Dual silicon wafer processing system and method

Abstract

The embodiment of the present application provides a dual silicon wafer processing system and method, wherein the system includes: a film feeding mechanism, a rotating conveying mechanism, a positioning mechanism, a positioning platform, a printing mechanism, a printing platform and a film discharging mechanism; a positioning mechanism is provided on the positioning platform, and a printing mechanism is provided on the printing platform; the two second ends of the conveying plate move between the conveyor belt and the positioning platform; the conveying plate is used to synchronously move the dual silicon wafers on the conveyor belt of the film feeding mechanism to the positioning platform for positioning, the positioning platform is used to synchronously transport the positioned dual silicon wafers to the printing platform for printing and then send them back to the positioning platform, and the conveying plate is also used to synchronously move the dual silicon wafers on the positioning platform to the conveyor belt of the film discharging mechanism. The rotary and alternating structures are used in combination, two rows of conveying structures are parallel, two silicon wafers are conveyed at the same time, the film feeding speed is not affected, two sets of visual positioning systems and two sets of printing structures are printed at the same time, which can effectively improve the production capacity and facilitate maintenance.

Description

Technical Field

[0001] The present invention relates to the field of processing technology, and in particular to a dual silicon wafer processing system and method. Background Art

[0002] The existing solar printing methods are single-table printing on a rotary table or alternating printing on a linear transmission table, but they are only single-sheet printing and cannot print two sheets at the same time. As the printing speed and ink return speed reach the limit required by the printing process, the speed can no longer be increased, and the production capacity of the entire line can no longer be effectively improved. This has become a bottleneck for increasing production capacity and restricts the development of the industry.

[0003] Most conventional printing press turntables use four-station turntables, where one station is for feeding and aligning, two stations are for printing, three stations are for discharging, and four stations are idle. Most of them are for single-sheet printing. Even if there is a turntable for double-sheet printing, the turntable structure and the corresponding film feeding structure will be very large, making maintenance very difficult.

[0004] Due to the time constraints of the printing process, the printing speed can no longer be increased. In the same amount of time, only one sheet can be printed at a time, which becomes a bottleneck for increasing production capacity. Summary of the invention

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a dual silicon wafer processing system and method.

[0006] In a first aspect, an embodiment of the present invention provides a dual silicon wafer processing system, including a wafer feeding mechanism, a rotating conveying mechanism, a positioning mechanism, a positioning platform, a printing mechanism, a printing platform and a wafer discharging mechanism; wherein,

[0007] The sheet feeding mechanism and the sheet discharging mechanism each include two conveyor belts, the positioning platform is provided with the positioning mechanism, the printing platform is provided with the printing mechanism, the positioning mechanism is communicatively connected with the printing mechanism, and the positioning platform and the printing platform are linearly connected;

[0008] The rotating conveying mechanism comprises a rotating shaft and a conveying plate, wherein the first end of the conveying plate is drivingly connected to the rotating shaft, and the two second ends of the conveying plate move between the conveyor belt and the positioning platform;

[0009] The transport plate is used to synchronously move the dual silicon wafers on the conveyor belt of the film feeding mechanism to the positioning platform for positioning; the positioning platform is used to synchronously transport the positioned dual silicon wafers to the printing platform for printing and then return them to the positioning platform; the transport plate is also used to synchronously move the dual silicon wafers on the positioning platform to the conveyor belt of the film output mechanism.

[0010] According to a specific embodiment of the present disclosure, the two conveyor belts of the film feeding mechanism and the film discharging mechanism are parallel to each other, and the film feeding mechanism and the film discharging mechanism are located on the same straight line;

[0011] The positioning platform includes two mutually parallel positioning sub-platforms;

[0012] The distance between the two conveyor belts is equal to the distance between the two positioning sub-platforms, and is equal to the distance between the two second ends of the conveyor plate.

[0013] According to a specific embodiment of the present disclosure, the two conveyor belts are parallel to the first direction, and the two positioning platforms are parallel to the second direction;

[0014] The first direction is perpendicular to the second direction.

[0015] According to a specific embodiment of the present disclosure, the printing platform includes two separate printing sub-platforms, the two printing sub-platforms are respectively located on both sides of the positioning platform, and the two printing sub-platforms and the positioning platform are located on the same straight line extending along the first direction.

[0016] According to a specific embodiment of the present disclosure, the second end includes a vacuum suction cup and / or a clamping member for adsorbing the silicon wafer.

[0017] According to a specific implementation of the present disclosure, the positioning platform includes a carrying plate, a through hole is formed on the carrying plate, and a movable protrusion that can enter and exit the carrying plate is disposed below the carrying plate.

[0018] According to a specific embodiment of the present disclosure, the printing sub-platform and the positioning sub-platform are the same platform;

[0019] A cylinder is arranged under the positioning sub-platform, and the cylinder is transmission-connected with the positioning sub-platform, and the cylinder pushes the positioning sub-platform to move between a positioning area under the positioning mechanism and a printing area under the printing mechanism.

[0020] According to a specific embodiment of the present disclosure, the rotating conveying mechanism is a six-axis manipulator.

[0021] According to a specific embodiment of the present disclosure, the number of the transmission plates is at least two, and the first ends of at least two transmission plates are hinged to the rotating shaft.

[0022] In a second aspect, an embodiment of the present invention provides a dual silicon wafer processing method, which is applied to the dual silicon wafer processing system described in any one of the first aspects, and the method includes:

[0023] The two conveyor belts of the wafer feeding mechanism receive a silicon wafer in the wafer storage basket respectively and feed the wafer to the first position;

[0024] The transport plate synchronously moves the dual silicon wafers on the wafer transport mechanism from the first position to the positioning platform for positioning;

[0025] The positioning platform positions the dual silicon wafers and synchronously transports the positioned dual silicon wafers to the printing platform;

[0026] The printing mechanism prints the dual silicon wafers on the printing platform according to the positioning data of the positioning mechanism;

[0027] The positioning platform moves the printed dual silicon wafers to a second location;

[0028] The transport plate synchronously moves the dual silicon wafers of the positioning platform from the second position to the conveyor belt of the wafer discharging mechanism.

[0029] The dual silicon wafer processing system and method provided by the present application are as follows, wherein the dual silicon wafer processing system includes a film feeding mechanism, a rotating conveying mechanism, a positioning mechanism, a positioning platform, a printing mechanism, a printing platform and a film discharging mechanism; the film feeding mechanism and the film discharging mechanism each include two conveyor belts, the positioning mechanism is arranged on the positioning platform, the printing mechanism is arranged on the printing platform, the positioning mechanism is communicatively connected with the printing mechanism, and the positioning platform and the printing platform are linearly connected; the rotating conveying mechanism includes a rotating shaft and a conveying plate, the first end of the conveying plate is transmission-connected with the rotating shaft, and the two second ends of the conveying plate move between the conveyor belt and the positioning platform; the conveying plate is used to synchronously move the dual silicon wafers on the conveyor belt of the film feeding mechanism to the positioning platform for positioning, the positioning platform is used to synchronously convey the positioned dual silicon wafers to the printing platform for printing and then send them back to the positioning platform, and the conveying plate is also used to synchronously move the dual silicon wafers on the positioning platform to the conveyor belt of the film discharging mechanism. The present invention adopts a rotary and alternating structure, two rows of conveying structures are in parallel, two silicon wafers are conveyed at the same time without affecting the film feeding speed, two sets of visual positioning systems and two sets of printing structures are printed at the same time, which can effectively improve the production capacity and facilitate maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solution of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope of protection of the present invention. In each of the drawings, similar components are numbered similarly.

[0031] Figure 1 A schematic structural diagram of a dual silicon wafer processing system provided in an embodiment of the present application is shown;

[0032] Figure 2A schematic flow chart of a dual silicon wafer processing method provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0035] Hereinafter, the terms "including", "having" and their cognates, which may be used in various embodiments of the present invention, are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or adding the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0036] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0037] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as those generally understood by those skilled in the art to which the various embodiments of the present invention belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meanings as the contextual meanings in the relevant technical field and will not be interpreted as having idealized meanings or overly formal meanings unless clearly defined in the various embodiments of the present invention.

[0038] Example 1

[0039] See also Figure 1 , is a schematic diagram of the structure of a dual silicon wafer processing system provided by an embodiment of the present invention. Figure 1 As shown, the dual silicon wafer processing system 100 mainly includes a wafer feeding mechanism 110, a rotating conveying mechanism 120, a positioning mechanism 130, a positioning platform 140, a printing mechanism 150, a printing platform and a wafer discharging mechanism 160; wherein,

[0040] The sheet feeding mechanism 110 and the sheet discharging mechanism 160 each include two conveyor belts, the positioning mechanism 130 is disposed on the positioning platform 140, the printing mechanism 150 is disposed on the printing platform, the positioning mechanism 130 is communicatively connected with the printing mechanism 150, and the positioning platform 140 is parallelly connected with the printing platform;

[0041] The rotating conveying mechanism 120 includes a rotating shaft 121121 and a conveying plate 122122, wherein a first end of the conveying plate 122 is transmission-connected to the rotating shaft 121, and two second ends of the conveying plate 122 move between the conveyor belt and the positioning platform 140;

[0042] The conveying plate 122 is used to synchronously move the dual silicon wafers on the conveyor belt of the film feeding mechanism 110 to the positioning platform 140 for positioning. The positioning platform 140 is used to synchronously transport the positioned dual silicon wafers to the printing platform for printing and then return them to the positioning platform 140. The conveying plate 122 is also used to synchronously move the dual silicon wafers on the positioning platform 140 to the conveyor belt of the film output mechanism 160.

[0043] The dual silicon wafer processing system 100 provided in this embodiment is used to realize the synchronous processing of dual silicon wafers. This processing process mainly involves the positioning and printing of silicon wafers after they come out of the flower basket. The dual silicon wafer processing system 100 includes a wafer feeding mechanism 110 and a wafer discharging mechanism 160, as well as a positioning mechanism 130 and a printing mechanism 150 located between the wafer feeding mechanism 110 and the wafer discharging mechanism 160. The wafer feeding mechanism 110 is connected to the flower basket and synchronously receives dual silicon wafers from the flower basket. The wafer discharging mechanism 160 is used to deliver the printed dual silicon wafers to the next process. Optionally, the rotating conveying mechanism 120 is a six-axis manipulator.

[0044] Specifically, Figure 1 As shown, the film feeding mechanism 110 and the film discharging mechanism 160 each include two conveyor belts. According to a specific embodiment of the present disclosure, the two conveyor belts of the film feeding mechanism 110 and the film discharging mechanism 160 are parallel to each other, and the film feeding mechanism 110 and the film discharging mechanism 160 are located on the same straight line;

[0045] The positioning platform 140 includes two positioning sub-platforms parallel to each other;

[0046] The distance between the two conveyor belts is equal to the distance between the two positioning sub-platforms, and is also equal to the distance between the two second ends of the conveying plate 122 .

[0047] Optionally, both conveyor belts are parallel to the first direction (eg Figure 1 As shown in F1, both positioning stages are parallel to the second direction (such as Figure 1 F2 shown in );

[0048] The first direction is perpendicular to the second direction.

[0049] In this embodiment, Figure 1 The horizontal direction in the image is defined as the first direction F1, and the direction perpendicular to the horizontal direction is defined as the second direction F2. In addition, the paper direction perpendicular to F1 and F2 can also be defined as F3 or the Z axis, that is, the printing system of the present application is a three-dimensional system, and the rotating conveying mechanism can move in three directions. In this way, the rotating conveying mechanism 120 rotates back and forth 90 degrees to achieve smooth transfer between the film feeding mechanism 110 and the positioning platform 140, and between the positioning platform 140 and the film output mechanism 160, further optimizing the dual silicon wafer processing process.

[0050] According to a specific embodiment of the present disclosure, the printing platform includes two separate printing sub-platforms, the two printing sub-platforms are respectively located on both sides of the positioning platform 140, and the two printing sub-platforms and the positioning platform 140 are located on the same straight line extending along the first direction.

[0051] In this embodiment, the printing platform is divided into two printing sub-platforms, which are respectively arranged on both sides of the positioning platform 140. Figure 1 In this way, after the positioning platform 140 is positioned, the two silicon wafers can be moved to the printing platforms on both sides for synchronous printing, and then sent back to the positioning platform 140, and then the positioning platform 140 can be sent back to the film discharge mechanism 160.

[0052] In a specific implementation, the number of the conveying plates 122 is at least two, and the first ends of at least two conveying plates 122 are hinged to the rotating shaft 121 .

[0053] The number of conveying plates 122 is usually at least two, which can respectively carry out the conveying process of the current double silicon wafer and the conveying process of the next double silicon wafer, ensuring that the processing processes of the previous and next double silicon wafers are carried out in sequence, thereby improving the processing efficiency.

[0054] Next, the specific structures and the coordination process of the rotating conveying mechanism 120 , the positioning platform 140 and the printing platform will be specifically defined.

[0055] According to a specific embodiment of the present disclosure, the second end includes a vacuum suction cup and / or a clamping member for adsorbing the silicon wafer.

[0056] A vacuum suction cup or a clamping member such as a tongue or a fork is arranged at the second end, which can be connected to the silicon wafer from the upper surface or the lower surface to move up and down or move horizontally before printing.

[0057] According to a specific implementation of the present disclosure, the positioning platform 140 includes a carrying plate, a through hole is formed on the carrying plate, and a movable protrusion that can enter and exit the carrying plate is disposed below the carrying plate.

[0058] For the printed silicon wafer, since the printed upper surface cannot be touched, the lower surface of the silicon wafer can be lifted up by the tongue or movable protrusion at the second end to protect the printed circuit on the upper surface of the silicon wafer from being damaged.

[0059] According to a specific embodiment of the present disclosure, the printing sub-platform and the positioning sub-platform are the same platform;

[0060] A cylinder is disposed under the positioning sub-platform, and the cylinder is transmission-connected to the positioning sub-platform. The cylinder pushes the positioning sub-platform to move between a positioning area under the positioning mechanism 130 and a printing area under the printing mechanism 150 .

[0061] Based on the above ideas, the specific structures of the positioning platform and the printing platform can have a variety of combinations. One combination is that the positioning platform includes two separate positioning sub-platforms, and the two positioning sub-platforms can be translated to the sides to the bottom of the printing mechanism on both sides, and used as a printing platform. Another combination is that the positioning sub-platform includes a carrier plate made of transparent glass material and a movable protrusion arranged under the carrier plate, and the positioning sub-platform is also used as a printing sub-platform. When in use, only the carrier plate can be moved, that is, the movable protrusion is fixed under the positioning mechanism. Of course, the carrier plate and the movable protrusion can also be set to move synchronously. Of course, there can be other combinations, which are not limited here.

[0062] In this embodiment, a movable printing solution is realized by moving the same platform between the positioning area and the printing area, which saves hardware layout and improves processing speed.

[0063] The following will be combined Figure 1 , explaining the complete processing flow of the dual silicon wafer processing system 100 provided in this embodiment.

[0064] The two conveyor belts of the conveyor mechanism are conveyed in parallel at the same time. After coming out of the AGV basket, they can be directly conveyed to the bottom of the second end suction cup station of the rotating conveyor mechanism 120, and the suction cup will absorb the silicon wafer on the conveyor belt to the suction cup. Of course, the silicon wafer can also be lifted by the tongue or fork at the second end. After the silicon wafer is sucked up, the conveyor belt can continue to transport the next pair of double silicon wafers.

[0065] While the suction cup is sucking the wafer, the glass table of the positioning slip below the vision has a lifting mechanism, such as a movable protrusion, which can lift the silicon wafer through the through hole of the glass table. Considering that the printed silicon wafer has silver paste or aluminum paste on it, it cannot be adsorbed on it and can only be moved from below. At this time, the tongue or fork can be inserted between the silicon wafer and the glass table, and the lifting mechanism below the vision glass table will drop, and the silicon wafer will fall on the tongue or fork and be adsorbed by vacuum. Vacuum adsorption can fix the silicon wafer on the glass table to prevent the silicon wafer from shifting during movement.

[0066] After that, the suction cup or fork fixed structure rotates 90 degrees along the plane direction, and then the silicon wafer is placed on the vacuum glass table below the vision. Along the Z axis direction, the tongue or fork structure descends at the same time, releasing the vacuum, and placing the silicon wafer on the wafer conveyor belt. After that, the suction cup, tongue or fork retracts. The vision takes a picture for positioning, and then rotates 90 degrees back to the original position.

[0067] In the above process, the specific process of positioning and printing includes: after the visual positioning is completed, the Z axis under the glass table descends, and the glass table is transported to the bottom of the printing mechanism 150. Along the horizontal direction F, according to the data given by the visual positioning, the glass table is translated to the printing mechanisms 150 on both sides, and moves to the bottom of the glass table under the two printing mechanisms 150 that are printing. At the same time, the printing mechanism 150 is printing on the other two silicon wafers that have been positioned. After printing, the two glass tables that have just been printed move to the bottom of the vision, and then the Z axis of the glass table under the vision descends, and the Z axis of the glass table that has been positioned and moved under the printing head rises and prints. The visual positioning sheet can also perform the feeding operation of the next two sheets again. In this way, continuous alternating positioning and printing of double silicon wafers can be achieved.

[0068] In summary, the present invention adopts a rotary and alternating structure, two rows of transmission structures are in parallel, two silicon wafers are transmitted at the same time, the feeding speed is not affected, two sets of visual positioning systems and two sets of printing structures are printed at the same time, which can effectively improve the production capacity and facilitate maintenance. The current AGV loading also happens to use double-row loading, and the silicon wafer transmission and the AGV width can be effectively docked. In this way, two silicon wafers can be printed at the same time, so that the production capacity is greatly improved on the original basis. In addition, the present application makes full use of the advantages of the product line, and the conveyor belt and the printing head are as close to the operating side of the person as possible, so that the existing production capacity is nearly doubled, and the equipment is easy to maintain and the operation is more superior. Even if a single printing mechanism has a problem, the other printing mechanism can still print, which ensures the continuation of the printing process under the failure of a single mechanism, and the production capacity of dual silicon wafer processing is greatly improved.

[0069] Example 2

[0070] See also Figure 2, is a schematic flow chart of a double silicon wafer processing method provided by an embodiment of the present invention, the method is mainly applied to the above Figure 1 The embodiment shown provides a dual silicon wafer processing system. Figure 2 As shown, the method mainly comprises the following steps:

[0071] S201, two conveyor belts of the wafer feeding mechanism respectively receive a silicon wafer in the wafer storage basket and feed the wafer to the first position;

[0072] S202, the transport plate synchronously moves the dual silicon wafers on the wafer transport mechanism from the first position to the positioning platform for positioning;

[0073] S203, the positioning platform positions the dual silicon wafers, and synchronously transports the positioned dual silicon wafers to the printing platform;

[0074] S204, the printing mechanism prints the dual silicon wafers on the printing platform according to the positioning data of the positioning mechanism;

[0075] S205, the positioning platform moves the printed dual silicon wafers to a second location;

[0076] S206, the transport plate synchronously moves the dual silicon wafers on the positioning platform from the second position to the conveyor belt of the wafer discharging mechanism.

[0077] The double silicon wafer processing method provided by the present application, the double silicon wafer processing system used in it includes a film feeding mechanism, a rotating conveying mechanism, a positioning mechanism, a positioning platform, a printing mechanism, a printing platform and a film discharge mechanism; the film feeding mechanism and the film discharge mechanism each include two conveyor belts, the positioning mechanism is arranged on the positioning platform, the printing mechanism is arranged on the printing platform, the positioning mechanism is communicatively connected with the printing mechanism, and the positioning platform and the printing platform are linearly connected; the rotating conveying mechanism includes a rotating shaft and a conveying plate, the first end of the conveying plate is drivingly connected with the rotating shaft, and the two second ends of the conveying plate move between the conveyor belt and the positioning platform; the conveying plate is used to synchronously move the double silicon wafers on the conveyor belt of the film feeding mechanism to the positioning platform for positioning, the positioning platform is used to synchronously transport the positioned double silicon wafers to the printing platform for printing and then send them back to the positioning platform, and the conveying plate is also used to synchronously move the double silicon wafers on the positioning platform to the conveyor belt of the film discharge mechanism. The specific implementation process of the dual silicon wafer processing method provided in the embodiment of the present application can refer to the specific implementation process of the dual silicon wafer processing system mentioned above, which will not be described in detail here.

[0078] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and structure diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the structure diagram and / or the flow chart, and the combination of boxes in the structure diagram and / or the flow chart, can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0079] In addition, the functional modules or units in the various embodiments of the present invention may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0080] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a smart phone, a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention.

[0081] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A dual silicon wafer processing system, characterized in that: It includes a film feeding mechanism, a rotating conveying mechanism, a positioning mechanism, a positioning platform, a printing mechanism, a printing platform and a film discharging mechanism; wherein, The sheet feeding mechanism and the sheet discharging mechanism each include two conveyor belts, the positioning platform is provided with the positioning mechanism, the printing platform is provided with the printing mechanism, the positioning mechanism is communicatively connected with the printing mechanism, and the positioning platform and the printing platform are linearly connected; The rotating conveying mechanism comprises a rotating shaft and a conveying plate, wherein the first end of the conveying plate is drivingly connected to the rotating shaft, and the two second ends of the conveying plate move between the conveyor belt and the positioning platform; The conveying plate is used to synchronously move the dual silicon wafers on the conveyor belt of the film feeding mechanism to the positioning platform for positioning; the positioning platform is used to synchronously transport the positioned dual silicon wafers to the printing platform for printing and then return them to the positioning platform; the conveying plate is also used to synchronously move the dual silicon wafers on the positioning platform to the conveyor belt of the film discharging mechanism; The positioning platform includes two mutually parallel positioning sub-platforms; The distance between the two conveyor belts of the sheet feeding mechanism and the sheet discharging mechanism is equal to the distance between the two positioning sub-platforms, and is also equal to the distance between the two second ends of the conveying plate; The two conveyor belts of the film feeding mechanism and the film discharging mechanism are both parallel to the first direction, and the two positioning sub-platforms are both parallel to the second direction; The first direction is perpendicular to the second direction; The printing platform includes two separate printing sub-platforms, which are respectively located on both sides of the positioning platform, and the two printing sub-platforms and the positioning platform are located on the same straight line extending along the first direction. The positioning platform is used to move two silicon wafers to the printing platforms on both sides for synchronous printing and then send them back to the positioning platform.

2. The system according to claim 1, characterized in that The two conveyor belts of the film feeding mechanism and the film discharging mechanism are parallel to each other, and the film feeding mechanism and the film discharging mechanism are located on the same straight line.

3. The system according to claim 1, characterized in that The second end includes a vacuum suction cup and / or a clamping member for adsorbing the silicon wafer.

4. The system according to claim 3, characterized in that The positioning platform comprises a bearing plate, a through hole is formed on the bearing plate, and a movable protrusion which can enter and exit the bearing plate is arranged below the bearing plate.

5. The system according to claim 4, characterized in that The printing sub-platform and the positioning sub-platform are the same platform; A cylinder is arranged under the positioning sub-platform, and the cylinder is transmission-connected with the positioning sub-platform. The cylinder pushes the positioning sub-platform to move between a positioning area under the positioning mechanism and a printing area under the printing mechanism.

6. The system according to claim 5, characterized in that The rotating conveying mechanism is a six-axis manipulator.

7. The system according to any one of claims 1 to 6, characterized in that The number of the conveying plates is at least two, and the first ends of at least two conveying plates are hinged to the rotating shaft.

8. A method for processing double silicon wafers, characterized in that: Applicable to the dual silicon wafer processing system according to any one of claims 1 to 7, the method comprising: The two conveyor belts of the wafer feeding mechanism receive a silicon wafer in the wafer storage basket respectively and feed the wafer to the first position; The transport plate synchronously moves the dual silicon wafers on the wafer transport mechanism from the first position to the positioning platform for positioning; The positioning platform positions the dual silicon wafers and synchronously transports the positioned dual silicon wafers to the printing platform; The printing mechanism prints the dual silicon wafers on the printing platform according to the positioning data of the positioning mechanism; The positioning platform moves the printed dual silicon wafers to a second location; The transport plate synchronously moves the dual silicon wafers on the positioning platform from the second position to the conveyor belt of the wafer discharging mechanism.

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