Resin Composition

Abstract

The objective of this invention is to provide a resin composition capable of producing a cured product with a low dielectric loss tangent and a high glass transition temperature. The solution of this invention is a resin composition comprising (A) a maleimide compound, (B) an epoxy resin, and (C) an active ester-based curing agent, wherein (A) the maleimide compound comprises (A-1) a maleimide compound containing a trimethylindene backbone.

Description

Technical Field

[0001] This invention relates to resin compositions. Furthermore, this invention relates to cured products of the resin compositions, and resin sheets, printed circuit boards, and semiconductor devices obtained using the resin compositions. Background Technology

[0002] As a manufacturing technology for printed circuit boards, a manufacturing method using a build-up approach is known, in which insulating layers and conductor layers are alternately stacked. In the build-up manufacturing method, the insulating layer is generally formed by curing a resin composition. As such a resin composition, for example, the resin composition disclosed in Patent Document 1 is known.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-29494. Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The cured product formed by curing a resin composition can be used as an insulating layer on a printed wiring board for semiconductor devices. Therefore, it is necessary to reduce the dielectric loss tangent of the cured product. Furthermore, from the viewpoint of improving heat resistance, a high glass transition temperature of the cured product is desirable.

[0008] The present invention addresses the aforementioned issues and aims to provide: a resin composition capable of producing a cured product with a low dielectric loss tangent and a high glass transition temperature; a cured product of the aforementioned resin composition; a resin sheet having a resin composition layer comprising the aforementioned resin composition; a printed wiring board comprising an insulating layer formed from the cured product of the aforementioned resin composition; and a semiconductor device comprising the aforementioned printed wiring board.

[0009] means for solving problems

[0010] The inventors, through in-depth research to solve the aforementioned problems, discovered that a resin composition comprising (A) a maleimide compound, (B) an epoxy resin, and (C) an active ester curing agent, wherein (A) the maleimide compound comprises (A-1) a maleimide compound containing a trimethylindene skeleton, can solve the aforementioned problems, thus completing the present invention.

[0011] That is, the present invention includes the following solutions.

[0012] [1] A resin composition comprising (A) a maleimide compound, (B) an epoxy resin and (C) an active ester curing agent,

[0013] (A) Maleimide compounds include (A-1) maleimide compounds containing a trimethylindanium skeleton.

[0014] [2] According to the resin composition of [1], wherein component (A-1) comprises the structure shown in formula (A4),

[0015] [Chemistry 1]

[0016]

[0017] (In formula (A4),)

[0018] Ar a1 This indicates an optional divalent aromatic hydrocarbon group with substituents;

[0019] R a1 Each of these can be independently represented as an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;

[0020] R a2 Each of these can be independently represented as an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group.

[0021] R a3 Each can independently represent a divalent aliphatic hydrocarbon group;

[0022] n a1 Represents positive integers;

[0023] n a2 Each can independently represent an integer from 0 to 4;

[0024] n a3 Each can independently represent an integer from 0 to 3;

[0025] R a1 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may be optionally replaced by halogen atoms;

[0026] R a2 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may be optionally replaced by halogen atoms;

[0027] n a2 When R is 2~4, a1They can be the same or different on the same ring;

[0028] n a3 When R is 2~3, a2 They can be the same or different on the same ring.

[0029] [3] The resin composition according to [1] or [2], wherein the amount of component (A-1) is 0.5% by mass or more and 70% by mass or less relative to 100% by mass of the resin component in the resin composition.

[0030] [4] The resin composition according to any one of [1] to [3], wherein the amount of component (A) is 0.5% by mass or more and 70% by mass or less relative to 100% by mass of the resin component in the resin composition.

[0031] [5] The resin composition according to any one of [1] to [4], wherein the amount of component (B) is 3% by mass or more and 50% by mass or less relative to 100% by mass of the resin component in the resin composition.

[0032] [6] The resin composition according to any one of [1] to [5], wherein the amount of component (C) is 6% by mass or more and 80% by mass or less relative to 100% by mass of the resin component in the resin composition.

[0033] [7] The resin composition according to any one of [1] to [6] further comprises (D) an inorganic filler.

[0034] [8] According to the resin composition of [7], wherein the amount of component (D) is 20% by mass or more and 90% by mass or less relative to 100% by mass of non-volatile components in the resin composition.

[0035] [9] The resin composition according to any one of [1] to [8] is used to form an insulating layer.

[0036] Cured products of the resin composition described in any one of

[10] [1] to [9].

[0037]

[11] A resin sheet having a support and a layer of resin composition formed on the support by any one of the resin compositions described in [1] to [9].

[0038]

[12] A printed wiring board comprising an insulating layer formed from a cured resin composition of any one of [1] to [9].

[0039]

[13] A semiconductor device comprising the printed wiring board described in

[12] .

[0040] Invention Effects

[0041] According to the present invention, a resin composition capable of producing a cured product with a low dielectric loss tangent and a high glass transition temperature can be provided; a cured product of the aforementioned resin composition; a resin sheet having a resin composition layer comprising the aforementioned resin composition; a printed wiring board comprising an insulating layer formed from the cured product of the aforementioned resin composition; and a semiconductor device comprising the aforementioned printed wiring board. Detailed Implementation

[0042] The following description illustrates embodiments and examples of the present invention. However, the present invention is not limited to the embodiments and examples shown below, and can be implemented in any way without departing from the scope of the claims and their equivalents.

[0043] [1. Overview of the Resin Composition]

[0044] One embodiment of the present invention relates to a resin composition comprising (A) a maleimide compound, (B) an epoxy resin, and (C) an active ester-based curing agent. Furthermore, (A) the maleimide compound comprises (A-1) a maleimide compound containing a trimethylindene backbone.

[0045] According to such a resin composition, a cured product with a low dielectric loss tangent and a high glass transition temperature can be obtained. Furthermore, the cured product of the aforementioned resin composition can generally reduce the dielectric constant. Moreover, when an insulating layer is formed from the cured product of the aforementioned resin composition, the surface roughness of the insulating layer can generally be reduced, or the plating peel strength can be improved.

[0046] The aforementioned resin composition may further include, as needed, optional components such as (D) inorganic filler, (E) optional curing agent, and (F) curing accelerator.

[0047] [2. (A) Maleimide compounds]

[0048] The maleimide compound included as component (A) in the resin composition refers to a compound containing one or more maleimide groups in its molecule. The maleimide group is represented by the following formula (A2). In formula (A2), * indicates a bonding site. The number of maleimide groups contained in one molecule of the maleimide compound (A) is generally one or more, preferably two or more. There is no particular upper limit, and it can be, for example, 22 or less, 10 or less, 6 or less, 4 or less, or 3 or less.

[0049] [Chemistry 2]

[0050]

[0051] The resin composition involved in this embodiment contains (A) a maleimide compound comprising (A-1) a maleimide compound comprising a trimethylindane skeleton. In the following description, "a maleimide compound comprising a trimethylindane skeleton" is sometimes referred to as a "specific maleimide compound". The trimethylindane skeleton refers to the skeleton shown in formula (A3).

[0052] [Chemistry 3]

[0053]

[0054] The trimethylindene skeleton contains a benzene ring that may optionally be bonded with substituents. Examples of substituents include alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, cycloalkyl, halogen atoms, hydroxyl, and mercapto.

[0055] The alkyl group preferably has 1 to 10 carbon atoms. Examples of alkyl groups include methyl, ethyl, propyl, n-butyl, and tert-butyl.

[0056] The number of carbon atoms in the alkoxy group is preferably 1 to 10. Examples of alkoxy groups include methoxy, ethoxy, propoxy, and butoxy.

[0057] The number of carbon atoms in the alkylthio group is preferably 1 to 10. Examples of alkylthio groups include methylthio, ethylthio, propylthio, and butylthio.

[0058] The aryl group preferably has 6 to 10 carbon atoms. Examples of aryl groups include phenyl and naphthyl groups.

[0059] The number of carbon atoms in the aryloxy group is preferably 6 to 10. Examples of aryloxy groups include phenoxy and naphthoxy groups.

[0060] The number of carbon atoms in the aryl thio group is preferably 6 to 10. Examples of aryl thio groups include phenylthio and naphthio.

[0061] The cycloalkyl group preferably has 3 to 10 carbon atoms. Examples of cycloalkyl groups include cyclopentyl, cyclohexyl, and cycloheptyl.

[0062] Examples of halogen atoms include fluorine, chlorine, and iodine.

[0063] In the aforementioned substituents, the hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms.

[0064] The number of substituents bonded to one benzene ring in a trimethylindene skeleton can be one or more. The number of substituents bonded to the benzene ring in a trimethylindene skeleton is typically 0 to 3. When the number of substituents is two or more, these two or more substituents can be the same or different. Preferably, the benzene ring in a trimethylindene skeleton is unbonded.

[0065] (A-1) A molecule of a particular maleimide compound may contain one or more trimethylindene skeletons. The upper limit may be, for example, less than 10, less than 8, less than 7, or less than 6.

[0066] (A-1) In addition to the aforementioned trimethylindane skeleton, the specific maleimide compound preferably further comprises an aromatic ring skeleton. The number of carbon atoms in the constituting ring of this aromatic ring skeleton is preferably 6 to 10. Examples of aromatic ring skeletons include, for example, benzene ring skeletons and naphthalene ring skeletons. (A-1) The number of the aforementioned aromatic ring skeletons contained in one molecule of the specific maleimide compound is preferably 1 or more, more preferably 2 or more, preferably 6 or less, more preferably 4 or less, and particularly preferably 3 or less. (A-1) When the specific maleimide compound comprises two or more aromatic ring skeletons in addition to the trimethylindane skeleton, these aromatic ring skeletons may be the same or different.

[0067] The aromatic ring contained in the aforementioned aromatic ring skeleton may optionally be bonded with substituents. Examples of substituents include, for instance, the substituents described above that can be bonded to the benzene ring contained in the trimethylindene skeleton, and nitro groups. The number of substituents bonded to one aromatic ring may be one or more. The number of substituents bonded to an aromatic ring is typically 0 or more and 4 or less. When the number of substituents is two or more, these two or more substituents may be the same or different.

[0068] The (A-1) specific maleimide compound preferably contains a divalent aliphatic hydrocarbon group in addition to the aforementioned trimethylindane skeleton. Specifically, when the (A-1) specific maleimide compound contains an aromatic ring skeleton other than the benzene ring contained in the trimethylindane skeleton, the (A-1) specific maleimide compound preferably contains a divalent aliphatic hydrocarbon group. In this case, the divalent aliphatic hydrocarbon group preferably links the benzene ring contained in the trimethylindane skeleton to the aromatic ring skeleton. Furthermore, the divalent aliphatic hydrocarbon group preferably links the aromatic ring skeletons to each other.

[0069] The number of carbon atoms in the divalent aliphatic hydrocarbon group is preferably 1 or more, preferably 12 or less, more preferably 8 or less, and particularly preferably 5 or less. The divalent aliphatic hydrocarbon group is more preferably an alkylene group that is a saturated aliphatic hydrocarbon group. Examples of divalent aliphatic hydrocarbon groups include straight-chain alkylene groups such as methylene, ethylene, trimethylene, tetramethylene, pentamethylene, and hexamethylene; and branched alkylene groups such as ethylidene (-CH(CH3)-), propyleneidene (-CH(CH2CH3)-), isopropyleneide (-C(CH3)2-), ethylmethylmethylene (-C(CH3)(CH2CH3)-), and diethylmethylene (-C(CH2CH3)2-). In the case where a specific maleimide compound (A-1) contains two or more divalent aliphatic hydrocarbon groups in addition to the trimethylindane skeleton, these divalent aliphatic hydrocarbon groups may be the same or different.

[0070] (A-1) A particular maleimide compound preferably comprises the structure shown in formula (A4). The entirety of the particular maleimide compound (A-1) may have the structure shown in formula (A4), or a portion of the particular maleimide compound (A-1) may have the structure shown in formula (A4).

[0071] [Chemistry 4]

[0072]

[0073] (In formula (A4), Ar) a1 R represents a divalent aromatic hydrocarbon group with optional substituents; a1 Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; R a2 Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; R a3 Each independently represents a divalent aliphatic hydrocarbon group; n a1 n represents a positive integer; a2 Each can independently represent an integer from 0 to 4; n a3 Each can independently represent an integer from 0 to 3. (R) a1 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms; R a2The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms; n a2 When R is 2~4, a1 They can be the same or different on the same ring; n a3 When R is 2~3, a2 They can be the same or different on the same ring.

[0074] In formula (A4), Ar a1 This refers to a divalent aromatic hydrocarbon group optionally having a substituent. The divalent aromatic hydrocarbon group preferably has 6 or more carbon atoms, more preferably 20 or less, and more preferably 16 or less. Examples of divalent aromatic hydrocarbon groups include, for example, phenylene and naphthylene. Examples of substituents that can be present in the divalent aromatic hydrocarbon group include, for example, alkyl groups with 1 to 10 carbon atoms, alkoxy groups with 1 to 10 carbon atoms, alkylthio groups with 1 to 10 carbon atoms, aryl groups with 6 to 10 carbon atoms, aryloxy groups with 6 to 10 carbon atoms, arylthio groups with 6 to 10 carbon atoms, cycloalkyl groups with 3 to 10 carbon atoms, halogen atoms, hydroxyl groups, and mercapto groups. The hydrogen atoms of each substituent are further optionally replaced by halogen atoms. Furthermore, specific examples of these substituents include those that can bond to the benzene ring contained in the trimethylindene skeleton. When the divalent aromatic hydrocarbon group has substituents, the number of substituents is preferably 1 to 4. When the divalent aromatic hydrocarbon group has 2 or more substituents, these 2 or more substituents may be the same or different. Among them, Ar... a1 Preferably, it is a divalent aromatic hydrocarbon group without substituents.

[0075] In equation (A4), R a1 Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. The hydrogen atoms of the alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms. Specific examples of these groups include substituents that are identical to those that can bond to the benzene ring contained in the trimethylindene skeleton. Wherein, R a1 More preferably, it is one or more groups selected from alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms, and particularly preferably alkyl groups having 1 to 4 carbon atoms.

[0076] In equation (A4), R a2Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. The hydrogen atoms of the alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms. Specific examples of these groups include substituents that are identical to those that can bond to the benzene ring contained in the trimethylindene skeleton. Wherein, R a2 More preferably, it is one or more groups selected from alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms.

[0077] In equation (A4), R a3 Each group independently represents a divalent aliphatic hydrocarbon group. The preferred range of divalent aliphatic hydrocarbon groups is as described above.

[0078] In equation (A4), n a1 Represents a positive integer. n a1 Preferably, it is 1 or more, more preferably 10 or less, and more preferably 8 or less.

[0079] In equation (A4), n a2 Each element independently represents an integer from 0 to 4. a2 Preferably 2 or 3, more preferably 2. Multiple n a2 They can be different, but being the same is preferred. a2 When the value is 2 or higher, multiple R a1 They can be the same or different on the same ring.

[0080] In equation (A4), n a3 Each n independently represents an integer from 0 to 3. Multiple n a3 They can be different, but being the same is preferred. a3 The preferred value is 0.

[0081] (A-1) A particular maleimide compound particularly preferably comprises the structure shown in formula (A5). The entirety of the particular maleimide compound (A-1) may have the structure shown in formula (A5), or a portion of the particular maleimide compound (A-1) may have the structure shown in formula (A5).

[0082] [Chemistry 5]

[0083]

[0084] (In formula (A5), R) b1Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; R b2 Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; n b1 n represents a positive integer; b2 Each can independently represent an integer from 0 to 4; n b3 Each can independently represent an integer from 0 to 3. (R) b1 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms. b2 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms. b2 When R is 2~4, b1 They can be the same or different on the same ring. b3 When R is 2~3, b2 They can be the same or different on the same ring.

[0085] In formula (A5), R b1 、R b2 n b1 n b2 and n b3 Each with R in equation (A4) a1 、R a2 n a1 n a2 and n a3 same.

[0086] (A-1) Certain maleimide compounds may further comprise the structure shown in formula (A6).

[0087] [Chemistry 6]

[0088]

[0089] In equation (A6), R c1 、R c2 n c2 and n c3 Each with R in equation (A4) a1 、R a2 n a2 and na3 Same. Furthermore, in equation (A6), n c1 The number of repeating units is an integer from 1 to 20. Further, in formula (A6), * denotes a bonding site. For example, in formula (A4), n represents a specific maleimide compound (A-1). a2 The number is 3 or less, and in the ortho and para positions of the benzene ring bonded to the maleimide group, there are more than 2 unbonded R groups. a1 In such cases, it may include a combination of the structures shown in formula (A6) and formula (A4). Furthermore, for example, in formula (A5), a specific maleimide compound (A-1) may contain n... b2 The number is 3 or less, and in the benzene ring bonded to the maleimide group, there are more than two unbonded R positions in the ortho and para positions relative to the maleimide group. b1 In the case of [the above], it may include a combination of the structure shown in equation (A6) and the structure shown in equation (A5).

[0090] The (A-1) specific maleimide compound that is a component of (A-1) can be used alone or in combination of two or more in any ratio.

[0091] (A-1) The maleimide equivalent of a specific maleimide compound is preferably 50 g / eq. or more, more preferably 100 g / eq. or more, particularly preferably 200 g / eq. or more, preferably 2000 g / eq. or less, more preferably 1000 g / eq. or less, and particularly preferably 800 g / eq. or less. The maleimide equivalent indicates the mass of the maleimide compound per maleimide equivalent. (A-1) When the maleimide equivalent of a specific maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0092] The amount of the specific maleimide compound (A-1) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, more preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition. When the amount of the specific maleimide compound (A-1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0093] The amount of the specific maleimide compound (A-1) in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, particularly preferably 2% by mass or more, more preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less, relative to 100% by mass of the resin component in the resin composition. The resin component in the resin composition refers to the non-volatile components in the resin composition, excluding the inorganic filler (D). When the amount of the specific maleimide compound (A-1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0094] The amount of the specific maleimide compound (A-1) in the resin composition relative to 100% by mass of the epoxy resin (B) in the resin composition is preferably 60% by mass or more, more preferably 80% by mass or more, particularly preferably 100% by mass or more, preferably 200% by mass or less, more preferably 180% by mass or less, and particularly preferably 160% by mass or less. When the amount of the specific maleimide compound (A-1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0095] The ratio (maleimide groups / epoxy groups) of the total number of maleimide groups in the specific maleimide compound (A-1) to the total number of epoxy groups in the epoxy resin (B) is preferably within a specific range. The aforementioned ratio (maleimide groups / epoxy groups) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. "The total number of maleimide groups in the specific maleimide compound (A-1)" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the specific maleimide compound (A-1) present in the resin composition by the maleimide group equivalent. Furthermore, "the total number of epoxy groups in the epoxy resin (B)" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the epoxy resin present in the resin composition by the epoxy equivalent. When the aforementioned ratio (maleimide groups / epoxy groups) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0096] The amount of the specific maleimide compound (A-1) in the resin composition relative to 100% by mass of the active ester curing agent (C) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, preferably 160% by mass or less, more preferably 130% by mass or less, and particularly preferably 110% by mass or less. When the amount of the specific maleimide compound (A-1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0097] (A-1) The ratio (maleimide groups / active ester groups) of the total number of maleimide groups in the specific maleimide compound to the total number of active ester groups in the (C) active ester curing agent is preferably within a specific range. The aforementioned ratio (maleimide groups / active ester groups) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. "Total number of active ester groups in the (C) active ester curing agent" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the (C) active ester curing agent present in the resin composition by the active ester equivalent. When the aforementioned ratio (maleimide groups / active ester groups) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0098] The amount of the specific maleimide compound (A-1) in the resin composition is 100% by mass relative to the total amount of the maleimide compound (A), preferably 30% to 100% by mass, more preferably 40% to 100% by mass, and particularly preferably 50% to 100% by mass. When the amount of the specific maleimide compound (A-1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0099] (A-1) There are no particular limitations on the method for manufacturing a specific maleimide compound. (A-1) A specific maleimide compound can be manufactured by, for example, the method described in Patent Application Publication No. 2020-500211. According to the manufacturing method described in Patent Application Publication No. 2020-500211, a maleimide compound having a distribution of the number of repeating units of the trimethylindene skeleton can be obtained. The maleimide compound obtained by this method comprises the structure shown in formula (A1). Therefore, (A) a maleimide compound can comprise a maleimide compound containing the structure shown in formula (A1).

[0100] [Chemistry 7]

[0101]

[0102] (In formula (A1), R) 1 Each of these groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; R 2Each of the following groups independently represents an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; n1 represents the average number of repeating units from 0.95 to 10.0; n2 independently represents an integer from 0 to 4; n3 independently represents an integer from 0 to 3. R 1 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms. 2 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may optionally be replaced by halogen atoms. When n² is 2–4, R 1 On the same ring, they can be the same or different. When n3 is 2~3, R... 2 They can be the same or different on the same ring.

[0103] In equation (A1), R 1 、R 2 n2 and n3 are respectively related to R in equation (A4) a1 、R a2 n a2 and n a3 same.

[0104] In formula (A1), n1 represents the average number of repeating units, which ranges from 0.95 to 10.0. According to the manufacturing method described in Patent Application Publication No. 2020-500211, a group of maleimide compounds containing the structure shown in formula (A1) are obtained. Since the average number of repeating units n1 in formula (A1) can be less than 1.00, the maleimide compound containing the structure shown in formula (A1) obtained in this way can contain maleimide compounds with a repeating unit number of 0 in the trimethylindane skeleton. Here, by refining the maleimide compound containing the structure shown in formula (A1), maleimide compounds with a repeating unit number of 0 in the trimethylindane skeleton are removed to obtain the specific maleimide compound (A-1), and the resin composition can contain only this obtained specific maleimide compound (A-1). However, the effects of the present invention can be obtained even when a maleimide compound with zero repeating units in the trimethylindane skeleton is included in the resin composition. Furthermore, costs can be reduced by omitting purification. Here, it is preferable that a maleimide compound comprising the structure shown in formula (A1) is included in the resin composition without removing the maleimide compound with zero repeating units in the trimethylindane skeleton.

[0105] In formula (A1), the average number of repeating units n1 is preferably 0.95 or more, more preferably 0.98 or more, further preferably 1.0 or more, particularly preferably 1.1 or more, preferably 10.0 or less, more preferably 8.0 or less, further preferably 7.0 or less, and particularly preferably 6.0 or less. When the average number of repeating units n1 is within the aforementioned range, the effects of the present invention can be significantly obtained. In particular, the glass transition temperature of the resin composition can be effectively increased.

[0106] As an example of the structure shown in formula (A1), the following substances can be cited.

[0107] [Chemistry 8]

[0108]

[0109] Maleimide compounds containing the structure shown in formula (A1) may further contain the structure shown in formula (A6). For example, in maleimide compounds containing the structure shown in formula (A1), n2 is 3 or less, and in the ortho and para positions of the benzene ring bonded to the maleimide group, there are more than two unbonded R groups. 1 In the case of [the specific case], the structure shown in equation (A6) may be combined with the structure shown in equation (A1).

[0110] The molecular weight distribution (Mw / Mn) of the maleimide compound containing the structure shown in formula (A1), as determined by gel permeation chromatography (GPC), preferably falls within a specific range. The molecular weight distribution is the value obtained by dividing the weight-average molecular weight (Mw) by the number-average molecular weight (Mn), and is denoted by "Mw / Mn". Specifically, the molecular weight distribution (Mw / Mn) of the maleimide compound containing the structure shown in formula (A1) is preferably 1.0 to 4.0, more preferably 1.1 to 3.8, further preferably 1.2 to 3.6, and particularly preferably 1.3 to 3.4. When the molecular weight distribution (Mw / Mn) of the maleimide compound containing the structure shown in formula (A1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0111] In the maleimide compounds containing the structure shown in formula (A1), the amount of maleimide compounds with an average repeating unit number n1 of 0 is preferably within a specific range. When performing the aforementioned GPC determination, the amount of maleimide compounds with an average repeating unit number n1 of 0 can be expressed as area % based on the results of the GPC determination. Specifically, in the chromatogram obtained by the aforementioned GPC determination, the amount of maleimide compounds with an average repeating unit number n1 of 0 can be expressed as the ratio (area %) of the peak area of ​​maleimide compounds with an average repeating unit number n1 of 0 to the total area of ​​the peaks of maleimide compounds containing the structure shown in formula (A1). Specifically, relative to 100% of the total area of ​​maleimide compounds containing the structure shown in formula (A1), the amount of maleimide compounds with an average repeating unit number n1 of 0 is preferably 32 area % or less, more preferably 30 area % or less, and even more preferably 28 area % or less. When the amount of maleimide compound with an average repeating unit number n1 of 0 is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0112] The maleimide equivalent of the maleimide compound containing the structure shown in formula (A1) is preferably in the same range as the maleimide equivalent of the specific maleimide compound described in (A-1) above. When the maleimide equivalent of the maleimide compound containing the structure shown in formula (A1) is in the aforementioned range, the effects of the present invention can be significantly obtained.

[0113] The amount of the maleimide compound containing the structure shown in formula (A1) relative to 100% by mass of the non-volatile component in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. When the amount of the maleimide compound containing the structure shown in formula (A1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0114] The amount of the maleimide compound containing the structure shown in formula (A1) relative to 100% by mass of the resin component in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, particularly preferably 2% by mass or more, preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. When the amount of the maleimide compound containing the structure shown in formula (A1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0115] The amount of the maleimide compound containing the structure shown in formula (A1) relative to 100% by mass of epoxy resin (B) in the resin composition is preferably 60% by mass or more, more preferably 80% by mass or more, particularly preferably 100% by mass or more, preferably 200% by mass or less, more preferably 180% by mass or less, and particularly preferably 160% by mass or less. When the amount of the maleimide compound containing the structure shown in formula (A1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0116] The ratio (maleimide group / epoxy group) of the total number of maleimide groups in the maleimide compound containing the structure shown in formula (A1) to the total number of epoxy groups in the epoxy resin (B) is preferably within a specific range. The aforementioned ratio (maleimide group / epoxy group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. "The total number of maleimide groups in the maleimide compound containing the structure shown in formula (A1)" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the maleimide compound containing the structure shown in formula (A1) present in the resin composition by the maleimide group equivalent. When the aforementioned ratio (maleimide group / epoxy group) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0117] The amount of the maleimide compound containing the structure shown in formula (A1) relative to 100% by mass of the (C) active ester curing agent in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, preferably 160% by mass or less, more preferably 130% by mass or less, and particularly preferably 110% by mass or less. When the amount of the maleimide compound containing the structure shown in formula (A1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0118] The ratio (maleimide groups / active ester groups) of the maleimide compound containing the structure shown in formula (A1) to the total number of active ester groups in the active ester curing agent (C) is preferably within a specific range. The aforementioned ratio (maleimide groups / active ester groups) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. When the aforementioned ratio (maleimide groups / active ester groups) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0119] The amount of the maleimide compound containing the structure shown in formula (A1) is 100% by mass relative to the total amount of the maleimide compound in (A), preferably 30% to 100% by mass, more preferably 40% to 100% by mass, and particularly preferably 50% to 100% by mass. When the amount of the maleimide compound containing the structure shown in formula (A1) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0120] (A) The maleimide compound may further comprise an optional maleimide compound that does not contain a trimethylindane skeleton in combination with the specific maleimide compound described in (A-1) above. Examples of optional maleimide compounds include, for example, biphenyl-type maleimide compounds (A-2) and aliphatic maleimide compounds (A-3). The optional maleimide compound may be used alone or in combination of two or more in any ratio.

[0121] (A-2) Biphenyl-type maleimide compounds refer to maleimide compounds containing a biphenyl skeleton. When (A-2) biphenyl-type maleimide compounds are used in combination with (A-1) specific maleimide compounds, the plating peel strength can be effectively improved.

[0122] (A-2) Biphenyl-type maleimide compounds may have one or more substituents bonded to the benzene ring of the biphenyl skeleton. Examples of substituents include halogen atoms, -OH, and -OC. 1-10 Alkyl, -N(C 1-10 Alkyl)2, C 1-10 Alkyl, C 6-10 Aryl, -NH2, -CN, -C(O)OC 1-10 Alkyl groups, -COOH, -C(O)H, -NO2, etc. Here, "C" is used... x-y The term "(x and y are positive integers, satisfying x < y)" indicates that the number of carbon atoms in the organic group immediately following the term is x ~ y. For example, "C 1-10 The expression "alkyl" indicates an alkyl group having 1 to 10 carbon atoms. These substituents can bond to each other to form a ring. The aforementioned rings also include spirocyclic and fused rings. The aforementioned substituents may further have substituents (hereinafter sometimes referred to as "secondary substituents"). As secondary substituents, the same group as the aforementioned substituents can be used. Among them, in (A-2) biphenyl maleimide compounds, the benzene ring of the biphenyl skeleton preferably has no bonded substituents.

[0123] (A-2) Biphenyl-type maleimide compounds preferably contain either an aliphatic hydrocarbon group or an aromatic hydrocarbon group combined with a biphenyl skeleton, more preferably having both an aliphatic hydrocarbon group and an aromatic hydrocarbon group combined with a biphenyl skeleton. As a preferred (A-2) biphenyl-type maleimide compound, a maleimide compound represented by the following formula (A7) can be cited.

[0124] [Chemistry 9]

[0125]

[0126] (In formula (A7), R) d1 Each independently represents an alkylene group; R d2 Each independently represents an alkyl group optionally having a substituent, or an aryl group optionally having a substituent; R d3 Each substituent is represented independently; n d1 n represents an integer from 1 to 100; d2 Each represents an integer from 0 to 2 independently; n d3 Each can independently represent an integer from 0 to 4.

[0127] In equation (A7), R d1 Each alkylene group is represented independently. The number of carbon atoms in the alkylene group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 3. As an alkylene group, a straight-chain alkylene group is preferred, and a methylene group is more preferred.

[0128] In equation (A7), R d2 Each can be independently represented as an alkyl group with optional substituents, or an aryl group with optional substituents.

[0129] The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 6, and particularly preferably 1 to 3. The alkyl group can be straight-chain, branched, or cyclic. Furthermore, examples of substituents that can be present in the alkyl group include, for example, substituents that can bond to the benzene ring, which forms the biphenyl backbone, and are the same as the groups described above.

[0130] The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 15, and particularly preferably 6 to 10. Examples of substituents that the aryl group can have include, for example, substituents that can bond to the benzene ring, which is part of the biphenyl skeleton, and are the same as the groups described above.

[0131] In equation (A7), R d3 Each substituent can be represented independently. Examples of such substituents include those that are identical to the groups described above and can be bonded to the benzene ring, which forms the biphenyl backbone.

[0132] In equation (A7), n d1It represents an integer from 1 to 100, preferably from 1 to 50, more preferably from 1 to 20, and even more preferably from 1 to 5.

[0133] In equation (A7), n d2 Each can independently represent an integer from 0 to 2, preferably 0.

[0134] In equation (A7), n d3 Each can independently represent an integer from 0 to 4, preferably from 0 to 3, more preferably 0 or 1, and especially preferably 0.

[0135] Examples of biphenyl-type maleimide compounds represented by formula (A7) include, for instance, "MIR-3000-70MT" (main component: compound of formula (A8) below) manufactured by Nippon Kayaku Co., Ltd. In formula (A8) below, n d4 It represents 1 or 2.

[0136] [Chemistry 10]

[0137]

[0138] (A-2) The amount of the biphenyl-type maleimide compound relative to 100% by mass of the non-volatile component in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, preferably 10.0% by mass or less, more preferably 6.0% by mass or less, and particularly preferably 4.0% by mass or less. (A-2) When the amount of the biphenyl-type maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0139] (A-2) The amount of the biphenyl-type maleimide compound relative to 100% by mass of the resin component in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and particularly preferably 10% by mass or less. (A-2) When the amount of the biphenyl-type maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0140] (A-3) Aliphatic maleimide compounds refer to maleimide compounds containing an aliphatic hydrocarbon group with 5 or more carbon atoms. When (A-3) aliphatic maleimide compounds are used in combination with (A-1) specific maleimide compounds, the plating peel strength can be effectively improved.

[0141] (A-3) The number of carbon atoms in the aliphatic hydrocarbon group contained in the aliphatic maleimide compound is generally 5 or more, preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less.

[0142] (A-3) The aliphatic hydrocarbon groups contained in the aliphatic maleimide compound can be saturated or unsaturated, with saturated aliphatic hydrocarbon groups being preferred. Furthermore, the aliphatic hydrocarbon groups can be chain-like or cyclic groups. Further, the aliphatic hydrocarbon groups can be monovalent or divalent groups.

[0143] Examples of aliphatic hydrocarbon groups included in (A-3) aliphatic maleimide compounds include alkyl groups such as pentyl, hexyl, heptyl, octyl, nonyl, and decyl; alkylene groups such as pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecanylene, hexadecylene, octylene-cyclohexylene, octylene-cyclohexylene-octylene, and propylene-cyclohexylene-octylene.

[0144] (A-3) The aliphatic maleimide compound contains optionally bonded substituents on the aliphatic hydrocarbon group. Examples of substituents include, for instance, substituents that can bond to the benzene ring, which forms the biphenyl skeleton, as described in the description of the (A-2) biphenyl-type maleimide compound, and are the same groups described above. Preferably, the aliphatic hydrocarbon group contained in the (A-3) aliphatic maleimide compound contains unbonded substituents.

[0145] (A-3) Aliphatic maleimide compounds preferably contain a polyimide structure. Examples of preferred (A-3) aliphatic maleimide compounds include maleimide-terminated polyimide compounds represented by formula (A9).

[0146] [Chemistry 11]

[0147]

[0148] (In formula (A9), R) e1 Each independently represents a divalent aliphatic hydrocarbon group with 5 or more carbon atoms that may be optionally substituented; R e2 Each independently represents a divalent linker; n e1 (Represents integers from 1 to 10).

[0149] In equation (A9), R e1 Each can be independently represented by a divalent aliphatic hydrocarbon group with 5 or more carbon atoms, which may be optionally substituented. R e1 Preferably, it refers to an alkylene, alkenylene, or polyeneylene group having 5 or more carbon atoms (more preferably, the number of double bonds is 2). R a1Preferably, it comprises an alkylene group having 5 or more carbon atoms, optionally with a substituent. In this case, the alkylene group having 5 or more carbon atoms may be part of an alkenyl or polyalkenyl group. R e1 Specifically, the number of carbon atoms is typically 5 or more, preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. Substituents that can be present on divalent aliphatic hydrocarbon groups such as alkylene, alkenyl, and polyene groups can be exemplified by, for example, substituents that can bond to the benzene ring of the biphenyl skeleton as described in the description of (A-2) biphenyl-type maleimide compounds and are the same as the groups described above. Wherein, R e1 Preferably, it is a divalent aliphatic hydrocarbon group without substituents, and more preferably, it is an alkylene group without substituents.

[0150] In equation (A9), R e2 Each of the groups independently represents a divalent linking group. Preferably, the divalent linking group is an oxygen atom, an aryl group, an alkyl group, or a divalent group formed by a combination of two or more of these groups. The aryl group preferably has 6 to 24 carbon atoms, more preferably 6 to 18, further preferably 6 to 14, and particularly preferably 6 to 10. Examples of preferred aryl groups include phenylene, naphthylene, and anthracene. The alkyl group preferably has 1 to 50 carbon atoms, more preferably 1 to 45, and further preferably 1 to 40. The alkyl group can be linear, branched, or cyclic. Preferred alkylene groups include, for example, methyl ethylene, cyclohexylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecanylene, hexadecylene, octylene, groups having an octylene-cyclohexylene structure, groups having an octylene-cyclohexylene-octylene structure, and groups having a propylene-cyclohexylene-octylene structure. Among these, R... e2 The preferred atom is oxygen.

[0151] In equation (A9), n e1 Represents integers from 1 to 10;

[0152] Examples of aliphatic maleimide compounds represented by formula (A9) (A-3) include, for instance, "BMI-1500" (a compound of formula (A10) and "BMI-1700" (a compound of formula (A11) and "BMI-1700" (a compound of formula (A13)) manufactured by Designar Molecules Co., Ltd. In formulas (A10), (A11), (A12), and (A13) below, n e2 n e3 n e4 and n e5 Each can independently represent an integer from 1 to 10;

[0153] [Chemistry 12]

[0154]

[0155] (A-3) The amount of the aliphatic maleimide compound relative to 100% by mass of the non-volatile component in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, preferably 10.0% by mass or less, more preferably 6.0% by mass or less, and particularly preferably 4.0% by mass or less. (A-3) When the amount of the aliphatic maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0156] (A-3) The amount of the aliphatic maleimide compound relative to 100% by mass of the resin component in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and particularly preferably 10% by mass or less. (A-3) When the amount of the aliphatic maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0157] The maleimide equivalent of the optional maleimide compounds, such as (A-2) biphenyl-type maleimide compounds and (A-3) aliphatic maleimide compounds, is preferably in the same range as that of the specific maleimide compound in (A-1) described above. When the maleimide equivalent of the optional maleimide compounds is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0158] (A) The amount of maleimide compound relative to 100% by mass of the non-volatile component in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. (A) When the amount of maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0159] (A) The amount of maleimide compound relative to 100% by mass of the resin component in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, particularly preferably 2% by mass or more, preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. (A) When the amount of maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0160] (A) The amount of maleimide compound relative to 100% by mass of (B) epoxy resin in the resin composition is preferably 60% by mass or more, more preferably 80% by mass or more, particularly preferably 100% by mass or more, preferably 200% by mass or less, more preferably 180% by mass or less, and particularly preferably 160% by mass or less. (A) When the amount of maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0161] The ratio (maleimide group / epoxy group) of the total number of maleimide groups in the (A) maleimide compound to the total number of epoxy groups in the (B) epoxy resin is preferably within a specific range. The aforementioned ratio (maleimide group / epoxy group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. "The total number of maleimide groups in the (A) maleimide compound" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the (A) maleimide compound present in the resin composition by the maleimide group equivalent. When the aforementioned ratio (maleimide group / epoxy group) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0162] (A) The amount of maleimide compound relative to 100% by mass of the (C) active ester curing agent in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, preferably 160% by mass or less, more preferably 130% by mass or less, and particularly preferably 110% by mass or less. (A) When the amount of maleimide compound is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0163] The ratio (maleimide groups / active ester groups) of the total number of maleimide groups in the (A) maleimide compound to the total number of active ester groups in the (C) active ester curing agent is preferably within a specific range. The aforementioned ratio (maleimide groups / active ester groups) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. When the aforementioned ratio (maleimide groups / active ester groups) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0164] [3.(B) Epoxy Resin]

[0165] The epoxy resin included as component (B) in the resin composition is a curable resin having epoxy groups. Examples include, for instance, bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, dicyclopentadiene-type epoxy resin, triphenol-type epoxy resin, naphthol-phenolic varnish-type epoxy resin, phenolic varnish-type epoxy resin, tert-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, and glycidylamine-type epoxy resin. Epoxy resins include: glycidyl ester type epoxy resins, cresol phenolic varnish type epoxy resins, phenol aralkyl type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins with butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spirocyclic epoxy resins, cyclohexane type epoxy resins, cyclohexane-diethanol type epoxy resins, naphthalene ether type epoxy resins, tris(hydroxymethyl) type epoxy resins, tetraphenylethane type epoxy resins, isocyanurate type epoxy resins, phenol benzopyrrolidone type epoxy resins, and phenolphthalein type epoxy resins, etc. (B) One type of epoxy resin can be used alone, or two or more types can be used in any ratio.

[0166] The resin composition, as epoxy resin (B), preferably comprises epoxy resin having two or more epoxy groups per molecule. The proportion of epoxy resin having two or more epoxy groups per molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more, relative to 100% by mass of the non-volatile components of epoxy resin (B).

[0167] The epoxy resin includes epoxy resins that are liquid at 20°C (hereinafter sometimes referred to as "liquid epoxy resin") and epoxy resins that are solid at 20°C (hereinafter sometimes referred to as "solid epoxy resin"). The resin composition, as epoxy resin (B), may contain only liquid epoxy resin, only solid epoxy resin, or a combination of both. Of these, using only liquid epoxy resin as epoxy resin (B) is more preferable.

[0168] As a liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferred.

[0169] As liquid epoxy resins, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenolic varnish type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane type epoxy resin, cyclohexanediethanol type epoxy resin, and epoxy resin with butadiene structure are preferred.

[0170] Specific examples of liquid epoxy resins include DIC's "HP-4032", "HP-4032-D", and "HP-4032-SS" (naphthalene-type epoxy resin); Mitsubishi Chemical Corporation's "828US", "828EL", "jER828EL", "825", and "Epicoto 828EL" (bisphenol A type epoxy resin); Mitsubishi Chemical Corporation's "jER807" and "1750" (bisphenol F type epoxy resin); and Mitsubishi Chemical Corporation's "jER152" (phenolic varnish type epoxy resin). Chemical Corporation's "630", "630LSD", and "604" (glycidylamine type epoxy resin); ADEKA's "ED-523T" (glycyrrhizic acid type epoxy resin); ADEKA's "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resin); ADEKA's "EP-4088S" (dicyclopentadiene type epoxy resin); Nippon Steel & Sumitomo Metal Chemicals' "ZX1059" (bisphenol A type epoxy resin and bisphenol F type epoxy resin). Epoxy resin mixtures); "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagasek Tech; "Cerokide 2021P" (alicyclic epoxy resin with ester skeleton) manufactured by Daissel; "PB-3600" manufactured by Daissel; "JP-100" and "JP-200" (butadiene structure epoxy resins) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin), etc. These can be used individually or in combination of two or more.

[0171] As a solid epoxy resin, it is preferred to be a solid epoxy resin having three or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups in one molecule.

[0172] As solid epoxy resins, the preferred types are bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol phenolic varnish-type epoxy resins, cresol phenolic varnish-type epoxy resins, dicyclopentadiene-type epoxy resins, triphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthyl ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenol aralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, phenol benzopyrrolidone-type epoxy resins, and phenolphthalein-type epoxy resins.

[0173] Specific examples of solid epoxy resins include: DIC's "HP4032H" (naphthalene-type epoxy resin); DIC's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC's "N-690" (cresol-phenolic varnish type epoxy resin); DIC's "N-695" (cresol-phenolic varnish type epoxy resin); DIC's "HP-7200," "HP-7200HH," "HP-7200H," and "HP-7200L" (dicyclopentadiene type epoxy resin); and DIC's "EXA-7311," "EXA-7311-G3," "EXA-7311-G4," and "EXA-7311-G4S." "HP6000" (naphthalene ether type epoxy resin); "EPPN-502H" (triphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthalene phenolic varnish type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", and "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V" (naphthalene type epoxy resin) manufactured by Nippon Steel Kemica & Materia; "ESN485" (naphthalene type epoxy resin) manufactured by Nippon Steel Kemica & Materia; "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Nippon Steel Kemica & Materia; Mitsubishi The following epoxy resins are manufactured by Mitsubishi Chemical Corporation: "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bi-xylenol type epoxy resin); "YL6121" (biphenyl type epoxy resin); "YX8800" (anthracite type epoxy resin); "YX7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500"; "YL7760" (bisphenol AF type epoxy resin); "YL7800" (fluorene type epoxy resin); and "jER1010" (bisphenol A type epoxy resin). "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Corporation;Examples include "WHR991S" (phenol-benzopyrrolidone type epoxy resin) manufactured by Nippon Kayaku Co., Ltd. These can be used alone or in combination of two or more types.

[0174] (B) The epoxy equivalent of the epoxy resin is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., even more preferably 80 g / eq. to 2000 g / eq., and even more preferably 110 g / eq. to 1000 g / eq. Epoxy equivalent represents the mass of epoxy resin per equivalent of epoxy groups. This epoxy equivalent can be determined according to JIS K7236.

[0175] (B) The weight-average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight-average molecular weight of the resin can be determined by gel permeation chromatography (GPC) as a value converted from polystyrene.

[0176] The amount of epoxy resin (B) in the resin composition is not particularly limited, but is preferably 1% by mass or more, more preferably 3% by mass or more, particularly preferably 5% by mass or more, more preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition. When the amount of epoxy resin (B) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0177] The amount of epoxy resin (B) in the resin composition is not particularly limited, but is preferably 3% by mass or more, more preferably 10% by mass or more, particularly preferably 20% by mass or more, more preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less, relative to 100% by mass of the resin component in the resin composition. When the amount of epoxy resin (B) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0178] [4. (C) Reactive ester-based curing agent]

[0179] The active ester-based curing agent (C), which is included in the resin composition, is a compound having one or more active ester groups in its molecule and capable of reacting with the epoxy resin (B). The active ester-based curing agent (C) can be used alone or in combination of two or more in any ratio.

[0180] As the (C) reactive ester-based curing agent, compounds with highly reactive ester groups in one molecule, such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, and heterocyclic hydroxyl compounds, are preferred. This reactive ester compound is preferably obtained through a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxyl compound and / or a thiol compound. Particularly from the viewpoint of improving heat resistance, reactive ester compounds obtained from carboxylic acid compounds and hydroxyl compounds are preferred, and reactive ester compounds obtained from carboxylic acid compounds and phenolic and / or naphthol compounds are more preferred.

[0181] Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0182] Examples of phenolic or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthol, 1,6-dihydroxynaphthol, 2,6-dihydroxynaphthol, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyroglucinol, dicyclopentadiene-type diphenol compounds, and phenol novolac. "Dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0183] Specifically, as (C) the active ester-based curing agent, preferred are dicyclopentadiene-type active ester compounds, naphthyl-type active ester compounds containing a naphthalene structure, active ester compounds containing acetylated derivatives of phenolic varnishes, and active ester compounds containing benzoyl derivatives of phenolic varnishes. More preferably, it is selected from at least one of dicyclopentadiene-type and naphthyl-type active ester compounds, and even more preferably, it is a dicyclopentadiene-type active ester compound. As a dicyclopentadiene-type active ester compound, it is preferably an active ester compound containing a dicyclopentadiene-type diphenol structure. "Dicyclopentadiene-type diphenol structure" refers to a divalent structural unit containing a phenylene-dicyclopentylene-phenylene group.

[0184] Commercially available products as (C) reactive ester-based curing agents, including reactive ester compounds containing a dicyclopentadiene-type diphenol structure, include DIC's "EXB-9451", "EXB-9460", "EXB-9460S", "HPC-8000", "HPC-8000-65T", "HPC-8000H", "HPC-8000H-65TM", "EXB-8000L", "EXB-8000L-65M", "HPC-8000L-65TM", and "EXB-8000L-65TM"; as packaging Examples of active ester compounds containing naphthalene structures include "EXB-8100L-65T", "HPC-8150-60T", "HPC-8150-62T", "EXB-8150-60T", "EXB-9416-70BK" (manufactured by DIC Corporation), and "PC1300-02" (manufactured by Air World Corporation); examples of phosphorus-containing active ester compounds include "EXB9401" (manufactured by DIC Corporation); and examples of active ester compounds that are acetylated derivatives of phenolic varnishes include "DC808" (Mitsubishi). Examples of active ester compounds that are benzoyl compounds of phenolic varnishes include "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation); examples of active ester compounds containing styrene groups include "PC1300-02-65MA" (manufactured by Air Weather Company).

[0185] (C) The active ester equivalent of the active ester curing agent is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The active ester equivalent indicates the mass of the active ester compound per 1 equivalent of active ester groups.

[0186] The amount of (C) active ester-based curing agent in the resin composition is not particularly limited, but is preferably 3% by mass or more, more preferably 6% by mass or more, particularly preferably 10% by mass or more, more preferably 80% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition. When the amount of (C) active ester-based curing agent is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0187] The amount of (C) active ester-based curing agent in the resin composition is not particularly limited, but is preferably 6% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, more preferably 80% by mass or less, more preferably 70% by mass or less, and even more preferably 60% by mass or less, relative to 100% by mass of the resin component in the resin composition. When the amount of (C) active ester-based curing agent is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0188] The ratio (reactive ester groups / epoxy groups) of the total number of active ester groups in the (C) reactive ester-based curing agent to the total number of epoxy groups in the (B) epoxy resin is preferably within a specific range. The aforementioned ratio (reactive ester groups / epoxy groups) is preferably 0.1 or more, more preferably 0.5 or more, particularly preferably 0.8 or more, preferably 5 or less, more preferably 3 or less, and particularly preferably 2 or less. When the aforementioned ratio (reactive ester groups / epoxy groups) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0189] [5.(D) Inorganic filler materials]

[0190] In addition to the components described above, the resin composition may optionally further include (D) an inorganic filler. The inorganic filler, as component (D), is typically contained in the resin composition in particulate form.

[0191] Inorganic compounds can be used as the inorganic filler material for (D). Examples of inorganic filler materials for (D) include silicon dioxide, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconium phosphate, and zirconium tungstate phosphate. Among these, silicon dioxide is particularly suitable. Examples of silicon dioxide include amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide, and hollow silicon dioxide. Furthermore, spherical silicon dioxide is preferred. (D) Inorganic filler materials can be used alone or in combination of two or more in any ratio.

[0192] Commercially available products as (D) inorganic filler materials include, for example, "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admadex Co., Ltd.; and those manufactured by Denka Co., Ltd. "UFP-30"; "シルフィルNSS-3N", "シルフィルNSS-4N", "シルフィルNSS-5N" manufactured by Tokuta Corporation; "SC2500SQ", "SO-C4", "SO-C2", "SO-C1" made by the company; "DAW-03", "FB-105FD" made by the company, etc.

[0193] (D) From the viewpoint of significantly achieving the effects of the present invention, the average particle size of the inorganic filler material is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, preferably 5 μm or less, more preferably 2 μm or less, and even more preferably 1 μm or less. (D) The average particle size of the inorganic filler material can be determined by laser diffraction and scattering based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler material is prepared on a volume basis using a laser diffraction and scattering particle size distribution measuring device, and the median diameter is used as the average particle size, thereby enabling measurement. The sample to be measured can be a substance obtained by weighing 100 mg of the inorganic filler material and 10 g of methyl ethyl ketone into a vial and dispersing it ultrasonically for 10 minutes. For the sample to be measured, the volume-based particle size distribution of the inorganic filler material is measured using a laser diffraction and scattering particle size distribution measuring device with the light source wavelength set to blue and red in a flow cell manner, and the average particle size can be calculated from the obtained particle size distribution using the median diameter. Examples of laser diffraction particle size distribution measuring devices include the "LA-960" manufactured by Horiba Manufacturing Co., Ltd.

[0194] (D) From the viewpoint of significantly achieving the effects of the present invention, the specific surface area of ​​the inorganic filler material is preferably 0.1 m². 2 / g or more, more preferably 0.5m 2 / g or more, further preferably 1m 2 / g or more, preferably 3m 2 / g or more, preferably 100m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, preferably 40m 2 / g or less. The specific surface area of ​​the inorganic filler material is obtained by the BET method using a fully automated BET specific surface area measuring device (Macsorb HM-1210 manufactured by Macsorb Corporation). Nitrogen gas is adsorbed on the sample surface, and the specific surface area is calculated using the BET multi-point method.

[0195] (D) From the viewpoint of improving moisture resistance and dispersibility, inorganic filler materials are preferably treated with surface treatment agents. Examples of surface treatment agents include fluorinated silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, titanate coupling agents, etc. Furthermore, a single surface treatment agent can be used, or two or more can be used in combination.

[0196] Commercially available surface treatment agents include, for example, those manufactured by Shin-Etsu Chemical Industry Co., Ltd.: "KBM-1003", "KBE-1003" (vinyl silane coupling agent); "KBM-303", "KBM-402", "KBM-403", "KBE-402", "KBE-403" (epoxy silane coupling agent); "KBM-1403" (styrene silane coupling agent); "KBM-502", "KBM-503", "KBE-502", "KBE-503" (methacryloyl silane coupling agent); "KBM-5103" (acrylic silane coupling agent); "KBM-602", "KBM-603", "KBM-903", "KBE-903", "KBE-9103P", "KBM-573", and "KBM-575". Amino-based silane coupling agents; "KBM-9659" (isocyanurate-based silane coupling agent); "KBE-585" (urea-based silane coupling agent); "KBM-802", "KBM-803" (mercapto-based silane coupling agents); "KBE-9007N" (isocyanate-based silane coupling agent); "X-12-967C" (anhydride-based silane coupling agent); "KBM-13", "KBM-22", "KBM-103", "KBE-13", "KBE-22", "KBE-103", "KBM-3033", "KBE-3033", "KBM-3063", "KBE-3063", "KBE-3083", "KBM-3103C", "KBM-3066", "KBM-7103" (non-silane coupling - alkoxysilane compounds), etc.

[0197] From the viewpoint of improving the dispersibility of the (D) inorganic filler, the degree of surface treatment using the surface treatment agent is preferably within a specified range. Specifically, 100% by mass of the (D) inorganic filler is preferably surface treated with 0.2% to 5% by mass of the surface treatment agent, more preferably with 0.2% to 3% by mass, and even more preferably with 0.3% to 2% by mass.

[0198] The degree of surface treatment using the surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the inorganic filler (D). From the viewpoint of improving the dispersibility of the inorganic filler, the carbon content per unit surface area is preferably 0.02 mg / m³. 2 The above, and more preferably, is 0.1 mg / m³ 2 The above, and more preferably, is 0.2 mg / m³ 2 That's all. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition and the melt viscosity in flake form, 1.0 mg / m³ is preferred. 2 The following, more preferably, is 0.8 mg / m 2 The following, and more preferably, is 0.5 mg / m². 2 the following.

[0199] (D) The carbon content per unit surface area of ​​inorganic filler materials can be determined by washing the surface-treated inorganic filler materials with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the surface-treated inorganic filler materials, and ultrasonic washing is performed at 25°C for 5 minutes. After removing the supernatant and drying the non-volatile components, the carbon content per unit surface area of ​​the inorganic filler materials can be determined using a carbon analyzer. A carbon analyzer such as the "EMIA-320V" manufactured by Horiba Seisakusho Co., Ltd. can be used.

[0200] From the viewpoint of significantly achieving the effects of the present invention, the amount of inorganic filler (D) in the resin composition is preferably 20% by mass or more, more preferably 30% by mass or more, further preferably 40% by mass or more, particularly preferably 50% by mass or more, preferably 90% by mass or less, more preferably 80% by mass or less, and further preferably 70% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition.

[0201] The amount of the specific maleimide compound (A-1) relative to 100% by mass of the inorganic filler material (D) is preferably 2% by mass or more, more preferably 5% by mass or more, particularly preferably 8% by mass or more, preferably 40% by mass or less, more preferably 30% by mass or less, and particularly preferably 20% by mass or less. When using an amount of inorganic filler material (D) that satisfies these relationships, the effects of the present invention can be significantly obtained.

[0202] The amount of maleimide compound comprising the structure shown in formula (A1) is preferably 2% by mass or more, more preferably 5% by mass or more, particularly preferably 8% by mass or more, more preferably 40% by mass or less, more preferably 30% by mass or less, and particularly preferably 20% by mass or less, relative to 100% by mass of inorganic filler material (D). When using an amount of inorganic filler material (D) that satisfies these relationships, the effects of the present invention can be significantly obtained.

[0203] The amount of (A) maleimide compound relative to 100% by mass of (D) inorganic filler material is preferably 2% by mass or more, more preferably 5% by mass or more, particularly preferably 10% by mass or more, preferably 40% by mass or less, more preferably 30% by mass or less, and particularly preferably 20% by mass or less. When using an amount of (D) inorganic filler material that satisfies these relationships, the effects of the present invention can be significantly obtained.

[0204] [6. (E) Optional curing agent]

[0205] In addition to the components described above, the resin composition may optionally include (E) an optional curing agent. However, (C) an active ester-based curing agent is not included in (E) the optional curing agent. Examples of optional curing agents as component (E) include phenol-based curing agents, naphthol-based curing agents, benzoxazine-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, and anhydride-based curing agents. From the viewpoint of significantly obtaining the effects of the present invention, the optional curing agent (E) is preferably any one or more of phenol-based curing agents, naphthol-based curing agents, cyanate ester-based curing agents, and carbodiimide-based curing agents, more preferably any one or more of phenol-based curing agents and naphthol-based curing agents, and particularly preferably a phenol-based curing agent. The optional curing agent (E) may be used alone or in combination of two or more in any ratio.

[0206] From the viewpoint of heat resistance and water resistance, phenolic curing agents with a novolac structure or naphthol curing agents with a novolac structure are preferred as curing agents. Furthermore, from the viewpoint of adhesion to the conductor layer, nitrogen-containing phenolic curing agents are preferred, and phenolic curing agents containing a triazine backbone are more preferred.

[0207] Specific examples of phenol-based and naphthol-based curing agents include Meiwa Chemical Co., Ltd.'s "MEH-7700", "MEH-7810", and "MEH-7851"; Nippon Chemical Co., Ltd.'s "NHN", "CBN", and "GPH"; Nippon Steel & Sumitomo Metal Chemical Co., Ltd.'s "SN170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-495V", "SN-375", and "SN-395"; and DIC Corporation's "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA3018-50P", and "EXB-9500".

[0208] Specific examples of benzoxazine-based curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Kemica Co., Ltd.; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd" and "Fa" manufactured by Shikoku Chemical Co., Ltd.

[0209] Examples of cyanate ester curing agents include bisphenol A dicyanate, polyphenol cyanate, oligomeric (3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethoxydiphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanoyl)phenylpropane, 1,1-bis(4-cyanoylphenylmethane), bis(4-cyanoyl-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanoylphenyl-1-(methylethoxy))benzene, bis(4-cyanoylphenyl) sulfide, and bis(4-cyanoylphenyl) ether, as well as multifunctional cyanate ester resins derived from phenolic varnishes and cresol novolac, and prepolymers obtained by triazinizing a portion of these cyanate ester resins. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenolic varnish-type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resins), "BA230" and "BA230S75" (prepolymers formed by partially or completely triazinizing bisphenol A dicyanate to form trimers), etc.

[0210] Specific examples of carbodiimide-based curing agents include "V-03" and "V-07" manufactured by Nisshinbo Kemikal Co., Ltd.

[0211] As an anhydride-based curing agent, examples include curing agents having one or more anhydride groups per molecule, preferably curing agents having two or more anhydride groups per molecule. Specific examples of anhydride-based curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride (anhydrous methylnadic acid), hydrogenated methylnadic anhydride (hydrogenated anhydrous methylnadic acid), trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, Polymer-type anhydrides include trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, naphthalene tetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfone tetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(trimeric trimellitic anhydride ester), and styrene-maleic acid resin obtained by copolymerizing styrene and maleic acid. Commercially available anhydride-based curing agents include "HNA-100" and "MH-700" manufactured by Shin Nippon Rikka Co., Ltd.

[0212] The amount of optional curing agent (E) in the resin composition is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, particularly preferably 0.3% by mass or more, preferably 8% by mass or less, more preferably 5% by mass or less, and particularly preferably 3% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition. When the amount of optional curing agent (E) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0213] The amount of optional curing agent (E) in the resin composition is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, more preferably 10% by mass or less, more preferably 8% by mass or less, and particularly preferably 6% by mass or less, relative to 100% by mass of the resin component in the resin composition. When the amount of optional curing agent (E) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0214] The ratio (active group / epoxy group) of the total number of active groups in the optional curing agent (E) to the total number of epoxy groups in the epoxy resin (B) is preferably within a specific range. The aforementioned ratio (active group / epoxy group) is preferably 0.01 or more, more preferably 0.05 or more, particularly preferably 0.1 or more, preferably 3 or less, more preferably 1 or less, and particularly preferably 0.5 or less. "Total number of active groups in the optional curing agent (E)" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the optional curing agent (E) present in the resin composition by the equivalent of the active groups. When the aforementioned ratio (active group / epoxy group) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0215] [7. (F) Curing Accelerator]

[0216] In addition to the components described above, the resin composition may optionally further include (F) a curing accelerator. Examples of curing accelerators include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. One type of (F) curing accelerator may be used alone, or two or more may be used in any combination at any ratio.

[0217] Examples of phosphorus-based curing accelerators include tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitic phthalate, tetrabutylphosphonium hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butylphosphonium tetraphenylborate, as well as aliphatic phosphorus salts such as methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, and benzyltriphenylphosphonium chloride. Aromatic phosphorus salts including tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tri(3-methylphenyl)ethylphosphonium tetraphenylborate, tri(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc.; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone addition reactants such as triphenylphosphine-p-benzoquinone addition reactants; tributylphosphine, triterpenoid... Butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, tricyclohexylphosphine, and other aliphatic phosphines; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, Tris(2,6-dimethylphenyl)phosphine, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, 2,2'-bis(diphenylphosphino)diphenyl ether, and other aromatic phosphines.

[0218] Examples of urea-based curing accelerators include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; and 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. Aromatic dimethylureas include 1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea)[toluenebisdimethylurea], etc.

[0219] Examples of guanidine-based curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanidine, 1-ethylbiguanidine, 1-n-butylbiguanidine, 1-n-octadecylbiguanidine, 1,1-dimethylbiguanidine, 1,1-diethylbiguanidine, 1-cyclohexylbiguanidine, 1-allylbiguanidine, 1-phenylbiguanidine, and 1-(o-tolyl)biguanidine.

[0220] Examples of imidazole-based curing accelerators include 2-methylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolium-(1 [1']-ethyl-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine isocyanuric acid adduct, 2-phenylimidazolyl isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylmethylimidazolyl chloride, 2-methylimidazoline, 2-phenylimidazoline and other imidazole compounds and adducts of imidazole compounds with epoxy resins. As an imidazole-based curing accelerator, commercially available products can be used, such as "1B2PZ", "2MZA-PW", "2PHZ-PW" manufactured by Shikoku Chemical Industry Co., Ltd., and "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0221] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) and cobalt(III) acetylacetone, organocopper complexes such as copper(II) acetylacetone, organozinc complexes such as zinc(II) acetylacetone, organoiron complexes such as iron(III) acetylacetone, organonickel complexes such as nickel(II) acetylacetone, and organomanganese complexes such as manganese(II) acetylacetone. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0222] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyl dimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene. Commercially available products can also be used as amine-based curing accelerators, such as "MY-25" manufactured by Ajinomoto Fine-Techno.

[0223] The amount of curing accelerator (F) in the resin composition is not particularly limited, but is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, particularly preferably 0.05% by mass or more, more preferably 15% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less, relative to 100% by mass of the non-volatile components in the resin composition. When the amount of curing accelerator (F) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0224] The amount of curing accelerator (F) in the resin composition is not particularly limited, but is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, particularly preferably 0.1% by mass or more, preferably 15% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less, relative to 100% by mass of the resin component in the resin composition. When the amount of curing accelerator (F) is within the aforementioned range, the effects of the present invention can be significantly obtained.

[0225] [8. (G) Solvent]

[0226] In addition to the components described above, the resin composition may optionally further include a solvent (G). The solvent is typically a volatile component and may be an organic solvent. Examples of solvents for (G) include ketone solvents such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetate solvents such as ethyl acetate, butyl acetate, cellosol acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitol solvents such as cellosol and butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. A single solvent (G) may be used, or two or more may be used in any ratio.

[0227] (G) The amount of solvent is not particularly limited. (G) The amount of solvent relative to 100% by mass of all components in the resin composition can be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, etc.

[0228] [9. Other ingredients]

[0229] In addition to the components described above, the resin composition may optionally contain optional additives. Examples of such additives include thermoplastic resins, organic fillers, thickeners, defoamers, leveling agents, adhesion promoters, and flame retardants. These additives may be used individually or in combination of two or more in any ratio.

[0230] [10. Method for manufacturing resin composition]

[0231] The resin composition can be manufactured, for example, by mixing the above-mentioned components in any order. Furthermore, during the mixing of the components, heating and / or cooling can be performed by appropriately adjusting the temperature. Additionally, during or after mixing, the components can be stirred using a stirring device such as a mixer to ensure uniform dispersion. Further, if necessary, the resin composition can be degassed.

[0232] [11. Properties of the Resin Composition]

[0233] Based on the above resin composition, a cured product with a low dielectric loss tangent and a high glass transition temperature can be obtained.

[0234] For example, the dielectric loss tangent Df of the cured product obtained by curing the resin composition under the conditions described in the following examples is preferably 0.010 or less, more preferably 0.005 or less, and particularly preferably 0.004 or less. The lower limit value of the dielectric loss tangent Df of the aforementioned cured product is not particularly limited and can be 0.001 or more. The dielectric loss tangent of the cured product can be measured by the method described in the examples.

[0235] For example, the glass transition temperature (Tg) of the cured product obtained by curing the resin composition under the conditions described in the following embodiments is preferably 130°C or higher, more preferably 140°C or higher, and particularly preferably 150°C or higher. The upper limit of the glass transition temperature (Tg) of the aforementioned cured product is not particularly limited and may be 260°C or lower.

[0236] Cured resin compositions typically have low dielectric constants. For example, the dielectric constant Dk of a cured resin composition obtained by curing under the conditions described in the later examples is preferably 3.5 or less, more preferably 3.2 or less, and particularly preferably 3.0 or less. The lower limit of the dielectric constant of the aforementioned cured composition is not particularly limited and can be, for example, 2.0 or more. The dielectric constant of the cured composition can be determined by the method described in the examples.

[0237] When an insulating layer is formed from a cured resin composition, the surface roughness of the insulating layer after roughening treatment can be reduced. For example, when the insulating layer is formed and roughened using the method described in the examples below, the arithmetic mean roughness Ra of the surface of the insulating layer is preferably 200 nm or less, more preferably 100 nm or less, and particularly preferably 70 nm or less. The lower limit of the arithmetic mean roughness Ra is not particularly limited and can be, for example, 10 nm or more. The arithmetic mean roughness Ra of the surface of the insulating layer can be measured using the method described in the examples.

[0238] When an insulating layer is formed from a cured resin composition, and a conductor layer is formed on this insulating layer by plating, the plating peel strength, which is the adhesion strength between the insulating layer and the conductor layer, can be improved. For example, when the insulating layer and the conductor layer are formed by the method described in the following examples, the plating peel strength between the insulating layer and the conductor layer is preferably 0.3 kgf / cm or more, more preferably 0.4 kgf / cm or more, and particularly preferably 0.5 kgf / cm or more. The upper limit of the plating peel strength is not particularly limited and can be, for example, 2.0 kgf / cm or less. The plating peel strength between the insulating layer and the conductor layer can be measured by the method described in the examples.

[0239] [12. Uses of the resin composition]

[0240] The resin composition according to one embodiment of the present invention is suitable as a resin composition for insulating purposes, and is particularly suitable as a resin composition for forming an insulating layer. Therefore, for example, the resin composition is suitable as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board). Furthermore, the resin composition is suitable as a resin composition for forming an insulating layer (resin composition for forming an insulating layer of a conductor layer), said insulating layer being used to form a conductor layer (including a redistribution layer) formed on the insulating layer. In addition, the resin composition can be widely used in applications where the resin composition can be used, such as resin sheets, sheet laminates such as prepregs, solder resists, underfill materials, chip bonding materials, semiconductor sealing materials, via-filling resins, and component embedding resins.

[0241] Furthermore, in the case of manufacturing a semiconductor chip package via steps (1) to (6) below, the resin composition according to this embodiment is also suitable as a resin composition for forming a redistribution layer (which serves as an insulating layer for forming the redistribution layer) (resin composition for forming the redistribution layer) and a resin composition for sealing the semiconductor chip (resin composition for sealing the semiconductor chip). During the manufacturing of the semiconductor chip package, a redistribution layer may be further formed on the sealing layer.

[0242] (1) The step of laminating a pre-fixed film on a substrate.

[0243] (2) The step of pre-fixing the semiconductor chip on the pre-fixing film.

[0244] (3) The step of forming a sealing layer on the semiconductor chip.

[0245] (4) The step of peeling the substrate and pre-fixed film off the semiconductor chip.

[0246] (5) The step of forming a redistribution layer as an insulating layer on the surface of the semiconductor chip where the substrate and pre-fixed film have been stripped, and

[0247] (6) Step of forming a redistribution layer as a conductor layer on the redistribution layer

[0248] The above-mentioned resin composition can also be used in the case of circuit boards where the printed wiring board is an internal component.

[0249] [13. Sheet-like laminated materials]

[0250] The resin composition according to one embodiment of the present invention can also be used in a varnish state, and industrially it is preferably used in the form of a sheet laminate containing the resin composition. As a sheet laminate, resin sheets and prepregs as shown below are preferred.

[0251] The resin sheet includes a support and a resin composition layer formed on the support by the aforementioned resin composition layer.

[0252] From the viewpoint of achieving thinner printed circuit boards and providing a cured product with excellent film insulation properties even when the cured resin composition is a thin film, the thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less. The lower limit of the resin composition layer thickness is not particularly limited; for example, it can be 3 μm or more, 5 μm or more, etc.

[0253] Examples of supports include films made of plastic materials, metal foils, and release paper, with films and metal foils made of plastic materials being preferred.

[0254] When a film formed of a plastic material is used as the support, examples of plastic materials include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, and polyimide. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0255] When a metal foil is used as a support, examples of metal foils include copper foil and aluminum foil, with copper foil being preferred. As copper foil, foil formed from a single metal such as copper can be used, or foil formed from an alloy of copper with other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0256] The support can be surface-treated with matte finish, corona treatment, antistatic treatment, etc. on the surface that bonds with the resin composition layer.

[0257] Furthermore, as a support, a support with a release layer can be used on the surface bonded to the resin composition layer. Examples of release agents used in the release layer of the support with a release layer include, for example, one or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available products can be used as the support with the release layer, such as PET films having a release layer with an alkyd resin-based release agent as the main component, namely LINTEC's "SK-1," "AL-5," and "AL-7," Toray's "Lumira T60," Teijin's "Purex," and Unipul's "Unipul," etc.

[0258] The thickness of the support is not particularly limited, but is preferably in the range of 5μm to 75μm, more preferably in the range of 10μm to 60μm. It should be noted that when using a support with a release layer, the overall thickness of the support with the release layer is preferably within the above range.

[0259] In one embodiment, the resin sheet may further include optional layers as needed. Examples of such optional layers include, for instance, a protective film, oriented towards the support, disposed on the side of the resin composition layer not bonded to the support (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, but may be, for example, 1 μm to 40 μm. By laminating the protective film, the adhesion of dirt and other contaminants, as well as scratches, on the surface of the resin composition layer can be suppressed.

[0260] Resin sheets can be manufactured, for example, by preparing a resin varnish in which a resin composition is dissolved in a solvent, applying the resin varnish onto a support using a coating apparatus such as a die coater, and further drying it to form a resin composition layer. Examples of solvents include the same substances described as components (G) that can be included in the resin composition. One solvent can be used alone, or two or more solvents can be used in any ratio.

[0261] Drying can be carried out by methods such as heating or blowing hot air. Drying conditions are not particularly limited, but drying is generally carried out when the content of organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Depending on the boiling point of the organic solvent in the resin varnish, when using, for example, a resin varnish containing 30% to 60% by mass of organic solvent, a resin composition layer can be formed by drying at 50°C to 150°C for 1 to 10 minutes.

[0262] Resin sheets can be rolled up and stored. If the resin sheet has a protective film, it can be used by peeling off the protective film.

[0263] In one embodiment, the prepreg can be formed by impregnating a resin composition into a sheet fiber substrate.

[0264] The sheet fiber substrate used in the prepreg is not particularly limited, and examples include glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric. From the viewpoint of thinning the printed circuit board, the thickness of the sheet fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, further preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet fiber substrate is not particularly limited, and it is usually 10 μm or more.

[0265] Prepregs can be manufactured using known methods such as hot-melt method and solvent method.

[0266] The thickness of the prepreg can be the same range as the resin composition layer in the resin sheet described above.

[0267] [14. Printed Wiring Board]

[0268] One embodiment of the present invention relates to a printed wiring board comprising an insulating layer formed from a cured product obtained by curing the above-described resin composition.

[0269] Printed wiring boards can be manufactured, for example, using the resin sheets described above, by a method including the steps (I) and (II) below.

[0270] (I) The step of laminating a resin sheet onto an inner substrate in such a way that the resin composition layer of the resin sheet is bonded to the inner substrate.

[0271] (II) Step of curing the resin composition layer to form an insulating layer

[0272] The "inner layer substrate" used in step (I) refers to the component of the substrate that forms the printed wiring board, such as glass epoxy substrate, metal substrate, polyester substrate, polyimide substrate, BT resin substrate, thermosetting polyphenylene ether substrate, etc. Furthermore, the substrate may have a conductor layer on one or both sides, and this conductor layer may also be patterned. An inner layer substrate with a conductor layer formed on one or both sides of the substrate is sometimes called an "inner layer circuit board." In addition, intermediate components that should be further formed with an insulating layer and / or a conductor layer during the manufacture of the printed wiring board are also included in the "inner layer substrate." In the case where the printed wiring board is a circuit board with embedded components, an inner layer substrate with embedded components can be used.

[0273] The lamination of the inner substrate and the resin sheet can be achieved, for example, by heating and pressing the resin sheet onto the inner substrate from the support side. Examples of components for heating and pressing the resin sheet onto the inner substrate (hereinafter also referred to as "heat-pressing components") include, for example, a heated metal plate (SUS mirror plate, etc.) or a metal roller (SUS roller, etc.). It should be noted that it is preferable not to directly press the resin sheet onto the heat-pressing component, but rather to press the resin sheet onto the inner substrate in a manner that allows the resin sheet to fully follow the surface irregularities of the inner substrate, using an elastic material such as heat-resistant rubber.

[0274] The lamination of the inner substrate and the resin sheet can be performed by vacuum lamination. In vacuum lamination, the heating and pressing temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C; the heating and pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably 0.29 MPa to 1.47 MPa; and the heating and pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination can preferably be performed under reduced pressure conditions below 26.7 hPa.

[0275] Lamination can be performed using commercially available vacuum laminators. Examples of commercially available vacuum laminators include the vacuum pressurized laminator manufactured by Meiki Seisakusho Co., Ltd., the vacuum applicator manufactured by Nikka Materias Co., Ltd., and the intermittent vacuum pressurized laminator.

[0276] After lamination, the laminated resin sheets can be smoothed under atmospheric pressure, for example, by applying pressure from the support side using a heated pressing member. The pressure conditions for smoothing can be the same as the heating and pressing conditions for lamination described above. Smoothing can be performed using a commercially available laminator. It should be noted that lamination and smoothing can be performed continuously using the aforementioned commercially available vacuum laminator.

[0277] The support can be removed between step (I) and step (II), or it can be removed after step (II).

[0278] In step (II), the resin composition layer is cured to form an insulating layer comprising the cured resin composition. The curing conditions for the resin composition layer are not particularly limited, and the conditions used when forming the insulating layer of a printed wiring board can be used. Typically, the resin composition layer can be cured by thermosetting.

[0279] For example, the thermosetting conditions of the resin composition layer vary depending on the type of resin composition. In one embodiment, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and even more preferably 170°C to 210°C. The curing time can be set preferably to 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0280] Before heat curing the resin composition layer, the resin composition layer can be preheated at a temperature lower than the curing temperature. For example, before heat curing the resin composition layer, it can be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0281] The method for manufacturing a printed wiring board may further include (III) the step of creating holes in the insulating layer, (IV) the step of roughening the insulating layer, and (V) the step of forming a conductor layer. If the support is removed after step (II), the removal of the support can be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating and conductor layers in steps (I) to (V) can be repeated to form a multilayer wiring board.

[0282] In another embodiment, the printed wiring board can be manufactured using the prepreg described above. The manufacturing method is essentially the same as when using resin sheets.

[0283] Step (III) is the step of creating holes in the insulating layer, thereby forming vias, through holes, and other holes in the insulating layer. Step (III) can be carried out using, for example, a drill bit, a laser, or plasma, depending on the composition of the resin composition used in the formation of the insulating layer. The size and shape of the holes can be appropriately determined according to the design of the printed circuit board.

[0284] Step (IV) is the step of roughening the insulating layer. Typically, drilling debris removal is also performed in step (IV). There are no particular limitations on the process or conditions of the roughening treatment. For example, the insulating layer can be roughened by sequentially performing swelling treatment using a swelling solution, roughening treatment using an oxidizing agent, and neutralization treatment using a neutralizing solution.

[0285] Examples of swelling solutions used in the roughening process include alkaline solutions and surfactant solutions, with alkaline solutions being preferred. Sodium hydroxide solution and potassium hydroxide solution are more preferred as alkaline solutions. Commercially available swelling solutions include, for example, "Swelling Dip Securiganth P" and "Swelling Dip Securiganth SBU" manufactured by Atotech Japan. The swelling treatment using the swelling solution is not particularly limited and can be performed by immersing the insulating layer in a swelling solution at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 to 15 minutes.

[0286] Examples of oxidants used in roughening treatments include alkaline permanganate solutions, such as potassium permanganate or sodium permanganate dissolved in an aqueous solution of sodium hydroxide. Roughening treatment using alkaline permanganate solutions or similar oxidants is preferably performed by immersing the insulating layer in an oxidant solution heated to 60°C to 100°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidants include, for example, alkaline permanganate solutions such as "Concentrate Compact CP" and "Dozing Solution Securigans P" manufactured by Atotech Japan.

[0287] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available example is "Reduction solution SecuriganthP" manufactured by Atotech Japan. The treatment using the neutralizing solution can be performed by immersing the roughened surface treated with the oxidant in a neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From a workability perspective, it is preferable to immerse the roughened object treated with the oxidant in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0288] In one embodiment, the arithmetic mean roughness Ra of the roughened insulating layer surface is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit; for example, it can be 1 nm or more, 2 nm or more, etc. Furthermore, the root mean square roughness (Rq) of the roughened insulating layer surface is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit; it can be, for example, 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0289] Step (V) is the step of forming a conductor layer, which is formed on the insulating layer. The conductor material used in the conductor layer is not particularly limited. In a suitable embodiment, the conductor layer comprises one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer can be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). From the viewpoints of versatility in conductor layer formation, cost, and ease of pattern formation, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy, copper-nickel alloy, or copper-titanium alloy, is preferred. More preferably, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy, is even more preferred. A single metal layer of copper is even more preferred.

[0290] The conductor layer can be a single-layer structure or a multilayer structure obtained by stacking two or more single-metal layers or alloy layers formed of different kinds of metals or alloys. When the conductor layer is a multilayer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

[0291] The thickness of the conductor layer varies depending on the desired design of the printed wiring board, and is generally 3μm to 35μm, preferably 5μm to 30μm.

[0292] The conductor layer is preferably formed by plating. For example, the conductor layer with the desired wiring pattern can be formed by plating on the surface of the insulating layer using methods such as semi-additive or fully additive methods. From the viewpoint of ease of manufacturing, it is preferred to form it by the semi-additive method. Hereinafter, examples of forming the conductor layer by the semi-additive method are shown.

[0293] A plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, corresponding to the desired wiring pattern, exposing a portion of the plating seed layer. After forming a metal layer on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Subsequently, the unwanted plating seed layer is removed by etching or the like, thus forming a conductor layer with the desired wiring pattern.

[0294] [15. Semiconductor Devices]

[0295] One embodiment of the present invention relates to a semiconductor device comprising the aforementioned printed wiring board. This semiconductor device can be manufactured using the aforementioned printed wiring board.

[0296] As semiconductor devices, examples include various semiconductor devices supplied to electrical products (such as computers, mobile phones, digital cameras, and televisions) and vehicles (such as autonomous two-wheeled vehicles, automobiles, trains, ships, and aircraft). Example

[0297] The present invention will now be specifically described with reference to embodiments shown. However, the present invention is not limited to the embodiments described below. In the following description, the terms "parts" and "%" to indicate quantities refer to "parts by mass" and "% by mass," respectively, unless otherwise explicitly stated. Furthermore, the operations described below are performed under normal temperature and pressure conditions unless otherwise explicitly stated.

[0298] [Preparation of maleimide compounds]

[0299] A MEK solution (70% by mass of non-volatile component) of maleimide compound A1 is prepared for synthesis by the method described in Synthesis Example 1 of Patent Application Publication No. 2020-500211. The maleimide compound A1 has the following formula.

[0300] [Chemistry 13]

[0301]

[0302] If the FD-MS spectrum of maleimide compound A1 is measured, peaks with M+ = 560, 718, and 876 are identified. These peaks correspond to n1 values ​​of 0, 1, and 2, respectively. Furthermore, if maleimide compound A1 is analyzed by GPC, and the number of repeating units n1 in the indane skeleton is determined based on the number-average molecular weight, then n1 = 1.47, and the molecular weight distribution (Mw / Mn) = 1.81. Further, out of 100% of the total area of ​​maleimide compound A1, the proportion of maleimide compounds with an average repeating unit number n1 of 0 is 26.5% by area.

[0303] The FD-MS spectrum of the aforementioned maleimide compound A1 was determined using the following measuring apparatus and under the following measuring conditions.

[0304] (Apparatus and conditions for FD-MS spectroscopy)

[0305] Measurement device: JMS-T100GC AccuTOF

[0306] Measurement conditions

[0307] Measurement range: m / z = 4.00~2000.00

[0308] Rate of change: 51.2 mA / min

[0309] Final current value: 45mA

[0310] Cathode voltage: -10kV

[0311] Recording interval: 0.07 sec

[0312] The GPC of the aforementioned maleimide compound A1 was determined using the following measuring apparatus and measuring conditions.

[0313] Measurement apparatus: Tosoh Corporation "HLC-8320 GPC"

[0314] Pillars: Tosoh Corporation garden pillars "HXL-L", Tosoh Corporation "TSK-GEL G2000HXL", Tosoh Corporation "TSK-GEL G2000HXL", Tosoh Corporation "TSK-GEL G3000HXL", and Tosoh Corporation "TSK-GELG4000HXL"

[0315] Detector: RI (Differential Refractometer)

[0316] Data processing: Tosoh Corporation's "GPC Workstation EcoSEC-WorkStation"

[0317] Measurement conditions: column temperature 40℃

[0318] Elution solvent tetrahydrofuran

[0319] Flow rate 1.0 ml / min

[0320] Standard: According to the aforementioned "GPC Workstation EcoSEC-WorkStation" test manual, use monodisperse polystyrene with a known molecular weight.

[0321] Sample: 50 μl obtained by filtering a tetrahydrofuran solution containing 1.0% by mass of maleimide compound (converted to non-volatile components) through a microfilter.

[0322] The molecular weight distribution (weight-average molecular weight (Mw) / number-average molecular weight (Mn)) of maleimide compound A1 and the average number of repeating units "n1" contributing to the indane skeleton in the maleimide compound are expressed as numbers calculated from the GPC plot obtained by the aforementioned GPC determination. Furthermore, the average number of repeating units "n1" is a number calculated based on the number-average molecular weight (Mn). Specifically, for compounds with n1 ranging from 0 to 4, the theoretical molecular weight and the measured molecular weight from the GPC are plotted on a scatter plot to create an approximate straight line. The number-average molecular weight (Mn) is then calculated from the point indicated by the measured value Mn (1) on this straight line, and the average number of repeating units "n1" is further calculated. Furthermore, based on the results of the GPC determination, the proportion (area %) of maleimide compounds with an average number of repeating units n1 of 0 in 100 area % of the total amount of maleimide compound A1 is calculated. For details, please refer to Patent Application Publication No. 2020-500211.

[0323] [Example 1]

[0324] The following mixture was prepared: 20 parts of the above-mentioned maleimide compound A1 (70% by mass solution of non-volatile component), 10 parts of liquid epoxy resin containing a naphthalene skeleton (DIC Corporation "HP-4032-SS", epoxy equivalent 144 g / eq.), 30 parts of an active ester curing agent containing a dicyclopentadiene-type diphenol structure (DIC Corporation "HPC-8000-65T", toluene solution with 65% by mass of non-volatile component, active ester equivalent 223 g / eq.), and spherical silica (Admadex Corporation "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m²) surface-treated with an inorganic filler material (amine-based alkoxysilane compound (Shin-Etsu Chemical Industry Co., Ltd. "KBM573"). 2 Mix 80 parts of resin varnish and 0.5 parts of curing accelerator (imidazolium compound "1B2PZ" manufactured by Shikoku Kasei Corporation), and disperse evenly using a high-speed rotary mixer to obtain resin varnish.

[0325] As a support, a polyethylene terephthalate film (LINTEC "AL5", 38 μm thick) with a release layer was prepared. The aforementioned resin varnish was uniformly applied onto the release layer of this support, such that the dried resin composition layer reached a thickness of 40 μm. Subsequently, the resin varnish was dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet comprising the support and the resin composition layer.

[0326] [Example 2]

[0327] Instead of the dicyclopentadiene-type diphenol-based active ester curing agent (DIC Corporation's "HPC-8000-65T"), 30 parts of an active ester compound containing a naphthalene structure (DIC Corporation's "HPC-8150-62T", a toluene solution with 62% by mass of non-volatile components, and an active ester equivalent of 229 g / eq.) were used. Except as described above, the resin sheet was manufactured in the same manner as in Example 1.

[0328] [Example 3]

[0329] The amount of maleimide compound A1 (70% by mass solution of non-volatile component) was changed from 20 parts to 15 parts. Furthermore, instead of the active ester curing agent (DIC Corporation's "HPC-8000-65T") containing a dicyclopentadiene-type diphenol structure, 30 parts of an active ester compound containing a naphthalene structure (DIC Corporation's "HPC-8150-62T", 62% by mass toluene solution of non-volatile component, 229 g / eq. of active ester group equivalent) were used. Further, 5 parts of a biphenyl aralkyl-type maleimide compound (Nippon Kayaku Co., Ltd.'s "MIR-3000-70MT", maleimide group equivalent: 275 g / eq., 70% MEK / toluene mixed solution of non-volatile component) were added to the resin composition. Except for the above, the resin sheet was manufactured in the same manner as in Example 1.

[0330] [Example 4]

[0331] The amount of maleimide compound A1 (a solution of 70% by mass of non-volatile components) was changed from 20 parts to 18 parts. Furthermore, instead of the active ester curing agent ("HPC-8000-65T" manufactured by DIC Corporation) containing a dicyclopentadiene-type diphenol structure, 30 parts of an active ester compound containing a naphthalene structure ("HPC-8150-62T" manufactured by DIC Corporation, a toluene solution of 62% by mass of non-volatile components, and an active ester equivalent of 229 g / eq.) were used. Further, 2 parts of a liquid aliphatic maleimide compound ("BMI-1500" manufactured by Designar Molecules Corporation, with a maleimide equivalent of 750 g / eq.) were added to the resin composition. Except for the above, a resin sheet was manufactured in the same manner as in Example 1.

[0332] [Example 5]

[0333] Instead of the dicyclopentadiene-type diphenol-based active ester curing agent (DIC Corporation's "HPC-8000-65T"), 25 parts of an active ester compound containing a naphthalene structure (DIC Corporation's "HPC-8150-62T", a toluene solution with 62% by mass of non-volatile components and an active ester equivalent of 229 g / eq.) were used. Furthermore, the amount of the curing accelerator (Shikoku Kasei Corporation's imidazole compound "1B2PZ") was changed from 0.5 parts to 0.1 parts. Further, 5 parts of a cresol phenolic varnish-based curing agent containing a triazine skeleton (DIC Corporation's "LA-3018-50P", a 2-methoxypropanol solution with a hydroxyl equivalent of approximately 151 and 50% non-volatile components) were added to the resin composition. Except for the above, the resin sheet was manufactured in the same manner as in Example 1.

[0334] [Comparative Example 1]

[0335] Maleimide compound A1 was not used. Furthermore, instead of the reactive ester curing agent containing a dicyclopentadiene-type diphenol structure (DIC Corporation's "HPC-8000-65T"), 30 parts of an reactive ester compound containing a naphthalene structure (DIC Corporation's "HPC-8150-62T", a toluene solution with 62% by mass of non-volatile components, and an active ester equivalent of 229 g / eq.) were used. Furthermore, the amount of inorganic filler was changed from 80 parts to 55 parts. Except for the above, the resin sheet was manufactured in the same manner as in Example 1.

[0336] [Comparative Example 2]

[0337] Instead of maleimide compound A1 (a solution of 70% by mass of non-volatile components), 20 parts of a biphenyl aralkyl type maleimide compound (MIR-3000-70MT manufactured by Nippon Kayaku Co., Ltd., maleimide equivalent: 275 g / eq., a MEK / toluene mixed solution of 70% non-volatile components) was used. Furthermore, instead of an active ester curing agent containing a dicyclopentadiene-type diphenol structure (HPC-8000-65T manufactured by DIC Co., Ltd.), 30 parts of an active ester compound containing a naphthalene structure (HPC-8150-62T manufactured by DIC Co., Ltd., a toluene solution of 62% by mass of non-volatile components, an active ester equivalent of 229 g / eq.) was used. Except for the above, the resin sheet was manufactured in the same manner as in Example 1.

[0338] [Comparative Example 3]

[0339] Instead of maleimide compound A1 (a solution of 70% by mass of non-volatile components), 20 parts of a liquid aliphatic maleimide compound (Designer Molecules Co., Ltd., "BMI-1500", maleimide equivalent 750 g / eq.) were used. Furthermore, instead of an active ester curing agent containing a dicyclopentadiene-type diphenol structure (DIC Co., Ltd., "HPC-8000-65T"), 30 parts of an active ester compound containing a naphthalene structure (DIC Co., Ltd., "HPC-8150-62T", toluene solution of 62% by mass of non-volatile components, active ester equivalent 229 g / eq.) were used. Except for the above, resin sheets were manufactured in the same manner as in Example 1.

[0340] [Determination of dielectric properties]

[0341] The resin sheets prepared in the examples and comparative examples were heated at 200°C for 90 minutes to thermally cure the resin composition layer. Subsequently, the support was peeled off to obtain the cured resin composition. The cured composition was cut into test pieces with a width of 2 mm and a length of 80 mm. For these test pieces, the dielectric constant Dk and dielectric loss tangent Df were measured using an Agilent Technologies HP8362B via the void resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on three test pieces, and the average values ​​are shown in the table below.

[0342] [Determination of plating peel strength]

[0343] (1) Pre-treatment of inner layer circuit board (underground processing):

[0344] As the inner layer circuit board, a double-sided copper-clad laminate (copper foil thickness 18μm, substrate thickness 0.4mm, Panasonic "R1515A") is prepared on a glass cloth substrate with inner layer circuits (copper foil) on both sides. The copper surface is roughened by etching 1μm on both sides of the inner layer circuit board using Mek's "CZ8101".

[0345] (2) Lamination of resin sheets:

[0346] Resin sheets were laminated onto both sides of the inner circuit board using an intermittent vacuum pressure laminator (Niccolò Matterels, 2-stage laminator, CVP700). This lamination was performed by bringing the resin composition layer of the resin sheet into contact with the inner circuit board. Furthermore, the lamination was performed by depressurizing for 30 seconds, setting the pressure to below 13 hPa, and then pressing for 45 seconds at 130°C and 0.74 MPa. Following this, a heat pressurization was performed for 75 seconds at 120°C and 0.5 MPa.

[0347] (3) Curing of the resin composition:

[0348] The laminated resin sheet and inner circuit board are heated at 130°C for 30 minutes, followed by heating at 170°C for 30 minutes to cure the resin composition and form an insulating layer. The support is then peeled off to obtain a laminated substrate having an insulating layer, an inner circuit board, and an insulating layer in sequence.

[0349] (4) Roughening treatment:

[0350] The aforementioned laminated substrate was immersed in a swelling solution (Swelling Dip Securiganth P (diol ether, sodium hydroxide aqueous solution) containing diethylene glycol monobutyl ether manufactured by Atotech Japan) at 60°C for 10 minutes. Next, the laminated substrate was immersed in a roughening solution (Atotech Japan's Concentrate Compact P (an aqueous solution of KMnO4: 60 g / L and NaOH: 40 g / L) at 80°C for 20 minutes. Afterward, the laminated substrate was immersed in a neutralization solution (Atotech Japan's Reduction Solution Securiganth P (an aqueous solution of sulfuric acid)) at 40°C for 5 minutes. Finally, the laminated substrate was dried at 80°C for 30 minutes to obtain "Evaluation Substrate A".

[0351] (5) Plating using a semi-additive process:

[0352] Evaluation substrate A was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, followed by immersion in an electroless copper plating solution at 25°C for 20 minutes. Then, it was annealed at 150°C for 30 minutes. Next, an etch resist was formed, and an etched pattern was created. Then, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 20 μm. Finally, it was annealed at 200°C for 60 minutes to obtain "evaluation substrate B".

[0353] (6) Determination of plating peel strength:

[0354] On the conductor layer of evaluation substrate B, a cut is formed to enclose a rectangular portion with a width of 10 mm and a length of 100 mm. One end of the rectangular portion is peeled off and held in place with a jig (TIEYI Co., Ltd., Autocom type testing machine "AC-50C-SL"). Using the jig, the rectangular portion is peeled off vertically at a speed of 50 mm / min at room temperature, and the load (kgf / cm) at which 35 mm is peeled off is measured as the plating peel strength.

[0355] [Determination of surface roughness Ra]

[0356] The arithmetic mean roughness Ra of the insulating layer surface of the evaluation substrate A, prepared in the aforementioned [Determination of Plating Peel Strength] section, was measured. The measurement was performed using a non-contact surface roughness meter (Veeco Instruments Inc. WYKO NT3300) in VSI mode with a 50x lens, and the measurement range was set to 121 μm × 92 μm. The measurement was conducted at 10 measurement points, and the average values ​​are shown in the table below.

[0357] [Determination of glass transition temperature Tg]

[0358] The resin sheet was heated in an oven at 190°C for 90 minutes to cure the resin composition layer. Subsequently, the support was peeled off to obtain the cured resin composition layer. This cured layer was then cut into pieces 20 mm in length and 6 mm in width to obtain the cured product for evaluation.

[0359] For the cured material used in the evaluation, a thermomechanical analysis (TMA) apparatus manufactured by Rigaku Corporation was used. The tensile weighting method was employed to obtain the first TMA curve, obtained by heating from 25°C to 250°C at a rate of 5°C / min. Subsequently, the same measurement was performed on the same cured material to obtain a second TMA curve. The glass transition temperature Tg (°C) was determined from the second TMA curve.

[0360] [result]

[0361] The results of the examples and comparative examples are shown in Table 1 below.

[0362]

Claims

1. A resin composition comprising (A) a maleimide compound, (B) an epoxy resin, (C) an active ester-based curing agent, and (D) an inorganic filler. (A) Maleimide compounds include (A-1) maleimide compounds containing a trimethylindane skeleton. Component (A-1) contains the structure shown in formula (A4). The amount of component (A-1) relative to 100% by mass of the resin component in the resin composition is 0.5% by mass or more and 70% by mass or less. (B) The amount of the component relative to 100% by mass of the resin component in the resin composition is 3% by mass or more and 50% by mass or less; (D) The amount of the component relative to 100% by mass of the non-volatile component in the resin composition is 20% by mass or more and 90% by mass or less. [Chemistry 1] In formula (A4), Ar a1 This indicates an optional divalent aromatic hydrocarbon group with substituents; R a1 Each of these can be independently represented as an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. R a2 Each of these can be independently represented as an alkyl group with 1 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, an aryl group with 6 to 10 carbon atoms, an aryloxy group with 6 to 10 carbon atoms, an arylthio group with 6 to 10 carbon atoms, a cycloalkyl group with 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. R a3 Each can independently represent a divalent aliphatic hydrocarbon group; n a1 Represents positive integers; n a2 Each can independently represent an integer from 0 to 4; n a3 Each can independently represent an integer from 0 to 3; R a1 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may be optionally replaced by halogen atoms; R a2 The hydrogen atoms of alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups may be optionally replaced by halogen atoms; n a2 When R is 2 to 4, a1 They can be the same or different on the same ring; n a3 When R is 2 to 3, a2 They can be the same or different on the same ring.

2. The resin composition according to claim 1, wherein, The amount of component (A-1) is 2% by mass or more relative to 100% by mass of the resin component in the resin composition.

3. The resin composition according to claim 1, wherein, The amount of component (A-1) is less than 50% by mass relative to 100% by mass of the resin component in the resin composition.

4. The resin composition according to claim 1, wherein, (A) The amount of component is 0.5% by mass and less than 70% by mass relative to 100% by mass of the resin component in the resin composition.

5. The resin composition according to claim 1, wherein, (A) The amount of component is 2% by mass or more relative to 100% by mass of the resin component in the resin composition.

6. The resin composition according to claim 1, wherein, (A) The amount of component is less than 50% by mass relative to 100% by mass of the resin component in the resin composition.

7. The resin composition according to claim 1, wherein, (B) The amount of component is 20% by mass or more relative to 100% by mass of the resin component in the resin composition.

8. The resin composition according to claim 1, wherein, (B) The amount of component is less than 30% by mass relative to 100% by mass of the resin component in the resin composition.

9. The resin composition according to claim 1, wherein, The amount of component (A-1) is more than 60% by mass and less than 200% by mass relative to 100% by mass of epoxy resin (B) in the resin composition.

10. The resin composition according to claim 1, wherein, (C) The amount of component is 6% by mass and less than 80% by mass relative to 100% by mass of the resin component in the resin composition.

11. The resin composition according to claim 1, wherein, (C) The amount of component is 30% or more by mass relative to 100% by mass of the resin component in the resin composition.

12. The resin composition according to claim 1, wherein, (C) The amount of component is less than 60% by mass relative to 100% by mass of the resin component in the resin composition.

13. The resin composition according to claim 1, wherein, (D) The amount of component (D) is 50% or more of the non-volatile components in the resin composition, relative to 100% by mass.

14. The resin composition according to claim 1, wherein, (D) The amount of component (D) is less than 70% by mass relative to 100% by mass of non-volatile components in the resin composition.

15. The resin composition according to claim 1, wherein, The amount of component (A-1) is more than 2% and less than 40% by mass relative to 100% by mass of inorganic filler material (D).

16. The resin composition according to claim 1, used to form an insulating layer.

17. The cured product of the resin composition according to any one of claims 1 to 16.

18. A resin sheet having a support and a layer of resin composition formed on the support by any one of the resin compositions of claims 1 to 16.

19. A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 16.

20. A semiconductor device comprising the printed wiring board of claim 19.

Images