Resonator and communication device

Abstract

The application provides a resonator and a communication device, the resonator comprising a base, a wafer and a cover plate; the wafer is arranged on the base; the cover plate is arranged on the base and covers the wafer; wherein the angle between the wafer and the optical axis is a first preset angle. The resonator provided by the application enables the wafer with the first preset angle between the wafer and the optical axis to be installed in the resonator, so that the change of the resonant frequency of the resonator reaches a minimum with the change of the ambient temperature at the ambient temperature used by the resonator, the resonant frequency of the resonator is prevented from changing greatly with the change of the ambient temperature when the resonator is used, the function of the resonator is prevented from being affected, and thus the resonator has high stability and precision.

Description

Technical Field

[0001] The present invention relates to the field of crystal resonators, and in particular to a resonator and communication equipment. Background Art

[0002] At present, in related technologies, the use of crystal resonators is becoming more and more extensive, but the frequency of the crystal resonator will change greatly with the ambient temperature within a certain temperature change range, which makes the frequency of the crystal resonator unable to remain stable when the ambient temperature changes. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] To this end, a first aspect of the present invention provides a resonator.

[0005] A second aspect of the present invention provides a communication device.

[0006] In view of this, a first aspect of the present invention provides a resonator, comprising a base, a chip and a cover; the chip is arranged on the base; the cover is arranged on the base and covers the chip; wherein the angle between the optical axes of the chips is a first preset angle.

[0007] In this technical solution, the resonator includes a base, a chip and a cover plate, the chip is arranged on the base; the cover plate is arranged on the base and covers the chip, thereby realizing the installation and fixation of the chip, and the angle between the chip and the optical axis is set to a first preset angle, so that the chip with the first preset angle between the chip and the optical axis of the crystal is installed in the resonator, thereby minimizing the change in the resonant frequency of the resonator as the ambient temperature changes under the ambient temperature of use, avoiding the resonant frequency of the resonator to change greatly with the ambient temperature when the resonator is in use, avoiding affecting the function of the resonator, and thus realizing extremely high stability and precision of the resonator.

[0008] Specifically, the chip is a piezoelectric quartz crystal, which exhibits a piezoelectric effect. Due to the peculiarities of its structure, the piezoelectric effect only occurs in certain directions and under the action of certain forces. When a quartz crystal is subjected to a force along the X-axis, a piezoelectric effect occurs in the X-direction, but not in the Y and Z directions. When a quartz crystal is subjected to a force along the Y-axis, a piezoelectric effect occurs in the X-direction, but not in the Y and Z directions. If a force along the Z-axis is applied, no piezoelectric effect occurs. Therefore, the X-axis is also called the electrical axis, and the Y-axis is called the mechanical axis. Although quartz crystal exhibits birefringence, birefringence does not occur when light is incident along the Z-axis, so the Z-axis is also called the optical axis. That is, the first preset angle between the chip and the optical axis is the angle between the chip and the crystal's Z-axis.

[0009] Specifically, when the ambient temperature is greater than or equal to -5 degrees and less than or equal to 60 degrees, the resonant frequency of the resonator will reach a minimum as the ambient temperature changes.

[0010] Specifically, the wafer is cut on the crystal using an AT cut method, with the length direction of the wafer parallel to the X axis, the thickness direction parallel to the Y axis, and a pair of parallel sides parallel to the X axis of the crystal.

[0011] Specifically, replacing TCXO (temperature compensated crystal oscillator) crystals with quartz crystal resonators can greatly reduce production costs while ensuring frequency accuracy and high stability.

[0012] In addition, the resonator in the above technical solution provided by the present invention may also have the following additional technical features:

[0013] In one technical solution of the present invention, the first preset angle is greater than or equal to 35 degrees and 45 seconds, and less than or equal to 35 degrees and 01 minute and 15 seconds.

[0014] In this technical solution, the first preset angle is greater than or equal to 35 degrees and 45 seconds and less than or equal to 35 degrees and 01 minutes and 15 seconds, so that when the first preset angle is at any angle in this angle range, the relative change of the resonant frequency of the crystal resonator in the thickness shear mode is very small.

[0015] Specifically, when the first preset angle is greater than or equal to 35 degrees and 45 seconds and less than or equal to 35 degrees and 01 minute and 15 seconds, and the ambient temperature is between -5 degrees and 60 degrees, the relative change in resonant frequency Δf (frequency change value) / f (frequency) will be between greater than or equal to -3 and less than or equal to +3.

[0016] In one technical solution of the present invention, the first preset angle is 35 degrees and 01 minutes.

[0017] In this technical solution, when the first preset angle is exactly 35 degrees and 01 minutes, the relative change Δf (frequency change value) / f (frequency) of the resonator's resonant frequency will reach a minimum when the ambient temperature is -5 degrees to 60 degrees, thereby making the resonant frequency of the resonator more stable.

[0018] Specifically, when the first preset angle is 35 degrees and 01 minutes and the ambient temperature is between -5 degrees and 60 degrees, the relative change of the resonant frequency Δf (frequency change value) / f (frequency) will be greater than or equal to -1.5 and less than or equal to +1.5.

[0019] In one technical solution of the present invention, the resonator further includes a support portion, which is annular and disposed between the cover and the base; wherein the cover, the support portion and the base are surrounded by a cavity, and the chip is located in the cavity.

[0020] In this technical solution, the resonator also includes a support portion, which is annular and is arranged between the cover plate and the base, so that the support portion completely supports the cover plate on all sides; the cover plate, the support portion and the base are surrounded by a cavity, so that the chip can be located in the cavity, and the cavity formed by the cover plate, the support portion and the base can not only protect the chip in the cavity, but also prevent other external substances or impurities from entering the cavity and affecting the structure of the chip, thereby avoiding affecting the resonator.

[0021] Specifically, the cover plate is a metal cover plate.

[0022] Specifically, the supporting portion is a fallable ring.

[0023] In one technical solution of the present invention, the resonator further includes a protrusion, which is provided on at least one side of the base and is located in the cavity; at least one side of the chip is placed on the protrusion.

[0024] In this technical solution, the resonator also includes a protrusion, which is arranged on one side of the base in the cavity. By arranging the protrusion on the base in the cavity and placing one side of the chip on the protrusion, the chip can be set up in the cavity, thereby realizing the installation and fixation of the chip. Setting up the chip can also prevent the chip from directly contacting the base when the resonator is working, thereby preventing the resonator base from affecting the structure of the chip.

[0025] Specifically, the resonator further includes protrusions, which are arranged on both sides of the base and located in the cavity; both sides of the chip are placed on the two protrusions.

[0026] In one technical solution of the present invention, the chip includes at least two electrodes, a chip body and a conductive adhesive, wherein the chip body is connected to the at least two electrodes; the conductive adhesive is arranged on the protrusion and connected to the at least two electrodes.

[0027] In this technical solution, at least two electrodes, a chip body and conductive glue are provided in the chip. One of the two electrodes is a negative electrode and the other is a positive electrode. The chip body is connected to the at least two electrodes, so that current can flow between the chip body and the two electrodes of the chip. The conductive glue is provided on the protrusion and connected to the at least two electrodes. Since the conductive glue is sticky, the chip can be connected to the protrusion together, thereby achieving fixation of the chip.

[0028] In a technical solution of the present invention, the number of the conductive adhesives is at least two.

[0029] In this technical solution, the number of conductive adhesives is at least two, so that at least two electrodes in the chip are connected to at least two points of conductive adhesive.

[0030] Specifically, the number of the conductive adhesives is 4.

[0031] In one technical solution of the present invention, the resonator further includes a pad and at least two conductive layers, the pad is arranged at the bottom of the base; the at least two conductive layers are arranged on the pad; and the at least two conductive layers pass through the base and are connected to the conductive glue.

[0032] In this technical solution, a solder pad is also provided in the resonator, and at least two conductive layers are provided on the solder pad, and these two conductive layers are connected to the conductive glue on the base and the protrusion, so that the chip is electrically connected to the conductive layer on the solder pad, and then the electrical connection between the inside and outside of the resonator is realized.

[0033] Specifically, a through hole communicating with the inside and outside of the cavity is provided on the base of the resonator, and at least two conductive layers on the pad pass through the through hole on the base and are connected to the conductive glue on the protrusion.

[0034] Specifically, the at least two conductive layers are two disconnected conductive layers.

[0035] In a technical solution of the present invention, the resonator further includes a first packaging glue and a second packaging glue, the first packaging glue is arranged between the cover and the support portion; the second packaging glue is arranged between the support portion and the base.

[0036] In this technical solution, the resonator also includes a first packaging glue and a second packaging glue. The first packaging glue is arranged between the cover plate and the support part; the second packaging glue is arranged between the support part and the base. By arranging the first packaging glue between the cover plate and the support part and arranging the second packaging glue between the support part and the base, the resonator is sealed to prevent impurities from entering the resonator, thereby affecting the accuracy and stability of the resonator.

[0037] A second aspect of the present invention provides a communication device comprising the above-mentioned resonator. Therefore, the communication device has all the beneficial effects of the above-mentioned resonator.

[0038] In this technical solution, the communication equipment includes a resonator, and the resonator includes a base, a chip and a cover plate, wherein the chip is arranged on the base; the cover plate is arranged on the base and covers the chip, thereby realizing the installation and fixation of the chip, and the angle between the chip and the optical axis is set to a first preset angle, so that the chip with the first preset angle between the chip and the optical axis of the crystal is installed in the resonator, thereby minimizing the change in the resonant frequency of the resonator as the ambient temperature changes under the ambient temperature of use, avoiding the resonant frequency of the resonator from changing greatly with the ambient temperature when the resonator is in use, avoiding affecting the function of the resonator, and thereby realizing extremely high stability and precision of the resonator.

[0039] Specifically, the chip is a piezoelectric quartz crystal, which exhibits a piezoelectric effect. Due to the peculiarities of its structure, the piezoelectric effect only occurs in certain directions and under the action of certain forces. When a quartz crystal is subjected to a force along the X-axis, a piezoelectric effect occurs in the X-direction, but not in the Y and Z directions. When a quartz crystal is subjected to a force along the Y-axis, a piezoelectric effect occurs in the X-direction, but not in the Y and Z directions. If a force along the Z-axis is applied, no piezoelectric effect occurs. Therefore, the X-axis is also called the electrical axis, and the Y-axis is called the mechanical axis. Although quartz crystal exhibits birefringence, birefringence does not occur when light is incident along the Z-axis, so the Z-axis is also called the optical axis. That is, the first preset angle between the chip and the optical axis is the angle between the chip and the crystal's Z-axis.

[0040] Specifically, when the ambient temperature is greater than or equal to -5 degrees and less than or equal to 60 degrees, the resonant frequency of the resonator will reach a minimum as the ambient temperature changes.

[0041] Specifically, the communication equipment is a walkie-talkie. When the ambient temperature is greater than or equal to -5 degrees and less than or equal to 60 degrees, the resonant frequency of the resonator will reach a minimum as the ambient temperature changes, making the resonant frequency highly stable and accurate, thereby enabling the walkie-talkie to be used for communication and command and dispatch between group members, thereby improving communication efficiency and enhancing the ability to respond quickly to emergencies.

[0042] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0044] Figure 1 shows an exploded view of a resonator according to one embodiment of the present invention;

[0045] Figure 2 shows a schematic diagram of a resonator according to an embodiment of the present invention;

[0046] Figure 3 shows a schematic diagram of a change in the resonant frequency of a resonator according to an embodiment of the present invention;

[0047] Figure 4 shows a schematic diagram of a crystal according to an embodiment of the present invention;

[0048] Figure 5 A schematic diagram of a first preset angle of a wafer according to an embodiment of the present invention is shown.

[0049] in, Figures 1 to 5 The corresponding relationship between the reference numerals and component names is as follows:

[0050] 100 resonator, 110 base, 120 chip, 122 electrode, 124 chip body, 126 conductive adhesive, 130 cover, 140 first preset angle, 150 support portion, 160 protrusion, 170 pad. DETAILED DESCRIPTION

[0051] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other.

[0052] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0053] Refer to the following Figures 1 to 5 The resonator and communication device according to some embodiments of the present invention are described.

[0054] Example 1:

[0055] like Figure 1 、 Figure 2 、 Figure 4 and Figure 5 As shown, this embodiment provides a resonator 100, including a base 110, a chip 120 and a cover 130; the chip 120 is arranged on the base 110; the cover 130 is covered on the base 110 and covers the chip 120; wherein the angle between the chip 120 and the optical axis is a first preset angle 140.

[0056] In this technical solution, the resonator 100 includes a base 110, a chip 120 and a cover 130. The chip 120 is arranged on the base 110; the cover 130 is covered on the base 110 and covers the chip 120, thereby realizing the installation and fixation of the chip 120, and the angle between the chip 120 and the optical axis is set to a first preset angle 140, so that the chip 120 with the first preset angle 140 to the optical axis of the crystal is installed in the resonator 100, thereby minimizing the change in the resonant frequency of the resonator 100 as the ambient temperature changes under the ambient temperature of use, avoiding the resonant frequency of the resonator 100 from changing significantly with the ambient temperature when the resonator 100 is in use, avoiding affecting the function of the resonator 100, and thus achieving extremely high stability and precision of the resonator 100.

[0057] Specifically, chip 120 is a piezoelectric quartz crystal that exhibits a piezoelectric effect. Due to the peculiarities of its structure, the piezoelectric effect only occurs in certain directions and under certain forces. When a force acts along the X-axis, the quartz crystal produces a piezoelectric effect in the X-direction, but not in the Y and Z directions. When a force acts along the Y-axis, the quartz crystal produces a piezoelectric effect in the X-direction, but not in the Y and Z directions. If a force acts along the Z-axis, the piezoelectric effect does not occur. Therefore, the X-axis is also called the electrical axis, and the Y-axis is called the mechanical axis. Although quartz crystal exhibits birefringence, birefringence does not occur when light is incident along the Z-axis. Therefore, the Z-axis is also called the optical axis. That is, the first preset angle 140 between chip 120 and the optical axis is the angle between chip 120 and the crystal's Z-axis.

[0058] Specifically, when the ambient temperature is greater than or equal to -5 degrees and less than or equal to 60 degrees, the resonant frequency of the resonator 100 will reach a minimum as the ambient temperature changes.

[0059] Specifically, the wafer 120 is cut on the crystal using an AT cut method, wherein the length direction of the wafer 120 is parallel to the X axis, the thickness direction is parallel to the Y axis, and a pair of parallel sides are parallel to the X axis of the crystal.

[0060] Specifically, using the quartz crystal resonator 100 to replace a TCXO (temperature compensated crystal oscillator) crystal can greatly reduce production costs while ensuring frequency accuracy and high stability.

[0061] Example 2:

[0062] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0063] like Figure 3 and Figure 5 As shown, the first preset angle 140 is greater than or equal to 35 degrees and 45 seconds, and less than or equal to 35 degrees and 01 minutes and 15 seconds.

[0064] In this technical solution, the first preset angle 140 is greater than or equal to 35 degrees and 45 seconds and less than or equal to 35 degrees and 1 minute and 15 seconds, so that when the first preset angle 140 is at any angle in this angle range, the relative change of the resonant frequency of the resonator 100 in the thickness shear mode is very small.

[0065] Specifically, when the first preset angle 140 is greater than or equal to 35 degrees 45 seconds and less than or equal to 35 degrees 01 minute 15 seconds, and the ambient temperature is between -5 degrees and 60 degrees, the relative change in resonant frequency Δf (frequency change value) / f (frequency) will be between greater than or equal to -3 and less than or equal to +3.

[0066] Example 3:

[0067] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0068] like Figure 3 and Figure 5 As shown, the first preset angle 140 is 35 degrees and 01 minutes.

[0069] In this technical solution, when the first preset angle 140 is exactly 35 degrees and 01 minutes, the relative change Δf (frequency change value) / f (frequency) of the resonant frequency of the resonator 100 will reach a minimum when the ambient temperature is between -5 degrees and 60 degrees, thereby making the resonant frequency of the resonator 100 more stable.

[0070] Specifically, when the first preset angle 140 is 35 degrees and 01 minutes and the ambient temperature is between -5 degrees and 60 degrees, the relative change of the resonant frequency Δf (frequency change value) / f (frequency) will be greater than or equal to -1.5 and less than or equal to +1.5.

[0071] Example 4:

[0072] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0073] like Figure 1 and Figure 2 As shown, the resonator 100 further includes a support portion 150 , which is annular and disposed between the cover 130 and the base 110 ; wherein the cover 130 , the support portion 150 and the base 110 surround a cavity, and the chip 120 is located in the cavity.

[0074] In this technical solution, the resonator 100 also includes a support portion 150, which is annular and is arranged between the cover plate 130 and the base 110, so that the support portion 150 completely supports the cover plate 130 on all sides; the cover plate 130, the support portion 150 and the base 110 are surrounded by a cavity, so that the chip 120 can be located in the cavity, so that the cavity formed by the cover plate 130, the support portion 150 and the base 110 can not only protect the chip 120 in the cavity, but also prevent other external substances or impurities from entering the cavity and affecting the structure of the chip 120, thereby avoiding affecting the resonator 100.

[0075] Specifically, the cover plate 130 is a metal cover plate 130 .

[0076] Specifically, the support portion 150 is a kovable ring.

[0077] Embodiment 5:

[0078] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0079] like Figure 1 and Figure 2 As shown, the resonator 100 further includes a protrusion 160 , which is disposed on at least one side of the base 110 and located within the cavity; at least one side of the chip 120 is placed on the protrusion 160 .

[0080] In this technical solution, the resonator 100 also includes a protrusion 160, which is arranged on one side of the base 110 in the cavity. By arranging the protrusion 160 on the base 110 in the cavity and placing one side of the chip 120 on the protrusion 160, the chip 120 can be set up in the cavity, thereby realizing the installation and fixation of the chip 120. Setting up the chip 120 can also prevent the chip 120 from directly contacting the base 110 when the resonator 100 is working, thereby preventing the base 110 of the resonator 100 from affecting the structure of the chip 120.

[0081] Specifically, the resonator 100 further includes protrusions 160 . The protrusions 160 are disposed on both sides of the base 110 and are located in the cavity. Both sides of the chip 120 are placed on the two protrusions 160 .

[0082] Example 6:

[0083] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0084] like Figure 1 and Figure 2 As shown, the chip 120 includes at least two electrodes 122 , a chip body 124 and a conductive adhesive 126 . The chip body 124 is connected to the at least two electrodes 122 . The conductive adhesive 126 is disposed on the protrusion 160 and is connected to the at least two electrodes 122 .

[0085] In this technical solution, at least two electrodes 122, a chip body 124 and a conductive glue 126 are provided in the chip 120. One of the two electrodes 122 is a negative electrode and the other is a positive electrode. The chip body 124 is connected to the at least two electrodes 122, so that current can flow between the chip body 124 and the two electrodes 122 of the chip 120. The conductive glue 126 is provided on the protrusion 160 and connected to the at least two electrodes 122. Since the conductive glue 126 is sticky, the chip 120 can be connected to the protrusion 160, thereby achieving fixation of the chip 120.

[0086] Embodiment seven:

[0087] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0088] like Figure 1 As shown, the number of the conductive adhesives 126 is at least two.

[0089] In this technical solution, the number of the conductive adhesives 126 is at least two, so that at least two electrodes 122 in the chip 120 are connected to at least two points of the conductive adhesives 126 .

[0090] Specifically, the number of the conductive adhesives 126 is four.

[0091] Embodiment 8:

[0092] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0093] like Figure 2 As shown, the resonator 100 further includes a pad 170 and at least two conductive layers. The pad 170 is disposed at the bottom of the base 110 ; the at least two conductive layers are disposed on the pad 170 ; and the at least two conductive layers pass through the base 110 and are connected to the conductive adhesive 126 .

[0094] In this technical solution, a solder pad 170 is also provided in the resonator 100, and at least two conductive layers are provided on the solder pad 170, and these two conductive layers pass through the base 110 and are connected to the conductive glue 126 on the protrusion 160, so that the chip 120 is electrically connected to the conductive layer on the solder pad 170, thereby realizing electrical connection between the inside and outside of the resonator 100.

[0095] Specifically, a through hole connecting the inside and outside of the cavity is provided on the base 110 of the resonator 100 , and at least two conductive layers on the pad 170 pass through the through hole on the base 110 and are connected to the conductive glue 126 on the protrusion 160 .

[0096] Specifically, the at least two conductive layers are two disconnected conductive layers.

[0097] Embodiment 9:

[0098] This embodiment provides a resonator 100 . In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0099] The resonator 100 further includes a first packaging adhesive and a second packaging adhesive. The first packaging adhesive is disposed between the cover 130 and the support portion 150 ; the second packaging adhesive is disposed between the support portion 150 and the base 110 .

[0100] In this technical solution, the resonator 100 also includes a first packaging glue and a second packaging glue. The first packaging glue is arranged between the cover plate 130 and the support part 150; the second packaging glue is arranged between the support part 150 and the base 110. By arranging the first packaging glue between the cover plate 130 and the support part 150 and arranging the second packaging glue between the support part 150 and the base 110, the resonator 100 is sealed to prevent impurities from entering the resonator 100, thereby affecting the accuracy and stability of the resonator 100.

[0101] Embodiment 10:

[0102] The present invention provides a communication device, including the resonator 100 according to any of the above solutions. Therefore, the communication device has all the beneficial effects of the resonator 100 according to any of the above technical solutions.

[0103] The communication device provided by the present invention includes a resonator 100, which includes a base 110, a chip 120 and a cover 130. The chip 120 is arranged on the base 110; the cover 130 is covered on the base 110 and covers the chip 120, thereby achieving the installation and fixation of the chip 120, and setting the angle between the chip 120 and the optical axis to a first preset angle 140, so that the chip 120 with the first preset angle 140 between it and the optical axis of the crystal is installed in the resonator 100, thereby minimizing the change in the resonant frequency of the resonator 100 as the ambient temperature changes under the ambient temperature of use, avoiding the resonant frequency of the resonator 100 from changing significantly with the ambient temperature when the resonator 100 is in use, avoiding affecting the function of the resonator 100, and thus achieving extremely high stability and precision of the resonator 100.

[0104] Specifically, chip 120 is a piezoelectric quartz crystal that exhibits a piezoelectric effect. Due to the peculiarities of its structure, the piezoelectric effect only occurs in certain directions and under certain forces. When a force acts along the X-axis, the quartz crystal produces a piezoelectric effect in the X-direction, but not in the Y and Z directions. When a force acts along the Y-axis, the quartz crystal produces a piezoelectric effect in the X-direction, but not in the Y and Z directions. If a force acts along the Z-axis, the piezoelectric effect does not occur. Therefore, the X-axis is also called the electrical axis, and the Y-axis is called the mechanical axis. Although quartz crystal exhibits birefringence, birefringence does not occur when light is incident along the Z-axis. Therefore, the Z-axis is also called the optical axis. That is, the first preset angle 140 between chip 120 and the optical axis is the angle between chip 120 and the crystal's Z-axis.

[0105] Specifically, when the ambient temperature is greater than or equal to -5 degrees and less than or equal to 60 degrees, the resonant frequency of the resonator 100 will reach a minimum as the ambient temperature changes.

[0106] Specifically, the communication device is a walkie-talkie. When the ambient temperature is greater than or equal to -5 degrees and less than or equal to 60 degrees, the resonant frequency of the resonator 100 will reach a minimum as the ambient temperature changes, so that the resonant frequency has high stability and accuracy, thereby enabling the walkie-talkie to be used for communication and command and dispatch between group members, so as to improve communication efficiency and enhance the ability to quickly respond to emergencies.

[0107] In the claims, specification and drawings of the present invention, the term "plurality" refers to two or more. Unless otherwise expressly defined, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the purpose of more conveniently describing the present invention and making the description process simpler. It is not intended to indicate or imply that the device or element referred to must have the specific orientation described, be constructed and operated in a specific orientation. Therefore, these descriptions cannot be understood as limiting the present invention. The terms "connect", "install", "fix" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection between multiple objects, or a detachable connection between multiple objects, or an integral connection; it can be a direct connection between multiple objects, or an indirect connection between multiple objects through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood based on the specific circumstances of the above data.

[0108] In the claims, specification, and drawings of the present invention, the terms "one embodiment," "some embodiments," "a specific embodiment," and the like mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In the claims, specification, and drawings of the present invention, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0109] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A resonator, characterized in that include: base; a wafer, wherein the wafer is disposed on the base; a cover plate, the cover plate being arranged on the base and covering the wafer; Wherein, the angle between the wafer and the optical axis is a first preset angle; The first preset angle is 35 degrees and 01 minutes; It also includes a support portion, which is annular and disposed between the cover plate and the base; The cover plate, the support portion and the base are surrounded by a cavity, and the wafer is located in the cavity; It also includes a protrusion, which is provided on at least one side of the base and is located in the cavity; At least one side of the wafer is placed on the protruding portion.

2. The resonator according to claim 1, characterized in that The wafer comprises: at least two electrodes; a wafer body connected to the at least two electrodes; Conductive adhesive is disposed on the protruding portion and connected to the at least two electrodes.

3. The resonator according to claim 2, characterized in that The number of the conductive adhesives is at least two.

4. The resonator according to claim 3, characterized in that Also includes: A soldering pad, the soldering pad being arranged at the bottom of the base; at least two conductive layers, wherein the at least two conductive layers are disposed on the pad; The at least two conductive layers pass through the base and are connected to the conductive adhesive.

5. The resonator according to claim 4, characterized in that Also includes: a first packaging adhesive disposed between the cover plate and the support portion; A second packaging adhesive is disposed between the support portion and the base.

6. A communication device, characterized in that: Comprising the resonator according to claim 5.

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