Integrated circuit testing equipment

Abstract

The present invention belongs to the technical field of testing equipment, and specifically is an integrated circuit testing equipment, including a controller, a testing box, a mobile platform, a chuck, a transmission hole, a transmission rod, a transmission block, a rotating rod, a connecting rod, a sliding block and a sliding groove; a transmission hole is provided at a position corresponding to the chuck on one side of the testing box; transmission rods are slidably connected to the front and rear ends of the transmission hole; a transmission block is fixedly connected to the position corresponding to the chuck and the transmission rod; the transmission rods are engaged with the transmission blocks, and each transmission rod is hingedly connected to a rotating rod on the side away from the chuck; a sliding block is fixedly connected to the side of each rotating rod close to the chuck, and a connecting rod is fixedly connected between the two rotating rods; a sliding groove is provided at the lower end of the transmission block corresponding to the sliding block; the present invention solves the problem that in order to prevent the influence of particulate matter in the air on the detection process, the detection process is carried out in a clean room with a large area, thereby making cleaning control more difficult.

Description

Technical Field

[0001] The invention belongs to the technical field of testing equipment, in particular to an integrated circuit testing equipment. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function; during the inspection of integrated circuits, unqualified samples are marked to avoid wasting packaging costs.

[0003] For example, a Chinese patent with application number CN201520817357.9 discloses a probe station. When testing sample parameters, the driving assembly drives the support to move up and down to adjust the relative positions of the probe on the support and the mounting platform, so that the probe can be quickly separated or contacted with the test point of the sample. The operation process is convenient and efficient.

[0004] Although this technical solution uses a driving assembly to drive the support member to move up and down, so that the probe is quickly separated from the sample to be tested; however, in order to prevent the influence of particulate matter in the air on the detection process, the detection process is carried out in a clean room with a large area, which makes the cleaning control more difficult; based on this, the present invention designs an integrated circuit testing equipment to solve the technical problems existing in the above-mentioned prior art. Summary of the invention

[0005] In order to make up for the shortcomings of the prior art and solve the problem that in order to prevent the influence of particulate matter in the air on the detection process, the detection process is carried out in a clean room with a larger area, thereby making cleaning control more difficult, the present invention proposes an integrated circuit testing device.

[0006] The technical solution adopted by the present invention to solve its technical problems is as follows: an integrated circuit testing device described in the present invention comprises a controller, a test box, a mobile platform, a chuck, a sealing module and a transmission module; the mobile platform is fixedly connected to the lower end inside the test box; the upper end of the mobile platform is clamped with a chuck; the transmission module comprises a transmission hole, a transmission rod, a transmission block, a rotating rod, a connecting rod, a sliding block and a sliding groove; a transmission hole is provided at a position corresponding to the chuck on one side of the test box; the front and rear ends of the transmission hole are slidably connected with a transmission rod; the position corresponding to the chuck and the transmission rod is fixedly connected with a transmission block; the transmission rod is clamped with the transmission block, and each transmission rod is hinged with a rotating rod on one side away from the chuck; each of the rotating rods is fixedly connected with a sliding block on one side close to the chuck, and a connecting rod is fixedly connected between the two rotating rods; a sliding groove is provided at a position corresponding to the sliding block at the lower end of the transmission hole;

[0007] During the work, in the existing wafer inspection process, in order to prevent the particles in the air from affecting the inspection process, the inspection process is carried out in a Class VI clean room, but the control and maintenance of the clean room with a larger space is more difficult;

[0008] Therefore, the present invention sets a transmission module, firstly lifts the connecting rod upward to drive the rotating rod to rotate from a vertical state to a horizontal state, so that the sliding block on the rotating rod is slidably connected with the sliding groove, and then pushes the connecting rod in the direction of the chuck, the connecting rod drives the rotating rod and the transmission rod to move, and a slot is provided at a position corresponding to the chuck on the transmission rod, so that the transmission rod is engaged with the transmission block on the chuck; the upper end of the moving platform is engaged with the lower end of the chuck, and the moving platform can be moved in the horizontal and vertical directions, and the moving platform moves downward again to disengage from the chuck, and then the connecting rod is pulled outward to drive the chuck to move outward, The connecting rod is lowered to drive the rotating rod to return to the initial state; the wafer is then taken out from the storage position and placed on the chuck, which absorbs the wafer through vacuum; the connecting rod is then lifted and pushed to drive the chuck back to the initial position, and the moving platform also moves upward to the initial position to engage with the chuck; the moving platform drives the chuck upward to make the pad area on the wafer contact with the needle tip of the probe card, and then power is turned on to detect whether the chip can work normally. The moving platform then drives the chuck to move horizontally to adjust the position of the wafer, so that the detection device on the sealing module contacts the pad areas at different positions to complete the test process;

[0009] Because the present invention is provided with a conveying module, the test can be carried out inside a test box that can achieve the cleanliness level of a Class VI clean room. At the same time, the cleaning control difficulty of the test box is lower than that of a Class VI clean room, and the time that the wafer is in contact with the outside air after being taken out from the storage position is reduced, preventing the pad area on the wafer from being adhered to dirt and damaging the intermediate insulating layer during the test process, thereby further improving the reliability of the integrated circuit testing equipment.

[0010] Preferably, the sealing module includes an electric telescopic rod, a sealing plate, a visual recognition device, a driving block, a movable slide, a probe head and a probe card; the four corners of the upper end of the test box are fixedly connected with the electric telescopic rod; the upper end of the electric telescopic rod is fixedly connected with the sealing plate; the central position of the lower end of the sealing plate is fixedly connected with the visual recognition device, and the driving blocks are fixedly connected with the driving blocks on both sides of the lower end of the sealing plate; the lower end of the driving block is fixedly connected with the probe head; both sides of the upper end of the test box are provided with movable slides; one end of the probe head is slidably connected to the movable slide, and the other end of the probe head is slidably connected to the movable slide. The end card is connected to a probe card; during operation, because during the wafer detection process, if there are foreign objects on the needle tip of the probe card or the pad area of ​​the wafer, it will affect the contact effect between the needle tip of the probe card and the chip. In order to meet the electrical connection between the probe card and the chip, the probe card continues to press against the chip to achieve electrical contact, which can easily cause the middle insulating layer of the chip to be damaged, thereby affecting the stability of the chip. In severe cases, a short circuit or open circuit may occur in the lower metal circuit. Therefore, the present invention uses a sealing module, and the controller first controls the electric telescopic rod to extend to drive the sealing plate to move upward, and the sealing plate is lifted to drive the block to drive the probe head and the probe card to move along the moving slide; then observe whether there is dirt on the needle tip of the probe card or whether the needle tip of the probe card is deformed or bent. If there is dirt on the needle tip of the probe card, it is necessary to clean it with a cleaning paper of the same model first. If the needle tip of the probe card is deformed or bent, the probe card needs to be replaced first; the controller then controls the electric telescopic rod to retract, driving the sealing plate to move downward, so that the test box forms a closed working environment; then the wafer to be tested is placed on the chuck through the transmission module, and the mobile platform drives the chuck to move upward, so that the pad area on the wafer contacts the needle tip of the probe card, and then power is turned on to detect whether the chip can work normally, and the mobile platform drives the chuck to move horizontally to adjust the position of the wafer, so that the probe card contacts the pad areas at different positions to complete the test process; the staff watches the record of the real-time monitoring feedback of the test process by the visual recognition device on the computer screen in real time; because the sealing module is provided in the present invention, the probe card is inspected, wiped and replaced before the wafer is inspected, so as to prevent the dirt in the air from adhering to the needle tip of the probe card or the pad area of ​​the wafer, causing the middle insulating layer of the chip to be damaged, thereby improving the reliability of the integrated circuit test equipment test.

[0011] Preferably, an elastic dustproof cloth is fixedly connected to the surface of the test box at the upper end of the transmission hole; a dustproof block is fixedly connected to the lower end of the elastic dustproof cloth; a dustproof groove is provided on the rotating rod at a position corresponding to the dustproof block, and the dustproof block is engaged with the dustproof groove; during operation, the present invention arranges an elastic dustproof cloth, and after the wafer is placed in the chuck, the dustproof block on the elastic dustproof cloth is inserted into the dustproof groove of the rotating rod, so that the elastic dustproof cloth is stretched to cover the transmission hole, so that the test box remains airtight, and the cleanliness of the internal test environment is further ensured; when the chuck needs to be taken out, the rotating rod is flipped to a horizontal state so that the dustproof block can be separated from the dustproof groove under the elastic action of the elastic dustproof cloth; dirt is prevented from sticking to the wafer and affecting the contact between the probe head and the chip, thereby improving the safety of detection by integrated circuit testing equipment.

[0012] Preferably, a fixing hole is provided at one end of the probe card which is close to the probe head; a fixing block is slidably connected to the other end of the probe head; a reset spring is fixedly connected to the other end of the fixing block, and the other end of the reset spring is fixedly connected to the driving block; during operation, the present invention sets a fixing hole and a fixing block, and when the probe card needs to be disassembled for cleaning or replacement, one end of the fixing block is manually moved in the direction of the driving block, so that the fixing block is separated from the fixing hole, the reset spring is compressed, and then the probe card is removed; when the probe card is to be inserted again, one end of the probe card is inserted from the through hole at the lower end of the probe head, when one end of the probe card moves to the upper end of the probe head, the probe card pushes the fixing block to move in the direction of the driving block, and when the probe card moves to the fixing hole corresponding to the position of the fixing block, the fixing block enters the fixing hole; so that the probe head can be replaced conveniently; the fixing block slides along the inverted "T"-shaped slide groove on the probe head, so that the fixing block will not be separated from the probe head, so that after the fixing block is inserted into the fixing hole, the probe card will not move along the through hole due to the force on the needle tip; the contact between the needle tip of the probe head and the chip of the wafer is ensured to be stable, thereby improving the convenience of using the integrated circuit test equipment.

[0013] Preferably, the front and rear ends of the sealing plate are slidably connected with viewing columns; the lower end of the viewing column is hinged with a magnifying glass; when working, the present invention sets a magnifying glass, and after the electric telescopic rod is extended, the viewing column can be moved to the position corresponding to the probe card, and the probe card can be observed using the magnifying glass, so that it can be more clearly observed whether the needle tip of the probe card is dirty or the probe card is deformed, thereby avoiding the dirt on the probe card affecting the contact effect between the probe card and the chip, and further ensuring the stability of the testing process of the integrated circuit testing equipment.

[0014] Preferably, laser sensors are fixedly connected to the positions of the two probe heads corresponding horizontally to the needle heads of the probe card; the optical ports of the two laser sensors are arranged facing each other; when working, the present invention sets a laser sensor; before testing, the laser sensor senses the needle tip position of the probe card, and the laser sensor transmits the detection signal to the controller, and the controller processes the signal detected by the laser sensor through a built-in program. When the built-in program receives that the positions sensed by the two laser sensors are not in the same horizontal plane, the alarm program is activated, the test process is paused, and the staff adjusts the position of the probe card; the needle tips of the two probe cards are not in the same plane, causing one probe card to pierce the chip pad layer and the needle tip of the other probe card to have poor contact, and the contact surfaces between the probe card and the chip are not coplanar, which affects the contact effect between the probe card and the chip, and further ensures the safety of the integrated circuit during the testing process of the integrated circuit testing equipment.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. Compared with the traditional technical solutions, the integrated circuit testing equipment described in the present invention is provided with a conveying module, so that the test can be carried out inside a test box with the cleanliness level of a Class VI clean room. At the same time, the cleaning control difficulty of the test box is lower than that of a Class VI clean room, and the time for the wafer to be in contact with the outside air after being taken out from the storage position is reduced, and the pad area on the wafer is prevented from being contaminated and damaging the intermediate insulating layer during the test process, thereby further improving the reliability of the integrated circuit testing equipment.

[0017] 2. An integrated circuit testing device described in the present invention provides a fixing hole and a fixing block, and one end of the fixing block is manually moved toward the direction of the driving block, so that the fixing block is disengaged from the fixing hole, the reset spring is compressed, and then the probe card is removed; when the probe card is to be inserted again, one end of the probe card is inserted from the through hole at the lower end of the probe head, and when one end of the probe card moves to the upper end of the probe head, the probe card pushes the fixing block to move in the direction of the driving block, and when the probe card moves to the fixing block and corresponds to the position of the fixed block, the fixing block enters the fixing hole, thereby improving the convenience of using the integrated circuit testing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 is a stereogram of the present invention;

[0020] Figure 2 yes Figure 1 A partial enlarged view of the middle A;

[0021] Figure 3 yes Figure 1 A partial enlarged view of point B in the middle;

[0022] In the figure: 1. test box; 2. mobile platform; 3. chuck; 41. electric telescopic rod; 42. sealing plate; 43. visual recognition device; 44. driving block; 45. moving slide; 46. probe head; 47. probe card; 51. transmission hole; 52. transmission rod; 53. transmission block; 54. rotating rod; 55. connecting rod; 56. sliding block; 57. sliding groove; 6. elastic dustproof cloth; 7. dustproof block; 8. dustproof groove; 9. fixing hole; 10. fixing block; 11. reset spring; 12. viewing column; 13. magnifying glass; 14. laser sensor. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0024] like Figures 1 to 3 As shown, an integrated circuit test device described in the present invention includes a controller, a test box 1, a mobile platform 2, a chuck 3, a sealing module and a transmission module; the mobile platform 2 is fixedly connected to the lower end of the test box 1; the chuck 3 is clamped on the upper end of the mobile platform 2; the transmission module includes a transmission hole 51, a transmission rod 52, a transmission block 53, a rotating rod 54, a connecting rod 55, a sliding block 56 and a sliding groove 57; a transmission hole 51 is opened at a position corresponding to the chuck 3 on one side of the test box 1; the front and rear ends of the transmission hole 51 are slidably connected with the transmission rod 52; the chuck 3 is fixedly connected with the transmission block 53 at the position corresponding to the transmission rod 52; the transmission rod 52 is clamped with the transmission block 53, and each transmission rod 52 is hinged with a rotating rod 54 on the side away from the chuck 3; each of the rotating rods 54 is fixedly connected with a sliding block 56 on the side close to the chuck 3, and a connecting rod 55 is fixedly connected between the two rotating rods 54; a sliding groove 57 is opened at the lower end of the transmission hole 51 corresponding to the sliding block 56;

[0025] During the work, in the existing wafer inspection process, in order to prevent the particles in the air from affecting the inspection process, the inspection process is carried out in a Class VI clean room, but the control and maintenance of the clean room with a larger space is more difficult;

[0026] Therefore, the present invention sets a transmission module, firstly lifts the connecting rod 55 upward to drive the rotating rod 54 to rotate from a vertical state to a horizontal state, so that the sliding block 56 on the rotating rod 54 is slidably connected with the sliding groove 57, and then pushes the connecting rod 55 in the direction of the chuck 3, the connecting rod 55 drives the rotating rod 54 and the transmission rod 52 to move, and a slot is provided on the transmission rod 52 at a position corresponding to the chuck 3, so that the transmission rod 52 is engaged with the transmission block 53 on the chuck 3; the upper end of the mobile platform 2 is engaged with the lower end of the chuck 3, and the mobile platform 2 can be moved in the horizontal and vertical directions, and the mobile platform 2 moves downward again to disengage from the chuck 3, and then the connecting rod 55 is pulled out to drive the chuck 3 to move. The disk 3 is moved outward, and the connecting rod 55 is lowered to drive the rotating rod 54 to restore to the initial state; then the wafer is taken out from the storage position, and the wafer is placed on the chuck 3, and the chuck 3 absorbs the wafer through vacuum; then the connecting rod 55 is lifted up, and the connecting rod 55 is continued to be pushed to drive the chuck 3 to return to the initial position, and the moving platform 2 also moves upward to the initial position and engages with the chuck 3; the moving platform 2 drives the chuck 3 to move upward, so that the pad area on the wafer contacts the needle tip of the probe card 47, and then the power is turned on to detect whether the chip can work normally, and the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, so that the detection device on the sealing module contacts the pad areas at different positions to complete the test process;

[0027] Because the present invention is provided with a conveying module, the test can be carried out inside a test box that can achieve the cleanliness level of a Class VI clean room. At the same time, the cleaning control difficulty of the test box is lower than that of a Class VI clean room, and the time that the wafer is in contact with the outside air after being taken out from the storage position is reduced, preventing the pad area on the wafer from being adhered to dirt and damaging the intermediate insulating layer during the test process, thereby further improving the reliability of the integrated circuit testing equipment.

[0028] As an embodiment of the present invention, the sealing module includes an electric telescopic rod 41, a sealing plate 42, a visual recognition device 43, a driving block 44, a movable slide 45, a probe head 46 and a probe card 47; the electric telescopic rod 41 is fixedly connected to the four corners of the upper end of the test box 1; the upper end of the electric telescopic rod 41 is fixedly connected to the sealing plate 42; the visual recognition device 43 is fixedly connected to the center position of the lower end of the sealing plate 42, and the driving blocks 44 are fixedly connected to both sides of the lower end of the sealing plate 42; the lower end of the driving block 44 is fixedly connected to the probe head 46; Both sides are provided with movable slide grooves 45; one end of the probe head 46 is slidably connected to the movable slide groove 45, and the other end of the probe head 46 is clamped with a probe card 47; during operation, because during the wafer detection process, if there are foreign objects on the needle tip of the probe card 47 or the pad area of ​​the wafer, it will affect the contact effect between the needle tip of the probe card 47 and the chip. In order to meet the electrical connection between the probe card 47 and the chip, the probe card 47 continues to press against the chip to achieve an electrical contact state, which can easily cause the middle insulation layer of the chip to be damaged, thereby affecting the stability of the chip, and in severe cases, it will also cause a short circuit or open circuit in the lower metal circuit. Therefore, the present invention uses the sealing module, the controller first controls the electric telescopic rod 41 to extend to drive the sealing plate 42 to move upward, the sealing plate 42 lifts the driving block 44 to drive the probe head 46 and the probe card 47 to move along the moving slide 45; then observe whether there is dirt on the needle tip of the probe card 47 or whether the needle tip of the probe card 47 is deformed or bent. If there is dirt on the needle tip of the probe card 47, it is necessary to clean it with a cleaning paper of the same model; if the needle tip of the probe card 47 is deformed or bent, the probe card 47 needs to be replaced first; the controller then controls the electric telescopic rod 41 to contract, drive the sealing plate 42 to move downward, so that the test box 1 forms a closed working environment; the mobile platform 2 then drives the chuck 3 to move horizontally to adjust the position of the wafer, so that the probe card 47 contacts the pad areas at different positions to complete the test process; the staff watches the real-time monitoring feedback of the test process by the visual recognition device 43 on the computer screen in real time; because the present invention is provided with a sealing module, the probe card 47 is inspected, wiped and replaced before the wafer is inspected, so as to prevent the dirt in the air from adhering to the needle tip of the probe card 47 or the pad area of ​​the wafer, causing the middle insulation layer of the chip to be damaged, thereby improving the reliability of the integrated circuit test equipment test.

[0029] As an embodiment of the present invention, an elastic dustproof cloth 6 is fixedly connected to the surface of the test box 1 at the upper end of the transmission hole 51; a dustproof block 7 is fixedly connected to the lower end of the elastic dustproof cloth 6; a dustproof groove 8 is opened at a position corresponding to the dustproof block 7 on the rotating rod 54, and the dustproof block 7 is engaged with the dustproof groove 8; during operation, the present invention sets an elastic dustproof cloth 6, and after the wafer is placed in the chuck 3, the dustproof block 7 on the elastic dustproof cloth 6 is inserted into the dustproof groove 8 of the rotating rod 54, so that the elastic dustproof cloth 6 is stretched to cover the transmission hole 51, so that the test box 1 remains airtight, and the cleanliness of the internal test environment is further ensured; when the chuck 3 needs to be taken out, the rotating rod 54 is flipped to a horizontal state so that the dustproof block 7 can be separated from the dustproof groove 8 under the elastic action of the elastic dustproof cloth 6; dirt is prevented from sticking to the wafer to affect the contact between the probe head 47 and the chip, thereby improving the safety of detection by the integrated circuit test equipment.

[0030] As an embodiment of the present invention, a fixing hole 9 is provided at one end of the probe card 47 close to the probe head 46; a fixing block 10 is slidably connected to the other end of the probe head 46; a return spring 11 is fixedly connected to the other end of the fixing block 10, and the other end of the return spring 11 is fixedly connected to the driving block 44; during operation, the present invention provides the fixing hole 9 and the fixing block 10, and when the probe card 47 needs to be disassembled for cleaning or replacement, one end of the fixing block 10 is manually moved toward the driving block 44, so that the fixing block 10 is separated from the fixing hole 9, the return spring 11 is compressed, and then the probe card 47 is removed; when the probe card 47 is to be inserted again, one end of the probe card 47 is removed from the probe head 4 6, when one end of the probe card 47 moves to the upper end of the probe head 46, the probe card 47 pushes the fixed block 10 to move in the direction of the driving block 44, and when the probe card 47 moves to the fixing hole 9 and corresponds to the position of the fixed block 10, the fixed block 10 enters the fixing hole 9, so that the probe head 47 can be replaced conveniently; the fixed block 10 slides along the inverted "T"-shaped slide groove on the probe head 46, so that the fixed block 10 will not be separated from the probe head 46, so that after the fixed block 10 is inserted into the fixing hole 9, the probe card 47 will not move along the through hole due to the force on the needle tip; ensuring that the contact between the needle tip of the probe head 47 and the chip of the wafer is stable, and better improving the convenience of using the integrated circuit test equipment.

[0031] As an embodiment of the present invention, the front and rear ends of the sealing plate 42 are slidably connected with viewing columns 12; the lower end of the viewing column 12 is hinged with a magnifying glass 13; when working, the present invention sets the magnifying glass 13, and after the electric telescopic rod 41 is extended, the viewing column 12 can be moved to the position corresponding to the probe card 47, and the magnifying glass 13 can be used to observe the probe card 47, so that it can be more clearly observed whether the needle tip of the probe card 47 is dirty or whether the probe card 47 is deformed, thereby avoiding the dirt on the probe card 47 affecting the contact effect between the probe card 47 and the chip, and further ensuring the stability of the testing process of the integrated circuit testing equipment.

[0032] As an embodiment of the present invention, the two probe heads 46 and the probe card 47 needle heads are fixedly connected with laser sensors 14 at positions corresponding to each other horizontally; the optical ports of the two laser sensors 14 are arranged facing each other; when working, the present invention sets the laser sensor 14; before testing, the laser sensor 14 senses the needle tip position of the probe card 47, and the laser sensor 14 transmits the detection signal to the controller, and the controller processes the signal detected by the laser sensor 14 through the built-in program. When the built-in program receives that the positions sensed by the two laser sensors 14 are not in the same horizontal plane, the alarm program is activated, the test process is paused, and the staff adjusts the position of the probe card 47; to prevent the needle tips of the two probe cards 47 from not being in the same plane, causing one probe card 47 to pierce the chip pad layer and the needle tip of the other probe card 47 to have poor contact, to avoid the contact surfaces between the probe card 47 and the chip being not coplanar, affecting the contact effect between the probe card 47 and the chip, and further ensuring the safety of the integrated circuit during the testing process of the integrated circuit testing equipment.

[0033] The specific workflow is as follows:

[0034] Because in the existing wafer inspection process, in order to prevent the influence of particulate matter in the air on the inspection process, the inspection process is carried out in a Class VI clean room, but the clean room with a larger space is more difficult to control and maintain; therefore, the present invention sets a transmission module, first lifts the connecting rod 55 upward to drive the rotating rod 54 to rotate from a vertical state to a horizontal state, so that the sliding block 56 on the rotating rod 54 is slidably connected with the sliding groove 57, and then pushes the connecting rod 55 in the direction of the chuck 3, and the connecting rod 55 drives the rotating rod 54 and the transmission rod 52 to move. A slot is provided on the transmission rod 52 at a position corresponding to the chuck 3, so that the transmission rod 52 is engaged with the transmission block 53 on the chuck 3; the upper end of the mobile platform 2 is engaged with the lower end of the chuck 3, and the mobile platform 2 can be realized in the horizontal The mobile platform 2 moves in the axial and vertical directions, and then moves downward to disengage from the chuck 3, and then the connecting rod 55 is pulled outward to drive the chuck 3 to move outward, and the connecting rod 55 is lowered to drive the rotating rod 54 to restore the initial state; then the wafer is taken out from the storage position, and the wafer is placed on the chuck 3, and the chuck 3 adsorbs the wafer through vacuum; then the connecting rod 55 is lifted up again, and the connecting rod 55 is continued to be pushed to drive the chuck 3 to return to the initial position, and the mobile platform 2 also moves upward to the initial position and engages with the chuck 3; the mobile platform 2 drives the chuck 3 to move upward so that the pad area on the wafer contacts the needle tip of the probe card 47, and then the power is turned on to detect whether the chip can work normally, and the mobile platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer so that the detection device on the sealing module is in contact with the non- The test process is completed by contacting the pad area at the same position; because the present invention is provided with a conveying module, the test can be carried out inside a test box that can reach the cleanliness of a Class 6 clean room. At the same time, the cleaning control difficulty of the test box is less than that of a Class 6 clean room, which reduces the time the wafer is in contact with the outside air after being taken out from the storage position, and prevents the pad area on the wafer from being contaminated and damaging the intermediate insulating layer during the test, thereby further improving the reliability of the integrated circuit testing equipment; because during the wafer detection process, if the needle tip of the probe card 47 or the pad area of ​​the wafer is contaminated with debris, it will affect the contact effect between the needle tip of the probe card 47 and the chip. In order to meet the electrical connection between the probe card 47 and the chip, the probe card 47 continues to press against the chip to achieve an electrical contact state, which is easy to cause the intermediate insulation layer of the chip to be damaged. The insulating layer is damaged, thereby affecting the stability of the chip. In severe cases, the lower metal circuit may be short-circuited or open-circuited. Therefore, the present invention uses a sealing module. The controller first controls the electric telescopic rod 41 to extend and drive the sealing plate 42 to move upward. The sealing plate 42 lifts the driving block 44 to drive the probe head 46 and the probe card 47 to move along the moving slide 45. Then observe whether there is dirt on the needle tip of the probe card 47 or whether the needle tip of the probe card 47 is deformed or bent. If there is dirt on the needle tip of the probe card 47, it is necessary to clean it with a cleaning paper of the same model. If the needle tip of the probe card 47 is deformed or bent, the probe card 47 needs to be replaced first. The controller then controls the electric telescopic rod 41 to contract and drive the sealing plate 42 to move downward, so that the test box 1 forms a closed working environment.Then the wafer to be tested is placed on the chuck 3 through the conveying module, and the mobile platform 2 drives the chuck 3 to move upward, so that the pad area on the wafer contacts the needle tip of the probe card 47, and then the power is turned on to detect whether the chip can work normally. The mobile platform 2 then drives the chuck 3 to move horizontally to adjust the position of the wafer, so that the probe card 47 contacts the pad areas at different positions to complete the test process; the staff watches the real-time monitoring and feedback of the test process by the visual recognition device 43 on the computer screen in real time; because the present invention is provided with a sealing module, the probe card 47 is inspected, wiped and replaced before the wafer is inspected, so as to prevent the dirt in the air from adhering to the needle tip of the probe card 47 or the pad area of ​​the wafer, causing the middle insulating layer of the chip to be damaged, thereby improving The reliability of the integrated circuit test equipment test is improved; because the present invention sets an elastic dustproof cloth 6, when the wafer is placed in the chuck 3, the dustproof block 7 on the elastic dustproof cloth 6 is inserted into the dustproof groove 8 of the rotating rod 54, so that the elastic dustproof cloth 6 is stretched to cover the transmission hole 51, so that the test box 1 remains airtight, and the cleanliness of the internal test environment is further ensured; when the chuck 3 needs to be taken out, the rotating rod 54 is flipped to a horizontal state so that the dustproof block 7 can be separated from the dustproof groove 8 under the elastic action of the elastic dustproof cloth 6; dirt is prevented from sticking to the wafer and affecting the contact between the probe head 47 and the chip, thereby improving the safety of the integrated circuit test equipment detection; because the present invention sets a fixing hole 9 and a fixing block 10, when the probe card 47 needs to be disassembled for cleaning or When replacing, one end of the fixing block 10 is manually moved in the direction of the driving block 44, so that the fixing block 10 is disengaged from the fixing hole 9, the reset spring 11 is compressed, and then the probe card 47 is removed; when the probe card 47 is to be inserted again, one end of the probe card 47 is inserted from the through hole at the lower end of the probe head 46, and when one end of the probe card 47 is moved to the upper end of the probe head 46, the probe card 47 pushes the fixing block 10 to move in the direction of the driving block 44, and when the probe card 47 moves to the fixing hole 9 and corresponds to the position of the fixing block 10, the fixing block 10 enters the fixing hole 9, so that the probe head 47 can be replaced conveniently; the fixing block 10 slides along the inverted "T"-shaped slide groove on the probe head 46, so that the fixing block 10 will not be disengaged from the probe head 46, thereby fixing the block After the probe card 47 is inserted into the fixing hole 9, the probe card 47 will not move along the through hole due to the force on the needle tip; the contact between the needle tip of the probe head 47 and the chip of the wafer is ensured to be stable, thereby improving the convenience of using the integrated circuit test equipment; because the present invention is provided with a magnifying glass 13, when the electric telescopic rod 41 is extended, the magnifying glass 13 can be used to observe the probe card 47 by moving the viewing column 12 to the corresponding position of the probe card 47, and the probe card 47 can be observed more clearly to see whether the needle tip of the probe card 47 is dirty or whether the probe card 47 is deformed, thereby avoiding the dirt on the probe card 47 from affecting the contact effect between the probe card 47 and the chip, thereby further ensuring the stability of the test process of the integrated circuit test equipment; and because the present invention is provided with a laser sensor 14;Before the test, the laser sensor 14 senses the position of the needle tip of the probe card 47, and the laser sensor 14 transmits the detection signal to the controller. The controller processes the signal detected by the laser sensor 14 through the built-in program. When the built-in program receives that the positions sensed by the two laser sensors 14 are not in the same horizontal plane, the alarm program will be activated, the test process will be suspended, and the staff will adjust the position of the probe card 47; to prevent the needle tips of the two probe cards 47 from not being in the same plane, causing one probe card 47 to pierce the chip pad layer, and the needle tip of the other probe card 47 to have poor contact, to avoid the contact surface between the probe card 47 and the chip is not coplanar, affecting the contact effect of the probe card 47 and the chip, and further ensuring the safety of the integrated circuit during the test of the integrated circuit test equipment. ;

[0035] The front, back, left, right, top and bottom mentioned above are based on the perspective of observation of the person. The side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present invention.

[0037] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An integrated circuit testing device, characterized in that: The invention comprises a controller, a test box (1), a mobile platform (2), a chuck (3), a sealing module and a transmission module; the mobile platform (2) is fixedly connected to the lower end of the test box (1); the chuck (3) is clamped on the upper end of the mobile platform (2); the transmission module comprises a transmission hole (51), a transmission rod (52), a transmission block (53), a rotating rod (54), a connecting rod (55), a sliding block (56) and a sliding groove (57); a transmission hole (51) is provided at a position corresponding to the chuck (3) on one side of the test box (1); the front and rear ends of the transmission hole (51) are provided with a plurality of transmission holes (51). The ends of the chuck (3) are slidably connected with a transmission rod (52); a transmission block (53) is fixedly connected at a position corresponding to the transmission rod (52); the transmission rod (52) is engaged with the transmission block (53), and a rotating rod (54) is hinged on a side of each transmission rod (52) away from the chuck (3); a sliding block (56) is fixedly connected to a side of each rotating rod (54) close to the chuck (3), and a connecting rod (55) is fixedly connected between the two rotating rods (54); a sliding groove (57) is provided at a position corresponding to the sliding block (56) at the lower end of the transmission hole (51); The sealing module comprises an electric telescopic rod (41), a sealing plate (42), a visual recognition device (43), a driving block (44), a movable slide groove (45), a probe head (46) and a probe card (47); the electric telescopic rod (41) is fixedly connected to the four corners of the upper end of the test box (1); the upper end of the electric telescopic rod (41) is fixedly connected to the sealing plate (42); the visual recognition device (43) is fixedly connected to the center position of the lower end of the sealing plate (42), and the driving blocks (44) are fixedly connected to both sides of the lower end of the sealing plate (42); the lower end of the driving block (44) is fixedly connected to the probe head (46); the movable slide groove (45) is opened on both sides of the upper end of the test box (1); one end of the probe head (46) is slidably connected to the movable slide groove (45), and the other end of the probe head (46) is clamped with the probe card (47).

2. An integrated circuit testing device according to claim 1, characterized in that: An elastic dustproof cloth (6) is fixedly connected to the surface of the test box (1) at the upper end of the transmission hole (51); a dustproof block (7) is fixedly connected to the lower end of the elastic dustproof cloth (6); a dustproof groove (8) is provided on the rotating rod (54) at a position corresponding to the dustproof block (7), and the dustproof block (7) is engaged with the dustproof groove (8).

3. An integrated circuit testing device according to claim 1, characterized in that: A fixing hole (9) is provided at one end of the probe card (47) which is close to the probe head (46); the other end of the probe head (46) is slidably connected to a fixing block (10); the other end of the fixing block (10) is fixedly connected to a return spring (11), and the other end of the return spring (11) is fixedly connected to the driving block (44).

4. The integrated circuit testing device according to claim 1, characterized in that: The front and rear ends of the sealing plate (42) are slidably connected with a viewing column (12); the lower end of the viewing column (12) is hinged with a magnifying glass (13).

5. The integrated circuit testing device according to claim 1, characterized in that: The two probe heads (46) and the probe card (47) are fixedly connected to laser sensors (14) at positions corresponding to the needle heads' horizontality; the optical ports of the two laser sensors (14) are arranged facing each other.

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