Flat conductor connection element

Abstract

The invention relates to a flat conductor connection element (1) for an electrically conductive structure (3), in particular an electrically conductive layer, the electrically conductive structure being applied on a plate (2), the flat conductor connection element comprising at least one conductor (4, 4'), the conductor comprising a flat conductor (5), the conductor having a first connection region (9) at a first end (11) and a second connection region (10) at a second end (12), wherein the first connection region (9) has a connection surface (13) for electrical connection to the electrically conductive structure (3) and a contact surface (14) opposite the connection surface for contact with a welding tool; an encapsulation layer (15) made of an electrically insulating material, the encapsulation layer encapsulating the conductor (4) at least in the conductor section containing the first connection region (9), the encapsulation layer (15) having a perforation (19), the connection surface (13) and the contact surface (14) of the first connection region (9) being accessible through the perforation (19), wherein the first connection region (9) of the conductor (4) is located within the perforation (19) when viewed perpendicularly through the plane of the encapsulation layer (15). Furthermore, the invention relates to a connection arrangement having such a flat-conductor connecting element, wherein the through-opening is covered.

Description

Technical Field

[0001] The invention relates to a flat-conductor connecting element, a connecting device comprising a flat-conductor connecting element, a method for producing the same, and the use thereof. Background Art

[0002] Flexible flat conductors, also called flat ribbon conductors or foil conductors, are frequently used in the automotive industry, in particular to enable movable electrical contacting under limited space conditions.

[0003] Flat conductors typically consist of tinned copper strips with a thickness of 0.03 mm to 0.1 mm and a width of 2 mm to 16 mm. Copper has proven suitable for these ribbon conductors because of its good electrical conductivity, ease of processing into thin films, and low material costs. Other conductive materials that can be processed into thin films can also be used. Examples include gold, silver, aluminum, or tin.

[0004] For electrical insulation and stabilization, the tinned copper tape can be applied to a carrier material made of plastic or laminated on both sides with the carrier material. A plurality of electrically conductive layers that are electrically insulated from one another can be located in a foil conductor tape.

[0005] Flat-conductor connecting elements are known, for example, from EP 1 153 801 A2, DE 10 2007 059818 B3, WO 01 / 56334 A1 or WO 2016 / 104137 A1.

[0006] In the automotive sector, flat conductors are used, for example, to contact electrical functional layers in composite glass panes. Examples can be found in DE 42 35 063 A1, DE 20 2004 019 286 U1, or DE 93 13 394 U1. Further prior art can be found in US 2018 / 287294 A1.

[0007] Such composite glass panes typically consist of at least two rigid individual glass panes, which are bonded together in a planar manner via a thermoplastic adhesive layer. The adhesive layer thickness is, for example, 0.76 mm. Additionally, electrical functional layers, such as heating coatings and / or antenna elements, are located between the individual glass panes and are connected to flat conductors. Suitable flat conductors for this purpose have a total thickness of only 0.3 mm. Such thin flat conductors can be easily embedded in the thermoplastic adhesive layer between the individual glass panes.

[0008] The use of flat conductors for contacting electrical functional layers is not limited to the automotive sector. As known from DE 199 60 450 C1, flat conductors are also used in the architectural sector. In composite or insulating glass panes, thin-film conductors are used to make electrical contact with integrated electrical components, such as voltage-controlled electrochromic layers, solar cells, filaments, alarm circuits, and the like.

[0009] Typically, the board manufacturer requires a board with a connection area and complete connection elements for tool-free connection to further control electronics.

[0010] In practice, it is common to weld flat conductors to electrically conductive structures by placing a hot stamp onto the electrically insulating covering of the flat conductor. Since the weld point cannot be seen through the insulating covering, the poor weld quality is disadvantageous in this method of operation. Only hot stamps are well-suited as welding tools. Summary of the Invention

[0011] In contrast, the present invention aims to provide an improved flat conductor connecting element and a connecting device made therefrom which can achieve better quality control and in particular can also use different welding tools. In addition, the connecting device should be simple, cost-effective and efficiently manufactured.

[0012] According to the proposal of the invention, this and other objects are achieved by a flat-conductor connecting element and a connecting device as well as a method for producing the connecting device. Preferred embodiments of the invention are apparent from the further exemplary embodiments.

[0013] The flat conductor connecting element according to the invention is provided for soldering to an electrically conductive structure on a board. The electrically conductive structure is preferably an electrically conductive layer applied to the board.

[0014] The flat conductor element includes at least one conductor, including at least one flat conductor. The conductor has a first connection region at a first end and a second connection region at a second end. The first connection region has a connection surface for electrical connection to a conductive structure and a contact surface opposite the connection surface for contact with a soldering tool (touch) for soldering the connection surface. In the installed state, the connection surface and the contact surface are parallel to the board plane. The second connection region is used for connection to an electrical control device, a voltage source, etc.

[0015] According to one embodiment, the conductor consists only of a flat conductor (strip conductor, in particular a metal strip). In this case, the first connection region is formed by the flat conductor. The flat conductor has two opposite sides or surfaces forming the connection surface and the contact surface.

[0016] According to another embodiment, the conductor comprises a flat conductor that is electrically connected to a round conductor, wherein the round conductor is optionally electrically connected to a connecting element. The first connection region is formed by the round conductor or, if appropriate, by the connecting element. The connection surface and the contact surface are advantageously formed by opposing sides or surfaces of the connecting element.

[0017] Flat conductors (also called foil conductors or flat ribbon conductors) are electrical conductors whose width is significantly greater than their thickness. Flat conductors are preferably designed to be so thin (ie, so thin) that they are flexible and bendable.

[0018] The flat conductor preferably contains a metal film, particularly preferably a strip-shaped or band-shaped metal film. In an advantageous embodiment of the flat conductor connecting element according to the invention, the flat conductor consists of a metal film, preferably a strip-shaped or band-shaped metal film.

[0019] The flat conductor preferably comprises or consists of a copper, aluminum, stainless steel, tin, gold, or silver foil as a metal foil. The metal foil may also comprise or consist of alloys of the aforementioned metals. The metal foil is advantageously tinned in sections or completely. This is particularly advantageous in order to achieve good solderability while simultaneously protecting against corrosion.

[0020] In an advantageous embodiment of the flat-conductor connecting element according to the invention, the flat conductor has a thickness of 10 μm to 300 μm, preferably 30 μm to 250 μm, and in particular 50 μm to 150 μm. Such thin flat conductors are particularly flexible and can, for example, be easily laminated into and led out of composite panels.

[0021] In another advantageous embodiment of the flat-conductor connecting element according to the invention, the flat conductor has a width of 0.5 mm to 100 mm, preferably 1 mm to 50 mm, and in particular 10 mm to 30 mm. This width is particularly suitable for achieving a sufficient current-carrying capacity in combination with the aforementioned thicknesses. The width of the flat conductor can be constant or can vary.

[0022] In an advantageous embodiment of the flat conductor connecting element according to the invention, the flat conductor has a length of 5 cm to 150 cm, preferably 10 cm to 100 cm and in particular 50 cm to 90 cm. It goes without saying that the length, width and thickness of the flat conductor can be adapted to the requirements of the respective individual case.

[0023] In the case of a flat conductor, the length direction defines the extension direction. The length direction and the width direction span a first side and a second side opposite the first side. For example, the first side can also be referred to as the bottom side of the flat conductor, and the second side can also be referred to as the top side of the flat conductor. The first end and the second end are opposite ends of the flat conductor in the extension direction.

[0024] The flat conductor connecting element also includes a flat, planar encapsulation layer made of an electrically insulating material, which encapsulates the conductor at least in the conductor section containing the first connection region. The encapsulation layer has a first layer side that faces the board in the assembled state and an opposite, second layer side that faces away from the board in the assembled state. In the assembled state, both layer sides are parallel to the board plane.

[0025] In this case, it is important that the encapsulation layer has a perforation through which the connection surface and the contact surface of the first connection region are accessible from the outside, so that the connection surface can be soldered to the conductive structure and a soldering tool for soldering the connection surface to the conductive structure by contact contact can be placed on the contact surface. The perforation is designed so that, viewed perpendicularly through a plane through the encapsulation layer, the first connection region of the conductor is located within the perforation (at least in projection onto the plane of the encapsulation layer). In other words, the encapsulation layer surrounds the first connection region in the plane of the encapsulation layer, with the connection region being exposed from both layer sides due to the perforation. Within the meaning of the present invention, the first connection region can also protrude from the perforation perpendicularly to the plane of the encapsulation layer (in the direction of the conductive structure). At least in projection onto the plane of the encapsulation layer, the first connection region is always located within the perforation.

[0026] The perforation advantageously enables soldering of the connection surface to the conductive structure by placing a soldering tool, in particular a soldering iron, on the exposed contact surface. The quality of the soldering can be easily verified. After the flat conductor connection element is assembled, the perforation can be sealed on the side facing away from the plate with a cover to prevent water from penetrating into the perforation. In the context of the present invention, "sealing" is to be understood as meaning, in particular, water-tightness, i.e., preventing water from penetrating into the perforation, so that the first connection area of ​​the conductor is protected from moisture.

[0027] The encapsulation layer is firmly connected to the conductor and, for example, is soldered. The encapsulation layer preferably contains or consists of a polyimide or polyester, particularly preferably polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). The encapsulation layer can also contain or consist of thermoplastics and elastomers, such as polyamide, polyoxymethylene, polybutylene terephthalate, or ethylene-propylene-diene rubber. Alternatively, potting materials such as acrylate or epoxy resin systems can be used as the encapsulation layer.

[0028] The first connection region of the conductor is exposed due to the perforation of the encapsulation layer, i.e., accessible from both layer sides. This enables simple electrical and, in particular, galvanic contacting of the conductor in the first connection region. It goes without saying that the two connection regions of the conductor can be protected from corrosion by a conductive layer such as tinning or a non-conductive layer such as solder lacquer. This protective layer is typically removed, burned, or otherwise penetrated only when electrical contact is established to enable electrical contact.

[0029] The perforations of the encapsulation layer can be produced, for example, by window technology or by subsequent removal, for example by laser ablation or mechanical ablation. In the case of window technology, the conductor is coated, for example bonded or laminated, with an insulating film having corresponding recesses (windows) in the connection area.

[0030] The perforation extends completely from one side of the encapsulation layer to the other side in a direction perpendicular to the plane of the encapsulation layer, exposing the first connection area of ​​the conductor. The perforation is, for example, a circular or round opening, wherein any other closed shape is also possible, in particular an oval or rectangular shape.

[0031] According to an advantageous embodiment of the flat-conductor connecting element according to the present invention, the encapsulation layer comprises an adhesive, in particular an adhesive tape, surrounding the perforation on the layer side intended to face the board and / or on the layer side intended to face away from the board. This, on the one hand, allows for simple fastening of the flat-conductor connecting element to the board. On the other hand, a cover can be easily placed over the perforation on the side facing away from the board to ensure the tightness of the flat-conductor connecting element after assembly. With regard to tightness, the adhesive is particularly advantageously configured so that it completely surrounds the perforation on both layer sides.

[0032] According to another advantageous embodiment of the flat-conductor connecting element according to the invention, the connection surface of the conductor has solder applied thereto. This facilitates electrical contacting of the flat-conductor connecting element, since the conductor can be soldered to the conductive structure in a simple manner. The solder is already provided in a particularly practical manner by the flat-conductor connecting element.

[0033] According to another advantageous embodiment of the flat conductor connecting element according to the present invention, the flat conductor has at least one insulating layer, and preferably an insulating film, on the first side, on the second side, or on both the first side and the second side. The insulating layer is advantageously firmly connected to the flat conductor and, for example, adhesively bonded. The insulating layer or insulating film preferably comprises or consists of a polyimide or polyester, particularly preferably polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). The insulating layer can also consist of an electrical insulating lacquer, preferably a polymer lacquer, applied to the flat conductor, for example, by spraying or dipping the flat conductor into the lacquer. The insulating layer can also consist of or consist of thermoplastics and elastomers, such as polyamide, polyoxymethylene, polybutylene terephthalate, or ethylene-propylene-diene rubber. Alternatively, a potting material such as an acrylate or epoxy resin system can be used as the insulating layer.

[0034] Such an insulating layer or insulating film preferably has a thickness of 10 μm to 300 μm, particularly preferably 25 μm to 200 μm, and in particular 60 μm to 150 μm. Advantageously, the insulating layer is bonded to the flat conductor via an adhesive layer. The thickness of the adhesive layer is preferably 10 μm to 150 μm, and particularly preferably 50 μm to 75 μm. Such an insulating layer is particularly suitable for electrically insulating flat conductors, mechanically stabilizing them, and protecting them from mechanical damage and corrosion.

[0035] In an advantageous embodiment of the flat-conductor connecting element according to the invention, the flat conductor is coated with the aforementioned insulating layer or insulating film. The insulating layer can also be larger and, in particular, wider than the flat conductor. The insulating layer can also serve as a carrier layer for the flat conductor and mechanically stabilize it.

[0036] According to one embodiment of the flat-conductor connecting element according to the present invention, the flat conductor is enclosed at least outside the encapsulation layer by an insulating layer (insulating sheath) made of an electrically insulating material. This insulating layer is designed similarly to the aforementioned insulating layer, wherein the enclosed flat conductor is advantageously flexible. The flat conductor can thus be easily adapted to the spatial conditions at the installation site and can also be used to cover the penetration.

[0037] The sheathed flat conductor preferably has a length outside the encapsulation layer that allows the perforation of the encapsulation layer to be covered by the insulating layer. The sheathed flat conductor can then be guided over the perforation and fixed to the encapsulation layer on the side facing away from the plate to seal the perforation. Further covering devices can advantageously be dispensed with.

[0038] The flat conductor with the insulating layer is so thin that it can be easily embedded between the individual panes in the thermoplastic intermediate layer of the composite pane and can be led out of the thermoplastic intermediate layer. The flat conductor is particularly suitable for contacting conductive coatings in the panes.

[0039] A plurality of electrically conductive metal films that are electrically insulated from one another can be located in the flat conductor according to the invention having the insulating layer.

[0040] The present invention further relates to a connecting device comprising a plate having an electrically conductive structure, in particular an electrically conductive layer, applied thereon. The connecting device further comprises a flat conductor connecting element according to the present invention, wherein a connecting surface is electrically connected to the electrically conductive structure by welding. In particular, the connecting surface is welded directly to the electrically conductive structure. The connecting device further comprises a covering that covers (watertightly seals) the perforations of the encapsulation layer on the layer side facing away from the plate. The covering is fixed to the encapsulation layer.

[0041] According to an advantageous embodiment of the connecting device according to the invention, the encapsulation layer is fixed to the plate by means of an adhesive, in particular an adhesive tape, wherein the adhesive is preferably already applied to the side of the encapsulation layer facing the plate before the flat-conductor connecting element is mounted on the plate.

[0042] According to another advantageous embodiment of the connecting device according to the present invention, the covering is formed by a flat conductor encased by an insulating layer (insulating sheath), which is fixed to the encapsulation layer in the region of the perforation, completely covering the perforation. Alternatively, a separate covering component fixed to the encapsulation layer can be provided as the covering. Particularly advantageously, the covering is fixed to the encapsulation layer by means of an adhesive, in particular an adhesive tape, which allows for cost-effective and practically simple fixing of the covering. Preferably, the adhesive is already applied to the side of the encapsulation layer facing away from the plate before the flat-conductor connecting element is assembled.

[0043] The pane may be a single pane or a multi-pane glass, in particular a multi-pane composite glass.

[0044] The pane preferably comprises glass, particularly preferably flat glass, even more preferably float glass, and in particular quartz glass, borosilicate glass, soda-lime glass, or clear plastic, preferably rigid clear plastic, in particular polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polyamide, polyester, polyvinyl chloride, and / or mixtures thereof. The pane is preferably transparent, in particular for use as a windshield or rear window in a vehicle or for other applications where high light transmission is desired. For the purposes of the present invention, transparent is understood to mean a pane having a transmission of greater than 70% in the visible spectral range. However, for panes not in the driver's field of view related to traffic, such as roof windows, the transmission can also be much lower, for example, greater than 5%.

[0045] The thickness of the panels can vary widely and can therefore be optimally adapted to the requirements of the individual application. Standard thicknesses of 0.5 mm to 25 mm, preferably 1.4 mm to 2.5 mm, are preferably used for vehicle glazing, and 4 mm to 25 mm for furniture, appliances, and buildings, especially for electric heaters. The dimensions of the panels can vary widely and depend on the size of the application according to the invention. For example, a panel having a surface area of ​​200 cm2, which is typical in the vehicle manufacturing industry and in the field of architecture, is preferably used. 2 Up to 20m 2 .

[0046] The present invention further relates to a method for producing a connecting device according to the invention, comprising the following steps:

[0047] - providing a plate having an electrically conductive structure, in particular an electrically conductive layer, applied thereto,

[0048] - arranging the flat-conductor connecting element according to the invention on the plate,

[0049] - soldering the connection surface of the conductor to the electrically conductive structure, wherein a soldering tool, in particular a soldering iron, is placed on the contact surface,

[0050] - sealingly covering the perforation of the encapsulation layer.

[0051] According to an advantageous development of the method according to the invention, a flat conductor, which is surrounded by an insulating layer outside the encapsulation layer, is guided over the perforation on the side of the encapsulation layer facing away from the plate so that the perforation is completely covered and is fixed to the encapsulation layer, in particular by means of an adhesive such as an adhesive tape.

[0052] According to a further advantageous embodiment of the method according to the invention, the separate cover part is fastened to the encapsulation layer, in particular by means of an adhesive such as an adhesive tape.

[0053] The present invention further relates to the use of a connecting device according to the invention with a multi-pane composite glass pane in the automotive or architectural applications, in furniture, electrical appliances, or decorative articles. The connecting device is used to weld the connection surfaces of conductors of flat-conductor connecting elements to electrically conductive structures of a pane in the automotive or architectural applications, in furniture, electrical appliances, or decorative articles. The pane is, for example, a multi-pane composite glass pane.

[0054] The different embodiments of the present invention can be implemented individually or in any combination. In particular, the features mentioned above and to be explained below can be used not only in the combination described, but also in other combinations or alone without departing from the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] The invention will be explained in more detail below based on exemplary embodiments, with reference to the accompanying drawings, which are simplified and not to scale:

[0056] Figure 1 A schematic diagram showing an embodiment of a connecting device according to the present invention is shown in a top view,

[0057] Figure 2 According to the first variant Figure 1 A cross-sectional view of the connecting device,

[0058] Figure 3 According to the second variant Figure 1 A cross-sectional view of the connecting device,

[0059] Figures 4A to 4B A schematic diagram showing another embodiment of a connecting device according to the present invention is shown in a top view and a sectional view. Figure 5 A flow chart of the method according to the invention for producing the connecting device according to the invention is shown. DETAILED DESCRIPTION

[0060] First, you should observe Figures 1 to 3 , in which an embodiment of a connecting device according to the invention is explained in a schematic manner.

[0061] The connecting device, generally designated by reference numeral 100, comprises a flat conductor connecting element 1, which is attached to a panel 2. Panel 2 is, for example, a composite panel, such as a windshield for a motor vehicle. The composite panel comprises two single sheets, which are securely connected to each other via a thermoplastic intermediate layer. A precise description of the composite panel's structure is unnecessary for understanding the present invention and is therefore unnecessary. Panel 2 may also consist of only a single sheet and, for example, be constructed as so-called single-pane safety glass (ESG). Panel 2 is, for example, made of soda-lime glass.

[0062] An electrically conductive layer 3 is applied to the surface of the plate 2 and is electrically contacted via flat-conductor connecting elements 1. The flat-conductor connecting elements 1 are arranged close to the plate edge on the engine side, adjacent to the bonding area 8 ("PU line"), at which the plate 2 is bonded to the vehicle body.

[0063] The flat conductor connecting element 1 comprises a conductor 4 which is formed here, for example, from a flat conductor 5 and a round conductor 6 connected thereto (see Figure 2 and 3 ). The connecting piece 7 is also electrically connected to the round conductor 6.

[0064] Conductor 4 has a first connection region 9 at a first end 11 and a second connection region 10 at a second end 12. First connection region 9 has, on its side facing plate 2, a connection surface 13 for electrical connection to conductive layer 3 and a contact surface 14 opposite connection surface 13 for contacting a welding tool (not shown) for welding connection surface 13 to conductive layer 3. Connection surface 13 and contact surface 14 are parallel to the plate plane. Second connection region 10 is used for connection to an electrical control device, a voltage source, etc., which is not shown in greater detail in the figure.

[0065] Alternatively, it would also be possible for the conductor 4 to consist solely of a flat conductor 5 , wherein the first connection region 9 would then be formed by the flat conductor 5 . Thus, in particular, the connection area 13 and the contact area 14 would also be formed by the flat conductor 5 .

[0066] The flat conductor 5 includes or consists of a strip- or ribbon-shaped metal film, such as a copper film, aluminum film, stainless steel film, tin film, gold film, or silver film. The flat conductor 5 may have a thickness of, for example, 10 μm to 300 μm, preferably 30 μm to 250 μm, and in particular 50 μm to 150 μm. The flat conductor 5 may have a width of, for example, 0.5 mm to 100 mm, preferably 1 mm to 50 mm, and in particular 10 mm to 30 mm. The flat conductor 5 may have a length of, for example, 5 cm to 150 cm, preferably 10 cm to 100 cm, and in particular 50 cm to 90 cm. It goes without saying that the length, width, and thickness of the flat conductor 5 can be adapted to the requirements of the respective individual case.

[0067] The flat conductor connecting element 1 has a planar, flat encapsulation layer 15 made of an electrically insulating material, which encapsulates or encapsulates the conductor 4 in the conductor section containing the first connection region 9. The encapsulation layer 15 has a first layer side 16 that faces the board 2 in the assembled state and an opposite, second layer side 17 that faces away from the board 2 in the assembled state. Both layer sides 16, 17 are parallel to the board plane. For example, the first layer side 16 can also be referred to as the bottom side of the encapsulation layer 15, and the second layer side 17 can also be referred to as the top side of the encapsulation layer 15. The encapsulation layer 15 does not extend as far as the second connection region 10 of the conductor 4. For example, the encapsulation layer 15 consists of polyimide or polyester.

[0068] The flat conductor 5 is electrically connected to the round conductor 6 in the region of the encapsulation layer 15. The flat conductor 5 is located outside the encapsulation layer 15, surrounded only by a flat, planar insulating layer 18 (insulating sheath) made of an electrically insulating material (here, for example, polyimide). The flat conductor 5 outside the encapsulation layer 15, surrounded by the insulating layer 18, is flexible. The flat conductor 5 is firmly connected to the encapsulation layer 15.

[0069] As in Figures 1 to 3As can be clearly seen in FIG, the encapsulation layer 15 has a perforation 19, which is rectangular in shape here, for example, and through which the connection surface 13 and the contact surface 14 of the first connection region 9 are accessible on both layer sides 16, 17. Figure 1 , the contact surface 14 is shown from above.

[0070] First connection region 9 is located within perforation 19, viewed perpendicularly through the plane of encapsulation layer 15 or through the plane of plate 2. Walls 20 delimiting or defining perforation 19 completely surround first connection region 9 (viewed perpendicularly through the plane of encapsulation layer 15). Therefore, in the region of first connection region 9, no material of encapsulation layer 15 is present within perforation 19.

[0071] Double-sided adhesive tapes 21, 21' are located both on the first layer side 16 and on the second layer side 17 of the encapsulation layer 15, each of which extends beyond the perforation 19 and completely surrounds the perforation 19. The encapsulation layer 15 is bonded to the pane 2 via the adhesive tape 21 arranged on the pane side.

[0072] like Figure 2 and 3 As shown in FIG, the flat conductor 5 is electrically connected to the round conductor 6 within the encapsulation layer 15 via contact elements 23, such as clamping elements. The connector 7 is soldered to the conductive layer 3 at the connection surface 13 via solder 22. The connector 7 protrudes slightly from the through-hole 19 in a direction perpendicular to the board 2. The solder 22 is already applied to the connector 7 before soldering to the conductive layer 3.

[0073] like Figure 2 As shown in FIG, a flexible flat conductor 5 encapsulated by an insulating layer 18 is guided on the first layer side 16 of the encapsulation layer 15 and completely covers the perforation 19. The flat conductor 5 is fixed to the encapsulation layer 15 by an adhesive tape 21. This ensures a tight seal on the second layer side 17 of the perforation 9. On the opposite side, the perforation 9 is sealed on the first layer side 16 by an adhesive tape 21 ′, with which the encapsulation layer 15 is placed on the plate 2. This effectively protects the first connection area 9 from water ingress. As the flat conductor 5 is extended further, it is fixed to the plate 2 by another adhesive tape 21 ″.

[0074] exist Figure 3 , a variant is described in which the perforation on the first layer side 16 is completely covered by a flat, planar cover 24 made of an electrically insulating material, such as polyimide. The cover 24 is adhered by means of an adhesive tape 21 ′.

[0075] During the production of the connection device 100, the connection surface 13 can be soldered to the conductive layer 3 in a simple manner, wherein a soldering tool such as a soldering iron can be placed on the contact surface 14. After the conductor 4 is soldered to the conductive layer 3, the through-hole 19 can be sealed, using a coated flat conductor 5 or a separate cover 24. Due to the good visibility, the soldering can be performed with high quality, wherein a soldering tool such as a soldering iron can also be used, which in particular enables manual soldering.

[0076] 4 illustrates another embodiment in which the flat conductor connecting element 1 has two conductors 4 , 4 ′, wherein the flat conductor connecting element 1 otherwise has a similar structure. Reference is made to the above statements. Only two through-holes 19 are each covered by a covering cap 25 , 25 ′.

[0077] Figure 5 A flow chart of the method according to the invention for producing the connecting device 1 according to the invention is shown.

[0078] The method comprises at least the following steps:

[0079] a) providing a plate (2) having an electrically conductive structure (3), in particular an electrically conductive layer, applied thereon,

[0080] b) arranging the flat conductor connecting element (1) on the plate (29),

[0081] c) soldering the connection surface (13) of the conductor (4) to the electrically conductive structure (3), wherein a soldering tool, in particular a soldering iron, is placed on the contact surface,

[0082] d) Covering the perforation (19) of the encapsulation layer (15).

[0083] From the above, it follows that the present invention provides a flat conductor connecting element and an associated connecting device, which, due to the perforation of the encapsulation layer, allow simple and reliable soldering of the conductors. The perforation can be covered in a sealing manner in a simple manner.

[0084] Reference numerals:

[0085] 1 Flat conductor connection element

[0086] 2 boards

[0087] 3 Conductive layer

[0088] 4. 4' conductor

[0089] 5 Flat conductor

[0090] 6 Circular conductors

[0091] 7 Connectors

[0092] 8 Bonding area

[0093] 9 First connection area

[0094] 10 Second connection area

[0095] 11 First end

[0096] 12 Second end

[0097] 13 Connection surface

[0098] 14 contact surface

[0099] 15 Encapsulation layer

[0100] 16 First floor side

[0101] 17 Second floor side

[0102] 18 Insulation layer

[0103] 19 Piercing

[0104] 20 wall

[0105] 21, 21', 21" adhesive tape

[0106] 22 Solder

[0107] 23 Contact elements

[0108] 24 Cover

[0109] 25, 25' cover

[0110] 100 connection device.

Claims

1. A flat conductor connection element (1) for an electrically conductive structure (3), the electrically conductive structure being applied to a plate (2), the flat conductor connection element comprising at least one conductor (4, 4'), comprising a flat conductor (5), having a first connection region (9) at a first end (11) and a second connection region (10) at a second end (12), wherein the first connection region (9) has a connection surface (13) for electrical connection to the electrically conductive structure (3) and a contact surface (14) opposite the connection surface for contact with a soldering tool; - an encapsulation layer (15) made of an electrically insulating material, which encapsulates the conductor (4) at least in the conductor section containing the first connection area (9), wherein the encapsulation layer (15) has a perforation (19) through which the connection surface (13) and the contact surface (14) of the first connection area (9) are accessible, wherein the first connection area (9) of the conductor (4) is located within the perforation (19) when viewed perpendicularly through the plane of the encapsulation layer (15).

2. The flat-conductor connecting element (1) according to claim 1, wherein the electrically conductive structure (3) comprises an electrically conductive layer.

3. The flat-conductor connecting element (1) according to claim 1, wherein the encapsulation layer (15) comprises an adhesive (21, 21') surrounding the perforation on the layer side (17) facing the plate and / or on the layer side (16) facing away from the plate.

4. Flat-conductor connecting element (1) according to claim 3, wherein the encapsulation layer (15) comprises an adhesive tape on the layer side (17) that is to face the plate and / or on the layer side (16) that is to face away from the plate. 5 . The flat-conductor connecting element ( 1 ) according to claim 1 , wherein the connecting surface has a solder ( 22 ) applied thereto.

6. The flat-conductor connecting element (1) according to claim 1, wherein the flat conductor (5) is coated outside the encapsulation layer by an insulating layer (18) made of an electrically insulating material, wherein the coated flat conductor is flexible.

7. The flat-conductor connecting element (1) according to claim 6, wherein the sheathed flat conductor (5) has such a length that the perforations of the encapsulation layer can be covered by the insulating layer (18).

8. The flat-conductor connecting element (1) according to claim 1, wherein the first connecting region (9) is formed by a flat conductor.

9. The flat-conductor connecting element according to claim 1, wherein the flat conductor (5) is electrically connected to a round conductor (6), wherein the first connecting region is formed by the round conductor.

10. The flat-conductor connecting element according to claim 9, wherein the flat conductor (5) is electrically connected to the round conductor (6) by means of a connecting piece (7). 11 . The flat-conductor connecting element according to claim 9 , wherein the first connecting region is formed by a connecting piece.

12. A connecting device (100), comprising: - a plate (2) having an electrically conductive structure (3) applied thereon, - Flat conductor connection element (1) according to any one of claims 1 to 7, wherein the connection surface is connected to the conductive structure by soldering, - a covering (18, 24) of the perforations of the encapsulation layer on the layer side facing away from the plate.

13. The connection device (100) according to claim 12, wherein the conductive structure (3) comprises a conductive layer.

14. The connecting device (100) according to claim 12, wherein the encapsulation layer (15) is fixed to the plate by means of an adhesive (21).

15. The connection device (100) according to claim 14, wherein the encapsulation layer (15) is fixed to the plate by means of an adhesive tape.

16. The connection device (100) according to any one of claims 12 to 15, wherein the covering is formed by a flat conductor enclosed by an insulating sheath or a cover (24) on the encapsulation layer.

17. The connection device (100) according to claim 16, wherein the cover is fixed to the encapsulation layer by means of an adhesive (21').

18. The connection device (100) according to claim 17, wherein the cover is fixed to the encapsulation layer by means of an adhesive tape.

19. A method for producing a connecting device (100) according to any one of claims 12 to 18, comprising the following steps: - providing a plate (2) having an electrically conductive structure (3) applied thereon, - arranging a flat-conductor connecting element (1) according to any one of claims 1 to 11 on the plate, - welding the connection surface of the conductor to the electrically conductive structure, wherein a welding tool is placed at the contact surface, - Covering the perforations of the encapsulation layer with a cover.

20. The method according to claim 19, wherein the conductive structure (3) comprises a conductive layer.

21. The method of claim 19, wherein the soldering tool comprises a soldering iron. 22 . The method according to claim 19 , wherein a flat conductor, which is surrounded by an insulating sheath outside the encapsulation layer, is guided over the through-hole and fixed to the encapsulation layer. 23 . The method according to claim 22 , wherein a flat conductor, which is surrounded by an insulating sheath outside the encapsulation layer, is guided over the through-hole and fixed to the encapsulation layer by means of an adhesive. 24 . The method according to claim 23 , wherein a flat conductor, which is surrounded by an insulating sheath outside the encapsulation layer, is guided over the through-hole and fixed to the encapsulation layer by means of an adhesive tape. The method according to claim 19 , wherein a covering member is fixed to the encapsulation layer.

26. The method according to claim 25, wherein the covering member is fixed to the encapsulation layer by means of an adhesive.

27. The method according to claim 26, wherein the covering member is fixed to the encapsulation layer by means of an adhesive tape.

28. Use of the connecting device (100) according to any one of claims 12 to 18 for welding connecting surfaces of conductors of flat-conductor connecting elements to electrically conductive structures of plates in the automotive sector or in the construction sector, in furniture, electrical appliances or decorative items.

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