An adsorption carrier

Abstract

The present invention discloses an adsorption carrier for securing materials, comprising a light-transmitting portion, the outer wall of which is provided with a fixing groove for accommodating the material, and the bottom inner wall of the fixing groove is provided with a plurality of adsorption holes for applying negative pressure suction to the material. The plurality of adsorption holes are arranged around the edge of the bottom inner wall of the fixing groove, with one end of the adsorption hole connected to the fixing groove and the other end connected to the outside world, and the adsorption holes are used to apply negative pressure suction to the material. Ultraviolet LED chips are adsorbed through the light-transmitting portion, thereby reducing the loss of good ultraviolet LED chips.

Description

Technical Field

[0001] The present invention relates to the field of adsorption technology, and in particular to an adsorption carrier. Background Art

[0002] Ultraviolet LEDs (UV LEDs) are primarily used in biomedicine, anti-counterfeiting and identification, purification (water, air, etc.), computer data storage, and military applications. Furthermore, as technology advances, new applications will continue to emerge, replacing existing technologies and products. UV LEDs have broad market application prospects. For example, UV LED phototherapy devices are expected to be very popular medical devices in the future.

[0003] Due to light absorption by the blue film, optical characteristics (such as WLPLOP HW) cannot be collected during the COT test during UVC LED production. Only characteristic values from the COW test can be obtained. In the UVC LED COW flip-chip tester, the adsorption stage must both secure the chip and prevent it from moving while allowing light to pass through.

[0004] At present, there is an adsorption carrier on the market, which includes a platform body with a through hole in the middle of the platform body for light transmission. A plurality of fixing parts for supporting ultraviolet LED chips are arranged in the through hole. The fixing part is provided with adsorption holes for adsorbing ultraviolet LED chips. Such fixing parts and the platform body are generally made of cast iron. Since the fixing part is made of opaque material, it will block light. When testing data, the part corresponding to the fixing part in the data has no optical data due to the distance from the light blocking. When sorting good products, the part of the ultraviolet LED chip that lacks optical data is mistakenly judged as defective products, resulting in the loss of some good ultraviolet LED chips. Summary of the Invention

[0005] In view of this, it is necessary to provide an adsorption carrier to solve the technical problem in the prior art that the adsorption carrier blocks light and causes loss of ultraviolet LED chips.

[0006] In order to achieve the above-mentioned technical purpose, the technical solution of the present invention provides an adsorption platform for fixing materials, which is characterized in that it includes a light-transmitting part, the outer wall of the light-transmitting part is provided with a fixed groove for accommodating the material, and the bottom inner wall of the fixed groove is provided with a plurality of adsorption holes for applying negative pressure suction to the material. The plurality of adsorption holes are arranged around the edge of the bottom inner wall of the fixed groove, and one end of the adsorption hole is connected to the fixed groove, and the other end is connected to the outside world.

[0007] Furthermore, an annular cavity is provided in the light-transmitting portion, and the annular cavity is communicated with each of the adsorption holes.

[0008] Furthermore, an air extraction channel communicating with the annular cavity is provided on the outer wall of the light-transmitting portion.

[0009] Furthermore, it is used to fix the ultraviolet LED chip, characterized in that the fixing groove matches the shape of the ultraviolet LED chip.

[0010] Furthermore, the light-transmitting portion includes a first light-transmitting block, one side of the first light-transmitting block is provided with the fixing groove, and the other side of the first light-transmitting block is provided with an annular groove, and the annular groove is connected to each of the adsorption holes.

[0011] Furthermore, a connecting groove is provided on the other side of the first light-transmitting block, and the connecting groove is connected to the annular groove. The light-transmitting part also includes a second light-transmitting block, and the second light-transmitting block is connected to the other side of the first light-transmitting block. The outer wall of the second light-transmitting block and the inner wall of the annular groove together form the annular cavity, and the outer wall of the second light-transmitting block and the inner wall of the connecting groove together form the exhaust channel.

[0012] Furthermore, the other side of the first light-transmitting block is a plane, the side of the second light-transmitting block connected to the first light-transmitting block is also a plane, and the second light-transmitting block is attached to the other side of the first light-transmitting block.

[0013] Furthermore, the second light-transmitting block is sealed to the other side of the first light-transmitting block.

[0014] Furthermore, the plurality of adsorption holes are arranged parallel to each other.

[0015] Furthermore, the annular cavity is arranged around the edge of the bottom inner wall of the fixing groove.

[0016] Compared with the prior art, the beneficial effects of the present invention include: placing the ultraviolet LED chip to be tested in a fixed groove, then connecting the air inlet end of the vacuum device with the adsorption hole, starting the vacuum device, and under the action of the vacuum device, the air in the adsorption hole is extracted, so that the ultraviolet LED chip is fixed in the fixed groove under the action of the negative pressure suction of the adsorption hole, and then placing the adsorption carrier containing the ultraviolet LED chip on a UVC LED COW flip chip testing machine for COW testing, and according to the COW test, the unqualified area of the ultraviolet LED chip is found, and the ultraviolet LED chip is supported by the light-transmitting part to avoid the components supporting the ultraviolet LED chip blocking the light. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a perspective view of a first embodiment of the adsorption carrier according to the present invention;

[0018] Figure 2 1 is a schematic structural diagram of a first embodiment of the adsorption carrier according to the present invention;

[0019] Figure 3 is a cross-sectional view of a first embodiment of the adsorption carrier according to the present invention;

[0020] Figure 4 is a cross-sectional view of a second embodiment of the adsorption carrier according to the present invention;

[0021] Figure 5 yes Figure 4 A local enlarged schematic diagram of point A in the middle. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, and are not used to limit the scope of the present invention.

[0023] The present invention provides an adsorption carrier for fixing materials, such as Figures 1 to 5 As shown, it includes a light-transmitting portion 1, the outer wall of the light-transmitting portion 1 is provided with a fixed groove 2 for accommodating materials, and the bottom inner wall of the fixed groove 2 is provided with a plurality of adsorption holes 3 for applying negative pressure suction to the materials. The plurality of adsorption holes 3 are arranged around the edge of the bottom inner wall of the fixed groove 2, and one end of the adsorption hole 3 is connected to the fixed groove, and the other end is connected to the outside world.

[0024] The number of the adsorption holes 3 may be three, four, five, six, seven, eight, etc. The number of the adsorption holes 3 may be set as needed.

[0025] Since there is air at the position of the adsorption hole 3, its refractive index is 1, while the refractive index of the glass is 1.47. The two refractive indices are different. When the adsorption hole 3 is set at the center of the ultraviolet LED chip, due to the difference in the refractive index of the light-emitting medium, under the same point measurement setting, the brightness refractive index of the adsorption hole 3 and the flat glass is greatly different. As a result, when finally sorting good products, the brightness ratio of the LED chip at the adsorption hole 3 is inaccurate due to inconsistent standards of optical data.

[0026] By setting the adsorption hole 3 around the edge of the bottom inner wall of the fixing groove 2, the adsorption hole 3 is relative to the edge of the ultraviolet LED chip, and the edge part of the ultraviolet LED chip is the part that needs to be removed later, and its quality does not interfere with the test of the ultraviolet LED chip, thereby avoiding the adsorption hole 3 interfering with the test of the ultraviolet LED chip.

[0027] In this embodiment, an annular cavity 4 is defined in the light-transmitting portion 1 , and the annular cavity 4 is communicated with each of the adsorption holes 3 .

[0028] By setting the annular cavity 4, the annular cavity 4 is connected to each adsorption hole 3. When vacuuming is performed through the adsorption hole 3 later, the air inlet end of the vacuuming device can be connected to the annular cavity 4 without being connected to each adsorption hole 3.

[0029] In this embodiment, an air extraction channel 5 communicating with the annular cavity 4 is further defined on the outer wall of the light-transmitting portion 1 .

[0030] By providing the air extraction channel 5, the annular cavity 4 is connected to the air inlet end of the vacuum extraction device.

[0031] In this embodiment, the adsorption carrier is used to fix the UV LED chip, and the fixing groove 2 matches the shape of the UV LED chip.

[0032] By matching the shape of the fixing groove 2 with that of the ultraviolet LED chip, when the ultraviolet LED chip is inserted into the fixing groove 2 , the ultraviolet LED chip is fixed relative to the fixing groove 2 .

[0033] The light-transmitting portion 1 may be formed by processing a piece of integral material, or may be formed by combining a plurality of blocks.

[0034] In this embodiment, the light-transmitting portion 1 includes a first light-transmitting block 11 . A fixing groove 2 is defined on one side of the first light-transmitting block 11 , and an annular groove is defined on the other side. The annular groove is connected to each adsorption hole 3 .

[0035] The first light-transmitting portion 1 may be in a square, circular shape, etc. In this embodiment, the first light-transmitting portion 1 is circular, but the shape of the first light-transmitting portion 1 is not limited thereto.

[0036] In this embodiment, a connecting groove is further provided on the other side of the first light-transmitting block 11, and the connecting groove is connected to the annular groove. The light-transmitting portion 1 also includes a second light-transmitting block 12, and the second light-transmitting block 12 is connected to the other side of the first light-transmitting block 11. The outer wall of the second light-transmitting block 12 and the inner wall of the annular groove together form an annular cavity 4, and the outer wall of the second light-transmitting block 12 and the inner wall of the connecting groove together form an exhaust channel 5.

[0037] When processing the first light-transmitting block 11, a fixing groove 2 is processed on one side of the first light-transmitting block 11, and then an adsorption hole 3 is processed on the bottom inner wall of the fixing groove 2, and an annular groove and a connecting groove are processed on the other side of the first light-transmitting block 11. By dividing the light-transmitting part 1 into the first light-transmitting block 11 and the second light-transmitting block 12, it is convenient to process the annular groove and the connecting groove.

[0038] In this embodiment, the other side of the first light-transmitting block 11 is a plane, the side of the second light-transmitting block 12 connected to the first light-transmitting block 11 is also a plane, and the second light-transmitting block 12 is attached to the other side of the first light-transmitting block 11 .

[0039] By setting the contact surface of the first light-transmitting block 11 and the second light-transmitting block 12 to be a plane, a gap between the first light-transmitting block 11 and the second light-transmitting block 12 can be avoided, so that the first light-transmitting block 11 and the second light-transmitting block 12 can fit perfectly.

[0040] In this embodiment, the second light-transmitting block 12 is sealed to the other side of the first light-transmitting block 11 .

[0041] By sealing the second light-transmitting block 12 with the other side of the first light-transmitting block 11, it is prevented that the outside air enters the exhaust channel 5 through the contact surface between the first light-transmitting block 11 and the second light-transmitting block 12 during vacuuming, thereby avoiding affecting the vacuuming of the vacuuming device.

[0042] The second light-transmitting portion 1 may be in a square, circular shape, etc. In this embodiment, the second light-transmitting portion 1 is circular, but the shape of the second light-transmitting portion 1 is not limited thereto.

[0043] Among them, the second light-transmitting block 12 and the first light-transmitting block 11 can be connected by electrostatic adsorption or by glue. In this embodiment, the second light-transmitting block 12 and the first light-transmitting block 11 are precisely matched by abutment, and the connection between the second light-transmitting block 12 and the first light-transmitting block 11 is achieved by applying adhesive on the outer walls of the second light-transmitting block 12 and the first light-transmitting block 11. The exhaust channel 5 is staggered when connecting with the adhesive.

[0044] In this embodiment, the plurality of adsorption holes 3 are arranged parallel to each other.

[0045] In this embodiment, the annular cavity 4 is disposed around the edge of the bottom inner wall of the fixing groove 2 .

[0046] Among them, the material of the light-transmitting part 1, the first light-transmitting block 11, and the second light-transmitting block 12 can be glass, polymethyl methacrylate, OZ-1000 resin, KT-153 spirane resin, TS series optical materials, MH resin, APO resin and TS26 resin, etc. In this embodiment, the material of the light-transmitting part 1, the first light-transmitting block 11, and the second light-transmitting block 12 is transparent glass.

[0047] By setting the ultraviolet LED chip to be a light-transmitting material, it is prevented that the light-transmitting portion 1 hinders the transmission of light.

[0048] By setting the material of the light-transmitting portion 1 to glass, the glass has good light transmittance and sufficient hardness, which can support the ultraviolet LED chip while preventing the light-transmitting portion 1 from hindering the transmission of light.

[0049] By setting the material of the light-transmitting portion 1 to glass, a plurality of adsorption holes 3 with smaller diameters can be opened on the glass, and the adsorption holes 3 with smaller diameters are set at the bottom edge of the fixing groove 2, thereby preventing the adsorption holes 3 from interfering with the test.

[0050] The specific working process of the present invention is as follows: the ultraviolet LED chip is a disc-shaped part with chamfered edges on one side. The ultraviolet LED chip to be tested is placed in a fixing groove 2 whose shape matches the ultraviolet LED chip. After the ultraviolet LED chip is placed in the fixing groove 2, the positioning of the ultraviolet LED chip is achieved. Then the air inlet end of the vacuum pumping device is connected to the exhaust channel 5, and the vacuum pumping device is started. Under the action of the vacuum pumping device, the air in the exhaust channel 5, the annular cavity 4 and the adsorption hole 3 is extracted, so that the ultraviolet LED chip is fixed in the fixing groove 2 under the action of the negative pressure suction of the adsorption hole 3. Then the adsorption carrier containing the ultraviolet LED chip is placed on the UVC LEDCOW flip chip testing machine for COW test, and the unqualified areas of the ultraviolet LED chip are found according to the COW test.

[0051] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed by the present invention should be covered by the scope of protection of the present invention.

Claims

1. An adsorption carrier for fixing materials, characterized in that: Used to fix the ultraviolet LED chip, comprising a light-transmitting portion, wherein the outer wall of the light-transmitting portion is provided with a fixing groove for accommodating the material, and the bottom inner wall of the fixing groove is provided with a plurality of adsorption holes for applying negative pressure suction to the material, wherein the plurality of adsorption holes are arranged around the edge of the bottom inner wall of the fixing groove, the adsorption holes are arranged relative to the edge of the ultraviolet LED chip, and one end of the adsorption hole is connected to the fixing groove and the other end is connected to the outside world; The edge portion of the ultraviolet LED chip is the portion that needs to be removed later.

2. The adsorption platform according to claim 1, characterized in that: An annular cavity is provided in the light-transmitting portion, and the annular cavity is communicated with each of the adsorption holes.

3. The adsorption platform according to claim 2, characterized in that: The outer wall of the light-transmitting portion is further provided with an air extraction channel connected to the annular cavity.

4. The adsorption platform according to any one of claims 1 to 3, characterized in that: The fixing groove matches the shape of the ultraviolet LED chip.

5. The adsorption platform according to claim 3, characterized in that: The light-transmitting portion includes a first light-transmitting block. The fixing groove is formed on one side of the first light-transmitting block, and an annular groove is formed on the other side of the first light-transmitting block. The annular groove is communicated with each of the adsorption holes.

6. The adsorption platform according to claim 5, characterized in that: A connecting groove is also provided on the other side of the first light-transmitting block, and the connecting groove is connected to the annular groove. The light-transmitting part also includes a second light-transmitting block, and the second light-transmitting block is connected to the other side of the first light-transmitting block. The outer wall of the second light-transmitting block and the inner wall of the annular groove together form the annular cavity, and the outer wall of the second light-transmitting block and the inner wall of the connecting groove together form the exhaust channel.

7. The adsorption platform according to claim 6, characterized in that: The other side of the first light-transmitting block is a plane, the side of the second light-transmitting block connected to the first light-transmitting block is also a plane, and the second light-transmitting block is attached to the other side of the first light-transmitting block.

8. The adsorption platform according to claim 7, characterized in that: The second light-transmitting block is sealed and connected to the other side of the first light-transmitting block.

9. The adsorption platform according to claim 1, characterized in that: The plurality of adsorption holes are arranged parallel to each other.

10. The adsorption carrier according to claim 6, characterized in that: The annular cavity is arranged around the edge of the bottom inner wall of the fixing groove.

Images