An adsorption type chip transfer device and a chip repair equipment

Abstract

The present invention discloses an adsorption type chip transfer device, which comprises a substrate, a sliding plate, a driving assembly, a movable seat, a suction rod, a suction nozzle and an elastic member. The sliding plate is longitudinally slidably arranged on the substrate, and the driving assembly drives the sliding plate to move. The movable seat is longitudinally slidably arranged on the sliding plate. The suction rod is installed on the movable seat, and the suction rod is connected to a vacuum generator. The suction nozzle is connected to the lower end of the suction rod. The elastic member is longitudinally telescopically arranged between the sliding plate and the movable seat, and the movable seat abuts against the upper end of the elastic member, so that the movable seat floats on the sliding plate. The adsorption type chip transfer device of the present invention plays a buffering role for the chip when adsorbing the chip, effectively overcomes the situation that the chip is damaged due to excessive pressure during the process of sucking the chip, and realizes the lossless transfer of the chip. The present invention also discloses a chip repair device with the adsorption type chip transfer device.

Description

Technical Field

[0001] The present invention relates to the technical field of chip transfer, and in particular, to an adsorption type chip transfer device and a chip repair device. Background Art

[0002] During the repair process of GBA chips, a chip repair device is usually used for operation, which is mainly responsible for desoldering, mounting and soldering the chips. When mounting a chip, the suction nozzle moves downward and contacts the chip, and then the chip is adsorbed by the suction nozzle and transferred to the position to be soldered on the circuit board. In this process, if the downward stroke of the suction nozzle is not properly controlled, the suction nozzle will apply a large pressure to the chip, which easily causes the chip to be damaged due to excessive pressure.

[0003] Therefore, in the technical field of chip repair, how to achieve damage-free transfer of chips has become an urgent problem to be solved in this field. Summary of the Invention

[0004] Based on this, it is necessary to provide an adsorption type chip transfer device that can buffer the chip;

[0005] It is also necessary to provide a chip repair device with the adsorption type chip transfer device.

[0006] The technical solution adopted by the present invention to solve its technical problems is: an adsorption type chip transfer device, including a substrate, a sliding plate, a driving component, a movable seat, a suction rod, a suction nozzle and an elastic member. The sliding plate is longitudinally slidably arranged on the substrate, the driving component drives the sliding plate to move, the movable seat is longitudinally relatively slidably arranged on the sliding plate, the suction rod is installed on the movable seat, the suction rod is connected to a vacuum generator, the suction nozzle is connected to the lower end of the suction rod, the elastic member is longitudinally telescopically arranged between the sliding plate and the movable seat, and the movable seat abuts against the upper end of the elastic member, so that the movable seat floats on the sliding plate.

[0007] Further, a support block is connected to the sliding plate, a abutting block is correspondingly connected to the movable seat for the support block, the lower end of the elastic member abuts against the support block, and the abutting block abuts against the upper end of the elastic member.

[0008] Further, a guiding column is fixedly connected to the upper end surface of the support block, the guiding column slidably penetrates through the abutting block, and the elastic member is a spring, and the spring is sleeved outside the guiding column.

[0009] Further, a dual-axis motor is installed on the movable seat. The output shaft of the dual-axis motor is a hollow tubular structure. The lower end of the output shaft of the dual-axis motor is connected to the upper end of the suction rod through a coupling, and the upper end of the output shaft of the dual-axis motor is connected to the vacuum generator through a rotary joint. The use of a precision suction rod directly connected to a hollow motor improves the verticality of the suction rod and enhances the suction force to meet the picking and placement of large-size BGA chips.

[0010] Further, the movable seat includes a connecting seat, a first fixed seat and a second fixed seat oppositely arranged on the connecting seat. The connecting seat is slidably connected to the sliding plate. The first fixed seat and the second fixed seat are both perpendicular to the connecting seat, and the suction rod rotatably passes through the first fixed seat and the second fixed seat.

[0011] Further, the driving assembly includes a driving motor, a driving pulley, a driven pulley and a transmission belt. The driving motor is fixedly installed on one side of the substrate relative to the sliding plate. The driving pulley and the driven pulley are both rotatably connected to the substrate. The output shaft of the driving motor is connected to the driving pulley. The transmission belt is sleeved outside the driving pulley and the driven pulley at the same time, and one side of the transmission belt is fixedly connected to the sliding plate.

[0012] Further, the adsorption type chip transfer device further includes a photoelectric switch and a controller. The photoelectric switch includes a transmitter installed on the sliding plate and a receiver installed on the movable seat. The receiver and the vacuum generator are both electrically connected to the controller.

[0013] A chip repair device, which includes the adsorption type chip transfer device described in any one of the foregoing items.

[0014] Further, the chip repair device further includes a carrier mechanism for placing chips, and the adsorption type chip transfer device is movably arranged above the carrier mechanism.

[0015] Further, the chip repair device further includes a machine table. The carrier mechanism is arranged on the machine table. A longitudinal beam is fixedly installed on the machine table. A cross beam is slidably installed on the longitudinal beam. The cross beam and the longitudinal beam are perpendicular to each other. A movable plate is slidably installed on the cross beam. The substrate is fixedly connected to the movable plate.

[0016] The beneficial effects of the present invention are as follows: The adsorption type chip transfer device or chip repair equipment provided by the present invention has a compact structure and ingenious design. The suction nozzle can be suspended at a certain height. When the movable seat moves downward and the suction nozzle presses against the chip, the elastic member gradually resets, thus playing a good buffering role, greatly reducing the acting force of the movable seat on the chip, effectively overcoming the situation that the chip is damaged due to excessive pressure during the chip suction process, and realizing the damage-free transfer of the chip. Especially for the mounting of small-size chips, the pressure generated on their surfaces is greater and the potential hazards are greater. Applying the adsorption type chip transfer device or chip repair equipment of the present invention can improve the reliability during use.

[0017] The present invention also provides a desoldering heating mechanism with high desoldering efficiency and capable of timely sucking chips, a heating device with the desoldering heating mechanism, and a chip repair equipment with the heating device.

[0018] The technical solution adopted by the present invention to solve its technical problems is as follows: A desoldering heating mechanism includes a fixing plate, a sliding plate, a sliding plate driving member, a heating module, a suction rod, and a suction rod driving member. The sliding plate is longitudinally slidably arranged on the fixing plate, the driving plate driving member drives the sliding plate to move, the heating module is fixedly installed on the sliding plate, the suction rod is connected to a vacuum generator and is longitudinally slidably arranged on the sliding plate. The heating module includes a housing installed on the sliding plate, a blower arranged on the top of the housing, and a heater arranged inside the housing. An opening is formed at the bottom of the housing, and the suction rod is movably penetrated through the opening under the drive of the suction rod driving member.

[0019] Further, the housing is in a boxed structure, there are multiple blowers, and the multiple blowers are evenly distributed on opposite sides of the suction rod. Multiple air inlets are formed at the top of the housing, and one blower is correspondingly connected to one air inlet.

[0020] Further, a heat insulation plate is arranged above the heater inside the housing, and multiple evenly distributed air guiding grooves are formed on the heat insulation plate.

[0021] Further, the heater is a ceramic heater.

[0022] Further, the suction rod driving member includes a suction rod motor fixedly connected to the sliding plate and a sliding block longitudinally slidably arranged on the sliding plate. The output shaft of the suction rod motor is a screw rod and is in threaded connection with the sliding block, and the suction rod is connected to the sliding block.

[0023] A heating device, the heating device includes the desoldering heating mechanism described in any one of the foregoing, the heating device further includes a bottom heating mechanism and a local heating mechanism, the desoldering heating mechanism, the local heating mechanism and the bottom heating mechanism are arranged in sequence from top to bottom, and the circuit board to be heated is located between the desoldering heating mechanism and the local heating mechanism, and the local heating mechanism moves synchronously with the desoldering heating mechanism.

[0024] A chip rework device, the chip rework device includes the heating device described above, the chip rework device further includes a machine table, the bottom heating mechanism is fixedly installed on the machine table, the desoldering heating mechanism and the local heating mechanism are movably arranged above the machine table, a longitudinal beam is fixedly installed on the machine table, a cross beam is slidably installed on the longitudinal beam, the cross beam and the longitudinal beam are perpendicular to each other, and a movable plate is slidably installed on the cross beam, and the fixed plate is fixedly installed on the movable plate.

[0025] Further, the local heating mechanism includes an air outlet cavity, a connecting pipe and a cylindrical heater communicated between the air outlet cavity and the connecting pipe. A plurality of air outlet holes are opened at the top of the air outlet cavity. The air outlet cavity corresponds to the housing. The connecting pipe is connected to the movable plate through the connecting arm, and the connecting pipe is communicated with the air source.

[0026] Further, the chip rework device further includes a carrier mechanism for placing chips and an adsorption type chip transfer device. The carrier mechanism is installed on the machine table, and the adsorption type chip transfer device is movably arranged above the carrier mechanism.

[0027] The beneficial effects of the present invention are: the desoldering heating mechanism, the heating device or the chip rework device provided by the present invention is equipped with a separate suction rod to suck the desoldered chip during desoldering. When the heating module completes the desoldering work, the suction rod can descend in time and suck the chip, which speeds up the desoldering process, improves the desoldering efficiency, and ensures the effect of sucking the chip.

[0028] The present invention also provides a carrier mechanism that can prevent the PCB circuit board from collapsing and deforming and is convenient for installation and operation, and a chip rework device with the carrier mechanism.

[0029] The technical solution adopted by the present invention to solve its technical problems is as follows: A stage mechanism is installed on a machine table. The stage mechanism includes a sliding seat slidably disposed on the machine table, a frame rotatably mounted on the sliding seat, and a support plate and a support rod slidably disposed on the frame. A side pressing member is installed on the support plate, and a supporting member is installed on the support rod. The side pressing member abuts against the upper end surface of the circuit board, and the supporting member abuts against the lower end surface of the circuit board. An expansion member is provided between the sliding seat and the frame. One end of the expansion member is hinged to the sliding seat, and the other end of the expansion member is hinged to the frame. A positioning seat is provided on the machine table on the sliding path of the sliding seat, and the frame is detachably connected to the positioning seat.

[0030] Further, a positioning hole is formed at the top of the positioning seat, and a positioning post protrudes from the bottom of the frame. The positioning post is detachably inserted into the positioning hole.

[0031] Further, there are two support plates. The two support plates are arranged oppositely. Strip-shaped notches are formed on the opposite side walls of the two support plates. The two notches together form an installation slot for placing the circuit board.

[0032] Further, the side pressing member includes a side pressing plate and a side pressing bolt. The side pressing plate is connected to the support plate. The side pressing bolt passes through the side pressing plate and is threadedly connected to the side pressing plate. The lower end of the side pressing bolt abuts against the upper end surface of the circuit board.

[0033] Further, a plurality of auxiliary supporting members are installed on the support plate. The auxiliary supporting member includes a bent rod and a positioning disk. The positioning disk is connected to one end of the bent rod. A waist-shaped slot is formed on the bent rod. A locking bolt is connected to the support plate. The locking bolt passes through the waist-shaped slot and can slide along the waist-shaped slot.

[0034] Further, the supporting member includes a slider, a thimble, and an elastic member. The slider is slidably disposed on the support rod. The thimble is slidably disposed on the slider in the longitudinal direction. The elastic member is telescopically disposed between the slider and the thimble.

[0035] Further, a receiving groove is formed on the slider. The thimble is slidably disposed in the receiving groove. A stepped surface is provided on the outer side wall of the thimble. The upper end of the elastic member elastically abuts against the stepped surface, and the lower end of the elastic member elastically abuts against the bottom wall of the receiving groove.

[0036] Further, a locking bolt is installed on the side wall of the slider. One end of the locking bolt can squeeze and fix the thimble. A fixing bolt is also installed on the side wall of the slider. One end of the fixing bolt can squeeze the side wall of the support rod.

[0037] A chip repair device, the chip repair device includes the stage mechanism described in any one of the foregoing.

[0038] Further, the chip repair device further includes an adsorption type chip transfer device, and the adsorption type chip transfer device is movably disposed above the stage mechanism.

[0039] The beneficial effects of the present invention are as follows: The stage mechanism or the chip repair device provided by the present invention presses the circuit board between the side pressing member and the supporting member, so as to realize the loading and fixing effect on the circuit board. At the same time, it can effectively avoid the collapse and deformation of the circuit board during the heating process. Moreover, when installing the circuit board, the angle and position of the circuit board can be adjusted, which is convenient for the installation operation and greatly improves the loading efficiency and loading quality of the circuit board. Description of the Drawings

[0040] The present invention will be further described below in conjunction with the drawings and embodiments.

[0041] Figure 1 is a perspective view of the chip repair device according to Embodiment 1 of the present invention;

[0042] Figure 2 is Figure 1 another perspective view of the shown chip repair device (the control cabinet, the protective housing and the protective cover are omitted);

[0043] Figure 3 is Figure 2 another perspective view of;

[0044] Figure 4 is Figure 1 a perspective view of the stage mechanism in the shown chip repair device;

[0045] Figure 5 is Figure 4 another perspective view of the shown stage mechanism (some auxiliary support members are omitted);

[0046] Figure 6 is Figure 5 a partial enlarged view of part A in the shown stage mechanism;

[0047] Figure 7 is Figure 5 a top view of the shown stage mechanism;

[0048] Figure 8 is Figure 7 a partial enlarged view of part B in the shown stage mechanism;

[0049] Figure 9 is Figure 8 a cross-sectional view along C-C in;

[0050] Figure 10 is Figure 8 A sectional view taken along D-D in the figure;

[0051] Figure 11 is Figure 4 A perspective view of another state of the shown stage mechanism;

[0052] Figure 12 is Figure 2 A perspective view of the adsorption-type chip transfer device in the shown chip repair equipment;

[0053] Figure 13 is Figure 12 A perspective view of another angle of the shown adsorption-type chip transfer device;

[0054] Figure 14 is Figure 2 A partial exploded view of the bottom heating mechanism in the shown chip repair equipment;

[0055] Figure 15 is Figure 2 A perspective view of the desoldering heating mechanism in the shown chip repair equipment;

[0056] Figure 16 is Figure 15 A perspective view of another angle of the shown desoldering heating mechanism;

[0057] Figure 17 is Figure 2 A perspective view of the local heating mechanism in the shown chip repair equipment;

[0058] Figure 18 It is a partial structural schematic diagram of the desoldering heating mechanism in the chip repair equipment of the second embodiment of the present invention.

[0059] The names and numbers of the components in the figure are as follows:

[0060] Machine table 10, Slide rail 11, Longitudinal beam 12

[0061] Cross beam 13, Movable plate 14, Protective housing 15

[0062] Bracket 16, Guide rod 161, Guide block 162

[0063] Stage mechanism 20, Slide 21, Frame 22

[0064] Positioning post 221, Support rail 222, Bracket handle 223

[0065] Support plate 23, Side pressing member 231, Side pressing plate 2311

[0066] Side pressing bolt 2312, Auxiliary support member 232, Bending rod 2321

[0067] Positioning plate 2322, waist-shaped groove 2323, locking bolt 2324

[0068] Missing groove 233, support rod 24, support member 241

[0069] Slider 2411, ejector pin 2412, elastic member 2413

[0070] Receiving groove 2414, snap ring 2415, locking bolt 2416

[0071] Fixed bolt 2417, telescopic member 25, positioning seat 26

[0072] Positioning hole 261, adsorption type chip transfer device 30, substrate 31

[0073] Slide plate 32, support block 321, drive assembly 33

[0074] Drive motor 331, driving pulley 332, driven pulley 333

[0075] Drive belt 334, movable seat 34, connecting seat 341

[0076] First fixing seat 342, second fixing seat 343, abutting block 344

[0077] Suction rod 35, suction nozzle 36, elastic member 37

[0078] Biaxial motor 38, coupling 381, adapter 382

[0079] Photoelectric sensor 391, baffle 392, heating device 40

[0080] Bottom heating mechanism 41, heating housing 411, heating element 412

[0081] Protective net 413, desoldering heating mechanism 42, fixing plate 421

[0082] Sliding plate 422, sliding plate driving member 423, heating module 424

[0083] Housing 4241, fan 4242, heater 4243

[0084] Opening 4244, air inlet 4245, heat insulation plate 4246

[0085] Air guide groove 4247, suction rod 425, suction rod driving member 426

[0086] Suction rod motor 4261, sliding block 4262, local heating mechanism 43

[0087] Air outlet cavity 431, air outlet hole 4311, connecting pipe 432

[0088] Cartridge heaters 433, 4249, protective covers 50, cooling modules 60

[0089] Control cabinet 70, display panel 80, hot air mixing chamber 4248

[0090] Hot air nozzles 4250, air pipe connectors 4251, temperature sensors 4252 Detailed implementation manners

[0091] The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basic structure of the present invention in a schematic manner. Therefore, it only shows the components related to the present invention.

[0092] Embodiment 1

[0093] Please refer to Figure 1 、 Figure 2 The present invention provides a chip rework device for desoldering, transferring, and soldering chips. The chip rework device includes a machine table 10, a stage mechanism 20 disposed on the machine table 10 for placing chips, a suction chip transfer device 30 movably disposed above the stage mechanism 20, and a heating device 40 installed on the machine table 10. Among them, the stage mechanism 20 is used for loading and fixing a circuit board, the suction chip transfer device 30 is used for transferring the chip to the mounting position of the circuit board, and the heating device 40 is used for heating the circuit board to facilitate desoldering and soldering.

[0094] Please refer to Figure 4 The stage mechanism 20 includes a slide 21 slidably disposed on the machine table 10, a frame 22 rotatably mounted on the slide 21, and a support plate 23 and a support rod 24 slidably disposed on the frame 22. A side pressing member 231 is installed on the support plate 23, and a support member 241 is installed on the support rod 24. The side pressing member 231 is used to abut against the upper end surface of the circuit board, and the support member 241 is used to abut against the lower end surface of the circuit board. An expansion member 25 is provided between the slide 21 and the frame 22. One end of the expansion member 25 is hinged to the slide 21, and the other end of the expansion member 25 is hinged to the frame 22. A positioning seat 26 is provided on the machine table 10 on the sliding path of the slide 21, and the frame 22 is detachably connected to the positioning seat 26.

[0095] When the circuit board to be repaired is installed on the frame 22, the circuit board is squeezed between the side pressing member 231 and the supporting member 241, so as to realize the loading and fixing function of the circuit board. At the same time, it can effectively prevent the circuit board from collapsing and deforming during the heating process. When the frame 22 is flipped relative to the sliding seat 21, the telescopic member 25 is stretched, so that one side of the frame 22 is lifted and locked at a certain angular position. At the same time, by sliding the sliding seat 21, the frame 22 together with the circuit board thereon is pulled out to one side of the machine table 10, which is convenient for the user to adjust the installation position of the circuit board. After the position of the circuit board is adjusted, the sliding seat 21 and the frame 22 are reset, and the frame 22 is locked on the positioning seat 26, which can effectively prevent the circuit board from moving during the repair process. The above operations are simple and convenient, greatly improving the loading efficiency and loading quality of the circuit board.

[0096] Please refer to Figure 1 、 Figure 4 In this embodiment, a sliding seat guide rail 11 is installed on the machine table 10, and the sliding seat 21 is slidably connected to the sliding seat guide rail 11 to realize the slidable connection relationship between the sliding seat 21 and the machine table 10. In addition, there are two sliding seat guide rails 11 and two sliding seats 21, and one sliding seat 21 corresponds to one sliding seat guide rail 11. The two opposite sides of the frame 22 are respectively rotatably connected to the two sliding seats 21, thereby improving the sliding stability of the sliding seat 21 and the flipping stability of the frame 22.

[0097] Please refer to Figure 11 In order to realize the connection between the frame 22 and the positioning seat 26, a positioning hole 261 is opened at the top of the positioning seat 26, and a positioning column 221 protrudes from the bottom of the frame 22. The positioning column 221 is detachably inserted into the positioning hole 261. When the positioning column 221 is inserted into the positioning hole 261, the frame 22 and the positioning seat 26 are in a locked state, and the sliding seat 21 cannot slide relative to the machine table 10; when the frame 22 is flipped upward relative to the sliding seat 21, the positioning column 221 is separated from the positioning hole 261, and the locked state between the frame 22 and the positioning seat 26 is released. At this time, the user can slide the sliding seat 21 relative to the machine table 10 to drive the frame 22 to move together. It can be understood that in other embodiments not shown, the frame 22 and the positioning seat 26 can also be connected by detachable means such as clamping and magnetic connection, which is not limited herein.

[0098] In this embodiment, the telescopic member 25 is a gas spring. After the frame 22 is flipped, the gas spring can support the frame 22 by its own damping effect, which is convenient for the user to operate. In other embodiments not shown, the telescopic member 25 can also be an inner and outer sleeve structure, that is, the outer sleeve is slidably sleeved outside the inner sleeve, and the damping effect of itself is realized by controlling the friction force between the outer sleeve and the inner sleeve. Here, the specific structure of the telescopic member 25 is not limited.

[0099] Please refer to Figure 4 、 Figure 5 and Figure 7 , there are two support plates 23, and the two support plates 23 are arranged oppositely. Strip-shaped notches 233 are formed on the opposite side walls of the two support plates 23, and the two notches 233 together form a placement groove (not marked in the figure) for placing the circuit board. During use, by sliding the support plate 23, the distance between the two support plates 23 can be changed, thereby adjusting the width of the installation groove to meet the installation requirements of circuit boards with different widths, and it has strong versatility.

[0100] Please refer to Figure 6 , the side pressing member 231 includes a side pressing plate 2311 and a side pressing bolt 2312. The side pressing plate 2311 is connected to the support plate 23, the side pressing bolt 2312 passes through the side pressing plate 2311 and is threadedly connected to the side pressing plate 2311, and the lower end of the side pressing bolt 2312 abuts against the upper end surface of the circuit board. During use, place the circuit board in the placement groove, and then rotate the side pressing bolt 2312 so that the lower end of the side pressing bolt 2312 presses against the upper end surface of the circuit board, thereby pressing and fixing the circuit board in the placement groove.

[0101] In addition, in order to adapt to the loading and fixing of circuit boards with irregular shapes, a plurality of auxiliary support members 232 are installed on the support plate 23. The auxiliary support member 232 includes a bent rod 2321 and a positioning disk 2322. The positioning disk 2322 is connected to one end of the bent rod 2321. A waist-shaped groove 2323 is formed on the bent rod 2321, and a locking bolt 2324 is connected to the support plate 23. The locking bolt 2324 passes through the waist-shaped groove 2323 and can slide along the waist-shaped groove 2323. During use, loosen the locking bolt 2324, adjust the position and angle of the bent rod 2321 until the bottom of the edge of the circuit board is lapped on the positioning disk 2322, and then the circuit board can be pressed and fixed between the side pressing bolt 2312 and the positioning disk 2322 by rotating the side pressing bolt 2312. The irregularly shaped circuit board refers to a circuit board whose edge cannot be lapped on the notch 233. In this way, by adjusting the position and angle of the auxiliary support member 232, the edge part of the circuit board that cannot be lapped on the notch 233 can be lapped on the positioning disk 2322 to facilitate the loading and fixing of the circuit board.

[0102] In this embodiment, the support member 241 includes a slider 2411, a thimble 2412, and an elastic member 2413. The slider 2411 is slidably disposed on the support rod 24. The thimble 2412 is slidably disposed on the slider 2411 in the longitudinal direction. The elastic member 2413 is telescopically disposed between the slider 2411 and the thimble 2412. During use, by sliding the slider 2411, the thimble 2412 is driven to move to the required position. The thimble 2412 abuts against the lower end surface of the circuit board under the elastic force of the elastic member 2413, providing support for the circuit board to prevent the circuit board from deforming or collapsing. At the same time, since the extension amount of the thimble 2412 can be changed, it can thus meet the support requirements of circuit boards with different thicknesses.

[0103] Specifically, please refer to Figure 6 , Figure 9 , a receiving groove 2414 is formed in the slider 2411. The thimble 2412 is slidably disposed in the receiving groove 2414. A stepped surface (not shown in the figure) is provided on the outer sidewall of the thimble 2412. The upper end of the elastic member 2413 elastically abuts against the stepped surface, and the lower end of the elastic member 2413 elastically abuts against the bottom wall of the receiving groove 2414.

[0104] In this embodiment, the elastic member 2413 is a spring sleeved outside the thimble 2412. It can be understood that in other embodiments not shown, the elastic member 2413 can also be an element with rigidity and elasticity such as a stainless steel shrapnel or a copper shrapnel, which is not limited herein.

[0105] In addition, to prevent the thimble 2412 from moving upward under the elastic force of the elastic member 2413 and thus disengaging from the receiving groove 2414 of the slider 2411, the lower end of the thimble 2412 extends downward outside the slider 2411. A snap ring 2415 is installed at the lower end of the thimble 2412. The snap ring 2415 abuts against the bottom of the slider 2411, thereby preventing the thimble 2412 from disengaging from the slider 2411.

[0106] At the same time, please refer to Figure 8 - Figure 10 , to lock the thimble 2412 to a lower position before loading and fixing the circuit board, a locking bolt 2416 is installed on the sidewall of the slider 2411. Tightening the locking bolt 2416 can cause one end of the locking bolt 2416 to press and fix the thimble 2412. When the locking bolt 2416 is loosened, the locked state of the thimble 2412 is released, and the thimble 2412 automatically moves upward under the elastic force of the elastic member 2413 and then abuts against the lower end surface of the circuit board.

[0107] In addition, a fixing bolt 2417 is also installed on the side wall of the slider 2411. Tightening the fixing bolt 2417 can cause one end of the fixing bolt 2417 to press against the side wall of the support rod 24. In this way, when the slider 2411 drives the ejector pin 2412 to slide to the required position, the slider 2411 can be fixed on the support rod 24 by tightening the fixing bolt 2417.

[0108] In other embodiments not shown, the elastic member 2413 can also be omitted. At this time, the support member 241 includes a slider 2411 slidably disposed on the support rod 24 and an ejector pin 2412 fixedly connected to the slider 2411. The ejector pin 2412 is made of a deformable material that can rebound. At this time, the ejector pin 2412 can abut against the lower end surface of the circuit board by the elastic force generated after its own deformation. It can be understood that the ejector pin 2412 is made of silica gel or rubber material.

[0109] Please refer to Figure 4 , in this embodiment, support rails 222 are installed on both opposite sides of the frame 22. The support rails 222 are perpendicular to the slide base rails 11. Both ends of the support plate 23 and both ends of the support rod 24 are slidably connected to the support rails 222 to achieve the function of adjusting the side pressing member 231 and the support member 241. A bolt (not shown in the figure) is installed on one side of the support plate 23. One end of the bolt abuts against the frame 22 to lock and fix the support plate 23 after adjusting its position. In addition, a bracket handle 223 is installed on one side of the frame 22 to facilitate the user to hold the bracket handle 223 to perform a flipping operation on the frame 22.

[0110] Please refer to Figure 12 , Figure 13 , in this embodiment, the adsorption type chip transfer device 30 includes a substrate 31, a slide plate 32, a driving assembly 33, a movable seat 34, a suction rod 35, a suction nozzle 36 and an elastic member 37. The slide plate 32 is slidably disposed on the substrate 31 in the longitudinal direction. The driving assembly 33 drives the slide plate 32 to move. The movable seat 34 is slidably disposed on the slide plate 32 in the longitudinal direction relative to each other. The suction rod 35 is installed on the movable seat 34. The suction rod 35 is connected to a vacuum generator (not shown in the figure). The suction nozzle 36 is connected to the lower end of the suction rod 35. The elastic member 37 is telescopically disposed between the slide plate 32 and the movable seat 34 along the sliding direction of the movable seat 34. The movable seat 34 abuts against the upper end of the elastic member 37, so that the movable seat 34 floats on the slide plate 32.

[0111] During use, the adsorption chip transfer device 30 is moved above the storage box containing chips placed on the machine table 10. The driving component 33 drives the slide plate 32 to move downward relative to the substrate 31, thereby driving the movable seat 34 together with the suction rod 35 and the suction nozzle 36 to move downward. When the suction nozzle 36 presses against the chip, the vacuum generator works, and a negative pressure is formed inside the suction rod 35, so that the chip is adsorbed on the suction nozzle 36. At this time, the slide plate 32 moves upward to lift the chip. Then, the integrated adsorption chip transfer device 30 is moved above the position to be soldered on the circuit board, and the movable seat 34 is lowered again, so that the chip is placed at the mounting position of the circuit board, and the vacuum generator is turned off.

[0112] In the above process, in the initial state, the elastic member 37 is compressed under the gravity of the movable seat 34. After being compressed by a certain displacement, the elastic force generated by the elastic member 37 suspends the movable seat 34, the suction rod 35 and the suction nozzle 36 at a certain height. When the movable seat 34 moves downward and the suction nozzle 36 presses against the chip, the movable seat 34 moves upward, and the elastic member 37 gradually returns to its original position. In this way, the movement of the movable seat 34 conforms to the reset trend of the elastic member 37, and the elastic member 37 plays a good buffering role, greatly reducing the force exerted by the movable seat 34 on the chip, effectively solving the problem that the chip is damaged due to excessive pressure during the process of sucking the chip.

[0113] In this embodiment, a support block 321 is vertically connected to the slide plate 32, and a abutting block 344 is correspondingly connected to the movable seat 34 for the support block 321. The lower end of the elastic member 37 abuts against the support block 321, and the abutting block 344 abuts against the upper end of the elastic member 37.

[0114] In addition, a guide post 3211 is fixedly connected to the upper end surface of the support block 321. The guide post 3211 slidably penetrates through the abutting block 344. The elastic member 37 is a spring, and the spring is sleeved outside the guide post 3211. By providing the guide post 3211, the situation that the spring bends to the side during the compression process can be effectively prevented, ensuring the stable operation of the elastic member 37. It can be understood that in other embodiments not shown, the guide post 3211 can also be omitted. At this time, the elastic member 37 can be a rigid and elastic element such as a stainless steel elastic sheet or a copper elastic sheet, which is not limited here.

[0115] In this embodiment, the driving assembly 33 includes a driving motor 331, a driving pulley 332, a driven pulley 333 and a transmission belt 334. The driving motor 331 is fixedly installed on one side of the substrate 31 opposite to the sliding plate 32. The driving pulley 332 and the driven pulley 333 are both rotatably connected to the substrate 31. The output shaft of the driving motor 331 is connected to the driving pulley 332. The transmission belt 334 is sleeved outside both the driving pulley 332 and the driven pulley 333, and one side of the transmission belt 334 is fixedly connected to the sliding plate 32. In this way, when the driving motor 331 is started, the transmission belt 334 can be driven to rotate, thereby driving the sliding plate 32 to move. In addition, the driving motor 331 is a forward and reverse motor, so as to realize the reciprocating movement of the sliding plate 32 in the longitudinal direction.

[0116] It can be understood that in other embodiments not shown, the driving assembly 33 can also be composed of a compression cylinder or a lead screw transmission mechanism, which is not limited here. The sliding between the sliding plate 32 and the substrate 31 and between the movable seat 34 and the sliding plate 32 is realized through guide rails, and the guide rail structure will not be elaborated here.

[0117] In this embodiment, a dual-axis motor 38 is installed on the movable seat 34. The output shaft of the dual-axis motor 38 is a hollow tubular structure. The lower end of the output shaft of the dual-axis motor 38 is connected to the upper end of the suction rod 35 through a coupling 381, and the upper end of the output shaft of the dual-axis motor 38 is connected to the vacuum generator through a rotary joint 382. When the suction nozzle 36 adsorbs the chip, the dual-axis motor 38 is driven to rotate, thereby driving the suction rod 35 together with the suction nozzle 36 to rotate, and thus realizing the adjustment of the chip angle, which is beneficial to accurate mounting.

[0118] The movable seat 34 includes a connecting seat 341, a first fixed seat 342 and a second fixed seat 343 oppositely arranged on the connecting seat 341. The connecting seat 341 is slidably connected to the sliding plate 32 relatively. The first fixed seat 342 and the second fixed seat 343 are both perpendicular to the connecting seat 341. The suction rod 35 rotatably penetrates through the first fixed seat 342 and the second fixed seat 343. During use, the first fixed seat 342 and the second fixed seat 343 can support the suction rod 35 to prevent the suction rod 35 from being bent due to its excessive length during the process of adsorbing the chip, ensuring the stable operation of the suction rod 35. In addition, bearings (not shown in the figure) are provided between the suction rod 35 and the first fixed seat 342 and between the suction rod 35 and the second fixed seat 343 to ensure the smooth rotation of the suction rod 35.

[0119] In this embodiment, the adsorption chip transfer device 30 further includes a photoelectric switch and a controller (not shown), wherein the photoelectric switch includes a photoelectric sensor 391 mounted on the slide plate 32 and a baffle 392 mounted on the movable seat 34, and the photoelectric sensor 391 and the vacuum generator are both electrically connected to the controller. The controller is used to control the start / stop of the vacuum generator according to the signal received by the photoelectric sensor 391.

[0120] During the specific working process, in the initial state when the chip is not adsorbed, the movable seat 34 is in a suspended state, the baffle 392 and the photoelectric sensor 391 are in a relative position, the light is blocked, and the controller cannot receive the signal of the photoelectric sensor 392. Accordingly, the controller controls the vacuum generator not to work; when the driving motor 331 drives the slide plate 32, the photoelectric sensor 391, and the movable seat 34 (because the movable seat 34 and the slide plate 32 are connected as a whole through the linear track, the slide plate 32 moves longitudinally, and correspondingly drives the movable seat 34 to move longitudinally) to move downward at the same time until the suction nozzle 36 contacts the chip, because the movable seat 34 is slidably connected to the slide plate 32 through the linear track, the two have a relative movement relationship along the longitudinal direction, and then when the suction nozzle 36 contacts the chip, it will prompt the movable seat 34 to move upward relative to the slide plate, causing the baffle 392 and the photoelectric sensor 391 to move relative to each other. The sensors 391 are staggered with each other, and there is no light shielding in the photoelectric sensor 391, and the light signal can be received. The controller receives the electrical signal converted by the photoelectric sensor 391, and then controls the vacuum generator to start and then start to absorb the chip; at the same time, the driving motor 331 stops and starts to reverse, driving the slide plate 32 to move upward; after the chip is sucked and lifted, the baffle 392 and the photoelectric sensor 391 are in a relative position again. At this time, the vacuum generator continues to work until the coordinate to be mounted, and then the driving motor 331 drives the slide plate 32 and the photoelectric sensor 391 and the movable seat 34 to move downward at the same time, so that the chip is completely in contact with the substrate pad, and then the movable seat 34 moves upward relative to the slide plate 32, so that the baffle 392 and the photoelectric sensor 391 are staggered again, and then the controller controls the vacuum generator to stop working. In this way, the automatic control of the vacuum generator during the chip absorption, transfer and mounting process is realized.

[0121] Please refer again Figure 2, To enable the adsorption chip transfer device 30 to transfer chips, a longitudinal beam 12 is fixedly installed on the machine platform 10, and a cross beam 13 is slidably installed on the longitudinal beam 12. The cross beam 13 and the longitudinal beam 12 are perpendicular to each other. A movable plate 14 is slidably installed on the cross beam 13, and the adsorption chip transfer device 30 is installed on the movable plate 14. During operation, the cross beam 13 moves along the extension direction of the longitudinal beam 12, which can drive the adsorption chip transfer device 30 to move synchronously. The movable plate 14 moves along the extension direction of the cross beam 13, which can also drive the adsorption chip transfer device 30 to move synchronously. In this way, the adsorption chip transfer device 30 can move horizontally and longitudinally, enabling the suction nozzle 36 to be accurately positioned. In this embodiment, the substrate 31 is fixedly connected to the movable plate 14.

[0122] In a specific embodiment, the driving methods for driving the longitudinal movement of the cross beam 13 and the lateral movement of the movable plate 14 are both screw drives. It can be understood that in other embodiments not shown, the movement methods of the cross beam 13 and the movable plate 14 can also be achieved by cylinder driving, which is not limited here.

[0123] In addition, please refer to Figure 1 again. To achieve aesthetics and prevent accidental touch by users, a protective housing 15 is provided outside the longitudinal beam 12.

[0124] Please refer to Figure 1 and Figure 2 again. In this embodiment, the heating device 40 includes a bottom heating mechanism 41, a desoldering heating mechanism 42, and a local heating mechanism 43. The bottom heating mechanism 41 is fixedly installed on the machine platform 10. The desoldering heating mechanism 42 and the local heating mechanism 43 are movably arranged above the machine platform 10. The desoldering heating mechanism 42, the local heating mechanism 43, and the bottom heating mechanism 41 are arranged in sequence from top to bottom. During use, the circuit board is located between the desoldering heating mechanism 42 and the local heating mechanism 43. The bottom heating mechanism 41 is used to heat the circuit board as a whole, and the desoldering heating mechanism 42 and the local heating mechanism 43 move synchronously to heat the position of the chip to be desoldered on the circuit board in a concentrated and fixed-point manner.

[0125] Please refer to Figure 14 . The bottom heating mechanism 41 includes a heating housing 411, a heating element 412 installed at the bottom of the heating housing 411, and a protective net 413 installed at the top of the heating housing 411. There are multiple heating elements 412, and the multiple heating elements 412 are evenly distributed. In this embodiment, the heating element 412 is a ceramic infrared heater. It can be understood that the heating element 412 can also be a heating sheet, a heating rod, or other elements that generate heat after being energized, which is not limited here.

[0126] Please refer to Figure 15 and Figure 16The desoldering heating mechanism 42 includes a fixed plate 421, a sliding plate 422, a sliding plate driving member 423, a heating module 424, a suction rod 425 and a suction rod driving member 426. The sliding plate 422 is slidably arranged on the fixed plate 421 along the longitudinal direction. The driving plate driving member 423 drives the sliding plate 422 to move. The heating module 424 is fixedly installed on the sliding plate 422. The suction rod 425 is connected to the vacuum generator and is slidably arranged on the sliding plate 422 along the longitudinal direction. The heating module 424 includes a shell 4241 installed on the sliding plate 422, a fan 4242 arranged on the top of the shell 4241 and a heater 4243 arranged inside the shell 4241. An opening 4244 is opened at the bottom of the shell 4241. The suction rod 425 can movably pass through the opening 4244 under the drive of the suction rod driving member 426.

[0127] During desoldering, the desoldering heating mechanism 42 is moved to the position of the chip to be desoldered, the sliding plate driving member 423 drives the sliding plate 422 to move downward and close to the chip to be desoldered, and the fan 4242 is started. The wind generated by the fan blows the heat generated by the heater 4243 to the position to be desoldered through the opening 4244. When a certain temperature is reached, the solder ball at the desoldering position melts, and the suction rod driving member 426 drives the suction rod 425 to move downward and then pass through the bottom of the shell 4241 to further absorb the chip. The desoldering heating mechanism 42 is equipped with a separate suction rod 425 to absorb the desoldering chip. When the heating module 424 completes the desoldering work, the suction rod 425 can go down in time and absorb the chip, which speeds up the desoldering process and improves work efficiency.

[0128] The housing 4241 is a box-shaped structure, and has a plurality of fans 4242, which are evenly distributed on opposite sides of the suction rod 425. The top of the housing 4241 is provided with a plurality of air inlets 4245, and one fan 4242 is correspondingly connected to one air inlet 4245. By providing two fans 4242, the uniformity of the heat of the airflow at the opening 4244 is improved, ensuring that the position of the chip to be desoldered on the circuit board is evenly heated. In this embodiment, there are two fans 4242.

[0129] Furthermore, a heat insulating plate 4246 is provided in the shell 4241 above the heater 4243, and a plurality of evenly distributed air guide grooves 4247 are provided on the heat insulating plate 4246. By providing the heat insulating plate 4246, the wind blown into the shell 4241 can be blown out from the opening 4244 as evenly as possible under the action of the air guide grooves 4247, thereby further improving the desoldering effect.

[0130] In addition, in the present embodiment, the heater 4243 is a ceramic heater. The ceramic heater distributes hot air evenly when working, has good thermal conductivity, and can ensure that the temperature of the surface to be desoldered is uniform.

[0131] In this embodiment, the sliding plate 422 and the fixed plate 421 are slidably connected through a guide rail structure, and the sliding plate driving member 423 adopts the structure of the driving assembly 33 mentioned above, that is, the motor drives the conveyor belt to move, and then drives the sliding plate 422 fixed on the conveyor belt to move. In other embodiments, the sliding plate 422 can also be driven by a cylinder driving method.

[0132] The suction rod driving member 426 adopts a screw drive structure. Specifically, the suction rod driving member 426 includes a suction rod motor 4261 fixedly connected to the sliding plate 422 and a sliding block 4262 slidably arranged on the sliding plate 422 longitudinally. The output shaft of the suction rod motor 4261 is a screw and is threadedly connected to the sliding block 4262, and the suction rod 425 is connected to the sliding block 4262. During use, the suction rod motor 4261 rotates and then drives its output shaft to rotate. Since the sliding block 4262 can only move longitudinally and cannot rotate relative to the sliding plate 422, the sliding block 4262 is forced to slide longitudinally, and then drives the suction rod 425 to move up and down longitudinally. In this embodiment, the sliding block 4262 and the sliding plate 422 are connected through a guide rail structure, so that the sliding block 4246 can only slide relative to the sliding plate 422 and cannot rotate. In addition, the suction rod motor 4261 is a forward and reverse rotation motor, so that the suction rod 425 can move up and down longitudinally.

[0133] Please refer to again Figure 2 , in this embodiment, the fixed plate 421 is fixedly installed on the movable plate 14, so that the suction rod 425 can be accurately moved to the position of the chip to be desoldered.

[0134] Please refer to Figure 3 , Figure 17 , the local heating mechanism 43 includes an air outlet cavity 431, a connecting pipe 432, and a cylindrical heater 433 communicating between the air outlet cavity 431 and the connecting pipe 432. A plurality of air outlet holes 4311 are opened at the top of the air outlet cavity 431. The air outlet cavity 431 always corresponds to the housing 4241 of the heating module 424. The connecting pipe 432 is connected to the movable plate 14 through a connecting arm 434. The connecting pipe 432 is communicated with a gas source, and the cylindrical heater 433 can generate heat after being energized. During use, the air outlet cavity 431 moves to the bottom of the chip to be desoldered, and the heat generated by the cylindrical heater 433 is blown out through the air outlet holes 4311 under the action of the gas source and acts on the chip to be desoldered, so as to realize the fixed-point heating function.

[0135] Furthermore, please refer to again Figure 3, To improve the moving stability of the local heating mechanism 43, a support 16 is connected to the upper end surface of the machine table 10. A guide rod 161 is installed on the support 16, and a guide block 162 is slidably connected to the guide rod 161. The connecting pipe 432 slidably penetrates through the guide block 162. During operation, the guide block 162 can support the connecting pipe 432 and prevent the connecting pipe 432 from being easily deformed.

[0136] Please refer to again Figure 1 , To achieve aesthetics and prevent accidental touch by the user, a protective cover 50 is provided outside the adsorption chip transfer device 30 and the desoldering heating mechanism 42.

[0137] Please refer to again Figure 2 , The chip repair equipment of the present invention further includes a cooling module 60 provided on the side of the stage mechanism 20. The cooling module 60 is used to provide a large amount of cold air to quickly cool down the circuit board. In this embodiment, the cooling module 60 is a cross-flow fan, and the cross-flow fan belongs to the prior art, so its structure will not be described in detail here.

[0138] Please refer to again Figure 2 , The chip repair equipment of the present invention further includes a control cabinet 70 and a display panel 80. The control cabinet 70 is provided at the bottom of the machine table 10, and the display panel 80 is provided on one side of the machine table 10. The display panel 80 is used to display the operation status information of the chip repair equipment.

[0139] The chip repair equipment provided by the present invention, by setting the stage mechanism 20, presses the circuit board between the side pressing member 231 and the supporting member 241, thereby realizing the loading and fixing function of the circuit board. At the same time, it can effectively avoid the collapse and deformation of the circuit board during the heating process. And when installing the circuit board, the angle and position of the circuit board can be adjusted, which is convenient for installation operation and greatly improves the loading efficiency and loading quality of the circuit board; by setting the adsorption chip transfer device 30, the suction nozzle 36 can be suspended at a certain height. When the movable seat 34 moves downward and the suction nozzle 36 presses against the chip, the elastic member 37 gradually returns to its original position, thereby playing a good buffering role, greatly reducing the force exerted by the movable seat 34 on the chip, effectively overcoming the situation that the chip is damaged due to excessive pressure during the chip suction process, and realizing the lossless transfer of the chip; in addition, a separate suction rod 425 is provided in the desoldering heating mechanism 42 to suck the desoldered chip. When the heating module 424 completes the desoldering work, the suction rod 425 can quickly move downward and suck the chip, accelerating the desoldering process and improving the work efficiency.

[0140] Embodiment 2

[0141] Please refer to Figure 18, Embodiment 2 of the present invention provides a chip rework device. The difference between this chip rework device and Embodiment 1 lies in the different structure of the desoldering heating mechanism 42 of the present invention, specifically, the structure of the heating module 424 is different.

[0142] Specifically, the heating module 424 in this embodiment includes a hot air mixing chamber 4248 installed on the sliding plate 422, a cartridge heater 4249 installed on the top of the hot air mixing chamber 4248, and a hot air nozzle 4250 installed on the bottom of the hot air mixing chamber 4248. The cartridge heater 4249 is connected to the blower through an air pipe joint 4251. During use, the air generated after the blower starts passes through the cartridge heater 4249, is heated and enters the hot air mixing chamber 4248, and then flows through the hot air nozzle 4250 to the chip part to be desoldered.

[0143] In addition, in order to realize real-time monitoring of the temperature during desoldering, a temperature sensor 4252 is installed on the side wall of the hot air mixing chamber 4248. In this embodiment, the temperature sensor 4252 is a K-type thermocouple.

[0144] The other components and connection structures not mentioned in the chip rework device of Embodiment 2 are the same as those in Embodiment 1 and will not be elaborated here.

[0145] Taking the above ideal embodiment based on the present invention as an inspiration, through the above description, relevant staff can make various changes and modifications completely within the scope not deviating from the present invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An adsorption type chip transfer device, characterized in that: it includes a substrate, a slide plate, a driving component, a movable seat, a suction rod, a suction nozzle and an elastic member. The slide plate is longitudinally slidably arranged on the substrate. The driving component drives the slide plate to move. The movable seat is longitudinally relatively slidably arranged on the slide plate. The suction rod is installed on the movable seat. The suction rod is connected to a vacuum generator. The suction nozzle is connected to the lower end of the suction rod. The elastic member is longitudinally telescopically arranged between the slide plate and the movable seat. The movable seat abuts against the upper end of the elastic member, so that the movable seat floats on the slide plate. In the initial state, the elastic member is compressed under the gravity of the movable seat. The elastic force generated after the elastic member is compressed makes the movable seat, the suction rod and the suction nozzle float. When the movable seat moves downward and the suction nozzle abuts against the chip, the movable seat moves upward and the elastic member resets.

2. The adsorption type chip transfer device according to claim 1, characterized in that: a support block is connected to the slide plate, a abutting block is correspondingly connected to the movable seat opposite the support block. The lower end of the elastic member abuts against the support block, and the abutting block abuts against the upper end of the elastic member.

3. The adsorption type chip transfer device according to claim 2, characterized in that: a guide post is fixedly connected to the upper end surface of the support block. The guide post slidably penetrates through the abutting block. The elastic member is a spring, and the spring is sleeved outside the guide post.

4. The adsorption type chip transfer device according to claim 1, characterized in that: a biaxial motor is installed on the movable seat. The output shaft of the biaxial motor is a hollow tubular structure. The lower end of the output shaft of the biaxial motor is connected to the upper end of the suction rod through a coupling. The upper end of the output shaft of the biaxial motor is connected to the vacuum generator through a rotary joint.

5. The adsorption type chip transfer device according to claim 1, characterized in that: the movable seat includes a connecting seat and a first fixing seat and a second fixing seat oppositely arranged on the connecting seat. The connecting seat is relatively slidably connected to the slide plate. The first fixing seat and the second fixing seat are both perpendicular to the connecting seat. The suction rod rotatably penetrates through the first fixing seat and the second fixing seat.

6. The adsorption type chip transfer device according to claim 1, characterized in that: the driving component includes a driving motor, a driving pulley, a driven pulley and a transmission belt. The driving motor is fixedly installed on one side of the substrate opposite the slide plate. The driving pulley and the driven pulley are both rotatably connected to the substrate. The output shaft of the driving motor is connected to the driving pulley. The transmission belt is simultaneously sleeved outside the driving pulley and the driven pulley, and one side of the transmission belt is fixedly connected to the slide plate.

7. The adsorption type chip transfer device according to any one of claims 1-6, characterized in that: The adsorption type chip transfer device further includes a photoelectric switch and a controller. The photoelectric switch includes a transmitter mounted on the sliding plate and a receiver mounted on the movable seat. The receiver and the vacuum generator are both electrically connected to the controller.

8. A chip repair device Characterized in that: The chip repair device includes the adsorption type chip transfer device according to any one of claims 1-7.

9. The chip repair device according to claim 8, Characterized in that: The chip repair device further includes a stage mechanism for placing the chip, and the adsorption type chip transfer device is movably arranged above the stage mechanism.

10. The chip repair device according to claim 9, Characterized in that: The chip repair device further includes a machine table. The stage mechanism is arranged on the machine table. A longitudinal beam is fixedly installed on the machine table. A cross beam is slidably installed on the longitudinal beam. The cross beam and the longitudinal beam are perpendicular to each other. A movable plate is slidably installed on the cross beam. The substrate is fixedly connected to the movable plate.

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