MEMS Vibration Sensor Die

Abstract

The present disclosure relates to a micro-electromechanical system vibration sensor die. The micro-electromechanical system vibration sensor die may include a substrate having a top portion, a mounting surface, and a hole extending at least partially through the substrate. The die may include a first electrode, which is coupled to the top portion of the substrate and is placed above the hole. The die may include a second electrode, which is arranged between the substrate and the first electrode. The second electrode may be spaced apart from the first electrode. The die may include a proof mass, which may have a first portion coupled to the first electrode or the second electrode. The proof mass may have a second end opposite to the first portion. The second end may be recessed in the hole relative to the mounting surface of the substrate. The proof mass may be suspended in the hole without obstruction. The proof mass may move the first electrode or the second electrode in response to vibration, and the proof mass is suspended from the first electrode or the second electrode.

Description

Technical Field

[0001] The present disclosure generally relates to a microelectromechanical systems (MEMS) transducer assembly including a vibration sensor. Background Art

[0002] Currently, MEMS microphones are used in electronic devices to detect the movement of the device. Advances in micro-nano processing technology have led to the development of smaller and smaller MEMS microphones. MEMS microphone sensors can be integrated into compact devices such as mobile phones, laptops, smart watches, headphones, other compact devices, and other devices in general. This is because MEMS microphones are relatively small, which is useful when space on various devices is at a premium. Summary of the invention

[0003] According to one aspect of the present disclosure, there is provided a micro-electromechanical system vibration sensor die, the micro-electromechanical system vibration sensor die comprising: a substrate having a top portion, a mounting surface and a hole extending at least partially through the substrate; a first electrode, the first electrode being coupled to the top portion of the substrate and disposed above the hole; a second electrode, the second electrode being arranged between the substrate and the first electrode, wherein the second electrode is spaced apart from the first electrode; a proof mass block, the proof mass block having: a first portion, the first portion being coupled to the first electrode or the second electrode; and a second end, the second end being opposite to the first portion, the second end being recessed into the hole relative to the mounting surface of the substrate, wherein the proof mass block is suspended in the hole unobstructed, and wherein the proof mass block moves the first electrode or the second electrode in response to vibration, the proof mass block being suspended from the first electrode or the second electrode.

[0004] According to another aspect of the present disclosure, there is provided a micro-electromechanical system vibration sensor die, the micro-electromechanical system vibration sensor die comprising: a substrate having a top portion and a mounting surface; a hole extending at least partially through the substrate; capacitive electrodes arranged in a spaced-apart relationship and arranged on the top portion of the substrate, at least one of the capacitive electrodes being coupled to the substrate; and a proof mass coupled to one of the capacitive electrodes and suspended unimpeded within the hole, the proof mass being surrounded by the substrate and relative to the recess of the substrate; wherein the proof mass moves the capacitive electrode in response to vibration, the proof mass being suspended from the capacitive electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In order to describe the manner in which the advantages and features of the present disclosure can be obtained, the present disclosure is described by reference to the specific embodiments of the present disclosure illustrated in the accompanying drawings. These drawings only illustrate example embodiments of the present disclosure and are therefore not to be considered as limiting the scope of the present disclosure. For clarity, the drawings may have been simplified and are not necessarily drawn to scale.

[0006] Figure 1 is a side cross-sectional view of a vibration sensor die according to a possible implementation;

[0007] Figure 2 is a top cross-sectional view of a vibration sensor die according to a possible implementation;

[0008] Figure 3 is a side cross-sectional view of a vibration sensor die according to a possible implementation;

[0009] Figure 4 is a top cross-sectional view of a vibration sensor die according to a possible implementation;

[0010] Figure 5 is a side cross-sectional view of a vibration sensor die according to a possible implementation;

[0011] Figure 6 According to possible implementations include Figure 1 a side cross-sectional view of a vibration sensor assembly having a vibration sensor die; and

[0012] Figure 7 According to possible implementations include Figure 1 Schematic illustration of the microphone assembly of a vibration sensor die. DETAILED DESCRIPTION

[0013] At least some embodiments may provide a MEMS vibration sensor die. The die may include a substrate having a top portion, a mounting surface, and a hole extending at least partially through the substrate. The die may include a first electrode coupled to the top portion of the substrate and placed above the hole. The die may include a second electrode disposed between the substrate and the first electrode. The second electrode may be spaced apart from the first electrode. The die may include a proof mass. The proof mass may have a first portion coupled to the first electrode or the second electrode. The proof mass may have a second end opposite to the first portion. The second end may be recessed in the hole relative to the mounting surface of the substrate. The proof mass may be suspended in the hole without obstruction. The proof mass may move the first electrode or the second electrode in response to vibration, and the proof mass is suspended from the first electrode or the second electrode. In some implementations, the die includes a semiconductor material and is manufactured using a photolithography process known to a person of ordinary skill in the art.

[0014] At least some embodiments can provide robustness of the vibration sensor. For example, in the event that the sensor is impacted and vibrates, a proof mass in the vibration sensor can be defined to prevent an electrode such as a polysilicon diaphragm from breaking. For example, the vibration sensor may include a relatively large proof mass coupled to the diaphragm, and certain forces may damage the diaphragm or the proof mass. Similarly, large deflections may cause the diaphragm to collide with the backplate and / or damage the diaphragm, the backplate, or the runner that connects the diaphragm to the substrate. Therefore, in at least some implementations, the die can be configured to reduce or eliminate the possibility of damage.

[0015] For example, at least some embodiments can provide structure added to the proof mass and / or substrate to physically limit vertical or lateral travel of the proof mass to a range that does not cause damage. This can provide shock robustness to the vibration sensor, which can also be used as an accelerometer. In at least some embodiments, the proof mass can be recessed relative to the mounting surface of the die to prevent damage during fabrication and separation of the die from the wafer and during assembly of the die onto the base or substrate of the sensor package.

[0016] Reference Figures 1 to 7 In different possible implementations shown, the MEMS vibration sensor die 100 may include a substrate 110 and a proof mass 130. The die 100 may include and / or may be formed of: multiple substrates, one or more dielectric layers, one or more metal layers, one or more semiconductors, one or more layers of material forming a substrate, and / or other materials.

[0017] Reference Figure 1 , Figure 3 , Figure 5 and Figure 7 In the different possible embodiments shown in , the die 100 may include a first electrode 121 and a second electrode 122, at least one of which moves relative to the other during operation. The mobile electrode may be the first electrode or the second electrode, and may be a free plate type or a constrained plate type. According to one possible implementation, the first electrode 121 may be a back plate, and the second electrode 122 may be a diaphragm. The substrate 110 may also include a hole 116 extending at least partially through the substrate.

[0018] Reference Figure 1 , Figure 3 and Figure 5 In various possible embodiments shown, substrate 110 may have a top portion 112, a mounting surface 114, and a hole 116 extending at least partially through substrate 110. A first electrode 121 may be coupled to top portion 112 of substrate 110 and disposed over hole 116. A second electrode 122 may be disposed between substrate 110 and first electrode 121. Second electrode 122 may be spaced apart from first electrode 121.

[0019] The proof mass 130 can have a first portion 131 coupled to the first electrode 121 or the second electrode 122. In the illustrated embodiment, the first portion 131 is shown coupled to the second electrode 122. The proof mass 130 can have a second end 132 opposite the first portion 131. The proof mass 130 can be suspended unobstructed within the aperture 116. The proof mass 130 can move the first electrode 121 or the second electrode 122 from which it is suspended in response to vibration.

[0020] Reference Figure 1 In a possible implementation, the second end 132 can be recessed within the hole 116 relative to the mounting surface 114 of the substrate 110. According to one possible implementation, the height of the proof mass 130 can be etched back so that the proof mass is recessed relative to the substrate 110. In one implementation, the height of the proof mass 130 can be reduced 134 by an amount between 10um and at least 50um. In other implementations, the degree to which the proof mass is recessed can vary depending on the size of the proof mass and other portions of the die, the specified range of motion of the proof mass, the intended use, etc.

[0021] According to one aspect of the present disclosure, the die may include a lateral support member adjacent to the proof mass, wherein the lateral support member restricts movement of the proof mass in a direction that is not parallel to a direction of movement of the first electrode or the second electrode to which the proof mass is coupled. Figures 2 to 5 1, which is a possible embodiment of the present invention, which is part of the substrate. The transverse support member 210 can be part of the substrate 110. Alternatively, the transverse support member can be another member located between the substrate and the proof mass, or a fixed member around which the proof mass is arranged. The spacing between the proof mass 130 and the transverse support member 210 can be such that the transverse support member 210 can prevent the proof mass 130 from being damaged. The specific size of the spacing may depend on the size of the proof mass and other parts of the tube core, the specified range of motion, the expected use, etc.

[0022] According to a possible implementation, the die 100 may include a plurality of protrusions 220. The plurality of protrusions 220 may be as follows: Figure 4 and Figure 5 As shown, the substrate 110 extends toward the proof mass 130, or as shown Figure 2 and Figure 3 130 extends from the proof mass 130 toward the base plate 110. The lateral support member 210 can be a portion of the base plate 110 extending from the protrusion 220, or a portion of the base plate 110 from which the protrusion 220 extends from the proof mass 130. For example, according to possible embodiments, Figure 2 and Figure 3 A protrusion 220 is illustrated extending from the proof mass 130 toward the substrate 110. As another example embodiment, Figure 4 and Figure 5 A protrusion 220 is illustrated extending from the substrate 110 toward the proof mass 130. The protrusion 220 may be a fin, a column, a cup, any other protrusion shape, depending on possible implementations. The protrusion 220 may be sized to minimize added mass, maintain sensitivity, and / or reduce lateral travel, such as less than 15 um.

[0023] According to a possible implementation, the proof mass 130 may have a hollow portion 230, and the substrate 110 may substantially surround the proof mass 130. The proof mass 130 and the substrate 110 may have any substantially complementary shapes. According to a possible implementation, the lateral support member may be inside the hollow portion 230 of the proof mass 130.

[0024] Figure 6 According to possible implementations include Figure 11 is a side cross-sectional view of a vibration sensor assembly 600 of a vibration sensor die 100. The die 100 may include at least one rigid post 610 protruding from the mounting surface 114 of the substrate 110. The post 610 may be integrally formed with the substrate 110. The post may also be integrally formed with the base portion 710, or may be separate from the substrate 110 and the base portion 710. According to possible embodiments, the post 610 may reduce the variation in the thickness of a die attach such as an adhesive 630 that may couple the substrate 110 to the base portion 710. The at least one rigid post 610 may be embedded in the adhesive 630 and disposed between the mounting surface 114 of the substrate 110 and the base portion 710. The post shown has a uniform cross-section, but it may also have other shapes suitable for use in MEMS die manufacturing processes (e.g., conical, tetrahedral, etc.).

[0025] According to a possible embodiment, the die 100 may be combined with a MEMS sensor housing 700, which includes a cover or lid mounted on a base portion 710. The mounting surface 114 of the substrate 110 may be mounted on the base portion 710, such as via an adhesive 630, and the hole 116 may extend completely through the substrate 110. The proof mass 130 may be arranged in the hole 116 between the base portion 710 and the first electrode 121. According to a possible embodiment, the housing 700 may also include a plurality of covers 720.

[0026] According to possible embodiments, the die 100 may include a displacement limiting support member 620 that may be coupled to the base portion 710. The displacement limiting support member 620 may be integral with the die 100, such as by being a part of the substrate 110. For example, the displacement limiting support member 620 may be manufactured by bonding two separate dies (such as by a die bonding process) after etching the desired structure. According to possible implementations, the displacement limiting support member 620 may be coupled to the substrate 110. The displacement limiting support member 620 may be located below the proof mass 130 and spaced apart from the proof mass 130. The displacement limiting support member 620 may limit the displacement of the proof mass 130 in the direction of movement of the first electrode 121 and / or the second electrode 122 to which the proof mass 130 is coupled.

[0027] According to possible implementations, the displacement limiting support member 620 may be separate from the die 100. For example, the displacement limiting support member 620 may be a copper pillar, may be a silicon pillar, may be a glass pillar, may be made of the same material as the base portion 710, or may be made of any other material. According to possible implementations, the height of the displacement limiting support member 620 may be greater than the height of the pillar 610.

[0028] Figure 7 is a schematic illustration of a microphone assembly 900 including a vibration sensor die 100 and a housing 700 according to a possible implementation. Although the proof mass 130 is shown as a solid proof mass in this implementation, it may also have any other form, such as shown in the previous implementation. Similarly, this implementation and other implementations may include or exclude other aspects of other implementations.

[0029] The housing 700 may include a cover 720 mounted on the base portion 710. The microphone assembly 900 may also include an integrated circuit 740 disposed in the housing 700. The integrated circuit 740 may be electrically coupled to the vibration sensor die 100 and to electrical contacts on a surface mount interface 750 disposed on an outer surface 712 of the base portion 710.

[0030] According to a possible embodiment, the surface mount interface 750 can have a plurality of contacts connected to the integrated circuit 740, such as connected to connection pads, such as bonding pads, that can be provided on the integrated circuit 740. The contacts can be implemented as pins, pads, bumps, balls and / or other structures. The function and number of the contacts on the surface mount interface 750 can depend on the protocol or protocols implemented, and can include power contacts, ground contacts, data contacts, clock contacts, etc. The surface mount interface 750 can allow the microphone assembly 900 to be integrated with a host device using reflow soldering, fusion bonding or other assembly processes.

[0031] According to a possible embodiment, the microphone assembly 900 may include an acoustic sensor 800. The hole 116 may be a first hole 116, and the acoustic sensor 800 may include a second hole 810 extending through a second portion of the substrate 110. The acoustic sensor 800 may include a first acoustic electrode 821 coupled to the substrate 110 and disposed above the second hole 810. The acoustic sensor 800 may include a second acoustic electrode 822 disposed between the substrate 110 and the first acoustic electrode 821. The second acoustic electrode 822 may be spaced apart from the first acoustic electrode 821. The first acoustic electrode 821 or the second acoustic electrode 822 may move relative to each other in response to sound.

[0032] According to a possible embodiment, the housing 700 may have an acoustic port 730 that is acoustically coupled to the second hole 810 of the substrate 110. The acoustic port 730 may be in the base portion 710, in the cover 720, or in any other location on the housing 700. The acoustic sensor 800 may be placed on the acoustic port 730 so that the second hole 810 is aligned with the acoustic port 730 to allow the acoustic signal received through the acoustic port 730 to be received.

[0033] According to possible implementations, the integrated circuit 740 may be disposed on the base portion 710 and may be electrically coupled to the acoustic sensor 800, to the vibration sensor 100, and to electrical contacts on a surface mount interface 750 disposed on an outer surface 712 of the base portion 710. For example, the integrated circuit 740 may be electrically coupled (e.g., wire bonded) to the acoustic sensor 800, such as via a first electrical lead 724, and electrically coupled to the vibration sensor 100 via a second electrical lead 726. The integrated circuit 740 may also be coupled to the base portion 710 via a third electrical lead 728, such as coupled to a trace or other electrical contact disposed on the base portion 710. The integrated circuit 740 may receive electrical signals from the acoustic sensor 800 and the vibration sensor 100. According to possible implementations, the base portion 710 may include a printed circuit board (PCB) configured to mount the vibration sensor die 100, the acoustic sensor 800, the integrated circuit 740, and the cover 720 thereon.

[0034] In some implementations, encapsulant 722 can be disposed over integrated circuit 740. The encapsulant can include, for example, epoxy or other material that protects the integrated circuit from moisture and / or heat dissipation.

[0035] The vibration sensor 100, the acoustic sensor 800, and the integrated circuit 740 are shown as being arranged on the surface of the base portion 710. In other embodiments, one or more of these components may be arranged on the cover 720, on the inner surface of the cover 720, on the sidewalls of the cover 720, and / or stacked on each other.

[0036] According to a possible first embodiment related to the above embodiment, a microelectromechanical system (MEMS) vibration sensor die, the die comprising a substrate having a top portion, a mounting surface, and a hole extending at least partially through a portion of the substrate. The die comprises a first electrode, the first electrode being coupled to the top portion of the substrate and disposed above the hole. The die comprises a second electrode, the second electrode being disposed between the substrate and the first electrode, wherein the second electrode is spaced apart from the first electrode. The die comprises a proof mass coupled to the first electrode or the second electrode, the proof mass being suspended unobstructed within the hole, and the proof mass being recessed relative to the mounting surface of the substrate. The proof mass moves the first electrode or the second electrode in response to vibration, the proof mass being suspended from the first electrode or the second electrode.

[0037] According to a second possible implementation related to the first implementation, the tube core comprises a transverse support member adjacent to the proof mass, wherein the transverse support member limits the movement of the proof mass in a direction that is not parallel to the movement direction of the first electrode or the second electrode to which the proof mass is coupled.

[0038] According to a third possible embodiment related to the second embodiment, the tube core also includes a plurality of protrusions, which extend from the substrate towards the proof mass block or from the proof mass block towards the substrate, wherein the lateral support member is a part of the substrate extending from the protrusions or a part of the substrate from which the protrusions extend from the proof mass block.

[0039] According to a fourth possible implementation related to the third implementation, the proof mass has a hollow portion and the substrate substantially surrounds the proof mass.

[0040] According to a fifth possible implementation related to the first implementation, the die further comprises a protrusion extending from the mounting surface of the substrate and formed integrally with the substrate.

[0041] According to a sixth possible embodiment related to any one of the first to fifth embodiments, the tube core includes a displacement limiting support member connected to the substrate, the displacement limiting support member is located below the inspection mass block and is spaced apart from the inspection mass block, wherein the displacement limiting support member limits the displacement of the inspection mass block in the movement direction of the first electrode or the second electrode to which the inspection mass block is connected.

[0042] According to a seventh possible implementation related to the third implementation, the tube core further comprises an acoustic sensor. The acoustic sensor comprises a second hole extending through a second portion of the substrate. The acoustic sensor comprises a first acoustic electrode, the first acoustic electrode being coupled to the substrate and disposed above the second hole. The acoustic sensor comprises a second acoustic electrode, the second acoustic electrode being disposed between the substrate and the first acoustic electrode, wherein the second acoustic electrode is spaced apart from the first acoustic electrode. The first acoustic electrode or the second acoustic electrode is movable relative to each other in response to sound.

[0043] According to an eighth possible implementation related to one of the first to fifth implementations, the die is combined with a base portion of the MEMS sensor housing, the mounting surface of the substrate is mounted on the base portion and the hole extends through the substrate, and the proof mass is arranged between the base portion and the first electrode. The die is also combined with a displacement limiting support member coupled to the base portion, the displacement limiting support member being located below the proof mass and spaced apart from the proof mass, wherein the displacement limiting support member limits the displacement of the proof mass in the direction of movement of the first electrode or the second electrode to which the proof mass is coupled.

[0044] According to a ninth possible embodiment related to the eighth embodiment, the combination further comprises: an adhesive connecting the mounting surface of the substrate to the base portion; and at least one rigid column embedded in the adhesive and arranged between the substrate and the base portion.

[0045] According to a tenth possible embodiment related to the ninth embodiment, the combination also includes: a MEMS sensor housing, which includes a cover mounted on the base part; and an integrated circuit, which is arranged in the housing, and is electrically connected to the vibration sensor and electrically connected to electrical contacts on the surface mounting interface arranged on the outer surface of the base part.

[0046] Although the present disclosure has been described using specific embodiments of the present disclosure, it is apparent that many substitutions, modifications, and variations will be apparent to those skilled in the art. For example, in other embodiments, the various components of the embodiments may be interchangeable, added, or replaced. Moreover, all elements of each of the accompanying drawings are not necessary for the operation of the disclosed embodiments. For example, a person of ordinary skill in the art of the disclosed embodiments will be able to carry out and use the teachings of the present disclosure by simply adopting the elements of the independent claims. Therefore, the embodiments of the present disclosure set forth herein are intended to be illustrative, not restrictive. Various changes may be made without departing from the spirit and scope of the present disclosure.

[0047] In this document, relational terms such as "first", "second", etc. can be used only to distinguish one entity or action from another entity or action, without requiring or implying any actual such relationship or order between such entities or actions. The phrase "at least one of the following", "at least one selected from the following group", or "at least one selected from the following" followed by a list is defined as representing one, some or all (but not necessarily all) elements in the list. The term "comprise", "contain", "include" or any other variant thereof is intended to cover non-exclusive inclusions, so that the process, method, product or device including a series of elements does not include only those elements, but may include other elements that are not explicitly listed or inherent to such processes, methods, products or devices. In the absence of more constraints, elements starting with "one", "one", etc. do not exclude the presence of additional identical elements in the process, method, product or device including the element. Similarly, the term "another" is defined as at least the second or more. The terms "include", "have", etc. used herein are defined as "comprising". In addition, the background technology section is not considered to be prior art and is written as the inventor's own understanding of the background of certain embodiments at the time of filing, and includes the inventor's own recognition of any problems with the prior art and / or problems encountered in the inventor's own work.

Claims

1. A micro-electromechanical system vibration sensor die, characterized in that: The micro-electromechanical system vibration sensor die comprises: a substrate having a top portion, a mounting surface, and a hole extending at least partially through the substrate; a plurality of posts protruding from the mounting surface of the substrate, the plurality of posts being integrally formed with the substrate; an adhesive surrounding a perimeter of each of the plurality of posts; a first electrode coupled to the top portion of the substrate and disposed over the hole; a second electrode, the second electrode being arranged between the substrate and the first electrode, wherein the second electrode is spaced apart from the first electrode; A proof mass, the proof mass having: a first portion coupled to the first electrode or the second electrode; and a second end, the second end being opposite to the first portion, the second end being recessed into the hole relative to the mounting surface of the substrate, wherein the proof mass is suspended unobstructed within the aperture, and wherein the proof mass moves the first electrode or the second electrode from which the proof mass is suspended in response to vibration.

2. The micro-electromechanical system vibration sensor die according to claim 1, characterized in that: The MEMS vibration sensor die also includes a lateral support member adjacent the proof mass, wherein the lateral support member limits movement of the proof mass in a direction non-parallel to a direction of movement of the first electrode or the second electrode to which the proof mass is coupled.

3. The micro-electromechanical system vibration sensor die according to claim 2, characterized in that: The MEMS vibration sensor die further comprises a plurality of protrusions extending from the substrate toward the proof mass or from the proof mass toward the substrate, wherein the lateral support member is a portion of the substrate extending from the protrusions or a portion of the substrate from which the protrusions extend from the proof mass toward the substrate.

4. The micro-electromechanical system vibration sensor die according to claim 3, characterized in that: The proof mass has a hollow portion, and the substrate surrounds the proof mass, wherein the hollow portion extends through the proof mass from the first portion to the second end, wherein the hollow portion has a width in a direction parallel to the mounting surface, wherein the width is constant from the first portion to the second end.

5. The micro-electromechanical system vibration sensor die according to claim 1, characterized in that: The micro-electromechanical system vibration sensor die also includes a displacement limiting support member connected to the substrate, the displacement limiting support member is located below the inspection mass block and is spaced apart from the inspection mass block, wherein the displacement limiting support member limits the displacement of the inspection mass block in a moving direction of the first electrode or the second electrode to which the inspection mass block is connected.

6. The micro-electromechanical system vibration sensor die according to claim 1, characterized in that: The micro-electromechanical system vibration sensor die includes a semiconductor.

7. The micro-electromechanical system vibration sensor die according to claim 3, characterized in that: The micro-electromechanical system vibration sensor die is combined with the following components to form an assembly: a base portion of a MEMS sensor housing, the mounting surface of the substrate being mounted on the base portion and the hole extending completely through the substrate, and the proof mass being disposed between the base portion and the first electrode; as well as A displacement limiting support member is coupled to the base portion, the displacement limiting support member being located below the proof mass block and spaced apart from the proof mass block, wherein the displacement limiting support member limits displacement of the proof mass block in a moving direction of the first electrode or the second electrode to which the proof mass block is coupled.

8. The micro-electromechanical system vibration sensor die according to claim 7, characterized in that: The adhesive couples the mounting surface of the substrate to the base portion; and The posts are embedded in the adhesive and disposed between the substrate and the base portion.

9. The micro-electromechanical system vibration sensor die according to claim 8, characterized in that: The assembly also includes: a micro-electromechanical system sensor housing comprising a cover mounted on the base portion; and An integrated circuit is disposed in the micro-electromechanical system sensor housing, the integrated circuit being electrically coupled to the vibration sensor and to electrical contacts on a surface mount interface disposed on an outer surface of the base portion.

10. The micro-electromechanical system vibration sensor die according to claim 3, It is characterized in that The holes include a first hole, The micro-electromechanical system vibration sensor die is combined with the following components: An acoustic sensor, the acoustic sensor comprising: a second hole extending through a second portion of the substrate; a first acoustic electrode coupled to the substrate and positioned over the second hole; and a second acoustic electrode, the second acoustic electrode being disposed between the substrate and the first acoustic electrode, the second acoustic electrode being spaced apart from the first acoustic electrode, and Wherein, the first acoustic electrode or the second acoustic electrode is movable relative to each other in response to sound.

11. The micro-electromechanical system vibration sensor die according to claim 10, characterized in that: The adhesive couples the mounting surface of the substrate to a base portion; and Wherein, the pillar is embedded in the adhesive and arranged between the substrate and the base portion.

12. The micro-electromechanical system vibration sensor die according to claim 11, characterized in that: The micro-electromechanical system vibration sensor die is combined with the following components: a micro-electromechanical system sensor housing including a cover mounted on the base portion, the micro-electromechanical system sensor housing having an acoustic port acoustically coupled to the second hole of the substrate; as well as An integrated circuit is disposed in the micro-electromechanical system sensor housing, the integrated circuit being electrically coupled to the acoustic sensor, to a vibration sensor, and to electrical contacts on a surface mount interface disposed on an outer surface of the base portion.

13. A micro-electromechanical system vibration sensor die, characterized in that: The micro-electromechanical system vibration sensor die comprises: a base plate having a top portion and a mounting surface; a hole extending at least partially through the substrate; a plurality of posts protruding from the mounting surface of the substrate, the plurality of posts being integrally formed with the substrate; an adhesive surrounding a perimeter of each of the plurality of posts; capacitive electrodes arranged in spaced relationship and on the top portion of the substrate, at least one of the capacitive electrodes being coupled to the substrate; and a proof mass coupled to one of the capacitive electrodes and suspended unobstructed within the aperture, the proof mass being surrounded by the substrate and recessed relative to the mounting surface of the substrate; wherein the proof mass moves the capacitive electrode in response to vibration, the proof mass being suspended from the capacitive electrode.

14. The micro-electromechanical system vibration sensor die according to claim 13, characterized in that: The MEMS vibration sensor die also includes a lateral support member including a plurality of protrusions extending from the substrate toward the proof mass or from the proof mass toward the substrate, wherein the lateral support member limits movement of the proof mass in a direction that is not parallel to a direction of movement of the capacitive electrode to which the proof mass is coupled.

15. The micro-electromechanical system vibration sensor die according to claim 14, characterized in that: The proof mass has a first end proximate to the electrode and a second end distal to the electrode, wherein the proof mass has a hollow portion extending through the proof mass from the first end to the second end, and wherein the substrate surrounds the proof mass, and Wherein, the hollow portion has a width in a direction parallel to the mounting surface, wherein the width is constant from the first end to the second end.

16. The micro-electromechanical system vibration sensor die according to claim 15, characterized in that: The micro-electromechanical system vibration sensor die includes semiconductor material.

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