Method for manufacturing electronic component module and electronic component module

Abstract

The resin structure is not easily broken even when stress is applied to the electronic component. The manufacturing method of the electronic component module comprises a sacrificial body configuration step, a resin molding step, a recess forming step, a wiring layer forming step and a component mounting step. In the sacrificial body configuration step, a sacrificial body (15) whose size is smaller than the size of the first main surface (131) when viewed from the thickness direction of a support body (13) having a first main surface (131) and a second main surface (132) is configured on the first main surface (131). In the resin molding step, a resin structure (2) is molded on the first main surface (131) so as to cover the sacrificial body (15) configured on the first main surface (131). In the recess forming step, a recess is formed in the resin structure (2) by removing the sacrificial body (15). In the wiring layer forming step, a wiring layer is formed across the side surface of the recess and the first main surface (21) of the resin structure (2) continuous with the side surface. In the component mounting step, the electronic component is mounted in the recess.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electronic component module and an electronic component module, and more particularly, to a method for manufacturing an electronic component module including an electronic component and a resin structure and an electronic component module. Background Art

[0002] In the past, there is known a component built-in substrate (electronic component module) equipped with built-in components (for example, refer to Patent Document 1). The component built-in substrate described in Patent Document 1 includes a core substrate, an intermediate layer, and a surface layer. The core substrate, the intermediate layer, and the surface layer are each formed by stacking a plurality of resin sheets. Then, the core substrate, the intermediate layer, and the surface layer are overlapped and uniformly stacked in a state where their positions are aligned with each other. In the component built-in substrate described in Patent Document 1, a mounting component (electronic component) is arranged in an opening (recess) formed by stacking the intermediate layer and the surface layer.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-141282 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the component-embedded substrate described in Patent Document 1, for example, when stress is applied to a mounted component arranged in an opening, there is a possibility that peeling may occur at the interface between the intermediate layer and the surface layer.

[0008] An object of the present invention is to provide a method for manufacturing an electronic component module and an electronic component module in which a resin structure is unlikely to break even when stress is applied to the electronic component.

[0009] Technical solutions to solve problems

[0010] A method for manufacturing an electronic component module according to one embodiment of the present invention comprises a sacrificial body placement step, a resin molding step, a recess forming step, a wiring layer forming step, and a component mounting step. In the sacrificial body placement step, a sacrificial body whose size is smaller than the size of the first main surface when viewed from the thickness direction of a support having a first main surface and a second main surface is placed on the first main surface. In the resin molding step, a resin structure is molded on the first main surface so as to cover the sacrificial body arranged on the first main surface. In the recess forming step, a recess is formed in the resin structure by removing the sacrificial body. In the wiring layer forming step, a wiring layer is formed that spans a side surface of the recess and one main surface of the resin structure continuous with the side surface. In the component mounting step, an electronic component is mounted in the recess.

[0011] An electronic component module according to one embodiment of the present invention comprises a resin structure, an electronic component and a wiring layer. The resin structure has a main surface, and a recess is provided on the main surface. The electronic component is provided in the recess. The wiring layer is formed across the main surface and the side surface of the recess continuous with the main surface. The wiring layer is electrically connected to the electronic component.

[0012] Effects of the Invention

[0013] According to the present invention, there is an effect that the resin structure is less likely to break even when stress is applied to the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a cross-sectional view of the electronic component module according to the embodiment.

[0015] Figure 2 A~ Figure 2 C is a cross-sectional view of a process for explaining the manufacturing method of the electronic component module as above.

[0016] Figure 3 A~ Figure 3 C is a cross-sectional view of a process for explaining the manufacturing method of the electronic component module as above.

[0017] Figure 4 A~ Figure 4 D is a cross-sectional view of a process for explaining the manufacturing method of the electronic component module as above.

[0018] Figure 5 It is a cross-sectional view of a main part of an electronic component module according to Modification 1 of the embodiment.

[0019] Figure 6 It is a cross-sectional view of an electronic component module according to Modification 2 of the embodiment.

[0020] Figure 7 It is a cross-sectional view of an electronic component module according to Modification 3 of the embodiment. DETAILED DESCRIPTION

[0021] Hereinafter, an electronic component module and a method for manufacturing an electronic component module according to an embodiment will be described with reference to the accompanying drawings. Figure 1 to Figure 6 These are schematic drawings, and the sizes and thickness ratios of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0022] (Implementation Method)

[0023] (1) Overall structure of electronic component module

[0024] First, the overall structure of an electronic component module according to an embodiment will be described with reference to the drawings.

[0025] like Figure 1 As shown, the electronic component module 1 according to the embodiment includes a resin structure 2, a first electronic component 31 as an electronic component 3, and a plurality of first wiring layers 41 as wiring layers 4. The resin structure 2 has a first main surface 21 as a main surface. A recess 23 is provided on the first main surface 21. The first electronic component 31 is provided in the recess 23. When the first electronic component 31 is arranged in the recess 23, the first electronic component 31 is arranged on the opposite side of the resin structure 2 (ie, the first main surface 21) relative to the first main surface 21 in the thickness direction D1 of the resin structure 2. Figure 1 In other words, in the thickness direction D1 of the resin structure 2, the height H1 of the first electronic component 31 is higher than the height of the recess 23. The first wiring layer 41 corresponding to the first electronic component 31 among the plurality of first wiring layers 41 is formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recess 23 continuous with the first main surface 21, and the bottom surface 232 of the recess 23. The first wiring layer 41 corresponding to the first electronic component 31 among the plurality of first wiring layers 41 is electrically connected to the first electronic component 31 at the bottom surface 232 of the recess 23 via the conductive portion 311 and the conductor portion 11.

[0026] The electronic component module 1 according to the embodiment further includes a plurality of columnar electrodes 5, an insulating layer 6, a second electronic component 32, and a third electronic component 33. The plurality of columnar electrodes 5 penetrate the resin structure 2 in the thickness direction D1 of the resin structure 2. The insulating layer 6 is formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recess 23 continuous with the first main surface 21, and the bottom surface 232 of the recess 23. The second electronic component 32 is built into the resin structure 2 at a position that does not overlap with the first electronic component 31 in the thickness direction D1 of the resin structure 2. The third electronic component 33 is provided on the first main surface 21 of the resin structure 2 so as not to overlap with the first electronic component 31 in the thickness direction D1 of the resin structure 2. Furthermore, the second electronic component 32 and the third electronic component 33 are arranged in the thickness direction D1 of the resin structure 2 so that a part of the third electronic component 33 overlaps with the second electronic component 32 in the thickness direction D1 of the resin structure 2. In the thickness direction D1 of the resin structure 2 , a height H1 of the first electronic component 31 is higher than a height H2 of the third electronic component 33 .

[0027] In addition, the electronic component module 1 according to the embodiment further includes a plurality of first terminal electrodes 7 and a plurality of second terminal electrodes 8. Each of the plurality of first terminal electrodes 7 is electrically connected to a corresponding first wiring layer 41 among the plurality of first wiring layers 41. Each of the plurality of first terminal electrodes 7 is, for example, an UBM (Under Bump Metal). Each of the plurality of second terminal electrodes 8 is electrically connected to a corresponding second wiring layer 42 among the plurality of second wiring layers 42. Each of the plurality of second terminal electrodes 8 is, for example, an UBM.

[0028] (2) Components of electronic component modules

[0029] Next, each component of the electronic component module according to the embodiment will be described with reference to the drawings.

[0030] (2.1) Resin structure

[0031] like Figure 1 As shown, the resin structure 2 is a resin molded body configured to hold the first electronic component 31, the second electronic component 32, the fourth electronic component 34 and a plurality of columnar electrodes 5. The resin structure 2 is plate-shaped. The resin structure 2 has a first principal surface (one principal surface) 21 and a second principal surface 22 that are on opposite sides of each other in its thickness direction D1. The first principal surface 21 and the second principal surface 22 are opposite to each other. The outer peripheral shape of the resin structure 2 observed from the thickness direction D1 of the resin structure 2 is a rectangle, but is not limited to this, for example, it can also be a square. Observed from the thickness direction D1 of the resin structure 2, the size of the resin structure 2 is larger than the size of any of the first electronic component 31, the second electronic component 32, the third electronic component 33 and the fourth electronic component 34.

[0032] The resin structure 2 has a recess 23. The recess 23 is a storage space for storing the first electronic component 31. The recess 23 has a side surface 231 and a bottom surface 232. The side surface 231 is parallel to the thickness direction D1 of the resin structure 2. The bottom surface 232 is parallel to the length direction D2 of the resin structure 2. From the direction intersecting the thickness direction D1 of the resin structure 2 ( Figure 1 The shape of the recess 23 when viewed in a direction perpendicular to the paper surface is rectangular. In addition, by accommodating the first electronic component 31 in the recess 23, the height of the electronic component module 1 can be reduced.

[0033] The resin structure 2 is formed of a resin having electrical insulation properties. In addition, the resin structure 2 may include a filler mixed in the resin in addition to the resin, but the filler is not an essential component. The resin is, for example, an epoxy resin. However, the resin is not limited to epoxy resin, and may be, for example, a polyimide resin, an acrylic resin, a polyurethane resin, or a silicone resin, a maleimide resin, etc. The filler is, for example, an inorganic filler such as silica and alumina. In addition to the resin and the filler, the resin structure 2 may also include a black pigment such as carbon black.

[0034] (2.2) Electronic components

[0035] The first electronic component 31 is, for example, a rectangular parallelepiped electronic component that is long in a direction parallel to the thickness direction D1 of the resin structure 2. The outer peripheral shape of the first electronic component 31 when viewed in the thickness direction D1 of the resin structure 2 is a rectangle, but is not limited thereto and may be, for example, a square.

[0036] The second electronic component 32 is, for example, a chip-shaped electronic component. The outer peripheral shape of the second electronic component 32 when viewed in the thickness direction D1 of the resin structure 2 is a rectangle, but the shape is not limited thereto and may be, for example, a square.

[0037] The third electronic component 33 is, for example, a chip-shaped electronic component. In the length direction D2 of the resin structure 2, the length of the third electronic component 33 is longer than the length of the second electronic component 32. The outer peripheral shape of the third electronic component 33 when viewed from the thickness direction D1 of the resin structure 2 is a rectangle, but is not limited to this, and may be, for example, a square. In the electronic component module 1 involved in the embodiment, the height H1 of the first electronic component 31 is higher than the height H2 of the third electronic component 33.

[0038] The fourth electronic component 34 is, for example, a chip-shaped electronic component. The outer peripheral shape of the fourth electronic component 34 when viewed from the thickness direction D1 of the resin structure 2 is a square, but is not limited to this, and may also be a rectangle. In the electronic component module 1 involved in the embodiment, the second electronic component 32 and the fourth electronic component 34 are built into the resin structure 2.

[0039] Here, the term "built-in" includes a first state and a second state. The first state refers to a state in which one main surface of each of the second electronic component 32 and the fourth electronic component 34 is not covered by the resin structure 2 (that is, one main surface of each of the second electronic component 32 and the fourth electronic component 34 is exposed from the resin structure 2). The second state refers to a state in which the remaining portion (including one main surface) of each of the second electronic component 32 and the fourth electronic component 34 except for the connection portion with the external circuit is covered by the resin structure 2.

[0040] Each of the first electronic component 31, the second electronic component 32, the third electronic component 33, and the fourth electronic component 34 is, for example, a semiconductor element (semiconductor chip). Semiconductor elements are, for example, IC (Integrated Circuit), MPU (Micro Processing Unit), power amplifier, low noise amplifier, RF (Radio Frequency) switch, etc. Each of the first electronic component 31, the second electronic component 32, the third electronic component 33, and the fourth electronic component 34 is not limited to a semiconductor element, and may be, for example, an inductor, a capacitor, a resistor, etc.

[0041] A plurality of conductive portions 311 are electrically connected to the first electronic component 31. Each of the plurality of conductive portions 311 is formed into an L-shape by a first conductive portion arranged along the side surface of the first electronic component 31 and a second conductive portion arranged along the bottom surface of the first electronic component 31. The first electronic component 31 is electrically connected to a corresponding first wiring layer 41 among the plurality of first wiring layers 41 by connecting the second conductive portion of the conductive portion 311 to the conductor portion 11 provided along the bottom surface 232 of the recessed portion 23 of the resin structure 2.

[0042] (2.3) Wiring layer

[0043] The electronic component module 1 according to the embodiment includes a plurality of second wiring layers 42 in addition to the plurality of first wiring layers 41 as the wiring layers 4 .

[0044] Each of the plurality of first wiring layers 41 electrically connects each of the first electronic component 31 to the fourth electronic component 34 to a corresponding columnar electrode 5 among the plurality of columnar electrodes 5 on the first main surface 21 side of the resin structure 2. The first wiring layers 41 corresponding to the second electronic component 32 to the fourth electronic component 34 among the plurality of first wiring layers 41 are formed along the first main surface 21 of the resin structure 2. The first wiring layers 41 corresponding to the first electronic component 31 among the plurality of first wiring layers 41 are formed across the first main surface 21 of the resin structure 2 and the recess 23. Specifically, the first wiring layers 41 corresponding to the first electronic component 31 among the plurality of first wiring layers 41 are formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recess 23 continuous with the first main surface 21, and the bottom surface 232 of the recess 23. In other words, among the plurality of first wiring layers 41 , the first wiring layer 41 corresponding to the first electronic component 31 is composed of one layer integrally formed along the first main surface 21 of the resin structure 2 , the side surface 231 of the recess 23 , and the bottom surface 232 of the recess 23 .

[0045] Each of the plurality of second wiring layers 42 electrically connects each of the plurality of columnar electrodes 5 and the plurality of second terminal electrodes 8 on the second main surface 22 side of the resin structure 2. Each of the plurality of second wiring layers 42 is formed along the second main surface 22 of the resin structure 2.

[0046] The material of the first wiring layer 41 and the second wiring layer 42 is, for example, a single layer or a laminate of an alloy or metal. In the electronic component module 1 according to the embodiment, the material of the first wiring layer 41 and the second wiring layer 42 is, for example, a material obtained by adding at least one selected from the group consisting of chromium, nickel, iron, cobalt, and zinc to copper, or a laminate of copper and titanium.

[0047] (2.4) Columnar Electrode

[0048] In the electronic component module 1 according to the embodiment, as Figure 1 As shown in FIG. 1 , a plurality of columnar electrodes 5 are held in the resin structure 2. The plurality of columnar electrodes 5 are arranged on the sides of the first electronic component 31, the second electronic component 32, and the fourth electronic component 34. The plurality of columnar electrodes 5 are separated from the outer peripheral surfaces of the first electronic component 31, the second electronic component 32, and the fourth electronic component 34. The plurality of columnar electrodes 5 are separated from each other. In addition, the position and number of the columnar electrodes 5 are not limited to Figure 1 Example shown.

[0049] Each of the plurality of columnar electrodes 5 is, for example, a cylindrical shape that is long in a direction parallel to the thickness direction D1 of the resin structure 2. Each of the plurality of columnar electrodes 5 has a first end face and a second end face that are located on opposite sides of each other in a direction parallel to the thickness direction D1 of the resin structure 2. Figure 1The conductive portion 12 has a laminated structure in which gold, nickel, and copper are laminated in this order from the first main surface 21 side of the resin structure 2. On the second end surface ( Figure 1 A corresponding second wiring layer 42 among a plurality of second wiring layers 42 is electrically connected to the lower end surface thereof.

[0050] The material of each columnar electrode 5 is, for example, metal. In the electronic component module 1 according to the embodiment, the material of each columnar electrode 5 is, for example, copper.

[0051] (2.5) Insulation layer

[0052] The electronic component module 1 according to the embodiment includes a third insulating layer 63 and a fourth insulating layer 64 in addition to the first insulating layer 61 and the second insulating layer 62 as the insulating layer 6. The first insulating layer 61, the second insulating layer 62, the third insulating layer 63, and the fourth insulating layer 64 each have electrical insulation. The first insulating layer 61 is an insulating layer located on the upper side of the first wiring layer 41. The second insulating layer 62 is an insulating layer located on the lower side of the first wiring layer 41.

[0053] The first insulating layer 61 has a function of preventing the solder from wetting and spreading in the first terminal electrode 7. The third insulating layer 63 has a function of preventing the solder from wetting and spreading in the second terminal electrode 8. The second insulating layer 62 has a function of improving the adhesion between the plurality of first wiring layers 41 and the resin structure 2. The fourth insulating layer 64 has a function of improving the adhesion between the plurality of second wiring layers 42 and the resin structure 2.

[0054] The first insulating layer 61 is patterned along the first main surface 21 of the resin structure 2. The portion of the first insulating layer 61 corresponding to the recessed portion 23 is formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recessed portion 23 continuous with the first main surface 21, and the bottom surface 232 of the recessed portion 23. In other words, the portion of the first insulating layer 61 corresponding to the recessed portion 23 is composed of a single layer formed integrally along the first main surface 21 of the resin structure 2, the side surface 231 of the recessed portion 23, and the bottom surface 232 of the recessed portion 23.

[0055] The second insulating layer 62 is patterned along the first main surface 21 of the resin structure 2. The portion of the second insulating layer 62 corresponding to the recessed portion 23 is formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recessed portion 23 continuous with the first main surface 21, and the bottom surface 232 of the recessed portion 23. In other words, the portion of the second insulating layer 62 corresponding to the recessed portion 23 is composed of a single layer formed integrally along the first main surface 21 of the resin structure 2, the side surface 231 of the recessed portion 23, and the bottom surface 232 of the recessed portion 23.

[0056] Each of the third insulating layer 63 and the fourth insulating layer 64 is patterned along the second main surface 22 of the resin structure 2 .

[0057] The material of each of the first insulating layer 61 and the third insulating layer 63 is a material having lower solder wettability than the first terminal electrode 7 and the second terminal electrode 8. The material of each of the first insulating layer 61 and the third insulating layer 63 is, for example, an organic material such as polyimide, but is not limited thereto. The material of each of the first insulating layer 61 and the third insulating layer 63 is not limited to an organic material such as polyimide, but may also be an inorganic material. In addition, the material of each of the second insulating layer 62 and the fourth insulating layer 64, which function as a close-contact layer, is, for example, a resin (epoxy resin, polyimide resin, polybenzoxazole, benzocyclobutene, bismaleimide, cycloolefin resin, phenolic resin, etc.).

[0058] (2.6) First terminal electrode

[0059] The plurality of first terminal electrodes 7 are located at a position separated from the first main surface 21 on the first main surface 21 side of the resin structure 2. Each of the plurality of first terminal electrodes 7 is electrically connected to a corresponding columnar electrode 5 among the plurality of columnar electrodes 5 via the first wiring layer 41 and the conductive portion 12. Each of the plurality of first terminal electrodes 7 has, for example, a laminated structure of a nickel layer and a metal on the nickel layer. In addition, each of the plurality of first terminal electrodes 7 is not limited to a laminated structure, and may also be a single-layer structure.

[0060] (2.7) Second terminal electrode

[0061] The plurality of second terminal electrodes 8 are located at a position separated from the second main surface 22 on the second main surface 22 side of the resin structure 2. Each of the plurality of second terminal electrodes 8 is electrically connected to a corresponding columnar electrode 5 among the plurality of columnar electrodes 5 via the second wiring layer 42. Each of the plurality of second terminal electrodes 8 has, for example, a laminated structure of a nickel layer and a gold layer on the nickel layer. In addition, each of the plurality of second terminal electrodes 8 is not limited to a laminated structure, and may also be a single-layer structure.

[0062] (2.8) Protective layer

[0063] In the electronic component module 1 according to the embodiment, as Figure 1 As shown, the first electronic component 31 and the third electronic component 33 are covered by the protective layer 10. The material of the protective layer 10 is, for example, a synthetic resin such as epoxy resin or polyimide resin. When viewed from the thickness direction D1 of the resin structure 2, the size of the protective layer 10 is substantially the same as that of the resin structure 2.

[0064] (3) Method for manufacturing electronic component module

[0065] Next, refer to Figure 2 A~ Figure 2 C. Figure 3 A~ Figure 3 C and Figure 4 A~ Figure 4 D. A method for manufacturing the electronic component module 1 according to the embodiment will be described. In the method for manufacturing the electronic component module 1 according to the embodiment, after the first to fourth electronic components 31 to 34 are prepared, the first to thirteenth steps are sequentially performed.

[0066] In the first step, if Figure 2 As shown in A, a temporary fixing material 14 is formed on the first main surface 131 of the first support (support) 13 having a first main surface 131 and a second main surface 132. The first support 13 includes, for example, a glass epoxy material. The temporary fixing material 14 is directly formed on the first main surface 131 of the first support 13. In addition, the first support 13 is not limited to the glass epoxy material, and may also include, for example: a metal material such as stainless steel and aluminum; an inorganic material such as alumina and various glasses; or a resin material such as a PET film, a PEN film, and a polyimide film.

[0067] In the second step, if Figure 2 As shown in B, a plurality of columnar electrodes 5 are formed on the first main surface 131 of the first support 13. Here, the so-called "forming a plurality of columnar electrodes 5 on the first main surface 131 of the first support 13" includes the case where the plurality of columnar electrodes 5 are directly formed on the first main surface 131 of the first support 13 and the case where the plurality of columnar electrodes 5 are indirectly formed on the first main surface 131 of the first support 13. In the second step, the plurality of columnar electrodes 5 are formed on the first main surface 131 of the first support 13 via the temporary fixing material 14. That is, in the second step, the plurality of columnar electrodes 5 are indirectly formed on the first main surface 131 of the first support 13. In addition, in the second step, the plurality of columnar electrodes 5 are formed on the first main surface 131 of the first support 13 via the temporary fixing material 14 and the conductive portion 12.

[0068] Furthermore, in the second step, Figure 2As shown in B, the second electronic component 32 and the fourth electronic component 34 are arranged on the first main surface 131 of the first support 13. Here, the so-called "arranging the second electronic component 32 and the fourth electronic component 34 on the first main surface 131 of the first support 13" includes the case where the second electronic component 32 and the fourth electronic component 34 are directly arranged on the first main surface 131 of the first support 13 and the case where the second electronic component 32 and the fourth electronic component 34 are indirectly arranged on the first main surface 131 of the first support 13. In the second step, the second electronic component 32 and the fourth electronic component 34 are arranged on the first main surface 131 of the first support 13 via the temporary fixing material 14. That is, the second electronic component 32 and the fourth electronic component 34 are indirectly arranged on the first main surface 131 of the first support 13. When viewed from the thickness direction of the first support 13, the size of the second electronic component 32 is smaller than the size of the first main surface 131 of the first support 13.

[0069] In addition, in the second step, if Figure 2 As shown in B, the sacrificial body 15 is arranged on the first main surface 131 of the first support 13. Here, the so-called "arranging the sacrificial body 15 on the first main surface 131 of the first support 13" includes the case where the sacrificial body 15 is directly arranged on the first main surface 131 of the first support 13 and the case where the sacrificial body 15 is indirectly arranged on the first main surface 131 of the first support 13. In the second step, the sacrificial body 15 is arranged on the first main surface 131 of the first support 13 via the temporary fixing material 14. That is, in the second step, the sacrificial body 15 is indirectly arranged on the first main surface 131 of the first support 13. The sacrificial body 15 is a member for forming the recessed portion 23 in the resin structure 2. As described later, the recessed portion 23 is formed in the resin structure 2 by removing the sacrificial body 15 from the resin structure 2.

[0070] The sacrificial body 15, the second electronic component 32, and the fourth electronic component 34 are arranged in a horizontal direction along the main surface of the temporary fixing material 14. The plurality of columnar electrodes 5 are arranged on the sides of the sacrificial body 15, the second electronic component 32, and the fourth electronic component 34, respectively.

[0071] The sacrificial body 15 is, for example, in the shape of a chip. The outer peripheral shape of the sacrificial body 15 when viewed from the thickness direction of the first support 13 is a rectangular parallelepiped, but is not limited thereto, and may be, for example, a square. When viewed from the thickness direction of the first support 13, the size of the sacrificial body 15 is smaller than the size of the first main surface 131 of the first support 13. The material of the sacrificial body 15 is, for example, a metal such as copper and aluminum, a resist material such as silicon (Si), novolac resin, acrylic resin, or paraffin wax. In the manufacturing method of the electronic component module 1 involved in the embodiment, the sacrificial body 15 is, for example, copper. That is, in the manufacturing method of the electronic component module 1 involved in the embodiment, the material of the sacrificial body 15 is different from the material of the resin structure 2. In the case where the material of the sacrificial body 15 is copper, the sacrificial body 15 can be patterned by, for example, photolithography technology, so that the sacrificial body 15 with high-precision dimensions can be formed.

[0072] In the manufacturing method of the electronic component module 1 involved in the embodiment, the second step constitutes a sacrificial body configuration step of configuring a sacrificial body 15 on the first main surface 131 of the first support body 13, a second component configuration step of configuring a second electronic component 32 on the first main surface 131 of the first support body 13, and an electrode forming step of forming a columnar electrode 5 on the first main surface 131 of the first support body 13.

[0073] In the third step, if Figure 2 As shown in C, the resin structure 2 is molded on the first main surface 131 of the first support 13 so as to cover the plurality of columnar electrodes 5, the sacrificial body 15, the second electronic component 32, and the fourth electronic component 34. Here, the so-called "molding the resin structure 2 on the first main surface 131 of the first support 13" includes the case where the resin structure 2 is directly molded on the first main surface 131 of the first support 13 and the case where the resin structure 2 is indirectly molded on the first main surface 131 of the first support 13. In the third step, molding is performed on the first main surface 131 of the first support 13 via the temporary fixing material 14. That is, in the third step, the resin structure 2 is indirectly molded on the first main surface 131 of the first support 13.

[0074] Furthermore, in the third step, Figure 2 As shown in C, the second support 16 is formed on the second main surface 22 of the resin structure 2. Here, the so-called "forming the second support 16 on the second main surface 22 of the resin structure 2" includes the case where the second support 16 is directly formed on the second main surface 22 of the resin structure 2 and the case where the second support 16 is indirectly formed on the second main surface 22 of the resin structure 2. In the third step, the second support 16 is directly formed on the second main surface 22 of the resin structure 2.

[0075] In the method for manufacturing the electronic component module 1 according to the embodiment, the third step constitutes a resin molding step of molding the resin structure 2 on the first main surface 131 .

[0076] In the fourth step, the structure formed in the third step (see Figure 2 C) removing the first support 13 and the temporary fixing material 14, thereby obtaining Figure 3 The structure shown in A is obtained. Thus, in the fourth step, the first main surface 21 of the resin structure 2 is exposed. In the fourth step, for example, the adhesive force of the temporary fixing material 14 is reduced to remove (peel off) the first support 13.

[0077] In the fifth step, if Figure 3 As shown in B, by removing the sacrificial body 15, a recess 23 is formed in the resin structure 2. In the fifth step, for example, the sacrificial body 15 is removed by wet etching. In the method for manufacturing the electronic component module 1 according to the embodiment, the material of the sacrificial body 15 is copper. Therefore, as an etching solution (etchant) for wet etching the sacrificial body 15, for example, ammonium persulfate, ferric chloride, or nitric acid can be used. As for the etching solution for removing the sacrificial body 15 in the fifth step, from the viewpoint of selectively etching the sacrificial body 15 with respect to the resin structure 2, an etching solution with a large etching selectivity ratio (etching speed of the sacrificial body 15 / etching speed of the resin structure 2) is preferably used, and an etching solution that does not etch the resin structure 2 is more preferably used. In addition, in the method for manufacturing the electronic component module 1 according to the embodiment, the first end surface of the columnar electrode 5 is covered by the conductive portion 12, so that the etching solution for removing the sacrificial body 15 can suppress corrosion of the columnar electrode 5.

[0078] In addition, when the material of the sacrificial body 15 is aluminum, for example, it is preferable to remove the sacrificial body 15 by an etching solution such as hydrochloric acid or mixed acid (a mixture of phosphoric acid and acetic acid). Furthermore, when the material of the sacrificial body 15 is silicon, for example, it is preferable to remove the sacrificial body 15 by an etching solution such as a hydrofluoric acid. Furthermore, when the material of the sacrificial body 15 is a resist material, for example, it is preferable to remove the sacrificial body 15 by an N-methylpyrrolidone-based stripping solution. Furthermore, when the material of the sacrificial body 15 is paraffin, it is preferable to remove the sacrificial body 15 by heating to vaporize the sacrificial body 15. Furthermore, for example, the material of the sacrificial body 15 may be carbon, and the recess 23 may be formed by removing the carbon.

[0079] In the method for manufacturing the electronic component module 1 according to the embodiment, the fifth step constitutes a recessed portion forming step of forming the recessed portion 23 in the resin structure 2 by removing the sacrificial body 15 .

[0080] In the sixth step, if Figure 3As shown in FIG. 3C, a wiring layer 4 and an insulating layer 6 are formed. In the sixth step, first, a second insulating layer 62 (see FIG. 3C ) which functions as a bonding layer in the insulating layer 6 is formed. Figure 1 ). The second insulating layer 62 is a base layer of the wiring layer 4 (the first wiring layer 41). In the sixth step, for example, after a photosensitive resist is applied to the resin structure 2, exposure is performed, and then development is performed, thereby forming the second insulating layer 62.

[0081] In the sixth step, after forming the second insulating layer 62, the wiring layer 4 is formed. In the sixth step, for example, after forming a power supply film on the resin structure 2, a photosensitive resist is applied to the resin structure 2, and then exposed and developed to obtain a resist pattern. Furthermore, in the sixth step, after forming a plating layer by electroplating, unnecessary portions of the power supply film are removed to form the wiring layer 4.

[0082] In the sixth step, after forming the wiring layer 4, the first insulating layer 61 is formed. The first insulating layer 61 is formed by the same method as the second insulating layer 62, and therefore, the description thereof is omitted here.

[0083] In the method for manufacturing the electronic component module 1 according to the embodiment, the sixth step includes a wiring layer forming step of forming the wiring layer 4 and an insulating layer forming step of forming the insulating layer 6 .

[0084] In the seventh step, if Figure 4 As shown in A of FIG. 1 , a plurality of first terminal electrodes 7 are formed. In the seventh step, for example, sputtering, photolithography, etching, and plating techniques are used to form the plurality of first terminal electrodes 7 .

[0085] In the eighth step, the structure formed in the seventh step (see Figure 4 A) removing the second support 16, thereby obtaining Figure 4 Furthermore, in the eighth step, the second main surface 22 of the resin structure 2 is ground so that the second end surface ( Figure 4 The upper end surface of B) is exposed.

[0086] In the 9th step, if Figure 4 As shown in C, the first electronic component 31 as the electronic component 3 is arranged in the recessed portion 23 of the resin structure 2, and the first electronic component 31 is electrically connected to the corresponding first wiring layer 41. In the ninth step, the second conductive portions of the plurality of conductive portions 311 electrically connected to the first electronic component 31 are respectively connected to the plurality of conductor portions 11 arranged on the bottom surface 232 of the recessed portion 23. Thus, the first electronic component 31 is mechanically held in the resin structure 2, and the first electronic component 31 is electrically connected to the corresponding first wiring layer 41.

[0087] Furthermore, in the ninth step, if Figure 4 As shown in C, the third electronic component 33 is arranged on the first main surface 21 of the resin structure 2. In the ninth step, the first terminal electrode 7 and the third electronic component 33 are connected via the solder bump 9. Thus, the third electronic component 33 is mechanically held on the resin structure 2, and the third electronic component 33 and the corresponding first wiring layer 41 are electrically connected.

[0088] In the method for manufacturing the electronic component module 1 according to the embodiment, the ninth step includes a component mounting step of mounting the electronic component 3 in the recess 23 of the resin structure 2 and a third component placement step of placing the third electronic component 33 on the first main surface 21 of the resin structure 2 .

[0089] In the method for manufacturing the electronic component module 1 according to the embodiment, the steps of disposing the electronic component 3 in the recess 23 of the resin structure 2 and electrically connecting the electronic component 3 and the wiring layer 4 are performed simultaneously in one step (component mounting step), but they may be performed in different steps.

[0090] In the 10th step, if Figure 4 As shown in D, the protective layer 10 is formed so as to cover the first electronic component 31 and the third electronic component 33 mounted on the resin structure 2 .

[0091] In the eleventh step, the fourth insulating layer 64 , the plurality of second wiring layers 42 , and the third insulating layer 63 are formed in this order on the second main surface 22 of the resin structure 2 .

[0092] In the twelfth step, a plurality of second terminal electrodes 8 are formed. In the twelfth step, for example, a plurality of second terminal electrodes 8 are formed by using sputtering, photolithography technology, etching technology, and plating technology.

[0093] In the thirteenth step, the wafer on which the plurality of electronic component modules 1 are formed is cut, for example, by dicing, to cut out the electronic component modules 1 one by one.

[0094] (4) Effect

[0095] The manufacturing method of the electronic component module 1 according to the embodiment includes a recess forming step. In the recess forming step, the sacrificial body 15 is removed to form the recess 23 in the resin structure 2. That is, in the recess forming step, the sacrificial body 15 is removed from the resin structure 2 to form the recess 23 for mounting the electronic component 3. Therefore, the recess 23 is entirely formed by an integral resin molded body such as the resin structure 2. For example, when the protective layer 10 is molded on the resin structure 2, there is an advantage that the resin structure 2 is not easily broken even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2.

[0096] In addition, the manufacturing method of the electronic component module 1 according to the embodiment includes a wiring layer forming step. In the wiring layer forming step, the wiring layer 4 is formed across the first main surface (one main surface) 21 of the resin structure 2 and the side surface 231 of the recess 23 continuous with the first main surface 21. That is, the wiring layer 4 is formed integrally from the first main surface 21 of the resin structure 2 to the side surface 231 of the recess 23. Therefore, for example, when the protective layer 10 is molded on the resin structure 2, there is an advantage that the wiring layer 4 is not easily broken even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2.

[0097] Furthermore, when the recess (opening) is formed by stacking the intermediate layer and the surface layer as in the above-mentioned Patent Document 1, the module size may be enlarged due to the stacking misalignment of the intermediate layer and the surface layer. On the other hand, when the resin structure 2 is composed of a single resin molded body as in the manufacturing method of the electronic component module 1 according to the embodiment, the enlargement of the module size caused by the stacking misalignment can be suppressed.

[0098] Furthermore, in the method for manufacturing the electronic component module 1 according to the embodiment, the recessed portion 23 is formed in the resin structure 2 by removing the sacrificial body 15. Therefore, there is an advantage that a member for forming the recessed portion is not required.

[0099] In the method for manufacturing the electronic component module 1 according to the embodiment, the sacrificial body 15 is removed by etching in the recess forming step. Therefore, the recess 23 can be easily formed.

[0100] The manufacturing method of the electronic component module 1 according to the embodiment further includes a second component placement step. In the second component placement step, the second electronic component 32 is placed on the first main surface 21 of the resin structure 2 so as not to overlap with the sacrificial body 15 in the thickness direction of the first support body 13. Therefore, a highly integrated electronic component module 1 can be realized.

[0101] The manufacturing method of the electronic component module 1 according to the embodiment further includes a third component placement step. In the third component placement step, the third electronic component 33 is placed on the first main surface 21 of the resin structure 2 so as not to overlap with the first electronic component 31 in the thickness direction D1 of the resin structure 2. Therefore, a highly integrated electronic component module 1 can be realized.

[0102] The manufacturing method of the electronic component module 1 according to the embodiment further includes an insulating layer forming step. In the insulating layer forming step, an insulating layer 6 is formed to at least span the first main surface (one main surface) 21 of the resin structure 2 and the side surface 231 of the recess 23. That is, the insulating layer 6 is formed as a whole from at least the first main surface 21 of the resin structure 2 to the side surface 231 of the recess 23. Therefore, for example, when the protective layer 10 is molded on the resin structure 2, there is an advantage that the insulating layer 6 is not easily broken even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2.

[0103] Furthermore, in the method for manufacturing the electronic component module 1 according to the embodiment, in the insulating layer forming step, the insulating layer 6 is formed across the first main surface (one main surface) 21 of the resin structure 2, the side surface 231 of the recess 23 continuous with the first main surface 21, and the bottom surface 232 of the recess 23. Therefore, there is an advantage that the insulating layer 6 is less likely to break.

[0104] The manufacturing method of the electronic component module 1 according to the embodiment further includes an electrode forming step. In the electrode forming step, a columnar electrode 5 is formed on the first main surface 131 of the first support 13. Therefore, the electrode can be led out to the second main surface 22 side opposite to the first main surface 21 on which the electronic component 3 is arranged through the columnar electrode 5, and the electronic component module 1 can be miniaturized compared to the case where the electrode is led out to the first main surface 21 side. In addition, the columnar electrode 5 makes it possible to stack the electronic components, and the electronic component module 1 with a high degree of integration can be realized.

[0105] In the method for manufacturing the electronic component module 1 according to the embodiment, in the wiring layer forming step, the wiring layer 4 is formed across the first main surface (one main surface) 21 of the resin structure 2, the side surface 231 of the recessed portion 23 continuous with the first main surface 21, and the bottom surface 232 of the recessed portion 23. Therefore, there is an advantage that the wiring layer 4 is less likely to break.

[0106] In the method for manufacturing the electronic component module 1 according to the embodiment, the material of the sacrificial body 15 is different from that of the resin structure 2. Therefore, there is an advantage that, when the sacrificial body 15 is removed by etching, for example, the resin structure 2 is less susceptible to the etching.

[0107] The electronic component module 1 according to the embodiment includes a resin structure 2. The resin structure 2 is provided with a recess 23 for arranging the electronic component 3. Therefore, there is an advantage that the resin structure 2 is not easily broken even when stress is applied to the electronic component 3 arranged in the recess 23 of the resin structure 2, for example, in the thickness direction D1 of the resin structure 2.

[0108] In addition, the electronic component module 1 according to the embodiment includes a wiring layer 4. The wiring layer 4 is formed across the first main surface 21 of the resin structure 2 and the side surface 231 of the recess 23 continuous with the first main surface 21. That is, the wiring layer 4 is formed integrally from the first main surface 21 to the side surface 231 of the recess 23. Therefore, there is also an advantage that even when stress is applied to the electronic component 3 arranged in the recess 23 of the resin structure 2, for example, in the thickness direction D1 of the resin structure 2, the wiring layer 4 is not easily broken.

[0109] Furthermore, when the recess (opening) is formed by stacking the intermediate layer and the surface layer as in the above-mentioned Patent Document 1, the module size may be enlarged due to the stacking misalignment of the intermediate layer and the surface layer. On the other hand, when the recess 23 is provided in the resin structure 2 as in the electronic component module 1 involved in the embodiment, the enlargement of the module size caused by the stacking misalignment can be suppressed.

[0110] The electronic component module 1 according to the embodiment further includes a columnar electrode 5. The columnar electrode 5 penetrates the resin structure 2 in the thickness direction D1 of the resin structure 2. Therefore, the electrode can be led out to the second main surface 22 side opposite to the first main surface 21 on which the electronic component 3 is provided, and the electronic component module 1 can be miniaturized compared to the case where the electrode is led out to the first main surface 21 side. In addition, the columnar electrode 5 makes it possible to stack the electronic components, and it is possible to realize the electronic component module 1 with a high degree of integration.

[0111] In the electronic component module 1 according to the embodiment, the wiring layer 4 is formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recess 23 continuous with the first main surface 21, and the bottom surface 232 of the recess 23. Therefore, there is an advantage that the wiring layer 4 is less likely to break.

[0112] The electronic component module 1 according to the embodiment further includes an insulating layer 6. The insulating layer 6 is formed to at least span the first main surface (one main surface) 21 of the resin structure 2 and the side surface 231 of the recess 23. That is, the insulating layer 6 is formed integrally from at least the first main surface 21 of the resin structure 2 to the side surface 231 of the recess 23. Therefore, there is an advantage that even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2, the insulating layer 6 is not easily broken.

[0113] In addition, in the electronic component module 1 according to the embodiment, the insulating layer 6 is formed across the first main surface (one main surface) 21 of the resin structure 2, the side surface 231 of the recess 23 continuous with the first main surface 21, and the bottom surface 232 of the recess 23. Therefore, there is an advantage that the insulating layer 6 is less likely to break. Specifically, there is an advantage that even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2, for example, in the thickness direction D1 of the resin structure 2, the insulating layer 6 is less likely to break.

[0114] The electronic component module 1 according to the embodiment further includes a second electronic component 32. The second electronic component 32 is embedded in the resin structure 2 at a position not overlapping the first electronic component 31 in the thickness direction D1 of the resin structure 2. Therefore, a highly integrated electronic component module 1 can be realized.

[0115] The electronic component module 1 according to the embodiment further includes a third electronic component 33. The third electronic component 33 is provided on the first main surface 21 of the resin structure 2 so as not to overlap with the first electronic component 31 in the thickness direction D1 of the resin structure 2. Therefore, a highly integrated electronic component module 1 can be realized.

[0116] In the electronic component module 1 according to the embodiment, in the thickness direction D1 of the resin structure 2, the height H1 of the first electronic component 31 is higher than the height H2 of the third electronic component 33. Therefore, by arranging the first electronic component 31, which is relatively higher than the third electronic component 33, in the recess 23, the height of the electronic component module 1 can be reduced.

[0117] (5) Modification

[0118] Hereinafter, modifications of the electronic component module 1 according to the embodiment will be described.

[0119] (5.1) Modification 1

[0120] like Figure 5 As shown, from the direction intersecting with the thickness direction D1 of the resin structure 2 ( Figure 5 The shape of the recess 23 when viewed from the direction perpendicular to the paper surface) may also be a tapered shape with the opening becoming wider toward the upper side. In this case, the first wiring layer 41, the first insulating layer 61, and the second insulating layer 62 formed in the recess 23 are curved along the shape of the recess 23.

[0121] As described above, when the recess 23 is tapered, it is advantageous to easily accommodate the first electronic component 31 in the recess 23. In addition, since the first wiring layer 41 is curved along the recess 23, it is also advantageous that the wiring is less likely to be disconnected.

[0122] (5.2) Modification 2

[0123] Although in the electronic component module 1 according to the embodiment, Figure 1 As shown, the second electronic component 32 is built into the resin structure 2, but Figure 6 As shown, the second electronic component 32 may not be built into the resin structure 2. Figure 6 An electronic component module 1a according to Modification 2 will be described. In the electronic component module 1a according to Modification 2, the same components as those of the electronic component module 1 according to the embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0124] like Figure 6 As shown, the electronic component module 1a according to the second modification includes a resin structure 2, a first electronic component 31 as the electronic component 3, a third electronic component 33, and a first wiring layer 41 and a second wiring layer 42 as the wiring layer 4. In addition, the electronic component module 1a according to the second modification includes a plurality of columnar electrodes 5, a first insulating layer 61 and a second insulating layer 62, a third insulating layer 63, and a fourth insulating layer 64 as the insulating layer 6. In addition, the electronic component module 1a according to the second modification includes a plurality of first terminal electrodes 7, a plurality of second terminal electrodes 8, and a protective layer 10. That is, in the electronic component module 1a according to the second modification, the second electronic component 32 and the fourth electronic component 34 are omitted compared with the electronic component module 1 according to the embodiment.

[0125] In the method for manufacturing the electronic component module 1a according to Modification 2, the process of placing the second electronic component 32 and the fourth electronic component 34 on the temporary fixing material 14 is omitted in the second step. The other steps are the same as those of the electronic component module 1a according to the embodiment, and description thereof is omitted.

[0126] In the electronic component module 1a according to the second modification, similarly to the electronic component module 1 according to the embodiment, the resin structure 2 is provided with a recess 23 for arranging the electronic component 3. Therefore, there is an advantage that even when stress is applied to the electronic component 3 arranged in the recess 23 of the resin structure 2, for example, in the thickness direction D1 of the resin structure 2, the resin structure 2 is not easily broken.

[0127] In addition, the manufacturing method of the electronic component module 1a according to the modification 1 includes a recess forming step similar to the manufacturing method of the electronic component module 1 according to the embodiment. Therefore, the recess 23 is entirely formed by an integral resin molded body such as the resin structure 2. For example, when the protective layer 10 is molded on the resin structure 2, there is an advantage that the resin structure 2 is not easily broken even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2.

[0128] (5.3) Modification 3

[0129] In the electronic component module 1 according to the embodiment, as Figure 1 As shown, the first electronic component 31 is electrically connected to the first wiring layer 41 (wiring layer 4) via the second conductive portion of the conductive portion 311 arranged along the bottom surface of the first electronic component 31. Figure 7 As shown, the first electronic component 31 may be electrically connected to the first wiring layer 43 (wiring layer 4b) via the conductive portion 311b disposed along the side surface of the first electronic component 31. Figure 7 An electronic component module 1b according to Modification 3 will be described. In the electronic component module 1b according to Modification 3, the same components as those of the electronic component module 1 according to the embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0130] like Figure 7 As shown, the electronic component module 1b according to the modification example 3 includes a resin structure 2, a first electronic component 31, a second electronic component 32, a third electronic component 33, a fourth electronic component 34 as the electronic components 3, and a first wiring layer 43 and a second wiring layer 44 as the wiring layer 4b. In addition, the electronic component module 1b according to the modification example 3 further includes a plurality of columnar electrodes 5, and a first insulating layer 61 and a second insulating layer 62, a third insulating layer 63, and a fourth insulating layer 64 as the insulating layer 6. In addition, the electronic component module 1b according to the modification example 3 further includes a plurality of first terminal electrodes 7, a plurality of second terminal electrodes 8, and a protective layer 10.

[0131] A plurality of conductive portions 311b are electrically connected to the first electronic component 31. Each of the plurality of conductive portions 311b is arranged along the side surface of the first electronic component 31. On the other hand, the first wiring layer 43 corresponding to the first electronic component 31 among the plurality of first wiring layers 43 is formed across the first main surface 21 of the resin structure 2 and the side surface 231 of the recess 23 continuous with the first main surface 21. That is, the first wiring layer 43 is formed integrally from the first main surface 21 to the side surface 231 of the recess 23. Moreover, the first electronic component 31 is electrically connected to the corresponding first wiring layer 43 among the plurality of first wiring layers 43 via the conductor portion 11b provided along the side surface 231 of the recess 23 of the resin structure 2.

[0132] Here, in the manufacturing method of the electronic component module 1b involved in the variant example 3 and the manufacturing method of the electronic component module 1 involved in the embodiment, only the connection position between the first electronic component 31 and the first wiring layer 41 (or the first wiring layer 43) is different, and the electronic component module 1 (or 1b) is formed by going through the same steps (first step to thirteenth step).

[0133] In the electronic component module 1b according to the third modification, similarly to the electronic component module 1 according to the embodiment, the resin structure 2 is provided with a recess 23 for arranging the electronic component 3. Therefore, there is an advantage that even when stress is applied to the electronic component 3 arranged in the recess 23 of the resin structure 2, for example, in the thickness direction D1 of the resin structure 2, the resin structure 2 is not easily broken.

[0134] In addition, the manufacturing method of the electronic component module 1b according to the modification 3 includes a recess forming step similar to the manufacturing method of the electronic component module 1 according to the embodiment. Therefore, the recess 23 is entirely formed by an integral resin molded body such as the resin structure 2. For example, when the protective layer 10 is molded on the resin structure 2, there is an advantage that the resin structure 2 is not easily broken even when stress is applied to the electronic component 3 mounted in the recess 23 of the resin structure 2.

[0135] (5.4) Other variations

[0136] Other modified examples will be described below.

[0137] In the electronic component module 1 according to the embodiment, both the first insulating layer 61 and the second insulating layer 62 are included in the insulating layer 6, but at least one of the first insulating layer 61 and the second insulating layer 62 only needs to be included in the insulating layer 6. In other words, at least one of the first insulating layer 61 and the second insulating layer 62 may be omitted.

[0138] Although the electronic component module 1 according to the embodiment includes the first to fourth electronic components 31 to 34, it is sufficient to include at least the first electronic component 31. In other words, the second to fourth electronic components 32 to 34 may be omitted.

[0139] In the electronic component module 1 according to the embodiment, the first electronic component 31 and the third electronic component 33 are covered with the protective layer 10 , but they do not need to be covered with the protective layer 10 .

[0140] In the method for manufacturing the electronic component module 1 according to the embodiment, the temporary fixing material 14 is formed on the first support 13 in the first step. However, the temporary fixing material 14 may be omitted.

[0141] In the electronic component module 1 according to the embodiment, the insulating layer 6 is formed across the first main surface 21 of the resin structure 2, the side surface 231 of the recess 23, and the bottom surface 232 of the recess 23. However, the insulating layer 6 only needs to be formed across at least the first main surface 21 of the resin structure 2 and the side surface 231 of the recess 23.

[0142] In the electronic component module 1 according to the embodiment, the first end surface of the columnar electrode 5 is covered with the conductive portion 12 , but the conductive portion 12 may be omitted.

[0143] In the method for manufacturing the electronic component module 1 according to the embodiment, the material of the sacrificial body 15 and the material of the resin structure 2 are different, but they may be the same.

[0144] (Way)

[0145] According to the above-described embodiments and the like, the following aspects are disclosed.

[0146] The manufacturing method of the electronic component module (1; 1a; 1b) involved in the first embodiment comprises a sacrificial body arrangement step, a resin molding step, a recess forming step, a wiring layer forming step and a component mounting step. In the sacrificial body arrangement step, a sacrificial body (15) whose size is smaller than the size of the first main surface (131) when viewed from the thickness direction of a support body (13) having a first main surface (131) and a second main surface (132) is arranged on the first main surface (131). In the resin molding step, a resin structure (2) is molded on the first main surface (131) so as to cover the sacrificial body (15) arranged on the first main surface (131). In the recess forming step, a recess (23) is formed in the resin structure (2) by removing the sacrificial body (15). In the wiring layer forming step, a wiring layer (4; 4a; 4b) is formed across the side surface (231) of the recess (23) and one main surface (21) of the resin structure (2) continuous with the side surface (231). In the component mounting step, the electronic component (3) is mounted in the recess (23).

[0147] According to this embodiment, there is an advantage that the resin structure (2) is unlikely to break even when stress is applied to the electronic component (3).

[0148] In the method for manufacturing an electronic component module (1; 1a; 1b) according to the second aspect, in the first aspect, the sacrificial body (15) is removed by etching in the recess forming step.

[0149] According to this aspect, the recessed portion (23) can be easily formed.

[0150] The manufacturing method of the electronic component module (1; 1b) involved in the third embodiment further comprises a second component configuration step in the first or second embodiment. In the second component configuration step, before the resin molding step, a second electronic component (32) whose size when viewed from the thickness direction of the support body (13) is smaller than the size of the first main surface (131) is configured on the first main surface (131) so as not to overlap with the sacrificial body (15) in the thickness direction of the support body (13). The second electronic component (32) is different from the first electronic component (31) which is the electronic component (3). In the resin molding step, the resin structure (2) is molded so as to cover the sacrificial body (15) and the second electronic component (32) configured on the first main surface (131).

[0151] According to this aspect, it is possible to realize an electronic component module (1; 1b) with a high degree of integration.

[0152] The manufacturing method of the electronic component module (1; 1b) according to the fourth embodiment further comprises a third component disposing step in the third embodiment. In the third component disposing step, a third electronic component (33) is disposed on one main surface (21) so as not to overlap with the first electronic component (31) in the thickness direction (D1) of the resin structure (2). The third electronic component (33) is different from the first electronic component (31) and the second electronic component (32).

[0153] According to this aspect, it is possible to realize an electronic component module (1; 1b) with a high degree of integration.

[0154] The manufacturing method of the electronic component module (1; 1a; 1b) according to the fifth aspect is, in any one of the first to fourth aspects, further comprising an insulating layer forming step. In the insulating layer forming step, an insulating layer (6) is formed so as to span at least one main surface (21) and a side surface (231) of the recess (23).

[0155] According to this embodiment, there is an advantage that the insulating layer (6) is less likely to break.

[0156] The manufacturing method of the electronic component module (1; 1a; 1b) according to the sixth aspect is, in any one of the first to fifth aspects, further comprising an electrode forming step. In the electrode forming step, a columnar electrode (5) is formed on the first main surface (131) before the resin molding step.

[0157] According to this aspect, the electronic component module (1; 1a; 1b) can be miniaturized.

[0158] In the manufacturing method of the electronic component module (1; 1a) involved in the seventh embodiment, in any one of the first to sixth embodiments, in the wiring layer forming step, a wiring layer (4) is formed across a main surface (21), a side surface (231) of a recess (23) and a bottom surface (232) of the recess (23).

[0159] According to this embodiment, there is an advantage that the wiring layer (4) is less likely to break.

[0160] In the method for manufacturing an electronic component module (1; 1a; 1b) according to an eighth aspect, in any one of the first to seventh aspects, the material of the sacrificial body (15) and the material of the resin structure (2) are different.

[0161] According to this embodiment, there is an advantage that when the sacrificial body (15) is removed by etching, the resin structure (2) is less likely to be affected by the etching.

[0162] The electronic component module (1; 1a; 1b) involved in the ninth embodiment comprises a resin structure (2), an electronic component (3) and a wiring layer (4; 4a; 4b). The resin structure (2) has a main surface (21), and a recess (23) is provided on the main surface (21). The electronic component (3) is provided in the recess (23). The wiring layer (4; 4a; 4b) is formed across the main surface (21) and the side surface (231) of the recess (23) continuous with the main surface (21). The wiring layer (4; 4a; 4b) is electrically connected to the electronic component (3).

[0163] According to this embodiment, there is an advantage that the resin structure (2) is unlikely to break even when stress is applied to the electronic component (3).

[0164] The electronic component module (1; 1a; 1b) according to the tenth aspect is further provided with a columnar electrode (5) in the ninth aspect. The columnar electrode (5) penetrates the resin structure (2) in the thickness direction (D1) of the resin structure (2).

[0165] According to this aspect, the electronic component module (1; 1a; 1b) can be miniaturized.

[0166] In the electronic component module (1; 1a) involved in the 11th aspect, in the 9th or 10th aspect, the wiring layer (4) is formed across a main surface (21), a side surface (231) of the recess (23) and a bottom surface (232) of the recess (23).

[0167] According to this embodiment, there is an advantage that the wiring layer (4) is less likely to break.

[0168] The electronic component module (1; 1a; 1b) according to the twelfth aspect is any one of the ninth to eleventh aspects, further comprising an insulating layer (6). The insulating layer (6) is formed across at least one main surface (21) and a side surface (231) of the recess (23).

[0169] According to this embodiment, there is an advantage that the insulating layer (6) is less likely to break.

[0170] The electronic component module (1; 1b) according to the 13th aspect is any one of the 9th to 12th aspects, further comprising a second electronic component (32). The second electronic component (32) is different from the first electronic component (31) as the electronic component (3). The second electronic component (32) is built into the resin structure (2) at a position that does not overlap with the first electronic component (31) in the thickness direction (D1) of the resin structure (2).

[0171] According to this aspect, it is possible to realize an electronic component module (1; 1b) with a high degree of integration.

[0172] The electronic component module (1; 1b) according to the 14th embodiment is further provided with a third electronic component (33) in the 13th embodiment. The third electronic component (33) is different from the first electronic component (31) and the second electronic component (32). The third electronic component (33) is provided on one main surface (21) so as not to overlap with the first electronic component (31) in the thickness direction (D1) of the resin structure (2).

[0173] According to this aspect, it is possible to realize an electronic component module (1; 1b) with a high degree of integration.

[0174] In the electronic component module (1; 1b) according to the fifteenth aspect, in the fourteenth aspect, a height (H1) of the first electronic component (31) is higher than a height (H2) of the third electronic component (33) in the thickness direction (D1) of the resin structure (2).

[0175] According to this aspect, by arranging the first electronic component (31) in the recess (23), it is possible to reduce the height of the electronic component module (1; 1b).

[0176] In the electronic component module (1; 1a; 1b) according to the sixteenth aspect, in the fifteenth aspect, a height (H1) of the first electronic component (31) is higher than a height of the recess (23) in a thickness direction (D1) of the resin structure (2).

[0177] According to this aspect, by arranging the first electronic component (31) in the recess (23), it is possible to reduce the height of the electronic component module (1; 1a; 1b).

[0178] Description of Reference Numerals

[0179] 1, 1a, 1b: electronic component module;

[0180] 2: Resin structure;

[0181] 21: 1st main surface (one main surface);

[0182] 23: concave part;

[0183] 231: side;

[0184] 232: Bottom;

[0185] 3: Electronic components;

[0186] 31: 1st electronic component (electronic component);

[0187] 32: 2nd electronic component;

[0188] 33: 3rd electronic component;

[0189] 4, 4a, 4b: wiring layer;

[0190] 5: Columnar electrode;

[0191] 6: Insulation layer;

[0192] 13: the first support (support);

[0193] 131: 1st main surface;

[0194] 132: 2nd main surface;

[0195] 15: Sacrificial body;

[0196] D1: thickness direction;

[0197] H1, H2: height.

Claims

1. A method for manufacturing an electronic component module, comprising: A sacrificial body arrangement step of arranging a sacrificial body having a size smaller than that of the first main surface when viewed from the thickness direction of a support body having a first main surface and a second main surface on the first main surface; A resin molding step of molding a resin structure on the first main surface so as to cover the sacrificial body arranged on the first main surface; a recessed portion forming step of forming a recessed portion in the resin structure by removing the sacrificial body; a wiring layer forming step of forming a wiring layer spanning a side surface of the recessed portion and one main surface of the resin structure continuous with the side surface; and a component mounting step of mounting a first electronic component as an electronic component in the recessed portion, Prior to the resin molding step, the method further comprises: a second component placement step of placing a second electronic component on the first main surface so as not to overlap with the sacrificial body in the thickness direction of the support body, wherein the second electronic component is different from the first electronic component as the electronic component and has a smaller size than the first main surface when viewed in the thickness direction of the support body, In the resin molding step, the resin structure is molded so as to cover the sacrificial body and the second electronic component arranged on the first main surface. The method further comprises: a third component placement step of placing a third electronic component different from the first electronic component and the second electronic component on the side of the wiring layer opposite to the resin structure so as not to overlap with the first electronic component in the thickness direction of the resin structure; The second electronic component and the third electronic component are arranged in the thickness direction of the resin structure so that a portion of the third electronic component overlaps with the second electronic component in the thickness direction of the resin structure. In the thickness direction of the resin structure, the height of the first electronic component is higher than the height of the recessed portion, and the height of the first electronic component is higher than the height of the third electronic component.

2. The method for manufacturing an electronic component module according to claim 1, wherein: In the recess forming step, the sacrificial body is removed by etching.

3. The method for manufacturing an electronic component module according to claim 1 or 2, wherein: The method further includes: forming an insulating layer to form an insulating layer extending across at least the one main surface and the side surface of the recessed portion.

4. The method for manufacturing an electronic component module according to claim 1 or 2, wherein: Prior to the resin molding step, an electrode forming step of forming a columnar electrode on the first main surface is further provided.

5. The method for manufacturing an electronic component module according to claim 1 or 2, wherein: In the wiring layer forming step, the wiring layer is formed across the one main surface, the side surface of the recessed portion, and the bottom surface of the recessed portion.

6. The method for manufacturing an electronic component module according to claim 1 or 2, wherein: The sacrificial body is made of a material different from that of the resin structure.

7. An electronic component module comprising: The resin structure has a main surface, and a recess is provided on the main surface; a first electronic component as an electronic component disposed in the recess; and a wiring layer formed across the one main surface and the side surface of the recessed portion continuous with the one main surface and electrically connected to the first electronic component, The invention further comprises: a second electronic component which is different from the first electronic component as the electronic component; The second electronic component is built into the resin structure at a position that does not overlap with the first electronic component in the thickness direction of the resin structure. The invention further comprises: a third electronic component which is different from the first electronic component and the second electronic component; The third electronic component is disposed on the side of the wiring layer opposite to the resin structure so as not to overlap with the first electronic component in the thickness direction of the resin structure. The second electronic component and the third electronic component are arranged in the thickness direction of the resin structure so that a portion of the third electronic component overlaps with the second electronic component in the thickness direction of the resin structure. In the thickness direction of the resin structure, the height of the first electronic component is higher than the height of the recessed portion, and the height of the first electronic component is higher than the height of the third electronic component.

8. The electronic component module according to claim 7, wherein: The invention further includes a columnar electrode penetrating the resin structure in a thickness direction of the resin structure.

9. The electronic component module according to claim 7 or 8, wherein: The wiring layer is formed across the one main surface, the side surface of the recessed portion, and the bottom surface of the recessed portion.

10. The electronic component module according to claim 7 or 8, wherein: The invention further includes an insulating layer formed across at least the one main surface and the side surface of the recessed portion.

11. The electronic component module according to claim 7, wherein: The electronic component is an inductor.

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