generally circular shape, a generally elliptical shape, or a generally polygonal shape.

[0022] The number of times the laser beam rotates along the path may be in a range of approximately greater than or equal to once and less than or equal to approximately one hundred times.

[0023] The module hole can be provided in plurality.

[0024] The laser beam may be generated by a pulsed laser.

[0025] The step of forming the setting module may include moving the laser beam along a first path at a first speed slower than a speed at which the laser beam moves along a second path, wherein the first path overlaps the first area and the second path overlaps the second area.

[0026] The laser beam may move at a speed within a range of greater than or equal to about 50 mm / s and less than or equal to about 6000 mm / s.

[0027] The laser beam may have a power in a range of greater than or equal to about 0.5 W and less than or equal to about 30 W.

[0028] The laser beam may have a frequency in a range of greater than or equal to about 100 kHz and less than or equal to about 20,000 kHz.

[0029] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0031] Figure 1 is an assembled perspective view showing an exemplary embodiment of an electronic device constructed according to the principles of the present invention.

[0032] Figure 2A and Figure 2B It is shown Figure 1 A perspective view of different folded positions of an exemplary electronic device shown in FIG.

[0033] Figure 3A It is shown Figure 1 An exploded perspective view of an exemplary electronic device is shown in FIG.

[0034] Figure 3B It is shown Figure 3A A block diagram of an exemplary electronic device is shown in FIG.

[0035] Figure 4A is a cross-sectional view illustrating an exemplary embodiment of a method of manufacturing an electronic device according to the principles of the present invention.

[0036] Figure 4B is a plan view showing an exemplary embodiment of a method of manufacturing an electronic device according to the principles of the present invention.

[0037] Figure 5A is a cross-sectional view illustrating an exemplary embodiment of an unfinished setup module constructed in accordance with the principles of the present invention.

[0038] Figure 5B It is shown Figure 5A 0 is a plan view of an enlarged view of a portion of area AA of an unfinished setting module shown in FIG.

[0039] Fig. 6A and Figure 6B It is shown in Figure 5B A perspective view of a portion of area AA shown in FIG. 1 , in which a laser beam is irradiated along a moving path.

[0040] Figure 7 is a cross-sectional view illustrating an exemplary embodiment of a setting module constructed according to the principles of the present invention.

[0041] Figure 8 is a plan view illustrating an exemplary embodiment of an unfinished setup module constructed in accordance with the principles of the present invention. DETAILED DESCRIPTION

[0042] In the following description, for the purpose of illustration, many specific details are elaborated to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "implementation" and "implementation" are interchangeable words, which are non-limiting examples of one or more devices or methods using the inventive concept disclosed herein. However, it is obvious that various exemplary embodiments can be put into practice without these specific details or with one or more equivalent arrangements. In other examples, in order to avoid unnecessarily blurring various exemplary embodiments, known structures and devices are shown in block diagram form. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0043] Unless otherwise specified, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter, individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0044] The use of cross hatching and / or shading in the drawings is generally to make the boundaries between adjacent elements clear. Therefore, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the exemplary embodiments can be implemented differently, the specific processing sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0045] When an element, such as a layer, is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or coupled to, another element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may represent a physical connection, an electrical connection, and / or a fluid connection with or without the presence of an intervening element. In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of a rectangular coordinate system (such as, the x-axis, the y-axis, and the z-axis), and may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0046] Although the terms "first", "second", etc. may be used herein to describe various types of elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present disclosure, the first element, first component, first region, first layer or first part discussed below may be referred to as the second element, second component, second region, second layer or second part.

[0047] Spatially relative terms such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), and the like may be used herein for descriptive purposes, and thereby to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "beneath" other elements or features would then be oriented to be "above" the other elements or features. Thus, the exemplary term "below" may encompass both the above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0048] The terms used herein are for the purpose of describing a particular embodiment, rather than being intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "one", "an" and "the" are intended to also include plural forms. In addition, when used in this specification, the terms "comprise", "comprises", "includes" and / or "includes" represent the existence of stated features, integral bodies, steps, operations, elements, parts and / or their sets, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or their sets. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as degree terms, and are therefore used to allow for the inherent deviations in the measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0049] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specific illustrated shapes of the regions, but will include deviations in shape due to, for example, manufacturing. In this manner, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0051] Figure 1 is an assembled perspective view showing an exemplary embodiment of an electronic device constructed according to the principles of the present invention. Figure 2A and Figure 2B It is shown Figure 1 A perspective view of different folded positions of an exemplary electronic device shown in FIG.

[0052] Figure 2A Shows Figure 1 The electronic device EA shown in FIG. 1 is in a perspective view in a first folded position, and Figure 2B Shows Figure 1 The electronic device EA shown in FIG. is in a perspective view in the second folded position. Figures 1 to 2B Some exemplary embodiments are described.

[0053] The electronic device EA may be a device that is activated in response to an electrical signal applied thereto. The electronic device EA may be applied to various exemplary embodiments. For example, the electronic device EA may be a tablet computer, a notebook computer, a computer, or a smart TV. In some exemplary embodiments, a smart phone is described as a representative example of the electronic device EA.

[0054] The electronic device EA displays an image IM through the transmissive area TA. The image IM includes at least one of a still image and a moving image. Figure 1 A clock widget and application icons are shown as representative examples of the image IM.

[0055] The transmission area TA may have a substantially quadrilateral shape substantially parallel to each of the first direction DR1 and the second direction DR2, however, this is merely exemplary. The transmission area TA may include various shapes and should not be particularly limited thereto.

[0056] The frame area BZA is defined to be adjacent to the transmission area TA. The frame area BZA may surround the transmission area TA. However, this is merely exemplary, and the frame area BZA may be defined to be adjacent to only one side of the transmission area TA, or may be omitted. The electronic device EA according to some exemplary embodiments may include various embodiments and should not be limited to specific exemplary embodiments.

[0057] According to some exemplary embodiments, a hole area HA may be defined in the electronic device EA. The hole area HA may be connected to the electronic module EM (refer to Figure 3A ) overlap. That is, the hole area HA may be an area in which a camera or the like is provided to photograph an external object, or may be an area in which an optical sensor is provided to sense light. The image IM may be displayed while surrounding at least a portion of the edge of the hole area HA. ​​In the illustrated exemplary embodiment, the image IM may be displayed while surrounding the hole area HA. ​​This will be described in detail below.

[0058] The normal direction of the front surface FS may correspond to the thickness direction DR3 (hereinafter referred to as the "third direction") of the electronic device EA. In the exemplary embodiment shown, the front surface (or upper surface) and the rear surface (or lower surface) of each member are defined relative to the direction along which the image IM is displayed. The front surface and the rear surface are opposite to each other in the third direction DR3.

[0059] Directions indicated by the first direction DR1 , the second direction DR2 , and the third direction DR3 are relative to each other and may be changed to other directions.

[0060] The electronic device EA may have an appearance defined by the window WM and the housing HU. The front surface FS of the electronic device EA may be defined in the window WM.

[0061] Reference Figure 2A and Figure 2B , the electronic device EA can be folded relative to predetermined folding axes FX1 and FX2. Figure 2A As shown in , the electronic device EA-F1 can be folded relative to the first folding axis FX1. The first folding axis FX1 can be defined on the window WM. Therefore, the electronic device EA-F1 can be folded in the first mode so that different parts of the window WM face each other and the housing HU is exposed to the outside.

[0062] like Figure 2B As shown in , the electronic device EA-F2 can be folded relative to the second folding axis FX2. The second folding axis FX2 can be defined on the housing HU. Therefore, the electronic device EA-F2 can be folded in the second mode so that different parts of the housing HU face each other and the window WM is exposed to the outside. Even if the electronic device EA-F2 is in the folded state, the image IM displayed by the electronic device EA-F2 can be easily seen by the user.

[0063] The first folding axis FX1 and the second folding axis FX2 may exist in the electronic device EA substantially at the same time. In this case, the electronic device EA may be changed into the electronic device EA-F1 of the first mode or the electronic device EA-F2 of the second mode according to the direction of the external force applied thereto. In other words, the first folding axis FX1 and the second folding axis FX2 may selectively exist in the electronic device EA. The extension directions of the first folding axis FX1 and the second folding axis FX2 may be defined in different directions without being limited to the first direction DR1, and should not be limited to a specific exemplary embodiment.

[0064] Figure 3A It is shown Figure 1 An exploded perspective view of an exemplary electronic device is shown in FIG. Figure 3B It is shown Figure 3A . Hereinafter, reference will be made to Figure 3A and Figure 3B To describe the electronic device EA.

[0065] Reference Figure 3A The electronic device EA may include a window WM, a setting module SM, an electronic module EM and a housing HU.

[0066] In the illustrated exemplary embodiment, the setting module SM may include an electronic panel EP, an optical film POL, an adhesive layer ADL, a circuit board DC, and a protective layer PTL. As described above, the window WM and the housing HU are attached to each other to define the appearance of the electronic device EA.

[0067] The window WM may be provided on the electronic panel EP and may cover the front surface IS of the electronic panel EP. The window WM may include an optically transparent insulating material. In addition, the window WM may have flexibility. For example, the window WM may include a resin film of polyimide, a resin substrate, or a thin glass substrate.

[0068] The window WM may have a single-layer or multi-layer structure. For example, the window WM may have a stacked structure in which a plurality of plastic films are attached to each other by an adhesive, or may have a stacked structure in which a glass substrate and a plastic film are attached to each other by an adhesive.

[0069] The window WM may include a front surface FS exposed to the outside. The front surface FS of the electronic device EA may be defined by the front surface FS of the window WM. In detail, the transmission area TA may be an optically transparent area. The transmission area TA may have a shape corresponding to the active area AA. For example, the transmission area TA may overlap the entire portion or at least a portion of the active area AA. The image IM displayed through the active area AA of the electronic panel EP may be viewed from the outside through the transmission area TA.

[0070] The bezel area BZA may be an area having relatively low light transmittance compared to the transmission area TA. The bezel area BZA may define the shape of the transmission area TA. The bezel area BZA may be defined adjacent to the transmission area TA and may surround the transmission area TA.

[0071] The frame area BZA may have a predetermined color. When the window WM is a glass substrate or a plastic substrate, the frame area BZA may be a colored layer printed or deposited on the surface of the glass substrate or the plastic substrate. In other words, the frame area BZA may be formed by coloring the corresponding area of ​​the glass substrate or the plastic substrate.

[0072] The bezel area BZA may cover the peripheral area NAA of the electronic panel EP to prevent the peripheral area NAA from being seen from the outside, however, this is merely exemplary. According to some exemplary embodiments, the bezel area BZA may be omitted from the window WM.

[0073] The electronic panel EP may display an image IM. The electronic panel EP may include a front surface IS in which an active area AA and a peripheral area NAA are defined. The active area AA may be an area activated in response to an electrical signal.

[0074] In the illustrated exemplary embodiment, the active area AA may be an area through which the image IM is displayed. The transmissive area TA may overlap at least the active area AA. For example, the transmissive area TA may overlap the entire portion or at least a portion of the active area AA. Therefore, the user may view the image IM through the transmissive area TA.

[0075] The peripheral area NAA may be covered by the bezel area BZA. The peripheral area NAA may be defined to be adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or a driving line may be arranged in the peripheral area NAA to drive the active area AA.

[0076] Various signal lines, pads PD, or electronic components may be provided in the peripheral area NAA to apply electrical signals to the active area AA. The peripheral area NAA may be covered by the bezel area BZA, and thus, the peripheral area NAA may not be visible from the outside.

[0077] In the exemplary embodiment shown, the electronic panel EP can be assembled into a substantially flat state so that the active area AA and the peripheral area NAA face the window WM, however, this is merely exemplary. That is, a portion of the peripheral area NAA of the electronic panel EP may be substantially curved. In this case, the portion of the peripheral area NAA may be toward the rear surface of the electronic device EA, and therefore, the border area BZA in the front surface FS of the electronic device EA may be reduced. In other words, the electronic panel EP may be assembled to allow a portion of the active area AA to bend. In addition, according to some exemplary embodiments, the peripheral area NAA may be omitted from the electronic panel EP.

[0078] The panel hole HH may be defined to pass through the electronic panel EP. At least a portion of the panel hole HH may be surrounded by the active area AA. In the exemplary embodiment shown, the panel hole HH may be spaced apart from the peripheral area NAA. The panel hole HH may be defined in the active area AA so that its edge is completely surrounded by the active area AA. In the assembled state of the electronic device EA according to the exemplary embodiment shown, the panel hole HH may be formed at a position overlapping with the transmissive area TA and spaced apart from the frame area BZA.

[0079] The circuit board DC may be connected to the electronic panel EP. The circuit board DC may include a flexible board CF and a main board MB. The flexible board CF may include an insulating film and a conductive wire mounted on the insulating film. The conductive wire may be connected to the pad PD to electrically connect the circuit board DC and the electronic panel EP.

[0080] In the exemplary embodiment shown, the flexible board CF can be installed in a substantially bent state. Therefore, the main board MB can be set on the rear surface of the electronic panel EP and can be stably accommodated in the space provided by the housing HU. In some exemplary embodiments, the flexible board CF can be omitted, and in this case, the main board MB can be directly connected to the electronic panel EP.

[0081] The main board MB may include signal lines and electronic components. The electronic components may be connected to the signal lines and may be electrically connected to the electronic panel EP. The electronic components may generate a variety of electrical signals (e.g., signals for generating an image IM or signals for sensing an external input), and may process the sensed signals. The main board MB may be provided in plurality to correspond to the electrical signals generated and processed thereby, however, exemplary embodiments are not limited thereto.

[0082] In the electronic device EA according to some exemplary embodiments, the driving circuit that applies the electrical signal to the active area AA may be directly mounted on the electronic panel EP. In the exemplary embodiment shown, the driving circuit may be mounted in chip form or may be formed together with the pixel. In this case, the area of ​​the circuit board DC may be reduced, or the circuit board DC may be omitted. The electronic device EA may include various exemplary embodiments, and it should not be limited to a specific exemplary embodiment.

[0083] The optical film POL may be disposed between the window WM and the electronic panel EP. The optical film POL may reduce the reflectivity of external light incident thereto from the outside of the window WM relative to the electronic panel EP. In the illustrated exemplary embodiment, the optical film POL may include a polarizing film or a color filter.

[0084] A predetermined hole HH-P (hereinafter, referred to as an "optical film hole") may be defined to pass through the optical film POL. The optical film hole HH-P may be defined to pass through an area of ​​the optical film POL corresponding to the panel hole HH of the electronic panel EP. In the exemplary embodiment shown, the optical film hole HH-P may be defined in a position overlapping with the panel hole HH of the electronic panel EP, and may have a shape matching the shape of the panel hole HH, however, this is merely exemplary. Due to manufacturing process errors, there may be a tolerance in position and size between the optical film hole HH-P and the panel hole HH of the electronic panel EP.

[0085] The adhesive layer ADL may be disposed between the optical film POL and the window WM. The adhesive layer ADL may attach the optical film POL and the window WM. In the case of the optical film POL according to some exemplary embodiments, a color filter is formed in the electronic panel EP, and the adhesive layer ADL may substantially attach the electronic panel EP and the window WM. The adhesive layer ADL may include an optically transparent adhesive, an optically transparent resin, or a pressure-sensitive adhesive, however, it should not be limited to a specific exemplary embodiment as long as it is optically transparent.

[0086] The predetermined hole HH-A (hereinafter referred to as "adhesive layer hole") may be defined to pass through the adhesive layer ADL. The adhesive layer hole HH-A may be formed along the panel hole HH of the electronic panel EP. In the exemplary embodiment shown, the adhesive layer hole HH-A and the optical film hole HH-P are aligned along the panel hole HH of the electronic panel EP, however, this is merely exemplary. Due to manufacturing process errors, the adhesive layer hole HH-A and the optical film hole HH-P may not completely overlap with the panel hole HH of the electronic panel EP.

[0087] The protective layer PTL may be provided below the electronic panel EP. The protective layer PTL may include a plurality of layers, and the protective layer PTL may include various layers for alleviating stress applied to the electronic panel EP when the electronic panel EP is folded or protecting the electronic panel EP from external impact. For example, the protective layer PTL may include a buffer layer having a foam shape to absorb impact on the electronic panel EP, a light blocking layer to block light from the electronic panel EP, and a heat dissipation layer to dissipate heat generated from the electronic panel EP.

[0088] The predetermined hole HH-T (hereinafter referred to as a "protective layer hole") may be defined to pass through the protective layer PTL. The protective layer hole HH-T may be formed along the panel hole HH of the electronic panel EP. In the exemplary embodiment shown, the protective layer hole HH-T, the adhesive layer hole HH-A, and the optical film hole HH-P are aligned to correspond to the panel hole HH of the electronic panel EP, however, this is merely exemplary. Due to process errors, the protective layer hole HH-T, the adhesive layer hole HH-A, and the optical film hole HH-P may not completely overlap with the panel hole HH of the electronic panel EP.

[0089] The electronic module EM may be disposed below the window WM. When viewed in a plane, the electronic module EM may overlap the panel hole HH. The electronic module EM may receive an external input transmitted through the panel hole HH, or may provide an output through the panel hole HH.

[0090] In the electronic module EM, a receiving portion receiving external input or an output portion providing output may overlap the panel hole HH when viewed in a plane. According to some exemplary embodiments, the electronic module EM may be disposed to overlap the active area AA, and thus, the bezel area BZA may be prevented from increasing.

[0091] Reference Figure 3B , the electronic device EA may include an electronic panel EP, a power module PS, a first electronic module EM1, and a second electronic module EM2. The electronic panel EP, the power module PS, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other.

[0092] exist Figure 3B, a display unit DU and a sensing unit SU among possible components of the electronic panel EP are shown as representative examples. The display unit DU may include a plurality of pixels and may display an image IM. The sensing unit SU may sense an external input applied to the window WM. The external input may include various types of external inputs, such as a part of the body of a user using the electronic device EA, light, heat, or pressure provided from the outside. In addition, the electronic device EA may sense a proximity input to the electronic device EA as well as a touch input. The sensing unit SU may be stacked on the display unit DU, or may be inserted into the display unit DU to be formed integrally with the display unit DU.

[0093] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for operating the electronic device EA. The first electronic module EM1 may be directly mounted on a motherboard electrically connected to the electronic panel EP, or may be electrically connected to the motherboard through a connector after being mounted on a separate substrate.

[0094] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some of the modules may be electrically connected to the motherboard through a flexible circuit board instead of being mounted on the motherboard.

[0095] The control module CM can control the overall operation of the electronic device EA. The control module CM can be, but is not limited to, a microprocessor. For example, the control module CM can activate or deactivate the electronic panel EP. The control module CM can control other modules such as the image input module IIM, the audio input module AIM, etc. based on a touch signal provided from the electronic panel EP.

[0096] The wireless communication module TM can use Bluetooth or WiFi links to send wireless signals to other terminals / receive wireless signals from other terminals. The wireless communication module TM can use general communication lines to send / receive voice signals. The wireless communication module TM may include a transmitter TM1 and a receiver TM2, wherein the transmitter TM1 modulates the signal to be sent and sends the modulated signal, and the receiver TM2 demodulates the signal applied thereto.

[0097] The image input module IIM can process image signals and convert them into image data that can be displayed through the electronic panel EP. The audio input module AIM can receive external sound signals through a microphone in a recording mode or a voice recognition mode and convert them into electrical voice data.

[0098] The external interface IF serves as an interface between the control module CM and external devices such as an external charger, wired / wireless data ports, card slots (e.g., memory cards and subscriber identity module (SIM) cards / universal subscriber identity module (USIM) cards), etc.).

[0099] The second electronic module EM2 may include an audio output module AOM, a light transmitting module LM, a light receiving module LRM, and a camera module CMM. The components may be directly mounted on a motherboard, may be electrically connected to the electronic panel EP via a connector after being mounted on a separate substrate, or may be electrically connected to the first electronic module EM1.

[0100] The audio output module AOM may convert sound data provided from the wireless communication module TM or sound data stored in the memory MM, and may output the converted sound data to the outside.

[0101] The light emitting module LM can generate light and can output light. The light emitting module LM can emit infrared rays. The light emitting module LM may include an LED element. The light receiving module LRM can sense infrared rays. When infrared rays having a predetermined level or higher are sensed, the light receiving module LRM may be activated. The light receiving module LRM may include a complementary metal oxide semiconductor (CMOS) sensor. The infrared rays generated by the light emitting module LM and output from the light emitting module LM may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared rays may be incident into the light receiving module LRM. The camera module CMM may capture an image of an external object.

[0102] The electronic module EM according to some exemplary embodiments may include at least one of the configurations of the first electronic module EM1 and the second electronic module EM2. For example, the electronic module EM may include at least one of a camera, a speaker, a light sensor, and a thermal sensor. The electronic module EM may sense an external object through the panel hole HH, and may provide a sound signal such as a voice to the outside through the panel hole HH. In addition, the electronic module EM may include different configurations and should not be limited to a specific exemplary embodiment.

[0103] According to some exemplary embodiments, the electronic module EM may be assembled to overlap the transmissive area TA when viewed in a plane, thereby preventing the bezel area BZA from increasing when the electronic module EM is arranged in the bezel area BZA, and improving the aesthetics of the electronic device EA.

[0104] Figure 4A is a cross-sectional view illustrating an exemplary embodiment of a method of manufacturing an electronic device according to the principles of the present invention. Figure 4Bis a plan view showing an exemplary embodiment of a method of manufacturing an electronic device according to the principles of the present invention. Figure 5A is a cross-sectional view illustrating an exemplary embodiment of an unfinished setup module constructed in accordance with the principles of the present invention. Figure 5B It is shown Figure 5A 0 is a plan view of an enlarged view of a portion of area AA of an unfinished setting module shown in FIG. Fig. 6A and Figure 6B It is shown in Figure 5B A perspective view of a portion of area AA shown in FIG. 1 , in which a laser beam is irradiated along a moving path. Figure 7 is a cross-sectional view illustrating an exemplary embodiment of a setting module constructed according to the principles of the present invention.

[0105] In the following, reference will be made to FIG. 4A to FIG. 7 A method for manufacturing an electronic device according to some exemplary embodiments is described. In more detail, a method for manufacturing an electronic device according to some exemplary embodiments is described. Figure 3A ) A method for manufacturing an electronic device in which holes HH-A, HH-P, HH and HH-T are formed to overlap with an electronic module EM. FIG. 4A to FIG. 7 In the Figures 1 to 3B , and thus, detailed description of the same elements will be omitted to avoid redundancy.

[0106] The manufacturing method of the electronic device according to the illustrated exemplary embodiment may include providing an working substrate. The working substrate EAS may include an unfinished setting module (preliminary setting module) SM-A and protective films PF1 and PF2.

[0107] In the exemplary embodiment shown, the preliminary setting module SM-A can be defined as a module that is not yet included in the Figure 3A The preliminary setting module SM-A is a module in a state where holes HH-A, HH-P, HH and HH-T are formed in the components in the setting module SM described in the previous description. Therefore, the preliminary setting module SM-A may include the electronic panel EP, the optical film POL, the adhesive layer ADL and the protective layer PTL in states before the holes HH-A, HH-P, HH and HH-T are formed, respectively. For ease of explanation, the circuit board DC will be omitted in the following figures, and the process of forming the panel hole HH through the electronic panel EP will be mainly described.

[0108] Reference Figure 4A and Figure 4BThe preliminary setting module SM-A includes an active area AA and a peripheral area NAA defined to be adjacent to the active area AA, and a hole forming area CA is defined in the active area AA. In addition, the preliminary setting module SM-A includes an upper surface SU and a rear surface SB opposite to the upper surface SU. The preliminary setting module SM-A can be folded around an imaginary folding axis FX1 extending in the first direction DR1.

[0109] Figure 4B The hole forming area CA is shown as being defined at the upper center of the active area AA, however, the position of the hole forming area CA should not be limited thereto or thereby. For example, the hole forming area CA may be defined as being Figure 3A The area where the electronic modules EM shown in FIG. 1 overlap is an area where the electronic modules EM shown in FIG. 1 overlap, and the shape and number of the hole forming areas CA should not be particularly limited as long as the hole forming areas CA are defined within the effective area AA.

[0110] The protective films PF1 and PF2 may be disposed on at least one of the upper surface SU and the back surface SB of the preliminary setting module SM-A. The protective films PF1 and PF2 may be attached to the preliminary setting module SM-A through an adhesive layer (not shown).

[0111] The protective films PF1 and PF2 can protect the preliminary setting module SM-A from external impacts generated when the preliminary setting module SM-A is transported and assembled. The protective films PF1 and PF2 can prevent external moisture from entering the preliminary setting module SM-A and can absorb external impacts. In addition, the protective films PF1 and PF2 can prevent residues generated when a hole is formed through the preliminary setting module SM-A from entering the preliminary setting module SM-A.

[0112] The protective films PF1 and PF2 may protect the preliminary setting module SM-A. The protective films PF1 and PF2 may provide an outer surface exposed to the outside and may provide an adhesive surface attached to the adhesive member. The protective films PF1 and PF2 may prevent external moisture from entering the preliminary setting module SM-A and may absorb external impact.

[0113] The protective films PF1 and PF2 may include a plastic film as their base layer. The protective films PF1 and PF2 may include a plastic film containing one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone) and combinations thereof.

[0114] The material used for the protective films PF1 and PF2 should not be limited to plastic resins and may include organic-inorganic composite materials. The protective films PF1 and PF2 may include a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective films PF1 and PF2 may also include a functional layer formed in a plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. According to some exemplary embodiments, the protective films PF1 and PF2 may be omitted.

[0115] Reference Figure 5A and Figure 5B , the laser unit LS can irradiate the laser beam onto the upper surface SU of the preliminary setting module SM-A. The laser beam can be irradiated from a predetermined point defined within the hole forming area CA (which is defined by the effective area AA of the preliminary setting module SM-A) or a predetermined point defined within a path in the form of a moving path MP.

[0116] According to some exemplary embodiments, the boundary between the hole forming area CA and the effective area AA may be defined as a path along which the laser beam is irradiated, that is, a moving path MP of the laser beam. Therefore, the laser beam may be irradiated along the moving path MP to remove the hole forming area CA of the preliminary setting module SM-A. In the illustrated exemplary embodiment, the laser beam may be a pulsed laser generated from a laser unit LS such as a pulsed laser.

[0117] As disclosed herein, the laser beam provided from the laser unit LS may rotate a plurality of times along the moving path MP. For example, the number of times the laser beam rotates along the moving path MP to remove the hole forming area CA may be in a range of greater than or equal to about once to less than or equal to about one hundred times.

[0118] The moving speed of the laser beam moving along the moving path MP may be in the range of greater than or equal to about 50 millimeters per second (mm / s) and less than or equal to about 6000 mm / s. The frequency of the laser beam may be in the range of greater than or equal to about 100 kilohertz (kHz) and less than or equal to about 20000 kHz. The power of the laser beam may be in the range of greater than or equal to about 0.5 watts (W) and less than or equal to about 30 W.

[0119] According to some example embodiments, the active area AA may include Figure 3A The first areas SH-L and SH-R and the second areas SL-U and SL-B adjacent to the panel hole HH shown in the figure can be distinguished from each other by the intensity of stress generated when the electronic device EA is repeatedly folded around one of the folding axes FX1 and FX2.

[0120] For example, due to repeated folding operations when a user folds the electronic device EA, the first regions SH-L and SH-R may be regions having relatively greater stress than stress applied to the second regions SL-U and SL-B.

[0121] The first regions SH-L and SH-R may be spaced apart from each other along the imaginary line FA. The second regions SL-U and SL-B may be disposed between the first regions SH-L and SH-R. The imaginary line FA may extend in a first direction DR1 parallel to an extension direction of the folding axes FX1 and FX2.

[0122] Therefore, when the laser beam is irradiated onto the effective area AA of the preliminary setting module SM-A to remove the hole forming area CA and the laser beam is irradiated onto the first areas SH-L and SH-R and the second areas SL-U and SL-B with the same energy density, the parts of the electronic panel EP overlapping with the first areas SH-L and SH-R to which relatively greater stress is applied may be damaged.

[0123] According to the principles of the present invention, since the regions to which different stresses are applied due to repeated folding operations are predetermined, and the laser beam for removing the hole forming region CA is irradiated with different energy densities according to the predetermined regions, it is possible to protect the components disposed in the region to which relatively greater stresses are applied. Therefore, the electronic device manufactured by the manufacturing method according to the principles of the present invention and the exemplary embodiment has improved reliability.

[0124] For example, refer to Fig. 6A and Figure 6B , a method for manufacturing an electronic device may include: providing a preliminary setting module, the preliminary setting module including an effective area AA and a peripheral area NAA in which a hole forming area CA is defined, and can be folded around an imaginary folding axis FX1.

[0125] The method of manufacturing an electronic device may include irradiating a laser beam along a moving path MP defined along a boundary between the hole forming area CA and the active area AA.

[0126] The moving paths MP may include first paths MP-L and MP-R overlapping the first areas SH-L and SH-R and second paths MP-U and MP-B overlapping the second areas SL-U and SL-B.

[0127] The method for manufacturing an electronic device may include: removing the hole forming area CA to form a setting module SM, thereby defining Figure 7 The module hole MH can be made by using Figure 3A The adhesive layer hole HH-A, optical film hole HH-P, panel hole HH and protective layer hole HH-T shown in FIG.

[0128] The manufacturing method of the electronic device may further include: forming a module hole MH passing through the preliminary setting module SM-A to form the setting module SM; and removing the protective films PF1 and PF2 attached to at least one of the upper surface SU and the back surface SB of the preliminary setting module SM-A.

[0129] According to some exemplary embodiments, the laser beam LB1 irradiated to the first paths MP-L and MP-R may have a first energy density different from a second energy density of the laser beam LB2 irradiated to the second paths MP-U and MP-B. For example, the first energy density may be less than the second energy density. Therefore, the first energy density of the laser beam LB1 irradiated to the first areas SH-L and SH-R may be less than the second energy density of the laser beam LB2 irradiated to the second areas SL-U and SL-B.

[0130] As used herein, the expression “the energy density of the laser beam is small” means that the moving speed of the laser beam is relatively fast, the frequency of the laser beam is relatively high, and the power of the laser beam is relatively low.

[0131] According to some exemplary embodiments, when the first energy density of the laser beam LB1 irradiated to the first paths MP-L and MP-R is less than the second energy density of the laser beam LB2 irradiated to the second paths MP-U and MP-B, the components of the electronic panel EP overlapping the first regions SH-L and SH-R to which relatively greater stress is applied can be protected. Therefore, the manufacturing method according to the principles of the present invention and exemplary embodiments produces an electronic device with improved reliability.

[0132] Figure 8 is a plan view showing an exemplary embodiment of an unfinished setting module constructed in accordance with the principles of the present invention. Figure 8 In the same / similar reference numerals, Figure 5B , and thus, detailed descriptions of the same / similar elements will be omitted to avoid redundancy.

[0133] Reference Figure 8 , the hole forming area CA-1 may have a substantially elliptical shape. Therefore, the moving path MP-1 along which the laser beam moves may have a substantially elliptical shape. According to the illustrated exemplary embodiment, the preliminary setting module may include first areas SH-L and SH-R and second areas SL-U and SL-B that are distinguished from each other according to stress applied by the folding operation.

[0134] Compared with the energy density of the laser beam applied to the portion of the moving path MP-1 overlapping the second regions SL-U and SL-B, a laser beam with relatively smaller energy density can be irradiated to the portion of the moving path MP-1 overlapping the first regions SH-L and SH-R to which relatively greater stress is applied.

[0135] However, the exemplary embodiment should not be limited to this or thereby, and the hole forming area CA-1 may have one of a substantially circular shape, a substantially elliptical shape, and a substantially polygonal shape. Therefore, the laser beam may be irradiated along a path having a shape corresponding to the shape of the hole forming area CA-1, however, the exemplary embodiment should not be limited to this or thereby.

[0136] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. A method for manufacturing an electronic device, comprising the following steps: providing an unfinished setting module for a display panel having an active area and a peripheral area adjacent to the active area and foldable about a foldable axis extending in one direction, wherein a hole forming area is defined in the active area; selectively irradiating a laser beam at a first energy density and a second energy density greater than the first energy density along a path defined by a boundary between the hole forming region and the effective region, the path including a first path and a second path, the first paths being spaced apart from each other in a direction parallel to the foldable axis, the second path being disposed between the first paths, wherein the laser beam is irradiated at the first energy density along the first path, and the laser beam is irradiated at the second energy density along the second path; and A setting module having a hole is formed by removing the hole forming area from the unfinished setting module.

2. The method according to claim 1, wherein: The hole forming area has a circular shape, an elliptical shape, or a polygonal shape.

3. The method according to claim 1, wherein: The number of times the laser beam rotates along the path is within a range of greater than or equal to once and less than or equal to one hundred times.

4. The method according to claim 1, wherein: The hole forming area is provided in plurality.

5. The method according to claim 1, wherein: The laser beam is generated by a pulsed laser.

6. The method according to claim 1, wherein: Selectively irradiating the laser beam includes moving the laser beam along the first path at a first speed faster than a speed at which the laser beam moves along the second path.

7. The method according to claim 1, wherein: The laser beam moves at a speed within a range of greater than or equal to 50 mm / s and less than or equal to 6000 mm / s.

8. The method according to claim 1, wherein: The laser beam has a power in a range of greater than or equal to 0.5 W and less than or equal to 30 W.

9. The method according to claim 1, wherein: The laser beam has a frequency in a range of greater than or equal to 100 kHz and less than or equal to 20000 kHz.

10. A method of manufacturing an electronic device, comprising: providing an unfinished setting module for a display panel, the display panel having an active area and a peripheral area adjacent to the active area and being foldable about a foldable axis extending in one direction, the active area including a first area and a second area that are subjected to different stresses during folding, wherein the first areas are spaced apart from each other in a direction parallel to the foldable axis, and the second area is disposed between the first areas; irradiating a laser beam to the effective area along a path defined in the effective area; and A setting module is formed by irradiating the laser beam to the first area with a first energy density and irradiating the laser beam to the second area with a second energy density greater than the first energy density, in which a module hole having a shape corresponding to the shape of the path is defined by the unfinished setting module.

11. The method according to claim 10, wherein: The laser beam has a circular shape, an elliptical shape, or a polygonal shape.

12. The method according to claim 10, wherein: The number of times the laser beam rotates along the path is in a range of greater than or equal to once and less than or equal to one hundred times.

13. The method according to claim 10, wherein: The module holes are arranged in plurality.

14. The method according to claim 10, wherein: The laser beam is generated by a pulsed laser.

15. The method according to claim 10, wherein the step of forming the setting module comprises: The laser beam is moved along a first path at a first speed faster than a speed at which the laser beam is moved along a second path, wherein the first path overlaps the first region and the second path overlaps the second region.

16. The method according to claim 10, wherein: The laser beam moves at a speed within a range of greater than or equal to 50 mm / s and less than or equal to 6000 mm / s.

17. The method according to claim 10, wherein: The laser beam has a power in a range of greater than or equal to 0.5 W and less than or equal to 30 W.

18. The method according to claim 10, wherein: The laser beam has a frequency in a range of greater than or equal to 100 kHz and less than or equal to 20000 kHz.

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